Shell and electronic equipment

Abstract

The invention relates to a shell and electronic equipment, relates to the technical field of electronic equipment, and is used for improving the reliability of the electronic equipment when the electronic equipment is impacted by external force and reducing the damage rate of the electronic equipment. The shell is applied to the electronic equipment. The shell comprises a frame and a middle frame. The frame comprises a gap, a first frame body and a second frame body, the middle frame comprises a middle frame main body and a reinforcing body which are connected with each other. The middle frame body is connected with the inner surface of the frame and fills the gap. At least part of the reinforcing body is located in the extending direction of the gap. The modulus of the middle frame body is smaller than that of the frame, and the modulus of the reinforcing body is larger than that of the middle frame body.

Description

Technical Field

[0001] This disclosure relates to the field of electronic device technology, and more particularly to a housing and an electronic device. Background Technology

[0002] Electronic devices are ubiquitous in people's daily work and life, allowing them to browse information, chat, shop, watch movies and TV shows, play games, and more. However, electronic devices can also be damaged by drops, bumps, and other external impacts during daily use.

[0003] Currently, electronic devices are subject to a high rate of damage from external impacts. Summary of the Invention

[0004] This application provides a housing and an electronic device to improve the reliability of the electronic device under external impact and reduce the damage rate of the electronic device.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] In a first aspect, a housing is provided. The housing is applied to an electronic device. The housing includes a frame and a middle frame. The frame includes a slot and first and second frame members located on either side of the slot. The middle frame includes a middle frame body and a reinforcing member connected to each other. The middle frame body is connected to the inner surface of the frame and fills the slot. At least a portion of the reinforcing member is located in the extension direction of the slot. The modulus of the middle frame body is less than the modulus of the frame, and the modulus of the reinforcing member is greater than the modulus of the middle frame body.

[0007] In this application, a reinforcing body with a higher modulus is provided around the location in the shell where the structural strength is lower than that of other locations to compensate for the structural strength of the local location in the shell where the structural strength is lower.

[0008] By placing at least a portion of the reinforcement along the extension direction of the gap in the frame, the modulus of the extended area of ​​the gap increases because the modulus of the reinforcement is greater than that of the metal frame. Thus, when the electronic device is impacted, the stress is no longer concentrated at the gap, but rather distributed more evenly across various parts of the frame, preventing the casing from breaking at the gap, improving the reliability of the electronic device under external impact, and reducing the damage rate of the electronic device.

[0009] In some feasible embodiments of the first aspect, in the direction of arrangement from the first frame to the second frame, the size of the reinforcing body is larger than the size of the gap.

[0010] Understandably, the width of the gap is smaller than the length of the reinforcement. This allows the reinforcement to cover the extended area of ​​the gap, ensuring it fully strengthens the modulus of that area. Consequently, when the electronic device is subjected to external impact, the stress is no longer concentrated at the gap, but rather distributed more evenly across the frame, preventing the casing from breaking at the gap, improving the reliability of the electronic device under impact, and reducing the damage rate.

[0011] In some feasible embodiments of the first aspect, the middle frame body has a receiving hole, and the reinforcing body is at least partially located within the receiving hole.

[0012] For example, the receiving hole is a blind hole, or it may also be called a groove. The depth direction of the groove is parallel to the thickness direction of the electronic device. At least a portion of the reinforcement is received within the groove. The shape of the groove can match the shape of the reinforcement. For example, a portion of the reinforcement is received within the groove, while another portion of the reinforcement is located outside the groove, protruding relative to the main body of the mid-frame. Yet another example, the entire reinforcement is received within the groove, with the surface of the reinforcement away from the bottom of the groove flush with the opening of the groove.

[0013] As another example, the receiving hole is a through hole. It can be understood that, in the thickness direction of the electronic device, the size of the through hole is equal to the size of the main body of the mid-frame. The reinforcement is received in the through hole, which is equivalent to the reinforcement penetrating the main body of the mid-frame along the thickness direction of the electronic device.

[0014] Since the reinforcement has thickness in the thickness direction of the electronic device, by creating a receiving hole in the main body of the mid-frame and accommodating at least part of the reinforcement within the hole, the increase in the reinforcement's dimension in the thickness direction of the electronic device can be minimized. Furthermore, by creating a groove in the main body of the mid-frame to accommodate the reinforcement, it is also easier to increase the reinforcement's dimension in the thickness direction of the electronic device, reducing the degree of deformation caused by external stress. This reduces the deformation at the location of the gap under stress, prevents the casing from breaking at the gap, improves the reliability of the electronic device under external impact, and reduces the damage rate of the electronic device.

