Refrigerating device, system, method, medium and equipment with dynamically adjustable air-liquid ratio

Abstract

The invention discloses a refrigerating device, system, method, medium and equipment capable of dynamically adjusting the air-liquid ratio. The refrigerating device comprises an air cooling tail end module, a liquid cooling tail end module and a cold supplementing module, the air cooling tail end module is used for conducting air cooling on the environment where the high-heat-flux equipment is located, and the liquid cooling tail end module is used for conducting liquid cooling on the high-heat-flux equipment through a liquid cooling agent. The cold supplementing module is connected with the air cooling tail end module and the liquid cooling tail end module, and the cold supplementing module obtains cold energy through an external cold source and dynamically distributes the cold energy to the air cooling tail end module and / or the liquid cooling tail end module according to the air cooling load and the liquid cooling load and a preset proportion. According to the refrigeration device, the cold supplementing module can respond to changes of air cooling loads and liquid cooling loads in real time, the proportion of the cooling capacity distributed to the air cooling tail end and the liquid cooling tail end is accurately adjusted by controlling components such as a compressor and an expansion valve in the cold supplementing module, and the adaptability of the refrigeration device to actual requirements is improved.

Description

Technical Field

[0001] This invention relates to the fields of infrastructure and IT support technology, and in particular to a refrigeration device, system, method, medium, and equipment with dynamically adjustable air-liquid ratio. Background Technology

[0002] With the rapid development of technologies such as artificial intelligence and cloud computing, computing centers are facing an ever-increasing demand for high heat flux density cooling. Cold plate liquid cooling technology, due to its high technological maturity, has become one of the mainstream cooling technologies for data centers. This technology uses liquid as the heat transfer medium, flowing through the interior of the server's cold plate to remove the heat generated by high heat flux density components such as the CPU and GPU, while the remaining low-power density components in the server still rely on air cooling, thus forming a hybrid air-liquid cooling architecture.

[0003] In this architecture, the dynamic adjustment of the air-to-liquid ratio (i.e., the ratio of air cooling to liquid cooling heat dissipation) is key to achieving efficient and adaptable cooling. However, data center infrastructure is usually built ahead of business needs, making it difficult to accurately predict the actual air-to-liquid ratio requirements during the design phase; and in subsequent operation, dynamic changes in server power consumption, equipment upgrades, and fluctuations in outdoor environmental conditions will all lead to continuous changes in the proportion of air cooling and liquid cooling loads.

[0004] Two types of solutions have been proposed in related technologies: The first type is an independent air-liquid loop system, which, although achieving adjustable ratio, suffers from problems such as large cold source design capacity and high initial investment cost. The second type is a solution that uses a fluorine system to supplement cooling to the air-cooled side. Although this solution can adjust the air-liquid ratio to some extent, its adjustment range is limited, mainly suitable for scenarios with a high proportion of air-cooled load, and it is difficult to meet the needs of large-scale dynamic changes in the air-liquid ratio.

[0005] In summary, all the relevant technologies have limitations and cannot achieve a wide range of flexible dynamic adjustment of the air-liquid ratio while taking into account both cost and energy efficiency. Summary of the Invention

[0006] The present invention aims to at least partially solve one of the technical problems in the related art.

[0007] Therefore, embodiments of the present invention propose a cooling device with dynamically adjustable air-liquid ratio to adapt to uncertain business needs and dynamic server operating states, thereby improving the adaptability and reliability of the cooling device.

[0008] The dynamically adjustable air-liquid ratio refrigeration device of this invention includes an air-cooled terminal module, a liquid-cooled terminal module, and a supplementary cooling module. The air-cooled terminal module is used to cool the environment where the high heat flux density equipment is located. The liquid-cooled terminal module is used to liquid-cool the high heat flux density equipment using a liquid coolant. The supplementary cooling module is connected to the air-cooled terminal module and the liquid-cooled terminal module. The supplementary cooling module obtains cooling capacity through an external cold source and dynamically distributes the cooling capacity to the air-cooled terminal module and / or the liquid-cooled terminal module according to a preset ratio based on the air-cooling load and the liquid-cooling load.

[0009] In some embodiments, the cooling replenishment module is provided with a first interface, a second interface, a third interface, a fourth interface, a fifth interface, and a sixth interface; The cooling replenishment module is connected to an external cold source through the first interface and the second interface to obtain the cooling replenishment amount; The cooling replenishment module is connected to the liquid cooling terminal module through the third interface and the fourth interface, and is used to provide cooling replenishment to the liquid cooling terminal module; The cooling replenishment module is connected to the air-cooled terminal module through the fifth and sixth interfaces, and is used to provide cooling replenishment to the air-cooled terminal module.

[0010] In some embodiments, the cooling module includes a cooling heat exchanger, a first valve, a first compressor, a first expansion valve, and a second expansion valve; The first interface is connected to the first end of the supplementary cooling heat exchanger, and the second interface is connected to the second end of the supplementary cooling heat exchanger through the first valve, so as to supply supplementary cooling capacity to the supplementary cooling heat exchanger. The outlet of the first compressor is connected to the third end of the heat exchanger, the suction port of the first compressor is connected to the sixth interface for drawing in refrigerant from the air-cooled terminal module, and the gas supply port of the first compressor is connected to the fourth interface for drawing in refrigerant from the liquid-cooled terminal module. The inlets of the first expansion valve and the second expansion valve are both connected to the fourth end of the supplemental cooling heat exchanger. The outlet of the first expansion valve is connected to the third interface for supplying throttled refrigerant to the liquid-cooled terminal module. The outlet of the second expansion valve is connected to the fifth interface for supplying throttled refrigerant to the air-cooled terminal module.

[0011] In some embodiments, the cooling module further includes a second valve, through which the gas supply port of the first compressor is connected to the fourth interface.

[0012] In some embodiments, the cooling module includes a cooling heat exchanger, a first valve, a first compressor, a second compressor, a first expansion valve, and a second expansion valve; The first interface is connected to the first end of the supplementary cooling heat exchanger, and the second interface is connected to the second end of the supplementary cooling heat exchanger through the first valve, so as to supply supplementary cooling capacity to the supplementary cooling heat exchanger. The outlets of the first compressor and the second compressor are both connected to the third end of the supplementary cooling heat exchanger. The inlet of the first compressor is connected to the sixth interface for independently adjusting the supplementary cooling capacity to the air-cooled terminal module. The inlet of the second compressor is connected to the fourth interface for independently adjusting the supplementary cooling capacity to the liquid-cooled terminal module. The inlets of both the first expansion valve and the second expansion valve are connected to the fourth end of the supplemental cooling heat exchanger. The outlet of the first expansion valve is connected to the third interface, and the outlet of the second expansion valve is connected to the fifth interface.

