Sensor module

Abstract

The invention relates to a sensor module for a contactless smart card with biometric functionality. The sensor module includes: a biometric sensor, such as a fingerprint sensor; a microcontroller configured to process a signal detected by the biometric sensor; a security chip configured to store data processed by the microcontroller; the multi-layer PCB substrate is provided with a PCB area; wherein the microcontroller and the security chip are directly mounted on the biometric sensor, and the biometric sensor is mounted on the multilayer PCB substrate to form a stacked structure having a maximum area corresponding to a PCB area. The invention also relates to a contactless biometric smart card comprising said sensor module, and to a method for forming a sensor module and a smart card.

Description

Technical Field

[0001] This invention relates to a sensor module, a method for forming a sensor module, a smart card including a sensor module, and a method for forming a smart card. Background Technology

[0002] Smart cards equipped with biometric sensors (such as fingerprint sensors) are commonly used in this field. Biometric sensors represent an additional security feature of smart cards.

[0003] Given the widespread use of smart cards with biometric sensors for banking applications or access permissions, there has been a persistent need for optimization, such as reducing production and manufacturing costs and improving reliability and security features.

[0004] Document US 2021 / 0117743 A1 discloses, for example, a sensor device and a corresponding dual-interface smart card. The sensor device includes a fingerprint sensor and an antenna coupled to the fingerprint sensor, which is used for inductive coupling between the fingerprint sensor and an enhancement antenna of the smart card.

[0005] However, the sensor device of US 2021 / 0117743 A1 has a complex and large structure, which requires specific tools for implantation into the final card body, making the manufacturing process and the resulting sensor device and smart card expensive.

[0006] Therefore, the object of the present invention is to provide a sensor module and a corresponding smart card that overcome one or more of these disadvantages. Summary of the Invention

[0007] This invention relates to an integrated sensor module having a reduced and compact size, such as the size of an ISO 8-pin sensor as defined in ISO 7816.

[0008] According to a first aspect of the present invention, a sensor module for a contactless smart card with biometric functionality is provided. The sensor module includes:

[0009] - Biometric sensors, such as fingerprint sensors;

[0010] - A microcontroller configured to process signals detected by biometric sensors;

[0011] - A security chip configured to store data processed by a microcontroller;

[0012] - A multilayer printed circuit board (PCB) substrate having a PCB area;

[0013] The microcontroller and security chip are directly mounted on the biometric sensor, which is then mounted on a multilayer PCB substrate to form a stacked structure with a maximum area corresponding to the PCB area.

[0014] The advantage of this configuration is that the sensor module includes all the electronic components and biometric features required to perform contactless payments, transactions, or access operations in a single unit. In this way, during the manufacture of the final biometric, contactless smart card, only the sensor module needs to be inserted into the card body, without the need to add other electronic components.

[0015] According to the present invention, a multilayer PCB substrate is used as the base of the entire sensor module. The biometric sensor is directly formed on the multilayer PCB substrate using surface mount technology. The microcontroller and security chip are formed on the biometric sensor using surface mount technology. In this way, a stacked structure with a compact and reduced size is produced.

[0016] In this disclosure, it should be understood that the term "multilayer PCB substrate" is used to refer to a PCB substrate comprising two or more different PCBs.

[0017] It should be understood that a sensor module with a stacked structure comprises several components, each having an area (defined by width and length) and a thickness. The area of ​​the biometric sensor is preferably smaller than the area of ​​the PCB substrate. The area of ​​each microcontroller or security chip is preferably smaller than the area of ​​the biometric sensor. Therefore, the maximum area of ​​the sensor module corresponds to the area of ​​the multilayer PCB substrate. In this way, by forming a multilayer PCB substrate with a reduced size, a compact sensor module with a reduced size can be formed.

[0018] Preferably, the biometric sensor has a square or rectangular shape. Preferably, the biometric sensor has a width greater than or equal to 5 mm and / or a length greater than or equal to 5 mm.

