Precise semiconductor device production and packaging equipment

Abstract

The invention belongs to the technical field of packaging equipment, and particularly relates to precise semiconductor device production packaging equipment which comprises a conveying assembly, the top of the conveying assembly is provided with a packaging rack assembly used for installing semiconductor components, and one side of the top of the conveying assembly is fixedly connected with a vertical plate. One side wall of the vertical plate is fixedly connected with a transverse plate, the output end of the second air cylinder is used for pushing the positioning assembly to move horizontally, the positioning assembly is used for orienting the position of the semiconductor component in the packaging rack assembly, and the heating assembly is used for preheating the orientated semiconductor component and then conveying the semiconductor component to the packaging rack assembly. And then the pre-pressing assembly is used for pressing the pre-heated semiconductor component from top to bottom, so that the semiconductor component is packaged and formed, the horizontal position can be adjusted before each time of pre-pressing, and the use requirements of semiconductor components with different heights are met.

Description

[0001] This application is a divisional application of application filed on October 20, 2025, with application number 202511499450.4 and invention title "A Packaging Equipment for Semiconductor Device Production". Technical Field

[0002] This invention belongs to the field of packaging equipment technology, and specifically relates to a precision semiconductor device production packaging equipment. Background Technology

[0003] Precision semiconductor components are the fundamental building blocks of electronic technology. They play a crucial role in various electronic devices and systems. Semiconductor component packaging involves encapsulating the manufactured semiconductor chip in a protective shell through a series of sophisticated processes using packaging equipment. This aims to protect the chip from physical damage, chemical corrosion, and environmental influences. Typically, the semiconductor chip is encapsulated in a ceramic substrate, and then the two ceramic substrates are bonded together with high-strength resin and sintered to achieve the purpose of semiconductor component packaging.

[0004] A search revealed that Chinese Patent Publication No. CN118737926B, authorized on January 3, 2025, discloses a packaging equipment for precision semiconductor component processing. The equipment includes a packaging frame, a pre-pressor at the top of the frame, a thermo-pressor alignment device at the output end of the pre-pressor, and a feeder at the center of the upper surface of the frame. This packaging equipment, through the cooperation of the feeder and clamp, supports and clamps the ceramic substrate of the semiconductor component to be packaged, then moves it below the thermo-pressor alignment device to cooperate with the pre-pressor. This causes the thermo-pressor alignment device to move downwards, pre-fixing the ceramic substrate. During the pre-fixing process, the ceramic substrate is aligned to ensure proper alignment. During the thermo-pressor pre-fixing process, the resin softens rapidly upon heating and begins to cure.

[0005] However, the equipment still has the following drawbacks: although it can make the resin soften quickly and begin to cure after being heated during the hot pressing pre-fixing process, it cannot be precisely adjusted before pre-fixing semiconductor components. The feeder and clamp cannot be adjusted according to the height of the semiconductor components, and the use of the pre-pressor is prone to errors. Summary of the Invention

[0006] To address the aforementioned problems, this invention provides a precision semiconductor device manufacturing and packaging equipment, including a conveying assembly. A packaging rack assembly for mounting semiconductor components is mounted on the top of the conveying assembly. A vertical plate is fixedly connected to one side of the top of the conveying assembly, and a horizontal plate is fixedly connected to one side wall of the vertical plate. Two sets of first cylinders are mounted at the bottom of the horizontal plate, and the output ends of both sets of first cylinders are drivenly connected to linkage plates. Both sets of linkage plates are slidably connected to the outer wall of the packaging rack assembly. A pre-pressing assembly is rotatably connected to the outer wall of the packaging rack assembly, near the vertical plate. Second cylinders are fixedly connected to the outer walls of both sets of linkage plates, and the output ends of the second cylinders are drivenly connected to positioning components for orienting semiconductor components. A heating assembly for preheating the semiconductor components is also mounted on the outer wall of the packaging rack assembly.

