A plastic package chip opening device and method

Abstract

This application relates to the field of semiconductor testing technology and discloses a device and method for opening a plastic-encapsulated chip. The device includes: a housing; a guide frame; a clamping component movably mounted on the guide frame; a driving component, which is connected to the clamping component; a first dropper, a third dropper, and a second dropper; the first dropper is connected to an acid storage mechanism, the third dropper is connected to a cleaning solution storage mechanism, and the second dropper is connected to an alkali storage mechanism; and a control system electrically connected to the acid storage mechanism, the cleaning solution storage mechanism, the alkali storage mechanism, and the driving component. The first dropper, the third dropper, and the second dropper are arranged sequentially along the length of the guide frame within the housing. The specific layout of the first dropper connected to the acid solution, the third dropper connected to the cleaning solution, and the second dropper connected to the alkali solution, combined with the sliding clamping component and the control system, achieves full automation of the plastic-encapsulated chip opening process and collaborative operation of multiple reagents without cross-contamination.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and in particular to a device and method for opening a plastic-encapsulated chip. Background Technology

[0002] A molded chip is a device in which a semiconductor chip is encapsulated using materials such as epoxy molding compound. The encapsulation effectively protects the internal semiconductor chip from damage caused by moisture, dust, and mechanical impact. In the reliability assessment, failure analysis, and destructive physical analysis of semiconductor devices, chemical decapsulation technology can be used to remove the external molding compound and fully expose the chip surface and surrounding structure without damaging the internal circuitry in order to perform high-precision morphological observation, material analysis, and electrical testing of the internal chip structure, bonding wires, and lead frame. For example, patent document with application number CN117141878A discloses a chemical decapsulation device and method for molded components. The device includes a device clamping structure, including a first clamping part for clamping the molded component and a first guide rail part extending in a horizontal direction. The first clamping part is slidably connected to the first guide rail part. A dropper clamping structure includes a second clamping part for clamping a pipette and a second guide rail part extending in a vertical direction. The pipette is slidably connected to the second guide rail part, and a container for loading acid is provided below the second guide rail part.

[0003] During operation, the pipette is first slid downwards along the vertical guide rail via the second clamping part, immersing itself in the container filled with acid to draw up the reagent, and then moved upwards to detach from the container. Next, the first clamping part holding the molded component is slid along the horizontal guide rail and moved to a position directly below the pipette. Finally, the pipette is controlled to drip acid onto the surface of the molded component. However, the opening process of molded chips generally requires multiple chemical reagents, such as fuming nitric acid to remove the molding compound, alkaline solution to treat the red glue or PI film, and cleaning solution to remove residues. For chips that require a complex opening process using multiple reagents to be fully opened, this device can only use one reagent at a time, requiring manual intervention to change it. Furthermore, when switching between different types of reagents using the same dropper and tubing, cross-contamination is easily caused due to incomplete cleaning, affecting the opening accuracy and device safety. Summary of the Invention

[0004] The technical problem to be solved by this application is that the existing chemical opening device for plastic-encapsulated components is not applicable to plastic-encapsulated chips that require multiple reagents to be fully opened.

[0005] To address the aforementioned technical problems, this application provides a device for opening plastic-encapsulated chips, comprising: Box; The guide frame is horizontally installed inside the housing; The clamping element is movably mounted on the guide frame and is used to fix the plastic-encapsulated chip. The driving component is connected to the clamping component in a transmission manner; The liquid supply system includes an acid storage mechanism, a cleaning fluid storage mechanism, and an alkali storage mechanism; The first dropper, the third dropper, and the second dropper, with their outlets spaced apart along the axial direction of the guide frame above the encapsulated chip; The first dropper is connected to the acid storage mechanism, the third dropper is connected to the cleaning solution storage mechanism, and the second dropper is connected to the alkali storage mechanism. The control system is electrically connected to the acid storage mechanism, the cleaning solution storage mechanism, the alkali storage mechanism, and the drive unit, respectively. The control system is used for: The control drive is activated to drive the clamping component to move horizontally along the guide frame; Control the acid storage mechanism to deliver acid to the first dropper; Control the cleaning fluid storage mechanism to deliver cleaning fluid to the third dropper; Control the alkali storage mechanism to deliver alkali to the second dropper.

[0006] Preferably, the acid storage mechanism includes a first acid container, a second acid container, an acid mixing container, a first solenoid valve, and a second solenoid valve; The inlet of the first solenoid valve is connected to the first acid container, and the outlet is connected to the acid mixing container. The inlet of the second solenoid valve is connected to the second acid container, and the outlet is connected to the acid mixing container. The first dropper is connected to the acid mixing container; The first and second solenoid valves are electrically connected to the control system, respectively.

[0007] Preferably, the cleaning fluid storage mechanism includes a cleaning fluid container and a third solenoid valve, and the alkali storage mechanism includes an alkali container and a fourth solenoid valve. The inlet of the third solenoid valve is connected to the cleaning fluid container, and the outlet is connected to the third dropper. The inlet of the fourth solenoid valve is connected to the alkali solution container, and the outlet is connected to the second dropper. The third and fourth solenoid valves are electrically connected to the control system.

[0008] Preferably, the guide frame is a lead screw, and a slider is provided on the lead screw, with the slider threadedly engaged with the lead screw; the clamping component is connected to the upper side of the slider; The driving component is a motor, and the output shaft of the motor is connected to one end of the lead screw for transmission.