[0019] Preferably, the sensor module is inserted into a smart card with biometric functionality that operates in contactless mode. Therefore, it is unnecessary to insert ISO contacts into the sensor module, nor into the final smart card with biometric functionality, and the size of the sensor module can be further reduced.

[0020] Preferably, the security chip is configured to store fingerprint data and process secure payment transactions and fingerprint verification by comparing a fingerprint template with the actual fingerprint presented to the fingerprint sensor.

[0021] According to a preferred embodiment of the invention, a sensor module is provided, wherein the PCB area of ​​the sensor module corresponding to the maximum area of ​​the stacked structure has a width included in the range of 6 mm to 13.1 mm, preferably equal to 12.6 mm, and a length included in the range of 6 mm to 11.9 mm, preferably equal to 11.4 mm. Preferably, the multilayer PCB substrate and the corresponding sensor module have dimensions conforming to the ISO 8 PIN standard as defined in ISO 7816.

[0022] The advantage of this configuration is that it allows for the production of sensor modules with standard dimensions. Therefore, when embedding the sensor module into the final contactless biometric smart card, there is no need to build new equipment for manufacturing the smart card, nor to adapt existing equipment to a new standard. Instead, existing tools can be used to produce ISO 8-pin modules as defined in ISO 7816. This reduces production and manufacturing costs.

[0023] According to an embodiment of the present invention, a sensor module is provided, wherein the multilayer PCB substrate includes a first PCB and a second PCB.

[0024] According to the illustrative embodiment, the first PCB and the second PCB can be made of two different base materials to better adapt each PCB to its intended function. For example, the first PCB can be made of black PET, and the second PCB can be made of epoxy glass.

[0025] According to another embodiment of the present invention, a sensor module is provided, wherein the second PCB includes a cutout portion for receiving a biometric sensor mounted on the first PCB.

[0026] The advantage of this configuration is that the first PCB serves as a common substrate for electronic components and biometric sensors, while the second PCB acts as a frame for housing the biometric sensors.

[0027] According to another embodiment of the present invention, a sensor module is provided, wherein a first PCB includes a first metal layer, and a second PCB includes a second metal layer and a third metal layer formed on opposite sides of a central layer, and the first metal layer of the first PCB is mechanically and / or electrically connected to the second metal layer of the second PCB.

[0028] This solution enables the formation of mechanical and electrical connections between two PCBs in a simple and efficient manner.

[0029] According to another embodiment of the present invention, a sensor module is provided, wherein a first metal layer is mechanically and / or electrically connected to a second metal layer via an adhesive layer, an anisotropic conductive film (ACF), short post bump connections and / or solder bump connections.

[0030] These solutions enable the formation of stable and efficient mechanical and / or electrical connections between two PCBs, particularly between the first metal layer of the first PCB and the second metal layer of the second PCB facing the corresponding metal layer of the first PCB.

[0031] According to another embodiment of the present invention, a sensor module is provided, which further includes two antenna disks for realizing a current connection with the card antenna of a smart card.

[0032] The advantage of this configuration is that it enables a stable current connection between the sensor module and the card antenna of the contactless biometric smart card.

[0033] According to another embodiment of the present invention, a sensor module is provided, which further includes a coupling antenna formed on a multilayer PCB and configured to be inductively coupled to the card antenna of a smart card.

[0034] The advantage of this configuration is that the connection between the sensor module and the card antenna of the contactless smart card is made through inductive coupling, without the need to add any electrical connection or any wires.

[0035] According to another embodiment of the invention, a sensor module is provided, wherein the first PCB is made of black PET.

[0036] Preferably, at least a portion of the first PCB is visible through the card body of the contactless smart card. Preferably, for aesthetic reasons, the smart card may be black, and the first PCB may be made of black PET, making the sensor module invisible within the card body.

