Joint butt joint method for connecting component fine wire and multi-strand wire

Abstract

The invention provides a connector butt joint method for connecting a component fine wire and a multi-strand wire. The connector butt joint method comprises the following steps: adjusting the fine wire of a silver-plated copper wire to be in a divergent shape; the divergent filaments are placed in the horn-shaped channel, and the divergent filaments are arranged upwards; the tail section of the fine nickel wire is downwards inserted into the middle of the divergent fine wire; powdery brazing filler metal, copper wire segments and liquid brazing filler metal are added into the horn-shaped channel; the side wall of the horn-shaped channel is heated, so that the brazing filler metal located in the horn-shaped channel is kept in a molten state; and the silver-plated copper wire is pulled down according to the preset speed so as to control the flowing state of the brazing filler metal, and in the pull-down treatment process, filaments of the silver-plated copper wire are gradually folded and extrude the molten brazing filler metal.

Description

[0001] Cross-referencing This application claims priority to U.S. Application No. US19401394, filed November 25, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention belongs to the field of electronic component welding technology, specifically relating to a joint connection method for connecting component microfilaments and multi-strand wires. Background Technology

[0003] The developed component micro-wire lead connector and its morphology control method (see existing literature CN118572401A) includes a micro-wire lead, to which multiple strands of connecting wire are soldered via a solder body. The multiple strands of the wire are axially wrapped around the micro-wire lead, with the axis of the micro-wire lead essentially coinciding with the axis of the connecting wire. The non-gaps within the multiple strands of the wire and the gaps between the multiple strands and the micro-wire lead are filled with solder body. The multiple strands of the connecting wire are embedded in the solder body and "grip" the micro-wire lead. This solution allows for rapid and precise control of the micro-wire connector morphology and facilitates precise control of the micro-wire connector length.

[0004] However, the strength of the joint between the aforementioned micro-nickel wire and multi-strand silver-plated copper wire still needs to be optimized, and its axial tensile strength needs to be improved. Therefore, a joint connection method for connecting micro-wires and multi-strand wires of components is provided to improve the joint strength of micro-nickel wires and multi-strand silver-plated copper wires, while significantly improving the axial tensile strength of micro-nickel wires and multi-strand silver-plated copper wires. Summary of the Invention

[0005] In order to at least address the problems mentioned in the background art, the present invention aims to provide a method for connecting component microfilaments and multi-strand wires to a connector.

[0006] This specification provides an embodiment of a connector mating method for connecting microfilaments of electronic components to multi-strand wires, including: Step 110: Adjust the fine filaments of the silver-plated copper wire to a divergent shape; Step 120: Place the diverging filaments in the funnel-shaped channel with the diverging filaments facing upwards. Step 130: Insert the end of the fine nickel wire downwards into the middle of the diverging filament; Step 140: Add powdered brazing filler metal, copper wire segments, and liquid brazing filler metal into the funnel-shaped channel; the surface of the end segment of the fine nickel wire adopts a non-smooth wall structure; Step 150: Heat the sidewall of the funnel-shaped channel to keep the brazing filler metal in the funnel-shaped channel in a molten state; Step 160: Pull down the silver-plated copper wire at a preset speed to control the flow state of the brazing filler metal. During the pull-down process, the fine filaments of the silver-plated copper wire gradually gather and squeeze the molten brazing filler metal.

[0007] The connector connection method for connecting micro-wires and multi-strand wires provided in some embodiments of this specification has at least the following beneficial effects: it improves the connection strength of micro-nickel wires and multi-strand silver-plated copper wires, and at the same time, it significantly improves the axial tensile strength of micro-nickel wires and multi-strand silver-plated copper wires. Attached Figure Description

[0008] Figure 1 This is a schematic diagram illustrating the process of connecting a fine nickel wire to a multi-strand silver-plated copper wire electrode according to some embodiments of this specification; Figure 2 This is a schematic diagram illustrating the connection process of another fine nickel wire to a multi-strand silver-plated copper wire electrode according to some embodiments of this specification; Figure 3 This is a schematic diagram illustrating the connection process of a fine nickel wire to a multi-strand silver-plated copper wire electrode, as shown in some embodiments of this specification. Figure 4 This is a top-view schematic diagram showing copper wire segments placed in grooves of fine nickel wires according to some embodiments of this specification; Figure 5 This is a side view of a copper wire segment placed in a groove of a fine nickel wire, according to some embodiments of this specification. Figure 6 This is a top-down schematic diagram showing the upper part of the copper wire segment far away from the end of the fine nickel wire and radially spread out according to some embodiments of this specification; Figure 7 This is a lateral schematic diagram showing the upper part of the copper wire segment far away from the end of the fine nickel wire and radially spread out according to some embodiments of this specification; Figure 8 This is a top-view schematic diagram illustrating the process of connecting a fine nickel wire to a multi-strand silver-plated copper wire electrode according to some embodiments of this specification; Figure 9 This is a cross-sectional schematic diagram illustrating the process of connecting a fine nickel wire to a multi-strand silver-plated copper wire electrode according to some embodiments of this specification. Figure 10 This is an exemplary flowchart of a connector mating method for connecting component microfilaments and multi-strand wires according to some embodiments of this specification.

[0009] Reference numerals: 1. Copper wire segment; 2. Brazing filler metal; 3. Silver-plated copper wire; 4. Groove; 5. Liquid brazing filler metal; 6. Powdered brazing filler metal; 7. Fine wire; 8. Etching point; 9. End of micro-fine nickel wire; 10. Horn-shaped channel; 11. Graphite component one; 12. Graphite component two; 13. Cooling support block; 14. Cooling channel; 20. Angled through hole; 21. Injection needle; 22. Through hole. Detailed Implementation

[0010] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0011] Figure 1 This is a schematic diagram illustrating the process of connecting a fine nickel wire to a multi-strand silver-plated copper wire electrode according to some embodiments of this specification; Figure 3 This is a schematic diagram illustrating the connection process of another fine nickel wire to a multi-strand silver-plated copper wire electrode according to some embodiments of this specification; Figure 9 This is a cross-sectional schematic diagram illustrating the process of connecting a fine nickel wire to a multi-strand silver-plated copper wire electrode according to some embodiments of this specification.

