Wafer conveying and carrying manipulator

Abstract

The wafer conveying and carrying manipulator relates to the technical field of wafer production and comprises a connecting sleeve, three deflection telescopic mechanisms are arranged on the side edge of the connecting sleeve at equal angles, and the ends, away from the connecting sleeve, of the deflection telescopic mechanisms are connected with a mounting ring groove mechanism; a first driving mechanism and a second driving mechanism are arranged on the mounting ring groove mechanism, a plurality of positioning clamping frame mechanisms are arranged on the mounting ring groove mechanism, synchronous displacement moving mechanisms are arranged on the positioning clamping frame mechanisms, the synchronous displacement moving mechanisms are connected with electric suction cups, and synchronous deflection mechanisms are arranged on the positioning clamping frame mechanisms; according to the wafer edge clamping device, connection with other moving parts can be achieved through the arrangement of the connecting sleeve, wafers placed in different offset modes can be positioned in cooperation with the deflection telescopic mechanism, and meanwhile the wafers can be driven to different positions; and through the mounting ring groove mechanism, a specified number of positioning clamping frame mechanisms can be mounted, so that the safety of wafer transmission and carrying is improved.

Description

Technical Field

[0001] This invention relates to the field of wafer manufacturing technology, specifically a wafer transport and handling robot. Background Technology

[0002] In high-end manufacturing fields such as semiconductor chips and microelectromechanical systems (MEMS), wafers serve as the basic substrate and need to be frequently and precisely moved between different chambers, workstations, or carriers throughout the production line. Wafers are inherently valuable, with extremely delicate and fragile surfaces; even minor scratches, particle contamination, or breakage can lead to significant economic losses. Therefore, the performance requirements for wafer handling robots are extremely stringent. Currently, mainstream wafer handling robots mainly face the following technical bottlenecks:

[0003] Poor size adaptability and cumbersome changeover: Most robotic arms have fixed-size end effectors, with fixed positions and numbers of vacuum chucks or edge gripping points. When the production line needs to switch to wafers of different diameters or non-standard sizes, the machine must be stopped and the entire end effector replaced or complex mechanical adjustments made, severely impacting equipment uptime and production flexibility.

[0004] The single clamping method raises concerns about its reliability: The widely used pure vacuum adsorption method is susceptible to slippage or even drop during handling if there are pressure fluctuations in the vacuum system, aging of the suction cup seals, or minor unevenness on the back of the wafer. This single clamping method lacks redundant protection, posing significant safety hazards during high-speed or high-acceleration movements.

[0005] Lack of proactive adaptation and fine-tuning capability for wafer orientation: Wafers may have slight positional shifts or tilts within the carrier. Traditional robotic arms can only pick up wafers in a preset fixed posture. If not perfectly aligned with the wafer, edge collisions or only partial adsorption can easily occur during pickup, leading to wafer pickup failure or the generation of particles.

[0006] Insufficient protection of wafer edges: Some robotic arms that use edge-contact gripping do not have precise enough gripping force control, which can easily cause stress concentration or microscopic damage in sensitive areas at the wafer edges. At the same time, rigid gripping cannot compensate for the slight warpage that exists in the wafer itself.

[0007] Cleaning and Contamination Prevention Challenges: End effectors with complex mechanical structures are prone to particle accumulation and may come into unnecessary contact with the wafer surface during clamping, increasing the risk of contamination.

[0008] Therefore, there is an urgent need for an intelligent handling robot that can quickly adapt to wafers of various sizes, provide reliable fixation through both vacuum and mechanical means, possess posture self-adaptation capabilities, and maximize the protection of the wafer surface and edges. Summary of the Invention

[0009] This invention provides a wafer transport and handling robot that solves the problems mentioned in the background art.

