Epoxy resin material with low curing stress and high insulating property as well as preparation method and application of epoxy resin material

Abstract

The invention belongs to the technical field of epoxy insulating materials, and particularly relates to an epoxy resin material with low curing stress and high insulating property as well as a preparation method and application thereof. According to the epoxy resin material provided by the invention, 4, 5-cyclohexane-1, 2-dioctyl phthalate diglycidyl ester, 4-aminobenzoic acid and sebacic acid are introduced in the curing process of epoxy resin, three-section curing is matched, a dynamic ester exchange reaction is activated, a'reaction-relaxation 'platform of chain segment rearrangement and stress relaxation is constructed, and the dynamic ester exchange reaction is activated. Internal stress caused by non-uniform shrinkage at high temperature is balanced; fluorine-containing hyperbranched epoxy resin molecules absorb crack propagation energy and dissipate impact stress through a hyperbranched structure; in addition, nitrogen and fluorine in a compact epoxy cross-linking curing network constructed by a double-curing agent system can be used as charge traps to capture carriers, so that the mechanical property and the insulating property of the epoxy resin material are improved; the technical problem that a high-performance epoxy resin material is difficult to prepare in the prior art is solved.

Description

Technical Field

[0001] This application belongs to the field of epoxy insulation materials technology, and particularly relates to an epoxy resin material with low curing stress and high insulation performance, its preparation method and application. Background Technology

[0002] Epoxy resins are widely used in electronic component packaging, power equipment insulation, and composite material matrices due to their excellent bonding properties, mechanical strength, chemical corrosion resistance, and good electrical insulation properties. However, with the increasing demands of modern industry for miniaturization, integration, and high reliability of devices, the inherent shortcomings of traditional epoxy resin materials are becoming increasingly prominent. Two key technical challenges are: high curing internal stress and insufficient insulation performance under high electric fields.

[0003] The curing internal stress of epoxy resin materials mainly originates from the uneven crosslinking density and volume shrinkage that occur when the epoxy resin changes from a liquid to a solid state during curing. Especially in fast-curing or thick-walled parts, the temperature difference between the inside and outside and the difference in curing rate can lead to stress concentration. This internal stress can cause microcracks, warping deformation, and decreased mechanical properties in the product. At the same time, microcracks in epoxy resin materials can accelerate the deterioration of insulation performance in a high electric field environment, and even lead to the failure of encapsulated devices, which seriously affects the product yield, service life, and long-term operational reliability. In order to reduce curing stress, existing technologies usually use the addition of flexible segment toughening agents, the use of aliphatic epoxy compounds, and slow temperature increase to adjust the curing process. However, adding toughening agents often sacrifices the rigidity, heat resistance, and insulation properties of the material, while simple process adjustment has limited effect on reducing the stress caused by the intrinsic characteristics of the crosslinking network and will significantly prolong the production cycle and reduce efficiency.

[0004] Traditional epoxy resin materials form an irreversible and non-dynamic epoxy cross-linked network structure during curing. Developing a novel epoxy resin preparation method that can activate the rearrangement of epoxy cross-linked segments during high-temperature rapid curing, fully relaxing the internal stress of the cross-linked system, can effectively reduce the curing stress caused by high-temperature rapid curing, optimize the cross-linked network structure, prevent microcracks from forming in the epoxy resin material during curing, and improve the mechanical and insulating properties of the epoxy resin material. However, current research on epoxy resin material preparation processes is insufficient, making it difficult to prepare epoxy resin materials with low curing stress and high insulation performance. Summary of the Invention

[0005] In view of this, this application provides an epoxy resin material with low curing stress and high insulation performance, its preparation method and application, to solve the technical problem that it is difficult to prepare high-performance epoxy resin materials in the prior art.

[0006] The first aspect of this application provides a method for preparing an epoxy resin material with low curing stress and high insulation performance, comprising the following steps:

[0007] Preparation steps of fluorinated hyperbranched epoxy resin molecules: fluorinated bisphenol compounds and branched multifunctional glycidyl ethers are subjected to nucleophilic epoxy ring-opening reaction to obtain fluorinated hyperbranched epoxy resin molecules.

