Bonding equipment and bonding methods

Abstract

This application provides a bonding apparatus and a bonding method. The bonding apparatus includes: a base with a bearing surface for supporting a first workpiece; a first driving mechanism with its fixed end fixed to the base; and a bonding head including multiple second driving mechanisms and multiple bonding blocks. The fixed ends of the multiple second driving mechanisms are all fixed to the driving ends of the first driving mechanisms, and the multiple bonding blocks are respectively fixed to the driving ends of the multiple second driving mechanisms. Each bonding block has a fixed surface facing the bearing surface for fixing the second workpiece. This application can improve bonding efficiency while meeting bonding accuracy requirements.

Description

Technical Field

[0001] This application relates to the field of chip fabrication technology, and in particular to a bonding apparatus and bonding method. Background Technology

[0002] Chip-to-wafer (C2W) bonding is an advanced semiconductor packaging technology. The process involves moving the chip over the wafer, placing it on the wafer, and then bonding the chip to the wafer. As C2W bonding becomes more widespread, the requirements for bonding precision are increasing, leading to slower bonding speeds and consequently lower bonding efficiency. Summary of the Invention

[0003] To address the aforementioned technical problems, this application provides a bonding apparatus and a bonding method that can improve bonding efficiency while meeting bonding accuracy requirements.

[0004] A first aspect of this application provides a bonding apparatus, including a base, a first driving mechanism, and a bonding head. The base has a bearing surface for supporting a first workpiece. The first workpiece may be a wafer or a substrate, etc. A fixed end of the first driving mechanism is fixed to the base, and the bonding head is fixed to a driving end of the first driving mechanism; therefore, the first driving mechanism can drive the bonding head to move relative to the base. The bonding head includes multiple second driving mechanisms and multiple bonding blocks, with each bonding block correspondingly fixed to the driving end of one of the multiple second driving mechanisms. Thus, each second driving mechanism can drive the movement of each bonding block. Each bonding block has a fixed surface facing the bearing surface, used to fix a second workpiece. Multiple fixed surfaces can be formed on the multiple bonding blocks, thereby allowing multiple second workpieces to be fixed on the bonding head. The second workpiece may be a chip or a wafer, etc.

[0005] During the bonding process of the first and second workpieces using the bonding apparatus of this application, the first driving mechanism drives the bonding head to move above the tray where the second workpieces are placed. Each fixed surface of the bonding head adsorbs one second workpiece, thus multiple second workpieces can be adsorbed on the bonding head. Next, the first driving mechanism drives the bonding head to move above the first workpiece. Then, each second driving mechanism drives each bonding block to move, thereby moving the corresponding second workpiece to calibrate its position. Finally, the first driving mechanism drives the bonding head towards the first workpiece and places the calibrated second workpieces onto the first workpiece, completing the bonding between the multiple second workpieces and the first workpiece.

[0006] In this application, the position of each second workpiece can be individually calibrated via each second driving mechanism, thereby improving the calibration accuracy of each second workpiece and consequently improving the bonding accuracy of bonding the calibrated second workpiece to the first workpiece. Furthermore, since multiple second workpieces can be adsorbed on the bonding head, and multiple second workpieces can be bonded to the first workpiece in the same process, bonding efficiency can be improved. In other words, this application can improve bonding efficiency while meeting bonding accuracy requirements.

[0007] In some embodiments of this application, the first workpiece has multiple bonding regions arranged in a rectangular array, each bonding region being used for bonding with a second workpiece. The bonding device also includes a controller, which is electrically connected to each second drive mechanism. The controller is configured to: acquire first coordinate difference information between M second workpieces and their corresponding bonding regions, and control the M second drive mechanisms to drive the bonding blocks to move based on the first coordinate difference information, so as to calibrate the positions of the M second workpieces; and control the N second drive mechanisms corresponding to N second workpieces to drive the bonding blocks to move based on the first coordinate difference information of the M second workpieces, so as to calibrate the positions of the N second workpieces. The N second workpieces are the other second workpieces besides the M second workpieces among the multiple second workpieces. The first coordinate difference information can usually be obtained by detection, but the detection method requires a certain amount of time. However, in this application, after obtaining the first coordinate difference information, in addition to calibrating the M second workpieces based on the first coordinate difference information, it also calibrates the N second workpieces based on the first coordinate difference information. Compared to the method of obtaining the coordinate difference information of N second workpieces through detection, this application can save the time of obtaining the coordinate difference information of N second workpieces, thereby improving bonding efficiency.

[0008] In some embodiments of this application, M ≥ 2. That is, at least two second workpieces are calibrated first, followed by the remaining second workpieces. The controller is specifically configured to: determine the second coordinate difference information between N second workpieces and their corresponding bonding regions based on the first coordinate difference information of the M second workpieces. In one possible embodiment, the second coordinate difference information is the same as the first coordinate difference information of any one of the M second workpieces. That is, after obtaining the first coordinate difference information of the M second workpieces, the first coordinate difference information of any one second workpiece can be determined as the second coordinate difference information corresponding to the remaining N second workpieces. The method for determining this second coordinate difference information is relatively simple.

[0009] In another possible implementation, the second coordinate difference information is the average of the first coordinate difference information of the M second workpieces. That is, after obtaining the first coordinate difference information of the M second workpieces, the average of the first coordinate difference information of the M second workpieces can be calculated, and this average value can be determined as the second coordinate difference information corresponding to the N second workpieces. This method combines the first coordinate difference information of each of the M second workpieces, therefore, the calculation accuracy of the second coordinate difference information is higher, thereby improving the position calibration accuracy of the N second workpieces.

[0010] After obtaining the second coordinate information of N second workpieces, the controller can be specifically used to: control the N second drive mechanisms to drive the bonding block to move according to the second coordinate difference information of the N second workpieces, so as to calibrate the position of the N second workpieces.

[0011] Multiple bonding blocks can be arranged in a rectangular array; therefore, multiple second workpieces fixed on the bonding blocks are also arranged in a rectangular array. When M is 2, the two second workpieces can be the two second workpieces that are furthest apart along the diagonal of the rectangle among the multiple second workpieces arranged in a rectangular array.

[0012] It is understood that in other possible implementations, M = 1. That is, one of the second workpieces is calibrated first, followed by the remaining second workpieces. In this case, the first coordinate difference information of the first calibrated second workpiece can be used as the second coordinate difference information of the other second workpieces.

[0013] Furthermore, the controller is specifically configured to: acquire the measured coordinate difference information of the M calibrated second workpieces, and correct the second coordinate difference information using the measured coordinate difference information. After acquiring the second coordinate difference information, the controller can continue to detect the measured coordinate difference information of the M calibrated second workpieces, and correct the second coordinate difference information using the measured coordinate difference information. Then, the corrected second coordinate difference information can be used to calibrate the positions of the N second workpieces. In this way, when correcting the second coordinate difference information, the error generated when the second drive mechanism drives the bonding block to move is fully considered, and the corrected second coordinate difference information can eliminate some of the error. Therefore, the accuracy of the second coordinate difference information can be improved, thereby improving the position calibration accuracy of the N second workpieces.

[0014] In one possible embodiment of this application, the bonding device further includes an image acquisition device electrically connected to the controller. In this embodiment, the number of image acquisition devices may be one. The image acquisition device is movably connected to the base, so that the image acquisition device can move relative to the base.

