A PA board temperature compensation link device and its control method
By introducing devices such as couplers, RMS logarithmic detectors, and ADC analog-to-digital converters into the radio frequency communication system, the output power signal of the PA board is acquired in real time, and the correlation between power and temperature is established. This solves the problem of low temperature detection accuracy in existing temperature compensation schemes and realizes real-time accurate control of PA board output power and stability over a wide temperature range.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHINA WANBAO ENG
- Filing Date
- 2026-02-10
- Publication Date
- 2026-05-26
AI Technical Summary
In existing radio frequency communication systems, the temperature compensation scheme of the PA board is greatly affected by the layout and ambient temperature, resulting in low temperature detection accuracy and difficulty in achieving precise and constant control of the output power of the radio frequency link.
By employing devices such as couplers, RMS logarithmic detectors, ADC analog-to-digital converters, and DAC digital-to-analog converters, the output power signal of the PA board is acquired in real time. The power signal is converted into a digital signal by combining the RMS logarithmic detector and the ADC analog-to-digital converter, establishing the correlation between power and temperature, and using a data processor to calculate the control signal to achieve real-time and precise power control of the PA board.
It achieves high-precision temperature detection unaffected by installation layout and ambient temperature, strong real-time power control, wide applicable temperature range, simple structure and easy integration, and low cost.
Smart Images
Figure CN122086150A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of radio frequency communication technology, specifically to a PA board temperature compensation link device and its control method. Background Technology
[0002] In radio frequency communication systems, the PA (Power Amplifier) board is one of the core components, and the stability of its output power directly affects the communication quality. Since the electrical characteristics of the PA board are significantly affected by temperature, temperature changes can cause the output power of the PA board to drift. Therefore, a temperature compensation scheme is needed to maintain a constant output power of the PA board.
[0003] There are two main temperature compensation schemes for existing RF links: one is to connect a unique temperature-sensitive attenuation resistor to the RF link, utilizing the attenuation value of the attenuation resistor to control the transmit power of the PA board; the other is to use a thermistor to detect the motherboard temperature, collect the temperature data through a digital-to-analog converter, and then adjust the PA board output power based on the temperature data. However, both schemes have significant limitations: the temperature reading accuracy of the thermistor depends on its installation location; if it is far from the heat source of the PA board, the actual temperature of the heat source cannot be accurately obtained, resulting in a significant reduction in temperature detection accuracy; at the same time, the thermistor is highly susceptible to ambient temperature interference, further affecting the temperature compensation effect and making it difficult to achieve precise and constant control of the RF link output power over a wide temperature range.
[0004] Therefore, there is an urgent need for a PA board temperature compensation solution that can achieve real-time and accurate power control of PA boards without being limited by layout or affected by ambient temperature. Summary of the Invention
[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a PA board temperature compensation link device and its control method, which solves the problems of low temperature detection accuracy and large influence of layout and environment in the existing temperature compensation scheme of thermistor, and realizes real-time and accurate control of the output power of the radio frequency PA board.
[0006] To achieve the above objectives, the present invention adopts the following technical solution.
[0007] According to one aspect of the present invention, a PA board temperature compensation link device is provided, comprising: an RF PA board (11), which is an RF signal processing board in an RF link, used to amplify the received signal and output the transmit power; a coupler (12), whose input end is connected to the output end of the RF PA board (11) and whose output end is connected to an antenna interface, used to receive the transmit power from the RF PA board (11) and output it to the antenna interface, and to collect the transmit power and output an RF signal representing the coupling power through the coupling end; an RMS logarithmic detector (13), which is connected to the coupling end of the coupler (12), performs root mean square value calculation on the RF signal output by the coupler (12), and converts it into an analog voltage signal that is logarithmically related to the power value; and an ADC analog-to-digital converter (14), whose input end is connected to the output end of the RMS logarithmic detector (13), and converts the RF signal output by the RMS logarithmic detector (13) into an analog voltage signal. The analog voltage signal is converted into a digital signal; the data processor (16), which is connected in communication with the ADC analog-to-digital converter (14), is responsible for processing the digital signal output by the ADC analog-to-digital converter (14) and controlling the working state of the RF PA board (11) based on the processing result; and the DAC digital-to-analog converter (15), which is connected in communication with the data processor (16), converts the control digital signal output by the data processor (16) into an analog voltage signal that controls the working state of the RF PA board (11). The data processor (16) controls the output power of the RF PA board (11) based on a first temperature function and a second temperature function. The first temperature function represents the correspondence between the digital signal corresponding to the transmission power of the RF PA board (11) and the temperature. The second temperature function represents the correspondence between the control digital signal of the RF PA board (11) and the temperature.