[0012] The connector mating method for connecting component microfilaments and multi-strand wires provided in some embodiments of this specification uses a welding tool to control the shape of the mating joint and the flowability of the solder.

[0013] Combination Figures 1 to 3 , Figure 9 As shown, the welding tool includes a graphite assembly, which includes a graphite component 11 connected to the positive terminal of the welding power supply and a graphite component 12 connected to the negative terminal of the welding power supply.

[0014] In some embodiments, both graphite component 11 and graphite component 12 are provided with arc grooves, which are used to form a horn-shaped channel 10 for accommodating the silver-plated copper wire 3.

[0015] Graphite component 11 and graphite component 12 are used to fix the flared channel 10 and to heat the sidewalls of the flared channel 10. By setting up graphite components, the high temperature resistance and good thermal conductivity of graphite components are utilized to improve the stability and efficiency of joint mating processes (such as the first process, the second process, and the third process).

[0016] In some embodiments, a cooling support block 13 is disposed against the wall below the graphite assembly, and the through hole 22 on the cooling support block 13 is arranged coaxially with the horn-shaped channel 10.

[0017] The cooling support block 13 can be made of a metal material with high thermal conductivity, such as copper or aluminum alloy. The cooling support block 13 supports the entire graphite assembly. In some embodiments, a cooling channel 14 is provided inside the cooling support block 13. The cooling channel 14 is perpendicular to the length direction of the through hole 22, and can be configured to communicate with the through hole 22 or to pass near the through hole 22. In some embodiments, the cooling control system can inject coolant (such as water) through the cooling channel 14. The coolant is used to cool the silver-plated copper wire 3 passing through the through hole 22 to promote the solidification of the molten solder and to promote the shaping of the electrode connection joint.

[0018] In some embodiments, the diameter of the lower section of the horn-shaped channel 10 is equal to the outer diameter of the silver-plated copper wire 3, and the diameter of the through hole 22 is equal to the outer diameter of the silver-plated copper wire 3.

[0019] In some embodiments, a screw lifting mechanism for vertically pulling down the silver-plated copper wire 3 is provided below the cooling support block 13. The lifting plate of the screw lifting mechanism is provided with a clamp for holding the silver-plated copper wire 3. In some embodiments, the screw lifting mechanism is configured to: control the clamp to rise to the target height and clamp the silver-plated copper wire 3 in response to the need to vertically pull down the silver-plated copper wire 3; control the clamp to move down at a preset speed to realize vertically pulling down the silver-plated copper wire 3 at a preset speed.

[0020] In some embodiments, a slanted through hole 20 is provided on graphite component 11 or graphite component 12, and a movable injection needle 21 is provided in the slanted through hole 20. In the initial state, the tip of the injection needle 21 just coincides with the side wall of the trumpet-shaped channel 10 (e.g., Figure 1 As shown, the injection needle 21 has an orifice diameter of 0.45 mm, and its tip can extend into the target area of ​​the flared channel 10. The injection needle 21 is externally connected to a liquid solder injection system. More details about the flared channel 10, injection needle 21, initial state, cooling control system, and liquid solder injection system are described below.

[0021] This specification provides a method for connecting a component's microfilament to a multi-strand wire via several embodiments. The method includes steps 1 to 6. Hereinafter, this method is also referred to as a first process. In this first process, the powdered solder 6 is a powder with a particle size of 100-150 mesh, comprising the following parts by weight of raw materials and unavoidable impurities: AgCuZn: 38 parts, Ni: 8 parts, Cr: 3 parts, Mo: 1.2 parts, Li: 1.4 parts.

[0022] Step 1: Adjust the fine wires 7 of the silver-plated copper wire 3 to a divergent shape; Step 2: Place the divergent filaments 7 in the funnel-shaped channel 10 with the divergent filaments 7 facing upwards.

[0023] Step 3: Insert the end of the fine nickel wire 9 vertically downward into the middle of the diverging fine wire 7.

[0024] The lower end of the micro-nickel wire segment 9 is 5mm away from the root of the diverging filament (that is, the lower end of the micro-nickel wire segment 9 is 5mm away from the lower end of the stripped area of ​​the silver-plated copper wire 3, and the lower end of the stripped area of ​​the silver-plated copper wire 3 is also called the boundary area between the lower section of the trumpet-shaped channel and the upper section of the trumpet-shaped channel); the surface of the micro-nickel wire segment 9 adopts a non-glossy structure, specifically, etched points are processed on the surface of the micro-nickel wire segment 9.

[0025] Step 4: Add powdered brazing filler metal 6 and liquid brazing filler metal 5 into the funnel-shaped channel.

[0026] Step 41: Control the injection needle 21 to move upward until the tip of the injection needle 21 extends into the axis of the funnel-shaped channel 10.

[0027] Step 42: Add a measured amount of powdered brazing filler metal 6 into the channel from above the horn-shaped channel 10.

[0028] The added powdered brazing filler metal 6 is mainly distributed in the upper region of the radiating filaments 7 and the periphery of the filaments 7.

[0029] Step 43: Start the liquid brazing filler metal injection system.

[0030] The injection pressure is set to 0.35 MPa. The set amount of liquid brazing filler metal 5 is injected into the funnel-shaped channel. At this time, the injected liquid brazing filler metal 5 mainly fills the area where the powdered brazing filler metal 6 has not entered, including the lower area of ​​the radiating filaments 7 but located in the gaps between multiple filaments 7.

