Modular system for manufacturing electronic devices and method for manufacturing electronic devices

Abstract

The invention relates to a modular system for producing an electronic device (10), comprising: a housing part (12) comprising a first side wall (26) and a second side wall (28) and an upper side (30) connecting the side walls (26, 28); a set of circuit boards (14) provided with different electrical connection means (16); and a set of discrete side parts (18, 20), each of which has a different recess (38) corresponding to the different electrical connection means (16). An accommodating space (32) for accommodating at least one circuit board (14) of the group of circuit boards (14) is arranged between the first side wall (26) and the second side wall (28). Optionally, at least one circuit board (14) of the set of circuit boards (14) can be inserted into the accommodating space (32), and a respective side part (18, 20) of the set of discrete side parts (18, 20) can be connected to the housing part (12) such that the first side wall (26) and the second side wall (28) together with the side parts (18, 20) form a continuous housing wall, a connection mechanism (16) arranged on the circuit board (14) is accessible through a recess (38) in the side part (18, 20). The invention also relates to a method for producing an electronic device (10).

Description

Technical Field

[0001] This invention relates to a modular system for manufacturing electronic devices and a method for manufacturing electronic devices. The electronic device is, for example, a smart device. Background Technology

[0002] Such electronic devices typically include a housing, components (e.g., electronic components and connector mechanisms) housed within the housing, and at least one circuit board as a wiring carrier for the components (i.e., electronic components and connector mechanisms).

[0003] Electronic devices are available in various structural forms. Therefore, different components, especially housings or circuit boards of different sizes, are required for manufacturing. This is disadvantageous in terms of manufacturing costs, as each component must have its own mold. The large variety of components is also disadvantageous logistically, as the different parts used for manufacturing must be registered and stored separately, which ultimately reflects in manufacturing costs. Summary of the Invention

[0004] Therefore, the object of the present invention is to provide an electronic device that can be manufactured cost-effectively.

[0005] According to the present invention, this task is solved by a modular system for manufacturing electronic devices, the modular system comprising: a housing component including a first sidewall and a second sidewall and an upper sidewall connecting the sidewalls; a set of circuit boards having different electrical connector mechanisms; and a set of discrete side components, each side component having different openings corresponding to different electrical connector mechanisms. A receiving space exists between the first and second sidewalls for accommodating at least one circuit board from the set of circuit boards. Selectively, at least one circuit board from the set of circuit boards can be inserted into the receiving space, and each corresponding side component from the set of discrete side components can be connected to the housing component such that the first and second sidewalls together with the side component form a continuous housing wall, and the connector mechanisms arranged on the circuit boards are accessible through the openings in the side components.

[0006] In particular, the connector mechanism arranged on the circuit board is accessible from the outside, so that, for example, a plug connector can be externally connected to the connector mechanism.

[0007] The modular system according to the invention reduces the diversity of individual components. In particular, the same housing component can be used to manufacture different variations of the electronic device. The housing is customized as needed by connecting the separate side components to the housing component. In this way, the electronic device can be manufactured particularly cost-effectively.

[0008] The molds used to manufacture variable components (especially side parts) are smaller and less complex, and are therefore more cost-effective than those used to manufacture complete shells.

[0009] The larger and more geometrically complex molds used to manufacture the shell components only need to be manufactured once for this modular system. Because more shell components are manufactured compared to individual side components, the relative mold cost per component is also reduced.

[0010] Circuit boards and side components are present in pairs, that is, for each circuit board in the set of circuit boards, there is a corresponding side component in the set of side components.

[0011] For example, separate side components can be connected to the first sidewall, the second sidewall, and / or the upper side.

[0012] Therefore, in the assembled state, the housing has multiple sidewalls, which are composed of the sidewalls of the housing components, namely the first sidewall and the second sidewall, and at least one separate side component.

[0013] Optionally, a set of separate second side components also exists, which are also capable of being connected to the housing component. The set of separate second side components particularly includes the same side components as the set of separate first side components.

[0014] For example, two identical or two different side parts can be connected to the housing part.

[0015] In another alternative embodiment, the housing component may have a third sidewall, such that only one separate side component can be connected to the housing component. This single separate side component, together with the sidewall, forms the four sidewalls of the housing in the assembled state.

