Liquid crystal display substrate and manufacturing method thereof

Abstract

The invention provides a liquid crystal display substrate and a manufacturing method thereof applied to the technical field of liquid crystal display, and the liquid crystal display substrate comprises an aluminum alloy upper substrate which is used for bearing a glass substrate to carry out HPCP photoresist curing heating; and the lower aluminum alloy substrate is packaged at the bottom of the upper aluminum alloy substrate and used for providing adsorption force for the glass substrate, so that the glass substrate is attached to the upper surface of the upper aluminum alloy substrate in the heating process. The adsorption device is arranged on the upper aluminum alloy substrate, is communicated with an output port and an input port of the lower aluminum alloy substrate and is matched with an external negative pressure mechanism to provide stable adsorption force for the glass substrate, so that the glass substrate is tightly attached to the upper aluminum alloy substrate, and warping and deviation in the heating process are avoided; and meanwhile, the heat can be uniformly distributed through the soaking channel, so that the glass substrate is uniformly heated, and the curing consistency of the HPCP photoresist is improved.

Description

Technical Field

[0001] This application relates to the field of liquid crystal display technology, and in particular to a liquid crystal display substrate and its manufacturing method. Background Technology

[0002] Liquid crystal displays (LCDs) are widely used in various electronic devices such as televisions, monitors, and mobile terminals due to their advantages of being thin, light, low-power, and high-definition. The glass substrate, as the core component of LCD devices, directly determines the display effect, lifespan, and mass production yield of the LCD device through its structural stability, surface flatness, optical performance, and processing precision.

[0003] The glass substrate industry is currently accelerating its iteration towards 8K ultra-high definition and large sizes (65 inches and above), which continuously increases the performance requirements for glass substrates. However, existing glass substrates still have many shortcomings in manufacturing and use: during the molding process of large-size glass substrates, the rigidity of the supporting substrate is insufficient and the heat deformation resistance is poor, which can easily lead to warping and deformation of the substrate. This causes the surface flatness deviation of the glass substrate to exceed the allowable range, which in turn affects the uniformity of liquid crystal molecule arrangement and results in problems such as blurry display and color deviation.

[0004] Therefore, a liquid crystal display substrate and its manufacturing method are proposed. Summary of the Invention

[0005] The purpose of this application is to solve the problems of high thermal expansion coefficient, easy deformation at high temperatures, and insufficient lightweight of existing substrates, and to provide a liquid crystal display substrate compared with the prior art, comprising: An aluminum alloy upper substrate is used to support a glass substrate for HPCP photoresist curing heating. The aluminum alloy lower substrate is encapsulated at the bottom of the aluminum alloy upper substrate and is used to provide an adsorption force for the glass substrate, so that the glass substrate adheres to the upper surface of the aluminum alloy upper substrate during the heating process.

[0006] Furthermore, the top of the aluminum alloy upper substrate is provided with a bearing groove that cooperates with the glass substrate, and the side of the aluminum alloy upper substrate away from the glass substrate is provided with a diverging tie. Several of the diverging ties are evenly distributed at equal angles on the bottom side of the aluminum alloy upper substrate, and a cross reinforcing rib is provided in the middle of the bottom of the aluminum alloy upper substrate. All the diverging ties are connected to the cross reinforcing rib.

[0007] Furthermore, a heat equalization channel is provided between adjacent diverging tie rods. The heat equalization channel is provided with a number of equally spaced negative pressure through holes. The negative pressure through holes penetrate the aluminum alloy upper substrate and connect the heat equalization channel with the bearing groove.

[0008] Furthermore, auxiliary tie rods are fixed inside the heat dissipation channel, and the auxiliary tie rods are symmetrically arranged between two sets of adjacent diverging tie rods.

[0009] Furthermore, the end of the diverging tie away from the cross reinforcing rib extends to the side of the upper aluminum alloy substrate and is provided with a partition rib. The lower aluminum alloy substrate is sleeved on the bottom of the upper aluminum alloy substrate. The partition rib separates the sleeved side of the upper aluminum alloy substrate and the lower aluminum alloy substrate into an input port. The lower aluminum alloy substrate is also provided with a cover plate corresponding to the heat dissipation channel. The cover plate is used to enclose the corresponding heat dissipation channel. The middle part of the lower aluminum alloy substrate is provided with an output port corresponding to the input port. The output port is connected to an external negative pressure mechanism. The output port is connected to the output end of the heat dissipation channel. The input port is connected to the input end of the heat dissipation channel.

