Processor for testing electronic components

Abstract

The invention relates to a processor for testing electronic components. The processor for testing an electronic component according to the present invention has a sealed chamber in which a reconfiguration portion, a connection portion, and a moving portion are accommodated except for a mounting / dismounting portion, and an opening hole of the sealed chamber is automatically opened or closed only when necessary due to the provision of a shutter. According to the invention, the air quality of the test space can be strictly controlled so as to prevent semiconductor assembly damage or test errors caused by foreign matters.

Description

Technical Field

[0001] This invention relates to a processor that electrically connects electronic components to a testing machine to support the testing of electronic components. Background Technology

[0002] A processor for testing electronic components is a device that processes electronic components to enable them to be electrically connected to a testing machine.

[0003] The increasing integration of electronic components, such as semiconductors, is leading to a trend of narrower circuit linewidths. Therefore, the precision requirements for connecting electronic components to testing equipment are becoming increasingly stringent.

[0004] Previously had 20 The error range can also be achieved by ensuring proper electrical connection between the electronic components and the testing machine, but now it is actually required to be 10. or numbers below Within the error range.

[0005] On the other hand, electronic components also include dies, which are separated from wafers into individual units.

[0006] The bare die undergoes packaging or, in order to produce high-bandwidth memory (HBM), it is stacked and then packaged to become the final product.

[0007] In order to perform subsequent work on the bare film, it is necessary to test the bare film.

[0008] The contact pads can be electrically connected to the testing machine to test electronic components in their bare die state.

[0009] There has been a lack of automated testing that can effectively support the testing of electronic components in bare die or HBM condition. This is because bare dies are difficult to make precise contact due to the fine spacing between the contact pads and are very thin, making them easy to break or fracture.

[0010] For this purpose, the applicant previously disclosed Korean Patent Publication No. 10-2021-0088373 (hereinafter referred to as the "Prior Art").

[0011] The prior art reveals techniques for reconfiguring electronic components and aligning their positions before connecting them to a test machine.

[0012] Existing technology utilizes a camera to scan electronic components on a test stage (which is referred to as a "chuck") to determine the current position and then readjusts the position of the electronic components to reduce the error range.

[0013] Based on existing technology, the precise positioning of electronic components enables automated testing of die-level electronic components.

[0014] On the other hand, testing semiconductor components contaminated with foreign matter can cause electrical shocks that can damage them or lead to erroneous test results.

[0015] Foreign matter can be in particle or liquid form.

[0016] It occurs when particulate foreign objects flow in from the outside air or when grinding occurs due to mechanical interference during the operation of the processor.

[0017] The liquid foreign matter may be dew generated during low-temperature testing.

[0018] In particular, semiconductor components with fine-linewidth circuits are more vulnerable to damage or testing errors caused by foreign object contamination.

[0019] [Existing Technical Documents] [Patent Documents] (Patent Document 0001) Korean Patent Publication No. 10-2021-0088373 Summary of the Invention

[0020] Technical issues There is a need to develop a technology that can seal the testing environment, which could lead to contamination of electronic components by foreign objects, to the greatest extent possible.

[0021] Technical solution The processing unit for testing electronic components of the present invention includes: a loading and unloading section for supplying electronic components to be tested or collecting electronic components that have been tested; a reconfiguration section for reconfiguring the position of the electronic components to be tested supplied by the loading and unloading section; a connecting section for electrically connecting the electronic components reconfigured in the reconfiguration section to the testing unit; a moving section for moving the electronic components to be tested from the loading and unloading section toward the reconfiguration section and moving the tested electronic components from the reconfiguration section toward the loading and unloading section; and a sealed cavity for internally housing the reconfiguration section, The connecting portion and the moving portion protrude toward the loading / unloading portion in a manner that overlaps with the loading / unloading portion on a plane; an opener / closer opens or closes an opening formed on the upper surface of the sealed cavity; and a controller controls the opener / closer; the loading / unloading portion has a pick-up robot capable of moving the electronic component to be tested into the interior of the sealed cavity through the opening or pulling out the tested electronic component from the interior of the sealed cavity through the opening, and the opener / closer includes: an opener / closer door for opening or closing the opening; and an opener / closer mechanism for moving the opener / closer door to open or close the opener / closer door.

[0022] The moving part includes: a transport shuttle having a transport platform capable of moving to carry electronic components; and a position sensor that senses the position of the transport platform. When the position sensor senses the transport platform as it moves toward the opening, the controller controls the opening and closing mechanism to open the opening and closing door.

[0023] The moving part includes a transport shuttle having a transport platform capable of moving to carry electronic components, and the controller controls the opening and closing mechanism to open or close the opening and closing door according to the position of the transport platform.

[0024] The controller controls the opening and closing mechanism according to the position of the picking robot to open or close the door.

[0025] The opening and closing mechanism and the moving platform are linked to passively open or close the door.