[0013] In some embodiments, the air-cooled terminal module includes a first air-cooled heat exchanger, a fan, and a second air-cooled heat exchanger. The first and second ends of the first air-cooled heat exchanger are connected to an external cold source. The second air-cooled heat exchanger is connected to the cooling module through the fifth and sixth interfaces. The fan is used to drive return air to flow sequentially through the first and second air-cooled heat exchangers for heat exchange and cooling before being sent to the environment where the high heat flux density equipment is located.

[0014] In some embodiments, the liquid-cooled terminal module includes a first liquid-cooled heat exchanger, a secondary side pump, a liquid-cooled server cold plate, and a second liquid-cooled heat exchanger. The first and second ends of the first liquid-cooled heat exchanger are connected to an external cold source. The first and second ends of the second liquid-cooled heat exchanger are respectively connected to the cooling replenishment module through the third interface and the fourth interface. The third end of the second liquid-cooled heat exchanger is connected to the third end of the first liquid-cooled heat exchanger. The fourth end of the second liquid-cooled heat exchanger is connected to one end of the liquid-cooled server cold plate. The other end of the liquid-cooled server cold plate is connected to the inlet of the secondary side pump. The outlet of the secondary side pump is connected to the fourth end of the first liquid-cooled heat exchanger.

[0015] In some embodiments, the second liquid-cooled heat exchanger is integrated into the cooling module.

[0016] In some embodiments, the cooling module is a stand-alone module and is located in the environment where the high heat flux density equipment is situated, or... The cooling replenishment module is integrated into the air-cooled terminal module or the liquid-cooled terminal module.

[0017] Embodiments of the present invention also propose a refrigeration system with a dynamically adjustable air-liquid ratio.

[0018] The refrigeration system with dynamically adjustable air-liquid ratio according to an embodiment of the present invention includes: Cold source; A primary side water supply loop and a primary side water return loop are provided. The primary side water supply loop is connected to a cold source via a primary side pump, and the primary side water return loop is connected to a cold source. The refrigeration device is the dynamically adjustable air-liquid ratio refrigeration device described in the above embodiments. The first end and the second end of the first air-cooled heat exchanger of the air-cooled terminal module are respectively connected to the primary side water supply loop and the primary side water return loop to obtain cooling capacity. The first end and the second end of the first liquid-cooled heat exchanger of the liquid-cooled terminal module are respectively connected to the primary side water supply loop and the primary side water return loop to obtain cooling capacity. The first interface and the second interface of the cooling replenishment module are respectively connected to the primary side water supply loop and the primary side water return loop to obtain cooling replenishment capacity.

[0019] The embodiments of the present invention also propose a refrigeration method with dynamically adjustable air-liquid ratio, which is applicable to the refrigeration system with dynamically adjustable air-liquid ratio described in the above embodiments.

[0020] The cooling method with dynamically adjustable air-liquid ratio according to embodiments of the present invention includes: Real-time acquisition of air-cooled load parameters of the air-cooled terminal module and liquid-cooled load parameters of the liquid-cooled terminal module; Based on the air-cooled load and liquid-cooled load parameters, determine the total required supplemental cooling capacity and the target allocation ratio of air-cooled supplemental cooling capacity and liquid-cooled supplemental cooling capacity; The supplemental cooling module is controlled to dynamically allocate and deliver the supplemental cooling capacity obtained from the cold source to the air-cooled terminal module and the liquid-cooled terminal module according to the target allocation ratio, so as to adjust the ratio between air-cooled capacity and liquid-cooled capacity in real time.

[0021] In some embodiments, when the cooling module performs a single-stage compression dynamic distribution mode, the total refrigerant flow and evaporation pressure entering the air-cooled terminal module and the liquid-cooled terminal module are adjusted by controlling the frequency of the first compressor of the cooling module, and the refrigerant flow and evaporation pressure entering the air-cooled terminal module and the liquid-cooled terminal module are independently adjusted by controlling the opening degree of the first expansion valve and the second expansion valve of the cooling module, respectively.

[0022] In some embodiments, when the cooling module performs a quasi-two-stage compression dynamic distribution mode, the refrigerant flow rate and evaporation pressure entering the air-cooled terminal module are adjusted by controlling the frequency of the first compressor and the opening degree of the second expansion valve of the cooling module, and the refrigerant flow rate and evaporation pressure entering the liquid-cooled terminal module are adjusted by controlling the opening and closing of the second valve and the opening degree of the first expansion valve of the cooling module.

[0023] In some embodiments, when the supplemental cooling module executes the parallel compression dynamic distribution mode, the refrigerant flow rate and evaporation pressure entering the air-cooled terminal module are adjusted by controlling the frequency of the first compressor and the opening degree of the second expansion valve of the supplemental cooling module, and the refrigerant flow rate and evaporation pressure entering the liquid-cooled terminal module are adjusted by controlling the frequency of the second compressor and the opening degree of the first expansion valve of the supplemental cooling module.

[0024] Embodiments of the present invention also propose a storage medium storing a computer program thereon, which, when executed by a processor, implements the dynamically adjustable air-liquid ratio refrigeration method as described in the above embodiments.

[0025] Embodiments of the present invention also propose an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, it implements the refrigeration method with dynamically adjustable air-liquid ratio as described in the above embodiments.

[0026] In the embodiments of the present invention, the cooling supplement module can respond in real time to changes in air cooling and liquid cooling loads. By controlling its internal compressor, expansion valve and other components, it can accurately adjust the ratio of cooling capacity allocated to the air cooling terminal module and the liquid cooling terminal module, thus solving the problem of changes in air-liquid ratio demand caused by business uncertainty and dynamic server operation, and improving the adaptability of the refrigeration system to actual needs. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a refrigeration system with dynamically adjustable air-liquid ratio according to an embodiment of the present invention.

[0028] Figure 2 This is a schematic diagram of the cooling module of this invention executing a single-stage compression dynamic allocation mode.

[0029] Figure 3 This is a schematic diagram of the cooling module of this invention performing a quasi-two-stage compression dynamic allocation mode.

[0030] Figure 4 This is a schematic diagram of the parallel compression dynamic allocation mode executed by the cooling module in an embodiment of the present invention.

[0031] Figure label: 1. Air-cooled terminal module; 101. First air-cooled heat exchanger; 102. Fan; 103. Second air-cooled heat exchanger; 2. Liquid-cooled terminal module; 201. First liquid-cooled heat exchanger; 202. Secondary side pump; 203. Liquid-cooled server cold plate; 204. Second liquid-cooled heat exchanger; 3. Cooling supplement module; 301. Cooling supplement heat exchanger; 302. First valve; 303. First compressor; 304. First expansion valve; 305. Second expansion valve; 306. Second valve; 307. Second compressor; 4. Primary water supply loop; 5. Primary water return loop; 6. Primary pump; 7. Cold source; A. First interface; B. Second interface; C. Third interface; D. Fourth interface; E. Fifth interface; F. Sixth interface. Detailed Implementation

[0032] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0033] The following describes a dynamically adjustable air-liquid ratio refrigeration device according to an embodiment of the present invention with reference to the accompanying drawings.

