Thin film material taking and transferring device
By using a mesh structure and pressure-relieving components, the problem of protrusion formation during the transfer of thin film materials was solved, achieving uniform adsorption and fixation and improving product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN SHIZONG AUTOMATION EQUIP CO LTD
- Filing Date
- 2026-02-10
- Publication Date
- 2026-05-12
AI Technical Summary
The negative pressure suction hole structure of the existing adsorption stage causes bumps to form on the thin film material during the transfer process, which affects product quality.
A grid structure with mesh is used for negative pressure adsorption, combined with a pressure-reducing component to buffer the downward pressure and prevent the formation of protrusions.
It achieves uniform adsorption and fixation of thin membrane materials, avoids the formation of protrusions, improves product quality, and extends the service life of the mesh.
Smart Images
Figure CN122009872A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of workpiece carrier technology, and in particular to a thin film material handling and transfer device. Background Technology
[0002] As the name suggests, a workpiece carrier is used to load products. Products can be placed directly on it or fixed on it by vacuum adsorption. For thin film materials, such as screen protectors used in smart devices, they are usually fixed on an adsorption platform by vacuum adsorption for operations such as peeling.
[0003] As a current technology, the conventionally used adsorption stage has a suction area formed on its upper surface with multiple spaced negative pressure suction holes, which are used to adsorb and fix the thin film material under negative pressure.
[0004] The inventors of this patent discovered that the above operation has the following problem: regardless of the magnitude of the negative pressure suction of the multiple negative pressure suction holes, because the thin film material being adsorbed and fixed is very thin and very soft, when the vacuum is released from the multiple negative pressure suction holes and the robotic arm is used to pick up and transfer the thin film material, the bottom surface of the thin film material will form multiple protrusions due to the negative pressure adsorption of the multiple negative pressure suction holes, thus affecting the quality of the thin film material related products.
[0005] In response, the inventor of this patent, drawing on experience, deeply considered the problems encountered in his work, reviewed a large amount of scientific research data and literature, and gradually conceived and designed this application through a novelty search to solve the relevant technical problems. Summary of the Invention
[0006] This invention aims to at least partially solve one of the technical problems in related technologies. Therefore, the object of this invention is to provide a thin film material handling and transfer device.
[0007] To achieve one of the above objectives, a thin film material handling and transfer device according to an embodiment of the present invention includes a mesh sheet and a fixing frame for supporting the mesh sheet; The middle part of the mesh is formed with a grid to support the thin film material, and a sealing ring is formed around the grid. The bottom surface of the sealing ring is fixed to the upper surface of the fixing frame. The inside of the fixing frame is formed with a negative pressure cavity to generate negative pressure to adsorb the thin film material downward.
[0008] In addition, the thin film material handling and transfer device according to the above embodiments of the present invention may also have the following additional technical features: According to one embodiment of the present invention, the grid mesh has a plurality of closely and uniformly arranged mesh openings, the mesh opening diameter being D, wherein D = 0.5 mm - 2.0 mm; and the spacing between two adjacent mesh openings being L, wherein L = 0.3 mm - 1.2 mm.
[0009] According to one embodiment of the present invention, the sealing ring is formed by applying a sealing adhesive to the periphery of the upper surface and / or the periphery of the lower surface of the grid and then curing it.
[0010] According to one embodiment of the present invention, it further includes a base plate for sealing the negative pressure chamber; The fixed frame is stacked and fixed on the upper surface of the bottom support plate; the bottom surface of the bottom support plate is provided with an air inlet connector and an exhaust connector that connect to the negative pressure chamber.
[0011] According to one embodiment of the present invention, the bottom surface of the base plate is further provided with a fixing member for binding and fixing the air guide pipe connected to the air inlet and the air outlet.
[0012] According to one embodiment of the invention, it further includes a pressure-relieving member for supporting the base plate; The pressure-relieving component can be fixed to the bottom of the base plate by being compressed downwards.
