Image forming apparatus

Abstract

The invention relates to the technical field of imaging, and particularly provides imaging equipment. The imaging device includes an accommodating member and an imaging member; the accommodating part is used for accommodating a container for providing an imaging material, a base material is arranged on the container, a plurality of contact parts are arranged on the base material, and the base material is in contact with a contact pin arranged on the imaging part through the contact parts so as to realize communication with the imaging part; the imaging component comprises a detection component, the detection component is electrically connected with the at least two contact pins, and the detection component is used for detecting whether the performance of the base material meets a preset condition or not through the at least two contact pins after the container is embedded into the containing component. By detecting whether the loop between the contact part and the contact pin is normal or not, the performance of the base material is detected, so that the situation that the poor-quality base material (such as a chip) is installed on the imaging equipment to affect the imaging quality and the imaging efficiency is effectively prevented.

Description

Technical Field

[0001] This disclosure relates to the field of imaging technology, and in particular to an imaging device. Background Technology

[0002] During the printing process, the printing device requires imaging assistance information from the consumable cartridge to complete the imaging process. This imaging assistance information is recorded not only within the printing device itself but also on a consumable chip. The consumable chip can be installed on the consumable cartridge, which can be an ink cartridge filled with ink or a toner cartridge filled with toner. The ink cartridge and toner are the recording materials. The consumable chip's function is to control the authentication and data matching between the consumable cartridge and the printing device, and to provide imaging assistance information during subsequent imaging. The consumable chip contains electronic modules and terminals that electrically connect to the printing device's probes.

[0003] In related technologies, some compatible chips can affect printer performance during use, such as causing sudden interruptions during printing, intermittent authentication processes, and in severe cases, damaging the printer and causing irreparable damage. Summary of the Invention

[0004] This disclosure is made in view of the above-mentioned problems. This disclosure provides an imaging device.

[0005] According to a first aspect of this disclosure, an imaging apparatus is provided, comprising:

[0006] Housing components and imaging components; The receiving component is used to receive a container for providing imaging material. The container is provided with a substrate, and the substrate is provided with a plurality of contact portions. The substrate contacts the pins provided on the imaging component through the contact portions to achieve communication with the imaging component. The pins provided on the imaging component include power pins, clock pins, data pins, chip select pins, and ground pins. The number of contact portions provided on the substrate is less than or equal to the number of pins provided on the imaging component. The imaging component includes a detection component, which is electrically connected to at least two styluses. The detection component is used to detect, after the container is embedded into the receiving component, whether the performance of the substrate meets preset conditions through the at least two styluses. The preset conditions can indicate whether the circuit between two of the at least two styluses and the contact portion on the substrate is normal. When it is detected that the number of contact portions provided on the substrate is less than the number of styluses provided on the imaging component, the use of the substrate is restricted or prohibited.

[0007] Furthermore, according to the imaging apparatus of the first aspect of this disclosure, the detection component detects whether the loop voltage, loop current, or loop power consumption between the two styluses meets a preset value.

[0008] Furthermore, according to the imaging apparatus of the first aspect of this disclosure, after the imaging component switches from power supply to de-power supply to the substrate, the detection component detects whether the time it takes for the voltage of one of the two styluses to recover to a preset voltage is greater than a preset time.

[0009] Furthermore, according to the imaging apparatus of the first aspect of this disclosure, the detection component detects whether the waveform of the pulse width modulation signal or sine wave signal between the two styluses is distorted.

[0010] Furthermore, according to the imaging apparatus of the first aspect of this disclosure, after the imaging component switches the power supply to the substrate from de-energized to restored, the detection component detects whether it can read the response flag bit of the target stylus among the two styluses from the memory, the response flag bit being used to indicate that the circuit formed by the target stylus is a stable circuit, and the target stylus is one of the two styluses.

[0011] Furthermore, according to the imaging apparatus of the first aspect of this disclosure, the substrate is provided with 3 or 4 contact portions.

[0012] Furthermore, according to the imaging apparatus of the first aspect of this disclosure, the substrate lacks a grounding contact portion corresponding to the grounding pin, and / or the substrate lacks a chip select contact portion corresponding to the chip select pin.

