Circuit board windowing method

Abstract

The invention belongs to the technical field of circuit board processing, and relates to a circuit board windowing method. The windowing method for the circuit board comprises the following steps: attaching a shielding film to a circuit layer of the circuit board; setting a first processing area on the shielding film and setting a second processing area around the periphery of the first processing area according to the windowing pattern on the circuit board; according to the first machining area and the second machining area, first laser and second laser are determined respectively, and the shielding film in the first machining area is removed through the first laser; removing the shielding film in the second processing area through the second laser; wherein the diameter of a first light spot formed by the first laser on the shielding film is larger than that of a second light spot formed by the second laser on the shielding film. According to the circuit board windowing method, the windowing machining precision can be improved, and meanwhile the windowing efficiency can be improved.

Description

Technical Field

[0001] This invention belongs to the field of FPC processing technology, and in particular relates to a method for opening windows in circuit boards. Background Technology

[0002] Currently, the process sequence for opening windows in circuit boards is to first open the shielding film and then attach the opened shielding film to the circuit layer. In practical applications, this opening method is inefficient and has a large alignment accuracy error. At the same time, the alignment accuracy in the flexible circuit board production process is determined by multiple factors, which makes it difficult to control and restricts the design of flexible circuit boards to be more precise and refined. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a method for opening windows on circuit boards, which addresses the issue of large alignment accuracy errors in existing windowing methods.

[0004] To address the aforementioned technical problems, embodiments of the present invention provide a method for opening windows on a circuit board, comprising: The shielding film is attached to the circuit layer of the circuit board; According to the window pattern on the circuit board, a first processing area is set on the shielding film and a second processing area is set around the periphery of the first processing area; The first laser and the second laser are determined based on the first processing area and the second processing area, respectively; The shielding film in the first processing area is removed by the first laser; The shielding film in the second processing area is removed by the second laser; wherein the diameter of the first spot formed by the first laser on the shielding film is larger than the diameter of the second spot formed by the second laser on the shielding film.

[0005] According to the circuit board windowing method of the present invention, the shielding film of the first processing area is first removed by a first laser, and then the shielding film of the second processing area is removed by a second laser to form a window. During the shielding film removal process, the diameter of the second laser spot formed by the second laser is made smaller than the diameter of the first laser spot formed by the first laser. This allows for large-area and rapid processing of the non-edge area (i.e., the first processing area) of the window during the first laser processing, while the edge area (i.e., the second processing area) is finely processed during the second laser processing. This improves the processing accuracy of the window and speeds up the windowing process.

[0006] Optionally, the first laser and the second laser are generated by the same laser; the first laser and the second laser are determined according to the first processing area and the second processing area, respectively, including: Based on the first processing area and the second processing area, the first laser is focused to the second laser using the same laser; wherein, the first spot formed by the first laser on the shielding film is a defocused spot, and the second spot formed by the second laser on the shielding film is a focused spot.

[0007] Optionally, the first laser and the second laser are generated by the same laser, and a half-wave plate and a polarizer are further disposed on one side of the laser; the first laser and the second laser are determined according to the first processing area and the second processing area, respectively, including: Based on the first processing area and the second processing area, the laser beam emitted by the laser is controlled to be incident on the polarizer through the half-wave plate. The polarization state of the laser beam is adjusted by the half-wave plate, and the laser beam is split into the first laser and the second laser by the polarizer.

[0008] Optionally, the first laser is generated by a first laser, and the second laser is generated by a second laser; determining the first laser and the second laser based on the first processing area and the second processing area respectively includes: Based on the first processing area, a first laser is generated by the first laser. A second laser is generated by the second laser according to the second processing area.

[0009] Optionally, removing the shielding film from the first processing area using a first laser includes: The shielding film in the first processing area is removed by the first laser along the first path; The first path includes a first sub-path extending along a first direction; multiple first sub-paths are provided, and the multiple first sub-paths are arranged at intervals along a second direction; the emission direction of the first laser, the first direction, and the second direction are perpendicular to each other.

[0010] Optionally, the first laser is a pulsed laser; removing the shielding film of the first processing area by the first laser along the first path includes: the first laser sequentially forming a plurality of first light spots on the shielding film along each of the first sub-paths; Along the first direction, the diameter x of the first light spot and the first distance a between the centers of two adjacent first light spots satisfy the condition: 0 < a < x / 2.