[0010] A method for manufacturing a liquid crystal display substrate includes the following steps: S1. Raw material pretreatment: 7075 aluminum alloy and aluminum nitride particles are selected, and aluminum-aluminum nitride composite matrix is ​​adopted. The two are fused by friction stir welding. After solution treatment and aging, the thermal expansion coefficient of the matrix is ​​reduced to below 11×10^-6 / ℃, and the yield strength retention rate at 80℃ is ≥88%. S2. Aluminum alloy upper substrate processing: The aluminum alloy upper substrate is processed by extrusion molding process, and the bearing groove, diverging tie rod, cross reinforcing rib, heat dissipation channel, negative pressure through hole, auxiliary tie rod and partition rib are milled to complete the aluminum alloy upper substrate processing. S3. Aluminum alloy lower substrate processing: The aluminum alloy lower substrate is processed by extrusion molding process, and the cover plate, input port and output port are milled to complete the processing of the aluminum alloy lower substrate. S4. Assembly: Install high and low temperature resistant elastic washers between the upper aluminum alloy substrate and the lower aluminum alloy substrate, and tighten the upper aluminum alloy substrate and the lower aluminum alloy substrate with bolts and fit them together, and check the airflow connectivity. S5. Post-processing and inspection: The assembled aluminum alloy upper substrate and aluminum alloy lower substrate are polished, and the finished product is obtained after passing the inspection.

[0011] Furthermore, in step S1, the friction stir welding process controls the welding temperature to 450-550℃, the solution aging temperature to 120-150℃, and the holding time to 2-3 hours to ensure the stability of the composite matrix performance.

[0012] Furthermore, in step S1, the ratio of aluminum nitride particles to 7075 aluminum alloy is 1:5.

[0013] Furthermore, in step S4, the high and low temperature resistant elastic gasket is made of silicone rubber, and the splicing gap is ≤0.04mm.

[0014] Compared to existing technologies, the advantages of this application are: This application provides a heat-equalizing channel between the diverging tendons. The heat-equalizing channel has negative pressure through holes that are connected to the output and input ports of the aluminum alloy lower substrate. In conjunction with an external negative pressure mechanism, it can provide a stable adsorption force for the glass substrate, ensuring that the glass substrate is tightly attached to the aluminum alloy upper substrate and preventing warping or displacement during the heating process. At the same time, the heat-equalizing channel can make the heat evenly distributed, ensuring that the glass substrate is heated evenly and improving the consistency of HPCP photoresist curing. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the glass substrate, the upper aluminum alloy substrate, and the lower aluminum alloy substrate proposed in this application. Figure 2 for Figure 1 Enlarged structural diagram of section A in the middle; Figure 3 This is an exploded structural diagram of the aluminum alloy upper substrate and aluminum alloy lower substrate proposed in this application; Figure 4 This is a schematic diagram of the bottom structure of the aluminum alloy upper substrate proposed in this application; Figure 5 for Figure 4 Enlarged structural diagram of section B in the middle; Figure 6 This is a schematic diagram of the gas flow direction in the heat exchange channel proposed in this application.

[0016] Explanation of the labels in the diagram: 1. Glass substrate; 2. Aluminum alloy upper substrate; 201. Heat dissipation channel; 202. Negative pressure through hole; 21. Bearing groove; 22. Diverging tie; 221. Separating rib; 23. Auxiliary tie; 24. Cross reinforcing rib; 3. Aluminum alloy lower substrate; 301. Inlet; 31. Cover plate; 32. Outlet. Detailed Implementation

[0017] The embodiments will be described clearly and completely with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments in this application without creative effort are within the scope of protection of this application.

[0018] Example 1:

[0019] This invention provides a liquid crystal display substrate; please refer to [link / reference]. Figure 1 - Figure 5 It includes an upper aluminum alloy substrate 2 and a lower aluminum alloy substrate 3. The upper aluminum alloy substrate 2 is used to support the glass substrate 1 for HPCP photoresist curing heating. The lower aluminum alloy substrate 3 is encapsulated at the bottom of the upper aluminum alloy substrate 2 and is used to provide adsorption force for the glass substrate 1, so that the glass substrate 1 adheres to the upper surface of the upper aluminum alloy substrate 2 during the heating process.