[0015] In some feasible embodiments of the first aspect, the receiving hole is a blind hole, the receiving hole includes at least 6 hole walls, and the reinforcement is connected to at least 6 hole walls.

[0016] When the reinforcement is entirely housed within the receiving hole, the shape of the reinforcement can be the same as the shape of the receiving hole. For example, the receiving hole is a dovetail groove, and the reinforcement is dovetail-shaped. Another example is a T-shaped groove, and the reinforcement is T-shaped.

[0017] Understandably, the receiving hole may include at least six hole walls, and the reinforcement is in contact with each hole wall of the receiving hole. The hole walls may include sidewalls parallel to the thickness direction of the electronic device and bottom walls perpendicular to the thickness direction.

[0018] In this example, by designing the receiving hole to have a shape with multiple hole walls, the contact area between the reinforcement and the receiving hole can be increased, thereby improving the bonding strength between the reinforcement and the receiving hole.

[0019] In some feasible embodiments of the first aspect, the reinforcing body is a sheet-like structure and is disposed on the surface of the middle frame body.

[0020] The reinforcing element can be disposed on at least one surface of the mid-frame body in the thickness direction of the electronic device. For example, one reinforcing element can be disposed on one surface of the mid-frame body in the thickness direction of the electronic device. As another example, two reinforcing elements can be disposed on opposite surfaces of the mid-frame body in the thickness direction, respectively.

[0021] In this example, the reinforcement is a sheet-like structure, so the reinforcement has a small size in the thickness direction of the electronic device, which can reduce the increase in the size of the electronic device in the thickness direction.

[0022] In some feasible embodiments of the first aspect, the distance between the reinforcement and the gap is less than or equal to 2 cm in the direction of the gap's extension.

[0023] The distance between the reinforcement and the frame is less than or equal to 2 cm. For example, the distance between the reinforcement and the frame is 0.3 cm, 0.5 cm, 0.8 cm, 1 cm, 1.2 cm, 1.5 cm, 1.8 cm or 2 cm.

[0024] By placing the reinforcement close to the frame, the reinforcement can locally reinforce the gaps in the frame, reducing the deformation at the gaps when the frame is under stress. This avoids excessive bending and damage to the frame, improves the reliability of electronic devices under impact, and reduces the damage rate of electronic devices.

[0025] In some feasible embodiments of the first aspect, the reinforcing body includes at least one selected from epoxy resin, carbon fiber, glass fiber, ceramic, metal, and silicon dioxide. The metal may include steel, aluminum alloy, titanium alloy, magnesium alloy, etc., and is not limited thereto.

[0026] For example, the reinforcement may include carbon fiber. As another example, the reinforcement may include glass fiber and epoxy resin, with the epoxy resin coating the glass fiber.

[0027] The modulus of the aforementioned materials is greater than that of the frame body, and they are readily available, which can reduce the manufacturing difficulty of the casing and electronic devices.

[0028] In some feasible embodiments of the first aspect, the reinforcement comprises carbon fibers. The fiber direction of the carbon fibers is perpendicular to the extension direction of the gap.

[0029] When the reinforcement includes carbon fiber, the extension direction of the slot is perpendicular to the fiber direction of the carbon fiber. Due to the material properties of carbon fiber, it has a strong resistance to stress bending when subjected to stress intersecting the fiber direction. When an electronic device is impacted, the stress is transmitted along the extension direction of the slot. Therefore, in this example, by making the extension direction of the slot perpendicular to the fiber direction of the carbon fiber, the carbon fiber's ability to resist stress deformation can be utilized, minimizing the deformation of the carbon fiber and the slot, reducing the deformation of the slot extension area under stress, preventing the casing from breaking at the slot, improving the reliability of the electronic device under external impact, and reducing the damage rate of the electronic device.

[0030] In some feasible embodiments of the first aspect, the reinforcement comprises glass fiber. The fiber direction of the glass fiber is perpendicular to the extension direction of the gap.

[0031] When the reinforcement includes glass fiber, the direction of the gap is perpendicular to the fiber direction of the glass fiber. Similar to carbon fiber, glass fiber also has a strong resistance to bending under stress intersecting its fiber direction. Therefore, having the gap's extension direction perpendicular to the fiber direction of the glass fiber also allows the glass fiber to resist stress deformation, minimizing deformation of the glass fiber and the gap itself. This reduces the deformation in the gap extension area under stress, preventing the casing from breaking at the gap, improving the reliability of electronic devices under external impact, and reducing the damage rate of electronic devices.

