High-stability antistatic polyimide adhesive tape and preparation method thereof

Abstract

The invention discloses a high-stability antistatic polyimide adhesive tape and a preparation method thereof, and belongs to the technical field of polyimide adhesive tapes. The preparation method comprises the following steps: cleaning a polyimide film; coating an ionic liquid solution with a specific concentration on the surface and drying to form an ionic liquid interface layer; then anti-static slurry is coated, and preliminary drying is carried out; carrying out interface fusion leveling treatment on the wet coating, namely, carrying out uniform pressure through a silica gel uniform pressure roller at a certain pressure and roller speed; and finally, performing segmented high-temperature curing to obtain a finished product. Wherein the ionic liquid is 1-hexyl-3-methylimidazolium tetrafluoroborate, and the ionic liquid is 1-hexyl-3-methylimidazole tetrafluoroborate. Through the synergistic effect of ionic liquid molecule anchoring and an interface fusion leveling process, the interface bonding force and stability between the anti-static coating and the polyimide base material are greatly enhanced, the problems that a traditional coating is easy to peel off and the anti-static performance is degraded are effectively solved, and the prepared adhesive tape has lasting and stable anti-static performance.

Description

Technical Field

[0001] This invention belongs to the field of polyimide tape technology, and relates to a high-stability antistatic polyimide tape and its preparation method. Background Technology

[0002] Polyimide is a high-performance aromatic heterocyclic polymer. Its unique molecular backbone structure endows it with excellent thermal stability, mechanical strength, dielectric properties, and chemical resistance, making it irreplaceable in electronics, aerospace, microelectronics packaging, and high-end manufacturing. Polyimide tape, made from polyimide film as a substrate and coated with adhesive, inherits the core advantages of the substrate and also possesses properties such as high and low temperature resistance, acid and alkali resistance, solvent resistance, H-class electrical insulation, and radiation protection. It is widely used in applications such as wave soldering masking for electronic circuit boards, gold finger protection, insulation of high-end electrical appliances, motor insulation, and fixing of positive and negative electrodes in lithium batteries. With the rapid development of industries such as semiconductors and flexible displays, the requirements for electrostatic discharge (ESD) protection during production are becoming increasingly stringent, making the durable and stable anti-static capability of polyimide tape one of the core indicators for adapting to high-end manufacturing.

[0003] Currently, the main technical approaches to achieving antistatic properties in polyimide tapes in the industry fall into three categories: surface coating, filler composite, and structural design. Among these, surface coating is the most widely used basic method due to its simplicity and controllable cost. Its core principle is to coat the PI film surface with an antistatic coating to dissipate static electricity. However, this method has significant technical drawbacks that limit product stability. The key issue is insufficient interfacial adhesion between the coating and the polyimide substrate. Under stress conditions such as high temperatures (e.g., reflow soldering), mechanical friction (e.g., mounting and peeling), or humid environments encountered in practical applications, this interface is easily damaged, leading to coating peeling or microcracks, resulting in a rapid decline in antistatic performance and an inability to maintain long-term stability. Summary of the Invention

[0004] The purpose of this invention is to provide a highly stable antistatic polyimide tape and its preparation method, thereby solving the technical problem of insufficient interfacial adhesion between traditional coatings and polyimide substrates, which easily leads to a decline in antistatic performance. By constructing an ionic liquid interfacial layer and supplementing it with an interfacial fusion leveling process, the bonding strength and stability between the coating and the substrate are significantly enhanced, thus ensuring that the tape can maintain durable and reliable antistatic performance under complex working conditions.

[0005] The objective of this invention can be achieved through the following technical solutions: In a first aspect, the present invention provides a method for preparing a highly stable antistatic polyimide tape, comprising the following steps: S1. A solution containing an ionic liquid is coated onto the cleaned polyimide film surface, and then dried at 35-45°C to form an ionic liquid interface layer on the polyimide film surface. S2. Apply an antistatic slurry to the ionic liquid interface layer, and perform preliminary drying after application to obtain a wet coating with preliminary surface shaping. S3. Perform interface fusion and leveling treatment on the wet coating after the first stage of drying; the interface fusion and leveling treatment is to pass the wet coating through a silicone pressure roller with a pressure of 0.05-0.15MPa and a roller speed of 2-4m / min.

