Wafer processing operation platform and wafer edge die peeling device

Abstract

A wafer processing operation platform and a wafer edge die peeling device belong to the technical field of semiconductor device processing technology, the wafer processing operation platform, including the seat body, the clamping mechanism is arranged on the seat body, the seat body has the placing pad plate, the application, the blue film is abutted on the placing pad plate, a pair of synchronous moving side clamping plates are arranged on the clamping mechanism, the side clamping plates are used for limiting the circumferential side of the ring piece in application, a pair of pressing plates are further arranged on the clamping mechanism, and the pressing plates are abutted on the outer wall of the ring piece in application.The wafer edge die peeling device includes a connecting mechanism, and the connecting mechanism is used for peeling the incomplete die at the edge of the wafer.The present application improves the peeling efficiency of the incomplete die, and can avoid the displacement of the complete die during peeling.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device processing technology, and in particular to a wafer processing operation table and a wafer edge die stripping device. Background Technology

[0002] like Figure 10 The diagram shows a diced wafer disk. The wafer disk includes a ring 40, a blue film 41 attached to the ring 40, and a wafer 42 attached to the blue film 41. Before dicing, the wafer 42 and the ring 40 are concentric. After dicing, the wafer 42 has multiple complete dies 421 and multiple incomplete dies 420, with the incomplete dies 420 located at the edge of the wafer 42. These diced dies are usually bonded to the lead frame or substrate using a core-bonding machine. However, the presence of multiple incomplete dies 420 at the edge of the diced wafer 40 affects the bonding operation. Therefore, tweezers or a suction nozzle are often used to peel off the edge dies before bonding. Tweezers are suitable for larger dies, while suction nozzles are suitable for smaller dies. In some applications, automated equipment for peeling off incomplete dies 420 is used, but this equipment is expensive.

[0003] Manually peeling the edge grains presents a problem: it can easily cause the position of the intact grain 421 to shift, affecting subsequent core bonding operations. Furthermore, the peeling process typically involves placing the grain on a workbench, which presents a significant challenge. When separating the grain from the blue film, the grain needs to be pulled outwards, and this pulling force can easily cause localized deformation of the blue film. This deformation can even lead to positional shifts in grains closer to the incomplete grain 420. Additionally, the operator needs to apply pressure to the ring 40 during peeling to facilitate the detachment of the incomplete grain 420 from the blue film 41, further complicating the grain separation process. While some methods, such as heating or ultraviolet irradiation, reduce the adhesive strength of the blue film to facilitate grain peeling, this also introduces another problem: it can easily cause the position of the intact grain 421 to change. Summary of the Invention

[0004] This invention provides a wafer processing operating table and a wafer edge die stripping device to overcome the shortcomings of the prior art and solve the problems of low efficiency and easy displacement of intact dies during the stripping process.

[0005] In order to achieve the objectives of this invention, the following technologies are proposed:

[0006] One aspect provides a wafer processing worktable, including a base, on which a clamping mechanism is provided;

[0007] The base has a placement pad, and the blue film rests against the placement pad during use;

[0008] The clamping mechanism has a pair of synchronously moving side clamps, which limit the circumference of the ring part during application.

[0009] The clamping mechanism also has a pair of pressure plates, which abut against the outer wall of the ring during application.

[0010] Furthermore, the inner end of the side clamping plate is formed with a clamping arc plate, and in application, the inner wall of the clamping arc plate abuts against the circumference of the ring.

[0011] Furthermore, the inner end of the pressure plate is formed with an arc-shaped pressure member with a semi-circular structure. In application, the inner wall of the arc-shaped pressure member abuts against the blue film area located between the wafer and the annular part.

[0012] Furthermore, a rotating block is formed on the outer end of the pressure plate, and hinge shafts are fixed at both ends of the rotating block. The pressure plate rotates around the hinge shafts.

[0013] Furthermore, as the pressure plate moves toward the ring, the side clamps move synchronously toward the circumference of the ring, so that the pressure plate abuts against the outer wall of the ring, and the side clamps abut against the circumference of the ring.

[0014] On the other hand, a wafer edge die stripping device is provided, including a connecting mechanism connected to a placement pad on a wafer processing worktable;

[0015] The connecting mechanism has an abutment plate, and an inner pad with the same outer contour is fixed on the inner side of the abutment plate. The outer periphery of the abutment plate has a rectangular sawtooth structure, and the inner side of the inner pad abuts against the outer end face of the wafer.