[0032] In a second aspect, an electronic device is provided. The electronic device includes a housing, a screen, and a circuit board. The housing is as described in any of the first aspects. The edge of the screen is connected to the frame of the housing, and the middle frame of the housing is located on the non-display side of the screen. The circuit board is fixed to the housing. The circuit board includes a processor electrically connected to the screen. The processor provides image data to the screen to control the screen to display.

[0033] Since the electronic device of the second aspect includes the housing of the first aspect, the electronic device of the second aspect also possesses the beneficial effects of the housing of the first aspect.

[0034] In some feasible embodiments of the second aspect, the electronic device includes an antenna. A first or second frame within the housing serves as the radiator of the antenna.

[0035] For example, the frame can be a metal frame. In the case of an electronic device including an antenna, the gap separates the two frame sections, making the two frame sections insulated from each other and preventing signal transmission. In this way, the two power supplies of the antenna can be electrically connected to the two frame sections respectively, so that the two frame sections can act as two radiators of the electronic device's antenna, transmitting and receiving wireless signals. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the structure of a mobile phone casing;

[0037] Figure 2 This is a schematic diagram showing the shape of a phone case before and after it is subjected to an external impact.

[0038] Figure 3 A three-dimensional structural diagram of a mobile phone provided in some embodiments of this application;

[0039] Figure 4 An exploded view of an electronic device provided in some embodiments of this application;

[0040] Figure 5 A schematic diagram of a partial structure of the housing in an electronic device provided in some embodiments of this application, viewed from one perspective;

[0041] Figure 6 for Figure 5 A schematic diagram of a local structure from another perspective;

[0042] Figure 7 for Figure 5 A top view of a local structure. Detailed Implementation

[0043] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application are within the scope of protection of this application.

[0044] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0045] Furthermore, in this application, directional terms such as "upper," "lower," "left," and "right" may be defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms can be relative concepts, used for relative description and clarification, and may change accordingly depending on the orientation of the components in the accompanying drawings.

[0046] In describing some embodiments, the terms "connected," "linked," and their derivative expressions may be used. For example, the term "connected" may be used to indicate that two or more components are in direct or indirect physical contact with each other. For example, "A and B are connected" can mean that A and B are connected directly, or it can mean that A and B are connected through other components. Furthermore, the term "coupled" can refer to an electrical connection that enables signal transmission; coupling can indicate direct coupling or indirect coupling.

[0047] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0048] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0049] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0050] For ease of understanding, the technical terms used in this application will be explained and described below.

[0051] 1. Non-destructive micromachining technology (NMT): This is a process that combines metal and plastic using nanotechnology. NMT involves first nano-processing the metal surface, and then directly molding plastic onto the metal surface, thus obtaining a structure in which the metal and plastic are integrally formed.

[0052] Most structural components in electronic devices that are integrally molded from metal and plastic are manufactured using the NMT (Non-Metal-Plastic) process. Examples include the casings of electronic devices (mobile phones, tablets, laptops, etc.).

[0053] 2. Polybutylene terephthalate (PBT) plastic: It is a polyester made by polycondensation of terephthalic acid and 1,4-butanediol, and is one of the most widely used thermoplastic polyesters.

[0054] PBT plastics are widely used in the automotive, machinery, precision instrument components, electronics, and textile industries. For example, PBT plastics are commonly used in the housings of electronic devices.

[0055] 3. ABS (Acrylonitrile Butadiene Styrene) Plastic: A terpolymer of acrylonitrile (A), butadiene (B), and styrene (S). The relative amounts of these three monomers can be varied to create various resins. ABS plastic combines the properties of all three components: acrylonitrile provides chemical resistance, heat resistance, and high surface hardness; butadiene gives it high elasticity and toughness; and styrene provides the processing and molding characteristics of thermoplastics and excellent electrical properties. ABS plastic is widely used in automobiles, machinery, precision instrument components, electronics, and textiles. For example, the plastic materials used in the housings of electronic devices are typically ABS plastic.

[0056] 4. Modulus: This refers to the ratio between the stress value and the deformation of a material under stress, also known as the elastic modulus. Under the same stress, a higher modulus results in lower deformation due to stress, while a lower modulus results in higher deformation due to stress.

[0057] Figure 1 A schematic diagram of the mobile phone casing is shown; Figure 2 The diagram shows the shape of the phone case before and after it is subjected to an external impact.

[0058] like Figure 1 As shown, the mobile phone casing 00 includes a frame 01 and a middle frame 02. The frame 01 is arranged around the middle frame 02, and the edge of the middle frame 02 is connected to the frame 01.

