Thin copper material ceramic spraying pretreatment method and thin copper material ceramic spraying method

Abstract

The invention relates to the technical field of product surface treatment, in particular to a thin copper material ceramic spraying pretreatment method and a thin copper material ceramic spraying method.The thin copper material ceramic spraying pretreatment method comprises the steps that after a thin copper material is subjected to punch forming, cleaning is conducted, and a workpiece to be treated is obtained; and an included angle between a nozzle of nano sand blasting equipment and the to-be-treated workpiece is controlled, and the to-be-treated workpiece is subjected to sand blasting treatment through nano sand, so that the thin copper material ceramic spraying pretreatment is completed. The nano sand blasting process is utilized, and the included angle between the nozzle of the nano sand blasting equipment and the to-be-treated workpiece is controlled, so that the profile tolerance of the to-be-treated workpiece can be kept, and the adhesive force requirement of the product after high-temperature aging can be met; in addition, the internal stress generated by product sand blasting can be reduced to the maximum extent by adopting the pretreatment method, and high-temperature baking deformation of a post-process is avoided; in addition, by means of the pretreatment method, the product surface roughening effect can be achieved, the paint spraying adhesive force is effectively increased, and the test specification is achieved.

Description

Technical Field

[0001] This invention relates to the field of product surface treatment technology, and in particular to a pretreatment method for thin copper ceramic coating and a method for thin copper ceramic coating. Background Technology

[0002] When processing thin copper materials, traditional sandblasting processes are prone to a series of unavoidable defects due to the soft texture, low strength, and small thickness of copper itself, as well as uneven surface treatment caused by the impact of sandblasting. The most prominent problems are stress deformation, dimensional deviations, surface damage, and insufficient adhesion of ceramic coatings.

[0003] Conventional sandblasting uses abrasive particles with a relatively large particle size and high blasting pressure. The high-speed impact introduces large residual tensile stress into the thin copper surface and interior. This stress is unevenly distributed in the thickness direction, which directly causes the copper material to warp, waviness, and reduced flatness. This is especially noticeable in ultra-thin copper foils, strips, or precision copper parts with a thickness of less than 0.35mm. In severe cases, it can cause the workpiece to exceed the dimensional accuracy and become unassembleable. Furthermore, during the subsequent thermal cycling process of ceramic spraying, the stress release can further aggravate deformation and coating cracking.

[0004] Meanwhile, traditional sandblasting easily causes over-etching, localized pits, and scratches of varying depths on the copper surface, damaging the original uniform microstructure of the copper. This not only reduces the effective thickness and structural strength but also results in excessively high surface roughness in some areas and uneven overall surface roughness, making it impossible to form a stable and uniform mechanical interlocking interface. This irregular surface leads to uneven droplet spreading and weak interfacial bonding during ceramic spraying, ultimately resulting in significantly insufficient coating adhesion and making it prone to failure phenomena such as localized peeling, flaking, and delamination.

[0005] Furthermore, traditional sandblasting can easily cause problems such as abrasive embedding, residual contaminants, and accelerated localized oxidation on thin, soft copper surfaces. Abrasive particles pressed into the copper substrate can form interfacial impurity points, significantly weakening the bonding strength between the copper and the ceramic coating. Insufficient surface cleanliness and activation can further reduce interfacial adhesion, making it difficult to meet the interface reliability requirements of high-end ceramic coatings.

[0006] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0007] In view of the shortcomings of the prior art, the purpose of this invention is to provide a pretreatment method for thin copper ceramic coating and a thin copper ceramic coating method, which aims to solve the problems of stress deformation and insufficient coating adhesion caused by existing pretreatment methods for thin copper ceramic coating.

[0008] The technical solution of the present invention is as follows: A method for pretreatment of thin copper ceramic coating, comprising the following steps: After the thin copper material is stamped and formed, it is cleaned to obtain the workpiece to be processed; By controlling the angle between the nozzle of the nano-blasting equipment and the workpiece to be treated, the workpiece is blasted with nano-abrasive material to complete the pretreatment of thin copper ceramic coating.

[0009] The aforementioned method for pretreatment of thin copper ceramic coating, wherein the thickness of the thin copper material is between 0.15mm and 0.35mm.

[0010] In the aforementioned method for pretreatment of thin copper ceramic coating, the angle between the nozzle of the nano-blasting equipment and the surface of the workpiece to be treated is 10°-20°.

