Semiconductor wafer CMP (Chemical Mechanical Polishing) polishing machine capable of accurately spraying grinding liquid and capable of being manufactured

Abstract

The invention discloses a semiconductor wafer CMP (chemical mechanical polishing) polishing machine capable of accurately spraying grinding liquid. The semiconductor wafer CMP polishing machine comprises a polishing machine shell horizontally placed on a working table. Through cooperation of the polishing assembly and the tool assembly, the semiconductor wafer can be conveniently, stably and efficiently polished, and the capability of polishing the semiconductor wafer is achieved; through the cooperation of a flow meter and a gear pump of the liquid conveying assembly, the output flow can be conveniently monitored, adjusted and controlled in real time, and the accurate manufacturability of the device is achieved; through a fluid mechanics and system efficiency model established by the grinding fluid regulation and control module, multiple factors such as gear pump volume efficiency, pipeline resistance, grinding fluid viscosity and temperature dependence are comprehensively considered, and accurate calculation and dynamic regulation of actual output quantity are achieved; the module not only can judge whether the supply is sufficient or not, but also can reversely deduce and adjust the ideal output quantity when the supply is insufficient, so that the supply accuracy of the grinding fluid and the process stability are remarkably improved, and the cost waste caused by excessive supply is reduced.

Description

Technical Field

[0001] This invention relates to the field of CMP polishing technology, and in particular to a semiconductor wafer CMP polishing machine that can precisely produce polishing slurry. Background Technology

[0002] CMP polishing machines, or chemical mechanical polishing machines, are one of the core pieces of equipment in semiconductor chip manufacturing. They use the synergistic effect of chemical etching and mechanical polishing to planarize the wafer surface with nanometer-level precision. The majority of the operating cost of existing CMP polishing equipment comes from the consumption of polishing slurry. However, existing CMP polishing equipment output structures have certain problems in both flow control and flow monitoring. For example, the current equipment typically uses an injection-type output structure. While this theoretically ensures a quantitative output of polishing slurry each time, the short pauses during the piston's reciprocating motion result in a pulsed output curve, making the output highly unstable. Furthermore, the method of calculating the polishing slurry supply solely by counting the number of piston reciprocations within a fixed volume chamber is greatly affected by ambient temperature, thus lacking precise flow monitoring. This often leads to over-supply during polishing, increasing costs.

[0003] Therefore, the present invention improves the existing equipment to address the above problems. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the existing technology and to propose a semiconductor wafer CMP polishing machine that can precisely produce polishing slurry spray.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor wafer CMP polishing machine with precise slurry spraying, comprising a polishing machine housing placed horizontally on a worktable, a control panel fixedly installed on the front end face of the polishing machine housing, a polishing assembly fixedly installed inside the polishing machine housing, a tooling assembly fixedly installed on one side of the top surface of the polishing machine housing, an infusion machine housing fixedly installed on the rear side of the top surface of the polishing machine housing, a display screen fixedly installed on one side of the front end face of the infusion machine housing, and an infusion assembly for precise slurry spraying provided inside the infusion machine housing;

[0006] The control panel contains a slurry control module and a placement status module.

[0007] The grinding fluid control module is used to establish a fluid dynamics and system efficiency model based on the gear pump volumetric efficiency, pipeline resistance, grinding fluid viscosity and its temperature dependence, calculate the actual grinding fluid output, and achieve precise control of the grinding fluid supply through comparison with the actual demand and feedback adjustment.

[0008] The placement status module is used to perform grayscale and block processing on the wafer images acquired by the camera, identify wafer areas and detect their surface integrity and placement status. If an abnormality is detected, a corresponding warning will be issued through the display screen.

[0009] Preferably, the data analysis steps of the polishing slurry control module are as follows:

[0010] M1: Ideal output of grinding fluid Considering the influence of practical factors, the actual output of the grinding fluid is... , The volumetric efficiency of the gear pump. Flow loss due to pipeline resistance;

[0011] M2: Compare actual output Compared with theoretical demand The difference ,like If so, it is determined that the supply is insufficient and replenishment is required, and according to... Back-calculation of the required ideal output .