[0011] Optionally, along the second direction, the distance b between two adjacent first sub-paths satisfies the following relationship with the diameter x of the first light spot: 0 < b ≤ x / 2; the diameter x of the first light spot, the width k of the windowed pattern, and the number n of the first sub-paths satisfy the following relationship: x < k / (n+1).

[0012] Optionally, the first path further includes a second sub-path, with one second sub-path provided between every two adjacent first sub-paths; Each of the first sub-paths and each of the second sub-paths forms a bow-shaped first path.

[0013] Optionally, removing the shielding film from the second processing area using a second laser includes: The shielding film in the second processing area is removed along the second path of the second laser, wherein the emission direction of the second laser is perpendicular to the second path, and the second path is circular.

[0014] Optionally, the second laser is a pulsed laser, and the second laser forms multiple second light spots on the shielding film; the second light spots are circular. Along the second path, the distance between the centers of two adjacent second light spots is less than the radius of the second light spot.

[0015] Optionally, the radius of the second light spot is not greater than 0.02 mm; The radius of the first light spot is greater than 0.02 mm.

[0016] This invention also provides another method for opening windows on a circuit board, characterized by comprising: The shielding film is attached to the circuit layer of the circuit board; wherein the circuit board has multiple window patterns; According to the window patterns on the circuit board, a plurality of first processing areas and a plurality of second processing areas are set on the shielding film, wherein the plurality of first processing areas correspond one-to-one with the plurality of second processing areas, and each of the second processing areas is arranged around the periphery of the corresponding first processing area. Based on each of the first processing areas and each of the second processing areas, a plurality of first lasers and a plurality of second lasers are determined respectively; Multiple first lasers are configured to correspond one-to-one with multiple first processing areas, and the shielding film corresponding to the first processing area is removed by each first laser; Multiple second lasers are configured to correspond one-to-one with multiple second processing areas, and the shielding film of the corresponding second processing area is removed by each second laser; wherein, among the first light spot and the second light spot corresponding to the same window pattern, the diameter of the first light spot is larger than the diameter of the second light spot.

[0017] According to the circuit board windowing method of the present invention, the shielding film of each first processing area is first removed by each first laser, and then the shielding film of each second processing area is removed by each second laser to form a window. During the shielding film removal process, the diameter of the second spot formed by the second laser is made smaller than the diameter of the first spot formed by the first laser. This allows for large-area and rapid processing of the non-edge area (i.e., the first processing area) of the window during the first laser processing, while the edge area (i.e., the second processing area) is finely processed during the second laser processing. This improves the processing accuracy of the window and speeds up the windowing process. Attached Figure Description Figure 1 This is a schematic flowchart of a circuit board windowing method provided in an embodiment of the present invention; Figure 2 yes Figure 1 A schematic diagram of the first path of the first laser in the middle; Figure 3 yes Figure 1 A schematic diagram of the second path of the second laser in the middle; Figure 4 yes Figure 2 The first path and Figure 3 A schematic diagram of the combination of the second path; Figure 5 yes Figure 1 A schematic diagram of the circuit board windowing method; Figure 6 This is a schematic flowchart of a circuit board windowing method provided in another embodiment of the present invention; Figure 7 yes Figure 6 A schematic diagram of the first path of each of the first lasers in the middle; Figure 8 yes Figure 6 Schematic diagram of the second path of each second laser; Figure 9 yes Figure 6 A schematic diagram of the process for creating a window on a circuit board.

[0018] The reference numerals in the accompanying drawings are as follows: 1. Window opening pattern; 1a. First window opening; 1b. Second window opening; 11. 11a, 11b. First processing area; 12. 12a, 12b. Second processing area; 2, 2a, 2b, the first light spot; 3, 3a, 3b, the second light spot; L1, First Path; L11, First Sub-Path; L12, Second Sub-Path; L2, Second Path; X, the first direction; Y, the second direction. Detailed Implementation

[0019] To make the technical problems solved, the technical solutions, and the beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0020] Existing FPCs (Flexible Printed Circuits) typically use polyester film or polyimide as the substrate, with copper foil covering the substrate forming the circuitry through etching. These printed circuits offer high reliability and excellent flexibility. To prevent oxidation of the circuit board surface from exposure to air and to facilitate subsequent surface treatment and solder masking, a shielding film needs to be applied to the circuit board. Additionally, openings are needed in the pads or circuitry sections to expose the pads for electrical connections.

