Adhesive sheet
By designing an adhesive sheet structure for the transmission and absorption layers, the problem of poor laser peelability during the transfer of electronic components in existing technologies has been solved, achieving efficient electronic component peeling and minimal adhesive residue. This method is suitable for the transfer of small electronic components such as miniLEDs and μLEDs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NITTO DENKO CORP
- Filing Date
- 2025-08-08
- Publication Date
- 2026-05-29
AI Technical Summary
Existing adhesive sheets are difficult to peel effectively using laser irradiation during the transfer of electronic components, especially when transferring small electronic components, which can easily lead to unnecessary peeling and glue residue.
The adhesive sheet employs a structure of a transmission layer and an absorption layer. The light transmittance of the transmission layer is above 50%, and the light transmittance of the absorption layer is below 5%. The transmission layer has a tensile elastic modulus above 0.1 MPa. The absorption layer is peeled off by generating strain through laser irradiation. The transmission layer contains hydroxyl-containing polymers and isocyanate crosslinking agents, and the absorption layer contains an active energy radiation-cured adhesive.
It enables effective stripping of electronic components under laser irradiation, avoiding unnecessary stripping and glue residue, and is suitable for the transfer of small electronic components, improving production efficiency and reducing costs.
Smart Images
Figure CN122104075A_ABST