A current sensor

Abstract

The application provides a current sensor, and belongs to the technical field of sensors.The current sensor comprises a shell and a chip assembly, the chip assembly comprises a Hall chip and a mounting piece which is detachably connected with the Hall chip, at least one mounting cavity for mounting a magnetic core assembly is arranged in the shell, a magnetic core assembly is arranged in each mounting cavity, a mounting hole is formed in the shell, the number and position of the mounting hole correspond to those of the mounting cavity, the Hall chip is inserted into a corresponding magnetic core air gap through the mounting hole, the pin of the Hall chip penetrates out of the shell, and the mounting piece is detachably connected with the shell.The Hall chip is detachably connected with the shell, so that when the Hall chip needs to be repaired or replaced due to failure, the Hall chip can be easily removed from the shell, and subsequent repair and replacement are facilitated; and the detachable connection between the chip and the shell eliminates the need for pouring encapsulation glue to fix the chip during assembly of the current sensor.

Description

Technical Field

[0001] This invention belongs to the field of sensor technology, and in particular relates to a current sensor. Background Technology

[0002] Current detection is a crucial function of the electronic control system in new energy vehicles, and its performance directly affects the stability and reliability of electric vehicles. Current detection methods based on Hall effect current sensors offer advantages such as low loss, stable performance, built-in isolation, and strong overload capacity, gradually becoming the mainstream solution for current detection in new energy vehicles. Patent CN202815058U discloses a current sensor comprising a magnetic core, a magnetic core support, a housing, and a chip. In this patent, the chip is fixed to the housing via potting compound curing. However, the curing time of the potting compound is relatively long, resulting in a prolonged production time, which is unfavorable for large-scale production. Furthermore, temperature changes in the potting compound can generate significant stress on the chip, causing damage. Additionally, the potting compound has a relatively high water absorption rate compared to the chip, keeping it in a damp state. Both of these factors affect the performance of the current sensor, leading to abnormal performance. Moreover, once the chip is fixed to the housing with potting compound, it is difficult to replace, resulting in poor maintainability. Summary of the Invention

[0003] The purpose of this invention is to address the aforementioned problems in existing technologies by proposing a current sensor that is simple to assemble and easy to maintain.

[0004] The objective of this invention can be achieved through the following technical solution: A current sensor includes a housing and a chip assembly. The chip assembly includes a Hall chip and a mounting component detachably connected to the Hall chip. The housing has at least one mounting cavity for mounting a magnetic core assembly. Each mounting cavity contains a magnetic core assembly, which includes a magnetic core. The housing has mounting holes, the number and position of which correspond to the mounting cavities. The Hall chip passes through the mounting hole and is inserted into the corresponding air gap of the magnetic core, with the pins of the Hall chip protruding outside the housing. The mounting component is detachably connected to the housing.

[0005] In the aforementioned current sensor, each chip assembly is provided with multiple guide posts around its periphery. When the Hall chip is inserted into the housing, the guide posts are fixed to the end face of the housing.

[0006] In the aforementioned current sensor, the mounting component includes a chip support frame, which includes a first fixing plate. The Hall chip is detachably connected to the first fixing plate, and the pins of the Hall chip extend through the first fixing plate. First connecting buckles are fixedly provided at both ends of the first fixing plate. First connecting slots are provided on both sides of the housing. The mounting hole includes a through hole provided on the end face of the housing, which communicates with the mounting cavity. The Hall chip extends into the air gap of the magnetic core through the through hole, and the first connecting buckles are engaged and fixed with the first connecting slots.

[0007] In the aforementioned current sensor, the mounting component includes a chip holder, which includes a second fixing plate. The mounting hole includes an insertion hole on the side of the housing. Second connecting buckles are fixedly provided at both ends of the second fixing plate. A second connecting slot is provided on the side of the housing. An abutment block is fixedly provided on the second fixing plate. The abutment block is provided with an abutment groove that abuts and fixes against the side of the Hall chip. When the Hall chip passes through the insertion hole from the side of the housing and extends into the air gap of the magnetic core, the second fixing plate is fastened and fixed to the housing, the abutment groove abuts and fixes against the side of the Hall chip, and the pins of the Hall chip extend out of the housing.

