Loudspeaker module and terminal equipment

Abstract

The invention relates to the technical field of terminals, in particular to a loudspeaker module and terminal equipment. The loudspeaker module comprises an upper vibrating diaphragm, a lower vibrating diaphragm, a supporting shell, a magnetic circuit assembly, a voice coil assembly and a supporting assembly, the upper vibrating diaphragm and the lower vibrating diaphragm are arranged at intervals in the first direction, the supporting shell is connected with the side, away from the upper vibrating diaphragm, of the lower vibrating diaphragm, and the supporting shell is provided with at least one first sound outlet hole; the magnetic circuit assembly and the voice coil assembly are both located between the upper vibrating diaphragm and the lower vibrating diaphragm, the edge of one side, facing the upper vibrating diaphragm, of the magnetic circuit assembly is in sealed connection with the upper vibrating diaphragm, and the edge of one side, facing the lower vibrating diaphragm, of the magnetic circuit assembly is in sealed connection with the lower vibrating diaphragm; the voice coil assembly penetrates through the magnetic circuit assembly to connect the upper vibrating diaphragm and the lower vibrating diaphragm so as to drive the upper vibrating diaphragm and the lower vibrating diaphragm to vibrate in the same direction; the supporting assembly penetrates through the supporting shell and the lower vibrating diaphragm and supports the lower vibrating diaphragm and the magnetic circuit assembly. The loudspeaker module is high in leakproofness, and liquid cannot enter the space between the upper vibrating diaphragm and the lower vibrating diaphragm.

Description

Technical Field

[0001] This application relates to the field of terminal technology, and in particular to a speaker module and terminal device. Background Technology

[0002] In existing technologies, consumers often wear audio products such as headphones when engaging in recreational activities like swimming and diving, which places high demands on the waterproof performance of these products. However, when headphones produce sound, the diaphragm facing the front sound outlet vibrates, while the side opposite the diaphragm is the rear shell with a rear sound outlet that directly connects to the outside. When consumers wear headphones while swimming or diving, water can enter the headphones through the rear sound outlet, causing damage and corrosion to the components.

[0003] Therefore, improving the waterproof performance of audio products such as headphones has become an urgent problem to be solved. Summary of the Invention

[0004] This application provides a loudspeaker module and terminal device. During operation, the voice coil assembly drives the upper and lower diaphragms to vibrate in the same direction, ensuring minimal volume change within the loudspeaker module and eliminating the need for a separate pressure relief vent, thereby improving the module's airtightness.

[0005] In a first aspect, this application provides a loudspeaker module, comprising: an upper diaphragm, a lower diaphragm, a support shell, a magnetic circuit assembly, a voice coil assembly, and a support assembly. The upper and lower diaphragms are spaced apart along a first direction. Along the first direction, the support shell is connected to the side of the lower diaphragm away from the upper diaphragm. The support shell has at least one first sound outlet hole. The magnetic circuit assembly is located between the upper and lower diaphragms, and the edge of the magnetic circuit assembly facing the upper diaphragm is sealed to the upper diaphragm, and the edge of the magnetic circuit assembly facing the lower diaphragm is also sealed to the lower diaphragm. The voice coil assembly is located between the upper and lower diaphragms, and the voice coil assembly passes through the magnetic circuit assembly to connect the upper and lower diaphragms, thereby driving the upper and lower diaphragms to vibrate in the same direction. The support assembly passes through the support shell and the lower diaphragm, and the support assembly supports the lower diaphragm and the magnetic circuit assembly.

[0006] When the speaker module of this application is in operation, the voice coil assembly is energized. The voice coil assembly cooperates with the magnetic circuit assembly, enabling the voice coil assembly to drive the upper and lower diaphragms to vibrate in the same direction along a first direction, thus producing sound. In this method, during sound production, because the upper and lower diaphragms vibrate in the same direction, the air pressure change between them is small. Therefore, separate air pressure compensation for the space between the upper and lower diaphragms is not required, eliminating the need for a separate pressure relief hole, which is highly correlated with acoustic performance. This prevents water from entering between the upper and lower diaphragms through the pressure relief hole, improving the speaker module's waterproof performance. Compared to existing speaker modules, the speaker module of this application has a lower diaphragm between the upper diaphragm and the support shell, and the lower diaphragm has no pressure relief hole. The lower diaphragm prevents water from entering the speaker module's interior through the first sound outlet on the support shell, thereby improving the speaker module's waterproof performance.

[0007] In one embodiment, the support assembly includes a main shaft and an annular boss. The annular boss is fixed to the main shaft, which passes through the support shell and the lower diaphragm. The annular boss is located between the lower diaphragm and the support shell, and abuts against both the lower diaphragm and the support shell. The annular boss connects the lower diaphragm and the support shell, providing support to the lower diaphragm and improving its stability.

[0008] In one embodiment, the support assembly further includes a first air pressure balancing valve, and the main shaft has a first air pressure balancing hole extending through the main shaft along the first direction. The first air pressure balancing valve is used to seal the first air pressure balancing hole. When the voice coil assembly operates, it generates heat to heat the gas between the upper and lower diaphragms. The gas expands when heated, increasing the air pressure between the upper and lower diaphragms. The first air pressure balancing valve and the first air pressure balancing hole ensure that the gas between the upper and lower diaphragms can be discharged. Furthermore, the first air pressure balancing valve has a breathable and water-resistant membrane structure, preventing water from passing through it.

[0009] In one embodiment, the voice coil assembly includes a voice coil skeleton and at least one voice coil, the at least one voice coil being disposed around the outer side of the voice coil skeleton; along the first direction, the voice coil skeleton passes through the magnetic circuit assembly, and both ends of the voice coil skeleton are respectively connected to the upper diaphragm and the lower diaphragm. When energized, the voice coil, in conjunction with the magnetic circuit assembly, generates a driving force along the first direction, thereby causing the voice coil skeleton to move along the first direction, and subsequently causing the upper and lower diaphragms to vibrate and produce sound.

[0010] In one embodiment, there are two voice coils, both of which are arranged around the outside of the voice coil frame; the two voice coils are spaced apart along the first direction, and the winding directions of the two voice coils are opposite. The two voice coils can increase the vibration frequency of the upper and lower diaphragms along the first direction, ensuring the sound production effect.

[0011] In one embodiment, the voice coil skeleton includes a notch that extends through the voice coil skeleton along the first direction. When the voice coil skeleton passes through the magnetic circuit assembly and connects to the upper and lower diaphragms, it divides the space between the upper and lower diaphragms into two cavities. The notch connects the two cavities, ensuring the stability of the speaker assembly during operation.

[0012] In one embodiment, the voice coil skeleton further includes multiple openings evenly distributed along the circumference of the voice coil skeleton. When the voice coil skeleton passes through the magnetic circuit assembly and connects to the upper and lower diaphragms, it divides the space between the upper and lower diaphragms into two cavities. The openings connect the two cavities, ensuring the stability of the speaker assembly during operation.