[0037] According to another embodiment of the invention, a sensor module is provided, which further includes a passive component, such as a capacitor, mounted on the biometric sensor for antenna matching.

[0038] The advantage of this configuration is that any additional passive components used for antenna matching (e.g., additional capacitors) can be formed on the biometric sensor using surface mounting technology to create a stacked structure with reduced dimensions.

[0039] According to another embodiment of the invention, a sensor module is provided in which a microcontroller and a security chip are integrated into a single chip.

[0040] This configuration is advantageous because it reduces the number of parts.

[0041] According to a second aspect of the invention, a contactless smart card with biometric functionality is provided, the smart card including a sensor module as described above, and a card antenna configured to be inductively coupled or electrically connected to the sensor module.

[0042] The advantage of this configuration lies in simplifying and improving the manufacturing of contactless smart cards with biometric functionality. In fact, the sensor module includes all the electronic and biometric components for transaction or access operations in a single unit. The sensor module according to the invention is compact and small, thus it can be easily embedded into the card body of a contactless biometric smart card and can be easily and efficiently connected to the card antenna of the contactless smart card to enable communication with an external reader. The sensor module can be inductively coupled to the card antenna, or alternatively, it can be electrically connected to the sensor module.

[0043] Preferably, the card antenna is adapted to enable contactless communication in high-frequency fields (e.g., in the 13.56 MHz band).

[0044] According to a third aspect of the present invention, a method for forming a sensor module is provided, the method comprising the following steps:

[0045] a) Provide multilayer PCB substrates;

[0046] b) Install a biometric sensor, such as a fingerprint sensor, on one side of a multilayer PCB substrate;

[0047] c) A microcontroller is mounted on the side of the biometric sensor opposite to the multilayer PCB substrate, and the microcontroller is configured to process the signal detected by the biometric sensor.

[0048] d) A security chip configured to store data processed by a microcontroller is mounted on the side of the biometric sensor opposite to the multilayer PCB substrate, thereby forming a stacked structure with a maximum area corresponding to the area of ​​the multilayer PCB substrate.

[0049] The method of the present invention is advantageous because it enables the formation of a sensor module comprising all electronic and biometric components for contactless biometric smart cards, wherein the sensor module has a reduced size and dimensions. Preferably, the sensor module can have a maximum area conforming to the ISO 8 PIN standard as defined in ISO 7816. In this way, it is not necessary to create new tools or adapt existing tools to stamping and implanting the sensor module; instead, the sensor module can be easily and efficiently manufactured using standard tools conforming to the ISO 8 PIN standard as defined in ISO 7816. Therefore, manufacturing costs are reduced.

[0050] Preferably, the method of the present invention can be used to produce the sensor module of the present invention (the sensor module as described above).

[0051] According to an embodiment of the present invention, a method is provided, wherein a multilayer PCB substrate includes a first PCB and a second PCB, and step b) of the prior method includes the following sub-steps:

[0052] b1) Install a biometric sensor on the first PCB;

[0053] b2) Form a cutout portion within the second PCB;

[0054] b3) For example, the second PCB is attached to the first PCB via an adhesive layer, ACF, short post bump connection and / or solder bump connection, such that the biometric sensor is placed in the cutout portion.

[0055] The advantage of this method is that it enables the mechanical and / or electrical connection of the biometric sensor to a first PCB, which serves as the common foundation for other electronic components and the biometric component. On the other hand, a second PCB, including the cutout portion, acts as a frame for the biometric sensor, making the overall structure more stable and robust.

[0056] Preferably, the biometric sensor is mounted on the first PCB using surface mount technology.

[0057] Preferably, when the second PCB already includes the cutout portion, the adhesive layer is laminated onto the second PCB. Then, the second PCB, including the cutout portion and adhesive material, is mounted onto the first PCB using a thermal tool.