[0008] In the above scheme, the first temperature function is a linear function established based on the digital signal corresponding to the transmission power output of the RF PA board (11) under multiple different high and low temperatures within a wide temperature range and its corresponding temperature. The second temperature function is a linear function established based on the control digital signal and its corresponding temperature under the constant output power state of the RF PA board (11) under multiple different high and low temperatures within the wide temperature range.
[0009] In the above scheme, the data processor (16) calculates the current temperature information based on the first temperature function and the digital signal output from the ADC analog-to-digital converter (14), and inputs the temperature information into the second temperature function to calculate the current required control digital signal, and outputs the control digital signal to the DAC digital-to-analog converter (15).
[0010] In the above scheme, the multiple different high and low temperatures are -30℃, -10℃, 0℃, 20℃ and 40℃.
[0011] According to another aspect of the present invention, a control method for a PA board temperature compensation link device is provided, wherein the PA board temperature compensation link device is the aforementioned PA board temperature compensation link device, the control method comprising: establishing a first temperature function, the first temperature function representing the correspondence between the digital signal corresponding to the transmit power output by the RF PA board (11) of the PA board temperature compensation link device and the temperature; establishing a second temperature function, the second temperature function representing the correspondence between the control digital signal of the RF PA board (11) and the temperature; and performing real-time temperature compensation control based on the first temperature function and the second temperature function to control the output power of the RF PA board (11).
[0012] In the above scheme, the step of establishing the first temperature function includes: establishing a linear function based on the digital signal corresponding to the transmission power output of the RF PA board (11) under multiple different high and low temperatures within a wide temperature range and its corresponding temperature, as the first temperature function; the step of establishing the second temperature function includes: establishing a linear function based on the control digital signal under the constant output power state of the RF PA board (11) under multiple different high and low temperatures within the wide temperature range and its corresponding temperature, as the second temperature function.
[0013] In the above scheme, the ambient temperature is sequentially adjusted to the multiple different high and low temperatures within the wide temperature range, and the RF PA board (11) outputs transmission power; at each of the multiple different high and low temperatures, the digital signal corresponding to the transmission power output by the RF PA board (11) is acquired through a coupler (12), an RMS logarithmic detector (13), and an ADC analog-to-digital converter (14); and based on the dataset of the digital signal corresponding to the transmission power output by the RF PA board (11) at each of the multiple different high and low temperatures and its corresponding temperature value, the first temperature function is obtained by linear fitting.
[0014] In the above scheme, under the multiple different high and low temperatures within the wide temperature range, the data processor (16) generates control digital signals respectively, so that the output power of the RF PA board (11) is a predetermined power; and based on the dataset of the control digital signals and their corresponding temperature values at each of the multiple different high and low temperatures, the second temperature function is obtained by linear fitting.