[0011] The aforementioned method for pretreatment of thin copper ceramic coating, wherein the distance between the nozzle of the nano-blasting equipment and the workpiece to be treated is 12cm-15cm.

[0012] The aforementioned method for pretreatment of thin copper ceramic coating, wherein the nano-abrasive material includes at least one of 300#-400# white corundum sand, 300#-400# glass beads, 320#-400# silicon carbide, and 300#-600# ceramic sand.

[0013] The aforementioned pretreatment method for thin copper ceramic coating, wherein the nozzle orifice diameter is 1mm-2mm.

[0014] The aforementioned pretreatment method for thin copper ceramic coating, wherein the sandblasting pressure during sandblasting is 1 kgf / cm². 2 -2Kgf / cm 2 .

[0015] A method for ceramic coating of thin copper materials, comprising the following steps: After preheating the product treated by the aforementioned thin copper ceramic spraying pretreatment method, a base oil spraying and surface drying treatment are performed to obtain a base oil sprayed part. After preheating the base oil-coated part, it undergoes top oil spraying and baking to complete the thin copper ceramic coating.

[0016] The thin copper ceramic spraying method wherein the preheating temperature is 40℃-50℃; the surface drying temperature is 120℃-150℃; and the surface drying time is 10min-20min.

[0017] In the thin copper ceramic spraying method, the baking temperature is 220℃-250℃ and the baking time is 30min-45min.

[0018] Beneficial Effects: This invention provides a pretreatment method for thin copper ceramic coating and a method for thin copper ceramic coating. The pretreatment method for thin copper ceramic coating includes the following steps: after stamping and forming a thin copper material, it is cleaned to obtain a workpiece to be treated; controlling the angle between the nozzle of the nano-blasting equipment and the workpiece to be treated, the workpiece is sandblasted using nano-abrasive material to complete the pretreatment of the thin copper ceramic coating. This invention utilizes nano-blasting technology, and by controlling the angle between the nozzle of the nano-blasting equipment and the workpiece to be treated, the contour of the workpiece can be maintained, and the adhesion requirements after high-temperature aging of the product can be met; furthermore, this pretreatment method can minimize the internal stress generated by sandblasting, avoiding deformation during subsequent high-temperature baking; in addition, this pretreatment method can roughen the surface of the product, effectively increasing the adhesion of the paint and meeting the test specifications. Attached Figure Description

[0019] Figure 1 This is a process flow diagram of a pretreatment method for ceramic spraying of thin copper material according to the present invention; Figure 2 The image shows the results of a high-temperature aging test on a workpiece coated with a ceramic layer, as described in Example 1. Figure 3 The image shows the adhesion test results of the workpiece with a ceramic coating in Example 1 after high-temperature aging. Figure 4 This is a test diagram for deformation measurement in Example 1; Figure 5 The image shows the adhesion test results before high-temperature aging in Comparative Example 1. Figure 6 The image shows the adhesion test results after high-temperature aging for Comparative Example 1. Figure 7 The image shows the deformation of the product after ordinary sandblasting, as shown in Comparative Example 2. Detailed Implementation

[0020] This invention provides a pretreatment method for thin copper ceramic coating and a method for thin copper ceramic coating. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention is further described in detail below. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0021] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0022] like Figure 1 As shown, the present invention provides a pretreatment method for thin copper ceramic coating, including the following steps: Step S10: After the thin copper material is stamped and formed, it is cleaned to obtain the workpiece to be processed; Step S20: Control the angle between the nozzle of the nano-blasting equipment and the workpiece to be treated, and use nano-abrasive to blast the workpiece to be treated to complete the pretreatment of thin copper ceramic coating.

[0023] In this embodiment, by utilizing nano-blasting technology and controlling the angle between the nozzle of the nano-blasting equipment and the workpiece to be treated, the contour of the workpiece can be maintained, and the adhesion requirements after high-temperature aging of the product can be met. Furthermore, this pretreatment method can minimize the internal stress generated by sandblasting and avoid deformation during high-temperature baking in subsequent processes. In addition, this pretreatment method can roughen the surface of the product, effectively increasing the adhesion of the paint and meeting the test specifications.

