Method for detecting electrical parameters of dielectric sheet of electrode array by using detection device

Abstract

The invention provides a method for detecting electrical parameters of a dielectric sheet of an electrode array by using a detection device, the detection device comprises a bottom plate, a pressing plate arranged on the bottom plate and a test assembly, the pressing plate is provided with a plurality of test holes for accommodating a conductive solution, the test holes form a bottom opening at one end, close to the bottom plate, of the pressing plate, and the test assembly is provided with a conductive part; the detection method comprises the steps that S10, the electrode array is placed between the pressing plate and the bottom plate, so that the electrode array is placed in the mode that the dielectric pieces face the pressing plate, and the dielectric pieces are exposed in the corresponding test holes; s20, adding a conductive solution into the test hole of the pressing plate to enable the conductive solution to be in contact with the corresponding dielectric sheet; s30, the conductive part of the test assembly extends into the test hole and is in contact with the conductive solution; and S40, conducting the electrode array and the conductive part, and connecting a test device or a detection circuit to obtain electrical parameters of the dielectric sheet. According to the detection method, the electrical parameters of the dielectric sheet of the electrode array can be accurately detected, and nondestructive detection can be realized.

Description

Technical Field

[0001] This application relates to a method for detecting the electrical parameters of a dielectric sheet in an electrode array using a detection device. Background Technology

[0002] Tumor electric field therapy (TEF) is a treatment method that uses an electric field generator to produce a low-intensity, medium-to-high-frequency, alternating electric field to interfere with the mitotic process of tumor cells. Studies have shown that TGF therapy is effective in treating glioblastoma, non-small cell lung cancer, and malignant pleural mesothelioma. The electric field applied in this treatment method can affect the aggregation of microtubules, prevent spindle formation, inhibit the mitotic process, and induce apoptosis in cancer cells.

[0003] Existing tumor electric field therapy systems mainly include an electric field generator that generates alternating electrical signals for tumor electric field therapy, an adapter electrically connected to the electric field generator, and multiple pairs of electrode pads electrically connected to the electric field generator via the adapter. The electric field generator transmits the alternating electrical signals for tumor electric field therapy to each pair of electrode pads through the adapter. The paired electrode pads are applied to the surface of the patient's body on opposite sides of the tumor region and are subjected to alternating electrical signals to generate an alternating electric field for tumor therapy between the paired electrode pads.

[0004] The electrode pad comprises an electrode array and a backing for attaching the electrode array to the patient's skin. The electrode array is an array primarily composed of a flexible circuit board and dielectric sheets mounted on the flexible circuit board. The electrical parameters of the dielectric sheets determine the performance of the electrode array. Existing dielectric sheets are generally arranged in a circular sheet shape, exposed and in direct or indirect contact with the human body surface. The electrical parameters of the dielectric sheets are the core components determining the performance of the electrode pad. Relative permittivity and dielectric loss are two important criteria for evaluating the electrical parameters of the dielectric sheets. Therefore, a reliable and convenient detection device and method are needed to detect the electrical parameters of the dielectric sheets.

[0005] Currently, one of the upper and lower surfaces of the dielectric sheet on the electrode array has a metal coating for electrical connection with the circuit board, while the other side is not coated. There are two existing testing methods. One method is only for dielectric sheets with a metal coating on one side. During testing, a flexible conductive material, such as conductive gel, is first applied to the side without the metal coating, followed by a metal layer, forming a capacitor device with double-sided metal electrodes. The capacitance and resistance values ​​of the dielectric sheet are then measured and converted into relative permittivity and dielectric loss. However, this testing device has low efficiency, and due to the difficulty of the flexible conductive material making good contact with the dielectric sheet or its own high loss, the accuracy of the measured capacitance and resistance values ​​is not high. Furthermore, for flexible dielectric sheets, this method may damage the dielectric sheet when peeling off the flexible conductive material, creating a safety hazard during subsequent use. Another testing device is for dielectric sheets with metal coatings on both sides. During testing, both sides of the dielectric sheet are coated with metal, and then the capacitance and resistance values ​​are measured by the instrument. After the test, the metal coating on one side needs to be peeled off. This is because when the dielectric sheet is used on the electrode sheet, only one side needs to be coated with metal, and peeling off the metal coating is relatively difficult. Therefore, this testing method is a destructive test.

