Thermal management for electrical components

Abstract

A communication system (10) includes a first electrical component (100) having a board connector (130) mounted to a main circuit board (110) and a heat transfer assembly (170) having a heat bridge (200) mounted to a heat transfer element (172). The communication system includes a second electrical component (500) received in a component space (180) between the main circuit board and the heat transfer assembly and thermally and electrically coupled with the first electrical component. The second electrical component includes a receptacle connector (560) mounted to the circuit card (616), the receptacle connector configured to be electrically connected to the pluggable module (610). The circuit card is electrically connected to the board connector. A socket cage (510) of the second electrical component includes a module channel (516) that receives the socket connector and the pluggable module. The receptacle cage includes a thermal opening (580) open at the upper wall (530) and the rear wall that receives the thermal bridge to allow the thermal bridge to interface with the pluggable module in the module channel.

Description

Technical Field

[0001] The main topic of this article concerns thermal management for electrical components. Background Technology

[0002] It may be desirable to transfer heat energy (or heat) away from designated components of a system or device. Some systems use electrical components (such as electrical connectors) to transfer data and / or power to and from different systems or devices. Some systems use electrical components, such as pluggable modules for transmitting data signals in the form of optical and / or electrical signals over communication cables. Some systems use electrical components, such as integrated circuits, to control the system. Electrical components define heat generation sources within the system.

[0003] A common challenge for electrical system developers is thermal management. Heat generated by electrical components within a system can degrade performance or even damage system components. To dissipate this heat, systems include thermal components, such as heat sinks, which engage with heat sources, absorb heat from them, and transfer the heat away. For example, thermal components are typically mounted to an EMI cage and extend into the internal chamber of the EMI cage to interface with pluggable I / O modules when they are inserted into the EMI cage. Heat dissipation from such systems can be limited, and some known electrical systems include cold plates to dissipate heat from heat-generating components. Interface a cold plate with heat-generating components (e.g., pluggable I / O modules) can be challenging.

[0004] There is a need for a thermal management system that can effectively transfer heat away from electrical components. Summary of the Invention

[0005] According to the present invention, a communication system is provided, the communication system including a first electrical component, the first electrical component including a main circuit board having a first surface and a board connector mounted to the first surface. The first electrical component includes a heat transfer assembly including a heat transfer element. The heat transfer element includes a hot surface spaced apart from the first surface, thereby forming a component space between the first surface and the hot surface. The heat transfer assembly includes a thermal bridge in the component space, the thermal bridge including a first thermal interface thermally connected to the hot surface and a second thermal interface opposite to the first hot surface. The communication system includes a second electrical component received in the component space and thermally and electrically connected to the first electrical component. The second electrical component includes a circuit card having a first surface and a receptacle connector mounted to the first surface. The receptacle connector is configured to be electrically connected to a pluggable module. The circuit card is electrically connected to the board connector. The second electrical component includes a receptacle cage coupled to the circuit card. The receptacle cage includes cage walls, the cage walls including an upper wall, a lower wall, a first side wall, a second side wall, and a rear wall. The receptacle cage includes a module channel between the upper and lower walls, between the first and second side walls, and between the front and rear walls. The module channel receives a receptacle connector at the rear of the receptacle cage. The module channel is configured to receive a pluggable module through a port at the front of the receptacle cage. The receptacle cage includes open thermal openings at the upper and rear walls. These thermal openings receive thermal bridges of heat transfer components to allow the thermal bridges to abut against the pluggable module in the module channel. Attached Figure Description

[0006] Figure 1 This is a front perspective view of a communication system formed according to an exemplary embodiment.

[0007] Figure 2 This is a perspective view of a first electrical component according to an exemplary embodiment.

[0008] Figure 3 This is a perspective view of a thermal bridge according to an exemplary embodiment.

[0009] Figure 4 This is a cross-sectional view of a thermal bridge according to an exemplary embodiment.

[0010] Figure 5 This is a cross-sectional view of a thermal bridge according to an exemplary embodiment.

[0011] Figure 6 This is a perspective view of a second electrical component according to an exemplary embodiment.

[0012] Figure 7 This is a perspective view of a portion of a second electrical component according to an exemplary embodiment.

[0013] Figure 8This is a perspective view of a communication system according to an exemplary embodiment, showing a second electrical component that mates with a first electrical component portion. Detailed Implementation

[0014] Figure 1 This is a front perspective view of a communication system 10 formed according to an exemplary embodiment. The communication system 10 includes a heat dissipation component for thermal management of components of the communication system 10. The communication system includes a first electrical component 100 and a second electrical component 500 coupled to the first electrical component 100. In an exemplary embodiment, a thermal management system is incorporated into the first electrical component 100 and configured to dissipate heat from the second electrical component 500 when cooperating with the second electrical component 500.