[0013] According to one embodiment of the present invention, the pressure-relieving component includes a fixed plate, multiple guide rods, and multiple pressure-relieving springs; The fixing plate is located directly below the bottom support plate, and its upper surface has a plurality of guide holes that penetrate to its lower surface. A plurality of guide rods are correspondingly and movably inserted into the plurality of guide holes, and their upper ends are detachably connected to the lower surface of the bottom support plate. Their lower ends are respectively provided with a stop outer edge, and the outer diameter of the plurality of stop outer edges is larger than the inner diameter of the plurality of guide holes. Multiple pressure-relieving springs are correspondingly sleeved on the multiple guide rods and are all limited between the bottom support plate and the fixed plate. Their upper ends all abut against the lower bottom surface of the bottom support plate and their lower ends all abut against the upper top surface of the fixed plate. Initially, all of the aforementioned pressure-relieving springs are in a compressed state, and the upper surfaces of the outer edges of the multiple stops abut against the lower surface of the fixed plate.
[0014] According to one embodiment of the present invention, the outer diameter of the plurality of guide rods is slightly smaller than the inner diameter of the plurality of guide holes, and the outer diameter of the plurality of pressure-relieving springs is slightly larger than the inner diameter of the plurality of guide holes.
[0015] According to one embodiment of the present invention, the pressure-relieving member further includes a plurality of spring baffles; Multiple spring baffles are correspondingly sleeved on the outside of multiple guide rods and are correspondingly limited between the bottom of multiple pressure-relieving springs and the upper surface of the bottom support plate.
[0016] According to one embodiment of the present invention, the pressure-relieving member further includes a plurality of bushings; Multiple bushings are detachably snapped into multiple guide holes, and multiple guide rods are movably inserted into multiple bushings.
[0017] Firstly, in the specific implementation of the thin film material handling and transfer device provided in this application, this application abandons the traditional structure of multiple negative pressure suction holes evenly spaced apart, and instead designs a mesh to replace it. The mesh of the designed mesh is obviously a grid structure, which contains multiple closely arranged mesh holes, so that the thin film material can be negatively adsorbed and fixed through the multiple closely arranged mesh holes. In this way, even if the bottom surface of the thin film material that is negatively adsorbed and fixed is uniformly adsorbed and fixed by negative pressure, the bottom surface is not prone to obvious protrusions due to negative pressure adsorption, so that the product quality can be effectively guaranteed.
[0018] Secondly, in actual use of this application, when a robotic arm places the thin film material it has grasped onto the grid mesh, a certain downward pressure will be generated on the grid mesh at the moment of placement. At this time, this application provides the pressure-relieving component, which is fixed to the bottom of the base plate in a way that can be compressed downward. In this way, at the moment the grid mesh is pressed down, the pressure-relieving component buffers the downward pressure, so that the grid mesh is not hard pressed down, but is flexibly pressed down by a slight amplitude due to the presence of the pressure-relieving component, making it less likely to be crushed, thus resulting in a long service life of the mesh sheet of this application.
[0019] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0021] Figure 1 This is a schematic diagram of the overall structure of the thin film material handling and transfer device of the present invention. Figure 1 ; Figure 2This is a breakdown of the thin film material handling and transfer device of the present invention. Figure 1 ; Figure 3 yes Figure 2 Enlarged view of E in the middle; Figure 4 This is a schematic diagram of the overall structure of the thin film material handling and transfer device of the present invention. Figure 2 ; Figure 5 This is a breakdown of the thin film material handling and transfer device of the present invention. Figure 2 ; Figure label:
[0022] 10 mesh panels; Grille 101; 1011 mesh size; Sealing ring 102; Fixed frame 20; Negative pressure chamber 201; Base plate 30; Inlet connector 301; Exhaust connector 302; Fastener 303; Pressure-relieving component 40; Fixing plate 401; Guide hole 4011; Guide rod 402; 4021 is used to stop the outer edge. 403 pressure relief spring; Spring baffle 404; 405 bushing; The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0023] The embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0024] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "circumferential," and "radial," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.
