Method for manufacturing electronic component and medium
By using materials that sublimate below the firing temperature for tumbling grinding and burning the grinding chips during high-temperature firing, the problem of electronic component quality degradation caused by the chemical reaction of grinding chips was solved, and high-quality electronic component manufacturing was achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SINTOKOGIO LTD
- Filing Date
- 2025-11-10
- Publication Date
- 2026-05-12
AI Technical Summary
In the prior art, when electronic components are ground before firing, there is a risk that the grinding debris may undergo a chemical reaction, leading to a deterioration in the quality of the electronic components.
The grinding process employs a media consisting solely of materials that sublimate at temperatures below the firing temperature. The grinding debris is then sublimated and burned off during high-temperature firing, thus avoiding chemical reactions.
This effectively prevents the grinding debris from undergoing a chemical reaction during sintering, thus improving the quality of electronic components.
Smart Images
Figure CN122010559A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to methods and media for manufacturing electronic components. Background Technology
[0002] Patent Document 1 discloses a method for manufacturing a multilayer ceramic capacitor. In this method, a multilayer having ceramic layers is ground using a tumbling mill. The grinding medium is formed of silicon dioxide or aluminum oxide, or both. A conductive paste film for external electrodes is formed on the ground multilayer, and the multilayer with the conductive paste film is then fired.
[0003] Existing technical documents
[0004] Patent documents
[0005] Patent Document 1: Japanese Patent Application Publication No. 2003-324007 Summary of the Invention
[0006] As described in Patent Document 1, electronic components containing ceramic materials are ground before firing. However, there is a risk that the grinding debris containing metallic elements may undergo a chemical reaction during firing. The chemically reacted grinding debris may affect the quality of the electronic components. This disclosure provides a technique for preventing the degradation of electronic component quality due to a chemical reaction of grinding debris during sintering in electronic components containing ceramic materials.
[0007] One aspect of this disclosure relates to a method for manufacturing an electronic component, which includes the following steps.
[0008] (1) The process of preparing an unfired or low-temperature fired electronic component body made of ceramic material;
[0009] (2) The process of tumbling the electronic component body;
[0010] (3) The process of firing the electronic component body after tumbling grinding;
[0011] In this process, tumbling is performed using a medium consisting only of materials that sublimate at temperatures lower than those of the firing process, which includes sintering electronic components and removing the abrasive particles generated by tumbling.
[0012] The medium involved in another aspect of this disclosure is used in the manufacturing method of the aforementioned electronic component.
[0013] According to this disclosure, in electronic components containing ceramic materials, it is possible to avoid chemical reactions of grinding debris during sintering that could degrade the quality of the electronic components. Attached Figure Description
[0014] Figure 1This is a flowchart illustrating a method for manufacturing an electronic component according to one embodiment.
[0015] Figure 2 (A) is a cross-sectional view of an exemplary electronic component body. Figure 2 (B) is a cross-sectional view of an exemplary electronic component.
[0016] Figure 3 (A) is a schematic diagram of an exemplary drum grinding apparatus. Figure 3 (B) is a schematic diagram of an example of a cross-section of a roller groove. Detailed Implementation
[0017] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are given the same symbols, and repeated descriptions are omitted. The scale of the drawings is not necessarily the same as that of the description. The terms "upper," "lower," "left," and "right" are used for convenience based on the illustrated states.
[0018] Figure 1 This is a flowchart illustrating a method for manufacturing an electronic component according to one embodiment. Electronic components are the basic building blocks of electronic circuits, including resistors, capacitors, transistors, etc. Hereinafter, as an example, we will describe the case where the electronic component is a multilayer ceramic capacitor (MLCC). The ceramic material is, for example, barium zirconate-based or calcium zirconate-based, and the electrode material is, for example, conductive nickel. The multilayer ceramic capacitor is, for example, 4 mm or less in size.
[0019] like Figure 1 As shown, in the manufacturing method, a green sheet is first manufactured (step S10). In step S10, a paste is prepared by mixing raw material powder of ceramic dielectric with a binder. Next, the paste is stretched into a sheet form on a carrier film made of resin to obtain a green sheet.
[0020] Next, as step S12, internal electrodes are formed on the green sheet. In step S12, for example, a metal such as nickel is screen-printed on the green sheet.
[0021] Next, as step S14, cutting and stacking are performed. First, the green sheet with internal electrodes is cut to a specified size. Then, the electrode patterns of each cut sheet are aligned and stacked.
[0022] Next, as step S16, pressing is performed. In step S16, the stacked sheet groups are pressed together in the thickness direction to form an integral unit.
[0023] Next, as step S18, cutting is performed. In step S18, the crimped sheet assembly is cut to the size of a multilayer ceramic capacitor. Through the preparation steps S10 to S18 (step S20), multiple electronic component bodies are obtained from the crimped sheet assembly.
