Heat dissipation structure capable of being applied to multi-specification low-energy-consumption wireless ad hoc network communication equipment

Abstract

The invention provides a heat dissipation structure capable of being applied to multi-specification low-energy-consumption wireless ad hoc network communication equipment, and belongs to the field of communication equipment. Comprising a shell and a communication equipment structure, the communication equipment structure is arranged in the shell, a plurality of mounting plates are arranged on the top surface of the shell, the mounting plates are arranged in a square shape, combination assemblies are arranged on the side walls of the mounting plates, and circular grooves are formed in the centers of the side walls of the mounting plates. According to the low-energy-consumption wireless ad hoc network communication equipment, the specified number of mounting plates are selected according to the specification of the low-energy-consumption wireless ad hoc network communication equipment, inserting connection between the multiple mounting plates is achieved through mutual inserting connection between the inserting plates and the inserting grooves, after inserting connection is completed, the positioning rods are inserted into the positioning grooves through the elastic force effect of the second springs, and therefore the positioning effect of the low-energy-consumption wireless ad hoc network communication equipment is achieved. The mounting plate can be combined and fixed only by rotating the mounting plate, heat dissipation matching of corresponding communication equipment is achieved by controlling the combined and fixed shape of the mounting plate, and universality is improved.

Description

Technical Field

[0001] This invention relates to the field of communication equipment technology, and in particular to a heat dissipation structure applicable to multi-specification low-power wireless self-organizing network communication equipment. Background Technology

[0002] With the rapid development of the Internet of Things, smart cities, and industrial automation, the application of low-power wireless ad hoc network communication devices is becoming increasingly widespread. These devices typically need to operate stably for extended periods in complex environments. They integrate multiple heat-generating components such as radio frequency modules, processors, and sensors, which continuously generate heat during data transmission and signal processing. If this heat cannot be dissipated in time, the internal temperature of the device will rise, which will not only reduce communication efficiency and shorten the device's lifespan, but may also cause circuit failures in severe cases, affecting the stability of the entire ad hoc network system.

[0003] Currently, most heat dissipation structures for low-power wireless ad hoc network communication devices adopt a fixed design, meaning that heat dissipation components are customized according to the size and heat-generating component layout of specific device specifications. However, in practical applications, the specifications of low-power wireless ad hoc network communication devices are becoming increasingly diverse, resulting in extremely poor versatility of fixed heat dissipation structures, which cannot meet the heat dissipation requirements of different device specifications. Furthermore, due to the differences in the main control board layout of different device specifications, traditional heat dissipation structures cannot achieve full and close contact with the components (such as processors and power devices) on the main control board, leading to obstructed heat conduction paths and low heat dissipation efficiency.

[0004] Based on the above reasons, this invention proposes a heat dissipation structure applicable to low-power wireless self-organizing network communication devices of various specifications. This structure needs to have good versatility and adaptability, and can be flexibly adjusted according to the size and structure of different specifications of devices. At the same time, it ensures efficient heat conduction with the main control board, significantly improving heat dissipation efficiency, so as to meet the requirements of device stability in diverse application scenarios. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a heat dissipation structure that can be applied to low-power wireless self-organizing network communication devices of various specifications, with the advantages of good versatility and good heat dissipation effect.

[0006] The technical solution of this invention is implemented as follows: A heat dissipation structure applicable to multi-specification low-power wireless self-organizing network communication devices includes a housing, within which a communication device structure is housed. Several mounting plates are arranged on the top surface of the housing, each mounting plate being a regular quadrilateral. Assembly components are mounted on the sidewalls of the mounting plates. A circular groove is formed at the center of the sidewall of each mounting plate, and a circular plate is movably connected within the groove. Two through holes are symmetrically formed on the circular plate, and a common heat-conducting pipe is movably connected within each of the two through holes. Two fixing plates are symmetrically fixedly connected to the outer wall of the heat-conducting pipe, and two first springs are sleeved on them. The two ends of the first springs are respectively fixedly connected to the fixing plates and the inner walls of the through holes. A heat-conducting shell is installed inside the housing cavity of the heat-conducting pipe. A positioning component is provided on the bottom surface of the circular plate, and side plates are fixedly installed along the edge of the housing.

