Test equipment, test device and test method

Abstract

The invention provides test equipment, a test device and a test method. The test equipment comprises a first switch used for a first type of test; the resistive load is used for a second type of test; the electronic load is used for third-class testing; the control module is connected with the plurality of modules and is used for receiving a control signal (used for determining a test type of the tested equipment, and the test type comprises at least one of a first type test, a second type test or a third type test) from an upper computer; and controlling the first switch, the resistive load or the electronic load to be in a working state according to the test type. According to the embodiment of the invention, testing of various working conditions can be realized through one testing device, and all testing requirements of the tested device can be met. Besides, the test equipment can automatically switch different modules in the test equipment as loads of the tested equipment according to test requirements, so that tests under different working conditions can be automatically realized, the test efficiency can be improved, and the test cost can be reduced.

Description

Technical Field

[0001] This application relates to the field of vehicle technology, and more specifically to a testing device, a testing apparatus, and a testing method. Background Technology

[0002] Typically, the overload capacity, short-circuit protection capability, and steady-state operation capability of electronic devices directly determine their safety. Therefore, current testing of electronic devices is crucial. Currently, the loads used for current testing mainly include active electronic loads and passive power loads. However, both types of loads can only be applied to current testing in certain scenarios. In other words, current testing of electronic devices requires the use of multiple different types of loads, which is complex, inefficient, and costly. Summary of the Invention

[0003] This application provides a testing device, a testing apparatus, and a testing method, which helps to improve testing efficiency and reduce testing costs.

[0004] In a first aspect, embodiments of this application provide a testing device, which may include: a first switch for a first type of test; a resistive load for a second type of test; an electronic load for a third type of test; and a control module, wherein the input of the control module is connected to a host computer, and the output of the control module is connected to the first switch, the resistive load, and the electronic load, and the control module is configured to: receive a control signal from the host computer, the control signal being used to determine the test type of the device under test, the test type including at least one of the first type of test, the second type of test, or the third type of test; and control the first switch, the resistive load, or the electronic load to be in a working state according to the test type.

[0005] For example, the above-described test equipment can be used for current testing of vehicle controllers.

[0006] On the one hand, the testing equipment provided in this application, by integrating an electronic load, a resistive load, and a first switch, can perform tests under multiple operating conditions with a single device, helping to meet all the testing requirements of the device under test. On the other hand, the testing equipment can automatically switch its internal modules as loads for the device under test according to testing needs, thereby meeting the testing requirements of different operating conditions. This testing equipment helps reduce manual intervention in the controller testing process, facilitates automated testing procedures, and thus helps reduce operational complexity and improve testing efficiency.

[0007] In some embodiments, the first type of test is a short-circuit test. When the test type is the first type of test, the control module is used to control the first switch to be in the conducting state, and the first switch is connected in series in the output path of the device under test.

[0008] By activating the first switch, a short-circuit condition can be simulated, thereby automatically testing the short-circuit performance of the device under test, such as whether short-circuit protection can be activated and the activation time of short-circuit protection. This is easy to implement and helps improve the safety of the device under test. For example, the first switch can be a relay.

[0009] In some embodiments, the second type of test is a rated test. When the test type is the second type of test, the control module is used to control the resistance value of the resistive load to a first value, and the resistive load is connected to the output terminal of the device under test; wherein, the first value is determined based on the rated voltage and rated current of the device under test.

[0010] By controlling the resistance value of the resistive load to a first value, the rated operating conditions of the device under test can be tested automatically, which helps to improve the reliability of the device under test under rated operating conditions.

[0011] In some embodiments, the resistive load includes: a plurality of power resistors; and a switch array connected to the plurality of power resistors, wherein the connection method of the plurality of power resistors is determined based on the conduction state of the plurality of switches in the switch array; the control module is configured to: control the conduction state of the plurality of switches in the switch array so that the resistance value of the resistive load is the first value.

[0012] By controlling the different conduction states of multiple switches in the switch array, different resistance values ​​of the resistive load can be achieved, which helps to improve the flexibility of testing and meet different testing needs, thereby improving the versatility of the equipment.

[0013] In some embodiments, the power resistor is an aluminum-cased power resistor.

[0014] Because aluminum-cased power resistors offer high precision, low temperature drift, and long-term operational stability, they maintain high accuracy even under prolonged operation and high temperatures, contributing to improved testing accuracy and operational stability. The performance gains of aluminum-cased power resistors are even more pronounced in scenarios with long testing durations. Furthermore, since the casing of this type of resistor is metal, it can be directly mounted on metal structural components, allowing heat conduction through the contact between the casing and the metal structure. This helps reduce heat dissipation costs and improves heat dissipation efficiency.

[0015] In some embodiments, the third type of test is an overload test. When the test type is the third type of test, the control module is used to control the electronic load to be in a working state, and the electronic load is connected to the output terminal of the device under test. The output current of the electronic load is determined based on the overload multiple of the overload test.

[0016] By controlling the operation of the electronic load, overload testing can be performed automatically, which helps improve testing efficiency. Furthermore, the electronic load can perform tests at different overload ratios, thus expanding the applicability of the equipment.

[0017] In some embodiments, the overload test includes tests corresponding to multiple overload multiples. The electronic load includes a control unit and a first electronic device. The output current of the first electronic device is related to the input voltage of the first electronic device. The control unit is used to: sequentially output multiple voltages to the first electronic device, wherein the multiple voltages cause the output current of the first electronic device to be the current corresponding to the multiple overload multiples respectively.

[0018] By determining the output current of the electronic load based on the overload factor, the input voltage of the first electronic device can be determined, thus controlling the output current of the electronic load. Furthermore, this scheme can automatically perform tests at various overload factors, improving testing efficiency.

[0019] In some embodiments, the test device further includes: a channel selection module, wherein the three input terminals of the channel selection module are respectively connected to the first switch, the electronic load, and the resistive load, and the plurality of output terminals of the channel selection module are used to connect to a plurality of the devices under test; the control module is used to control each of the plurality of output terminals to be sequentially connected to the three input terminals of the channel selection module.

[0020] By controlling the connection method of the channel selection module, it is possible to automatically perform tests on a single device under test (DUT) under various operating conditions sequentially, and then sequentially control multiple DUTs to be tested individually. This solution helps to further improve testing efficiency.

[0021] In some embodiments, the test device further includes a data acquisition module connected to the output terminal of the test device, and the data acquisition module is used to acquire at least one of voltage, current or voltage cycle.

[0022] The testing equipment, through its integrated data acquisition module, can automatically acquire various parameters such as voltage, current, or voltage cycle without the need for external sensors or other devices, thus improving testing efficiency.

[0023] Secondly, embodiments of this application provide a testing apparatus, which includes: a cabinet; and testing equipment as described in the first aspect, wherein the testing equipment is installed in the cabinet.

[0024] Installing the test equipment in a rack helps improve the convenience of testing.

[0025] For example, the testing apparatus may include a single test device. Alternatively, the testing apparatus may include multiple test devices, which helps to improve the parallel testing capabilities of the testing apparatus. For example, the number of test devices can be adjusted according to the functions and number of interfaces of the device under test.

[0026] For example, the testing apparatus may also include a drawer unit for placing the device under test for testing purposes.

[0027] For example, the testing apparatus may also include a power control module, a communication module, accessories, etc.

