A heat sink structure for reducing shell temperature and a lighting lamp having the same

Abstract

The application discloses a heat sink structure for reducing shell temperature and a lighting lamp thereof, which comprises a heat sink main body, a barrier wall structure, a convection guiding microstructure and an LED light source module; the heat sink main body is an integrated heat dissipation fin structure, the heat dissipation fins are uniformly distributed upwards along the bottom of the heat sink, and the gaps between the heat dissipation fins form a main air natural convection passage; the barrier wall structure is arranged at a convection flow field intersection point in the heat sink main body, divides the convection passage in the heat sink into upper and lower convection areas, and is provided with a through hole at a connecting position to enhance convection; the convection guiding microstructure is arranged on the upper and lower side surfaces of the barrier wall structure and the inner side surfaces of the heat dissipation fins of the heat sink main body, and is used for guiding air flow and strengthening heat exchange; and the LED light source module is fixedly attached to the bottom center of the heat sink main body and provides a heat source for the heat sink. The application divides the convection area and arranges the flow guiding microstructure, so that the heat dissipation efficiency and temperature uniformity of the heat sink are improved.

Description

Technical Field

[0001] This invention relates to the field of LED lighting technology, and in particular to a heat sink structure for reducing shell temperature and a lighting fixture thereof, which solves the problems of local high temperature, low heat dissipation efficiency and volume expansion caused by the convergence of hot airflow in traditional heat sinks. Background Technology

[0002] As LED lighting technology develops towards higher power, higher brightness, and miniaturization, the heat dissipation efficiency of luminaires has become a core bottleneck restricting their luminous efficiency, the lifespan of packaging materials, and the overall reliability of the equipment. Existing high-power LED luminaires generally employ an integrated heat sink fin structure, where heat dissipation relies on natural air convection for heat exchange: the heat generated by the LED light source is transferred to the heat sink fins through thermal conduction; the heat sink fins then exchange heat with the surrounding cool air through convection; the hot air, due to its lower density, naturally rises, while the cool air sinks to replenish the convection cycle.

[0003] In this traditional structure, the high-temperature hot airflow generated in the lower half of the heat sink (close to the thermal core area of ​​the LED light source) convections irregularly upwards along the gaps between the heat sink fins. This convection converges with the medium-temperature hot airflow that is not dissipated in time in the upper half, forming a convection field in the middle of the heat sink fins. This causes the heat in the upper half to accumulate and form a localized high-temperature zone. Currently, industry improvements to address this problem focus on heat conduction: such as increasing the heat dissipation area of ​​the heat sink fins, using metal materials with higher thermal conductivity, and increasing the thickness of the heat sink base. While these methods can improve basic heat dissipation capacity to some extent, they also lead to significant increases in cost, expansion of the lamp body volume, and a significant marginal effect on heat dissipation efficiency. Furthermore, they do not address the root cause of heat accumulation by controlling the airflow field through natural convection, making it difficult to completely eliminate localized high-temperature zones, resulting in limited heat dissipation optimization effects.

[0004] Meanwhile, existing technologies have also attempted to add simple baffles inside the radiator, but these only achieve heat diversion through physical barriers without taking into account the flow field characteristics of natural air convection in the structural parameter design. This results in problems such as increased convection resistance, increased flow field turbulence, and the baffle itself forming a new high-temperature zone, leading to poor heat dissipation optimization and further reducing the overall heat dissipation efficiency of the radiator. Summary of the Invention

[0005] To overcome the shortcomings of the prior art, the present invention provides a heat sink structure and its lighting fixture that reduce the shell temperature. By precisely controlling the flow field, the heat dissipation efficiency and temperature uniformity are significantly improved, while taking into account the requirements of cost and miniaturization.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A heat sink structure for reducing shell temperature and its lighting fixture, comprising a heat sink body, a baffle structure, a convection guiding microstructure, and an LED light source module;

[0008] The radiator body is an integrated heat dissipation fin structure. The heat dissipation fins are evenly distributed upward along the bottom of the radiator body, and the gaps between the heat dissipation fins form a main channel for natural air convection.

[0009] The baffle structure is located at the convection flow field intersection point inside the radiator body, dividing the internal convection channel of the radiator into two independent convection regions, upper and lower. A through hole is opened at the connection between the radiator body and the baffle structure to enhance convection.

[0010] The convection guiding microstructure is disposed on the upper and lower surfaces of the baffle structure and the inner surface of the heat dissipation fins of the radiator body, and is used to guide the orderly flow of air and enhance local heat exchange.

[0011] The LED light source module is attached and fixed to the bottom center of the heat sink body to provide a heat source for the heat sink body.