[0007] Furthermore, the conveying assembly includes a support frame; a first crossbar is fixedly connected to the inner wall of the support frame, a feeding platform is provided on the top of the support frame, two sets of third cylinders are rotatably connected to the first crossbar, and the output ends of the two sets of third cylinders are rotatably connected to one end of the first conveying component.

[0008] Furthermore, a second crossbar is rotatably connected to the other end of the first conveying component, and four sets of diagonal braces are provided on both sides of the outer wall of the support frame, with the top ends of the four sets of diagonal braces rotatably connected to both ends of the second conveying component, and the bottom of the second conveying component not contacting the top of the feeding platform.

[0009] Furthermore, the packaging rack assembly includes a rack base; the rack base has a rectangular structure and an open top structure; a first conveying groove is provided on one side wall of the rack base, and the first conveying groove is connected to the top opening of the rack base; two sets of positioning holes are also provided on the outer side wall of the rack base, and one end of each of the two sets of positioning holes is connected to the first conveying groove.

[0010] Furthermore, the inner wall of the positioning hole is rotatably connected to both ends of the second crossbar, and the two side walls of the frame base are provided with second conveying grooves, and the two sets of second conveying grooves are interconnected with the inner wall of the frame base. The inner wall of the frame base is provided with four sets of hollow sliding cavity grooves, and the four sets of hollow sliding cavity grooves are interconnected with the second conveying grooves.

[0011] Furthermore, a number of support rollers are rotatably connected to the inner wall of the frame base on the side away from the first conveying groove, and the number of support rollers are arranged horizontally at equal intervals. A guide groove is opened on the inner wall of the frame base above the number of support rollers, and two servo motors are fixedly connected to the outer wall of the frame base on the side close to the guide groove.

[0012] Furthermore, the pre-compression assembly includes a sealing cover; a sealing plate is fixedly connected to one side of the bottom of the sealing cover, and the sealing plate is movably fitted to the inner wall of the first conveying groove; a fourth cylinder is embedded in the top of the sealing cover, and a pre-compression block is drivenly connected to the output end of the fourth cylinder; a pressure sensor is provided at the bottom of the pre-compression block; two sets of linkage blocks are fixedly connected to the outer wall of the sealing cover on the side away from the sealing plate; linkage rods are fixedly connected to the two sets of linkage blocks, and both ends of the linkage rods are drivenly connected to the output end of the servo motor.

[0013] Furthermore, the positioning component includes a scraper; a guide seat is fixedly connected to one side wall of the scraper, and a lead screw is rotatably connected to the inner wall of the guide seat; a micro motor is fixedly connected to the top of the guide seat, and one end of the lead screw is drivenly connected to the output end of the micro motor; the inner wall of the guide seat is slidably connected to the output end of the second cylinder, and the output end of the second cylinder is also threadedly connected to the lead screw; an inclined pressure plate is provided at the bottom of the scraper, and an angle is provided between the top side of the inclined pressure plate and the scraper; a right-angle plate is fixedly connected to the top of the inclined pressure plate.

[0014] Furthermore, the heating assembly includes a fifth cylinder; the output end of the fifth cylinder is drivenly connected to a top material block, and the side of the top material block away from the output end is fixedly connected to one side wall of the vertical plate.

[0015] Furthermore, a heat collection cavity is provided on the outer wall of the top material block on the side away from the output end of the fifth cylinder, and a third electric heating wire is provided on the inner wall of the heat collection cavity. A micro fan is embedded in the outer wall of the top material block on the side away from the heat collection cavity. The micro fan is connected to the heat collection cavity, and a perforated plate is movably engaged with the inner wall of the heat collection cavity.

[0016] The beneficial effects of this invention are: 1. A conveying assembly is used to sequentially transport semiconductor components into the packaging rack assembly. The output of the first cylinder drives the linkage plate to fall, which isolates the semiconductor components on the conveying assembly. Then, the output of the second cylinder pushes the positioning assembly to move horizontally, which orients the semiconductor components in the packaging rack assembly. After the oriented semiconductor components are preheated by the heating assembly, the preheated semiconductor components are pressed from top to bottom by the pre-pressing assembly to encapsulate the semiconductor components. The horizontal position can be adjusted before each pre-pressing to meet the needs of semiconductor components of different heights.