[0009] Preferably, the slider includes a base, an inclined portion, and an elastic reset mechanism; The lead screw passes horizontally through the lower side of the base, and the clamping part is connected to the upper side of the inclined part; One end of the inclined part is rotatably connected to one end of the base, one end of the elastic reset mechanism is connected to the base, and the other end of the elastic reset mechanism is connected to the inclined part; An electromagnet is installed on the base, and a magnetic component is installed on the inclined part; The control system is electrically connected to the electromagnet and is used to control the electromagnet to be energized so that it is attracted to the magnetic components, or to control the electromagnet to be de-energized.

[0010] Preferably, the plastic-encapsulated chip unpacking device further includes a gas spray gun, the outlet end of which is located inside the housing and above the guide frame, for spraying dry gas onto the plastic-encapsulated chip on the clamping member.

[0011] Preferably, the clamping member is provided with two horizontally spaced retainers, each retainer having a drive gear rotatably mounted inside, and each retainer having a rack rod horizontally mounted on it, each rack rod meshing with each drive gear respectively; Each rack bar has a clamping plate at its close end, and the gap between the two clamping plates forms a clamping space for holding the molded chip.

[0012] This application also provides a method for opening the above-mentioned plastic-encapsulated chip opening device, including the following steps: S1. Fix the plastic-encapsulated chip onto the clamping component; S2. The control system controls the driving component to drive the clamping component to move along the guide frame, so that the plastic-encapsulated chip moves to below the first dropper. The control system controls the acid storage mechanism to deliver acid to the first dropper. S3. The driving component drives the clamping component to move along the guide frame, so that the plastic-encapsulated chip moves to below the third dropper. The control system controls the cleaning fluid storage mechanism to deliver cleaning fluid to the third dropper. S4. The driving component drives the clamping component to move along the guide frame, so that the plastic-encapsulated chip moves to below the second dropper. The control system controls the alkali storage mechanism to deliver alkali to the second dropper.

[0013] Preferably, in step S2, the control system controlling the acid storage mechanism to deliver acid to the first dropper specifically includes: Determine the required type of acid solution based on the type of molded chip; The control system controls the first solenoid valve to open and the second solenoid valve to close, injecting a corresponding amount of first acid solution from the first acid solution container into the acid solution mixing container and delivering it to the first dropper. Alternatively, the control system controls the first solenoid valve to close and simultaneously controls the second solenoid valve to open, injecting a corresponding amount of the second acid solution from the second acid solution container into the acid solution mixing container and delivering it to the first dropper. Alternatively, the control system controls the first and second solenoid valves to open simultaneously, injecting a corresponding amount of acid from the first and second acid containers into the acid mixing container for mixing, and then delivering the mixed acid to the first dropper.

[0014] Preferably, step S3 further includes: After the third dropper supplies cleaning fluid to clean the molded chip, the control system de-energizes the electromagnet on the base. The elastic reset mechanism drives the tilting part to rotate around the base, switching the tilting part from a horizontal state to an inclined state. This causes the clamping parts on the tilting part to tilt synchronously, allowing the cleaning waste fluid to flow down the inclined surface. After the cleaning waste fluid flows down, the control system energizes the electromagnet. The electromagnet on the base and the magnetic parts on the tilting part are attracted by magnetism, overcoming the elastic force of the elastic reset mechanism and restoring the tilting part from the inclined state to a horizontal state.

[0015] Compared with the prior art, the advantages of the plastic-encapsulated chip unpacking device and method disclosed in this application are as follows: In the encapsulated chip unpacking device of this application embodiment, a specific layout is achieved by arranging a first dropper, a third dropper, and a second dropper sequentially along the axial direction of the guide frame within the housing. The first dropper is connected to the acid solution, the third dropper to the cleaning solution, and the second dropper to the alkali solution. This, combined with the sliding clamping component and the control system, enables fully automated unpacking of the encapsulated chip and collaborative operation of multiple reagents without cross-contamination. The third dropper, as a cleaning component, is positioned between the first and second droppers. Regardless of whether the process flow is acid etching followed by alkali etching or alkali etching followed by acid etching, the cleaning station is always located between the two active reagent stations. This ensures that the sample undergoes a cleaning step before contacting the other type of reagent, thereby isolating the acidic and alkaline reagent tubing and residues from direct contact. Simultaneously, the control system precisely coordinates the drive component and the liquid supply system, enabling the clamped encapsulated chip to automatically transfer between different dropper stations. This avoids the safety risks and operational errors caused by manual intervention, ensures the consistency and repeatability of unpacking parameters, and improves unpacking accuracy, device safety, and analytical reliability. Attached Figure Description

[0016] Figure 1 This is an overall flowchart of the plastic-encapsulated chip unpacking method provided in the embodiments of this application; Figure 2 This is a schematic diagram of the overall structure of the plastic-encapsulated chip unpacking device provided in the embodiments of this application; Figure 3 This is a schematic diagram of the overall structure of the plastic-encapsulated chip unpacking device provided in this application embodiment after removing the rubber tubing; Figure 4 This is a schematic diagram of the liquid supply system in the plastic-encapsulated chip unpacking device provided in this application embodiment; Figure 5This is a schematic diagram of the control system structure in the plastic-encapsulated chip unpacking device provided in the embodiments of this application; Figure 6 This is an enlarged front view of the slider and clamping parts in the plastic-encapsulated chip unpacking device provided in this application embodiment; Figure 7 This is an enlarged top view of the slider and clamping parts in the plastic-encapsulated chip unpacking device provided in this application embodiment; Figure 8 This is an enlarged side view of the slider portion in the plastic-encapsulated chip unpacking device provided in this application embodiment.