[0015] The image acquisition device is used to sequentially acquire first image signals of M second workpieces and second image signals of corresponding bonding regions, and send the first and second image signals to the controller. For each of the M second workpieces, the first image signal of that second workpiece and the second image signal of the bonding region corresponding to that second workpiece can be acquired. Since there is only one image acquisition device, it can be driven to move and align with one of the M second workpieces, and acquire the first image signal of that second workpiece and the second image signal of the corresponding bonding region. Then, the image acquisition device is driven to move and acquire the first image signal of the second second workpiece and the second image signal of the corresponding bonding region. This process is repeated until the first image signals of all the M second workpieces and the second image signals of the corresponding bonding regions are acquired. Because the number of image acquisition devices is small in this embodiment, the cost is low.

[0016] The controller is specifically used to: determine the first coordinate difference information of M second workpieces based on a first image signal and a second image signal. The first coordinate difference information of a second workpiece can be determined based on the first image signal and the second image signal corresponding to each of the M second workpieces. A first mark is provided on the surface of the second workpiece facing the first workpiece, and a second mark is provided on each bonding area of ​​the first workpiece. Therefore, the first image signal contains the first mark, and the second image signal contains the second mark. After obtaining the first image signal and the second image signal corresponding to a certain second workpiece, the controller can compare the position of the first mark in the first image signal and the position of the second mark in the second image signal, and calculate the coordinate difference between the two in two dimensions as the first coordinate difference information of the second workpiece.

[0017] In another possible embodiment of this application, M ≥ 2. The bonding apparatus further includes M image acquisition devices, the number of which may be the same as the number of M second workpieces. Each image acquisition device is movably connected to the base, so that each image acquisition device can move relative to the base.

[0018] M image acquisition devices are used to acquire first image signals of M second workpieces and second image signals of corresponding bonding areas, respectively, and send the first and second image signals to the controller. Each image acquisition device can be driven to move relative to the base to acquire the first image signals of the M second workpieces and the second image signals of the corresponding bonding areas, respectively.

[0019] The controller is specifically configured to determine the first coordinate difference information of M second workpieces based on the first image signal and the second image signal. The first coordinate difference information of each of the M second workpieces can be determined based on the first image signal and the second image signal corresponding to each of the M second workpieces. Since in this embodiment, the first image signals of the M second workpieces and the second image signals of the corresponding bonding areas can be acquired simultaneously, time can be further saved, thereby improving bonding efficiency.

[0020] In other embodiments, the number of image acquisition devices is at least two and less than M. For example, the number of image acquisition devices is half of all M. In this way, the first image signal and the second image signal corresponding to M second workpieces can be acquired through two detections.

[0021] In some embodiments of this application, the bonding device further includes a controller electrically connected to the second drive mechanism and an image acquisition device electrically connected to the controller, the image acquisition device being movably connected to the base.

[0022] An image acquisition device is used to acquire a first image signal of each second workpiece and a second image signal of the corresponding bonding area, and send the first and second image signals to a controller. In one example, the number of image acquisition devices can be one. Therefore, by driving the image acquisition device to move relative to the base, the first image signals of M second workpieces and the second image signals of the corresponding bonding areas can be acquired sequentially. Since the number of image acquisition devices is small in this embodiment, the cost is low.

[0023] In another example, the number of image acquisition devices can be the same as the number of all second workpieces. This allows for the acquisition of first image signals for all second workpieces and second image signals for the corresponding bonding regions at once, thereby further saving time and improving bonding efficiency.

[0024] In another example, the number of image acquisition devices is at least two and less than the number of all second workpieces. For example, the number of image acquisition devices is half the number of all second workpieces. In this way, the first image signal of all second workpieces and the second image signal of the corresponding bonding area can be acquired through two detections.

[0025] The controller is used to determine the coordinate difference information between each second workpiece and the corresponding bonding area based on the first image signal and the second image signal, and to control the second drive mechanism to drive the bonding block to move based on the coordinate difference information, so as to calibrate the position of each second workpiece.

[0026] A second aspect of this application provides a bonding method applied to a bonding apparatus. The bonding apparatus includes a base, a first driving mechanism, and a bonding head. The base has a bearing surface, and the bonding head includes a plurality of second driving mechanisms and a plurality of bonding blocks, each bonding block having a fixed surface facing the bearing surface. The bonding method includes: the first driving mechanism driving a plurality of second workpieces above a first workpiece, the first workpiece being fixed on the bearing surface, and each second workpiece being fixed on a respective fixed surface; calibrating the position of each second workpiece using the plurality of second driving mechanisms and the plurality of bonding blocks; and bonding each second workpiece to the first workpiece.

[0027] In this application, the position of each second workpiece can be individually calibrated via each second driving mechanism, thereby improving the calibration accuracy of each second workpiece and consequently improving the bonding accuracy of bonding the calibrated second workpiece to the first workpiece. Furthermore, since multiple second workpieces can be adsorbed on the bonding head, and multiple second workpieces can be bonded to the first workpiece in the same process during bonding, bonding efficiency can be improved. In other words, this application can improve bonding efficiency while meeting bonding accuracy requirements.

[0028] In some embodiments of this application, the first workpiece has multiple bonding regions; the bonding apparatus also includes a controller. The position of each second workpiece is calibrated using multiple second driving mechanisms and multiple bonding blocks, including: the controller acquiring first coordinate difference information between M second workpieces and their corresponding bonding regions, and controlling the M second driving mechanisms to drive the bonding blocks to move based on the first coordinate difference information, thereby calibrating the position of the M second workpieces; the controller controlling N second driving mechanisms corresponding to N second workpieces to drive the bonding blocks to move based on the first coordinate difference information of the M second workpieces, thereby calibrating the position of the N second workpieces, where the N second workpieces are the other second workpieces besides the M second workpieces. Typically, the first coordinate difference information can be obtained through detection, but this detection method requires a certain amount of time. However, this application, after obtaining the first coordinate difference information, not only calibrates the M second workpieces based on the first coordinate difference information, but also calibrates the N second workpieces based on the first coordinate difference information. Compared to the scheme of obtaining the coordinate difference information of the N second workpieces through detection, this application can save the time required to obtain the coordinate difference information corresponding to the N second workpieces, thereby improving bonding efficiency.

[0029] In some embodiments of this application, M ≥ 2. The controller controls the N second driving mechanisms corresponding to the N second workpieces to drive the bonding block movement based on the first coordinate difference information of the M second workpieces. This includes: the controller determining the second coordinate difference information between the N second workpieces and their corresponding bonding areas based on the first coordinate difference information of the M second workpieces. In one possible embodiment, the second coordinate difference information is the same as the first coordinate difference information of any one of the M second workpieces. That is, after obtaining the first coordinate difference information of the M second workpieces, the first coordinate difference information of any one second workpiece can be determined as the second coordinate difference information corresponding to the remaining N second workpieces. The method for determining this second coordinate difference information is relatively simple.

[0030] In another possible implementation, the second coordinate difference information is the average of the first coordinate difference information of the M second workpieces. That is, after obtaining the first coordinate difference information of the M second workpieces, the average of the first coordinate difference information of the M second workpieces can be calculated, and this average value can be determined as the second coordinate difference information corresponding to the N second workpieces. This method combines the first coordinate difference information of each of the M second workpieces, therefore, the calculation accuracy of the second coordinate difference information is higher, thereby improving the position calibration accuracy of the N second workpieces.

