Apparatus and method for testing electronic devices

Abstract

The invention provides an apparatus and method for testing an electronic device. The equipment comprises a test board which is provided with a device placing area, a test area and at least one signal circuit; a test socket operably mounted on the test board, where the test socket includes a socket body and contact posts, the plurality of contact posts vertically extending through the socket body and being vertically movable relative to the socket body; a calibration socket cover for mounting the test socket on the test board to press the plurality of contact posts against the test board but expose at least one target contact post such that a measurement result is generated by measuring an electrical characteristic associated with one of the at least one signal line; and a device socket cover used for installing the test socket on the test board so as to press the plurality of contact columns against the test board.

Description

Technical Field

[0001] This application generally relates to semiconductor technology, and more specifically, to an apparatus and method for testing electronic devices. Background Technology

[0002] The semiconductor industry has always faced complex integration challenges as consumers demand smaller, faster, and higher-performing electronic devices, packing more and more functionality into a single device. Various types of electrical tests are performed on these already complex electronic components to assess their characteristics and identify any defects.

[0003] Therefore, test sockets are used to electrically connect the metal wires or contact pads of a test board (e.g., a printed circuit board) mounted in a test device to the connectors or terminals of the electronic device under test (DUT). In other words, when testing an electronic device, the test socket serves as an interface for electrically connecting the test board of the test device to the DUT. Establishing a connection between the test device and the DUT may introduce path loss, which should be calibrated from the test results of the electronic device to improve the accuracy of the test results. However, it is difficult to accurately measure the path loss introduced by the test socket and test board using existing test equipment.

[0004] Therefore, there is a need for equipment and methods for testing electronic devices. Summary of the Invention

[0005] One objective of this application is to provide an apparatus and method for testing electronic devices to measure path loss introduced into the test results of the electronic devices.

[0006] According to one aspect of this application, an apparatus for testing electronic devices is provided. The apparatus includes: a test board having a device placement area, a test area, and at least one signal line, each signal line extending between a device contact pad in the device placement area and a test pad in the test area; a test socket operably mounted on the test board, wherein the test socket includes a socket body and a plurality of contact posts extending vertically through the socket body and movable vertically relative to the socket body; and a calibration socket cover for receiving the test socket and mounting the test socket on the device placement area of ​​the test board to press the plurality of contact posts against the test board, but exposing the plurality of contact posts. At least one target contact post of a plurality of contact posts, each target contact post being aligned with at least one device contact pad, such that when the plurality of contact posts are pressed against the test board by the calibration socket cover, a measurement result is generated by measuring the electrical characteristics associated with one of the at least one signal lines; and a device socket cover for receiving the test socket and the electronic device, and mounting the test socket on the device placement area of ​​the test board to press the plurality of contact posts against the test board via the electronic device, such that the electronic device can be tested via the at least one signal line of the test board.

[0007] In another aspect of this application, a method for testing electronic devices using a test board and a test socket is provided, wherein the test board has a device placement area, a test area, and at least one signal line, each signal line extending between a device contact pad in the device placement area and a test pad in the test area; the test socket includes a socket body and a plurality of contact posts extending vertically through the socket body and movable vertically relative to the socket body. The method includes: mounting the test socket onto the device placement area of ​​the test board using a calibration socket cover to press the plurality of contact posts against the test board, but exposing at least one target contact post among the plurality of contact posts, the at least one target contact post being aligned with at least one device contact pad; generating a measurement result by measuring electrical characteristics associated with one of the at least one signal line while the plurality of contact posts are pressed against the test board by the calibration socket cover; removing the calibration socket cover from the test socket and the test board; mounting the electronic device onto the test socket such that a plurality of conductive pads formed on the electronic device are aligned with the plurality of contact posts; mounting the test socket and the electronic device onto the device placement area of ​​the test board using a device socket cover to press the plurality of contact posts against the test board via the electronic device to establish an electrical connection between the electronic device and the test board via the plurality of contact posts; and testing the electronic device and calibrating the test result of the electronic device based on the measurement result.

[0008] It should be understood that the foregoing general description and the following detailed description are merely exemplary and explanatory and do not limit the invention. Furthermore, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. Attached Figure Description

[0009] The accompanying drawings, which are incorporated herein by reference, form part of this specification. Unless expressly indicated otherwise in the detailed description, the features shown in the drawings illustrate only some embodiments of this application, and not all embodiments thereof, and should not be construed as implying to the reader of this specification that all embodiments are possible.