[0006] Therefore, it is necessary to propose a new detection device and a method for detecting the electrical parameters of the dielectric sheet of the electrode array using the detection device. Summary of the Invention

[0007] This application provides a method for accurately and non-destructively testing the electrical parameters of a dielectric sheet of an electrode array using a testing device.

[0008] Specifically, this application is achieved through the following technical solution: a method for detecting the dielectric parameters of an electrode array using a detection device, the detection device comprising a base plate, a pressure plate disposed on the base plate, and a testing assembly, the pressure plate having a plurality of test holes for accommodating a conductive solution, the test holes forming bottom openings at one end of the pressure plate near the base plate, and the testing assembly having a conductive part for extending into the test holes and contacting the conductive solution within the test holes; the detection method includes the following steps: S10: placing the electrode array to be tested between the pressure plate and the base plate so that the electrode array, with its dielectric properties, is in contact with the conductive solution within the test holes. The dielectric sheet is placed facing the pressure plate and the bottom opening is covered so that the dielectric sheet is exposed in the corresponding test hole; S20: A conductive solution is added to the test hole of the pressure plate so that the conductive solution contacts the dielectric sheet of the electrode array; S30: The test assembly is brought close to the pressure plate with its conductive part facing the pressure plate so that the conductive part extends into the corresponding test hole of the pressure plate and contacts the conductive solution in the test hole; S40: The conductive parts of the electrode array and the test assembly are connected to conduct electricity and a test device or detection circuit is connected to obtain the electrical parameters of the dielectric sheet.

[0009] Further, the specific operation of step S10 is as follows: S101: The pressure plate of the detection device is placed upside down so that the bottom opening of the pressure plate faces upward; S102: The electrode array to be tested is placed on the pressure plate with its dielectric sheet facing the pressure plate and the bottom opening is covered so that the dielectric sheet is exposed in the corresponding test hole; S103: The base plate is placed on the pressure plate so that the electrode array is clamped and fixed between the pressure plate and the base plate, and the electrode array seals the bottom opening of the test hole; S104: The stacked pressure plate, the electrode array and the base plate are reversed as a whole so that the pressure plate is on the upper layer and the test hole of the pressure plate is exposed.

[0010] Further, the specific operation of step S10 is as follows: S101': The electrode array to be tested is placed on the base plate with its dielectric sheet facing away from the base plate; S102': The pressure plate is placed on the base plate so that the electrode array is sandwiched between the base plate and the pressure plate, the electrode array seals the bottom opening of the pressure plate and exposes the dielectric sheet in the corresponding test hole.

[0011] Furthermore, the pressure plate has a shallow groove on its bottom surface facing the base plate that connects to a plurality of the test holes, and the electrode array is located in the shallow groove and abuts against the inner wall of the pressure plate located in the shallow groove.

[0012] Furthermore, the detection device also includes a seal clamped between the electrode array and the base plate, the seal being placed in the shallow groove and abutting against the electrode array.

[0013] Furthermore, the sealing element is provided with several annular portions and connecting strips connecting adjacent annular portions. The base plate is provided with a boss, and the boss is provided with several protrusions and ribs connecting adjacent protrusions. The annular portions are fitted over the protrusions after the pressure plate and the base plate are stacked. The connecting strips are stacked on the ribs. The boss and the sealing element are both embedded in the shallow groove.

[0014] Furthermore, the protrusion has a step around its circumference, and the annular portion is located on the step and fitted over the protrusion.

[0015] Furthermore, the top surface of the rib facing the pressure plate is flush with the top surface of the step, and the top surface of the annular portion facing the pressure plate is higher than the top surface of the protrusion.

[0016] Furthermore, the outer contour dimension of the annular portion is larger than the size of the test hole.