[0017] In the diagram, 100 is the housing; 101 is the drive unit; 102 is the guide frame; 1021 is the rubber hose; and 1022 is the insulated wire. 103. Slider; 1031. Base; 1032. Inclined part; 1033. Limiting support rod; 1034. Spring; 1035. Electromagnet; 1036. Magnetic component; 104. Clamping component; 1041. Positioning pin; 1042. Positioning hole; 1043. Fixing device; 1044. Drive gear; 1045. Rack and pinion; 1046. Clamping plate; 105. First dropper; 106. Second dropper; 107. Third dropper; 108. Gas spray gun; 109. Sealing ring; 110. Glass protective cover; 111. Power and communication cables; 112. Waste liquid pipe; 113. Waste liquid collection container; 114. Exhaust pipe; 200. Liquid supply system; 201. Liquid supply pipe; 2031. First solenoid valve; 2032. Second solenoid valve; 2033. Third solenoid valve; 2034. Fourth solenoid valve; 204. Acid mixing container; 205. Reagent storage cabinet; 206. First acid container; 207. Second acid container; 208. Alkali container; 209. Cleaning solution container; 210. Water injection pipe; 300. Control system; 301. Communication interface; 302. Communication bus; 303. Processor; 304. Memory; 305. Computer program. Detailed Implementation

[0018] The specific embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but are not intended to limit the scope of this application.

[0019] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0020] It should be understood that the terms "first," "second," etc., are used in this application to describe various types of information, but these terms are not limited to them and are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information.

[0021] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] like Figures 2 to 8 As shown in the preferred embodiment of this application, a plastic-encapsulated chip unpacking device is provided, comprising: Box 100; Guide frame 102 is horizontally set inside housing 100; The clamping member 104 is movably mounted on the guide frame 102 and is used to fix the plastic-encapsulated chip. The driving component 101 is connected to the clamping component 104 in a transmission manner; The liquid supply system 200 includes an acid storage mechanism, a cleaning fluid storage mechanism, and an alkali storage mechanism; The first dropper 105, the third dropper 107, and the second dropper 106 are arranged sequentially and at intervals above the plastic-encapsulated chip along the axial direction of the guide frame 102. The first dropper 105 is connected to the acid storage mechanism, the third dropper 107 is connected to the cleaning solution storage mechanism, and the second dropper 106 is connected to the alkali storage mechanism. The control system 300 is electrically connected to the acid storage mechanism, the cleaning fluid storage mechanism, the alkali storage mechanism, and the drive unit 101, respectively. The control system 300 is used for: The control drive 101 is activated to drive the clamping member 104 to move horizontally along the guide frame 102; Control the acid storage mechanism to deliver acid to the first dropper 105; The cleaning fluid storage mechanism is controlled to deliver cleaning fluid to the third dropper 107; The alkaline solution storage mechanism is controlled to deliver alkaline solution to the second dropper 106.

[0023] In the molded chip unpacking device and method of this application embodiment, a first dropper 105, a third dropper 107, and a second dropper 106 are arranged sequentially along the length of the guide frame 102 within the housing 100. The specific layout of the first dropper 105 connected to acid, the third dropper 107 connected to cleaning solution, and the second dropper 106 connected to alkali solution, combined with the sliding clamping component 104 and the control system 300, achieves fully automated unpacking of the molded chip and collaborative operation of multiple reagents without cross-contamination. The third dropper 107, as a cleaning component, is confined between the first dropper 105 and the second dropper 106, regardless of whether the process flow is acid etching followed by alkali etching or alkali etching followed by... The acid etching and cleaning station is always located between the two active reagent stations, ensuring that the sample undergoes a cleaning step before contacting the other type of reagent, thus isolating the acidic and alkaline reagent tubing and residues from direct contact. At the same time, the control system 300 precisely coordinates the drive unit 101 and the liquid supply system 200, enabling the clamped encapsulated chip to be automatically transferred between different dropper stations. This avoids the safety risks and operational errors caused by manual intervention, while ensuring the consistency and repeatability of opening parameters, improving opening accuracy, device safety, and analytical reliability. It also solves the problem in existing technologies where single dropper devices cannot handle multiple reagent processes or where cross-contamination occurs due to incomplete tubing cleaning.

[0024] Specifically, the acid storage mechanism includes a first acid container 206, a second acid container 207, an acid mixing container 204, a first solenoid valve 2031, and a second solenoid valve 2032. The inlet end of the first solenoid valve 2031 is connected to the first acid container 206, and the outlet end is connected to the acid mixing container 204. The inlet end of the second solenoid valve 2032 is connected to the second acid container 207, and the outlet end is connected to the acid mixing container 204. The first dropper 105 is connected to the acid mixing container 204; The first solenoid valve 2031 and the second solenoid valve 2032 are electrically connected to the control system 300, respectively.

[0025] The acid storage mechanism is subdivided into a three-level structure consisting of a first acid container 206, a second acid container 207, and an acid mixing container 204. A first solenoid valve 2031 and a second solenoid valve 2032 are provided to independently control the first acid container 206 and the second acid container 207, respectively. Each solenoid valve is electrically connected to the control system 300. The control system 300 can automatically adjust the opening and closing duration and frequency of each solenoid valve according to the material characteristics and opening requirements of different molded chips, thereby injecting the first and second acids into the acid mixing container 204 according to a preset ratio. This avoids the safety risks of manual acid preparation and can generate the optimal corrosive agent for specific material types, significantly improving opening accuracy and consistency.

[0026] Specifically, the cleaning fluid storage mechanism includes a cleaning fluid container 209 and a third solenoid valve 2033, and the alkali storage mechanism includes an alkali container 208 and a fourth solenoid valve 2034. The inlet of the third solenoid valve 2033 is connected to the cleaning fluid container 209, and the outlet is connected to the third dropper 107. The inlet of the fourth solenoid valve 2034 is connected to the alkali container 208, and the outlet is connected to the second dropper 106. The third solenoid valve 2033 and the fourth solenoid valve 2034 are electrically connected to the control system 300.