[0021] The existing windowing process for circuit boards involves first opening the shielding film, and then attaching the opened shielding film to the circuit layer. In practical applications, this windowing method is inefficient and has a large alignment accuracy error. At the same time, the alignment accuracy during the production of flexible circuit boards is determined by multiple factors, making it difficult to control and restricting the design of flexible circuit boards to be more precise and refined.

[0022] Therefore, embodiments of the present invention provide a method for opening windows on circuit boards to improve opening accuracy and efficiency. The following description is based on specific embodiments.

[0023] Example 1 like Figures 1 to 5 As shown, the circuit board windowing method provided in Embodiment 1 of the present invention includes: S1. Apply the shielding film to the circuit layer of the circuit board.

[0024] S2. Based on the window pattern 1 on the circuit board, a first processing area 11 is set on the shielding film and a second processing area 12 is set around the periphery of the first processing area 11.

[0025] Therefore, the second processing area 12 will serve as the edge area of ​​the windowed pattern 1, and the first processing area 11 will serve as the non-edge area of ​​the windowed pattern 1.

[0026] S3. Determine the first laser and the second laser based on the first processing area 11 and the second processing area 12, respectively.

[0027] In one embodiment, the first laser and the second laser are generated by the same laser; or, the first laser and the second laser are generated by different lasers, that is, the first laser is generated by the first laser and the second laser is generated by the second laser.

[0028] When the first laser and the second laser are generated by the same laser, step S3 may include: focusing the first laser to the second laser using the same laser. Since the second laser is used to remove the shielding film corresponding to the edge region of the windowed pattern (i.e., the second processing area 12), the energy density requirement is high. Therefore, the second spot 3 formed by the second laser on the shielding film is a focused spot. The first laser is used to remove the shielding film corresponding to the center region of the windowed pattern (i.e., the first processing area 11). Since the second laser has already formed a blind hole in the edge region, the energy density requirement of the first laser is low. The first spot 2 formed by the first laser on the shielding film may be a defocused spot.

[0029] Laser zoom is typically achieved through mechanical or electronic zoom. Specifically, mechanical zoom changes the focal point of the laser by adjusting the distance between the laser head and the surface of the workpiece. By moving the laser head up or down, the focal point can be shifted, increasing or decreasing the size of the laser spot, thus achieving different energy densities and processing effects.

[0030] Electronic zoom typically includes multiple lens groups and motors. By adjusting the relative positions of the lenses, the focal distance and spot size of the laser can be changed. The motorized lens contains a miniature stepper motor or linear motor to drive the movement of the lens groups. The motors receive commands from the control system and adjust the position of the lens groups through a precise stepping and feedback control system, thereby changing the focal point of the laser beam.

[0031] When the laser needs to be defocused or its focus adjusted, a motor moves the lens group back and forth. By changing the distance between different lenses, the laser's focal point can be moved forward or backward, or the spot size can be changed. The entire process allows for continuous focusing.

[0032] In one embodiment, when the first laser and the second laser are generated by the same laser, a half-wave plate and a polarizer may also be provided on one side of the laser.

[0033] At this point, step S3 includes: controlling the laser beam emitted by the laser to be incident on the polarizer via a half-wave plate according to the first processing area 11 and the second processing area 12; adjusting the polarization state of the laser beam by the half-wave plate; and splitting the laser beam into a first laser and a second laser by the polarizer. Specifically, the polarizer can split the polarized P-beam into the first laser and the polarized S-beam into the second laser. Here, the P-beam is light whose polarization direction is parallel to the incident plane of the polarizer, and the S-beam is light whose polarization direction is perpendicular to the incident plane of the polarizer.