[0012] Preferably, the data analysis steps for placing the status module are as follows:

[0013] N1: Acquire a wafer image and perform grayscale conversion and block segmentation, dividing the image into several equal-sized grayscale blocks; select the central block and set its grayscale value. Compared with standard gray values If the comparison exceeds the standard range, it is marked as an abnormal block; if the number of abnormal blocks is... satisfy If the image is abnormal, it will be re-acquired. This is a preset proportional coefficient. This represents the total number of map tiles;

[0014] N2: Traverse from the center wafer block outwards, identify all wafer blocks, and mark the boundary wafer blocks; traverse the boundary wafer blocks, analyze the geometric relationship between adjacent blocks, and if the included angle between adjacent blocks is less than the preset angle threshold, the wafer surface is determined to be complete; otherwise, an incomplete surface warning is output.

[0015] N3: Draw horizontal reference lines, count the distance differences between boundary wafer blocks and image boundaries, and determine whether the wafer is centered; if the number of abnormal boundary blocks exceeds... If the placement is incorrect, a warning message will be output. This represents the total number of boundary blocks.

[0016] Preferably, the data preprocessing steps of the polishing slurry control module are as follows:

[0017] Q1: Sort the collected data according to the collection time, and sort the corresponding items collected at the same time. averaging the data and standard deviation The calculation, and the mean obtained from the calculation. and standard deviation Collect data fluctuation range for corresponding items The system is configured to compare the collected data for a given item with its fluctuation range, mark data outside the fluctuation range as outliers, and record the number of outliers. ;

[0018] Q2: If If the collected data is abnormal, the data will be re-tested; if If outliers are removed, the mean of the remaining corresponding test data after outlier removal is calculated. The calculation, and the mean obtained from the calculation. This serves as the corresponding data detected at the corresponding time.

[0019] Preferably, the grinding assembly includes a mounting bracket fixedly installed inside the housing of the grinding machine. A motor is fixedly installed on one side of the mounting bracket. A drive pulley is coaxially fixed to the rotating end of the motor. The drive pulley is connected to a driven pulley on the other side via a belt. The driven pulley is coaxially fixed to a splined shaft.

[0020] Preferably, the splined shaft is horizontally rotatably connected to the mounting bracket, a worm gear is fixedly mounted on the mounting bracket, a worm is meshed with one side of the worm gear, the worm is vertically rotatably connected to the mounting bracket, a rotating disk is fixedly connected to the upper end of the worm, and a grinding disk is fixedly mounted on the rotating disk.

[0021] Preferably, the infusion assembly includes a storage tank fixedly installed above the infusion machine housing, one side of which is connected to a gear pump, and the gear pump is fixedly installed inside the infusion machine housing.

[0022] Preferably, the output end of the gear pump is connected to a flow meter, and the other end of the flow meter passes through the casing of the infusion machine and is connected to an extension tube.

[0023] Preferably, the tooling assembly includes a mounting column that is vertically fixedly installed on the rear side of the top surface of the grinding machine housing, and an adjustment bracket is fitted on the outer side of the mounting column.

[0024] Preferably, a hydraulic rod is installed on the other end of the adjusting frame, and an installation plate is fixedly installed on the lower end of the hydraulic rod.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] 1. By combining the grinding components and tooling components, it is possible to grind semiconductor wafers stably and efficiently, thus realizing the ability to grind semiconductor wafers; furthermore, by combining the flow meter and gear pump of the infusion component, it is possible to monitor and adjust the output flow in real time, thus realizing the precise control capability of the device; ultimately solving the problem of excessive grinding fluid supply in existing equipment.