[0024] Specifically, this invention employs nano-blasting to pre-treat the surface of a thin copper stamped workpiece. By precisely controlling the spray angle between the nozzle and the workpiece surface in the nano-blasting equipment, internal stress is reduced and ceramic coating adhesion is improved through material surface modification and interfacial bonding mechanisms. Nano-blasting uses fine abrasive particles to act on the copper surface in a low-energy, high-density manner, uniformly etching and activating only the surface micro-areas. This avoids the localized strong impact and deep plastic deformation caused by traditional coarse blasting, thereby significantly reducing residual stress inside the thin copper and suppressing workpiece warping and deformation. Furthermore, nano-blasting has a low impact force on the thin copper material and generates low internal stress, effectively protecting the structural stability of the product and preventing deformation due to stress release during subsequent high-temperature processes. By optimizing the spray angle of the nozzle and nano-blasting, the nano-abrasive particles act on the thin copper surface at a reasonable incident angle, ensuring surface cleanliness and activation while forming a uniform and regular micro-nano-level rough morphology, increasing the effective interfacial bonding area and improving surface energy. Nanoblasting can roughen the surface of thin copper materials, effectively enhancing paint adhesion and meeting testing standards. Therefore, this pretreatment method for ceramic coating of thin copper materials can eliminate surface oxide layers and weak interface layers, constructing a stable and reliable mechanical bonding and physical adsorption interface, thereby significantly improving the bonding strength between the ceramic coating and the copper substrate, and enhancing coating adhesion and reliability.

[0025] In some embodiments, the thickness of the thin copper material is between 0.15mm and 0.35mm. Controlling the thickness of the thin copper material between 0.15mm and 0.35mm, combined with the pretreatment method for ceramic coating of the thin copper material, can minimize the internal stress generated by sandblasting and avoid deformation during subsequent high-temperature baking. Furthermore, this pretreatment method can roughen the product surface, effectively increasing the adhesion of the paint and meeting test specifications.

[0026] In a preferred embodiment, the thickness of the thin copper material is 0.2 mm. The product structure is relatively weak after the thin copper material is formed. The pretreatment of the paint using nano sandblasting process can minimize the internal stress generated by sandblasting, avoid deformation caused by high temperature baking in the subsequent process, and achieve the effect of roughening the product surface, effectively increasing the adhesion of the paint and meeting the test specifications.

[0027] In some embodiments, step S10, the step of stamping the thin copper material, includes: Step S11, Coil feeding and leveling: The coiled thin copper material is conveyed to the stamping line through an automatic feeding mechanism. The multi-roller leveling device eliminates the bending stress and wave deformation generated during the winding process of the copper material, ensuring the flatness and dimensional stability of the sheet material, and providing a uniform blank for subsequent stamping. Step S12, Surface Cleaning and Pretreatment: The surface of the leveled thin copper material is cleaned and degreased to remove surface oil, dust and slight oxide layer, so as to avoid impurities causing scratches, scratches or dimensional deviations during the stamping process, and at the same time improve the interface bonding quality of subsequent nano-sandblasting and ceramic spraying. Step S13, Precise Positioning and Feeding: The thin copper material is precisely fed to the stamping station according to the set step distance through the servo feeding mechanism. With the help of positioning pins, guide grooves and clamping mechanisms, the thin copper material is quickly positioned and fixed to prevent deviation and movement during the stamping process and ensure forming accuracy. Step S14, Pre-pressing and shallow stretching: Before the main forming process, the thin copper material is pre-pressed with a lower pressure to make it initially fit the mold cavity and release local stress; then shallow stretching is performed, and the stamping speed and blanking force are controlled so that the thin copper material gradually undergoes plastic deformation under uniform stress, avoiding cracking, wrinkling or local thinning due to stress concentration. Step S15, Finishing and Shaping: The workpiece after stamping is finished in dimensions. The edges, rounded corners and flatness are corrected by shaping molds, and springback deformation is corrected to ensure that the workpiece’s external dimensions, positional accuracy and surface flatness meet the requirements of assembly and subsequent surface treatment. Step S16, Trimming and Blanking: Trim, punch and blank the molded part according to the product design dimensions, remove process waste and obtain the final shape of thin copper molded part. The trimming process ensures that the cross-section is smooth and burr-free to avoid stress concentration. Step S17, Unloading and Stress Relief Treatment: The formed copper parts are unloaded smoothly to avoid collision and deformation. Low-temperature stress relief treatment is performed according to the material thickness and forming complexity to further eliminate residual stress generated during the stamping process, improve the dimensional stability of the workpiece, and provide a stable and reliable substrate for subsequent nano-blasting and ceramic coating processes.