[0059] Mobile phones typically have wireless communication capabilities, which require the phone to use its own antenna to receive and transmit wireless signals. To facilitate this wireless transmission and reception, the phone casing (00) has antenna slots. For example... Figure 1 As shown, Figure 1 The middle frame 01 has an antenna slot 03 to facilitate the antenna to transmit wireless signals to the outside world or receive wireless signals provided by the outside world.

[0060] However, because the frame 01 has an antenna slot 03, the structural strength at the location of the antenna slot 03 is lower than that at other locations on the frame 01. For example... Figure 2 As shown in (a), before the phone is dropped or impacted (collectively referred to as the phone being subjected to external force), the phone casing 00 is flat and intact. Under the circumstances of the phone being subjected to external force, as shown in (a), Figure 2 As shown in (b), the stress is concentrated at the location of the antenna slot 03, which causes the mobile phone casing 00 to deform and break at the location of the antenna slot 03, thus damaging the mobile phone. This results in low reliability and a high damage rate of the mobile phone when subjected to external impact.

[0061] Based on this, embodiments of this application provide a housing and an electronic device. By providing reinforcing elements with higher modulus around locations in the housing where the structural strength is lower than other locations, the embodiments of this application compensate for the structural strength of these localized areas of lower structural strength. This prevents the housing from breaking at these low-strength locations when the electronic device is subjected to external impact, thereby improving the reliability of the electronic device under impact and reducing its damage rate.

[0062] The electronic devices provided in the embodiments of this application may include, but are not limited to, mobile phones, tablets, laptops, handheld computers, netbooks, personal digital assistants (PDAs), wearable electronic devices (smartwatches, smart bracelets, smart rings, etc.), virtual reality devices, etc., and the embodiments of this application are not limited thereto. The following description uses a mobile phone as an example, but it is not limited to mobile phones.

[0063] Please see Figure 3 , Figure 3 This is a three-dimensional structural diagram of a mobile phone provided in some embodiments of this application. As can be seen from the above, in this embodiment, the mobile phone 100 can have an approximately rectangular plate-like structure.

[0064] For ease of description below, an XYZ coordinate system is established, defining the width direction of mobile phone 100 as the X-axis, the length direction of mobile phone 100 as the Y-axis, and the thickness direction of mobile phone 100 as the Z-axis. It is understandable that... Figure 3 The images only schematically illustrate some of the components included in the mobile phone 100; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 Restrictions.

[0065] Please see Figure 4 , Figure 4This is an exploded view of an electronic device provided in some embodiments of this application. The mobile phone 100 may include a screen 10, a housing 20, and a camera module 30.

[0066] Screen 10 can be used to display images, videos, etc. Screen 10 may include a light-transmitting cover 11 and a display screen 12. The light-transmitting cover 11 and the display screen 12 are stacked. The light-transmitting cover 11 is mainly used to protect the display screen 12 and prevent dust. The material of the light-transmitting cover 11 includes, but is not limited to, glass. The display screen 12 may be a flexible display screen or a rigid display screen.

[0067] The housing 20 can be used to protect the internal electronic components of the electronic device 100. The housing 20 can be located on the side of the display screen 12 away from the light-transmitting cover 11. The housing 20 and the screen 10 can together form a storage space.

[0068] The housing 20 may include a frame 21, a cover 22, and a middle frame 23. The frame 21 may be located between the cover 22 and the light-transmitting cover 11, and the frame 21 may be fixedly connected to the edge of the cover 22. For example, the frame 21 may be fixedly connected to the cover 22 by adhesive, and the light-transmitting cover 11 may be fixedly attached to the frame 31 by adhesive.

[0069] The middle frame 23 can be connected to the inner surface of the frame 31 to achieve the installation and fixation of the middle frame 23. Exemplarily, the middle frame 23 and the frame 21 can be made of metal, and the middle frame 23 can be fixed to the frame 21 by welding. The middle frame 23 can also be integrally formed with the frame 21. The middle frame 23 serves as the structural "skeleton" of the electronic device 100. Again, exemplarily, the middle frame 23 can be made of PBT plastic or ABS plastic, and the frame 21 can be made of metal. Taking the middle frame 23 as an example of being made of PBT plastic, the middle frame 23 and the frame 21 can be integrally formed with metal and PBT through NMT (non-metallic metallurgical process).

[0070] The camera module 30 can be used to take photos / videos. The camera module 30 can be fixedly connected to the mid-frame 23 by means of threaded connection, snap-fit, welding, etc. In this embodiment, the camera module 30 can be a front-facing camera in a mobile phone.

[0071] Additionally, the mobile phone 100 may also include a circuit board 40. For example... Figure 4 As shown, the circuit board 40 can be fixed to the middle frame 23. Multiple electronic devices can be mounted on the circuit board 40, such as a system-on-a-chip (SOC), memory, and a graphics processing unit (GPU).