[0017] 2. The semiconductor device at the top is horizontally conveyed into the frame through the continuous operation of the second conveying component. When the semiconductor device moves to the top position of several sets of support rollers, the output end of the first cylinder drives the linkage plate to move downward, so that the linkage plate blocks the second conveying grooves on both sides. Meanwhile, the output end of the servo motor drives the sealing cover to rotate around the linkage rod, which is used to block the sealing plate to the first conveying groove, so that the semiconductor device to be packaged in the frame is in an independent space.

[0018] 3. The output end of the second cylinder pushes the scrapers on both sides, so that the inclined pressure plate and the right angle plate can be oriented and limited on both sides and top of the semiconductor device during the horizontal movement, so that the semiconductor device after being limited is at the bottom of the pre-pressing block, which facilitates the accuracy of the pre-pressing of the semiconductor device after orientation.

[0019] 4. The output end of the servo motor drives the sealing cover to rotate to the other side around the linkage rod, which is used to bring the pre-pressed packaged semiconductor device into contact with the external space. The output end of the fifth cylinder pushes the top block, so that the pre-pressed packaged semiconductor device is moved horizontally to the first conveying component. The feeding angle of the first conveying component is changed according to the extension and retraction action of the output end of the third cylinder, so as to meet the needs of the pre-pressed packaged semiconductor device to move to different quality inspection stations.

[0020] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description, claims and drawings. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the packaging device according to an embodiment of the present invention is shown. Figure 1 ; Figure 2 A schematic diagram of the packaging device according to an embodiment of the present invention is shown. Figure 2 ; Figure 3 A schematic diagram of the conveying assembly according to an embodiment of the present invention is shown; Figure 4 A schematic diagram of the packaging rack assembly according to an embodiment of the present invention is shown; Figure 5A schematic diagram of the pre-compression assembly according to an embodiment of the present invention is shown; Figure 6 A schematic diagram of the positioning component according to an embodiment of the present invention is shown. Figure 1 ; Figure 7 A schematic diagram of the positioning component according to an embodiment of the present invention is shown. Figure 2 ; Figure 8 A schematic diagram of the heating assembly according to an embodiment of the present invention is shown; Figure 9 A schematic diagram showing the installation position of the multi-stage temperature control mechanism according to an embodiment of the present invention is provided. Figure 10 A schematic diagram showing the connection between the multi-stage temperature control mechanism and the temperature sensor in an embodiment of the present invention is shown; Figure 11 A schematic diagram of the multi-stage temperature control mechanism according to an embodiment of the present invention is shown.

[0023] In the diagram: 1. Conveying assembly; 11. Support frame; 12. First crossbar; 13. Feeding platform; 14. Third cylinder; 15. First conveying component; 16. Second crossbar; 17. Diagonal tie rod; 18. Second conveying component; 19. Semiconductor device; 110. Temperature sensor; 2. Packaging frame assembly; 21. Frame base; 22. First conveying groove; 23. Positioning hole; 24. Second conveying groove; 25. Hollow sliding cavity groove; 26. Support roller; 27. Guide groove; 28. Servo motor; 29. ​​Multi-stage temperature control mechanism; 291. Main channel pipe; 292. Air pipe interface; 293. Internal threaded cylinder; 294. Rotary... 1. Replacement pipe; 295. Diverter pipe; 296. First temperature control nozzle; 297. Extension pipe; 298. Second temperature control nozzle; 3. Vertical plate; 4. Horizontal plate; 5. First cylinder; 6. Linkage plate; 7. Pre-compression assembly; 71. Sealing cover; 72. Sealing plate; 73. Fourth cylinder; 74. Pre-compression block; 75. Linkage block; 76. Linkage rod; 8. Second cylinder; 9. Positioning assembly; 91. Scraper; 92. Guide seat; 93. Micro motor; 94. Lead screw; 95. Inclined pressure plate; 96. Right angle plate; 10. Heating assembly; 101. Fifth cylinder; 102. Top material block; 103. Heat collection chamber; 104. Perforated plate. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] This invention provides a precision semiconductor device manufacturing and packaging equipment, including a conveying assembly 1; exemplarily, such as... Figure 1 and Figure 2 As shown.