[0028] In some embodiments, in step S10, the workpiece after the thin copper material is stamped is inspected, and after confirming that the workpiece is qualified, a cleaning process is performed to remove impurities and surface oil from the workpiece surface to obtain the workpiece to be processed.

[0029] In some embodiments, before controlling the angle between the nozzle of the nanoblasting equipment and the workpiece to be treated in step S20, the worktable is cleaned, the sandblasting machine is inspected, and then the nanoblasting equipment and dust collector are started.

[0030] Specifically, before performing nano-blasting, the components and operating status of the blasting machine are inspected and confirmed. This allows for the timely elimination of potential problems such as equipment malfunctions, pipeline blockages, unstable pressure, and uneven abrasive supply, ensuring a stable and reliable nano-blasting process and preventing uneven surface treatment, abnormal stress, or localized damage to thin copper materials due to equipment failure. Subsequently, the nano-blasting equipment and dust collector are started sequentially, allowing the blasting operation and dust collection to run synchronously. This enables the rapid removal of fine abrasive particles, copper powder, and dust generated while the nano-abrasive impacts the surface of the workpiece, effectively preventing secondary pollution caused by dust adhering to the workpiece surface. This ensures the surface cleanliness and activation state of the workpiece, thereby improving the bonding stability between the subsequent ceramic coating and the substrate. At the same time, it reduces the impact of dust on equipment precision and the working environment, improving the continuity, safety, and processing quality of the nano-blasting process.

[0031] In some embodiments, the angle between the nozzle of the nanoblasting equipment and the surface of the workpiece to be treated is 10°-20°. Nanoblasting is used to pre-treat the surface of a thin copper stamped workpiece. By precisely controlling the spray angle between the nozzle and the workpiece surface, internal stress is reduced and the adhesion of the ceramic coating is improved through material surface modification and interfacial bonding mechanisms. By optimizing the spray angle between the nanoblasting equipment and the nozzle, the nano-abrasives act on the surface of the thin copper material at a reasonable incident angle. This ensures surface cleanliness and activation while forming a uniform and regular micro-nano-level rough morphology, increasing the effective interfacial bonding area and improving surface energy. In other words, nanoblasting can achieve a surface roughening effect on thin copper materials, effectively enhancing paint adhesion and meeting testing standards.

[0032] In a preferred embodiment, the angle between the nozzle of the nanoblasting equipment and the surface of the workpiece to be treated is 15°. This method of pretreatment for thin copper ceramic coating by adjusting the angle between the nozzle and the surface of the workpiece can eliminate the surface oxide layer and weak interface layer, constructing a stable and reliable mechanical bonding and physical adsorption interface, thereby significantly improving the bonding strength between the ceramic coating and the copper substrate, and enhancing coating adhesion and reliability.

[0033] In some embodiments, the distance between the nozzle of the nanoblasting equipment and the workpiece to be treated is 12cm-15cm. Controlling the distance between the nozzle of the nanoblasting equipment and the workpiece to be treated allows the nano-abrasive to have a stable and moderate spraying function when it reaches the surface of the workpiece, ensuring the uniformity of surface treatment while avoiding excessive impact on the thin copper workpiece. Within this distance range, the divergence of the nano-abrasive stream is moderate, which can form a uniform micro-nano rough structure on the workpiece surface, achieving a stable surface activation and roughening effect, and providing reliable interface conditions for subsequent ceramic spraying.

[0034] Specifically, an appropriate sandblasting distance can avoid problems such as localized stress concentration, material deformation, and surface over-etching caused by concentrated kinetic energy due to close distance. It can also prevent problems such as insufficient impact force of nano-abrasives, inadequate surface activation, and decreased coating adhesion caused by excessive distance. By controlling the sandblasting distance to 12cm-15cm, the consistency and controllability of the surface treatment of thin copper materials can be significantly improved, residual stress can be effectively reduced, and the bonding strength and overall reliability between the ceramic coating and the copper substrate can be improved.

[0035] In a preferred embodiment, the distance between the nozzle of the nano-blasting device and the workpiece to be treated is 13cm, which enables the nano-abrasive to have a stable and moderate spraying function when it reaches the surface of the workpiece, ensuring the uniformity of surface treatment while avoiding excessive impact on the thin copper workpiece. At this distance, the divergence of the nano-abrasive is moderate, which can form a uniform micro-nano rough structure on the surface of the workpiece, achieving a stable surface activation and roughening effect, and providing reliable interface conditions for subsequent ceramic spraying.