[0072] Taking circuit board 40 including GPU 41 as an example, GPU 41 can be electrically connected to display screen 12 via a flexible printed circuit board (FPC, not shown in the figure). GPU 41 provides image data to display screen 12, and display screen 12 displays the image corresponding to the image data after parsing the image data.

[0073] The structure of the housing 20 is described in detail below.

[0074] like Figure 4 As shown, the border 21 may include a first frame segment 21a, a second frame segment 21b, a third frame segment 21c, and a fourth frame segment 21d connected end to end. The first frame segment 21a and the third frame segment 21c are parallel to each other; for example, the extension directions of the first frame segment 21a and the third frame segment 21c are parallel to the X-axis direction. The second frame segment 21b and the fourth frame segment 21d are parallel to each other; for example, the extension directions of the second frame segment 21b and the fourth frame segment 21d are parallel to the Y-axis direction.

[0075] Figure 5 This illustration shows a schematic diagram of a partial structure of the housing in an electronic device provided in some embodiments of this application from one perspective; Figure 6 It shows Figure 5 A schematic diagram of a local structure from another perspective; Figure 7 It shows Figure 5 A top view of a local structure.

[0076] like Figure 5 and Figure 6 As shown, the border 21 may include one or more gaps 211. Exemplarily, each frame segment may include one gap 211; and exemplarily, a frame segment (e.g., the fourth frame segment 21d) may include multiple gaps 211.

[0077] In some examples, the extension direction of the gap 211 can be perpendicular to the extension direction of the border 21 at the location of the gap 211. For example, if the gap 211 is located on the first frame segment 21a and the extension direction of the first frame segment 21a is parallel to the X-axis, the extension direction of the gap 211 can be parallel to the Y-axis. As another example, if the gap 211 is located on the fourth frame segment 21d and the extension direction of the fourth frame segment 21d is parallel to the Y-axis, the extension direction of the gap 211 can be parallel to the X-axis.

[0078] In other examples, the angle between the extending direction of the gap 211 and the extending direction of the border 21 at the location of the gap 211 may not be equal to 90°. For example, the angle between the extending direction of the gap 211 and the extending direction of the border 21 at the location of the gap 211 may be 80°. The embodiments of this application do not limit the angle between the extending direction of the gap 211 and the extending direction of the border 21 at the location of the gap 211.

[0079] Different gaps 211 are distributed at intervals with each other. Understandably, two adjacent gaps 211 are separated by a section of the frame in the border 21, and a gap 211 separates two sections of the frame in the border 21.

[0080] For example, the frame 21 can be a metal frame. The mobile phone 100 may also include an antenna (not shown). The gap 211 separates the two frame sections, making the two frame sections insulated from each other and preventing signal transmission. In this way, the two power supplies of the antenna can be electrically connected to the two frame sections respectively, so that the two frame sections can act as two radiators of the mobile phone antenna to transmit and receive wireless signals.

[0081] For example, a power supply feeds a radiator, causing the radiator to excite a half-wavelength radiation mode. In this way, the radiator excites the mid-frequency and high-frequency radiation bands of long-term evolution (LTE) communication technology.

[0082] The frame located on one side of the gap 211 in the frame 21 is the first frame 212, and the frame located on the other side of the gap 211 in the frame 21 is the second frame 213. The first frame 212 can be a straight structure. For example, the first frame segment 21a includes two gaps 211, and the first frame 212 is located between the two gaps 211 and is a straight structure. The first frame 212 can also be a corner structure, such as an L-shaped structure. For example, as... Figure 5 and Figure 6 As shown, the first frame segment 21a includes a gap 211, the fourth frame segment 21d includes a gap 211, the first frame 212 is located between the two gaps 211, and the first frame 212 is a corner structure.

[0083] Similarly, the second frame 213 can be a straight structure, or it can be a corner structure, such as an L-shaped structure. Refer to the description of the first frame 212 for further details; it will not be repeated here.

[0084] The following explanation focuses on a gap 211 in the fourth frame segment 21d, with the first frame 212 and the second frame 213 on either side of the gap 211.

[0085] The middle frame 23 may include a middle frame body 231. The middle frame body 231 may be connected to the inner surface of the frame 21. Furthermore, the middle frame body 231 may fill the gap 211, thereby ensuring that the first frame 212 and the second frame 213 are insulated from each other. Exemplarily, the middle frame body 231 may include PBT plastic or ABS plastic, and the middle frame body 231 and the metal frame 21 are formed into an integral structure by NMT.