[0013] Furthermore, according to the imaging apparatus of the first aspect of this disclosure, the two contacts are a power contact and a ground contact, and the substrate lacks at least one contact portion corresponding to a functional contact, wherein the functional contact is one of the power contact, the clock contact, the data contact, the chip select contact, and the ground contact.

[0014] Furthermore, according to the imaging apparatus of the first aspect of this disclosure, the substrate lacks a grounding contact portion corresponding to the grounding pin, or the substrate lacks a power contact portion corresponding to the power pin.

[0015] Furthermore, in the imaging apparatus according to the first aspect of this disclosure, the restriction or prohibition of the use of the substrate is at least one of the following: The imaging component does not respond to the substrate; or... The imaging component always responds to invalid information to the substrate; or... The imaging component does not store the information transmitted by the substrate; or... The imaging component cuts off the voltage supplied to the substrate.

[0016] As will be described in detail below, the imaging device according to an embodiment of the present disclosure includes a receiving component, a container that can be received by the receiving component having a substrate disposed thereon, a contact portion disposed thereon, and an imaging component having a stylus disposed thereon. The contact portion and the stylus contact each other to realize communication between the substrate and the imaging component. By detecting whether the circuit between the contact portion and the stylus is normal, the performance of the substrate is detected, thereby effectively preventing the installation of substandard substrates (such as chips) into the imaging device, which would affect the imaging quality and imaging efficiency.

[0017] It should be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further illustration of the claimed technology. Attached Figure Description

[0018] The above and other objects, features, and advantages of this disclosure will become more apparent from the more detailed description of the embodiments thereof in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the disclosure and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0019] Figure 1 This is a schematic diagram illustrating an imaging device according to an embodiment of the present disclosure.

[0020] Figure 2 This is a schematic diagram illustrating the application of a stylus according to an embodiment of the present disclosure.

[0021] Figure 3 This is a schematic diagram illustrating a container used in an embodiment of this disclosure.

[0022] Figure 4 This is a schematic diagram illustrating an application of a stylus holder according to an embodiment of the present disclosure.

[0023] Figure 5 This is a schematic diagram illustrating a substrate used in an embodiment of the present disclosure.

[0024] Figure 6 This is a schematic diagram illustrating the electrical connections in a printing apparatus according to an embodiment of the present disclosure.

[0025] Figure 7 This is a schematic diagram illustrating the electrical connections in a printing apparatus according to an embodiment of the present disclosure.

[0026] Figure label: 1-Containing component, 2-Imaging component, 3-Container; 31-Substrate, 21-Stimulator; 311-Contact part, 211-Touch needle tip, 212-Touch needle front end, 213-Touch needle bevel end, 214-Touch needle tip, 201-Touch needle frame; 2011 - Upper end face of the stylus holder; 2012 - Front end face of the stylus holder; 21A - First contact pin, 21B - Second contact pin, 21C - Third contact pin, 21D - Fourth contact pin, 21E - Fifth contact pin. Detailed Implementation

[0027] The technical methods of the embodiments of the present invention will now be clearly and completely described with reference to the accompanying drawings.

[0028] To facilitate understanding of this embodiment, a detailed description of an imaging device disclosed in this disclosure will be provided first, see [link to relevant documentation]. Figures 1-3 The diagram shown is a schematic of an imaging device provided in an embodiment of this disclosure. The imaging device may include: Accommodating component 1 and imaging component 2; The receiving component 1 is used to receive the container 3 that provides imaging material. The container 3 is provided with a substrate 31, and the substrate 31 is provided with a plurality of contact parts 311. The substrate 31 contacts the stylus 21 provided in the imaging component 2 through the contact parts 311 to realize communication with the imaging component 2. The contact pins 21 provided on the imaging component 2 include power contact pins, clock contact pins, data contact pins, chip select contact pins and ground contact pins, wherein the number of contact portions 311 provided on the substrate 31 is less than or equal to the number of contact pins 21 provided on the imaging component 2. Imaging component 2 includes a detection component, which is electrically connected to at least two styluses 21. The detection component is used to detect whether the performance of the substrate 31 meets preset conditions after the container 3 is embedded into the receiving component 1. The preset conditions can indicate whether the circuit between two of the at least two styluses 21 and the contact portion on the substrate 31 is normal. When it is detected that the number of contact portions 311 provided on the substrate 31 is less than the number of styluses 21 provided on the imaging component 2, the use of the substrate 31 is restricted or prohibited.