[0015] In an exemplary embodiment, the second electrical component 500 includes a pluggable module 600 that can be plugged into (and removed from) the second electrical component 500. The pluggable module 600 may be an I / O module, such as a transceiver module. Other types of electrical components may be provided in alternative embodiments. In an exemplary embodiment, when the pluggable module 600 is plugged into the second electrical component 500, a thermal management system is used to dissipate heat from the pluggable module 600.

[0016] In an exemplary embodiment, the second electrical component 500 is a pluggable component configured to be inserted into the first electrical component 100. The second electrical component 500 is configured to be electrically connected to the first electrical component 100. The second electrical component 500 is configured to be thermally connected to the first electrical component 100. In an exemplary embodiment, the second electrical component 500 is a network interface card.

[0017] In an exemplary embodiment, the pluggable module 600 has a pluggable body 610, which may be defined by one or more housings. The pluggable body 610 may be thermally conductive and / or electrically conductive to provide EMI shielding for the pluggable module 600. The pluggable body 610 includes a mating end 612 and a cable end 614 opposite to the mating end 612. The mating end 612 is configured to be inserted into a second electrical component 500, such as into a socket or port of the second electrical component 500. A cable extends from the cable end 614, such as extending into another component within the system.

[0018] The pluggable module 600 includes a connector interface configured for electrical connection to a second electrical component 500 (such as an electrical connection to its receptacle connector). In an exemplary embodiment, the connector interface includes a module circuit card 616 having a card edge configured to be inserted into a slot in the receptacle connector of the second electrical component 500. The module circuit card 616 is retrievable at a mating end 612. The module circuit card 616 has mating edges and mating contacts (e.g., circuitry, pads, traces, etc.) at the mating edges, configured to mate with the receptacle connector. The module circuit card 616 may include components, circuitry, etc., for operating and / or using the pluggable module 600. For example, the module circuit card 616 may have conductors, traces, pads, electronics, drivers, sensors, controllers, switches, inputs, outputs, etc., associated with the pluggable module 600, which can be mounted to the module circuit card 616 to form various circuits. Heat generated by the components of the pluggable module 600 can be dissipated by a thermal management system. In various embodiments, the pluggable module 600 may be an optical fiber module. The pluggable module 600 may include optical fiber cables and / or an optical generator to transmit optical signals.

[0019] The pluggable module 600 includes an outer periphery defining the exterior of the pluggable body 610. For example, the outer periphery may be defined by a top 620, a bottom 622, a first side 624, and a second side 626. In alternative embodiments, the pluggable body 610 may have other shapes. The top 620 may be planar and define a thermal interface for the pluggable module 600, for example, to mate with a heat dissipation element of the first electrical component 100.

[0020] In an exemplary embodiment, the pluggable body 610 provides heat transfer to the module circuit card 616, for example, to electronic components on the module circuit card 616. For example, the module circuit card 616 is in thermal communication with the pluggable body 610, and the pluggable body 610 transfers heat from heat-generating components.

[0021] For further reference Figure 2 , Figure 2 This is a perspective view of a first electrical component 100 according to an exemplary embodiment, the first electrical component 100 including a main circuit board 110 and a board connector 130 mounted to the main circuit board 110. Figure 1 The first electrical component 100 includes a guide assembly 150 positioned relative to the board connector 130 to guide mating with the second electrical component 500. The first electrical component 100 includes a heat transfer assembly 170 to dissipate heat from the second electrical component 500 (e.g., from the pluggable module 600) when the second electrical component 500 mates with the first electrical component 100.

[0022] The main circuit board 110 includes an upper surface 112 and a lower surface 114. The main circuit board 110 includes one or more circuits (e.g., traces, pads, vias, etc.) on one or more layers of the main circuit board 110. The main circuit board 110 includes a mating region 116 configured to mate with a second electrical component 500. For example, the mating region 116 may be located on the upper surface 112, such as near an edge 118 of the main circuit board 110. The mating region 116 may be defined by the footprint of a board connector 130 and / or a guide assembly 150 and / or a heat transfer assembly 170. The main circuit board 110 may host other electrical components, such as processors, IC components, memory components, or other types of electrical components.

[0023] Board connector 130 is electrically connected to main circuit board 110. For example, board connector 130 may be mounted to the upper surface 112 of main circuit board 110. Board connector 130 may be soldered to circuitry of main circuit board 110. In an exemplary embodiment, board connector 130 includes board connector housing 132 that holds board connector contacts 134. Board connector contacts 134 are configured to be electrically connected to corresponding circuitry (e.g., pads of main circuit board 110). In an exemplary embodiment, board connector housing 132 is a card edge connector having a slot 136 at the front of board connector housing 132. Slot 136 is configured to receive the edge of a circuit card of second electrical component 500 in a loading direction, which may be parallel to the upper surface 112 of main circuit board 110. Other types of electrical connectors may be used in alternative embodiments.