[0016] The housing component is, for example, hood-shaped. The sidewalls may be parallel to each other.

[0017] Side components are, for example, plate-shaped.

[0018] The circuit boards in the above groups may also differ in size, in addition to the different connector mechanisms.

[0019] The housing components are constructed in a modular manner because they can be coupled with multiple different side components.

[0020] In principle, this modular system also ensures cost-effective retrofitting, such as functional expansion, by replacing side components and circuit boards, but not the entire housing. Therefore, at least the housing components are reusable.

[0021] This modular system can include a set of different cover components with a recess in the upper side of the housing component, into which one of the different cover components can be selectively inserted. This further improves the feasibility of customizing the housing.

[0022] Different cover components may differ, for example, in their height. Therefore, different housing volumes can be achieved using different cover components, allowing different components to be installed within the housing.

[0023] As already described in conjunction with the side components, manufacturing the cover component separately can save costs because the molds used to manufacture the cover component are less complex and therefore more cost-effective than the molds used to manufacture the complete shell.

[0024] At least one laterally protruding protrusion may be present on at least two opposite side edges of the cover member, the protrusion abutting against the inner side of the housing member in the inserted position where the cover member is inserted into the housing member. Therefore, the protrusion acts as a stop, determining how far the cover member can be inserted or pushed into the housing. Thus, the protrusion ensures a defined position of the cover member relative to the housing member in the inserted state.

[0025] The cover component is, for example, cuboid in shape and has four sidewalls and a top side, wherein at least two opposing sidewalls are configured to be elastically deformable and, in the inserted state, rest with their edges against the edge of the recess on the outside of the housing component. This means that when one of the cover components is inserted into the recess, particularly from the inside of the housing outward, the elastically deformable sidewalls are pressed inward. For this purpose, the cover component is made with a certain interference fit relative to the recess, such that the elastically deformable sidewalls are forced to deform when pushed into the recess. When the cover component reaches its final position, the elastically deformable area of ​​the sidewalls is outside the recess and can therefore spring back to its original position. Thus, the cover component is reliably held in its final position without the need for a separate fixing mechanism. The elastically deformable sidewalls, in particular, form a locking mechanism. For this purpose, a side recess may also be provided on at least one sidewall, i.e., on the outer surface of the corresponding sidewall. The side recess thus locks into the edge of the recess.

[0026] The elastic deformability of the sidewalls is achieved, in particular, through the openings along the edges of the cover components.

[0027] Alternatively, it is conceivable that the cover component is fixed to the housing component by means of plastic welding.

[0028] According to one embodiment, a guide portion extending from the lower to the upper side is provided on the inner side of the housing component, along which the discrete side components can be guided and pushed into the housing component. Specifically, the guide portion is provided on the first sidewall and / or the second sidewall. This also facilitates simple assembly. The guide portion may consist of two parallel extending protrusions, between which the corresponding discrete side components can be pushed and guided accordingly. The corresponding protrusions preferably extend over the entire height of the housing component, i.e., from the upper side to the edge of the first sidewall and / or the second sidewall facing away from the upper side. These edges may also be referred to as the lower edges of the sidewalls.

[0029] The modular system may have a bottom component that can be fixed to the housing component, wherein the bottom component, in its fixed state, rests against the lower edge of the side wall and the at least one side component. Thus, the side components are prevented from sliding downwards by the bottom component. This eliminates the need for additional fixing mechanisms, which contributes to cost-effective manufacturing of electronic devices.

[0030] For example, each side member includes at least one protrusion extending in the insertion direction, which overlaps with the housing member in the insertion direction in the final position of the side member. Through these protrusions, the side member is locked within the housing member and prevents lateral dislodgement. Thus, even without the bottom member, the side wall is reliably held in its respective position. If the bottom member is subsequently inserted, the installed side member is additionally secured.

