Shielding cover, circuit board assembly and electronic equipment

Abstract

The invention discloses a shielding case, a circuit board assembly and electronic equipment, relates to the technical field of electronic products, and can reduce the occupied space of the shielding case and reduce the weight of the shielding case while ensuring the shielding performance of the shielding case. Wherein the shielding case comprises a shielding main body and a shielding cover, and the shielding main body is provided with an opening; the shielding cover is connected to the shielding body and covers the opening, the shielding cover comprises a conductive cloth layer, the conductive cloth layer comprises first pores, the maximum aperture of the first pores is smaller than or equal to 75 micrometers, and the ratio of the number of the first pores to the total pore number of the conductive cloth layer is larger than or equal to 80%.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more particularly to a shielding cover, circuit board assembly, and electronic device. Background Technology

[0002] Electronic devices such as mobile phones and tablets often contain many noise sources, such as integrated circuits (ICs), power inductors, double data rate synchronous dynamic random access memory (DDR), and DDR traces. To prevent different noise sources from interfering with each other and to avoid noise sources affecting the wireless communication performance of electronic devices, shielding covers and other methods are often used to confine the noise sources within the shielding cover.

[0003] However, the shielding covers in the relevant technologies cannot reduce the size and weight of the shielding cover while ensuring its shielding performance. Summary of the Invention

[0004] This application provides a shielding cover, a circuit board assembly, and an electronic device that can reduce the space occupied by the shielding cover and reduce its weight while ensuring the shielding performance of the shielding cover.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] In a first aspect, this application provides a shielding cover, which includes a shielding body and a shielding cover. The shielding body has an opening. The shielding cover is connected to the shielding body and covers the opening. The shielding cover includes a conductive cloth layer. The conductive cloth layer includes a first pore. The maximum pore diameter of the first pore is less than or equal to 75 micrometers, and the ratio of the number of the first pores to the total number of pores in the conductive cloth layer is greater than or equal to 80%.

[0007] The shielding cover in this embodiment uses a conductive cloth layer to cover the opening, and sets the maximum aperture of the pores in the conductive cloth layer, which account for no less than 80% of the total, to be less than or equal to 75 micrometers. This effectively improves the shielding performance of the conductive cloth layer, thereby preventing electromagnetic wave leakage from affecting the performance of electronic components and the wireless communication performance of electronic devices. Because the conductive cloth layer can be made thinner and lighter, and because it has good flexibility and can adapt well to the surface shape of the shielding body, it is not prone to breakage or cracking. Therefore, the shielding cover in this embodiment can reduce the maintenance difficulty of electronic components inside the shielding cover, meet shielding requirements, and reduce the overall volume and weight of the shielding cover. This allows for a thinner and lighter design of electronic devices while ensuring their wireless communication performance.

[0008] In one possible implementation of the first aspect, the conductive fabric layer is a single layer of conductive fabric. Using a single layer of conductive fabric as the conductive fabric layer effectively reduces the overall thickness and weight of the conductive fabric layer, thereby helping to reduce the overall volume and weight of the shielding cover. This allows for a slimmer and lighter design of electronic devices while still meeting the shielding performance requirements.

[0009] In one possible implementation of the first aspect, the conductive cloth layer includes multiple conductive cloths stacked in a first direction; wherein the orthographic projection of at least a portion of the pores in one conductive cloth layer onto a reference plane overlaps with the orthographic projection of the non-pore portions of at least one other conductive cloth layer onto the reference plane; the reference plane is perpendicular to the first direction.

[0010] In this way, at least some of the pores in one layer of conductive cloth can be directly opposite the conductive structure (i.e., the non-porous part) of other conductive cloths, so that electromagnetic waves entering the pores can be blocked by other conductive cloths. This helps to reduce the maximum pore size of the first pore and increase the proportion of the first pore, so that the maximum pore size and proportion of the first pore in the conductive cloth layer meet the requirements.

[0011] In one possible implementation of the first aspect, the conductive cloth includes a first fiber and a second fiber, the extension direction of the first fiber being different from the extension direction of the second fiber; in two adjacent conductive cloth layers, the extension direction of the first fiber of one conductive cloth is different from the extension direction of the first fiber of the other conductive cloth.

[0012] This increases the area and probability of the pores in one of the two adjacent conductive fabric layers being blocked by the non-pore parts of the other conductive fabric layer. This helps to reduce the maximum pore size of the first pore in the conductive fabric layer, increase the proportion of the first pore, and thus improve the shielding performance of the conductive fabric layer.

[0013] In one possible implementation of the first aspect, in two adjacent conductive fabric layers, the extension direction of the first fiber of one conductive fabric layer is different from the extension direction of the second fiber of the other conductive fabric layer. This increases the probability that the pores in one of the two adjacent conductive fabric layers will be blocked by the non-pore portions of the other conductive fabric layer, and further increases the area of ​​blocked pores. This helps to reduce the maximum pore size of the first pore in the conductive fabric layer, increases the proportion of the first pore, and consequently improves the shielding performance of the conductive fabric layer.

[0014] In one possible implementation of the first aspect, the conductive cloth has at least three layers, and in a first direction, from one side surface of the conductive cloth layer to the other side surface of the conductive cloth layer, the first fibers of the multilayer conductive cloth are deflected sequentially at a predetermined angle in a clockwise direction.

[0015] This allows the first fibers in the multi-layer conductive fabric to be arranged in a spiral stacked form, which helps to reduce the size of the first pores and increase their proportion, thereby improving the shielding performance of the conductive fabric layer. At the same time, it also simplifies the processing technology of the conductive fabric layer and reduces production costs.

[0016] In one possible implementation of the first aspect, the thickness of the conductive fabric layer is less than or equal to 40 micrometers. This is beneficial for reducing the thickness and weight of the shielding cover, and consequently for reducing the overall volume and weight of the shielding cover.

[0017] In one possible implementation of the first aspect, the shielding body includes a first top plate and a first side frame, the first top plate having an opening; the first side frame surrounds the outer periphery of the first top plate, and the first side frame and the first top plate form an accommodating space, the opening communicating with the accommodating space. This facilitates the repair or replacement of electronic components inside the shielding cover from the opening, and the structure is simple and easy to manufacture.

[0018] In one possible implementation of the first aspect, the first top plate includes a first outer wall facing away from the receiving space, the first outer wall having a recessed groove, and at least a portion of the shielding cover is located within the recessed groove. Specifically, a portion of the shielding cover is located within the recessed groove, or the entire shielding cover is located within the recessed groove. This is beneficial for reducing the superimposed dimensions of the shielding cover and the shielding body, thereby reducing the overall height of the shielding cover and consequently reducing the overall volume of the shielding cover.

[0019] In one possible implementation of the first aspect, the first outer wall surface includes a first region and a second region, the first region being recessed into the interior of the receiving space relative to the second region to form a recessed groove; the first outer wall surface includes a third region connected between the first region and the second region; the shielding cover includes an adhesive structure, through which a conductive cloth layer is connected to at least two of the first region, the second region and the third region.

[0020] This increases the overlap width between the adhesive structure and the shielding body, improving the connection reliability between the conductive fabric and the shielding body while enhancing the wireless communication performance of electronic devices.

[0021] In one possible implementation of the first aspect, the first top plate includes a first inner wall surface facing away from a first outer wall surface; a third region extends toward the central axis of the first region in a direction from the first outer wall surface to the first inner wall surface. The central axis of the first region refers to an axis passing through the geometric center of the first region and perpendicular to the first region.

[0022] In this way, on the one hand, the overlap width between the third region and the adhesive structure can be increased without increasing the depth of the recessed groove, which is beneficial to ensuring the shielding performance of the shielding cover while ensuring the volume of the shielding space of the shielding cover; on the other hand, it is also beneficial to reduce the bending angle of the conductive cloth layer, which can help reduce the stress on the conductive cloth layer, thereby improving the reliability of the conductive cloth layer.

[0023] In one possible implementation of the first aspect, the shielding cover includes an adhesive structure, through which the conductive fabric layer is connected to the shielding body. The structure is simple and easy to assemble and disassemble.

[0024] In one possible implementation of the first aspect, the adhesive structure includes an adhesive and conductive particles, the conductive particles being dispersed in the adhesive, and a first gap of less than or equal to 400 micrometers between adjacent conductive particles. This approach balances the shielding performance and adhesive performance of the adhesive structure, ensuring the shielding performance of the shielding cover and the reliability of the connection between the conductive fabric layer and the shielding body.

[0025] In one possible implementation of the first aspect, the adhesive is a thermosetting adhesive. Thermosetting adhesives have excellent bonding properties, which can ensure the reliability of the connection between the conductive fabric layer and the shielding body while increasing the density of conductive particles and reducing the first gap. Therefore, more and denser conductive particles can be incorporated into the thermosetting adhesive, ultimately achieving better shielding effectiveness and a thinner thickness.

[0026] In one possible implementation of the first aspect, the conductive fabric layer includes an abutment portion located circumferentially outside the opening and abutting against the shielding body. In this way, the conductive fabric layer can achieve electrical connection through the contact between the abutment portion and the shielding body, enabling a gapless fit between the conductive fabric layer and the shielding body. This blocks the radiation path of electromagnetic waves, effectively preventing outward radiation of electromagnetic waves and further improving the shielding performance of the shield.

[0027] In one possible implementation of the first aspect, the shielding cover further includes a pressing member located on the side of the abutment portion opposite to the shielding body, for applying a force from the abutment portion toward the shielding body to the abutment portion. In this way, the abutment portion can remain in close contact with the shielding body under the action of the pressing member, ensuring the shielding performance of the shielding cover.

[0028] In one possible implementation of the first aspect, a buffer is provided between the pressing member and the abutting part. In this way, the force between the pressing member and the abutting part can be buffered, which on the one hand helps to reduce the friction on the surface of the abutting part and prevents the conductive layer in the conductive cloth from falling off; on the other hand, it also helps to absorb the assembly tolerance between the pressing member and the shielding body, thereby reducing the assembly difficulty of the electronic device.

