Circuit unit

Abstract

Disclosed is a circuit unit that suppresses thermal effects on a current sensor and effects on a magnetic field by a pass-through circuit. A circuit unit (10) is provided with: a current sensor (12); a conduction circuit (16) configured so as to include a detection conductor part (14) for detecting a current value by the current sensor (12); and non-conductive heat transfer members (20a, 20b) that are thermally connected to the conductive circuit (16) and that include heat transfer sections (18a, 18b) that are in contact with the heat dissipation target (26) so as to be thermally conductive.

Description

Technical Field

[0001] This disclosure relates to circuit units. Background Technology

[0002] Patent Document 1 discloses a circuit unit mounted in a vehicle and configured in the power supply path from a power source to a load. The circuit unit includes a current sensor that measures the current flowing in a closed circuit housed within it. With the increasing current in vehicles in recent years, the heat generated by energizing the closed circuit has also increased, raising concerns about its thermal impact on the current sensor. Therefore, in Patent Document 1, on both sides of the detection conductor portion of the closed circuit where the current sensor detects the current value, extensions are provided that bend in the same direction (downward) in a direction orthogonal to the detection conductor portion. By ensuring that the heat transfer portion provided at the front end of the extension portion is in thermal contact with the heat dissipation target, a heat dissipation path for the energized busbar is guaranteed.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-015959 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, with such a circuit layout, noise is easily generated due to the enhanced magnetic field caused by the extended portions on both sides of the current sensor, which is believed to potentially cause the current sensor to malfunction.

[0008] Therefore, a circuit unit for suppressing the thermal effects of the current sensor and the effects of the magnetic field on the current circuit is disclosed.

[0009] Technical solutions for solving the problem

[0010] The circuit unit disclosed herein includes: a current sensor; a circuit configured to include a detection conductor portion for detecting current values ​​by the current sensor; and a non-energized heat transfer component thermally connected to the circuit and including a heat transfer portion that contacts a heat dissipation object in a manner capable of thermal conduction.

[0011] Invention Effects

[0012] According to the circuit unit disclosed herein, the thermal effects of the circuit on the current sensor and its effects on the magnetic field can be suppressed. Attached Figure Description

[0013] Figure 1 This is a longitudinal sectional perspective view of the circuit unit according to Embodiment 1, shown in a state where a portion of the housing has been removed.

[0014] Figure 2 It is magnification Figure 1 A longitudinal sectional view of section II-II in the figure.

[0015] Figure 3 This is a longitudinal sectional perspective view of the circuit unit involved in Embodiment 2, shown in a state where a portion of the housing has been removed.

[0016] Figure 4 It is magnification Figure 3 A longitudinal sectional view of section IV-IV in the figure.

[0017] Figure 5 It is a three-dimensional diagram that represents a variation of a circuit unit in a stylized manner. Detailed Implementation

[0018] <Description of Embodiments of the Invention>

[0019] First, embodiments of this disclosure will be described.

[0020] The circuit unit disclosed herein, (1) It includes: a current sensor; a circuit configured to include a detection conductor portion for detecting current values ​​by the current sensor; and a non-energized heat transfer component thermally connected to the circuit and including a heat transfer portion that contacts a heat dissipation object in a manner capable of thermal conduction.

[0021] According to this circuit unit, a non-energized heat transfer component is included. This non-energized heat transfer component is thermally connected to a circuit containing a detection conductor portion sensed by a current sensor, and includes a heat transfer portion that contacts the heat dissipation object in a thermally conductive manner. Therefore, the non-energized heat transfer component can be positioned in a region different from the routing path of the circuit, allowing the heat transfer portion of the non-energized heat transfer component to contact the heat dissipation object in a thermally conductive manner, thus ensuring a heat dissipation path for the circuit. Furthermore, since the non-energized heat transfer component is non-energized, it does not generate a magnetic field caused by energization, advantageously avoiding or suppressing the influence of the non-energized heat transfer component on the magnetic field of the current sensor. Therefore, even when a large current flows through the circuit, heat dissipation of the circuit can be promoted, suppressing thermal effects on the current sensor, and even using a heat dissipation path with a non-energized heat transfer component, the influence on the magnetic field of the current sensor can be suppressed.

[0022] Furthermore, as a current sensor, any type of sensor, whether with or without a core, can be used as a magnetic field detection sensor.

[0023] (2) In (1) above, preferably, the circuit has a pair of parallel portions extending parallel to the detection conductor portion on both sides of the extension direction of the detection conductor portion in a direction away from the current sensor, and the non-energized heat transfer member is thermally connected to the circuit at the base end of at least one of the parallel portions. Since the circuit has a pair of parallel portions extending parallel to the detection conductor portion on both sides of the extension direction of the detection conductor portion, it is advantageous to avoid the formation of an energized region extending in the same direction in the direction intersecting the detection conductor portion near the detection conductor portion. As a result, it is advantageous to suppress the generation of noise associated with magnetic field coupling caused by the energized path near the current sensor, and the magnetic resistance of the current sensor can be improved. In addition, since the non-energized heat transfer member is thermally connected to the circuit at the base end of the parallel portion, a heat dissipation path of the circuit can be ensured near the current sensor, and the heat resistance of the current sensor can also be improved.