[0015] In the above scheme, the coupler (12), RMS logarithmic detector (13), and ADC analog-to-digital converter (14) of the PA board temperature compensation link device acquire the real-time digital signal corresponding to the output power of the RF PA board (11) in real time; substitute the real-time digital signal into the first temperature function to calculate the current actual working temperature; substitute the current actual working temperature into the second temperature function to calculate the target control digital signal that keeps the output power of the RF PA board (11) constant at the predetermined power; and the DAC digital-to-analog converter (15) converts the target control digital signal into the corresponding analog voltage signal and outputs it to the RF PA board (11) to control the output power of the RF PA board (11). Beneficial effects
[0016] Compared with the prior art, the present invention has the following advantages: High temperature detection accuracy: This invention does not rely on thermistors to detect temperature. Instead, it acquires the output power signal of the PA board in real time through a coupler. Combined with an RMS logarithmic detector and an ADC analog-to-digital converter, the power signal is converted into a digital signal. A function model is established based on the correlation between power and temperature, which directly reflects the actual operating temperature of the PA board. It is not affected by the installation layout and ambient temperature, and the temperature detection accuracy is significantly improved. Strong real-time power control: By establishing a linear functional relationship between the digital signal corresponding to the PA board output power and the temperature, as well as the control digital signal of the PA board and the temperature, the current temperature can be quickly calculated based on the digital signal corresponding to the output power acquired in real time, and the corresponding control digital signal can be generated in real time. Then, the VGS voltage of the PA board is adjusted through the DAC digital-to-analog converter, thereby realizing real-time dynamic compensation of the PA board output power and ensuring constant output power. Wide applicable temperature range: This invention establishes a function model by collecting data within a wide temperature range of different high and low temperatures. The fitted linear temperature function can cover the temperature range of most practical application scenarios, and the temperature compensation effect is stable and reliable. Simple structure and easy to implement: This invention can realize the temperature compensation function of the PA board by simply combining conventional RF and digital devices such as couplers, RMS logarithmic detectors, ADC analog-to-digital converters, CPUs, and DAC digital-to-analog converters. No special customized devices are required, the cost is low and it is easy to integrate into existing PA board designs. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of a PA board temperature compensation link device according to an embodiment of the present invention; Figure 2 This is a schematic flowchart illustrating the control method of the PA board temperature compensation link device according to an embodiment of the present invention. Detailed Implementation
[0019] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.
[0020] This invention provides a novel PA board temperature compensation link device, which introduces a logarithmic detector to detect the output power value of the RF PA board, and uses temperature parameters to effectively correspond the values of the DAC digital-to-analog converter and the ADC analog-to-digital converter to achieve real-time dynamic compensation of the PA board output power.
[0021] The essence of the technical solution of the present invention will be described in detail below with reference to the accompanying drawings.
[0022] Implementation Method 1: PA Board Temperature Compensation Link Device Figure 1 This is a schematic diagram of a PA board temperature compensation link device according to an embodiment of the present invention.
[0023] The PA board temperature compensation link device 10 of this embodiment includes an RF PA board 11, a coupler 12, an RMS (Root Mean Square) logarithmic detector 13, an ADC (Analog-to-Digital Converter) 14, a DAC (Digital-to-Analog Converter) 15, and a CPU (Central Processing Unit) 16.
[0024] Among them, the RF PA board 11 is an RF signal processing board that includes transmission and reception paths. It is used in RF links to amplify the received signals.
[0025] Coupler 12 is a front-end device of the radio frequency link. It can receive the transmit power from the radio frequency PA board 11 through the transmit power path and output it to the output port, namely the antenna interface 17. On the other hand, coupler 12 also collects the transmit power and outputs the radio frequency signal representing the coupling power through the coupling end.
[0026] The RMS logarithmic detector 13 calculates the root mean square value of the radio frequency signal acquired by the coupler 12, and then converts it into an analog voltage signal that is logarithmically related to the power value. This ensures the linear conversion accuracy from power signal to voltage signal and provides a reliable analog signal source for subsequent sampling by the ADC analog-to-digital converter 14 and data processing by the CPU 16.
[0027] The ADC analog-to-digital converter 14 is an interface for converting analog signals to digital signals. It converts the analog voltage signal detected by the RMS logarithmic detector 13 into a digital signal, providing data input for the data processing and logic control of the CPU 16.