[0024] Figure 2 (A) is a cross-sectional view of an exemplary electronic component body. Figure 2 As shown in (A), the electronic component body W is a chip-shaped component body made of ceramic material. The electronic component body W has a ceramic dielectric 1 and a plurality of internal electrodes 2. Internal electrodes led to one side of the ceramic dielectric 1 and internal electrodes led to the other side are alternately arranged. Each internal electrode 2 is formed, for example, of nickel.
[0025] Back Figure 1 As a step S22, a semi-firing is performed using a firing furnace. The semi-firing is carried out at a temperature lower than that of the main firing, which will be described later, and is also called low-temperature firing. For example, the semi-firing is carried out at a temperature below 500°C. As a result, the binder (such as a carrier film made of resin) is removed from the electronic component body W.
[0026] Next, as step S24, the semi-fired electronic component body W is tumbled. Tumbled grinding is performed to chamfer the electronic component body W. The hardness of the ceramic is increased through the subsequent main firing. In this manufacturing method, by performing tumbled grinding before solidification using the main firing, the chamfering of the electronic component body W can be performed efficiently. That is, by performing tumbled grinding on the electronic component body W while it is in a softer state than after the main firing, the chamfering of the electronic component body W can be performed efficiently. Tumbled grinding, for example, uses... Figure 3 The grinding is performed using the drum grinding apparatus shown in (A). Drum grinding is not limited to grinding using a drum grinding apparatus. Drum grinding also includes grinding without using a drum grinding apparatus, and also includes grinding the object to be ground by placing a substance comprising the object to be ground and a medium M into a container and allowing the substance to flow.
[0027] Figure 3 (A) is a schematic diagram of an exemplary drum grinding apparatus. Figure 3 (B) is a schematic diagram showing an example of a cross-section of the roller groove. For example... Figure 3 As shown in (A), the drum grinding apparatus 10 includes multiple drum grooves 11, multiple drum groove housings 12, a pair of turntables 13 (revolving disks), a revolving shaft 14, a drive mechanism 15, and a driven mechanism 16. Figure 3 In one example shown in (A), the drum grinding apparatus 10 has four drum grooves 11. Three of the four drum grooves 11 are illustrated. Figure 3As shown in (B), the electronic component body W and the medium M are housed inside each roller groove 11.
[0028] The medium M is composed solely of materials that sublimate at temperatures lower than those of the main firing process (step S26) described later. The temperature of the main firing process (step S26) is, for example, 800°C or higher, with a specific example being 1000°C to 1300°C. The medium M is formed, for example, from organic or carbon-based materials. Organic materials can be natural organics such as walnuts, peaches, corn (corn cob), or starch, or synthetic organics such as thermoplastic or thermosetting resins. Carbon-based materials are, for example, diamond. Diamond has the property of changing into gas (CO2) and sublimating at temperatures above 800°C. The medium M can be bonded by an adhesive. The adhesive is, for example, composed of polyester-based resins. Examples of adhesive materials include polyester, polyamide, ethylene-ethyl acrylate, and ethylene-vinyl acetate copolymer. The medium M can be 6 mm or smaller in size. In this case, an electronic component body W of 4 mm or smaller can be appropriately ground.
[0029] Each roller groove housing 12 includes a rotation shaft 12a. The drive mechanism 15 includes a drive motor 15a, a motor pulley 15b, a revolution pulley 15c, and a drive belt 15d.
[0030] In the drum grinding apparatus 10, when the drive motor 15a operates, the driving force is transmitted to the turntable 13 via the motor pulley 15b, the drive belt 15d, and the revolution pulley 15c. The turntable 13 rotates around the revolution axis 14. Along with the rotation of the turntable 13, each drum groove 11, fixed to its respective drum groove housing 12, rotates (revolves) around the revolution axis 14. Additionally, each drum groove 11 rotates (rotates) around its own rotation axis 12a via the driven mechanism 16 in a direction opposite to the rotation direction of the turntable 13. As described above, each drum groove 11 rotates around its own rotation axis 12a (extending horizontally) and revolves around the revolution axis 14 (extending horizontally). That is, each drum groove 11 undergoes planetary motion around its horizontally extending rotation axis.
[0031] It should be noted that the tumbling grinding apparatus used in the manufacturing methods of electronic components is not limited to... Figure 3 The tumbling grinding apparatus 10 shown in (A) is an example of a tumbling grinding apparatus used in a method for manufacturing electronic components. For example, the tumbling grinding apparatus used in a method for manufacturing electronic components may be any one of a vibratory tumbling grinding apparatus, a flow tumbling grinding apparatus, a rotary tumbling grinding apparatus, or a gyroscopic tumbling grinding apparatus.
[0032] Next, as step S26, a main firing is performed using a firing furnace. The main firing is carried out at a temperature of 800°C or higher, as described above. Here, the binder is further removed from the electronic component body W, forming ceramic. Furthermore, the abrasive particles generated by the tumbling mill are burned off during the main firing process because they consist only of materials that sublimate at temperatures lower than those of the main firing process.