[0010] Figures 1A to 1D An apparatus for testing electronic devices according to a first embodiment of this application is shown.

[0011] Figures 2A to 2C The various steps of a method for testing electronic devices according to a second embodiment of this application are shown.

[0012] Throughout the accompanying drawings, the same reference numerals will be used to refer to the same or similar parts. Specific Implementation

[0013] The following detailed description of exemplary embodiments of this application takes into account the accompanying drawings, which form a part of the description. The drawings illustrate specific exemplary embodiments in which this application may be practiced. The detailed description, including the drawings, describes these embodiments in sufficient detail to enable those skilled in the art to practice this application. Those skilled in the art may further utilize other embodiments of this application and make logical, mechanical, and other changes without departing from the spirit or scope of this application. Therefore, the reader of the following detailed description should not interpret the description in a limiting sense, and the scope of the embodiments of this application is defined only by the appended claims.

[0014] In this application, unless otherwise expressly stated, the use of the singular includes the plural form. In this application, unless otherwise stated, the use of “or” means “and / or”. Furthermore, the use of the term “comprising” is not restrictive. Additionally, unless otherwise expressly stated, terms such as “element” or “assembly” cover both elements and assemblies comprising one unit and elements and assemblies comprising more than one sub-unit. Furthermore, the section headings used herein are for organizational purposes only and should not be construed as limiting the subject matter described.

[0015] As used herein, for ease of description, spatial relative terms such as “below,” “under,” “above,” “upper,” “upper,” “lower,” “left,” “right,” “vertical,” “horizontal,” and “side” may be used to describe the relationship between an element or feature and another element (or feature) or feature (or feature), as shown in the diagrams. In addition to the orientations depicted in the diagrams, the spatial relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein shall be interpreted accordingly. It should be understood that when an element is referred to as “connected to” or “coupled to” another element, the element may be directly connected to or coupled to the other element, or there may be intermediate elements present.

[0016] As mentioned above, when electronic devices are tested by test equipment including fixtures such as test sockets and test boards, path loss may inevitably be introduced into the test results generated by the test equipment. More specifically, test sockets may include spring pins that help establish an electrical connection between the electronic device and the test board for testing. During this testing process, path loss of the spring pins may inevitably occur and be incorporated into the test results of the electronic device. Therefore, it is necessary to calibrate or remove path loss from the test results to improve the accuracy of the electronic device test results. However, it is difficult to accurately and conveniently measure path loss using conventional test equipment.

[0017] Several solutions are currently available for measuring the path loss of spring pins. For example, simulated values ​​of path loss or pre-measured results of path loss provided by spring pin suppliers can be used to calibrate the test results of the electronic device under test (DUT), rather than the actual measured values ​​of path loss when the DUT is being tested. However, because this pre-generated or measured calibration information is obtained in an environment different from the actual test environment of the DUT, the accuracy of the path loss calibration information may still be unsatisfactory.

[0018] To address this problem, an apparatus and method for testing electronic devices are provided. The apparatus includes a test board, a test socket including contact posts, and a calibration socket cover for mounting the test socket onto the test board. When the test socket is mounted onto the test board by the calibration socket cover, the contact posts are pressed against the test board by the calibration socket cover, and at least one target contact post is exposed from the calibration socket cover. Thus, when the contact posts are pressed against the test board by the calibration socket cover, a measurement result (e.g., a measurement of path loss) is generated. The measurement result can then be used to calibrate the test results of the electronic device, which were generated using the same test socket and test board. During subsequent testing of the electronic device, the contact posts are pressed against the test board to establish an electrical connection between the electronic device and the test board. Since the measurement result is generated when the contact posts are pressed against the test board, a calibration environment can be formed that simulates the actual test environment in which the electronic device is tested. Therefore, the measurement results can have satisfactory accuracy, resulting in more reliable test results for the electronic device.

[0019] Figures 1A to 1D An apparatus for testing electronic devices according to a first embodiment of this application is shown. The apparatus can operate in a test mode and another calibration mode; in the test mode, it can generate test results for the electronic devices, and in the calibration mode, it can generate calibration information for the test results. Here, Figures 1A to 1C The calibration mode of the device and certain parts of the device are shown, along with the measurement results used to generate test results for calibrating electronic components. Specifically, Figure 1A A side view of the device's test board, test socket, and calibration socket cover is shown. Figure 1B It shows Figure 1A The top view of the test socket and calibration socket cover shown, and Figure 1C It shows Figure 1A The bottom view of the test socket and calibration socket cover shown. Figure 1D A side view is shown of the device in test mode for testing electronic devices. The device includes... Figures 1A to 1C The test board and test socket shown, as well as the device socket cover.