[0028] The DAC (Digital-to-Analog Converter) 15 is the interface for converting control digital instructions into analog execution signals. It converts the control digital signals output by the CPU 16 into analog voltage signals that can directly adjust the working state of the RF PA board 11, i.e., control the PA_VGS voltage.
[0029] CPU 16 is the core control and computing unit, responsible for coordinating data acquisition, algorithm calculation, logic control, instruction scheduling and other data processing and control tasks of PA board temperature compensation link device 10. It is the core hub for realizing "temperature-power" closed-loop temperature compensation.
[0030] The connection methods for the above components are as follows.
[0031] The input terminal of coupler 12 is linked to the output port of RF PA board 11, and the output terminal of coupler 12 is connected to antenna interface 17; the coupling terminal of coupler 12 is connected to the input terminal of RMS logarithmic detector 13.
[0032] The output of the RMS logarithmic detector 13 is connected to the input of the ADC analog-to-digital converter 14 via an analog signal line.
[0033] The output of the ADC analog-to-digital converter 14 is connected to the CPU 16, and the CPU 16 is connected to the DAC digital-to-analog converter 15.
[0034] The output of the DAC digital-to-analog converter 15 is connected to the RF PA board 11 via a control line.
[0035] The working process and principle of the PA board temperature compensation link device 10 in this embodiment are as follows.
[0036] After being amplified by the RF PA board 11, the RF signal becomes the transmit power P1, which is radiated from the antenna connected to the antenna interface via the coupler 12, which is linked to the output of the RF PA board 11. On the other hand, the coupled power P2 is output from the signal coupling terminal of the coupler 12, and P2 = P1 - ATT, where ATT is the coupling coefficient of the coupler 12. The coupled power P2 enters the RMS logarithmic detector 13, where an analog signal voltage value V1 is generated. The analog signal voltage value V1 is sampled by the ADC analog-to-digital converter 14 to form a digital signal D1 corresponding to the coupled power of the transmit power P1 output by the RF PA board 11. The digital signal D1 is transmitted to the CPU 16 through the communication link.
[0037] In addition, the CPU 16 generates a control digital signal D2, and the DAC digital-to-analog converter 15 converts the control digital signal D2 into an analog signal voltage V2. This voltage V2 acts on the VGS (gate-source) control terminal voltage of the RF PA board 11, thereby controlling the amplification factor of the RF PA board 11.
[0038] In this embodiment, the CPU 16 controls the power of the RF PA board 11 based on a first temperature function X1 representing the correspondence between the digital signal D1 corresponding to the transmit power P1 output by the RF PA board 11 and the temperature, and a second temperature function X2 representing the correspondence between the control digital signal D2 of the RF PA board 11 and the temperature. Furthermore, the first temperature function X1 is a linear function established based on the digital signals D1 and their corresponding temperatures at multiple different high and low temperatures within a wide temperature range, corresponding to a straight line with a slope of slope1; the second temperature function X2 is a linear function established based on the digital signal D2 and its corresponding temperature at a constant predetermined power, such as a reference power at room temperature of 20°C, at multiple different high and low temperatures within the wide temperature range, corresponding to a straight line with a slope of slope2.
[0039] The aforementioned different high and low temperatures can be -30℃, -10℃, 0℃, 20℃, and 40℃.
[0040] Specifically, based on the two temperature functions X1 and X2 mentioned above, the CPU 16 reads the digital signal D1 output from the ADC analog-to-digital converter 14, calculates the first temperature function X1 to obtain the temperature information at this time, and then substitutes the temperature into the second temperature function X2 to calculate the control digital signal D2 required at this time. The CPU 16 transmits the calculated control digital signal D2 to the DAC digital-to-analog converter 15 to control the power of the RF PA board 11 at different temperatures.