[0024] A guide assembly 150 is used to guide the mating of the second electrical component 500 with the first electrical component 100. In an exemplary embodiment, the guide assembly 150 includes one or more guide rails 152 mounted to the main circuit board 110. Each guide rail 152 includes a guide rail 154. The guide rail 154 is configured to receive a portion of the second electrical component 500. For example, the guide rail 154 may receive a circuit card of the second electrical component 500 to guide the circuit card to mate with the board connector 130. In the illustrated embodiment, the guide rail 154 extends parallel to the upper surface 112 of the main circuit board 110. In an exemplary embodiment, the guide rail 152 is configured to horizontally position the second electrical component 500 and / or vertically position the second electrical component 500, for example, for mating with the board connector 130. The guide rail 152 may align the circuit card of the second electrical component 500 with a slot 136. The guide rail 152 may orient the circuit card parallel to the main circuit board 110. In alternative embodiments, other types of guiding features may be used to guide the engagement of the second electrical component 500 with the first electrical component 100.

[0025] The heat transfer assembly 170 is used to dissipate heat from the second electrical component 500. In an exemplary embodiment, the heat transfer assembly 170 includes a heat transfer element 172. The heat transfer element 172 may be a conductive cooling device. In the illustrated embodiment, the heat transfer element 172 is a cold plate. For example, the heat transfer element 172 includes a metal block 174 serving as a heat exchanger. In an exemplary embodiment, the metal block 174 may include a series of loops, channels, or pipes extending through the metal block 174 to allow cooling liquid to flow through the metal block 174. The metal block 174 may be an aluminum block, a copper block, or another metallic material. In alternative embodiments, other types of heat transfer elements, such as heat sinks having cooling fins for convective airflow cooling on the surface of the heat sink, may be used. The heat transfer element 172 includes a hot surface 176 configured to abut against the second electrical component 500 or an intermediate heat transfer element.

[0026] In an exemplary embodiment, thermal bridge 200 ( Figure 2 A thermal bridge 200 is configured to be positioned between the thermal surface 176 and the second electrical component 500 to form a thermal interface between the heat transfer element 172 and the second electrical component 500. The thermal bridge 200 includes a first thermal interface (or upper thermal interface) thermally coupled to the thermal surface 176 and a second thermal interface (or lower thermal interface) opposite the first thermal surface, the second thermal interface being configured to abut against the second electrical component 500. In an exemplary embodiment, the thermal bridge 200 may be mounted to the heat transfer element 172, for example, by fastening, clamping, latching, soldering, or otherwise securing it to the heat transfer element 172. The heat transfer element 172, for example, positions the thermal bridge 200 relative to the main circuit board 110 and / or board connector 130 to mate with the second electrical component 500. For example, the thermal bridge 200 may be suspended from the bottom surface of the heat transfer element 172 to abut against the top surface of the second electrical component 500 when the second electrical component 500 is inserted into the space between the heat transfer element 172 and the main circuit board 110.

[0027] The heat transfer element 172 is spaced apart from the upper surface 112 of the main circuit board 110. For example, a component space 180 is defined between the upper surface 112 and the hot surface 176. The component space 180 is configured to receive a second electrical component 500. A thermal bridge 200 is located in the component space 180 to abut against the second electrical component 500. In an exemplary embodiment, one or more support elements 182 are used to support the heat transfer element 172 relative to the main circuit board 110. For example, the support element 182 may include one or more support posts 184 extending between the heat transfer elements 172 in the upper surface 112 of the main circuit board 110. The height of the support posts 184 defines the height of the component space 180. The support posts 184 allow airflow through the component space 180. The support elements 182 support the heat transfer element 172 above the component space 180 to position the thermal bridge 200 relative to the main circuit board 110 and / or board connector 130 so that the thermal bridge 200 abuts against the second electrical component 500.

[0028] Thermal bridge 200 is configured to thermally connect to heat transfer element 172 at its upper thermal interface 190 at its top (e.g., directly to hot surface 176 or via a layer of thermally conductive grease or other thermal interface material). Thermal bridge 200 is configured to thermally connect to second electrical component 500 at its lower thermal interface 192 at its bottom. Thermal bridge 200 dissipates heat from second electrical component 500 (e.g., from pluggable module 600) when thermally connected to second electrical component 500. Heat transfer element 172 dissipates heat from thermal bridge 200. Thermal bridge 200 thermally connects second electrical component 500 and heat transfer element 172 to transfer heat away from second electrical component 500.