[0029] In this embodiment, the imaging material includes, but is not limited to, ink or toner. Accordingly, the container 3 providing the imaging material can be an ink cartridge filled with ink or a toner cartridge filled with toner.

[0030] In this embodiment, the imaging component 2 is provided with a communication port, and the substrate 31 is provided with an interface module. A communication link can be established between the communication port and the interface module, and the imaging component 2 and the substrate 31 transmit information through the communication link. For example, during the imaging process, the substrate 31 can provide identification information and information on the usage status of recording materials (such as ink cartridges or toner). When the imaging component 2 sends a signal to the substrate 31, the imaging component 2 is the sender and the substrate 31 is the receiver; conversely, when the substrate 31 sends a signal to the imaging component 2, the substrate 31 is the sender and the imaging component 2 is the receiver. The interface module is provided with a contact portion 311, and the communication port is provided with a stylus 21. The communication link between the communication port and the interface module is realized through physical electrical contact between the stylus 21 and the contact portion 311 on the substrate 31.

[0031] In this embodiment, the substrate 31 disposed on the container 3 can be a chip capable of communicating with the imaging component 2. This chip can be a compatible chip or an original chip included with the imaging device. Since the information transmission between the imaging component 2 and the substrate 31 is achieved through physical electrical contact between the stylus pins 21 on the imaging component 2 and the contact portions 311 on the substrate 31, in a preferred information transmission process, the stylus pins 21 on the imaging component 2 and the contact portions 311 on the substrate 31 should correspond one-to-one, with each stylus pin 21 contacting its corresponding contact portion 311. When the substrate 31 is an original chip included with the imaging device, the stylus pins 21 on the imaging component 2 and the contact portions 311 on the substrate 31 are indeed one-to-one.

[0032] When the substrate 31 is a compatible chip, the contact portion 311 provided on the substrate 31 is in partial or complete contact with the stylus 21 provided on the imaging component 2. That is, when the substrate 31 is a compatible chip, the contact portion 311 provided on the substrate 31 may contact all the stylus 21 provided on the imaging component 2, or it may contact some of the stylus 21 provided on the imaging component 2.

[0033] In this embodiment, if the contact portion 311 on the substrate 31 contacts some of the styluses 21 on the imaging component 2, it indicates that the number of contact portions 311 on the substrate 31 is less than the number of styluses 21 on the imaging component 2. This indicates that the substrate 31 is of poor quality. In other words, for some styluses 21 on the imaging component 2, there is no suitable contact portion 311 on the substrate 31 to contact them. The lack of contact portions 311 on the substrate 31 can cause sudden interruptions in the imaging process of the imaging system, intermittent authentication processes, and in severe cases, damage to the imaging equipment, causing irreparable damage. The detection component and preset conditions of this embodiment can detect whether there are missing contact portions 311 on the substrate 31, thereby identifying whether the substrate 31 is of poor quality.

[0034] In this embodiment, the five contacts on the imaging component 2—power contact, clock contact, data contact, chip select contact, and ground contact—have different functions. Specifically, the imaging component 2 can send data signals to the substrate 31 via the data contact, send chip select signals to the substrate 31 via the chip select contact, and send a periodic, alternating low-level and high-level clock signal to the substrate 31 via the clock contact. The imaging component 2 provides operating voltage to the substrate 31 via the power contact, and provides a unified reference low level for data reception and transmission between the imaging component 2 and the substrate 31 via the ground contact, ensuring the correctness and stability of the communication process.

[0035] Please refer to Figure 2 , Figure 2 This is a schematic diagram of the stylus 21 shown in this embodiment. Figure 2 As shown, the stylus 21 includes a stylus tip 211, a stylus front end 212, a stylus bevel end 213, and a stylus tip 214. The stylus tip 211, stylus front end 212, stylus bevel end 213, and stylus tip 214 can all form contact with the contact portion 311 on the substrate 31 for electrical connection. Thus, a communication connection is established between the substrate 31 on the container 3 and the imaging component 2 through the contact between the stylus 21 and the contact portion 311.