[0028] Thirdly, embodiments of this application provide a testing method that can be applied to a testing device. In this method: a control signal is received from a host computer, the control signal being used to determine the test type of the device under test, the test type including at least one of a first type of test, a second type of test, or a third type of test; according to the test type, a first switch, a resistive load, or an electronic load is controlled to be in an operating state, wherein the first switch is used for the first type of test; the resistive load is used for the second type of test; and the electronic load is used for the third type of test.

[0029] The testing method provided in this application can automatically switch different modules inside the testing equipment as the load of the device under test according to testing requirements, so as to meet the testing needs of different operating conditions. This solution helps to reduce the degree of human intervention in the controller testing process, helps to realize the automated testing process, thereby helping to reduce the complexity of operation and improve testing efficiency.

[0030] Fourthly, embodiments of this application provide a computer program product, which includes a computer program that, when executed by a processor, performs the method described in the third aspect above.

[0031] Fifthly, embodiments of this application provide a computer-readable storage medium storing a computer program, which, when executed, performs the method described in the third aspect above.

[0032] Sixthly, embodiments of this application provide a chip, the chip including: a processor, configured to call and run a computer program from a memory, causing a device equipped with the chip to perform the method described in the third aspect above. Attached Figure Description

[0033] Figure 1 This is a functional schematic diagram of the vehicle 100 provided in an embodiment of this application; Figure 2 Here is a structural block diagram of the test bench 200; Figure 3 This is a schematic diagram of the structure of the test device 300 provided in the embodiments of this application; Figure 4 This is a schematic diagram of the structure of the test device 400 provided in the embodiments of this application; Figure 5 An example diagram of an electronic load 330; Figure 6 An example diagram of a multifunction switcher 410; Figure 7 This is a schematic diagram illustrating the working principle of the multi-function switcher 410. Figure 8 This is a schematic diagram of the structure of the testing device provided in the embodiments of this application; Figure 9 Another schematic diagram of the test apparatus provided in the embodiments of this application; Figure 10 Another schematic diagram of the testing apparatus provided in the embodiments of this application; Figure 11 This is a flowchart illustrating a testing method provided in an embodiment of this application. Detailed Implementation

[0034] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0035] In the description of the embodiments of this application, unless otherwise stated, " / " indicates that the objects before and after are in an "or" relationship. For example, A / B can represent A or B. "And / or" in the embodiments of this application is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone, where A and B can be singular or plural. Furthermore, in the description of the embodiments of this application, unless otherwise stated, "multiple" refers to two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple. Additionally, to facilitate a clear description of the technical solutions of the embodiments of this application, the terms "first" and "second" are used in the embodiments of this application to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the words "first" and "second" do not limit the quantity or the order of execution, and that the words "first" and "second" do not necessarily imply that they are different.

[0036] In the various method embodiments of this application, the order of the sequence numbers does not imply the order of execution. The execution order should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0037] It is understood that in the embodiments of this application, descriptions such as "under the circumstances," "if," "when," and "if..." can be used interchangeably. Furthermore, these descriptions all refer to the corresponding processing that will be carried out under certain objective circumstances, and are not limited to a specific time, nor do they require any judgment action during implementation, nor do they imply any other limitations.

[0038] It is understood that some optional features in the embodiments of this application can be implemented independently in certain scenarios without relying on other features, such as the current solution on which they are based, to solve the corresponding technical problems and achieve the corresponding effects. Alternatively, they can be combined with other features as needed in certain scenarios. Correspondingly, the apparatus given in the embodiments of this application can also implement these features or functions, which will not be elaborated here.

[0039] In this embodiment of the application, "sending information to... (module 1)" can be understood as the destination of the information being module 1, which may include sending information directly or indirectly to module 1. "receiving information from... (module 2)" can be understood as the source of the information being module 2, which may include receiving information directly or indirectly from module 2. Information may undergo necessary processing between the source and destination, such as format changes, but the destination can understand the valid information from the source. Similar expressions in this application can be understood in a similar way, and will not be elaborated further here.

[0040] In the embodiments of this application, unless otherwise specified, the same or similar parts between the various embodiments can be referred to each other. In the various embodiments of this application, and in the various implementation methods / methods / implementations within each embodiment, unless otherwise specified or logically conflicting, the terminology and / or descriptions between different embodiments and between the various implementation methods / methods / implementations within each embodiment are consistent and can be mutually referenced. The technical features in different embodiments and the various implementation methods / methods / implementations within each embodiment can be combined according to their inherent logical relationships to form new embodiments, implementation methods, methods, or implementation approaches. The embodiments of this application described below do not constitute a limitation on the scope of protection of this application.

[0041] The testing equipment provided in this application can be applied to various testing scenarios for modules, components, devices, or apparatuses, such as testing scenarios for vehicles or components within vehicles. The following is a brief introduction to the testing scenarios applicable to the testing equipment provided in this application, using vehicles as an example.

[0042] Figure 1 This is a functional schematic diagram of the vehicle 100 provided in the embodiments of this application.

[0043] Vehicle 100 may include multiple subsystems, such as perception system 110 and computing platform 120. Optionally, vehicle 100 may include more or fewer subsystems, and each subsystem may include one or more components. In addition, each subsystem and component of vehicle 100 may be interconnected via wired or wireless means.

[0044] The perception system 110 may include several types of sensors for sensing information about the environment surrounding the vehicle 100. For example, the perception system 110 may include a positioning system, which may be a global positioning system (GPS), a BeiDou system, or another positioning system. The perception system 110 may include one or more of the following: an inertial measurement unit (IMU), lidar, millimeter-wave radar, ultrasonic radar, and a camera device.

[0045] Some or all of the functions of vehicle 100 can be controlled by computing platform 120. Computing platform 120 may include processors 121 to 12n (n being a positive integer). A processor is a circuit with signal processing capabilities. In one implementation, the processor can be a circuit with instruction read and execute capabilities, such as a central processing unit (CPU), microprocessor unit (MPU), graphics processing unit (GPU) (which can be understood as a type of microprocessor), or digital signal processor (DSP). In another implementation, the processor can implement certain functions through the logical relationships of hardware circuits. These logical relationships are fixed or reconfigurable. For example, the processor may be a hardware circuit implemented using an application-specific integrated circuit (ASIC) or a programmable logic device (PLD), such as a field-programmable gate array (FPGA). In reconfigurable hardware circuits, the process of the processor loading a configuration document and configuring the hardware circuit can be understood as the processor loading instructions to implement some or all of the functions of the aforementioned units. Furthermore, the processor can also be a hardware circuit designed for artificial intelligence, which can be understood as an ASIC, such as a neural network processing unit (NPU), tensor processing unit (TPU), deep learning processing unit (DPU), etc. In addition, the computing platform 120 may also include a memory for storing instructions. Some or all of the processors 121 to 12n can call the instructions in the memory to implement the corresponding functions.

[0046] The computing platform 120 can control the functions of the vehicle 100 based on inputs received from various subsystems, such as the sensing system 110. In some embodiments, the computing platform 120 can be used to provide control over many aspects of the vehicle 100 and its subsystems.

[0047] Optionally, the above components are just an example. In actual applications, the components in each of the above modules may be added or deleted as needed.