[0031] After obtaining the second coordinate difference information of N second workpieces, the controller controls the N second drive mechanisms corresponding to the N second workpieces to drive the bonding block to move according to the second coordinate difference information of the N second workpieces.

[0032] In some embodiments of this application, the controller controls the N second driving mechanisms corresponding to the N second workpieces to drive the bonding blocks to move based on the first coordinate difference information of the M second workpieces. The method further includes: the controller acquiring the measured coordinate difference information of the calibrated M second workpieces and correcting the second coordinate difference information using the measured coordinate difference information. After obtaining the second coordinate difference information, the controller can continue to detect the measured coordinate difference information of the calibrated M second workpieces and correct the second coordinate difference information using the measured coordinate difference information. Then, the corrected second coordinate difference information can be used to calibrate the positions of the N second workpieces. In this way, when correcting the second coordinate difference information, the error generated when the second driving mechanism drives the bonding blocks to move is fully considered, and the corrected second coordinate difference information can eliminate some of the error. Therefore, the accuracy of the second coordinate difference information can be improved, thereby improving the position calibration accuracy of the N second workpieces.

[0033] In some embodiments of this application, the bonding apparatus further includes an image acquisition device. The number of image acquisition devices can be one. The bonding method further includes: the image acquisition device sequentially acquiring first image signals of M second workpieces and second image signals of corresponding bonding regions, and sending the first and second image signals to a controller; the controller acquiring first coordinate difference information between the M second workpieces and their corresponding bonding regions, including: the controller determining the first coordinate difference information of the M second workpieces based on the first and second image signals. Since the number of image acquisition devices is small in this embodiment, the cost is low.

[0034] In some embodiments of this application, M ≥ 2; the bonding apparatus further includes M image acquisition devices. The bonding method further includes: the M image acquisition devices respectively acquire first image signals of M second workpieces and second image signals of corresponding bonding areas, and send the first image signals and second image signals to a controller; the controller acquires first coordinate difference information between the M second workpieces and the corresponding bonding areas, including: the controller determines the first coordinate difference information of the M second workpieces based on the first image signals and the second image signals. Since in this embodiment, the first image signals of M second workpieces and the second image signals of corresponding bonding areas can be acquired at once, time can be further saved, thereby improving bonding efficiency.

[0035] In some embodiments of this application, the first workpiece has multiple bonding regions; the bonding apparatus further includes a controller and an image acquisition device electrically connected to the controller. The position of each second workpiece is calibrated using a second driving mechanism and a bonding block, including: the image acquisition device acquiring a first image signal of each second workpiece and a second image signal of the corresponding bonding region, and sending the first and second image signals to the controller; the controller determining the coordinate difference information between each second workpiece and its corresponding bonding region based on the first and second image signals, and controlling the second driving mechanism to drive the bonding block to move based on the coordinate difference information, thereby calibrating the position of each second workpiece. In one example, the number of image acquisition devices can be one; therefore, by driving the image acquisition device to move relative to the base, the first image signals of M second workpieces and the second image signals of their corresponding bonding regions can be acquired sequentially. Since the number of image acquisition devices is small in this embodiment, the cost is low. In another example, the number of image acquisition devices can be the same as the number of all second workpieces. This allows the acquisition of the first image signals of all second workpieces and the second image signals of their corresponding bonding regions at once, thereby further saving time and improving bonding efficiency. In another example, the number of image acquisition devices is at least two and less than the number of all second workpieces. For example, the number of image acquisition devices is half the number of all second workpieces. In this way, the first image signal of all second workpieces and the second image signal of the corresponding bonding area can be acquired through two detections. Attached Figure Description

[0036] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the bonding process in related technologies, where bonding equipment bonds chips to wafers.

[0038] Figure 2 This is a schematic diagram of the bonding device in the first embodiment of this application;

[0039] Figure 3 for Figure 2 The diagram shown illustrates the bonding process where a bonding apparatus bonds multiple second workpieces to a portion of a first workpiece.

[0040] Figure 4 for Figure 2 The diagram shows a bonding process in which multiple second workpieces are bonded to another part of a first workpiece using a bonding apparatus.

[0041] Figure 5 This is a schematic diagram showing the arrangement of multiple bonding zones on the first workpiece.

[0042] Figure 6 for Figure 2 The diagram shows the arrangement of multiple second workpieces after the bonding head adsorbs them in the bonding device.

[0043] Figure 7 for Figure 2 A schematic diagram of signal transmission between the image acquisition device, the controller, and multiple second drive mechanisms in the bonding device shown;

[0044] Figure 8 This is a schematic diagram of the bonding device in the second embodiment of this application;

[0045] Figure 9 for Figure 8 A schematic diagram of signal transmission between the image acquisition device, the controller, and multiple second drive mechanisms in the bonding device shown;

[0046] Figure 10 For application Figure 2 or Figure 8 A schematic flowchart of a bonding method using the bonding device shown.

[0047] Figure 11 For application Figure 2 or Figure 8 Another schematic diagram of the bonding method for the bonding device shown.

[0048] Icons: 100-bonding equipment; 10-base; 11-bearing surface; 20-first driving mechanism; 30-bonding head; 31-second driving mechanism; 32-bonding block; 321-fixed surface; 33-chuck; 40-image acquisition device; 200-first workpiece; 201-bonding area; 202-second mark; 203-wafer; 300-second workpiece; 301-first mark; 302-chip; 400-tray. Detailed Implementation

[0049] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0050] In this article, the term "and / or" simply describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item)" refers to one or more, while "more" refers to two or more. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0051] The terms "first" and "second," etc., used in the specification and claims of this application are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.

[0052] Terms such as “connected” and “linked” are used to express the interconnection or interaction between different components, which may include direct connection or indirect connection through other components. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion, such as including a series of steps or units. A method, system, product, or apparatus is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or apparatuses. Terms such as “upper,” “lower,” “left,” and “right” are used only relative to the orientation of components in the accompanying drawings. These directional terms are relative concepts used for relative description and clarification, and may vary accordingly depending on the orientation of the components in the drawings.

[0053] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0054] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.

[0055] As chips continue to miniaturize and process technology advances to smaller sizes, such as 5nm, 3nm, and even 1nm, it is getting closer and closer to the physical limits. Therefore, advanced packaging technology is needed to meet the requirements of system miniaturization and multifunctionality.

[0056] Advanced packaging technologies, including 3D stacked packaging using solder balls as interconnect media, suffer from limitations. The relatively large size and spherical shape of solder balls affect the vias used for chip interconnection, hindering miniaturization. To address these issues, C2W bonding has emerged as a new advanced packaging method. This process avoids the cost and impact on vias associated with soldering solder balls. Furthermore, it supports higher-density and smaller-size 3D stacked packaging. For example, in scenarios where processor cores and memory chips are bonded using 3D stacking technology, C2W bonding can improve signal transmission quality and bandwidth, and alleviate storage challenges.

[0057] C2W bonding process refers to cleaning the opposing surfaces of the chip and wafer to obtain atomically flat surfaces, then cleaning and activating the opposing surfaces, and directly bonding them under certain conditions, and bonding them together through van der Waals forces, molecular forces or even atomic forces.