[0058] According to another embodiment of the present invention, a method is provided, which further includes the following steps:

[0059] e) Fill the cutout portion of the second PCB with underfill material or use transfer molding to cover the microcontroller and security chip.

[0060] The advantage of this configuration is that electronic components, such as microcontrollers and security chips, are protected by an underfill material. Preferably, the wires connecting the electronic components, such as microcontrollers and security chips, to the biometric sensor are also covered with a protective material. Preferably, the wire bonding connections used to electrically connect the electronic components to each other or to one of the metal layers of the PCB are also covered with a protective material.

[0061] For example, the cutout portion of the second PCB can be filled by using a side gate transfer molded part or a top gate transfer molded part.

[0062] According to a third aspect of the present invention, a method for forming a contactless smart card with biometric functionality is provided, the method comprising the following steps:

[0063] f) Provide a card body for a smart card, the card body including a card antenna for contactless communication;

[0064] g) Forming a cavity in the card body;

[0065] h) Form a sensor module according to one of the above methods;

[0066] i) Insert the sensor module into the cavity;

[0067] j) Connect the card antenna to the sensor module via inductive coupling or current connection.

[0068] The method for producing contactless smart cards with biometric functionality according to the present invention is highly efficient, simple, and reduces production costs.

[0069] The card body of the smart card can be formed using any known technology. Preferably, a cavity is milled in the card body, and the sensor module according to the invention is implanted into the cavity using ACF technology, edge link technology, TE connection technology, or a similar method for attaching modules to the card cavity. Attached Figure Description

[0070] The invention will be described in more detail with reference to the accompanying drawings, in which:

[0071] Figure 1A A schematic top view of the front side of a sensor module according to an embodiment of the present invention is shown.

[0072] Figure 1B A schematic top view of the rear side of a sensor module according to an embodiment of the present invention is shown.

[0073] Figure 2 A schematic cross-sectional view of a sensor module according to an embodiment of the present invention is shown.

[0074] Figure 3 The details of the base layer of the sensor module according to an embodiment of the present invention are schematically shown.

[0075] Figure 4 A schematic top view of a smart card including a sensor module according to an embodiment of the present invention is shown. Detailed Implementation

[0076] The invention is described below with reference to specific embodiments as illustrated in the accompanying drawings. However, the invention is not limited to the specific embodiments described in the following detailed description and shown in the drawings. Rather, the described embodiments are merely illustrative of different features of the invention, the scope of which is defined in the claims. Further modifications and variations of the invention will be apparent to those skilled in the art.

[0077] According to the present invention, the sensor module 100 is an integrated sensor module for a contactless smart card with biometric identification functionality.

[0078] Figure 1A A schematic top view of the front side of the sensor module 100 according to an embodiment of the present invention is shown.

[0079] Figure 1B A schematic top view of the rear side of the sensor module 100 according to an embodiment of the present invention is shown.

[0080] The sensor module 100 includes a biometric sensor 110 such as a fingerprint sensor, a microcontroller 120 configured to process signals detected by the biometric sensor 110, and a security chip 130 configured to store data processed by the microcontroller 120.

[0081] like Figure 1B As shown, the biometric sensor 110, microcontroller 120, and security chip 130 are formed directly or indirectly on the multilayer PCB substrate 150. Specifically, the biometric sensor 110 is formed on the multilayer PCB substrate 150, and chips 120 and 130 are formed on the biometric sensor 110. Preferably, the biometric sensor 110 is mounted on the multilayer PCB substrate 150 using surface mount technology. Preferably, the microcontroller 120 and security chip 130 are formed on the biometric sensor 110 using surface mount technology. In this way, the multilayer PCB 150, biometric sensor 110, microcontroller 120, and security chip 130 form a stacked structure.

[0082] As in Figure 1B As can be seen, each component of the sensor module 100 has a predefined area. The multilayer PCB substrate 150 has a PCB area with a width of W and a length of L (e.g., ...). Figure 1A As shown in the figure, the maximum area of ​​the stacked structure of sensor module 100 corresponds to the PCB area.