[0036] In this embodiment, a stylus holder 201 for placing the stylus 21 is also provided on the imaging component 2. As an example, please refer to... Figure 4 , Figure 4 This is a schematic diagram of the stylus holder 201 shown in this embodiment. Figure 4As shown, the pin holder 201 includes an upper pin holder surface 2011 along the Y-axis and a front pin holder surface 2012 along the X-axis. The pin holder 201 holds a first pin 21A, a second pin 21B, a third pin 21C, a fourth pin 21D, and a fifth pin 21E. These five pins can also be referred to as a power pin, a clock pin, a data pin, a chip select pin, and a ground pin.

[0037] It should be noted that there is no strict one-to-one correspondence between the first contact pin 21A to the fifth contact pin 21E and the power contact pin, clock contact pin, data contact pin, chip select contact pin, and ground contact pin. The first contact pin 21A to the fifth contact pin 21E are different from each other, and each of them can be any one of the power contact pin, clock contact pin, data contact pin, chip select contact pin, and ground contact pin.

[0038] In some embodiments, when the substrate 31 contacts all the styluses 21 provided on the imaging component 2 through the contact portion 311 provided thereon, such as Figure 5 As shown, the contact portion 311 provided on the substrate 31 may include a data contact portion SDA, a chip select contact portion RST, a clock contact portion SCL, a power contact portion VCC, and a ground contact portion GND. Specifically, the data contact portion SDA contacts the data pin provided on the imaging component 2, the chip select contact portion RST contacts the chip select pin provided on the imaging component 2, the clock contact portion SCL contacts the clock pin provided on the imaging component 2, the power contact portion VCC contacts the power pin provided on the imaging component 2, and the ground contact portion GND contacts the power pin provided on the imaging component 2.

[0039] In some embodiments, when the substrate 31 contacts a portion of the stylus 21 on the imaging component 2 via the contact portion 311 thereon, the number of contact portions 311 on the substrate 31 can be three or four. That is, the substrate 31 lacks one or two contact portions 311 for contacting the stylus 21 on the imaging component 2, so one or two stylus 21 on the imaging component 2 are empty and do not contact the contact portions 311 on the substrate 31.

[0040] It should be understood that, in some other embodiments, the number of contact portions 311 provided on the substrate 31 may also be less than three.

[0041] When the number of contact portions 311 on the substrate 31 is less than the number of styluses 21 on the imaging component 2, this substrate 31 is collectively referred to as a defective substrate. When the number of contact portions 311 on the defective substrate is close to the number of styluses 21 on the imaging component 2, for example, when the number of styluses 21 on the imaging component 2 is 5 and the number of contact portions 311 on the substrate 31 is 3 or 4, this defective substrate will have a smaller impact on the printing system. Therefore, this defective substrate is easier to circulate in the market. In other words, this type of substrate is more likely to be among the defective compatible substrates that may appear in imaging equipment. Therefore, this type of substrate is the main substrate that needs to be detected for performance that does not meet the preset conditions.

[0042] When the number of contact portions 311 on the defective substrate differs significantly from the number of styluses 21 on the imaging component 2 (for example, if the number of styluses 21 on the imaging component 2 is 5 and the number of contact portions 311 on the substrate 31 is less than 3), this defective substrate will cause significant damage to the printing system. Therefore, this defective substrate is not easily circulated in the market. Usually, the manufacturer of the substrate 31 will eliminate this substrate. In other words, this type of substrate is rarely among the defective compatible substrates that may appear in the imaging device. Therefore, this type of substrate is not the substrate that does not meet the preset conditions that this embodiment focuses on detecting.

[0043] In some embodiments, the two contacts are a power contact and a ground contact, and the substrate lacks at least one contact portion corresponding to one of the functional contacts. The functional contact is one of the power contact, clock contact, data contact, chip select contact, and ground contact.

[0044] When the contact portion 311 corresponding to the power contact pin is the power contact VCC, the contact portion 311 corresponding to the clock contact pin is the clock contact SCL, the contact portion 311 corresponding to the data contact pin is the data contact SDA, the contact portion 311 corresponding to the chip select contact pin is the chip select contact RST, and the contact portion 311 corresponding to the ground contact pin is the ground contact GND, the missing contact portion 311 of the substrate 31 can be at least one of the data contact SDA, the chip select contact RST, the clock contact SCL, the power contact VCC, and the ground contact GND.

[0045] As mentioned earlier, it is more common for the substrate 31 to lack the contact portion 311 corresponding to one or two of the five functional contact pins. Of course, there are also substrates 31 that lack the contact portion 311 corresponding to three or four of the five functional contact pins.