[0041] Implementation Method 2: Control Method for PA Board Temperature Compensation Link Device Figure 2This is a schematic flowchart illustrating the control method of the PA board temperature compensation link device according to an embodiment of the present invention. This embodiment is based on the PA board temperature compensation link device 10 of embodiment 1, and the specific steps are as follows.
[0042] In step 201, a first temperature function X1 is established, which represents the correspondence between the digital signal D1 corresponding to the transmit power P1 output by the RF PA board 11 and the temperature.
[0043] In this embodiment, a linear function is established based on multiple digital signals D1 at different high and low temperatures within a wide temperature range and their corresponding temperatures, which serves as the first temperature function X1. The first temperature function X1 corresponds to a straight line with a slope of slope1.
[0044] Specifically, the ambient temperature of the PA board temperature compensation link device 10 is sequentially adjusted to multiple different high and low temperatures within a predetermined wide temperature range, such as -30℃, -10℃, 0℃, 20℃, and 40℃. Under these multiple different high and low temperature conditions, digital signals D1 are acquired through coupler 12, RMS logarithmic detector 13, and ADC analog-to-digital converter 14, respectively. Then, based on the dataset of the corresponding relationship between the acquired multiple digital signals D1 and their corresponding temperature values T {(T1, D1-1), (T2, D1-2), (T3, D1-3), (T4, D1-4), (T5, D1-5)}, a linear fitting algorithm, such as the least squares method, is used to simulate and calculate a linear function relationship between the digital signal D1 and the temperature T, with a corresponding slope of slope1, which is used as the first temperature function X1.
[0045] In step 202, a second temperature function X2 is established, which represents the correspondence between the control digital signal D2 of the RF PA board 11 and the temperature.
[0046] In this embodiment, a linear function is established based on the digital signal D2 and its corresponding temperature under the condition that the output power of the RF PA board 11 at multiple different high and low temperatures within the wide temperature range is a predetermined power, such as the reference power at room temperature of 20°C. This second temperature function X2 corresponds to a straight line with a slope of slope2.
[0047] Specifically, under the aforementioned predetermined high and low temperatures, such as -30℃, -10℃, 0℃, 20℃, and 40℃, the CPU 16 generates multiple sets of digital signals D2, which control the DAC digital-to-analog converter 15 to generate multiple sets of analog signal voltages V2 to control the VGS voltage of the RF PA board 11, so that the output power of the RF PA board 11 is a predetermined power, such as the reference power at room temperature of 20℃. Then, based on the corresponding relationship dataset {(T1, D2-1), (T2, D2-2), (T3, D2-3), (T4, D2-4), (T5, D2-5)} of these multiple sets of digital signals D2 and their corresponding temperature values T, a linear fitting algorithm, such as the least squares method, is used to simulate and calculate a linear function relationship between the control digital signal D2 and the temperature T, with a corresponding slope of slope2, which serves as the second temperature function X2.
[0048] In step 203, based on the first temperature function X1 and the second temperature function X2, real-time temperature compensation control of the RF PA board 11 is performed to control the output power of the RF PA board 11.
[0049] Specifically, after the PA board temperature compensation link device 10 enters the normal working state, the coupler 12 continuously collects the coupling power of the output power of the RF PA board 11 in real time. The output power signal is converted into an analog signal voltage value V1 that is logarithmically related to the power value by the RMS logarithmic detector 13, and then sampled and converted into a real-time digital signal D1 by the ADC analog-to-digital converter 14, and transmitted to the CPU 16 in real time.
[0050] After receiving the real-time digital signal D1, the CPU 16 substitutes it into the first temperature function X1 to calculate the actual operating temperature T of the current RF PA board 11.
[0051] The CPU 16 substitutes the calculated current temperature T into the second temperature function X2 to calculate the target control digital signal D2 required to keep the output power of the RF PA board 11 constant at a predetermined power, such as the reference power at room temperature of 20°C.