[0017] Furthermore, after the dielectric sheet of the electrode array is tested, the following step S50 is also included: after the dielectric sheet of the electrode array is tested, the conductive solution in the test hole is drawn out, the pressure plate is lifted, and the electrode array is taken out.

[0018] Furthermore, the electrode array is provided with a wiring portion that is connected to the side of its dielectric sheet away from the conductive solution and is used to connect the power supply; the connection of the electrode array in step S40 specifically means connecting the wiring portion of the electrode array.

[0019] The detection method using the detection device in this application can accurately detect the electrical parameters of the dielectric sheet of the electrode array and can achieve non-destructive testing.

[0020] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0021] Figure 1 This is a perspective view of a detection device and electrode array according to one embodiment of this application;

[0022] Figure 2 for Figure 1 An exploded view of the detection device and electrode array shown.

[0023] Figure 3 for Figure 2 A partial three-dimensional enlargement of the base plate boss of the detection device shown in the figure;

[0024] Figure 4 for Figure 2 A perspective view of the detection device shown with the pressure plate in an inverted state;

[0025] Figure 5 For along Figure 1 The cross-sectional view obtained from line AA in the diagram;

[0026] Figure 6 For along Figure 5 Enlarged view of point A in the image;

[0027] Figure 7 A flowchart illustrating a method for detecting the dielectric parameters of an electrode array using the detection device described in this application;

[0028] Figure 8 for Figure 7 A flowchart showing a specific implementation of step S10 in the flowchart shown;

[0029] Figure 9 for Figure 7 The flowchart shown is a flowchart of another specific embodiment of step S10.

[0030] Explanation of reference numerals in the attached figures:

[0031] The testing device 100 includes a base plate 1, a boss 11, a protrusion 12, a rib 13, a step 14, a pressure plate 2, a test hole 21, a bottom opening 211, a shallow groove 22, a test assembly 3, a conductive part 31, an electrode mounting part 32, a heating device 33, an external arm 34, a conductive lead 35, a sealing element 4, an annular part 41, a connecting strip 42, an electrode array 200, a dielectric sheet 201, a front side 202, a wiring part 203, and an electrode unit 204. Detailed Implementation

[0032] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses, systems, devices, and methods consistent with some aspects of this application.

[0033] refer to Figure 1 and Figure 2 As shown, the detection device 100 can be used to detect the electrical parameters of the dielectric sheet 201 of the electrode array 200. Its detection principle is to form a capacitor by using a conductive solution to form each dielectric sheet 201 of the electrode array 200 under test into a capacitor, and then measure the electrical parameters.

[0034] The testing device 100 includes a base plate 1, a pressure plate 2, and a testing assembly 3. An electrode array 200 is positioned on the base plate 1, and the pressure plate 2 is stacked on top of the base plate 1. The electrode array 200 is clamped between the base plate 1 and the pressure plate 2, exposing the uncoated front surface 202 of the dielectric sheet 201. The pressure plate 2 has several through-holes 21. Each test hole 21 has a bottom opening 211 on the side of the pressure plate 2 facing the base plate 1. Each dielectric sheet 201 of the electrode array 200 is correspondingly positioned with each test hole 21, sealing the bottom opening 211 of the test hole 21. After the base plate 1, electrode array 200, and pressure plate 2 are in place, a conductive solution is injected into each test hole 21, contacting the front surface 202 of the dielectric sheet 201. The testing assembly 3 has a conductive part 31. The testing assembly 3 is placed on the pressure plate 2, and the conductive part 31 extends into the test hole 21, contacting the conductive solution and making conductive contact with the dielectric sheet 201 through the conductive solution. The electrode array 200 has a wiring portion 203 that is connected to the metal layer (not shown) on the back side of each dielectric sheet 201. Connecting the wiring portion 203 to an external power source via a wire (not shown) forms a detection circuit that uses the dielectric sheet 201 as a capacitor. Then, connecting the conductive portion 31 and the wiring portion 203 to an external testing device (not shown) or detection circuit (not shown) allows for the testing of the electrical parameters of the dielectric sheet 201. This testing method uses a relatively small amount of conductive solution because the distance between the end of the conductive portion 31 and the electrode array 200 can be controlled to be small, thus minimizing conductive solution bias. This method is suitable for testing dielectric sheets 201 with extremely low dielectric loss, such as single dielectric sheets 201 with an equivalent resistance of less than 0.5Ω. In this embodiment, the conductive portion 31 is a metallic conductive portion.