[0024] (3) In (2) above, preferably, the heat transfer portion of the non-electric heat transfer component contacts the heat dissipation object near the current sensor at the protruding end of the non-parallel portion. The heat transfer portion of the non-electric heat transfer component contacts the heat dissipation object near the current sensor at the protruding end of the non-parallel portion. This allows for rapid heat dissipation of the circuit near the current sensor, further improving the heat resistance and magnetic resistance of the current sensor.

[0025] (4) In (2) or (3) above, preferably, the current sensor has: a housing that houses the detection conductor portion; and a pair of terminal portions connected to the two sides of the detection conductor portion and protruding to the two sides of the housing. Each of the parallel portions of the circuit and the non-energized heat transfer component are respectively constructed using busbars made of metal plates. The base ends of the parallel portions are respectively fastened to the pair of terminal portions of the current sensor, and the non-energized heat transfer component is fastened to the terminal portion together with the base end of at least one of the parallel portions. Since the current sensor has a pair of terminal portions on both sides of the housing housing the detection conductor portion, by simply fastening each of the parallel portions of the circuit constructed of busbars to the pair of terminal portions, a circuit with parallel portions protruding to both sides of the detection conductor portion can be constructed with simple and good assembly workability. Furthermore, by simply fastening the non-energized heat transfer component constructed of busbars together with the parallel portions to at least one terminal portion, a heat dissipation path for the circuit can be easily and easily constructed near the current sensor.

[0026] (5) In (1) above, preferably, the circuit has: a first cross portion protruding from one end of the detection conductor portion toward one side in the thickness direction of the detection conductor portion; and a second cross portion protruding from the other end of the detection conductor portion toward the other side in the thickness direction of the detection conductor portion, wherein the non-energized heat transfer component is thermally connected to the circuit at the base end of at least one of the first cross portion and the second cross portion. Since the circuit has a first cross portion and a second cross portion protruding toward one side and the other side in the thickness direction of the detection conductor portion on both sides of the detection conductor portion, the magnetic fields generated by the first cross portion and the second cross portion near the detection conductor portion cancel each other out. As a result, the generation of noise associated with magnetic field coupling in the energized path near the current sensor can be advantageously suppressed, and the magnetic resistance of the current sensor can be improved. In addition, since the non-energized heat transfer component is thermally connected to the circuit at the base end of at least one of the first cross portion and the second cross portion, a heat dissipation path of the circuit can be ensured near the current sensor, and the heat resistance of the current sensor can also be improved.

[0027] (6) In (5) above, it is preferable that at least one of the first and second intersections is provided with an energized heat transfer section that contacts the heat dissipation object in a thermally conductive manner. The magnetic field caused by the first and second intersections protruding towards one side and the other side in the thickness direction of the detection conductor can be counteracted, and the energized heat transfer section is advantageously provided at the first and second intersections from the current sensor toward the housing side that can serve as a heat dissipation object. This ensures a further heat dissipation path for the circuit, and further improves the heat resistance and magnetic resistance of the current sensor.

[0028] (7) In (5) or (6) above, preferably, the current sensor has: a housing that houses the detection conductor portion; and a pair of terminal portions connected to the two sides of the detection conductor portion and protruding to the two sides of the housing, wherein the first and second intersection portions of the circuit and the non-energized heat transfer component are respectively constructed of busbars made of metal plates, and the base ends of the first and second intersection portions are respectively fastened to the pair of terminal portions of the current sensor, and the non-energized heat transfer component is fastened to the terminal portions together with the base end of at least one of the first and second intersection portions. Since the current sensor has a pair of terminal portions on both sides of the housing housing the detection conductor portion, by simply fastening the first and second intersection portions of the circuit constructed of busbars to the pair of terminal portions, a circuit extending to one side and the other side in the plate thickness direction of the detection conductor portion can be constructed with simple and good assembly operability. Moreover, by simply fastening the non-electrically conductive heat transfer component made of the busbar together with the first cross portion and / or the second cross portion to at least one terminal portion, a heat dissipation path for the circuit can be easily and easily constructed near the current sensor.

[0029] (8) In any of (1) to (3), (5) and (6) above, it is preferred that the non-electric heat transfer component is integrally provided as a branch from a portion of the conductive path. By integrally providing the non-electric heat transfer component as a branch from a portion of the conductive path, it is possible to reduce the number of parts and simplify the manufacturing process.