[0026] The top of the conveying assembly 1 is provided with a packaging rack assembly 2 for mounting semiconductor components. A vertical plate 3 is fixedly connected to one side of the top of the conveying assembly 1, and a horizontal plate 4 is fixedly connected to one side wall of the vertical plate 3. Two sets of first cylinders 5 are provided at the bottom of the horizontal plate 4, and the output ends of the two sets of first cylinders 5 are drivenly connected to linkage plates 6. The two sets of linkage plates 6 are slidably connected to the outer side wall of the packaging rack assembly 2. A pre-pressing assembly 7 is rotatably connected to the outer side wall of the packaging rack assembly 2 near the vertical plate 3. A second cylinder 8 is fixedly connected to the outer side wall of the two sets of linkage plates 6, and the output ends of the second cylinders 8 are drivenly connected to positioning assemblies 9 for orienting semiconductor components. A heating assembly 10 for preheating semiconductor components is also provided on the outer side wall of the packaging rack assembly 2.

[0027] Specifically, the conveying assembly 1 is used to sequentially convey semiconductor components into the packaging rack assembly 2. The output end of the first cylinder 5 drives the linkage plate 6 to fall, so that the linkage plate 6 isolates the semiconductor components on the conveying assembly 1. Then, the output end of the second cylinder 8 pushes the positioning assembly 9 to move horizontally, which is used to orient the semiconductor components in the packaging rack assembly 2. After the oriented semiconductor components are preheated by the heating assembly 10, the preheated semiconductor components are pressed from top to bottom by the pre-pressing assembly 7, so that the semiconductor components are packaged and formed.

[0028] The conveying assembly 1 includes a support frame 11; for example, such as Figure 3 As shown.

[0029] The inner wall of the support frame 11 is fixedly connected to a first crossbar 12. A feeding platform 13 is provided on the top of the support frame 11. Two sets of third cylinders 14 are rotatably connected to the first crossbar 12, and the output ends of the two sets of third cylinders 14 are rotatably connected to one end of the first conveying component 15. The other end of the first conveying component 15 is rotatably connected to a second crossbar 16. Four sets of diagonal tie rods 17 are provided on both sides of the outer wall of the support frame 11, and the top ends of the four sets of diagonal tie rods 17 are rotatably connected to both ends of the second conveying component 18. The bottom of the second conveying component 18 does not contact the top of the feeding platform 13.

[0030] Furthermore, the outer wall of the second conveying component 18 is provided with several sets of rectangular mounting grooves, and the inner wall of each set of rectangular mounting grooves is provided with a semiconductor device 19. Temperature sensors 110 are embedded and installed at the corners and the center of the central axis of each set of rectangular mounting grooves. The temperature sensors 110 are distributed at different positions on the bottom of the semiconductor device 19.

[0031] The packaging rack assembly 2 includes a rack base 21; for example, such as Figure 4 As shown.