[0008] In the aforementioned current sensor, both ends of the magnetic core are fixedly provided with a wrapping layer, a fixing block is provided at the air gap of the magnetic core, a fixing groove is provided on the fixing block, and both ends of the fixing block are respectively fixed to the wrapping layer. The Hall chip is inserted into the fixing groove and fixedly connected to the fixing groove. A positioning component is also provided on the wrapping layer, and a mating component is provided inside the housing. When the magnetic core is placed in the mounting cavity, the positioning component and the mating component position the magnetic core.

[0009] In the aforementioned current sensor, a positioning block is integrally formed on the wrapping layer, and a positioning groove is formed on the inner wall of the mounting cavity. When the magnetic core is placed in the mounting cavity, the positioning block is embedded in the positioning groove.

[0010] In the aforementioned current sensor, the positioning element includes an insulating layer integrally formed with the wrapping layer to wrap the magnetic core. A fixing ring is integrally formed symmetrically on the outer surface of the insulating layer. The housing includes a mounting shell and a cover detachably disposed from the mounting shell. The mating element includes mounting grooves formed on the mounting shell and the cover. When the magnetic core is placed in the mounting cavity, the fixing ring on one side is inserted and fixed into the mounting groove in the mounting shell. After the cover is placed on the mounting shell, the fixing ring on the other side is inserted and fixed into the cover.

[0011] In the aforementioned current sensor, the magnetic core has multiple punched slots, and a positioning block is fixedly provided in the mounting cavity. When the magnetic core is placed in the mounting cavity, the positioning slots and the positioning block are inserted and fixed.

[0012] In the aforementioned current sensor, both ends of the housing are fixedly provided with mounting parts that are fixed to external components.

[0013] In the aforementioned current sensor, a tension ring is fixedly disposed inside the mounting cavity. After the magnetic core is installed inside the mounting cavity, it is fitted onto the tension ring. A through hole coaxial with the tension ring is opened on the outer surface of the housing. The tension ring extends into the through hole, and the inner wall of the through hole abuts against the outer surface of the tension ring.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0015] (1) The Hall chip and the housing are detachable, which makes it easy to remove the Hall chip from the housing when it malfunctions and needs to be repaired or replaced, facilitating subsequent repair and replacement; and the detachable connection between the chip and the housing means that potting glue is no longer needed to fix the chip during the assembly of the current sensor, reducing the fixing time between the chip and the housing.

[0016] (2) The guide post can provide guidance when the current sensor is connected to the application PCB, making it easier to insert the pins of the Hall chip into the application PCB;

[0017] (3) The positioning components on the wrapping layer include an insulating layer that wraps the magnetic core integrally with the wrapping layer, which greatly improves the insulation performance between the magnetic core and the chip located in the air gap of the magnetic core. This solves the safety regulations and insulation withstand voltage problems of the product in high-voltage platform applications. In addition, during the processing of the magnetic core, there will be a problem of large size differences between individual cores, making it difficult to position them. However, after covering the magnetic core with an insulating layer, a precise matching size can be obtained, which is conducive to the assembly and fixation of the housing. Attached Figure Description

[0018] Figure 1 This is one of the three-dimensional structural schematic diagrams of the present invention;

[0019] Figure 2 This is one of the exploded structural diagrams of the present invention;

[0020] Figure 3 This is the second three-dimensional structural schematic diagram of the present invention;

[0021] Figure 4 This is the second schematic diagram of the exploded structure of the present invention;

[0022] Figure 5 This is a three-dimensional structural diagram of the mounting shell in this invention;

[0023] Figure 6 This is a three-dimensional structural diagram of the shell cover in this invention;

[0024] Figure 7 This is a three-dimensional structural diagram of the chip support frame in this invention;

[0025] Figure 8 This is one of the three-dimensional structural schematic diagrams of the magnetic core in this invention;

[0026] Figure 9 This is the second three-dimensional structural schematic diagram of the magnetic core in this invention;

[0027] Figure 10 This is the third three-dimensional structural schematic diagram of the magnetic core in this invention;

[0028] Figure 11 This is a partial connection diagram of the present invention.