[0046] In some embodiments, the substrate 31 lacks a grounding contact portion 311 corresponding to the grounding pin, and / or the substrate 31 lacks a chip select contact portion 311 corresponding to the chip select pin.

[0047] Even when the substrate 31 lacks a grounding contact corresponding to the grounding pin or a chip select contact corresponding to the chip select pin, the substrate 31 can still communicate with the imaging component 2. Data transmission can occur between the substrate 31 and the imaging component 2, but the communication quality cannot be guaranteed; for example, sudden communication interruptions may occur. Because this type of substrate 31 can still communicate with the imaging component 2, it is relatively easy to circulate in the market. Therefore, the performance of this type of substrate 31 urgently needs to be detected using the preset conditions in this embodiment.

[0048] In this embodiment, when the detection component detects that the performance of the substrate 31 does not meet the preset conditions, it indicates that the circuit formed between the two styluses 21 in the imaging component 2 that are in contact with the substrate 31 and the contact portion 311 on the substrate 31 is abnormal or unstable. The root cause is that the number of contact portions 311 provided on the substrate 31 is less than the number of styluses 21 provided on the imaging component 2. That is to say, for the two styluses 21 on the imaging component 2, the substrate 31 does not provide contact portions 311 corresponding to the two styluses 21, or does not provide contact portions 311 corresponding to one of the two styluses 21. Therefore, a conductive circuit cannot be formed between the two styluses 21 and the contact portion 311 on the substrate 31, that is, the circuit between the two styluses 21 and the contact portion 311 on the substrate 31 is abnormal.

[0049] In this embodiment, if the number of contacts 311 on the substrate 31 is less than the number of styluses 21 on the imaging component 2, the use of the substrate 31 is immediately restricted or prohibited. Specifically, the transmission of read / write commands between the imaging component 2 and the substrate 31 can be prohibited; that is, the imaging component 2 does not respond to the substrate 31, or the imaging component 2 always responds with invalid information to the substrate 31, or the imaging component 2 does not store the information sent by the substrate 31, or the imaging component 2 cuts off the voltage supplied to the substrate 31. This immediate "disallowing normal use" can serve as a protection mechanism to prevent some compatible consumable chips from burning out the circuitry of the imaging component 2 due to incorrect voltage or current input.

[0050] In some embodiments, the preset conditions can indicate whether the loop voltage, loop current or loop power consumption between two of the at least two styluses 21 and the contact portion 311 on the substrate 31 meets the preset value.

[0051] In this embodiment, when the detection component detects that the loop voltage, loop current, or loop power consumption between the two styluses 21 and the contact portion 311 on the substrate 31 meets the preset value, it indicates that a normal loop has been formed between the two styluses 21 and the contact portion 311 on the substrate 31, meaning that the performance of the substrate 31 meets the preset conditions. Therefore, the imaging component 2 is allowed to transmit read / write commands to the substrate 31. Conversely, when the loop voltage, loop current, or loop power consumption does not meet the preset value, it indicates that the loop formed between the two styluses 21 and the contact portion 311 on the substrate 31 is abnormal, meaning that the performance of the substrate 31 does not meet the preset conditions. Therefore, the imaging component 2 is prohibited from transmitting read / write commands to the substrate 31; that is, the imaging component 2 does not respond to the substrate 31, or the imaging component 2 always responds with invalid information to the substrate 31. It should be understood that the detection component is equipped with a comparator to compare the loop voltage, loop current, or loop power consumption with the preset value.

[0052] It should be understood that the preset values ​​for loop voltage, loop current, and loop power consumption are all different. When setting the preset values ​​for loop voltage, loop current, or loop power consumption, the voltage, current, or power consumption of the loop formed by the two contact pins 21 can be detected when the substrate 31 is the original substrate 31. The voltage detected in this case can be used as the preset value for loop voltage, the detected current as the preset value for loop current, and the detected power consumption as the preset value for loop power consumption. Of course, in practical applications, the preset values ​​for loop voltage, loop current, or loop power consumption can also be set based on experience or according to actual needs. This embodiment does not specifically limit this.