[0036] In some embodiments, the nano-abrasive includes at least one of 300#-400# white corundum sand, 300#-400# glass beads, 320#-400# silicon carbide, and 300#-600# ceramic sand. Using the above-mentioned nano-abrasive to sandblast the workpiece can achieve a combined effect of surface cleaning, activation, and micro-roughening while ensuring that the thin copper material does not deform.

[0037] Specifically, the 300#-400# white corundum abrasive has moderate cutting force, effectively removing the oxide layer to form a uniform rough surface and improving surface adhesion; the 300#-400# glass beads are soft and have gentle impact, achieving surface leveling and activation while minimizing substrate stress, significantly reducing the risk of warping and deformation of thin copper; the 320#-400# silicon carbide has high hardness, achieving sufficient interface roughness under lower pressure, which is beneficial for improving the bonding strength of ceramic coatings; the 300#-600# ceramic abrasive particles are uniform and have regular morphology, forming a stable and controllable micro-nano-level rough structure, resulting in higher interface bonding and uniform stress distribution. By rationally selecting the above abrasives and matching the corresponding particle size, while meeting the requirements of anti-deformation and low stress for thin copper materials, the surface activity and ceramic coating adhesion can be significantly improved, ensuring stable and reliable subsequent spraying quality.

[0038] In a preferred embodiment, the nano-sand material is micro-400# white corundum sand.

[0039] In some embodiments, the nano-blasting equipment is equipped with a nano-abrasive tank. The nano-abrasive content in the tank is maintained between 1 / 3 and 2 / 3 of the tank capacity, and replenished in a timely manner. This ensures that the abrasive is in a stable fluidized and continuously conveyed state during the blasting process, avoiding abrasive compaction, bridging, poor discharge, or pressure fluctuations due to excessively high material levels. Simultaneously, it prevents air intake short circuits, intermittent abrasive discharge, and unstable spray pressure due to excessively low material levels. This material level control allows the nano-abrasive to be supplied to the nozzle at a uniform and stable flow rate, ensuring that the surface of the thin copper material receives continuous and consistent micro-impact. This avoids surface roughness differences, localized stress concentration, or deformation problems caused by uneven abrasive discharge, thereby improving the uniformity and stability of the blasting process. Furthermore, a stable abrasive content reduces equipment start-up and shutdown and parameter fluctuations, maintaining a dynamic balance between the blasting system pressure and abrasive output. This is beneficial for forming a uniform and clean micro-nano rough interface, providing reliable surface conditions for subsequent ceramic coating, and improving coating adhesion and overall process reliability.

[0040] In some embodiments, the nozzle orifice diameter is 1mm-2mm. Controlling the nozzle orifice diameter within this range allows the airflow and abrasive to form a stable, concentrated jet stream with moderate impact force, particularly suitable for the low-stress, high-precision surface treatment requirements of thin copper materials. This orifice diameter range ensures a balance between airflow velocity and abrasive supply, preventing stress concentration, deformation, or over-etching of the thin copper material due to excessively small orifice diameter, or insufficient orifice diameter leading to dispersed jet energy and insufficient roughening, thus affecting surface activation and coating adhesion. A stable and uniform jet stream allows the nano-abrasive to act on the copper surface with consistent kinetic energy, forming a clean, activated interface with uniform roughness and no localized damage. This helps reduce residual stress in the substrate and improves the bonding strength of subsequent ceramic coatings, while ensuring the process stability and reproducibility of the entire treatment process.

[0041] In a preferred embodiment, the nozzle has an orifice diameter of 1.2 mm.

[0042] In some embodiments, the sandblasting pressure is 1 kgf / cm². 2 -2Kgf / cm 2 The pressure is approximately 0.09 MPa to 0.2 MPa. By synergistically controlling the blasting pressure of nano-blasting, the abrasive can act on the surface of thin copper materials with stable, gentle, and uniform kinetic energy, achieving precise control over the surface roughness and the stress state of the substrate. By reasonably matching the abrasive output and air pressure, excessive local impact, plastic deformation, and increased residual internal stress caused by excessive pressure or output can be avoided, thereby effectively suppressing problems such as warping and deformation of thin copper materials and ensuring the dimensional accuracy and structural stability of the workpiece. At the same time, stable process parameters can ensure that a uniform micro-nano-level rough morphology is formed on the copper surface, achieving sufficient surface cleaning and activation, increasing the interfacial bonding area and surface energy, and providing a reliable bonding foundation for subsequent ceramic spraying. By finely controlling the abrasive output and air pressure, the consistency and repeatability of the blasting process can be significantly improved, the risk of stress concentration can be reduced, the mechanical interlocking and interfacial bonding strength between the ceramic coating and the copper substrate can be enhanced, and the overall product reliability and service life can be improved.