[0030] (9) In any of (1) to (8) above, it is preferable to include a housing that houses the current sensor, the circuit, and the non-energized heat transfer component, the housing constituting the heat dissipation object, and the heat transfer portion of the non-energized heat transfer component contacting the housing in a thermally conductive manner. By using the housing of the circuit unit as the heat dissipation object, the heat transfer portion of the non-energized heat transfer component can be made to contact the heat dissipation object near the current sensor, which can lead to miniaturization of the non-energized heat transfer component and faster heat dissipation in the circuit.

[0031] <Details of the embodiments of the present invention>

[0032] Hereinafter, specific examples of the circuit units of this disclosure will be described with reference to the accompanying drawings. Furthermore, this disclosure is not limited to these examples, and as shown in the scope of the claims, it is intended to include all modifications within the scope of the claims and any equivalents thereof.

[0033] <Implementation Method 1>

[0034] The following uses Figure 1 , Figure 2The circuit unit 10 of Embodiment 1 of this disclosure will be described. The circuit unit 10 is, for example, mounted in a vehicle (not shown) such as an electric vehicle or a hybrid vehicle, and performs the supply and control of power from a power source (not shown) such as a battery to a load (not shown) such as an electric motor. The circuit unit 10 can be configured in any orientation, but in the following description, for convenience, it will be arranged according to... Figure 1 The arrows in the image can be used to indicate top, bottom, left, right, front, and back.

[0035] like Figure 1 , Figure 2 As shown, the circuit unit 10 has the following structure: a current sensor 12, a circuit 16 comprising a detection conductor 14 that detects the current value by the current sensor 12, and non-electrical heat transfer components 20a and 20b that are thermally connected to the circuit 16 and include heat transfer portions 18a and 18b that can contact a heat dissipation object (the bottom wall 26 of the first housing component 22 described later) in a thermally conductive manner, are housed within a housing 24 comprising the first housing component 22. Furthermore, although not shown in the figure, the first housing component 22, combined with a second housing component (not shown), forms a housing 24 that internally divides the housing space. Electrical components (not shown), such as relays, fuses, and connectors, which are electrically connected to the circuit 16, may also be housed on the second housing component side.

[0036] <First housing component 22>

[0037] The first housing component 22 is formed by injection molding an insulating synthetic resin into a predetermined shape. The synthetic resin constituting the first housing component 22 may also contain fillers such as glass fibers. Figure 1 As shown, the first housing component 22 is generally rectangular in shape with an upward opening, and has a bottom wall 26 and a peripheral wall 28 protruding upward from the end edge of the bottom wall 26. In Embodiment 1 of this disclosure, the first housing component 22 has a generally rectangular shape when viewed from above. However, the shape of the first housing component 22 is not limited to that of Embodiment 1.

[0038] like Figure 1 , Figure 2 As shown, a pair of support platforms 30a and 30b protrude from the right end of the bottom wall 26 of the first housing component 22, spaced apart in the left-right direction. The pair of support platforms 30a and 30b extend in the front-rear direction with rectangular cross-sections of the same shape. Nut receiving portions 32a and 32b, opening upwards, are provided at the central portion of the pair of support platforms 30a and 30b in the front-rear direction, each housing a nut 34a and 34b. Furthermore, a concave current sensor receiving portion 36, opening upwards, is provided between the pair of support platforms 30a and 30b.

[0039] <Current Sensor 12>

[0040] like Figure 2 As shown, the current sensor 12 has: a housing 38 that houses a detection conductor 14 that forms part of the circuit 16 and detects the current value by the current sensor 12; and a pair of terminals 40a and 40b, which extend in the same direction as the detection conductor 14. Figure 2 The current sensor 12 is connected to both sides (in the left-right direction) and protrudes to both sides of the housing 38 in the left-right direction. Bolt insertion holes 41a and 41b are respectively provided through a pair of terminal portions 40a and 40b for inserting the fastening bolts 60a and 60b (described later). Furthermore, a magnetic detection unit 42 is included, which is housed in a detection conductor portion 14 inside the housing 38 and detects the magnetic field corresponding to the current flowing through the detection conductor portion 14. Although not shown in the figure, the output signal detected by the magnetic detection unit 42 is transmitted to an external electrical control device or the like via a wire connected to the magnetic detection unit 42. The current sensor 12 in this embodiment is a magnetic field detection type sensor.

[0041] The current sensor 12 is supported by a pair of terminal portions 40a, 40b that overlap with the upper surfaces of a pair of support platforms 30a, 30b of the first housing component 22. At this time, the bolt insertion holes 41a, 41b provided in the pair of terminal portions 40a, 40b are substantially coaxially aligned with the nut receiving portions 32a, 32b that open on the upper surfaces of the pair of support platforms 30a, 30b. In this state, the housing 38 of the current sensor 12 is configured to be partially housed within the current sensor receiving portion 36 provided between the pair of support platforms 30a, 30b.