[0029] In one possible implementation of the first aspect, the pressing component may include a connected pressing portion and a connecting ear, the connecting ear being located circumferentially outside the pressing portion, and the pressing portion and the abutting portion being stacked. This allows for connection to the shielding body via the connecting ear, reducing the difficulty of connecting the pressing component to the shielding body.

[0030] In one possible implementation of the first aspect, the press-fitting part abuts against the abutting portion. Another implementation is provided.

[0031] Secondly, this application provides a circuit board assembly, including a circuit board, a shielding cover, and a first electronic component. The shielding cover is fixed to the circuit board, and a shielding space is formed between the shielding cover and the circuit board. The shielding cover can be any of the shielding covers described above. The first electronic component is electrically connected to the circuit board, and the first electronic component is located within the shielding space.

[0032] Thirdly, this application provides an electronic device, including a housing and a circuit board assembly, wherein the circuit board assembly is disposed within the housing, and the circuit board assembly is the circuit board assembly of any of the above-mentioned technical solutions.

[0033] The technical effects of any of the design methods in the second and third aspects can be found in the technical effects of different design methods in the first aspect, and will not be repeated here. Attached Figure Description

[0034] Figure 1 Perspective views of electronic devices provided in some embodiments of this application;

[0035] Figure 2 for Figure 1 Exploded view of the electronic device shown;

[0036] Figure 3 Cross-sectional views of circuit board assemblies provided in some embodiments of this application;

[0037] Figure 4 Cross-sectional views of circuit board assemblies provided for other embodiments of this application;

[0038] Figure 5 Cross-sectional views of the shielding cover provided in some embodiments of this application;

[0039] Figure 6 Cross-sectional views of circuit board assemblies provided for some embodiments of this application;

[0040] Figure 7 Cross-sectional views of conductive fabric provided in some embodiments of this application;

[0041] Figure 8 This is a top view of the conductive fabric layer in the embodiments of this application;

[0042] Figure 9 for Figure 8 A partial cross-sectional view of the conductive fabric layer shown;

[0043] Figure 10 This is a schematic diagram of the conductive cloth structure under a microscope in some other embodiments of this application;

[0044] Figure 11 This is a cross-sectional view of a circuit board assembly in some other embodiments of this application;

[0045] Figure 12 for Figure 10 A partial cross-sectional view of the conductive fabric layer shown;

[0046] Figure 13 for Figure 11 A schematic diagram of the stacking of two adjacent conductive fabric layers in the conductive fabric layer shown;

[0047] Figure 14 This is a schematic diagram of the structure of the conductive fabric layer provided in some embodiments of this application;

[0048] Figure 15 This is a schematic diagram showing the connection between the adhesive structure and the conductive cloth layer provided in some embodiments of this application;

[0049] Figure 16 for Figure 15 A top view of the adhesive structure shown;

[0050] Figure 17 for Figure 6 Enlarged view of section A circled in the circuit board assembly shown;

[0051] Figure 18 Cross-sectional views of circuit board assemblies provided for some embodiments of this application;

[0052] Figure 19 for Figure 18 The diagram shows the assembly of the shielding body and the circuit board in the circuit board assembly shown.

[0053] Figure 20 This application provides schematic diagrams of the structure of circuit board assemblies in some of its embodiments.

[0054] Figure 21 A partial structural schematic diagram of a circuit board assembly provided for some embodiments of this application;

[0055] Figure 22 A graph showing the electric field shielding effectiveness of different shielding covers;

[0056] Figure 23 The graph shows the magnetic field shielding effectiveness of different shielding covers.

[0057] Figure label:

[0058] 100 electronic devices;

[0059] 10. Screen; 11. Light-transmitting cover; 12. Display screen;

[0060] 20; 21; 211; 212; 22; 20;

[0061] Circuit board assembly 30; Shielding space Q;

[0062] Circuit board 31; electronic component 32; first electronic component 321;

[0063] Shielding cover 33; shielding body 331; first side frame 3311; first top plate 3312; first outer wall surface s; first region s11; second region s12; third region s13; opening K; shielding cover 332; shielding copper foil 332a; first adhesive layer 332b; fourth conductive cloth 332c; second adhesive layer 332d; shielding film 332e; conductive cloth layer 3321; conductive cloth 3321a; first conductive cloth 3321a1; the first Second conductive cloth 3321a2; Third conductive cloth 3321a3; Substrate layer A1; First surface A11; Second surface A12; Conductive layer A2; First fiber B1; Second fiber B2; First pore K1; First opening K11; Second opening K12; Abutment part D1; Adhesive structure 3322; Adhesive 3322a; Conductive particles 3322b; First hole K1a; Second hole K1b; Third hole K1c; Fourth hole K1d;

[0064] Recessed groove C1; Pressing part 34; Pressing part 341; Connecting ear 342; Buffer 35. Detailed Implementation

[0065] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0066] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0067] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0068] In the description of the embodiments of this application, "and / or" is merely a way of describing the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this application generally indicates that the related objects before and after it are in an "or" relationship.

[0069] In the embodiments of this application, directional terms such as "upper", "lower", "inner", and "outer" may be defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms can be relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0070] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, "joining" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. A detachable connection means that the connected components can be separated without damaging any parts. A non-detachable connection means that once the connection is completed, it cannot be separated without damaging the connected components. A "fixed connection" means that the components are connected to each other and their relative positional relationship remains unchanged after the connection. A fixed connection can be either a detachable or non-detachable connection.

[0071] In the description of embodiments of this application, the terms "consistent direction," "perpendicular," "parallel," and "equal" include the described situation and situations that are similar to the described situation, where the range of similarity is within an acceptable deviation range. For example, "parallel" includes absolute parallelism and approximately parallelism, where the acceptable deviation range for approximately parallelism can be, for example, a deviation within 15°; "perpendicular" includes absolute perpendicularity and approximately perpendicularity, where the acceptable deviation range for approximately perpendicularity can also be, for example, a deviation within 15°. "Equal" includes absolute equality and approximately equality, where the acceptable deviation range for approximately equality can be, for example, a difference between the two equalities being less than or equal to 15% of either one.

[0072] To facilitate understanding, before providing a detailed description of the shielding cover, circuit board assembly, and electronic device in the embodiments of this application, the relevant terms involved in the embodiments of this application will first be explained.

[0073] Orthographic projection: refers to projection in which the projection lines are perpendicular to the projection plane.

[0074] Stacked configuration: This refers to the stacking of individual layers along the thickness direction of the layer structure. The individual layers in a stacked configuration can be in direct contact with each other, or other layers can be interspersed among them.

[0075] Abutting: refers to two parts coming into contact with each other, and there is a squeezing force between the two parts.

[0076] Conductive nonwoven fabric: It is a type of nonwoven fabric that can be made by adding conductive fibers (such as metal fibers, carbon fibers, etc.) into the nonwoven fabric production process, or by pressing conductive fibers together.

[0077] Conductive fiber cloth: This type of cloth uses textile fiber cloth (such as polyester fiber cloth) as the base material and is made conductive through special processing techniques (such as metal plating). This type of cloth retains the texture and a certain degree of flexibility of the fiber cloth.

[0078] Included angle: refers to the smallest positive angle formed by the intersection of two straight lines.

[0079] In the embodiments of this application, the shielding cover uses one or more layers of conductive cloth to cover the opening on the shielding body. By designing the maximum pore size and proportion of the first pore in the conductive cloth layer, the conductive cloth layer can meet the shielding performance requirements of the shielding cover.

[0080] Since the conductive cloth layer can be made thinner and lighter, the shielding cover, circuit board assembly and electronic device in the embodiments of this application can reduce the maintenance difficulty of electronic components (such as the first electronic component below) and meet the shielding requirements, while reducing the overall volume and weight of the shielding cover. This is beneficial to improving the wireless communication performance of electronic devices while realizing the lightweight design of electronic devices.

[0081] This application provides an electronic device, which is a type of electronic device with a shielding cover and a circuit board assembly. The electronic device in this application can be a mobile phone, tablet computer, laptop computer, e-reader, smart home device, in-vehicle device, wearable device, etc. Wearable devices include, but are not limited to, wristbands, watches, augmented reality (AR) glasses, AR headsets, virtual reality (VR) glasses, VR headsets, etc. This application does not impose any special limitations on the specific form of the electronic device.

[0082] The electronic devices in the embodiments of this application can be foldable electronic devices (such as foldable screen mobile phones) or non-foldable electronic devices (i.e., candybar electronic devices, such as candybar mobile phones, tablet computers, etc.). The embodiments of this application use candybar mobile phones as an example for illustrative purposes, which should not be construed as limiting the embodiments of this application.

[0083] Please see Figures 1-2 , Figure 1 A perspective view of an electronic device 100 provided in some embodiments of this application. Figure 2 for Figure 1 An exploded view of the electronic device 100 shown. The electronic device 100 includes a screen 10, a housing 20, and a circuit board assembly 30.

[0084] It should be noted that, Figure 1 and Figure 2 The electronic device 100 is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1 and Figure 2 The limitations are not specified. In some other examples, the electronic device 100 may not include the screen 10. Furthermore, for the convenience of the following description, an XYZ coordinate system is established, defining the width direction of the electronic device 100 as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis. It is understood that the coordinate system of the electronic device 100 can be flexibly set according to actual needs, and no specific limitations are made here.

[0085] Screen 10 is used to display images, videos, etc. Please refer to [link / reference]. Figure 2 The screen 10 includes a light-transmitting cover 11 and a display screen 12. The light-transmitting cover 11 and the display screen 12 are stacked in the Z-axis direction. The light-transmitting cover 11 can protect the display screen 12 and prevent dust, and the screen 10 can be fixed to the housing 20 by means of the light-transmitting cover 11. The material of the light-transmitting cover 11 includes, but is not limited to, glass. The display screen 12 can be a flexible display screen or a rigid display screen.

