A feeding structure and antenna

Abstract

This disclosure provides a feeding structure and antenna, belonging to the field of communication technology, which can solve the problem of excessive thickness in existing feeding structures. The feeding structure of this disclosure includes a first reference electrode layer and a second reference electrode layer disposed opposite to each other, and a first dielectric layer and a transmission line disposed between the first and second reference electrode layers. The first reference electrode layer has a first slot, and the first dielectric layer is placed within the first slot; and / or, the second reference electrode layer has a second slot, and the first dielectric layer is placed within the second slot; the transmission line is insulated from the first and second reference electrode layers through the first dielectric layer. By providing slots on the first and / or second reference electrode layers, the miniaturization and lightweight requirements of modern communication equipment for feeding structures are met. Furthermore, the transmission line is insulated from the first and second reference electrode layers through the first dielectric layer, thereby ensuring the transmission loss of the feeding structure.

Description

Technical Field

[0001] This disclosure belongs to the field of communication technology, specifically relating to a feeding structure and an antenna. Background Technology

[0002] With the rapid development of wireless communication technology, the application fields of antennas are becoming increasingly widespread, and the requirements for their performance and form are also showing a diversified trend. Especially in the context of modern electronic devices pursuing miniaturization, integration, and thinness, antenna design is facing unprecedented challenges.

[0003] Traditional antenna designs are often limited by their profile height, making it difficult to meet the extreme space utilization requirements of modern electronic devices. For example, in portable devices such as smartphones and tablets, the installation space for antennas is extremely limited, and traditional external or protruding antennas not only affect the aesthetics and user experience of the product but may also be damaged by physical impacts. In addition, in the aviation, aerospace, and military fields, low-profile antenna designs are crucial for reducing radar cross-section and improving stealth and mobility.

[0004] In antenna design, the feed structure, as a crucial component, directly influences the antenna's profile height. Traditional feed structures often have a certain thickness, which to some extent limits the overall design of low-profile antennas. Therefore, there is an urgent need to design a low-profile feed structure. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and to provide a low-profile feeding structure and antenna.

[0006] The first aspect of the present invention provides a power feeding structure, the power feeding structure including a first reference electrode layer and a second reference electrode layer disposed opposite to each other, and a first dielectric layer and a transmission line disposed between the first reference electrode layer and the second reference electrode layer;

[0007] The first reference electrode layer has a first groove that partially extends through its thickness direction, and the first dielectric layer is disposed within the first groove; the transmission line is insulated from the first reference electrode layer and the second reference electrode layer through the first dielectric layer; and / or,

[0008] The second reference electrode layer has a second groove that extends partially through its thickness direction, and the first dielectric layer is placed in the second groove; the transmission line is insulated from the first reference electrode layer and the second reference electrode layer through the first dielectric layer.

[0009] In one possible implementation, when the first reference electrode layer has a first groove that partially extends through its thickness direction, and the first dielectric layer is placed within the first groove; and the transmission line is insulated from the first reference electrode layer and the second reference electrode layer through the first dielectric layer, the first dielectric layer has a third groove that partially extends through its thickness direction, the transmission line is placed within the third groove, and a second dielectric layer is disposed on the surface of the transmission line near the second reference electrode layer.

[0010] In one possible implementation, the second reference electrode layer has a second groove that partially extends through its thickness direction, and the first dielectric layer is placed in the second groove; when the transmission line is insulated from the first reference electrode layer and the second reference electrode layer through the first dielectric layer, the first dielectric layer has a fourth groove that partially extends through its thickness direction, the transmission line is placed in the fourth groove, and a second dielectric layer is disposed on the surface of the transmission line near the first reference electrode layer.

[0011] In one possible implementation, when the first reference electrode layer has a first groove that partially extends through its thickness direction, and the first dielectric layer is placed within the first groove; the second reference electrode layer has a second groove that partially extends through its thickness direction, and the first dielectric layer is placed within the second groove; and the transmission line is insulated from the first reference electrode layer and the second reference electrode layer through the first dielectric layer, the first groove and the second groove are opposite to each other, defining a first cavity, and the transmission line is disposed within the first cavity.

[0012] In one possible implementation, a support assembly is disposed within the first groove, and the transmission line is fixed to one end of the support assembly near the second reference electrode layer; or...

[0013] A support assembly is provided inside the second groove, and the transmission line is fixed to one end of the support assembly near the first reference electrode layer.

