Laser processing device for electric material component

Abstract

The application belongs to the technical field of electronic component processing, in particular to a laser processing device for electric material components, which comprises a machine table, a moving table, a processing table, a processing frame and an intelligent laser cutting head. The lower end of the intelligent laser cutting head is arranged towards the processing table. A discharging groove is provided through the inside of the processing table and the moving table. A limiting U-shaped frame and two transport assemblies are fixedly installed above the processing table. The PCB thin plate can be inserted into the inside of the two transport assemblies only in the front state and the circular component is in the downward state. The horizontal height and the position of the PCB thin plate are all preset positions. The intelligent laser cutting head can be used for intelligent laser cutting. The laser cutting is targeted to the multiple processing groove positions that can be acted on. The mechanical connection structure of the circular component and the inner wall of the processing groove is mostly cut off but still retains a trace of connection point. The temporary fixing structure prevents the component from shifting or falling off during the cutting process.

Description

Technical Field

[0001] This invention belongs to the field of electronic component processing, specifically a laser processing device for electrical components. Background Technology

[0002] Electrical components refer to electronic components and devices made from materials with specific electrical and dielectric properties, such as metals, semiconductors, ceramics, or composite materials. These components usually require precision processing using advanced laser cutting technology. Laser cutting technology uses a high-energy-density focused laser beam to perform non-contact processing on printed circuit boards, ceramic substrates, or semiconductor wafers, allowing electronic components to be separated from the circuit board for subsequent processing.

[0003] A patent document with announcement number CN221582386U discloses a laser cutting device for electronic components, including a base, a back plate, and a control box. A laser cutting head is installed at the bottom of the control box, a picking and placing mechanism is installed at the top of the base, and a dust removal mechanism is installed at the rear of the back plate. The picking and placing mechanism includes a storage plate, which is movably installed at the bottom of the base. Slide rails are installed on both inner walls of the top of the base. A positioning groove is opened on the top of the storage plate, and a top plate is movably installed inside the positioning groove. A first inclined block is installed at the bottom of the top plate and inside the storage plate.

[0004] In traditional technology, when performing laser cutting on PCB boards, the PCB board is usually placed in a preset position directly below the intelligent laser cutting head. Then, after position calibration, the laser cutting head processes the required cutting area, allowing the electronic components on the PCB board to be easily removed. However, in this process of repeatedly placing the PCB board for laser cutting, the position needs to be constantly calibrated and the front and back sides need to be distinguished. Therefore, operator errors may occur, resulting in the laser cutting position shifting and the front and back sides of the PCB board being easily misidentified.

[0005] Therefore, the present invention provides a laser processing apparatus for electrical material components to solve the problems mentioned in the background art. Summary of the Invention

[0006] The technical solution adopted by the present invention to solve its technical problem is as follows: The present invention provides a laser processing device for electrical material components, including a machine base and a movable stage movably installed on the machine base. A processing table is fixedly installed above the movable stage, and a processing frame is fixedly installed on the side of the machine base. An intelligent laser cutting head is installed below the top of the processing frame, with the lower end of the intelligent laser cutting head facing the processing table. A material feeding groove is provided through the interior of the processing table and the movable stage. A limiting U-shaped frame and two transport components are fixedly installed above the processing table. The two transport components are within the coverage area of ​​the limiting U-shaped frame. Multiple limiting components are also fixedly installed above the processing table. A PCB thin board is placed inside the limiting components. The multiple limiting components are used to limit the horizontal height of the PCB thin board. The PCB thin board has multiple processing slots inside, and circular components are installed inside the multiple processing slots.

[0007] Preferably, the transport component includes a transport block, the transport block having a transport trough inside, and multiple transport wheels being movably mounted inside the transport trough.

[0008] Preferably, a plurality of movable slots are provided below the transport block, and the plurality of movable slots are provided above the processing table. A plurality of sliding blocks are also fixedly installed below the transport block, and the plurality of sliding blocks are slidably installed inside the movable slots.

[0009] Preferably, the limiting component includes multiple limiting blocks, all of which are fixedly installed above the processing table, and the multiple limiting blocks are arranged in a U-shape.

[0010] Preferably, a limiting groove is formed inside the limiting block, and the horizontal height of the center position of the limiting groove is consistent with the horizontal height of the center position of the transport channel.

[0011] Preferably, the limiting block has multiple strip-shaped through grooves inside, and the multiple strip-shaped through grooves are connected to the corresponding limiting grooves.