[0043] In a preferred embodiment, the sandblasting pressure is 1 kgf / cm². 2 It is approximately 0.0981 MPa.

[0044] In some embodiments, the sandblasting process can be achieved with the assistance of a robotic arm; or, the sandblasting process can be achieved by manually holding the workpiece.

[0045] As an example, the sandblasting process is carried out by manually holding the workpiece to be treated, including the following steps: the operator wears protective equipment, inserts both hands into the operating port inside the chamber, and monitors the operation through the observation window. After preparation, the operator presses the foot switch to start sandblasting, maintaining a distance of about 12cm-15cm between the nozzle and the workpiece, rotating the workpiece in a uniform manner, starting from one side corner of the workpiece, first the four sides and then the top surface, maintaining an angle of about 15 degrees with the direction of the nozzle.

[0046] In some embodiments, in step S20, after the workpiece to be treated is sandblasted with nano-abrasive, the surface of the product is cleaned with an air gun to ensure that it is clean and free of residue before being placed on a tray, with each layer of bubble wrap separating it.

[0047] In some embodiments, after the sandblasting treatment, the surface roughness of the sandblasted product is between Ra 0.15 μm and Ra 0.30 μm. By optimizing the nano-sandblasting and nozzle spray angle, the nano-abrasive material acts on the surface of the thin copper material at a reasonable incident angle. This ensures surface cleanliness and activation while forming a uniform and regular micro-nano-level rough morphology with a surface roughness between Ra 0.15 μm and Ra 0.30 μm. This increases the effective bonding area at the interface and improves the surface energy, effectively enhancing the adhesion of the paint and meeting the testing standards.

[0048] In addition, the present invention also provides a method for ceramic spraying thin copper materials, comprising the following steps: Step S100: After preheating the product treated by the thin copper ceramic spraying pretreatment method, the product is then coated with primer and surface dried to obtain a primer-coated part. Step S200: After preheating the base oil sprayed part, the thin copper ceramic spraying is completed after top oil spraying and baking.

[0049] In this embodiment, the product obtained by the thin copper ceramic pretreatment method is subjected to ceramic spraying treatment. Since the thin copper ceramic pretreatment method can minimize the internal stress generated by sandblasting, avoid deformation caused by high temperature baking in the subsequent process, and achieve the effect of roughening the product surface, it can effectively increase the adhesion of the paint. As a result, the product obtained by the thin copper ceramic spraying method can meet the adhesion standard after aging test, and the outline is stable and there is no stress deformation.

[0050] In some embodiments, in step S100, the product treated by the thin copper ceramic spraying pretreatment method is wiped clean with a lint-free cloth and then neatly placed on a steel mesh before being preheated.

[0051] In some embodiments, the preheating temperature is 40℃-50℃. This preheating ensures that the product treated by the thin copper ceramic coating pretreatment method reaches a temperature of 40-50℃ before primer coating. Preheating before ceramic coating effectively removes adsorbed moisture and residual humidity from the product surface, preventing defects such as pores, pinholes, and cracks caused by rapid vaporization during coating, thus improving the density of the ceramic coating. Simultaneously, preheating reduces the temperature difference between the thin copper substrate and the primer coating, lowering thermal stress caused by the difference in their coefficients of thermal expansion, inhibiting warping and peeling during cooling, and enhancing the bonding strength between the coating and the substrate. Furthermore, preheating further activates the thin copper surface, increasing surface energy and enhancing the wettability and spreadability of ceramic droplets on the substrate surface, resulting in a more robust and reliable coating bond, thereby ensuring the forming quality and stability of the ceramic coating.

[0052] In a preferred embodiment, the preheating temperature is 45°C; that is, the product treated by the thin copper ceramic spraying pretreatment method is preheated to 45°C.