[0010] To achieve the above objectives, the present invention provides the following technical solution:

[0011] A wafer transfer and handling robot includes a connecting sleeve. Three deflection and telescopic mechanisms are equally spaced on the side of the connecting sleeve. The end of each deflection and telescopic mechanism away from the connecting sleeve is connected to a mounting ring groove mechanism. The mounting ring groove mechanism has a first drive mechanism and a second drive mechanism. The mounting ring groove mechanism has several positioning frame mechanisms. Each positioning frame mechanism has a synchronous displacement and movement mechanism connected to an electric chuck. Each positioning frame mechanism has a synchronous deflection mechanism connected to an auxiliary edge clamping mechanism. The connecting sleeve is used for installation and connection with other moving parts. The deflection and telescopic mechanisms are used to adjust the overall height and deflection angle of the mounting ring groove mechanism. The mounting ring groove mechanism is used to install the positioning frame mechanisms. The first drive mechanism drives the synchronous displacement and movement mechanism, and the second drive mechanism drives the synchronous deflection mechanism. The synchronous displacement and movement mechanism adjusts the position of the electric chuck to accommodate wafers of different sizes. The synchronous deflection mechanism adjusts the deflection state of the auxiliary edge clamping mechanism to assist in clamping the edge of the wafer.

[0012] As a preferred embodiment of the present invention, the deflection telescopic mechanism includes a first deflection seat fixed on the connecting sleeve, the first deflection seat being rotatably connected to a first linear motor, and the end of the first linear motor away from the first deflection seat being rotatably connected to a second deflection seat.

[0013] As a preferred embodiment of the present invention, the mounting ring groove mechanism includes a mounting ring fixedly connected to the second deflection seat, and the mounting ring is provided with an annular groove and a mounting notch groove.

[0014] As a preferred embodiment of the present invention, the first driving mechanism includes a first motor base fixed to the inner side of the mounting ring, the first motor base being fixedly connected to a first motor, the output shaft of the first motor being fixedly connected to a first gear, the first gear meshing with a second gear, the second gear being fixedly connected to a first rotating retaining ring, the second gear being disposed on the inner side of the first rotating retaining ring, the first rotating retaining ring being rotatably connected to the mounting ring, and the outer side of the first rotating retaining ring being fixedly connected to a first gear ring.

[0015] As a preferred embodiment of the present invention, the second driving mechanism includes a second motor base fixed to the inner side of the mounting ring, the second motor base being fixedly connected to the second motor, the output shaft of the second motor being fixedly connected to the third gear, the third gear meshing with the fourth gear, the fourth gear being fixedly connected to the second rotating retaining ring, the fourth gear being disposed on the inner side of the second rotating retaining ring, the second rotating retaining ring being rotatably connected to the mounting ring, and the second rotating retaining ring being fixedly connected to the second gear ring.

[0016] As a preferred embodiment of the present invention, the positioning frame mechanism includes a frame, a slider fixedly connected to the frame, the width of the slider being the same as the width of the mounting notch, the slider and the mounting ring being slidably connected, and a locking bolt threadedly connected to the frame, the locking bolt passing through the frame, and the end of the locking bolt contacting the mounting ring.

[0017] As a preferred embodiment of the present invention, the synchronous displacement mechanism includes a first plate fixed to a frame, the first plate being rotatably connected to a first rotating shaft, the first rotating shaft being fixedly connected to a fifth gear and a first bevel gear, the fifth gear meshing with a first gear ring, the first bevel gear meshing with a second bevel gear, the second bevel gear being coaxially fixedly connected to a threaded rod, the threaded rod being rotatably connected to the frame, the threaded rod being threadedly connected to a displacement block, the displacement block being slidably connected to the frame, the threaded rod passing through the displacement block, and the displacement block being fixedly connected to an electric suction cup.

