Chip pin supporting device and spaceflight electronic equipment

Abstract

The invention discloses a chip pin supporting device and spaceflight electronic equipment, and relates to the technical field of space test load large-scale vibration. Comprising supporting legs, a circuit board and chips, and the supporting legs are L-shaped and are installed at the edge of at least one corner of each chip; the supporting foot comprises an L-shaped groove matched with the side edge of the chip, and the L-shaped groove is connected with the side edge of the chip in a gluing mode. And the L-shaped surface is matched with the surface of the circuit board and is connected with the surface of the circuit board in a gluing manner. The supporting legs are L-shaped and are arranged at the edge of at least one corner of the chip, so that the corner edge pins of the chip, which are most easily damaged, are directly strengthened in a targeted manner, and the defect that the edges of the four corners cannot be effectively protected by the existing lead frame structure is overcome. The L-shaped supporting feet are connected in a gluing mode through the L-shaped grooves matched with the side edges of the chip, stable lateral support is provided, and micro motion of the chip is limited.

Description

Technical Field

[0001] This application relates to the field of high-level vibration technology for space test loads, and in particular to a chip pin support device and aerospace electronic equipment. Background Technology

[0002] Aerospace products are subjected to various harsh vibration environments during launch and operation, which can easily cause damage to local components, especially chip pins, which frequently break. This not only affects normal operation but also requires frequent updates and maintenance. Reusability of spacecraft has become a future development trend. Although there are currently no reports of reusable spacecraft in my country, the development of repeatable test payloads is underway. Conducting repeatable tests requires that internal components, especially fragile structures such as chip pins, possess sufficient connection rigidity and reusability.

[0003] Domestic literature (Sun Hui, Xu Shuyan, Sun Shouhong, et al. Analysis of pin fracture failure of large-size CQFP device in aerospace[J], Electronic Components and Materials, 2017, 36(2):5) mentions that chip pins of aerospace products are prone to fracture in harsh environments, and all of them are distributed at the four corners and edges of the device.

[0004] Currently, various solutions have been proposed in the industry to enhance the reliability of chip pins. For example, Chinese patent application CN201420807706.4 proposes a lead frame structure designed to enhance the pins' resistance to permanent deformation and fracture. However, this solution mainly focuses on optimizing the pin structure itself and does not provide dedicated external support and protection for the four corner edges of the chip, which have proven to be weak points in practical applications. This makes it difficult for such structures to effectively guarantee the normal operation of chip pins when facing the high-level, multi-directional vibration and shock environments experienced by aerospace products, especially the insufficient lateral and vertical support for the corner pins, failing to fundamentally solve the problem of pin fracture under complex vibration modes.

[0005] Therefore, there is an urgent need for a new type of chip pin support device that can not only effectively enhance the connection rigidity of chip pins and resist vibration and impact in various harsh environments, especially providing reinforced protection for corner areas, but also meet the reusability requirements of spacecraft, possessing good reliability and long life characteristics. Summary of the Invention

[0006] The purpose of this application is to provide a chip pin support device and aerospace electronic equipment, which can effectively enhance the connection rigidity of chip pins and resist vibration and impact in various harsh environments.

[0007] To achieve the above objectives, this application provides a chip pin support device, including pins, a circuit board, and chips. The pins are L-shaped and are installed at the edge of at least one corner of each chip. The legs include: An L-shaped groove that matches the side of the chip is connected to the side of the chip by adhesive. An L-shaped surface that matches the surface of the circuit board is attached to the circuit board surface by adhesive. At least one threaded hole for mounting a screw, through which the screw passes and is secured to the circuit board.

[0008] Preferably, the feet are mounted at the edges of the four corners of the chip.

[0009] Preferably, the width w of the L-shaped groove is 70% to 80% of the distance from the outermost pin of the chip to the outer end of the chip.

[0010] Preferably, the height h of the L-shaped groove is the same as the distance from the bottom surface of the chip to the circuit board.

[0011] Preferably, the support legs are made of steel or aluminum.

[0012] Preferably, the adhesive bonding area on the L-shaped surface and the projection area of ​​the threaded hole on the circuit board surface are arranged alternately or adjacently.