[0053] As an example, give as follows Figure 6 and Figure 7 A schematic diagram of the electrical connections of the imaging device is shown. Figure 6 and Figure 7 In the imaging component 2, there are detection components, a first stylus and a second stylus. The detection component includes a main controller and a detection circuit. The detection circuit is used to detect the loop voltage or loop current of the loop between the first stylus and the second stylus and the contact portion 311 of the substrate 31. The main controller is used to calculate the loop loss based on the loop voltage and loop current. At the same time, the main controller is provided with a comparator, which can compare the loop voltage or loop current with a preset value.

[0054] The substrate 31 includes an electronic module and a contact portion 311. The electronic module includes a storage module and a control module. The storage module can use common non-volatile memory cells, such as EPROM, EEPROM, FLASH, ferroelectric memory cells, phase-change memory cells, etc., or it can use volatile memory cells plus a power supply, such as SRAM plus a battery or capacitor, DRAM plus a battery or capacitor, etc. The control module is used to control the communication between the substrate 31 and the imaging component 2. The imaging component 2 reads information from the electronic module and stores information in the electronic module. The control module can specifically be a microcontroller (MCU), FPGA, logic circuit (ASIC), etc. The composition of the electronic module can be selected according to actual needs, and is not limited here.

[0055] If substrate 31 is as Figure 6 As shown, the substrate 31 includes all contact parts 311 that enable stable communication without affecting imaging quality. Specifically, the substrate 31 is provided with a first contact part for contacting the first stylus and a second contact part 1 for contacting the second stylus. A stable circuit will be formed between the first stylus 1, the second stylus, the first contact part, and the second contact part. That is, a stable conductive circuit is formed between the main controller and the electronic module. Correspondingly, if the circuit current, circuit voltage, or circuit power consumption detected by the detection component all reach the preset value, then read and write commands between the imaging component 2 and the substrate 31 are allowed.

[0056] If substrate 31 is as Figure 7 As shown, if the substrate 31 lacks a first contact portion corresponding to the first contact and / or a second contact portion corresponding to the second contact, then an unstable circuit with an interruption is formed between the main controller and the electronic module. In this case, the circuit voltage, circuit current, or circuit power consumption detected by the detection component does not reach the preset value. Therefore, read and write commands between the imaging component 2 and the substrate 31 are prohibited.

[0057] It should be noted that when the substrate 31 lacks a first contact portion corresponding to the first contact and / or a second contact portion corresponding to the second contact, the substrate 31 needs to be equipped with an external device capable of maintaining normal communication, such as a battery or capacitor. Figure 7 The power consumption of substrate 31 will be lower than Figure 6 The power consumption of substrate 31 means that, because an external device is added to maintain normal communication, the power consumption of the stable circuit will be greater than that of the unstable circuit. If the power consumption on the circuit is higher than the preset value, it means that a circuit is formed between the first terminal, the third terminal, and the third terminal on the device side, and read / write commands between the printing device and the chip are allowed; otherwise, read / write commands are stopped.

[0058] In some embodiments, after the imaging component 2 stops supplying power, and after the imaging component switches from supplying power to the substrate 31 to stopping supplying power, the detection component detects whether the time it takes for the voltage of one of the two styluses 21 to recover to a preset voltage is greater than a preset time.

[0059] Specifically, if the time it takes for the voltage of one of the contact pins 21 to recover to a preset voltage is greater than a preset time, it indicates that the performance of the substrate 31 meets the preset conditions, and therefore the transmission of read / write commands between the imaging component 2 and the substrate 31 is allowed. If the time it takes for the voltage of the contact pin 21 connected to the parasitic capacitance to recover to the preset voltage is less than a preset time, it indicates that the performance of the substrate 31 does not meet the preset conditions, and therefore the transmission of read / write commands between the imaging component 2 and the substrate 31 is stopped; that is, the imaging component 2 does not respond to the substrate 31, or the imaging component 2 always responds with invalid information to the substrate 31.

[0060] In this embodiment, one of the two probes 21 detected by the detection component can be a probe connected to a parasitic capacitor. The preset time can be set manually based on experience or according to actual needs. Alternatively, when the substrate 31 is the original substrate 31, power can be supplied to the probe 21 connected to the parasitic capacitor first to charge the parasitic capacitor, and then the power supply can be turned off. At the same time, the time it takes for the voltage of the probe 21 connected to the parasitic capacitor to drop to the preset terminal voltage is counted, and this time is used as the preset time. This embodiment does not make specific limitations on this.

