Method for enhancing hardness of W-Cu composite material by W atomic cluster powder

Abstract

The application discloses a method for enhancing the hardness of W-Cu composite material by W atomic cluster powder, and belongs to the technical field of hardness enhancement of W-Cu composite material. The method comprises the following steps: step SS1: W atomic cluster powder, tungsten powder and copper powder are added into a ball mill in a protective atmosphere glove box for ball milling to prepare a composite powder; and step SS2: the composite powder obtained in the step SS1 is added into a hot-pressing furnace for hot-pressing sintering to obtain a composite material. The W atomic cluster powder, the tungsten powder and the copper powder are mixed by a planetary ball mill to prepare the composite powder, and then the composite material is obtained by hot-pressing sintering, so that the hardness of the W-Cu composite material is greatly improved, and the technical guidance is provided for the development of high-performance tungsten-copper composite material applied to the research and development of major equipment such as brush material, abrasive electrode material, friction material and electromagnetic gun track.

Description

Technical Field

[0001] This invention relates to a method for enhancing the hardness of W-Cu composite materials using W atom cluster powder, belonging to the field of W-Cu composite material hardness enhancement technology. Background Technology

[0002] Tungsten-copper composite materials possess high temperature resistance, arc erosion resistance, high thermal conductivity, high electrical conductivity, high strength, and good corrosion resistance. They are widely used in military high-temperature materials (missile and rocket engine nozzles, gas rudders, air rudders, nose cones, etc. in aerospace), electrical alloys for high-voltage switches, EDM electrodes, microelectronic materials (semiconductor electronic packaging and heat sink materials), abrasive electrode materials, and brush materials. With the development of advanced weaponry in the defense field, higher requirements are placed on the hardness and electrical conductivity of new extreme-performance alloy materials such as W-Cu. Especially in advanced weapon systems such as electromagnetic railguns, W-Cu must withstand extreme application conditions. Electromagnetic railgun tracks must withstand high current density (MA level), severe thermal shock (instantaneous high temperatures reaching thousands of degrees Celsius), electromagnetic stress (GPa level), and high-speed friction and wear under extreme service conditions. W-Cu composite materials must meet higher strength, high electrical conductivity, high thermal conductivity, wear resistance, and arc erosion resistance. Tungsten-copper composite materials prepared from tungsten and copper powder cannot meet the requirements of electromagnetic railgun tracks in terms of strength, electrical conductivity, and ablation resistance. High electrical conductivity and high strength are contradictory in W-Cu composites. How to maintain both high conductivity and high hardness in W-Cu composites has been a long-standing and unsolved problem in the field of W-Cu composite processing.

[0003] A literature search of existing technologies revealed a Chinese invention patent with application number 202111299902.6, which relates to a method for reinforcing fine-grained high-temperature W-Cu materials with nano-carbide. The nano-carbide is TiC, ZrC, or HfC, with a content of 0.1-2 wt%, and the remainder is W. This method involves preparing a W salt + Cu salt composite solution, solid-liquid composite treatment, high-temperature rapid atomization drying, hydrothermal reduction, stress-relieving forming, and sintering to obtain the nano-carbide-reinforced fine-grained high-temperature W-Cu material. While this invention can enhance the strength of W-Cu composite materials, it introduces doped carbides, reducing the electrical conductivity of the W-Cu composite material. It cannot guarantee that both electrical conductivity and hardness can be simultaneously achieved. Summary of the Invention

[0004] The purpose of this invention is to overcome the technical defects of existing technologies and provide a method for enhancing the hardness of W-Cu composite materials using W-atom cluster powder. This method maintains both high electrical conductivity and high hardness in W-Cu composite materials, solving the problem that traditional W-Cu composite materials prepared from tungsten powder and copper powder cannot simultaneously maintain high strength and high conductivity. This provides a solution for the development of high-performance tungsten-copper composite materials. The method first involves ball milling and mixing W-atom cluster powder, tungsten powder, and copper powder using a planetary ball mill to prepare... Composite powder, then obtained by hot pressing and sintering. The addition of W atom cluster powder significantly improves the hardness of W-Cu composite materials.

[0005] The present invention specifically adopts the following technical solution: a method for enhancing the hardness of W-Cu composite materials with W atom cluster powder, comprising the following steps:

[0006] Step SS1: W-atom cluster powder, tungsten powder, and copper powder are added to a ball mill within a protective atmosphere glove box for ball milling to prepare... Composite powder;

[0007] Step SS2: Obtain the results from Step SS1 The composite powder is added to a hot press furnace for hot pressing and sintering to obtain... Composite materials.