[0014] In one possible implementation, the transmission line includes an Nth-order 1-to-2 power divider, which includes a main path and two branches connected to the main path; wherein the main path of the (i+1)th-order 1-to-2 power divider is connected to one of the branches of the i-th-order 1-to-2 power divider.

[0015] In one possible implementation, the material of the first dielectric layer includes foam.

[0016] A second aspect of the present invention provides an antenna, the antenna comprising the feeding structure provided in the first aspect of the present invention.

[0017] In one possible implementation, the antenna further includes a phase shifter and a radiating structure; the feeding structure and the radiating structure are respectively connected to two transmission ends of the phase shifter.

[0018] In one possible implementation, the phase shifter is disposed on the side of the second reference electrode layer opposite to the transmission line, and a slit opening is provided on the second reference electrode layer. The feeding structure is coupled to the phase shifter through the slit opening. Attached Figure Description

[0019] Figure 1 This is a cross-sectional view of an exemplary power supply structure.

[0020] Figure 2 This is a schematic diagram of a power supply structure provided in one embodiment of the present invention.

[0021] Figure 3 This is a cross-sectional view of a power supply structure provided in one embodiment of the present invention.

[0022] Figure 4 for Figure 3 A partially enlarged view of the provided power supply structure.

[0023] Figure 5 This is a schematic diagram of the structure of a first reference electrode layer provided in an embodiment of the present invention.

[0024] Figure 6 This is a schematic diagram of the structure of a first dielectric layer provided in one embodiment of the present invention.

[0025] Figure 7 This is a cross-sectional view of a power supply structure provided in one embodiment of the present invention.

[0026] Figure 8 This is a cross-sectional view of a power supply structure provided in one embodiment of the present invention.

[0027] Figure 9 This is a cross-sectional view of a power supply structure provided in one embodiment of the present invention.

[0028] Figure 10 This is a cross-sectional view of a power supply structure provided in one embodiment of the present invention.

[0029] Figure 11 This is a schematic diagram of the structure of a first reference electrode layer provided in an embodiment of the present invention.

[0030] Figure 12 This is a schematic diagram of the structure of a second reference electrode layer provided in one embodiment of the present invention.

[0031] Figure 13This is a schematic diagram of the structure of a first dielectric layer provided in one embodiment of the present invention.

[0032] Figure 14 This is a schematic diagram of a transmission line structure provided in one embodiment of the present invention.

[0033] Figure 15 This is a cross-sectional view of a power supply structure provided in one embodiment of the present invention.

[0034] Figure 16 This is a schematic diagram of a power supply structure provided in one embodiment of the present invention. Detailed Implementation

[0035] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms “a,” “an,” “an,” “the,” and similar words used in this application do not indicate quantity limitation and may indicate singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or devices. The terms “connected,” “linked,” “coupled,” and similar words used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Multiple” used in this application refers to two or more. “And / or” describes the relationship between related objects, indicating that three relationships may exist; for example, “A and / or B” can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following objects are in an "or" relationship. The terms "first," "second," and "third" used in this application are merely to distinguish similar objects and do not represent a specific ordering of objects. "Above," "below," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0037] As a key component in wireless communication equipment, the power supply structure is primarily responsible for efficiently and stably transmitting electrical energy to the main wire or other radio frequency components. To improve the transmission efficiency and stability of the power supply structure, and to reduce signal loss during transmission, the suspended stripline power supply structure is currently the main type used.

[0038] The suspended stripline feed structure achieves better electromagnetic shielding and lower signal loss by placing the transmission line between the first and second reference electrode layers and isolating it with air. It can also effectively reduce electromagnetic wave radiation leakage and coupling interference during transmission, overcoming the problems of high loss and increased loss with frequency in traditional microstrip feed networks.

[0039] However, despite the numerous performance advantages of suspended strip-feed structures, their physical structure prevents the implementation of low-profile designs. Suspended strip-feed structures typically utilize air bridges or suspension mechanisms, such as... Figure 1 As shown, the first reference electrode layer 101 and the second reference electrode layer 103 need to be arranged opposite each other to form a cavity with a certain thickness, so that there is a certain space between the first reference electrode layer 101 and the second reference electrode layer 103 to accommodate the transmission line 102 and the air medium. This makes the thickness and volume of the entire feeding structure relatively large. It is impossible to achieve the miniaturized and lightweight feeding structure pursued by modern wireless communication equipment.