[0006] S4. The coating after interface fusion and leveling treatment is cured at high temperature to obtain the high-stability antistatic polyimide tape.

[0007] Preferably, in step S1, the ionic liquid is 1-hexyl-3-methylimidazolium tetrafluoroborate, and the solution containing the ionic liquid is an anhydrous ethanol solution containing 1-hexyl-3-methylimidazolium tetrafluoroborate with a concentration of 5-15 wt%.

[0008] Preferably, in step S1, the dry film thickness of the ionic liquid interface layer formed after drying is 0.2-0.6 μm.

[0009] Preferably, in step S2, the coating thickness of the antistatic slurry is 8-10 μm, the initial drying temperature is 60-80℃, and the time is 150-180 s.

[0010] Preferably, in step S4, the high-temperature curing is a segmented curing process, specifically including: a first stage of curing at 80-100℃ for 4-5 minutes, and a second stage of curing at 150-160℃ for 5-6 minutes.

[0011] Preferably, in step S2, the solid content of the antistatic slurry is 20-22 wt%, and the antistatic slurry comprises the following components in parts by weight: 3-8 parts conductive filler, 0.3-0.8 parts dispersant, 1-3 parts bonding resin, 40-70 parts mixed solvent, and 0.05-0.2 parts curing catalyst.

[0012] Preferably, the conductive filler is a composite of graphene and ATO nanoparticles, with a mass ratio of graphene to ATO nanoparticles of 1:3; the mixed solvent is a composite of deionized water and anhydrous ethanol, with a mass ratio of deionized water to anhydrous ethanol of 2:1; the dispersant is BYK-110; the bonding resin is an aqueous polyurethane dispersion with a solid content of 30wt%; and the curing catalyst is dibutyltin dilaurate.

[0013] Preferably, the graphene has ≤5 layers and a sheet diameter of 1-5 μm; the ATO nanoparticles have a particle size of 20-50 nm.

[0014] Preferably, the cleaning process involves spraying and wiping the surface of the polyimide film with anhydrous ethanol, followed by drying at 40-50°C for 40-60 seconds.

[0015] In a second aspect, the present invention provides a highly stable antistatic polyimide tape, which is prepared by the preparation method described in the first aspect.

[0016] The beneficial effects of this invention are: (1) This invention deepens the dual mechanism through ionic liquid molecular anchoring and interface fusion leveling processes, significantly enhancing the connection strength between the antistatic coating and the PI substrate, and thoroughly improving the problem of insufficient adhesion between traditional coatings and PI substrates. Specifically, a dedicated interface layer is first constructed using 1-hexyl-3-methylimidazolium tetrafluoroborate ionic liquid, in which the cationic imidazole ring forms a strongly interacting π-π stack with the aromatic ring of the polyimide (PI) substrate backbone, while the anionic BF4... - Stable hydrogen bonds are formed between the ionic liquid and the polar groups such as imide and terminal carboxyl groups exposed on the PI surface. These two molecular-level forces work synergistically, preventing the ionic liquid from simply adsorbing onto the PI surface. Instead, it forms a robust molecular-level adsorption layer, firmly anchored to the inert PI substrate surface. This provides stable active binding sites for the subsequent antistatic coating, overcoming the inherent limitation of PI surfaces lacking active sites and being difficult to stably bond with external coatings. Building upon this, the interface fusion leveling process further enhances the bonding effect: a silicone pressure roller acts on the initially dried wet coating under gentle pressure. On one hand, it eliminates microscopic air bubbles between the antistatic coating and the ionic liquid layer, allowing for a gapless and tight fit, avoiding weak bonding caused by gaps. On the other hand, the pressure drives the flow of residual solvent at the bottom of the wet coating, promoting further rearrangement of ionic liquid molecules. Some ionic liquid even penetrates into the micropores of the PI substrate surface, simultaneously pushing the bonding resin and conductive fillers in the antistatic slurry to penetrate into the ionic liquid layer. Ultimately, a gradient transition zone is formed where the components of "PI substrate-ionic liquid-antistatic coating" interweave, with both chemical bonds and physical penetration acting, rather than an independent layered structure. This connection mode, which shifts from "ionic liquid anchoring PI" to "interpenetration between the antistatic coating and PI through ionic liquid," makes the ionic liquid a "flexible molecular bridge" between the two. This achieves a qualitative change from the traditional "surface adhesion" to "deep interlocking" between the antistatic coating and the PI substrate, significantly improving the connection strength between the two, effectively preventing interface peeling and cracking under complex working conditions, and ensuring stable and undegraded antistatic performance.