[0031] Furthermore, according to the invention, this task is solved by a method for manufacturing an electronic device, wherein the electronic device is manufactured, in particular, by means of a modular system according to the invention. The method includes the following steps:

[0032] A housing component is provided, comprising a first sidewall, a second sidewall, and an upper sidewall connecting the sidewalls. Furthermore, a set of circuit boards is provided, each circuit board having different electrical connector mechanisms, and a set of discrete side components, each side component having different openings corresponding to different electrical connector mechanisms. At least one circuit board is selected from the set of circuit boards, and a corresponding side component is selected from the set of side components. The selected circuit board is inserted into a receiving space of the housing component, and the selected side component is connected to the housing component, such that the first and second sidewalls, together with the side components, form a continuous housing wall, and the connector mechanisms arranged on the circuit boards are accessible through the openings in the side components.

[0033] Reference is made to the method according to the invention, which has already incorporated the advantages described in the modular system according to the invention.

[0034] It is preferable to pre-assemble the side components onto the circuit board before inserting it into the housing component. This simplifies the operation, especially because the circuit board and side components are more accessible and therefore easier to interconnect before being inserted into the housing component.

[0035] According to another embodiment, the circuit board and side components are first coupled to the bottom component, for example, inserted into the bottom component, and then mounted together with the bottom component onto the housing component.

[0036] The resulting assembly, including the circuit board and side components, is then inserted into the housing component or pushed into the housing component via the side components, particularly via guides constructed on the housing component. Thus, the side components and the circuit board form a pre-assembled unit.

[0037] According to one embodiment, at least one circuit board, particularly two circuit boards, is interconnected via two side members, and the resulting stack is pushed into the housing member as a unit. As already described in conjunction with a modular system, the side members are thus held onto the housing member.

[0038] Before inserting the circuit board into the housing component, a cover component is selected from a set of different cover components, and this cover component is inserted from the inside of the housing, i.e., in an outward direction, into the opening on the upper side of the housing component. In other words, the cover component is pressed outward from the inside of the housing through the opening, so that the cover component partially passes through the opening. As already described in conjunction with a modular system, the housing can thus be customized.

[0039] After inserting the circuit board and side components into the housing component, the bottom component is assembled onto the housing, resting against the lower edge of the side components in its fixed state. This is how the side components are secured to the housing component. Attached Figure Description

[0040] Other advantages and features of the invention will become apparent from the following description and the accompanying drawings, in which they are referenced.

[0041] - Figure 1 An exploded view shows an electronic device that can be manufactured using a modular system according to the invention, and

[0042] - Figure 2 Shown in the assembled state Figure 1 Electronic devices in the system. Detailed Implementation

[0043] Figure 1 and Figure 2Electronic device 10 is shown. In this embodiment, the electronic device is a "smart device" which can be mounted on a mounting rail (Hutschiene) for example by a spring-preloaded locking mechanism.

[0044] "Smart device" is specifically understood as a device that has a processor designed to perform computational processes, or has a communication interface, such as for communication via the Internet. "Smart device" can be installed in a switch cabinet, for example, mounted on a mounting rail. In particular, "smart device" can be used to monitor current or voltage supply.

[0045] In this embodiment, the electronic device 10 includes a housing component 12, two circuit boards 14 on which connector mechanisms 16 are respectively mounted, two side components 18 and 20, a bottom component 22, and a cover component 24.

[0046] In addition to connector mechanism 6, other electronic components may also be present on circuit board 14, especially components for current supply, microcontrollers, and interface modules.

[0047] The housing component 12 has a first sidewall 26 and a second sidewall 28, and an upper side 30 connecting these sidewalls 26, 28. In the illustrated embodiment, the upper side 30 connecting the two sidewalls 26, 28 is shown.

[0048] In this embodiment, sidewalls 26 and 28 are parallel to each other. However, it is also conceivable that sidewalls 26 and 28 extend relative to each other at an angle, thereby generally forming a wedge geometry of the housing component 12.

[0049] A receiving space 32 is formed between the sidewalls 26 and 28. The receiving space 32 is specifically used to receive (multiple) circuit boards 14.

[0050] The two side components 18 and 20 are manufactured separately from the housing component 12. Figure 2 In the assembled state shown, the separate side components 18 and 20, together with the side walls 26 and 28 of the housing component 12, form a surrounding housing wall. In other words, the side components 18 and 20 each form an additional side wall in the assembled state.

[0051] A recess 34 is provided in the upper side 30 of the housing component 12 for accommodating the cover component 24.

[0052] The housing component 12, side components 18 and 20, bottom component 22, and cover component 24 are assembled to form a closed housing 36 (see [link]). Figure 2 ).