[0086] The housing 20 can be used to protect the internal electronic components of the electronic device 100. See also: [link to relevant documentation] in some embodiments. Figure 2 The housing 20 includes a middle frame 21 and a back cover 22. The middle frame 21 includes a side frame 211 and a middle plate 212. The side frame 211 surrounds the outer periphery of the middle plate 212. The side frame 211 may be annular. For example, the side frame 211 may be generally rectangular.

[0087] The back cover 22 is fixed to the middle frame 21, and the back cover 22 is located on the side of the middle plate 212 facing away from the screen 10. Specifically, the screen 10, the middle plate 212, and the back cover 22 are arranged in the Z-axis direction. The back cover 22 and the middle frame 21 can form a receiving cavity, which can be used to accommodate electronic devices such as the circuit board assembly 30.

[0088] Please see Figure 3 , Figure 3 This is a cross-sectional view of a circuit board assembly 30 provided in some embodiments of this application. Wherein, Figure 3 The cross-sectional view shown is taken in the direction parallel to the thickness of circuit board 31 (e.g., Figure 3 This is a schematic diagram of a planar cross-section of the circuit board assembly 30 (in the Z-axis direction). The circuit board assembly 30 includes a circuit board 31 and electronic components 32. The electronic components 32 are electrically connected to the circuit board 31. The circuit board 31 may include a printed circuit board (PCB). The number of circuit boards 31 can be one or more. When there are multiple circuit boards 31, stacking multiple circuit boards 31 can form a circuit board 31 stack structure (e.g., a 3D stack structure). For example, when there are three circuit boards 31, the three circuit boards 31 can be stacked to form a sandwich structure.

[0089] Electronic components 32 include at least one of the following: processor (also known as a chip), double data rate synchronous dynamic random access memory (DDR), power inductor, antenna module, Bluetooth module, WiFi module, GPS module, charging module or screen display and operation module, resistor, capacitor, inductor, potentiometer, vacuum tube, heat sink, electromechanical component, connector, semiconductor discrete device, sensor, power supply, switch, micro motor, electronic transformer, relay, SIM card slot, and universal serial bus (USB) device.

[0090] In addition, the electronic device 100 may also include an external memory interface electrically connected to the processor, an audio module, a speaker, a receiver, a microphone, a headphone jack, buttons, a battery 40, a camera module, etc.

[0091] With the rapid development of electronic technology, the functions of electronic device 100 are becoming increasingly rich, and the integration and number of electronic components 32 within electronic device 100 are constantly increasing. This leads to a continuous increase in electromagnetic interference sources (i.e., noise sources) within electronic device 100. This not only reduces the performance of electronic components 32 but also adversely affects the wireless communication performance of electronic device 100.

[0092] To reduce mutual interference between different electronic components 32, ensure the normal operation of electronic components 32, and improve the wireless communication performance of electronic device 100, in some embodiments, please refer to... Figure 3 The circuit board assembly 30 also includes a shielding cover 33, which can be fixed to the circuit board 31.

[0093] The shield 33 can be used to confine the noise (e.g., electromagnetic waves) generated by electronic components 32 such as chips, power inductors, and DDR, as well as electromagnetic interference sources such as DDR traces, within the shield 33. It can effectively reduce or eliminate electromagnetic interference between electronic components 32, ensure the normal operation of electronic components 32, and effectively reduce or eliminate the adverse effects of electromagnetic interference sources on the wireless communication performance of electronic device 100, which is beneficial to improving the wireless communication performance of electronic device 100.

[0094] For ease of description, the electronic component 32 located in the shielded space Q in this paper is referred to as the first electronic component 321.

[0095] In some embodiments, please refer to Figure 3 The shielding cover 33 is formed as a cover structure with one end open. In this way, after the shielding cover 33 is fixed to the circuit board 31, the shielding cover 33 and the circuit board 31 can form a closed shielding space Q.

[0096] In this embodiment, the shielding cover 33 has good sealing of the shielding space Q and good shielding effect. However, when it is necessary to repair or replace the first electronic component 321 inside the shielding cover 33, the shielding cover 33 needs to be completely removed. After the repair or replacement is completed, the shielding cover 33 is then fixed back to the circuit board 31.

[0097] To ensure reliable connection between the shielding cover 33 and the circuit board 31, they are typically fixed together by soldering. Disassembly requires heating the solder joints between the shielding cover 33 and the circuit board 31, making the disassembly process complex and inefficient. Furthermore, the process can easily damage the first electronic component 321 inside the shielding cover 33 and other electronic components 32 on its outer periphery, affecting repair yield. In addition, to ensure the shielding performance of the shielding cover 33, it is usually made entirely of metal, resulting in a heavier shielding cover 33. This makes it difficult to reduce the overall weight of the circuit board assembly 30, thus hindering the achievement of a slimmer and lighter design for the electronic device 100.

[0098] To facilitate the repair of the first electronic component 321 and reduce the repair difficulty of the circuit board assembly 30, please refer to [link / reference needed]. Figure 4 , Figure 4This is a cross-sectional view of a circuit board assembly 30 provided in some other embodiments of this application. The shielding cover 33 in this embodiment includes a shielding body 331 and a shielding cover 332. The shielding body 331 can be fixed to the circuit board 31. For example, the shielding body 331 can be soldered to the circuit board 31. The shielding body 331 has an opening K, and the shielding cover 332 is connected to the shielding body 331 and seals the opening K. Thus, a shielding space Q can be formed between the shielding body 331, the shielding cover 332, and the circuit board 31.

[0099] In this embodiment, the shielding cover 332 and the shielding body 331 are separate components. Specifically, the shielding cover 332 and the shielding body 331 are separately manufactured and then connected together. For example, the shielding cover 332 and the shielding body 331 can be connected by snap-fit, fasteners, or other methods. The fasteners include at least one of screws, bolts, pins, and rivets.

[0100] In this way, by disassembling the shielding cover 33 into two structural components, the shielding body 331 and the shielding cover 332, when the first electronic component 321 inside the shielding cover 33 needs to be repaired or replaced, the shielding cover 332 can be removed from the shielding body 331, exposing the opening K. This facilitates maintenance personnel in repairing or replacing the first electronic component 321. After maintenance, the shielding cover 332 is then fastened back onto the shielding body 331 to ensure the sealing of the shielding space Q. This effectively reduces the difficulty of repairing the first electronic component 321 within the shielding cover 33 and improves maintenance efficiency.

[0101] However, to ensure the shielding effect of the shielding cover 33, both the shielding cover 332 and the shielding body 331 are made of metal. For example, the material of the shielding cover 332 and the shielding body 331 can include at least one of stainless steel and nickel silver. This results in a large superimposed size of the shielding body 331 and the shielding cover 332, and a large overall weight of the shielding cover 33, which makes the thickness and weight of the circuit board assembly 30 large, which is not conducive to achieving a thinner and lighter design of the electronic device 100.

[0102] The thickness direction of the circuit board assembly 30 is consistent with the thickness direction of the circuit board 31. For example, the thickness of the circuit board assembly can be the dimension of the circuit board assembly 30 in the Z-axis direction.

[0103] In order to reduce the repair difficulty of the first electronic component 321 while reducing the thickness and weight of the circuit board assembly 30, please refer to Figure 5 , Figure 5 This is a cross-sectional view of a shielding cover 332 provided in some embodiments of this application. The shielding cover 332 may be in the form of a flat sheet. In this embodiment, the shielding cover 332 can be used to seal the opening K on the shielding body 331.

[0104] For example, such as Figure 5 As shown in (a), the shielding cover 332 may include a shielding copper foil 332a and a first adhesive layer 332b. The shielding cover 332 can be adhered to the shielding body 331 by means of the first adhesive layer 332b. For example, as... Figure 5 As shown in (b), the shielding cover 332 may include a shielding copper foil 332a, a first adhesive layer 332b, a fourth conductive cloth 332c, and a second adhesive layer 332d. The first adhesive layer 332b is connected between the fourth conductive cloth 332c and the shielding copper foil 332a, and the second adhesive layer 332d is disposed on the side surface of the fourth conductive cloth 332c facing away from the shielding copper foil 332a. The shielding cover 332 can be adhered to the shielding body 331 by means of the second adhesive layer 332d. For example, both the first adhesive layer 332b and the second adhesive layer 332d can be conductive adhesive.

[0105] Compared to metal materials such as stainless steel and nickel silver, the thickness of the shielding copper foil 332a can be designed to be thinner, which helps to reduce the overall thickness and weight of the shielding cover 332. However, the shielding copper foil 332a has poor elongation. When the surface flatness of the shielding body 331 is poor, the shielding copper foil 332a is prone to wrinkles, which in turn can easily lead to cracks, affecting the shielding performance of the shielding cover 33.

[0106] For example, such as Figure 5 As shown in (c), the shielding cover 332 can also be a shielding film 332e formed by mixing conductive filler and polymer material. The shielding film 332e has good adhesive properties and can be directly bonded to the shielding body 331, ensuring a strong bond between the shielding film 332e and the shielding body 331. Furthermore, the density of the shielding film 332e is lower than that of metal, which helps to reduce the weight of the shielding cover 33.

[0107] However, the shielding membrane 332e has low electrical conductivity, and its thickness needs to be very large to meet shielding requirements. For example, in some embodiments, the thickness of the shielding membrane 332e must be greater than or equal to 60 micrometers to meet shielding requirements. Therefore, the shielding membrane 332e cannot simultaneously achieve both the shielding performance and volume of the shielding cover 33.