[0017] (2) A conductive system composed of graphene and ATO nanopowder (mass ratio 1:3) is used, and the optimized dispersion effect of BYK-110 dispersant is combined to form a continuous and dense 3D conductive network in the antistatic slurry. The conductive network is embedded and fixed by the cross-linked waterborne polyurethane resin, and is stably bonded to the PI substrate through the ionic liquid interface layer. Even under complex working conditions for a long time, the conductive network is not easily damaged or displaced. Detailed Implementation

[0018] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with embodiments, is provided below.

[0019] The following descriptions of some of the raw materials used in the examples and comparative examples are as follows: 1-Hexyl-3-methylimidazolium tetrafluoroborate ([HMIM]BF4), CAS No.: 244193-50-8; The bonding resin is an aqueous polyurethane dispersion with a solid content of 30wt%, specifically aqueous polyurethane resin PU704, purchased from Xiamen Aikema Chemical Co., Ltd. ATO nanopowder, SnO2 / Sb2O3=90:10, particle size 20-50nm; The graphene has 3-5 layers and a sheet diameter of 1-5 μm. The curing catalyst used is dibutyltin dilaurate; The polyimide film selected is Kapton 100HN; BYK-110 was selected as the dispersant.

[0020] Except for the raw materials explicitly mentioned above, all other raw materials not specifically mentioned are conventional industrial-grade products that can be easily obtained through commercial channels.

[0021] Example 1

[0022] A method for preparing a highly stable antistatic polyimide tape, specifically including the following steps: S1. Cleaning of polyimide film and preparation of ionic liquid interface layer: Take a polyimide film, spray its surface with anhydrous ethanol and wipe it unidirectionally with a polyester lint-free cloth, and then dry it at 45°C for 50 seconds to complete the cleaning process; prepare a 10wt% anhydrous ethanol solution of 1-hexyl-3-methylimidazolium tetrafluoroborate, and uniformly coat the solution on one side of the cleaned PI film using a microgravure coating method. After coating, dry it at 40°C for 65 seconds to form an ionic liquid interface layer with a dry film thickness of 0.4μm on the surface of the polyimide film.

[0023] S2. Preparation, coating, and preliminary drying of antistatic slurry: By weight, take 5 parts of conductive filler (graphene:ATO nanopowder = 1:3), 0.5 parts of BYK-110 dispersant, 2 parts of waterborne polyurethane resin PU704 (solid content 30wt%), 55 parts of mixed solvent (deionized water: anhydrous ethanol = 2:1), and 0.1 parts of dibutyltin dilaurate. First, stir the mixed solvent and dispersant evenly, add the conductive filler and disperse at high speed for 30 minutes until there is no obvious agglomeration, then add the waterborne polyurethane resin and curing catalyst and stir at low speed for 20 minutes. Adjust the solid content of the system to 21wt% to obtain the antistatic slurry. Use a comma-shaped doctor blade coating method to coat the antistatic slurry onto the surface of the ionic liquid interface layer, control the coating thickness to 9μm, and dry at 70℃ for 165 seconds after coating to obtain a wet coating with preliminary surface shaping and a small amount of solvent fluidity remaining in the bottom layer.