[0026] The opening and closing mechanism includes: a push rod disposed on the transport platform, which pushes the opening and closing door to open when the transport platform moves toward the opening hole side; and an elastic member, which applies an elastic force to the opening and closing door to close the opening and closing door when the transport platform moves toward the opposite side of the opening hole.

[0027] It may also include an anti-condensation mechanism capable of injecting dry air into the interior of the sealed cavity.

[0028] It may also include a foreign matter removal mechanism that blows a wind consisting of purified air onto the loading and unloading section to remove foreign matter.

[0029] Beneficial effects According to the present invention, the opening of the sealing cavity can be automatically opened or closed only when needed, thereby maximizing the sealing performance of the sealing cavity and suppressing contamination of the semiconductor components. Attached Figure Description

[0030] Figure 1 This is a conceptual plan view of the processor for testing electronic components according to the present invention.

[0031] Figures 2 to 12 It is used for explanation Figure 1 The diagram shows a reference image of a processor used for testing electronic components.

[0032] Figures 13 to 15 It is used to explain the applicability Figure 1 The diagram shows a schematic reference image of the sealed cavity and the opening / closing device of a processor used for testing electronic components. Detailed Implementation

[0033] The preferred embodiments of the present invention will be described below with reference to the drawings. For the sake of convenience, descriptions of well-known or repetitive configurations will be omitted or shortened as much as possible.

[0034] <Instructions for the processor used to test electronic components> Figure 1 This is a conceptual plan view of the processor TH (hereinafter referred to as "processor") for testing electronic components according to the present invention.

[0035] The processing machine TH of the present invention can be divided into a loading and unloading section LU, a reconfiguration section RP, a connecting section CP, and a moving section MP, including a transport shuttle 100, a first picking robot 210, a foreign object removal mechanism 270, a second picking robot 310, a test table 300, a vacuum device 400, a reconfiguration mechanism 500, a moving mechanism 600, an anti-condensation mechanism 700, and a controller 800.

[0036] The loading and unloading unit (LU) supplies electronic components that need to be tested or recycles electronic components that have been tested.

[0037] In the reconfiguration section RP, the positions of the electronic components to be tested supplied by the loading and unloading section LU are precisely reconfigured.

[0038] In the connection section CP, the electronic components and test equipment will be electrically connected to the precisely reconfigured positions in the reconfiguration section RP.

[0039] In the moving part MP, electronic components can be moved between the loading / unloading part LU and the reconfiguration part RP for the purpose of exchanging electronic components.

[0040] The moving part MP moves the electronic components to be tested from the loading / unloading part LU to the reconfiguration part RP, and moves the electronic components that have been tested from the reconfiguration part RP to the loading / unloading part LU.

[0041] The moving part MP is equipped with a transport shuttle 100 for carrying electronic components.

[0042] When viewed from a plan view, a portion of the moving part MP's transport shuttle 100 (the right side in the diagram) overlaps with the loading / unloading part LU.

[0043] The transport shuttle 100 is equipped for transporting electronic components between the loading / unloading section LU and the reconfiguration section RP.

[0044] The transport shuttle 100 has a movable transport platform 110.

[0045] The transport shuttle 100 may have one or more transport tables 110.

[0046] The transport platform 110 can move back and forth in one direction.

[0047] The transport table 110 can move back and forth in the X-axis direction.

[0048] When there are multiple transport tables 110, the multiple transport tables 110 can be arranged side by side in the Y-axis direction. In this case, the multiple transport tables 110 need to be able to reciprocate independently in the X-axis direction.

[0049] The transfer table 110 can move between a first area A1 on the side overlapping with the loading / unloading section LU and a second area A2 on the side of the reconfiguration section RP.

[0050] Electronic components can be mounted on the transfer table 110.

[0051] The transfer table 110 has a vacuum structure that uses vacuum pressure to fix electronic components placed on a plane.

[0052] as Figure 2 The schematic plan view shows that the transfer stage 110 has a vacuum hole VH and a vacuum tank VG for vacuum adsorption of electronic components.

[0053] A vacuum port VH is paired with a vacuum tank VG.

[0054] When viewed from a planar perspective, the vacuum port VH is positioned near the center of the area occupied by the vacuum tank VG.

[0055] The vacuum pressure entering through the vacuum port VH is evenly distributed through the vacuum tank VG and applied to the electronic components.

[0056] The electronic components can be fixed to the transport table 110 by vacuum pressure, so that the electronic components do not move during the process of being loaded on the transport table 110 and moving along the X-axis.

[0057] Vacuum holes VH and vacuum tanks VG can be configured in a 2x8 row and column configuration.

[0058] The loading capacity of the transfer table 110 can be increased or decreased, and therefore the number of vacuum holes VH and vacuum tanks VG can also be increased or decreased.

[0059] In the loading / unloading section LU, electronic components can be supplied to or recovered from the processor TH.

[0060] The electronic components to be tested are supplied to the processor TH through the loading / unloading section LU, and the tested electronic components are recovered from the processor TH through the loading / unloading section LU.