[0027] By configuring separate storage containers for the cleaning solution and the alkali solution, and by setting up a third solenoid valve 2033 and a fourth solenoid valve 2034 to independently control the cleaning solution container 209 and the alkali solution container 208, physical isolation and automated opening and closing control of the pipelines of reagents with different properties are achieved. This not only completely eliminates the risk of cross-contamination between the cleaning solution and the alkali solution, as well as between them and the acid system, but also ensures the purity and treatment effect of each reagent.

[0028] Specifically, the third solenoid valve 2033 is also equipped with a water injection pipe 210. One end of the water injection pipe 210 is connected to the water supply system, and the other end is connected to the inlet end of the third solenoid valve 2033. Additional water can be added through the water injection pipe 210.

[0029] Specifically, the guide frame 102 is a lead screw, and a slider 103 is provided on the lead screw. The slider 103 is threadedly engaged with the lead screw; the clamping member 104 is connected to the upper side of the slider 103. The driving component 101 is a motor, and the output shaft of the motor is connected to one end of the lead screw for transmission.

[0030] Specifically, the liquid supply system 200 also includes a reagent storage cabinet 205, in which the first acid container 206, the second acid container 207, the cleaning solution container 209, and the alkali container 208 are all located.

[0031] Specifically, a supply pipe 201 is provided between the first acid container 206 and the acid mixing container 204, between the second acid container 207 and the acid mixing container 204, between the acid mixing container 204 and the first dropper 105, between the cleaning solution container 209 and the third dropper 107, and between the alkali container 208 and the second dropper 106. The two ends of the supply pipe 201 are respectively connected to the corresponding container.

[0032] Specifically, the first solenoid valve 2031 is installed on the supply pipe 201 between the first acid container 206 and the acid mixing container 204, the second solenoid valve 2032 is installed on the supply pipe 201 between the second acid container 207 and the acid mixing container 204, the third solenoid valve 2033 is installed on the supply pipe 201 between the cleaning liquid container 209 and the third dropper 107, and the fourth solenoid valve 2034 is installed on the supply pipe 201 between the alkali container 208 and the second dropper 106.

[0033] Specifically, the slider 103 includes a base 1031, an inclined portion 1032, and an elastic reset mechanism; The lead screw passes horizontally through the lower side of the base 1031, and the clamping member 104 is connected to the upper side of the inclined part 1032; One end of the inclined part 1032 is rotatably connected to one end of the base 1031, one end of the elastic reset mechanism is connected to the base 1031, and the other end of the elastic reset mechanism is connected to the inclined part 1032. An electromagnet 1035 is provided on the base 1031, and a magnetic component 1036 is provided on the inclined part 1032; The control system 300 is electrically connected to the electromagnet 1035 and is used to control the electromagnet 1035 to be energized so that it is magnetically attracted to the magnetic component 1036, or to control the electromagnet 1035 to be de-energized.

[0034] When the electromagnet 1035 is energized, the tilting part 1032 is firmly attracted and kept horizontal, allowing the plastic-encapsulated chip to be stably transferred horizontally between multiple workstations; the elastic reset mechanism immediately releases the stored energy, driving the tilting part 1032 to rotate and automatically switch to the preset tilt angle, so that the waste liquid on the surface of the plastic-encapsulated chip flows down under the action of gravity. The attitude switching of the plastic-encapsulated chip can be completed in the sealed cavity inside the box without manual intervention, eliminating the safety risks of manual intervention and improving cleaning efficiency.

[0035] Specifically, the base 1031 is provided with two opposing bearing seats, and the corresponding position of the inclined part 1032 is provided with a shaft hole. The rotating shaft passes through one side bearing seat, the shaft hole of the inclined part 1032 and the other side bearing seat in sequence, so that the inclined part 1032 can rotate relative to the base 1031 around the axis of the rotating shaft.

[0036] Specifically, the top of the inclined part 1032 is provided with at least one upwardly protruding positioning post 1041. Correspondingly, the bottom of the clamping member 104 is provided with positioning holes 1042 that correspond one-to-one with the positioning post 1041. During installation, the positioning holes 1042 at the bottom of the clamping member 104 are aligned and fitted onto the positioning post 1041 to achieve quick alignment and connection between the two.

[0037] Specifically, it also includes rubber hose 1021, Figure 2 To demonstrate that the rubber hose 1021 is fitted over the lead screw, the middle of the rubber hose 1021 is cut off. In reality, one end of the rubber hose 1021 is connected to the housing of the drive component 101, and the other end is connected to the base 1031 of the slider 103. The rubber hose 1021 is fitted over the lead screw with an inner diameter larger than the outer diameter of the lead screw, allowing the lead screw to rotate inside the rubber hose 1021. The insulated wire 1022 of the electromagnet 1035 is threaded through the rubber hose 1021, and the insulated wire 1022 is connected to the external power supply and control system 300.

[0038] When the drive unit 101 drives the lead screw to rotate and causes the slider 103 to move along the lead screw axis, the rubber hose 1021 can expand and contract accordingly to adapt to the position change of the slider 103. The rubber hose 1021 physically isolates the insulated wire 1022 from the external corrosive environment, providing reliable dynamic sealing protection, effectively preventing chemical gases and liquids from corroding the insulated wire 1022, and greatly improving the long-term reliability of the electrical connection. At the same time, the flexible expansion and contraction characteristics of the rubber hose 1021 prevent it from interfering with the movement of the slider 103.