[0035] refer to Figure 2 and Figure 3 As shown, the electrode array 200 under test is an electrode array for tumor electric field therapy. Several pairs of electrode arrays 200 are attached to the surface of the patient's tumor area on opposite sides via adhesive (not shown) and are directly or indirectly connected to an electric field generating device (not shown). The electric field generating device (not shown) transmits an alternating electrical signal for tumor electric field therapy to each pair of electrode arrays 200 to generate a mid-frequency (e.g., 50kHz to 1MHz), low-intensity alternating electric field for tumor therapy between the pairs of electrode arrays 200, so as to perform electric field therapy on the corresponding tumor area. The electrode array 200 includes a flexible circuit board (not shown), which has several circularly arranged main bodies (not shown) and connecting parts (not shown) connecting adjacent main bodies (not shown). A wiring part 203 is electrically connected to one of the connecting parts (not shown) or one of the main bodies (not shown). Dielectric sheets 201 are respectively disposed on each main body portion (not shown). Specifically, the dielectric sheets can be ceramic sheets or thin films formed of high dielectric materials. The dielectric sheets 201 and the corresponding main body portions (not shown) together form electrode units 204.

[0036] The detection device 100 also includes a sealing member 4 sandwiched between the base plate 1 and the electrode array 200 and having the same shape as the electrode array 200. The upper and lower surfaces of the sealing member 4 are flat surfaces, and it includes multiple hollow annular portions 41 and several connecting strips 42 connecting adjacent annular portions 41. The outer contour of the electrode unit 204 is larger than the size of the test hole 21, the outer contour of the annular portion 41 is larger than the size of the test hole 21, and the inner contour of the annular portion 41 is not larger than the outer contour size of the electrode unit 24. In this embodiment, the outer contour of the annular portion 41 is the same as the outer contour size of the electrode unit 204. The distribution pattern of the annular portions 41 is consistent with the distribution pattern of the electrode units 204 of the electrode array 200, and the distribution pattern of the connecting strips 42 is consistent with the distribution pattern of the connecting portions (unlabeled) of the electrode array 200, so that the sealing member 4 can abut against and support the electrode array 200.

[0037] The base plate 1 is provided with a boss 11 for positioning and abutting the sealing element 4, corresponding to the electrode array 200. The shape of the boss 11 is consistent with the shape of the electrode array 200. The boss 11 includes several circular protrusions 12 corresponding to each electrode unit 204 and ribs 13 connecting adjacent protrusions 12. Since the shape of the sealing element 4 is also consistent with the shape of the electrode array 200, the shape of the boss 11 is also consistent with the shape of the sealing element 4. The protrusions 12 have a stepped surface 14 facing the pressure plate 2 on their top and around their circumference. The stepped surface 14 is flush with the top surface of the ribs 13. Figure 5 As shown, after the base plate 1, sealing element 4, electrode array 200, and pressure plate 2 are assembled, each annular portion 41 of the sealing element 4 is tightly fitted around the top of the corresponding protrusion 12 and placed on the step 14. The protrusion 12 and the step 14 support the annular portion 41, and the rib 13 supports the connecting strip 42. The sealing element 4 is located between the boss 11 of the base plate 1 and the electrode array 200, with one side abutting against the boss 11 of the base plate 1 and the other side abutting against the electrode array 200.