[0042] <Circuit 16>

[0043] The circuit 16, which detects the current value, includes: a detection conductor portion 14 housed within the housing 38 of the current sensor 12; and a pair of parallel portions 44a and 44b connected to a pair of terminal portions 40a and 40b of the current sensor 12, extending from both sides of the detection conductor portion 14 in a parallel manner away from the current sensor 12. The pair of parallel portions 44a and 44b are each formed by stamping and cutting a metal plate into a predetermined shape. Bolt insertion holes 48a and 48b (see reference) are provided through the base ends 46a and 46b at the ends of the current sensor 12 side that form the pair of parallel portions 44a and 44b, for inserting the fastening bolts 60a and 60b described later. Figure 2 At the protruding ends 50a and 50b of the pair of parallel portions 44a and 44b on the side away from the current sensor 12, bolt insertion holes 52a and 52b for fastening with other components (not shown) are also provided.

[0044] The base ends 46a and 46b of the pair of parallel portions 44a and 44b coincide with the upper surfaces of the pair of terminal portions 40a and 40b of the current sensor 12, respectively. At this time, the bolt insertion holes 48a and 48b provided at the base ends 46a and 46b are substantially coaxially aligned with the bolt insertion holes 41a and 41b of the pair of terminal portions 40a and 40b and the nut receiving portions 32a and 32b.

[0045] <Non-electrically powered heat transfer components 20a, 20b>

[0046] A pair of non-electrical heat transfer components 20a and 20b are thermally connected to the base ends 46a and 46b of a pair of parallel portions 44a and 44b constituting the circuit 16. Specifically, the pair of non-electrical heat transfer components 20a and 20b are formed by stamping and cutting a metal plate into a predetermined shape. In Embodiment 1, the pair of non-electrical heat transfer components 20a and 20b each have a fastening portion 54a and 54b at one end in the longitudinal direction. The fastening portions 54a and 54b, together with the base ends 46a and 46b of the pair of parallel portions 44a and 44b, are fastened to a pair of terminal portions 40a and 40b of the current sensor 12. At the other end in the longitudinal direction of each pair of non-electrical heat transfer components 20a and 20b, heat transfer portions 18a and 18b are respectively provided. The heat transfer portions 18a and 18b are in contact with the first housing component 22 (housing 24) which is the object of heat dissipation in a thermally conductive manner. Furthermore, bolt insertion holes 56a and 56b are provided through the fastening portions 54a and 54b of a pair of non-electrically conductive heat transfer components 20a and 20b for inserting the fastening bolts 60a and 60b described later (see reference). Figure 2 ).

[0047] like Figure 2 As shown, the fastening portions 54a, 54b and the heat transfer portions 18a, 18b on both sides of the length direction of the pair of non-electrical heat transfer components 20a, 20b extend parallel to the detection conductor portion 14, and the intermediate region between them is formed into a crank shape extending orthogonally to the extension direction of the detection conductor portion 14. The fastening portions 54a, 54b of the pair of non-electrical heat transfer components 20a, 20b coincide with the lower surfaces of the pair of terminal portions 40a, 40b of the current sensor 12, respectively. At this time, the bolt insertion holes 56a, 56b provided in the fastening portions 54a, 54b are substantially coaxially aligned with the bolt insertion holes 48a, 48b of the parallel portions 44a, 44b, the bolt insertion holes 41a, 41b of the pair of terminal portions 40a, 40b, and the nut receiving portions 32a, 32b. Furthermore, a pair of non-electrically conductive heat transfer components 20a and 20b are respectively housed within the current sensor housing 36 in such a manner that their intermediate regions and heat transfer portions 18a and 18b are respectively housed within the current sensor housing 36. Figure 2 The longitudinal sectional view shown (or its projection in the front-to-back direction) is arranged in a line-symmetric orientation.

[0048] Furthermore, in Embodiment 1, a pair of non-energized heat transfer components 20a and 20b are thermally connected to the circuit 16 at the base ends 46a and 46b of a pair of parallel portions 44a and 44b extending from both sides of the detection conductor portion 14. However, this is not a limitation; one non-energized heat transfer component 20a or 20b may also be thermally connected at the base end 46a or 46b of one parallel portion 44a or 44b. Specifically, the base end 46a or 46b of one parallel portion 44a or 44b may also be fastened together with one non-energized heat transfer component 20a or 20b to one terminal portion 40a or 40b of the current sensor 12 via fastening bolts 60a or 60b described later.