[0020] The top of the aluminum alloy upper substrate 2 is provided with a bearing groove 21 that mates with the glass substrate 1. A diverging rib 22 is provided on the side of the aluminum alloy upper substrate 2 away from the glass substrate 1. Several diverging ribs 22 are evenly distributed at equal angles on the bottom edge of the aluminum alloy upper substrate 2. A cross-shaped reinforcing rib 24 is provided in the center of the bottom of the aluminum alloy upper substrate 2, and all diverging ribs 22 are connected to the cross-shaped reinforcing rib 24. A heat dissipation channel 201 is provided between adjacent diverging ribs 22. Several equally spaced negative pressure through holes 202 are provided on the heat dissipation channel 201, penetrating the aluminum alloy upper substrate 2 and connecting the heat dissipation channel 201 to the bearing groove 21. An auxiliary rib 23 is fixed inside the heat dissipation channel 201, and the auxiliary ribs 23 are symmetrically arranged on two adjacent sets of diverging ribs 22. The radiating tie 22 extends away from the cross reinforcing rib 24 to the side of the upper aluminum alloy substrate 2 and is provided with a dividing rib 221. The lower aluminum alloy substrate 3 is sleeved on the bottom of the upper aluminum alloy substrate 2. The dividing rib 221 separates the sleeved side of the upper aluminum alloy substrate 2 and the lower aluminum alloy substrate 3 into an inlet 301. The lower aluminum alloy substrate 3 is also provided with a cover plate 31 corresponding to the heat dissipation channel 201. The cover plate 31 is used to encapsulate the corresponding heat dissipation channel 201. The middle part of the lower aluminum alloy substrate 3 is provided with an outlet 32 ​​corresponding to the inlet 301. The outlet 32 ​​is connected to an external negative pressure mechanism. The outlet 32 ​​is connected to the output end of the heat dissipation channel 201. The inlet 301 is connected to the input end of the heat dissipation channel 201.

[0021] In practical use, the liquid crystal display substrate of the present invention first places the glass substrate 1, which needs to be cured with HPCP photoresist, into the support groove 21 of the aluminum alloy upper substrate 2. The support groove 21 cooperates with the glass substrate 1 to provide initial positioning for the glass substrate 1 and prevent the glass substrate 1 from shifting laterally. Then, the external negative pressure mechanism is connected to the output port 32 of the aluminum alloy lower substrate 3 and the external negative pressure mechanism is activated. The external negative pressure mechanism draws air from the heat dissipation channel 201 through the output port 32 to form a negative pressure environment in the heat dissipation channel 201. At this time, outside air enters the heat dissipation channel 201 through the input port 301. Under the action of negative pressure, the air in the support groove 21 is drawn into the heat dissipation channel 201 through the negative pressure through hole 202, thereby causing the lower surface of the glass substrate 1 to be subjected to a downward adsorption force, ensuring that the glass substrate 1 is tightly attached to the support groove 21 of the aluminum alloy upper substrate 2 and preventing the glass substrate 1 from warping or shifting during the heating process.

[0022] After the glass substrate 1 is fixed, the upper aluminum alloy substrate 2 is heated to cure the HPCP photoresist on the glass substrate 1. During the heating process, the heat dissipation channel 201 at the bottom of the upper aluminum alloy substrate 2 can distribute the heat evenly, avoiding excessively high or low local temperatures on the upper aluminum alloy substrate 2, ensuring uniform heating of the glass substrate 1, and thus guaranteeing the curing effect of the HPCP photoresist. At the same time, the diverging ribs 22, the cross reinforcing ribs 24, and the auxiliary ribs 23 in the heat dissipation channel 201 at the bottom of the upper aluminum alloy substrate 2 work together to effectively improve the structural strength of the upper aluminum alloy substrate 2 and prevent deformation of the upper aluminum alloy substrate 2 during high-temperature heating. In addition, the upper aluminum alloy substrate 2 and the lower aluminum alloy substrate 3 are made of aluminum-aluminum nitride composite matrix. After the composite matrix is ​​fused by friction stir welding and solution aging treatment, the coefficient of thermal expansion is reduced to below 11×10^-6 / ℃, and the yield strength retention rate at 80℃ is ≥88%, which can effectively resist high-temperature deformation and further ensure the bonding stability of the glass substrate 1.

[0023] During assembly, the high and low temperature resistant elastic gasket installed between the upper aluminum alloy substrate 2 and the lower aluminum alloy substrate 3 is made of silicone rubber. It can effectively fill the splicing gap between the two, ensuring that the splicing gap is ≤0.04mm, improving the assembly sealing performance, avoiding negative pressure leakage in the heat dissipation channel 201, and ensuring the stability of the adsorption force. At the same time, the high and low temperature resistant elastic gasket can adapt to a wide temperature range of -50-160℃, which is suitable for the heating conditions of HPCP photoresist curing, and avoids gasket failure under high or low temperature environments.