[0032] The frame base 21 has a rectangular structure, and its top is open. A first conveying groove 22 is formed on one side wall of the frame base 21, and the first conveying groove 22 communicates with the top opening of the frame base 21. Two sets of positioning holes 23 are also formed on the outer side wall of the frame base 21, and one end of each set of positioning holes 23 communicates with the first conveying groove 22. The inner wall of each positioning hole 23 is rotatably connected to both ends of the second crossbar 16. Second conveying grooves 24 are formed on both side walls of the frame base 21, and both sets of second conveying grooves 24 are connected to the inner wall of the frame base 21. The frame base 21 is interconnected. The inner wall of the frame base 21 is provided with four sets of hollow sliding cavity grooves 25, and all four sets of hollow sliding cavity grooves 25 are interconnected with the second conveying groove 24. Several sets of support rollers 26 are rotatably connected to the inner wall of the frame base 21 away from the first conveying groove 22, and the several sets of support rollers 26 are arranged horizontally at equal intervals. The inner wall of the frame base 21 is provided with a guide groove 27 above the several sets of support rollers 26. Two sets of servo motors 28 are fixedly connected to the outer wall of the frame base 21 near the guide groove 27. The inner wall of the frame base 21 is also provided with a multi-stage temperature control mechanism 29.

[0033] The multi-stage temperature control mechanism 29 includes a main channel pipe 291; for example, such as Figure 9 , Figure 10 and Figure 11 As shown.

[0034] The main channel pipe 291 is embedded in the side wall of the frame base 21. An air pipe interface 292 is provided at the end of the main channel pipe 291 and on the side away from the inner wall of the frame base 21. An internal threaded cylinder 293 is threadedly connected to the end of the main channel pipe 291 and on the side away from the air pipe interface 292. A conversion pipe 294 is threadedly connected to the top of the internal threaded cylinder 293. The internal threaded cylinder 293 is used to adjust the distance between the main channel pipe 291 and the conversion pipe 294. The other end of the conversion pipe 294 is connected to a diversion pipe 295. A first temperature control nozzle 296 is provided at the other end of the diversion pipe 295. A first electric heating wire is provided inside the first temperature control nozzle 296. Four sets of extension pipes 297 are connected to the outer wall of the first temperature control nozzle 296. A second temperature control nozzle 298 is provided at the bottom of the four sets of extension pipes 297. A second electric heating wire is provided inside the four sets of second temperature control nozzles 298.

[0035] The pre-compression component 7 includes a sealing cover 71; for example, such as Figure 5 As shown.

[0036] A sealing plate 72 is fixedly connected to one side of the bottom of the sealing cover 71, and the sealing plate 72 is movably fitted to the inner wall of the first conveying groove 22. A fourth cylinder 73 is embedded in the top of the sealing cover 71, and a pre-pressure block 74 is drivenly connected to the output end of the fourth cylinder 73. A pressure sensor is provided at the bottom of the pre-pressure block 74. Two sets of linkage blocks 75 are fixedly connected to the outer wall of the sealing cover 71 on the side away from the sealing plate 72. Linkage rods 76 are fixedly connected to the two sets of linkage blocks 75. Both ends of the linkage rods 76 are drivenly connected to the output end of the servo motor 28.

[0037] The positioning component 9 includes a scraper 91; for example, such as Figure 6 and Figure 7 As shown.

[0038] A guide seat 92 is fixedly connected to one side wall of the scraper 91, and a lead screw 94 is rotatably connected to the inner wall of the guide seat 92. A micro motor 93 is fixedly connected to the top of the guide seat 92, and one end of the lead screw is drivenly connected to the output end of the micro motor 93. The inner wall of the guide seat 92 is slidably connected to the output end of the second cylinder 8, and the output end of the second cylinder 8 is also threadedly connected to the lead screw 94. An inclined pressure plate 95 is provided at the bottom of the scraper 91, and an angle is provided between the top side of the inclined pressure plate 95 and the scraper 91. A right-angle plate 96 is fixedly connected to the top of the inclined pressure plate 95.

[0039] The heating assembly 10 includes a fifth cylinder 101; for example, such as Figure 8 As shown.