[0086] like Figure 5 and Figure 6 As shown, the main body 231 of the middle frame may include a middle plate 2311, a surrounding body 2312, and a filler body 2313. The surrounding body 2312 may surround the middle plate 2311 and is connected to the inner surface of the frame 21. The filler body 2313 extends from the surrounding body 2312 to the side away from the middle plate 2311, and the filler body 2313 may be located within the gap 211 of the frame 21.

[0087] In the Z-axis direction, the size of the middle plate 2311 is smaller than the size of the enclosure 2312. Therefore, the connection between the middle plate 2311 and the enclosure 2312 will form a central recessed receiving groove, in which the circuit board 40, speaker, camera, battery and other components in the mobile phone 100 can be placed.

[0088] In some examples, the middle plate 2311 may include a metal plate, and the enclosure 2312 and filler 2313 may be PBT plastic parts or ABS plastic parts. The middle plate 2311, enclosure 2312, and filler 2313 can be formed into a single molded structure by NMT (non-metallic metallization). The modulus of both the PBT and ABS plastic parts is less than that of the metal material.

[0089] like Figure 5 and Figure 6 As shown, the middle frame 23 may also include a reinforcing body 232. The modulus of the reinforcing body 232 is greater than the modulus of the middle frame body 231. When the middle frame body 231 is made of PBT plastic, the fact that the modulus of the reinforcing body 232 is greater than the modulus of the middle frame body 231 can mean that the modulus of the reinforcing body 232 is greater than the modulus of the PBT plastic. When the middle frame body 231 is made of multiple materials (e.g., metal, PBT plastic, etc.), the fact that the modulus of the reinforcing body 232 is greater than the modulus of the middle frame body 231 can mean that the average modulus of the middle frame body 231 is greater than the modulus of the middle frame body 231.

[0090] For example, the reinforcement 232 may include at least one of epoxy resin adhesive (e.g., two-component epoxy resin adhesive), carbon fiber, fiberglass, ceramic, metal, and silica. The metal may include steel, aluminum alloy, titanium alloy, magnesium alloy, etc., and is not limited thereto. Table 1 below shows the modulus information of various materials. It can be seen that the elastic modulus of ABS plastic and PBT plastic is lower than that of the other materials.

[0091]

[0092] Table 1

[0093] For example, the reinforcement 232 may include carbon fiber. Also for example, the reinforcement 232 may include glass fiber and epoxy resin, with the epoxy resin coating the glass fiber.

[0094] like Figure 5 and Figure 6 As shown, the reinforcing member 232 is connected to the surrounding member 2312. Since the surrounding member 2312 is a component directly connected to the inner surface of the frame 21, when the reinforcing member 232 is connected to the surrounding member 2312, the distance between the reinforcing member 232 and the frame 21 is relatively close. For example, as... Figure 5 and Figure 6 As shown, the distance between the reinforcing body 232 and the frame 21 in the X-axis direction is less than or equal to 2 cm. For example, the distance between the reinforcing body 232 and the frame 21 in the X-axis direction is 0.3 cm, 0.5 cm, 0.8 cm, 1 cm, 1.2 cm, 1.5 cm, 1.8 cm or 2 cm.

[0095] By placing the reinforcing body 232 close to the frame 21, the reinforcing body 232 can locally reinforce the location of the gap 211 in the frame 21. When the frame 21 is under stress, the deformation at the location of the gap 211 in the frame 21 is reduced, avoiding the problem of excessive bending and damage to the frame 21. This improves the reliability of the mobile phone 100 under external impact and reduces the damage rate of the mobile phone 100.

[0096] In some examples, the enclosure 2312 may have a receiving hole. At least a portion of the reinforcement 232 is received within the receiving hole.

[0097] Exemplarily, the receiving hole is a blind hole, or it may also be referred to as a groove. The depth direction of the groove is parallel to the Z-axis direction. At least a portion of the reinforcing body 232 is received within the groove. The shape of the groove may match the shape of the reinforcing body 232. Exemplarily, a portion of the reinforcing body 232 is received within the groove, while another portion of the reinforcing body 232 is located outside the groove, protruding relative to the surrounding body 2312. Also exemplaryly, the entire reinforcing body 232 is received within the groove, with the surface of the reinforcing body 232 on the side away from the bottom of the groove flush with the opening of the groove.

[0098] For example, if the receiving hole is a blind hole, the reinforcing body 232 can be a two-component epoxy resin filling the blind hole. As another example, if the receiving hole is a blind hole, the reinforcing body 232 includes carbon fibers placed within the blind hole and a two-component epoxy resin injected into the blind hole to encapsulate the carbon fibers. It should be noted that the aforementioned two-component epoxy resin is a structure cured within the receiving hole, and is not a liquid colloid.