[0016] A peeling member is fitted around the outer periphery of the abutment plate. A connecting inner plate is provided at the outer end of the peeling member. A pair of separating members are symmetrically formed on the outer periphery of the peeling member. The inner ends of the peeling member and the separating member have a blade-shaped structure. The peeling member, the connecting inner plate and the separating member have cutting seams along the width direction of the separating member, so that the peeling member, the connecting inner plate and the separating member are separated into two mutually symmetrical parts.

[0017] Furthermore, the connecting mechanism includes a pair of side plates, each with a connecting end plate formed by bending inward at both ends. One connecting end plate is connected to a placement pad, and the other connecting end plate is fixed with a pair of connecting screws. A horizontal plate is fitted onto the connecting screws, and a pair of seventh slots are opened at both ends of the horizontal plate. The connecting screws pass through the seventh slots, and an inner extension plate is fixed to the other end of the connecting screws. A pair of eighth slots are opened at the inner end of the inner extension plate, and a second moving rod is movably installed in the eighth slots. A concave arm is fixed on the second moving rod, and movable notches are opened at both ends of the concave arm. The inner extension plate passes through the movable notches, and a first lead screw is connected to the concave arm. A first rotating cap is provided at the outer end of the first lead screw, and the inner end of the first lead screw is rotatably mounted on the horizontal plate.

[0018] Furthermore, an inner tube is fixed to the inner side of the horizontal plate, and a ninth strip-shaped hole is opened on the outer periphery of the inner tube. A third moving rod is movably installed in the ninth strip-shaped hole. An inner ring is connected to the inner end of the third moving rod. The inner ring is located inside the inner tube. A second lead screw is connected inside the inner ring. A second rotating cap is formed on the outer end of the second lead screw. The outer end of the second lead screw is rotatably mounted on the horizontal plate. The second rotating cap is located on the outer side of the horizontal plate. A sleeve is connected to the third moving rod. The sleeve is fitted onto the inner tube. An abutment plate is fixed to the inner end of the inner tube.

[0019] Furthermore, an inner plate is fixed to the inner end of the sleeve, and constraint holes are respectively opened at both ends of the inner plate. A fourth moving rod is movably installed in the constraint holes. The inner end of the fourth moving rod is fixed to the connecting inner plate. The connecting inner plate is sleeved on the sleeve and is located outside the abutment plate. The inner end of each pair of fourth moving rods is connected to a part of the connecting inner plate. The outer end of each pair of fourth moving rods is connected to a movable end plate. The movable end plate is located outside the inner plate. A fixed inner block is formed on the movable end plate. Push-pull side plates are fixed on both sides of the fixed inner block. An inclined movable elongated hole is opened on the push-pull side plate. A movable arm is movably installed between each pair of push-pull side plates. A pair of movable wheels are rotatably installed on the outer end of the movable arm. The movable wheels move in the movable elongated hole. A movable ring is fixed to the inner end of the movable arm and is sleeved on the sleeve.

[0020] The advantages of the above technical solution are:

[0021] In this invention, during the peeling of incomplete grains, an arc-shaped clamping plate constrains the circumference of the ring component, and a rotating pressure plate limits the outer wall of the ring component, facilitating grain peeling by the operator. To prevent deformation of the blue film or displacement of the complete grain position during peeling, an arc-shaped pressure member is also provided on the inner end of the pressure plate. When constraining the ring component using the arc-shaped clamping plate and pressure plate, the ring component is centered and clamped by moving the pressure plate. Furthermore, to prevent the presence of the pressure plate and the arc-shaped clamping plate from affecting the placement of the ring component, they are designed to be rotatable.

[0022] In another aspect, this invention improves the efficiency of grain stripping and limits the intact grains during stripping by using an abutment plate to prevent displacement of the intact grains. Furthermore, when stripping incomplete grains, two relatively movable stripping and separating members push the incomplete grains outwards, thus improving the efficiency of incomplete grain stripping. Attached Figure Description

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will now be described in further detail with reference to the accompanying drawings.

[0024] Figure 1 A three-dimensional structural diagram of the wafer processing worktable and the wafer edge grain stripping device after connection is shown.

[0025] Figure 2 A three-dimensional structural diagram of the base is shown.