[0061] Electronic components can be supplied to or recycled from the processor TH after being carried on customer pallets such as Jedec Tray, Ring Frame, Ring Tray, or other forms.

[0062] The structure of the loading and unloading unit (LU) can vary depending on the type of pallet the customer uses.

[0063] Electronic components to be tested, located in the loading / unloading section LU, are loaded onto a transfer table 110 located in the first area A1. Tested electronic components loaded onto the transfer table 110 in the first area A1 are then unloaded from the transfer table 110. For this purpose, the loading / unloading section LU is equipped with a first picking robot 210.

[0064] The first picking robot 210 is equipped for loading or unloading electronic components onto or from the transport table 110.

[0065] In order to use the first picking robot 210 for loading and unloading operations, the transfer table 110 needs to be moved to the loading and unloading section LU and located in the first area A1.

[0066] The first picking robot 210 loads the electronic components to be tested onto the transfer table 110 located in the first area A1, or unloads the tested electronic components from the transfer table 110 located in the first area A1.

[0067] The first picking robot 210 may have one or more pickers capable of gripping or releasing electronic components. The pickers may grip the electronic components by means of vacuum pressure.

[0068] Preferably, the four pickers can be installed in pairs on the first picking robot 210 to increase processing capacity.

[0069] For example, like Figure 3 As shown in the conceptual diagram, the first picking robot 210 may have four pickers P arranged in a 2x2 row and column configuration.

[0070] Depending on the implementation, the number of pickers P provided on the first picking robot 210 can be increased or decreased.

[0071] The loading and unloading section LU also includes a foreign matter removal mechanism 270.

[0072] The foreign matter removal mechanism 270 can remove foreign matter splashed in the loading / unloading section LU by blowing air composed of purified air free of foreign matter.

[0073] as Figure 4The concept diagram shows that the foreign object removal mechanism 270 can be equipped with the following structure: purified air is blown downward from the upper side of the loading / unloading section LU.

[0074] While air blown from top to bottom can also slide downwards, it can also be designed to slide to the side before reaching the bottom.

[0075] Preferably, the side is in the Y-axis direction, which can be the side where the supply stacker or recycling stacker is located, as described later. In this case, foreign objects that might flow in from the supply stacker or recycling stacker side can be prevented.

[0076] The air blown by the foreign object removal mechanism 270 is discharged to the outside along with the foreign object through various holes of the loading and unloading part LU by means of density difference.

[0077] The foreign object removal mechanism 270 can be configured as a pair of supply fans and intake fans, or it is sufficient to equip it with a connecting tool that is installed in the factory to supply purified air. Alternatively, a filter for removing foreign objects can be installed on one of the supply fans and intake fans.

[0078] More specific features of the loading and unloading section LU will be described in detail later.

[0079] In the reconfiguration section RP, the electronic component ED to be tested is unloaded from the transport table 110 and loaded onto the test table 300, and the reconfiguration of the electronic component loaded onto the test table 300 is achieved.

[0080] The reconfiguration portion RP forms a reconfiguration space RS for reconfiguring electronic components.

[0081] According to this embodiment, the reconfigured portion RP is configured on one side of the connecting portion CP in the X-axis direction.

[0082] The reconfigured RP section is equipped with a second picking robot 310.

[0083] The second picking robot 310 unloads the electronic component ED to be tested from the transport table 110 or loads the tested electronic component ED onto the transport table 110.

[0084] In order to use the second picking robot 310 for loading and unloading operations, the transfer table 110 needs to be moved to the reconfiguration part RP side and located in the second area A2.

[0085] The second picking robot 310 unloads the electronic components to be tested from the transfer table 110 in the second area A2 or loads the tested electronic components onto the transfer table 110 in the second area A2.

[0086] The second picking robot 310 can be configured in the same way as the first picking robot 210.

[0087] The number of pickups P in the second pickup robot 310 and the number of pickups P in the first pickup robot 210 can be different.

[0088] The second picking robot 310 unloads the electronic components to be tested from the transport table 110 in the second area A2 and loads them onto the test table 300, which is moved to the reconfiguration section RP.

[0089] The second picking robot 310 loads the tested electronic components from the test table 300 onto the transfer table 110 in the second area A2.

[0090] In order for the electronic components to be tested to be loaded onto the test stage 300 by the second pick-up robot 310, the test stage 300 needs to be located in the reconfiguration space RP.

[0091] The test stand 300 is equipped to hold the electronic components ED that are unloaded from the transport table 110 by the second pick-up robot 310.

[0092] as Figure 5 The schematic enlarged view shown shows that the test stage 300 is in the shape of a disk and has a flat upper surface.

[0093] When viewed from a flat surface, the test platform 300 can also be in the form of a four-cornered plate, in which case the upper surface remains flat.

[0094] The electronic components are loaded onto the test stage 300 in the form of a flat upper surface.