[0007] Preferably, the assembly includes insert plates, with insert plates fixedly connected to two side walls of each mounting plate at intervals. Slots are provided on the other two side walls of the mounting plates. Insert plates on adjacent mounting plates are inserted into the slots. Two side holes are symmetrically provided on the side walls of the insert plates. Positioning rods are movably connected in each side hole. A second spring is sleeved on the positioning rod. The two ends of the second spring are fixedly connected to the positioning rod and the inner wall of the side hole, respectively. Two positioning grooves are provided on the inner wall of the slots. The positioning rods are matched with the positioning grooves.

[0008] Preferably, the positioning component includes a bottom groove, and two bottom grooves are symmetrically opened on the bottom surface of the circular plate. A positioning plate is movably connected in each bottom groove, and a crossbar is movably connected on the positioning plate. The end of the crossbar away from the positioning plate is fixedly connected to the inner wall of the bottom groove, and a third spring is sleeved on the crossbar. The two ends of the third spring are fixedly connected to the crossbar and the positioning plate, respectively.

[0009] Preferably, both the bottom groove and the positioning plate are T-shaped, and the side of the positioning plate away from the center of the circular plate is arc-shaped and fixedly connected with an anti-slip pad.

[0010] Preferably, a heat-conducting plate is provided on the upper side of the heat-conducting shell, and an arc-shaped groove is provided on the opposite side of the heat-conducting plate and the heat-conducting shell. The heat-conducting pipe is provided through the arc-shaped groove, and the heat-conducting plate and the heat-conducting shell are fixedly connected by a first bolt.

[0011] Preferably, the side plate has an L-shaped cross-section, and the inner wall of the side plate has a side groove that matches the insert plate. The side plate is fixedly connected to the housing by a second bolt.

[0012] Preferably, the top surface of the heat pipe is arc-shaped and the bottom surface is horizontal, and several heat sinks are evenly distributed and fixedly connected to the side wall above the circular plate.

[0013] Preferably, a sealing ring is fixedly connected to the side wall of the mounting plate, and two sealing rings are symmetrically arranged vertically.

[0014] Preferably, the communication device structure includes a main control board, which is fixedly installed in the inner cavity of the housing. An antenna is fixedly connected to one side of the housing, and a plurality of connectors are fixedly connected to the other side of the housing. The connectors and the antenna are electrically connected to the main control board.

[0015] Preferably, the bottom surface of the heat-conducting shell is not sealed, and the heat-conducting shell and the main control board are matched and configured.

[0016] By adopting the above technical solution, the beneficial effects of the present invention are as follows: This invention selects a specified number of mounting plates according to the size of the low-power wireless self-organizing network communication equipment, and realizes the connection between multiple mounting plates by interlocking the plates with slots. After the connection is completed, the positioning rod is inserted into the positioning slot by the elastic force of the second spring, thereby realizing the combination and fixation of the mounting plates. By controlling the shape of the combination and fixation of the mounting plates, the heat dissipation matching of the corresponding communication equipment is achieved, thereby improving versatility. This invention selects a heat-conducting shell of a specified specification and adds a certain amount of thermal grease inside the heat-conducting shell. After the assembled mounting plate is fixed to the shell, under the elastic force of the first spring, the fixing plate drives the heat-conducting pipe to move into the inner cavity of the shell, so that the heat-conducting shell covers or is in close contact with the components of the main control board, realizing full contact between the heat-conducting shell and the main control board, effectively improving the heat transfer efficiency during the operation of the communication equipment, thereby achieving the effect of efficient heat dissipation. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 This is a schematic diagram of the three-dimensional structure of the transverse cross section of the present invention; Figure 3 This is a three-dimensional structural diagram of the mounting plate of the present invention; Figure 4 This is a three-dimensional structural diagram of the heat pipe of the present invention; Figure 5 This is a three-dimensional structural diagram of the internal structure of the mounting plate of the present invention; Figure 6 This is a three-dimensional structural diagram of the circular plate of the present invention; Figure 7 This is a three-dimensional structural diagram of the positioning component of the present invention; Figure 8 This is a three-dimensional structural diagram of the side plate of the present invention.