[0040] Based on this, embodiments of this disclosure provide a power supply structure, such as... Figure 2-15 As shown, the power supply structure includes a first reference electrode layer 201 and a second reference electrode layer 202 disposed opposite to each other, and a first dielectric layer 301 and a transmission line 40 disposed between the first reference electrode layer 201 and the second reference electrode layer 202. In order to reduce the cross-sectional height of the power supply structure, the first reference electrode layer 201 and / or the second reference electrode layer 202 of the power supply structure are provided with a groove, and the first dielectric layer 301 and the transmission line 40 are disposed in the groove, wherein the transmission line 40 is insulated from the first reference electrode layer 201 and the second reference electrode layer 202 through the first dielectric layer 301.

[0041] In this embodiment, the first reference electrode layer 201 and / or the second reference electrode layer 202 are provided with grooves for accommodating the first dielectric layer 301 and the transmission line 40. That is, the first dielectric layer 301 is basically accommodated by the grooves, without increasing the cross-sectional height of the feed structure. Compared with increasing the distance between the first reference electrode layer 201 and the second reference electrode layer 202 to accommodate the dielectric and transmission line disposed between them, this embodiment can reduce the cross-sectional height of the feed structure, which meets the requirements of modern communication equipment for miniaturization and lightweighting of the feed structure. In addition, the transmission line 40 is insulated from the first reference electrode layer 201 and the second reference electrode layer 202 through the first dielectric layer 301, thereby ensuring the transmission loss of the feed structure.

[0042] It should be noted that the first reference electrode layer 201 and the second reference electrode layer 202 provide an electromagnetic shielding environment for the transmission line, effectively preventing external electromagnetic waves from interfering with the transmission line. Furthermore, as the relative ground points of the transmission line, the first reference electrode layer 201 and the second reference electrode layer 202 provide a low-impedance loop path for the current, ensuring smooth current flow and reducing losses during transmission. For ease of control, the first reference electrode layer 201 and the second reference electrode layer 202 can be ground electrode layers.

[0043] To better illustrate the specific structure of the power supply structure in this embodiment, the following description is provided in conjunction with specific examples.

[0044] First example: such as Figure 3-6 As shown, in this example, the first reference electrode layer 201 and the second reference electrode layer 202 are disposed opposite to each other. The first reference electrode layer 201 includes components along its thickness direction (e.g., ...). Figure 3The first reference electrode layer 301 is partially penetrated in the Y direction (as shown), and a first flat portion 2012 (other areas besides the first reference electrode layer 2011) is also present. The first dielectric layer 301 is located only within the first reference electrode layer 2011. The first dielectric layer 301 includes a third groove 3011 partially penetrated in its thickness direction, and a third flat portion 3014 (other areas besides the third groove 3011). The third flat portion 3014 is located away from the surface of the bottom wall of the first groove 2011, at a distance of a first distance less than the depth of the first groove 2011. The transmission line 40 is placed within the third groove 3011, and the transmission line 40 is located at a distance from the surface of the first reference electrode layer 2011 furthest from the bottom wall of the first groove 2011, at a distance of a second distance less than the depth of the first groove 2011. In this case, the second reference electrode layer 202 only contacts the first flat portion of the first reference electrode layer 201 and does not contact the transmission line 40. Since the transmission line and the second reference electrode layer are not in contact, there will be a certain air gap between them when there is no structure between them. This increases the air content of the medium around the transmission line 40, thereby reducing signal propagation loss.

[0045] Of course, the thickness d3 of the transmission line 4 can also be greater than the depth of the third groove 3011, but the transmission line 40 near the surface of the second reference electrode layer 202 still needs to have a certain gap with the second reference electrode layer 202 in order to achieve insulation between the transmission line and the second reference electrode layer 202 and increase the air content of the medium around the transmission line 40.

[0046] The above structure can be prepared by the following steps:

[0047] S10, Provide a first reference electrode layer 201.

[0048] In some examples, step S10 may specifically include: preparing a metal plate by a casting or rolling process, wherein the metal plate may be one or more of aluminum, silver, copper, and gold. Then, a first groove 2011 is formed on the metal plate by machining or laser etching to obtain a first reference electrode layer 201 including the first groove 2011 and a first flat portion 2012.

[0049] In other examples, step S10 may specifically include: providing a substrate; depositing a metallic material on the substrate by a deposition method, the metallic material being one or more of aluminum, silver, copper, and gold; peeling the metallic material from the substrate by mechanical or chemical peeling to obtain a metal plate; and then forming a first trench 2011 on the metal plate by machining or laser etching to obtain a first reference electrode layer 201 including the first trench 2011 and a first planar portion 2012.