[0095] The test platform 300 can move along the X, Y and Z axes.

[0096] The test bench 300 can rotate and move in the θ-axis direction with the vertical line V passing through the center of the test bench 300 in the Z-axis direction as the axis of rotation.

[0097] Generally, during the movement of the electronic component ED towards the test bench 300, there will be impacts or inertia that follow the movement.

[0098] Impacts or inertia can disrupt the position of electronic components mounted on the test bench 300. To prevent this problem, a vacuum hole h is formed in the area of ​​the test bench 300 where the electronic components are mounted.

[0099] The vacuum structure of the test stage 300 used to fix electronic components can be the same as the vacuum structure of the transfer stage 110.

[0100] When the electronic component is placed on the test stage 300 by the second picking robot 310, the electronic component can be directly placed in the designated position due to vacuum pressure. In this state, if the second picking robot 310 releases its grip on the electronic component, the electronic component will be directly fixed in the designated position without any positional deviation.

[0101] Vacuum device 400 provides vacuum pressure to vacuum port h located on test stage 300 through vacuum circuit (not shown).

[0102] The vacuum unit 400 can be constructed using only the following structure: after being installed at the factory, the vacuum pressure supplied from outside the processor TH is distributed to each electronic component through a vacuum circuit.

[0103] The vacuum pressure provided by the vacuum unit 400 is transmitted to the electronic component ED through the vacuum port h, and the electronic component mounted on the test stage 300 is fixed in position by the vacuum pressure.

[0104] The vacuum port h can be selectively opened and closed according to the control of the vacuum circuit. The electronic component ED can be selectively fixed to or detached from the test stage 300.

[0105] The electronic components are electrically connected to the test machine in the state of being loaded onto the test bench 300.

[0106] The electrical connection between the electronic components mounted on the test bench 300 and the test machine is achieved through the test board TB.

[0107] The test board TB has test pins that make electrical contact with electronic components.

[0108] The test board TB is connected to the processor TH in a fixed position at the connection point CP.

[0109] The electronic components mounted on the test stand 300, which is moved to the connection part CP, make electrical contact with the test pins of the test board TB.

[0110] As long as it has a configuration that allows for electrical connection to electronic components, it can enable test boards of any structure (TB).

[0111] The test board TB can be a widely known probe card. In this case, the test stage 300 is preferably equipped in the form of a disk.

[0112] The test board TB can be a structure with a socket module. Test pins are located on the socket module, which is then mounted on the socket body. In this case, preferably, the test bench 300 is equipped in the form of a four-corner plate.

[0113] as Figure 6The bottom view shown has test areas TZ arranged on the test board TB, each corresponding to one electronic component.

[0114] The test area TZ corresponds one-to-one with the electronic components mounted on the test bench 300.

[0115] Each test area TZ is equipped with test pins that are electrically connected to a single electronic component. The test pins on a test zone TZ are arranged in a cluster to form the test zone TZ and are electrically connected to the electronic component ED.

[0116] When the test board TB is a probe card, a set of test pins t are densely arranged in the test area TZ. Here, a set of test pins t corresponds to a terminal on an electronic component. The test pins t on the probe card are usually also called probe pins.

[0117] When the test board TB has a structure with socket modules, a set of test pins t is installed on one socket module, and one socket module constitutes one test area TZ. Therefore, replacing a socket module 22 means replacing a test area TZ.

[0118] The test area TZ and the electronic component ED should be aligned with each other. If the coordinates of the electronic component ED on the test stage 300 in the XY plane are inconsistent with the coordinates of the test area TZ, the electrical connection between the electronic component ED and the test machine is faulty.

[0119] as Figure 7 As a conceptual example, when the electronic component ED on the test bench 300 is in an angular position with a torsional rotation angle θ1 relative to the test area TZ along the θ-axis, a poor electrical connection occurs between the electronic component ED and the test machine. To prevent this problem, all test areas TZ of the test board 20 and all electronic components ED on the test bench 300 should be aligned with each other.

[0120] The reconfiguration mechanism 500 is equipped to achieve alignment between the test area TZ and the electronic component ED.

[0121] According to this embodiment, the electronic component ED is moved from the transport table 110 to the test table 300 by the second picking robot 310. During this process, the position of the electronic component ED may be incorrect due to factors such as the operation error or impact of the second picking robot 310.

[0122] The position or angular position of the electronic component ED loaded onto the test stage 300 by the second pick-up robot 310 on the XY plane may vary, and the electronic component ED loaded on the test stage 300 and the test area TZ of the test board TB may be inconsistent with each other.

[0123] If the tolerance range between the electronic component ED and the test area TZ is wide, there is no problem. However, in reality, packaged semiconductor components are required to have a tolerance of 30. Precision within 5, while bare die or high bandwidth memory (HBM) is required. Precision within the range.

[0124] In this invention, when the second picking robot 310 moves the electronic component ED from the transport table 110 to the test table 300, it first loads the electronic component ED into a temporary area and then reconfigures it from the temporary area to the correct position area.