[0027] 2. The fluid dynamics and system efficiency model established through the grinding fluid control module comprehensively considers multiple factors such as gear pump volumetric efficiency, pipeline resistance, grinding fluid viscosity and its temperature dependence, to achieve accurate calculation and dynamic adjustment of the actual output. This module can not only determine whether the supply is sufficient, but also back-calculate and adjust the ideal output when the supply is insufficient, thereby significantly improving the accuracy of grinding fluid supply and process stability, and reducing cost waste caused by over-supply.

[0028] 3. The placement status module performs intelligent analysis and geometric judgment on the wafer image, which can automatically identify wafer areas, detect surface integrity and placement position deviation. The module has real-time monitoring and early warning functions. If wafer surface defects or misalignment or tilt exceeding the threshold is detected, the system can issue a timely warning through the display screen, thereby avoiding polishing quality problems caused by poor wafer condition and improving the reliability of the production process and product yield. Attached Figure Description

[0029] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this application, illustrate exemplary embodiments of the invention and, together with their description, serve to explain the invention and do not constitute an undue limitation thereof. In the drawings:

[0030] Figure 1 This is a three-dimensional schematic diagram of the overall appearance of the device proposed in this invention;

[0031] Figure 2 This is a three-dimensional schematic diagram of the tooling component structure proposed in this invention;

[0032] Figure 3 This is a three-dimensional schematic diagram of the tooling assembly and grinding assembly proposed in this invention.

[0033] Figure 4 This is a three-dimensional schematic diagram of the grinding component structure proposed in this invention;

[0034] Figure 5 This is a three-dimensional schematic diagram of the infusion assembly layout proposed in this invention.

[0035] Figure 6 This is a three-dimensional schematic diagram of the infusion assembly structure proposed in this invention;

[0036] Figure 7 This is a flowchart of the system proposed in this invention.

[0037] The components in the diagram are numbered as follows: 1. Grinding machine housing; 2. Control panel; 3. Infusion machine housing; 4. Display screen; 5. Mounting bracket; 6. Motor; 7. Drive pulley; 8. Driven pulley; 9. Worm gear; 10. Worm; 11. Rotary disc; 12. Grinding disc; 13. Storage tank; 14. Gear pump; 15. Flow meter; 16. Extension tube; 17. Mounting column; 18. Adjusting bracket; 19. Hydraulic rod; 20. Mounting plate. Detailed Implementation

[0038] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0039] Example 1: See Figures 1 to 6 This invention discloses a semiconductor wafer CMP polishing machine with precise slurry spraying, comprising a polishing machine housing 1 horizontally placed on a worktable, a control panel 2 fixedly mounted on the front end of the polishing machine housing 1, a polishing assembly fixedly mounted inside the polishing machine housing 1, a tooling assembly fixedly mounted on one side of the top surface of the polishing machine housing 1, an infusion machine housing 3 fixedly mounted on the rear side of the top surface of the polishing machine housing 1, a display screen 4 fixedly mounted on one side of the front end of the infusion machine housing 3, an infusion assembly for precise slurry spraying inside the infusion machine housing 3, and a mounting bracket 5 fixedly mounted inside the polishing machine housing 1. A motor 6 is fixedly mounted on one side of the mounting bracket 5, and a drive pulley 7 is coaxially fixedly connected to the rotating end of the motor 6 via a belt. The driven pulley 8 is connected to the other side and is coaxially fixed to the spline shaft. The spline shaft is horizontally rotatably connected to the mounting bracket 5. A worm gear 9 is fixedly installed on the mounting bracket 5. A worm 10 is meshed with one side of the worm gear 9 and is vertically rotatably connected to the mounting bracket 5. A rotating disk 11 is fixedly connected to the upper end of the worm 10. A grinding disk 12 is fixedly installed on the rotating disk 11. The tooling assembly includes a mounting column 17 vertically fixedly installed on the rear side of the top surface of the grinding machine housing 1. An adjusting frame 18 is sleeved on the outer side of the mounting column 17. A hydraulic rod 19 is fixedly installed on the other end of the adjusting frame 18. A mounting disk 20 is fixedly installed on the lower end of the hydraulic rod 19. Through the cooperation of the grinding assembly and the tooling assembly, it is convenient to grind semiconductor wafers stably and efficiently.