[0012] Preferably, the limiting U-shaped frame has multiple pressing components fixedly installed inside, and the multiple pressing components are all positioned above the corresponding circular components.

[0013] Preferably, two telescopic components are installed opposite each other inside the limiting U-shaped frame. One end of the telescopic component is fixedly connected to the inside of the limiting U-shaped frame, and the other end of the telescopic component is connected to the back of the adjacent transport component.

[0014] Preferably, the pressing assembly has a pressing head mounted downwards, and when the pressing head is in a retracted state, the lowest horizontal height of the pressing head is higher than the horizontal height of the PCB board above the processing table.

[0015] Preferably, the lower end diameter of the pressing head is smaller than the diameter of the processing groove, and the lower end of the pressing head is provided with an elastic structure for buffering.

[0016] The beneficial effects of this invention are as follows: 1. The laser processing device for electrical components of the present invention allows a PCB thin plate to be inserted into two transport components only when the PCB thin plate is in a frontal position and the circular component is facing down. The horizontal height and position of the PCB thin plate are preset. Intelligent laser cutting can be performed by an intelligent laser cutting head, which can perform targeted laser cutting on multiple processing slots. This results in the mechanical connection structure between the circular component and the inner wall of the processing slot being mostly severed, but a few connection points are still retained. The temporary fixing structure prevents the component from shifting or falling off during the cutting process.

[0017] 2. The laser processing device for electrical components described in this invention moves a PCB sheet towards a limiting component. The PCB sheet then passes through the limiting grooves of multiple limiting blocks until all PCB sheets inside the limiting component are pressed against the limiting grooves within the multiple limiting blocks. At this point, the PCB sheet is in a preset cutting position, thus limiting its position and differentiating between its front and back sides. This allows for more efficient laser cutting of the PCB sheet. When the intelligent laser cutting head performs laser cutting, the multiple through-slots increase the contact area between the inside of the limiting component and the outside environment, effectively dissipating heat from the laser cutting process.

[0018] 3. The laser processing device for electrical components of the present invention involves multiple circular components after being cut being positioned directly below multiple pressing heads. At this time, the contraction of the telescopic component causes two transport blocks to move in opposite directions through the cooperation of a moving groove and a sliding block, thus increasing the distance between the two transport blocks. Multiple transport wheels inside the transport blocks clamp the PCB sheet. When the two transport blocks move in opposite directions, the PCB sheet at the pressing position is slightly stretched, improving the mechanical strength of the corresponding position on the PCB sheet. Subsequently, an electric drive causes the pressing assembly to lower the pressing heads, simultaneously pressing down on the multiple pressing heads directly below. The buffer elastic structure at the bottom of the pressing heads prevents damage to the circular components during pressing. Attached Figure Description

[0019] The invention will now be further described with reference to the accompanying drawings.

[0020] Figure 1 This is a perspective view of the entire invention; Figure 2 This is a three-dimensional schematic diagram of the processing table in this invention; Figure 3 This is a three-dimensional schematic diagram of the transport block in this invention; Figure 4 This is a three-dimensional schematic diagram of the transport components and PCB thin board in this invention; Figure 5 This is a three-dimensional schematic diagram of the limiting block in this invention; Figure 6 This is a three-dimensional schematic diagram of the limiting U-shaped frame in this invention.

[0021] In the diagram: 1. Machine base; 2. Processing frame; 3. Moving table; 4. Processing table; 41. Limiting U-shaped frame; 411. Pressing component; 412. Telescopic component; 413. Pressing head; 42. Transport component; 421. Transport block; 4211. Transport trough; 4212. Transport wheel; 4213. Sliding block; 4214. Moving trough; 43. Limiting component; 431. Limiting block; 4311. Limiting groove; 4312. Strip through groove; 44. PCB thin board; 441. Processing groove; 442. Circular component; 5. Unloading trough; 6. Intelligent laser cutting head. Detailed Implementation

[0022] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0023] Example 1: As Figures 1-4 As shown, an embodiment of the present invention provides a laser processing apparatus for electrical components, including a machine base 1 and a movable stage 3 movably mounted on the machine base 1. A processing table 4 is fixedly mounted above the movable stage 3, and a processing frame 2 is fixedly mounted on the side of the machine base 1. An intelligent laser cutting head 6 is mounted below the top of the processing frame 2, with the lower end of the intelligent laser cutting head 6 facing the processing table 4. A feeding groove 5 is provided through the interior of the processing table 4 and the movable stage 3. A limiting U-shaped frame 41 and two transport components 42 are fixedly installed above the processing table 4. The two transport components 42 are within the coverage area of ​​the limiting U-shaped frame 41. Multiple limiting components 43 are also fixedly installed above the processing table 4. A PCB thin board 44 is placed inside the limiting component 43. The multiple limiting components 43 are used to limit the horizontal height of the PCB thin board 44. The PCB thin board 44 has multiple processing slots 441 inside, and circular components 442 are installed inside the multiple processing slots 441.