[0013] Preferably, the screw passes through the circuit board and is fixed to the back of the circuit board.

[0014] Preferably, the support legs are made of an insulating material with a high elastic modulus.

[0015] Preferably, the insulating high elastic modulus material is polyimide.

[0016] An aerospace electronic device includes the chip pin support device described in any of the above claims.

[0017] Compared to the aforementioned background technology, the L-shaped support pins are installed at at least one corner edge of the chip, directly and specifically reinforcing the most vulnerable chip corner edge pins, solving the defect of existing lead frame structures failing to effectively protect the four corner edges. These L-shaped support pins are connected by adhesive via L-shaped grooves that match the chip's side, providing stable lateral support and limiting chip micro-movements. Simultaneously, their L-shaped surfaces, which match the circuit board surface, are also connected by adhesive, providing vertical support. This invention employs a composite connection method of adhesive and screw fixing: the screws pass through threaded holes and are fixed to the circuit board. This combination of the uniform stress distribution of adhesive and the mechanical locking effect of screws significantly enhances the connection rigidity and reliability between the support pins and the circuit board. This multi-layered and composite support and fixing effectively limits the relative displacement of the chip under high vibration environments, significantly reducing the stress on the pins, thereby significantly reducing the risk of pin breakage and ensuring that the chip can still function normally under high vibration environments. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the chip pin support device provided in this application; Figure 2 A schematic diagram of the structure of the support provided in this application; Figure 3 A bottom view of the support legs provided in this application; Figure 4 This is a schematic diagram showing the width and height of the L-shaped groove provided in this application.

[0020] Among them: 1. Circuit board; 2. Chip; 21. Pin; 3. Support; 31. L-shaped groove; 32. Threaded hole; 33. L-shaped surface. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] It should be noted that the directional terms such as "upper end," "lower end," "left side," and "right side" mentioned below are defined based on the accompanying drawings in the instruction manual.

[0024] Please see Figures 1 to 2 A chip pin support device includes a circuit board 1, a chip 2 and a support pin 3. The circuit board 1 is usually flat, and the chip 2 is disposed on the circuit board 1. The relative positions of the circuit board 1 and the chip 2 are fixed, and the two are electrically connected to achieve corresponding functions.

[0025] The support leg 3 is L-shaped and is located on the circuit board 1, and is installed at the edge of at least one corner of each chip 2. The support leg 3 includes two limiting bodies, which are set at an angle and are connected by a connecting post. The connecting post can be a cylinder, and the support leg 3 can be integrally formed.

[0026] By using a cylinder to connect the two limiting bodies, stress concentration at the connection point is effectively avoided, improving the structural stability of the support leg 3. At the same time, the connection between the two limiting bodies is smooth, preventing scratches on the circuit board 1 and chip 2 during use and improving the performance.

[0027] The support leg 3 includes an L-shaped groove 31 that matches the side of the chip 2 and an L-shaped surface 33 that matches the surface of the circuit board 1. The L-shaped groove 31 is connected to the side of the chip 2 by adhesive. The L-shaped surface 33 is the bottom surface of the support leg 3 and is connected to the surface of the circuit board 1 by adhesive. For each limiting body, it has a stepped structure. The bottom surface of the L-shaped groove 31 can be regarded as the surface of one step of the stepped structure, and the surface of the other step of the stepped structure is the top surface of the support leg 3. The groove wall of the L-shaped groove 31 has a preset thickness, and the top surface of the groove wall of the L-shaped groove 31 is the top surface of the support leg 3.

[0028] The wall of the L-shaped groove 31 can fit against the side wall of the chip 2, and the bottom surface of the L-shaped groove 31 fits against the bottom of the chip 2 to support the chip 2.

[0029] Please refer to Figure 3 The connecting post is provided with at least one threaded hole 32 for mounting a screw, which passes through the threaded hole 32 and is fixed to the circuit board 1.