[0050] S20. A first medium layer 301 is provided in the first groove 2011.

[0051] In some examples, step S20 may specifically include: shaping the foam material by machining or laser engraving techniques to form a first medium layer 301 including a third groove 3011 and a third flat portion 3014, wherein the thickness of the third flat portion 3014 is less than the depth of the first groove 2011.

[0052] In other examples, step S20 may specifically include: forming a first dielectric layer 301 including a third groove 3011 and a third flat portion 3014 by a molding process, wherein the thickness of the third flat portion 3014 is less than the depth of the first groove 2011, and then disposing the first dielectric layer 301 within the first groove 2011.

[0053] S30. A transmission line 40 is installed in the third slot 3011.

[0054] In some examples, step S30 may specifically include: preparing the transmission line 40 by a stamping process, and then placing the transmission line 40 in the third groove 3011.

[0055] In other examples, step S30 may specifically include forming a transmission line 40 in the third tank 3011 by an electroplating process.

[0056] S50. A second reference electrode layer 202 is provided on the side of the first reference electrode layer 201 where the first groove 2011 is formed, and the second reference electrode layer 202 contacts the first flat portion 2012 of the first reference electrode layer 201.

[0057] It should be noted that the formation methods of the second reference electrode layer 202 and the first reference electrode layer 201 are roughly the same, the only difference being that the second reference electrode layer 202 does not need to form a groove. For relevant details, please refer to the above content, and it will not be repeated here.

[0058] The second example: (e.g.) Figure 7 As shown, the structure of this example is largely the same as the first example, except that a second dielectric layer 302 is provided on the side of the transmission line 40 near the second reference electrode layer 202, and the second dielectric layer 302 completely fills the air gap between the transmission line 40 and the second reference electrode layer. In this case, the first dielectric layer 301 and the second dielectric layer 302 enclose the transmission line 40, thereby improving the stability of the transmission line 40, preventing the transmission line 40 from changing position due to external forces, preventing the transmission line 40 from contacting the second reference electrode layer 202, and ensuring the signal transmission quality of the feed structure.

[0059] The method for preparing the feed structure in this example is roughly the same as that in the first example. The only difference is that before step S50 and after step S30, step S40 is included: a second dielectric layer 302 is provided on the bottom wall side of the transmission line 40 away from the third groove 3011.

[0060] In some examples, step S40 may specifically include: placing polyurethane, polypropylene, or other foam materials on the bottom wall side of the transmission line 40 away from the third groove 3011, and then shaping the foam materials by mechanical processing or laser engraving technology to remove the foam materials that extend beyond the area of ​​the first groove 2011, thereby forming the second dielectric layer 302.

[0061] In other examples, step S40 may specifically include: forming a second dielectric layer 302 by a molding process, and then placing the second dielectric layer 301 on the bottom wall side of the transmission line 40 away from the third groove 3011.

[0062] The third example: This example has a structure that is roughly the same as the first example, such as... Figure 8 As shown, the only difference is that the thickness of the third flat portion 3014 of the first dielectric layer 301 is equal to the depth of the first groove portion 2011. That is, the surface of the third flat portion 3014 near the second reference electrode layer 202 is flush with the surface of the first flat portion 2012 near the second reference electrode layer 202. Therefore, the second reference electrode layer 202 contacts both the first flat portion 2012 and the third flat portion 3014. In this case, the first dielectric layer 301 is disposed within the first groove portion 2011 and in contact with the second reference electrode layer 202, preventing displacement of the first dielectric layer 301 under external vibration and improving structural stability. In this situation, when the transmission line 40 is disposed within the third groove portion 3011, to avoid contact between the transmission line 40 and the second reference electrode layer 202, the thickness d3 of the transmission line 40 is less than the depth of the third groove portion 3011.

[0063] The fabrication method of the feed structure in this example is largely the same as that in the first example, except that the thickness of the third flat portion 3014 of the first dielectric layer 301 formed in step S20 is equal to the depth of the first trench portion 2011. Relevant details can be found above and will not be repeated here.

[0064] The fourth example: This example has a structure that is roughly the same as the third example, such as... Figure 9As shown, the only difference is that the power supply structure also includes a second dielectric layer 302 disposed on the side of the transmission line 40 near the second reference electrode layer 202. The second dielectric layer 302 fills the air gap between the transmission line 40 and the second reference electrode layer 202. At this time, the first dielectric layer 301 and the second dielectric layer 302 wrap the transmission line 40, thereby improving the stability of the transmission line 40 and ensuring the signal transmission quality of the power supply structure.