[0040] In this invention, in order to solve the problem of excessive supply of grinding fluid in existing equipment, the following technical solution is adopted: The infusion assembly includes a storage tank 13 fixedly installed on the upper part of the infusion machine housing 3. One side of the storage tank 13 is connected to a gear pump 14, which is fixedly installed inside the infusion machine housing 3. The output end of the gear pump 14 is connected to a flow meter 15, and the other end of the flow meter 15 passes through the infusion machine housing 3 and is connected to an extension tube 16. Through the cooperation of the flow meter 15 and the gear pump 14 of the infusion assembly, it is convenient to monitor and adjust the output flow rate in real time.

[0041] Working principle: When using this invention, firstly, power is supplied to all electrical equipment in the device to ensure that each component can operate normally; then, the semiconductor wafer to be polished is precisely installed and fixed on the mounting plate 20 of the tooling assembly to complete the pre-processing preparation; next, the motor 6 fixed on one side of the mounting frame 5 in the polishing assembly is started. The rotating end of the motor 6 drives the coaxially fixed drive pulley 7 to rotate. The drive pulley 7 drives the driven pulley 8 on the other side to rotate synchronously through belt transmission. Since the driven pulley 8 is coaxially fixed on the spline shaft, and the spline shaft is horizontally rotatably connected to the mounting frame 5, when the driven pulley 8 rotates, it will drive the worm gear 9 fixed on the mounting frame 5 to rotate through the spline shaft. The worm gear 9 meshes with the worm 10 on one side, thereby driving the worm 10 vertically rotatably connected to the mounting frame 5 to rotate. The rotating disk 11 fixed at the upper end of the worm 10 rotates synchronously, and finally drives the polishing disk 12 fixed on the rotating disk 11 to rotate to realize the polishing preparation;

[0042] Meanwhile, the gear pump 14 installed inside the infusion machine housing 3 in the infusion assembly is started. The gear pump 14 stably draws the polishing fluid from the storage tank 13 above the infusion machine housing 3. The polishing fluid enters the connected flow meter 15 through the output end of the gear pump 14. After the flow meter 15 detects the flow rate in real time, it flows into the extension pipe 16 from one end that penetrates the infusion machine housing 3, and finally flows out to the surface of the polishing disc 12 through the extension pipe 16, thus wetting the polishing disc 12. Then, the hydraulic rod 19 fixed on the adjusting frame 18 in the tooling assembly is started. The hydraulic rod 19 drives the mounting plate 20 at the lower end and the wafer fixed on the mounting plate 20 to move downward, so that the wafer is stably pressed against the rotating polishing disc 12 with a set pressure, and the semiconductor wafer is polished.

[0043] During the polishing process, the flow rate of the polishing fluid can be monitored in real time by the flow meter 15 of the fluid delivery component, and the output flow rate can be adjusted and controlled in conjunction with the gear pump 14 to avoid excessive supply of polishing fluid. After the wafer is polished to meet the requirements, the hydraulic rod 19, motor 6 and gear pump 14 are turned off in sequence to stop the rotation of the polishing disc 12 and the supply of polishing fluid. Finally, the processed wafer is removed, the power supply of all electrical equipment is disconnected, and the entire polishing operation process is completed.

[0044] Example 2: See Figure 7 The control panel 2 is equipped with a grinding fluid control module and a placement status module.

[0045] The grinding fluid control module establishes a fluid dynamics and system efficiency model, comprehensively considering factors such as gear pump volumetric efficiency, pipeline resistance, grinding fluid viscosity and its temperature dependence, to calculate the actual grinding fluid output. By comparing the difference between the actual output and the theoretical demand, it determines whether the supply is sufficient, and if necessary, it back-calculates and adjusts the required ideal output.