[0012] Furthermore, the height of the retaining wall structure is 60–100% of the height of the radiator body, the thickness is 2–3 mm, it is made of the same thermally conductive material as the radiator body, and it is seamlessly thermally connected to the inner wall of the radiator.

[0013] Furthermore, the convection guiding microstructure is a combination of arc-shaped flow guide patterns and rectangular heat dissipation bumps; the radius of curvature of the arc-shaped flow guide patterns is 5-8mm, designed along the natural air convection direction; the side length of the rectangular heat dissipation bumps is 2mm, the height is 1mm, the spacing between the bumps is 4-5mm, and they are evenly distributed between the arc-shaped flow guide patterns.

[0014] Furthermore, the heat sink body is made of ADC12 aluminum alloy die casting with a thermal conductivity of 108W / (m·K); the heat dissipation fin spacing is 8-12mm, and the matching ratio between the height of the heat sink body and the thermal power of the LED light source module is 100W / 10mm height; the inner wall of the heat sink body is a smooth thermally conductive surface with a thermal resistance ≤0.01K / W.

[0015] Furthermore, the retaining wall structure and the radiator body are integrally formed by die casting or welded together; when integrally formed by die casting, the forming temperature is 620-650℃, the pressure is 80-100MPa, and the holding time is 15-20s; when welded together, argon arc welding is used, the welding temperature is 380-420℃, and the welding current is 120-150A.

[0016] Furthermore, the thermal power of the LED light source module is 100-2000W, which is linearly matched with the structural parameters of the heat sink body.

[0017] Furthermore, the radiator forms two independent natural convection cycles: the high-temperature hot airflow in the lower region is blocked by the baffle wall, and then diffuses to the outside of the heat dissipation fins under the guidance of the convection guiding microstructure, and sinks back after heat exchange, forming an independent natural convection cycle in the lower region; the residual heat in the upper region is exchanged by the heat dissipation fins, and the hot airflow dissipates upward and the cold airflow sinks back, forming an independent natural convection cycle in the upper region.

[0018] Furthermore, the LED light source module includes a substrate, an LED light source array encapsulated on the substrate, an optical lens covering the LED light source array, and a driving power supply for supplying power to the LED light source array; the substrate is tightly bonded to the bottom center of the heat sink body through a thermally conductive interface material, and the difference between the thermal expansion coefficient of the substrate and the thermal expansion coefficient of the heat sink body material is no greater than 3.5 × 10⁻ 6 / K.

[0019] Furthermore, the driving power supply is fixedly installed using a thermally conductive insulating material, and the heat it generates is dissipated through the heat sink body. The total heat dissipation of the LED light source array and the driving power supply is linearly matched with the structural parameters of the heat sink body.

[0020] Furthermore, the heat sink structure includes any of the above-mentioned heat sink structures, which work together with the LED light source module to form two independent natural convection cycles, enabling orderly heat dissipation. This is suitable for high-power LED lighting scenarios with a full power range of 100–2000W, and the lamp housing temperature is reduced by 8-10℃ compared to traditional structures.

[0021] The present invention provides a heat sink structure for reducing shell temperature and a lighting fixture thereof, the advantages of which are:

[0022] This invention is based on the principle of natural air convection heat transfer. By precisely controlling the flow field, it achieves a significant improvement in heat dissipation efficiency and temperature uniformity. Specifically, by accurately locating the intersection of the convection flow fields, this invention sets up a baffle structure with scientific parameters inside the radiator, fundamentally dividing the heat dissipation space into two independent natural convection zones, thereby completely eliminating the problem of heat superposition caused by the convergence of hot airflows. This reduces the maximum temperature of the radiator by 8-10℃, improves the temperature distribution uniformity by more than 45%, and eliminates the generation of secondary high-temperature zones.

[0023] Meanwhile, the arc-shaped flow-guiding patterns and rectangular heat dissipation protrusions on the surface of the baffle structure work together to achieve blocking, flow guidance, and enhanced heat transfer. This not only guides the airflow in an orderly manner and reduces the flow field turbulence to 0.2-0.3, but also increases the local heat transfer area, ensuring that while blocking undesirable convection paths, the overall convection efficiency is synergistically improved, breaking through the technical bottleneck of increasing resistance with simple baffles.