[0065] The fabrication method of the feed structure in this example is largely the same as that in the fourth example, except that the thickness of the third flat portion 3014 of the first dielectric layer 301 formed in step S20 is equal to the depth of the first trench portion 2011. Relevant details can be found above and will not be repeated here.

[0066] The feed structure in this example can also be prepared using the following steps:

[0067] S10, Provide a second reference electrode layer 202.

[0068] S20, a second dielectric layer 302 is formed on the surface of the second reference electrode layer 202.

[0069] In some examples, step S20 may specifically include: depositing a foam material such as polyurethane or polypropylene on the surface of the second reference electrode layer 202, and then patterning the foam material using machining or laser engraving techniques to form the second dielectric layer 302. In other examples, step S20 may specifically include: forming the second dielectric layer 302 through a molding process, and depositing the second dielectric layer 302 on the surface of the second reference electrode layer 202.

[0070] S30, a transmission line 40 is provided on the side of the second dielectric layer 302 away from the second reference electrode layer 202.

[0071] S40, forming a first dielectric layer 301 and a first reference electrode layer 201 covering the transmission line 40.

[0072] Therefore, the first reference electrode layer 201 and the formed structure can be used as a pressing mold to directly shape the first dielectric layer 301 to form a third groove 3011 that matches the shape of the transmission line 40, thereby simplifying the manufacturing process and facilitating the large-scale production of the product.

[0073] It should be noted that the specific fabrication methods of the first reference electrode layer 201, the second reference electrode layer 202, and the transmission line 40 can be referred to the above examples, and will not be repeated here.

[0074] Fifth example: The power supply structure of this example, such as Figure 10-12As shown, in this example, both the first reference electrode layer 201 and the second reference electrode layer 202 of the feeding structure are provided with grooves. The first reference electrode layer 201 includes grooves along its thickness direction (e.g., ...). Figure 10 The first reference electrode layer 202 includes a first groove 2011 (shown in the Y direction) that partially penetrates the second reference electrode layer 202, and a first flat portion 2012 (other areas besides the first groove 2011). A first dielectric layer 301 is disposed only within the first groove 2011. The first dielectric layer 301 includes a third groove 3011 that partially penetrates the second reference electrode layer 202 along its thickness direction, and a third flat portion 3014. The third flat portion 3014 is flush with the surface of the first flat portion 2012 near the surface of the second reference electrode layer 202. The second reference electrode layer 202 includes a second groove 2021 that partially penetrates the second reference electrode layer 202 along its thickness direction, and a second flat portion 2022 (other areas besides the second groove 2021). The second dielectric layer 302 is disposed only within the second trench 2021. The second dielectric layer 302 includes a fourth trench 3021 and a fourth flat portion 3022 (the area other than the fourth trench 3021). The fourth flat portion 3022 is adjacent to the surface of the first reference electrode layer 201 and is flush with the surface of the second flat portion 2022 adjacent to the first reference electrode layer 201. The first trench 2011 and the second trench 2021 are disposed opposite to each other, defining a first cavity. The first dielectric layer 301 and the second dielectric layer 302 are disposed in the first cavity. The first flat portion 2012 and the second flat portion 2022 are in contact with each other. The third trench 3011 and the fourth trench 3021 are disposed opposite to each other, defining a second cavity. The transmission line 40 is disposed in the second cavity. The transmission line 40 passes through the first dielectric layer 301 and the second dielectric layer 302 and is insulated from the first reference electrode layer 201 and the second reference electrode layer 202. The third flat portion 3014 and the fourth flat portion 3022 are in contact with each other. In this case, the first dielectric layer 301 is fixedly disposed in the first cavity formed by the first groove 2011 and the second groove 2021 being disposed opposite to each other, and the first dielectric layer 301 and the second dielectric layer 302 are disposed to wrap the transmission line 40. Thus, when subjected to an external force impact, the transmission line and dielectric structure between the first reference electrode layer 201 and the second reference electrode layer 202 will not be displaced, the power supply structure is more stable, and the signal transmission quality is guaranteed.

[0075] The feed structure in this example can also be prepared using the following steps:

[0076] S10. A first reference electrode layer 201 and a second reference electrode layer 202 are provided. Here, the preparation method of the second reference electrode layer 202 is roughly the same as that of the first reference electrode layer 201, and other examples can be consulted for details.