[0046] The placement status module performs grayscale and block processing on the wafer image acquired by the camera. By comparing the grayscale value of the center block with the standard range, it identifies the wafer region and marks the boundary blocks. By traversing the boundary blocks and analyzing their geometric relationships, it determines whether the wafer surface is intact. By drawing and dynamically adjusting the horizontal reference line, it counts the distance difference between the boundary blocks and the image boundary to detect whether the wafer is placed in the center or tilted. If surface defects or placement position deviations exceed the threshold, the system issues a corresponding warning on the display screen.

[0047] Data on the displacement of gear pump 14 and the speed of motor 6 are acquired, the acquired data are preprocessed, and the preprocessed data is recorded as valid data.

[0048] Preprocessing: The collected data is sorted according to the collection time, and corresponding items collected at the same time are processed. averaging the data and standard deviation The calculation, and the mean obtained from the calculation. and standard deviation Collect data fluctuation range for corresponding items The system is configured to compare the collected data for a given item with its fluctuation range, mark data outside the fluctuation range as outliers, and record the number of outliers. ,like If the collected data is abnormal, the data will be re-tested; if If outliers are removed, the mean of the remaining corresponding test data after outlier removal is calculated. The calculation, and the mean obtained from the calculation. As the corresponding data detected at the corresponding time;

[0049] The output volume of the grinding fluid and the displacement of the gear pump 14 and the speed of motor 6 The ideal output of the grinding fluid is related to this. Considering the impact of actual factors such as leakage, pipeline resistance, and viscosity, the actual grinding fluid output volume... , The volumetric efficiency of the gear pump. Flow loss due to pipeline resistance;

[0050] The internal leakage of a gear pump is positively correlated with back pressure and negatively correlated with the viscosity of the grinding fluid, as well as its volumetric efficiency. ,in The leakage coefficient is (fitted experimentally). The pressure at the output end of the polishing slurry. The dynamic viscosity of the grinding fluid;

[0051] According to Poiseuille's law in fluid mechanics, the flow loss caused by frictional resistance along the pipeline... , The inner diameter of the pipe. The pressure difference between the two ends of the pipeline, This is the total length of the pipeline;

[0052] The dynamic viscosity of the grinding slurry varies with temperature. , Reference temperature The viscosity below, The viscosity temperature coefficient, Ambient temperature;

[0053] For the formula Taking the natural logarithm of both sides, we can transform it into a linear form. ,by The x-axis is... Using the vertical axis as the ordinate, substitute the historical valid data for the corresponding terms, and fit a straight line using the least squares method. The slope of the straight line is the viscosity temperature coefficient. ;

[0054] Based on the actual grinding fluid output With the ideal output of the grinding fluid The difference between them yields the output difference. ,like If the actual amount of polishing slurry supplied is insufficient for polishing, a replenishment operation is required; based on the actual output of polishing slurry... By reversing the formula, the ideal output volume of the grinding fluid can be obtained. .

[0055] A camera is installed on the casing 3 of the infusion machine at the position corresponding to the mounting plate 20 to acquire image data of the semiconductor wafer, perform grayscale processing on the acquired image data, and divide the grayscale processed image into several grayscale blocks of the same size according to the size of the pixel block. The grayscale blocks are numbered according to the row and column number of the grayscale block in the grayscale image.

[0056] Obtain the grayscale patch at the center of the grayscale image, and then calculate the grayscale value of this patch. Grayscale values ​​are calculated for grayscale blocks with corresponding numbers to standard parts. In comparison, if Not here If the value falls within the fluctuation range, then the grayscale patch is marked as an anomalous patch, and the number of anomalous patches on the grayscale image is counted. According to statistics, if If the image data is found to be abnormal, new image data will be selected for analysis. This is a preset proportional coefficient. This represents the total number of grayscale patches in the grayscale image.