[0033] Then, as in step S28, such as Figure 2 As shown in (B), external electrodes 3 are provided on both sides of the electronic component body W. The external electrodes 3 are electrically connected to any one of the plurality of internal electrodes 2. Then, as step S30, surface treatments such as plating are performed. Thus, the electronic component 4 is completed. Figure 1 The flowchart shown ends here.
[0034] [Summary of Implementation Methods]
[0035] In the manufacturing method of electronic component 4, the medium M used for polishing the electronic component body W is composed only of a material that sublimates at a temperature lower than that of the main firing (step S26). As a result, the polishing shavings are burned off during the main firing (step S26), preventing metals and the like from adhering to the electronic component body W. Therefore, the quality of electronic component 4 is improved.
[0036] [Variation Example]
[0037] The above descriptions of various exemplary embodiments are not limited to the above-described exemplary embodiments, and various omissions, substitutions, and modifications can be made. For example, in the manufacturing method of electronic component 4, the semi-firing can be omitted. That is, if the electronic component body W cut in step S18 has strength that will not disintegrate due to tumbling, the tumbling in step S24 can be performed after cutting in step S18, followed by the main firing in step S26.
[0038] [Summary of embodiments of this disclosure]
[0039] This disclosure includes the following methods.
[0040] (Project 1)
[0041] One aspect of this disclosure relates to a method for manufacturing an electronic component, which includes the following steps:
[0042] (1) The process of preparing an unfired or low-temperature fired electronic component body made of ceramic material;
[0043] (2) The process of tumbling the electronic component body;
[0044] (3) The process of firing the electronic component body after tumbling grinding;
[0045] In this process, tumbling grinding is performed using a medium made only of materials that sublimate at temperatures lower than those of the firing process, which includes sintering electronic components and burning off the grinding debris generated by tumbling grinding.
[0046] In the manufacturing method of this electronic component, the electronic component body that has not been fired or has been fired at a low temperature is subjected to tumbling. Tumbling is performed using a medium composed only of materials that sublimate at temperatures lower than those of the firing process. Then, the tumbling-ground electronic component body is fired. This sintering process burns the electronic component body, and the abrasive particles generated during tumbling sublimate and burn away. Therefore, chemical reactions of the abrasive particles that could cause metals or other materials to adhere to the electronic component body are avoided. Thus, the manufacturing method of this electronic component prevents chemical reactions of the abrasive particles during sintering, which could degrade the quality of the electronic component.
[0047] (Project 2)
[0048] In the manufacturing method of the electronic component described in Project 1, the firing temperature can be above 800°C. In this case, ceramics can be fired while the dielectric reliably sublimates.
[0049] (Project 3)
[0050] In the manufacturing method of the electronic component described in Project 1 or 2, the dielectric can be formed from organic matter or diamond. In this case, the dielectric can sublimate into CO2.
[0051] (Project 4)
[0052] In the manufacturing method of the electronic component according to any one of items 1 to 3, the dielectric can be 6 mm or less in size. In this case, electronic components with a size of 4 mm or less can be reliably ground.
[0053] (Project 5)
[0054] In any one of the manufacturing methods of electronic components in items 1 to 4, the electronic component manufactured from the electronic component body can be 4 mm or less in size.
[0055] (Project 6)
[0056] In any one of the methods for manufacturing an electronic component in items 1 to 5, the electronic component manufactured from the electronic component body can be a multilayer ceramic capacitor.
[0057] (Project 7)
[0058] The medium disclosed herein is used in a method for manufacturing an electronic component according to any one of items 1 to 6. By using this medium, the method for manufacturing the electronic component can avoid the degradation of the electronic component's quality due to a chemical reaction of the grinding debris during sintering.
Claims
1. A method for manufacturing an electronic component, comprising the following steps: The process of preparing the body of an electronic component made of ceramic material that is either unfired or fired at low temperature; The process of tumbling the electronic component body; and The process of firing the electronic component body after the roller grinding; The tumbling process uses a medium composed only of materials that sublimate at temperatures lower than those of the firing process. The firing process includes sintering the electronic component body and removing the grinding debris generated during the tumbling process.
2. The method for manufacturing an electronic component according to claim 1, wherein, The firing temperature is above 800°C.
3. The method for manufacturing an electronic component according to claim 1 or 2, wherein, The medium is formed from organic matter or diamond.
4. The method for manufacturing an electronic component according to any one of claims 1 to 3, wherein, The medium is less than 6 mm in size.
5. The method for manufacturing an electronic component according to any one of claims 1 to 4, wherein, The electronic components manufactured from the electronic component body are less than 4 mm in size.
6. A method for manufacturing an electronic component according to any one of claims 1 to 5, wherein, The electronic component manufactured from the electronic component body is a multilayer ceramic capacitor.
7. A medium used in a method for manufacturing an electronic component according to any one of claims 1 to 6.