[0031] Step 44: Control the injection needle 21 to retract to the initial state so that the tip of the injection needle 21 just coincides with the side wall of the funnel-shaped channel 10.

[0032] Step 45: Activate the cooling control system corresponding to the cooling support block 13.

[0033] Step 5: Heat the sidewall of the horn-shaped channel 10 to keep the brazing filler metal in the horn-shaped channel 10 in a molten state.

[0034] Step 6: Pull down the silver-plated copper wire 3 at a preset speed to control the flow state of the brazing filler metal. During the pull-down process, the fine wires 7 of the silver-plated copper wire 3 gradually gather and squeeze the molten brazing filler metal.

[0035] When the silver-plated copper wire 3 is pulled down to the target position and removed, a connector is obtained between the fine nickel wire and the multi-strand silver-plated copper wire electrode.

[0036] The details of steps 1 to 6 described above can be found elsewhere in this specification (such as in the second or third process).

[0037] In the first process described above, when the injection pressure of the liquid solder injection system is set to 0.35 MPa, it is referred to as Example 1; when the injection pressure of the liquid solder injection system is set to 0.4 MPa, it is referred to as Example 2.

[0038] Comparative Example 1: Referring to Example 1, the difference between Example 1 and Example 1 is that in step 4, only powdered brazing filler metal 6 is added into the funnel-shaped channel, and the amount of powdered brazing filler metal 6 is the same as the total amount of brazing filler metal in the two states in Example 1.

[0039] Comparative Example 2: Referring to Example 1, the difference between Example 1 and Example 2 is that in step 4, only liquid brazing filler metal 5 is added into the funnel-shaped channel, and the amount of liquid brazing filler metal 5 used is the same as the total amount of brazing filler metal in the two states in Example 1.

[0040] Compared with Example 1, Example 3 differs from Example 1 in that the powdered brazing filler metal 6 uses powder with a particle size of 100-150 mesh, including the following parts by weight of raw materials and unavoidable impurities, namely, AgCuZn: 38 parts, Ni: 8 parts, Cr: 3 parts, Mo: 1.2 parts, Li: 1.4 parts, and sodium chloride: 2 parts; in step 4, the powdered brazing filler metal 6 is added only into the funnel-shaped channel, and the amount of the powdered brazing filler metal 6 is the same as the total amount of brazing filler metal in the two states in Example 1.

[0041] Compared with Example 4, referring to Example 1, the difference between Example 4 and Example 1 is that the injection pressure of the liquid solder injection system is set to 0.5 MPa.

[0042] Compared with Example 1, Example 5 differs from Example 1 in that the injection pressure of the liquid solder injection system is set to 0.3 MPa.

[0043] Defect detection (RT) and dimensional inspection were performed on the electrode connection joint samples of the micro-nickel wire and multi-strand silver-plated copper wire obtained in Example 1 and the comparative example. The results are shown in the table below.

[0044] It is evident that the solutions in Examples 1 and 2 effectively solve the problem of the brazing filler metal failing to fully wet the fine gaps in the multi-strand silver-plated copper wires, significantly reducing joint defects.

[0045] In some embodiments of this specification, the solder without flow agent is made to smoothly and fully wet the gaps in the base material (i.e., to fully immerse itself in and wet the gaps in the fine filaments of the multi-strand silver-plated copper wire). In particular, by using a specific operating method to add powdered solder and liquid solder to different areas within the funnel-shaped channel, the solder is made to smoothly penetrate into the gaps in the fine filaments. During the process of pulling down and gathering the multi-strand silver-plated copper wire, the wire and the micro-filament are effectively connected. The flowability of the solder in the connection area between the micro-nickel wire and the multi-strand silver-plated copper wire is precisely and flexibly controlled. This allows the electrode connection area between the micro-nickel wire and the multi-strand silver-plated copper wire to extend to the root of the diverging filament, significantly improving the length and strength of the connection area.

[0046] Figure 10 This is an exemplary flowchart of a connector mating method for connecting component microfilaments and multi-strand wires according to some embodiments of this specification.

[0047] This specification provides a method for connecting a component's microfilament to a multi-strand wire using certain embodiments, such as... Figure 10 As shown, the method includes steps 110 to 160. Hereinafter, this method is also referred to as the second process. The difference between the second process and the first process is that, in the second process, in addition to adding powdered brazing filler metal 6 and liquid brazing filler metal 5 into the funnel-shaped channel 10, copper wire segments 1 are additionally added.

[0048] Step 110: Adjust the fine wires 7 of the silver-plated copper wire 3 to a divergent shape.

[0049] The fine filaments 7 of the silver-plated copper conductor 3 refer to the multiple strands of fine filaments exposed after the insulation layer of the silver-plated copper conductor 3 is stripped off.

[0050] In some embodiments, the multiple filaments 7 of the silver-plated copper conductor 3 are separated from each other at different angles to form a divergent pattern. The number of filaments 7 (e.g., 17 strands, 19 strands, etc.) and their diameter are determined by the preset specifications of the silver-plated copper conductor 3. In some embodiments, the number of filaments 7 is not less than 15 strands, and the diameter of the filaments 7 is not greater than 0.06 mm (e.g., 0.05 mm).

[0051] In some embodiments, a point can be fixed in the silver-plated copper wire 3, and multiple filaments 7 in the silver-plated copper wire 3 are radially separated (pried apart) with this point as the reference point. The different filaments 7 form an angle within a preset angle range in space to obtain divergent filaments 7, whose shape is similar to a funnel-shaped profile. The preset angle range can be determined according to the shape of the trumpet-shaped channel 10 (such as the opening size).

[0052] Step 120: Place the divergent filaments 7 in the funnel-shaped channel 10 with the divergent filaments 7 facing upwards.