[0125] The temporary area is not the default location but can be any location on the test table 300 where the electronic component ED is placed by the second pick-up robot 310.

[0126] The temporary area is not set or fixed by the controller 800, but is arbitrarily determined by the operation of the second picking robot 310.

[0127] For example, when the second pick-up robot 310 places the electronic component ED onto the test stage 300, the area where the electronic component ED is placed becomes a temporary area.

[0128] Exaggerated presentation Figure 8 An example of a temporary area BZ on test bench 300 is shown.

[0129] The temporary region BZ can have its own X-axis, Y-axis, and θ-axis positions.

[0130] The correct positioning area refers to the location where the electronic component aligns with the test area TZ. (This is an exaggeration.) Figure 9 The relationship between the temporary region BZ and the correct position region RZ on the test bench 300 is shown.

[0131] Although the correct position area RZ can be preset, it can also be set to ensure that the position and configuration of the test area TZ on the test board TB are consistent after the electronic component ED to be tested is loaded onto the test bench 300.

[0132] The correct location area RZ can be obtained from images precisely scanned by a separate high-magnification camera attached to the test bench 300 before the test run on the processor TH.

[0133] exist Figure 9 The temporary region BZ has errors relative to the correct region RZ in the X-axis, Y-axis and θ-axis directions.

[0134] The reconfiguration mechanism 500 is equipped for precisely reconfiguring the position of the electronic components ED mounted on the test bench 300 in the reconfiguration space RS.

[0135] The reconfiguration mechanism 500 is equipped to reconfigure the position of the electronic component ED, which will be loaded onto the test stage 300 by the second pick-up robot 310, from the temporary area BZ to the correct position area RZ.

[0136] According to this embodiment, the second pick-up robot 310 loads the electronic component ED to be tested, which is unloaded from the transport table 110, into a temporary area BZ. Then, the reconfiguration mechanism 500 moves the electronic component ED from the temporary area BZ to the correct position area RZ.

[0137] as Figure 10 The schematic diagram shows that the reconfiguration mechanism 500 includes a reconfiguration pickup 510, a reconfiguration camera 520, and a pickup lift 530.

[0138] The reconfiguration mechanism 500 can be installed by fixing it to the frame that constitutes the processor TH skeleton.

[0139] The reconfigurable pickup 510 can hold or release the electronic component ED. The reconfigurable pickup 510 can hold the electronic component ED by vacuum pressure.

[0140] The position of the pickup 510 in the horizontal direction, which serves as the X-axis and Y-axis, is fixed.

[0141] The camera 520 is reconfigured separately from the pickup 510.

[0142] The position of camera 520 was reconfigured and fixed in the horizontal direction, which serves as the X and Y axes.

[0143] The camera 520 was reconfigured for filming the electronic components ED.

[0144] The pickup lift 530 drives the reconfiguration pickup 510 to lift.

[0145] Preferably, the pickup lift 530 is equipped with a lifting motor to precisely control the lifting speed or lifting distance of the reconfigured pickup 510.

[0146] as Figure 11 As an example, the camera 520 is reconfigured to capture images of the identification markers M1 and M2 on the electronic component ED. The identification markers M can be configured diagonally opposite each other.

[0147] However, the object photographed by the reconfigured camera 520 for the purpose of reconfiguring the electronic component ED is not limited to the identification mark M. The object photographed by the reconfigured camera 520 may also be replaced by the corner of the electronic component ED, the identification pad or identification pattern of the electronic component ED, or other identifiable objects.

[0148] The reconfiguration pickup 510 and the reconfiguration camera 520 are bundled together and fixed as a single module. The relative positions of the reconfiguration pickup 510 and the reconfiguration camera 520 are fixed.

[0149] The moving mechanism 600 can move the test stage 300 in the horizontal direction, which is the X-axis and Y-axis.

[0150] The moving mechanism 600 can make the test stage 300 rotate and move along the θ axis.

[0151] The moving mechanism 600 can move the test stage 300 up and down in the Z-axis direction.

[0152] as Figure 12 The schematic enlarged view shows that the moving mechanism 600 includes a rotator 610, a lift 620, a first mover 640, and a second mover 660.

[0153] Rotator 610 rotates test stage 300 along the θ axis.

[0154] Rotator 610 rotates test stage 300 to adjust the angular position of electronic component ED in the θ-axis direction.

[0155] The lift 620 raises and lowers the test bench 300.

[0156] The test bench 300 is connected to the lift 620 via a rotator 610.

[0157] When the test bench 300 is raised by the lift 620, the electronic component ED of the test bench 300 contacts the test pin t, thereby electrically connecting the electronic component ED to the test machine. When the test bench 300 is lowered by the lift 620, the contact between the electronic component ED and the test pin t is released, and the test bench 300 becomes a state where it can move in the horizontal direction.

[0158] The first mover 640 moves the test stage 300 in the X-axis direction.