[0048] The vehicle 100 in this application may include: road vehicles, water vehicles, air vehicles, industrial equipment, agricultural equipment, or entertainment equipment, etc. For example, the vehicle 100 may be a means of transportation (such as commercial vehicles, passenger cars, motorcycles, flying cars, trains, etc.), industrial vehicles (such as forklifts, trailers, tractors, etc.), engineering vehicles (such as excavators, bulldozers, cranes, etc.), agricultural equipment (such as lawnmowers, harvesters, etc.), amusement equipment, toy vehicles, etc.; or the vehicle 100 may include a wheeled device, which may be a robot, mobile medical equipment, or experimental platform. The embodiments of this application do not specifically limit the type of mobile device.

[0049] The following section introduces the structural modes of the electronic and electrical architecture of Vehicle 100 from another perspective, including three architecture modes: distributed architecture, domain-centralized architecture, and centralized computing (CC) architecture.

[0050] Distributed architecture: Electronic devices are added to meet functional requirements, such as sensors and electronic control units (ECUs). Almost every function has its own ECU, and the system becomes increasingly complex as functional requirements increase.

[0051] Domain-centric architecture: This approach divides functions into domains, with centralized control within each domain, reducing the number of ECUs and lowering system complexity. The traditional five domain controllers are the powertrain domain, chassis domain, body domain, intelligent driving domain, and cockpit domain. Current trends favor the division into vehicle control domain, autonomous driving domain (or intelligent driving domain), and intelligent cockpit domain, each centrally controlled by a domain controller. The vehicle domain controller (VDC) is responsible for overall vehicle control and has high requirements for real-time performance and safety; the vehicle control domain can be understood as an integration of the original powertrain, chassis, and body domains. The intelligent driving domain controller (ADAS / AD domain controller, or simply ADC) is responsible for intelligent driving-related perception, decision-making, and control functions; the intelligent cockpit domain controller (CDC) is responsible for cockpit intelligence functions such as human-machine interaction. Domain controllers have different names on different manufacturers' platforms; this application does not limit this.

[0052] The CC architecture adopts a distributed network and domain controller architecture, dividing vehicle control into three main parts: driving, cockpit and vehicle control, and has launched three major platforms: intelligent driving platform (mobile data center, MDC), CDC and VDC (as a vehicle control platform).

[0053] As a core component of the drive system in vehicles, such as intelligent vehicles, the controller (such as the domain controller mentioned earlier) requires rigorous current testing. Typically, the controller's operating current, overload capacity, and short-circuit protection capabilities directly determine the safety of the entire vehicle. If the controller's operating current has an error, or if it drifts significantly after a certain period of operation, it may lead to actuator failure, malfunctions, and abnormal data processing, resulting in significant safety risks. An overcurrent fault could instantly damage the power module, causing drive system failure and posing a serious threat to the safety of vehicles traveling at high speeds. If the controller's short-circuit protection function malfunctions, it may fail to interrupt the short-circuit current in time during a short-circuit fault, potentially burning out the controller and even the vehicle containing it.

[0054] Therefore, current testing of the controller is crucial. Typically, current testing of the controller can be performed on a test bench before it leaves the factory. Figure 2 This is a structural block diagram of the test bench 200. See also... Figure 2 The test bench 200 may include a controller (as the device under test) 210, a sensor module 220, a power supply 230, a data acquisition module 240, a load 250, and a host computer 260.

[0055] During the testing of controller 210, host computer 260 can control load 250 to be connected in parallel to the output terminal of controller 210 to perform current tests on controller 210, such as overcurrent test, short circuit protection and operating current test mentioned above.

[0056] Sensor module 220 can be connected to the output terminal of controller 210 to sample the output parameters of controller 210, such as output current and voltage, and send the sampling results to acquisition module 240. Acquisition module 240 can process the sampling results, such as performing analog-to-digital conversion, and report the conversion results to host computer 260. Host computer 260 can determine the test results of controller 210 based on the output parameters of controller 210.

[0057] Power supply 230 can be used to power sensor module 220, load 250, acquisition module 240 and controller 210.

[0058] A 250Ω load could be an active electronic load, which performs well and is highly accurate in high-current scenarios such as overcurrent and short-circuit tests. However, active electronic loads are generally not suitable for rated operating condition testing. This is because rated operating conditions typically require long-term reliability testing, but the power devices in active electronic loads will generate a lot of heat when operating at rated current for extended periods, potentially affecting their reliability. Furthermore, active electronic loads are generally more expensive.

[0059] Currently, among the active electronic loads on the market, those with lower power output currents are insufficient to meet the testing requirements of controllers; while those with higher power output currents are much larger than the controller's test current, resulting in some waste. Using higher power active electronic loads for controller testing would drastically increase testing costs.

[0060] A 250Ω load can also be a power resistor load. This type of load adjusts its impedance by changing the connection of multiple power resistors using multiple switches. It performs well in low-power testing scenarios and is suitable for long-term reliable operation, such as rated condition testing. However, because this type of load adjusts its impedance by changing the series or parallel connection of multiple power resistors, its resistance value is usually not flexible enough, resulting in lower testing efficiency. Furthermore, lower-precision power resistor loads are generally cheaper, but the cost increases with increasing precision.

[0061] It can be seen that currently, a single type of load can only achieve testing under certain operating conditions. However, when testing the current of a controller, it is necessary to test multiple conditions, including the controller's rated operating condition, overload condition (i.e., the test condition for current overload capacity), and short-circuit condition (i.e., the test condition for short-circuit protection capability), to improve the controller's safety and reliability. If the load in related technologies is used to test the controller, multiple testing devices are required to test different operating conditions separately. After each test is completed, other loads need to be reconnected, making the operation complex. Moreover, a single controller requires multiple testing devices, resulting in high costs.

[0062] In addition, the controller needs to be tested on multiple channels, and each channel needs to be tested under the aforementioned various operating conditions. Therefore, switching test equipment is required for testing each channel under various operating conditions, which will increase the operational complexity exponentially.

[0063] This application provides a testing device to address one or more of the aforementioned problems. On one hand, by integrating an electronic load, a resistive load, and a first switch, this testing device can perform multiple types of tests (i.e., the tests under various operating conditions mentioned above) on a single device, helping to meet all the testing requirements of the controller. On the other hand, this testing device can automatically switch its internal modules as loads for the device under test according to testing requirements, thus meeting the testing needs of different operating conditions. This testing device helps reduce manual intervention in the controller testing process, facilitates automated testing procedures, thereby reducing operational complexity and improving testing efficiency.

[0064] The preceding text used the testing requirements of a vehicle controller as an example to introduce the problems existing in the related technologies. It should be understood that the testing equipment provided in the embodiments of this application can also be used for testing other electronic devices, and this application does not limit it.

[0065] The following is combined Figure 3 The testing equipment provided in the embodiments of this application will be described in detail.

[0066] Figure 3 This is a schematic diagram of the structure of the test device 300 provided in an embodiment of this application. The test device 300 may include a first switch 310, a resistive load 320, an electronic load 330, and a control module 340.

[0067] Specifically, the first switch 310 can be used for the first type of test, the resistive load 320 can be used for the second type of test, and the electronic load 330 can be used for the third type of test. Different types of tests can refer to tests under different operating conditions as mentioned above. That is to say, the first switch 310, the resistive load 320, and the electronic load 330 can be used for different types of tests or for tests under different operating conditions.