[0008] As a preferred embodiment, step SS1 specifically includes: weighing a certain amount of W atom cluster powder, tungsten powder, and copper powder in a mass percentage ratio of 1:4:5; placing the powder into a zirconia ball mill jar that has been ultrasonically cleaned with alcohol and dried in a protective atmosphere glove box; adding zirconia grinding balls; and ball milling and mixing.

[0009] In a preferred embodiment, the ball mill rotates at a speed of 200 r / min and the milling time is 12 h.

[0010] In a preferred embodiment, the W atom cluster powder has an average particle size of 1.9 nm.

[0011] In a preferred embodiment, the tungsten powder has an average particle size of 62 nm.

[0012] In a preferred embodiment, the copper powder has an average particle size of 283 nm.

[0013] In a preferred embodiment, step SS1 further includes: ultrasonically cleaning the zirconia grinding jar and zirconia grinding balls for the ball mill with alcohol for 15 minutes, and drying them in a drying oven at 80°C for 15 minutes.

[0014] In a preferred embodiment, step SS2 specifically includes: after ball milling, mixing the homogeneous mixture in a protective atmosphere glove box. The powder was placed into a silicon nitride mold that had been ultrasonically cleaned with alcohol and dried. The mold was then heated to 1050°C in a hot press furnace at a rate of 10°C / min and held at 100 MPa for 1 hour. Subsequently, the temperature was lowered at a rate of 10°C / min and allowed to cool to room temperature in the furnace, yielding powder doped with 10% W atomic clusters. Composite materials.

[0015] As a preferred embodiment, step SS2 specifically includes: ultrasonically cleaning the silicon nitride mold in the hot press furnace with alcohol for 15 minutes, and drying it in a drying oven at 80°C for 15 minutes.

[0016] The beneficial effects achieved by this invention are as follows: By adding W atom cluster powder to tungsten and copper powder, the hardness of W-Cu composite material is significantly improved, providing technical guidance for the development of high-performance tungsten-copper composite materials for use in major equipment such as brush materials, abrasive electrode materials, friction materials, and electromagnetic railgun tracks. By precisely controlling the process parameters of hot pressing sintering, this invention further ensures the density and uniformity of W-Cu composite material, thereby improving its comprehensive mechanical properties. Attached Figure Description

[0017] Figure 1 This is a flowchart of the method for enhancing the hardness of W-Cu composite materials using W atom cluster powder according to the present invention. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.

[0019] W-Cu composites combine the excellent thermal and electrical conductivity and good ductility of metallic Cu with the high strength and low coefficient of thermal expansion of metallic W, resulting in excellent thermal, electrical, and mechanical properties. However, the hardness and electrical conductivity of W-Cu composites are contradictory, and maintaining both high hardness and high conductivity has always been a pursuit in industry. By adding W atomic cluster powder to tungsten and copper powders and then hot-pressing and sintering them, the hardness of W-Cu composites can be further enhanced while maintaining high electrical conductivity.

[0020] This invention provides a method for enhancing the hardness of W-Cu composite materials using W atom cluster powder. The method includes the following steps:

[0021] S1. Clean the zirconia grinding jar and zirconia grinding balls for the ball mill with alcohol using ultrasonic cleaning for 15 minutes, and then dry them in a drying oven at 80°C for 15 minutes. In a protective atmosphere glove box, place the W-atom cluster powder, tungsten powder, and copper powder into the zirconia grinding jar containing the zirconia grinding balls, and ball mill and mix them to prepare the desired product. Composite powder; the ball mill used had a rotation speed of 200 r / min and a milling time of 12 h;

[0022] S2. Clean the silicon nitride mold in the hot press furnace with alcohol using ultrasonic cleaning for 15 minutes, then dry it in a drying oven at 80°C for 15 minutes. Grind the spheroidized material in a protective atmosphere glove box. The mixed powder was loaded into a silicon nitride mold for hot pressing sintering. The heating rate of the hot press was set to 10℃ / min, and hot pressing sintering was carried out at a temperature of 1050℃, a pressure of 100MPa, and a holding time of 1h. The cooling rate of the hot press was 10℃ / min, and the sintered sample was cooled to room temperature with the furnace.

[0023] In some embodiments, in step S1, in order to uniformly mix the W atom cluster powder with the tungsten and copper powder, different ball milling speeds and ball milling times can be used. Of course, other mixing methods can also be used, such as acoustic resonance, fluidized bed, etc.

[0024] In some embodiments, during the hot pressing sintering of the mixed powder in step S2, different heating rates, hot pressing sintering temperatures, pressures, holding times, and cooling rates can be used. Other powder metallurgy methods can also be employed.