[0008] The compounding steps of epoxy resin material precursor are as follows: Fluorine-containing hyperbranched epoxy resin molecules, 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, 4-aminobenzoic acid, sebacic acid and epoxy resin are mixed and stirred to degas, and then epoxy resin is obtained.

[0009] The three-stage curing process involves sequentially curing the epoxy resin precursor at low temperature (first temperature), medium temperature (second temperature), and high temperature (third temperature), followed by cooling to obtain an epoxy resin material with low curing stress and high insulation performance. The curing temperature for the high temperature (third temperature) curing is 105~135℃.

[0010] Preferably, in the preparation step of the fluorinated hyperbranched epoxy resin molecule, the fluorinated hyperbranched epoxy resin molecule is selected from at least one of bisphenol AF, fluorinated substituted bisphenol AP, and trifluoromethyl substituted bisphenol AP.

[0011] The branched multifunctional glycidyl ether is selected from at least one of trimethylolpropane triglycidyl ether, triglycidyl ether, triphenyl glycidyl ether, and 1,3,4-benzenetriethylone glycidyl ether.

[0012] Preferably, the catalyst used in the nucleophilic epoxy ring-opening reaction is tetrabutylammonium bromide, the reaction temperature is 80~120℃, the reaction time is 3~8h, and the atmosphere is nitrogen.

[0013] Preferably, in the compounding step of the epoxy resin material precursor, the product comprises, by weight parts: 5-45 parts by weight of fluorinated hyperbranched epoxy resin molecules, 20-60 parts by weight of 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, 10-25 parts by weight of 4-aminobenzoic acid, 25-45 parts by weight of sebacic acid, and 80-120 parts by weight of epoxy resin.

[0014] Preferably, in the compounding step of the epoxy resin material precursor, the epoxy resin is selected from at least one of E51 epoxy resin, E44 epoxy resin, E20 epoxy resin, E12 epoxy resin, E06 epoxy resin, and E03 epoxy resin.

[0015] Preferably, the temperature for stirring and degassing is 60~100℃, the time is 0.5~2h, and the rotation speed is 200~500rad / s.

[0016] Preferably, in the three-stage curing step, the low-temperature curing temperature is 70~85℃ and the time is 0.5~2.5h;

[0017] The medium-temperature curing temperature is 85~105℃, and the time is 1~5h;

[0018] The high-temperature curing time is 6~12 hours.

[0019] Preferably, in the three-stage curing step, the cooling rate is 2~10℃ / h.

[0020] The second aspect of this application provides an epoxy resin material with low curing stress and high insulation performance, which is prepared by the preparation method described in the first aspect.

[0021] The third aspect of this application provides the application of an epoxy resin material with low curing stress and high insulation performance, as described in the second aspect, in the insulation of electrical equipment.

[0022] Preferably, the power equipment includes high-voltage power equipment, ultra-high-voltage power equipment, or extra-high-voltage power equipment.

[0023] Compared with the prior art, the method for preparing an epoxy resin material with low curing stress and high insulation performance provided in this application has at least the following beneficial effects:

[0024] 1. This application provides an epoxy resin material with low curing stress and high insulation performance. During the epoxy resin curing process, 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, 4-aminobenzoic acid, and sebacic acid are introduced to construct a dynamic ester system, and a three-stage curing process is adopted. The three-stage curing process serves as a "reaction-relaxation" platform for dynamic ester exchange-driven chain rearrangement and stress relaxation. The first two curing stages avoid excessively high temperatures that could lead to localized explosive polymerization of the system, ensuring the uniformity of the network in the early stages of formation. In the third stage (105-135℃) of high-temperature curing, it can act as a highly efficient catalyst. The tertiary amine nitrogen atoms remaining after the curing reaction activate the ester bonds already formed in the network to undergo a dynamic ester exchange reaction, effectively balancing the internal stress caused by uneven shrinkage at high temperatures, and improving the mechanical and insulation properties of the epoxy resin material.