[0052] CPU 16 sends the target control digital signal D2 to DAC digital-to-analog converter 15 in real time. DAC digital-to-analog converter 15 converts the target control digital signal D2 into the corresponding analog signal voltage V2, which is transmitted to the VGS control terminal of RF PA board 11 through the control line. This dynamically adjusts the VGS voltage to change the amplification factor of RF PA board 11, thereby controlling the power of RF PA board 11 at different temperatures.
[0053] The PA board temperature compensation link device 10 and its control method according to the embodiments of this application, by introducing a logarithmic detector to detect the output power value of the RF PA board, and by using temperature parameters to effectively correspond the values of the DAC digital-to-analog converter and the ADC analog-to-digital converter, can achieve the following effects: Compared with the prior art, the present invention has the following advantages: 1. High temperature detection accuracy: This invention does not rely on thermistors to detect temperature. Instead, it acquires the output power signal of the PA board in real time through a coupler. Combined with an RMS logarithmic detector and an ADC analog-to-digital converter, the power signal is converted into a digital signal. A function model is established based on the correlation between power and temperature, which directly reflects the actual operating temperature of the PA board. It is not affected by the installation layout and ambient temperature, and the temperature detection accuracy is significantly improved. 2. Strong real-time power control: By establishing a linear function relationship between the digital signal corresponding to the output power of the PA board and the temperature, as well as the control digital signal of the PA board and the temperature, the current temperature can be quickly calculated based on the digital signal corresponding to the output power acquired in real time, and the corresponding control digital signal can be generated in real time. Then, the VGS voltage of the PA board is adjusted through the DAC digital-to-analog converter, thereby realizing real-time dynamic compensation of power and ensuring constant output power. 3. Wide applicable temperature range: This invention establishes a function model by collecting data within a wide temperature range of different high and low temperatures. The fitted linear temperature function can cover the temperature range of most practical application scenarios, and the temperature compensation effect is stable and reliable. 4. Simple structure and easy to implement: This invention can realize the temperature compensation function of the PA board by simply combining conventional RF and digital devices such as couplers, RMS logarithmic detectors, ADC analog-to-digital converters, CPUs, and DAC digital-to-analog converters. No special customized devices are required, the cost is low, and it is easy to integrate into existing PA board designs.
[0054] It should be understood that the apparatus and methods disclosed in the embodiments provided in this application can be implemented in other ways. The apparatus embodiments described above are merely illustrative. Furthermore, the features disclosed in the method or apparatus embodiments provided in this application can be arbitrarily combined without conflict to obtain new method or apparatus embodiments.
[0055] The above description is merely an embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.
Claims
1. A PA board temperature compensation link device, characterized in that, include: The radio frequency PA board (11) is a radio frequency signal processing board in the radio frequency link, which is used to amplify the received signal and output the transmit power; Coupler (12), whose input end is connected to the output end of the RF PA board (11) and whose output end is connected to the antenna interface, is used to receive the transmission power from the RF PA board (11) and output it to the antenna interface, and to collect the transmission power and output an RF signal representing the coupling power through the coupling end; The RMS logarithmic detector (13) is connected to the coupling end of the coupler (12) to calculate the root mean square value of the radio frequency signal output by the coupler (12) and convert it into an analog voltage signal that is logarithmically related to the power value. An ADC analog-to-digital converter (14) is connected to the output of the RMS logarithmic detector (13) to convert the analog voltage signal output by the RMS logarithmic detector (13) into a digital signal. A data processor (16), which is communicatively connected to the ADC analog-to-digital converter (14), is responsible for processing the digital signals output by the ADC analog-to-digital converter (14) and controlling the operating state of the RF PA board (11) based on the processing results; and A DAC (digital-to-analog converter) (15) is communicatively connected to the data processor (16) and converts the control digital signal output by the data processor (16) into an analog voltage signal that controls the operating state of the RF PA board (11). The data processor (16) controls the output power of the radio frequency PA board (11) based on a first temperature function and a second temperature function. The first temperature function represents the correspondence between the digital signal corresponding to the transmission power of the radio frequency PA board (11) and the temperature, and the second temperature function represents the correspondence between the control digital signal of the radio frequency PA board (11) and the temperature.