[0025] In the above embodiments of the present invention, W atom cluster powder is mixed into a tungsten and copper mixed powder, and then hot-pressed and sintered to prepare a... Composite materials exhibit significantly enhanced hardness, achieving atomic-level hardening of tungsten-copper composites. This provides a technical solution for maintaining both high conductivity and high hardness in tungsten-copper composites.

[0026] Example 1:

[0027] A certain amount of W atom cluster powder, tungsten powder, and copper powder were taken. Surface area analysis was performed using a specific surface area analyzer in a protective atmosphere glove box. The average particle size of the W atom cluster powder was 1.9 nm, the average particle size of the tungsten powder was 62 nm, and the average particle size of the copper powder was 283 nm. The three powders were weighed in a mass ratio of 1:4:5. The powders were then placed in a zirconia ball mill jar that had been ultrasonically cleaned with alcohol and dried in a protective atmosphere glove box. Zirconia grinding balls were added, and the mixture was ball-milled. The ball mill speed was set to 200 r / min, and the milling time was 12 h. After ball milling, the uniformly mixed powder was... The powder was placed into a silicon nitride mold that had been ultrasonically cleaned with alcohol and dried. The mold was then heated to 1050°C in a hot press furnace at a rate of 10°C / min and held at 100 MPa for 1 hour. Subsequently, the temperature was lowered at a rate of 10°C / min and allowed to cool to room temperature in the furnace, yielding powder doped with 10% W atomic clusters. Composite materials. Using tungsten powder and copper powder of the same particle size, weighed in a 1:1 mass ratio, and subjected to the same ball milling parameters and hot-pressing sintering process, a W-50%Cu composite material without W atom cluster powder was prepared as a control sample. Vickers hardness tests were performed on both materials, and the results showed that the material with 10% W atom cluster powder... The average Vickers hardness of the composite material was 407 HV, with a maximum value of 650 HV. The average hardness is approximately 3.6 times that of domestic and international standards, and about 100 HV higher than that of the W-50%Cu tungsten-copper composite material without W atom cluster powder. This indicates that the introduction of W atom cluster powder effectively improves the mechanical properties of the tungsten-copper composite material while maintaining its excellent electrical conductivity, demonstrating broad application prospects.

[0028] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A method for enhancing the hardness of W-Cu composite materials using W atom cluster powder, characterized in that, Includes the following steps: Step SS1: W-Cu@W atomic cluster powder, tungsten powder, and copper powder are added to a ball mill within a protective atmosphere glove box for ball milling to prepare W-Cu@W. 原 Composite powder; the W atom cluster powder has an average particle size of 1.9 nm; the tungsten powder has an average particle size of 62 nm; the copper powder has an average particle size of 283 nm; Step SS2: Take the W-Cu@W obtained in step SS1 原 The composite powder is added to a hot press furnace for hot pressing and sintering to obtain W-Cu@W 原 Composite material; heated to 1050℃ at 10℃ / min in a hot press furnace, held at 100MPa pressure for 1 h, then cooled to room temperature at 10℃ / min.

2. The method for enhancing the hardness of W-Cu composite materials using W atom cluster powder according to claim 1, characterized in that, The specific steps of SS1 include: taking a certain amount of W atom cluster powder, tungsten powder, and copper powder in a mass percentage ratio of 1:4:5, placing the powder into a zirconia ball mill jar that has been ultrasonically cleaned with alcohol and dried in a protective atmosphere glove box, adding zirconia grinding balls, and ball milling and mixing.

3. The method for enhancing the hardness of W-Cu composite materials using W atom cluster powder according to claim 1, characterized in that, The ball mill rotates at 200 r / min and the milling time is 12 h.

4. The method for enhancing the hardness of W-Cu composite materials using W atom cluster powder according to claim 1, characterized in that, Step SS1 specifically includes: ultrasonically cleaning the zirconia grinding jar and zirconia grinding balls for the ball mill with alcohol for 15 minutes, and drying them in a drying oven at 80°C for 15 minutes.

5. The method for enhancing the hardness of W-Cu composite materials with W atom cluster powder according to claim 1, characterized in that, Step SS2 specifically includes: after ball milling, mixing the uniformly blended W-Cu@W in a protective atmosphere glove box. 原 The powder was loaded into a silicon nitride mold that had been ultrasonically cleaned with alcohol and dried to obtain W-50%Cu@W powder doped with 10%W atomic clusters. 原 Composite materials.

6. The method for enhancing the hardness of W-Cu composite materials using W atom cluster powder according to claim 5, characterized in that, The specific steps of step SS2 include: ultrasonically cleaning the silicon nitride mold in the hot press furnace with alcohol for 15 minutes, and drying it in a drying oven at 80°C for 15 minutes.

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