[0053] The trumpet-shaped channel 10 refers to a space shaped like a trumpet. The trumpet-shaped channel 10 comprises two parts, combined... Figure 1 One part of the horn-shaped channel 10 is called the lower section, which is a cylindrical cavity; the other part of the horn-shaped channel 10 is called the upper section, which is a conical cavity with decreasing diameter from top to bottom.

[0054] The upper and lower sections of the flared channel 10 are interconnected. The lower section is used to hold the original portion of the silver-plated copper wire 3 (i.e., the portion where the filaments are not separated), and the upper section is used to hold the radiating filaments 7 of the silver-plated copper wire 3. The roots of the radiating filaments 7 correspond to the boundary (or connection) area between the lower and upper sections of the flared channel 10, where the roots of the radiating filaments 7 refer to the lower end of the stripped area of ​​the silver-plated copper wire 3 (the area where the insulation layer of the silver-plated copper wire 3 is stripped off, exposing the filaments 7). Figure 1 As shown, silver-plated copper wires 3 with diverging filaments 7 are arranged in a trumpet-shaped channel 10, with the diverging filaments 7 arranged upwards and distributed in the upper section of the trumpet-shaped channel 10.

[0055] Step 130: Insert the end segment 9 of the fine nickel wire downwards into the middle of the diverging fine wire 7.

[0056] Micro-nickel wire refers to nickel wire with a very fine size. In some embodiments, the diameter of the micro-nickel wire is no greater than 1.5 mm. In some embodiments, the diameter of the micro-nickel wire is in the range of 0.2 mm to 1 mm. For example, the diameter of the micro-nickel wire is 0.4 mm. The end segment 9 of the micro-nickel wire is used for mating with the silver-plated copper wire.

[0057] The middle part of the diverging filament 7 can be a predetermined position within the diverging filament 7. This predetermined position can be determined based on a predetermined distance from the root of the diverging filament 7. In some embodiments, the predetermined distance is 2 mm to 5 mm. As an example, the predetermined position is located 5 mm from the root of the diverging filament 7 at the lower end of the micro-nickel wire end segment 9.

[0058] like Figure 1 As shown, the end segment 9 of the fine nickel wire has been inserted downwards into a preset position within the diverging filaments 7. Understandably, when the end segment 9 of the fine nickel wire has been inserted downwards into the preset position, the end of the end segment 9 of the fine nickel wire near the lower section of the trumpet-shaped channel 10 is squeezed and fixed by multiple filaments 7.

[0059] In some embodiments of this specification, by inserting the end segment 9 of the micro-nickel wire downwards into the position of the filament 7, which is spaced apart according to a preset interval, the stability of the connection between the micro-nickel wire and the multi-strand silver-plated copper wire electrode can be improved.

[0060] In some embodiments, the surface of the end segment 9 of the fine nickel wire adopts a non-glossy structure. The non-glossy structure may have etched points 8 on its surface.

[0061] In some embodiments of this specification, the surface of the end segment 9 of the micro-nickel wire adopts a non-glossy structure, which can further improve the stability of the connection between the micro-nickel wire and the multi-strand silver-plated copper wire electrode.

[0062] Step 140: Add powdered brazing filler metal 6, copper wire segment 1 and liquid brazing filler metal 5 into the funnel-shaped channel 10.

[0063] Powdered brazing filler metal 6 refers to solid granular brazing filler metal with a preset particle size. The preset particle size can be determined according to actual needs. In some embodiments, powdered brazing filler metal 6 uses brazing filler metal with a preset particle size of 100-150 mesh.

[0064] Liquid solder 5 refers to solder that is in a liquid state. The raw materials of liquid solder 5 and powdered solder 6 can be the same.

[0065] In some embodiments, the powdered solder 6 comprises the following parts by weight of raw materials and unavoidable impurities, wherein the raw materials include: AgCuZn: 35-40 parts, Ni: 7-9 parts, Cr: 2-3.5 parts, Mo: 0.8-1.5 parts, Li: 1.3-1.5 parts.

[0066] In some embodiments, AgCuZn is 38 parts, Ni is 8 parts, Cr is 3 parts, Mo is 1.2 parts, and Li is 1.4 parts.

[0067] In some embodiments, the length of the copper wire segment 1 is 2 / 3 times the length of the end segment 9 of the fine nickel wire, and the diameter of the copper wire segment 1 is 0.2 mm.

[0068] In some embodiments, several (e.g., four) copper wire segments 1 are evenly arranged around the end segment 9 of the fine nickel wire, and the angle between the copper wire segments 1 and the end segment 9 of the fine nickel wire is no greater than 20°.

[0069] In some embodiments, step 140 includes steps 141 to 146.

[0070] Step 141: Control the injection needle 21 to move upward until the tip of the injection needle 21 extends into the target area of ​​the funnel-shaped channel 10.

[0071] The injection needle 21 is used to inject liquid brazing filler metal 5 into the target area. The target area refers to the region where the oblique through-hole 20 can lead to the funnel-shaped channel 10, and it can be determined according to the arrangement of the oblique through-hole 20. For example, the target area can be the root region of the diverging filaments 7 in the funnel-shaped channel 10, or the region corresponding to a preset position.

[0072] Figure 2This is a schematic diagram illustrating the connection process of another fine nickel wire to a multi-strand silver-plated copper wire electrode, as shown in some embodiments of this specification.