[0013] It is worth mentioning that notches and openings can coexist in the voice coil skeleton.

[0014] In one embodiment, the magnetic circuit assembly includes the magnet structure and a magnetic structure. The magnet structure includes a central magnet and side magnets disposed outside the central magnet, with a first gap existing between the central magnet and the side magnets. The magnetic guiding structure includes a first magnetic plate group and a second magnetic plate group, disposed on both sides of the magnet structure along the first direction. The voice coil assembly is located in the first gap, and its two ends pass through the first magnetic plate group and the second magnetic plate group, respectively, and are connected to the upper diaphragm and the lower diaphragm. In this configuration, the voice coil assembly is disposed in the first gap and passes through the first and second magnetic plate groups to connect to the upper and lower diaphragms. The first magnetic plate group, the second magnetic plate group, and the magnet structure can generate a magnetic circuit that cooperates with the voice coil assembly, so that when the voice coil assembly is energized, it generates a force along the first direction.

[0015] In one embodiment, the first magnetic plate group includes a first center magnetic plate and a first side magnetic plate, with a second gap between the first center magnetic plate and the first side magnetic plate. The first center magnetic plate is disposed on one side of the central magnet, and the first side magnetic plate is disposed on one side of the first side magnetic conductor. The first gap and the second gap are connected, and the voice coil assembly passes through the first gap and the second gap. The second magnetic plate group includes a second center magnetic plate and a second side magnetic plate, with a third gap between the second center magnetic plate and the second side magnetic plate. The second center magnetic plate is disposed on one side of the central magnet, and the second side magnetic plate is disposed on one side of the first side magnetic conductor. The first gap and the third gap are connected, and the voice coil assembly passes through the first gap and the third gap. In this configuration, the first magnetic plate group includes a second gap, the second magnetic plate group includes a third gap, and the magnetic circuit assembly passes through the second gap, the first gap, and the third gap to connect with the upper diaphragm and the lower diaphragm to drive the upper and lower diaphragms to vibrate.

[0016] In one embodiment, the first magnetic plate assembly includes a first central magnetic plate and a first side magnetic plate, with a second gap between them. The first central magnetic plate is disposed on one side of the central magnet, and the first side magnetic plate is disposed on one side of the first side magnetic conductor. The first gap and the second gap are connected, and the voice coil assembly passes through the first gap and the second gap. The second magnetic plate assembly includes a second magnetic plate with multiple connecting holes penetrating it along a first direction. In the projection of the upper or lower diaphragm, at least a portion of the connecting holes coincides with the first gap, and the voice coil assembly passes through the first gap and at least a portion of the connecting holes. In this configuration, the magnetic circuit assembly connects the upper and lower diaphragms through the second gap, the first gap, and the connecting holes. The second magnetic plate is a single, continuous plate, capable of supporting the magnet structure and the second magnetic plate assembly, thus improving the stability and strength of the magnetic circuit assembly.

[0017] In one embodiment, the voice coil skeleton includes a plurality of pins, with adjacent pins spaced apart, the pins being used for connection to the lower diaphragm. The pins pass through connection holes on a second magnet plate to connect to the lower diaphragm.

[0018] In one embodiment, the magnetization method in the magnetic circuit assembly can be varied. For example, when the materials of the first magnetic plate group and the second magnetic plate group are magnetically conductive materials, the central magnet and the side magnets are magnetized along a first direction, and the magnetization directions of the central magnet and the side magnets are opposite. Alternatively, when the materials of the first magnetic plate group and the second magnetic plate group are magnets, the central magnet and the side magnets are magnetized along a direction perpendicular to the first direction.

[0019] In one embodiment, the magnetic circuit assembly further includes a second air pressure balancing valve. At least one second air pressure balancing hole is provided on the side magnet. One end of the at least one second air pressure balancing hole communicates with the first gap, and the other end of the at least one second air pressure balancing hole communicates with the outside of the speaker module. The second air pressure balancing valve is used to block the second air pressure balancing hole. The second air pressure balancing hole and the second air pressure balancing valve serve the same function as the first air pressure balancing hole and the first air pressure balancing valve, only their positions differ.

[0020] In one embodiment, the speaker module further includes a flexible driving circuit board disposed on the side of the upper diaphragm facing the lower diaphragm, and the flexible driving circuit board is used for electrical connection with the voice coil assembly. The flexible driving circuit board eliminates the need for direct wires to enter the interior of the speaker module when driving the voice coil assembly.

[0021] In one embodiment, the support component is provided with a mounting hole that extends through the support component along the first direction. The mounting hole is used to insert a pin, which is connected to the flexible drive circuit board. The pin and the flexible drive circuit board can improve the safety of the speaker module when it is powered on.

[0022] In one embodiment, the upper diaphragm includes an upper membrane and at least one upper folded ring, and the lower diaphragm includes a lower membrane and at least one lower folded ring. One end of a voice coil assembly is connected to the lower membrane, and the other end of the voice coil assembly is used to connect to the upper membrane to drive the upper and lower diaphragms to vibrate. The upper folded ring can be annular or arched, the upper membrane can be arched or planar, the lower folded ring is annular, and the lower membrane is planar. An opening may be provided at the center of the lower folded ring for a support assembly to pass through.

[0023] Secondly, this application also provides a terminal device, including a housing and a speaker module as described in any of the technical solutions of the first aspect. The speaker module divides the housing into a front cavity and a rear cavity. The housing has a second sound outlet communicating with the front cavity, and the second sound outlet corresponds to the upper diaphragm. When water enters the terminal device equipped with this speaker module, water cannot enter the interior of the speaker module, ensuring the stability of the terminal device's audio output. Specifically, the terminal device can be a device with audio functions such as headphones, mobile phones, tablets, speakers, or televisions. When the terminal device is headphones, the user can wear the headphones while submerged in water. Attached Figure Description

[0024] Figure 1 A cross-sectional view of a terminal device provided in an embodiment of this application;

[0025] Figure 2A cross-sectional view of a speaker module provided in an embodiment of this application;

[0026] Figure 3 Another cross-sectional view of the speaker module provided in the embodiments of this application;

[0027] Figure 4 This is a schematic diagram of the structure of the support component and the support shell in the speaker module provided in the embodiments of this application;

[0028] Figure 5a A schematic diagram of a voice coil skeleton in a speaker module provided in an embodiment of this application;

[0029] Figure 5b This is another schematic diagram of the voice coil skeleton in the speaker module provided in the embodiments of this application;

[0030] Figure 6 This is a schematic diagram of a structure in which the voice coil assembly and the second magnetic plate assembly cooperate in a loudspeaker module provided in an embodiment of this application.