[0026] Figure 3 A three-dimensional structural diagram of the clamping mechanism from a first-person perspective is shown.

[0027] Figure 4 A three-dimensional structural diagram of the clamping mechanism from a second perspective is shown.

[0028] Figure 5 A schematic diagram of the connection between the moving plate and the inner end plate is shown.

[0029] Figure 6 A three-dimensional structural diagram of the connecting mechanism from a first-person perspective is shown.

[0030] Figure 7 A three-dimensional structural diagram of the connecting mechanism from a second perspective is shown.

[0031] Figure 8 A three-dimensional structural diagram of the glass edge grain component in a wafer edge grain stripping device is shown.

[0032] Figure 9 A detailed illustration of the glass edge grain component in a wafer edge grain stripping device is shown.

[0033] Figure 10 A diagram showing the wafer after dicing is provided.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1. Base body; 2. Clamping mechanism; 3. Connecting mechanism; 10. Base; 11. Vertical arm; 12. Support protrusion; 13. Rotating shaft; 14. Rotating arm; 15. First strip hole; 16. Boss; 17. Strip groove; 18. Placement pad; 181. Window; 180. Groove; 200. Guide rail; 201. Sliding sleeve; 202. Side clamping plate; 203. Concave part; 204. Protruding plate; 205. Second strip hole; 206. Third strip hole; 207. Guide rod; 208. Lower end plate; 209. Movable plate; 21. Guide sleeve. 0, First spring 211, Inner extension arm 212, Connecting arm 213, Rotating roller 214, Inner end plate 215, Side plate 216, Fifth strip hole 217, First moving rod 218, Movable clamping plate 219, Insert rod 220, Outer end plate 221, Second spring 223, Hinge shaft 224, Rotating block 225, Pressure plate 226, Arc-shaped pressure piece 227, Blade 228, Push-pull arm 229, Moving plate 230, Outer protrusion 232, Sixth strip hole 233, Limit screw 23 4. Limiting component 235, side clamping plate 300, connecting end plate 301, connecting screw 302, inner extension plate 303, eighth strip hole 304, second moving rod 305, concave arm 306, movable notch 307, first lead screw 308, first rotating cap 309, horizontal plate 310, seventh strip hole 311, inner tube 312, third moving rod 313, inner ring 314, second lead screw 315, second rotating cap 316, ninth strip hole 317, sleeve 318, inner plate 319 Constraint hole 320, fourth moving rod 321, connecting inner plate 322, peeling part 323, separating part 324, abutting plate 325, inner pad layer 326, moving ring 327, holding rod 328, third spring 329, moving arm 330, inner shaft 331, moving wheel 332, moving end plate 333, fixed inner block 334, push-pull side plate 335, moving elongated hole 336, circular ring part 40, blue film 41, wafer 42, incomplete grain 420, complete grain 421. Detailed Implementation

[0036] Example 1

[0037] like Figure 1 As shown, a wafer processing workbench includes a base 1, on which a clamping mechanism 2 is provided.

[0038] like Figure 2As shown, the base 1 includes a base 10. Vertical arms 11 are fixed to opposite sides of the base 10 by screws. A rotating shaft 13 is rotatably provided at the upper end of the vertical arm 11. A rotating arm 14 is sleeved on the inner end of the rotating shaft 13. A first strip hole 15 is opened on the rotating arm 14 parallel to its length direction. A strip groove 17 is proportionally enlarged on the inner side of the first strip hole 15. An inner plate is provided on the inner end of the rotating shaft 13. The rotating shaft passes through the first strip hole 15. The inner plate is located in the strip groove 17. The rotating arm 14 is located inside the vertical arm 11. A boss 16 is formed on the outer wall of the other end of the rotating arm 14. A supporting protrusion 12 is formed on the inner side of the vertical arm 11. A placement pad 18 is fixed to the other end of the rotating arm 14 by screws. Windows 181 are opened on opposite sides of the placement pad 18. Grooves 180 are opened on opposite sides of the bottom of the placement pad 18.