[0029] In an exemplary embodiment, the thermal bridge 200 may be compressible between the second electrical component 500 and the heat transfer element 172. In an exemplary embodiment, the lower thermal interface 192 is conformable to the shape of the second electrical component 500, and the upper thermal interface 190 is conformable to the shape of the heat transfer element 172 for efficient heat transfer therebetween. For example, the thermal bridge 200 may be a stacked plate structure, wherein the individual plates are movable relative to each other to conform to the second electrical component 500 and the heat transfer element 172. Thermal grease or other thermal interface materials may be applied at the interfaces (e.g., at the upper thermal interface 190) to enhance heat transfer between the thermal bridge 200 and other components.

[0030] Figure 3 This is a perspective view of the thermal bridge 200 according to an exemplary embodiment. Figure 4 This is a cross-sectional view of the thermal bridge 200 according to an exemplary embodiment. Figure 5This is a cross-sectional view of the thermal bridge 200 according to an exemplary embodiment. Other types of heat exchangers may be used as intermediate thermal components between the second electrical component 500 (e.g., from the pluggable module 600) and the heat transfer element 172 in alternative embodiments.

[0031] In an exemplary embodiment, the thermal bridge 200 includes an upper bridge assembly 202, a lower bridge assembly 204, a spring element 206 between the upper bridge assembly 202 and the lower bridge assembly 204, and a bridge frame 208 for holding the upper bridge assembly 202 and the lower bridge assembly 204 together. The lower bridge assembly 204 is configured to thermally engage the second electrical component 500. The upper bridge assembly 202 is configured to transfer heat to a heat transfer element 172. The upper bridge assembly 202 is in thermal communication with the lower bridge assembly 204 and transfers heat away from the lower bridge assembly 204 to cool the second electrical component 500.

[0032] Spring element 206 biases the upper bridge assembly 202 and the lower bridge assembly 204 separately. The upper bridge assembly 202 and the lower bridge assembly 204 are compressible relative to each other. For example, the upper bridge assembly 202 and the lower bridge assembly 204 are compressible between the second electrical component 500 and the heat transfer element 172 (e.g., by compressing the spring element 206).

[0033] Bridge frame 208 provides support for upper bridge assembly 202 and lower bridge assembly 204. For example, bridge frame 208 may surround or be around the outer periphery of thermal bridge 200 to hold components within the internal space of bridge frame 208. Bridge frame 208 may be mounted to heat transfer element 172, such as by fastening, clamping, latching, welding, or otherwise securing it to heat transfer element 172. In an exemplary embodiment, bridge frame 208 may extend along its sides and ends, leaving its top and bottom exposed to form a thermal interface with the second electrical component 500 and heat transfer element 172. Alternatively, bridge frame 208 may provide internal support via bridge assemblies 202, 204. For example, connecting rods, pins, or other types of internal connecting elements may pass through bridge assemblies 202, 204.

[0034] In an exemplary embodiment, spring element 206 presses the upper bridge assembly 202 outward against the bridge frame 208 in a first bias direction (e.g., upward), and spring element 206 presses the lower bridge assembly 204 outward against the bridge frame 208 in a second bias direction (e.g., downward). The upper bridge assembly 202 and the lower bridge assembly 204 may be held by the bridge frame 208 in a manner that allows a limited amount of floating movement of the upper bridge assembly 202 and the lower bridge assembly 204 relative to the bridge frame 208.

[0035] In an exemplary embodiment, thermal bridge 200 is parallelepiped (e.g., generally box-shaped). For example, thermal bridge 200 includes a top 270, a bottom 272, a front portion 274, a rear portion 276, a first side 280, and a second side 282. Top 270 may be generally planar. Bottom 272 may be generally planar. Front 274 may be generally planar. Rear 276 may be generally planar. First side 280 may be generally planar. Second side 282 may be generally planar. However, in alternative embodiments, thermal bridge 200 may have other shapes. A frame structure for holding thermal bridge 200 together is defined by bridge frame 208. Top 270 and bottom 272 have large surface areas to allow a large amount of available external surface area for heat transfer.

[0036] In an exemplary embodiment, bridge assemblies 202 and 204 each include a plurality of plates arranged in a plate stack. The plates interleave each other for thermal communication between the upper bridge assembly 202 and the lower bridge assembly 204. Each plate is movable relative to each other such that the plates can be individually hinged to conform to the second electrical component 500 and / or the heat transfer element 172. For example, each plate may conform to the second electrical component 500 at the lower thermal interface 104 to improve contact and / or proximity between the thermal bridge 200 and the second electrical component 500, and / or each plate may conform to the heat transfer element 172 at the upper thermal interface 108 to improve contact and / or proximity between the thermal bridge 200 and the heat transfer element 172. A gap or space may be provided between the plates of the upper bridge assembly 202 and the lower bridge assembly 204 to allow compressive movement of the spring element 206 between the bridge assemblies 202 and 204.