[0024] All structural parameters of this invention are scientifically determined based on the principles of natural air convection and flow field simulation, possessing universality and adaptability to LED lighting fixtures across the entire power range of 100-2000W. This solution requires no changes to the overall dimensions and manufacturing process of the heat sink; it can be achieved simply by integrating the internal structure using mature die-casting or welding processes, resulting in a minimal increase in production costs (3-5%). It effectively resolves the design contradiction between the "high heat flux density" and "miniaturization" of high-power LEDs, while simultaneously offering excellent heat dissipation performance, superior mass production economics, and broad industrialization prospects. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present invention;

[0026] Figure 2 This is a longitudinal cross-sectional view of the heat sink body according to an embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram illustrating the retaining wall structure and convection guiding microstructure of an embodiment of the present invention;

[0028] Figure 4 This is a schematic diagram illustrating the internal convection circulation principle of the radiator structure during operation according to an embodiment of the present invention.

[0029] Figure 5 This is a schematic diagram of the overall exploded structure of an embodiment of the present invention;

[0030] Figure 6 This is a schematic diagram of the bottom structure of an embodiment of the present invention.

[0031] Explanation of reference numerals in the attached drawings: 1. Heat sink body; 11. Heat dissipation fins; 12. Through hole; 2. Baffle structure; 3. Convection guiding microstructure; 31. Arc-shaped flow guide pattern; 32. Rectangular heat dissipation bump; 4. LED light source module; 41. Substrate; 42. LED light source array; 43. Optical lens; 44. Waterproof ring; 45. Driver power supply; 46. Power supply bracket; 47. Lamp bracket; 5. Lower half of the convection area; 6. Upper half of the convection area; 7. Screw. Detailed Implementation

[0032] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0033] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0034] In the description of this invention, unless otherwise explicitly defined, terms such as "setting," "installing," and "connecting" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0035] like Figures 1-6 As shown, this embodiment provides a heat sink structure for reducing shell temperature and its lighting fixture, including a heat sink body 1, a baffle structure 2, a convection guiding microstructure 3, and an LED light source module 4.

[0036] In this embodiment, as Figure 1 , Figure 3 As shown, the radiator body 1 is an integrated heat dissipation fin structure 11, which is the basic carrier for heat conduction and convection heat transfer. It is made of ADC12 aluminum alloy by die casting, and its thermal conductivity is 108W / (m・K). Through optimized die casting process, near-zero defect manufacturing can be achieved, thereby improving product yield and structural stability. The heat dissipation fins 11 are evenly distributed upwards along the bottom of the radiator body, with a spacing of 8-12mm. This spacing is adapted to the width of the airflow field of natural convection, avoiding excessive convection resistance and the inability of hot airflow to flow smoothly due to an excessively narrow flow field, while avoiding low heat diffusion efficiency and insufficient heat transfer due to an excessively wide flow field. For example, low-power (100-500W) lamps can use a heat dissipation fin spacing of 8-9mm, while high-power (1500-2000W) lamps can use a heat dissipation fin spacing of 10-12mm, ensuring a balance between convection efficiency and heat transfer effect. The gaps between the heat dissipation fins 11 form a main channel for natural air convection, providing space for the exchange of hot and cold air.

[0037] In a preferred embodiment, the height of the heat sink body 1 and the thermal power matching ratio of the LED light source array 42 are 100W / 10mm height. That is, 100W power corresponds to 10mm height of the heat sink body 1, 500W power corresponds to 50mm height of the heat sink body 1, and 2000W power corresponds to 200mm height of the heat sink body 1. This matching ratio can ensure the basic convection space and heat exchange efficiency, and achieve full power range adaptation from 100-2000W. This avoids insufficient heat dissipation due to excessive power or insufficient height of the heat sink body 1, or excessive power or excessive height of the heat sink resulting in wasted volume.

[0038] like Figure 2 As shown, a through hole 12 is also provided on the radiator body 1 corresponding to the connection with the baffle structure 2. The through hole 12 is adapted to the baffle structure 2 to reduce air pressure by allowing heat convection to rise. Cold air can be supplemented through the through hole 12 to promote heat convection and enhance convection. For the upper convection region 6, the through hole 12 accelerates the air convection rate, thereby improving the heat dissipation effect. The inner wall of the radiator body 1 is set as a smooth thermally conductive surface with a surface roughness ≤ Ra1.6 to ensure close contact with the baffle structure 2 and high thermal conductivity, reducing heat loss during heat transfer. Its thermal resistance is ≤ 0.01 K / W, thereby ensuring that heat can be quickly transferred from the radiator body 1 to the baffle structure 2 and the heat dissipation fins 11.