[0099] As another example, the receiving hole is a through hole, and it can be understood that the size of the through hole is equal to the size of the enclosure 2312 in the Z-axis direction. The reinforcement 232 is received in the through hole, which is equivalent to the reinforcement 232 penetrating the enclosure 2312 in the Z-axis direction.

[0100] Since the reinforcing member 232 has thickness in the Z-axis direction, by opening a receiving hole in the enclosure 2312 and accommodating at least a portion of the reinforcing member 232 within the receiving hole, the increase in the size of the mobile phone 100 in the Z-axis direction due to the reinforcing member 232 can be minimized. Furthermore, by opening a groove in the enclosure 2312 to accommodate the reinforcing member 232, it is also easier to increase the size of the reinforcing member 232 in the Z-axis direction, reducing the degree of deformation of the reinforcing member 232 due to external stress. This reduces the deformation at the location of the gap 211 under stress, prevents the housing 20 from breaking at the gap 211, improves the reliability of the mobile phone 100 under external impact, and reduces the damage rate of the mobile phone 100.

[0101] In other examples, the reinforcement 232 may be a sheet-like structure. In the Z-axis direction, the reinforcement 232 may be disposed on at least one surface of the enclosure 2312. Exemplarily, one reinforcement 232 may be disposed on one surface of the enclosure 2312 in the Z-axis direction. Also exemplaryly, two reinforcements 232 may be disposed on opposite surfaces of the enclosure 2312 in the Z-axis direction.

[0102] In this example, the reinforcing body 232 is a sheet-like structure, so the size of the reinforcing body 232 in the Z-axis direction is small, which can reduce the increase in the size of the mobile phone 100 in the Z-axis direction.

[0103] Since the modulus of the PBT material in the gap 211 is less than that of the metal frame 21, when the mobile phone 100 is subjected to an external impact, the stress will be concentrated at the location of the gap 211, which can easily cause the casing 20 to break at the gap 211, resulting in damage to the mobile phone 100 and rendering it unusable.

[0104] Therefore, as Figure 7 As shown, at least a portion of the reinforcing member 232 is located in the extending direction of the gap 211 on the frame 21, wherein, Figure 7 The two thick dashed lines in the middle are two extension lines of the edge of gap 211, and the area between the two thick dashed lines is the extension region of gap 211. This extension region is the one described above. Figure 2 The area where the housing 20 would fracture is shown in (b). In this example, by placing at least a portion of the reinforcement 232 along the extension direction of the gap 211 on the frame 21, the modulus of the extension region of the gap 211 increases because the modulus of the reinforcement 232 is greater than that of the metal frame 21. Thus, when the phone 100 is impacted, the stress is no longer concentrated at the location of the gap 211, but is distributed more evenly across various parts of the frame 21, preventing the housing 20 from fractureing at the gap 211, improving the reliability of the phone 100 under external impact, and reducing the damage rate of the phone 100.

[0105] The shape of the reinforcing body 232 can be rectangular, cylindrical, elliptical, etc., and is not limited here. The length direction of the reinforcing body 232 can be parallel to the direction from the first frame 212 to the second frame 213; in other words, the length direction of the reinforcing body 232 can be perpendicular to the extension direction of the gap 211. For example, when the gap 211 is located in the fourth frame segment 21d, the extension direction of the gap 211 is parallel to the X-axis direction, and the length direction of the reinforcing body 232 is parallel to the Y-axis direction.

[0106] In some examples, where the reinforcement 232 is entirely accommodated within the receiving hole, the shape of the reinforcement 232 may be the same as the shape of the receiving hole. For example, the receiving hole is a dovetail groove, and the reinforcement 232 is dovetail-shaped. Another example is a T-shaped recess, and the reinforcement 232 is T-shaped.

[0107] Understandably, the receiving hole may include at least six hole walls, and the reinforcing body 232 is in contact with each hole wall of the receiving hole. The hole walls may include hole sidewalls parallel to the Z-axis direction and hole bottom walls perpendicular to the Z-axis direction.

[0108] In this example, by designing the receiving hole to have a shape with multiple hole walls, the contact area between the reinforcing body 232 and the receiving hole can be increased, thereby improving the bonding strength between the reinforcing body 232 and the receiving hole.