[0073] In some embodiments, the injection needle 21 is controlled to move upward until its tip extends into the axis of the flared channel 10, thereby allowing the tip of the injection needle 21 to enter the target area of ​​the flared channel 10. In some embodiments, the liquid solder injection system can control the movement of the injection needle 21 within the oblique through-hole 20. Figure 1 and Figure 2 The liquid solder injection system can control the injection needle 21 to move obliquely upward along the path corresponding to the oblique through hole 20. One end of the oblique through hole 20 (hereinafter referred to as the injection end) coincides with the side wall of the funnel-shaped channel 10. The injection end is in communication with the internal cavity of the funnel-shaped channel 10, so that the injection needle 21 can inject liquid solder 5 into the target area of ​​the funnel-shaped channel 10. When the tip of the injection needle 21 is located at the injection end, the injection needle 21 is in its initial state. The liquid solder injection system can control the tip of the injection needle 21 to continue moving upward until the tip of the injection needle 21 reaches the axis of the funnel-shaped channel 10 (the central axis of the lower section of the funnel-shaped channel 10), which is characterized by the tip of the injection needle 21 extending into the target area of ​​the funnel-shaped channel 10.

[0074] Step 142: Insert the copper wire segment 1 downwards into the funnel-shaped channel 10 from above the diverging filament 7 until the bottom of the copper wire segment 1 is exposed from the outer contour of the diverging filament 7.

[0075] When the bottom (lower part) of the copper wire segment 1 is exposed from the outer contour of the divergent filament 7, the bottom of the copper wire segment 1 is located in the gap between the multiple filaments 7 in the lower part of the divergent filament 7, and is thus fixed in the lower part of the divergent filament 7 (such as between multiple filaments 7).

[0076] Step 143: Add powdered brazing filler metal 6 from above the horn-shaped channel 10 into the horn-shaped channel 10.

[0077] In some embodiments, a first preset amount of powdered brazing filler metal 6 can be added into the flared channel 10 from above using a preset feeding device or by a technician. The first preset amount can be determined based on the specifications of the silver-plated copper wire 3, the specifications of the fine nickel wire end 9, the distribution of the divergent filaments 7, and other actual conditions. The first preset amount must at least meet the minimum requirement for the joint connection strength to meet the usage requirements. It can be determined by a technician based on the actual situation. For example, if the amount of powdered brazing filler metal 6 required to meet the usage requirements for the joint connection strength is x mg, then the first preset amount should be greater than or equal to x mg.

[0078] The powdered brazing filler metal 6 is used to fill the upper region and the periphery of the radiating filament 7.

[0079] The lower region of the diverging filament 7 refers to the region of the diverging filament 7 near the lower section of the funnel-shaped channel 10; the upper region of the diverging filament 7 refers to the region of the diverging filament 7 away from the lower section of the funnel-shaped channel 10 (or the region near the funnel opening).

[0080] like Figure 2 As shown, the added powdered brazing filler metal 6 is distributed in the upper region of the radiating filament 7 and the periphery of the filament 7.

[0081] Step 144: Turn on the liquid solder injection system and inject the liquid solder 5 into the horn-shaped channel 10.

[0082] A liquid solder injection system refers to equipment used for storing and transporting liquid solder. Liquid solder 5 is used to fill the areas in the funnel-shaped channel 10 that the powdered solder 6 has not entered. These areas include the lower regions of the radiating filaments 7 and are located in the gaps between the filaments 7.

[0083] In some embodiments, the liquid solder injection system can control the injection needle 21 to inject a second preset amount of liquid solder 5 into the funnel-shaped channel 10. The second preset amount can be determined based on the actual situation of the lower or root region of the divergent filaments 7 (such as the number of filaments 7). The second preset amount is sufficient to fill at least the gaps between multiple filaments 7.

[0084] The injected liquid brazing filler metal 5 is distributed in the lower region of the divergent filaments 7 and is located in the gaps between multiple filaments 7.

[0085] Step 145: Control the injection needle 21 to retract to the initial state so that the tip of the injection needle 21 coincides with the side wall of the funnel-shaped channel 10.

[0086] After the liquid solder 5 is injected, the liquid solder injection system can control the injection needle 21 to retract to the initial state.

[0087] The initial state can be characterized as the injection needle 21 being in the initial position (e.g., the tip of the injection needle 21 is located at the injection end of the oblique through hole 20). The liquid solder injection system can control the tip of the injection needle 21 to move to the injection end of the oblique through hole 20, at which point the tip of the injection needle 21 coincides with the sidewall of the trumpet-shaped channel 10.

[0088] Step 146: Activate the cooling control system corresponding to the cooling support block 13.

[0089] A cooling control system is used to cool and solidify the molten solder during subsequent pull-down processing. The cooling control system can be a liquid cooling system, using water or a glycol solution as the coolant to absorb heat. In some embodiments, the cooling control system is configured to work in conjunction with the pull-down process, and can be used to cool high-temperature objects (such as molten solder, the joint portion generated during the pull-down process) to allow the electrode connection joint to solidify from top to bottom. For example, the cooling control system can be activated during the pull-down process until the pull-down process is complete.

[0090] In some embodiments, the cooling control system can inject coolant (such as water) through cooling channels 14 within the cooling support block 13. The coolant is used to remove heat from the cooling area via through-holes 22 during the pull-down process. Figure 1 As shown, the cooling zone is the area where the through hole 22 contacts the outer wall of the lower section of the flared channel 10. When the silver-plated copper wire 3 is pulled down through the cooling zone, the molten solder in the silver-plated copper wire 3 is cooled by the coolant.

[0091] Step 150: Heat the sidewall of the horn-shaped channel 10 to keep the brazing filler metal in the horn-shaped channel 10 in a molten state.

[0092] Molten brazing filler metal refers to a brazing filler metal in a molten state formed by heating one or a combination of powdered brazing filler metal 6 and liquid brazing filler metal 5. Molten brazing filler metal can be used as a connecting medium to connect fine nickel wires (such as the end of fine nickel wire 9) to multiple strands of silver-plated copper wires (such as the fine wire 7 of silver-plated copper wire 3) after cooling and solidification to obtain an electrode connection joint or a part thereof.

[0093] In some embodiments, various heating devices can be used to heat the sidewalls of the horn-shaped channel 10 based on a preset temperature, so that the brazing filler metal located in the horn-shaped channel 10 remains in a molten state.