[0030] The main components of this solution include a support leg 3, a circuit board 1, and a chip 2. The support leg 3 has an L-shaped structure and is installed at at least one corner edge of each chip 2. The L-shaped support leg 3 has an internal L-shaped groove 31 that matches the side of the chip 2, achieving a stable connection with the side of the chip 2 via adhesive bonding. Specifically, the bottom surfaces of the two limiting bodies' L-shaped grooves 31 respectively abut the bottom of different sides of the chip 2, effectively supporting the chip 2, while the groove walls of the two limiting bodies' L-shaped grooves 31 abut the side walls of the chip 2, ensuring the stability of the chip 2's position. The bottom of the support leg 3 has an L-shaped surface 33 that matches the surface of the circuit board 1, and this L-shaped surface 33 is also connected to the surface of the circuit board 1 via adhesive bonding. For further enhancement of the fixing effect, please refer to... Figure 3 The support leg 3 is also provided with at least one threaded hole 32 for mounting screws. The screws pass through the threaded hole 32 and are finally fixed to the circuit board 1. This can enhance the connection rigidity between the chip and the circuit board, reduce the stress on the pin supports, prevent the pins at the four corners from breaking, reduce losses, save costs, and enable the repeatability of test loads.

[0031] See attached document Figure 1 The support foot 3 can be installed on the edge of at least one corner of the chip 2. In a preferred embodiment, to provide comprehensive support and protection, the L-shaped support foot 3 of the present invention is deployed at the edges of all four corners of the chip 2. This all-around support design can maximize the lateral and vertical stability of the corner pins of the chip 2, effectively resist external impacts and vibration stresses from different directions, thereby significantly improving the overall reliability and durability of the chip 2 on the circuit board 1.

[0032] In some embodiments, refer to the appendix Figure 1 , Figure 2 , Figure 4 The width w of the L-shaped groove 31 is 70% to 80% of the distance from the outermost pin 21 of chip 2 to the outermost end of chip 2. This width w of the L-shaped groove 31 is set between 70% and 80% of the distance from the outermost pin 21 of chip 2 to the outermost end of chip 2. This ensures that the L-shaped groove 31 can effectively cover and support the outermost pin area, providing sufficient protection while avoiding over-design that could lead to excessively large pin sizes or interference with other components, thus achieving a good balance between performance and structural dimensions.

[0033] The height h of the L-shaped groove 31 is consistent with the distance from the bottom surface of the chip 2 to the circuit board 1. In other embodiments, the height h of the L-shaped groove 31 is precisely matched. The height h of the L-shaped groove 31 is designed to be exactly the same as the vertical distance from the bottom surface of the chip 2 to the circuit board 1. This height design ensures that the L-shaped support 3 can tightly fill the space between the bottom of the chip 2 and the circuit board 1, thereby providing the most stable vertical support for the chip pin area. This effectively prevents the chip pins from bending, deforming, or desoldering under vertical pressure, significantly improving the stability and reliability of the chip connection.

[0034] In some embodiments, the material of the support leg 3 is steel or aluminum. In some embodiments, the material of the support leg 3 can be selected according to specific needs, such as steel or aluminum. Steel is suitable for applications with stringent support requirements due to its high strength and rigidity, while aluminum is the preferred material for applications with specific requirements for weight or heat dissipation due to its lightweight, good thermal conductivity and ease of processing.

[0035] The adhesive bonding area on the L-shaped surface 33 and the projection area of ​​the threaded hole 32 on the surface of the circuit board 1 are arranged alternately or adjacently. In some embodiments, the connection layout between the support and the circuit board is optimized. Specifically, the adhesive bonding area on the L-shaped surface 33 and the projection area of ​​the threaded hole 32 on the surface of the circuit board 1 are designed to be arranged alternately or adjacently. This layout ensures that the two fixing methods, adhesive and screw, can work together effectively to maximize their fixing effect, avoid mutual interference, and thus significantly improve the overall stability and reliability of the device.

[0036] The screw penetrates through the circuit board 1 and is fixed to the back of the circuit board 1. To further enhance the mechanical fixing effect, in some embodiments, the screw is designed to penetrate through the circuit board 1 and ultimately be fixed to the back of the circuit board 1. This method provides a robust mechanical lock that can withstand greater tensile and shear forces, thereby ensuring that the support leg 3 can still be firmly connected to the circuit board 1 in harsh working environments, providing durable and reliable support and protection for the chip 2.