[0109] In the Y-axis direction, the distance between the first frame 212 and the second frame 213 is less than the length of the reinforcing member 232. Understandably, the width of the gap 211 is less than the length of the reinforcing member 232. This allows the reinforcing member 232 to cover the extended area of ​​the gap 211, ensuring that it can comprehensively reinforce the modulus of the extended area of ​​the gap 211. Thus, when the phone 100 is subjected to an external impact, the stress is no longer concentrated at the location of the gap 211, but is instead distributed more evenly across various parts of the frame 21, preventing the casing 20 from breaking at the gap 211, improving the reliability of the phone 100 under external impact, and reducing the damage rate of the phone 100.

[0110] In some examples, where the reinforcement 232 includes carbon fiber, the extension direction of the slot 211 is perpendicular to the fiber direction of the carbon fiber. Due to the material properties of carbon fiber, it has a strong ability to resist stress bending when subjected to stress intersecting the fiber direction. When the mobile phone 100 is impacted, the stress is transmitted along the extension direction of the slot 211. Therefore, in this example, by making the extension direction of the slot 211 perpendicular to the fiber direction of the carbon fiber, the carbon fiber can resist stress deformation, minimizing the deformation of the carbon fiber and the slot 211, reducing the deformation of the slot 211 extension area under stress, preventing the casing 20 from breaking at the slot 211, improving the reliability of the mobile phone 100 under external impact, and reducing the damage rate of the mobile phone 100.

[0111] In some other examples, where the reinforcement 232 includes glass fibers, the extension direction of the slot 211 is perpendicular to the fiber direction of the glass fibers. Similar to carbon fibers, glass fibers also have a strong ability to resist stress bending when subjected to stresses intersecting their fiber direction. Therefore, the extension direction of the slot 211 being perpendicular to the fiber direction of the glass fibers also allows the glass fibers to resist stress deformation, minimizing deformation of the glass fibers and the slot 211, reducing the deformation of the slot 211 extension area under stress, preventing the casing 20 from breaking at the slot 211, improving the reliability of the mobile phone 100 under external impact, and reducing the damage rate of the mobile phone 100.

[0112] It should be noted that the above example only illustrates the reinforcement of the gap 211 in the fourth frame segment 21d using the reinforcement 232. The gaps in other parts of the frame 21 are no different from the gap 211 in the fourth frame segment 21d. Therefore, the structures such as the receiving hole and the reinforcement 232 mentioned in the example can also be applied to the gaps in other parts of the frame 21 to reinforce the modulus of local parts of the frame 21, improve the reliability of the mobile phone 100 under external impact, and extend the service life of the mobile phone 100.

[0113] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A housing, characterized in that, The housing is used in an electronic device; the housing includes: The frame includes a gap, and a first frame and a second frame located on both sides of the gap; The middle frame includes a middle frame body and a reinforcing body that are connected to each other; the middle frame body is connected to the inner surface of the side frame and fills the gap, and at least a portion of the reinforcing body is located in the extension direction of the gap; the modulus of the middle frame body is less than the modulus of the side frame, and the modulus of the reinforcing body is greater than the modulus of the middle frame body.

2. The housing according to claim 1, characterized in that, In the direction from the first frame to the second frame, the size of the reinforcing body is larger than the size of the gap.

3. The housing according to claim 1 or 2, characterized in that, The main body of the middle frame has a receiving hole, and the reinforcing body is at least partially located in the receiving hole.

4. The housing according to claim 3, characterized in that, The receiving hole is a blind hole, and the receiving hole includes at least 6 hole walls, and the reinforcing body is connected to all 6 hole walls.

5. The housing according to claim 1 or 2, characterized in that, The reinforcing element is a sheet-like structure and is disposed on the surface of the main body of the middle frame.

6. The housing according to any one of claims 1-5, characterized in that, In the direction of extension of the gap, the distance between the reinforcement and the gap is less than or equal to 2 cm.

7. The housing according to any one of claims 1-6, characterized in that, The reinforcing material includes at least one of epoxy resin, carbon fiber, glass fiber, ceramic, metal, and silicon dioxide.

8. The housing according to any one of claims 1-7, characterized in that, The reinforcing body comprises carbon fibers; the fiber direction of the carbon fibers is perpendicular to the extension direction of the gap; and / or, The reinforcing element comprises glass fiber; the fiber direction of the glass fiber is perpendicular to the extension direction of the gap.

9. An electronic device, characterized in that, include: The housing, as described in any one of claims 1-8; The screen has its edge connected to the frame of the housing, and the middle frame of the housing is located on the non-display side of the screen; A circuit board is fixed to the housing; the circuit board includes a processor, which is electrically connected to the screen. The processor provides image data to the screen to control the screen to display images.

10. The electronic device according to claim 9, characterized in that, The electronic device includes an antenna; The first frame or the second frame in the housing serves as the radiator of the antenna.

Images