[0037] In an exemplary embodiment, the bridge frame 208 is made of a plurality of frame elements that can be connected together to form a support structure for the bridge assemblies 202, 204. For example, the frame elements may surround the outer periphery of the plate stack. The frame elements may extend through the interior of the plate stack to hold the bridge assemblies 202, 204. In an exemplary embodiment, the bridge frame 208 includes a front rail 240, a rear rail 242, a first side rail 244 extending between the front rail 240 and the rear rail 242, and a second side rail 246 extending between the front rail 240 and the rear rail 242. The rails may be stamped elements. In an exemplary embodiment, the front rail 240 and the rear rail 242 engage the bridge assemblies 202, 204 to limit the disintegration of the bridge assemblies 202, 204 against the opening force of the spring element 206.

[0038] In an exemplary embodiment, the upper bridge assembly 202 includes a plurality of upper plates 300 arranged in an upper plate stack 302. In an exemplary embodiment, the lower bridge assembly 204 includes a plurality of lower plates 400 arranged in a lower plate stack 402. The upper plates 300 overlap with the lower plates 400 in the plate stacks 302, 402.

[0039] In an exemplary embodiment, the upper plate 300 includes an upper transfer plate 320 and an upper partition 322 between the upper transfer plates 320. Each upper plate 300 has a side 304 extending between a lower end 306 and an upper end 308 of the upper plate 300. The lower end 306 faces the lower bridge assembly 204. The upper end 308 faces outward, for example toward the heat transfer element 172. For example, there are no other components between the upper end 308 and the heat transfer element 172. However, a thermal interface material or thermally conductive grease may be present at the upper end 308 to enhance heat transfer to the heat transfer element 172. Optionally, the various upper plates 300 may have different shapes and / or heights between the upper end 306 and the lower end 308. In an alternative embodiment, all upper plates 300 may have the same shape, such as the same height / thickness / length.

[0040] The upper end 308 of the upper transfer plate 320 and the upper end 308 of the upper partition plate 322 form an upper thermal interface 190. The upper ends 308 of the upper transfer plate 320 and the upper end 308 of the upper partition plate 322 are configured to face and engage the heat transfer element 172, such as the hot surface 176. The upper plates 300 are separate from each other to allow movement relative to each other within the upper plate stack. Thus, the upper ends 308 of the upper transfer plate 320 and the upper end 308 of the upper partition plate 322 are configured to conform to the heat transfer element 172 for efficient heat transfer from the thermal bridge 200 to the heat transfer element 172.

[0041] In an exemplary embodiment, the lower plate 400 includes a lower transfer plate 420 and a lower partition 430 between the lower transfer plates 420. Each lower plate 400 has a side 404 extending between an upper end 406 and a lower end 408 of the lower plate 400. The upper end 406 faces the upper bridge assembly 202. For example, the upper end 406 may face the lower end 308 of a corresponding upper plate 300 of the upper bridge assembly 202. The lower end 408 of the lower plate 400 faces outward, for example toward the second electrical component 500. Optionally, the various lower plates 400 may have different shapes and / or heights between the upper end 406 and the lower end 408. In an alternative embodiment, all lower plates 400 may have the same shape, such as the same height / thickness / length.

[0042] In an exemplary embodiment, the lower plate 400 includes a lower transfer plate 420 and a lower partition 422. The lower partition 422 is located between the lower transfer plates 420. The lower transfer plates 420 are configured to overlap with the upper transfer plate 320 to thermally connect the lower bridge assembly 204 and the upper bridge assembly 202.

[0043] In an exemplary embodiment, the upper transfer plate 320 includes an upper overlapping region 326, and the lower transfer plate 420 includes a lower overlapping region 426. The upper bridge assembly 202 and the lower bridge assembly 204 are nested together, such that the upper overlapping region 326 and the lower overlapping region 426 are thermally connected to thermally link the upper transfer plate 320 and the lower transfer plate 420. When the thermal bridge 200 is compressed, the overlap of the overlapping regions 326 and 426 increases. Thus, when the thermal bridge 200 is compressed, the heat transfer efficiency between the upper bridge assembly 202 and the lower bridge assembly 204 increases.

[0044] The lower end 408 of the lower transfer plate 420 and the lower end 408 of the lower partition plate 422 form a lower thermal interface 192. The lower ends 408 of the lower transfer plate 420 and the lower end 408 of the lower partition plate 422 are configured to face and engage the second electrical component 500. The lower plates 400 are separate from each other to allow movement relative to each other within the lower plate stack. Thus, the lower ends 408 of the lower transfer plate 420 and the lower end 408 of the lower partition plate 422 are configured to conform to the second electrical component 500 for efficient heat transfer from the second electrical component 500 to the thermal bridge 200.