[0108] To reduce the maintenance difficulty of the circuit board assembly 30 while meeting shielding requirements, and to reduce the overall thickness and weight of the circuit board assembly 30, please refer to [link to relevant documentation]. Figure 6 , Figure 6 This is a cross-sectional view of a circuit board assembly 30 provided for some embodiments of this application. The shielding cover 33 in this embodiment includes a shielding body 331 and a shielding cover 332. The shielding cover 332 includes a conductive cloth layer 3321 and an adhesive structure 3322.

[0109] The shielding body 331 has a receiving space. (See also...) Figure 6 The shielding body 331 includes a first side frame 3311 and a first top plate 3312, which can form an accommodating space. An opening K communicates with the accommodating space. The first side frame 3311 can be cylindrical. For example, the first side frame 3311 can surround the outer periphery of the first electronic component 321. The first top plate 3312 can be fixed to the first side frame 3311 and seal one end of the first side frame 3311. The first top plate 3312 is opposite to and spaced apart from the circuit board 31.

[0110] In some embodiments, the first side frame 3311 and the first top plate 3312 can be formed as an integral structural component. Alternatively, the first side frame 3311 and the first top plate 3312 can also be fixedly connected by welding or other methods. The shielding cover 33 can be fixed to the circuit board 31 by means of welding, bonding, snap-fitting, screw connection, or other methods using the first side frame 3311.

[0111] It should be noted that the "integrated structural component" described in the embodiments of this application can be an integrally formed structural component. For example, the integrated structural component can be integrally formed by processes such as stamping, etching, casting, forging, computer numerical control (CNC), and metal injection molding (MIM).

[0112] The shielding body 331 has an opening K, and the number of openings K can be one or more. For example, the first top plate 3312 can have an opening K, which facilitates the maintenance of the first electronic component 321.

[0113] The conductive fabric layer 3321 is connected to the shielding body 331 and covers the opening K. The conductive fabric layer 3321 may include one or more layers of conductive fabric 3321a. The conductive fabric 3321a refers to a fabric-like material with conductive properties. The conductive fabric 3321a can be a conductive non-woven fabric or a conductive fiber fabric. For example, the conductive fabric 3321a can be a nickel-plated conductive fabric, a gold-plated conductive fabric, a carbon-plated conductive fabric, or an aluminum foil fiber composite fabric.

[0114] In some embodiments, please refer to Figure 7 , Figure 7 This is a cross-sectional view of the conductive fabric 3321a provided in some embodiments of this application. The conductive fabric layer 3321 may include a substrate layer A1 and a conductive layer A2. The material of the substrate layer A1 may include at least one of textile fiber fabric and non-woven fabric. The textile fiber fabric can be woven by a weaving process, and the non-woven fabric can be formed by laminating filamentous materials.

[0115] For example, the material of the substrate layer includes at least one of carbon fiber, plant fiber, animal fiber, mineral fiber, polyester fiber, graphite fiber, carbon nanotube fiber, graphene fiber, glass fiber, alumina fiber, silicon carbide fiber, silicon nitride fiber, and boron nitride fiber.

[0116] Specifically, the substrate layer A1 includes a first surface A11 and a second surface A12 facing away from each other. Both the first surface A11 and the second surface A12 are provided with a conductive layer A2. The conductive layer A2 can be a metal plating layer. For example, the conductive layer A2 can be formed by processes such as physical vapor deposition (PVD), chemical vapor deposition (CVD), spraying, electroplating, hot-dip galvanizing, and electroless plating.

[0117] The metal plating material can include at least one of copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and chromium (Cr). These materials have good electrical conductivity and are readily available, which can reduce the processing difficulty while ensuring the shielding performance of the conductive cloth 3321a.

[0118] The conductive fabric layer 3321 can be electrically connected to the shielding body 331 via the conductive layer A2. For example, the conductive layer A2 and the shielding body 331 can be electrically connected via a conductive medium or through direct contact. This improves the shielding effect of the shielding cover 33.

[0119] In some embodiments, to improve the heat dissipation performance of the conductive cloth layer 3321, the thickness of the conductive layer A2 in the conductive cloth 3321a is greater than or equal to 5 micrometers. Specifically, when the conductive layer A2 is disposed only on one side of the substrate layer A1, the thickness of the conductive layer A2 in the conductive cloth 3321a is the thickness of a single conductive layer A2. When the conductive layer A2 is disposed on both sides of the substrate layer A1, the thickness of the conductive layer A2 in the conductive cloth 3321a is the sum of the thicknesses of the two conductive layers A2. This allows for improved heat dissipation performance of the conductive cloth layer 3321 while maintaining good shielding properties.

[0120] It is understood that in some other embodiments, the conductive layer A2 may be provided only on one of the first surface A11 and the second surface A12, as long as the conductive layer A2 is formed on at least one side of the first surface A11 and the second surface A12. Alternatively, in some other embodiments, when the substrate layer A1 is made of a conductive material (e.g., conductive carbon fiber), the conductive layer A2 may not be provided on either side of the substrate layer A1. In this case, the conductive cloth layer 3321 can be electrically connected to the shielding body 331 through the substrate layer A1.

[0121] Please see Figures 8-9 , Figure 8 This is a top view of the conductive fabric layer 3321 in the embodiments of this application. Figure 9 for Figure 8 The diagram shows a partial cross-sectional view of the conductive fabric layer 3321. Among them, Figure 8 The top view shown is a schematic diagram of the conductive cloth layer 3321 viewed from one side surface in the thickness direction to the other side surface of the conductive cloth layer 3321. Figure 9 The partial cross-sectional view shown is a schematic diagram obtained by cutting the conductive cloth layer 3321 with any cross section parallel to the thickness direction of the conductive cloth layer 3321.

[0122] The conductive fabric layer 3321 includes a first pore K1. (See also...) Figure 9 The first pore K1 includes a first opening K11 and a second opening K12, which are respectively formed on the two sides of the conductive cloth layer 3321 in the thickness direction.

[0123] In some embodiments, the maximum pore diameter d1 of the first pore K1 is less than or equal to 75 micrometers (μm), and the ratio of the number of first pores K1 to the total number of pores in the conductive cloth layer 3321 (i.e., the total number of pores) is greater than or equal to 80%.

[0124] It should be noted that, in the embodiments of this application, the first pore K1 refers to a through-hole that is not blocked by conductive material along the extension path from the first opening K11 to the second opening K12, and from the second opening K12 back to the first opening K11, along the thickness direction of the conductive fabric layer 3321. The maximum aperture d1 of the first pore K1 refers to the distance between the two points with the largest straight-line distance in the orthographic projection of the first pore K1 onto the reference plane. The reference plane is perpendicular to the thickness direction of the conductive fabric layer 3321.

[0125] For example, the maximum pore size d1 of the first pore K1 can be 75 micrometers, 70 micrometers, 65 micrometers, 60 micrometers, 55 micrometers, 50 micrometers, 45 micrometers, 42 micrometers, 40 micrometers, 35 micrometers, 30 micrometers, 25 micrometers, 20 micrometers, 15 micrometers, 10 micrometers, 5 micrometers, etc.

[0126] Specifically, the total number of pores in the conductive fabric layer 3321 is m, the number of first pores K1 is n, and the ratio of n to m is greater than or equal to 80%. That is, at least 80% of the pores in the conductive fabric layer 3321 have a maximum pore diameter d1 that is less than or equal to 75%. For example, the ratio of n to m can be 80%, 82%, 85%, 88%, 90%, 92%, 95%, 98%, 100%, etc.

[0127] The maximum pore diameter d1 of the first pore K1 and the proportion of the first pore K1 can be measured by a microscope (e.g., metallurgical microscope).

[0128] According to slot antenna theory, a slot can be considered a slot antenna; when an electromagnetic wave encounters this slot, it can radiate or receive energy through the slot. The slot antenna is most effective when its maximum line size is equal to half the wavelength. As the slot size decreases, the radiation efficiency decreases by 20 dB per ten times the length, while the shielding effect increases at the same rate. Therefore, the smaller the maximum aperture of the slot, the better the shielding performance of the conductive fabric layer 3321.

[0129] Therefore, in the shielding cover 33 of this application embodiment, the opening K is covered by a conductive cloth layer 3321. The maximum aperture d1 of the pores in the conductive cloth layer 3321, which accounts for no less than 80%, is set to be less than or equal to 75 micrometers. This can effectively improve the shielding performance of the conductive cloth layer 3321, thereby avoiding electromagnetic wave leakage from affecting the performance of the electronic components 32 and the wireless communication performance of the electronic device 100.

[0130] Compared to shielding copper foil 332a, metal shielding cover, and other structures, the conductive cloth layer 3321 can be made thinner and lighter. Furthermore, the conductive cloth layer 3321 has good flexibility and can adapt well to the surface shape of the shielding body 331, making it less prone to breakage or cracks. Therefore, the shielding cover 33 in this embodiment can reduce the maintenance difficulty of the first electronic component 321 inside the shielding cover 33, meet the shielding requirements, and reduce the overall volume and weight of the shielding cover 33. This allows for a thinner and lighter design of the electronic device 100 while ensuring its wireless communication performance.

[0131] In some embodiments, please refer to Figures 8-9 The conductive fabric layer 3321 includes a single layer of conductive fabric 3321a. In this case, the pores in the conductive fabric 3321a are the same as the pores in the conductive fabric layer 3321. Therefore, the pore size of a single layer of conductive fabric 3321a must meet the requirements of the proportion of the first pore K1 and the size requirement of the maximum pore diameter d1.

[0132] Specifically, the ratio of the number of first pores K1 in the conductive cloth 3321a to the total number of pores in the conductive cloth 3321a is greater than or equal to 80%, and the maximum pore diameter d1 of the first pores K1 is less than or equal to 75 micrometers. Thus, using a single layer of conductive cloth 3321a as the conductive cloth layer 3321 effectively reduces the overall thickness and weight of the conductive cloth layer 3321, thereby helping to reduce the overall volume and weight of the shielding cover 33. This allows for a thinner and lighter design of the electronic device 100 while meeting the shielding performance requirements of the shielding cover 33.