[0026] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0027] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0028] The thin film material handling and transfer device 1000 of the present invention will now be described in detail with reference to the accompanying drawings.
[0029] Reference Figures 1 to 5 As shown, the thin film material handling and transfer device 1000 provided according to an embodiment of the present invention includes a mesh 10 and a fixing frame 20 for supporting the mesh 10; The mesh 10 has a grid 101 in the middle to support the thin film material, and a sealing ring 102 is formed around the grid 101. The bottom surface of the sealing ring 102 is fixed to the upper surface of the fixing frame 20. The fixing frame 20 has a negative pressure cavity 201 inside to generate negative pressure to adsorb the thin film material downward.
[0030] Based on the above, it is clear that in specific implementation, this application is mainly used as a thin film material handling and transfer device 1000.
[0031] Specifically, when applying this application, a robotic arm is used to place the thin film material it has grasped onto the grid 101, and the negative pressure suction component connected to the negative pressure chamber 201 is activated, so that the grid 101 can be used to perform negative pressure adsorption and fixation on the thin film material.
[0032] Clearly, the use of this application as described above will have the following technical effects: This application abandons the traditional structure of multiple evenly spaced negative pressure suction holes and replaces it with a mesh 10. The mesh 10 has a grid structure with multiple closely spaced holes 1011. The thin film material is fixed by negative pressure adsorption through the multiple closely spaced holes 1011. In this way, the bottom surface of the thin film material is uniformly fixed by negative pressure adsorption, so that the bottom surface is not prone to obvious bumps due to negative pressure adsorption, thus effectively ensuring the product quality.
[0033] Furthermore, through the above-mentioned optimized design, the whole constituted by this application is highly practical and has a good effect in use.
[0034] Preferably, in this technical solution, compared with Figure 2 , Figure 3 and Figure 5 As shown, according to one embodiment of the present invention, the grid 101 has a plurality of closely and uniformly arranged mesh holes 1011, the aperture of the mesh holes 1011 is D, where D = 0.5mm-2.0mm; the spacing between two adjacent mesh holes 1011 is L, where L = 0.3mm-1.2mm.
[0035] Therefore, it can be clearly stated that the grid mesh 101 has a porous structure with multiple closely and evenly arranged mesh holes 1011. Since the diameter of each mesh hole 1011 is D, where D = 0.5mm-2.0mm, and the distance between two adjacent mesh holes 1011 is L, where L = 0.3mm-1.2mm, the multiple closely and evenly arranged mesh holes 1011 of the grid mesh 101 in this application are indeed very dense and small. This ensures that the various positions on the bottom surface of the thin film material that is fixed by negative pressure adsorption are indeed uniformly adsorbed and fixed by negative pressure. The bottom surface is not likely to have obvious protrusions due to negative pressure adsorption, so that the product quality can be effectively guaranteed.
[0036] Furthermore, in a specific implementation, according to one embodiment of the present invention, the sealing ring 102 is formed by applying a sealing adhesive to the periphery of the upper end face and / or the periphery of the lower bottom face of the grid mesh 101 and then curing it.
[0037] Clearly, the sealing adhesive used in this application has a dual function: on the one hand, when applied to the periphery of the upper surface and / or the periphery of the lower surface of the grid 101, it forms the sealing ring 102 after curing, thus constituting part of the mesh 10 and facilitating the sealing of the periphery of the negative pressure chamber 201 to prevent air leakage; on the other hand, when it contacts the upper surface of the fixing frame 20, it can effectively fix the periphery of the mesh 10 to the upper surface of the fixing frame 20 as a whole, making the mesh 10 less prone to loosening and displacement, thus ensuring the stable and reliable use of this application.