[0039] like Figures 3 to 5 As shown, the clamping mechanism 2 includes a pair of guide rails 200 fixed to the back of the placement pad 18 by screws. The guide rails 200 are located at the window 181. A sliding sleeve 201 is slidably provided on the guide rails 200. A side clamping plate 202 is fixed to one end of the sliding sleeve 201. The side clamping plate 202 is located on the front side of the placement pad 18. A clamping arc plate is formed on the inner end of the side clamping plate 202. A concave member 203 is also fixed on the sliding sleeve 201. A convex plate 204 is formed on the concave member 203. A second strip hole 205 is provided on the convex plate 204. The end of the second strip hole 205 near the concave member 203 extends inward at an incline. The other end of the second strip hole 205 is connected to a third strip hole 206. The length direction of the third strip hole 206 is parallel to the length direction of the convex plate 204.

[0040] Two sets of guide rods 207 are fixed on opposite sides of the bottom of the pad 18. The other end of each set of guide rods 207 is fixed to a lower end plate 208 by a nut. A movable plate 209 is movably mounted on each set of guide rods 207. A guide sleeve 210 is fitted on the guide rod 207 and fixed to the movable plate 209 by screws. A first spring 211 is fitted on the guide rod 207. One end of the first spring 211 abuts against the lower end plate 208, and the other end of the first spring 211 abuts against the movable plate 209. A pair of inner extension arms 212 are fixed on the movable plate 209. A rotating roller 214 is rotatably mounted on the inner end of the inner extension arm 212. The rotating roller 214 moves within the second strip hole 205 and the third strip hole 206. A connecting arm 213 is fixed between the inner extension arms 212 on the same side.

[0041] A push-pull arm 229 is fixed to the movable plate 209. The push-pull arm 229 passes through the window 181 and the guide rail 200. The other end of the push-pull arm 229 is fixed to an outer end plate 221 by screws. An L-shaped side plate 216 is fixed to the outer end plate 221 by screws. An inner end plate 215 is fixed to the side plate 216 by screws. The push-pull arm 229 passes through a notch on the outer side of the inner end plate 215. A pair of fifth strip holes 217 are provided on the side plate 216. The length direction of the fifth strip holes 217 is parallel to the length direction of the push-pull arm 229. A first moving rod 218 passes through the fifth strip holes 217. A movable section is provided between the side plates 216. The movable plate 219 has a concave structure. The inner end of the first moving rod 218 is threaded to both sides of the movable plate 219. A pair of insert rods 220 are threaded to the movable plate 219. The inner end of the side plate 216 is rotatably provided with a hinge shaft 224. The inner end of the hinge shaft 224 is formed with a rotating block 225 with a rectangular end face. The rotating block 225 is located between the side plates 216. A pair of insertion holes are opened on the adjacent sides of the rotating block 225. The rotating block 225 is formed with a pressure plate 226. The inner end of the pressure plate 226 is formed with an arc-shaped pressure member 227 with a semi-circular structure. The inner peripheral wall of the arc-shaped pressure member 227 is attached with a release film. The inner peripheral of the arc-shaped pressure member 227 is formed with a blade 228.

[0042] A pair of through rods are threaded through the movable plate 219. The two ends of the through rods are respectively threaded to the outer end plate 221 and the inner end plate 215. A second spring 223 is sleeved on the through rod. One end of the second spring 223 abuts against the inner side of the outer end plate 221, and the other end of the second spring 223 abuts against the movable plate 219.

[0043] The inner end plate 215 has external protrusions 232 formed on both sides of the notch. The outer side of the external protrusions 232 abuts against the L-shaped limiting member 235. The inner end of the limiting member 235 has a movable plate 230 formed. A pair of sixth strip holes 233 are opened on the movable plate 230 parallel to its length direction. A limiting screw 234 passes through the sixth strip hole 233. The end cap on the limiting screw 234 is located on the outer side of the movable plate 230. The inner end of the limiting screw 234 is connected to the placement pad 18 by thread.

[0044] In this embodiment, tweezers or a suction nozzle are used to peel off the incomplete grains 420, and the peeling operation is completed through the following steps.

[0045] Step 100: First, ensure that the placement pad 18 is in a flat position. In this position, the rotating arm 14 is in a vertical position, and the lower end of the boss 16 abuts against the upper end surface of the vertical arm 11.

[0046] Step 101: The operator places the diced wafer on the placement pad 18. During placement, it is necessary to ensure that the ring 40 is located between the clamping arc plates, and that one side of the blue film 41 is in contact with the placement pad 18. The length direction of the placement pressure plate 226 is perpendicular to the surface of the placement pad 18. Under the elastic force of the second spring 223, the insertion rod 220 is kept inserted into a pair of insertion holes on one side of the rotating block 225 to avoid interference with the placement of the wafer or the rotation of the pressure plate 226 affecting the placement operation.