[0029] In the figure, Hall effect chip 100; chip support frame 101; first fixing plate 102; first connecting buckle 103; first connecting slot 104; guide groove 105; pin hole 106; positioning post 107; chip fixing frame 108; second fixing plate 109; second connecting buckle 110; second connecting slot 111; abutment block 112; mounting post 113; punching groove 114; mounting post 115; housing 200; mounting cavity 201; magnetic core 202; guide. Column 203; Perforation 204; Fixing hole 205; Wrapping layer 206; Fixing block 207; Fixing groove 208; Insulation layer 209; Fixing ring 210; Mounting shell 211; Shell cover 212; Mounting groove 213; Fixing step 214; Positioning block 215; Positioning groove 216; Tension ring 217; Through hole 218; Isolation rib 219; Isolation groove 220; Mounting surface 221; Reinforcing rib 222; Positioning hole 223; Insertion hole 224; Welding rib 225. Detailed Implementation

[0030] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings to further illustrate the technical solutions of the present invention. However, the present invention is not limited to these embodiments.

[0031] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0032] like Figures 1-8As shown, a current sensor includes a housing 200 and a chip assembly. The chip assembly includes a Hall chip 100 and a mounting component detachably connected to the Hall chip 100. The housing 200 has at least one mounting cavity 201 for mounting a magnetic core 202 assembly. Each mounting cavity 201 contains a magnetic core assembly, which includes a magnetic core 202. The housing 200 has mounting holes, the number and position of which correspond to the mounting cavities 201. The Hall chip 100 passes through the mounting hole and is inserted into the corresponding air gap of the magnetic core. The pins of the Hall chip 100 protrude from the housing 200. The mounting component is detachably connected to the housing 200.

[0033] In this embodiment, the Hall chip 100 and the housing 200 are detachably connected, which makes it easy to remove the Hall chip 100 from the housing 200 when it malfunctions and needs to be repaired or replaced, facilitating subsequent repair and replacement. Furthermore, the detachable connection between the chip and the housing 200 eliminates the need for potting compound to seal the chip during the assembly of the current sensor, reducing the fixation time between the chip and the housing 200 and increasing the chip's lifespan.

[0034] Preferably, each chip assembly is provided with multiple guide posts 203 around its periphery. When the Hall chip 100 is inserted into the housing 200, the guide posts 203 are fixed to the end face of the housing 200.

[0035] In this embodiment, the guide post 203 provides guidance when the current sensor is connected to the application PCB, making it easier to insert the pins of the Hall chip 100 into the application PCB.

[0036] It is worth mentioning that a mounting post 115 is also fixedly installed on the upper surface of the housing to fix it to the application PCB and prevent the chip pins soldered to the application PCB from being subjected to force.

[0037] More preferably, the mounting component includes a chip support frame 101, which includes a first fixing plate 102. The Hall chip 100 is detachably connected to the first fixing plate 102, and the pins of the Hall chip 100 extend through the first fixing plate 102. The two ends of the first fixing plate 102 are fixedly provided with first connecting buckles 103. The two sides of the housing 200 are provided with first connecting slots 104. The mounting hole includes a through hole 204 provided on the end face of the housing 200. The through hole 204 is connected to the mounting cavity 201. The Hall chip 100 extends into the air gap of the magnetic core through the through hole 204. The first connecting buckle 103 is engaged and fixed with the first connecting slot 104.

[0038] In this embodiment, the mounting hole includes a through hole 204 formed on the upper end face of the housing 200 and communicating with the mounting cavity 201. The magnetic core 202 is fixed in the mounting cavity 201, and the magnetic core air gap on the magnetic core 202 is set facing the through hole 204, so that the Hall chip 100 can be inserted into the magnetic core air gap by passing through the through hole 204. The chip support frame 101 is fixed to the housing 200 by snap-fit, so that when the Hall chip 100 fails, the Hall chip 100 can be removed from the housing 200 for replacement without scrapping the entire sensor. The Hall chip 100 and the chip support frame 101 are also detachably connected, so that the chip support frame 101 can also be reused.