[0018] As a preferred embodiment of the present invention, the synchronous deflection mechanism includes a second rotating shaft rotatably connected to the frame. The second rotating shaft is coaxially and fixedly connected to a sixth gear and a third bevel gear. The sixth gear meshes with the second gear and the second gear ring. The third bevel gear meshes with a fourth bevel gear. The fourth bevel gear is coaxially and fixedly connected to the third rotating shaft. The third rotating shaft passes through a displacement block. The third rotating shaft and the displacement block are slidably connected. The third rotating shaft is rotatably connected to a second plate. The second plate is fixedly connected to the frame. The end of the third rotating shaft away from the fourth bevel gear is fixedly connected to a fifth bevel gear. The fifth bevel gear meshes with the sixth bevel gear. The sixth bevel gear is coaxially and fixedly connected to the fourth rotating shaft. The fourth rotating shaft is rotatably connected to the frame.

[0019] As a preferred embodiment of the present invention, the auxiliary clamping mechanism includes a deflection rod fixedly connected to a fourth rotating shaft, a second linear motor fixedly connected to the deflection rod, an elastic tensioning mechanism fixedly connected to the end of the second linear motor away from the deflection rod, and a conical block fixedly connected to the end of the elastic tensioning mechanism away from the second linear motor. The top of the conical block and the bottom of the electric suction cup are on the same plane.

[0020] As a preferred embodiment of the present invention, the elastic tensioning mechanism includes a tensioning sleeve fixedly connected to a second linear motor, a tensioning spring fixedly connected inside the tensioning sleeve, a reset slider fixedly connected to the tensioning spring, a reset slider and the tensioning sleeve being slidably connected, a tensioning rod fixedly connected to the reset slider, the tensioning rod passing through the tensioning sleeve, the tensioning rod and the tensioning sleeve being slidably connected, and a tension sensor provided at the end of the tensioning rod.

[0021] The present invention has the following advantages:

[0022] This wafer handling robot enhances the performance and safety of wafer handling operations in multiple dimensions through its modular and adaptive design. Its most significant advantages lie in its excellent multi-size compatibility and rapid changeover capability. By loosening the locking bolts, the operator can flexibly add, remove, and adjust the number and circumferential angle of the positioning clamping mechanism within the annular groove of the mounting ring. Multiple evenly distributed clamping points can be quickly configured to match wafers of different diameters. The motorized chuck at each clamping point can independently adjust its radial position via a synchronous displacement mechanism, ensuring that the chuck is always aligned with the optimal adsorption area on the back of the wafer. This design allows the same robot to seamlessly handle wafers of various sizes on the production line, greatly improving the equipment's versatility and production efficiency.

[0023] This robotic arm provides dual redundant fixation through vacuum adsorption and mechanical edge clamping, significantly improving handling reliability. Each gripping point is equipped with a motorized suction cup for primary fixation, while also integrating an auxiliary edge clamping mechanism driven by a synchronous deflection mechanism. When picking up a wafer, the motorized suction cup first engages, adsorbing and lifting the wafer; subsequently, the conical block of the auxiliary edge clamping mechanism deflects inward and slightly lifts under drive, providing flexible mechanical support and restraint from below the wafer edge. This "center adsorption + edge support" mode forms a double safety net. Even if there are temporary fluctuations in the vacuum system, the mechanical edge clamping can effectively prevent the wafer from slipping, making it particularly suitable for high-speed, high-acceleration, or vertical chamber handling scenarios, greatly improving safety.

[0024] Its sophisticated and compliant control and protection mechanism effectively prevents wafer damage. The elastic tensioning mechanism at the end of the auxiliary edge-clamping mechanism incorporates a tension spring and a force sensor. When the conical block contacts and supports the wafer edge, the spring is compressed to provide cushioning and avoid rigid impact. The force sensor monitors the clamping force in real time, and the control system precisely controls the movement of the second linear motor based on the feedback signal, ensuring sufficient but not excessive clamping force, perfectly protecting the wafer edge from stress damage. Furthermore, the design of the top of the conical block being flush with the bottom of the motorized chuck prevents the mechanical edge-clamping action from generating additional bending moments on the wafer.