[0068] In some embodiments, the first type of test may include short-circuit testing, the second type of test may include rated testing, and the third type of test may include overload testing. Rated testing may also be referred to as durability testing, etc. It should be understood that the contents included in the above-described different test types are merely illustrative; for example, the first, second, or third type of test may also include other types of load testing introduced in the future, and this application does not limit this.

[0069] In some embodiments, the first switch 310 can be a switching device that supports on / off control via a control signal. For example, the first switch 310 can be a relay. Since relays are small in size and low in cost, using a relay as the first switch 310 helps to reduce the size and cost of the test equipment 300.

[0070] In some embodiments, the resistive load 320 is a load module composed of resistors, which helps to improve operational stability. For example, the resistive load 320 may include multiple power resistors and a switch array connected to the multiple power resistors. The impedance or resistance value of the resistive load 320 is determined based on the connection method of the multiple power resistors. Alternatively, the resistance value or impedance of the resistive load 320 may differ depending on the connection method of the multiple power resistors, making it suitable for different testing scenarios.

[0071] The aforementioned switch array may include, for example, multiple switches. The connection method of the multiple power resistors can be determined based on the conduction state of the multiple switches in the switch array. The conduction state mentioned here can refer to: the switch being in the on state or the off state. The conduction state can also be replaced by the on / off state or the switch state, etc., and this application does not limit it in this way.

[0072] The switches in the aforementioned switch array can be switching devices that support on / off control via control signals. For example, the switch array may include multiple relays, which helps reduce cost and size. Alternatively, the switch array may include multiple contactors, which helps meet the requirements for conducting high currents.

[0073] It should be understood that the switch array mentioned in the embodiments of this application does not limit the deployment or installation method of multiple switches, and the switch array can also be replaced by multiple switches, etc.

[0074] For example, the power resistor can be an aluminum-cased power resistor, or what might be called a high-power gold resistor. Because aluminum-cased power resistors offer high precision, low temperature drift, and high long-term operational stability, they maintain high accuracy even under prolonged operation and high temperatures, contributing to improved testing accuracy and operational stability. For scenarios with long testing durations, the performance gains of aluminum-cased power resistors are even more pronounced. Furthermore, since the casing of this type of resistor is metal, it can be directly mounted on metal structural components, allowing heat conduction through the contact between the casing and the metal structure, thus reducing heat dissipation costs and improving heat dissipation efficiency.

[0075] In some embodiments, the test apparatus 300 may include one or more resistive loads. When the test apparatus 300 includes multiple resistive loads, the output parameters of the multiple resistive loads may be the same or different. On the one hand, this approach can expand the applicability of the test apparatus, helping to improve its versatility. On the other hand, this approach can support parallel testing, thereby helping to further improve testing efficiency.

[0076] In some embodiments, the electronic load 330 can be a controllable load implemented using a semiconductor power device, such as controlling the output current of the semiconductor power device by controlling its input voltage or input current, thereby forming a load with a specific current. For example, the electronic load 330 may include a control unit and a first electronic device, the output current of which is related to its input voltage. The first electronic device mentioned here refers to the aforementioned semiconductor power device, such as a metal-oxide-semiconductor field-effect transistor (MOSFET) (which can be simply referred to as a MOS transistor) or an insulated-gate bipolar transistor (IGBT).

[0077] In some embodiments, the output current range of the electronic load 330 can be 0~5A, 0~8A, 0~15A, or 0~20A. From a power perspective, the power of the electronic load 330 can be, for example, 100W~150W, to meet various testing requirements of the device under test, such as the controller.

[0078] In some embodiments, the electronic load 330 supports different continuous operating times at different output currents. Since operating at high current causes heat accumulation and affects the temperature of the electronic load, this solution helps ensure the thermal safety of the electronic load while meeting various testing requirements of the device under test. For example, the continuous operating time supported by the electronic load 330 is in the range of seconds or milliseconds, such as 3s, 5s, 8s, 10s, 12s, 15s, 18s, 20s, 800ms, 500ms, 200ms, or 100ms. Generally, the higher the operating current of the electronic load 330, the shorter the supported continuous operating time.

[0079] In some embodiments, the test equipment 300 may include one or more electronic loads. When the test equipment includes multiple electronic loads, the output parameters of the multiple electronic loads, such as output current range and single continuous operating time, may be the same or not entirely the same. On the one hand, this approach can expand the applicability of the test equipment, helping to improve its versatility. On the other hand, this approach can support parallel testing, thereby helping to further improve testing efficiency.

[0080] In some embodiments, the control module 340 may include a controller such as a CPU, MCU, DSP, or FPGA. It should be understood that the devices included in the control module are merely illustrative examples and are not intended to limit the scope of the application.

[0081] For example, the input of the control module 340 can be connected to a host computer, and the output of the control module 340 can be connected to a first switch, a resistive load, and an electronic load. The host computer mentioned here can be replaced with other modules used to control the test equipment; it should be understood that the name of the host computer should not limit the scope of protection of this application.

[0082] The control module 340 described above can be used to: receive a control signal from a host computer, which can be used to determine the test type of the device under test, wherein the test type can include at least one of a first type of test, a second type of test, or a third type of test.

[0083] For example, the control signal can include multiple signals, each corresponding to a different test type. As an example, these signals can have various values, such as 00, 01, 10, or 11.

[0084] The control module 340 can determine the current test type based on which of the various control signals it is.

[0085] When this solution is applicable to scenarios with a single type of testing requirement, the control signal can be one of several signal values. Taking the first type of test corresponding to 00 among several signals as an example, in a scenario requiring the first type of test, the control signal includes 00.

[0086] When this solution is applicable to scenarios with multiple types of testing requirements, the control signals can include the aforementioned signals. Taking the first type of test corresponding to 00 and the second type of test corresponding to 01 as an example, the control signals can include both 00 and 01. However, the host computer can send 00 and 01 to the control module 340 at different times; that is, the control module 340 can receive 00 and 01 at different times. Upon receiving 00, the control module 340 can determine that the current test type is the first type of test; upon receiving 01, the control module 340 can determine that the current test type is the second type of test.

[0087] Alternatively, the control module 340 can determine the various test types required for the device under test based on the multiple signals included in the control signal. This solution is suitable for scenarios with multiple types of test requirements. For example, taking the first type of test as corresponding to 00, the second type of test as corresponding to 01, and the third type of test as corresponding to 10, the control signal can include 00, 01, and 10. Upon receiving this control signal, the control module 340 can determine that the test type includes the first type of test, the second type of test, and the third type of test.

[0088] The control module 340 can control the first switch 310, the resistive load 320 or the electronic load 330 to be in working state according to the test type.

[0089] For example, in the case of a Type I test, the control module 340 can control the first switch 310 to be in an active state. Taking a short-circuit test as an example, the control module 340 can control the first switch 310 to be in a conducting state, and the first switch 310 is connected in series in the output path of the device under test, or in other words, the first switch 310 is connected in parallel at the output terminal of the device under test. This solution performs a short-circuit test by controlling the first switch 310 to be in a conducting state, thus short-circuiting the output path of the device under test.