[0053] In this regard, the separate side members 18, 20 and the side walls 26, 28 of the housing member 12 form the surrounding housing walls of the housing 36, since the separate side members 18, 20, in the assembled state, respectively form other side walls of the housing 36. Therefore, the housing 36 has four side walls, which are formed by the side walls 18, 20 of the housing member 12 and the separate side members 18, 20.

[0054] The aforementioned components constituting the housing 36 are preferably plastic injection molded parts.

[0055] In an alternative embodiment, which is not shown for simplicity, housing 36 has only one separate side member, and housing member 12 additionally has a third side wall. Thus, housing 36 also has four side walls here.

[0056] Alternatively, it is conceivable that electronic device 10 may replace two circuit boards 14, including only one circuit board or more than two circuit boards.

[0057] The at least one circuit board 14 is selected, for example, from a group of circuit boards 14, wherein the circuit boards 14 are provided with different electrical connector mechanisms 16. The group of circuit boards 14 particularly includes more than [number missing] [missing information]. Figure 1 The two circuit boards 14 shown in the figure.

[0058] Alternatively, it is conceivable to use a so-called backplane circuit board, through which other circuit boards can be connected. In this respect, the backplane circuit board is a general-purpose circuit board.

[0059] Side components 18 and 20 are selected from a set of discrete side components, wherein side components 18 and 20 each have different open portions 38 corresponding to different electrical connector mechanisms 16. Specifically, side components 18 and 20 in the set of side components differ in the position and size of their open portions 38.

[0060] Therefore, the circuit board 14 and the side components 18 and 20 are selected in pairs so that the connector mechanism 16 can be accessed from the outside through the clearance 38 when the electronic device 10 is assembled.

[0061] The cover component 24 may also be selected from a different set of cover components that can be selectively inserted into the recess 34 in the upper side 30 of the housing component 12.

[0062] The cover component 24 is cuboid in shape and has four side walls 40, 41, 42, 43 and a top side 44.

[0063] The different cover parts 24 vary, especially in their height.

[0064] Alternatively or additionally, some or all of the sidewalls 40, 41, 42, 43 and / or the upper side 44 of the cover member 24 may be arched in order to achieve different designs or different structural spaces below the cover member 24.

[0065] Alternatively or additionally, an opening may be provided in at least one sidewall 40, 41, 42, 43 and / or in the upper side 44, through which at least one LED, display or other operating element can be accessed or protruded. Thus, a display can be implemented on the cover member 24 whenever desired.

[0066] At their lower ends, that is, at the ends arranged in the open portion 34, the different cover parts 24 have the same profile. Thus, all cover parts 24 can be inserted into the open portion 34 in the same way.

[0067] When inserted, the cover component 24 is securely fixed in a defined position within the housing component 12.

[0068] Here, this defined positioning is achieved by laterally extending protrusions 46, which are present on two opposite side edges of the cover member 24.

[0069] With the cover member 24 inserted into the housing member 12, the protrusion 46 abuts against the inside of the housing member 12.

[0070] The cover member 24 is secured to the housing member 12, for example, by means that the two opposing sidewalls 40, 42 of the cover member 24 are elastically deformable, thereby allowing the cover member 24 to be locked onto the housing member 12. In particular, a gap 48 is provided along the edge of the cover member 24, allowing the sidewalls 40, 42 to move in a restricted manner within the area along the gap 48. The degree of mobility is determined by the stiffness of the material.

[0071] The elastically deformable sidewalls 40 and 42 may be slightly shorter than the remaining sidewalls 41 and 43, thereby ensuring that the elastically deformable sidewalls 40 and 42 do not deform in the final position of the cover member 24.

[0072] Alternatively or additionally, at least one of the empty portions 48 may be locked into at least one edge of the empty portion 34, and in particular, multiple empty portions 48 may be locked into multiple edges of the empty portion 34.

[0073] Furthermore, the cover member 24 tapers in the direction towards the upper side 44, thereby creating an inclined surface. This ensures centering when the cover member 24 is inserted. The same effect can be achieved by using a correspondingly large radius on the cover member 24.