[0053] In some embodiments, the surface drying treatment temperature is 120℃-150℃, and the surface drying treatment time is 10min-20min. Performing the surface drying treatment at this temperature and time allows the solvent in the primer coating to fully evaporate, preventing residual solvent from rapidly vaporizing under the high temperature of subsequent ceramic spraying, thus avoiding defects such as bubbles, pinholes, and coating blistering. Simultaneously, it allows the primer to form a uniform, dense, and sufficiently strong transition film. Appropriate surface drying temperature and time ensure that the primer fully wets the surface of the thin copper substrate, improving interfacial adhesion and providing a stable and reliable intermediate bonding interface for the subsequent ceramic coating. This effectively enhances the adhesion between the ceramic coating and the copper substrate, reduces the risk of coating peeling and cracking, and improves the structural stability and reliability of the overall composite coating.

[0054] In a preferred embodiment, the surface drying treatment is performed at a temperature of 140°C for 10 minutes.

[0055] In some embodiments, the baking temperature is 220℃-250℃, and the baking time is 30min-45min. Baking allows the topcoat coating to fully cross-link and cure, improving its density, hardness, and adhesion. This temperature and time range effectively removes residual solvents and small molecules from the coating, preventing defects such as blistering, pinholes, and cracking under high-temperature conditions, while also improving the coating's temperature resistance, corrosion resistance, and wear resistance. A suitable baking process enhances the interfacial bonding between the topcoat, the undercoat, and the copper substrate, making the overall coating structure more stable, thereby ensuring the product's reliability and service life during subsequent use.

[0056] The following examples further illustrate the present invention in detail. It should also be understood that the following examples are only for further explanation of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-essential improvements and adjustments made by those skilled in the art based on the above description of the present invention are within the scope of protection of the present invention.

[0057] Example 1 This embodiment tests the performance of the product obtained after pretreatment and thin copper ceramic coating. The specific steps are as follows: The workpiece is formed by stamping with a thin copper material with a thickness of 0.2mm. After passing the inspection, it is cleaned to obtain the workpiece to be processed. Clean the workbench, inspect the sandblasting machine, and then start the nano-sandblasting equipment and dust collector. Pour 400# white corundum sand (Al2O3) into the sand tank, maintaining the sand level between 1 / 3 and 2 / 3 of the tank's capacity, and replenish the sand as needed. Use a 1.2mm nozzle orifice, and adjust the sand output and air pressure (1 kgf / cm² = 0.0981 MPa). After confirming the workpiece surface is free of dirt / oil, the operator dons protective gear, inserts both hands into the operating port inside the chamber, and monitors the operation through the observation window. Once ready, press the foot switch to begin sandblasting, maintaining a distance of approximately 13cm between the nozzle and the workpiece. Rotate the workpiece evenly, starting from one corner, then the perimeter and finally the top, moving at approximately a 15-degree angle to the nozzle direction. After sandblasting, use an air gun to clean the surface of the product, ensuring it is clean and free of residue, and then place it on a tray, separating each layer with bubble wrap. The surface roughness of the product after sandblasting is between Ra0.15μm and Ra0.30μm.

[0058] After sandblasting, wipe the products clean with a lint-free cloth and arrange them neatly on the steel mesh. Preheat to 40-50℃ and place the products on the A-line platform for primer spraying. After primer spraying, place the products on the surface drying line and cover them. Set the temperature to 140℃ for 10 minutes. After the primer is surface dry, place the products on the preheating line. When the workpiece temperature reaches 40-50℃, place the preheated products on the B-line spraying machine platform for topcoat spraying. After spraying both layers of oil, the conveyor line automatically enters the high-temperature baking stage at 230℃ for 45 minutes. After baking, the products (workpieces with ceramic coating) are neatly placed on the turnover rack.

[0059] Product reliability testing was performed on workpieces coated with a ceramic layer, including high-temperature aging testing and adhesion testing after high-temperature aging; the workpiece was continuously maintained at a high temperature of 230°C for 160 hours, and the results were as follows. Figure 2As shown, the product surface is free of bubbles and paint peeling defects. Using a cross-cutting tool, a 100×100mm rectangular grid of 2×2mm was cut into the product surface after high-temperature aging. The surface was then cleaned with a brush. 3M 610 transparent tape was applied to the grid, pressed firmly with the fingers, and then quickly and steadily pulled up at an angle greater than 90° (Grade 3B). The result is as follows. Figure 3 As shown, the product adhesion test showed that no more than 5% of the coating peeled off, so it was deemed OK.

[0060] Deformation of the sandblasted product was measured using an LJ-S080 profile tester. The product was fixed on a fixture and tested perpendicular to the product. The test drawing is as follows. Figure 4 As shown in the figure, the test results for the four locations (A, B, C, D) specified on the test drawing are shown in Table 1.