[0077] S20. A first dielectric layer 301 is disposed in the first groove 2011 of the first reference electrode layer 201.

[0078] S30. A transmission line 40 is provided in the third groove 3011 of the first dielectric layer 301.

[0079] S40. A second dielectric layer 302 is disposed within the second trench 2021 of the second reference electrode layer 202. Here, the preparation method of the second dielectric layer 302 is roughly the same as that of the first dielectric layer 301, and other examples can be consulted for details.

[0080] S50, the third groove portion 3011 of the first dielectric layer 301 and the fourth groove portion 3021 of the second dielectric layer 302 are arranged opposite to each other, and the third flat portion 3014 of the first dielectric layer 301 and the fourth flat portion 3022 of the second dielectric layer 302 are brought into contact; the first flat portion 2012 of the first reference electrode layer 201 and the second flat portion 2022 of the second reference electrode layer 202 are brought into contact.

[0081] In some embodiments of this disclosure, the material of the first dielectric layer 301 includes, but is not limited to, foamed foam, polytetrafluoroethylene, and other low dielectric constant materials (materials with a dielectric constant less than 2.5) with a certain structural strength, so as to play a supporting role in fixing the transmission line 40, so that the transmission line 40 disposed in the third groove 3011 is insulated from the first reference electrode layer 201 and the second reference electrode layer 202, thereby realizing the suspended wire structure.

[0082] For example, the material of the first dielectric layer 301 is foamed foam, such as one or more of polyurethane foam, polystyrene foam, polyvinyl chloride foam, polyethylene foam, and polypropylene foam. The foamed foam has a high density and high processing precision, which can ensure the matching degree between the third groove 3011 and the transmission line 40, and can absorb external impacts to protect the transmission line 40 from external damage, thereby improving the service life of the power supply structure; and the dielectric constant of the foamed foam is less than 1.5, which can reduce delay and distortion in signal propagation, reduce signal loss, and improve propagation accuracy.

[0083] In some embodiments of this disclosure, the second dielectric layer 302 is a low dielectric constant material, such as foamed foam, polytetrafluoroethylene, etc.

[0084] In some embodiments of this disclosure, such as Figure 13As shown, a support component 3012 is also provided in the third groove 3011. The end of the support component 3012 away from the second reference electrode layer 202 is fixed to the bottom wall of the third groove 3011, and the transmission line 40 is fixed to the end of the support component 3012 near the second reference electrode layer 202. This improves the stability of the transmission line 40, prevents displacement of the transmission line 40, and ensures the signal transmission quality of the feeding structure. In addition, since the transmission line 40 is fixed to the side of the support component 3012 near the second reference electrode layer 202, there is an air gap between the transmission line 40 and the bottom wall of the third groove 3011. Therefore, the air ratio of the medium around the transmission line 40 is increased, and the signal loss of this feeding structure is lower than that of a feeding structure without a support component 3012. For example, the material of the support component 3012 is a low dielectric constant material, such as foam or polytetrafluoroethylene. There can be multiple support components 3012, and the support components 3012 can be columnar or frustum-shaped, such as cylindrical, quadrangular prism, or frustum-shaped. In practical applications, the transmission line 40 structure may have a cutout portion corresponding to the support component 3012, and each support component 3012 may be inserted into its corresponding cutout portion and contact the second reference electrode layer 202.

[0085] In this embodiment, the first dielectric layer 301 serves to support and fix the transmission line 40, providing stronger support compared to air bridge structures or suspension methods, thus enabling the installation of transmission lines 40 with more complex structures.

[0086] In some embodiments of this disclosure, such as Figure 14 As shown, the transmission line 40 includes an N-order 1-to-2 power divider 401. The 1-to-2 power divider 401 includes a main path 4011 and two branches 4012 connected to the main path 4011, where N ≥ 1. When N > 1, the main path 4011 of the (i+1)th order 1-to-2 power divider 401 is connected to one of the branches 4012 of the i-th order 1-to-2 power divider 401, where i ≥ 1. Specifically, the 1-to-2 power divider 401 is, for example, a T-type power divider. By cascading multiple 1-to-2 power dividers 401, the input signal can be evenly matched to multiple output ports, ensuring signal stability and improving the bandwidth of the power supply structure.