[0061] In this embodiment, the first preset voltage can be set manually based on experience or according to actual needs. This embodiment does not impose specific limitations. For example, the preset voltage can be set to 0.

[0062] In this embodiment, the contact pins 21 connected to parasitic capacitances include, but are not limited to, clock contact pins, data contact pins, chip select contact pins, and / or ground contact pins. When these contact pins 21 are in a stable power-on circuit, they have terminal voltages, and the parasitic capacitances connected to the contact pins 21 are charged. After the power supply is disconnected, the parasitic capacitances discharge, causing the voltage of the contact pins 21 to quickly drop to a preset voltage.

[0063] Therefore, if the voltage of the contact pin 21 drops to 0 in a relatively short time after the power supply is turned off, it means that the parasitic capacitance is discharging rapidly in the circuit; if the voltage of the contact pin 21 drops to 0 slowly, it means that the parasitic capacitance cannot discharge rapidly in the circuit, but is undergoing a slow leakage process. This indicates that the parasitic capacitance is not in a stable circuit, which means that there is a problem with the circuit where the contact pin 21 is located, posing a safety hazard. Therefore, the use of the substrate 31 should be restricted or prohibited.

[0064] In some embodiments, the detection component detects whether the waveform of the pulse width modulation signal or sine wave signal between the two styluses 21 is distorted.

[0065] In this embodiment, when the waveform of the pulse width modulation signal or sine wave signal between the two styluses 21 is not distorted, it indicates that the performance of the substrate 31 meets the preset conditions, and therefore the transmission of read / write commands between the imaging component 2 and the substrate 31 is allowed. When the waveform of the pulse width modulation signal or sine wave signal between the two styluses 21 is distorted, it indicates that the performance of the substrate 31 does not meet the preset conditions, and therefore the transmission of read / write commands between the imaging component 2 and the substrate 31 is stopped.

[0066] In this embodiment, the waveform distortion of the pulse width modulation signal or sine wave signal includes amplitude distortion, phase distortion, distortion distortion, and / or time delay distortion. Amplitude distortion refers to a change in the signal amplitude during transmission; phase distortion refers to a shift or jitter in the signal phase during transmission; distortion distortion refers to irregular deformation of the signal waveform during transmission; and time delay distortion refers to a change in the signal's time delay during transmission.

[0067] When the substrate 31 lacks the contact portion 311 corresponding to the two styluses 21, the signal transmitted in the circuit formed by the two styluses 21 and the contact portion 311 provided on the substrate 31 will be distorted due to poor transmission medium quality or signal attenuation during transmission. Therefore, once the waveform of the signal transmitted in the circuit is detected to be distorted, it can be considered that the circuit has failed and the performance of the substrate 31 does not meet the preset conditions.

[0068] In some embodiments, after the imaging component 2 switches the power supply to the substrate 31 from de-energized to restored, the detection component detects whether it can read the response flag bit of the target stylus 21 of the two stylus 21 from the memory. The response flag bit is used to indicate that the circuit formed by the target stylus 21 is a stable circuit, and the target stylus 21 is one of the two stylus 21.

[0069] It should be understood that when the two contact pins 21 form a stable conductive circuit with the contact portion 311 of the substrate 31, the target contact pin 21 has a terminal voltage. After the power supply is turned off, the voltage of the target contact pin 21 slowly decreases. Therefore, after a set time, the terminal voltage of the target contact pin 21 can still be detected to be greater than the voltage threshold. So, if the terminal voltage of the target contact pin 21 can still be detected to be greater than the voltage threshold after the power supply is turned off, it indicates that the circuit formed by the target contact pin 21 before the power supply was turned off was a stable circuit. At this time, an acknowledgment flag is stored in the memory of the main controller included in the control unit. This acknowledgment flag is used to indicate that the circuit formed by the target contact pin 21 is a stable circuit.

[0070] After power is restored, if the response flag of the target pin 21 can be read from the memory, it is assumed that the performance of the substrate 31 meets the preset conditions, and read and write commands between the printing device and the chip are allowed.