[0040] The output end of the fifth cylinder 101 is connected to a top material block 102, and the side of the top material block 102 away from the output end is fixedly connected to one side wall of the vertical plate 3. A heat collection cavity 103 is opened on the outer wall of the top material block 102 away from the output end of the fifth cylinder 101, and a third electric heating wire is provided on the inner wall of the heat collection cavity 103. A micro fan is embedded in the outer wall of the top material block 102 away from the heat collection cavity 103. The micro fan is connected to the heat collection cavity 103. A perforated plate 104 is movably engaged with the inner wall of the heat collection cavity 103.

[0041] Specifically, the continuous operation of the second conveying component 18 horizontally conveys the semiconductor device at the top to the frame base 21. When the semiconductor device moves to the top position of several sets of support rollers 26, the output end of the first cylinder 5 drives the linkage plate 6 to move downward, so that the linkage plate 6 blocks the second conveying grooves 24 on both sides. Meanwhile, the output end of the servo motor 28 drives the sealing cover 71 to rotate around the linkage rod 76, which is used to block the sealing plate 72 on the first conveying groove 22, so that the semiconductor device to be packaged in the frame base 21 is in an independent space. The output end of the second cylinder 8 pushes the scrapers 91 on both sides, so that the inclined pressure plate 95 and the right angle plate 96 can be oriented and limited on both sides and top of the semiconductor device during the horizontal movement, so that the semiconductor device after being limited is at the bottom of the pre-pressure block 74. The continuous operation of the micro fan blows on the surface of the third electric heating wire, causing high-temperature gas to form in the heat collection cavity 103. The perforated plate 104 is used to blow the high-temperature gas to different positions of the semiconductor device to be packaged. The output end of the fourth cylinder 73 pushes the pre-pressure block 74 to fall, and pre-press the preheated semiconductor device from top to bottom for pre-packaging. The output end of the servo motor 28 drives the sealing cover 71 to rotate to the other side around the linkage rod 76, which is used to bring the pre-pressed packaged semiconductor device into contact with the external space. The output end of the fifth cylinder 101 pushes the top block 102, so that the pre-pressed packaged semiconductor device is moved horizontally to the first conveying component 15. According to the extension and retraction action of the output end of the third cylinder 14, the feeding angle of the first conveying component 15 is changed to meet the needs of the pre-pressed packaged semiconductor device to move to different quality inspection stations. One end of the gas pipe interface 292 is used to inject gas into the main channel pipe 291, and the first electric heating wire in the first temperature control nozzle 296 is used to raise the temperature of the gas. The high temperature gas is first blown on the center of the central axis of the semiconductor device 19, which can effectively avoid the high temperature gas directly contacting the edge of the semiconductor device 19 with protruding pins, effectively preventing the pin temperature from being too high (leading to oxidation) and the body temperature from being insufficient. The temperature sensor at the center of the central axis of each set of rectangular mounting slots can quickly receive the temperature at the center of the semiconductor device 19, avoiding the temperature at the center of the semiconductor device 19 from being too low. The extension tube 297 can use the second temperature sensor in the second temperature control nozzle 298 to heat the top edge of the semiconductor device 19, while the temperature sensor at the corner of each set of rectangular mounting slots can quickly receive the temperature at the corner of the semiconductor device 19, avoiding damage to the pins of the semiconductor device 19 due to excessively high temperature at the center of the semiconductor device 19.