[0025] 2. This application provides an epoxy resin material with low curing stress and high insulation performance. During the epoxy resin curing process, 4-aminobenzoic acid and sebacic acid are used as dual curing agents for multi-stage curing, resulting in a tightly packed cross-linked network molecular chain with a uniform free volume distribution, which hinders the migration path of charge carriers. At the same time, nitrogen atoms have higher electronegativity than carbon, hydrogen, and oxygen, forming a local strongly negatively charged region around them to trap charge carriers. Charge carriers trapped in the trap have difficulty obtaining enough energy to escape, thereby effectively inhibiting the continued migration and collisional ionization of charge carriers, and improving the mechanical and insulation properties of the epoxy resin material.

[0026] 3. This application provides an epoxy resin material with low curing stress and high insulation performance. During the epoxy resin curing process, by introducing fluorine-containing hyperbranched epoxy resin molecules, on the one hand, the three-dimensional hole effect of the hyperbranched structure absorbs crack propagation energy and dissipates impact stress, thereby improving the impact strength of the material. On the other hand, the strong electronegativity of fluorine atoms is used to construct charge traps to inhibit the migration and proliferation of charge carriers, thereby improving the mechanical and insulation properties of the epoxy resin material. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of a method for preparing an epoxy resin material with low curing stress and high insulation performance, as provided in Embodiment 1 of this application. Detailed Implementation

[0029] This application provides an epoxy resin material with low curing stress and high insulation performance, its preparation method, and its application, which solves the technical problem that it is difficult to prepare high-performance epoxy resin materials in the prior art.

[0030] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] Example 1

[0032] This embodiment provides a method for preparing an epoxy resin material with low curing stress and high insulation performance, the process flow diagram of which is shown below. Figure 1 As shown, it includes the preparation steps of fluorinated hyperbranched epoxy resin molecules, the compounding steps of epoxy resin material precursors, and the three-stage curing steps.

[0033] The preparation steps of fluorinated hyperbranched epoxy resin molecules include:

[0034] 30g of bisphenol AF, 90g of trimethylolpropane triglycidyl ether, and 5g of tetrabutylammonium bromide were added to a reaction vessel and stirred at 100°C for 5 hours under nitrogen atmosphere to obtain fluorinated hyperbranched resin molecules.

[0035] The compounding steps for epoxy resin material precursors include:

[0036] 30g of fluorinated hyperbranched resin molecules, 30g of 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, 15g of 4-aminobenzoic acid, 30g of sebacic acid, and 100g of E51 epoxy resin were mixed and degassed at 70℃ and a rate of 250 rad / s for 0.5h to obtain an epoxy resin material precursor.

[0037] The three-stage curing process includes:

[0038] An epoxy resin precursor was poured into a mold and cured sequentially at 70°C for 1 hour, 85°C for 2 hours, and 105°C for 8 hours. After cooling to room temperature at a rate of 4°C / h, the material was demolded to obtain an epoxy resin material with low curing stress and high insulation performance.

[0039] Example 2

[0040] This embodiment provides a method for preparing epoxy resin materials with low curing stress and high insulation performance. The difference from Embodiment 1 is that the reaction process of fluorinated hyperbranched epoxy resin molecules is adjusted, including the preparation steps of fluorinated hyperbranched epoxy resin molecules, the compounding steps of epoxy resin material precursors, and the three-stage curing steps.

[0041] The preparation steps of fluorinated hyperbranched epoxy resin molecules include:

[0042] 30g of bisphenol AF, 150g of trimethylolpropane triglycidyl ether, and 8g of tetrabutylammonium bromide were added to a reaction vessel and stirred at 120°C for 7 hours under nitrogen atmosphere to obtain fluorinated hyperbranched resin molecules.

[0043] The compounding steps for epoxy resin material precursors include:

[0044] 30g of fluorinated hyperbranched resin molecules, 30g of 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, 15g of 4-aminobenzoic acid, 30g of sebacic acid, and 100g of E51 epoxy resin were mixed and degassed at 70℃ and a rate of 250 rad / s for 0.5h to obtain an epoxy resin material precursor.

[0045] The three-stage curing process includes:

[0046] An epoxy resin precursor was poured into a mold and cured sequentially at 70°C for 1 hour, 85°C for 2 hours, and 105°C for 8 hours. After cooling to room temperature at a rate of 4°C / h, the material was demolded to obtain an epoxy resin material with low curing stress and high insulation performance.