[0090] For example, in the case of a Type II test, the control module 340 can control the resistive load 320 to be in an operating state. Taking the Type II test as a rated test as an example, the control module 340 can control the resistance value of the resistive load 320 to a first value, and the resistive load 320 is connected to the output terminal of the device under test, or in other words, the resistive load 320 is connected in parallel to the output terminal of the device under test. The first value is determined based on the rated voltage and rated current of the device under test. Taking the resistive load 320 as a purely resistive load as an example, the first value is the quotient (or ratio) of the rated voltage and rated current of the device under test. The first value can also be called the rated load value, which is not limited in this application.

[0091] Taking the resistive load 320, which includes the aforementioned multiple power resistors and the aforementioned switch array, as an example, in the case of the second type of test, the control module 340 can be used to control the conduction state of multiple switches in the switch array so that the resistance value of the resistive load 320 is the aforementioned first value, thereby realizing the rated test of the device under test. As an example, the control module 340 can determine the conduction state of multiple switches corresponding to the first value based on the pre-configured correspondence between the conduction states of multiple switches and the resistance values ​​of the resistive load 320, and the first value, thereby controlling which switches are on and which are off among the multiple switches.

[0092] In some embodiments, the control module 340 is an independent control component that can be connected to other modules in the testing equipment via electronic circuitry to enable communication with other modules. This scheme can also be referred to as a centralized control scheme.

[0093] Alternatively, the control module 340 may include multiple control components, which can be deployed in multiple modules of the test equipment. This approach can also be called a distributed control scheme.

[0094] Alternatively, control module 340 may include a main control module and multiple auxiliary control modules, which can be deployed in the electronic load, the first switch, and the resistive load, respectively. The main control module can be used to communicate with a host computer or with multiple auxiliary control modules. For example, the main control module can parse and process control signals from the host computer and send the processing results to the corresponding auxiliary control modules deployed in the test equipment, allowing the auxiliary control modules to control the internal functions of their respective modules.

[0095] Typically, test duration is also a critical test parameter in rated testing. In some embodiments, the test duration for the second type of test can be predefined. For example, the control module 340 can read the internally stored test duration information to control the resistance value of the resistive load 320 to be maintained at a first value for the specified test duration. This approach is simple to implement and helps reduce the interaction of control signals. Alternatively, the test duration can be determined according to the instructions of the host computer. This approach allows for the configuration of different test durations according to the different needs of the device under test, thus improving flexibility.

[0096] For example, in the case of a Type 3 test, the control module 340 can control the electronic load 330 to be in an operating state, and the electronic load 330 is connected to the output terminal of the device under test (DUT), or in other words, the electronic load 330 is connected in parallel to the output terminal of the DUT. The output current of the electronic load 330 is determined based on the overload factor of the overload test. For example, the control module 340 can determine the test current based on the overload factor, thereby controlling the output current of the electronic load 330 to be the test current. The overload factor can be predefined, or it can be indicated by a host computer.

[0097] Some devices under test (DUTs) only require testing under one overload condition, such as an overload test at the first overload multiple. Other DUTs require testing under multiple overload conditions, such as an overload test at the first overload multiple and an overload test at the second overload multiple. These multiple overload multiples can correspond one-to-one with multiple overload levels; for example, the first overload multiple corresponds to Level 1 overload (overload level), and the second overload multiple corresponds to Level 2 overload (overload level). As an example, the number of overload levels can be four, meaning the electronic load 330 supports testing at all four overload levels. This helps meet the testing needs of various controllers and improves versatility.

[0098] Multiple overload factors can be predefined, and the control module 340 can control the output current of the electronic load 330 to be the test current corresponding to each of the multiple overload factors in sequence. As an example, overload tests can be performed in ascending order of overload factors, which helps reduce the current stress on the devices under test and improves the automation level of the test equipment. Taking overload factors including 1.2, 1.3, and 1.4 as an example, the overload test sequence can be 1.2 times overload test, 1.3 times overload test, and 1.4 times overload test, respectively. Alternatively, multiple overload factors can be indicated separately by the host computer, or the test sequence corresponding to multiple overload factors can be indicated by the host computer to improve flexibility.

[0099] Taking the electronic load 330, which includes the aforementioned first electronic device and control unit, as an example, the control unit can sequentially output multiple voltages to the first electronic device, such that the output current of the first electronic device is sequentially the current corresponding to multiple overload multiples. For example, the control unit can sequentially output the aforementioned multiple voltages to the first electronic device when it receives a control signal from the control module 340.

[0100] It should be understood that the duration of the continuous test for each overload factor can be determined according to the requirements of the device under test. For example, this duration can be predefined for ease of implementation, such as 15 seconds for a 1.2x overload and 3 seconds for a 1.5x overload. Alternatively, the duration can be determined by a control signal from a host computer. This approach allows for flexible configuration of the duration of the test, thereby improving flexibility.

[0101] As an example, the control unit is also used to sample the output current of the electronic load 330, thereby adjusting the input voltage of the first electronic device based on the sampling results. This scheme enables closed-loop control of the output current of the first electronic device, which helps improve the accuracy of the output current of the electronic load 330, thus contributing to improved testing accuracy.

[0102] Similarly, the overload factor for a single overload test can be predefined or indicated by the host computer.

[0103] It should be understood that the overload factor mentioned here is relative to the rated current of the device under test. In other words, the test current in the overload test is the product of the rated current and the overload factor.

[0104] In related technologies, when testing different channels of a controller, it is necessary to disconnect the connection cable of one channel after testing, connect another channel to the load, and then test again, and so on. This operation is complex and inefficient. Alternatively, when testing multiple controllers, it is necessary to disconnect the connection cable of one controller after testing, connect another controller to the load, and then operate the load, which is also inefficient.

[0105] To address this issue, in some embodiments, the test device 300 may further include a channel selection module that supports multiple connection methods between multiple modules within the test device 300 and multiple outputs of the test device 300 (i.e., multiple outputs of the channel selection module).

[0106] The three input terminals of the channel selection module can be connected to the first switch 310, the resistive load 320, and the electronic load 330 mentioned above, respectively. The channel selection module supports multiple output terminals, which can also be understood as the test device 300 supporting multiple test channels. For example, the multiple output terminals of the channel selection module can be used to connect to multiple devices under test.

[0107] For example, each test channel in the channel selection module may include one or more sets of switches (which can be controlled by control signals). The connection method between the input and output terminals of the channel selection module can be determined based on the conduction state of the aforementioned one or more sets of switches.

[0108] The control module 340 can be used to control each of the multiple output terminals to be sequentially connected to the three input terminals of the channel selection module. In other words, the control module 340 can control the connection method of the channel selection module to sequentially connect the first switch, resistive load, and electronic load to a device under test (DUT). After completing multiple types of tests on one DUT, it can control the first switch, resistive load, and electronic load to sequentially connect to another DUT, and so on. This allows for testing of multiple operating conditions of each DUT without manual intervention, facilitating automated processing, reducing processing complexity, and thus further improving testing efficiency.

[0109] It should be understood that the connection order of the multiple outputs and three inputs of the channel selection module can be predefined or determined based on control signals from the host computer.

[0110] For example, the channel selection module can be connected to the control module 340 to receive control signals from the control module 340.

[0111] In some embodiments, the test device 300 may further include a data acquisition module, which can be used to sample parameters internal to the test device 300 and to sample parameters at the output of the test device 300 to obtain relevant parameters of the device under test. For example, the data acquisition module can be connected to the output of the test device 300, i.e., the output of the channel selection module. Since the output of the channel selection module is close to the output of the device under test, this approach helps reduce processing complexity and wiring complexity, and also helps reduce costs.