[0042] The working principle of a precision semiconductor device manufacturing and packaging equipment proposed in this invention is as follows: The semiconductor device at the top is horizontally conveyed into the frame base 21 through the continuous operation of the second conveying component 18. When the semiconductor device moves to the top position of several sets of support rollers 26, the output end of the first cylinder 5 drives the linkage plate 6 to move downward, so that the linkage plate 6 blocks the second conveying grooves 24 on both sides. Meanwhile, the output end of the servo motor 28 drives the sealing cover 71 to rotate around the linkage rod 76, which is used to block the sealing plate 72 against the first conveying groove 22, so that the semiconductor device to be packaged in the frame base 21 is in an independent space. The output end of the second cylinder 8 pushes the scrapers 91 on both sides, so that the inclined pressure plate 95 and the right angle plate 96 can be oriented and limited on both sides and top of the semiconductor device during the horizontal movement, so that the semiconductor device after being limited is at the bottom of the pre-pressing block 74. The micro fan continuously blows on the surface of the third electric heating wire, forming high-temperature gas in the heat collection cavity 103. The perforated plate 104 is used to blow the high-temperature gas to different positions of the semiconductor device to be packaged. The output end of the fourth cylinder 73 pushes the pre-pressure block 74 to fall, and the preheated semiconductor device is pre-pressed and packaged from top to bottom. The output of the servo motor 28 drives the sealing cover 71 to rotate to the other side around the linkage rod 76, which is used to bring the pre-pressed packaged semiconductor device into contact with the external space. The output of the fifth cylinder 101 pushes the top block 102, so that the pre-pressed packaged semiconductor device is moved horizontally to the first conveying component 15. According to the extension and retraction of the output of the third cylinder 14, the feeding angle of the first conveying component 15 is changed to meet the needs of the pre-pressed packaged semiconductor device to move to different quality inspection stations. Gas is injected into the main channel tube 291 through one end of the gas pipe interface 292, and the temperature of the gas is raised by the first electric heating wire in the first temperature control nozzle 296. The high temperature gas is first blown on the center of the central axis of the semiconductor device 19, which can effectively avoid the high temperature gas directly contacting the edge of the semiconductor device 19 with protruding pins, effectively preventing the pin temperature from being too high (leading to oxidation) and the body temperature from being too low. The temperature sensor at the center of the central axis of each set of rectangular mounting slots can quickly receive the temperature at the center of the semiconductor device 19, preventing the temperature at the center of the semiconductor device 19 from being too low. The extension tube 297 can utilize the second temperature sensor inside the second temperature control nozzle 298 to heat the top edge of the semiconductor device 19, while the temperature sensor at the corner of each set of rectangular mounting slots can quickly receive the temperature at the corner of the semiconductor device 19, preventing the center of the semiconductor device 19 from being damaged by excessively high temperature.

[0043] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A precision semiconductor device production packaging apparatus characterized by comprising: The device includes a conveying assembly, the top of which is provided with a packaging rack assembly for mounting semiconductor components. A vertical plate is fixedly connected to one side of the top of the conveying assembly, and a horizontal plate is fixedly connected to one side wall of the vertical plate. Two sets of first cylinders are provided at the bottom of the horizontal plate, and the output ends of the two sets of first cylinders are drivenly connected to linkage plates. The two sets of linkage plates are slidably connected to the outer wall of the packaging rack assembly. A pre-pressing assembly is rotatably connected to the outer wall of the packaging rack assembly near the vertical plate. A second cylinder is fixedly connected to the outer wall of the two sets of linkage plates, and the output ends of the second cylinders are drivenly connected to positioning assemblies for orienting semiconductor components. A heating assembly for preheating semiconductor components is also provided on the outer wall of the packaging rack assembly. The heating assembly includes a fifth cylinder. The output end of the fifth cylinder is drivenly connected to a top material block, and the side of the top material block away from the output end is fixedly connected to one side wall of the vertical plate. The packaging rack assembly includes a rack base; The inner wall of the frame base is also provided with a multi-stage temperature control mechanism; The multi-stage temperature control mechanism includes a main channel tube; the main channel tube is embedded in the side wall of the frame base, and an air pipe interface is provided at the end of the main channel tube on the side away from the inner wall of the frame base. An internal threaded cylinder is threadedly connected to the end of the main channel tube on the side away from the air pipe interface. A conversion tube is threadedly connected to the top of the internal threaded cylinder. The internal threaded cylinder is used to adjust the distance between the main channel tube and the conversion tube. The other end of the conversion tube is connected to a diversion tube. A first temperature control nozzle is provided at the other end of the diversion tube. A first electric heating wire is provided inside the first temperature control nozzle. Four sets of extension tubes are connected to the outer wall of the first temperature control nozzle. A second temperature control nozzle is provided at the bottom of the four sets of extension tubes. A second electric heating wire is provided inside the four sets of second temperature control nozzles. The pre-compression assembly includes a sealing cover; a sealing plate is fixedly connected to one side of the bottom of the sealing cover, and the sealing plate is movably fitted to the inner wall of the first conveying groove; a fourth cylinder is embedded in the top of the sealing cover, and a pre-compression block is drivenly connected to the output end of the fourth cylinder; a pressure sensor is provided at the bottom of the pre-compression block; two sets of linkage blocks are fixedly connected to the outer wall of the sealing cover on the side away from the sealing plate; linkage rods are fixedly connected to the two sets of linkage blocks, and both ends of the linkage rods are drivenly connected to the output end of the servo motor.