[0031] Figure 7 for Figure 2 Schematic diagram of a local structure in the middle;

[0032] Figure 8 Another cross-sectional view of the speaker module provided in the embodiments of this application;

[0033] Figure 9 Another cross-sectional view of the speaker module provided in the embodiments of this application;

[0034] Figure 10 Another cross-sectional view of the speaker module provided in the embodiments of this application;

[0035] Figure 11 Another cross-sectional view of the speaker module provided in the embodiments of this application;

[0036] Figure 12 Another cross-sectional view of the speaker module provided in the embodiments of this application;

[0037] Figure 13 Another cross-sectional view of the speaker module provided in the embodiments of this application;

[0038] Figure 14 This is a schematic diagram of the flexible drive circuit board in the speaker module provided in an embodiment of this application.

[0039] Figure label:

[0040] 10-Speaker module; 11-Upper diaphragm; 110-Upper surround; 111-Upper diaphragm; 12-Lower diaphragm; 120-Lower surround; 121-Lower diaphragm; 13-Support shell; 130-First sound outlet; 14-Magnetic circuit assembly; 140-Magnetic structure; 1400-Center magnet; 1401-Side magnet; 1402-First gap; 1403-Second air pressure balance hole; 141-First magnetic plate assembly; 1410-First center magnetic plate; 1411-First side magnetic plate; 1412-Second gap; 142-Second magnetic plate assembly; 1420-Second center magnetic plate; 1421-Second side magnetic plate; 1422-Third gap; 1423-Second magnetic plate; 1424-Connection hole; 143-Second air pressure balance valve; 15-Voice coil assembly; 150-Voice coil skeleton; 1500-Notch; 1501-Pin; 1502-Opening; 151-Voice coil; 16-Support assembly; 160-Spindle; 1600-First air pressure balancing hole; 161-Annular boss; 162-First air pressure balancing valve; 17-First sealing support; 18-Second sealing support; 19a-First annular bracket; 19b-Second annular bracket; 19c-Flexible drive circuit board; 19d-Pin; 190-First contact; 191-Second contact; 20-Housing; 21-Front housing; 210-Front cavity; 211-Second sound outlet; 212-Second vent hole; 22-Rear housing; 220-Rear cavity; 221-First vent hole; 30-Support rod. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0042] Sound is produced by the vibration of objects. For devices like speaker modules, sound is also generated by the vibration of vibrating components. Specifically, the sound production principle of speaker modules is that the vibration of the diaphragm drives the air to vibrate, thereby producing sound.

[0043] Speaker modules can be used in many devices, such as mobile phones, tablets, speakers, televisions, and headphones. When a speaker module is used in headphones, and the user frequently engages in recreational activities like swimming and diving, the speaker module needs to be waterproofed to prevent water damage. However, existing speaker modules generally consist of a diaphragm and a rear shell. The diaphragm is housed within the rear shell, and a rear sound outlet is located on the side of the rear shell opposite the diaphragm. When the diaphragm vibrates, the air pressure between the diaphragm and the rear shell increases or decreases, and gas can enter this space through the rear sound outlet. When water gets into headphones with this speaker module, water can enter the space between the diaphragm and the rear shell through the rear sound outlet, damaging the speaker module.

[0044] Therefore, improving the waterproof performance of speaker modules has become an urgent problem to be solved.

[0045] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0046] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0047] Figure 1 A cross-sectional view of a terminal device provided in an embodiment of this application, with reference to... Figure 1 The terminal device can be any device with audio capabilities, such as headphones, mobile phones, tablets, speakers, or televisions. The following explanation uses headphones as an example. Figure 1As shown, the terminal device may include a housing 20 and a speaker module 10. The speaker module 10 may be fixedly disposed in the housing 20, and the speaker module 10 divides the housing into a front cavity 210 and a rear cavity 220. The front cavity 210 and the rear cavity 220 may not be interconnected. More specifically, the terminal device may also include a support rod 30. The housing 20 may include a front shell 21 and a rear shell 22. One end of the rear shell 22 is fixedly connected to the front shell 21, and the two ends are sealed together. The support rod 30 is fixedly connected to the other end of the rear shell 22. The rear shell 22 and the front shell 21 are connected to form a cavity for accommodating the speaker module 10. The speaker module 10 divides this cavity into a front cavity 210 and a rear cavity 220. A first vent hole 221 is provided on the rear shell 22, which communicates with the rear cavity 220. A second sound outlet hole 211 is provided on the front shell 21, which communicates with the front cavity 210. When a user wears headphones and immerses them in water, water can enter the rear cavity 220 through the first vent 221 and then enter the speaker module 10 through the first sound outlet. Since the speaker module 10 has an upper diaphragm 11 and a lower diaphragm 12, the lower diaphragm 12 can prevent water from continuing to enter the space between the upper diaphragm 11 and the lower diaphragm 12, thereby preventing water from entering the components located between the upper diaphragm 11 and the lower diaphragm 12. In addition, the synchronous vibration between the lower diaphragm 12 and the upper diaphragm 11 can also ensure that the air pressure inside the speaker module 10 is relatively stable when the headphone is submerged. There is no need to set up a separate pressure relief vent that is strongly related to acoustic performance, which further improves the waterproof performance of the speaker module 10 to meet the needs of users wearing headphones in water.

[0048] In one embodiment, a second vent hole 212 may also be provided on the front shell 21, and both the second vent hole 212 and the second sound outlet hole 211 are connected to the front cavity 210.

[0049] The speaker module in this application will be described in detail below.

[0050] Figure 2 This is a cross-sectional view of a speaker module provided in an embodiment of this application. Figure 3 Another cross-sectional view of the speaker module provided in the embodiments of this application; Figure 4 for Figure 2 and Figure 3 A schematic diagram of the structure in which the central support component and the support shell mate. (Refer to...) Figure 2 , Figure 3 and Figure 4The loudspeaker module 10 includes an upper diaphragm 11, a lower diaphragm 12, a support shell 13, a magnetic circuit assembly 14, a voice coil assembly 15, and a support assembly 16. The upper diaphragm 11 and the lower diaphragm 12 are arranged at intervals along a first direction, which can be understood as the thickness direction of the upper diaphragm 11 and the lower diaphragm 12. Along the first direction, the support shell 13 is disposed on the side of the lower diaphragm 12 away from the upper diaphragm 11, and the support shell 13 is fixedly connected to the side of the lower diaphragm 12 away from the upper diaphragm 11. There is a gap between the support shell 13 and the side of the lower diaphragm 12 away from the upper diaphragm 11. The support shell 13 has at least one first sound outlet hole 130. When the upper diaphragm 11 and the lower diaphragm 12 vibrate, the sound generated by the lower diaphragm 12 can be emitted through the first sound outlet hole 130. Both the magnetic circuit assembly 14 and the voice coil assembly 15 are disposed between the upper diaphragm 11 and the lower diaphragm 12. The edge of the magnetic circuit assembly 14 facing the upper diaphragm 11 is sealed to the upper diaphragm 11, and the edge of the magnetic circuit assembly 14 facing the lower diaphragm 12 is sealed to the lower diaphragm 12. This ensures a sealed connection between the outer contours of the upper diaphragm 11 and the lower diaphragm 12. The voice coil assembly 15 passes through the magnetic circuit assembly 14 and connects the upper diaphragm 11 and the lower diaphragm 12. When energized, the voice coil assembly 15 can drive the upper diaphragm 11 and the lower diaphragm 12 to vibrate in the same direction under the magnetic circuit action of the magnetic circuit assembly 14. That is, the upper diaphragm 11 and the lower diaphragm 12 vibrate synchronously upward or downward under the drive of the voice coil assembly 15. One end of the support assembly 16 extends through the support shell 13 and the lower diaphragm 12 to the space between the upper diaphragm 11 and the lower diaphragm 12. The support assembly 16 can support the lower diaphragm 12 and the magnetic circuit assembly 14 to ensure the stability of the operation of the lower diaphragm 12 and the magnetic circuit assembly 14 and improve the reliability of the speaker module 10.