[0071] In the imaging device provided in this embodiment, a substrate is provided on a container that can be contained by the receiving component. A contact part is provided on the substrate, and a stylus is provided on the imaging component. The contact part and the stylus contact each other to realize communication between the substrate and the imaging component. By detecting whether the circuit between the contact part and the stylus is normal, the performance of the substrate is detected, thereby effectively preventing the installation of poor-quality substrates (such as chips) into the imaging device, which would affect the imaging quality and imaging efficiency.

[0072] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0073] The block diagrams of devices, apparatuses, devices, and systems disclosed herein are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0074] Additionally, as used herein, the "or" used in a list of items beginning with "at least one" indicates a separate list, such that a list of, for example, "at least one of A, B, or C" means A or B or C, or AB or AC or BC, or ABC (i.e., A and B and C). Furthermore, the word "exemplary" does not imply that the described example is preferred or better than other examples.

[0075] It should also be noted that in the systems and methods of this disclosure, the components or steps can be decomposed and / or recombined. These decompositions and / or recombinations should be considered as equivalent solutions to this disclosure.

[0076] Various changes, substitutions, and modifications can be made to the technology described herein without departing from the teachings defined by the appended claims. Furthermore, the scope of the claims of this disclosure is not limited to the specific aspects of the processes, machines, manufactures, events, means, methods, and actions described above. Currently existing or later-developed processes, machines, manufactures, events, means, methods, or actions that perform substantially the same function or achieve substantially the same result as the corresponding aspects described herein can be utilized. Therefore, the appended claims include such processes, machines, manufactures, events, means, methods, or actions within their scope.

[0077] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features disclosed herein.

[0078] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this disclosure to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations therein.

Claims

1. An imaging device, characterized in that, include: Housing components and imaging components; The receiving component is used to receive a container for providing imaging material. The container is provided with a substrate, and the substrate is provided with a plurality of contact portions. The substrate contacts the pins provided on the imaging component through the contact portions to achieve communication with the imaging component. The pins provided on the imaging component include power pins, clock pins, data pins, chip select pins, and ground pins. The number of contact portions provided on the substrate is less than or equal to the number of pins provided on the imaging component. The imaging component includes a detection component, which is electrically connected to at least two styluses. The detection component is used to detect, after the container is embedded into the receiving component, whether the performance of the substrate meets preset conditions through the at least two styluses. The preset conditions can indicate whether the circuit between two of the at least two styluses and the contact portion on the substrate is normal. When it is detected that the number of contact portions provided on the substrate is less than the number of styluses provided on the imaging component, the use of the substrate is restricted or prohibited.

2. The imaging device according to claim 1, characterized in that, The detection component detects whether the loop voltage, loop current, or loop power consumption between the two styluses meets a preset value.

3. The imaging device according to claim 1, characterized in that, After the imaging component switches from power supply to the substrate to power supply stop, the detection component detects whether the time it takes for the voltage of one of the two styluses to recover to a preset voltage is greater than a preset time.

4. The imaging device according to claim 1, characterized in that, The detection component detects whether the waveform of the pulse width modulation signal or sine wave signal between the two styluses is distorted.

5. The imaging device according to claim 1, characterized in that, After the imaging component switches the power supply to the substrate from off to restored, the detection component detects whether it can read the response flag bit of the target stylus from the memory. The response flag bit is used to indicate that the circuit formed by the target stylus is a normal circuit, and the target stylus is one of the two styluses.

6. The imaging device according to claim 1, characterized in that, The substrate has three or four contact portions.

7. The imaging device according to claim 6, characterized in that, The substrate lacks a grounding contact portion corresponding to the grounding pin, and / or the substrate lacks a chip select contact portion corresponding to the chip select pin.

8. The imaging device according to claim 1, characterized in that, The two contacts are a power contact and a ground contact, respectively. The substrate lacks at least one contact portion corresponding to a functional contact. The functional contact is one of the power contact, the clock contact, the data contact, the chip select contact, and the ground contact.

9. The imaging device according to claim 8, characterized in that, The substrate lacks a grounding contact portion corresponding to the grounding pin, or the substrate lacks a power contact portion corresponding to the power pin.

10. The imaging device according to any one of claims 1 to 9, characterized in that, The restriction or prohibition of the use of the substrate is at least one of the following: The imaging component does not respond to the substrate; or... The imaging component always responds to invalid information to the substrate; or... The imaging component does not store the information transmitted by the substrate; or... The imaging component cuts off the voltage supplied to the substrate.

Images