[0039] Specifically, the elastic reset mechanism includes a spring 1034 and an arc-shaped limiting support rod 1033. An arc-shaped mounting blind hole matching the shape of the limiting support rod 1033 is provided on the base 1031. The limiting support rod 1033 is slidably disposed in the mounting blind hole. One end of the spring 1034 is fixedly connected to the bottom wall of the mounting blind hole, and the other end of the spring 1034 is fixedly connected to one end of the limiting support rod 1033. The other end of the limiting support rod 1033 is fixedly connected to the bottom wall of the inclined part 1032.

[0040] When the electromagnet 1035 is energized and attracts the magnetic component 1036, the inclined part 1032 is pulled to a horizontal position. At this time, the limiting support rod 1033 overcomes the elastic force of the spring 1034 and slides into the arc-shaped mounting blind hole. The spring 1034 is in a compressed energy storage state. When the electromagnet 1035 is de-energized and the magnetic force disappears, the spring 1034 releases its elastic force and pushes the limiting support rod 1033 to slide outward along the arc-shaped mounting blind hole, thereby driving the inclined part 1032 to rotate around the rotation axis to the inclined position.

[0041] Specifically, a heating module is provided on the base 1031 of the slider 103 for heating the plastic-encapsulated chip on the slider 103.

[0042] Specifically, the heating module is a heating element, and a sealed chamber is provided in the base 1031. The heating element is fixed in the sealed chamber, and the insulated wire 1022 of the heating element is also passed through the rubber hose 1021. The insulated wire 1022 is connected to the external power supply and control system 300.

[0043] The heating element is placed in a sealed chamber inside the base 1031 of the slider 103, which physically isolates it from corrosive reagents, gases and possible liquid splashes inside the housing 100. This fundamentally solves the safety and reliability problems of heating elements being easily corroded and short-circuited. The insulated wire 1022 of the heating element is also protected by a rubber hose 1021, which ensures the reliability of the electrical connection and realizes efficient and uniform indirect heating of the plastic-encapsulated chip.

[0044] Specifically, the plastic-encapsulated chip unpacking device also includes a gas spray gun 108, the outlet end of which is located inside the housing 100 and above the guide frame 102, for spraying dry gas onto the plastic-encapsulated chip on the clamping member 104.

[0045] When the slider 103 carries the molded chip to the gas spray gun 108 station, the gas spray gun 108 sprays dry gas onto the molded chip on the clamping member 104 to remove residual waste liquid on the chip surface.

[0046] Specifically, the gas spray gun 108 is tilted, and the nozzle of the gas spray gun 108 faces the plastic-encapsulated chip at the cleaning station. After the cleaning process is completed, the control system 300 de-energizes the electromagnet 1035, and the tilting part 1032 switches to the tilted state under the action of the elastic reset mechanism. The gas spray gun 108 then blows directionally onto the chip surface in the tilted state. By utilizing the combined effect of gravity and airflow, the residual cleaning liquid on the chip surface and in the gaps of the microstructure quickly flows to the waste liquid collection area. At the same time, the directional spray of the drying gas can effectively penetrate the gaps in the deep grooves and bonding wires on the chip surface to dry the residual waste liquid, thus improving the rapid cleaning of the waste liquid.

[0047] Specifically, the top of the box 100 is provided with a glass protective cover 110. The glass protective cover has multiple perforations. One end of the first dropper 105, the third dropper 107, and the second dropper 106 passes through the perforations and extends into the top of the protective frame. Each perforation is provided with a sealing ring 109.

[0048] Operators can observe the opening progress and surface morphology changes of the plastic-encapsulated chip at each station in real time and clearly through the high-transmittance glass protective cover 110. At the same time, the first dropper 105, the third dropper 107, and the second dropper 106 extend from the outside of the box 100 into the internal working area through preset perforations, so that the large liquid supply system 200 can be arranged as a whole outside the box 100. The corrosion-resistant sealing rings 109 configured at each perforation form an airtight seal after the pipeline is inserted, ensuring that the toxic gas generated by the volatilization of highly corrosive reagents is effectively confined in the sealed cavity inside the box 100.

[0049] Specifically, the glass protective cover 110 is also equipped with an exhaust pipe 114, which is connected to the inside of the box 100; the exhaust pipe 114 is used to directionally discharge toxic gases during the opening process.

[0050] Specifically, exhaust pipe 114 is connected to an exhaust fan or fume hood.

[0051] Specifically, the clamping member 104 is provided with two horizontally spaced retainers 1043, each retainer 1043 is rotatably provided with a drive gear 1044, and each retainer 1043 is horizontally provided with a rack 1045, each rack 1045 meshing with each drive gear 1044 respectively. Each rack bar 1045 has a clamping plate 1046 at its close end, and the gap between the two clamping plates 1046 forms a clamping space for clamping the plastic-encapsulated chip.

[0052] In use, the operator places the plastic-encapsulated chip to be opened between the rack bars 1045 of the two retainers 1043. Then, by manually turning the knobs or using tools, the two drive gears 1044 are turned. The rotation of each drive gear 1044 is converted into horizontal linear motion of each rack bar 1045, thereby driving the two rack bars 1045 to move synchronously towards each other. This allows the two clamping plates 1046 to smoothly clamp and fix the plastic-encapsulated chip from both sides. Turning the two drive gears 1044 in the opposite direction causes the rack bars 1045 to move away from each other, allowing the two clamping plates 1046 to release the chip. This achieves a stable and centered clamping of the plastic-encapsulated chip.

[0053] Specifically, each drive gear 1044 has a fixed manual knob at its shaft end, which allows operators to directly and effortlessly rotate each drive gear 1044 by manually turning the knob, thereby achieving convenient and precise adjustment of the clamping force of the plastic-encapsulated chip.