[0112] For example, the data acquisition module can report the acquisition results to the host computer. For instance, the data acquisition module can report the acquisition results to the control module 340, which then reports them to the host computer via the communication module. In this case, the data acquisition module can be connected to the control module 340. Alternatively, the data acquisition module can report the acquisition results to the host computer via the communication module.

[0113] For example, the data acquisition module can be used to acquire at least one of voltage, current, or voltage cycle. By integrating the data acquisition module, the test equipment 300 can automatically acquire multiple parameters such as voltage, current, or voltage cycle, which helps to improve test efficiency.

[0114] In some embodiments, the test device 300 may further include the aforementioned communication module. For example, the control module 340 can receive control signals from a host computer via the aforementioned communication module.

[0115] In some embodiments, the test device 300 may include multiple communication modules, such as a first switch, a resistive load, an electronic load, and a control module, each including a communication module to enable communication between different modules within the test device. Alternatively, the first switch and the resistive load may be integrated into a single component, in which case that component may be equipped with a communication module, and the electronic load and control module may each be equipped with a separate communication module, thereby enabling communication between different components or modules.

[0116] In some embodiments, the communication module may communicate using a controller area network (CAN) bus or other means.

[0117] During current testing, the testing equipment generates a high amount of heat. If this heat cannot be dissipated in time, it may affect the reliable operation of the testing equipment, the lifespan of the components in the testing equipment, or even damage the components in the testing equipment.

[0118] In view of this, in some embodiments, the test equipment 300 may include one or more heat dissipation modules for dissipating the heat generated during operation of the test equipment 300, thereby helping to ensure that the operating temperature of the test equipment 300 does not exceed a first threshold. It should be understood that the first threshold is related to the operating temperature and high-temperature resistance of the devices and components in the test equipment.

[0119] For example, a heat dissipation module may include at least one of a fan, a heat sink, or thermally conductive adhesive. For instance, thermally conductive adhesive and a heat sink may be used to dissipate heat from a first electronic device in the electronic load 330. As another example, each module or component of the test equipment 300 may include one or more cooling fans.

[0120] In some embodiments, multiple modules included in the test equipment 300 can be integrated into a single component, such as the first switch and the resistive load, which can be referred to as a multi-function switch for ease of description. Alternatively, the channel selection module can also be integrated into the multi-function switch. It should be understood that the multi-function switch can be replaced with other names, which should not limit its scope of protection. This approach helps reduce the number of independent components in the test equipment, and the multiple integrated modules can share some structures or components, thereby helping to reduce hardware costs. For example, the first switch, the resistive load, and the channel selection module can be controlled by the same control unit and communicate with other modules using the same communication module, which helps to reduce the number of control units and communication modules in the test equipment, thereby helping to reduce hardware costs. In addition, the switch array included in the resistive load, the first switch, and the switch in the channel selection module are of the same type of device and are deployed in the same component, which facilitates control and wiring.

[0121] Figure 4 This is a schematic diagram of the structure of the test device 400 provided in an embodiment of this application. See also... Figure 4 The test equipment 400 may include a control module 340 and a multi-function switch 410 (such as...). Figure 4 (As shown in the gray-filled area), electronic load 330, and data acquisition module 420. The multi-function switch 410 may include a short-circuit switch 411 (i.e., the first switch mentioned above), a resistive load 412, and a channel selection module 413. The resistive load 412 may include a switch array 4121 and a power resistor 4122.

[0122] The control module 340 can communicate with a host computer to receive control signals from the host computer and to report the acquisition results from the data acquisition module. Additionally, the control module can control one or more of the following components—short-circuit switch 411, resistive load 412, electronic load 330, channel selection module 413, and data acquisition module 420—to be in a working state, and specify the working state. For example, it can control the channel selection module 413 to be in a working state and control the first output terminal of the channel selection module 413 to be connected to the first input terminal, i.e., connected to the short-circuit switch 411. The short-circuit switch, resistive load, electronic load, and channel selection module are described above and will not be repeated for brevity.

[0123] The test equipment 400 can also be connected to a power supply, which can be used to power the various modules in the test equipment.

[0124] The test equipment 400 may include M output terminals, which are used to connect to M devices under test.

[0125] For example, the test equipment 400 may also include a heat dissipation module ( Figure 4 (Not shown in the text), please refer to the previous introduction.

[0126] The testing equipment provided in this application can automatically switch between different load modules according to testing needs, thereby meeting diverse testing requirements and improving testing efficiency. Simultaneously, this testing equipment possesses the capability for testing in small spaces, at high density, and under complex operating conditions. Furthermore, the equipment has the ability to perform independent testing on a single channel or simultaneous testing on multiple channels. For example, while completing tests on all port outputs of a vehicle controller, this testing equipment can reduce single-channel testing costs, decrease equipment size, and improve space utilization.

[0127] Taking a vehicle controller as an example, in actual testing, the testing equipment provided in this application can achieve 100% full coverage of the entire vehicle controller channel and 100% automation of test cases (test cases under different operating conditions). Taking the same test scenario as an example, compared with related technologies, the testing equipment provided in this application can improve testing efficiency by 4 times and reduce costs by 50%.

[0128] To facilitate understanding, the following will be combined with... Figures 5 to 7 The electronic load 330 and the multifunction switcher 410 are described by way of example.

[0129] Figure 5 This is an example diagram of an electron load 330. See also... Figure 5The electronic load 330 may include a CAN interface, an MCU (i.e., the control unit mentioned earlier), a DAC, an ADC, an output operational amplifier (which can be simply referred to as an output op-amp), a power MOSFET (i.e., the first electronic device mentioned earlier), a power interface, an input operational amplifier (which can be simply referred to as an input op-amp), a sampling resistor, a fan, thermal adhesive, and a heatsink. The CAN interface, MCU, DAC, and ADC can be deployed on the upper-level control board, while the output op-amp, power MOSFET, power interface, input op-amp, sampling resistor, fan, thermal adhesive, and heatsink can be deployed on the lower-level power board. The following section describes the functions of each module of the electronic load 330 in conjunction with its operation.

[0130] When the CAN interface receives a communication signal, it can transmit the signal to the MCU, which then processes the signal and outputs corresponding control signals. For example, the communication signal might instruct the electronic load 330 to output 10A of current.

[0131] The MCU can determine its output voltage based on the relationship between the output current and the output voltage of the power MOSFET. The output operational amplifier amplifies the MCU's output voltage to meet the input requirements of the power MOSFET. This is because the MCU's output power is limited; typically, the MCU outputs a small voltage signal, which is then amplified by external circuitry to meet the input requirements of subsequent circuits.

[0132] After receiving a voltage signal from the output operational amplifier, the power MOSFET enters the operating state and outputs operating current (also known as power output) through the power interface. The output current of the power MOSFET is related to the input voltage. This scheme allows for stepless adjustment of the electronic load.

[0133] The sampling resistor can be used to sample the output current of the power MOSFET. After amplification by the input operational amplifier and analog-to-digital conversion by the ADC module, the converted result of the sampling information can be transmitted to the MCU. The MCU can adjust the input voltage of the power MOSFET according to the sampling result to stabilize the output current at the required level. This closed-loop control can improve the accuracy and stability of the output current of the electronic load.