[0159] The first mover 640 moves the test stage 300 in the X-axis direction, allowing the test stage 300 to be selectively located in the reconfiguration space RS and the test space TS. Here, the test space TS is the space formed in the connecting part CP, and when the test stage 300 is located in the test space TS, the electronic component ED and the tester are electrically connected by the rise of the test stage 300.

[0160] The second mover 660 moves the test stage 300 in the Y-axis direction.

[0161] The aforementioned mobile mechanism 600 has four functions.

[0162] The primary function is to allow the test bench 300 to move between the reconfiguration space RS and the test space TS.

[0163] The second function is to electrically connect or disconnect the electronic component (ED) from the testing machine.

[0164] The third function is the ability to raise and lower the test bench 300 during the movement of the connection section CP and the reconfiguration section RP. This is because the test bench 300 may be at different heights in the test space TS and the reconfiguration space RS due to interference from the surrounding environment during movement. However, it is preferable for the test bench 300 to be at the same height in the test space TS and the reconfiguration space RS.

[0165] The fourth function is for the reconfiguration of the electronic components ED implemented in the reconfiguration space RS.

[0166] Because the reconfiguration pickup 510 is fixed, the test stage 300 adjusts the position of the electronic component ED on the horizontal plane while moving in the X-axis and Y-axis directions (which are horizontal) or rotating in the θ-axis direction.

[0167] Depending on the implementation, the test stage 300 may be raised or lowered during the reconfiguration process of the electronic component ED, allowing the reconfiguration pickup 510 to hold or release the electronic component ED. However, preferably, instead of raising or lowering the test stage 300 during the reconfiguration process, the pickup lift 530 may be used to raise or lower the reconfiguration pickup 510. Raising or lowering the test stage 300 when the connection portion CP electrically connects the electronic component ED to the test machine improves the contact precision between the electronic component and the test machine.

[0168] Here, we will explain the actions taken when the electronic component (ED) is reconfigured.

[0169] as Figure 9 As shown, the temporary region BZ of the electronic component ED can differ from the correct position region RZ in the X-axis, Y-axis and θ-axis directions.

[0170] The camera 520 was reconfigured to capture the electronic components ED on the test stand 300, and the temporary area BZ was confirmed by identifying the position of the marker M.

[0171] Upon confirmation of the temporary area BZ, the first mover 640 and the second mover 660 operate such that the center of the temporary area BZ is located below the reconfiguration pickup 510, and the pickup elevator 530 operates such that the reconfiguration pickup 510 descends.

[0172] With the reconfigured pickup 510 holding the electronic component ED of the rising test stage 300 by suction using vacuum pressure, the pickup lift 530 operates, causing the reconfigured pickup 510 to rise. Then, the first mover 640 and the second mover 660 operate to align the center of the correct position region RZ with the center of the electronic component ED held by the reconfigured pickup 510, and the rotator 610 operates to align the electronic component ED with the correct position region RZ. In this state, the pickup lift 530 operates, causing the reconfigured pickup 510 to descend and placing the electronic component ED held by the reconfigured pickup 510 into the correct position region RZ.

[0173] If the electronic component ED is fixed to the test stage 300 by applying vacuum pressure to the vacuum port h while it is in the correct position area RZ, the reconfiguration pickup 510 releases the electronic component ED from its holding state. Then, the reconfiguration pickup 510 rises and begins reconfiguring the next electronic component ED in sequence.

[0174] The controller 800 controls components necessary for the proper operation of the processor TH, such as the transport shuttle 100, the first pickup robot 210, the foreign object removal mechanism 270, the second pickup robot 310, the vacuum unit 400, the reconfiguration mechanism 500, the moving mechanism 600, and the anti-condensation mechanism 700.

[0175] Next, the operation method of the processor TH of the present invention will be explained from the logistics perspective of electronic component ED.

[0176] In the loading and unloading section LU, the first picking robot 210 loads the electronic component ED to be tested onto the transport table 110 located in the first area A1.

[0177] With all electronic components ED loaded onto the transport table 110, the transport shuttle 100 operates, causing the transport table 110 to move to the second area A2.

[0178] After the second pick-up robot 310 unloads the electronic component ED from the transport table 110 in the second area A2, it moves it to the test table 300 in the reconfiguration area RS. At this time, the electronic component ED loaded onto the test table 300 by the second pick-up robot 310 is located in the temporary area BZ.

[0179] With all the electronic components ED to be tested loaded onto the test bench 300, the controller 820 activates the reconfiguration mechanism 500 and the moving mechanism 600 to reconfigure the electronic components ED from the temporary area BZ to the correct position area RZ.

[0180] Once the electronic component ED has been reconfigured on the test bench 300, the moving mechanism 600 operates to move the test bench 300 to the test space TS formed in the connecting portion CP. Then, the connector 700 actuates to raise the test bench 300 toward the test board 20, thereby electrically connecting the electronic component ED to the test machine.