[0024] After the HPCP photoresist has cured, the external negative pressure mechanism is turned off, the negative pressure environment in the heat dissipation channel 201 disappears, and the adsorption force of the glass substrate 1 is released. At this time, the glass substrate 1 can be taken out from the carrier tank 21 to complete the curing process. If maintenance or replacement of the substrate is required, the bolts can be loosened to separate the upper aluminum alloy substrate 2 and the lower aluminum alloy substrate 3 for individual maintenance or replacement, thereby reducing maintenance and replacement costs.

[0025] Example 2:

[0026] This invention provides a method for manufacturing a liquid crystal display substrate. Please refer to [link / reference]. Figure 1 - Figure 6 Components that are the same as or corresponding to those in Embodiment 1 are referred to by the same reference numerals as those in Embodiment 1. For the sake of simplicity, only the differences from Embodiment 1 will be described below: Includes the following steps: S1. Raw material pretreatment: 7075 aluminum alloy and aluminum nitride particles are selected, with the ratio of aluminum nitride particles to 7075 aluminum alloy being 1:5. An aluminum-aluminum nitride composite matrix is ​​used, and the two are fused together by friction stir welding. The welding temperature of the friction stir welding process is controlled at 450-550℃. Subsequently, solution aging treatment is performed at a temperature of 120-150℃ for 2-3 hours to reduce the coefficient of thermal expansion of the matrix to below 11×10^-6 / ℃, and the yield strength retention rate at 80℃ is ≥88%. S2. Processing of aluminum alloy upper substrate 2: The aluminum alloy upper substrate 2 is processed by extrusion molding process, and then milling process is used to mill the bearing groove 21 on the top of the aluminum alloy upper substrate 2, and the diverging tie 22, cross reinforcing rib 24, heat dissipation channel 201, auxiliary tie rib 23 and partition rib 221 on the bottom. Several equally spaced negative pressure through holes 202 are milled on the heat dissipation channel 201 to ensure that the negative pressure through holes 202 penetrate the aluminum alloy upper substrate 2 and are connected to the bearing groove 21, thus completing the processing of aluminum alloy upper substrate 2. S3. Processing of aluminum alloy lower substrate 3: The aluminum alloy lower substrate 3 is processed by extrusion molding process, and then the cover plate 31, the input port 301 and the output port 32 are milled on the aluminum alloy lower substrate 3 by milling process to complete the processing of aluminum alloy lower substrate 3. S4. Assembly: Install a high and low temperature resistant elastic gasket between the upper aluminum alloy substrate 2 and the lower aluminum alloy substrate 3. The high and low temperature resistant elastic gasket is made of silicone rubber to ensure that the splicing gap is ≤0.04mm. Then, tighten the upper aluminum alloy substrate 2 and the lower aluminum alloy substrate 3 with bolts and fit them together. Check the airflow connectivity between the heat dissipation channel 201 and the inlet 301 and outlet 32 ​​to ensure that there is no leakage. S5. Post-processing and inspection: The assembled aluminum alloy upper substrate 2 and aluminum alloy lower substrate 3 are polished to remove burrs and impurities generated during processing and assembly. Then, the structural dimensions, splicing gaps, adsorption performance, deformation resistance and connectivity of the substrates are inspected. Once the inspection is qualified, it is a finished product.

[0027] In this embodiment, the upper aluminum alloy substrate 2 and the lower aluminum alloy substrate 3 are bolted together and fitted together, making assembly and disassembly convenient, facilitating subsequent maintenance and replacement, and reducing maintenance and replacement costs. Simultaneously, they can be flexibly combined according to the actual equipment frame specifications, reducing customized production cycles, improving equipment adaptability, and meeting the usage needs of equipment of different specifications. The friction stir welding process controls the welding temperature to 450-550℃, the solution aging temperature to 120-150℃, and the holding time to 2-3 hours. This ensures the stability of the aluminum-aluminum nitride composite substrate, avoids delamination and cracking, and further enhances the substrate's resistance to deformation and its service life. A high- and low-temperature resistant elastic gasket is installed between the upper aluminum alloy substrate 2 and the lower aluminum alloy substrate 3 to improve assembly sealing, prevent negative pressure leakage in the heat dissipation channel 201, and ensure stable adsorption force. Moreover, the high- and low-temperature resistant elastic gasket can adapt to a wide temperature range and is suitable for the heating conditions of HPCP photoresist curing, preventing gasket failure and improving the stability and reliability of the product.

[0028] The above description is merely the best implementation method adopted in light of current practical needs, but the scope of protection of this application is not limited thereto.

Claims

1. A liquid crystal display substrate, characterized in that, include: An aluminum alloy upper substrate (2) is used to support a glass substrate (1) for HPCP photoresist curing heating; The lower aluminum alloy substrate (3) is encapsulated at the bottom of the upper aluminum alloy substrate (2) and is used to provide an adsorption force for the glass substrate (1) so that the glass substrate (1) adheres to the upper surface of the upper aluminum alloy substrate (2) during the heating process.