[0083] Because the biometric components and electronic components are stacked on a multilayer PCB substrate 150 and the PCB area is small, the entire sensor module 100 can have a compact and small size.

[0084] The PCB area is preferably designed to conform to the ISO 8-pin standard as defined in ISO 7816. In this way, the entire sensor module 100 has an area conforming to the ISO 8-pin standard as defined in ISO 7816. For example, as... Figure 1A and Figure 4As schematically shown, the width of the multilayer PCB substrate 150 can be included in the range of 6 mm to 13.1 mm, preferably equal to 12.6 mm, and the length of the multilayer PCB substrate 150 can be included in the range of 6 mm to 11.9 mm, preferably equal to 11.4 mm. Therefore, the width of the sensor module 100 can be included in the range of 6 mm to 13.1 mm, preferably equal to 12.6 mm, and the length of the sensor module 100 can be included in the range of 6 mm to 11.9 mm, preferably equal to 11.4 mm.

[0085] according to Figure 1A In an illustrative configuration, the sensor module 100 may have a substantially rectangular shape, wherein the corners of the rectangle are designed to be slightly rounded. Preferably, the radius of each corner may be included in the range of 1.7 mm to 2.3 mm, preferably equal to 2 mm.

[0086] about Figure 1A In this reference frame, the width is defined as the dimension along the X-axis, and the length is defined as the dimension along the Y-axis. However, it should be understood that... Figure 1A The preferred orientation of the sensor module 100 should not limit the scope of protection of this invention.

[0087] The fact that sensor module 100 conforms to the ISO 8-pin standard as defined in ISO 7816 allows it to be manufactured using pre-existing standard tools. In contrast, if sensor module 100 has larger or non-standardized dimensions, specific tools for manufacturing sensor module 100 will need to be constructed.

[0088] exist Figure 1B In the schematic representation, an additional capacitor 160 for matching the antenna frequency of the smart card's card antenna is also mounted on the biometric sensor 110.

[0089] It should be understood that the additional capacitor 160 is an optional electronic component of the sensor module 100. Other electronic components, such as passive components for antenna matching, may be formed on the sensor module 100 as an alternative to or in addition to the capacitor 160.

[0090] In addition, Figure 1B The configuration of the sensor module 100 shows two antenna disks 140A and 140B. The two antenna disks 140A and 140B can be advantageously used to connect the sensor module 100 to the card antenna of a contactless biometric smart card.

[0091] According to an alternative configuration (not shown), antenna disks 140A and 140B may not be formed on the multilayer PCB substrate 150, and the connection between the sensor module 100 and the card antenna of the contactless biometric smart card can be achieved through inductive coupling. According to this configuration, an inductively coupled antenna (not shown) can be formed around the biometric sensor 110 on the upper surface of the multilayer PCB substrate 150. Preferably, the inductively coupled antenna can be formed on a second PCB 154, which will be referenced below. Figure 2 Describe it.

[0092] The biometric sensor 110 may be a fingerprint sensor. The biometric sensor 110 may include an array of touch-sensitive sensor pads, which are exposed or at least partially covered with, for example, a thin protective layer without affecting their sensitivity to fingerprint measurements. Signals detected by the touch-sensitive sensor pads of the biometric sensor 110 may be processed by a microcontroller 120, which may be a microprocessor for converting the signals detected by the biometric sensor 110 (e.g., a capacitive sensor) into electronic signals. The electronic signals from the microcontroller 120 may then be further processed and stored in a security chip 130, which acts as the memory of the sensor module 100. In this way, during a transaction or access operation, the user does not need to provide any PIN or security code to complete the transaction or access operation, as these processes can be confirmed simply by pressing the user's finger onto the sensor module 100. In this way, the capacitive sensor of the biometric sensor 110 can generate an image by measuring the capacitance changes between the ridges and valleys that constitute a fingerprint. The data measured by the biometric sensor 110 and processed by the microcontroller 120 can ultimately be compared with the memory data of the security chip 130.