[0034] like Figure 1 As shown, the refrigeration device with dynamically adjustable air-liquid ratio according to an embodiment of the present invention includes an air-cooled terminal module 1, a liquid-cooled terminal module 2, and a supplementary cooling module 3.

[0035] Air-cooled terminal module 1 is used to cool the environment where the high heat flux density equipment is located, and liquid-cooled terminal module 2 is used to cool the high heat flux density equipment with liquid coolant.

[0036] The high heat flux density equipment cluster includes data center servers, power electronic devices (such as IGBTs), lasers, high-performance computing modules, and other objects with high heat power density. In the embodiments of this invention, a data center server is specifically used as an example for description.

[0037] The cooling replenishment module 3 is connected to the air-cooled terminal module 1 and the liquid-cooled terminal module 2. The cooling replenishment module 3 obtains cooling capacity through the external cold source 7 and dynamically distributes the cooling capacity to the air-cooled terminal module 1 and / or the liquid-cooled terminal module 2 according to the air-cooled load and the liquid-cooled load in a preset ratio.

[0038] Understandably, this involves real-time monitoring of the air cooling load (e.g., server room return air temperature) and liquid cooling load (e.g., liquid cooling loop temperature or server power consumption) within the data center. Based on the monitored load information, the control components inside the supplementary cooling module 3 begin to operate. According to its built-in control logic, the supplementary cooling module 3 dynamically determines, based on a preset optimization algorithm, how to allocate the pre-set cooling capacity from the cold source 7 (which may be cooling a certain working fluid, such as Freon) to the air cooling loop and the liquid cooling loop. This allocation is not fixed but rather a dynamic process responding to changes in the air-to-liquid ratio demand. The precisely allocated cooling capacity is then delivered to the air cooling terminal module 1 to further reduce the supply air temperature, and to the liquid cooling terminal module 2 to assist in reducing the coolant temperature.

[0039] The cooling replenishment module 3, as a cooling capacity distribution unit, is controllably connected to both the air-cooled and liquid-cooled terminals. It can replenish cooling to the air-cooled side, the liquid-cooled side, or both sides simultaneously at different ratios. This bidirectional and adjustable architecture extends its adjustment range from (air-cooled only) to the entire range (air-cooled and liquid-cooled), achieving wide-range adjustment.

[0040] Therefore, the dynamically adjustable air-liquid ratio refrigeration device of this invention can respond in real time to the dynamic changes in air-cooling and liquid-cooling loads, solving the problem of fluctuating air-liquid ratio requirements caused by business uncertainties and dynamic server operation. By replacing two independent systems with the supplementary cooling module 3, equipment costs, installation costs, and space occupation are directly reduced.

[0041] Because the supplemental cooling module 3 provides differential cooling capacity on demand and can be optimized for different temperature requirements of the air and liquid terminals (such as achieving dual evaporation temperature operation), it reduces energy waste caused by excess capacity and temperature mismatch. This architecture eliminates the need to precisely lock the air-liquid ratio during the initial construction of the data center, providing flexibility to cope with future business and technology changes.

[0042] In some embodiments, such as Figures 1 to 4 As shown, the cooling module 3 is provided with a first interface A, a second interface B, a third interface C, a fourth interface D, a fifth interface E, and a sixth interface F.

[0043] The cooling replenishment module 3 is connected to an external cold source 7 through the first interface A and the second interface B to obtain cooling capacity. The first interface A and the second interface B are the energy input ports of the cooling replenishment module 3, enabling the cooling replenishment module 3 to obtain cooling capacity from the cold source 7 and ensuring a stable supply of cooling capacity.

[0044] The supplemental cooling module 3 is connected to the liquid-cooled terminal module 2 via the third interface C and the fourth interface D, and is used to provide supplemental cooling to the liquid-cooled circulation loop of the liquid-cooled terminal module 2. The supplemental cooling module 3 is connected to the air-cooled terminal module 1 via the fifth interface E and the sixth interface F, and is used to provide supplemental cooling to the air-cooled circulation loop of the air-cooled terminal module 1.

[0045] The third interface C and the fourth interface D, along with the fifth interface E and the sixth interface F, together constitute the energy output and recovery interfaces of the cooling module 3. For example, the third interface C serves as the outlet for supplying liquid refrigerant to the liquid-cooled terminal module 2, while the fourth interface D serves as the inlet for recovering gaseous refrigerant from the liquid-cooled terminal module 2. The fifth interface E serves as the outlet for supplying liquid refrigerant to the air-cooled terminal module 1, while the sixth interface F serves as the inlet for recovering gaseous refrigerant from the air-cooled terminal module 1. By separating the supply and recovery paths, the system achieves independent monitoring and control of the air and liquid cooling circuits.

[0046] The six interfaces of the cooling module 3 define a standardized physical and functional protocol, making it a plug-and-play module. Whether building a new data center or renovating an old server room, integration is quick and easy, provided that the air-cooled terminal module 1 and liquid-cooled terminal module 2 have compatible connection points. This improves the deployability, maintainability, and replaceability of the cooling system. If the cooling module 3 requires repair or upgrades, it can be safely disconnected from other devices without interrupting the entire system.

[0047] Optionally, the cooling replenishment module 3 is connected to at least one air-cooled terminal module 1 and at least one liquid-cooled terminal module 2. In other words, the third interface C and the fourth interface D of the cooling replenishment module 3 can be connected to one or more liquid-cooled terminal modules 2, and the fifth interface E and the sixth interface F of the cooling replenishment module 3 can be connected to one or more air-cooled terminal modules 1.

[0048] Understandably, a single cooling module 3 can simultaneously provide cooling services to multiple air-cooled air conditioners and multiple liquid-cooled racks in server room area 1, avoiding the huge waste of equipping each terminal with a small cooling unit. Data center administrators can dynamically allocate cooling capacity to the areas that need it most based on the real-time load of different areas and racks through software.

[0049] In some embodiments, such as Figure 1 and Figure 2 As shown, the cooling module 3 is used to execute the single-stage compression dynamic distribution mode. At this time, the cooling module 3 includes a cooling heat exchanger 301, a first valve 302, a first compressor 303, a first expansion valve 304, and a second expansion valve 305.

[0050] The first port A is connected to the first end of the supplementary cooling heat exchanger 301, and the second port B is connected to the second end of the supplementary cooling heat exchanger 301 through the first valve 302, so as to supply supplementary cooling capacity to the supplementary cooling heat exchanger 301. The supplementary cooling heat exchanger 301 acts as a condenser, exchanging heat between the high-temperature, high-pressure gaseous refrigerant from the first compressor 303 and the cold water on the cold source 7 side, condensing it into a medium-temperature, high-pressure liquid refrigerant. Simultaneously, the supplementary cooling heat exchanger 301 also draws cooling capacity from the loop on the cold source 7 side.

[0051] The first valve 302 is located between the second end of the cooling heat exchanger 301 and the second port B. Its function is to control whether the fluid on the cold source 7 side flows through the cooling heat exchanger 301. When the cooling demand is zero, closing the first valve 302 can functionally isolate the cooling module 3 from the loop on the cold source 7 side, reducing unnecessary flow resistance or heat loss.