[0038] refer to Figure 4 As shown, several test holes 21 on the pressure plate 2 are interconnected in pairs, forming pairs corresponding to two adjacent dielectric sheets 201 on the electrode array 200. The bottom openings 211 of the test holes 21 are stepped holes and interconnected, forming a shallow groove 22 on the bottom surface of the pressure plate 2 facing the base plate 1. The shape of the shallow groove 22 matches the shape of the electrode array 200. Figure 2 , Figure 5 and Figure 6As shown, the electrode array 200 is placed entirely within the shallow groove 22 with the dielectric sheet 201 facing the test hole 21 and abutting against the inner wall of the pressure plate 2 located in the shallow groove 22. Each electrode unit 204 of the electrode array 200 covers the bottom opening 211 of the test hole 21, and the uncoated front side 202 of the dielectric sheet 201 of the electrode unit 204 is exposed in the corresponding test hole 21. When the pressure plate 2 is placed on the base plate 1, the boss 11 and the sealing member 4 on the base plate 1 are embedded entirely into the shallow groove 22. The boss 11 presses against the sealing member 4 towards the electrode array 200, thereby pressing the sealing member 4 against the electrode array 200, so that the electrode array 200 is clamped between the inner wall of the pressure plate 2 located in the shallow groove 22 and the sealing member 4. Under the pressing action of the base plate 1 and the sealing member 4, the electrode array 200 can seal the bottom opening 211 of all the test holes 21, which can prevent the conductive solution in the test holes 21 from leaking. After the seal 4 is placed on the base plate 1, the top surface of its annular part 41 facing the pressure plate 2 is slightly higher than the top surface of the protrusion 12 of the base plate 1. Therefore, after the base plate 1 and the pressure plate 2 are assembled, there is a gap between the side of the electrode unit 204 facing the base plate 1 and the protrusion 12, that is, the protrusion 12 will not contact the electrode unit 204, thus avoiding damage to the electrode unit 204.

[0039] The test assembly 3 is provided with an electrode mounting part 32 for mounting conductive parts 31. The conductive parts 31 are cylindrical, with a diameter slightly smaller than that of the test holes 21, so that the conductive parts 31 can smoothly extend downward into the test holes 21 to contact the conductive solution located in the test holes 21. The test assembly 3 has two conductive parts 31, which are inserted into two interconnected test holes 21. Optionally, a heating device 33 can also be configured in the electrode mounting part 32 to heat the conductive parts 31 and control their temperature. A heating device (not shown) can also be mounted on the bottom of the base plate 1. The test assembly 3 can also be provided with an external arm 34 connected to the electrode mounting part 32, which can be used to connect external robotic arms or other devices to achieve automated control of the test assembly 3. The electrode mounting part 32 is provided with a conductive lead 35, one end of which is electrically connected to the conductive parts 31, and the other end can be connected to external testing equipment (not shown) or detection circuit (not shown). The conductive lead 35 is a metal conductive lead.

[0040] During testing, the assembly and testing sequence of the testing device 100 is as follows: First, the pressure plate 2 is inverted, that is, the shallow groove 22 of the pressure plate 2 is placed upwards. Then, the electrode array 200 is embedded in the shallow groove 22 of the pressure plate 2 with the dielectric sheet 201 facing the pressure plate 2. The electrode array 200 covers the bottom opening 211 of all test holes 21 from the bottom side, and each dielectric sheet 201 is exposed in each test hole 21. After that, the sealing member 4 is placed in the shallow groove 22. Then, the base plate 1 is placed on the inverted pressure plate 2 with the boss 11 facing the pressure plate 2. The boss 11 extends into the shallow groove 22 and abuts against the sealing member 4, so that each annular part 41 of the sealing member 4 is placed at each step 14 and sleeved on each protrusion 12 of the boss 11. Then, the stacked pressure plate 2, electrode array 200, sealing member 4 and base plate 1 are reversed as a whole, so that the base plate 1 is below and the pressure plate 2 is above. In other embodiments, the base plate 1 can be placed with its steps 14 facing upwards, and the seal 4 can be placed on the base plate 1 with each annular portion 41 of the seal 4 positioned at each step 14 and fitted over each protrusion 12 of the boss 11; the electrode array 200 to be tested can be placed on the seal 4 with its dielectric sheet 201 facing away from the base plate 1; then the pressure plate 2 can be placed on the base plate 1 with its shallow groove 22 facing the base plate 1 and the electrode array 200, the seal 4 and the boss 11 located in the shallow groove 22, with the electrode array 200 covering the bottom opening 211 of the pressure plate 2 and each dielectric sheet 201 exposed in each test hole 21. The step 14 of the base plate 1 presses the sealing element 4 against the pressure plate 2 onto the electrode array 200, ensuring tight contact between the electrode array 200 and the inner wall of the pressure plate 2 located in the shallow groove 22. This seals the bottom openings 211 of all test holes 21, preventing gaps from forming at the contact points between the test holes 21 and the electrode array 200, which could lead to leakage of the conductive solution within the test holes 21. After assembling the pressure plate 2, electrode array 200, sealing element 4, and base plate 1, conductive solution is dripped into the test holes 21 of the pressure plate 2. The conductive part 31 of the test component 3 is then inserted into the test hole 21 and contacts the conductive solution. A test device or a self-made detection circuit is then used to connect the conductive lead 35 to the wiring part 203 of the electrode array 200 to test the capacitance, resistance, and other electrical parameters of the dielectric sheet 201 of the electrode array 200. After testing, a pipette is used to remove the conductive solution, the pressure plate 2 is lifted, and the electrode array 200 is removed.