[0019] in: 1. Housing; 2. Communication equipment structure; 3. Mounting plate; 4. Assembly assembly; 5. Circular plate; 6. Through hole; 7. Heat pipe; 8. Fixing plate; 9. First spring; 10. Heat-conducting shell; 11. Positioning assembly; 12. Side plate; 13. Insert plate; 14. Slot; 15. Side hole; 16. Positioning rod; 17. Second spring; 18. Positioning groove; 19. Bottom groove; 20. Positioning plate; 21. Crossbar; 22. Third spring; 23. Anti-slip pad; 24. Heat-conducting plate; 25. Arc groove; 26. First bolt; 27. Side groove; 28. Second bolt; 29. ​​Heat sink; 30. Sealing ring; 31. Main control board; 32. Antenna; 33. Connector. Implementation The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] like Figure 1-8 As shown, an embodiment of the present invention provides a heat dissipation structure applicable to multi-specification low-power wireless self-organizing network communication devices, including a housing 1, a communication device structure 2 disposed inside the housing 1, the communication device structure 2 including a main control board 31, the main control board 31 being fixedly installed in the inner cavity of the housing 1, an antenna 32 being fixedly connected to one side of the housing 1, and a plurality of connectors 33 being fixedly connected to the other side of the housing 1, the connectors 33 and the antenna 32 being electrically connected to the main control board 31, the connectors 33 enabling connection with external devices, the main control board 31 enabling data processing operations, and the antenna 32 enabling signal transmission and reception operations, thereby realizing communication functions; A number of mounting plates 3 are provided on the top surface of the housing 1. The mounting plates 3 are arranged in a regular quadrilateral shape, and the side walls of the mounting plates 3 are provided with a combination component 4. The combination component 4 includes a plug plate 13. The plug plate 13 is fixedly connected to the side wall of each mounting plate 3 at intervals of two. The other two side walls of the mounting plates 3 are provided with slots 14. The plug plates 13 on adjacent mounting plates 3 are plugged into the slots 14. Two side holes 15 are symmetrically opened on the side wall of the plug plate 13. A positioning rod 16 is movably connected in each side hole 15. A second spring 17 is sleeved on the positioning rod 16. The two ends of the second spring 17 are fixedly connected to the positioning rod 16 and the inner wall of the side hole 15, respectively. Two positioning grooves 18 are opened on the inner wall of the slot 14. The positioning rod 16 is matched with the positioning groove 18. In the technical solution of this embodiment, during use, a specified number of mounting plates 3 are selected according to the size of the low-power wireless self-organizing network communication equipment. The mounting plates 3 are connected by interlocking with each other through the insertion of the insert plate 13 and the slot 14. After the insertion is completed, the positioning rod 16 is inserted into the positioning groove 18 by the elastic force of the second spring 17, so that the mounting plates 3 can be combined and fixed. By controlling the shape of the combined and fixed mounting plates 3, the heat dissipation matching of the corresponding communication equipment is achieved, thereby improving versatility. Furthermore, a sealing ring 30 is fixedly connected to the side wall of the mounting plate 3. Two sealing rings 30 are symmetrically arranged on the upper and lower sides to improve the sealing between the mounting plates 3, thereby enabling the low-power wireless self-organizing network communication equipment to operate stably. A circular groove is provided in the center of the side wall of the mounting plate 3. A circular plate 5 is movably connected in the circular groove. Two through holes 6 are symmetrically provided on the circular plate 5. The same heat-conducting pipe 7 is movably connected in the two through holes 6. Two fixing plates 8 are symmetrically fixedly connected to the outer wall of the heat-conducting pipe 7 and two first springs 9 are sleeved on it. The two ends of the first springs 9 are fixedly connected to the fixing plates 8 and the inner wall of the through holes 6, respectively. A heat-conducting shell 10 is installed in the inner cavity of the shell 1, where the heat-conducting pipe 7 is located. In the technical solution of this embodiment, a certain amount