[0047] Step 102: The operator rotates the rotating block 225 so that the length direction of the pressure plate 226 is parallel to the surface where the pad 18 is placed. While rotating, the operator first pulls the insertion rod 220 outward. After rotating to the correct position, the operator inserts the insertion rod 220 into another pair of insertion holes. In this way, the posture of the pressure plate 226 is locked.

[0048] In step 103, the operator pushes the outer end plate 221, push-pull arm 229, and movable plate 209 inward to move along the axial direction of guide rod 207. During the movement, the outer end plate 221 moves toward the placement pad 18, and the first spring 211 is gradually compressed. When the movable plate 209 moves, the rotating roller 214 will first move in the second strip hole 205. As the rotating roller 214 moves, the protruding plate 204, sliding sleeve 201, and clamping arc plate will move inward. When the rotating roller 214 moves from the second strip hole 205 to the third strip hole 206, the inner circumference of the clamping arc plate will abut against the outer circumference of the ring 40.

[0049] In step 104, the operator continuously presses the outer end plate 221, causing the roller 214 to move within the third strip hole 206. During the movement, the inner side of the pressure plate 226 abuts against the outer wall of the ring 40, and the release film of the arc-shaped pressure member 227 abuts against the blue film 41 area located between the wafer 42 and the ring 40. Furthermore, there is a gap between the inner circumference of the arc-shaped pressure member 227 and the outer circumference of the wafer 42.

[0050] In step 105, the operator pushes the moving plate 230 inward so that the limiting member 235 abuts against the outside of the outer protrusion 232 to lock the movement of the outer end plate 221. At this time, the first spring 211 is compressed to provide power for automatic release from the clamping in the subsequent release.

[0051] In step 106, the operator then uses tweezers or a suction nozzle to peel off the incomplete grains 420. During peeling, the blue film 41 and other components are fixed in place, thus facilitating the peeling operation. Furthermore, during the peeling process, the blue film 41 is constrained by the arc-shaped pressure member 227, thereby preventing deformation of the blue film 41.

[0052] Step 107: Pull the placement pad 18 and the rotating arm 14 upwards, and rotate the placement pad 18 to a vertical position, with the upper wall of the supporting protrusion 12 abutting against the lower side of the rotating arm 14.

[0053] Step 108: Clean the residue from the wafer disk after the incomplete grains 420 have been removed.

[0054] Step 109: Rotate the placement pad 18 to a horizontal position, release the clamp on the ring part 40, etc., and then remove it.

[0055] Example 2

[0056] like Figure 1 and Figure 6 As shown, a wafer edge die stripping device includes a connecting mechanism 3 disposed on the wafer processing operating table provided in Embodiment 1, and the connecting mechanism 3 is connected to the placement pad 18.

[0057] like Figures 6 to 9 As shown, the connecting mechanism 3 includes a pair of side plates 300. Each end of the side plates 300 is bent inward to form a connecting end plate 301. A pair of connecting screws 302 are threaded onto the other connecting end plate 301. A horizontal plate 310 is fitted onto each connecting screw 302. A pair of seventh slots 311 are formed at each end of the horizontal plate 310. The length direction of the seventh slots 311 is parallel to the length direction of the horizontal plate 310. The connecting screws 302 pass through the seventh slots 311. An inner extension plate 303 is threaded onto the other end of the connecting screw 302. The inner end of the inner extension plate 303 has a... A pair of eighth strip-shaped holes 304 are parallel to its length direction. A second moving rod 305 is movably installed in the eighth strip-shaped hole 304. A concave arm 306 is fixed on the second moving rod 305. Movable notches 307 are opened at both ends of the concave arm 306. An inner extension plate 303 passes through the movable notch 307. A first lead screw 308 is threadedly connected to the concave arm 306. A first rotating cap 309 is provided at the outer end of the first lead screw 308. A pair of limiting rings are fixed at the inner end of the first lead screw 308 by a pin. The limiting rings are located on the inner and outer sides of the horizontal plate 310. The inner end of the first lead screw 308 is rotatably mounted on the horizontal plate 310.