[0045] Figure 6 This is a perspective view of the second electrical component 500 according to an exemplary embodiment. Figure 7 This is a perspective view of a portion of a second electrical component 500 according to an exemplary embodiment. The second electrical component 500 is configured to be received in component space 180 ( Figure 1 In the first electrical component 100, it is thermally and electrically connected.

[0046] In an exemplary embodiment, the second electrical component 500 includes a circuit card 550 ( Figure 6 ) and the socket connector assembly 504 installed into the circuit card 550. Pluggable module 600 (such as Figure 1 (As shown) is configured to be electrically connected to the receptacle connector assembly 504. The pluggable module 600 is electrically connected to the circuit card 550 via the receptacle connector assembly 504. In an exemplary embodiment, the second electrical component 500 is a network interface card having a pluggable interface for insertion into the first electrical component 100.

[0047] In an exemplary embodiment, the second electrical component 500 includes a panel 506 at the front of the second electrical component 500. The panel 506 is configured to interface with the first electrical component 100 to provide shielding and / or environmental coverage for the communication system 10.

[0048] In an exemplary embodiment, the second electrical component 500 includes a bracket 508 at its front portion. The bracket 508 provides surfaces for retaining the second electrical component 500 for engagement and disengagement. The bracket 508 can be used to mechanically secure the second electrical component 500 to the first electrical component 100, for example, by including a latch or other securing features to secure the second electrical component 500 to the first electrical component 100.

[0049] In an exemplary embodiment, the receptacle connector assembly 504 includes a receptacle cage 510 and a receptacle connector 560 adjacent to the receptacle cage 510. The receptacle connector 560 is received within the receptacle cage 510, for example, at the rear of the receptacle cage 510. In various embodiments, the receptacle cage 510 is enclosing and provides electrical shielding for the receptacle connector 560. A pluggable module 600 is configured to be loaded into the receptacle cage 510 and at least partially enclosed by the receptacle cage 510. In an exemplary embodiment, the receptacle cage 510 is a shielded, stamped cage member including a plurality of shielding walls 514 defining one or more module channels 516 for receiving a corresponding pluggable module 600.

[0050] In the illustrated embodiment, the receptacle cage 510 is a single-port receptacle cage configured to receive a single pluggable module 600. In various other embodiments, the receptacle cage 510 may be a combined cage member having multiple ports arranged in a single row and / or a stacked cage member having multiple ports stacked as upper and lower ports. The receptacle cage 510 includes a module channel 516 having a module port 518 leading to the module channel 516. The module channel 516 receives the pluggable module 600 through the module port 518. In an exemplary embodiment, the receptacle cage 510 extends between a front end 520 and a rear end 522. The module port 518 is located at the front end 520. The module port 518 includes polarized features (e.g., slots or keyways) for keying engagement with the pluggable module 600. In various embodiments, any number of module channels 516 may be arranged in a single row or multiple rows (e.g., 2x2, 3x2, 4x2, 4x3, 4x1, 2x1, etc.). Alternatively, multiple receptacle connectors 560 may be arranged within the receptacle cage 510, for example when multiple rows and / or columns of module channels 516 are provided.

[0051] In an exemplary embodiment, the shielding wall 514 of the socket cage 510 includes a first end wall 530, a second end wall 532, a first side wall 534, a second side wall 536, a rear wall 538, and may include a front wall. The side walls 534 and 536 extend between the end walls 530 and 532. In various embodiments, the first end wall 530 is located at the top of the socket cage 510 and thus defines an upper wall 530, and the second end wall 532 is located at the bottom of the socket cage 510 and thus defines a lower wall 532. In alternative embodiments, other orientations are possible; for example, the second end wall 532 or one of the side walls 534 and 536 defines a top wall. The second end wall 532 may face the circuit card 550 and may rest on the circuit card 550. In various embodiments, the socket cage 510 may be configured without a lower wall 532.

[0052] Wall 514 defines cavity 540. For example, cavity 540 may be defined by a first end wall 530, a second end wall 532, side walls 534, 536, and a rear wall 538. Cavity 540 includes module channels 516. In various embodiments, cavity 540 receives a receptacle connector 560, for example, at a rear end 522. Other walls 514 may separate or partition cavity 540 into additional module channels 516, for example, in embodiments using grouped and / or stacked receptacle cages. For example, wall 514 may include one or more vertical partition walls between groups of module channels 516. In various embodiments, wall 514 may include a separation panel between stacked upper and lower module channels 516.

[0053] In an exemplary embodiment, the receptacle cage 510 may include one or more springs 542 at a front end 520 for providing electrical shielding for the module channel 516. For example, the springs 542 may be located at a port 518 for electrical connection to a pluggable module 600 received in the module channel 516. The springs 542 may be electrically connected to a panel 506, for example, received in an opening or socket 507 formed in the panel 506. The springs 542 may include spring fingers or other deflectable features configured to mate with the pluggable module 600 and / or the panel 506.