[0052] The first compressor 303 has an intake port, a refrigerant inlet, and an outlet. The outlet of the first compressor 303 is connected to the third end of the cooling heat exchanger 301. The intake port of the first compressor 303 is connected to the sixth interface F for drawing in refrigerant from the air-cooled terminal module 1. The refrigerant inlet of the first compressor 303 is connected to the fourth interface D for drawing in refrigerant from the liquid-cooled terminal module 2.

[0053] The inlets of both the first expansion valve 304 and the second expansion valve 305 are connected to the fourth end of the supplementary cooling heat exchanger 301. The outlet of the first expansion valve 304 is connected to the third interface C, which is used to supply throttled refrigerant to the liquid-cooled terminal module 2. The outlet of the second expansion valve 305 is connected to the fifth interface E, which is used to supply throttled refrigerant to the air-cooled terminal module 1.

[0054] The first compressor 303 mixes and compresses the low-temperature, low-pressure vapor from the air-cooled terminal module 1 with the medium-pressure vapor from the liquid-cooled terminal module 2, and then sends the mixture to the supplementary cooling heat exchanger 301 to condense it into liquid. The liquid refrigerant flowing out of the supplementary cooling heat exchanger 301 is divided into two streams: The refrigerant is throttled to medium pressure via the first expansion valve 304, and then fed into the second liquid-cooled heat exchanger 204 of the liquid-cooled terminal module 2 through the third port C. In the second liquid-cooled heat exchanger 204, the refrigerant absorbs heat from the liquid working fluid and evaporates into medium-pressure gaseous refrigerant. This medium-pressure gaseous refrigerant is then led back to the gas supply port of the first compressor 303 through the fourth port D.

[0055] Another path leads to a low-pressure flow via the second expansion valve 305, and then into the second air-cooled heat exchanger 103 of the air-cooled terminal module 1 through the fifth port E. In the second air-cooled heat exchanger 103, the refrigerant absorbs heat from the room air and evaporates into a low-temperature, low-pressure gaseous refrigerant. This low-pressure gaseous refrigerant is then returned to the suction port of the first compressor 303 through the sixth port F.

[0056] Medium-pressure gas from liquid-cooled terminal module 2 enters the compressor through the gas inlet and mixes with the main suction gas from air-cooled terminal module 1 to complete a complete refrigeration cycle.

[0057] The device cleverly utilizes a single compressor and employs enthalpy-boosting technology to simultaneously maintain a low evaporation temperature on the air-cooled side and a medium evaporation temperature on the liquid-cooled side. This matches the needs of air cooling, which requires lower-temperature air, with liquid cooling, which can accept slightly higher-temperature coolant, thus significantly improving the overall energy efficiency of the device. By controlling two expansion valves separately, the amount of supplemental cooling to the air-cooled and liquid-cooled sides can be adjusted independently and over a wide range.

[0058] In some embodiments, such as Figure 1 and Figure 3 As shown, the cooling module 3 is used to execute the quasi-two-stage compression dynamic distribution mode. At this time, the cooling module 3 includes not only the cooling heat exchanger 301, the first valve 302, the first compressor 303, the first expansion valve 304 and the second expansion valve 305, but also the second valve 306. The gas supply port of the first compressor 303 is connected to the fourth interface D through the second valve 306.

[0059] The quasi-two-stage compression dynamic cooling module 3 is based on the single-stage compression dynamic cooling module 3 with the addition of a second valve 306. The opening and closing of the second valve 306 determines whether the cooling module 3 provides cooling to the liquid-cooled terminal module 2.

[0060] After refrigerant condensation and throttling, a critical branch appears in the system operation process, forming two parallel evaporation-compression paths: In the air-cooled main circuit (low-pressure circuit), the refrigerant is throttled to low pressure by the second expansion valve 305 and enters the second air-cooled heat exchanger 103 to absorb heat from the air in the machine room, evaporating into low-temperature, low-pressure vapor. This vapor returns directly to the main suction port of the first compressor 303 through the sixth interface F. The air-cooled main circuit is responsible for meeting basic and substantial air-cooled supplementary cooling needs.

[0061] In the liquid-cooled gas supply circuit (medium-pressure circuit), the refrigerant is throttled to medium pressure via the first expansion valve 304. This medium-pressure two-phase refrigerant enters the second liquid-cooled heat exchanger 204, absorbs heat from the liquid-cooled working fluid, and evaporates into medium-pressure, medium-temperature vapor. Its pressure and temperature are both higher than the vapor from the air-cooled terminal. This medium-pressure vapor is precisely injected into the gas supply port of the first compressor 303 during operation via the fourth port D and the second valve 306.

[0062] At this time, the following processes are simultaneously taking place inside the compressor: First-stage compression, where the low-temperature, low-pressure vapor from the air-cooled terminal (sixth interface F) is compressed to a certain intermediate pressure; Gas mixing, where the vapor returning from the medium-pressure liquid-cooled terminal mixes with the refrigerant vapor after the first-stage compression in the compressor cavity; Second-stage compression, where the mixed gas is further compressed to the final required condensing pressure and then discharged.

[0063] By supplementing the refrigerant, the compressor's discharge temperature is lowered, and its compression process is improved, allowing the compressor to maintain high efficiency even when the pressure ratio is increased (i.e., to meet greater temperature difference requirements). This system can still operate efficiently in harsher outdoor environments (higher primary side water temperatures) or when liquid cooling requires lower temperatures. Because the refrigerants for the air-cooled and liquid-cooled circuits are separated within the compressor, the unit can independently provide optimal evaporation temperatures for both air-cooled and liquid-cooled systems.

[0064] In some embodiments, such as Figure 1 and Figure 4 As shown, the cooling module 3 is used to execute the parallel compression dynamic allocation mode. At this time, the cooling module 3 includes a cooling heat exchanger 301, a first valve 302, a first compressor 303, a second compressor 307, a first expansion valve 304, and a second expansion valve 305.

[0065] The first port A is connected to the first end of the supplementary cooling heat exchanger 301, and the second port B is connected to the second end of the supplementary cooling heat exchanger 301 through the first valve 302 to supply supplementary cooling capacity to the supplementary cooling heat exchanger 301.

[0066] The outlets of the first compressor 303 and the second compressor 307 are both connected to the third end of the supplementary cooling heat exchanger 301. The inlet of the first compressor 303 is connected to the sixth interface F, which is used to independently adjust the supplementary cooling capacity to the air-cooled terminal module 1. The inlet of the second compressor 307 is connected to the fourth interface D, which is used to independently adjust the supplementary cooling capacity to the liquid-cooled terminal module 2.

[0067] The inlets of the first expansion valve 304 and the second expansion valve 305 are both connected to the fourth end of the supplementary cooling heat exchanger 301. The outlet of the first expansion valve 304 is connected to the third interface C, and the outlet of the second expansion valve 305 is connected to the fifth interface E.