[0047] Example 3

[0048] This embodiment provides a method for preparing epoxy resin materials with low curing stress and high insulation performance. The difference from Embodiment 1 is that the compounding process of the epoxy resin material precursor is adjusted, including the preparation steps of fluorinated hyperbranched epoxy resin molecules, the compounding steps of the epoxy resin material precursor, and the three-stage curing steps.

[0049] The preparation steps of fluorinated hyperbranched epoxy resin molecules include:

[0050] 30g of bisphenol AF, 90g of trimethylolpropane triglycidyl ether, and 5g of tetrabutylammonium bromide were added to a reaction vessel and stirred at 100°C for 5 hours under nitrogen atmosphere to obtain fluorinated hyperbranched resin molecules.

[0051] The compounding steps for epoxy resin material precursors include:

[0052] 10g of fluorinated hyperbranched resin molecules, 50g of 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, 23g of 4-aminobenzoic acid, 40g of sebacic acid, and 100g of E51 epoxy resin were mixed and degassed at 100℃ and a rate of 400 rad / s for 1h to obtain an epoxy resin material precursor.

[0053] The three-stage curing process includes:

[0054] An epoxy resin precursor was poured into a mold and cured sequentially at 70°C for 1 hour, 85°C for 2 hours, and 105°C for 8 hours. After cooling to room temperature at a rate of 4°C / h, the material was demolded to obtain an epoxy resin material with low curing stress and high insulation performance.

[0055] Example 4

[0056] This embodiment provides a method for preparing epoxy resin materials with low curing stress and high insulation performance. The difference from Embodiment 1 is that the three-stage curing process is adjusted, including the preparation steps of fluorinated hyperbranched epoxy resin molecules, the compounding steps of epoxy resin material precursors, and the three-stage curing steps.

[0057] The preparation steps of fluorinated hyperbranched epoxy resin molecules include:

[0058] 30g of bisphenol AF, 90g of trimethylolpropane triglycidyl ether, and 5g of tetrabutylammonium bromide were added to a reaction vessel and stirred at 100°C for 5 hours under nitrogen atmosphere to obtain fluorinated hyperbranched resin molecules.

[0059] The compounding steps for epoxy resin material precursors include:

[0060] 30g of fluorinated hyperbranched resin molecules, 30g of 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, 15g of 4-aminobenzoic acid, 30g of sebacic acid, and 100g of E51 epoxy resin were mixed and degassed at 70℃ and a rate of 250 rad / s for 0.5h to obtain an epoxy resin material precursor.

[0061] The three-stage curing process includes:

[0062] An epoxy resin precursor was poured into a mold and cured sequentially at 85°C for 2 hours, 105°C for 4 hours, and 135°C for 8 hours. After cooling to room temperature at a rate of 4°C / h, the material was demolded to obtain an epoxy resin material with low curing stress and high insulation performance.

[0063] Example 5

[0064] This embodiment provides a method for preparing epoxy resin material. As a first comparative embodiment, the difference from Embodiment 1 is that fluorinated hyperbranched epoxy resin molecules and 4-aminobenzoic acid are not introduced into the epoxy resin material. The method includes the compounding step of epoxy resin material precursor and the three-stage curing step.

[0065] The compounding steps for epoxy resin material precursors include:

[0066] 30g of 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, 79g of sebacic acid, and 100g of E51 epoxy resin were mixed and degassed at 70°C and a rate of 250 rad / s for 0.5h to obtain an epoxy resin material precursor.

[0067] The three-stage curing process includes:

[0068] The epoxy resin precursor was poured into a mold and cured sequentially at 70℃ for 1 hour, 85℃ for 2 hours, and 105℃ for 8 hours. After cooling to room temperature at a rate of 4℃ / h, the epoxy resin was demolded to obtain the epoxy resin material.

[0069] Example 6

[0070] This embodiment provides a method for preparing epoxy resin material. As a second comparative embodiment, the difference from Embodiment 1 is that the three-stage curing process is not performed, which includes the preparation step of fluorinated hyperbranched epoxy resin molecules, the compounding step of epoxy resin material precursor, and the curing step.