[0134] For example, the sampling resistor can be connected in series in the output path, and its resistance value is typically small to reduce power consumption. In this case, the sampling result from the sampling resistor is usually a small value, and therefore, the sampling result can be amplified by an input operational amplifier before being transmitted to the MCU. Furthermore, since the MCU typically processes digital signals, an ADC module can be used to convert the analog signal sampling result from the sampling resistor into a digital signal sampling result for MCU processing. Optionally, the MCU can upload the sampling result to a host computer via a CAN interface.

[0135] In addition, the MCU can also control the operating status of the fan. For example, the fan can be started immediately when the electronic load starts. Or, the fan can be started when the temperature of the electronic load, such as the temperature of the power MOSFET, exceeds a certain threshold, and the fan can be turned off when the temperature is below a certain threshold to save energy.

[0136] For example, by using multiple heat dissipation methods such as fans, heat sinks, and thermal conductive adhesive, the temperature of the electronic load can be kept below or equal to 90°C while covering the single-port output power of the vehicle controller.

[0137] For example, the electronic load can be made to a size of approximately 250mm × 100mm × 60mm, which is relatively small.

[0138] Figure 6 This is an example diagram of a multifunction switcher 410. Figure 6 The multi-function switcher 410 shown may include a switching control board (part of the control module 340), gold resistors (i.e., the power resistors mentioned above), short-circuit switches, switch arrays, channel selection modules, a recommended standard (RS) 485 interface (for communication, but can be replaced with other types of communication interfaces), a fan, air ducts, and metal structural components for mounting multiple parts of the multi-function switcher (including...). Figure 6 (The metal casing, as well as the shelves and brackets for mounting the various components).

[0139] The multi-function switcher 410 can achieve time-sharing switching between resistive and electronic loads via a channel selection module. The multi-function switcher 410 also incorporates multiple high-power gold resistors, short-circuit switches (such as relays), and an independent heat dissipation module (i.e., a cooling fan). Besides switching resistive and electronic loads, the switch itself can be used to test rated impedance and short-circuit conditions. For example, rated impedance can be tested by switching the switch array, and short-circuit conditions can be tested by closing the short-circuit switch (i.e., short-circuiting).

[0140] By integrating resistive loads, short-circuit switches, switch arrays, and channel selection modules, a multi-functional switcher 410 is formed, which helps to reduce the size of test equipment, improve the space utilization of test equipment, and improve heat dissipation efficiency.

[0141] Figure 7 This is a schematic diagram illustrating the working principle of the multi-function switcher 410. (See also...) Figure 7 The controller in the switching control board can receive control signals from the communication interface and control different modules to operate accordingly. For example, the controller can perform short-circuit testing by controlling a short-circuit relay (i.e., a short-circuit switch). Alternatively, the controller can perform load or overload testing by controlling a relay array (i.e., a channel selection module). The conduction state of the relays in the array allows the output of the test equipment to switch between an electronic load and a gold resistor, achieving load or overload testing (i.e., rated operating condition testing). Furthermore, the controller can perform rated operating condition testing (or endurance testing) by controlling a gold resistor.

[0142] Figure 8 This is a schematic diagram of the test device provided in an embodiment of this application. Figure 8 The test apparatus 800 shown may include a cabinet 810 and a test device 300, wherein the test device 300 is mounted in the cabinet 810. Optionally, the cabinet has wheels for easy movement. Mounting the test device in a cabinet helps improve the convenience of testing.

[0143] In some embodiments, the test apparatus 800 may include a single test device 300. Alternatively, the test apparatus 800 may include multiple test devices 300, which helps to improve the parallel testing capability of the test apparatus 800. For example, the number of test devices can be adjusted according to the functions and number of interfaces of the device under test.

[0144] In some embodiments, the test apparatus 800 may further include a drawer unit for placing the device under test (DUT) for easy testing. Exemplarily, the drawer unit may include one or more output ports of the test device, which can be directly connected to the ports in the drawer unit, helping to reduce wiring complexity.

[0145] In some embodiments, the test apparatus 800 may further include a communication module, such as a switch, for communicating with a host computer and various modules in the test apparatus.

[0146] In some embodiments, the test apparatus 800 may further include a power control module for supplying power to the various components within the test apparatus 800. Exemplarily, the power control module may include an input socket or plug for connecting to an external power source. Exemplarily, the power control module may also include a main power switch, an emergency stop switch, a fuse, etc., which helps to improve the safety of the test apparatus 800.

[0147] In some embodiments, the testing apparatus 800 may further include accessories, such as connecting cables, power strips, etc. For example, the testing apparatus 800 may also include an accessory drawer unit for storing accessories for easy use.

[0148] Figure 9 Another schematic diagram of the test apparatus provided in the embodiments of this application. Figure 9 The test apparatus 900 shown may include P active power loads (i.e., the electronic loads mentioned above), N power switches (i.e., the multi-function switches mentioned above), M devices under test, and accessories. The components of the test apparatus 900 are described in detail above and will not be repeated here.

[0149] Figure 10 This is another structural schematic diagram of the testing device provided in the embodiments of this application. Figure 10 The test apparatus 1000 shown may include a power control module 1010, multiple active power loads 1020, multiple multi-function switches 1030, and accessories. Figure 10 (Not shown in the image). Optionally, the test apparatus 1000 may also include a drawer unit 1040 for placing the device under test. Optionally, the test apparatus 1000 may also include a communication module, such as a switch, for communicating with a host computer and with various modules in the device under test. The components in the test apparatus 1000 can be referred to the description above, and will not be repeated here.

[0150] This application embodiment also provides a bench testing device, which may include testing equipment 300.

[0151] The apparatus embodiments provided in this application have been described above. The method embodiments provided in this application will be described below. It should be understood that the description of the method embodiments corresponds to the description of the apparatus embodiments. Therefore, any content not described in detail can be referred to the apparatus embodiments above. For the sake of brevity, it will not be repeated here.

[0152] Figure 11 This is a flowchart illustrating a testing method provided in an embodiment of this application. Figure 11 The method shown can be executed by the test equipment 300 mentioned above, such as the control module 340 in the test equipment 300.

[0153] Figure 11The test method shown may include steps S1110 and S1120.

[0154] Step S1110: Receive a control signal from the host computer. The control signal is used to determine the test type of the device under test. The test type includes at least one of the first type of test, the second type of test, or the third type of test.

[0155] Step S1120: Control the first switch, resistive load, or electronic load to be in working state according to the test type, wherein the first switch is used for the first type of test; the resistive load is used for the second type of test; and the electronic load is used for the third type of test.

[0156] In some embodiments, the first type of test is a short-circuit test, and controlling the first switch, resistive load, or electronic load to be in an operating state according to the test type includes: when the test type is the first type of test, controlling the first switch to be in a conducting state, and the first switch being connected in series in the output path of the device under test.

[0157] In some embodiments, the second type of test is a rated test, and controlling the first switch, resistive load, or electronic load to be in an operating state according to the test type includes: when the test type is the second type of test, controlling the resistance value of the resistive load to a first value, and the resistive load is connected to the output terminal of the device under test; wherein the first value is determined based on the rated voltage and rated current of the device under test.