[0087] In some examples of this disclosure, such as Figure 15 As shown, the first groove 2011 can also be disposed in the second reference electrode layer 202. Other structures are roughly the same as those in the above example, and will not be described in detail here.

[0088] Another embodiment of this disclosure provides an antenna including the feeding structure provided in the above embodiments. It should be noted that the feeding structure provided in the above embodiments can also be used as a component of microwave radio frequency devices, radar, or other equipment.

[0089] In some examples, the antenna is a phased array antenna, including the feeding structure, phase shifter, and radiating structure provided in the above embodiments; the feeding structure and radiating structure are respectively connected to the two transmission ends of the phase shifter, supporting TEM transmission mode. It should be noted that, as... Figure 16 As shown, the second reference electrode layer 202 of the feed structure has multiple slit openings 50 extending through its own thickness. The feed structure is coupled to the phase shifter through these slit openings. To avoid unnecessary radiation loss or reflection during signal transmission, which would affect the efficiency of the entire antenna system, the orthographic projection of the slit opening 50 on the first reference electrode layer 201 does not overlap with the orthographic projection of the transmission line 40 on the first reference electrode layer 201. The shape of the slit opening 50 can be rectangular or circular. It should be noted that the shape, size, and number of the slit openings can be designed by those skilled in the art based on the radiation mode and target frequency, and will not be elaborated here.

[0090] In some examples, the phase shifter also includes a phase shifting section. One transmission end of the phase shifter is used as an input end, and the other transmission end is used as an output end. For example, the transmission end connected to the feed structure is used as the input end, and the transmission end connected to the radiating structure is used as the output end. The input end feeds the signal input from the feed structure into the phase shifting section, which modulates the phase of the signal to control the beam direction of the antenna. The signal is then fed out to the radiating structure through the output end. The radiating structure is used to convert the signal output by the phase shifter into electromagnetic waves, such as linearly polarized electromagnetic waves or circularly polarized electromagnetic waves, and radiate them into space. Alternatively, the transmission end connected to the feed structure is used as the output end, and the transmission end connected to the radiating structure is used as the input end. The radiating structure receives electromagnetic waves from space and converts the received electromagnetic waves into electrical signals. Subsequently, the input end of the phase shifter feeds the electrical signals into the phase shifting section. The phase shifting section adjusts the phase of the electrical signals according to a preset program, and then transmits the adjusted signal to the feed structure through the output end, which further transmits it to back-end devices, such as amplifiers or other processing units.

[0091] In some examples, the phase shifter is, for example, a liquid crystal phase shifter. Liquid crystal phase shifters can flexibly adjust the signal phase and offer advantages such as low power consumption, small size, high integration, and fine phase adjustment, reducing signal loss and meeting the requirements of low-profile antennas. Specifically, the thickness of the liquid crystal phase shifter is less than 25 μm, for example, 3 μm, 10 μm, or 18 μm.

[0092] In some examples, a circularly polarized antenna is mounted on the surface of the radiating structure away from the feed structure. The circularly polarized antenna can transmit and receive signals uniformly in different directions, thus improving communication quality.

[0093] In some examples, the antenna in an electronic device also includes a transceiver unit, an RF transceiver, a signal amplifier, a power amplifier, and a filtering unit. The antenna in a communication device can function as either a transmitting antenna or a receiving antenna. The transceiver unit can include a baseband and a receiving end. The baseband provides signals in at least one frequency band, such as 2G, 3G, 4G, and 5G signals, and transmits these signals to the RF transceiver. After receiving the signal, the antenna in the communication system processes it through the filtering unit, power amplifier, signal amplifier, and RF transceiver before transmitting it to the receiving end in the transceiver unit. The receiving end can be, for example, a smart gateway.

[0094] Furthermore, the RF transceiver is connected to the transceiver unit and is used to modulate the signals transmitted by the transceiver unit, or to demodulate the signals received by the antenna before transmitting them to the transceiver unit. Specifically, the RF transceiver may include a transmitting circuit, a receiving circuit, a modulation circuit, and a demodulation circuit. After the transmitting circuit receives various types of signals provided by the baseband, the modulation circuit can modulate these signals before sending them to the antenna. The antenna receives the signals and transmits them to the receiving circuit of the RF transceiver. The receiving circuit then transmits the signals to the demodulation circuit, which demodulates the signals before transmitting them to the receiving end.