[0058] An inner tube 312 is fixed to the inner side of the horizontal plate 310 by screws. A ninth strip-shaped hole 317 is opened on the outer periphery of the inner tube 312. The length direction of the ninth strip-shaped hole 317 is parallel to the axial direction of the inner tube 312. A third moving rod 313 is movably installed in the ninth strip-shaped hole 317. An inner ring 314 is threaded to the inner end of the third moving rod 313. The inner ring 314 is located inside the inner tube 312. A second lead screw 315 is threaded to the inner ring 314. A second rotating cap 316 is formed on the outer end of the second lead screw 315. The outer end of the second lead screw 315 is rotatably mounted on the horizontal plate 310. The second rotating cap 316 is located on the outer side of the horizontal plate 310. A constraint ring is fixed to the second lead screw 315 by a pin. The constraint ring is located on the inner side of the horizontal plate 310. A sleeve 318 is threaded to the third moving rod 313. The sleeve 318 is fitted onto the inner tube 312.

[0059] The inner end of the inner tube 312 is fixed with an abutment plate 325 by screws. The inner side of the abutment plate 325 is fixed with an inner pad layer 326 with the same outer contour. The outer periphery of the abutment plate 325 has a rectangular sawtooth structure.

[0060] Reference Figure 8 and Figure 9As shown, an inner plate 319 is fixed to the inner end of the sleeve 318 by screws. Constraint holes 320 parallel to the length direction are respectively opened at both ends of the inner plate 319. A fourth moving rod 321 is movably installed within the constraint holes 320. A connecting inner plate 322 is fixed to the inner end of the fourth moving rod 321. The connecting inner plate 322 is sleeved on the sleeve 318 and is located outside the abutment plate 325. A peeling member 323 is formed on the outer periphery of the connecting inner plate 322. The contour structure of the peeling member 323 is the same as the outer contour structure of the abutment plate 325. Furthermore, the peeling member 323 is sleeved on the outer periphery of the abutment plate 325. A pair of separating members 324 are symmetrically formed on the outer periphery of the peeling member 323. The inner ends of the peeling member 323 and the separating members 324 have a blade-shaped structure. Along the width direction of the separating members 324, the peeling member 323, the connecting inner plate 322, and the separating members 324 have cutting seams, so that the peeling member 323, the connecting inner plate 322, and the separating members 324 are separated into two symmetrical parts. The inner ends of each pair of fourth moving rods 321 are respectively threaded to one of the connecting inner plates 322. In some parts, the inner ends of each pair of fourth moving rods 321 are respectively connected to a movable end plate 333 by threads. The movable end plate 333 is located on the outer side of the inner plate 319. A fixed inner block 334 is formed on the movable end plate 333. Push-pull side plates 335 are fixed to both sides of the fixed inner block 334 by screws. The push-pull side plates 335 are provided with inclined moving elongated holes 336. The end of the moving elongated hole 336 near the inner plate 319 extends inward at an inward angle. A movable arm 330 is movably provided between each pair of push-pull side plates 335. The outer end of the movable arm 330 is fixed. An inner shaft 331 is fixed, and two ends of the inner shaft 331 are respectively provided with movable wheels 332. The movable wheels 332 move within the movable elongated hole 336. The inner end of the movable arm 330 is fixed with a movable ring 327 by screws. The movable ring 327 is sleeved on the sleeve 318. A pair of gripping rods 328 are threadedly connected to the outer circumference of the movable ring 327. A third spring 329 is sleeved on the sleeve 318. The inner end of the third spring 329 abuts against the outer wall of the inner plate 319, and the outer end of the third spring 329 abuts against the inner end of the movable ring 327.

[0061] This embodiment is based on the operation steps of Embodiment 1, and uses a wafer edge die stripping device to strip incomplete dies 420. The specific operation steps are as follows:

[0062] Step 200: Perform steps 100 to 105 in Example 1 and form a complete clamping of the wafer.

[0063] Step 201: The operator abuts the inner side of the inner pad 326 against the outer end face of the wafer 42 so that all the complete dies 421 are located between the placement pad 18 and the inner pad 326.

[0064] Step 202: The operator moves the connecting end plate 301 inward so that one of the connecting end plates 301 is locked in the groove 180 and the inner wall of the side plate 300 abuts against the side wall of the placement pad 18.

[0065] In step 203, the operator rotates the first lead screw 308 using the first rotating cap 309. The rotation of the first lead screw 308 will increase the distance between the horizontal plate 310 and the concave arm 306, and cause the inner side of the inner pad layer 326 to abut against the outer end face of the wafer 42, while the inner wall of the connecting end plate 301 abuts against the bottom of the groove 180.