[0049] Each of the heat transfer portions 18a and 18b of a pair of non-electrically conductive heat transfer components 20a and 20b contacts the bottom wall 26 of the first housing component 22, which forms the bottom of the current sensor housing 36, via heat conduction components 58a and 58b in a thermally conductive manner. Specifically, the heat transfer portions 18a and 18b of each non-electrically conductive heat transfer component 20a and 20b make thermal contact with the heat dissipation target (the bottom wall 26 of the first housing component 22) via heat conduction components 58a and 58b at the protruding ends 50a and 50b of the parallel portions 44a and 44b on the side closer to the current sensor 12. Both heat conduction components 58a and 58b are flat, insulating sheets made of a synthetic resin with a thermal conductivity greater than that of air. Specifically, silicone-based resins, non-silicone acrylic resins, ceramic resins, etc., can be used. More specifically, examples include heat dissipation gap fillers made of silicone-based resins, thermally conductive greases, and thermally conductive silicone rubber. The heat-conducting components 58a and 58b are flexible, and their thickness can vary depending on the force applied in the vertical direction. Furthermore, in Embodiment 1, the heat-conducting components 58a and 58b are both sheet-like, but this is not a limitation, and any shape can be used. Moreover, according to the above structure, the pair of non-electrical heat-conducting components 20a and 20b are thermally connected to the circuit 16 at the fastening portions 54a and 54b, but the remaining portions are not connected to the circuit 16 or other electrically conductive components, and therefore are non-electrical components.

[0050] Assembly process of circuit unit 10

[0051] Next, an example of the assembly process of circuit unit 10 will be described. The assembly process of circuit unit 10 is not limited to the following description.

[0052] First, the first housing component 22 constituting the housing 24 is prepared. Next, two heat-conducting components 58a and 58b are cut into a predetermined shape using known methods such as Thomson die cutting. The heat-conducting components 58a and 58b thus formed are then positioned at a predetermined location at the bottom of the current sensor housing 36.

[0053] Next, by stamping and punching a metal plate into a specified shape, a pair of parallel portions 44a and 44b consisting of busbars and a pair of non-electrical heat transfer components 20a and 20b are prepared. The pair of non-electrical heat transfer components 20a and 20b are arranged with their middle regions and heat transfer portions 18a and 18b respectively housed in the current sensor housing portion 36. The fastening portions 54a and 54b of the pair of non-electrical heat transfer components 20a and 20b are aligned with their respective bolt insertion holes 56a and 56b in a substantially coaxial position with the nut housing portions 32a and 32b and placed on the upper surface of a pair of support platforms 30a and 30b.

[0054] Then, a pair of terminal portions 40a and 40b of the separately prepared current sensor 12 are placed on the fastening portions 54a and 54b of a pair of non-electric heat transfer components 20a and 20b, with their respective bolt insertion holes 41a and 41b aligned with bolt insertion holes 56a and 56b and nut receiving portions 32a and 32b in a substantially coaxial position. Next, a pair of parallel portions 44a and 44b are arranged in their respective placement locations, and the bolt insertion holes 48a and 48b of the pair of parallel portions 44a and 44b are placed on the upper surface of the pair of terminal portions 40a and 40b of the current sensor 12 in a substantially coaxial position aligned with bolt insertion holes 41a and 41b, bolt insertion holes 56a and 56b and nut receiving portions 32a and 32b. Finally, the additionally prepared fastening bolts 60a and 60b are sequentially inserted through bolt insertion holes 48a and 48b, bolt insertion holes 41a and 41b, and bolt insertion holes 56a and 56b, and then inserted into nut receiving portions 32a and 32b, and fastened to nuts 34a and 34b respectively housed in nut receiving portions 32a and 32b. Thus, the base ends 46a and 46b of each parallel portion 44a and 44b, together with the fastening portions 54a and 54b of each non-electrical heat transfer component 20a and 20b, are fastened to the terminal portions 40a and 40b of the current sensor 12 by the fastening bolts 60a and 60b. Then, the first housing component 22, which includes the current sensor 12, the circuit 16 including the detection conductor portion 14, and the non-electrical heat transfer components 20a and 20b with heat transfer portions 18a and 18b, is assembled. For example, a second housing component (not shown) that houses electrical components such as relays, fuses, and connectors (not shown) can be combined to form a housing 24 that houses electrical components, thereby completing the circuit unit 10.