[0095] Furthermore, the RF transceiver is connected to a signal amplifier and a power amplifier, which are then connected to a filtering unit. The filtering unit is connected to at least one antenna. During signal transmission in the communication system, the signal amplifier improves the signal-to-noise ratio (SNR) of the RF transceiver's output signal before transmitting it to the filtering unit; the power amplifier amplifies the power of the RF transceiver's output signal before transmitting it to the filtering unit. The filtering unit may specifically include a duplexer and a filtering circuit. The filtering unit combines the signals output from the signal amplifier and power amplifier, filters out clutter, and transmits them to the antenna, which then radiates the signal. During signal reception in the communication system, the antenna receives the signal and transmits it to the filtering unit. The filtering unit filters out clutter from the received signal and transmits it to the signal amplifier and power amplifier. The signal amplifier increases the gain of the received signal, improving the SNR; the power amplifier amplifies the power of the received signal. The signal received by the antenna, after processing by the power amplifier and signal amplifier, is transmitted to the RF transceiver, which then transmits it to the transceiver unit.

[0096] In some examples, the signal amplifier may include various types of signal amplifiers, such as low-noise amplifiers, without limitation.

[0097] In some examples, the antenna provided in this disclosure also includes a power management unit connected to a power amplifier to provide voltage to the power amplifier for amplifying signals.

[0098] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A power supply structure, characterized in that, The power supply structure includes a first reference electrode layer and a second reference electrode layer disposed opposite to each other, and a first dielectric layer and a transmission line disposed between the first reference electrode layer and the second reference electrode layer; The first reference electrode layer has a first groove that partially extends through its thickness direction, and the first dielectric layer is disposed within the first groove; the transmission line is insulated from the first reference electrode layer and the second reference electrode layer through the first dielectric layer; and / or, The second reference electrode layer has a second groove that extends partially through its thickness direction, and the first dielectric layer is placed in the second groove; the transmission line is insulated from the first reference electrode layer and the second reference electrode layer through the first dielectric layer.

2. The power supply structure according to claim 1, characterized in that, When the first reference electrode layer has a first groove that partially penetrates its thickness direction, the first dielectric layer is placed in the first groove; when the transmission line is insulated from the first reference electrode layer and the second reference electrode layer through the first dielectric layer, the first dielectric layer has a third groove that partially penetrates its thickness direction, the transmission line is placed in the third groove, and a second dielectric layer is provided on the surface of the transmission line near the second reference electrode layer.

3. The power supply structure according to claim 1, characterized in that, When the second reference electrode layer has a second groove that partially penetrates its thickness direction, the first dielectric layer is placed in the second groove; when the transmission line is insulated from the first reference electrode layer and the second reference electrode layer through the first dielectric layer, the first dielectric layer has a fourth groove that partially penetrates its thickness direction, the transmission line is placed in the fourth groove, and a second dielectric layer is provided on the surface of the transmission line near the first reference electrode layer.

4. The power supply structure according to claim 1, characterized in that, When the first reference electrode layer has a first groove that partially extends through its thickness direction, and the first dielectric layer is placed in the first groove; the second reference electrode layer has a second groove that partially extends through its thickness direction, and the first dielectric layer is placed in the second groove; and the transmission line is insulated from the first reference electrode layer and the second reference electrode layer through the first dielectric layer, the first groove and the second groove are opposite to each other, defining a first cavity, and the transmission line is disposed in the first cavity.

5. The power supply structure according to claim 1, characterized in that, A support assembly is provided within the first groove, and the transmission line is fixed to one end of the support assembly near the second reference electrode layer; or, A support assembly is provided inside the second groove, and the transmission line is fixed to one end of the support assembly near the first reference electrode layer.

6. The power supply structure according to claim 1, characterized in that, The transmission line includes an Nth-order 1-to-2 power divider, which includes a main path and two branches connected to the main path; wherein the main path of the (i+1)th-order 1-to-2 power divider is connected to one of the branches of the i-th-order 1-to-2 power divider.

7. The power supply structure according to claim 1, characterized in that, The material of the first dielectric layer includes foam.

8. An antenna, characterized in that, Includes the power supply structure as described in any one of claims 1-7.

9. The antenna according to claim 8, characterized in that, The antenna also includes a phase shifter and a radiating structure; the feeding structure and the radiating structure are respectively connected to the two transmission ends of the phase shifter.

10. The antenna according to claim 9, characterized in that, The phase shifter is disposed on the side of the second reference electrode layer away from the transmission line. A slit opening is provided on the second reference electrode layer, and the power supply structure is coupled to the phase shifter through the slit opening.

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