[0020] like Figure 1A As shown, the device includes a test board 100, which serves as the base of the device. When the test board 100 is tested, it can be electrically connected to an electronic device. Furthermore, the test board 100 is electrically coupled to a test device, such as a multimeter, which may or may not have a signal generator for testing the electronic device. In some embodiments, the test board 100 includes a device placement area for placing a test fixture (e.g., a test socket 110) and the electronic device under test. Additionally, the test board 100 includes a test area where test tools (e.g., test probes) can be placed and / or connected, such that the test tools can be electrically coupled to the electronic device to collect measurements of the electronic device before or during the testing process. In some embodiments, the device placement area can be the central area of ​​the test board 100, and the test area can be the peripheral area of ​​the test board 100. Alternatively, the test area can be located on the back side of the test board 100, wherever the test tools can easily access it. Furthermore, the test board 100 includes at least one device contact pad in the device placement area and at least one test pad in the test area of ​​the test board 100. A signal line 101 (e.g., a metal wire) extends between a pair of device contact pads and a test pad, serving to transmit signals between the electronic device and external test equipment. For example, during testing of the electronic device, the signal line 101 may be coupled to a signal generator of the test equipment to receive and apply test signals to the electronic device. In some embodiments, the signal line 101 may have a corresponding layout corresponding to the layout of the electronic device, such as having a specific length corresponding to the size of the electronic device. Furthermore, device contact pads may be formed at specific locations on the test board 100, the specific locations indicating the specific locations of the signal line 101 corresponding to the layout of the electronic device.

[0021] See also Figure 1A The device includes a test socket 110 operably mounted on a test board 100. During testing, the test socket 110 serves to house electronic components and simultaneously provide an electrical connection between the electronic components and the test board 100 to establish a complete test environment or system for testing the electronic components. More specifically, the test socket 110 includes a socket body 111, which may be configured to have a cuboid structure. The socket body 111 may have a plurality of through-holes extending from its front surface to its rear surface. Furthermore, the test socket 110 includes a plurality of contact posts 112 extending vertically through the socket body 111 and respectively housed within the plurality of through-holes. The contact posts 112 are vertically movable relative to the socket body 111. During testing of the electronic components, the contact posts 112 establish a resilient electrical connection between the electronic components and the test board 100. The top and bottom portions of the contact posts 112 may be exposed from the front and bottom surfaces of the socket body 111, respectively, to allow for convenient connection to the electronic components and the test board 100.

[0022] Combination Figure 1B and 1C refer to Figure 1A The contact post 112 includes at least one target contact post 112a, each target contact post 112a being aligned with a device contact pad and electrically coupled to a signal line 101 during testing of the electronic device. In addition to the at least one target contact post 112a, the contact post 112 also includes at least one non-target contact post 112b that may not be electrically coupled to the signal line 101. The at least one non-target contact post 112b may be used for other purposes, such as power supply, grounding, or connection to other signal lines (e.g., non-target signal lines). The test board 100 may include at least one additional device contact pad in the device placement area for coupling the at least one non-target contact post 112b. The non-target contact post 112b and the target contact post 112a may have the same structure. In some embodiments, the contact post 112 includes a spring pin. Each spring pin 112 includes a tubular pin body, a metal top contactor coupled to the top end of the pin body, a metal bottom contactor coupled to the bottom end of the pin body, and a compressible helical spring disposed within the pin body. A compressible helical spring can contact a top contactor at its tip and a bottom contactor at its bottom. Thus, the spring pin 112 can move vertically relative to the socket body 111, with the helical spring providing a resilient connection between the electronic device and the test board 100. Using these configurations, when the electronic device is tested by the test socket 110, the top contactor of the spring pin 112 can contact the conductive pad of the electronic device, and the bottom contactor can contact the device contact pad and additional device contact pads in the device placement area. Additionally, the top and bottom contactors are exposed from the front and rear surfaces of the socket body 111. When the electronic device is tested via the test socket 110, the contact pin 112 can press against the test board 100 to establish a reliable electrical connection between the electronic device and the test board 100, thus establishing a complete test environment or system for testing the electronic device. In some other embodiments, the contact pin may include other types of resilient connectors, such as resilient conductive pins.