[0054] The pluggable module 600 is configured to be loaded via port 518 at front end 520 to mate with receptacle connector 560. Shielding walls 514 of the receptacle cage 510 provide electrical shielding around the receptacle connector 560 and the pluggable module 600, for example, around the mating interface between the receptacle connector 560 and the pluggable module 600. The pluggable module 600 is electrically connected to circuit card 550 via receptacle connector 560.

[0055] In an exemplary embodiment, circuit card 550 includes an upper surface 552 and a lower surface 554. Main circuit board 550 includes one or more circuits (e.g., traces, pads, vias, etc.) on one or more layers of circuit card 550. Circuit card 550 includes a mating interface at a card edge 556. The mating interface at card edge 556 is configured to connect to board connector 130 of first electrical component 100. Figure 1 The circuit card 550 includes a contact pad 558 at a card edge 556, the contact pad 558 being configured to electrically connect to a board contact of the board connector 130. The contact pad 558 may be located at an upper surface 552 and / or a lower surface 554. The circuit card 550 may carry other electrical components, such as processors, IC components, memory components, or other types of electrical components.

[0056] A receptacle connector 560 is electrically connected to a circuit card 550. For example, the receptacle connector 560 may be mounted to the upper surface 552 of the circuit card 550. The receptacle connector 560 may be soldered to the circuitry of the circuit card 550. In an exemplary embodiment, the receptacle connector 560 includes a receptacle connector housing 562 that holds receptacle connector contacts 564. The receptacle connector contacts 564 are configured to be electrically connected to corresponding circuitry (e.g., pads of the circuit card 550). In an exemplary embodiment, the receptacle connector housing 562 is a card edge connector having a slot 566 at the front of the receptacle connector housing 562. The slot 566 is configured to receive the card edge of the module circuit card 616 of the pluggable module 600 in a loading direction, which may be parallel to the upper surface 552 of the circuit card 550. Other types of electrical connectors may be used in alternative embodiments.

[0057] In an exemplary embodiment, the socket cage 510 includes a thermal opening 580 configured to receive a thermal bridge 200. The thermal opening 580 opens into a module channel 516 to allow the thermal bridge 200 to mate with a pluggable module 600. The thermal opening 580 is sized and shaped to receive the thermal bridge 200. In an exemplary embodiment, the thermal opening 580 is open at an upper wall 530 and at a rear wall 538 to receive the thermal bridge 200 of the heat transfer assembly 170. The thermal opening 580 is open to allow the thermal bridge 200 to mate with the pluggable module 600 in the module channel 516.

[0058] In an exemplary embodiment, the thermal opening 580 is continuous along the upper wall 530 and the rear wall 538 to allow the thermal bridge 200 to be positioned in the module channel 516 through the upper wall 530 and the rear wall 538. The thermal opening 580 is continuous along the upper wall 530 and the rear wall 538. For example, the upper wall 530 includes an upper edge 582 defining a portion of the thermal opening 580, and the rear wall 538 includes a rear edge 584 defining a portion of the thermal opening 580. The upper edge 582 and the rear edge 584 are continuous with each other. For example, the upper edge 582 and the rear edge 584 are continuous to form a continuous thermal opening 580. In an exemplary embodiment, the thermal opening 580 opens in front of the receptacle connector 560, opens above the receptacle connector 560, and opens behind the receptacle connector 560. The thermal opening 580 allows the thermal bridge 200 to be positioned in the module channel 516 through the upper wall 530 and the rear wall 538.

[0059] Figure 8 This is a perspective view of the communication system 10, showing a second electrical component 500 that partially mates with the first electrical component 100. During mating, a circuit card 550 is loaded into a guide rail 152. The guide rail 152 guides the second electrical component 500 into the component space 180. The guide rail 152 guides the circuit card 550 to the board connector 130.

[0060] During mating, the thermal bridge 200 is received in the thermal opening 580. The guide rail 152 aligns the circuit card 550, and thus the socket cage 510, with the thermal bridge 200. For example, the thermal opening 580 aligns with the thermal bridge 200. The thermal opening 580 is open at the rear and top of the socket cage 510 to receive the thermal bridge 200. For example, during mating, the thermal opening 580 initially receives the thermal bridge 200 through the rear wall 538 (e.g., through the rear edge 584 of the thermal opening 580). Further loading of the second electrical component 500 into the component space 180 loads the thermal bridge 200 through the upper wall 530 (e.g., through the upper edge 582). Due to loading in a horizontal loading direction, the thermal bridge 200 cannot be loaded into the thermal opening 580 in the upper wall 530 if the rear wall 538 does not have a thermal opening 580. When fully loaded, the thermal bridge 200 is located in the module channel 516 to connect with the pluggable module 600 when it is loaded into the module channel 516. Figure 1 ) docking.