[0094] Step 160: The silver-plated copper wire 3 is pulled down at a preset speed to control the flow state of the brazing filler metal. During the pulling down process, the fine wires 7 of the silver-plated copper wire 3 gradually gather and squeeze the molten brazing filler metal.

[0095] The pull-down process can be achieved using a lead screw lifting mechanism. For example, after the lead screw lifting mechanism clamps the silver-plated copper wire 3 using a fixture, it controls the fixture to move downwards at a preset speed, thereby performing the pull-down process on the silver-plated copper wire 3. The preset speed can be set based on historical experience. For example, the preset speed could be 1.2 mm / s.

[0096] During the pull-down process, the squeezed molten solder can fully penetrate the lower region of the divergent filament 7 and the gaps between multiple filaments 7, and fully contact and wet the surface of the filament 7, thereby improving the strength and stability of the electrode connection between the micro-nickel wire and the multi-strand silver-plated copper wire.

[0097] In some embodiments, 4 to 6 copper wire segments 1 are arranged around the periphery of each micro nickel wire end segment 9. After the pull-down process is completed, the copper wire segments 1 are completely placed inside the brazing filler metal.

[0098] like Figure 9 As shown, after the silver-plated copper wire 3 is pulled down to the target position and removed, a connector is obtained between the fine nickel wire and the multi-strand silver-plated copper wire electrode. Figure 9 The arrow in the image indicates the direction in which the fine filament 7 of the silver-plated copper conductor 3 gradually converges.

[0099] The target position can be determined according to the actual requirements of the electrode connection joint (such as the preset length). The length of the electrode connection joint is the part where the end of the fine nickel wire 9 connects to the silver-plated copper wire 3.

[0100] In some embodiments, the target position can be determined based on the position and preset length of the radiating filament 7 inserted at the lower end of the micro-nickel wire end 9. As an example only, the target position can be a position mark (such as a scale value) on the micro-nickel wire end 9. When the wire is pulled down to this position mark, it indicates that the target position has been reached, and the pull-down process is complete.

[0101] In some embodiments of this specification, by introducing copper wire segments 1 into the electrode connection joint, the connection strength of the electrode connection joint can be improved, and the axial tensile performance of the electrode connection joint can also be improved.

[0102] In some embodiments, the outer wall of each micro-nickel wire tip is provided with an axially arranged groove 4. After the pull-down process is completed, the groove 4 is filled with solder and is covered by the solder. The copper wire segment 1 is placed in the groove 4, so that the copper wire segment 1 is completely placed inside the solder.

[0103] The axially arranged groove 4 refers to a groove set on the outer wall of the micro-nickel wire end segment 9 along the long axis of the micro-nickel wire end segment. For example, multiple (such as 4) grooves 4 are distributed on the outer wall of the micro-nickel wire end segment along the long axis of the micro-nickel wire end segment. More details about the application of groove 4 and copper wire segment 1 in the process are described below.

[0104] This specification provides a method for connecting a connector between a microfilament of another component and a multi-strand wire, comprising steps 210 to 260. Hereinafter, this method is also referred to as a third process. The main difference between the third process and the second process is that, in the third process, a groove 4 is provided on the surface of the end segment 9 of the microfilament.

[0105] Step 210: Adjust the fine wires 7 of the silver-plated copper wire 3 to a divergent shape.

[0106] For details on step 210, please refer to the description of step 110.

[0107] Step 220: Place the divergent filaments 7 in the funnel-shaped channel 10 with the divergent filaments 7 facing upwards.

[0108] For details on step 220, please refer to the description of step 120.

[0109] Step 230: Insert the end segment 9 of the fine nickel wire downwards into the middle of the diverging fine wire 7.

[0110] For details on step 230, please refer to the description of step 130.

[0111] Step 240: Add powdered brazing filler metal 6, copper wire segment 1 and liquid brazing filler metal 5 into the funnel-shaped channel.

[0112] In some embodiments, the surface of the end segment 9 of the fine nickel wire adopts a non-smooth wall structure, which may be that the surface of the end segment 9 of the fine nickel wire is processed with etching points 8 and axially arranged grooves 4.

[0113] In some embodiments, the outer wall of the end segment 9 of each micro-nickel wire is provided with an axially arranged groove 4. Steps 230 and 240 can be implemented based on steps 241 to 247 below.

[0114] Step 241: Place the copper wire segment 1 into the groove 4.

[0115] In some embodiments, the groove 4 is an arc groove, the width of which is greater than the diameter of the copper wire segment 1, so that the copper wire segment 1 can move away from the end segment 9 of the fine nickel wire in the radial direction.

[0116] For example, the diameter of the copper wire segment 1 is 0.2 mm, and the width of the arc groove can be set to 0.3 mm so that the copper wire segment 1 can move away from the end segment 9 of the fine nickel wire in the radial direction.

[0117] For more information about powdered brazing filler metal 6, copper wire segment 1, and liquid brazing filler metal 5, please refer to the description above.

[0118] Figure 4This is a top-view schematic diagram showing copper wire segments placed in grooves of fine nickel wires according to some embodiments of this specification; Figure 5 This is a side view schematic diagram showing a copper wire segment placed in a groove of a fine nickel wire, according to some embodiments of this specification.

[0119] See Figure 4 and Figure 5 Four copper wire segments 1 are placed in four grooves 4 on the outer wall of the end segment 9 of the fine nickel wire.

[0120] Step 242: Insert the end segment 9 of the fine nickel wire with copper wire segment 1 downward into the middle of the diverging fine wire 7, so that after the end segment 9 of the fine nickel wire is inserted into place, the upper part of the copper wire segment 1 moves away from the end segment 9 of the fine nickel wire and spreads out in the radial direction.