[0181] Upon completion of testing of the electronic component ED, the test table 300 is moved to the reconfiguration section RP by the moving mechanism 600. Then, the second pick-up robot 310 moves the tested electronic component ED to the transport table 110 located in the second area A2, and the transport table 110, filled with the tested electronic component ED, moves to the first area A1. Next, the first pick-up robot 210 unloads the tested electronic component ED from the transport table 110 and loads it onto an empty customer pallet.

[0182] Using the basic operating method described above, the electronic component ED is supplied to the testing machine for testing and then recycled after the testing is completed.

[0183] <Explanation of the sealed cavity> The sealed cavity maintains the test temperature environment and improves the efficiency of the anti-condensation mechanism 700.

[0184] Preferably, the sealed cavity is equipped with a structure that can isolate the test space TS from the outside air and the loading / unloading part LU as much as possible.

[0185] According to this embodiment, the sealed cavity internally houses the reconfiguration portion RP, the connecting portion CP, and the moving portion MP.

[0186] The anti-condensation mechanism 700 injects dry air into the interior of the sealed cavity.

[0187] Figure 13 This is a schematic three-dimensional view of the sealed cavity 900.

[0188] as Figure 1 and Figure 13 As shown, the sealing cavity 900 has a protruding portion 910 that protrudes toward the loading / unloading portion LU in a manner that overlaps with the loading / unloading portion LU on a plane.

[0189] The upper surface of the protruding part 910 has an open hole 911 that is consistent with the first region A1 in the plane.

[0190] The transport table 110 located in the first area A1 can be exposed above through the opening 911.

[0191] The electronic component ED to be tested can be accessed from the loading / unloading section LU through the opening 911 into the sealed cavity 900.

[0192] The first picking robot 210 can move the electronic component ED to be tested into the sealed cavity 900 through the open hole 911 and place it into the transfer table 110 located in the first area A1.

[0193] The tested electronic component ED can enter or exit the sealed cavity 900 through the opening 911, thereby moving to the loading / unloading section LU.

[0194] The first picking robot 210 can pull out the tested electronic component ED from the inside of the sealed cavity 900 through the opening 911.

[0195] In order to maintain the internal temperature of the sealing cavity 900, keep the internal state of the sealing cavity 900 dry, and prevent foreign matter from flowing into the sealing cavity 900, the opening hole 911 should only be opened when necessary.

[0196] as Figure 14 As an example, the processor TH has an opener 920 for opening or closing the open hole 911.

[0197] The opener 920 is controlled by the controller 800 to automatically open or close the opening 911.

[0198] The opener / closer 920 includes an opener / closer 921 and an opener / closer mechanism 922.

[0199] The opening and closing door 921 is equipped to reciprocate along the X-axis direction in the horizontal direction.

[0200] The opening 911 opens or closes depending on the position of the opening / closing door 921.

[0201] The opening and closing mechanism 922 causes the opening and closing door 921 to move along the X-axis.

[0202] The opening and closing mechanism 922 moves the opening and closing door 921 to open or close the opening and closing door 921.

[0203] The opener 920 can isolate the interior of the sealed cavity 900 from the outside air and the loading / unloading parts LU as much as possible, and can open the opening 911 only when needed.

[0204] The controller 800 controls the opener 920 to open the opening 911 only when the electronic component to be tested enters the sealed cavity 900 or the electronic component that has been tested exits the sealed cavity 900.

[0205] Therefore, the air quality inside the sealed cavity 900 can be managed more strictly.

[0206] The following describes several preferred examples related to the control of the switch 920.

[0207] 1. First example The processor TH may have a position sensor S for sensing the position of the transport table 110.

[0208] If the position sensor S detects the movement of the transport table 110 toward the opening 911, the controller 800 controls the opening and closing mechanism 922 to open the opening and closing door 921.

[0209] If the required operation (electronic component movement operation) is completed with the opening 911 open, the controller 800 controls the opening and closing mechanism 922 to close the opening and closing door 921.

[0210] 2. The second example The controller 800 can open and close the mechanism 922 by software control based on the position of the transport table 110.

[0211] The controller 800 may have software that tracks the position of the transport table 110 through arithmetic operations.

[0212] When the transport table 110 moves toward the opening hole 911, the controller 800 controls the opening and closing mechanism 922 in such a way that the opening and closing door 921 is opened before or at the same time as the transport table 110 arrives at the opening hole 911.

[0213] In the second example, the controller 800 controls the opening and closing mechanism 922 according to the position of the transport table 110.

[0214] 3. The third example The opening 911 may be opened only when: the first pick-up robot 210 allows the electronic component ED to be tested to enter the interior of the sealed cavity 910, or the first pick-up robot 210 allows the tested electronic component ED to enter the interior of the sealed cavity 910 or exit from the interior of the sealed cavity 910.

[0215] Therefore, the controller 800 can be configured to control the opening and closing mechanism 922 to open or close the rear opening and closing door 921 based on the position of the first picking robot 210.