[0025] Overall, this robotic arm boasts a high degree of integration and excellent intelligent linkage. The three deflection and telescopic mechanisms are independently adjustable, enabling the entire end effector to adapt to minute offsets or tilts of the wafer within the carrier, achieving adaptive pick-up. The first and second drive mechanisms, via gear-ring drive, synchronously and precisely drive all gripping points to coordinate their movements, ensuring operational symmetry and consistency. This design integrates flexibility, reliability, and protection, providing a high-performance automated solution for wafer handling in advanced semiconductor manufacturing. Attached Figure Description

[0026] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 This is a first-person view structural diagram of a wafer transport and handling robot.

[0028] Figure 2 This is a schematic diagram of a wafer transport and handling robot from a second-view perspective.

[0029] Figure 3 This is a partial structural diagram of a wafer transport and handling robot.

[0030] Figure 4 This is a partial structural diagram of a wafer transport and handling robot.

[0031] Figure 5 This is a cross-sectional view of an elastic tensioning mechanism in a wafer transport and handling robot.

[0032] In the diagram: 1. Connecting sleeve; 2. Deflection telescopic mechanism; 201. First deflection seat; 202. First linear motor; 203. Second deflection seat; 3. Mounting ring groove mechanism; 301. Mounting ring; 302. Annular groove; 303. Mounting notch groove; 4. First drive mechanism; 401. First motor seat; 402. First motor; 403. First gear; 404. Second gear; 405. First rotating retaining ring; 406. First gear ring; 5. Second drive mechanism; 501. Second motor seat; 502. Second motor; 503. Third gear; 504. Fourth gear; 505. Second rotating retaining ring; 506. Second gear ring; 6. Positioning frame mechanism; 601. Frame; 602. Slider; 603. Locking bolt; 7. Synchronous displacement movement mechanism 701. First plate; 702. First rotating shaft; 703. Fifth gear; 704. First bevel gear; 705. Second bevel gear; 706. Threaded rod; 707. Displacement block; 8. Electric suction cup; 9. Synchronous deflection mechanism; 901. Second rotating shaft; 902. Sixth gear; 903. Third bevel gear; 904. Fourth bevel gear; 905. Third rotating shaft; 906. Second plate; 907. Fifth bevel gear; 908. Sixth bevel gear; 909. Fourth rotating shaft; 10. Auxiliary clamping mechanism; 1001. Deflection rod; 1002. Second linear motor; 1003. Elastic tensioning mechanism; 10031. Tensioning sleeve; 10032. Tensioning spring; 10033. Reset slider; 10034. Tensioning rod; 1004. Conical block. Detailed Implementation

[0033] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0034] It should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0035] For examples, please refer to Figures 1-5 A wafer transfer and handling robot includes a connecting sleeve 1. Three deflection and telescopic mechanisms 2 are provided at equal angles on the side of the connecting sleeve 1. The end of each deflection and telescopic mechanism 2 away from the connecting sleeve 1 is connected to a mounting ring groove mechanism 3. A first drive mechanism 4 and a second drive mechanism 5 are provided on the mounting ring groove mechanism 3. Several positioning frame mechanisms 6 are provided on the mounting ring groove mechanism 3. A synchronous displacement and movement mechanism 7 is provided on the positioning frame mechanism 6. The synchronous displacement and movement mechanism 7 is connected to an electric suction cup 8. A synchronous deflection mechanism 9 is provided on the positioning frame mechanism 6. The synchronous deflection mechanism 9 is connected to an auxiliary edge clamping mechanism 1. 0; Connecting sleeve 1 is used to connect with other moving parts; deflection telescopic mechanism 2 is used to adjust the overall height and deflection angle of mounting ring groove mechanism 3; mounting ring groove mechanism 3 is used to install positioning frame mechanism 6; first drive mechanism 4 is used to drive synchronous displacement movement mechanism 7; second drive mechanism 5 is used to drive synchronous deflection mechanism 9; synchronous displacement movement mechanism 7 is used to adjust the position of electric chuck 8 to adapt to the fixing of wafers of different sizes; synchronous deflection mechanism 9 is used to adjust the deflection state of auxiliary edge clamping mechanism 10, thereby assisting in clamping the edge of the wafer.