[0133] For example, in some embodiments, the thickness of the conductive cloth 3321a can be set to about 5 micrometers, and the thickness of the adhesive structure 3322 can be set to 2 micrometers. In this way, the overall thickness of the shielding cover 332 is only 7 micrometers, which can greatly reduce the thickness and weight of the shielding cover 332.

[0134] The proportion of the first pore K1 and the size of the maximum pore diameter d1 of the first pore K1 in the single-layer conductive cloth 3321a can be achieved by optimizing the process parameters of the conductive cloth 3321a. For example, during the processing, the weave density of the conductive cloth 3321a can be increased by optimizing the parameters of the fine weave process, thereby reducing the maximum pore diameter d1 of the first pore K1 and increasing the proportion of the first pore K1.

[0135] For example, in some embodiments, please refer to Figure 8 The conductive fabric 3321a can be a bidirectional fiber conductive fabric 3321a. The conductive fabric 3321a may include a first fiber B1 and a second fiber B2, wherein the extension direction of the first fiber B1 (e.g., Figure 8 The e1 direction in the middle) and the extension direction of the second fiber B2 (e.g.) Figure 8 The e2 direction is different. That is to say, the extension direction of the first fiber B1 is not parallel to the extension direction of the second fiber B2.

[0136] For example, the extension direction of the first fiber B1 is perpendicular to the extension direction of the second fiber B2. Alternatively, other angles can be formed between the extension directions of the first fiber B1 and the second fiber B2, as long as the extension directions of the first fiber B1 and the second fiber B2 are different.

[0137] In this structure, there can be multiple first fibers B1 and second fibers B2, which can be interwoven to form a fiber cloth. Adjacent first fibers B1 and adjacent second fibers B2 can form pores. In this case, the proportion of the first pores K1 can be increased and the maximum pore size d1 of the first pores K1 can be reduced by optimizing the process parameters of the conductive cloth 3321a and increasing its weave density.

[0138] The first fiber B1 can be either a conductive fiber or an insulating fiber. Similarly, the second fiber B2 can be either a conductive fiber or an insulating fiber.

[0139] For example, please refer to Figure 10 , Figure 10 This is a schematic diagram of the conductive cloth 3321a in some other embodiments of this application under a microscope. Figure 10The conductive fabric 3321a shown is a conductive nonwoven fabric. Conductive nonwoven fabric can be formed by first laminating filamentous materials to form a substrate layer A1, and then forming a conductive layer A2 on the substrate layer A1 to achieve conductivity. Alternatively, conductive nonwoven fabric can also be formed by laminating conductive fibers.

[0140] When the conductive fabric 3321a is a conductive nonwoven fabric, the porosity in the conductive nonwoven fabric can be reduced by optimizing the length and diameter of the filamentous material or conductive fibers, and by using finer, shorter, and denser materials for lamination. Alternatively, the porosity in the conductive nonwoven fabric can be reduced by increasing the number of lamination layers. In this way, the maximum pore size d1 of the first pore K1 in the conductive fabric layer 3321 can be reduced, and the proportion of the first pore K1 can be increased, so that the first pore K1 in the conductive fabric layer 3321 meets the requirements.

[0141] In other embodiments, please refer to Figure 11 , Figure 11 This is a cross-sectional view of the circuit board assembly 30 in some other embodiments of this application. The conductive fabric layer 3321 may also include multiple conductive fabric layers 3321a, which are stacked in a first direction. The first direction may be parallel to the Z-axis direction.

[0142] For example, in Figure 11 In the illustrated embodiment, the conductive fabric layer 3321 comprises two layers of conductive fabric 3321a. In other embodiments, the conductive fabric layer 3321 may also comprise three, four, or more layers of conductive fabric 3321a. Adjacent layers of conductive fabric 3321a can be connected by conductive adhesive. Alternatively, multiple layers of conductive fabric 3321a can be bonded together using processes such as hot pressing.

[0143] Specifically, the pores in the laminated structure formed by stacking multiple conductive fabrics 3321a are the pores in the conductive fabric layer 3321. In this case, there are no specific requirements for the pore size or proportion in a single layer of conductive fabric 3321a, as long as the pore size and proportion in the laminated structure obtained after stacking multiple conductive fabrics 3321a meet the requirements. This helps to reduce the process requirements of a single layer of conductive fabric 3321a, thereby helping to reduce the production cost of a single layer of conductive fabric 3321a.

[0144] Based on this, to ensure that parameters such as the proportion of the first pore K1 and the size of the maximum pore diameter d1 in the conductive fabric layer 3321 meet the requirements, at least two conductive fabric layers 3321a can be staggered. Specifically, the orthographic projection of at least a portion of the pores in one conductive fabric layer 3321a onto the reference plane overlaps with the orthographic projection of the conductive structure (e.g., conductive fibers, metal plating, etc.) of at least one other conductive fabric layer 3321a onto the reference plane. The reference plane is perpendicular to the thickness direction of the conductive fabric layer 3321. That is, the reference plane is perpendicular to the stacking direction of the multiple conductive fabric layers 3321a (i.e., the first direction).

[0145] Please refer to this. Figure 12 , Figure 12 for Figure 10 The partial cross-sectional view of the conductive cloth layer 3321 shown shows that at least some of the pores in one layer of conductive cloth 3321a can be directly opposite the conductive structure (i.e., the non-porous part) of other conductive cloths 3321a, so that electromagnetic waves entering the pores can be blocked by other conductive cloths 3321a. This helps to reduce the maximum aperture d1 of the first pore K1 and increase the proportion of the first pore K1, so that the size and proportion of the first pore K1 in the conductive cloth layer 3321 meet the requirements.

[0146] For ease of description, the two adjacent conductive fabric layers are referred to as the first conductive fabric 3321a1 and the second conductive fabric 3321a2, respectively. Figure 12 As shown, one of the pores in the first conductive fabric 3321a1 includes a first pore portion K1a and a second pore portion K1b, and one of the pores in the second conductive fabric 3321a2 includes a third pore portion K1c and a fourth pore portion K1d. The first pore portion K1a is opposite to the non-pore portion of the second conductive fabric 3321a2, the second pore portion K1b is connected to the third pore portion K1c, and the fourth pore portion K1d is opposite to the first conductive fabric 3321a1. The second pore portion K1b and the third pore portion K1c each constitute a part of the first pore K1.

[0147] Thus, one end of the first aperture K1a is blocked by the second conductive cloth 3321a2 to form a blind aperture, and one end of the fourth aperture K1d is blocked by the first conductive cloth 3321a1 to form a blind aperture. Electromagnetic waves within the first aperture K1a can be blocked by the second conductive cloth 3321a2, and electromagnetic waves within the fourth aperture K1d can be blocked by the first conductive cloth 3321a1. Therefore, neither the first aperture K1a nor the fourth aperture K1d constitutes the first pore K1. This helps to reduce the maximum aperture d1 of the first pore K1 in the conductive cloth layer 3321 and increases the proportion of the first pore K1, ensuring that the maximum aperture d1 and proportion of the first pore K1 in the conductive cloth layer 3321 meet the requirements, thereby improving the shielding performance of the conductive cloth layer 3321.

[0148] It is understood that in other embodiments, some of the pores in one layer of conductive cloth 3321a may also be completely blocked by the non-pore portions of other conductive cloths 3321a.

[0149] Please see Figure 13 , Figure 13 for Figure 11 The diagram shows a stacking of two adjacent conductive fabric layers 3321a in the conductive fabric layer 3321. For ease of explanation, in... Figure 13 The schematic diagram shown illustrates the non-overlapping portions of two adjacent conductive fabric layers 3321a. In practical applications, these non-overlapping portions can be cut off. For example, in practical applications, these non-overlapping portions can be retained. Figure 13 The structure within the rectangular frame F. The layering diagrams in other embodiments can be understood in the same way and will not be repeated later.

[0150] In some embodiments, the extension direction of the first fiber B1 of one of the two adjacent conductive fabrics 3321a is different from the extension direction of the first fiber B1 of the other conductive fabric 3321a. For example, the extension direction of the first fiber B1 in the first conductive fabric 3321a1 is different from the extension direction of the first fiber B1 in the second conductive fabric 3321a2.

[0151] This increases the probability that the pores in one of the two adjacent conductive fabric layers 3321a will be blocked by the non-pore portion of the other conductive fabric layer 3321a, as well as the area of ​​the blocked pores. This helps to reduce the maximum aperture d1 of the first pore K1 in the conductive fabric layer 3321, increase the proportion of the first pore K1, and thus improve the shielding performance of the conductive fabric layer 3321.

[0152] Furthermore, the extension direction of the first fiber B1 in one of the two adjacent conductive fabrics 3321a is different from the extension direction of the second fiber B2 in the other conductive fabric 3321a. For example, the extension direction of the first fiber B1 in the first conductive fabric 3321a1 is different from the extension direction of the second fiber B2 in the second conductive fabric 3321a2.

[0153] This increases the probability that the pores in one of the two adjacent conductive fabric layers 3321a will be blocked by the non-pore portion of the other conductive fabric layer 3321a, and further increases the area of ​​the blocked pores. This helps to reduce the maximum pore diameter d1 of the first pore K1 in the conductive fabric layer 3321, increase the proportion of the first pore K1, and thus improve the shielding performance of the conductive fabric layer 3321.

[0154] For example, please refer to Figure 13 The included angle between the first fibers B1 in two adjacent layers of conductive fabric 3321a is the first included angle, and the included angle between the first fiber B1 in one layer of conductive fabric 3321a and the second fiber B2 in the other layer of conductive fabric 3321a is the second included angle. The first included angle can be greater than 0 degrees and less than or equal to 90 degrees, and the second included angle can be greater than 0 degrees and less than or equal to 90 degrees. For example, the first included angle can be 10 degrees, 15 degrees, 20 degrees, 25 degrees, 30 degrees, 45 degrees, 60 degrees, 70 degrees, 80 degrees, 90 degrees, etc. The second included angle can be 10 degrees, 15 degrees, 20 degrees, 25 degrees, 30 degrees, 45 degrees, 60 degrees, 70 degrees, 80 degrees, 90 degrees, etc. The process is simple and easy to implement.