[0024] S3. Interface fusion and leveling treatment: The pre-dried film material is conveyed to the silicone pressure roller station, so that the wet coating passes through the silicone pressure roller. The pressure is controlled at 0.10MPa and the roller speed is 3m / min. The interface fusion and leveling treatment is completed in one rolling, eliminating micro air bubbles at the interface and achieving coating leveling.

[0025] S4. High-temperature curing and finished product preparation: The leveled film material is cured in sections at high temperature. The first stage is cured at 90℃ for 4.5 minutes, and the second stage is cured at 155℃ for 5.5 minutes. After curing, it is cooled to room temperature by a 30℃ cooling roller and wound up with a tension of 65N / m to obtain a high-stability antistatic polyimide tape roll. It can be cut and coated with an anti-stick protective film as needed.

[0026] Example 2

[0027] A method for preparing a highly stable antistatic polyimide tape, specifically including the following steps: S1. Cleaning of polyimide film and preparation of ionic liquid interface layer: Take a polyimide film, spray its surface with anhydrous ethanol and wipe it unidirectionally with a polyester lint-free cloth, and then dry it at 40°C for 40 seconds to complete the cleaning process; prepare a 5wt% anhydrous ethanol solution of 1-hexyl-3-methylimidazolium tetrafluoroborate, and uniformly coat the solution on one side of the cleaned PI film using a microgravure coating method. After coating, dry it at 35°C for 50 seconds to form an ionic liquid interface layer with a dry film thickness of 0.2μm on the surface of the PI film.

[0028] S2. Preparation, coating, and preliminary drying of antistatic slurry: By weight, take 3 parts of conductive filler (graphene:ATO nanopowder = 1:3), 0.3 parts of BYK-110 dispersant, 1 part of waterborne polyurethane resin PU704 (solid content 30wt%), 40 parts of mixed solvent (deionized water: anhydrous ethanol = 2:1), and 0.05 parts of dibutyltin dilaurate. First, stir the mixed solvent and dispersant evenly, add the conductive filler and disperse at high speed for 30 minutes until there is no obvious agglomeration, then add the waterborne polyurethane resin and curing catalyst and stir at low speed for 20 minutes. Adjust the solid content of the system to 20wt% to obtain the antistatic slurry. Use a comma-shaped doctor blade coating method to coat the antistatic slurry onto the surface of the ionic liquid interface layer, control the coating thickness to 8μm, and dry at 60℃ for 180 seconds after coating to obtain a wet coating with preliminary surface shaping and a small amount of solvent fluidity remaining in the bottom layer.

[0029] S3. Interface fusion and leveling treatment: The pre-dried film material is conveyed to the silicone pressure roller station, so that the wet coating passes through the silicone pressure roller. The pressure is controlled at 0.05MPa and the roller speed is 2m / min. The interface fusion and leveling treatment is completed in one rolling, eliminating micro air bubbles at the interface and achieving coating leveling.

[0030] S4. High-temperature curing and finished product preparation: The leveled film material is cured in sections at high temperature. The first stage is cured at 80℃ for 4 minutes, and the second stage is cured at 150℃ for 5 minutes. After curing, it is cooled to room temperature by a 25℃ cooling roller and wound up with a tension of 50N / m to obtain a high-stability antistatic polyimide tape roll. It can be cut and coated with an anti-stick protective film as needed.