2. The precision semiconductor device production packaging apparatus according to claim 1, characterized by: The conveying assembly includes a support frame; a first crossbar is fixedly connected to the inner wall of the support frame, and a feeding platform is provided on the top of the support frame. Two sets of third cylinders are rotatably connected to the first crossbar, and the output ends of the two sets of third cylinders are rotatably connected to one end of the first conveying component.

3. The precision semiconductor device manufacturing and packaging equipment according to claim 2, characterized in that: The other end of the first conveying component is rotatably connected to a second crossbar. Four sets of diagonal braces are provided on both sides of the outer wall of the support frame, and the top ends of the four sets of diagonal braces are rotatably connected to both ends of the second conveying component. The bottom of the second conveying component does not contact the top of the feeding platform.

4. The precision semiconductor device manufacturing and packaging equipment according to claim 1, characterized in that: The frame base is a rectangular structure, and the top of the frame base is an open structure. A first conveying groove is provided on one side wall of the frame base, and the first conveying groove is connected to the top opening of the frame base. Two sets of positioning holes are also provided on the outer side wall of the frame base, and one end of each set of positioning holes is connected to the first conveying groove.

5. The precision semiconductor device manufacturing and packaging equipment according to claim 4, characterized in that: The inner wall of the positioning hole is rotatably connected to both ends of the second crossbar. The two side walls of the frame base are provided with second conveying grooves, and the two sets of second conveying grooves are interconnected with the inner wall of the frame base. The inner wall of the frame base is provided with four sets of hollow sliding cavity grooves, and the four sets of hollow sliding cavity grooves are interconnected with the second conveying grooves.

6. The precision semiconductor device manufacturing and packaging equipment according to claim 5, characterized in that: A number of support rollers are rotatably connected to the inner wall of the frame base on the side away from the first conveying groove, and the number of support rollers are horizontally arranged at equal intervals. A guide groove is opened on the inner wall of the frame base above the number of support rollers. Two servo motors are fixedly connected to the outer wall of the frame base on the side close to the guide groove.

7. The precision semiconductor device manufacturing and packaging equipment according to claim 1, characterized in that: The positioning component includes a scraper; a guide seat is fixedly connected to one side wall of the scraper, and a lead screw is rotatably connected to the inner wall of the guide seat; a micro motor is fixedly connected to the top of the guide seat, and one end of the lead screw is drivenly connected to the output end of the micro motor; the inner wall of the guide seat is slidably connected to the output end of a second cylinder, and the output end of the second cylinder is also threadedly connected to the lead screw; an inclined pressure plate is provided at the bottom of the scraper, and an angle is provided between the top side of the inclined pressure plate and the scraper; a right-angle plate is fixedly connected to the top of the inclined pressure plate.

8. The precision semiconductor device manufacturing and packaging equipment according to claim 1, characterized in that: A heat collection chamber is provided on the outer wall of the top material block away from the output end of the fifth cylinder, and a third electric heating wire is provided on the inner wall of the heat collection chamber. A micro fan is embedded in the outer wall of the top material block away from the heat collection chamber. The micro fan is connected to the heat collection chamber. A perforated plate is movably engaged with the inner wall of the heat collection chamber.

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