[0155] In some embodiments, the first included angle and the second included angle are equal. For example, both the first included angle and the second included angle are 15 degrees, 20 degrees, 25 degrees, 30 degrees, 45 degrees, or 60 degrees. This has two advantages: firstly, it helps to improve the uniformity of the size of the first pore K1 in the conductive fabric layer 3321, and increases the proportion of the first pore K1, thereby improving the shielding performance of the conductive fabric layer 3321; secondly, it also helps to simplify the processing technology of the conductive fabric layer 3321 and reduce production costs.

[0156] It is understood that in other embodiments, the first included angle and the second included angle may not be equal.

[0157] In some embodiments, please refer to Figure 14 , Figure 14 This is a schematic diagram of the structure of the conductive fabric layer 3321 provided in some embodiments of this application. The conductive fabric 3321a has at least three layers. In a first direction, and in the direction from one side surface of the conductive fabric layer 3321 to the other side surface of the conductive fabric layer 3321a, the first fibers B1 of the multilayer conductive fabric 3321a are sequentially deflected in a clockwise direction by a predetermined angle. The predetermined angle can be less than or equal to 90 degrees.

[0158] For example, along the stacking direction of the multilayer conductive fabric 3321a, the three adjacent conductive fabrics 3321a are respectively a first conductive fabric 3321a1, a second conductive fabric 3321a2, and a third conductive fabric 3321a3. The second conductive fabric 3321a2 is located between the first conductive fabric 3321a1 and the third conductive fabric 3321a3.

[0159] The angle at which the first fiber B1 in the second conductive cloth 3321a2 deflects in the clockwise direction relative to the first fiber B1 in the first conductive cloth 3321a1 can be the same as or different from the angle at which the first fiber B1 in the third conductive cloth 3321a3 deflects in the clockwise direction relative to the first fiber B1 in the second conductive cloth 3321a2.

[0160] This allows the first fibers B1 in the multilayer conductive fabric 3321a of the conductive fabric layer 3321 to be arranged in a spiral stacked form, which helps to reduce the size of the first pore K1 and increase the proportion of the first pore K1, thereby improving the shielding performance of the conductive fabric layer 3321. At the same time, it also helps to simplify the processing technology of the conductive fabric layer 3321 and reduce production costs.

[0161] In some embodiments, the thickness of the conductive fabric layer 3321 is less than or equal to 40 micrometers. For example, the thickness of the conductive fabric layer 3321 can be 40 micrometers, 35 micrometers, 30 micrometers, 25 micrometers, 20 micrometers, 15 micrometers, 10 micrometers, 7 micrometers, 5 micrometers, etc. This helps to reduce the thickness and weight of the shielding cover 332, and consequently, reduces the overall volume and weight of the shielding cover 33.

[0162] Please see Figure 15 , Figure 15 This diagram illustrates the connection between the adhesive structure 3322 and the conductive fabric layer 3321 provided in some embodiments of this application. In some embodiments, the adhesive structure 3322 is a conductive adhesive. The adhesive structure 3322 (i.e., the conductive adhesive) may include an adhesive 3322a and conductive particles 3322b, with the conductive particles 3322b dispersed in the adhesive 3322a. The adhesive 3322a serves an adhesive function. For example, the adhesive 3322a may include resin. The conductive particles 3322b serve a conductive function, enabling electrical connection between the shielding copper foil 332a and the shielding body 331, and blocking electromagnetic radiation. The material of the conductive particles 3322b includes at least one of metal and graphite.

[0163] In this way, the conductive cloth layer 3321 can be bonded and fixed to the shielding body 331 through the adhesive structure 3322. When maintenance is required, the conductive cloth layer 3321 can be easily removed from the shielding body 331. After maintenance, a new conductive cloth layer 3321 can be attached to the shielding body 331, which is convenient for operation. In addition, since the surface flatness of the conductive cloth 3321a is poor, the uneven structure on the surface of the conductive cloth 3321a can extend into the adhesive 3322a. The conductive structures in the uneven structure (such as conductive layer A2, conductive fibers, etc.) can play a role in blocking electromagnetic waves. Therefore, it is beneficial to reduce the gap between the conductive structures (including conductive particles 3322b and conductive layer A2) in the adhesive 3322a, thereby improving the shielding performance of the shielding cover 33.

[0164] Please see Figure 16 , Figure 16 for Figure 15 The top view of the adhesive structure 3322 shown. Wherein, Figure 16The top view shown is a schematic diagram viewed from one surface of the adhesive structure 3322 in the thickness direction to the other surface in the thickness direction of the adhesive structure 3322. A first gap d2 exists between two adjacent conductive particles 3322b, and the first gap d2 is less than or equal to 400 micrometers. For example, the first gap can be 400 micrometers, 380 micrometers, 350 micrometers, 300 micrometers, 250 micrometers, 200 micrometers, 180 micrometers, 150 micrometers, etc.

[0165] The first gap d2 is the minimum gap between the outer contours of two adjacent conductive particles 3322b. The first gap d2 can be measured using a microscope.

[0166] The conductivity of the conductive adhesive is inversely proportional to the size of the first gap d2, while its adhesive properties are directly proportional to the size of the first gap d2. Specifically, the larger the first gap d2 between adjacent conductive particles 3322b, the worse the conductivity of the conductive adhesive, and the greater the probability of electromagnetic waves radiating outward through this first gap d2, thus resulting in poorer shielding performance. Conversely, the larger the first gap d2 between adjacent conductive particles 3322b, the better the adhesive properties of the first conductive adhesive, and the stronger the bond between the conductive fabric layer 3321 and the shielding body 331.

[0167] In this embodiment, the shielding cover 33, by setting the size of the first gap d2 to be less than or equal to 400 micrometers, can take into account both the shielding performance and the bonding performance of the conductive adhesive (i.e., the bonding structure 3322), thus ensuring the shielding performance of the shielding cover 33 and the reliability of the connection between the conductive cloth layer 3321 and the shielding body 331.

[0168] In some embodiments, the average spacing between two adjacent conductive particles 3322b is less than or equal to 300 micrometers. For example, the average spacing between two adjacent conductive particles 3322b can be 300 micrometers, 250 micrometers, 200 micrometers, 180 micrometers, 150 micrometers, etc. This helps to reduce the size of the first gap d2 between two adjacent conductive particles 3322b, thereby improving the shielding performance of the shielding cover 33.

[0169] The average spacing between two adjacent conductive particles 3322b refers to the average value of multiple first gaps d2. The average spacing between two adjacent conductive particles 3322b can be measured using a microscope (e.g., a metallographic microscope).

[0170] In some embodiments, the adhesive 3322a is a thermosetting adhesive. Thermosetting adhesives have excellent bonding properties, which can ensure the reliability of the connection between the conductive fabric layer 3321 and the shielding body 331 while increasing the density of the conductive particles 3322b and reducing the first gap d2. Therefore, more and denser conductive particles 3322b can be incorporated into the thermosetting adhesive, ultimately achieving better shielding effectiveness and a thinner thickness.

[0171] In some embodiments, the maximum aperture d1 of the first pore K1 is less than or equal to 0.2d2. For example, d1 is less than or equal to 0.18d2, 0.15d2, 0.1d2, 0.08d2, 0.05d2, etc. This facilitates further reduction of the maximum aperture d1 of the first pore K1, thereby further improving the shielding performance of the conductive fabric layer 3321.

[0172] Based on any of the above embodiments, please refer to Figure 17 , Figure 17 for Figure 6 The enlarged view of section A circled in the circuit board assembly 30 shown. The overlap width w between the adhesive structure 3322 and the shielding body 331 is greater than or equal to 1 mm. For example, the overlap width w between the adhesive structure 3322 and the shielding body 331 can be 1 mm, 1.5 mm, 2 mm, 3 mm, 4 mm, etc. It should be noted that the "overlap width" mentioned in this embodiment refers to the width of the overlapping area of ​​the two components. For example, when the overlapping area is annular, the overlap width refers to the width of the annular area.

[0173] This approach has several advantages. First, it increases the connection area between the conductive fabric layer 3321 and the shielding body 331, thereby improving the reliability of the connection and preventing the conductive fabric layer 3321 from detaching from the shielding body 331. Second, it extends the radiation path of electromagnetic waves along the side surface of the adhesive structure 3322, increasing the probability of electromagnetic waves being blocked by the conductive particles 3322b, thus reducing the amount of electromagnetic wave radiation. This effectively improves the shielding performance of the shielding cover 33, thereby reducing the impact of electronic components 32 on the wireless communication performance of the electronic device 100 and ensuring the wireless communication performance of the electronic device 100.

[0174] In some other embodiments, please refer to Figures 18-19 , Figure 18 A cross-sectional view of the circuit board assembly 30 provided in some embodiments of this application. Figure 19 for Figure 18 The diagram shows the assembly of the shielding body 331 and the circuit board 31 in the circuit board assembly 30. In this embodiment, the shielding cover 33 and... Figure 6 The difference of the shield 33 shown is that, Figure 6 The first top plate 3312 shown is generally flat. In this embodiment, the first top plate 3312 of the shielding body 331 has a recessed groove C1.

[0175] Specifically, the first top plate 3312 includes a first outer wall surface s1 and a first inner wall surface s2 facing away from each other. The first outer wall surface s1 faces away from the circuit board 31. That is, the first outer wall surface s1 faces away from the accommodating space inside the shielding body 331.