[0068] The parallel compression dynamic cooling module 3 achieves flexibility through complete hardware decoupling. Its core lies in using two completely independent compression-evaporation circuits, sharing the same cooling heat exchanger 301 only at the condensing end. The first compressor 303 and the second compressor 307 are no longer in a master-slave or gas-supply relationship, but are two completely equal and independent compressors, serving the air-cooled and liquid-cooled terminals respectively, forming a parallel architecture with completely independent control and no interference between them.

[0069] The system adjusts the air-cooled supplemental cooling capacity (by controlling the first compressor 303 and the second expansion valve 305) and the dedicated liquid-cooled circuit (by controlling the second compressor 307 and the first expansion valve 304). The two circuits are thermodynamically independent, thus achieving their respective theoretical maximum energy efficiency without being constrained by the demand of the other circuit.

[0070] If one of the compressors (such as the second compressor 307 serving liquid cooling) fails, the dedicated air-cooled circuit can still continue to operate, providing basic supplemental cooling for the data center. While one system is undergoing maintenance, the other system can continue to operate, improving the availability of the facility.

[0071] Furthermore, with the large-scale increase in liquid-cooled servers in data centers in the future, the cooling capacity of the original liquid-cooling circuit will be insufficient. A third compressor can be added in parallel to the liquid-cooling circuit without modifying the air-cooling circuit, achieving a smooth, stacked upgrade.

[0072] In some embodiments, such as Figures 1 to 4 As shown, the air-cooled terminal module 1 includes a first air-cooled heat exchanger 101, a fan 102, and a second air-cooled heat exchanger 103. The first and second ends of the first air-cooled heat exchanger 101 are connected to an external cold source 7. The second air-cooled heat exchanger 103 is connected to the supplementary cooling module 3 through the fifth interface E and the sixth interface F. The fan 102 is used to drive the return air to flow sequentially through the first air-cooled heat exchanger 101 and the second air-cooled heat exchanger 103 for heat exchange and cooling before being sent to the environment where the high heat flux density equipment is located.

[0073] The first air-cooled heat exchanger 101 directly obtains cooling capacity from the primary side water supply loop 4 in the cold source 7 circulation loop, and performs the first and main step of cooling the return air of the computer room.

[0074] The second air-cooled heat exchanger 103 contains a low-temperature refrigerant flowing from the supplementary cooling module 3, which performs precise temperature regulation. The supplementary cooling module 3 is activated when the primary cooling capacity is insufficient or a lower supply air temperature is required, allowing the refrigerant to evaporate and absorb the remaining heat in the air, thus achieving precise fine-tuning of the supply air temperature.

[0075] Fan 102 is the aerodynamic source for the entire air-cooling path, establishing a stable airflow to ensure that air can flow sequentially and fully through the two heat exchangers.

[0076] The operation process of the air-cooled terminal module 1 is as follows: hot return air from the computer room → first air-cooled heat exchanger 101 (exchanges heat with primary side chilled water for initial cooling) → second air-cooled heat exchanger 103 (exchanges heat with refrigerant from the cooling module 3 for final cooling) → low-temperature air is supplied to the computer room.

[0077] In an embodiment of the invention, precise control of the supply air temperature is achieved through the cooperation of the primary-side basic cold source 7 and the supplementary cooling module 3. The air-cooled terminal module 1 achieves flexible superposition and precise control of cooling capacity by connecting two heat exchangers in series.

[0078] In some embodiments, such as Figures 1 to 4As shown, the liquid-cooled terminal module 2 includes a first liquid-cooled heat exchanger 201, a secondary side pump 202, a liquid-cooled server cold plate 203, and a second liquid-cooled heat exchanger 204.

[0079] The first and second ends of the first liquid-cooled heat exchanger 201 are connected to an external cold source 7. The first and second ends of the second liquid-cooled heat exchanger 204 are connected to the cooling module 3 through the third interface C and the fourth interface D, respectively. The third end of the second liquid-cooled heat exchanger 204 is connected to the third end of the first liquid-cooled heat exchanger 201. The fourth end of the second liquid-cooled heat exchanger 204 is connected to one end of the liquid-cooled server cold plate 203. The other end of the liquid-cooled server cold plate 203 is connected to the inlet of the secondary side pump 202. The outlet of the secondary side pump 202 is connected to the fourth end of the first liquid-cooled heat exchanger 201.

[0080] The first liquid-cooled heat exchanger 201 is connected to the primary-side water supply loop 4 in the cold source 7 circulation loop, and is responsible for dissipating most of the heat in the liquid-cooled loop. The second liquid-cooled heat exchanger 204 is used for auxiliary cooling and temperature protection of the liquid-cooled path. The secondary-side pump 202 is the power core of the liquid-cooled circulation loop, driving the cooling medium to complete the circulation. The liquid-cooled server cold plate 203 is the final heat dissipation component, directly contacting the server's heat-generating chips to remove heat.

[0081] The cooling medium is cooled by primary side chilled water at the first liquid-cooled heat exchanger 201, and then cooled again by refrigerant from the supplementary cooling module 3 at the second liquid-cooled heat exchanger 204 before entering the server cold plate. The flow path of the cooling medium clearly demonstrates a two-stage cooling process, ensuring that the temperature of the coolant flowing to the server is sufficiently low and stable.

[0082] Alternatively, the second liquid-cooled heat exchanger 204 can be located between the first end of the first liquid-cooled heat exchanger 201 and the primary side water supply loop 4, so that the cooling medium is pre-cooled by the second liquid-cooled heat exchanger 204 and then mainly cooled by the first liquid-cooled heat exchanger 201, which can also ensure the heat dissipation effect of the server cold plate.

[0083] Furthermore, the second liquid-cooled heat exchanger 204 is a component of the liquid-cooled terminal module 2. The infrastructure (primary loop and supplemental cooling module 3) is physically separated from the server equipment (liquid-cooled terminal module 2), making the supplemental cooling module 3 itself universal and able to serve any liquid-cooled terminal that conforms to the interface standard, regardless of its brand, model or deployment time.

[0084] Alternatively, the second liquid-cooled heat exchanger 204 can be integrated into the supplementary cooling module 3. The supplementary cooling module 3 essentially provides the liquid-cooled server with an upgrade kit that includes its own cooling source 7, enabling plug-and-play rapid deployment of the liquid-cooled server. Furthermore, since the second liquid-cooled heat exchanger 204 and other components within the supplementary cooling module 3 (such as the compressor and expansion valve) have already undergone optimized connection and matching at the factory, performance loss due to improper on-site installation is avoided.

[0085] In some embodiments, the cooling module 3 is an independent module located in the environment of high heat flux density equipment. The cooling module 3 is designed as a cooling capacity distribution module that can exist independently both physically and functionally. The cooling module 3 can be pre-manufactured and tested, like a standard server rack, and then deployed in any available space in the data center. Data center operators or server manufacturers can procure and stockpile such standardized modules in advance.