[0034] By adjusting the half-wave plate, when a large-diameter first spot 2 is needed to remove the shielding film of the first processing area 11, the laser beam is adjusted to P-state linearly polarized light (i.e., P-light) to meet the requirement of high efficiency; when a small-diameter second spot 3 is needed to remove the shielding film of the second processing area 12, the entire laser beam is adjusted to S-state linearly polarized light (i.e., S-light) to meet the problem of small edge corner curvature and small unprocessed area. Compared to zooming, the light spots (including the first light spot 2 and the second light spot 3) formed on the shielding film in this embodiment are all focused light spots. Therefore, compared to zooming, the energy density control of the laser is more uniform and the windowing effect is better.

[0035] Furthermore, the polarization effect of polarizers can be utilized to set two polarizers so that the emission path of the first laser coincides with the emission path of the second laser. In this case, one polarizer (hereinafter referred to as the first polarizer) is used to split the laser beam into the first laser and the second laser with different optical paths, while the other polarizer (hereinafter referred to as the second polarizer) is used to make the emission path of the first laser after passing through the second polarizer coincide with the emission path of the second laser after passing through the second polarizer.

[0036] Specifically, the first laser can be directly emitted to the second polarizer, and at least one reflector can be set in the path of the second laser so that the second laser is emitted to the second polarizer after being reflected by each reflector. Through the action of the second polarizer, the emitted light path of the first laser after passing through the second polarizer coincides with the emitted light path of the second laser after passing through the second polarizer.

[0037] Furthermore, when the emission path of the first laser coincides with the emission path of the second laser, a focusing lens can be set on the emission path to focus the first laser and the second laser into a focal spot.

[0038] In one embodiment, the polarizer can be replaced by an acousto-optic modulator, an electro-optic modulator, or a beam splitter; in this embodiment, a polarizing crystal is used.

[0039] In one embodiment, when the first laser and the second laser are generated by different lasers, that is, when the first laser is generated by the first laser and the second laser is generated by the second laser, step 3 may include: generating the first laser using the first laser according to the first processing area 11; and generating the second laser using the second laser according to the second processing area 12.

[0040] S4. The shielding film of the first processing area 11 is removed by the first laser, and the first laser forms a first spot 2 on the shielding film.

[0041] In step S4, the first laser spot 2 formed on the shielding film is circular. The specific shape of the first laser spot 2 can be designed according to actual needs, and is not limited here.

[0042] In one embodiment, in step S4, when removing the shielding film from the first processing area 11, such as Figure 2 and Figure 4 As shown, the first laser can remove the shielding film of the first processing area 11 along the first path L1. The first path L1 can be designed in advance before processing, and the design should ensure that the first laser can cover the entire first processing area 11 when processing along the first path L1.

[0043] In one embodiment, such as Figure 2 , Figure 4 and Figure 5 As shown, the first path L1 may include a first sub-path L11 extending along the first direction X.

[0044] Multiple first sub-paths L11 can be provided, and the multiple first sub-paths L11 are arranged at intervals along the second direction Y. The emission direction of the first laser, the first direction X, and the second direction Y are perpendicular to each other. At this time, when the first laser removes the shielding film of the first processing area 11 along the first path L1, it can remove the shielding film of the first processing area 11 sequentially along each first sub-path L11 from one side of the first processing area 11 to the other side along the second direction Y.

[0045] The shielding film of the first processing area 11 is removed one by one along each of the first sub-paths L11, thereby removing the shielding film of the entire first processing area 11.

[0046] Preferably, the first direction X is the length direction of the window pattern 1, and the second direction Y is the width direction of the window pattern 1.

[0047] In one embodiment, such as Figure 2 , Figure 4 and Figure 5 As shown, the first path L1 may also include a second sub-path L12, with a second sub-path L12 set between every two adjacent first sub-paths L11.

[0048] After removing the shielding film of the first processing area 11 along one of the first sub-paths L11, the first laser will move along the second sub-path L12 to the adjacent first sub-path L11 and remove the shielding film of the first processing area 11 along the adjacent first sub-path L11.

[0049] The second sub-path L12 is configured to connect two adjacent first sub-paths L11, providing a predetermined route for switching between the two adjacent first sub-paths L11. Furthermore, on the second sub-path L12, the first laser only passes through without processing. In this case, the first laser only removes the shielding film of the first processing area 11 along the first sub-path L11, and does not remove the shielding film of the first processing area 11 along the second sub-path L12.