[0066] Step 204: Perform step 107 in Example 1 to make the wafer 42 in a vertical position.

[0067] In step 205, the operator rotates the second rotating cap 316. The rotation of the second rotating cap 316 will drive the second lead screw 315 to rotate. During the rotation, the inner ring 314, sleeve 318, connecting inner plate 322, peeling member 323 and separating member 324 will move closer to the wafer 42. During the movement, the peeling member 323 and separating member 324 will be inserted into the cutting seam at the junction of the incomplete grain 420 and the complete grain 421, and the inner ends of the peeling member 323 and separating member 324 will be close to the blue film 41 but will not contact the blue film 41.

[0068] In step 206, the operator presses the moving ring 327. During the pressing process, the third spring 329 is compressed, and the moving wheel 332 moves inward within the moving elongated hole 336. During this process, the two parts of the peeling member 323 and the separating member 324 separate. During the separation process, the incomplete grains 420 are pushed outward as a whole. When the incomplete grains 420 move to the blade 228 of the arc-shaped pressing member 227, these incomplete grains 420 will be peeled off. This operation continues until the incomplete grains 420 are completely peeled off. This peeling method significantly improves the peeling efficiency. Since the complete grains 421 are abutted and constrained, displacement of the complete grains 421 can be avoided. Furthermore, this peeling method can significantly improve the cleanliness of the peeling and avoid the problem of omissions during peeling. During peeling, the incomplete grains 420 move outward along the blue film 41. This peeling method avoids the problem of large deformation of the blue film 41 caused by pulling the incomplete grains outward. Furthermore, the force applied to the grains during peeling is a shear force, which reduces the difficulty of peeling. In addition, since the wafer 42 is in a vertical position during peeling, it is easier for the incomplete grains 420 to fall off.

[0069] Step 207: The operator removes the connecting mechanism 3.

[0070] Step 208: Perform step 108 in Example 1.

[0071] Step 209: Perform step 109 in Example 1.

[0072] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and variations.

Claims

1. A wafer processing worktable, characterized in that, Includes a base (1), on which a clamping mechanism (2) is provided; The base (1) has a placement pad (18). When in use, the blue film (41) of the wafer disk abuts against the placement pad (18). The clamping mechanism (2) has a pair of synchronously moving side clamps (202). When in use, the side clamps (202) limit the periphery of the annular part (40) of the wafer disk. The clamping mechanism (2) also has a pair of pressure plates (226). The inner end of the pressure plate (226) is formed with an arc-shaped pressure piece (227) in a semi-circular structure. The inner peripheral wall of the arc-shaped pressure piece (227) is attached with a release film. The inner peripheral of the arc-shaped pressure piece (227) is formed with a blade (228). When in use, the pressure plate (226) abuts against the outer wall of the ring piece (40), and the release film of the arc-shaped pressure piece (227) abuts against the blue film (41) area located between the wafer (42) and the ring piece (40), thus constraining the blue film (41) during the peeling process.

2. The wafer processing stage according to claim 1, characterized in that, The inner end of the side clamping plate (202) is formed with a clamping arc plate. When in use, the inner wall of the clamping arc plate abuts against the circumference of the ring (40).

3. The wafer processing stage according to claim 1, characterized in that, The inner end of the pressure plate (226) is formed with an arc-shaped pressure member (227) with a semi-circular structure. When in use, the inner wall of the arc-shaped pressure member (227) abuts against the blue film (41) area located between the wafer (42) and the ring (40).

4. The wafer processing stage according to claim 3, characterized in that, The outer end of the pressure plate (226) is formed with a rotating block (225), and the two ends of the rotating block (225) are fixed with hinge shafts (224). The pressure plate (226) rotates 90 degrees around the hinge shafts (224).

5. The wafer processing stage according to claim 1, characterized in that, When the pressure plate (226) moves toward the ring (40), the side clamp (202) moves synchronously toward the circumference of the ring (40) so that the pressure plate (226) abuts against the outer wall of the ring (40) and the side clamp (202) abuts against the circumference of the ring (40).