[0038] Furthermore, in this technical solution, compared with Figure 2 and Figure 5 As shown, according to one embodiment of the present invention, this application further includes a base plate 30 for sealing the negative pressure chamber 201; The fixed frame 20 is stacked and fixed on the upper surface of the base plate 30; the bottom surface of the base plate 30 is provided with an air inlet connector 301 and an exhaust connector 302 that are connected to the negative pressure chamber 201. The air inlet connector 301 and the exhaust connector 302 are used to connect to external negative pressure suction components, such as negative pressure suction devices, etc.
[0039] Thus, by using a negative pressure suction device to draw air outward from the exhaust port 302, the negative pressure chamber 201 can be evacuated to form a negative pressure, so as to adsorb and fix the thin film material placed on the grid 101 under negative pressure. Conversely, by inflating air inward from the air inlet port 301, the negative pressure chamber 201 can be inflated to release the vacuum, so as to use a robot to pick up the thin film material placed on the grid 101.
[0040] Preferably, in specific implementation, refer to Figure 4 and Figure 5 As shown, according to one embodiment of the present invention, the bottom surface of the base plate 30 is further provided with a fixing member 303 for binding and fixing the air guide pipes connected to the air inlet connector 301 and the exhaust connector 302.
[0041] In this way, the required air duct is fixed in place and is not easy to shake, which makes its use stable.
[0042] Furthermore, in specific implementation, in accordance with... Figure 2 , Figure 4 and Figure 5 As shown, according to one embodiment of the present invention, this application also includes a pressure-relieving member 40 for supporting the bottom support plate 30; The pressure-relieving member 40 is fixedly mounted at the bottom of the base plate 30 and can be compressed downwards.
[0043] Therefore, it can be understood that in actual use of this application, when a robotic arm is used to place the thin film material it has grasped onto the grid 101, a certain downward pressure will be generated on the grid 101 at the moment of placement. At this time, this application provides the pressure-relieving member 40, and the pressure-relieving member 40 is fixed to the bottom of the base plate 30 in a way that can be compressed downward. In this way, at the moment when the grid 101 is pressed down, the pressure-relieving member 40 buffers the downward pressure, so that the grid 101 is not hard pressed down, but is flexibly pressed down slightly due to the presence of the pressure-relieving member 40, making it less likely to be crushed, thus resulting in a long service life of the mesh 10 of this application.
[0044] Furthermore, in this technical solution, we continue to compare... Figure 2 , Figure 4 and Figure 5 As shown, according to one embodiment of the present invention, the pressure-relieving member 40 includes a fixing plate 401, multiple guide rods 402 and multiple pressure-relieving springs 403; The fixing plate 401 is located directly below the bottom support plate 30, and its upper surface has a plurality of guide holes 4011 that penetrate to its lower surface. A plurality of guide rods 402 are correspondingly movable up and down and are interference-fitted through the plurality of guide holes 4011. Their upper ends are detachably connected to the lower surface of the bottom support plate 30, and their lower ends are respectively provided with a stop outer edge 4021. The outer diameter of the plurality of stop outer edges 4021 is larger than the inner diameter of the plurality of guide holes 4011. Furthermore, multiple pressure-relieving springs 403 are correspondingly sleeved on the multiple guide rods 402, and are all limited between the bottom support plate 30 and the fixing plate 401. Their upper ends all abut against the lower bottom surface of the bottom support plate 30, and their lower ends all abut against the upper end surface of the fixing plate 401. Initially, all of the pressure-relieving springs 403 are in a compressed state, and the upper surfaces of the multiple outer edges of the stops 4021 abut against the lower surface of the fixing plate 401.
[0045] Therefore, in actual use of this application, when the thin film material grasped by the robotic arm is placed on the grid 101, a certain downward pressure will be generated on the grid 101 at the moment of placement. At this time, the pressure relief spring 403 of the pressure relief component 40 of this application will be pressed down slightly and further compressed. The multiple guide rods 402 will move down slightly along the multiple guide holes 4011 to drive the whole structure composed of the bottom support plate 30, the fixing frame 20 and the mesh 10 to move down slightly. At this time, the downward pressure can be buffered by the pressure relief component 40 so that the grid 101 is flexibly pressed down slightly, making it less likely to be crushed, so that the mesh 10 of this application has a long service life.