[0037] When a short circuit occurs between pin 21 and pin 3, an insulating high-elastic-modulus material such as polyimide can be selected. Pin 3 is made of an insulating high-elastic-modulus material, specifically polyimide. In some embodiments, to eliminate potential electrical failure risks, especially when pin 3 may accidentally contact chip pin 21, selecting a material with insulating properties for pin 3 is crucial. While traditional metal materials (such as steel or aluminum) have high strength, such contact can directly lead to a short circuit, causing device malfunction or component damage. Therefore, in some embodiments, the material of pin 3 is preferably an insulating high-elastic-modulus material, such as polyimide. Polyimide not only possesses excellent electrical insulation properties, effectively isolating the circuit and preventing accidental current flow; its high elastic modulus also ensures that the pin provides sufficient rigidity support when subjected to severe vibration and impact, maintaining structural stability, thereby providing comprehensive mechanical protection and electrical safety under extreme operating conditions.

[0038] The effectiveness of the chip pin support device mentioned in this invention in reducing the load during random vibration was verified by experiments.

[0039] The sinusoidal and random vibration conditions of reusable aerospace products are generally quite large. Even with vibration isolators in place to reduce the stress from random vibration loads, and considering that the vibration isolators typically amplify the resonance peak by 3 to 5 times, their resonant frequency cannot be designed too low, generally set to no less than 160Hz, to avoid sinusoidal vibration conditions. Based on this, the traditional method of reinforcing chip pins using adhesive dispensing is defined as the conventional method, while the novel method of reinforcing chip pins using the pin support device of this invention is defined as the novel method. Vibration tests were conducted, and the results are shown in Table 1.

[0040] Table 1. Stress test results of chips under traditional and new methods.

[0041] As shown in Table 1, under the traditional method of adhesive reinforcement, the chip stress reaches a maximum of 94.5 MPa, which far exceeds the tensile strength of the pins. However, under the new method of using the pin support device of this invention, the chip stress is reduced to a maximum of 9 MPa and a minimum of 1.8 MPa. The stress is more than 10 times smaller than that of the traditional method, and it can resist the random vibration conditions of the identification level. The effect is significantly better than that of the traditional method.

[0042] The present invention also discloses an aerospace electronic device, which may include the chip pin support device described in any of the above embodiments.

[0043] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0044] The chip pin support device and aerospace electronic equipment provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the solution and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A chip pin support device, characterized in that, It includes a support (3), a circuit board (1), and a chip (2), wherein the support (3) is L-shaped and is installed at the edge of at least one corner of each chip (2); The support leg (3) includes: An L-shaped groove (31) that matches the side of the chip (2) is connected to the side of the chip (2) by adhesive bonding. An L-shaped surface (33) that matches the surface of the circuit board (1) is connected to the surface of the circuit board (1) by adhesive bonding. At least one threaded hole (32) for mounting a screw, through which the screw passes and is secured to the circuit board (1).

2. The chip pin support device as described in claim 1, characterized in that, The feet (3) are installed at the edges of the four corners of the chip (2).

3. The chip pin support device as described in claim 1, characterized in that, The width w of the L-shaped groove (31) is 70% to 80% of the distance from the outermost pin (21) of the chip (2) to the outer end of the chip (2).

4. The chip pin support device as described in claim 1, characterized in that, The height h of the L-shaped groove (31) is the same as the distance from the bottom surface of the chip (2) to the circuit board (1).

5. A chip pin support device as described in claim 1, characterized in that, The material of the support leg (3) is steel or aluminum.

6. The chip pin support device as described in claim 1, characterized in that, The adhesive bonding area on the L-shaped surface (33) and the projection area of ​​the threaded hole (32) on the surface of the circuit board (1) are arranged alternately or adjacently.

7. A chip pin support device as described in claim 1, characterized in that, The screw passes through the circuit board (1) and is fixed to the back of the circuit board (1).

8. The chip pin support device as described in claim 1, characterized in that, The material of the support leg (3) is an insulating high elastic modulus material.

9. A chip pin support device as described in claim 8, characterized in that, The insulating high-elasticity modulus material is polyimide.

10. An aerospace electronic device, characterized in that, Includes the chip pin support device according to any one of claims 1-9.

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