[0031] Example 3

[0032] A method for preparing a highly stable antistatic polyimide tape, specifically including the following steps: S1. Cleaning of polyimide film and preparation of ionic liquid interface layer: Take a polyimide film, spray its surface with anhydrous ethanol and wipe it unidirectionally with a polyester lint-free cloth, and then dry it at 50°C for 60 seconds to complete the cleaning process; prepare a 15wt% anhydrous ethanol solution of 1-hexyl-3-methylimidazolium tetrafluoroborate, and uniformly coat the solution on one side of the cleaned PI film using a microgravure coating method. After coating, dry it at 45°C for 80 seconds to form an ionic liquid interface layer with a dry film thickness of 0.6μm on the surface of the PI film.

[0033] S2. Preparation, coating, and preliminary drying of antistatic slurry: By weight, take 8 parts of conductive filler (graphene:ATO nanopowder = 1:3), 0.8 parts of BYK-110 dispersant, 3 parts of waterborne polyurethane resin PU704 (solid content 30wt%), 70 parts of mixed solvent (deionized water: anhydrous ethanol = 2:1), and 0.2 parts of dibutyltin dilaurate. First, stir the mixed solvent and dispersant evenly, add the conductive filler and disperse at high speed for 30 minutes until there is no obvious agglomeration, then add the waterborne polyurethane resin and curing catalyst and stir at low speed for 20 minutes. Adjust the solid content of the system to 22wt% to obtain the antistatic slurry. Apply the slurry to the surface of the ionic liquid interface layer using a comma-shaped doctor blade coating method, control the wet film coating thickness to 10μm, and dry at 80℃ for 150 seconds after coating to obtain a wet coating with preliminary surface shaping and a small amount of solvent fluidity remaining in the bottom layer.

[0034] S3. Interface fusion and leveling treatment: The pre-dried film material is conveyed to the silicone pressure roller station, so that the wet coating passes through the silicone pressure roller. The pressure is controlled at 0.15MPa and the roller speed is 4m / min. The interface fusion and leveling treatment is completed in one rolling, eliminating micro air bubbles at the interface and achieving coating leveling.

[0035] S4. High-temperature curing and finished product preparation: The leveled film material is cured in sections at high temperature. The first stage is cured at 100℃ for 5 minutes, and the second stage is cured at 160℃ for 6 minutes. After curing, it is cooled to room temperature by a 30℃ cooling roller and wound up with a tension of 80N / m to obtain a high-stability antistatic polyimide tape roll. It can be cut and coated with an anti-stick protective film as needed.

[0036] Comparative Example 1 The difference from Example 1 is that there is no ionic liquid interface layer preparation step. In S1, only the polyimide film is cleaned, and the 1-hexyl-3-methylimidazolium tetrafluoroborate anhydrous ethanol solution is not coated. In S2, the antistatic slurry is directly coated on the surface of the cleaned polyimide film. The subsequent steps S3 and S4 remain unchanged.

[0037] Comparative Example 2 The difference from Example 1 is that the interface fusion and leveling process step S3 is omitted, and after the antistatic slurry is initially dried in S2, the wet coating is directly sent to S4 for segmented high-temperature curing. The remaining steps remain unchanged.

[0038] Comparative Example 3 The difference from Example 1 is that: instead of preparing the ionic liquid interface layer separately, 3 parts by weight of 1-hexyl-3-methylimidazolium tetrafluoroborate are mixed together with the antistatic slurry components; specifically, in S2, when preparing the antistatic slurry, the ionic liquid, mixed solvent, and BYK-110 dispersant are added simultaneously and stirred evenly, and then the conductive filler, waterborne polyurethane resin, and curing catalyst are added in sequence, adjusting the solid content to 21 wt%; S1 only cleans the polyimide film, and then the antistatic slurry containing the ionic liquid is directly coated on the film surface, and the subsequent steps S3 and S4 remain unchanged.

[0039] Comparative Example 4 The difference from Example 1 is that 1-hexyl-3-methylimidazolium tetrafluoroborate is not used, and the interface fusion and leveling process in S3 is omitted; S1 is only used to clean the polyimide film, and in S2, an antistatic slurry without ionic liquid is directly applied to the film surface and pre-dried, and then directly enters the S4 staged high-temperature curing.