[0051] When the speaker module 10 in this application is working, the voice coil assembly 15 is energized. The voice coil assembly 15 cooperates with the magnetic circuit assembly 14, enabling the voice coil assembly 15 to drive the upper diaphragm 11 and the lower diaphragm 12 to vibrate in the same direction along a first direction, thereby causing the speaker module 10 to produce sound. In this method, when the speaker module 10 produces sound, because the upper diaphragm 11 and the lower diaphragm 12 vibrate in the same direction, the air pressure change between the upper diaphragm 11 and the lower diaphragm 12 is small. There is no need to compensate for the air pressure in the space between the upper diaphragm 11 and the lower diaphragm 12 separately. Therefore, there is no need to set up a pressure relief hole that is strongly related to acoustic performance. This can prevent water from entering between the upper diaphragm 11 and the lower diaphragm 12 through the pressure relief hole, thereby improving the waterproof performance of the speaker module 10. Compared with the speaker modules in the prior art, the speaker module 10 in this application has a lower diaphragm 12 between the upper diaphragm 11 and the support shell 13, and there is no pressure relief hole between the lower diaphragm 12 and the upper diaphragm 11. The lower diaphragm 12 can prevent water from entering the interior of the speaker module 10 through the first sound outlet 130 on the support shell 13, thereby improving the waterproof performance of the speaker module 10.

[0052] The support shell 13 can be bowl-shaped to ensure that when the edge of the support shell 13 is connected to the side of the lower diaphragm 12 away from the upper diaphragm 11, a cavity for accommodating at least part of the support assembly 16 can be formed between the support shell 13 and the lower diaphragm 12, and to ensure that the lower diaphragm 12 is not interfered with by the support shell 13 when vibrating along the first direction. The number of first sound outlet holes 130 can be one or more, as long as the sound generated by the vibration of the lower diaphragm 12 can be emitted through the first sound outlet holes 130. Furthermore, in the projection of the lower diaphragm 12 or the upper diaphragm 11, the support assembly 16 is located within the voice coil assembly 15, and the centerline of the support assembly 16 can coincide with the centerline of the voice coil assembly 15 and the centerline of the magnetic circuit assembly 14.

[0053] Continue to refer to Figure 2 and Figure 3 To ensure the airtight connection between the magnetic circuit assembly 14 and the upper diaphragm 11 and the lower diaphragm 12, a first sealing support 17 can be provided between the magnetic circuit assembly 14 and the upper diaphragm 11, and the first sealing support 17 is located at the edge of the magnetic circuit assembly 14. A second sealing support 18 can be provided between the magnetic circuit assembly 14 and the lower diaphragm 12, and the second sealing support 18 is also located at the edge of the magnetic circuit assembly 14. Along the first direction, the first sealing support 17 and the second sealing support 18 can also be symmetrically arranged at both ends of the magnetic circuit assembly 14. The provision of the first sealing support 17 allows for a certain gap between the magnetic circuit assembly 14 and the upper diaphragm 11, ensuring that the upper diaphragm 11 does not directly contact the magnetic circuit assembly 14 when vibrating on the side facing the lower diaphragm 12, thereby improving the operational stability of the upper diaphragm 11. Correspondingly, the second sealing support 18 allows for a certain gap between the magnetic circuit assembly 14 and the lower diaphragm 12, ensuring that the lower diaphragm 12 does not directly contact the magnetic circuit assembly 14 when vibrating on the side of the upper diaphragm 11, thereby improving the stability of the lower diaphragm 12 during operation.

[0054] Continue to refer to Figure 2 , Figure 3 and Figure 4The support assembly 16 may include a main shaft 160 and an annular boss 161. The annular boss 161 is fixed to the main shaft 160, and the main shaft 160 and the annular boss 161 may be integrally formed. The main shaft 160 may extend through the support shell 13 and the lower diaphragm 12 to the side where the upper diaphragm 11 is located. The annular boss 161 may be disposed between the lower diaphragm 12 and the support shell 13, and along the first direction, both ends of the annular boss 161 abut against the lower diaphragm 12 and the support shell 13, respectively. The annular boss 161 can connect the lower diaphragm 12 and the support shell 13, and the annular boss 161 can support the lower diaphragm 12. The annular boss 161 does not overlap with the first sound outlet 130 in the projection of the first direction, and the annular boss 161 also needs to avoid the lower fold ring 120 on the lower diaphragm 12 to ensure that the lower diaphragm 12 can vibrate under the drive of the voice coil assembly 15.

[0055] In the above embodiments, the speaker module 10 may further include a first annular bracket 19a, which is disposed between the magnetic circuit assembly 14 and the lower diaphragm 12. Along the first direction, the first annular bracket 19a and the annular boss 161 are symmetrically disposed at both ends of the lower diaphragm 12. The first annular bracket 19a connects the lower diaphragm 12 and the magnetic circuit assembly 14. The main shaft 160 passes through the first annular bracket 19a, and the lower diaphragm 12 is also connected to the support shell 13 through the annular boss 161. In this way, the support shell 13 can also support the magnetic circuit assembly 14, thereby improving the stability of the magnetic circuit assembly 14. A sealing ring may also be provided between the first annular bracket 19a and the lower diaphragm 12 to improve the airtightness of the magnetic circuit assembly 14 when it is fitted with the support assembly 16.

[0056] The speaker module 10 may also include a second annular bracket 19b, which may be disposed between the magnetic circuit assembly 14 and the upper diaphragm 11. Along the first direction, the second annular bracket 19b and the first annular bracket 19a are symmetrically disposed at both ends of the magnetic circuit assembly 14. The arrangement of the second annular bracket 19b can further improve the stability of the magnetic circuit assembly 14 installed between the upper diaphragm 11 and the lower diaphragm 12.