[0039] It is worth mentioning that the first connecting slot 104 is also provided with a guide slot 105 that communicates with it. The distance between the end faces of the two guide slots 105 is smaller than the distance between the end faces of the two first connecting slots 104, which facilitates the snap-fit ​​and fixation between the first connecting buckle 103 and the first connecting slot 104.

[0040] It is worth mentioning that the first fixing plate 102 has a pin hole 106, through which the pins of the Hall chip 100 extend; and two positioning posts 107 are also vertically arranged on the first fixing plate 102, which fix the Hall chip 100 between the two positioning posts 107, and at the same time facilitate the separation of the Hall chip 100 from the chip support frame 101.

[0041] In this embodiment, a fixing hole 205 is provided on the end face of the housing 200, and the guide post 203 is fixed on the first fixing plate 102. Both ends of the guide post 203 extend out of the first fixing plate 102. The guide post 203 is inserted and fixed with the fixing hole 205 on the housing 200, which can position the chip on the housing 200.

[0042] More preferably, both ends of the magnetic core 202 are fixedly provided with a wrapping layer 206, and a fixing block 207 is provided at the air gap of the magnetic core. The fixing block 207 is provided with a fixing groove 208. Both ends of the fixing block 207 are fixed to the wrapping layer 206 respectively. The Hall chip 100 is inserted into the fixing groove 208 and fixed to the fixing groove 208. The wrapping layer 206 is also provided with a positioning element, and the housing 200 is provided with a mating element. When the magnetic core 202 is placed in the mounting cavity 201, the positioning element and the mating element position the magnetic core 202.

[0043] In this embodiment, the positioning element on the wrapping layer 206 includes an insulating layer 209 integrally formed with the wrapping layer 206 to wrap the magnetic core 202. This significantly improves the insulation performance between the magnetic core 202 and the chip located in the air gap of the magnetic core, solving the safety regulations and insulation withstand voltage issues of the product in high-voltage platform applications. Furthermore, during the processing of the magnetic core 202, there may be large differences in size between individual units, making positioning difficult. However, after covering the magnetic core 202 with the insulating layer 209, a precise fit can be obtained, which is beneficial for the assembly and fixation of the housing 200.

[0044] It is worth mentioning that a fixing ring 210 is integrally and symmetrically arranged on the outer surface of the insulating layer 209. The housing 200 includes a mounting shell 211 and a cover 212 detachably disposed from the mounting shell 211. The mating parts include mounting grooves 213 formed on the mounting shell 211 and the cover 212. When the magnetic core 202 is placed in the mounting cavity 201, the fixing ring 210 on one side is inserted and fixed with the mounting groove 213 in the mounting shell 211. After the cover 212 is placed on the mounting shell 211, the fixing ring 210 on the other side abuts against the cover 212. This achieves the installation and positioning of the magnetic core 202 and also solves the problem that the thin-walled part of the existing magnetic core 202 is prone to cracking during integral injection molding.

[0045] It is worth mentioning that the mounting cavity 201 has an opening to facilitate the installation of the magnetic core 202 into the cavity. The cover 212 and the mounting shell 211 are fixed to close the opening and fix the magnetic core 202. The opening on the mounting cavity 201 is provided with a fixing step 214. The cover 212 is integrally provided with a welding rib 225. When the cover 212 is placed on the mounting shell 211, the welding rib 225 abuts against the fixing step 214. Afterwards, assembly and fixation can be achieved by ultrasonic welding or pressing. The cover 212 is also provided with a welding support surface.

[0046] It is worth mentioning that a positioning block 215 is integrally provided on the wrapping layer 206, and a positioning groove 216 is provided on the inner wall of the mounting cavity 201. When the magnetic core 202 is placed in the mounting cavity 201, the positioning block 215 is embedded in the positioning groove 216.

[0047] More preferably, a tension ring 217 is fixedly disposed in the mounting cavity 201, and the magnetic core 202 is installed in the mounting cavity 201 and then sleeved on the tension ring 217. The outer surface of the housing 200 is provided with a through hole 218 coaxial with the tension ring 217, the tension ring 217 extends into the through hole 218, and the outer surface of the tension ring 217 abuts against the inner wall of the through hole 218.

[0048] In this embodiment, the tension ring 217 increases the creepage distance between the primary busbar and the chip, thereby improving the product's insulation creepage distance and increasing insulation capability.