[0023] like Figure 1AAs shown, the device further includes a calibration socket cover 130 that mounts the test socket 110 onto the device placement area of ​​the test board 100. More specifically, the calibration socket cover 130 includes a housing having a back opening 133 on its back side and a cover portion 132 on its front side. The cover portion 132 may be a flat plate covering the at least one non-target contact post 112b and has at least one hole 131 for exposing the at least one target contact post 112a, such that a test tool (e.g., a test probe 140) can pass through the hole 131 to contact the at least one target contact post 112a. In some embodiments, the at least one hole 131 may have a larger size at its top portion and may taper to a smaller size at its bottom portion, forming a truncated shape. For example, the top portion of the hole 131 may have a size larger than the target contact post 112a, while the bottom portion of the hole 131 may have a size smaller than at least a portion of the target contact post 112a. In this manner, the probe 140 more easily passes through the hole 131 to reach the target contact post 112a, while the target contact post 112a can still be pressed down by the calibration socket cover 130. The housing also has two vertical portions 134 arranged parallel to each other on opposite sides of the cover portion 132 and extending downward from the cover portion 132. The cover portion 132 and the vertical portions 134 together define a back opening 133 through which the test socket 110 can be inserted into the housing. Furthermore, the calibration socket cover 130 includes a pair of tabs 135 formed at the back opening 133, or specifically, extending from the vertical portions 134 toward each other. The pair of tabs 135 can act as fasteners to secure the test socket 110 within the housing after it has been inserted. In some embodiments, the pair of tabs 135 may have a triangular cross-section, with one side of the triangular tab 135 contacting the test socket 110. In some other embodiments, the pair of tabs 135 may have a truncated triangular cross-section, with a shorter length on the top side that contacts the test socket 110, thereby making it easier to remove the calibration socket cover 130 from the test socket 110 in subsequent processes.

[0024] After assembly with the test socket 110, the calibration socket cover 130 can be placed on the device placement area of ​​the test board 100, with the vertical portion 134 of the housing contacting the test board 100. The height of the housing may be slightly less than the height of the contact post 112. Thus, when the calibration socket cover 130 with the test socket 110 is placed on the test board 100, the at least one non-target contact post 112b and the at least one target contact post 112a can be pressed against the test board 100 by the covering portion 132 of the calibration socket cover 130. The at least one target contact post 112a and the at least one non-target contact post 112b are aligned with the device contact pad and the additional device contact pad, respectively, to allow electrical connection between the test socket 110 and the test board 100. In some other embodiments, alignment marks may be formed at specific locations in the device placement area of ​​the test board 100 to facilitate accurate positioning of the test socket 110 onto the test board 100, thereby ensuring alignment of the contact post 112 with the corresponding device contact pad. The marking may be a recess on the test plate 100, which is used to accommodate the bottom portion of the calibration socket cover 130. It is understood that the calibration socket cover 130 can be placed on the device placement area in any other suitable alignment.

[0025] In this embodiment, the testing tool (e.g., a pair of test probes 140, etc.) can respectively contact the at least one target contact post 112a and the test pad in the test area of ​​the test plate 100 (e.g. Figure 1A (As shown). In this way, measurement results are generated by measuring the electrical characteristics associated with the at least one signal line 101 via probe 140. The electrical characteristics may be radio frequency (RF) characteristics, such as path loss, within the test equipment including contact posts 112 and test board 100. More specifically, such as Figure 1A As shown, the path loss of the electrical path between the top of the target contact post 112a and the corresponding test pad in the test area can be measured using a pair of test probes 140. This path loss may include the path loss between the target contact post 112a and the signal line 101. When measuring electrical characteristics, during the measurement, the calibration socket cover 130 presses at least one non-target contact post 112b against the test plate 100, and the calibration socket cover 130 also presses at least one target contact post 112a against the test plate 100. This results in higher accuracy of the measurement because the calibration socket cover 130 establishes a measurement environment that accurately simulates the actual test environment in which the electronic device is tested. Furthermore, since the test socket 110 has no sidewalls and its cross-section is cuboid, the probes 140 can more easily access the test socket 110 without any obstructions, thereby improving the contact reliability between the probes 140 and the target contact post 112a, as well as the durability of the probes.