[0057] Continue to refer to Figure 2 , Figure 3 and Figure 4The main shaft 160 is provided with a first air pressure balancing hole 1600, which penetrates the main shaft 160 along a first direction. The support assembly 16 includes a first air pressure balancing valve 162 for sealing the first air pressure balancing hole 1600. The first air pressure balancing valve 162 can be a waterproof and breathable membrane. When the voice coil assembly 15 is energized, it generates heat, which causes the gas between the upper diaphragm 11 and the lower diaphragm 12 to expand, increasing the air pressure between them. This increased air pressure is then discharged through the first air pressure balancing hole 1600 and the first air pressure balancing valve 162, ensuring the stability of the air pressure in the space between the upper diaphragm 11 and the lower diaphragm 12. The second annular support 19b may also have multiple openings penetrating it along a direction perpendicular to the first direction, allowing gas in cavity a to enter the first air pressure balancing hole 1600.

[0058] It is worth mentioning that the first air pressure balancing valve 162 can be specifically located on the surface of the main shaft 160 facing the upper diaphragm 11, or the first air pressure balancing valve 162 can be located in the first air pressure balancing hole 1600 (not shown in the figure), or the first air pressure balancing valve 162 can be located on the surface of the main shaft 160 away from the upper diaphragm 11 (not shown in the figure), as long as the first air pressure balancing valve 162 can block the first air pressure balancing hole 1600. The first air pressure balancing valve 162 is a waterproof and breathable membrane.

[0059] In the above embodiments, the voice coil assembly 15 may include a voice coil skeleton 150 and at least one voice coil 151, with the at least one voice coil 151 disposed around the outer side of the voice coil skeleton 150. Along a first direction, the voice coil skeleton 150 passes through the magnetic circuit assembly 14 and is connected to the upper diaphragm 11 and the lower diaphragm 12, respectively. The voice coil skeleton 150 passes through the magnetic circuit assembly 14 and connects to the upper diaphragm 11 and the lower diaphragm 12. The voice coil skeleton 150 divides the space between the upper diaphragm 11 and the lower diaphragm 12 into chamber a and chamber b. The voice coil 151 is disposed in one of the chambers b. When the voice coil 151 is energized, it generates heat, causing the temperature in chamber a and chamber b to rise. This causes the air in chambers a and b to expand due to the heat, increasing the air pressure in chambers a and b. The first pressure balancing hole 1600 is only connected to chamber a, allowing gas in chamber a to escape and balance the air pressure in chamber a with the external pressure. To ensure that gas in chamber b can also escape when the temperature rises, preventing uneven air pressure between chambers a and b, the voice coil skeleton 150 is designed to facilitate the release of gas from chamber b. Figure 5a This is a schematic diagram of a voice coil skeleton in a speaker module provided in this application embodiment. Continuing to refer to... Figure 2 and Figure 5aA notch 1500 can be provided in the voice coil skeleton 150. Along the first direction, the notch 1500 can penetrate the voice coil skeleton 150. In the thickness direction of the voice coil skeleton 150, the notch 1500 also penetrates the voice coil skeleton 150, so that the cavities a and b on both sides of the voice coil skeleton 150 are connected, ensuring the stability of the spatial air pressure formed between the upper diaphragm 11 and the lower diaphragm 12, so that the upper diaphragm 11 and the lower diaphragm 12 can work stably. Figure 5b This is another structural schematic diagram of the voice coil skeleton in the speaker module provided in the embodiments of this application, referring to... Figure 2 and Figure 5b In some other embodiments, a plurality of openings 1502 may be provided on the voice coil skeleton 150. These openings 1502 may penetrate the voice coil skeleton 150 along its thickness direction and may be evenly distributed circumferentially on the voice coil skeleton 150. Alternatively, the openings 1502 may be spirally distributed on the voice coil skeleton 150, or irregularly distributed. When the voice coil skeleton 150 has a notch, it may also have a plurality of openings 1502. When the voice coil skeleton 150 has a plurality of openings 1502, and these openings are evenly distributed circumferentially on the voice coil skeleton 150, the voice coil 151, when located on the outside of the voice coil skeleton 150, can avoid the multiple openings 1502 to ensure gas flow between cavity a and cavity b.

[0060] Continue to refer to Figure 2 and Figure 3The magnetic circuit assembly 14 may include a magnet structure 140 and a magnetic structure. The magnet structure 140 includes a central magnet 1400 and a side magnet 1401, which are spaced apart to form a first gap 1402. The magnetic guiding structure includes a first magnetic plate group 141 and a second magnetic plate group 142. Along a first direction, the first magnetic plate group 141 and the second magnetic plate group 142 are disposed on both sides of the magnet structure 140. A portion of the voice coil assembly 15 is located in the first gap 1402, and both ends of the voice coil assembly 15 pass through the first magnetic plate group 141 and the second magnetic plate group 142 and are connected to the upper diaphragm 11 and the lower diaphragm 12. There are several ways in which the two ends of the voice coil assembly 15 pass through the first magnetic plate group 141 and the second magnetic plate group 142. For example, the first magnetic plate group 141 includes a first central magnetic plate 1410 and a first side magnetic plate 1411. There is a second gap 1412 between the first central magnetic plate 1410 and the first side magnetic plate 1411. The first central magnetic plate 1410 is located on the side of the central magnet 1400 facing the upper diaphragm 11, and the first side magnetic plate 1411 is located on the side of the side magnet 1401 facing the upper diaphragm 11. The first gap 1402 and the second gap 1412 are connected. The dimensions of the first gap 1402 and the second gap 1412 can be the same or different, as long as the voice coil assembly 15 can be set up and the movement of the voice coil assembly 15 along the first direction is not affected.

[0061] Continue to refer to Figure 2 When the first magnetic plate group 141 includes a first central magnetic plate 1410 and a first side magnetic plate 1411, the second magnetic plate group 142 may include a second central magnetic plate 1420 and a second side magnetic plate 1421. The second central magnetic plate 1420 and the second side magnetic plate 1421 may be spaced apart, such that a third gap 1422 exists between the second central magnetic plate 1420 and the second side magnetic plate 1421. Along the first direction, the second central magnetic plate 1420 and the first central magnetic plate 1410 are located on both sides of the central magnet 1400, and the second side magnetic plate 1421 and the first side magnetic plate 1411 are located on both sides of the side magnet 1401. The third gap 1422 communicates with the first gap 1402, that is, the third gap 1422, the first gap 1402 and the second gap 1412 are interconnected. The voice coil assembly 15 can pass through the third gap 1422, the first gap 1402 and the second gap 1412 to connect with the upper diaphragm 11 and the lower diaphragm 12, respectively.

[0062] Figure 6 for Figure 3 A schematic diagram of a structure in which the midrange coil assembly and the second magnet assembly work together. (Continue referring to...) Figure 3 and Figure 6When the first magnetic plate group 141 includes a first central magnetic plate 1410 and a first side magnetic plate 1411, the second magnetic plate group 142 may also include a second magnetic plate 1423. The second magnetic plate 1423 includes a plurality of connecting holes 1424. The connecting holes 1424 penetrate the second magnetic plate 1423 along a first direction. The arrangement of the plurality of connecting holes 1424 can be in various ways, such as: the plurality of connecting holes 1424 are evenly distributed around the center of the second magnetic plate 1423, or the plurality of connecting holes 1424 are arranged in an array. In the projection of the upper diaphragm 11 or the lower diaphragm 12, at least some of the connecting holes 1424 coincide with the first gap 1402. The voice coil assembly 15 can connect the upper diaphragm 11 and the lower diaphragm 12 through the second gap 1412, the first gap 1402 and the connecting holes 1424.