[0046] Furthermore, in a specific implementation, according to one embodiment of the present invention, the outer diameter of the plurality of guide rods 402 is slightly smaller than the inner diameter of the plurality of guide holes 4011, and the outer diameter of the plurality of pressure-relieving springs 403 is slightly larger than the inner diameter of the plurality of guide holes 4011.
[0047] Thus, even when multiple pressure-relieving springs 403 are compressed, their vertical movement is stable, and their bottoms are not easily jammed into the multiple guide holes 4011.
[0048] Preferably, in this technical solution, the comparison is still made. Figure 2 , Figure 4 and Figure 5 As shown, according to one embodiment of the present invention, the pressure-relieving member 40 further includes a plurality of spring baffles 404; Among them, multiple spring baffles 404 are correspondingly sleeved on multiple guide rods 402 and correspondingly limited between the bottom of multiple pressure relief springs 403 and the upper end face of the bottom support plate 30.
[0049] Therefore, by setting multiple spring baffles 404 and correspondingly sleeved on the outside of multiple guide rods 402, and correspondingly limited between the bottom of multiple pressure-relieving springs 403 and the upper end face of the bottom support plate 30, it is possible to block the bottom of multiple pressure-relieving springs 403, making it less likely for the bottom of multiple pressure-relieving springs 403 to be stuck into the multiple guide holes 4011, thus making the application more stable and reliable in use.
[0050] It should be added that, in a specific implementation, according to one embodiment of the present invention, the pressure-relieving member 40 further includes a plurality of bushings 405; Among them, multiple bushings 405 are detachably snapped into multiple guide holes 4011, and multiple guide rods 402 are movably inserted into multiple bushings 405.
[0051] Therefore, by setting multiple bushings 405 for isolation, even when multiple guide posts move up and down along the multiple guide holes 4011, the multiple guide holes 4011 are not easily worn out, thus making the fixing plate 401 of this application have a long service life.
[0052] It should be noted that when the inner walls of multiple bushings 405 are worn due to insertion and removal, they can be disassembled and replaced, as they are consumable parts, so it is not necessary to replace the entire fixing plate 401.
[0053] Furthermore, in specific implementation, according to the thin film material handling and transfer device 1000 provided in the embodiment of the present invention, a soft rubber sealing ring is preferably fitted between the fixing frame 20 and the bottom support plate 30 to ensure good air leakage prevention between them.
[0054] Furthermore, in specific implementation, the mesh 10 of the thin film material handling and transfer device 1000 provided according to the embodiments of the present invention is preferably made of stainless steel or corundum material, so as to make it hard and firm and have a long service life.
[0055] Other embodiments, etc., will not be described here.
[0056] In summary, the thin film material handling and transfer device 1000 provided in this application, in its specific implementation, abandons the traditional structure of multiple uniformly spaced negative pressure suction holes and replaces it with a mesh 10. The mesh 10 has a grid structure with a grid-like structure containing multiple closely spaced mesh holes 1011. The thin film material is then negatively adsorbed and fixed through these mesh holes. In this way, the bottom surface of the thin film material is uniformly adsorbed and fixed by negative pressure, making it less likely for obvious bumps to appear on the bottom surface due to negative pressure adsorption, thus effectively ensuring product quality.
[0057] Furthermore, in actual use of this application, when a robotic arm places the thin film material it has grasped onto the grid 101, a certain downward pressure will be generated on the grid 101 at the moment of placement. At this time, this application provides the pressure-relieving member 40, and the pressure-relieving member 40 is fixed to the bottom of the base plate 30 in a way that can be compressed downward. In this way, at the moment when the grid 101 is pressed down, the pressure-relieving member 40 buffers the downward pressure, so that the grid 101 is not hard pressed down, but is flexibly pressed down slightly due to the presence of the pressure-relieving member 40, making it less likely to be crushed, thus resulting in a long service life of the mesh 10 of this application.