Claims

1. A communication system (10), comprising: A first electrical component (100) includes a main circuit board (110) having a first surface and a board connector (130) mounted to the first surface. The first electrical component includes a heat transfer assembly (170) including a heat transfer element (172) including a hot surface (176) spaced apart from the first surface, thereby forming a component space (180) between the first surface and the hot surface. The heat transfer assembly includes a thermal bridge (200) in the component space, the thermal bridge including a first thermal interface thermally connected to the hot surface and a second thermal interface opposite to the first hot surface. and A second electrical component (500) is received in the component space and is thermally and electrically connected to the first electrical component. The second electrical component includes a circuit card (616) having a first surface and a socket connector (560) mounted to the first surface. The socket connector is configured to be electrically connected to a pluggable module (610). The circuit card is electrically connected to the board connector. The second electrical component includes a socket cage (510) coupled to the circuit card. The socket cage includes cage walls, including an upper wall (530), a lower wall (532), a first side wall (534), and a second side wall (535). 6) and rear wall (538), the socket cage includes a module channel (516) between the upper wall and the lower wall and between the first side wall and the second side wall and between the front wall and the rear wall, the module channel receiving the socket connector in the rear of the socket cage, the module channel being configured to receive the pluggable module through a port (518) at the front of the socket cage, the socket cage including thermal openings (580) open at the upper wall and the rear wall, the thermal openings receiving thermal bridges of the heat transfer assembly to allow the thermal bridges to dock with the pluggable module in the module channel.

2. The communication system (10) according to claim 1, wherein, The thermal bridge (200) is installed on the heat transfer element (172) such that the thermal bridge is mechanically and thermally connected to the transfer element.

3. The communication system (10) according to claim 1, wherein, The thermal bridge (200) includes a bridge frame (208) which is fixed to the heat transfer element (172).

4. The communication system (10) according to claim 1, wherein, The thermal bridge (200) includes: The upper bridge assembly (202) includes a plurality of upper transfer plates (320), each upper transfer plate having a side (304) between an upper end (308) and a lower end (306), the upper end of the upper transfer plate being thermally connected to the hot surface (176) of the heat transfer element (172). The lower bridge assembly (204) includes a plurality of lower transfer plates (420), each lower transfer plate having a side surface between an upper end and a lower end, the side surface of the lower transfer plate being configured to abut the side surface of the upper transfer plate to transfer heat from the lower bridge assembly to the upper bridge assembly, the lower end of the lower transfer plate being configured to face and be thermally connected to the second electrical component (500); and A spring element (206) is positioned between the upper bridge assembly and the lower bridge assembly. The spring element includes an upper spring member that engages the upper transmission plate to bias the upper transmission plate substantially away from the lower transmission plate by an opening force. The spring element also includes a lower spring member that engages the lower transmission plate to bias the lower transmission plate substantially away from the upper transmission plate by an opening force.

5. The communication system (10) according to claim 4, wherein, The spring element (206) is compressible, thereby allowing the upper transfer plate (320) to move relative to the lower transfer plate (420) so that the upper transfer plate conforms to the heat transfer element (172) and the lower transfer plate conforms to the second electrical component (500).

6. The communication system (10) according to claim 4, wherein, The upper transfer plate (320) includes an upper overlapping region, and the lower transfer plate (420) includes a lower overlapping region (426). The upper bridge assembly (202) and the lower bridge assembly (204) are nested together, such that the upper overlapping region and the lower overlapping region are thermally connected, so that the upper transfer plate and the lower transfer plate are thermally connected.

7. The communication system (10) according to claim 1, wherein, The heat transfer assembly (170) includes a support element (182) connected to the main circuit board (110), the support element supporting the heat transfer assembly (172) above the component space (180) to position the thermal bridge (200) relative to the board connector (130) so that the thermal bridge (200) mates with the second electrical component (500).

8. The communication system (10) according to claim 1 further includes a guide rail (152) positioned relative to the board connector (130) to guide the engagement of the second electrical component (500) with the board connector.

9. The communication system (10) according to claim 8, wherein, The guide rail (152) includes a guide rail (154) configured to receive a circuit card of the second electrical component (500).

10. The communication system (10) according to claim 1, wherein, The board connector (130) includes a board connector housing (132) for retaining board connector contacts (134), the board connector housing including a slot (136) configured to receive a circuit card of the second electrical component (500).

11. The communication system (10) according to claim 1, wherein, The thermal opening (580) is continuous along the upper wall (530) and the rear wall (538).

12. The communication system according to claim 1, wherein, The thermal opening (580) is open in front of, above and behind the socket connector (560).

13. The communication system according to claim 1, wherein, The thermal opening (530) allows the thermal bridge (200) to pass through the upper wall (530) and through the rear wall (538) and be positioned in the module channel.

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