[0026] In some embodiments, such as Figure 1B As shown, one or more target contact posts 112a are included within contact posts 112. In this case, each of the plurality of target contact posts 112a is coupled to a signal line within the test board 100. Electrical characteristics can be measured between one of the plurality of target contact posts 112a and one of the plurality of signal lines 101, respectively. Measurements can be performed independently for each pair of target contact posts 112a and signal lines 101 to generate multiple measurement results for the target contact posts 112a and signal lines 101. In a later step, these multiple measurement results can be used to calibrate the test results of the obtained electronic device, as described below.

[0027] In some other embodiments, the calibration socket cover 130 may be a flat plate without a vertical portion 134, and the flat plate has at least one hole 131 for exposing the at least one target contact post 112a. The flat plate may be positioned above the contact post 112, but does not directly contact the plurality of contact posts 112 before measuring the electrical characteristics. When measuring the electrical characteristics, the flat plate moves downward to press the at least one non-target contact post 112b against the test plate 100. In this way, the structure of the calibration socket cover 130 and the assembly process of the calibration socket cover 130 and the test socket 110 are simplified. Furthermore, the contact post 112 may not be pressed before the actual measurement of the electrical characteristics, which protects the contact post 112 from excessive wear and extends the life of the test socket 110. Also, the calibration socket cover 130 can be more easily removed before the testing steps of the electronic device. In some embodiments, the calibration socket cover 130 may be mechanically coupled to a driver or actuator that automatically controls the upward or downward movement of the calibration socket cover 130. In some other embodiments, the calibration socket cover 130 can be manually controlled by at least one handwheel or other similar drive mechanism.

[0028] In some other embodiments, the calibration socket cover 130 may include a cover frame having internal openings exposing all contact posts 112, and a plurality of sheet inserts movably inserted within the cover frame to cover the at least one non-target contact post 112b. Each of the plurality of sheet inserts may have a designed pattern. At least one sheet insert with a designed pattern may be selected from the plurality of sheet inserts to cover the at least one non-target contact post 112b. More specifically, the layout of the target contact post 112a and the non-target contact post 112b may be different for testing various electronic devices. A specific set of sheet inserts with a designed pattern may be selected from the plurality of sheet inserts based on the layout of the non-target contact post 112b. The selected set of sheet inserts may then be assembled together and inserted within the cover frame to achieve the desired layout that covers the at least one non-target contact post 112b but exposes the at least one target contact post 112a. In this way, the calibration socket cover 130, with its cover frame and the plurality of sheet inserts, can be used to test different electronic devices with various layouts, which provides better testing flexibility and saves costs.

[0029] In some other embodiments, the receptacle body 111 may include sidewalls at its periphery that project upwards from the front surface of the receptacle body 111, forming an outer cover having a cavity at its center. In this case, the calibration receptacle cover 130 may include a slit aligned with the sidewall, allowing the sidewall to pass through it. The test receptacle 110 and the calibration receptacle cover 130 can be assembled together using the following steps. First, the calibration receptacle cover 130 can be positioned onto the test receptacle 110 by allowing the sidewall of the test receptacle 110 to penetrate the slit of the calibration receptacle cover 130. Simultaneously, the pair of tabs 135 can be pulled away from each other to allow the receptacle body 111 to be received within the housing of the calibration receptacle cover 130. Then, the pair of tabs 135 can be returned to their original position to clamp and secure the test receptacle 110 within the housing. Alternatively, the calibration receptacle cover 130 may be a flat plate with a through-hole.

[0030] After measuring the electrical characteristics, the calibration socket cover 130 can be removed from the test socket 110. The electronic device to be tested can then be mounted on the test socket 110. Alternatively, a device socket cover is introduced to assemble the electronic device and the test socket 110 so that the device can be tested using the equipment.

[0031] Figure 1D A cross-sectional view of an apparatus for performing test steps on electronic device 150 in test mode is shown. The apparatus now includes Figures 1A to 1C The test board 100 and test socket 110, as well as the device socket cover 160, are shown.

[0032] like Figure 1D As shown, after removing the calibration socket cover 130 from the test socket 110, the electronics 150 is mounted onto the test socket 110. The electronics 150 may include various types of electronic modules, such as radio frequency (RF) devices, semiconductor chips, resistors, capacitors, system-in-package (SiP) modules, or other large-size devices with complex functions. The electronic modules included within the electronics 150 may be encapsulated by a molded cover. Furthermore, the electronics 150 has a plurality of conductive pads on its bottom surface to provide electrical connection between the electronics 150 and the test socket 110. More specifically, each of the conductive pads may be aligned with one of the contact posts 112.