[0049] It is worth mentioning that the tension ring 217 is fixed inside the mounting shell 211, the through hole 218 is opened on the shell cover 212, and the shell 200 is also integrally provided with an isolation rib 219 coaxial with the through hole 218. The insulating layer 209 is provided with an isolation groove 220. When the shell cover 212 is fastened and fixed to the mounting shell 211, the isolation rib 219 extends into the isolation groove 220.

[0050] Preferably, both ends of the housing 200 are fixedly provided with mounting parts for fixing to external parts.

[0051] It is worth mentioning that the mounting part includes mounting surfaces 221 at both ends of the housing 200. A reinforcing rib 222 is fixedly provided between the mounting surface 221 and the housing 200. A positioning hole 223 is provided on the mounting surface 221. A bushing is fixedly provided in the positioning hole 223. Fasteners pass through the bushing and are fixed to the external parts.

[0052] like Figure 11 As shown, in other preferred embodiments: the mounting component includes a chip holder 108, the chip holder 108 includes a second fixing plate 109, the mounting hole includes an insertion hole 224 opened on the side of the housing 200, the two ends of the second fixing plate 109 are fixedly provided with second connecting buckles 110, the side of the housing 200 is provided with a second connecting slot 111, the second fixing plate 109 is fixedly provided with an abutment block 112, the abutment block 112 is provided with an abutment groove that abuts and fixes against the side of the Hall chip 100, when the Hall chip 100 passes through the insertion hole 224 from the side of the housing 200 and extends into the air gap of the magnetic core 202, the second fixing plate 109 is fastened and fixed to the housing 200, the abutment groove abuts and fixes against the side of the Hall chip 100, and the pins of the Hall chip 100 extend out of the housing 200.

[0053] In this embodiment, the mounting hole includes an insertion hole 224 that is formed on the side of the housing 200 and communicates with the mounting cavity 201. The magnetic core 202 is fixed in the mounting cavity 201, and the bottom wall of the insertion hole 224 and the magnetic core air gap mounting position on the magnetic core 202 are on the same horizontal plane. This allows the Hall chip 100 to be installed in the air gap of the magnetic core 202 by pushing the bottom end of the Hall chip 100 against the bottom wall of the insertion hole 224 during the installation process. After the Hall chip 100 is installed in place, the second fixing plate 109 is fastened and fixed to the housing 200, and the abutment groove abuts and fixes the side of the Hall chip 100 to fix the Hall chip 100 in the housing 200. When the Hall chip 100 malfunctions, it can be removed from the housing 200 for replacement, and the chip fixing bracket 108 can also be reused.

[0054] In this embodiment, the guide post 203 is directly fixed to the upper end face of the housing 200.

[0055] It is worth mentioning that the upper gap distance of the socket 224 is smaller than the lower gap distance, which allows the lower end of the socket 224 to guide the chip during installation while fixing the chip's vertical position.

[0056] In other preferred embodiments: the mounting component includes adhesive, and the Hall chip 100 is inserted into the housing 200 for bonding and fixation.

[0057] like Figure 9 As shown, in other preferred embodiments: the positioning element on the wrapping layer 206 includes a mounting post 113 disposed on the wrapping layer 206, and a mounting hole is provided in the mounting cavity 201. When the magnetic core 202 is placed in the mounting cavity 201, the mounting post 113 is inserted into the positioning groove for fixation.

[0058] like Figure 10 As shown, in other preferred embodiments: a plurality of punching slots 114 are provided on the magnetic core 202, and a mounting block is fixedly provided in the mounting cavity 201. When the magnetic core 202 is placed in the mounting cavity 201, the punching slots and the mounting block are inserted and fixed.

[0059] It is worth mentioning that the punching groove 114 is manufactured by punching and riveting. Due to the high dimensional accuracy of the punching, it can be directly fixed to the housing 200.

[0060] In other preferred embodiments: the mounting shell 211 and the shell cover 212 are integrally injection molded, and the through hole 218 is provided on the end face of the shell; or after the shell cover 212 is removed, glue is poured into the mounting cavity 201 to fix the magnetic core 202, and no glue is poured into the stretching hole 217.