[0058] Currently, in related technologies, the C2W bonding process typically involves bonding the chip onto the wafer using a pick-and-place method. Specifically, for example... Figure 1 As shown, the bonding apparatus 100 includes a base 10 and a bonding head 30, the bonding head 30 being movable relative to the base 10. During bonding, as... Figure 1 As shown in (a), wafer 203 can be fixed on base 10, bonding head 30 picks up chip 302 and moves chip 302 above wafer 203. The position of chip 302 is calibrated. Then, as... Figure 1 As shown in (b), the bonding head 30 moves toward the wafer 203 and places the chip 302 onto the wafer 203, thus bonding the chip 302 to the wafer 203. Then, as... Figure 1 As shown in (c), the bonding head 30 picks up another chip 302 and moves it above the wafer 203. It continues to bond the chip 302 to the wafer 203 until all chips 302 are bonded to the wafer 203.

[0059] With the increasing demand for C2W bonding processes, higher requirements are being placed on bonding accuracy and unit per hour (UPH). Higher bonding accuracy requirements mean longer time is needed for calibrating the position of chip 302, resulting in fewer chips 302 that can be bonded within the same timeframe, thus leading to lower bonding efficiency. Therefore, existing bonding processes are no longer sufficient to meet current bonding efficiency requirements.

[0060] Based on this, embodiments of this application provide a bonding apparatus 100 that can improve bonding efficiency. The bonding apparatus 100 can be used to implement C2W bonding processes, that is, to bond multiple chips onto a wafer. The bonding apparatus 100 can also be used to bond multiple chips onto a substrate, or to bond multiple wafers onto multiple substrates, etc.

[0061] For ease of explanation, three directions are defined here: X-axis, Y-axis, and Z-axis. X-axis can refer to the length direction of the bonding device 100, Y-axis can refer to the width direction of the bonding device 100, and Z-axis can refer to the height direction of the bonding device 100. The X-axis, Y-axis, and Z-axis are perpendicular to each other.

[0062] like Figure 2 As shown, the bonding device 100 may include a base 10, a first drive mechanism 20, and a bonding head 30.

[0063] Among them, such as Figure 2 As shown, the base 10 has a bearing surface 11, which is used to support the first workpiece 200. The first workpiece 200 can be a wafer or a substrate.

[0064] The fixed end of the first drive mechanism 20 is fixed to the base 10, such as Figure 2 As shown, the bonding head 30 is fixed to the driving end of the first driving mechanism 20, so that the first driving mechanism 20 can drive the bonding head 30 to move relative to the base 10. This movement can include movement along the X-axis, along the Y-axis, and along the Z-axis. Figure 2 (Not shown in the image) Move, rotate about the X direction, rotate about the Y direction, and rotate about the Z direction.

[0065] like Figure 2 As shown, the bonding head 30 includes a chuck 33, a plurality of second drive mechanisms 31, and a plurality of bonding blocks 32. The fixed end of each second drive mechanism 31 is fixed to the chuck 33. The number of bonding blocks 32 may be the same as the number of second drive mechanisms 31, and the plurality of bonding blocks 32 are respectively fixed to the drive ends of the plurality of second drive mechanisms 31. Thus, each second drive mechanism 31 can drive each bonding block 32 to move relative to the chuck 33. This movement may include movement along the X-axis and movement along the Y-axis.

[0066] Specifically, the second driving mechanism 31 can be a nanopiezoelectric platform, which can achieve high-precision motion. For example, it can achieve motion with an accuracy of 10 nm. Of course, the second driving mechanism 31 can also adopt other structures that can achieve high-precision motion.

[0067] like Figure 2 As shown, each bonding block 32 has a fixing surface 321 facing the bearing surface 11, which can be used to fix the second workpiece 300. In this way, multiple fixing surfaces 321 can be formed on multiple bonding blocks 32, thereby fixing multiple second workpieces 300 on the bonding head 30.

[0068] The second workpiece 300 can be a chip or a wafer, etc. The chip can be an unpackaged chip, i.e., a bare chip; or it can be a packaged functional module. For example, the chip can be a system-on-chip (SOC), a test or dummy chip, a central processing unit (CPU), a graphics processing unit (GPU), memory, input / output (I / O) chips, integrated passive devices (IPDs), etc. It can also integrate other packaged functional modules, such as high bandwidth memory (HBM), die-on-silicon interposer (DOI), fan-out RDL interposer (FOI), etc. In practical applications, multiple chips can be set up as needed. The multiple chips may include at least one of the chips listed above.

[0069] The bonding apparatus 100 of this embodiment can bond multiple second workpieces 300 onto a first workpiece 200. Specifically, as shown... Figure 3 As shown in (a), the multiple second workpieces 300 to be bonded are all placed on the tray 400. Figure 3 As shown in (b), the first driving mechanism 20 can drive the bonding head 30 to move above the tray 400. Each fixed surface 321 of the bonding head 30 is hollow and adsorbs a second workpiece 300, thus, multiple second workpieces 300 can be adsorbed on the bonding head 30. Next, as... Figure 4 As shown in (a), the first drive mechanism 20 drives the bonding head 30 to move above the first workpiece 200. Each second drive mechanism 31 drives each bonding block 32 to move, thereby moving the corresponding second workpiece 300 to calibrate the position of the second workpiece 300. Finally, as... Figure 4As shown in (b), the first driving mechanism 20 drives the bonding head 30 to move toward the first workpiece 200 and places a plurality of second workpieces 300 after position calibration on the first workpiece 200, and the plurality of second workpieces 300 can be bonded to the first workpiece 200.

[0070] In this embodiment, the position of each second workpiece 300 can be individually calibrated by each second driving mechanism 31. This improves the calibration accuracy of each second workpiece 300, thereby increasing the bonding accuracy of bonding the calibrated second workpiece 300 to the first workpiece 200. Furthermore, since multiple second workpieces 300 can be adsorbed onto the bonding head 30, and multiple second workpieces 300 can be bonded to the first workpiece 200 in the same process, bonding efficiency can be improved. In other words, this application can improve bonding efficiency while meeting bonding accuracy requirements.

[0071] like Figure 5 As shown, the first workpiece 200 has multiple bonding regions 201 arranged in a rectangular array, each bonding region 201 being used to bond with... Figure 2 A second workpiece 300 is shown being bonded. Each bonding area 201 is provided with a second mark 202. There can be two second marks 202, which are located on the diagonal of the bonding area 201.

[0072] like Figure 2 As shown, multiple bonding blocks 32 can be arranged in a rectangular array, and the number of bonding blocks 32 can be 2×2=4, 3×3=9, or 4×4=16, etc. Therefore, as Figure 6 As shown, fixed at such Figure 2 The multiple second workpieces 300 on the multiple bonding blocks 32 shown can also be arranged in a rectangular array. Each second workpiece 300, which needs to be bonded to the surface of the first workpiece 200, has a first mark 301. There can be two first marks 301, located on the diagonal of the second workpiece 300. Furthermore, the position of the first mark 301 on each second workpiece 300 is the same as the position of the second mark 202 on the corresponding bonding area 201.

[0073] like Figure 6 As shown, the multiple second workpieces 300 can be divided into M second workpieces 300a and N second workpieces 300b. That is, M+N is the same as the number of the multiple second workpieces 300 fixed on the bonding head 30, and the N second workpieces 300 are the other second workpieces 300 besides the M second workpieces 300. For example, as... Figure 6 As shown, 16 second workpieces 300 are fixed on the bonding head 30, and M=2, N=14.