[0176] The first outer wall surface s1 has a recessed groove C1. At least a portion of the shielding cover 332 is located within the recessed groove C1. Exemplarily, at least a portion of the conductive cloth layer 3321 is disposed within the recessed groove C1. This helps to reduce the superposition dimension of the shielding cover 332 and the shielding body 331 in the Z-axis direction, thereby helping to reduce the overall height of the shielding cover 33 in the Z-axis direction, and further helping to reduce the overall volume of the shielding cover 33.

[0177] For example, the first outer wall surface s1 includes a first region s11, a second region s12, and a third region s13. The first region s11 is recessed relative to the second region s12 toward the interior of the receiving space, forming a recessed groove C1. The third region s13 connects the first region s11 and the second region s12. The first region s11 may be formed on the bottom wall of the recessed groove C1, and the third region s13 may be formed as the side wall of the recessed groove C1. At least one of the first region s11 and the second region s12 has an opening K.

[0178] A portion of the conductive fabric layer 3321 is connected to the first region s11 via an adhesive structure 3322, another portion is connected to the second region s12 via an adhesive structure 3322, and yet another portion is connected to the third region s13 via an adhesive structure 3322.

[0179] Please see Figure 18 In this embodiment, the overlapping area between the adhesive structure 3322 and the shielding body 331 includes: a first overlapping area where the adhesive structure 3322 overlaps with the first region s11, a second overlapping area where the adhesive structure 3322 overlaps with the third region s13, and a third overlapping area where the adhesive structure 3322 overlaps with the second region s12. Therefore, the overlap width w between the adhesive structure 3322 and the shielding body 331 can be the sum of the width of the first overlapping area, the width of the second overlapping area, and the width of the third overlapping area.

[0180] This increases the overlap width w between the adhesive structure 3322 and the shielding body 331, which improves the connection reliability between the conductive cloth layer 3321 and the shielding body 331, while also enhancing the wireless communication performance of the electronic device 100.

[0181] Because the conductive cloth layer 3321 has good flexibility and can adapt well to the shape changes of the surface connected to it (e.g., the first outer wall surface s1), the shielding cover 33 in this embodiment can ensure a reliable connection between the conductive cloth layer 3321 and the shielding body 331 while avoiding tearing of the conductive cloth layer 3321. It is also easy to assemble and implement.

[0182] In some embodiments, please refer to Figure 19 In the direction from the first top plate 3312 to the circuit board 31, the third region s13 extends toward the central axis of the first region s11. The central axis of the first region s11 refers to the axis passing through the geometric center of the first region s11 and perpendicular to the first region s11.

[0183] In this way, on the one hand, the overlap width between the third region s13 and the adhesive structure 3322 can be increased without increasing the depth of the recessed groove C1, which is beneficial to ensuring the shielding performance of the shielding cover 33 while ensuring the volume of the shielding space Q of the shielding cover 33; on the other hand, it is also beneficial to reduce the bending angle of the conductive cloth layer 3321, which is beneficial to reduce the stress on the conductive cloth layer 3321, thereby improving the reliability of the conductive cloth layer 3321.

[0184] It is understood that in other embodiments where the first region s11 has an opening K, the conductive fabric layer 3321 may also be connected to the third region s13 and the first region s11 solely through the adhesive structure 3322, and the conductive fabric layer 3321 may also be connected to the first region s11 and the second region s12 solely through the adhesive structure 3322. In this case, the conductive fabric layer 3321 may or may not be in contact with the third region s13. This also increases the overlap width between the adhesive structure 3322 and the shielding body 331 to a certain extent.

[0185] In other embodiments, the second region s12 may have an opening K. In this case, the first region s11 may or may not have an opening K. In embodiments where the second region s12 has an opening K, the conductive fabric layer 3321 may be connected to the third region s13 and the second region s12 only via the adhesive structure 3322. Alternatively, the conductive fabric layer 3321 may also be connected to the first region s11 and the second region s12 only via the adhesive structure 3322, as long as the conductive fabric layer 3321 is connected to at least two of the first region s11, the second region s12, and the third region s13 via the adhesive structure 3322.

[0186] exist Figure 19In the illustrated embodiment, a portion of the first top plate 3312 arches toward the circuit board 31 to form a recessed groove C1. Exemplarily, the recessed groove C1 can be formed by stamping from the first outer wall surface s1 of the first top plate 3312 toward the first inner wall surface s2 of the first top plate 3312.

[0187] In other embodiments, please refer to Figure 20 , Figure 20 This is a schematic diagram of the circuit board assembly 30 provided in some embodiments of this application. A portion of the first top plate 3312 arches in the direction away from the circuit board 31 to form a hollow protrusion, and a recessed groove C1 is formed between the protrusion and other portions of the first top plate 3312. Exemplarily, the protrusion can be formed by stamping from the first inner wall surface s2 of the first top plate 3312 toward the first outer wall surface s1 of the first top plate 3312. In this way, the recessed groove C1 can also be formed on the first top plate 3312.

[0188] In this case, please refer to Figure 20 In the direction from the first top plate 3312 to the circuit board 31, the third region s13 extends toward the central axis of the opening K on the second region s12.

[0189] In some other embodiments, please refer to Figure 20 The conductive cloth layer 3321 also includes an abutment portion D1, which is located on the circumferential outer side of the opening K and abuts against the shielding body 331. Specifically, the abutment portion D1 is in close contact with the shielding body 331, and there is a certain compressive force between the abutment portion D1 and the shielding body 331.

[0190] In some embodiments, the abutment portion D1 is annular. Exemplarily, the edge portion of the conductive fabric layer 3321 may be formed as the abutment portion D1. The abutment portion D1 may be located circumferentially outside the adhesive structure 3322. Specifically, the orthographic projection of the abutment portion D1 on the reference plane does not overlap with the orthographic projection of the opening K on the reference plane, and the orthographic projection of the abutment portion D1 on the reference plane does not overlap with the orthographic projection of the adhesive structure 3322 on the reference plane.

[0191] In this way, the conductive cloth layer 3321 can achieve electrical connection with the shielding body 331 through the contact of the abutment portion D1, and the conductive cloth layer 3321 and the shielding body 331 can be fitted together without gaps. This makes the radiation path of electromagnetic waves blocked by the abutment portion D1. For example, in some embodiments, the side of the adhesive structure 3322 can be surrounded by the abutment portion D1. The path of electromagnetic waves radiating outward from the side of the adhesive structure 3322 is blocked by the abutment portion D1, thereby effectively preventing electromagnetic waves from radiating outward and further improving the shielding performance of the shielding cover 33.

[0192] It is understood that the contact portion D1 in this embodiment can be applied to the shielding cover 33 in any embodiment of this application. In addition, since the conductive cloth layer 3321 and the shielding body 331 in this embodiment can be electrically connected through the contact portion D1, the adhesive structure 3322 can be made of either conductive adhesive or insulating adhesive.

[0193] To ensure proper contact between the contact part D1 and the shielding body 331, please refer to... Figure 20 The circuit board assembly 30 also includes a pressing member 34, which is located on the side of the abutment portion D1 facing away from the shielding body 331. The pressing member 34 is used to apply a force from the abutment portion D1 towards the shielding body 331 to the abutment portion D1. Specifically, the abutment portion D1 is located between the pressing member 34 and the shielding body 331. In this way, the abutment portion D1 can remain in close contact with the shielding body 331 under the action of the pressing member 34, ensuring the shielding performance of the shielding cover 33.

[0194] In some embodiments, the press-fit member 34 can be connected to the shielding body 331 by means of adhesion, snap-fit, fastener connection, etc. For facilitating the connection between the press-fit member 34 and the shielding body 331, please refer to [link to relevant documentation]. Figure 20 The pressing component 34 may include a connected pressing portion 341 and a connecting ear 342, with the connecting ear 342 located circumferentially outside the pressing portion 341. The pressing portion 341 is stacked with the abutment portion D1, and the connecting ear 342 is used to connect with the shielding body 331. This facilitates the assembly and disassembly of the pressing component 34, and consequently facilitates the assembly and disassembly of the conductive cloth layer 3321, thereby improving the maintenance efficiency of the electronic components 32.

[0195] It is understood that in other embodiments, the pressing member 34 and the shielding body 331 may not be fixed together. For example, the pressing member 34 may abut against the shielding body 331. In this case, the pressing member 34 may or may not include the connecting ear 342. This also simplifies the assembly process of the electronic device 100 and helps to reduce the maintenance difficulty of the circuit board assembly 30.

[0196] In some embodiments, to simplify the structure of the electronic device 100, the pressing member 34 can reuse other structures of the electronic device 100. For example, the pressing member 34 can be composed of the back cover 22, the middle frame 21, the circuit board 31 support, the heat sink (e.g., heat sink, heat spreader, etc.), the camera bracket, etc. of the electronic device 100. Of course, the pressing member 34 can also be an additional structural component.

[0197] In some other embodiments, please refer to Figure 21 , Figure 21This is a partial structural schematic diagram of a circuit board assembly 30 provided in some embodiments of this application. The circuit board assembly 30 in this embodiment differs from the circuit board assembly 30 in any of the above embodiments in that the circuit board assembly 30 in this embodiment further includes a buffer member 35, which is located between the pressing member 341 and the abutment portion D1. For example, the buffer member 35 may be located between the pressing portion 341 and the abutment portion D1.

[0198] The cushioning element 35 can undergo elastic deformation. The cushioning element 35 can be made of plastic, silicone, rubber, foam, etc. For example, the material of the cushioning element 35 can be thermoplastic polyurethane (TPU) or thermoplastic polyester elastomer (TPEE). Both thermoplastic polyurethane and thermoplastic polyester elastomer have excellent resilience and good abrasion resistance, ensuring that the cushioning element 35 has good cushioning performance.