[0086] In the initial stage of construction, only the basic primary side system and terminals can be deployed. When future business growth or server technology iteration leads to heat dissipation requirements exceeding the design, the supplementary cooling module 3 can be connected to the system to achieve on-demand expansion and significantly reduce the initial investment risk.

[0087] Alternatively, the components of the cooling supplement module 3 can be directly integrated into the chassis of the air-cooled terminal module 1 (such as an air conditioning unit) or the liquid-cooled terminal module 2 (such as a coolant distribution unit, CDU). For data centers where space is extremely limited, integrating the cooling supplement function into existing equipment saves valuable server room space.

[0088] The following describes a dynamically adjustable air-liquid ratio refrigeration system according to an embodiment of the present invention with reference to the accompanying drawings.

[0089] like Figures 1 to 4 As shown, the dynamically adjustable air-liquid ratio refrigeration system of this invention includes a cold source 7, a primary side water supply loop 4, a primary side water return loop 5, and a refrigeration device.

[0090] The primary-side supply water loop 4 and the primary-side return water loop 5 can be understood as the primary-side circulation loop of the cold source 7, which is the fundamental and stable source of cooling for the entire system. The primary-side supply water loop 4 is connected to the cold source 7 through the primary-side pump 6, and the primary-side return water loop 5 is connected to the cold source 7. The cold source 7 can be a natural cold source (such as a cooling tower) or a mechanical cold source (such as a chiller unit).

[0091] The refrigeration device is the dynamically adjustable air-liquid ratio refrigeration device in the above embodiment. The first end and the second end of the first air-cooled heat exchanger 101 of the air-cooled terminal module 1 are respectively connected to the primary side water supply loop 4 and the primary side water return loop 5 to obtain cooling capacity. The first end and the second end of the first liquid-cooled heat exchanger 201 of the liquid-cooled terminal module 2 are respectively connected to the primary side water supply loop 4 and the primary side water return loop 5 to obtain cooling capacity. The first interface A and the second interface B of the cooling replenishment module 3 are respectively connected to the primary side water supply loop 4 and the primary side water return loop 5 to obtain cooling replenishment capacity.

[0092] The primary-side circulation loop is clearly divided into a primary-side water supply loop 4 and a primary-side water return loop 5. The primary-side water supply loop 4 carries the cooling energy flowing out from the cold source 7, while the primary-side water return loop 5 collects the cooled fluid (lower temperature and quality) that has absorbed heat and returns from all heat exchange modules (the first air-cooled heat exchanger 101 of the air-cooled terminal module 1, the first liquid-cooled heat exchanger 201 of the liquid-cooled terminal module 2, and the make-up cooling module 3 itself). Since all terminal cooling modules and make-up cooling modules draw water from a stable and unified primary-side water supply loop 4, it ensures that the quality of the cold source 7 obtained by each unit is the same, providing a unified and reliable benchmark for the entire system.

[0093] The supplemental cooling module 3 is connected to the primary-side water supply loop 4 and the primary-side water return loop 5 via the first interface A and the second interface B, respectively. If the supplemental cooling module 3 needs to directly obtain cooling capacity from the liquid-cooled or air-cooled loop, the stability of its internal system will be directly affected by drastic changes in the terminal load. In the embodiment of the present invention, regardless of changes in the terminal load, the primary-side water temperature flowing into the supplemental cooling module 3 is relatively constant, simplifying the internal control logic of the supplemental cooling module 3 and improving the robustness of the entire system.

[0094] The following describes a refrigeration method with dynamically adjustable air-liquid ratio according to an embodiment of the present invention, with reference to the accompanying drawings. This refrigeration method is applicable to the refrigeration system with dynamically adjustable air-liquid ratio described in the above embodiments.

[0095] The cooling method with dynamically adjustable air-liquid ratio according to embodiments of the present invention includes: Real-time acquisition of air cooling load parameters of air-cooled terminal module 1 and liquid cooling load parameters of liquid cooling terminal module 2; Based on the air-cooled load and liquid-cooled load parameters, determine the total required supplemental cooling capacity and the target allocation ratio of air-cooled supplemental cooling capacity and liquid-cooled supplemental cooling capacity; The supplementary cooling module 3 is controlled to dynamically allocate and deliver the supplementary cooling capacity obtained from the cold source 7 to the air-cooled terminal module 1 and the liquid-cooled terminal module 2 according to the target allocation ratio, so as to adjust the ratio between the air-cooled capacity and the liquid-cooled capacity in real time.

[0096] like Figure 1 and Figure 2As shown, when the cooling module 3 executes the single-stage compression dynamic distribution mode, the total refrigerant flow and evaporation pressure entering the air-cooled terminal module 1 and the liquid-cooled terminal module 2 are adjusted by controlling the frequency of the first compressor 303 of the cooling module 3. The refrigerant flow and evaporation pressure entering the air-cooled terminal module 1 and the liquid-cooled terminal module 2 are also independently adjusted by controlling the opening degree of the first expansion valve 304 and the second expansion valve 305 of the cooling module 3.

[0097] The system monitors the air cooling load and liquid cooling load of the data center in real time, and calculates the total required supplemental cooling capacity and the allocation ratio between the air and liquid sides based on the load demand.

[0098] By controlling the operating frequency of the first compressor 303, its displacement is adjusted. This is equivalent to controlling the total horsepower of the system, determining the total refrigerant circulation volume of the supplementary cooling module 3 and the system evaporation pressure level. The two expansion valves act like two faucets, precisely controlling the flow of water to the air-cooled and liquid-cooled sides. The refrigerant flow into the air-cooled terminal module 1 and the liquid-cooled terminal module 2 is independently adjusted by controlling the opening degrees of the first expansion valve 304 and the second expansion valve 305, respectively. Ultimately, dynamic and precise adjustment of the air-liquid ratio is achieved.

[0099] Therefore, by pre-installing the cooling replenishment module 3, the infrastructure side can flexibly accommodate different types of servers and adapt to the liquid cooling transformation scenario of the data center. When using air-cooled servers, closing the first expansion valve 304 and opening the first compressor 303, the first valve 302, and the second expansion valve 305 can achieve dynamic cooling replenishment adjustment to the air-cooled side; when only cooling replenishment to liquid-cooled servers is needed, closing the second expansion valve 305 and opening the first compressor 303, the first valve 302, and the first expansion valve 304; when it is necessary to adjust the cooling replenishment of both air-cooled and liquid-cooled sides simultaneously, opening the first compressor 303, the first valve 302, the first expansion valve 304, and the second expansion valve 305.

[0100] The operating logic of the single-stage compression dynamic cooling module 3 is suitable for scenarios where the air-cooling and liquid-cooling loads change dynamically, and the total cooling demand fluctuates within a certain range. For example, when the liquid-cooled server has heavy computing tasks at night, the system will increase the opening of the first expansion valve 304; when the ambient temperature rises during the day, causing the air-cooling load to increase, the system will prioritize ensuring the opening of the second expansion valve 305, thus balancing the efficiency of centralized adjustment with the flexibility of independent allocation.