[0057] like exist If the grayscale image is within the fluctuation range, it is determined to be a wafer image. The process is then repeated around the wafer image, stopping when an adjacent position is not a wafer image. After traversing all image blocks, wafer images whose adjacent grayscale images are not wafer images are marked as boundary wafer images. A boundary wafer image is randomly selected, and the traversal of adjacent boundary wafer images continues until the initially selected boundary wafer image is reached, or until a preset number of traversals are reached. If the angle between adjacent boundary wafer blocks is less than a preset angle threshold, the wafer surface at that angle is considered intact; otherwise, a warning is issued and "Wafer surface is incomplete" is displayed on the display screen 4.

[0058] A horizontal line is drawn connecting the midpoints of the boundaries on both sides of the grayscale image. The number of grayscale blocks between the two boundary wafer blocks on the horizontal line and the grayscale image boundary is counted. If the number is equal, the grayscale block is moved up / down by one grayscale block size based on the horizontal line. The same judgment is then performed on the two boundary wafer blocks on the horizontal line after the movement. If the number is not equal, the corresponding two boundary wafer blocks are marked as abnormal, and the horizontal line continues to move.

[0059] If the number of boundary wafer blocks marked with anomalies exceeds , If the total number of boundary blocks is not specified, it is determined that the placement of the boundary wafer blocks is inaccurate, an alarm is issued, and "Wafer placement is inaccurate" is displayed on screen 4 to inform the staff to adjust the position of the semiconductor wafer in time; (When the semiconductor wafer is actively adjusted, the adjustment command is entered on control panel 2 so that the camera draws the horizontal line by the farthest distance between the boundary wafer blocks when drawing the horizontal line)

[0060] Before placing the semiconductor wafer, its length and width are measured along the imaging direction. The perimeter of the ellipse is calculated based on the length and width data, and then converted into the number of grayscale blocks. .

[0061] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor wafer CMP polishing machine with precise slurry spraying, comprising a polishing machine housing (1) horizontally placed on a worktable, a control panel (2) fixedly installed on the front end face of the polishing machine housing (1), a polishing assembly fixedly installed inside the polishing machine housing (1), and a tooling assembly fixedly installed on one side of the top surface of the polishing machine housing (1), characterized in that: The grinding machine housing (1) is fixedly installed with an infusion machine housing (3) on the rear side of the top surface. The infusion machine housing (3) is fixedly installed with a display screen (4) on one side of the front end face. The infusion machine housing (3) is equipped with an infusion component for precise liquid spraying. The control panel (2) is equipped with a grinding fluid control module and a placement status module. The grinding fluid control module is used to establish a fluid dynamics and system efficiency model based on the gear pump volumetric efficiency, pipeline resistance, grinding fluid viscosity and its temperature dependence, calculate the actual grinding fluid output, and achieve precise control of the grinding fluid supply through comparison with the actual demand and feedback adjustment. The placement status module is used to perform grayscale and block processing on the wafer image acquired by the camera, identify the wafer area and detect its surface integrity and placement status. If an abnormality is detected, a corresponding warning is issued through the display screen (4).

2. The semiconductor wafer CMP polishing machine with precise slurry spraying as described in claim 1, characterized in that: The data analysis steps for the slurry control module are as follows: M1: Ideal output of grinding fluid Considering the influence of practical factors, the actual output of the grinding fluid is... , The volumetric efficiency of the gear pump. Flow loss due to pipeline resistance; M2: Compare actual output Compared with theoretical demand The difference ,like If so, it is determined that the supply is insufficient and replenishment is required, and according to... Back-calculation of the required ideal output .