6. A wafer edge grain stripping device, characterized in that, Includes a connection mechanism (3), which is connected to a placement pad (18) on a wafer processing worktable as described in any one of claims 1 to 5; The connecting mechanism (3) has an abutment plate (325), and an inner pad (326) with the same outer contour is fixed on the inner side of the abutment plate (325). The outer periphery of the abutment plate (325) has a rectangular sawtooth structure, and the inner side of the inner pad (326) abuts against the outer end face of the wafer (42) of the wafer disk. A peeling member (323) is fitted around the outer periphery of the abutment plate (325). A connecting inner plate (322) is provided at the outer end of the peeling member (323). A pair of separating members (324) are symmetrically formed on the outer periphery of the peeling member (323). The inner ends of the peeling member (323) and the separating member (324) have a blade-shaped structure. Along the width direction of the separating member (324), the peeling member (323), the connecting inner plate (322) and the separating member (324) have cutting seams so that the peeling member (323), the connecting inner plate (322) and the separating member (324) are separated into two symmetrical parts.

7. The wafer edge grain stripping device according to claim 6, characterized in that, The connecting mechanism (3) includes a pair of side plates (300), each end of which is bent inward to form a connecting end plate (301). One of the connecting end plates (301) is connected to the placement pad (18), and the other connecting end plate (301) is fixed with a pair of connecting screws (302). A horizontal plate (310) is fitted on the connecting screw (302). A pair of seventh strip holes (311) are opened at both ends of the horizontal plate (310). The connecting screw (302) passes through the seventh strip hole (311), and an inner extension plate (303) is fixed at the other end of the connecting screw (302). The inner end of the inner plate (303) is provided with a pair of eighth strip holes (304). A second moving rod (305) is movably provided in the eighth strip hole (304). A concave arm (306) is fixed on the second moving rod (305). Movable notches (307) are provided at both ends of the concave arm (306). The inner plate (303) passes through the movable notches (307). A first lead screw (308) is connected to the concave arm (306). A first rotating cap (309) is provided at the outer end of the first lead screw (308). The inner end of the first lead screw (308) is rotatably provided on the horizontal plate (310).

8. The wafer edge grain stripping device according to claim 7, characterized in that, An inner tube (312) is fixed to the inner side of the horizontal plate (310). A ninth strip hole (317) is opened on the outer periphery of the inner tube (312). A third moving rod (313) is movably installed in the ninth strip hole (317). An inner ring (314) is connected to the inner end of the third moving rod (313). The inner ring (314) is located inside the inner tube (312). A second lead screw (315) is connected inside the inner ring (314). A second rotating cap (316) is formed on the outer end of the second lead screw (315). The outer end of the second lead screw (315) is rotatably mounted on the horizontal plate (310). The second rotating cap (316) is located on the outer side of the horizontal plate (310). A sleeve (318) is connected to the third moving rod (313). The sleeve (318) is fitted onto the inner tube (312). An abutment plate (325) is fixed to the inner end of the inner tube (312).

9. The wafer edge grain stripping device according to claim 8, characterized in that, An inner plate (319) is fixed to the inner end of the sleeve (318). Constraint holes (320) are respectively opened at both ends of the inner plate (319). A fourth moving rod (321) is movably installed in the constraint hole (320). The inner end of the fourth moving rod (321) is fixed to the connecting inner plate (322). The connecting inner plate (322) is sleeved on the sleeve (318). The connecting inner plate (322) is located outside the abutment plate (325). The inner ends of each pair of fourth moving rods (321) are respectively connected to a portion of the connecting inner plate (322). The outer ends of each pair of fourth moving rods (321) are respectively connected to a movable end plate (333). 33) Located on the outside of the inner plate (319), the movable end plate (333) has a fixed inner block (334) formed on it. The two sides of the fixed inner block (334) are respectively fixed with push-pull side plates (335). The push-pull side plates (335) have a movable elongated hole (336) set at an inclination. A movable arm (330) is movably provided between each pair of push-pull side plates (335). A pair of movable wheels (332) are rotatably provided at the outer end of the movable arm (330). The movable wheels (332) move in the movable elongated hole (336). A movable ring (327) is fixed at the inner end of the movable arm (330). The movable ring (327) is sleeved on the sleeve (318).

10. The wafer edge grain stripping device according to claim 9, characterized in that, A third spring (329) is fitted on the sleeve (318). The inner end of the third spring (329) abuts against the outer wall of the inner plate (319), and the outer end of the third spring (329) abuts against the inner end of the moving ring (327).

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