[0199] In this way, the force between the pressing part 34 and the abutment part D1 can be buffered. On the one hand, it helps to reduce the friction on the surface of the abutment part D1 and prevent the conductive layer A2 in the conductive cloth layer 3321 from falling off. On the other hand, it also helps to absorb the assembly tolerance between the pressing part 34 and the shielding body 331, thereby helping to reduce the assembly difficulty of the electronic device 100.

[0200] To evaluate the shielding performance of the shielding cover 33, the shielding effectiveness of different shielding covers 33 was tested. Shielding effectiveness is an important indicator for measuring the degree to which a shield attenuates electromagnetic waves. Shielding effectiveness is defined as the ratio of the field strength E1 of the radiator without a shield to the field strength E2 after the shield is added. If an electric field is used in the calculation formula, it is called electric field shielding effectiveness; if a magnetic field is used, it is called magnetic field shielding effectiveness. Shielding effectiveness is usually expressed in decibels (dB).

[0201] Table 1 shows the stacked structure of the shielding cover 332 corresponding to the shielding cover 33 in different schemes, as well as the performance parameters of the shielding cover 332.

[0202] Table 1

[0203]

[0204] Please see Figures 22-23 , Figure 22 The graph shows the electric field shielding effectiveness of different shielding covers 33. Figure 23 The graph shows the magnetic field shielding effectiveness of different shielding covers 33. Figure 22 The horizontal axis represents the signal frequency in Hertz (Hz), and the vertical axis represents the electric field shielding effectiveness. Figure 23 The horizontal axis represents the signal frequency in Hertz (Hz), and the vertical axis represents the magnetic shielding effectiveness.

[0205] in, Figure 22 Curve L11 represents the electric field shielding effectiveness of shielding cover 33 in Scheme 1, curve L12 represents the electric field shielding effectiveness of shielding cover 33 in Scheme 2, curve L13 represents the electric field shielding effectiveness of shielding cover 33 in Scheme 3, curve L14 represents the electric field shielding effectiveness of shielding cover 33 in Scheme 4, curve L15 represents the electric field shielding effectiveness of shielding cover 33 in Scheme 5, and curve L16 represents the electric field shielding effectiveness of shielding cover 33 in Scheme 6.

[0206] Figure 23 Curve L21 represents the magnetic field shielding effectiveness of shielding cover 33 in Scheme 1, curve L22 represents the magnetic field shielding effectiveness of shielding cover 33 in Scheme 2, curve L23 represents the magnetic field shielding effectiveness of shielding cover 33 in Scheme 3, curve L24 represents the magnetic field shielding effectiveness of shielding cover 33 in Scheme 4, curve L25 represents the magnetic field shielding effectiveness of shielding cover 33 in Scheme 5, and curve L26 represents the magnetic field shielding effectiveness of shielding cover 33 in Scheme 6.

[0207] from Figure 22 As can be seen from this, at a signal frequency of 1.0*10 9 Hz~2*10 9 Within the Hz range, the electric field shielding effectiveness of different schemes basically meets the following requirements: the electric field shielding effectiveness of shielding cover 33 in scheme 3 is better than that in scheme 2, and the electric field shielding effectiveness of shielding cover 33 in scheme 2 is better than that in scheme 6. The larger the pores of the conductive cloth layer 3321, the worse the electric field shielding effectiveness.

[0208] Comparing curves L13 and L12, as well as curves L15 and L14, it can be seen that the electric field shielding effectiveness of the shielding cover 33 can be significantly improved after the two layers of conductive cloth 3321a are superimposed.

[0209] Furthermore, by comparing curves L13, L15, and L11, it can be seen that after the conductive cloth 3321a is superimposed, the electric field shielding effectiveness of the shielding cover 33 (Scheme 3 and Scheme 5) is comparable to that of the shielding cover 33 including the shielding copper foil 332a (Scheme 1). In some signal frequency bands, the electric field shielding effectiveness of Scheme 3 and Scheme 5 is even better than that of Scheme 1.

[0210] from Figure 23 As can be seen from this, at a signal frequency of 1.5*10 9 Hz~3*10 9Within the Hz range, the magnetic field shielding effectiveness of different schemes basically meets the following requirements: the magnetic field shielding effectiveness of shielding cover 33 in scheme 3 is better than that in scheme 2, and the magnetic field shielding effectiveness of shielding cover 33 in scheme 2 is better than that in scheme 6. The larger the pores of the conductive cloth layer 3321, the worse the magnetic field shielding effectiveness.

[0211] Comparing curves L23 and L22, as well as curves L25 and L24, it can be seen that the magnetic field shielding effectiveness of the shielding cover 33 can be significantly improved after the two layers of conductive cloth 3321a are superimposed.

[0212] Furthermore, by comparing curves L23, L25, and L21, it can be seen that after the conductive cloth 3321a is superimposed, the magnetic field shielding effectiveness of the shielding cover 33 (Scheme 3 and Scheme 5) is comparable to that of the shielding cover 33 including the shielding copper foil 332a (Scheme 1). In some signal frequency bands, the magnetic field shielding effectiveness of Scheme 3 and Scheme 5 is even better than that of Scheme 1.

[0213] Therefore, the shielding cover 33 in this embodiment breaks the traditional understanding that the conductive cloth 3321a, due to its porous nature, cannot be used for shielding. By using a shielding cover 332 including the conductive cloth layer 3321, it can meet the shielding performance requirements of near-field shielding scenarios without the need for a non-porous shielding copper foil 332a. Furthermore, the conductive cloth layer 3321 is thin and lightweight, which can reduce the overall volume of the shielding cover 33 while ensuring its shielding performance, thereby reducing the overall weight of the shielding cover 33. This balances the shielding performance of the electronic device 100 with the need for overall thinning and weight reduction.

[0214] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0215] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A shielding cover, characterized in that, include: A shielding body having an opening; A shielding cover is connected to the shielding body and covers the opening. The shielding cover includes a conductive cloth layer, the conductive cloth layer includes a first pore, the maximum pore diameter of the first pore is less than or equal to 75 micrometers, and the ratio of the number of the first pores to the total number of pores in the conductive cloth layer is greater than or equal to 80%.

2. The shielding cover according to claim 1, characterized in that, The conductive cloth layer is a single-layer conductive cloth.

3. The shielding cover according to claim 1, characterized in that, The conductive fabric layer includes multiple conductive fabrics, which are stacked in a first direction; wherein at least a portion of the pores in one conductive fabric layer have orthographic projections on a reference plane that overlap with the orthographic projections of the non-pore portions of at least one other conductive fabric layer on the reference plane. The reference plane is perpendicular to the first direction.

4. The shielding cover according to claim 3, characterized in that, The conductive cloth includes a first fiber and a second fiber, wherein the extension direction of the first fiber is different from that of the second fiber. In two adjacent layers of the conductive fabric, the extension direction of the first fiber of one layer of the conductive fabric is different from the extension direction of the first fiber of the other layer of the conductive fabric.

5. The shielding cover according to claim 4, characterized in that, In two adjacent layers of the conductive fabric, the extension direction of the first fiber of one layer of the conductive fabric is different from the extension direction of the second fiber of the other layer of the conductive fabric.

6. The shielding cover according to any one of claims 3-5, characterized in that, The conductive cloth has at least three layers. In the first direction, from one side surface of the conductive cloth layer to the other side surface of the conductive cloth layer, the first fibers of the multiple conductive cloth layers are deflected sequentially at a preset angle in a clockwise direction.

7. The shielding cover according to any one of claims 1-6, characterized in that, The thickness of the conductive cloth layer is less than or equal to 40 micrometers.

8. The shielding cover according to any one of claims 1-7, characterized in that, The shielding body includes: A first top plate having the opening; A first side frame surrounds the outer periphery of the first top plate, and the first side frame and the first top plate form an accommodating space, with the opening communicating with the accommodating space.

9. The shielding cover according to claim 8, characterized in that, The first top plate includes a first outer wall facing away from the receiving space, the first outer wall having a recessed groove, at least a portion of the shielding cover being located within the recessed groove.

10. The shielding cover according to claim 9, characterized in that, The first outer wall surface includes a first region and a second region, the first region being recessed into the interior of the receiving space relative to the second region to form the recessed groove; the first outer wall surface includes a third region, the third region being connected between the first region and the second region; The shielding cover includes an adhesive structure, and the conductive fabric layer is connected to at least two of the first region, the second region, and the third region through the adhesive structure.

11. The shielding cover according to claim 10, characterized in that, The first top plate includes a first inner wall surface, which is opposite to the first outer wall surface; The third region extends toward the central axis of the first region in the direction from the first outer wall surface to the first inner wall surface.

12. The shielding cover according to any one of claims 1-11, characterized in that, The shielding cover includes an adhesive structure, through which the conductive fabric layer is connected to the shielding body.

13. The shielding cover according to claim 12, characterized in that, The adhesive structure includes an adhesive and conductive particles, wherein the conductive particles are dispersed in the adhesive, and there is a first gap between two adjacent conductive particles, the first gap being less than or equal to 400 micrometers.

14. The shielding cover according to claim 13, characterized in that, The adhesive is a thermosetting adhesive.

15. The shielding cover according to any one of claims 1-14, characterized in that, The conductive fabric layer includes an abutting portion located circumferentially outside the opening, and the abutting portion abuts against the shielding body.

16. The shielding cover according to claim 15, characterized in that, It includes a pressing member located on the side of the abutment portion opposite to the shielding body, for applying a force from the abutment portion toward the shielding body to the abutment portion.

17. The shielding cover according to claim 16, characterized in that, A buffer is provided between the pressing component and the abutting part.

18. A circuit board assembly, characterized in that, include: Circuit board; A shielding cover is fixed to the circuit board, and a shielding space is formed between the shielding cover and the circuit board. The shielding cover is the shielding cover according to any one of claims 1-17. A first electronic component is electrically connected to the circuit board and is located within the shielding space.

19. An electronic device, characterized in that, include: case; A circuit board assembly is disposed within the housing, the circuit board assembly being the circuit board assembly of claim 18.

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