[0074] Before bonding multiple second workpieces 300 to the first workpiece 200, the positions of the multiple second workpieces 300 need to be calibrated. During calibration, the positions of M second workpieces 300a can be calibrated first, and then the positions of N second workpieces 300b can be calibrated.

[0075] The bonding apparatus 100 also includes a controller electrically connected to each of the second drive mechanisms 31. The controller is used to: acquire first coordinate difference information between the M second workpieces 300a and the corresponding bonding area 201, and control the M second drive mechanisms 31 to drive the bonding block 32 to move according to the first coordinate difference information, so as to calibrate the position of the M second workpieces 300a.

[0076] The first coordinate difference information may include the X-axis coordinate difference and the Y-axis coordinate difference. The M second drive mechanisms 31 are the second drive mechanisms 31 that correspond to the M second workpieces 300a among all the second drive mechanisms 31.

[0077] In specific implementation, such as Figure 2 As shown, the bonding apparatus 100 also includes an image acquisition device 40 electrically connected to the controller. The image acquisition device 40 is movably connected to the base 10, so that the image acquisition device 40 can move relative to the base 10. Specifically, the image acquisition device 40 can be a dual-view lens, which can be moved between the bonding head 30 and the base 10, that is, the dual-view lens can be moved between the second workpiece 300 and the first workpiece 200, and acquire a first image signal of the second workpiece 300 and a second image signal of the first workpiece 200 corresponding to the bonding area 201.

[0078] Regarding the number of image acquisition devices 40, in one example, such as Figure 2 As shown, the number of image acquisition devices 40 can be one. Figure 7 As shown, the image acquisition device 40 is used to sequentially acquire first image signals of M second workpieces 300a and second image signals of the corresponding bonding regions 201, and send the first image signals and second image signals to the controller. That is, for each of the M second workpieces 300a, the first image signal of the second workpiece 300a and the second image signal of the bonding region 201 corresponding to the second workpiece 300a can be acquired.

[0079] For example, the image acquisition device 40 can be driven to move between one of the M second workpieces 300a and the first workpiece 200, and acquire a first image signal of the second workpiece 300a and a second image signal of the corresponding bonding region 201. Next, the image acquisition device 40 is driven to move between a second second workpiece 300a and the first workpiece 200, and acquires a first image signal of the second second workpiece 300a and a second image signal of the corresponding bonding region 201. This process continues until the first image signals of all the M second workpieces 300a and the second image signals of the corresponding bonding regions 201 have been acquired. Since the number of image acquisition devices 40 is small in this embodiment, the cost is low.

[0080] In another example, such as Figure 8 As shown, the number of image acquisition devices 40 is M, that is, the number of image acquisition devices 40 can be the same as the number of M second workpieces 300a. Each image acquisition device 40 is movably connected to the base 10, so that each image acquisition device 40 can move relative to the base 10.

[0081] like Figure 9 As shown, the M image acquisition devices 40 are respectively used to acquire first image signals of the M second workpieces 300a and second image signals of the corresponding bonding regions 201, and send the first image signals and second image signals to the controller. Specifically, each image acquisition device 40 can be driven to move between each of the M second workpieces 300a and the first workpiece 200, and acquire the first image signals of the M second workpieces 300a and the second image signals of the corresponding bonding regions 201, respectively.

[0082] For example, such as Figure 9 As shown, the first image acquisition device 40 acquires the first image signal of the first second workpiece 300a and the second image signal of the corresponding bonding region 201 and sends them to the controller. The second image acquisition device 40 acquires the first image signal of the second second workpiece 300a and the second image signal of the corresponding bonding region 201 and sends them to the controller... The Mth image acquisition device 40 acquires the first image signal of the Mth second workpiece 300a and the second image signal of the corresponding bonding region 201 and sends them to the controller. Since in this embodiment, the first image signals of M second workpieces 300a and the second image signals of the corresponding bonding regions 201 can be acquired at once, time can be further saved, thereby improving bonding efficiency.

[0083] In another example, the number of image acquisition devices 40 is at least two and less than M. For example, the number of image acquisition devices 40 is half of M. In this way, the first image signals of M second workpieces 300a and the second image signals of the corresponding bonding regions 201 can be acquired through two detections. This also saves time and improves bonding efficiency.

[0084] like Figure 6 As shown, when M is 2, the two second workpieces 300a can be the two second workpieces 300 that are furthest apart from each other along the diagonal of the rectangle among a plurality of second workpieces 300 arranged in a rectangular array.

[0085] Specifically, the controller is used to determine the first coordinate difference information of M second workpieces 300a based on the first image signal and the second image signal. That is, the first coordinate difference information of each of the M second workpieces 300a can be determined based on the first image signal of each second workpiece 300a and the second image signal of the corresponding bonding region 201. Since a first mark 301 is provided on the surface of the second workpiece 300a facing the first workpiece 200, and a second mark 202 is provided on each bonding region 201 of the first workpiece 200, there is a third mark in the first image signal and a fourth mark in the second image signal. The third mark corresponds to the first mark 301, and the fourth mark corresponds to the second mark 202. After obtaining the first image signal and the second image signal of the corresponding bonding region 201 of a certain second workpiece 300a, the controller can compare the position of the third mark in the first image signal and the position of the fourth mark in the second image signal to calculate the coordinate difference between the two in two dimensions (X-axis and Y-axis), which is used as the first coordinate difference information of that second workpiece 300.

[0086] It is understandable that when calculating the first coordinate difference information, when Figure 6 The first mark 301 of the second workpiece 300a is located in Figure 5 When the second marker 202 is in the positive X-direction, the X-direction coordinate difference in the first coordinate difference information is a positive value; otherwise, it is a negative value. Similarly, when Figure 6 The first mark 301 of the second workpiece 300a is located in Figure 5 When the second mark 202 is in the positive Y direction, the Y-axis coordinate difference in the first coordinate difference information is a positive value; otherwise, it is a negative value.

[0087] After the controller obtains the first coordinate difference information of M second workpieces 300, as follows: Figure 7As shown, a first control signal can be sent to the second drive mechanism 31 corresponding to each of the M second workpieces 300a. The first control signal includes the first coordinate difference information of the corresponding second workpiece 300. After receiving the first control signal, the second drive mechanism 31 drives the bonding head 30 to move according to the first control signal and moves the second workpiece 300a to be aligned with the corresponding bonding area 201 on the first workpiece 200, thereby completing the calibration of the position of the second workpiece 300a.

[0088] The controller is also used to: control the N second driving mechanisms 31 corresponding to the N second workpieces 300b to drive the bonding blocks 32 to move based on the first coordinate difference information of the M second workpieces 300a, so as to calibrate the positions of the N second workpieces 300b. The first coordinate difference information can usually be obtained through detection, but this method requires a certain amount of time. In this embodiment, after obtaining the first coordinate difference information, in addition to calibrating the M second workpieces 300a based on the first coordinate difference information, it also calibrates the N second workpieces 300b based on the first coordinate difference information. Compared to the scheme of obtaining the coordinate difference information of the N second workpieces 300b through detection, this embodiment can save the time required to obtain the coordinate difference information corresponding to the N second workpieces 300, thereby improving bonding efficiency.