[0093] Figure 2 Schematic representation of sensor module 100 according to an embodiment of the present invention along Figure 1B The cross section of axis II-II is shown.

[0094] exist Figure 2 The stacked structure of the integrated sensor module 100 is clearly visible in the image. (Reference) Figure 2 The orientation of the components, from bottom to top, shows the multilayer PCB substrate 150, the biometric sensor 110, and the microcontroller 120 (the security chip 130 is not visible in cross-section). The electronic components and biometric components are formed on top of each other to form a stacked structure with a compact and small size, wherein the maximum area of ​​the sensor module 100 corresponds to the area of ​​the multilayer PCB substrate 150.

[0095] like Figure 2As shown, the multilayer PCB substrate 150 includes two PCBs (a first PCB 152 and a second PCB 154). The first PCB 152 forms a common substrate for all electronic components and biometric components. The biometric sensor 110 is directly mounted on the first PCB 152. The second PCB 154 forms a frame surrounding the biometric sensor 110 and chips 120 and 130. In this way, the sensor module 100 is more stable and robust.

[0096] Antenna disks 140A and 140B are formed on the upper part of the second PCB 154, on the opposite side of the biometric sensor 110. Antenna disks 140A and 140B are metal disks used to achieve current connection with the card antenna of the contactless smart card. Antenna disks 140A and 140B are preferably formed on the second PCB 154 to have a height suitable for achieving connection with the card antenna of the smart card when the sensor module 100 is implanted into the corresponding cavity of the smart card (as shown below). Figure 4 (As shown).

[0097] Figure 3 Details of the PCB substrate 150 according to the present invention are schematically shown. (See reference...) Figure 2 The multilayer PCB substrate 150 preferably includes a first PCB 152 and a second PCB 154. The first PCB 152 includes a base layer 151 and a metal layer 152A. The second PCB 154 includes a central layer 155 and two metal layers 154A and 154B attached to the opposite side of the central layer 155. The first metal layer 152A is preferably attached to the second metal layer 154A via an adhesive layer 158. The adhesive layer 158 can be made of any adhesive material suitable for making electronic or mechanical connections between the two metal layers; for example, it can be an anisotropic conductive film (ACF), a plurality of short pillar bumps, and / or a plurality of solder bumps. In this way, the electronic and mechanical connections between the two PCBs of the multilayer PCB substrate 150 are stable and reliable.

[0098] exist Figure 2 In the configuration shown, two antenna disks 140A and 140B are formed on the second PCB 154, which are obtained directly from the metal layer 154B of the second PCB 154.

[0099] According to the alternative configuration (where the inductive antenna is formed on the second PCB 154), the inductively coupled antenna can be formed directly from the metal layer 154B.

[0100] Figure 4 A top view of a contactless smart card including a sensor module according to an embodiment of the present invention is shown schematically.

[0101] Despite Figure 4In the smart card 100, the sensor module 100 is shown positioned at the lower right corner of the card; however, it should be understood that this configuration is not limiting for the invention. In fact, the sensor module 100 can be positioned at any corner of the smart card 100, even in locations not defined in ISO 7816.

[0102] exist Figure 4 In this configuration, the sensor module 100 is positioned at a distance y from the horizontal line of the defining smart card 1000 and at a distance x from the vertical line of the defining smart card 1000.

[0103] The smart card 1000 is a contactless smart card with biometric functionality. Preferably, the smart card 1000 does not include any contact pad for operating the card in contact mode. In this way, the number of electronic components included in the smart card is reduced.

[0104] Preferably, the smart card 1000 has a width and length Furthermore, the angle forms a circle with a radius of curvature z.