of thermal grease is added into the heat-conducting shell 10. After the assembled mounting plate 3 is fixed to the shell 1, under the elastic force of the first spring 9, the fixing plate 8 drives the heat-conducting pipe 7 to move into the inner cavity of the shell 1, so that the heat-conducting shell 10 covers or is in close contact with the components of the main control board 31, realizing full contact between the heat-conducting shell 10 and the main control board 31, effectively improving the heat transfer efficiency during the operation of the communication equipment, thereby achieving the effect of efficient heat dissipation. Furthermore, the top surface of the heat pipe 7 is arc-shaped and the bottom surface is horizontal. Several heat sinks 29 are evenly distributed and fixedly connected on the side wall of the circular plate 5, which can effectively improve the heat dissipation efficiency of the heat pipe 7. A positioning component 11 is provided on the bottom surface of the circular plate 5. The positioning component 11 includes a bottom groove 19. Two bottom grooves 19 are symmetrically opened on the bottom surface of the circular plate 5. A positioning plate 20 is movably connected in each bottom groove 19. A crossbar 21 is movably connected on the positioning plate 20. The end of the crossbar 21 away from the positioning plate 20 is fixedly connected to the inner wall of the bottom groove 19. A third spring 22 is sleeved on the crossbar 21. The two ends of the third spring 22 are fixedly connected to the crossbar 21 and the positioning plate 20, respectively. In the technical solution of this embodiment, when installing the heat-conducting shell 10 between the main control board 31 and the heat-conducting shell 10, the circular plate 5 can be rotated and adjusted according to the position of the components on the main control board 31 or the shape of the heat-conducting shell 10, so that the heat-conducting shell 10 can fully contact the main control board 31. After the adjustment is completed, under the elastic force of the third spring 22, the positioning plate 20 is pressed tightly against the inner wall of the circular groove to achieve the positioning of the circular plate 5, which facilitates the stable heat dissipation. Furthermore, both the bottom groove 19 and the positioning plate 20 are T-shaped. The side of the positioning plate 20 away from the center of the circular plate 5 is arc-shaped and fixedly connected with an anti-slip pad 23, which can effectively improve the positioning reliability of the positioning plate 20 on the circular plate 5. A heat-conducting plate 24 is provided on the upper side of the heat-conducting shell 10. An arc-shaped groove 25 is opened on the opposite side of the heat-conducting plate 24 and the heat-conducting shell 10. The heat-conducting pipe 7 is installed through the arc-shaped groove 25. The heat-conducting plate 24 and the heat-conducting shell 10 are fixedly connected by the first bolt 26. The bottom surface of the heat-conducting shell 10 is not closed. The heat-conducting shell 10 is matched with the main control board 31. In use, the heat-conducting shell 10 of a specified shape and specification can be selected according to the different specifications and sizes of the components on the main control board 31 corresponding to the mounting plate 3. The heat-conducting plate 24 and the heat-conducting shell 10 are fixedly installed on the heat-conducting pipe 7 by the first bolt 26. This realizes the adaptive installation operation based on the structure of the main control board 31 and improves the heat dissipation efficiency of the heat-conducting shell 10 on the main control board 31. A side plate 12 is fixedly installed at the edge of the housing 1. The side plate 12 has an L-shaped cross section, and a side groove 27 matching the insert plate 13 is opened on the inner wall of the side plate 12. The side plate 12 is fixedly connected to the housing 1 by a second bolt 28. In the technical solution of this embodiment, after the mounting plate 3 is assembled, a side plate 12 that matches the side of the housing 1 is selected, and then the insert plate 13 on the edge of the mounting plate 3 is inserted into the side groove 27 on the side plate 12. The side plate 12 is aligned with the housing 1, and the side plate 12 and the housing 1 are fixedly installed by rotating the second bolt 28, thereby realizing the fixed installation operation of the assembled mounting plate 3.

