Imaging device

By setting a through hole in the imaging device and using a breathable sealing material, the problems of pressure rise and dust ingress during the lens barrel fixation process were solved, achieving a dual optimization of imaging quality and cost.

CN122095282APending Publication Date: 2026-05-26SONY SEMICON SOLUTIONS CORP +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SONY SEMICON SOLUTIONS CORP
Filing Date
2024-10-22
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

In imaging devices, when thermosetting adhesives are used to fix the lens barrel, the increased pressure in the containment space causes the adhesive to crack, and the through holes make it easy for dust to enter, affecting image quality. At the same time, it increases the number of components and steps, raising manufacturing costs.

Method used

By forming through holes on the substrate, a distance relationship of L > 10×D is ensured to allow air circulation, while a breathable sealing material is used to seal the through holes to prevent dust from entering and avoid pressure rise.

Benefits of technology

Without adding components and steps, it effectively prevents increased pressure in the containment space, avoids adhesive cracking and dust ingress, maintains image quality, and reduces manufacturing costs.

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Abstract

An imaging apparatus is provided that can suppress pressure rise during heating in a housing space housing an imaging element without increasing the number of components and steps. The imaging apparatus includes: a substrate having a mounting surface; an imaging element disposed on the mounting surface; a cover glass covering a light-receiving surface; a lens disposed on the side opposite to the substrate, passing over the imaging element; and a support member fixed to the mounting surface, forming a housing space for housing the imaging element and the cover glass together with the lens between the support member and the substrate. A through-hole is formed in the substrate, penetrating the mounting surface and its back surface, to connect the housing space to the outside. When the distance between the light-receiving surface of the imaging element (facing the cover glass) and the incident surface of the cover glass (facing the lens) is defined as L, and the diameter of the through-hole is defined as D, L > 10 × D is satisfied.
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