[0071] The preparation steps of fluorinated hyperbranched epoxy resin molecules include:

[0072] 30g of bisphenol AF, 90g of trimethylolpropane triglycidyl ether, and 5g of tetrabutylammonium bromide were added to a reaction vessel and stirred at 100°C for 5 hours under nitrogen atmosphere to obtain fluorinated hyperbranched resin molecules.

[0073] The compounding steps for epoxy resin material precursors include:

[0074] 30g of fluorinated hyperbranched resin molecules, 30g of 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, 15g of 4-aminobenzoic acid, 30g of sebacic acid, and 100g of E51 epoxy resin were mixed and degassed at 70℃ and a rate of 250 rad / s for 0.5h to obtain an epoxy resin material precursor.

[0075] The curing process includes:

[0076] The epoxy resin material precursor was poured into a mold and cured sequentially at a low temperature of 70℃ for 1 hour and a medium temperature of 85℃ for 10 hours. After cooling to room temperature at a cooling rate of 4℃ / h, the epoxy resin material was demolded to obtain the epoxy resin material.

[0077] Experimental Example 1

[0078] This experimental example tests the mechanical and insulation properties of the epoxy resin materials provided in Examples 1-6.

[0079] Among them, the impact strength test in the mechanical performance test was carried out in accordance with the national standard GB / T 1043.1-2008, and the test condition was room temperature; the volume resistivity test in the insulation performance test was carried out in accordance with the national standard GB / T 1410-2006, and the test voltage was 100V; while the AC breakdown strength test was carried out in accordance with the national standard GB / T 1408.1-2016, with a voltage increase rate of 1kV / s and uniform voltage increase; the test results are shown in Table 1.

[0080] Table 1: Test Results of Mechanical and Insulation Properties

[0081]

[0082] As can be seen from the performance test results shown in Table 1, the impact strength range of the epoxy resin materials provided in Examples 1-4 is 18.9~20.4 kJ / m. 2 The volume resistivity range is The AC breakdown strength ranges from 37.5 to 38.9 kV / mm, indicating that the internal stress generated during the curing process is relatively small, resulting in good mechanical and insulation properties. It is an epoxy resin material with low curing stress and high insulation performance.

[0083] Meanwhile, as shown in Table 1, the performance test results indicate that, compared to the epoxy resin material provided in Example 1, the epoxy resin material provided in Example 5 has an impact strength of 13.5 kJ / m. 2 The volume resistivity is The AC breakdown strength is 31.7 kV / mm, and the mechanical and insulation properties are relatively low. Only sebacic acid is used as a single curing agent, which eliminates the catalytic effect of the residual tertiary amine of 4-aminobenzoic acid on transesterification during the high-temperature curing stage and the trapping effect of nitrogen element. Secondly, the network density of the single crosslinking system is significantly reduced. At the same time, no fluorinated hyperbranched epoxy resin molecules are introduced during the curing process. On the one hand, it is impossible to absorb crack propagation energy and dissipate impact stress through the three-dimensional hole effect of the hyperbranched structure to improve the impact strength of the material. On the other hand, it is impossible to build charge traps by utilizing the strong electronegativity of fluorine atoms to inhibit the carrier migration and proliferation process. As a result, the epoxy resin material provided in Example 5 has low mechanical properties and insulation strength.

[0084] Furthermore, the performance test results shown in Table 1 further indicate that, compared with the epoxy resin material provided in Example 1, the epoxy resin material provided in Example 6 did not undergo three-stage curing, making it difficult to activate the dynamic ester to rearrange the epoxy crosslinking segments and fully relax the internal stress of the crosslinking system. At the same time, the excessively rapid cooling rate also caused network shrinkage due to temperature changes, resulting in deficiencies in the epoxy crosslinking network structure and the possible presence of microcracks. Consequently, the mechanical and insulation properties of the epoxy resin material are relatively low.

[0085] Furthermore, the performance test results shown in Table 1 further indicate that, compared with the epoxy resin material provided in Example 5, the epoxy resin material provided in Example 6 has slightly better mechanical and insulation properties. This may be due to the fluorine-containing hyperbranched epoxy resin molecules absorbing crack propagation energy and dissipating impact stress through the three-dimensional hole effect of the hyperbranched structure, as well as the role played by the strong electronegativity of fluorine atoms in constructing charge traps.