[0033] The device socket cover 160 is used to press the electronic device 150 against the test plate 100. More specifically, the device socket cover 160 has a cover cavity in which the electronic device 150 and the test socket 110 can be accommodated. The device socket cover 160 is configured to have a shape that mates with the external profiles of the electronic device 150 and the test socket 110. During the testing process of the electronic device 150, an external force can be applied to the device socket cover 160 and then transmitted to the electronic device 150, whereby the electronic device 150 can press the contact posts 112 (including target contact posts 112a and non-target contact posts 112b) against the test plate 100 to establish a resilient electrical connection between the electronic device 150 and the test plate 100.

[0034] In this way, test results are generated by testing the electronics 150 via at least one signal line 101 of the test board 100. The test results are then calibrated based on measurements associated with the at least one signal line 101, thereby improving the accuracy of the test results, which are generated prior to the testing process using a calibration socket cover 130 (e.g., ...). Figures 1A to 1C (As shown).

[0035] As previously mentioned, in some embodiments, the measurement obtained using the calibration socket cover 130 prior to the testing process may be the path loss of the device including the contact post 112. Figure 1D As shown, during the testing steps of electronic device 150, contact post 112 is pressed against test plate 100 by an external force applied from device socket cover 160. See also... Figures 1A to 1C When the calibration socket cover 130 presses at least one non-target contact post 112b and at least one target contact post 112a against the test plate 100, the path loss of the device is measured. Figure 1DThe test environment used for testing electronic device 150 is the same as that used for testing electronic device 150. In other words, when measuring the path loss of the device, the contact post 112 is pressed by the calibration socket cover 130, which accurately simulates the working state of the contact post 112 during the actual test steps of electronic device 150. Therefore, the path loss measured with the help of the calibration socket cover 130 can have greatly improved accuracy. When the path loss is used to calibrate the test results of electronic device 150, more accurate test results of electronic device 150 can be obtained. In addition, when measuring path loss, the contact post 112 is coupled to the test board 100, which is also used during the actual test steps of electronic device 150. Therefore, by taking into account the effect of the mismatch of heterojunction between the contact post 112 and the signal line 101 of the test board 100 during the actual test steps of electronic device 150, the path loss is measured based on this, which also helps to accurately calibrate the test results.

[0036] Figures 2A to 2C The various steps of a method for testing an electronic device according to a second embodiment of this application are illustrated. In some embodiments, the method may be performed by... Figures 1A to 1D The equipment shown is implemented.

[0037] like Figure 2A As shown, a test board 200 and a test socket 210 are provided. The test board 200 has a device placement area, a test area, and at least one signal line 201, each signal line 201 extending between a device contact pad in the device placement area and a test pad in the test area. The test socket 210 includes a socket body 211 and a plurality of contact posts 212 extending vertically through the socket body 211 and movable vertically relative to the socket body 211. The contact posts 212 include at least one non-target contact post 212b and at least one target contact post 212a. In some embodiments, the contact post 212 may be a spring pin. The test socket 210 is mounted on the test board 200. At least one device contact pad is aligned with the at least one target contact post 212a. Additionally, the test board 200 may include at least one additional device contact pad in the device placement area aligned with the at least one non-target contact post 212b. Details of the test board 200 and the test socket 210 may be similar to those described above. Figures 1A to 1C The details illustrated in the test board 100 and test socket 110 shown in the diagram will not be elaborated upon here for the sake of simplicity.

[0038] Next, as Figure 2BAs shown, a calibration socket cover 230 is provided, comprising a housing having a back opening on its back side and a covering portion on its front side. The covering portion has at least one hole 231. The calibration socket cover 230 also includes a pair of tabs formed at the back opening and extending toward each other. A test socket 210 is inserted into the back opening of the calibration socket cover 230 such that at least a portion of the at least one target contact post 212a is exposed from the at least one hole 231 of the covering portion, and the at least one non-target contact post 212b is covered by the covering portion.