3. The semiconductor wafer CMP polishing machine with precise slurry spraying as described in claim 1, characterized in that: The data analysis steps for the placement status module are as follows: N1: Acquire a wafer image and perform grayscale conversion and block segmentation, dividing the image into several equal-sized grayscale blocks; select the central block and set its grayscale value. Compared with standard gray values If the comparison exceeds the standard range, it is marked as an abnormal block; if the number of abnormal blocks is... satisfy If the image is found to be abnormal, it will be re-acquired. This is a preset proportional coefficient. This represents the total number of map tiles; N2: Traverse from the center wafer block outwards, identify all wafer blocks, and mark the boundary wafer blocks; traverse the boundary wafer blocks, analyze the geometric relationship between adjacent blocks, and if the included angle between adjacent blocks is less than the preset angle threshold, the wafer surface is determined to be complete; otherwise, an incomplete surface warning is output. N3: Draw horizontal reference lines, count the distance differences between boundary wafer blocks and image boundaries, and determine whether the wafer is centered; if the number of abnormal boundary blocks exceeds... If the placement is incorrect, a warning message will be output. This represents the total number of boundary blocks.

4. The semiconductor wafer CMP polishing machine with precise slurry spraying as described in claim 1, characterized in that: The data preprocessing steps for the slurry control module are as follows: Q1: Sort the collected data according to the collection time, and sort the corresponding items collected at the same time. averaging the data and standard deviation The calculation, and the mean obtained from the calculation. and standard deviation Collect data fluctuation range for corresponding items The system is configured to compare the collected data for a given item with its fluctuation range, mark data outside the fluctuation range as outliers, and record the number of outliers. ; Q2: If If the collected data is abnormal, the data will be re-tested; if If outliers are removed, the mean of the remaining corresponding test data after outlier removal is calculated. The calculation, and the mean obtained from the calculation. This serves as the corresponding data detected at the corresponding time.

5. The semiconductor wafer CMP polishing machine with precise slurry spraying as described in claim 1, characterized in that: The grinding assembly includes a mounting bracket (5) fixedly installed inside the grinding machine housing (1). A motor (6) is fixedly installed on one side of the mounting bracket (5). A drive pulley (7) is coaxially fixed to the rotating end of the motor (6). The drive pulley (7) is connected to a driven pulley (8) on the other side via a belt. The driven pulley (8) is coaxially fixed to the spline shaft.

6. The semiconductor wafer CMP polishing machine with precise slurry spraying as described in claim 5, characterized in that: The spline shaft is horizontally rotatably connected to the mounting bracket (5). A worm gear (9) is fixedly installed on the mounting bracket (5). A worm (10) is meshed on one side of the worm gear (9). The worm (10) is vertically rotatably connected to the mounting bracket (5). A rotating disk (11) is fixedly connected to the upper end of the worm (10). A grinding disk (12) is fixedly installed on the rotating disk (11).

7. The semiconductor wafer CMP polishing machine with precise slurry spraying as described in claim 1, characterized in that: The infusion assembly includes a storage tank (13) fixedly installed above the infusion machine housing (3), and a gear pump (14) is connected to one side of the storage tank (13). The gear pump (14) is fixedly installed inside the infusion machine housing (3).

8. A semiconductor wafer CMP polishing machine with precise slurry spraying as described in claim 7, characterized in that: The output end of the gear pump (14) is connected to the flow meter (15), and the other end of the flow meter (15) passes through the casing (3) of the infusion machine and is connected to the extension tube (16).

9. A semiconductor wafer CMP polishing machine with precise slurry spraying as described in claim 1, characterized in that: The tooling assembly includes a mounting column (17) that is vertically fixed on the rear side of the top surface of the grinding machine housing (1), and an adjustment bracket (18) is fitted on the outer side of the mounting column (17).

10. A semiconductor wafer CMP polishing machine with precise slurry spraying as described in claim 9, characterized in that: A hydraulic rod (19) is installed on the other end of the adjustment frame (18), and an installation plate (20) is fixedly installed on the lower end of the hydraulic rod (19).

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