[0105] The card body 500 of the smart card 1000 can be formed according to any known technology. A cavity 510 is then milled in the card body 500. The sensor module 100 is subsequently implanted into the milled cavity 510 in the card body 500. Because the sensor module 100 has a reduced size and is compact and easy to handle, it can be efficiently implanted into the cavity 510 of the card body 500 of the smart card 1000.

[0106] Since the size of the sensor module 100 is determined by the size of the PCB substrate 150, and the size of the PCB substrate 150 is preferably compatible with the ISO 8-PIN standard as defined in ISO 7816, manufacturing tools commonly used in the field of smart cards conforming to the ISO 8-PIN standard as defined in ISO 7816 can be reused to embed the integrated sensor module 100 into the card body 500. Therefore, no modification or adjustment to existing manufacturing tools is required to produce or embed the sensor module 100. Thus, the process for manufacturing the smart card 1000 can be cost-effective and efficient.

[0107] Preferably, the card body 500 of the smart card 1000 is made of black. Preferably, the front side of the multilayer PCB substrate 150, where the sensor module 100 is formed (visible through the card body 500), is also made of black. In this way, the color of the visible side of the sensor module 100 does not contrast with the color of the card body 500, and the sensor module 100 is not immediately visible from the outside of the smart card. Preferably, the first PCB of the multilayer PCB substrate 150 is visible through the card body 500, and therefore it is made of black PET material.

[0108] According to the alternative configuration, one side of the front of the forming sensor module 100 on the multilayer PCB substrate 150 (which is visible through the card body 500) can be made of any other color such as red, gold, etc., and can be clearly seen through the card body 500.

[0109] Even though the present invention has been described with reference to the above embodiments, it will be apparent to those skilled in the art that various modifications, variations, and improvements of the invention can be applied in accordance with the above teachings and scope and within the scope of the appended claims without departing from the scope and purpose of the invention.

[0110] Finally, areas that are considered to be known to those skilled in the art are not described in order to avoid covering the described invention in a useless way.

[0111] Figure Labels

[0112] 100: Sensor Module

[0113] 110: Biometric Sensors

[0114] 120: Microcontroller

[0115] 130: Security Chip

[0116] 140A, 140B: Antenna disk

[0117] 142: Coupled Antenna

[0118] 150: PCB substrate

[0119] 152: First PCB

[0120] 152A: First metal layer of the first PCB

[0121] 154: Second PCB

[0122] 154A, 154B: The second and third metal layers of the second PCB

[0123] 155: Center layer of the second PCB

[0124] 156: Incision area

[0125] 158: Adhesive layer

[0126] 160: Passive components used for antenna matching

[0127] 200: Card Antenna

[0128] 500: Card body

[0129] 510: cavity

[0130] 1000: Smart Card

Claims

1. A sensor module (100) for use in a contactless smart card with biometric functionality, the sensor module (100) comprising: - A biometric sensor (110), such as a fingerprint sensor; - A microcontroller (120) configured to process the signals detected by the biometric sensor (110); - A security chip (130) is configured to store data processed by the microcontroller (120); - Multilayer printed circuit board substrate, also known as multilayer PCB substrate (150), has PCB area; The microcontroller (120) and the security chip (130) are directly mounted on the biometric sensor (110), and the biometric sensor (110) is mounted on the multilayer PCB substrate (150) to form a stacked structure with a maximum area corresponding to the PCB area.

2. The sensor module (100) according to claim 1, wherein, The multilayer PCB substrate (150) includes a first PCB (152) and a second PCB (154).

3. The sensor module according to claim 2, wherein, The second PCB (154) includes a cutout portion (156) for accommodating the biometric sensor (110) mounted on the first PCB (152).

4. The sensor module (100) according to claim 2 or 3, wherein, The first PCB (152) includes a first metal layer (152A), and the second PCB (154) includes a second metal layer (154A) and a third metal layer (154B) formed on the opposite side of the central layer (155), and the first metal layer (152A) is mechanically and / or electrically connected to the second metal layer (154A) of the second PCB (154).