[0024] Specifically, in this device, the PCB sheet 44 is inserted into the interior of two transport components 42. At this time, the PCB sheet 44 is positioned between the two transport components 42, which limits the horizontal height of the PCB sheet 44. Since the PCB sheet 44 contains multiple circular components 442, when the PCB sheet 44 is in the back position, the circular components 442 are facing upwards. When the upper ends of the circular components 442 are inserted into the two transport components 42, they are obstructed by the limiting U-shaped frame 41. Therefore, it is difficult to insert the PCB sheet 44 into the two transport components 42 when it is in the back position. The PCB sheet 44 can only be inserted into the two transport components 42 in the front position with the circular components 442 facing downwards. When the PCB sheet 44 is transported through the two transport components 42... It will continue to move and enter the interior of the limiting component 43 until the PCB board 44 moves to the limit position. At this time, the horizontal height and position of the PCB board 44 are both preset positions. Therefore, intelligent laser cutting can be performed by the intelligent laser cutting head 6 to perform targeted laser cutting on the multiple processing slots 441 that can be acted on. This will cut off most of the mechanical connection structure between the circular component 442 and the inner wall of the processing slot 441, but leave a few connection points. The temporary fixing structure prevents the component from shifting or falling off during the cutting process. Then, the PCB board 44 after cutting is transported out by two transport components 42. At this time, the circular component 442 and the PCB board 44 are separated, so that the circular component 442 can be unloaded into a fixed and higher protected position.

[0025] like Figures 2-5 As shown, the transport component 42 includes a transport block 421, the transport block 421 has a transport groove 4211 inside, and multiple transport wheels 4212 are movably installed inside the transport groove 4211.

[0026] Multiple moving slots 4214 are provided below the transport block 421. The multiple moving slots 4214 are provided above the processing table 4. Multiple sliding blocks 4213 are also fixedly installed below the transport block 421. The multiple sliding blocks 4213 are slidably installed inside the moving slots 4214.

[0027] The limiting component 43 includes multiple limiting blocks 431, which are all fixedly installed above the processing table 4, and the multiple limiting blocks 431 are arranged in a U-shape.

[0028] The limiting block 431 has a limiting groove 4311 inside, and the horizontal height of the center position of the limiting groove 4311 is the same as the horizontal height of the center position of the transport channel 4211.

[0029] The limiting block 431 has multiple strip-shaped through grooves 4312 inside, and the multiple strip-shaped through grooves 4312 are connected to the corresponding limiting grooves 4311.

[0030] Specifically, when the PCB thin board 44 is inserted into the two transport components 42, the PCB thin board 44 will first be inserted into the center of the transport groove 4211, and then be driven to rotate by multiple transport wheels 4212. The multiple transport wheels 4212 in the upper horizontal group and the multiple transport wheels 4212 in the lower horizontal group rotate in the same direction, thereby driving the PCB thin board 44 to move towards the limiting component 43. At this time, the PCB thin board 44 will pass through the limiting grooves 4311 of multiple limiting blocks 431 until the PCB thin board 44 inside the limiting component 43 is all against the limiting grooves 4311 opened inside the multiple limiting blocks 431. At this time, the PCB thin board 44 is in the preset cutting position, which limits the PCB thin board 44 and distinguishes the front and back sides, so that the laser cutting of the PCB thin board 44 can be carried out more efficiently. When the intelligent laser cutting head 6 performs laser cutting, the opening of multiple strip through grooves 4312 can increase the contact area between the inside of the limiting component 43 and the outside, effectively dissipating the heat of laser cutting.

[0031] Example 2: Figure 6 As shown in the first embodiment, another embodiment of the present invention is as follows: multiple pressing components 411 are fixedly installed inside the limiting U-shaped frame 41, and the multiple pressing components 411 are all located above the corresponding circular components 442.