[0063] When specifically setting the first magnetic plate group 141 and the second magnetic plate group 142, the first magnetic plate group 141 may include a first central magnetic plate 1410 and a first side magnetic plate 1411, or the first magnetic plate group 141 includes a first magnetic plate and a plurality of connecting holes (not shown in the figure) are provided on the first magnetic plate. The second magnetic plate group 142 may include a second central magnetic plate 1420 and a second side magnetic plate 1421, or the second magnetic plate group 142 includes a second magnetic plate 1423 and a plurality of connecting holes 1424 are provided on the second magnetic plate 1423. When multiple connecting holes are provided on the first magnetic plate or multiple connecting holes 1424 are provided on the second magnetic plate 1423, multiple pins 1501 can be provided on the voice coil frame 150. The pins 1501 can pass through the connecting holes on the first magnetic plate to connect with the upper diaphragm, and the pins 1501 can also pass through the connecting holes 1424 on the second magnetic plate 1423 to connect with the lower diaphragm 12. In this way, the first magnetic plate or the second magnetic plate 142 is a whole structure, which can improve the overall strength of the magnetic circuit assembly 14 and make the magnetic circuit assembly 14 more stable when positioned between the upper diaphragm 11 and the lower diaphragm 12. It is worth mentioning that when the pins 1501 on the voice coil frame 150 pass through the second magnetic plate 1423, there is a gap between the main body of the voice coil frame 150 and the side of the second magnetic plate 1423 facing the upper diaphragm 11, so as to ensure that the cavities a and b on both sides of the voice coil frame 150 can be connected.

[0064] Figure 7 for Figure 2 A schematic diagram of a local structure in the middle. Figure 7 Part A is axially magnetized. Figure 7 Part B is radially magnetized, refer to Figure 2 and Figure 7In the above embodiments, the materials of the first magnetic plate group 141 and the second magnetic plate group 142 can be magnetically conductive materials or magnets. When the materials of the first magnetic plate group 141 and the second magnetic plate group 142 are magnetically conductive materials, the central magnet 1400 and the side magnet 1401 are magnetized axially. Axial magnetization can be understood as magnetization along a first direction, and the magnetization directions of the central magnet 1400 and the side magnet 1401 are opposite. For example, the magnetization direction of the central magnet 1400 is upward. The diaphragm 11 points towards the lower diaphragm 12, and the magnetization direction of the side magnet 1401 is the same as the direction from the lower diaphragm 12 to the upper diaphragm 11. Similarly, when the magnetization direction of the center magnet 1400 is the same as the direction from the lower diaphragm 12 to the upper diaphragm 11, the magnetization direction of the side magnet 1401 is the same as the direction from the upper diaphragm 11 to the upper diaphragm 11. Both the center magnet 1400 and the side magnet 1401 are magnetized along the first direction, but their magnetization directions are two opposite directions of the first direction. This allows the magnetic circuit assembly to form a magnetic circuit and cooperate with the voice coil assembly 15, enabling the voice coil assembly to reciprocate along the first direction through the third gap 1422, the first gap 1402, and the second gap 1412.

[0065] When both the first magnetic plate group 141 and the second magnetic plate group 142 are magnets, the central magnet 1400 and the edge magnet 1401 are radially magnetized. Radial magnetization can be understood as the central magnet 1400 and the edge magnet 1401 being magnetized along a direction perpendicular to the first direction. Here, the direction perpendicular to the first direction is the direction from the center of the central magnet 1400 to its edge. The first magnetic plate group 141 and the second magnetic plate group 142 are magnetized along the first direction, and the magnetization direction of the parts of the first magnetic plate group 141 and the second magnetic plate group 142 corresponding to the central magnet 1400 is perpendicular to the direction of the central magnet 1400. That is, the part of the first magnetic plate group 141 corresponding to the central magnet 1400 (the first...) The magnetization direction of the central magnetic plate 1410 is from the upper diaphragm 11 to the lower diaphragm 12. The magnetization direction of the part of the second magnetic plate group 142 corresponding to the central magnet 1400 (the second central magnetic plate 1420) is from the lower diaphragm 12 to the upper diaphragm 11. The magnetization direction of the part of the first magnetic plate group 141 corresponding to the side magnet (the first side magnetic plate 1411) is also perpendicular to the part of the side magnet 1401. That is, the magnetization direction of the part of the first magnetic plate group 141 corresponding to the side magnet 1401 (the first side magnetic plate 1411) is from the lower diaphragm 12 to the upper diaphragm 11. The magnetization direction of the part of the second magnetic plate group 142 corresponding to the side magnet 1401 (the second side magnetic plate 1421) is from the upper diaphragm 11 to the lower diaphragm 12.

[0066] Continue to refer to Figure 2The upper diaphragm 11 may include an upper folded ring 110 and an upper diaphragm 111, and the lower diaphragm 12 may include a lower folded ring 120 and a lower diaphragm 121. The number of upper folded rings 110 and lower folded rings 120 may both be two, and the two upper folded rings 110 and the two lower folded rings 120 are symmetrically arranged. The upper folded rings 110 and the lower folded rings 120 are both annular. The voice coil assembly 15 connects the upper diaphragm 11 and the lower diaphragm 12 through the upper diaphragm 111 and the lower diaphragm 121. The voice coil assembly 15 includes two voice coils 151. Both voice coils 151 cooperate with the magnetic circuit assembly 14, and the winding directions of the two voice coils 151 are opposite to improve the driving effect of driving the upper diaphragm 11 and the lower diaphragm 12.

[0067] Figure 8 Another cross-sectional view of the speaker module provided in an embodiment of this application. (Refer to...) Figure 8 The upper diaphragm 11 may include an upper folded ring 110 and an upper diaphragm 111, and the lower diaphragm 12 may include a lower folded ring 120 and a lower diaphragm 121. The number of upper folded rings 110 and lower folded rings 120 may both be two, and the two upper folded rings 110 and the two lower folded rings 120 are symmetrically arranged. The upper folded rings 110 and 120 are both annular. The voice coil assembly 15 connects the upper diaphragm 11 and the lower diaphragm 12 through the upper diaphragm 111 and the lower diaphragm 121, and the voice coil assembly 15 includes a voice coil 151. The voice coil 151 cooperates with the magnetic circuit assembly 14 to drive the upper diaphragm 11 and the lower diaphragm 12.