[0040] Test 1 Test objects: High-stability antistatic polyimide tapes prepared in Examples 1-3 and Comparative Examples 1-4. Three samples were cut from each group of samples, with a sample size of 50mm×100mm. The test area was the bonding surface between the tape coating and the polyimide substrate.

[0041] Test method: The cross-cut test is conducted according to ASTM D3359 standard. A 1mm × 1mm square grid is made on the surface of the tape coating using a utility knife. The number of grids is 10 × 10, for a total of 100 grids. The grid depth penetrates the coating to the surface of the polyimide substrate. After removing debris from the grid area with a soft brush, the 3M 610 pressure-sensitive tape is flatly applied to the grid surface. The tape is pressed evenly with a finger to ensure no air bubbles. Then, the tape is quickly peeled off at a 90° angle to the coating surface. The peeling operation is repeated 3 times.

[0042] Evaluation indicators: Rating according to ASTM D3359 standard, divided into 0-5 levels. Level 0: no coating peeling; Level 1: a small amount of coating peeling at grid intersections with a peeling area ≤5%; Level 2: coating peeling at grid edges or at intersections with a peeling area of ​​5%-15%; Level 3: large area of ​​coating peeling along grid edges or partial grid square peeling with a peeling area of ​​15%-35%; Level 4: large area of ​​coating peeling with a peeling area of ​​35%-65%; Level 5: complete coating peeling or all grid squares peeling off. Record the average rating of 3 samples in each group.

[0043] Test 2 Test subjects: antistatic polyimide tapes prepared in Examples 1-3 and Comparative Examples 1-4. Five samples were cut from each group of samples, with a sample size of 100mm×100mm. Before the test, the samples were placed in an environment of 23℃ and 50% relative humidity for 24 hours under constant temperature and humidity.

[0044] Test method: According to GB / T1410 standard, the ZC36 high resistance meter was used for testing. First, the initial surface resistance of the sample was measured. Then, three environmental aging treatments were performed: high temperature aging (placed in a 150℃ oven at a constant temperature for 24 hours), damp heat aging (placed in a constant temperature and humidity chamber at 40℃ and 90% relative humidity for 72 hours), and friction aging (rubbed on the coating surface with cotton cloth at a pressure of 500g and a speed of 0.3m / s 100 times). After aging, the sample was placed back in an environment of 23℃ and 50%RH for 2 hours to recover, and then the corresponding resistance value was measured.

[0045] Evaluation index: Record the average surface resistance (unit: Ω / sq) of each sample at the initial stage and after each aging condition, and calculate the rate of change of the resistance after aging relative to the initial resistance (ΔR / R0×100%), where ΔR is the difference between the resistance after aging and the initial resistance, and R0 is the initial resistance.

[0046] The test data for the above test cases are shown in Table 1.

[0047]

[0048] As shown in Table 1, the tapes prepared in Examples 1-3 are significantly superior to those in Comparative Examples 1-4 in terms of coating-substrate adhesion and antistatic performance stability. Regarding adhesion, Examples 1 and 3 achieved level 0 (no coating peeling), Example 2 achieved level 1 (minor intersection peeling), while Comparative Examples 1-4 were rated only 2-4, especially Comparative Example 4 (without ionic liquid and leveling process) which reached level 4 (large-area peeling). This fully demonstrates that the synergistic effect of the ionic liquid interface layer and the interface fusion leveling process can significantly improve the coating adhesion strength. Regarding antistatic performance, the initial surface resistance of the examples was concentrated at 1.0 × 10⁻⁶. 7 -1.5×10 7 The resistance of the sample is Ω / sq. After high temperature, humid heat and friction aging, the resistance change rate is only 3%-10%, while the change rate of the comparative sample after aging is generally over 50%. This shows that the solution of the present invention can effectively suppress the degradation of antistatic performance under complex working conditions.