[0021] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A heat dissipation structure applicable to multi-specification low-power wireless self-organizing network communication equipment, comprising a housing (1), characterized in that, The housing (1) is provided with a communication device structure (2). Several mounting plates (3) are provided on the top surface of the housing (1). The mounting plates (3) are square in shape and a combination component (4) is provided on the side wall of the mounting plates (3). A circular groove is provided in the center of the side wall of the mounting plate (3). A circular plate (5) is movably connected in the circular groove. Two through holes (6) are symmetrically opened on the circular plate (5). The same heat-conducting pipe (7) is movably connected in the two through holes (6). Two fixing plates (8) are symmetrically fixed on the outer wall of the heat-conducting pipe (7) and two first springs (9) are sleeved on it. The two ends of the first springs (9) are fixedly connected to the fixing plates (8) and the inner wall of the through holes (6) respectively. A heat-conducting shell (10) is installed in the inner cavity of the housing (1) of the heat-conducting pipe (7). A positioning component (11) is provided on the bottom surface of the circular plate (5). A side plate (12) is fixedly installed on the edge of the housing (1).

2. The heat dissipation structure applicable to multi-specification low-power wireless self-organizing network communication equipment according to claim 1, characterized in that, The assembly (4) includes insert plates (13). Each mounting plate (3) has an insert plate (13) fixedly connected to two side walls spaced apart. The other two side walls of the mounting plate (3) are provided with slots (14). The insert plates (13) on adjacent mounting plates (3) are inserted into the slots (14). Two side holes (15) are symmetrically opened on the side walls of the insert plates (13). A positioning rod (16) is movably connected in each side hole (15). A second spring (17) is sleeved on the positioning rod (16). The two ends of the second spring (17) are fixedly connected to the positioning rod (16) and the inner wall of the side hole (15) respectively. Two positioning grooves (18) are opened on the inner wall of the slot (14). The positioning rod (16) is matched with the positioning groove (18).

3. The heat dissipation structure applicable to multi-specification low-power wireless self-organizing network communication equipment according to claim 2, characterized in that, The positioning component (11) includes a bottom groove (19). Two bottom grooves (19) are symmetrically opened on the bottom surface of the circular plate (5). A positioning plate (20) is movably connected in each bottom groove (19). A crossbar (21) is movably connected on the positioning plate (20). The end of the crossbar (21) away from the positioning plate (20) is fixedly connected to the inner wall of the bottom groove (19). A third spring (22) is sleeved on the crossbar (21). The two ends of the third spring (22) are fixedly connected to the crossbar (21) and the positioning plate (20) respectively.

4. The heat dissipation structure applicable to multi-specification low-power wireless self-organizing network communication equipment according to claim 3, characterized in that, Both the bottom groove (19) and the positioning plate (20) are T-shaped. The positioning plate (20) is arc-shaped on the side away from the center of the circular plate (5) and is fixedly connected with an anti-slip pad (23).

5. A heat dissipation structure applicable to multi-specification low-power wireless self-organizing network communication equipment according to claim 4, characterized in that, A heat-conducting plate (24) is provided on the upper side of the heat-conducting shell (10). An arc-shaped groove (25) is provided on the opposite side of the heat-conducting plate (24) and the heat-conducting shell (10). The heat-conducting pipe (7) is provided through the arc-shaped groove (25). The heat-conducting plate (24) and the heat-conducting shell (10) are fixedly connected by a first bolt (26).

6. The heat dissipation structure applicable to multi-specification low-power wireless self-organizing network communication equipment according to claim 5, characterized in that, The side plate (12) has an L-shaped cross section, and a side groove (27) matching the insert plate (13) is provided on the inner wall of the side plate (12). The side plate (12) is fixedly connected to the housing (1) by the second bolt (28).

7. A heat dissipation structure applicable to multi-specification low-power wireless self-organizing network communication equipment according to claim 6, characterized in that, The top surface of the heat pipe (7) is arc-shaped and the bottom surface is horizontal. Several heat sinks (29) are evenly distributed and fixedly connected on the side wall of the circular plate (5).

8. A heat dissipation structure applicable to multi-specification low-power wireless self-organizing network communication equipment according to claim 7, characterized in that, A sealing ring (30) is fixedly connected to the side wall of the mounting plate (3), and two sealing rings (30) are symmetrically arranged on the top and bottom.

9. A heat dissipation structure applicable to multi-specification low-power wireless self-organizing network communication equipment according to claim 8, characterized in that, The communication device structure (2) includes a main control board (31), which is fixedly installed in the inner cavity of the housing (1). An antenna (32) is fixedly connected to one side of the housing (1), and several connectors (33) are fixedly connected to the other side of the housing (1). The connectors (33) and the antenna (32) are electrically connected to the main control board (31).

10. A heat dissipation structure applicable to multi-specification low-power wireless self-organizing network communication equipment according to claim 9, characterized in that, The bottom surface of the heat-conducting shell (10) is not sealed, and the heat-conducting shell (10) and the main control board (31) are matched and configured.

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