[0050] In one embodiment, such as Figure 2 , Figure 4 and Figure 5 As shown, each first sub-path L11 and each second sub-path L12 can form a bow-shaped first path L1. In other embodiments, each first sub-path L11 and each second sub-path L12 can also form an E-shaped first path L1 or a Z-shaped first path L1.

[0051] In one embodiment, the first laser is a pulsed laser, which causes the first laser to form multiple first light spots 2 sequentially along each first sub-path L11 on the shielding film.

[0052] The diameter of each first light spot 2 can be designed to a fixed value. Taking the first light spot 2 as a circle as an example, the diameter of the first light spot 2 can be set to 42.09 micrometers.

[0053] Alternatively, the diameter of each first spot 2 can be designed in conjunction with the size of the window pattern 1. In this case, along the first direction X, the diameter x of the first spot 2 and the first distance a between the centers of two adjacent first spots 2 satisfy: 0 < a < x / 2. This setting allows the first laser to better remove the shielding film of the first processing area 11 when processing along the first sub-path L11, making the processing area of ​​the first laser along the first sub-path L11 as large as possible.

[0054] Furthermore, along the second direction Y, the distance b between two adjacent first sub-paths L11 satisfies the relationship 0 < b ≤ x / 2 with respect to the diameter x of the first spot 2. The diameter x of the first spot 2, the width k of the windowed pattern 1, and the number n of the first sub-paths L11 satisfy the relationship x < k / (n+1). This setting allows the first laser to process the first processing area 11 with a larger processing area along the second direction Y, maximizing the coverage of the first processing area 11.

[0055] In one embodiment, the first laser is a CO2 laser, a UV laser, a green laser, or an IR laser. The choice of the light source for the first laser can be designed according to requirements and is not limited herein.

[0056] The first light spot 2 is a Gaussian light spot or a flat-top light spot. The mode selection of the first light spot 2 can be designed according to requirements, and there are no restrictions on it here.

[0057] S5. The shielding film of the second processing area 12 is removed by the second laser, and the second laser forms a second spot 3 on the shielding film. The diameter of the first spot 2 is larger than the diameter of the second spot 3.

[0058] In one embodiment, such as Figures 3 to 5 As shown, in step S5, when the second laser removes the shielding film of the second processing area 12, it can remove the shielding film of the second processing area 12 along the second path L2. The emission direction of the second laser is perpendicular to the second path L2, and the shape of the second path L2 is consistent with the outer contour of the window pattern 1. Specifically, the second path L2 can be annular, so that the outer edge of the area covered by the second spot 3 (i.e., the second processing area 12) is as close as possible to the outer contour of the window pattern 1.

[0059] In one embodiment, such as Figures 3 to 5 As shown, the second laser is a pulsed laser, which forms multiple second light spots 3 on the shielding film. Each second light spot 3 has a circular design.

[0060] At this point, along the second path L2, the distance d between the centers of two adjacent second light spots 3 is less than the radius r of the second light spot 3. This setting allows the second laser to better remove the shielding film of the second processing area 12 when processing along the second path L2, making the processing area of ​​the second laser along the second path L2 as large as possible.

[0061] In one embodiment, such as Figures 3 to 5 As shown, the second light spot 3 is circular, and its radius is no greater than 0.02 mm. Experiments have shown that this setting can improve the window opening accuracy from ±0.05 mm to ±0.03 mm, and even reach ±0.0015 mm.

[0062] Furthermore, the first light spot 2 is circular, and its radius is set to be greater than 0.02 mm. In this case, the coverage area of ​​the first light spot 2 is larger than that of the second light spot 3, thereby improving processing efficiency.

[0063] In one embodiment, the second laser is a CO2 laser, a UV laser, a green laser, or an IR laser. The choice of the light source for the second laser can be designed according to requirements and is not limited herein.

[0064] The second light spot 3 is a Gaussian light spot or a flat-top light spot. The mode selection of the second light spot 3 can be designed according to requirements, and there are no restrictions on it here.

[0065] The circuit board windowing method provided in Embodiment 1 of this invention first removes the shielding film of the first processing area 11 using a first laser, and then removes the shielding film of the second processing area 12 using a second laser, thereby forming a window. During the shielding film removal process, the diameter of the second laser spot 3 is made smaller than the diameter of the first laser spot 2, allowing for large-area, rapid processing of the non-edge area (i.e., the first processing area 11) during the first laser processing, while the edge area (i.e., the second processing area 12) is finely processed during the second laser processing. This improves the processing accuracy of the window and accelerates the windowing efficiency. This circuit board windowing method removes the shielding film evenly, with minimal copper damage and side etching, fully meeting process requirements.