5. The sensor module (100) according to claim 4, wherein, The first metal layer (152A) is mechanically and / or electrically connected to the second metal layer (154A) through an adhesive layer (158), an anisotropic conductive film (ACF), short post bump connections and / or solder bump connections.

6. The sensor module (100) according to any one of the preceding claims further includes two antenna disks (140A, 140B), the two antenna disks (140A, 140B) being used to achieve a current connection with the card antenna of the contactless smart card.

7. The sensor module (100) according to any one of claims 1 to 5 further includes a coupling antenna (142) formed on the multilayer PCB (150) and configured to cause inductive coupling between the biometric sensor (110) and the card antenna of the contactless smart card.

8. The sensor module (100) according to any one of claims 2 to 7, wherein, The first PCB (152) is made of colored PET, such as PET made of any color such as black, red or gold.

9. The sensor module (100) according to any one of the preceding claims further includes a passive component (160), such as a capacitor, said passive component (160) being mounted on said biometric sensor (110) for antenna matching.

10. The sensor module (100) according to any one of the preceding claims, wherein, The multilayer PCB substrate (150) has a width (W) that is included in the range of 6 mm to 13.1 mm, preferably equal to 12.6 mm, and / or a length (L) that is included in the range of 6 mm to 11.9 mm, preferably equal to 11.4 mm, for example having a width (W) and length (L) that conform to the ISO 8 PIN standard as defined in ISO 7816.

11. The sensor module (100) according to any one of the preceding claims, wherein, The microcontroller (120) and the security chip (130) are integrated into a single chip.

12. A contactless smart card (1000) with biometric identification functionality, comprising: - Sensor module (100) according to any one of claims 1 to 11; - A card antenna (200) is configured to be inductively coupled to or electrically connected to the sensor module (100).

13. A method for forming a sensor module (100) for use in a contactless smart card (1000) having biometric functionality, the method comprising the steps of: a) Provide a multilayer printed circuit board substrate, namely a multilayer PCB substrate (150), the multilayer PCB substrate having a PCB area; b) Install a biometric sensor (110), such as a fingerprint sensor, on one side of the multilayer PCB substrate (150); c) A microcontroller (120) is mounted on the side of the biometric sensor (110) opposite to the multilayer PCB substrate (150), the microcontroller (120) being configured to process the signal detected by the biometric sensor (110); d) A security chip (130) is mounted on the side of the biometric sensor (110) opposite to the multilayer PCB substrate (150), the security chip (130) being configured to store data processed by the microcontroller (120). This results in a stacked structure with a maximum area corresponding to the PCB area.

14. The method according to claim 13, wherein, The multilayer PCB substrate (150) includes a first PCB (152) and a second PCB (154), and step b) includes the following sub-steps: b1) Install the biometric sensor (110) on the first PCB (152); b2) A cutout portion (156) is formed within the second PCB (154); b3) For example, the second PCB (154) is attached to the first PCB (152) by means of an adhesive layer (158), an anisotropic conductive film (ACF), short post bump connections and / or solder bump connections, such that the biometric sensor (110) is placed in the cut-out portion (156).

15. The method according to claim 13 or 14, further comprising the step of: e) Fill the cutout portion (156) of the second PCB (154) with underfill material or by using a gate transfer molding to cover the microcontroller (120) and the security chip (130).

16. A method for forming a contactless smart card (1000) with biometric functionality, the method comprising the following steps: f) Provides a card body (500) for a smart card (1000), the card body (500) including a card antenna for contactless communication; g) A cavity (510) is formed in the card body (500); h) The sensor module (100) is formed by the method according to any one of claims 13 to 15; i) Insert the sensor module (100) into the cavity (510); j) Connect the card antenna to the sensor module (100) via inductive coupling or current connection.

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