[0068] Figure 9 Another cross-sectional view of the speaker module provided in an embodiment of this application. (Refer to...) Figure 9 The upper diaphragm 11 may include an upper folded ring 110 and an upper diaphragm 111, and the lower diaphragm 12 may include a lower folded ring 120 and a lower diaphragm 121. An opening may be provided on the lower diaphragm 121, located at its center. The support assembly 16 passes through the opening. There is one upper folded ring 110 and two lower folded rings 120, both of which are annular. The upper diaphragm 111 is arched, or can be understood as an arched dome. The upper folded ring 110 is connected to the edge of the upper diaphragm 111. The voice coil assembly 15 is connected at both ends to the upper diaphragm 111 and the lower diaphragm 121 respectively to connect the upper diaphragm 11 and the lower diaphragm 12. The voice coil assembly 15 includes a voice coil 151, which cooperates with the magnetic circuit assembly 14 to drive the upper diaphragm 11 and the lower diaphragm 12.

[0069] Figure 10 Another cross-sectional view of the speaker module provided in an embodiment of this application. (Refer to...) Figure 10The upper diaphragm 11 may include an upper folded ring 110 and an upper membrane 111, and the lower diaphragm 12 may include a lower folded ring 120 and a lower membrane 121. An opening may be provided on the lower membrane 121, located at its center. The support assembly 16 passes through the opening. There is one upper folded ring 110 and two lower folded rings 120. Both the upper folded ring 110 and the two lower folded rings 120 are annular. The upper membrane 111 is arched, or it can be understood as an arched dome. The upper folded ring 110 is connected to the edge of the upper membrane 111. The two ends of the voice coil assembly 15 are connected to the upper diaphragm 111 and the lower diaphragm 121 respectively to connect the upper diaphragm 11 and the lower diaphragm 12. The voice coil assembly 15 includes two voice coils 151, both of which are engaged with the magnetic circuit assembly 14. The winding directions of the two voice coils 151 are opposite to improve the driving effect of driving the upper diaphragm 11 and the lower diaphragm 12.

[0070] Figure 11 Another cross-sectional view of the speaker module provided in an embodiment of this application. (Refer to...) Figure 11 The diaphragm 11 may include an upper folded ring 110 and an upper diaphragm 111, and the lower diaphragm 12 may include a lower folded ring 120 and a lower diaphragm 121. An opening may be provided on the lower diaphragm 121, and the opening is located at the center of the lower diaphragm 121. The support assembly 16 passes through the opening. There is one upper folded ring 110 and two lower folded rings 120. Both the upper folded ring 110 and the lower folded ring 120 are annular. The upper diaphragm 111 may be planar. One upper folded ring 110 surrounds the edge of the upper diaphragm 111. The voice coil assembly 15 connects the upper diaphragm 11 and the lower diaphragm 12 through the upper diaphragm 111 and the lower diaphragm 121. The voice coil assembly 15 includes a voice coil 151. The voice coil 151 cooperates with the magnetic circuit assembly 14 to drive the upper diaphragm 11 and the lower diaphragm 12.

[0071] Figure 12 Another cross-sectional view of the speaker module provided in an embodiment of this application. (Refer to...) Figure 12 The diaphragm 11 may include an upper folded ring 110 and an upper diaphragm 111, and the lower diaphragm 12 may include a lower folded ring 120 and a lower diaphragm 121. An opening may be provided on the lower diaphragm 121, and the opening is located at the center of the lower diaphragm 121. The support assembly 16 passes through the opening. There is one upper folded ring 110 and two lower folded rings 120. Both the upper folded ring 110 and the lower folded ring 120 are annular. The upper diaphragm 111 may be planar. One upper folded ring 110 surrounds the edge of the upper diaphragm 111. The voice coil assembly 15 connects the upper diaphragm 11 and the lower diaphragm 12 through the upper diaphragm 111 and the lower diaphragm 121. The voice coil assembly 15 includes two voice coils 151. Both voice coils 151 cooperate with the magnetic circuit assembly 14, and the winding directions of the two voice coils 151 are opposite to improve the driving effect of driving the upper diaphragm 11 and the lower diaphragm 12.

[0072] Continue to refer to Figure 9 , Figure 10, Figure 11 and Figure 12 In the speaker assembly, no second annular bracket is provided, which simplifies the internal structure of the speaker assembly and reduces the difficulty of assembly. The magnetic circuit assembly 14 is supported by the support assembly 16 and the first annular bracket 19a to ensure the stability of the magnetic circuit assembly 14.

[0073] In the above embodiments, the number of voice coils can be one or two. When the number of voice coils is two, the voice coils include a first voice coil and a second voice coil. The first voice coil and the second voice coil are spaced apart along a first direction, and the winding directions of the first voice coil and the second voice coil are opposite.

[0074] Figure 13 Another cross-sectional view of the speaker module provided in an embodiment of this application. (Refer to...) Figure 13 The magnetic circuit assembly 14 may also include a second air pressure balancing valve 143, and at least one second air pressure balancing hole 1403 is provided on the side magnet 1401. The at least one second air pressure balancing hole 1403 penetrates the side magnet 1401 in a direction perpendicular to the first direction. That is, one end of the second air pressure balancing hole 1403 is connected to the first gap 1402, and the other end of the second air pressure balancing hole 1403 is connected to the outside of the speaker module 10. The second air pressure balancing valve 143 is used to block the second air pressure balancing hole 1403. Specifically, when the voice coil assembly 15 operates to heat the air pressure in the space between the upper diaphragm 11 and the lower diaphragm 12, increasing the air pressure in the space between the upper diaphragm 11 and the lower diaphragm 12, gas can be discharged through the second air pressure balancing hole 1403 and the second air pressure balancing valve 143. The second air pressure balancing valve 143 can prevent water from entering the space between the upper diaphragm 11 and the lower diaphragm 12 through the second air pressure balancing hole 1403. Specifically, the second air pressure balancing valve 143 can be located inside the second air pressure balancing hole 1403, or the second air pressure balancing valve 143 can be located in the first gap 1402 and completely cover the second air pressure balancing hole 1403, or the second air pressure balancing valve 143 can be located on the surface of the speaker module 10.

[0075] Figure 14 This is a schematic diagram of the flexible drive circuit board in the speaker module provided in an embodiment of this application. (Refer to...) Figure 13 and Figure 14The speaker module 10 also includes a flexible drive circuit board 19c and a pin 19d. The flexible drive circuit board 19c is disposed on the side of the upper diaphragm 11 facing the lower diaphragm 12. That is, the flexible drive circuit board 19c can be connected to the magnetic circuit assembly 14 through the second annular bracket 19b. The flexible drive circuit board 19c is also connected to the voice coil assembly 15, in which case the voice coil assembly 15 is connected to the upper diaphragm 11 through the flexible drive circuit board 19c. The support assembly 16 is provided with a mounting hole that extends through the support assembly 16 in a first direction. The pin 19d is disposed on the support assembly 16 through the mounting hole and connected to the flexible drive circuit board 19c. The flexible drive circuit board 19c may be provided with a first contact point 190 for connecting to the pin 19d and a second contact point 191 for connecting to the voice coil. The first contact 190 and the second contact 191 are connected by internal wiring in the flexible drive circuit board 19c. The flexible drive circuit board 19c may also include an inner ring 192, a middle ring 193 and an outer ring 194. The inner ring 192 is used to abut against the support component 16, the middle ring 193 is fixed to the voice coil frame, and the outer ring is used to connect with the first sealing support, which can ensure the stability of the flexible drive circuit board.