[0055] Next, the effects of the circuit unit 10 in Embodiment 1 will be explained. According to Embodiment 1, a pair of non-energized heat-transferring components 20a and 20b are thermally connected to a circuit 16 configured to include a detection conductor portion 14 sensed by the current sensor 12 and a pair of parallel portions 44a and 44b. Specifically, the fastening portions 54a and 54b of the pair of non-energized heat-transferring components 20a and 20b, together with the base ends 46a and 46b of the parallel portions 44a and 44b, are fastened to the terminal portions 40a and 40b of the current sensor 12, thereby thermally connecting the pair of non-energized heat-transferring components 20a and 20b relative to the circuit 16. Furthermore, the heat-transfer portions 18a and 18b provided on the pair of non-energized heat-transferring components 20a and 20b contact the bottom wall 26 of the first housing component 22, which is the target for heat dissipation, in a manner capable of thermal conduction. Therefore, by arranging non-energized heat transfer components 20a and 20b in areas different from the routing path of the circuit 16, the heat dissipation path of the circuit 16 can be ensured with good space efficiency via the non-energized heat transfer components 20a and 20b. Furthermore, since the non-energized heat transfer components 20a and 20b are non-energized, they do not generate magnetic fields caused by energization, thus advantageously avoiding or suppressing the influence of the non-energized heat transfer components 20a and 20b on the magnetic field of the current sensor 12. Therefore, even when a large current flows through the circuit 16, heat dissipation of the circuit 16 can be promoted, suppressing the thermal impact on the current sensor 12. Moreover, even when using a heat dissipation path based on the non-energized heat transfer components 20a and 20b, the influence on the magnetic field of the current sensor 12 can be suppressed.

[0056] In particular, in this embodiment, since the circuit 16 has a pair of parallel portions 44a, 44b extending parallel to the detection conductor 14 on both sides of the extending direction of the detection conductor 14, it is advantageous to avoid the formation of an energized region extending in the same direction in the direction intersecting the detection conductor 14 near the detection conductor 14. As a result, it is advantageous to suppress the generation of noise associated with magnetic field coupling caused by the energized path near the current sensor 12, and to improve the magnetic resistance of the current sensor.

[0057] Furthermore, the non-electrical heat transfer components 20a and 20b are thermally connected to the circuit 16 by fastening together with the base ends 46a and 46b of the parallel portions 44a and 44b. This ensures a heat dissipation path for the circuit 16 near the current sensor 12 and improves the heat resistance of the current sensor 12. In particular, by using the first housing component 22 constituting the housing 24 of the circuit unit 10 as the heat dissipation target, the heat transfer portions 18a and 18b of each non-electrical heat transfer component 20a and 20b can come into contact with the heat dissipation target near the current sensor 12. This allows for miniaturization of the non-electrical heat transfer components 20a and 20b and more rapid heat dissipation in the circuit 16.

[0058] Furthermore, the heat transfer portions 18a and 18b of each of the non-energized heat transfer components 20a and 20b, closer to the current sensor 12 than the protruding ends 50a and 50b of each of the parallel portions 44a and 44b that are connected, contact the bottom wall 26 of the first housing component 22, which is the object of heat dissipation. Therefore, heat dissipation via the circuit 16 can be rapidly achieved near the current sensor 12 through the non-energized heat transfer components 20a and 20b, further improving the heat resistance and magnetic resistance of the current sensor 12.

[0059] Furthermore, the current sensor 12 has a pair of terminal portions 40a, 40b on both sides of the housing 38 housing the detection conductor portion 14 (both sides in the extending direction of the detection conductor portion 14). Therefore, by simply fastening a pair of parallel portions 44a, 44b made of busbars to a pair of terminal portions 40a, 40b, a circuit 16 protruding from both sides of the detection conductor portion 14 by the pair of parallel portions 44a, 44b can be formed with simple and good assembly workability. Moreover, by simply fastening a pair of non-energized heat transfer components 20a, 20b made of busbars together with each parallel portion 44a, 44b to each terminal portion 40a, 40b, a heat dissipation path for the circuit 16 can be easily and easily formed near the current sensor 12.

[0060] <Implementation Method Two>

[0061] based on Figure 3 , Figure 4 Embodiment two, which applies the technology disclosed in this specification to circuit unit 70, will be described. The circuit unit 70 of Embodiment two has a generally similar structure to the circuit unit 10 of Embodiment one, but also... Figure 4 As shown, the difference from circuit unit 10 lies in the arrangement shape of the circuit 72 and the presence of a heat transfer section on the energized side that contacts the circuit 72 in a manner capable of thermal conduction. Furthermore, in Embodiment 2, components and parts substantially the same as in Embodiment 1 are labeled with the same markings as in Embodiment 1, thus omitting detailed descriptions.