[0074] With the cover component 24 inserted into the housing component 12, the side walls 40, 42 rest against the outer side of the housing component 12 with their edges, more precisely along the edge of the recess 34. Therefore, the cover component 24 can no longer be easily pulled out of the housing component 12.

[0075] To simplify the assembly of the side components 18 and 20, a guide portion 50 extending from the lower side to the upper side 30 is provided on the inner side of the housing component 12, along which the separate side components 18 and 20 can be guided and inserted into the housing component 12. More specifically, the guide portion is provided on the first side wall 26 and the second side wall 28. Furthermore, the guide portion 50 serves as a stop for positioning the side components 18 and 20 relative to the housing component 12.

[0076] To securely fasten the side members 18 and 20 to the housing member 12, each of the side members 18 and 20 has a plurality of protrusions 52 extending in the insertion direction, which overlap with the housing member 12 in the insertion direction in the final position of the side members 18 and 20. These protrusions 52 are, in particular, hooks that abut against the inner wall of the housing member 12, thereby holding the side members 18 and 20 to the housing member 12 in a direction transverse to the insertion direction.

[0077] When the bottom component 22 is fixed to the housing component 12, the bottom component 22 abuts against the lower edges of the side walls 26, 28 and the side components 18, 20, thereby securing the side components 18, 20 to the housing component 12 in conjunction with the protrusion 52.

[0078] The housing component 12 and the bottom component 22, together with the set of circuit boards 14, the set of side components 18, 20 and the set of cover components 24, form a modular system by means of which different variations of the electronic device 10 can be manufactured in a particularly simple manner.

[0079] Next, please refer to the appendix. Figure 1 and Figure 2 A method for manufacturing electronic device 10 using a modular system is described.

[0080] First, the housing component 12 as described above is provided.

[0081] In addition, a set of circuit boards 14 is provided, wherein the circuit boards 14 are provided with different electrical connector mechanisms 16. In addition, a set of discrete side parts 18, 20 is provided, wherein the side parts 18, 20 are respectively provided with different openings 38 corresponding to different electrical connector mechanisms 16.

[0082] Optionally, a set of different cover components 24 are provided, which differ in their height.

[0083] If a set of different cover parts 24 are provided, then first select one cover part 24 and insert it, more precisely, from the inside out, into the recess 34 of the housing part 12, as in Figure 1 As shown in the diagram.

[0084] Here, the cover member 24 is inserted into the housing member 12 until the protrusion 46 abuts against the inside of the housing member 12 and the cover member 24 is locked onto the housing member 12 by means of the elastically deformable sidewalls 40, 42.

[0085] However, the cover component 24 can also be omitted. In this case, the opening 34 on the upper side 30 of the housing component 12 can also be omitted. Instead, a baffle is inserted into the opening 34 to replace the cover component 24.

[0086] In addition, at least one circuit board 14 is selected from the group of circuit boards 14 and corresponding side components 18, 20 are selected from the group of side components 18, 20.

[0087] In this embodiment, two different circuit boards 14 are selected, on which connector mechanisms 16 of different sizes are present.

[0088] Accordingly, two side components 18 and 20 are selected, with their open portions 38 corresponding to the position and size of the connector mechanism 16 arranged on the circuit board 14.

[0089] Side components 18 and 20 are pre-assembled onto these two circuit boards 14, thereby... Figure 1 The stacked unit shown consists of a circuit board 14 and side components 18 and 20.

[0090] The pre-assembled unit, consisting of circuit board 14 and side components 18 and 20, is then pushed into housing component 12.

[0091] Here, the side parts 18 and 20 are pushed into the housing part 12 along the guide portion 50, or more precisely, until the side parts 18 and 20 abut against the upper side of the housing part 12.

[0092] Subsequently, the bottom component 22 is fixed to the housing component 12. Specifically, the bottom component 22 is threaded onto the housing component 12.

[0093] Once the bottom component 22 is fixed to the housing component 12, the side components 18, 20 and therefore the circuit board 14 are also securely fixed to the housing component 12.