[0076] In the above embodiments, the upper and lower diaphragms have the same shape. Specifically, the upper and lower diaphragms can be circular, rectangular, rhomboid, or other polygonal shapes.

[0077] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope and intent of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application is also intended to include such modifications and variations.

Claims

1. A speaker module, characterized in that, include: upper diaphragm; The lower diaphragm, wherein the upper diaphragm and the lower diaphragm are arranged at intervals along a first direction; A support shell, along the first direction, is connected to the side of the lower diaphragm away from the upper diaphragm, and the support shell has at least one first sound outlet hole; A magnetic circuit assembly is located between the upper diaphragm and the lower diaphragm, and the edge of the magnetic circuit assembly facing the upper diaphragm is sealed to the upper diaphragm, and the edge of the magnetic circuit assembly facing the lower diaphragm is sealed to the lower diaphragm. A voice coil assembly is located between the upper diaphragm and the lower diaphragm, and the voice coil assembly passes through the magnetic circuit assembly to connect the upper diaphragm and the lower diaphragm, so as to drive the upper diaphragm and the lower diaphragm to vibrate in the same direction; A support assembly passing through the support shell and the lower diaphragm, and the support assembly being used to support the lower diaphragm and the magnetic circuit assembly.

2. The speaker module as described in claim 1, characterized in that, The support assembly includes a main shaft and an annular boss. The annular boss is fixed to the main shaft. The main shaft passes through the support shell and the lower diaphragm. The annular boss is located between the lower diaphragm and the support shell, and the annular boss abuts against the lower diaphragm and the support shell respectively.

3. The speaker module as described in claim 2, characterized in that, The support assembly further includes a first air pressure balance valve, and the main shaft has a first air pressure balance hole that extends through the main shaft along the first direction. The first air pressure balance valve is used to block the first air pressure balance hole.

4. The speaker module as described in claim 1, characterized in that, The voice coil assembly includes a voice coil skeleton and at least one voice coil, wherein the at least one voice coil is disposed around the outer side of the voice coil skeleton; Along the first direction, the voice coil skeleton passes through the magnetic circuit assembly, and the two ends of the voice coil skeleton are respectively connected to the upper diaphragm and the lower diaphragm.

5. The speaker module as described in claim 4, characterized in that, There are two voice coils, both of which are arranged around the outside of the voice coil frame; Along the first direction, the two voice coils are spaced apart, and the winding directions of the two voice coils are opposite.

6. The speaker module as described in claim 4 or 5, characterized in that, The voice coil skeleton includes a notch that extends through the voice coil skeleton along the first direction.

7. The speaker module as described in any one of claims 4 to 6, characterized in that, The voice coil skeleton also includes multiple openings, which are evenly distributed along the circumference of the voice coil skeleton.

8. The loudspeaker module as described in any one of claims 4 to 7, characterized in that, The voice coil skeleton includes a plurality of pins, with adjacent pins spaced apart, and the pins are used to connect to the lower diaphragm.

9. The speaker module as described in claim 1, characterized in that, The magnetic circuit assembly includes the magnet structure and the magnetic structure. The magnet structure includes a central magnet and a side magnet disposed outside the central magnet. A first gap exists between the central magnet and the side magnet. The magnetic guiding structure includes a first magnetic plate group and a second magnetic plate group. Along the first direction, the first magnetic plate group and the second magnetic plate group are disposed on both sides of the magnet structure. The voice coil assembly is located in the first gap, and the two ends of the voice coil assembly pass through the first magnetic plate group and the second magnetic plate group respectively and are connected to the upper diaphragm and the lower diaphragm.

10. The speaker module as described in claim 9, characterized in that, The first magnetic plate assembly includes a first center magnetic plate and a first side magnetic plate. A second gap exists between the first center magnetic plate and the first side magnetic plate. The first center magnetic plate is disposed on one side of the center magnet, and the first side magnetic plate is disposed on one side of the first side magnetic conductor. The first gap and the second gap are connected, and the voice coil assembly passes through the first gap and the second gap.

11. The speaker module as described in claim 9 or 10, characterized in that, The second magnetic plate assembly includes a second center magnetic plate and a second side magnetic plate. A third gap exists between the second center magnetic plate and the second side magnetic plate. The second center magnetic plate is disposed on one side of the center magnet, and the second side magnetic plate is disposed on one side of the first side magnetic conductor. The first gap and the third gap are connected, and the voice coil assembly passes through the first gap and the third gap.

12. The speaker module as described in claim 9 or 10, characterized in that, The second magnetic plate assembly includes a second magnetic plate, the second magnetic plate including a plurality of connecting holes penetrating the second magnetic plate along a first direction, at least a portion of the connecting holes coinciding with the first gap in the projection of the upper diaphragm or the lower diaphragm, and the voice coil assembly passing through the first gap and at least a portion of the connecting holes.

13. The speaker module as described in claim 9, characterized in that, When the materials of the first magnetic plate group and the second magnetic plate group are magnetically conductive materials, the central magnet and the side magnet are magnetized along the first direction, and the magnetization directions of the central magnet and the side magnet are opposite.

14. The speaker module as described in claim 9, characterized in that, The first magnetic plate group and the second magnetic plate group are made of magnets, and the central magnet and the side magnets are magnetized in a direction perpendicular to the first direction.

15. The loudspeaker module as described in any one of claims 9 to 14, characterized in that, The magnetic circuit assembly further includes a second air pressure balancing valve. At least one second air pressure balancing hole is provided on the side magnet. One end of the at least one second air pressure balancing hole is connected to the first gap, and the other end of the at least one second air pressure balancing hole is connected to the outside of the speaker module. The second air pressure balancing valve is used to block the second air pressure balancing hole.

16. The speaker module as described in claim 1, characterized in that, The speaker module also includes a flexible drive circuit board, which is disposed on the side of the upper diaphragm facing the lower diaphragm, and is used to electrically connect with the voice coil assembly.

17. The speaker module as described in claim 16, characterized in that, The support component is provided with a mounting hole that extends through the support component along the first direction. The mounting hole is used to insert a pin, which is connected to the flexible drive circuit board.

18. The loudspeaker module as described in any one of claims 1 to 17, characterized in that, The upper diaphragm includes an upper membrane and at least one upper folded ring, and the lower diaphragm includes a lower membrane and at least one lower folded ring.

19. A terminal device, characterized in that, The device includes a housing and a speaker module as described in any one of claims 1 to 18 disposed within the housing, the speaker module dividing the housing into a front cavity and a rear cavity, the housing having a second sound outlet communicating with the front cavity, and the second sound outlet corresponding to the upper diaphragm.

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