[0089] When M ≥ 2, that is, at least two second workpieces 300a are calibrated first, followed by the remaining second workpieces 300b. Specifically, the controller is used to: determine the second coordinate difference information between N second workpieces 300b and their corresponding bonding regions 201 based on the first coordinate difference information of the M second workpieces 300a. The second coordinate difference information of each of the N second workpieces 300b is identical.

[0090] In one example, the second coordinate difference information is the same as the first coordinate difference information of any one of the M second workpieces 300a. That is, after obtaining the first coordinate difference information of the M second workpieces 300a, the first coordinate difference information of any one second workpiece 300a can be determined as the second coordinate difference information corresponding to the remaining N second workpieces 300b. The second coordinate difference information may include the X-axis coordinate difference and the Y-axis coordinate difference. The method for determining this second coordinate difference information is relatively simple.

[0091] In another example, the second coordinate difference information is the average of the first coordinate difference information of M second workpieces 300a. That is, after obtaining the first coordinate difference information of M second workpieces 300a, the average of the first coordinate difference information of the M second workpieces 300a can be calculated, and this average value can be determined as the second coordinate difference information corresponding to N second workpieces 300b. This method combines the first coordinate difference information of each of the M second workpieces 300a, therefore, the calculation accuracy of the second coordinate difference information is higher, thereby improving the position calibration accuracy of the N second workpieces 300b.

[0092] When M=1, that is, one of the second workpieces 300a is calibrated first, and then the remaining second workpieces 300b are calibrated. In this case, the first coordinate difference information of the first calibrated second workpiece 300a can be determined as the second coordinate difference information of the other second workpieces 300b.

[0093] Furthermore, the controller is specifically configured to: acquire the measured coordinate difference information of the M calibrated second workpieces 300a, and correct the second coordinate difference information using the measured coordinate difference information. After acquiring the second coordinate difference information, the controller can continue to detect the measured coordinate difference information of the M calibrated second workpieces 300a, and correct the second coordinate difference information using the measured coordinate difference information. Then, the corrected second coordinate difference information can be used to calibrate the positions of the N second workpieces 300b. In this way, when correcting the second coordinate difference information, the error generated when the second driving mechanism 31 drives the bonding block 32 to move is fully considered, and the corrected second coordinate difference information can eliminate some of the error. Therefore, the accuracy of the second coordinate difference information can be improved, thereby improving the position calibration accuracy of the N second workpieces 300b.

[0094] Specifically, the measured coordinate difference information of the M calibrated second workpieces 300a can be acquired through the image acquisition device 40. The specific acquisition method is the same as that used for acquiring the first coordinate difference information of the M second workpieces 300a, and will not be repeated here.

[0095] The second coordinate difference information can include the X-axis coordinate difference (x1) and the Y-axis coordinate difference (y1). The measured coordinate difference information can also include the X-axis coordinate difference (x2) and the Y-axis coordinate difference (y2). The corrected coordinate difference information can include the X-axis coordinate difference (x3) and the Y-axis coordinate difference (y3). Therefore, the X-axis coordinate difference (x3) can be obtained by adding the X-axis coordinate difference (x1) and the X-axis coordinate difference (x2), i.e., x3 = x1 + x2. Similarly, the Y-axis coordinate difference (y1) can be obtained by adding the Y-axis coordinate difference (y2), i.e., y3 = y1 + y2.

[0096] After obtaining the second coordinate information of N second workpieces 300a, the controller can specifically be used to: control N second driving mechanisms 31 to drive the bonding block 32 to move according to the second coordinate difference information of the N second workpieces 300b, so as to calibrate the position of the N second workpieces 300b. Here, the N second driving mechanisms 31 are the second driving mechanisms 31 that correspond to the N second workpieces 300b among a plurality of second driving mechanisms 31.

[0097] Specifically, such as Figure 7 As shown, the controller can send a second control signal to the second drive mechanism 31 corresponding to each of the N second workpieces 300b. The second control signal includes the second coordinate difference information of the second workpiece 300b. After receiving the second control signal, the second drive mechanism 31 drives the bonding head 30 to move and moves the second workpiece 300b to align with the corresponding bonding area 201 on the first workpiece 200, thereby completing the calibration of the position of the second workpiece 300b.

[0098] In other embodiments of this application, the difference from the above embodiments lies in the calibration method for the positions of the plurality of second workpieces 300. Specifically, in this embodiment, the coordinate difference information of each second workpiece 30 can be obtained, and the position of each second workpiece 30 can be calibrated based on the coordinate difference information of each second workpiece 30.

[0099] In a specific embodiment, the image acquisition device 40 can be used to acquire a first image signal of each second workpiece 300 and a second image signal of the corresponding bonding area 201, and send the first image signal and the second image signal to the controller.

[0100] In one example, the number of image acquisition devices 40 can be one. Therefore, by driving the image acquisition device 40 to move relative to the base 10, the first image signals of M second workpieces 300 and the second image signals of the corresponding bonding areas 201 can be acquired sequentially. Since the number of image acquisition devices 40 is small in this embodiment, the cost is low.

[0101] In another example, the number of image acquisition devices 40 can be the same as the number of all second workpieces 300. This allows for the acquisition of first image signals from all second workpieces 300 and second image signals from the corresponding bonding regions 201 at once, thereby further saving time and improving bonding efficiency.

[0102] In yet another example, such as Figure 8As shown, the number of image acquisition devices 40 is at least two and less than the number of all second workpieces 300. For example, the number of image acquisition devices 40 is half the number of all second workpieces 300. In this way, the first image signal of all second workpieces 300 and the second image signal of the corresponding bonding region 201 can be acquired through two detections.

[0103] The controller can be used to determine the coordinate difference information between each second workpiece 300 and the corresponding bonding area 201 based on the first image signal and the second image signal, and control the second drive mechanism 31 to drive the bonding block 32 to move based on the coordinate difference information, so as to calibrate the position of each second workpiece 300.

[0104] This application also provides a bonding method, applied to... Figure 2 or Figure 8 The bonding device 100 is shown. (As shown in the image) Figure 10 As shown, the bonding methods include:

[0105] S101, the first drive mechanism drives multiple second workpieces to above the first workpiece.

[0106] Specifically, the first workpiece 200 can be fixed on the bearing surface 11, and the first workpiece 200 has multiple bonding areas 201.

[0107] like Figure 3 As shown in (a), the multiple second workpieces 300 to be bonded are all placed on the tray 400. Figure 3 As shown in (b), the first driving mechanism 20 can drive the bonding head 30 to move above the tray 400. Each fixed surface 321 of the bonding head 30 adsorbs a second workpiece 300, thus, multiple second workpieces 300 can be adsorbed on the bonding head 30. Next, as... Figure 4 As shown in (a), the first driving mechanism 20 drives the key head 30 to move, which in turn moves multiple second workpieces 300 to above the first workpiece 200.

[0108] like Figure 6 As shown, the multiple second workpieces 300 can be divided into M second workpieces 300a and N second workpieces 300b. When calibrating the positions of the multiple second workpieces 300, the positions of the M second workpieces 300a can be calibrated first, and then the positions of the N second workpieces 300b can be calibrated.

[0109] S102, the image acquisition device acquires the first image signals of M second workpieces and the second image signals of the corresponding bonding areas, and sends the first image signals and the second image signals to the controller.