[0061] It should be noted that in this invention, the use of terms such as "first," "second," and "a" is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. The terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two elements or the interaction between two elements, unless otherwise explicitly specified. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0062] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0063] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A current sensor, characterized in that, The device includes a housing and a chip assembly. The chip assembly includes a Hall effect chip and a mounting component detachably connected to the Hall effect chip. The housing has at least one mounting cavity for mounting a magnetic core assembly, and each mounting cavity contains a magnetic core assembly, which includes a magnetic core. The housing has mounting holes, the number and position of which correspond to the mounting cavities. The Hall effect chip passes through the mounting hole and is inserted into the corresponding air gap of the magnetic core, with its pins protruding outside the housing. The mounting component is detachably connected to the housing. Both ends of the magnetic core are fixedly covered with a wrapping layer. A fixing block is provided at the air gap of the magnetic core, and a fixing groove is formed on the fixing block. The two ends of the fixing block are respectively connected to… The enclosure layer is fixed, and the Hall chip is inserted into the fixing groove and fixed. The enclosure layer is also provided with a positioning element, and the housing is provided with a mating element. When the magnetic core is placed in the mounting cavity, the positioning element and the mating element position the magnetic core. The positioning element includes an insulating layer integrally formed with the enclosure layer to wrap the magnetic core. The outer surface of the insulating layer is symmetrically provided with fixing rings. The housing includes a mounting shell and a shell cover detachably formed with the mounting shell. The mating element includes mounting grooves formed on the mounting shell and the shell cover. When the magnetic core is placed in the mounting cavity, the fixing ring on one side is inserted into the mounting groove in the mounting shell and fixed. After the shell cover is placed on the mounting shell, the fixing ring on the other side is inserted into the shell cover and fixed.

2. A current sensor according to claim 1, characterized in that, Each of the chip components is provided with multiple guide posts around its periphery. When the Hall chip is inserted into the housing, the guide posts are fixed to the end face of the housing.

3. A current sensor according to claim 1, characterized in that, The mounting component includes a chip support frame, which includes a first fixing plate. The Hall chip is detachably connected to the first fixing plate, and the pins of the Hall chip extend through the first fixing plate. First connecting buckles are fixedly provided at both ends of the first fixing plate. First connecting slots are provided on both sides of the housing. The mounting hole includes a through hole provided on the end face of the housing. The through hole communicates with the mounting cavity. The Hall chip extends into the air gap of the magnetic core through the through hole. The first connecting buckles are engaged and fixed with the first connecting slots.

4. A current sensor according to claim 1, characterized in that, The mounting component includes a chip holder, which includes a second fixing plate. The mounting hole includes an insertion hole on the side of the housing. Second connecting buckles are fixedly provided at both ends of the second fixing plate. A second connecting slot is provided on the side of the housing. An abutment block is fixedly provided on the second fixing plate. The abutment block is provided with an abutment groove that abuts and fixes against the side of the Hall chip. When the Hall chip passes through the insertion hole from the side of the housing and extends into the air gap of the magnetic core, the second fixing plate is fastened and fixed to the housing, the abutment groove abuts and fixes against the side of the Hall chip, and the pins of the Hall chip extend out of the housing.

5. A current sensor according to claim 1, characterized in that, The wrapping layer is also integrally provided with a positioning block, and the inner wall of the mounting cavity is provided with a positioning groove. When the magnetic core is placed in the mounting cavity, the positioning block is embedded in the positioning groove.

6. A current sensor according to claim 1, characterized in that, The magnetic core has multiple punching slots, and a mounting block is fixedly provided in the mounting cavity. When the magnetic core is placed in the mounting cavity, the punching slots and the mounting block are inserted and fixed.

7. A current sensor according to claim 1, characterized in that, Both ends of the housing are fixedly provided with mounting parts for fixing to external parts.

8. A current sensor according to claim 1, characterized in that, A tension ring is fixedly installed inside the mounting cavity. After the magnetic core is installed inside the mounting cavity, it is sleeved on the tension ring. A through hole coaxial with the tension ring is opened on the outer surface of the housing. The tension ring extends into the through hole, and the inner wall of the through hole abuts against the outer surface of the tension ring.

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