[0121] Figure 6 This is a top-down schematic diagram showing the upper part of the copper wire segment far away from the end of the fine nickel wire and radially spread out according to some embodiments of this specification; Figure 7 This is a lateral schematic diagram showing the upper part of the copper wire segment far from the end of the fine nickel wire and radially spread out according to some embodiments of this specification.

[0122] like Figure 6 and Figure 7 As shown, when the end of the fine nickel wire 9 is inserted into place, that is, when the end of the fine nickel wire 9 has been inserted downward into the preset position in the diverging filament 7, the end of the fine nickel wire 9 near the lower section of the trumpet-shaped channel 10 and the lower part of the copper wire segment 1 are fixed, and the upper part of the copper wire segment 1 moves away from the end of the fine nickel wire 9 and spreads out in the radial direction.

[0123] Spreading out radially means spreading outwards away from the long axis of the fine nickel wire end segment 9, thereby creating an angle between the copper wire segment 1 and the fine nickel wire end segment 9. In some embodiments, the angle between the radially spread copper wire segment 1 and the fine nickel wire end segment 9 is no greater than 20°; In some embodiments of this specification, by introducing grooves 4, multiple copper wire segments 1 are evenly and precisely distributed around the end segments 9 of the fine nickel wire, thereby improving the stability of the process and the quality of the electrode connection joint.

[0124] Step 243: Control the injection needle 21 to move upward until the tip of the injection needle 21 extends into the target area of ​​the funnel-shaped channel 10.

[0125] Step 244: Add powdered brazing filler metal 6 from above the horn-shaped channel 10 into the horn-shaped channel 10.

[0126] Step 245: Turn on the liquid solder injection system and inject the liquid solder 5 into the horn-shaped channel 10.

[0127] Step 246: Control the injection needle 21 to retract to the initial state so that the tip of the injection needle 21 coincides with the side wall of the funnel-shaped channel 10.

[0128] Step 247: Activate the cooling control system corresponding to the cooling support block 13.

[0129] For details on steps 243 to 247, please refer to the descriptions of steps 141 to 146.

[0130] Step 250: Heat the sidewall of the horn-shaped channel 10 to keep the brazing filler metal in the horn-shaped channel 10 in a molten state.

[0131] Step 260: The silver-plated copper wire 3 is pulled down at a preset speed to control the flow state of the brazing filler metal. During the pulling down process, the fine wires 7 of the silver-plated copper wire 3 gradually gather and squeeze the molten brazing filler metal.

[0132] Figure 8 This is a top-down schematic diagram illustrating the process of connecting a fine nickel wire to a multi-strand silver-plated copper wire electrode according to some embodiments of this specification.

[0133] During the dropdown process, such as Figure 8 As shown, when the fine wires 7 of the silver-plated copper wire 3 gradually gather and squeeze the brazing filler metal 2 (which is in a molten state at this time), the copper wire segment 1 is gradually wetted by the brazing filler metal 2 and covered from bottom to top, and the groove 4 is also gradually filled with the brazing filler metal 2 from bottom to top.

[0134] After the dropdown process is complete, such as Figure 9 As shown, the copper wire segment 1 is completely placed inside the solder 2, and the groove 4 is filled with and encased in the solder 2. When the silver-plated copper wire 3 is pulled down to the target position and removed, a connector is obtained between the fine nickel wire and the multi-strand silver-plated copper wire electrode.

[0135] In some embodiments, after the copper wire segment 1 is placed in the groove 4, and before the end of the fine nickel wire 9 is inserted into place, the copper wire segment 1 is radially pressed or wrapped; after the copper wire segment 1 is placed in the groove 4 and the end of the fine nickel wire 9 is inserted into place, the copper wire segment 1 is no longer pressed or wrapped.

[0136] For example, after the copper wire segment 1 is placed in the groove 4 and before the micro-nickel wire end segment 9 is inserted into place, radial pressure (in the direction of the copper wire segment 1 adhering to the micro-nickel wire end segment 9) can be applied to the copper wire segment 1, or a single thin wire 7 can be used to wrap around the copper wire segment 1 so that the copper wire segment 1 is relatively fixed.

[0137] After the copper wire segment 1 is placed in the groove 4 and the end segment 9 of the fine nickel wire is inserted into place, the bottom of the copper wire segment 1 is fixed in the lower area of ​​the radiating filament 7. At this time, the radial pressure applied to the copper wire segment 1 can be removed, or the single filament 7 that covers the copper wire segment 1 can be removed.

[0138] The following is a performance comparison test of electrode connection joint samples of fine nickel wire and multi-strand silver-plated copper wire (hereinafter referred to as joint samples). The joint sample obtained by the first process is called the first joint sample, the joint sample obtained by the second process is called the second joint sample, and the joint sample obtained by the third process is called the third joint sample. Compared with the second or third process, the first process omits copper wire segment 1 (i.e., the placement of copper wire segment 1 is omitted).

[0139] The performance comparison test method is as follows: connect the silver-plated copper wire 3 and the end segment 9 of the micro-nickel wire of the joint sample (such as the first joint sample, the second joint sample and the third joint sample) to the tensile tester, and then conduct an axial tensile test to obtain the tensile force required when the end segment 9 of the micro-nickel wire is pulled out or broken (i.e., axial pull-out force, which characterizes the axial tensile performance).

[0140] The results showed that the axial pull-out force (the end of the fine nickel wire was pulled out) of the first joint sample was 144 MPa, the axial pull-out force (the end of the fine nickel wire was pulled out) of the second joint sample was 177.5 MPa, and the axial pull-out force (the end of the fine nickel wire was pulled out) of the third joint sample was 205 MPa.

[0141] Therefore, it can be seen that the second and third processing methods, which embed copper wire segments in the connector, not only improve the strength of the connector between the fine nickel wire and the multi-strand silver-plated copper wire, but also significantly improve the axial tensile properties of the fine nickel wire and the multi-strand silver-plated copper wire.