[0039] Furthermore, the test socket 210 can be secured within the housing by the pair of tabs. After the test socket 210 is inserted into the rear opening of the calibration socket cover 230, the non-target contact post 212b and the target contact post 212a can be pressed against the test plate 200 by the calibration socket cover 230 to establish an electrical connection between the test socket 210 and the test plate 200. More specifically, the calibration socket cover 230 can be placed on the device placement area of ​​the test plate 200. The height of the housing, i.e., the total height of the rear opening and the tabs, can be slightly less than the height of the contact post 212. Thus, when the calibration socket cover 230 with the test socket 210 is placed on the test plate 200, the at least one non-target contact post 212b and the target contact post 212a can be pressed against the test plate 200 by the covering portion 232 of the calibration socket cover 230. For example, in some embodiments, the at least one hole 231 can have a larger size at its top portion and can taper to a smaller size at its bottom portion, forming a truncated shape. For example, the top portion of the hole 231 may have a size larger than that of the target contact post 212a, while the bottom portion of the hole 231 may have a size smaller than at least a portion of that of the target contact post 212a. In this way, the target contact post 212a can still be pressed down by the calibration socket cover 230. In some other embodiments, the test socket 210 may first be mounted onto the test board 200 and then inserted into the calibration socket cover 230.

[0040] Next, a test tool, such as a pair of probes 240, is provided. One of the probes 240 contacts the at least one target contact post 212a, and the other probe 240 contacts a test pad in the test area of ​​the test board 200. In this way, when the at least one non-target contact post 212b and the target contact post 212a are pressed against the test board 200, a measurement result is generated by measuring the electrical characteristics associated with the at least one signal line 201 through the probes 240. The electrical characteristics may be RF characteristics within the test equipment including the contact post 212 and the test board 200, such as path loss. More specifically, such as Figure 2BAs shown, the path loss of the electrical path between the top of the target contact post 212a and the corresponding test pad in the test area can be measured using a pair of test probes 240. This path loss may include the path loss between the target contact post 212a and the signal line 201. Figure 2C As shown, the calibration socket cover 230 is removed from the test socket 210, and the electronics 250 is mounted onto the test socket 210. The electronics 250 has a set of conductive pads on its bottom surface to provide an electrical connection between the electronics 250 and the test socket 210. More specifically, each of the conductive pads is aligned with one of the contact posts 212.

[0041] Next, the device socket cover 260 is placed over the electronic device 250 and the test socket 210 to press the electronic device 250 against the test plate 200. Thus, the contact post 212, including the at least one non-target contact post 212b and the at least one target contact post 212a, is pressed against the test plate 200 via the electronic device 250, thereby establishing an electrical connection between the electronic device 250 and the test plate 200 via the contact post 212.

[0042] Next, test results are generated by testing the electronic device 250 via at least one signal line 201 of the test board 200. Then, according to the calibration socket cover 230 (as shown) used before the test step, the test results are generated. Figure 2B The measurement results generated (as shown) are used to calibrate the test results, for example, by removing measurement results (such as path loss) from the test results, thereby improving the accuracy of the test results.

[0043] Although exemplary apparatus and methods for testing electronic devices have been described in conjunction with the corresponding figures, those skilled in the art will understand that modifications and adaptations can be made to the apparatus and methods without departing from the scope of the invention.

[0044] Various embodiments have been described herein with reference to the accompanying drawings. However, it will be apparent that various modifications and alterations can be made thereto, and additional embodiments can be implemented, without departing from the broader scope of the invention as set forth in the appended claims. Furthermore, other embodiments will be apparent to those skilled in the art upon consideration of practice of one or more embodiments of the invention disclosed herein. Therefore, the examples in this application and herein are intended to be considered merely exemplary, and the true scope and spirit of the invention are indicated by the list of exemplary claims appended.

Claims

1. An apparatus for testing electronic devices, characterized in that, The device includes: A test board having a device placement area, a test area, and at least one signal line, each signal line extending between a device contact pad in the device placement area and a test pad in the test area; A test socket operably mounted on the test board, wherein the test socket includes a socket body and a plurality of contact posts that extend vertically through the socket body and are movable vertically relative to the socket body; A calibration socket cover for receiving the test socket and mounting the test socket on the device placement area of ​​the test board to press the plurality of contact posts against the test board, but exposing at least one target contact post among the plurality of contact posts, the at least one target contact post being aligned with at least one device contact pad, such that when the plurality of contact posts are pressed against the test board by the calibration socket cover, a measurement result is generated by measuring the electrical characteristics associated with one of the at least one signal lines; and A device socket cover for accommodating the test socket and the electronic device, and for mounting the test socket on the device placement area of ​​the test board to press the plurality of contact posts against the test board via the electronic device, so that the electronic device can be tested via at least one signal line of the test board.