[0036] The deflection telescopic mechanism 2 includes a first deflection seat 201 fixed on the connecting sleeve 1, the first deflection seat 201 is rotatably connected to a first linear motor 202, and the end of the first linear motor 202 away from the first deflection seat 201 is rotatably connected to a second deflection seat 203.

[0037] Specifically, by coordinating the extension and retraction lengths of the three first linear motors 202, the height and level of the mounting ring 301 can be adjusted as a whole, and even a certain tilt angle can be generated, thereby compensating for the positional deviation of the wafer in the carrier and achieving adaptive alignment.

[0038] The mounting ring groove mechanism 3 includes a mounting ring 301 fixedly connected to the second deflection seat 203. The mounting ring 301 is provided with an annular groove 302 and a mounting notch 303.

[0039] The first drive mechanism 4 includes a first motor base 401 fixed to the inner side of the mounting ring 301, a first motor 402 fixedly connected to the first motor base 401, a first gear 403 fixedly connected to the output shaft of the first motor 402, a first gear 403 meshing with a second gear 404, a first rotating retaining ring 405 fixedly connected to the second gear 404, the second gear 404 being disposed on the inner side of the first rotating retaining ring 405, the first rotating retaining ring 405 being rotatably connected to the mounting ring 301, and a first gear ring 406 fixedly connected to the outer side of the first rotating retaining ring 405. The second drive mechanism 5 includes a second motor base 501 fixed to the inner side of the mounting ring 301, a second motor 502 fixedly connected to the second motor base 501, a third gear 503 fixedly connected to the output shaft of the second motor 502, a third gear 503 meshing with a fourth gear 504, a second rotating retainer 505 fixedly connected to the fourth gear 504, the fourth gear 504 being located inside the second rotating retainer 505, the second rotating retainer 505 being rotatably connected to the mounting ring 301, and a second gear ring 506 fixedly connected to the second rotating retainer 505.

[0040] Specifically, the first drive mechanism 4 includes a first motor 402, which drives the first rotating retaining ring 405 to rotate within the mounting ring 301 via a first gear 403 and a second gear 404. A first gear ring 406 is fixed to the outer edge of the first rotating retaining ring 405. The second drive mechanism 5 includes a second motor 502, which drives the second rotating retaining ring 505 to rotate via a third gear 503 and a fourth gear 504. A second gear ring 506 is fixed to the second rotating retaining ring 505. The first and second rotating retaining rings are coaxial but operate independently.

[0041] The positioning frame mechanism 6 includes a frame 601, a slider 602 fixedly connected to the frame 601, the width of the slider 602 being the same as the width of the mounting notch 303, the slider 602 being slidably connected to the mounting ring 301, and a locking bolt 603 threadedly connected to the frame 601, the locking bolt 603 passing through the frame 601, and the end of the locking bolt 603 contacting the mounting ring 301.

[0042] Specifically, multiple positioning frame mechanisms 6 slide from the mounting notch 303 into the annular groove 302 via their sliders 602, and can slide along the annular groove 302 to any circumferential position. The frame body 601 is fixed to the mounting ring 301 by locking bolts 603. The user can select and install an appropriate number of positioning frame mechanisms 6 according to the diameter of the wafer to be transported, and evenly distribute and lock them.

[0043] The synchronous displacement and movement mechanism 7 includes a first plate 701 fixed on a frame 601, a first rotating shaft 702 rotatably connected to the first plate 701, a fifth gear 703 and a first bevel gear 704 fixedly connected to the first rotating shaft 702, the fifth gear 703 meshing with a first gear ring 406, the first bevel gear 704 meshing with a second bevel gear 705, the second bevel gear 705 coaxially fixedly connected to a threaded rod 706, the threaded rod 706 rotatably connected to the frame 601, the threaded rod 706 threadedly connected to a displacement block 707, the displacement block 707 slidably connected to the frame 601, the threaded rod 706 passing through the displacement block 707, and the displacement block 707 fixedly connected to an electric suction cup 8.