Claims

1. A modular system for manufacturing electronic equipment (10), the modular system having: The housing component (12) includes a first sidewall (26) and a second sidewall (28) and an upper side (30) connecting the sidewalls (26, 28). A set of circuit boards (14), wherein, The circuit board (14) is provided with different electrical connector mechanisms (16). And a set of separate side components (18, 20), wherein the side components (18, 20) have different openings (38) corresponding to different electrical connector mechanisms (16). There exists a receiving space (32) between the first sidewall (26) and the second sidewall (28) for accommodating at least one of the circuit boards (14) in the set of circuit boards (14), and Selectively, at least one of the set of circuit boards (14) can be inserted into the receiving space (32), and one of the respective side parts (18, 20) of the set of separate side parts (18, 20) can be connected to the housing part (12) such that the first side wall (26) and the second side wall (28) together with the side parts (18, 20) form a continuous housing wall, and the connector mechanism (16) arranged on the circuit board (14) is accessible through the opening (38) in the side parts (18, 20).

2. The modular system according to claim 1, characterized in that, The modular system includes a set of different cover components (24), wherein there is a gap (34) in the upper side (30) of the housing component, and one of the different cover components (24) can be selectively inserted into the gap.

3. The modular system according to claim 2, characterized in that, The different cover components (24) differ in their height.

4. The modular system according to claim 2 or 3, characterized in that, At least one laterally protruding protrusion (46) is present on at least two opposite side edges of the cover member (24), the protrusion abutting against the inside of the housing member (12) in the insertion position where the cover member (24) is inserted into the housing member (12).

5. The modular system according to any one of claims 2 to 4, characterized in that, The cover component (24) is cuboid in shape and has four side walls (40, 41, 42, 43) and a top side (44), wherein at least two opposing side walls (40, 42) are configured to be elastically deformable and, in the inserted state, rest with their edges on the outside of the housing component (12) against the edge of the recess (34).

6. The modular system according to any one of the preceding claims, characterized in that, A guide portion (50) extending from the lower side to the upper side is provided on the inner side of the housing component (12), and the separate side components (18, 20) can be guided into the housing component (12) along the guide portion. In particular, the guide portion (50) is provided on the first side wall (26) and / or the second side wall (28).

7. The modular system according to claim 6, characterized in that, The modular system has a bottom component (22) that can be fixed to the housing component (12), wherein the bottom component (22) is attached to the lower edge of the side walls (26, 28) and the at least one side component (28, 20) in the fixed state.

8. The modular system according to any one of the preceding claims, characterized in that, The side components (18, 20) each include at least one protrusion (52) extending in the insertion direction, the protrusion overlapping the housing component (12) in the insertion direction at the final position of the side components (18, 20).

9. A method for manufacturing electronic equipment (12), wherein, The electronic device (12) is manufactured, in particular, by means of a modular system according to any one of the preceding claims, the method comprising the following steps: - Provide a housing component (12) including a first sidewall (26) and a second sidewall (28) and an upper side (30) connecting the sidewalls (26, 28); - A set of circuit boards (14) is provided, wherein the circuit boards (14) are provided with different electrical connector mechanisms (16); and - Provide a set of discrete side components (18, 20), wherein the side components (18, 20) have different openings (38) corresponding to different electrical connector mechanisms (16). - Wherein, at least one circuit board (14) is selected from the set of circuit boards (14) and a corresponding side component (18, 20) is selected from the set of side components (18, 20), and - The selected circuit board (14) is inserted into the receiving space (32) of the housing component (12), and the selected side components (18, 20) are connected to the housing component (12), so that the first side wall (26) and the second side wall (28) together with the side components (18, 20) form a continuous housing wall, and the connector mechanism (16) arranged on the circuit board (14) is accessible through the opening (38) in the side components (18, 20).

10. The method according to claim 9, characterized in that, Before inserting the circuit board (14) into the housing component (12), the side components (18, 20) are pre-assembled on the circuit board (14).

11. The method according to claim 9 or 10, characterized in that, Before inserting the circuit board (14) into the housing component (12), select one cover component (24) from a set of different cover components (24) and insert the cover component (24) into the empty portion (34) in the upper side (30) of the housing component (12) in a direction from the inside of the housing to the outside.

12. The method according to any one of claims 9 to 11, characterized in that, After inserting the circuit board (14) and the side parts (18, 20) into the housing part (12), the bottom part (22) is assembled onto the housing (12), with the bottom part abutting against the lower edge of the side parts (18, 20) in a fixed state.

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