[0049] In summary, this invention successfully solves the core problems of insufficient adhesion and easy performance degradation of traditional antistatic polyimide tape coatings by constructing a 1-hexyl-3-methylimidazolium tetrafluoroborate ionic liquid interface layer, which provides stable binding sites for the coating through molecular-level anchoring, combined with an interface fusion leveling process to form a gradient transition region with component interpenetration, and further combined with a conductive network of graphene and ATO nanoparticles and a segmented high-temperature curing process. The resulting tape has both excellent interface stability and long-lasting antistatic properties, which can meet the adaptation requirements of harsh working conditions in high-end manufacturing fields such as semiconductors and flexible displays, and has significant technical advantages and application value.

[0050] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A method for preparing a high-stability antistatic polyimide tape, characterized in that, Includes the following steps: S1. A solution containing an ionic liquid is coated on the cleaned polyimide film surface and then dried at 35-45°C to form an ionic liquid interface layer on the polyimide film surface. S2. Apply an antistatic slurry to the ionic liquid interface layer, and perform preliminary drying after application to obtain a wet coating with preliminary surface shaping. S3. Perform interface fusion and leveling treatment on the wet coating after the first stage of drying. The interface fusion and leveling process is as follows: the wet coating is passed through a silicone pressure roller with a pressure of 0.05-0.15 MPa and a roller speed of 2-4 m / min. S4. The coating after interface fusion and leveling treatment is cured at high temperature to obtain the high-stability antistatic polyimide tape.

2. The method for preparing a high-stability antistatic polyimide tape according to claim 1, characterized in that, In step S1, the ionic liquid is 1-hexyl-3-methylimidazolium tetrafluoroborate, and the solution containing the ionic liquid is an anhydrous ethanol solution containing 1-hexyl-3-methylimidazolium tetrafluoroborate with a concentration of 5-15 wt%.

3. The method for preparing a high-stability antistatic polyimide tape according to claim 1, characterized in that, In step S1, the dry film thickness of the ionic liquid interface layer formed after drying is 0.2-0.6 μm.

4. The method for preparing a high-stability antistatic polyimide tape according to claim 1, characterized in that, In step S2, the coating thickness of the antistatic slurry is 8-10 μm, the initial drying temperature is 60-80℃, and the time is 150-180 s.

5. The method for preparing a high-stability antistatic polyimide tape according to claim 1, characterized in that, In step S4, the high-temperature curing is a segmented curing process, specifically including: a first stage of curing at 80-100℃ for 4-5 minutes, and a second stage of curing at 150-160℃ for 5-6 minutes.

6. The method for preparing a high-stability antistatic polyimide tape according to claim 1, characterized in that, In step S2, the antistatic slurry has a solid content of 20-22 wt% and comprises the following components in parts by weight: 3-8 parts conductive filler, 0.3-0.8 parts dispersant, 1-3 parts bonding resin, 40-70 parts mixed solvent and 0.05-0.2 parts curing catalyst.

7. The method for preparing a high-stability antistatic polyimide tape according to claim 6, characterized in that, The conductive filler is a blend of graphene and ATO nanoparticles, with a mass ratio of 1:3; the mixed solvent is a blend of deionized water and anhydrous ethanol, with a mass ratio of 2:1; the dispersant is BYK-110; the bonding resin is an aqueous polyurethane dispersion with a solid content of 30wt%; and the curing catalyst is dibutyltin dilaurate.

8. The method for preparing a high-stability antistatic polyimide tape according to claim 7, characterized in that, The graphene has ≤5 layers and a sheet diameter of 1-5μm; the ATO nanoparticles have a particle size of 20-50nm.

9. The method for preparing a high-stability antistatic polyimide tape according to claim 1, characterized in that, The cleaning process involves spraying and wiping the surface of the polyimide film with anhydrous ethanol, followed by drying at 40-50°C for 40-60 seconds.

10. A high-stability antistatic polyimide tape, characterized in that, It is prepared by any one of claims 1-9.

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