[0054] Specifically, the first acid solution is fuming nitric acid, and the second acid solution is concentrated sulfuric acid. The type of acid solution required is determined according to the type of plastic-encapsulated chip, and the first or second acid solution is added accordingly. For example, if the plastic-encapsulated chip to be opened is a copper wire product, a mixture of the first and second acid solutions can be added.

[0055] Specifically, the alkaline solution can be EDA, ethanolamine, or other alkaline reagents, which can clean the red glue product on the surface of the molded chip or the PI film present on the chip surface.

[0056] Specifically, the cleaning solution can be deionized water, anhydrous ethanol, acetone, or other reagents that can dissolve organic residues.

[0057] Specifically, the compressed gas gun blows out dry nitrogen or other dry inert gas.

[0058] Specifically, the bottom of the tank 100 is shaped like an inclined funnel that gradually slopes down from the periphery to the center, with the lowest point in the middle. A drain outlet is located at the lowest point, and a waste liquid pipe 112 is connected to the drain outlet. The other end of the waste liquid pipe 112 is connected to a waste liquid collection container 113 located outside the tank 100. This ensures that all waste liquid generated by dripping or rinsing can automatically and quickly collect by gravity and be discharged from the center of the tank 100. This effectively avoids waste liquid remaining, accumulating, or corroding the cavity at the bottom of the tank, while achieving centralized, sealed, and safe disposal of waste liquid.

[0059] Specifically, the power and communication cables 111 of the control system 300 pass through the housing 100 and are electrically connected to the corresponding actuators such as the drive unit 101, the solenoid valves 203 of the liquid supply system 200, the heating module, and the electromagnet 1035 in the slider 103, thereby realizing centralized power supply and coordinated control of the various functional units of the device.

[0060] Specifically, the control system 300 includes a communication interface 301, a communication bus 302, a processor 303, a memory 304, and a computer program 305. The communication interface 301 is used for communication between the electronic device and the plastic-encapsulated chip unpacking device. The processor 303 can read and execute instructions and data in the memory 304. The two communicate through the communication bus 302, and the results are ultimately presented in the computer program 305.

[0061] For computer program 305, upon startup, a system self-test is performed, including checking whether the waste liquid collection container 113 is properly connected and not full. If the check fails, an alarm is triggered and startup is paused. After the test, the program can prompt the operator to perform a cleaning and maintenance procedure, rinsing all pipes and droppers with deionized water to prevent residual chemicals from crystallizing and clogging or corroding the pipes. Adjustable parameters in computer program 305 include, but are not limited to, reagents, reagent ratios, reaction time, reaction temperature, number of reactions, and type of cleaning solution.

[0062] Specifically, in computer program 305, based on the molding characteristics of the molded device to be opened, appropriate reagents, reagent ratios, reaction times, reaction temperatures, reaction times, and cleaning solution types are selected, and the molded chip opening device automatically executes the opening program.

[0063] Specifically, the reaction time and number of reactions do not need to be adjusted. During the opening process, the operator can manually adjust the reaction time and number of reactions based on visual observation of the chemical reaction progress. At the same time, the computer program 305 records the actual parameters and generates a parameter file.

[0064] Specifically, after the computer program 305 saves the parameter file recording the successful opening, it can be directly called in the computer program 305 when encountering the same type or model of device in the future.

[0065] In other embodiments, the first acid solution is phosphoric acid and the second acid solution is concentrated sulfuric acid, in which case crater testing can be performed.

[0066] In other embodiments, the first acid solution is ammonia water and the second acid solution is hydrogen peroxide solution, in which case a wet delamination test can be performed.

[0067] In other embodiments, when the cleaning solution is anhydrous ethanol or acetone, or when the size of the plastic-encapsulated chip to be opened is small, drying can be completed by relying on the heating effect of the slider 103 without the need for a compressed gas gun.

[0068] like Figure 1 As shown, this application also provides a method for opening the above-mentioned plastic-encapsulated chip opening device, including the following steps: S1. Fix the plastic-encapsulated chip onto the clamping member 104; S2. The control system 300 controls the drive unit 101 to drive the clamping unit 104 to move along the guide frame 102, so that the plastic-encapsulated chip moves to below the first dropper 105. The control system 300 controls the acid storage mechanism to deliver acid to the first dropper 105. S3, the driving component 101 drives the clamping component 104 to move along the guide frame 102, so that the plastic-encapsulated chip moves to the bottom of the third dropper 107, and the control system 300 controls the cleaning fluid storage mechanism to deliver cleaning fluid to the third dropper 107. S4. The driving component 101 drives the clamping component 104 to move along the guide frame 102, so that the plastic-encapsulated chip moves to below the second dropper 106, and the control system 300 controls the alkali storage mechanism to deliver alkali to the second dropper 106.

[0069] Specifically, step S1 includes: The plastic-encapsulated chip to be opened is subjected to non-destructive inspections such as appearance, X-ray, and SAT to clarify its internal structure, chip location, and bonding wire material. A laser is used to make a precision groove on the area to be opened on the device surface. The groove depth should be as close as possible to the thickness from the surface of the plastic package to the chip surface, while strictly avoiding damage to the chip body. The plastic-encapsulated chip is fixed on the clamping member 104, and the clamping member 104 is fixedly connected to the inclined part 1032 of the slider 103. The glass protective cover is then closed.

[0070] Specifically, step S1 also includes: The plastic-encapsulated chip is heated by the heating element on the base 1031 of the slider 103 at a preset temperature, which is 40°C to 200°C, and negative pressure is applied by the exhaust pipe 114.