[0032] Two telescopic components 412 are installed opposite each other inside the limiting U-shaped frame 41. One end of the telescopic component 412 is fixedly connected to the inside of the limiting U-shaped frame 41, and the other end of the telescopic component 412 is connected to the back of the adjacent transport component 42.

[0033] The pressing assembly 411 is mounted with a pressing head 413 facing downwards. When the pressing head 413 is in the retracted state, the lowest horizontal height of the pressing head 413 is higher than the horizontal height of the PCB board 44 above the processing table 4.

[0034] The lower end diameter of the pressure head 413 is smaller than the diameter of the processing groove 441, and the lower end of the pressure head 413 is provided with an elastic structure for buffering.

[0035] Specifically, when the PCB sheet 44 moves to the inner limit position of the limiting component 43, that is, when the outer side of the PCB sheet 44 abuts against the inside of the multiple limiting grooves 4311, the intelligent laser cutting head 6 performs laser cutting, so that the mechanical connection structure between the circular component 442 and the inner wall of the processing groove 441 is mostly severed but a few connection points are still retained. Then, the cut PCB sheet 44 is moved towards the limiting U-shaped frame 41 by the conveying of the two transport components 42 until the multiple cut circular components 442 are in multiple... Directly below the pressing head 413, the retraction of the telescopic member 412 causes the two transport blocks 421 to move in opposite directions through the cooperation of the moving groove 4214 and the sliding block 4213, thus increasing the distance between the two transport blocks 421. At this time, the multiple transport wheels 4212 inside the transport blocks 421 clamp the PCB board 44. When the two transport blocks 421 move in opposite directions, the PCB board 44 at the pressing position is slightly stretched, improving the mechanical strength of the corresponding position of the PCB board 44. Subsequently... The pressing assembly 411, driven by electricity, lowers the pressing head 413, simultaneously pressing down on multiple pressing heads 413 directly below. The buffer elastic structure at the bottom of the pressing head 413 prevents damage to the circular component 442 during pressing. Compared to traditional technology where manual pressing causes the circular component 442 to detach from the PCB board 44, which can bend the PCB board 44 and lead to burrs and fiber tears at the edges when the circular component 442 detaches under bending stress, this method addresses the issue of multiple components detaching from the PCB board 44. The circular components 442 are fed into the fixed and highly protective collection structure through the feeding groove 5. The laser cutting can cut two rows of circular components 442 in one go. Therefore, the other row of circular components 442 can be fed through the transport component 42. Then, the conveyed PCB board 44 is picked up and rotated so that the two rows of uncut circular components 442 are inserted into the direction of the limiting component 43. The other two rows of circular components 442 are then laser cut to complete the entire processing.

[0036] Working principle: When the PCB board 44 is inserted into the two transport components 42, it first enters the center of the transport groove 4211. Then, it is driven to rotate by multiple transport wheels 4212. The upper horizontal group of transport wheels 4212 rotates in the same direction as the lower horizontal group, thus moving the PCB board 44 towards the limiting component 43. At this point, the PCB board 44 passes through the limiting grooves 4311 of multiple limiting blocks 431 until all the PCB board 44 inside the limiting component 43 is against the limiting grooves 4311 of the multiple limiting blocks 431. At this point, the PCB board 44 is at the preset cutting position, and the PCB board 44 is cut. The system is designed with limiting positions and differentiates between front and back placement, allowing for more efficient laser cutting of the PCB thin board 44. During laser cutting by the intelligent laser cutting head 6, the multiple through-slots 4312 increase the contact area between the inside of the limiting component 43 and the outside, effectively dissipating heat from the laser cutting. When the PCB thin board 44 moves to the internal limit position of the limiting component 43, i.e., when the outer side of the PCB thin board 44 abuts against the inside of the multiple limiting slots 4311, the intelligent laser cutting head 6 performs laser cutting. This cuts off most of the mechanical connection structure between the circular component 442 and the inner wall of the processing groove 441, but retains a few connection points. Then, the cut PCB thin board 44 is conveyed by two transport components 42 to the limiting U-shaped frame 4. The component moves in one direction until the multiple cut circular components 442 are directly below the multiple pressing heads 413. At this time, the telescopic component 412 retracts, causing the two transport blocks 421 to move in opposite directions through the cooperation of the moving groove 4214 and the sliding block 4213, thus increasing the distance between the two transport blocks 421. At this time, the multiple transport wheels 4212 inside the transport blocks 421 clamp the PCB board 44. When the two transport blocks 421 move in opposite directions, the PCB board 44 at the pressing position is slightly stretched, improving the mechanical strength of the corresponding position of the PCB board 44. Then, the pressing component 411 drives the pressing head 413 to descend through electric drive, simultaneously pressing down the multiple pressing heads 413 directly below. The buffer elastic structure at the bottom of the pressing head 413 prevents damage to the circular components 442 during pressing. Compared to traditional technology, where manual pressing causes the circular components 442 to detach from the PCB sheet 44, resulting in the PCB sheet 44 being bent and prone to burrs and fiber tears at the edges when detached under bending stress, multiple circular components 442 detached from the PCB sheet 44 are fed into a fixed and highly protective collection structure through the feeding groove 5. Laser cutting can cut two rows of circular components 442 in one go, so another row of circular components 442 can be fed through the transport component 42. Then, the conveyed PCB sheet 44 is picked up and rotated.The two rows of uncut circular components 442 are inserted towards the limiting assembly 43, and the other two rows of circular components 442 are laser-cut to complete the entire processing.