[0066] Example 2 like Figures 6 to 9 As shown, the circuit board windowing method provided in Embodiment 2 of the present invention includes: S10. The shielding film is attached to the circuit layer of the circuit board. The circuit board has multiple window patterns 1.

[0067] by Figures 7 to 9 As shown in the example, the circuit board has two window patterns 1, which are marked as the first window 1a and the second window 1b respectively.

[0068] S20. According to the window patterns 1 on the circuit board, a plurality of first processing areas 11 and a plurality of second processing areas 12 are set on the shielding film. The plurality of first processing areas 11 correspond one-to-one with the plurality of second processing areas 12, and each second processing area 12 is set around the periphery of the corresponding first processing area 11.

[0069] like Figures 7 to 9 As shown, the first window 1a is provided with a first processing area 11a and a second processing area 12a, and the second processing area 12a is arranged around the periphery of the first processing area 11a.

[0070] The second window 1b is provided with a first processing area 11b and a second processing area 12b, with the second processing area 12b surrounding the periphery of the first processing area 11b.

[0071] S30. Based on each first processing area 11 and each second processing area 12, determine a plurality of first lasers and a plurality of second lasers respectively.

[0072] S40. Assign a one-to-one correspondence between multiple first lasers and multiple first processing areas 11, such as... Figures 7 to 9As shown, one first laser is set corresponding to the first processing area 11a, and another first laser is set corresponding to the first processing area 11b, so that the shielding film of the corresponding first processing area 11 can be removed by each first laser.

[0073] Each first laser beam forms a first spot 2 on the shielding film. Specifically, the first laser beam corresponding to the first processing area 11a forms a first spot 2a on the shielding film, and the first laser beam corresponding to the first processing area 11b forms a first spot 2b on the shielding film.

[0074] S50, Set multiple second lasers to correspond one-to-one with multiple second processing areas 12, such as Figures 7 to 9 As shown, one second laser is set corresponding to the second processing area 12a, and another second laser is set corresponding to the second processing area 12b. The shielding film of the corresponding second processing area 12 is removed by each second laser.

[0075] Each second laser forms a second spot 3 on the shielding film. Specifically, the second laser corresponding to the second processing area 12a forms a second spot 3a on the shielding film, and the second laser corresponding to the second processing area 12b forms a second spot 3b on the shielding film.

[0076] Among the first light spot 2 and the second light spot 3 corresponding to the same window pattern 1, the diameter of the second light spot 3 is smaller than the diameter of the first light spot 2. That is, among the first light spot 2a and the second light spot 3a corresponding to the first window 1a, the diameter of the second light spot 3a is smaller than the diameter of the first light spot 2a. Similarly, among the first light spot 2b and the second light spot 3b corresponding to the second window 1b, the diameter of the second light spot 3b is smaller than the diameter of the first light spot 2b.

[0077] The circuit board windowing method provided in Embodiment 2 of the present invention firstly removes the shielding film of each first processing area 11 simultaneously using first lasers, and then simultaneously removes the shielding film of each second processing area 12 using second lasers, thereby forming windows. During the shielding film removal process, the diameter of the second laser spot 3 is made smaller than the diameter of the first laser spot 2, allowing for large-area, rapid processing of the non-edge areas (i.e., the first processing area 11) during the first laser processing, while the edge areas (i.e., the second processing area 12) are finely processed during the second laser processing, thus improving the processing accuracy of the windowing and accelerating the windowing efficiency. This circuit board windowing method removes the shielding film evenly, with minimal copper damage and side etching, fully meeting process requirements.

[0078] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for opening windows in a circuit board, characterized in that, include: The shielding film is attached to the circuit layer of the circuit board; According to the window pattern on the circuit board, a first processing area is set on the shielding film and a second processing area is set around the periphery of the first processing area; The first laser and the second laser are determined based on the first processing area and the second processing area, respectively; The shielding film in the first processing area is removed by the first laser; The shielding film in the second processing area is removed by the second laser; wherein the diameter of the first spot formed by the first laser on the shielding film is larger than the diameter of the second spot formed by the second laser on the shielding film.