[0216] According to the third example, the controller 800 controls the opening and closing mechanism 922 in a software manner based on the position of the first picking robot 210.

[0217] The controller 800 may have software that tracks the position of the first picking robot 210 through arithmetic operations.

[0218] When the first picking robot 210 moves toward the opening hole 911, the controller 800 controls the opening and closing mechanism 922 in the following manner: the opening and closing door 921 is opened before or at the same time as the second picking robot 210 arrives at the opening hole 911.

[0219] According to the third example, the opening 911 can be opened or closed at any time during the operation of moving the electronic component ED, so the internal environment of the sealed cavity 900 can be better preserved accordingly.

[0220] 4. The fourth example The opening and closing mechanism 922 can be implemented as follows: it passively opens or closes the opening and closing door 921 in conjunction with the movement of the transport table 110.

[0221] The opening and closing mechanism 922 includes a push rod 922a and a spring 922b.

[0222] Push rod 922a is located on transport table 110.

[0223] The push rod 922a and the transport table 110 move together.

[0224] As the transport table 110 moves toward the opening hole 911, the push rod 922a pushes open the push plate 921a of the closing door 921, thereby opening the opening and closing door 921.

[0225] Spring 922b is equipped with an elastic element that applies an elastic force to the opening and closing door 921 in the direction that causes the opening and closing door 921 to close.

[0226] The elastic force of spring 922b always acts in the direction that causes the opening and closing door 921 to close. Therefore, when the transport table 110 moves to the opposite side of the opening hole 911 and the push rod 922a no longer pushes the push plate 921a, the opening and closing door 921 closes due to the action of spring 922b.

[0227] When there are multiple transport stations> Multiple transport tables can be arranged side by side in the Y-axis direction. In this case, although one large open hole 911 can be formed, two open holes 911 can also be formed in the Y-axis direction as shown in Figure 16.

[0228] When two open holes 911 are formed, it can be achieved by using a single opener 920 to open or close both open holes 911.

[0229] However, for the sealing of the cavity 900, it is preferable to form two opening holes 911 and have two openers 920 that open and close the two opening holes 911 independently.

[0230] The foregoing embodiments are merely preferred examples of the present invention, and many other applications are possible. Therefore, the present invention should not be construed as limited to the content described above. The scope of the present invention should be interpreted as the scope of the patent application and its equivalents.

Claims

1. A processor for testing electronic components, in, include: The loading and unloading section supplies electronic components that need to be tested or recycles electronic components that have been tested. The reconfiguration section reconfigures the positions of the electronic components to be tested supplied by the loading and unloading section; The connection section enables the electronic components and test electromechanical connections to be completed at the reconfiguration position in the reconfiguration section; The moving part moves the electronic components to be tested from the loading and unloading part to the reconfiguration part side, and moves the electronic components that have been tested from the reconfiguration part to the loading and unloading part side. A sealed cavity, which internally houses the reconfiguration portion, the connecting portion, and the moving portion, protruding toward the loading / unloading portion side in a manner that overlaps with the loading / unloading portion in a plane; An opener / closer that opens or closes an opening formed on the upper surface of the sealed cavity; and The controller controls the switch. The loading and unloading section has a picking robot capable of moving the electronic component to be tested into the sealed cavity through the open hole, or pulling out the tested electronic component from the sealed cavity through the open hole. The opening / closing device includes: Opening and closing the door, opening or closing the opening; and An opening and closing mechanism that moves the opening and closing door to open or close it.

2. The processor for testing electronic components according to claim 1, wherein, The moving part includes: A transport shuttle having a transport platform capable of moving to carry electronic components; and The position sensor senses the position of the transport table. When the position sensor detects the transport platform as it moves toward the open hole, the controller controls the opening and closing mechanism to open the door.

3. The processor for testing electronic components according to claim 1, wherein, The moving part includes a transport shuttle with a transport table capable of moving to carry electronic components. The controller controls the opening and closing mechanism according to the position of the transport platform to open or close the door.

4. The processor for testing electronic components according to claim 1, wherein, The controller controls the opening and closing mechanism according to the position of the picking robot to open or close the door.

5. The processor for testing electronic components according to claim 1, wherein, The opening and closing mechanism is linked to the movement of the transport platform to passively open or close the door.

6. The processor for testing electronic components according to claim 5, wherein, The opening and closing mechanism includes: A push rod, disposed on the transport platform, pushes the opening / closing door to open it when the transport platform moves toward the opening hole side; and An elastic element applies an elastic force to the opening and closing door to close the door when the transport platform moves to the opposite side of the opening.

7. The processor for testing electronic components according to claim 1, wherein, It also includes an anti-condensation mechanism capable of injecting dry air into the interior of the sealed cavity.

8. The processor for testing electronic components according to claim 1, wherein, It also includes a foreign matter removal mechanism that blows a wind consisting of purified air onto the loading and unloading section to remove foreign objects.

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