[0037] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A laser processing apparatus for electrical components, comprising a machine base (1) and a movable stage (3) movably mounted on the machine base (1), wherein a processing table (4) is fixedly mounted above the movable stage (3), a processing frame (2) is fixedly mounted on the side of the machine base (1), and an intelligent laser cutting head (6) is mounted below the top of the processing frame (2), with the lower end of the intelligent laser cutting head (6) facing the processing table (4), characterized in that: The processing table (4) and the moving table (3) are provided with a material feeding chute (5) through the interior; A limiting U-shaped frame (41) and two transport components (42) are fixedly installed above the processing table (4). The two transport components (42) are within the coverage area of ​​the limiting U-shaped frame (41). Multiple limiting components (43) are also fixedly installed above the processing table (4). A PCB thin board (44) is placed inside the limiting component (43). The multiple limiting components (43) are used to limit the horizontal height of the PCB thin board (44). The PCB thin board (44) has multiple processing slots (441) inside, and circular components (442) are installed inside the multiple processing slots (441).

2. The laser processing apparatus for electrical material components according to claim 1, characterized in that: The transport component (42) includes a transport block (421), the transport block (421) has a transport trough (4211) inside, and multiple transport wheels (4212) are movably installed inside the transport trough (4211).

3. The laser processing apparatus for electrical material components according to claim 1, characterized in that: Multiple moving slots (4214) are provided below the transport block (421), and the multiple moving slots (4214) are provided above the processing table (4). Multiple sliding blocks (4213) are also fixedly installed below the transport block (421), and the multiple sliding blocks (4213) are slidably installed inside the moving slots (4214).

4. The laser processing apparatus for electrical material components according to claim 1, characterized in that: The limiting component (43) includes multiple limiting blocks (431), all of which are fixedly installed above the processing table (4), and the multiple limiting blocks (431) are arranged in a U-shape.

5. The laser processing apparatus for electrical material components according to claim 2, characterized in that: The limiting block (431) has a limiting groove (4311) inside, and the horizontal height of the center position of the limiting groove (4311) is consistent with the horizontal height of the center position of the transport trough (4211).

6. The laser processing apparatus for electrical material components according to claim 5, characterized in that: The limiting block (431) has multiple strip-shaped through grooves (4312) inside, and the multiple strip-shaped through grooves (4312) are connected to the corresponding limiting grooves (4311).

7. The laser processing apparatus for electrical material components according to claim 1, characterized in that: The limiting U-shaped frame (41) has multiple pressing components (411) fixedly installed inside, and the multiple pressing components (411) are all located above the corresponding circular component (442).

8. The laser processing apparatus for electrical material components according to claim 1, characterized in that: The limiting U-shaped frame (41) has two telescopic components (412) installed opposite each other inside. One end of the telescopic component (412) is fixedly connected to the inside of the limiting U-shaped frame (41), and the other end of the telescopic component (412) is connected to the back of the adjacent transport component (42).

9. The laser processing apparatus for electrical material components according to claim 7, characterized in that: The pressing assembly (411) is mounted with a pressing head (413) facing downward. When the pressing head (413) is in a retracted state, the lowest horizontal height of the pressing head (413) is higher than the horizontal height of the PCB board (44) above the processing table (4).

10. The laser processing apparatus for electrical material components according to claim 9, characterized in that: The lower end diameter of the pressure head (413) is smaller than the diameter of the processing groove (441), and the lower end of the pressure head (413) is provided with an elastic structure for buffering.

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