[0101] like Figure 1 and Figure 3As shown, when the cooling module 3 executes the quasi-two-stage compression dynamic distribution mode, the refrigerant flow rate and evaporation pressure entering the air-cooled terminal module 1 are adjusted by controlling the frequency of the first compressor 303 and the opening degree of the second expansion valve 305 of the cooling module 3, and the refrigerant flow rate and evaporation pressure entering the liquid-cooled terminal module 2 are adjusted by controlling the opening and closing of the second valve 306 and the opening degree of the first expansion valve 304 of the cooling module 3.

[0102] Control of the air-cooled circuit: The refrigerant flow rate and evaporation pressure entering the air-cooled terminal module 1 are regulated by controlling the frequency of the first compressor 303 and the opening of the second expansion valve 305. When it is necessary to increase the air-cooled supplemental cooling capacity, on the one hand, the compressor frequency is increased to pump more refrigerant; on the other hand, the opening of the second expansion valve 305 is adjusted to precisely control the flow rate and evaporation pressure.

[0103] Control of the liquid cooling circuit: Depending on whether liquid cooling replenishment is needed, the second valve 306 is instructed to open or close, thereby controlling whether the liquid cooling replenishment circuit is activated. When there is no liquid-cooled server or the liquid cooling load is extremely low, the second valve 306 and the first expansion valve 304 can be directly closed. When liquid cooling replenishment is needed, the second valve 306 is opened, and the refrigerant flow rate and evaporation pressure entering the liquid cooling terminal module 2 are adjusted by controlling the opening degree of the first expansion valve 304.

[0104] Therefore, the cooling module 3 adopts quasi-two-stage compression dynamic cooling, enabling the system to operate efficiently at dual evaporation temperatures. The first compressor 303 is turned on, and the first valve 302 and the second valve 306 are open, as are the first expansion valve 304 and the second expansion valve 305. The liquid refrigerant at the fourth outlet of the cooling heat exchanger 301 is split; part enters the first expansion valve 304, where it is throttled to medium pressure. After absorbing heat from the medium-temperature liquid refrigerant in the second liquid-cooled heat exchanger 204, it enters the charging port of the first compressor 303. The other part enters the second expansion valve 305, where it is throttled to low pressure. After absorbing heat from the machine room air in the second air-cooled heat exchanger 103, it returns to the suction port of the first compressor 303. The system operates at dual evaporation temperatures, matching the different temperature requirements of the air-cooled and liquid-cooled terminals, thus improving the energy efficiency of the refrigeration system.

[0105] like Figure 1 and Figure 4 As shown, when the supplemental cooling module 3 executes the parallel compression dynamic distribution mode, the refrigerant flow rate and evaporation pressure entering the air-cooled terminal module 1 are adjusted by controlling the frequency of the first compressor 303 and the opening of the second expansion valve 305 of the supplemental cooling module 3, and the refrigerant flow rate and evaporation pressure entering the liquid-cooled terminal module 2 are adjusted by controlling the frequency of the second compressor 307 and the opening of the first expansion valve 304 of the supplemental cooling module 3.

[0106] On the air-cooled side, the refrigerant flow rate and evaporation pressure entering the air-cooled terminal module 1 are regulated by controlling the frequency of the first compressor 303 and the opening of the second expansion valve 305. The operation of the first compressor 303 and the second expansion valve 305 is coordinated; increasing the frequency of the first compressor 303 increases the total flow rate, while simultaneously adjusting the opening of the second expansion valve 305 sets the evaporation pressure, ultimately precisely controlling the supplementary cooling capacity and the supply air temperature.

[0107] Similarly, in liquid cooling, the refrigerant flow rate and evaporation pressure entering the liquid cooling terminal module 2 are adjusted by controlling the frequency of the second compressor 307 and the opening degree of the first expansion valve 304.

[0108] The Parallel Compression Dynamic Cooling Module 3 is suitable for scenarios where both air-cooled and liquid-cooled loads are high and fluctuate dramatically, such as large-scale hybrid deployments of CPU air-cooled servers and GPU liquid-cooled servers, where the loads of both types of servers are highly dynamic. The Parallel Compression Dynamic Cooling Module 3 can provide maximum cooling support for both simultaneously without affecting each other.

[0109] To implement the above embodiments, embodiments of the present invention also propose a storage medium storing a computer program thereon, which, when executed by a processor, implements the refrigeration method with dynamically adjustable air-liquid ratio as described in the above embodiments.

[0110] To implement the above embodiments, embodiments of the present invention also propose an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, it implements the cooling method with dynamically adjustable air-liquid ratio as described in the above embodiments.

[0111] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0112] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0113] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0114] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0115] In this invention, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0116] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A refrigeration device with dynamically adjustable air-liquid ratio, characterized in that, include: An air-cooled terminal module is used to cool the environment in which the equipment with high heat flux density is located. A liquid-cooled terminal module, wherein the liquid-cooled terminal module is used to liquid-cool high heat flux density equipment using a liquid coolant; A cooling replenishment module is connected to the air-cooled terminal module and the liquid-cooled terminal module. The cooling replenishment module obtains cooling capacity through an external cold source and dynamically distributes the cooling capacity to the air-cooled terminal module and / or the liquid-cooled terminal module according to a preset ratio based on the air-cooled load and the liquid-cooled load.

2. The refrigeration device with dynamically adjustable air-liquid ratio according to claim 1, characterized in that, The cooling module is equipped with a first interface, a second interface, a third interface, a fourth interface, a fifth interface, and a sixth interface; The cooling replenishment module is connected to an external cold source through the first interface and the second interface to obtain the cooling replenishment amount; The cooling replenishment module is connected to the liquid cooling terminal module through the third interface and the fourth interface, and is used to provide cooling replenishment to the liquid cooling terminal module; The cooling replenishment module is connected to the air-cooled terminal module through the fifth and sixth interfaces, and is used to provide cooling replenishment to the air-cooled terminal module.

3. The refrigeration device with dynamically adjustable air-liquid ratio according to claim 2, characterized in that, The cooling module includes a cooling heat exchanger, a first valve, a first compressor, a first expansion valve, and a second expansion valve; The first interface is connected to the first end of the supplementary cooling heat exchanger, and the second interface is connected to the second end of the supplementary cooling heat exchanger through the first valve, so as to supply supplementary cooling capacity to the supplementary cooling heat exchanger. The outlet of the first compressor is connected to the third end of the heat exchanger, the suction port of the first compressor is connected to the sixth interface for drawing in refrigerant from the air-cooled terminal module, and the gas supply port of the first compressor is connected to the fourth interface for drawing in refrigerant from the liquid-cooled terminal module. The inlets of the first expansion valve and the second expansion valve are both connected to the fourth end of the supplemental cooling heat exchanger. The outlet of the first expansion valve is connected to the third interface for supplying throttled refrigerant to the liquid-cooled terminal module. The outlet of the second expansion valve is connected to the fifth interface for supplying throttled refrigerant to the air-cooled terminal module.