[0041] The conductive solution can be a high-concentration, safe, non-toxic, and non-corrosive solution, such as potassium chloride solution or sodium chloride solution, with a conductivity of over 20 S / m. The type and concentration of the conductive solution need to be calculated to ensure that the resistance of the conductive solution itself is as low as possible compared to the resistance of the dielectric sheet 201 of the electrode array 200 under test, so as to achieve high detection accuracy without damaging the dielectric sheet 201 under test.

[0042] Reference Figures 7 to 9As shown, this application also provides a method for detecting the electrical parameters of the dielectric sheet 201 of the electrode array 200 using the above-described detection device 100. The detection method includes the following steps:

[0043] S10: Place the electrode array 200 to be tested between the pressure plate 2 and the base plate 1, so that the electrode array 200 is positioned with its dielectric sheet 201 facing the pressure plate 2 and covers the bottom opening 211 so that the dielectric sheet 201 is exposed in the corresponding test hole 21.

[0044] S20: Add the conductive solution into the test hole 21 of the pressure plate 2 so that the conductive solution comes into contact with the dielectric sheet 201 of the electrode array 200.

[0045] S30: The test component 3 is brought close to the pressure plate 2 with its conductive part 31 facing the pressure plate 2 so that the conductive part 31 extends into the corresponding test hole 21 of the pressure plate 2 and comes into contact with the conductive solution in the test hole 21.

[0046] S40: Connect the conductive part 31 of the electrode array 200 and the test component 3 and connect the test equipment or detection circuit to obtain the electrical parameters of the dielectric sheet 201.

[0047] Specifically, the operation of step S10 above is as follows:

[0048] S101: Reverse the pressure plate 2 of the detection device 100 so that the bottom opening 211 of the pressure plate 2 faces upward;

[0049] S102: Place the electrode array 200 under test on the pressure plate 2 with its dielectric sheet 201 facing the pressure plate 2 and cover the bottom opening 211 so that the dielectric sheet 201 is exposed in the corresponding test hole 21;

[0050] S103: Place the base plate 1 on the pressure plate 2 so that the electrode array 200 is clamped and fixed between the pressure plate 2 and the base plate 1, and the electrode array 200 seals the bottom opening 211 of the test hole 21;

[0051] S104: The stacked pressure plate 2, electrode array 200 and base plate 1 are reversed as a whole so that the pressure plate 2 is on the upper layer and the test hole 21 of the pressure plate 2 is exposed.

[0052] The above step S10 can also be performed as follows:

[0053] S101': Place the electrode array 200 under test on the base plate 1 with its dielectric sheet 201 facing away from the base plate 1;

[0054] S102': Place the pressure plate 2 on the base plate 1 so that the electrode array 200 is sandwiched between the base plate 1 and the pressure plate 2. The electrode array 200 seals the bottom opening 211 of the pressure plate 2 and exposes the dielectric sheet 201 in the corresponding test hole 21.