[0110] In one possible implementation, such as Figure 2As shown, the number of image acquisition devices 40 can be one. In this embodiment, the image acquisition device 40 can sequentially acquire first image signals of M second workpieces 300 and second image signals of corresponding bonding regions 201, and send the first image signals and second image signals to the controller.

[0111] In another possible implementation, such as Figure 8 As shown, the number of image acquisition devices 40 can be M. That is, the number of image acquisition devices 40 is the same as the number of M second workpieces 300a. In this embodiment, the M image acquisition devices 40 respectively acquire the first image signal of the M second workpieces 300 and the second image signal of the corresponding bonding region 201, and send the first image signal and the second image signal to the controller.

[0112] S103, the controller determines the first coordinate difference information of the M second workpieces based on the first image signal and the second image signal.

[0113] like Figure 5 As shown, the second workpiece 300 is provided with a first mark 301, such as Figure 5 As shown, each bonding region 201 of the first workpiece 200 is provided with a second mark 202. Therefore, the first image signal contains a fourth mark corresponding to the first mark 301, and the second image signal contains a third mark corresponding to the second mark 202. After obtaining the first image signal and the second image signal corresponding to a certain second workpiece 300, the controller can compare the position of the third mark in the first image signal and the position of the fourth mark in the second image signal, and calculate the coordinate difference between the two in two dimensions, which is used as the first coordinate difference information of the second workpiece 300.

[0114] S104, the controller controls the M second drive mechanisms to drive the bonding blocks to move according to the first coordinate difference information, so as to calibrate the positions of the M second workpieces.

[0115] Specifically, such as Figure 7 As shown, the controller can send a first control signal to the second drive mechanism 31 corresponding to each of the M second workpieces 300a. The first control signal includes the first coordinate difference information of the second workpiece 300a. After receiving the first control signal, the second drive mechanism 31 drives the bonding head 30 to move and moves the second workpiece 300a to align with the corresponding bonding area 201 on the first workpiece 200, thereby completing the position calibration of the second workpiece 300a.

[0116] S105, the controller determines the second coordinate difference information between N second workpieces and their corresponding bonding areas based on the first coordinate difference information of M second workpieces.

[0117] When M ≥ 2. In one possible implementation, the second coordinate difference information is the same as the first coordinate difference information of any one of the M second workpieces 300a. That is, after obtaining the first coordinate difference information of the M second workpieces 300a, the first coordinate difference information of any one second workpiece 300a can be determined as the second coordinate difference information corresponding to the remaining N second workpieces 300b. The method for determining this second coordinate difference information is relatively simple.

[0118] In another possible implementation, the second coordinate difference information is the average of the first coordinate difference information of the M second workpieces 300a. That is, after obtaining the first coordinate difference information of the M second workpieces 300a, the average of the first coordinate difference information of the M second workpieces 300a can be calculated, and this average value can be determined as the second coordinate difference information corresponding to the N second workpieces 300b. This method combines the first coordinate difference information of each of the M second workpieces 300a, therefore, the calculation accuracy of the second coordinate difference information is higher, thereby improving the position calibration accuracy of the N second workpieces 300b.

[0119] When M=1, the first coordinate difference information of a first-calibrated second workpiece 300a can be determined as the second coordinate difference information of other second workpieces 300b.

[0120] S106, the controller acquires the measured coordinate difference information of the M second workpieces after calibration, and uses the measured coordinate difference information to correct the second coordinate difference information.

[0121] After obtaining the second coordinate difference information, the measured coordinate difference information of the M calibrated second workpieces 300a can be further detected, and the second coordinate difference information can be corrected using the measured coordinate difference information. Then, the corrected second coordinate difference information can be used to calibrate the positions of the N second workpieces 300b. In this way, when correcting the second coordinate difference information, the error generated when the second driving mechanism 31 drives the bonding block 32 to move is fully considered, and the corrected second coordinate difference information can eliminate some of the error. Therefore, the accuracy of the second coordinate difference information can be improved, thereby improving the position calibration accuracy of the N second workpieces 300b.

[0122] S107, the controller controls the N second drive mechanisms corresponding to the N second workpieces to drive the bonding block to move according to the second coordinate difference information of the N second workpieces.

[0123] Specifically, such as Figure 7As shown, the controller can send a second control signal to the second drive mechanism 31 corresponding to each of the N second workpieces 300b. The control signal includes the second coordinate difference information of the second workpiece 300. After receiving the second control signal, the second drive mechanism 31 drives the bonding head 30 to move and moves the second workpiece 300 to align with the corresponding bonding area 201 on the first workpiece 200, thereby completing the calibration of the position of the second workpiece 300.

[0124] S108, each second workpiece is bonded to the first workpiece.

[0125] like Figure 4 As shown in (b), the first drive mechanism 20 drives the bonding head 30 to move toward the first workpiece 200 and bonds multiple second workpieces 300 to the first workpiece 200. In this way, multiple second workpieces 300 can be bonded to the first workpiece 200 in the same process, thereby improving bonding efficiency.

[0126] In other embodiments of this application, a bonding method is also provided, applied to Figure 2 or Figure 8 The bonding device shown. (As shown) Figure 11 As shown, the bonding methods include:

[0127] S111, the first drive mechanism drives multiple second workpieces to above the first workpiece.

[0128] Reference Figure 10 The step S101 shown.

[0129] S112, the image acquisition device acquires the first image signal of each second workpiece and the second image signal of the corresponding bonding area, and sends the first image signal and the second image signal to the controller.

[0130] In one example, such as Figure 2 As shown, the number of image acquisition devices 40 can be one. Therefore, by driving the image acquisition device 40 to move relative to the base 10, the first image signals of M second workpieces 300 and the second image signals of the corresponding bonding areas 201 can be acquired sequentially. Since the number of image acquisition devices 40 is small in this embodiment, the cost is low.

[0131] In another example, the number of image acquisition devices 40 can be the same as the number of all second workpieces 300. This allows for the acquisition of first image signals from all second workpieces 300 and second image signals from the corresponding bonding regions 201 at once, thereby further saving time and improving bonding efficiency.

[0132] In yet another example, such as Figure 8As shown, the number of image acquisition devices 40 is at least two and less than the number of all second workpieces 300. For example, the number of image acquisition devices 40 is half the number of all second workpieces 300. In this way, the first image signal of all second workpieces 300 and the second image signal of the corresponding bonding region 201 can be acquired through two detections.

[0133] S113, the controller determines the coordinate difference information between each second workpiece and the corresponding bonding area based on the first image signal and the second image signal.

[0134] After obtaining the first image signal and the second image signal corresponding to a certain second workpiece 300, the controller can compare the position of the third mark in the first image signal and the position of the fourth mark in the second image signal, and calculate the coordinate difference between the two in the two dimensions as the coordinate difference information of the second workpiece 300.

[0135] S114, the controller controls the second drive mechanism to drive the bonding block to move according to the coordinate difference information, so as to calibrate the position of each second workpiece.

[0136] Specifically, the controller can send a control signal to the second drive mechanism 31 corresponding to each second workpiece, the control signal including the coordinate difference information of the second workpiece 300. After receiving the control signal, the second drive mechanism 31 drives the bonding head 30 to move according to the control signal and moves the second workpiece 300 to align with the corresponding bonding area 201 on the first workpiece 200, thereby completing the calibration of the position of the second workpiece 300.

[0137] S115, each second workpiece is bonded to the first workpiece.

[0138] Reference Figure 10 The step S107 shown.