[0058] Furthermore, the thin film material handling and transfer device 1000 provided in this application is indeed highly practical and has excellent performance, which makes this application inherently valuable for market promotion and will certainly be very popular and widely adopted.
[0059] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0060] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.
Claims
1. A thin film material handling and transfer device, characterized in that, Includes a mesh panel and a fixing frame for supporting the mesh panel; The middle part of the mesh is formed with a grid to support the thin film material, and a sealing ring is formed around the grid. The bottom surface of the sealing ring is fixed to the upper surface of the fixing frame. The inside of the fixing frame is formed with a negative pressure cavity to generate negative pressure to adsorb the thin film material downward.
2. The thin film material handling and transfer device according to claim 1, characterized in that, The grid has multiple closely spaced and evenly arranged mesh openings, the mesh opening diameter being D, where D = 0.5 mm - 2.0 mm; the spacing between two adjacent mesh openings is L, where L = 0.3 mm - 1.2 mm.
3. The thin film material handling and transfer device according to claim 1, characterized in that, The sealing ring is formed by applying a sealing adhesive to the periphery of the upper surface and / or the periphery of the lower surface of the grid and then curing it.
4. The thin film material handling and transfer device according to claim 1, characterized in that, It also includes a base plate for sealing the negative pressure chamber; The fixed frame is stacked and fixed on the upper surface of the bottom support plate; the bottom surface of the bottom support plate is provided with an air inlet connector and an exhaust connector that connect to the negative pressure chamber.
5. The thin film material handling and transfer device according to claim 4, characterized in that, The bottom surface of the base plate is also provided with a fixing member for binding and fixing the air guide pipe connected to the air inlet and the air outlet.
6. The thin film material handling and transfer device according to claim 4, characterized in that, It also includes a pressure-relieving component for supporting the base plate; The pressure-relieving component can be fixed to the bottom of the base plate by being compressed downwards.
7. The thin film material handling and transfer device according to claim 6, characterized in that, The pressure-relieving component includes a fixed plate, multiple guide rods, and multiple pressure-relieving springs; The fixing plate is located directly below the bottom support plate, and its upper surface has a plurality of guide holes that penetrate to its lower surface. A plurality of guide rods are correspondingly and movably inserted into the plurality of guide holes, and their upper ends are detachably connected to the lower surface of the bottom support plate. Their lower ends are respectively provided with a stop outer edge, and the outer diameter of the plurality of stop outer edges is larger than the inner diameter of the plurality of guide holes. Multiple pressure-relieving springs are correspondingly sleeved on the multiple guide rods and are all limited between the bottom support plate and the fixed plate. Their upper ends all abut against the lower bottom surface of the bottom support plate and their lower ends all abut against the upper top surface of the fixed plate. Initially, all of the aforementioned pressure-relieving springs are in a compressed state, and the upper surfaces of the outer edges of the multiple stops abut against the lower surface of the fixed plate.
8. The thin film material handling and transfer device according to claim 7, characterized in that, The outer diameter of the multiple guide rods is slightly smaller than the inner diameter of the multiple guide holes, and the outer diameter of the multiple pressure-relieving springs is slightly larger than the inner diameter of the multiple guide holes.
9. The thin film material handling and transfer device according to claim 8, characterized in that, The pressure-relieving component also includes multiple spring baffles; Multiple spring baffles are correspondingly sleeved on the outside of multiple guide rods and are correspondingly limited between the bottom of multiple pressure-relieving springs and the upper surface of the bottom support plate.
10. The thin film material handling and transfer device according to claim 9, characterized in that, The pressure-relieving component also includes multiple bushings; Multiple bushings are detachably snapped into multiple guide holes, and multiple guide rods are movably inserted into multiple bushings.