[0071] Specifically, in step S2, the control system 300 controls the acid storage mechanism to deliver acid to the first dropper 105, which includes: Determine the required type of acid solution based on the type of molded chip; If only the first acid solution needs to be added, the control system 300 controls the first solenoid valve 2031 to open and the second solenoid valve 2032 to close, injecting the corresponding amount of the first acid solution from the first acid solution container 206 into the acid solution mixing container 204 and delivering it to the first dropper 105, with a reaction time of T1 seconds; If only the second acid solution needs to be added, the control system 300 controls the first solenoid valve 2031 to close and the second solenoid valve 2032 to open, injecting the corresponding amount of the second acid solution from the second acid solution container 207 into the acid solution mixing container 204 and delivering it to the first dropper 105, with a reaction time of T1 seconds; If only the mixed acid solution needs to be added, select the acid solution mixing ratio parameter, and the control system 300 controls the first solenoid valve 2031 and the second solenoid valve 2032 to open simultaneously. According to the acid solution mixing ratio parameter, the corresponding amount of acid solution is injected from the first acid solution container 206 and the second acid solution container 207 into the acid solution mixing container 204 for mixing, and the mixed acid solution is delivered to the first dropper 105. The reaction time is T1 seconds.

[0072] Specifically, step S3 also includes: After the third dropper 107 supplies cleaning fluid to clean the encapsulated chip, the control system 300 de-energizes the electromagnet 1035 on the base 1031. The elastic reset mechanism drives the tilting part 1032 to rotate around the base 1031, causing the tilting part 1032 to switch from a horizontal state to an inclined state. This causes the clamping part 104 on the tilting part 1032 to tilt synchronously, allowing the cleaning waste fluid to flow down the inclined surface. After the cleaning waste fluid flows down, the control system 300 energizes the electromagnet 1035. The electromagnet 1035 on the base 1031 and the magnetic part 1036 on the tilting part 1032 are magnetically attracted, overcoming the elastic force of the elastic reset mechanism and restoring the tilting part 1032 from the inclined state to a horizontal state.

[0073] Specifically, step S4 also includes: S4, the second dropper 106 delivers the alkaline solution, and the reaction time is T2 seconds.

[0074] Specifically, it also includes: S5. Repeat steps S2 to S4 until the plastic encapsulation material on the surface of the plastic-encapsulated chip to be opened is completely removed. S6. Use a microscope to inspect the unpacking effect, fully exposing the chip morphology, and the unpacking is complete; S7. Clean the plastic-encapsulated chip opening device. After cleaning, ensure that there are no reagent residues in the first dropper 105, the second dropper 106, the third dropper 107, and the box 100, and that the device is dry. The transparent glass protective cover 110 should be dry enough to allow clear observation of the inside of the box 100.

[0075] In summary, this application provides a device and method for opening molded chips. The device, through a specific layout of a first dropper, a third dropper, and a second dropper arranged sequentially along the axial direction of a guide frame within the housing, with the first dropper connected to acid, the third dropper to cleaning solution, and the second dropper to alkali solution, combined with a sliding clamping component and a control system, achieves fully automated opening of the molded chip and collaborative operation with multiple reagents without cross-contamination. The third dropper, acting as a cleaning component, is positioned between the first and second droppers. Regardless of whether the process involves acid etching followed by alkali etching or alkali etching followed by acid etching, the cleaning station is always located between the two active reagent stations, ensuring that the sample undergoes a cleaning step before contacting another type of reagent, thus isolating the acidic and alkaline reagent lines and residues from direct contact. Simultaneously, the control system precisely coordinates the drive component and the liquid supply system, enabling the clamped molded chip to automatically transfer between different dropper stations. This avoids safety risks and operational errors caused by manual intervention, ensures the consistency and repeatability of opening parameters, and improves opening accuracy, device safety, and analytical reliability.

[0076] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of this application, and these improvements and substitutions should also be considered within the scope of protection of this application.

Claims

1. A device for opening a plastic-encapsulated chip, characterized in that, The device comprises a box (100), a guide frame (102) horizontally arranged in the box (100), a clamping piece (104) movably arranged on the guide frame (102), the clamping piece (104) being used for fixing a plastic package chip, a driving piece (101) in transmission connection with the clamping piece (104), a liquid supply system (200) comprising an acid liquid storage mechanism, a cleaning liquid storage mechanism and an alkali liquid storage mechanism, a first dropper (105), a third dropper (107) and a second dropper (106), the liquid outlet of the first dropper (105), the liquid outlet of the third dropper (107) and the liquid outlet of the second dropper (106) being sequentially and spacedly arranged above the plastic package chip along the axial direction of the guide frame (102), the first dropper (105) being in communication with the acid liquid storage mechanism, the third dropper (107) being in communication with the cleaning liquid storage mechanism, and the second dropper (106) being in communication with the alkali liquid storage mechanism, a control system (300) in electric connection with the acid liquid storage mechanism, the cleaning liquid storage mechanism, the alkali liquid storage mechanism and the driving piece (101) respectively, the control system (300) being used for controlling the driving piece (101) to start, so as to drive the clamping piece (104) to move horizontally along the guide frame (102), controlling the acid liquid storage mechanism to deliver acid liquid to the first dropper (105), controlling the cleaning liquid storage mechanism to deliver cleaning liquid to the third dropper (107), and controlling the alkali liquid storage mechanism to deliver alkali liquid to the second dropper (106). The acid liquid storage mechanism comprises a first acid liquid container (206), a second acid liquid container (207), an acid liquid mixing container (204), a first electromagnetic valve (2031) and a second electromagnetic valve (2032), the inlet end of the first electromagnetic valve (2031) is in communication with the first acid liquid container (206), and the outlet end is in communication with the acid liquid mixing container (204), the inlet end of the second electromagnetic valve (2032) is in communication with the second acid liquid container (207), and the outlet end is in communication with the acid liquid mixing container (204), the first dropper (105) is in communication with the acid liquid mixing container (204), and the first electromagnetic valve (2031) and the second electromagnetic valve (2032) are in electric connection with the control system (300) respectively. The cleaning liquid storage mechanism comprises a cleaning liquid container (209) and a third electromagnetic valve (2033), and the alkali liquid storage mechanism comprises an alkali liquid container (208) and a fourth electromagnetic valve (2034), the inlet end of the third electromagnetic valve (2033) is in communication with the cleaning liquid container (209), and the outlet end is in communication with the third dropper (107), the inlet end of the fourth electromagnetic valve (2034) is in communication with the alkali liquid container (208), and the outlet end is in communication with the second dropper (106), and the third electromagnetic valve (2033) and the fourth electromagnetic valve (2034) are in electric connection with the control system (300) respectively. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 2. The apparatus of claim 1, wherein ​ ​ ​ ​ ​ 3. The apparatus of claim 1, wherein the apparatus further comprises a laser. ​ ​ ​ ​ 4. The apparatus of claim 1, wherein the apparatus further comprises a laser. The guide frame (102) is a lead screw, and a slider (103) is provided on the lead screw. The slider (103) is threadedly engaged with the lead screw. The clamping member (104) is connected to the upper side of the slider (103). The driving component (101) is a motor, and the output shaft of the motor is connected to one end of the lead screw.