2. A liquid crystal display substrate according to claim 1, characterized in that, The top of the aluminum alloy upper substrate (2) is provided with a bearing groove (21) that cooperates with the glass substrate (1). The aluminum alloy upper substrate (2) is provided with a diverging rib (22) on the side away from the glass substrate (1). Several diverging ribs (22) are evenly distributed at the bottom edge of the aluminum alloy upper substrate (2). A cross reinforcing rib (24) is provided in the middle of the bottom of the aluminum alloy upper substrate (2). The diverging ribs (22) are all connected to the cross reinforcing rib (24).

3. A liquid crystal display substrate according to claim 2, characterized in that, A heat equalization channel (201) is provided between adjacent diverging tie rods (22). The heat equalization channel (201) is provided with a number of equally spaced negative pressure through holes (202). The negative pressure through holes (202) penetrate the aluminum alloy upper substrate (2) and connect the heat equalization channel (201) with the bearing groove (21).

4. A liquid crystal display substrate according to claim 3, characterized in that, An auxiliary tie rod (23) is fixed inside the heat dissipation channel (201), and the auxiliary tie rod (23) is symmetrically arranged between two adjacent sets of diverging tie rods (22).

5. A liquid crystal display substrate according to claim 4, characterized in that, The diverging rib (22) extends away from the cross reinforcing rib (24) to the side of the upper aluminum alloy substrate (2) and is provided with a partition rib (221). The lower aluminum alloy substrate (3) is sleeved on the bottom of the upper aluminum alloy substrate (2). The partition rib (221) separates the sleeved side of the upper aluminum alloy substrate (2) and the lower aluminum alloy substrate (3) into an input port (301). The lower aluminum alloy substrate (3) is also provided with a cover plate (31) corresponding to the heat dissipation channel (201). The cover plate (31) is used to encapsulate the corresponding heat dissipation channel (201). The middle part of the lower aluminum alloy substrate (3) is provided with an output port (32) corresponding to the input port (301). The output port (32) is connected to an external negative pressure mechanism. The output port (32) is connected to the output end of the heat dissipation channel (201). The input port (301) is connected to the input end of the heat dissipation channel (201).

6. A method for manufacturing a liquid crystal display substrate, used to prepare the liquid crystal display substrate according to claim 5, characterized in that, Includes the following steps: S1. Raw material pretreatment: 7075 aluminum alloy and aluminum nitride particles are selected, and aluminum-aluminum nitride composite matrix is ​​adopted. The two are fused by friction stir welding. After solution treatment and aging, the thermal expansion coefficient of the matrix is ​​reduced to below 11×10^-6 / ℃, and the yield strength retention rate at 80℃ is ≥88%. S2. Aluminum alloy upper substrate (2) processing: The aluminum alloy upper substrate (2) is processed by extrusion molding process, and the bearing groove (21), diverging tie (22), cross reinforcing rib (24), heat dissipation channel (201), negative pressure through hole (202), auxiliary tie (23) and partition rib (221) are milled to complete the processing of aluminum alloy upper substrate (2); S3, Aluminum alloy lower substrate (3) processing: The aluminum alloy lower substrate (3) is processed by extrusion molding process, and the cover plate (31), input port (301) and output port (32) are milled to complete the processing of the aluminum alloy lower substrate (3); S4. Assembly: Install high and low temperature resistant elastic gaskets between the upper aluminum alloy substrate (2) and the lower aluminum alloy substrate (3), and tighten the upper aluminum alloy substrate (2) and the lower aluminum alloy substrate (3) with bolts and fit them together to check the airflow connectivity. S5. Post-processing and inspection: The assembled aluminum alloy upper substrate (2) and aluminum alloy lower substrate (3) are polished and inspected to ensure they pass the inspection.

7. A method for manufacturing a liquid crystal display substrate according to claim 5, characterized in that, In step S1, the friction stir welding process controls the welding temperature to 450-550℃, the solution aging temperature to 120-150℃, and the holding time to 2-3 hours to ensure the stability of the composite matrix performance.

8. A method for manufacturing a liquid crystal display substrate according to claim 5, characterized in that, In step S1, the ratio of aluminum nitride particles to 7075 aluminum alloy is 1:

5.

9. A method for manufacturing a liquid crystal display substrate according to claim 5, characterized in that, In step S4, the high and low temperature resistant elastic gasket is made of silicone rubber, and the splicing gap is ≤0.04mm.

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