[0139] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A bonding apparatus, characterized in that, include: A base having a bearing surface for supporting a first workpiece; The first drive mechanism has its fixed end fixed to the base; A bonding head is fixed to the driving end of the first driving mechanism. The bonding head includes multiple second driving mechanisms and multiple bonding blocks. The multiple bonding blocks are respectively fixed to the driving ends of the multiple second driving mechanisms. Each bonding block has a fixing surface facing the bearing surface, and the fixing surface is used to fix the second workpiece.

2. The bonding apparatus according to claim 1, characterized in that, The first workpiece has multiple bonding areas; the bonding device further includes a controller, which is electrically connected to each of the second drive mechanisms; The controller is used for: Obtain the first coordinate difference information between M second workpieces and the corresponding bonding area, and control M second driving mechanisms to drive the bonding block to move according to the first coordinate difference information, so as to calibrate the position of the M second workpieces; Based on the first coordinate difference information of the M second workpieces, the N second driving mechanisms corresponding to the N second workpieces are controlled to drive the bonding block to move, so as to calibrate the position of the N second workpieces. The N second workpieces are other second workpieces besides the M second workpieces among a plurality of second workpieces.

3. The bonding apparatus according to claim 2, characterized in that, M≥2; the controller is specifically used for: Based on the first coordinate difference information of the M second workpieces, determine the second coordinate difference information between the N second workpieces and the corresponding bonding area; the second coordinate difference information is the same as the first coordinate difference information of any one of the M second workpieces; or, the second coordinate difference information is the average value of the first coordinate difference information of the M second workpieces. Based on the second coordinate difference information of the N second workpieces, the N second driving mechanisms are controlled to drive the bonding block to move.

4. The bonding apparatus according to claim 3, characterized in that, The controller is specifically used for: Obtain the measured coordinate difference information of the M second workpieces after calibration, and use the measured coordinate difference information to correct the second coordinate difference information.

5. The bonding apparatus according to any one of claims 2-4, characterized in that, The bonding device further includes an image acquisition device electrically connected to the controller, the image acquisition device being movably connected to the base; The image acquisition device is used to sequentially acquire the first image signal of the M second workpieces and the second image signal of the corresponding bonding area, and send the first image signal and the second image signal to the controller; The controller is specifically used to determine the first coordinate difference information of the M second workpieces based on the first image signal and the second image signal.

6. The bonding apparatus according to any one of claims 2-4, characterized in that, M≥2; the bonding device further includes M image acquisition devices electrically connected to the controller, each of the image acquisition devices being movably connected to the base; The M image acquisition devices are respectively used to acquire the first image signal of the M second workpieces and the second image signal of the corresponding bonding area, and send the first image signal and the second image signal to the controller; The controller is specifically used to determine the first coordinate difference information of the M second workpieces based on the first image signal and the second image signal.

7. The bonding apparatus according to claim 1, characterized in that, The first workpiece has multiple bonding regions; The bonding device further includes a controller electrically connected to the second drive mechanism and an image acquisition device electrically connected to the controller, the image acquisition device being movably connected to the base; The image acquisition device is used to acquire a first image signal of each of the second workpieces and a second image signal of the corresponding bonding area, and send the first image signal and the second image signal to the controller; The controller is configured to determine the coordinate difference information between each second workpiece and the corresponding bonding area based on the first image signal and the second image signal, and control the second driving mechanism to drive the bonding block to move based on the coordinate difference information, so as to calibrate the position of each second workpiece.

8. A bonding method, characterized in that, The bonding device includes a base, a first drive mechanism, and a bonding head. The base has a bearing surface, and the bonding head includes a plurality of second drive mechanisms and a plurality of bonding blocks, each of the bonding blocks having a fixed surface facing the bearing surface. The bonding method includes: The first driving mechanism drives a plurality of second workpieces to a position above the first workpiece, the first workpiece being fixed to the bearing surface, and each of the second workpieces being fixed to each of the fixed surfaces. The position of each second workpiece is calibrated using multiple second drive mechanisms and multiple bonding blocks; Each of the second workpieces is bonded to the first workpiece.

9. The bonding method according to claim 8, characterized in that, The first workpiece has multiple bonding areas; the bonding device further includes a controller; The step of calibrating the position of each second workpiece using multiple second driving mechanisms and multiple bonding blocks includes: The controller acquires the first coordinate difference information between the M second workpieces and the corresponding bonding area, and controls the M second driving mechanisms to drive the bonding block to move according to the first coordinate difference information, so as to calibrate the position of the M second workpieces. The controller controls N second driving mechanisms corresponding to N second workpieces to drive the bonding block to move based on the first coordinate difference information of the M second workpieces, so as to calibrate the position of the N second workpieces. The N second workpieces are other second workpieces besides the M second workpieces among a plurality of second workpieces.

10. The bonding method according to claim 9, characterized in that, M≥2； The controller, based on the first coordinate difference information of the M second workpieces, controls N second driving mechanisms corresponding to the N second workpieces to drive the bonding block to move, including: The controller determines the second coordinate difference information between N second workpieces and the corresponding bonding area based on the first coordinate difference information of the M second workpieces; the second coordinate difference information is the same as the first coordinate difference information of any one of the M second workpieces; or, the second coordinate difference information is the average value of the first coordinate difference information of the M second workpieces. The controller controls the N second driving mechanisms corresponding to the N second workpieces to drive the bonding block to move based on the second coordinate difference information of the N second workpieces.

11. The bonding method according to claim 10, characterized in that, The controller, based on the first coordinate difference information of the M second workpieces, controls the N second driving mechanisms corresponding to the N second workpieces to drive the bonding block to move, and further includes: The controller acquires the measured coordinate difference information of the M second workpieces after calibration, and uses the measured coordinate difference information to correct the second coordinate difference information.

12. The bonding method according to any one of claims 9-11, characterized in that, The bonding device also includes an image acquisition device; The bonding method further includes: The image acquisition device sequentially acquires the first image signal of the M second workpieces and the second image signal of the corresponding bonding area, and sends the first image signal and the second image signal to the controller; The controller acquires the first coordinate difference information between the M second workpieces and the corresponding bonding areas, including: The controller determines the first coordinate difference information of the M second workpieces based on the first image signal and the second image signal.

13. The bonding method according to any one of claims 9-11, characterized in that, M≥2; the bonding device further includes M image acquisition devices; The bonding method further includes: The M image acquisition devices respectively acquire the first image signal of the M second workpieces and the second image signal of the corresponding bonding area, and send the first image signal and the second image signal to the controller; The controller acquires the first coordinate difference information between the M second workpieces and the corresponding bonding areas, including: The controller determines the first coordinate difference information of the M second workpieces based on the first image signal and the second image signal.

14. The bonding method according to claim 8, characterized in that, The first workpiece has multiple bonding areas; the bonding device further includes a controller and an image acquisition device electrically connected to the controller; The calibration of the position of each of the second workpieces using the second driving mechanism and the bonding block includes: The image acquisition device acquires a first image signal for each of the second workpieces and a second image signal for the corresponding bonding area, and sends the first image signal and the second image signal to the controller; The controller determines the coordinate difference information between each second workpiece and the corresponding bonding area based on the first image signal and the second image signal, and controls the second driving mechanism to drive the bonding block to move based on the coordinate difference information, so as to calibrate the position of each second workpiece.

Images