[0086] The experimental results above show that the epoxy resin material with low curing stress and high insulation performance provided in this application, during the epoxy resin curing process, introduces reactants such as 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, 4-aminobenzoic acid, and sebacic acid. Combined with a multi-stage curing regime, the ester bonds already formed in the epoxy crosslinking network are catalyzed and activated during the high-temperature curing stage to undergo dynamic transesterification reactions. This effectively balances the curing internal stress caused by uneven shrinkage at high temperatures. Simultaneously, the three-dimensional hole effect of the hyperbranched structure of the introduced fluorinated hyperbranched epoxy resin molecules absorbs crack propagation energy, thus optimizing the crosslinking structure of the epoxy resin material and improving its mechanical and insulation properties. Furthermore, the nitrogen atoms in 4-aminobenzoic acid and the fluorine in the fluorinated hyperbranched epoxy resin molecules can construct localized strongly negatively charged regions to capture charge carriers, thereby inhibiting carrier migration and improving the resistivity and breakdown strength of the epoxy resin material.

[0087] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A method for preparing an epoxy resin material with low curing stress and high insulation performance, characterized in that, Includes the following steps: Fluorinated bisphenol compounds and branched multifunctional glycidyl ethers were subjected to nucleophilic epoxy ring-opening reaction to obtain fluorinated hyperbranched epoxy resin molecules. Fluorinated hyperbranched epoxy resin molecules, 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, 4-aminobenzoic acid, sebacic acid and epoxy resin were mixed and then stirred to degas, thus obtaining an epoxy resin material precursor. The epoxy resin material precursor is cured sequentially at a first temperature, a second temperature, and a third temperature, and then cooled to obtain an epoxy resin material with low curing stress and high insulation performance. The first temperature is lower than the second temperature, and the second temperature is lower than the third temperature. The curing temperature for the third temperature curing is 105~135℃.

2. The method for preparing an epoxy resin material with low curing stress and high insulation performance according to claim 1, characterized in that, The fluorinated hyperbranched epoxy resin molecule is selected from at least one of bisphenol AF, fluorinated bisphenol AP, and trifluoromethyl substituted bisphenol AP; The branched multifunctional glycidyl ether is selected from at least one of trimethylolpropane triglycidyl ether, triglycidyl ether, triphenyl glycidyl ether, and 1,3,4-benzenetriethylone glycidyl ether.

3. The method for preparing an epoxy resin material with low curing stress and high insulation performance according to claim 1, characterized in that, The epoxy resin material precursor comprises, by weight, 5-45 parts by weight of fluorinated hyperbranched epoxy resin molecules, 20-60 parts by weight of 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, 10-25 parts by weight of 4-aminobenzoic acid, 25-45 parts by weight of sebacic acid, and 80-120 parts by weight of epoxy resin.

4. The method for preparing an epoxy resin material with low curing stress and high insulation performance according to claim 1, characterized in that, The epoxy resin is selected from at least one of E51 epoxy resin, E44 epoxy resin, E20 epoxy resin, E12 epoxy resin, E06 epoxy resin, and E03 epoxy resin.

5. The method for preparing an epoxy resin material with low curing stress and high insulation performance according to claim 1, characterized in that, The stirring and degassing process is carried out at a temperature of 60~100℃ for 0.5~2h and a rotation speed of 200~500rad / s.

6. The method for preparing an epoxy resin material with low curing stress and high insulation performance according to claim 1, characterized in that, The curing temperature for the first temperature is 70~85℃, and the curing time is 0.5~2.5h; The second curing temperature is 85~105℃, and the time is 1~5h; The curing time at the third temperature is 6~12 hours.

7. The method for preparing an epoxy resin material with low curing stress and high insulation performance according to claim 1, characterized in that, The cooling rate is 2~10℃ / h.

8. An epoxy resin material with low curing stress and high insulation performance, characterized in that, It is prepared by the preparation method according to any one of claims 1-7.

9. The application of the epoxy resin material with low curing stress and high insulation performance as described in claim 8 in the insulation of power equipment.

10. The application according to claim 9, characterized in that, The power equipment includes high-voltage power equipment, ultra-high-voltage power equipment, or extra-high-voltage power equipment.

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