[0158] In some embodiments, the resistive load includes: a plurality of power resistors; and a switch array connected to the plurality of power resistors, wherein the connection method of the plurality of power resistors is determined based on the on-state of the plurality of switches in the switch array; controlling the resistance value of the resistive load to a first value includes: controlling the on-state of the plurality of switches in the switch array to make the resistance value of the resistive load the first value.

[0159] In some embodiments, the third type of test is an overload test, and controlling the first switch, resistive load, or electronic load to be in an operating state according to the test type includes: when the test type is the third type of test, controlling the electronic load to be in an operating state, and the electronic load is connected to the output terminal of the device under test, wherein the output current of the electronic load is determined based on the overload multiple of the overload test.

[0160] In some embodiments, the overload test includes tests corresponding to multiple overload multiples, the electronic load includes a control unit and a first electronic device, the output current of the first electronic device is related to the input voltage of the first electronic device, and controlling the electronic load to be in a working state includes: sequentially outputting multiple voltages to the first electronic device, the multiple voltages causing the output current of the first electronic device to be the current corresponding to the multiple overload multiples respectively.

[0161] In some embodiments, the method further includes: controlling each of the plurality of output terminals of the channel selection module to be sequentially connected to the three input terminals of the channel selection module, and the three input terminals of the channel selection module to be respectively connected to the first switch, the electronic load, and the resistive load.

[0162] This application also provides an automated vehicle testing method, which includes the above-described testing method.

[0163] This application also provides an electronic device including one or more processors and a memory. The memory is coupled to the one or more processors and is used to store computer program code, which includes computer instructions. The one or more processors invoke the computer instructions to cause the electronic device to perform the above-described test method.

[0164] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, causes the processor to perform the test method of any of the above embodiments.

[0165] This application also provides a computer program product that, when run on a computer, causes the computer to perform the aforementioned steps to implement the testing method described in the above embodiments.

[0166] In addition, embodiments of this application also provide an apparatus, which may specifically be a chip, component or module. The apparatus may include a connected processor and a memory; wherein the memory is used to store computer execution instructions, and when the apparatus is running, the processor may execute the computer execution instructions stored in the memory to cause the chip to execute the test methods in the above method embodiments.

[0167] It should be understood that the beneficial effects achieved by the method embodiments can be referred to the corresponding beneficial effects in the device embodiments described above, and will not be repeated here.

[0168] In the embodiments of this application, the terms and English abbreviations are exemplary examples given for ease of description and should not be construed as limiting the application in any way. The embodiments of this application do not preclude the possibility of defining other terms that can achieve the same or similar functions in existing or future agreements.

[0169] The terms “component,” “module,” “system,” etc., used in this specification are used to refer to computer-related entities, hardware, firmware, combinations of hardware and software, software, or software in execution. For example, a component can be, but is not limited to, a process running on a processor, a processor, an object, an executable file, an execution thread, a program, and / or a computer. As illustrated, applications running on computing devices and computing devices can both be components. One or more components may reside in a process and / or an execution thread, and components may be located on a single computer and / or distributed among two or more computers. Furthermore, these components can be executed from various computer-readable storage media on which various data structures are stored. Components can communicate, for example, via local and / or remote processes based on signals having one or more data packets (e.g., data from two components interacting with another component between a local system, a distributed system, and / or a network, such as the Internet interacting with other systems via signals).

[0170] Those skilled in the art will recognize that the various illustrative logical blocks and steps described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this application.

[0171] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be based on the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0172] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0173] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0174] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0175] In the above embodiments, the functions of each functional unit can be implemented entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. The computer program product includes one or more computer instructions (programs). When the computer program instructions (programs) are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available media may be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., digital video discs (DVDs)), or semiconductor media (e.g., solid-state disks (SSDs)).

[0176] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the embodiments of this application, essentially or in other words, the parts that contribute to the prior art, or parts of the technical solutions, can be embodied in the form of software products. These computer software products are stored in a storage medium and include several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0177] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A testing device, characterized in that, include: The first switch is used for the first type of test; Resistive load, used for Type II testing; Electronic load, used for Category III testing; as well as The control module has its input connected to a host computer, and its output connected to the first switch, the resistive load, and the electronic load. The control module is used for: The system receives a control signal from the host computer, the control signal being used to determine the test type of the device under test, the test type including at least one of the first type of test, the second type of test, or the third type of test; The first switch, the resistive load, or the electronic load is controlled to be in an operating state according to the test type.

2. The testing equipment according to claim 1, characterized in that, The first type of test is a short-circuit test. When the test type is the first type of test, the control module is used to control the first switch to be in the conducting state, and the first switch is connected in series in the output path of the device under test.

3. The testing equipment according to claim 1 or 2, characterized in that, The second type of test is a rated test. When the test type is the second type of test, the control module is used to control the resistance value of the resistive load to a first value, and the resistive load is connected to the output terminal of the device under test; wherein, the first value is determined based on the rated voltage and rated current of the device under test.

4. The testing equipment according to claim 3, characterized in that, The resistive load includes: Multiple power resistors; and A switch array connected to the plurality of power resistors, wherein the connection method of the plurality of power resistors is determined based on the conduction state of the plurality of switches in the switch array; The control module is used for: The conduction state of multiple switches in the switch array is controlled so that the resistance of the resistive load is the first value.

5. The testing equipment according to claim 4, characterized in that, The power resistor is an aluminum-cased power resistor.

6. The testing equipment according to any one of claims 1-5, characterized in that, The third type of test is an overload test. When this is the third type of test, the control module controls the electronic load to be in an operating state, and the electronic load is connected to the output terminal of the device under test. The output current of the electronic load is determined based on the overload factor of the overload test.

7. The testing equipment according to claim 6, characterized in that, The overload test includes tests corresponding to multiple overload multiples. The electronic load includes a control unit and a first electronic device. The output current of the first electronic device is related to the input voltage of the first electronic device. The control unit is used for: Multiple voltages are sequentially output to the first electronic device, such that the output current of the first electronic device is sequentially the current corresponding to the multiple overload multiples.

8. The testing equipment according to any one of claims 1-7, characterized in that, The testing equipment also includes: The channel selection module has three input terminals connected to the first switch, the electronic load, and the resistive load, respectively, and multiple output terminals for connecting to multiple devices under test. The control module is used to control each of the plurality of output terminals to be sequentially connected to the three input terminals of the channel selection module.

9. The testing equipment according to any one of claims 1-8, characterized in that, The testing equipment also includes a data acquisition module, which is connected to the output terminal of the testing equipment. The data acquisition module is used to acquire at least one of voltage, current, or voltage cycle.

10. A testing apparatus, characterized in that, include: Server rack; as well as The test equipment as described in any one of claims 1-9, wherein the test equipment is installed in the cabinet.

11. A testing method, characterized in that, include: Receive control signals from the host computer, the control signals being used to determine the test type of the device under test, the test type including at least one of a first type of test, a second type of test, or a third type of test; The first switch, resistive load, or electronic load is controlled to be in an operating state according to the test type, wherein the first switch is used for the first type of test; the resistive load is used for the second type of test; and the electronic load is used for the third type of test.

12. A readable storage medium having a computer program or instructions stored thereon, characterized in that, When the computer program or instructions are executed, the computer performs the method as described in claim 11.

13. A computer program product, characterized in that, It includes computer program instructions that cause the computer to perform the method as described in claim 11.

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