2. The method for opening windows in a circuit board according to claim 1, characterized in that, The first laser and the second laser are generated by the same laser; the first laser and the second laser are determined according to the first processing area and the second processing area, respectively, including: Based on the first processing area and the second processing area, the first laser is focused to the second laser using the same laser; wherein, the first spot formed by the first laser on the shielding film is a defocused spot, and the second spot formed by the second laser on the shielding film is a focused spot.

3. The method for opening windows in a circuit board according to claim 1, characterized in that, The first laser and the second laser are generated by the same laser, and a half-wave plate and a polarizer are also provided on one side of the laser; the first laser and the second laser are determined according to the first processing area and the second processing area, respectively, including: Based on the first processing area and the second processing area, the laser beam emitted by the laser is controlled to be incident on the polarizer through the half-wave plate, the polarization state of the laser beam is adjusted by the half-wave plate, and the laser beam is split into the first laser and the second laser by the polarizer.

4. The method for opening windows in a circuit board according to claim 1, characterized in that, The first laser is generated by a first laser, and the second laser is generated by a second laser; determining the first laser and the second laser based on the first processing area and the second processing area respectively includes: generating the first laser using the first laser based on the first processing area; A second laser is generated by the second laser according to the second processing area.

5. The method for opening windows in a circuit board according to claim 1, characterized in that, The removal of the shielding film from the first processing area by the first laser includes: The shielding film in the first processing area is removed by the first laser along the first path; The first path includes a first sub-path extending along a first direction; multiple first sub-paths are provided, and the multiple first sub-paths are arranged at intervals along a second direction; the emission direction of the first laser, the first direction, and the second direction are perpendicular to each other.

6. The method for opening windows in a circuit board according to claim 5, characterized in that, The first laser is a pulsed laser; removing the shielding film of the first processing area by the first laser along the first path includes: the first laser sequentially forming a plurality of first light spots on the shielding film along each of the first sub-paths; Along the first direction, the diameter x of the first light spot and the first distance a between the centers of two adjacent first light spots satisfy the condition: 0 < a < x / 2.

7. The method for opening windows in a circuit board according to claim 6, characterized in that, Along the second direction, the distance b between two adjacent first sub-paths satisfies the following relationship with the diameter x of the first light spot: 0 < b ≤ x / 2; the diameter x of the first light spot, the width k of the windowed pattern, and the number n of the first sub-paths satisfy the following relationship: x < k / (n+1).

8. The method for opening windows in a circuit board according to claim 5, characterized in that, The first path also includes a second sub-path, with one second sub-path provided between every two adjacent first sub-paths; Each of the first sub-paths and each of the second sub-paths forms a bow-shaped first path.

9. The method for opening windows in a circuit board according to claim 1, characterized in that, The removal of the shielding film from the second processing area by the second laser includes: The shielding film in the second processing area is removed by the second laser along the second path, wherein the emission direction of the second laser is perpendicular to the second path, and the second path is circular.

10. The method for opening windows in a circuit board according to claim 1, characterized in that, The radius of the second light spot is no greater than 0.02 mm; The radius of the first light spot is greater than 0.02 mm.

11. A method for opening windows in a circuit board, characterized in that, include: The shielding film is attached to the circuit layer of the circuit board; wherein the circuit board has multiple window patterns; According to the window patterns on the circuit board, a plurality of first processing areas and a plurality of second processing areas are set on the shielding film, wherein the plurality of first processing areas correspond one-to-one with the plurality of second processing areas, and each of the second processing areas is arranged around the periphery of the corresponding first processing area. Based on each of the first processing areas and each of the second processing areas, a plurality of first lasers and a plurality of second lasers are determined respectively; Multiple first lasers are configured to correspond one-to-one with multiple first processing areas, and the shielding film corresponding to the first processing area is removed by each first laser; Multiple second lasers are configured to correspond one-to-one with multiple second processing areas, and the shielding film of the corresponding second processing area is removed by each second laser; wherein, among the first light spot and the second light spot corresponding to the same window pattern, the diameter of the first light spot is larger than the diameter of the second light spot.

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