[0055] After the dielectric sheet of the electrode array is tested, the following step S50 is further included: drawing out the conductive solution in the test hole, lifting the pressure plate and taking out the electrode array.

[0056] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A method for detecting the electrical parameters of a dielectric sheet in an electrode array using a detection device, characterized in that: The detection device includes a base plate, a pressure plate disposed on the base plate, and a testing assembly. The pressure plate has a plurality of test holes for accommodating a conductive solution. Each test hole forms a bottom opening at one end of the pressure plate near the base plate. The testing assembly has a conductive part for extending into the test holes and contacting the conductive solution within the test holes. The detection method includes the following steps: S10: Place the electrode array to be tested between the pressure plate and the base plate, such that the electrode array is positioned with its dielectric sheet facing the pressure plate and covers the bottom opening so that the dielectric sheet is exposed in the corresponding test hole; S20: Add the conductive solution into the test hole of the pressure plate so that the conductive solution comes into contact with the dielectric sheet of the electrode array; S30: The test component is brought close to the pressure plate with its conductive part facing the pressure plate so that the conductive part extends into the corresponding test hole of the pressure plate and comes into contact with the conductive solution in the test hole; S40: Turn on the conductive parts of the electrode array and the test component and connect the test equipment or detection circuit to obtain the electrical parameters of the dielectric sheet.

2. The method according to claim 1, characterized in that: The specific operation of step S10 is as follows: S101: The pressure plate of the detection device is placed upside down so that the bottom opening of the pressure plate faces upward; S102: Place the electrode array to be tested on the pressure plate with its dielectric sheet facing the pressure plate and cover the bottom opening so that the dielectric sheet is exposed in the corresponding test hole; S103: The base plate is placed on the pressure plate so that the electrode array is clamped and fixed between the pressure plate and the base plate, and the electrode array seals the bottom opening of the test hole; S104: The stacked pressure plate, the electrode array and the base plate are reversed as a whole so that the pressure plate is on the upper layer and the test hole of the pressure plate is exposed.

3. The method according to claim 1, characterized in that: The specific operation of step S10 is as follows: S101': The electrode array to be tested is placed on the base plate with its dielectric sheet facing away from the base plate; S102': The pressure plate is placed on the base plate so that the electrode array is sandwiched between the base plate and the pressure plate, the electrode array sealing the bottom opening of the pressure plate and exposing the dielectric sheet in the corresponding test hole.

4. The method according to any one of claims 2 or 3, characterized in that: The pressure plate has a shallow groove on its bottom surface facing the base plate that connects to several of the test holes. The electrode array is located in the shallow groove and abuts against the inner wall of the pressure plate located in the shallow groove.

5. The method according to claim 4, characterized in that: The detection device further includes a sealing element clamped between the electrode array and the base plate, the sealing element being placed in the shallow groove and abutting against the electrode array.

6. The method according to claim 5, characterized in that: The sealing element has several annular portions and connecting strips connecting adjacent annular portions. The base plate has a boss, and the boss has several protrusions and ribs connecting adjacent protrusions. The annular portions are fitted over the protrusions after the pressure plate and the base plate are stacked. The connecting strips are stacked on the ribs. The boss and the sealing element are both embedded in the shallow groove.

7. The method according to claim 6, characterized in that: The protrusion has a step around its circumference, and the annular portion is located on the step and fitted over the protrusion.

8. The method according to claim 7, characterized in that: The top surface of the rib facing the pressure plate is flush with the top surface of the step, and the top surface of the annular portion facing the pressure plate is higher than the top surface of the protrusion.

9. The method according to claim 6, characterized in that: The outer contour dimension of the annular portion is larger than the size of the test hole.

10. The method according to claim 1, characterized in that: After the dielectric sheet of the electrode array is tested, the following step S50 is further included: drawing out the conductive solution in the test hole, lifting the pressure plate and taking out the electrode array.

11. The method according to claim 1, characterized in that: The electrode array is provided with a wiring portion that is connected to the side of its dielectric sheet away from the conductive solution and is used to connect the power supply; the connection of the electrode array in step S40 specifically means connecting the wiring portion of the electrode array.

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