[0062] like Figure 3 , Figure 4 As shown, in circuit unit 70, a first cross portion 74 and a second cross portion 76, each made of a busbar made of a metal plate, are connected to a pair of terminal portions 40a and 40b of current sensor 12, instead of a pair of parallel portions 44a and 44b. That is, in circuit unit 70, the circuit 72 is configured to include a detection conductor portion 14, and a circuit from one end of the detection conductor portion 14 ( Figure 4 (Left side) Towards the thickness direction of the detection conductor section 14 ( Figure 4 The first cross portion 74 protruding from the upper middle part, and from the other end of the detection conductor portion 14 ( Figure 4 (Right side of the middle) to the other side in the plate thickness direction of the detection conductor section 14 ( Figure 4 The second cross portion 76 protrudes from the lower center. In the circuit unit 70, the fastening portion 54a of the non-energized heat transfer component 20a is thermally connected to the circuit 72 at the base end portion 78 of the first cross portion 74 together with the base end portion 78 of the first cross portion 74. Specifically, the base ends 78 and 79 of the first cross portion 74 and the second cross portion 76 are fastened to the terminal portions 40a and 40b of the current sensor 12 by fastening bolts 60a and 60b respectively. Moreover, the non-energized heat transfer component 20a is fastened to the terminal portion 40a of the current sensor 12 together with the base end portion 78 of the first cross portion 74. The heat transfer portion 18a of the non-energized heat transfer component 20a, similar to that in Embodiment 1, contacts the bottom wall 26 of the first housing component 22 constituting the housing 24 in a thermally conductive manner via the heat conduction component 58a. Thus, a first heat dissipation path for the circuit 72 is ensured near the current sensor 12 (on the terminal portion 40a side).

[0063] In the circuit unit 70, although no non-energized heat transfer component 20b is provided on the second intersection 76 side, the second intersection 76 has an energized heat transfer component 82 that contacts the bottom wall 26 of the first housing component 22, which is the object of heat dissipation, via a heat conduction component 80 in a manner capable of heat conduction (see reference). Figure 4 Therefore, a second discharge path for the circuit 72 is ensured near the current sensor 12 (on the terminal 40b side). Alternatively, any component exemplified as the heat conduction components 58a and 58b described above can be used as the heat conduction component 80.

[0064] In this circuit unit 70, since the circuit 72 has a first intersection 74 and a second intersection 76 protruding from both sides of the extension direction of the detection conductor 14 toward one side and the other side of the plate thickness direction of the detection conductor 14, the magnetic fields generated by the first intersection 74 and the second intersection 76 near the detection conductor 14 cancel each other out. This advantageously suppresses the generation of noise associated with magnetic field coupling caused by the circuit 72 near the current sensor 12, improving the magnetic resistance of the current sensor 12. Furthermore, since a heat dissipation path is ensured for the circuit 72 on the first intersection 74 side using the non-energized heat transfer component 20a, and a heat dissipation path is ensured from the energized side heat transfer component 82 provided at the second intersection 76 to the first housing component 22, the heat resistance of the current sensor 12 is also improved.

[0065] In the circuit unit 70, the current sensor 12 also has a pair of terminal portions 40a and 40b on both sides of the housing 38 that houses the detection conductor portion 14. Therefore, by simply fastening the first cross portion 74 and the second cross portion 76, which are made of busbars, to the pair of terminal portions 40a and 40b, a through circuit 72 extending to one side and the other side in the plate thickness direction of the detection conductor portion 14 can be formed with simple and good assembly workability. Moreover, by simply fastening the non-energized heat transfer component 20a, which is made of busbars, together with the first cross portion 74 to the terminal portion 40a, a heat dissipation path in the through circuit 72 can be easily and workably formed near the current sensor 12.

[0066] <Variation Example>

[0067] The above description, as specific examples of this disclosure, details Embodiment 1 and Embodiment 2, but this disclosure is not limited to these specific descriptions. Modifications and improvements within the scope of achieving the objectives of this disclosure are included in this disclosure. For example, modifications of the embodiments as described below are also included within the technical scope of this disclosure.

[0068] (1) In Embodiment 1 and Embodiment 2, the parallel portions 44a and 44b formed by the busbar, or the first intersection portion 74 and the second intersection portion 76, and the non-energized heat transfer components 20a and 20b are fastened to the terminal portions 40a and 40b of the current sensor 12, thereby forming the circuit 16 and 72 and the non-energized heat transfer components 20a and 20b, but this is not a limitation. For example, such as Figure 5 As shown in the schematic diagram, the circuit 84 can also be formed by a continuous busbar, and the separate current sensor 86 can be assembled into the circuit 84. Alternatively, a non-energized heat transfer component 88 can be branched off from a portion of the circuit 84 and integrally provided, with a heat transfer section 90 at its end. This allows for a reduction in the number of parts and a simplification of the manufacturing process.

[0069] (2) In Embodiment 1, the non-electric heat transfer components 20a and 20b are thermally connected to a pair of parallel portions 44a and 44b of the circuit 16, but the number of non-electric heat transfer components can be one or more.

[0070] (3) In Embodiment 2, a non-energized heat transfer component 20a is thermally connected only to the first intersection 74 of the circuit 72. However, a non-energized heat transfer component 20b may be thermally connected to the second intersection 76 in addition to the first intersection 74. Specifically, for example, each non-energized heat transfer component 20a, 20b may be fastened together with the base ends 78, 79 of the first and second intersections 74, 76 to the terminal portions 40a, 40b of the current sensor 12. In addition, in Embodiment 2, the energized heat transfer component 82 is only provided in the second intersection 76. However, a non-energized heat transfer component 82 may be provided in addition to the second intersection 76, or in addition to the second intersection 76, it may also be provided in the first intersection 74.