[0044] Specifically, the synchronous displacement mechanism 7 is used to radially move the electric suction cup 8. Its fifth gear 703 is constantly meshed with the first gear ring 406. When the first drive mechanism 4 drives the first gear ring 406 to rotate, the fifth gears 703 on all the positioning frame mechanisms rotate synchronously, which in turn drives the threaded rod 706 to rotate through the first bevel gear 704 and the second bevel gear 705. The displacement block 707, which meshes with the threaded rod 706, slides radially along the frame 601, thereby driving the electric suction cup 8 fixed on it to move and adjust the position of the suction point.

[0045] The synchronous deflection mechanism 9 includes a second rotating shaft 901 rotatably connected to the frame 601. The second rotating shaft 901 is coaxially and fixedly connected to a sixth gear 902 and a third bevel gear 903. The sixth gear 902 meshes with the second gear 902 and the second gear ring 506. The third bevel gear 903 meshes with a fourth bevel gear 904. The fourth bevel gear 904 is coaxially and fixedly connected to a third rotating shaft 905. The third rotating shaft 905 passes through a displacement block 707. The third rotating shaft 905 and the displacement block 707 are slidably connected. The third rotating shaft 905 is rotatably connected to a second plate 906. The second plate 906 is fixedly connected to the frame 601. The end of the third rotating shaft 905 away from the fourth bevel gear 904 is fixedly connected to a fifth bevel gear 907. The fifth bevel gear 907 meshes with a sixth bevel gear 908. The sixth bevel gear 908 is coaxially and fixedly connected to a fourth rotating shaft 909. The fourth rotating shaft 909 is rotatably connected to the frame 601.

[0046] Specifically, the synchronous deflection mechanism 9 is used to drive the auxiliary clamping action. Its sixth gear 902 is constantly meshed with the second gear ring 506. When the second drive mechanism 5 drives the second gear ring 506 to rotate, all the sixth gears 902 rotate synchronously, driving the third rotating shaft 905 to rotate through the third bevel gear 903 and the fourth bevel gear 904. The fifth bevel gear 907 at the lower end of the third rotating shaft 905 drives the sixth bevel gear 908, which ultimately drives the fourth rotating shaft 909 to rotate.

[0047] The auxiliary edge clamping mechanism 10 includes a deflection rod 1001 fixedly connected to the fourth rotating shaft 909. The deflection rod 1001 is fixedly connected to the second linear motor 1002. The end of the second linear motor 1002 away from the deflection rod 1001 is fixedly connected to the elastic tensioning mechanism 1003. The end of the elastic tensioning mechanism 1003 away from the second linear motor 1002 is fixedly connected to the conical block 1004. The top of the conical block 1004 and the bottom of the electric suction cup 8 are on the same plane. The elastic tensioning mechanism 1003 includes a tensioning sleeve 10031 fixedly connected to a second linear motor 1002, a tensioning spring 10032 fixedly connected inside the tensioning sleeve 10031, a reset slider 10033 fixedly connected to the tensioning spring 10032, a slidable connection between the reset slider 10033 and the tensioning sleeve 10031, a tensioning rod 10034 fixedly connected to the reset slider 10033, the tensioning rod 10034 passing through the tensioning sleeve 10031, a slidable connection between the tensioning rod 10034 and the tensioning sleeve 10031, and a tension sensor provided at the end of the tensioning rod 10034.

[0048] Specifically, the deflection rod 1001 of the auxiliary clamping mechanism 10 is fixed to the fourth rotating shaft 909. The cylinder of the second linear motor 1002 is fixed to the deflection rod 1001, and its push rod end is connected to the elastic tensioning mechanism 1003. Inside the elastic tensioning mechanism 1003, the tension spring 10032 is placed inside the tensioning sleeve 10031, with one end pressing against the bottom of the sleeve and the other end pressing against the reset slider 10033. The tension rod 10034 is fixed to the reset slider 10033 and extends out of the sleeve, with a conical block 1004 installed at its end. A tension sensor is integrated on the tension rod 10034. The top surface of the conical block 1004 is precision machined to ensure that when the mechanism is in the retracted state, its top surface is coplanar with the adsorption surface of the electric suction cup 8, avoiding interference with the wafer.