5. The apparatus of claim 4, wherein the apparatus further comprises a laser. The slider (103) includes a base (1031), an inclined portion (1032), and an elastic reset mechanism; The lead screw passes horizontally through the lower side of the base (1031), and the clamp (104) is connected to the upper side of the inclined part (1032); One end of the inclined part (1032) is rotatably connected to one end of the base (1031), one end of the elastic reset mechanism is connected to the base (1031), and the other end of the elastic reset mechanism is connected to the inclined part (1032). An electromagnet (1035) is provided on the base (1031), and a magnetic component (1036) is provided on the inclined part (1032). The control system (300) is electrically connected to the electromagnet (1035) and is used to control the electromagnet (1035) to be energized so that it is magnetically attracted to the magnetic component (1036), or to control the electromagnet (1035) to be de-energized.

6. The apparatus of claim 1, wherein the apparatus is configured to: The encapsulated chip unpacking device also includes a gas spray gun (108), the outlet end of which is located inside the housing (100) and above the guide frame (102), for spraying dry gas onto the encapsulated chip on the clamping member (104).

7. The apparatus of claim 1, wherein the apparatus is configured to: The clamping member (104) is provided with two horizontally spaced retainers (1043), each retainer (1043) is rotatably provided with a drive gear (1044), and each retainer (1043) is horizontally provided with a rack (1045), each rack (1045) meshing with each drive gear (1044); Each of the rack bars (1045) has a clamping plate (1046) at its close end, and the gap between the two clamping plates (1046) forms a clamping space for clamping the plastic-encapsulated chip.

8. A method of opening a plastic-sealed chip using the opening device according to any one of claims 1 to 7, characterized by, Includes the following steps: S1. Fix the plastic-encapsulated chip onto the clamp (104); S2. The control system (300) controls the drive unit (101) to drive the clamping unit (104) to move along the guide frame (102), so that the plastic-encapsulated chip moves to below the first dropper (105). The control system (300) controls the acid storage mechanism to deliver acid to the first dropper (105). S3, the driving component (101) drives the clamping component (104) to move along the guide frame (102), so that the plastic-encapsulated chip moves to below the third dropper (107), and the control system (300) controls the cleaning fluid storage mechanism to deliver cleaning fluid to the third dropper (107); S4. The driving component (101) drives the clamping component (104) to move along the guide frame (102), so that the plastic-encapsulated chip moves to the bottom of the second dropper (106), and the control system (300) controls the alkali storage mechanism to deliver alkali to the second dropper (106).

9. The unpackaging method of the unpackaging apparatus for a plastic packaged chip as claimed in claim 8, wherein In step S2, the control system (300) controls the acid storage mechanism to deliver acid to the first dropper (105), specifically including: Determine the required type of acid solution based on the type of molded chip; The control system (300) controls the first solenoid valve (2031) to open and the second solenoid valve (2032) to close, injecting a corresponding amount of first acid from the first acid container (206) into the acid mixing container (204) and delivering it to the first dropper (105); Alternatively, the control system (300) controls the first solenoid valve (2031) to close and simultaneously controls the second solenoid valve (2032) to open, injecting a corresponding amount of second acid from the second acid container (207) into the acid mixing container (204) and delivering it to the first dropper (105); Alternatively, the control system (300) controls the first solenoid valve (2031) and the second solenoid valve (2032) to open simultaneously, injecting a corresponding amount of acid from the first acid container (206) and the second acid container (207) into the acid mixing container (204) for mixing, and delivering the mixed acid to the first dropper (105).

10. The method of claim 8, wherein the method further comprises: Step S3 also includes: After the third dropper (107) supplies cleaning fluid to clean the encapsulated chip, the control system (300) controls the electromagnet (1035) on the base (1031) to be de-energized. The elastic reset mechanism drives the tilting part (1032) to rotate around the base (1031), so that the tilting part (1032) switches from a horizontal state to a tilted state, and drives the clamping part (104) on the tilting part (1032) to tilt synchronously, so that the cleaning waste fluid flows down with the tilted surface. After the cleaning waste fluid flows down, the control system (300) controls the electromagnet (1035) to be energized. The electromagnet (1035) on the base (1031) and the magnetic part (1036) on the tilting part (1032) are attracted by magnetism, which overcomes the elastic force of the elastic reset mechanism and makes the tilting part (1032) return from the tilted state to the horizontal state.

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