2. The PA board temperature compensation link device according to claim 1, characterized in that, The first temperature function is a linear function established based on the digital signal corresponding to the transmit power output by the RF PA board (11) at multiple different high and low temperatures within a wide temperature range and its corresponding temperature. The second temperature function is a linear function established based on the control digital signal and its corresponding temperature of the RF PA board (11) under constant output power at multiple different high and low temperatures within the wide temperature range.
3. The PA board temperature compensation link device according to claim 1, characterized in that, The data processor (16) calculates the current temperature information based on the first temperature function and the digital signal output from the ADC analog-to-digital converter (14), and inputs the temperature information into the second temperature function to calculate the current required control digital signal, and outputs the control digital signal to the DAC digital-to-analog converter (15).
4. The PA board temperature compensation link device according to claim 1, characterized in that, The various high and low temperatures are -30℃, -10℃, 0℃, 20℃, and 40℃.
5. A control method for a PA board temperature compensation link device, characterized in that, The PA board temperature compensation link device is the PA board temperature compensation link device according to any one of claims 1-4, and the control method includes: Establish a first temperature function, which represents the correspondence between the digital signal corresponding to the transmit power output by the radio frequency PA board (11) of the PA board temperature compensation link device and the temperature; Establish a second temperature function, which represents the correspondence between the control digital signal of the RF PA board (11) and the temperature; and Real-time temperature compensation control is performed based on the first temperature function and the second temperature function to control the output power of the RF PA board (11).
6. The control method according to claim 5, characterized in that, The steps for establishing the first temperature function include: A linear function is established based on the digital signals corresponding to the transmit power output by the RF PA board (11) at multiple different high and low temperatures within a wide temperature range, and their corresponding temperatures, as the first temperature function. The steps for establishing the second temperature function include: A linear function is established based on the control digital signal and its corresponding temperature of the RF PA board (11) under constant output power at multiple different high and low temperatures within the wide temperature range, and serves as the second temperature function.
7. The control method according to claim 6, characterized in that, The steps for establishing the first temperature function include: The ambient temperature is sequentially adjusted to the multiple different high and low temperatures within the wide temperature range, and the radio frequency PA board (11) outputs transmission power; At each of the multiple different high and low temperatures, the digital signal corresponding to the transmit power output by the RF PA board (11) is acquired via coupler (12), RMS logarithmic detector (13), and ADC analog-to-digital converter (14); and Based on the digital signal corresponding to the transmission power output by the RF PA board (11) at various temperatures of different high and low temperatures and the corresponding temperature value dataset, the first temperature function is obtained by linear fitting.
8. The control method according to claim 7, characterized in that, The steps for establishing the second temperature function include: At the various high and low temperatures within the wide temperature range, the data processor (16) generates control digital signals to ensure that the output power of the RF PA board (11) is always a predetermined power; and The second temperature function is obtained by linear fitting based on the dataset of control digital signals and their corresponding temperature values at various temperatures of multiple different high and low temperatures.
9. The control method according to claim 5, characterized in that, The steps for controlling the output power of the RF PA board (11) include: The real-time digital signal corresponding to the output power of the RF PA board (11) is acquired in real time through the coupler (12), RMS logarithmic detector (13), and ADC analog-to-digital converter (14) of the PA board temperature compensation link device. Substitute the real-time digital signal into the first temperature function to calculate the current actual operating temperature. Substituting the current actual operating temperature into the second temperature function, a target control digital signal is calculated to keep the output power of the RF PA board (11) constant at the predetermined power; and The DAC (digital-to-analog converter) converts the target control digital signal into a corresponding analog voltage signal and outputs it to the RF PA board (11) to control the output power of the RF PA board (11).