[0049] The workflow of this invention is as follows:

[0050] Configuration and Preparation: Determine the required number of positioning clamping mechanisms 6 based on the diameter of the wafer to be transported. Insert these mechanisms into the annular grooves 302 via the mounting notch slots 303, distribute them evenly, and then tighten the locking bolts 603. Through the control system, drive the first drive mechanism 4 to move all the electric suction cups 8 radially to the preset position, forming an adsorption ring that matches the wafer diameter.

[0051] Positioning and Pickup: The robotic arm moves the manipulator above the wafer. Three deflection and extension mechanisms 2 can fine-tune the end effector posture, ensuring that the planes of all motorized suction cups 8 are parallel and aligned with the back of the wafer. The manipulator descends, bringing all motorized suction cups 8 into contact with the back of the wafer, activating a vacuum, and firmly adhering to the wafer.

[0052] Assisted edge-clamping start (optional, for high-risk handling): After the wafer is firmly attached, the second drive mechanism 5 is activated for additional safety. The second gear ring 506 rotates, driving all deflection rods 1001 to deflect inward synchronously via the synchronous deflection mechanism 9, causing the conical block 1004 to move directly below the wafer edge. Then, each of the second linear motors 1002 operates synchronously, pushing the elastic tensioning mechanism 1003 and the conical block 1004 upward until the conical surface of the conical block 1004 gently supports the wafer edge. The tension spring 10032 provides cushioning, and the tension sensor monitors the lifting force to ensure it remains within a safe range.

[0053] Handling and Placement: Under double fixation, the robotic arm smoothly and quickly transports the wafer to the target workstation (such as the process chamber or measurement stage). Upon reaching the target position, the second linear motor 1002 retracts, causing the conical block 1004 to descend and disengage from the wafer edge. Then, the second drive mechanism 5 reverses, retracting the deflection rod 1001 to its initial position. Finally, the vacuum of the electric chuck 8 is deactivated, releasing the wafer to the target location.

[0054] Reset and Cycle: The robotic arm lifts and returns to its standby point, ready for the next handling operation. Throughout the process, all gripping points of the same type move synchronously, ensuring balanced force on the wafer.

[0055] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer transport and handling robot, comprising a connecting sleeve, characterized in that, The connecting sleeve has three deflection telescopic mechanisms at equal angles on its side. The end of each deflection telescopic mechanism away from the connecting sleeve is connected to a mounting ring groove mechanism. The mounting ring groove mechanism has a first drive mechanism and a second drive mechanism. It also has several positioning frame mechanisms, each with a synchronous displacement mechanism connected to an electric chuck. The positioning frame mechanism has a synchronous deflection mechanism connected to an auxiliary edge-clamping mechanism. The connecting sleeve is used to connect with other moving parts. The deflection telescopic mechanisms adjust the overall height and deflection angle of the mounting ring groove mechanism. The mounting ring groove mechanism is used to install the positioning frame mechanisms. The first drive mechanism drives the synchronous displacement mechanism, the second drive mechanism drives the synchronous deflection mechanism, the synchronous displacement mechanism adjusts the position of the electric chuck to accommodate wafers of different sizes, and the synchronous deflection mechanism adjusts the deflection state of the auxiliary edge-clamping mechanism to assist in clamping the wafer edges.

2. The wafer transfer and handling robot according to claim 1, characterized in that, The deflection telescopic mechanism includes a first deflection seat fixed to the connecting sleeve, the first deflection seat being rotatably connected to a first linear motor, and the end of the first linear motor away from the first deflection seat being rotatably connected to a second deflection seat.

3. The wafer transfer and handling robot according to claim 1, characterized in that, The mounting ring groove mechanism includes a mounting ring fixedly connected to the second deflection seat, and the mounting ring is provided with an annular groove and a mounting notch groove.