Claims

1. A method for connecting a component's microfilament to a multi-strand wire, characterized in that, include: Adjust the fine filaments of the silver-plated copper wire to a divergent shape; A diverging filament is placed in a funnel-shaped channel, with the diverging filament facing upwards; Insert the end of the fine nickel wire downwards into the middle of the diverging filament; Powdered brazing filler metal, copper wire segments, and liquid brazing filler metal are added into the funnel-shaped channel; the surface of the end segment of the fine nickel wire adopts a non-smooth wall structure. The sidewalls of the funnel-shaped channel are heated to keep the solder in the funnel-shaped channel in a molten state. The silver-plated copper wire is pulled down at a preset speed to control the flow state of the solder. During the pulling down process, the filaments of the silver-plated copper wire gradually gather and squeeze the molten solder.

2. The method according to claim 1, characterized in that: The length of the copper wire segment is 2 / 3 times the length of the end segment of the fine nickel wire. The diameter of the copper wire segment is 0.2 mm.

3. The method according to claim 1, characterized in that: Several copper wire segments are evenly arranged around the end of the fine nickel wire, and the angle between the copper wire segments and the end of the fine nickel wire is no greater than 20°.

4. The method according to claim 1, characterized in that: The flowability of the brazing filler metal is controlled by a welding tool, the welding tool including a graphite assembly, the graphite assembly including a graphite component one connected to the positive terminal of the welding power source and a graphite component two connected to the negative terminal of the welding power source. Both the first graphite component and the second graphite component are provided with arc grooves, and the two arc grooves are used to form the horn-shaped channel for accommodating the silver-plated copper wire. A cooling support block is attached to the wall below the graphite component, and the through holes on the cooling support block are arranged coaxially with the trumpet-shaped channel. The graphite component one or the graphite component two is provided with an oblique through hole, and a movable injection needle is provided in the oblique through hole. The tip of the injection needle can extend into the target area of ​​the trumpet-shaped channel, and the injection needle is connected to a liquid solder injection system.

5. The method according to claim 4, characterized in that, The diameter of the lower section of the horn-shaped channel is equal to the outer diameter of the silver-plated copper wire; The diameter of the through hole is equal to the outer diameter of the silver-plated copper wire.

6. The method according to claim 4, characterized in that, Below the cooling support block is a lead screw lifting mechanism for vertically pulling down the silver-plated copper wire. The lifting plate of the lead screw lifting mechanism is equipped with a clamp for holding the silver-plated copper wire. The lead screw lifting mechanism is configured as follows: In response to the need to pull the silver-plated copper wire vertically downwards, Control the clamp to rise to the target height and clamp the silver-plated copper wire; The clamp is controlled to move downward at a preset speed so as to pull the silver-plated copper wire vertically downward at a preset speed.

7. The method according to claim 4, characterized in that, The process of adding powdered brazing filler metal, copper wire segments, and liquid brazing filler metal into the funnel-shaped channel includes: Control the injection needle to move upward until the tip of the injection needle extends into the target area of ​​the funnel-shaped channel; The copper wire segment is inserted downwards into the funnel-shaped channel from above the radiating filament until the bottom of the copper wire segment is exposed from the outer contour of the radiating filament. The powdered brazing filler metal is added from above the horn-shaped channel into the horn-shaped channel; Turn on the liquid solder injection system and inject the liquid solder into the funnel-shaped channel; Control the injection needle to retract to its initial state so that the tip of the injection needle coincides with the side wall of the funnel-shaped channel; Turn on the cooling control system corresponding to the cooling support block.

8. The method according to claim 7, characterized in that: Four to six copper wire segments are arranged around the periphery of the end of each of the fine nickel wires, and after the pull-down process is completed, the copper wire segments are completely placed inside the brazing filler metal. Each of the micro-nickel wires has an axially arranged groove on the outer wall of its end segment. After the pull-down process is completed, the groove is filled with the solder and is covered by the solder.

9. The method according to claim 4, characterized in that, Each of the micro-nickel wire segments has an axially arranged groove on its outer wall. The process of inserting the micro-nickel wire segment downwards into the middle of the diverging filament and adding powdered brazing filler metal, copper wire segments, and liquid brazing filler metal into the funnel-shaped channel includes: Place the copper wire segment into the groove; The end segment of the fine nickel wire with the copper wire segment is inserted downward into the middle of the diverging filament, so that after the end segment of the fine nickel wire is inserted into place, the upper part of the copper wire segment moves away from the end segment of the fine nickel wire and spreads out in the radial direction. Control the injection needle to move upward until the tip of the injection needle extends into the target area of ​​the funnel-shaped channel; The powdered brazing filler metal is added from above the horn-shaped channel into the horn-shaped channel; Turn on the liquid solder injection system and inject the liquid solder into the funnel-shaped channel; Control the injection needle to retract to its initial state so that the tip of the injection needle coincides with the side wall of the funnel-shaped channel; Turn on the cooling control system corresponding to the cooling support block.

10. The method according to claim 9, characterized in that, The groove is an arc groove. The width of the arc groove is greater than the diameter of the copper wire segment, so that the copper wire segment can move away from the end of the fine nickel wire in the radial direction; After the copper wire segment is placed in the groove, and before the end of the fine nickel wire is inserted into place, the copper wire segment is radially pressed or wrapped. After the copper wire segment is placed in the groove, and after the end of the fine nickel wire is inserted into place, the copper wire segment is no longer pressed or wrapped. The brazing filler metal comprises the following raw materials in parts by weight: 35-40 parts AgCuZn, 7-9 parts Ni, 2-3.5 parts Cr, 0.8-1.5 parts Mo, and 1.3-1.5 parts Li. The composition is 38 parts AgCuZn, 8 parts Ni, 3 parts Cr, 1.2 parts Mo, and 1.4 parts Li.

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