[0061] Table 1

[0062] Comparative Example 1 This comparative example provides a laser-etched grid ceramic coating product, which uses laser-engraved roughened thin copper material, followed by ceramic coating; the ceramic coating process is the same as in Example 1.

[0063] The laser-coated ceramic coating product of Comparison 1 will undergo DOE verification, including: Adhesion testing was conducted on laser-coated ceramic products. A 100×100mm rectangular grid of 2×2mm was cut into the product surface using a cross-cutting tool. The surface was then cleaned with a brush. 3M 610 transparent tape was applied to the grid, pressed firmly with fingers, and then quickly and steadily pulled off at an angle greater than 90° (Grade 3B). The adhesion test results before high-temperature aging are as follows: Figure 5 As shown, the result is OK; the adhesion test results after high-temperature aging are as follows. Figure 6 As shown, it is determined to be NG.

[0064] Comparative Example 2 This comparative example provides a conventional sandblasted product, which undergoes ceramic coating after conventional sandblasting. The ceramic coating process is the same as in Example 1; the results are as follows. Figure 7 As shown, the product is severely deformed after ordinary sandblasting, exceeding the specifications.

[0065] In summary, this invention provides a pretreatment method and a ceramic coating method for thin copper materials. The pretreatment method for thin copper materials includes the following steps: after stamping and forming a thin copper material, it is cleaned to obtain a workpiece to be treated; controlling the angle between the nozzle of a nano-blasting device and the workpiece to be treated, and using nano-abrasive to blast the workpiece to be treated, thus completing the pretreatment of the thin copper material for ceramic coating. This invention utilizes nano-blasting technology, and by controlling the angle between the nozzle of the nano-blasting device and the workpiece to be treated, the contour of the workpiece to be treated can be maintained, and the adhesion requirements after high-temperature aging of the product can be met; furthermore, this pretreatment method can minimize the internal stress generated by sandblasting of the product, avoiding deformation during subsequent high-temperature baking; in addition, this pretreatment method can achieve a roughening effect on the product surface, effectively increasing the adhesion of the paint and meeting the test specifications.

[0066] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A method for pretreatment of thin copper ceramic coating, characterized in that, Including the following steps: After the thin copper material is stamped and formed, it is cleaned to obtain the workpiece to be processed; By controlling the angle between the nozzle of the nano-blasting equipment and the workpiece to be treated, the workpiece is blasted with nano-abrasive material to complete the pretreatment of thin copper ceramic coating.

2. The pretreatment method for thin copper ceramic coating according to claim 1, characterized in that, The thickness of the thin copper material is between 0.15mm and 0.35mm.

3. The pretreatment method for thin copper ceramic coating according to claim 1, characterized in that, The angle between the nozzle of the nano-blasting equipment and the surface of the workpiece to be treated is 10°-20°.

4. The pretreatment method for thin copper ceramic coating according to claim 1, characterized in that, The distance between the nozzle of the nano-blasting equipment and the workpiece to be treated is 12cm-15cm.

5. The pretreatment method for thin copper ceramic coating according to claim 1, characterized in that, The nano-abrasive material includes at least one of 300#-400# white corundum sand, 300#-400# glass beads, 320#-400# silicon carbide, and 300#-600# ceramic sand.

6. The pretreatment method for thin copper ceramic coating according to claim 1, characterized in that, The nozzle has an orifice diameter of 1mm-2mm.

7. The pretreatment method for thin copper ceramic coating according to claim 1, characterized in that, The sandblasting pressure for the sandblasting treatment is 1 kgf / cm. 2 -2Kgf / cm 2 .

8. A method for ceramic spraying thin copper material, characterized in that, Including the following steps: After preheating the product treated by the pretreatment method for thin copper ceramic spraying according to any one of claims 1-7, a base oil spraying and surface drying treatment are performed to obtain a base oil sprayed part. After preheating the base oil-coated part, it undergoes top oil spraying and baking to complete the thin copper ceramic coating.

9. The method for ceramic spraying thin copper material according to claim 8, characterized in that, The preheating temperature is 40℃-50℃; the surface drying temperature is 120℃-150℃; and the surface drying time is 10min-20min.

10. The method for ceramic spraying thin copper material according to claim 8, characterized in that, The baking temperature is 220℃-250℃, and the baking time is 30min-45min.

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