4. The wafer transfer and handling robot according to claim 3, characterized in that, The first drive mechanism includes a first motor base fixed to the inner side of the mounting ring, a first motor fixedly connected to the first motor base, a first gear fixedly connected to the output shaft of the first motor, the first gear meshing with a second gear, the second gear fixedly connected to a first rotating retaining ring, the second gear being located inside the first rotating retaining ring, the first rotating retaining ring and the mounting ring being rotatably connected, and a first gear ring fixedly connected to the outer side of the first rotating retaining ring.

5. The wafer transfer and handling robot according to claim 4, characterized in that, The second drive mechanism includes a second motor base fixed to the inner side of the mounting ring, a second motor fixedly connected to the second motor base, a third gear fixedly connected to the output shaft of the second motor, the third gear meshing with a fourth gear, the fourth gear fixedly connected to a second rotating retaining ring, the fourth gear being located inside the second rotating retaining ring, the second rotating retaining ring and the mounting ring being rotatably connected, and the second rotating retaining ring being fixedly connected to a second gear ring.

6. The wafer transfer and handling robot according to claim 5, characterized in that, The positioning frame mechanism includes a frame, a slider fixedly connected to the frame, the width of the slider being the same as the width of the mounting notch, the slider and the mounting ring being slidably connected, and a locking bolt threadedly connected to the frame, the locking bolt passing through the frame, the end of the locking bolt contacting the mounting ring.

7. The wafer transfer and handling robot according to claim 6, characterized in that, The synchronous displacement and movement mechanism includes a first plate fixed to the frame, a first rotating shaft rotatably connected to the first plate, a fifth gear and a first bevel gear fixedly connected to the first rotating shaft, the fifth gear meshing with a first gear ring, the first bevel gear meshing with a second bevel gear, a threaded rod coaxially fixedly connected to the second bevel gear, the threaded rod rotatably connected to the frame, the threaded rod threadedly connected to a displacement block, the displacement block slidingly connected to the frame, the threaded rod passing through the displacement block, and the displacement block fixedly connected to an electric suction cup.

8. The wafer transfer and handling robot according to claim 7, characterized in that, The synchronous deflection mechanism includes a second rotating shaft rotatably connected to the frame. The second rotating shaft is coaxially and fixedly connected to a sixth gear and a third bevel gear. The sixth gear meshes with the second gear and the second gear ring. The third bevel gear meshes with a fourth bevel gear. The fourth bevel gear is coaxially and fixedly connected to the third rotating shaft. The third rotating shaft passes through a displacement block. The third rotating shaft and the displacement block are slidably connected. The third rotating shaft is rotatably connected to a second plate. The second plate is fixedly connected to the frame. The end of the third rotating shaft away from the fourth bevel gear is fixedly connected to a fifth bevel gear. The fifth bevel gear meshes with the sixth bevel gear. The sixth bevel gear is coaxially and fixedly connected to the fourth rotating shaft. The fourth rotating shaft is rotatably connected to the frame.

9. The wafer transfer and handling robot according to claim 8, characterized in that, The auxiliary clamping mechanism includes a deflection rod fixedly connected to the fourth rotating shaft, a second linear motor fixedly connected to the deflection rod, an elastic tensioning mechanism fixedly connected to the end of the second linear motor away from the deflection rod, and a conical block fixedly connected to the end of the elastic tensioning mechanism away from the second linear motor. The top of the conical block and the bottom of the electric suction cup are on the same plane.

10. The wafer transfer and handling robot according to claim 9, characterized in that, The elastic tensioning mechanism includes a tensioning sleeve fixedly connected to a second linear motor, a tensioning spring fixedly connected inside the tensioning sleeve, a reset slider fixedly connected to the tensioning spring, a slidable connection between the reset slider and the tensioning sleeve, a tensioning rod fixedly connected to the reset slider, the tensioning rod passing through the tensioning sleeve, the tensioning rod and the tensioning sleeve being slidably connected, and a tension sensor provided at the end of the tensioning rod.

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