4. The refrigeration device with dynamically adjustable air-liquid ratio according to claim 3, characterized in that, The cooling module also includes a second valve, through which the gas supply port of the first compressor is connected to the fourth interface.

5. The refrigeration device with dynamically adjustable air-liquid ratio according to claim 2, characterized in that, The cooling module includes a cooling heat exchanger, a first valve, a first compressor, a second compressor, a first expansion valve, and a second expansion valve; The first interface is connected to the first end of the supplementary cooling heat exchanger, and the second interface is connected to the second end of the supplementary cooling heat exchanger through the first valve, so as to supply supplementary cooling capacity to the supplementary cooling heat exchanger. The outlets of the first compressor and the second compressor are both connected to the third end of the supplementary cooling heat exchanger. The inlet of the first compressor is connected to the sixth interface for independently adjusting the supplementary cooling capacity to the air-cooled terminal module. The inlet of the second compressor is connected to the fourth interface for independently adjusting the supplementary cooling capacity to the liquid-cooled terminal module. The inlets of both the first expansion valve and the second expansion valve are connected to the fourth end of the supplemental cooling heat exchanger. The outlet of the first expansion valve is connected to the third interface, and the outlet of the second expansion valve is connected to the fifth interface.

6. The refrigeration device with dynamically adjustable air-liquid ratio according to claim 2, characterized in that, The air-cooled terminal module includes a first air-cooled heat exchanger, a fan, and a second air-cooled heat exchanger. The first and second ends of the first air-cooled heat exchanger are connected to an external cold source. The second air-cooled heat exchanger is connected to the cooling module through the fifth and sixth interfaces. The fan is used to drive return air to flow sequentially through the first and second air-cooled heat exchangers for heat exchange and cooling before being sent to the environment where the high heat flux density equipment is located.

7. The refrigeration device with dynamically adjustable air-liquid ratio according to claim 2, characterized in that, The liquid-cooled terminal module includes a first liquid-cooled heat exchanger, a secondary side pump, a liquid-cooled server cold plate, and a second liquid-cooled heat exchanger. The first and second ends of the first liquid-cooled heat exchanger are connected to an external cold source. The first and second ends of the second liquid-cooled heat exchanger are connected to the cooling replenishment module through the third and fourth interfaces, respectively. The third end of the second liquid-cooled heat exchanger is connected to the third end of the first liquid-cooled heat exchanger. The fourth end of the second liquid-cooled heat exchanger is connected to one end of the liquid-cooled server cold plate. The other end of the liquid-cooled server cold plate is connected to the inlet of the secondary side pump. The outlet of the secondary side pump is connected to the fourth end of the first liquid-cooled heat exchanger.

8. The refrigeration device with dynamically adjustable air-liquid ratio according to claim 7, characterized in that, The second liquid-cooled heat exchanger is integrated into the cooling module.

9. The refrigeration device with dynamically adjustable air-liquid ratio according to any one of claims 1-8, characterized in that, The cooling module is an independent module and is located in the environment where the high heat flux density equipment is located, or, The cooling replenishment module is integrated into the air-cooled terminal module or the liquid-cooled terminal module.

10. A refrigeration system with dynamically adjustable air-liquid ratio, characterized in that, include: Cold source; A primary side water supply loop and a primary side water return loop are provided. The primary side water supply loop is connected to a cold source via a primary side pump, and the primary side water return loop is connected to a cold source. A refrigeration device, wherein the refrigeration device is a dynamically adjustable air-liquid ratio refrigeration device according to any one of claims 1-9, wherein the first end and the second end of the first air-cooled heat exchanger of the air-cooled terminal module are respectively connected to the primary side water supply loop and the primary side water return loop to obtain cooling capacity, the first end and the second end of the first liquid-cooled heat exchanger of the liquid-cooled terminal module are respectively connected to the primary side water supply loop and the primary side water return loop to obtain cooling capacity, and the first interface and the second interface of the make-up cooling module are respectively connected to the primary side water supply loop and the primary side water return loop to obtain make-up cooling capacity.

11. A refrigeration method with dynamically adjustable air-liquid ratio, characterized in that, The refrigeration method is applicable to the dynamically adjustable air-liquid ratio refrigeration system according to claim 10, and the refrigeration method includes: Real-time acquisition of air-cooled load parameters of the air-cooled terminal module and liquid-cooled load parameters of the liquid-cooled terminal module; Based on the air-cooled load and liquid-cooled load parameters, determine the total required supplemental cooling capacity and the target allocation ratio of air-cooled supplemental cooling capacity and liquid-cooled supplemental cooling capacity; The supplemental cooling module is controlled to dynamically allocate and deliver the supplemental cooling capacity obtained from the cold source to the air-cooled terminal module and the liquid-cooled terminal module according to the target allocation ratio, so as to adjust the ratio between air-cooled capacity and liquid-cooled capacity in real time.

12. The refrigeration method with dynamically adjustable air-liquid ratio according to claim 11, characterized in that, When the supplemental cooling module executes the single-stage compression dynamic distribution mode, the total refrigerant flow and evaporation pressure entering the air-cooled terminal module and the liquid-cooled terminal module are adjusted by controlling the frequency of the first compressor of the supplemental cooling module. The refrigerant flow and evaporation pressure entering the air-cooled terminal module and the liquid-cooled terminal module are also independently adjusted by controlling the opening of the first expansion valve and the second expansion valve of the supplemental cooling module.

13. The refrigeration method with dynamically adjustable air-liquid ratio according to claim 11, characterized in that, When the supplemental cooling module executes the quasi-two-stage compression dynamic distribution mode, the refrigerant flow rate and evaporation pressure entering the air-cooled terminal module are adjusted by controlling the frequency of the first compressor and the opening degree of the second expansion valve of the supplemental cooling module, and the refrigerant flow rate and evaporation pressure entering the liquid-cooled terminal module are adjusted by controlling the opening and closing of the second valve and the opening degree of the first expansion valve of the supplemental cooling module.

14. The refrigeration method with dynamically adjustable air-liquid ratio according to claim 11, characterized in that, When the supplemental cooling module executes the parallel compression dynamic distribution mode, the refrigerant flow rate and evaporation pressure entering the air-cooled terminal module are adjusted by controlling the frequency of the first compressor and the opening of the second expansion valve of the supplemental cooling module, and the refrigerant flow rate and evaporation pressure entering the liquid-cooled terminal module are adjusted by controlling the frequency of the second compressor and the opening of the first expansion valve of the supplemental cooling module.

15. A storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements a refrigeration method with dynamically adjustable air-liquid ratio as described in any one of claims 11-14.

16. An electronic device, characterized in that, It includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, it implements a refrigeration method with dynamically adjustable air-liquid ratio as described in any one of claims 11-14.

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