[0071] (4) The heat dissipation object is the housing 24 of the circuit unit, but the heat transfer parts 18a, 18b and the energized side heat transfer part 82 provided in the opening of the housing 24 can also contact the heat dissipation object outside the housing (such as the metal housing of other components) in a way that enables heat conduction.

[0072] Explanation of reference numerals in the attached figures

[0073] 10 circuit units (Implementation Method 1); 12 current sensors; 14. Inspect the conductor section; 16-channel circuit; Heat transfer sections 18a and 18b; 20a and 20b are non-electrically conductive heat transfer components; 22 First housing component; 24 enclosures; 26. Bottom wall (the object of heat dissipation); 28th week wall; 30a and 30b are a pair of support platforms; 32a, 32b Nut Receiving Parts; Nuts 34a and 34b; 36. Current sensor housing; 38 enclosures (current sensor); Terminal sections 40a and 40b; 41a, 41b Bolt through holes (terminal section); 42 magnetic detection units; 44a, 44b parallel parts; 46a, 46b base ends; 48a and 48b bolts are inserted into the through holes (parallel section); 50a and 50b protrude from the ends; 52a and 52b bolts are inserted into the through holes; Fasteners 54a and 54b; 56a and 56b bolts are inserted into through holes (non-electrically conductive heat transfer components); 58a and 58b heat conduction components; 60a and 60b fastening bolts; 70 circuit units (Implementation Method 2); 72-channel circuit; 74 First intersection; 76 Second intersection; 78, 79 basal ends; 80 heat conduction components; 82. Heat transfer section on the energized side; 84-channel circuit (modified example); 86 Current sensor (modified example); 88. Non-electrically conductive heat transfer components (modified examples); 90 Heat transfer section (modified example).

Claims

1. A circuit unit comprising: Current sensor; The circuit is configured to include a detection conductor portion for detecting current values ​​by the current sensor; and A non-electrically powered heat transfer component, thermally connected to the electrically powered component, and including a heat transfer portion that contacts the heat dissipation object in a manner capable of thermal conduction.

2. The circuit unit according to claim 1, wherein, The circuit has a pair of parallel portions extending parallel to the detection conductor portion on both sides of the extension direction of the detection conductor portion in a direction away from the current sensor. The non-electric heat transfer component is thermally connected to the electrically conductive component at the base end of at least one of the parallel portions.

3. The circuit unit according to claim 2, wherein, The heat transfer portion of the non-electrically powered heat transfer component contacts the heat dissipation object at the protruding end of the parallel portion near the current sensor side.

4. The circuit unit according to claim 2 or 3, wherein, The current sensor has: a housing that houses the detection conductor portion; and a pair of terminal portions that are connected to both sides of the detection conductor portion and protrude towards both sides of the housing. Each of the parallel sections of the conductive circuit and the non-electrically conductive heat transfer component is constructed using a busbar made of a metal plate. The base ends of the parallel portions are respectively fastened to a pair of terminal portions of the current sensor, and the non-energized heat transfer component is fastened together with the base ends of at least one of the parallel portions to the terminal portions.

5. The circuit unit according to claim 1, wherein, The circuit has: a first intersection portion that protrudes from one end of the detection conductor portion toward one side in the plate thickness direction of the detection conductor portion; And a second intersection portion, which protrudes from the other end of the detection conductor portion toward the other side of the plate thickness direction of the detection conductor portion. At the base end side of at least one of the first and second intersection portions, the non-electrical heat transfer component is thermally connected to the electrical circuit.

6. The circuit unit according to claim 5, wherein, At least one of the first intersection and the second intersection is provided with an electrically powered heat transfer section that contacts the heat dissipation object in a manner that enables thermal conduction.

7. The circuit unit according to claim 5 or 6, wherein, The current sensor includes: a housing that houses the detection conductor portion; and a pair of terminal portions that are connected to both sides of the detection conductor portion in its extending direction and protrude towards both sides of the housing. The first and second intersections of the conductive circuit, as well as the non-electrically conductive heat transfer component, are each constructed using busbars made of metal plates. The base ends of the first cross portion and the second cross portion are respectively fastened to a pair of terminal portions of the current sensor, and the non-energized heat transfer component is fastened together with the base end of at least one of the first cross portion and the second cross portion to the terminal portion.

8. The circuit unit according to claim 1, wherein, The non-electric heat transfer component is branched off from a portion of the conductive circuit but integrally disposed therefrom.

9. The circuit unit according to claim 1 or 2, wherein, The circuit unit includes a housing that houses the current sensor, the conductive circuit, and the non-energized heat transfer component; the housing constitutes the heat dissipation device. The heat transfer portion of the non-electric heat transfer component contacts the housing in a manner that enables thermal conduction.

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