2. The device according to claim 1, characterized in that, The device further includes: A test module for testing the electronic device via the test board when the test socket and the electronic device are mounted on the test board via the device socket cover, wherein the test module is further configured to calibrate the test results of the electronic device based on the measurement results associated with the at least one signal line.

3. The device according to claim 1, characterized in that, Generating a measurement result by measuring the electrical characteristics associated with one of the at least one signal lines when the plurality of contact posts are pressed against the test plate by the calibration socket cover further includes: generating a measurement result by measuring the electrical characteristics of the electrical path between one of the at least one target contact post and a corresponding one of the at least one test pad when the plurality of contact posts are pressed against the test plate by the calibration socket cover.

4. The device according to claim 1, characterized in that, The plurality of contact posts include spring pins.

5. The device according to claim 1, characterized in that, The calibration socket cover includes a flat front surface.

6. The device according to claim 5, characterized in that, The calibration socket cover includes: A housing for receiving the test socket, wherein the housing has a rear opening on its rear side into which the test socket can be inserted, and a covering portion on its front side for pressing the plurality of contact posts against the rear opening, wherein the covering portion has at least one hole for exposing at least one target contact post; and A pair of tabs formed at the back opening and extending toward each other, wherein the pair of tabs are configured to secure the test socket within the housing after the test socket is inserted into the housing.

7. The device according to claim 5, characterized in that, The calibration socket cover is a flat plate having at least one hole for exposing the at least one target contact post.

8. The device according to claim 1, characterized in that, The socket body includes sidewalls at its periphery that project upwards from the front surface of the socket body; and the calibration socket cover includes a slit aligned with the sidewalls, the slit allowing the sidewalls to pass through when the test socket is mounted on the test plate via the calibration socket cover.

9. A method for testing electronic devices using a test board and test sockets, characterized in that, The test board has a device placement area, a test area, and at least one signal line, each signal line extending between a device contact pad in the device placement area and a test pad in the test area; the test socket includes a socket body and a plurality of contact posts, the plurality of contact posts extending vertically through the socket body and movable vertically relative to the socket body, and wherein the method includes: The test socket is installed onto the device placement area of ​​the test board by the calibration socket cover to press the plurality of contact posts against the test board, but exposes at least one target contact post among the plurality of contact posts, the at least one target contact post being aligned with at least one device contact pad; When the plurality of contact posts are pressed against the test plate by the calibration socket cover, a measurement result is generated by measuring the electrical characteristics associated with one of the at least one signal lines; Remove the calibration socket cover from the test socket and the test board; The electronic device is mounted onto the test socket such that the plurality of conductive pads formed on the electronic device are respectively aligned with the plurality of contact posts; The test socket and the electronic device are mounted onto the device placement area of ​​the test board by the device socket cover, so as to press the plurality of contact posts against the test board via the electronic device, so as to establish an electrical connection between the electronic device and the test board via the plurality of contact posts; and Test the electronic device and calibrate the test results of the electronic device based on the measurement results.

10. The method according to claim 9, characterized in that, The plurality of contact posts include spring pins.

11. The method according to claim 9, characterized in that, The calibration socket cover includes a flat front surface.

12. The method according to claim 11, characterized in that, The calibration socket cover includes: a housing having a rear opening on its rear side and a cover portion on its front side, wherein the cover portion has at least one hole; and a pair of tabs formed at the rear opening and extending toward each other; and The step of installing the test socket onto the device placement area of ​​the test board using the calibration socket cover includes: The test socket is inserted into the rear opening of the calibration socket cover, such that the pair of tabs secure the test socket within the housing, wherein the at least one hole in the cover exposes the at least one target contact post; and The calibration socket cover and the test socket are attached to the device placement area of ​​the test board, such that the plurality of contact posts are pressed against the test board by the cover portion.

13. The method according to claim 9, characterized in that, The step of generating a measurement result by measuring the electrical characteristics associated with one of the at least one signal line when the plurality of contact posts are pressed against the test plate by the calibration socket cover further includes: generating a measurement result by measuring the electrical characteristics of the electrical path between one of the at least one target contact post and a corresponding one of the at least one test pad when the plurality of contact posts are pressed against the test plate by the calibration socket cover.

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