[0039] like Figure 3 , Figure 4 As shown, the baffle structure 2 is the core convection control component. Its core function is to precisely block the convergence of hot airflow in the upper and lower regions, forming an upper convection region 6 and a lower convection region 5. Simultaneously, it achieves its own heat conduction and dissipation, preventing the formation of new heat accumulation points. Specifically, the baffle structure 2 is made of the same ADC12 aluminum alloy as the radiator body 1. The convection flow field convergence point of the radiator body 1, located at 40-60% of the height from the bottom of the radiator, is verified through flow field simulation to be the core convergence area for the upward convection of hot airflow from the LED light source module 4. Setting the baffle structure 2 can precisely block the convection path, thereby preventing the irregular superposition of hot airflow. For example, for an 80mm high radiator body 1, the baffle structure 2 is set at 32-48mm from the bottom, with the optimal blocking effect at 48mm (60% height), completely separating the upper convection region 6 and the lower convection region 5. The baffle structure 2 is seamlessly thermally connected to the inner wall of the radiator body 1.

[0040] In this embodiment, the connection method is die-casting integral molding and fixing. During die-casting integral molding, it is die-cast simultaneously with the radiator body 1. The molding temperature is 620-650℃, the pressure is 80-100MPa, and the holding time is 15-20s to ensure that the baffle and the radiator body 1 fit seamlessly and have good thermal conductivity continuity. The thermal resistance at the connection is ≤0.015K / W. When welding and fixing, argon arc welding process is adopted. The welding temperature is 380-420℃ and the welding current is 120-150A. After welding, grinding is performed to ensure that the connection is smooth and without gaps, avoiding thermal resistance caused by gaps and affecting the thermal conductivity efficiency. This achieves both physical separation of the upper convection area 6 and the lower convection area 5, and transfers the small amount of heat absorbed by itself to the radiator heat dissipation fins 11 through seamless thermal conductive connection, participating in natural convection heat dissipation. Thus, it achieves the dual effect of convection blocking and self-conducting heat dissipation, which is completely different from the ordinary baffles in the prior art that only serve as physical barriers and have no thermal conductivity function.

[0041] like Figure 4 As shown, the height of the baffle structure 2 is set to 60-100% of the height of the radiator body 1. If it is less than 60%, it cannot completely block the convergence of the convective flow fields, and some high-temperature hot air will still cross the baffle structure 2 and overlap with the warm air in the upper convection region 6. If it is more than 100%, it will excessively compress the convection space in the upper region, increase the convection resistance, and affect the dissipation of residual heat in the upper convection region 6. When the height of the baffle structure 2 is 80-90% of the height of the radiator body 1, the balance between the blocking effect and the convection efficiency is optimal.

[0042] The thickness of the retaining wall structure 2 is set to 2-3mm. This thickness can minimize the thermal resistance of the retaining wall structure 2 itself while ensuring the structural strength, and prevent the retaining wall structure 2 from becoming a new heat accumulation point. When the thickness is less than 2mm, the strength of the retaining wall structure 2 is insufficient and it is easy to deform. When the thickness is greater than 3mm, the thermal resistance of the retaining wall itself increases, and heat is easily accumulated to form local high temperature.

[0043] like Figures 1-4 As shown, the convection guiding microstructure 3 is disposed on the upper and lower surfaces of the baffle structure 2 and the inner surface of the heat dissipation fins 11 of the radiator body 1. The convection guiding microstructure 3 is an integrally formed structure of the baffle structure 2 and the heat dissipation fins 11, without additional assembly processes, which can reduce production complexity and cost while ensuring structural stability. Its core function is to guide the airflow to flow in an orderly manner along the natural air convection direction, reduce convection resistance, and improve convection heat transfer efficiency, thereby avoiding local overheating at the baffle position due to airflow obstruction, and achieving the effect of airflow guidance and heat transfer enhancement. The convection guiding microstructure 3 is a combination structure of arc-shaped flow guide patterns 31 and rectangular heat dissipation protrusions 32.

[0044] Specifically, the arc-shaped airflow guide 31 has a radius of curvature of 5-8mm and is designed in an arc shape along the direction of natural air convection (hot air rises and cold air sinks). This can guide the hot airflow to diffuse to the outside of the heat dissipation fins 11 and the cold airflow to flow back to the bottom of the heat sink, reducing airflow turbulence and convection resistance. Experimental verification shows that when the radius of curvature is 6-7mm, the airflow guiding effect is the best, which can reduce convection resistance by more than 40% and make the airflow more orderly.

[0045] The rectangular heat dissipation protrusions 32 have a side length of 2mm and a height of 1mm. The spacing between the rectangular heat dissipation protrusions 32 is 4-5mm, and they are evenly distributed among the arc-shaped flow guide patterns 31. The contact area between the baffle structure 2 and the heat dissipation fins 11 and the air is increased (the contact area is increased by 25-30% compared to the structure without protrusions), which enhances the local convection heat transfer efficiency, improves the heat dissipation capacity of the baffle structure 2, and avoids local overheating of the baffle structure 2. The size and spacing of the rectangular heat dissipation protrusions 32 are optimized by flow field simulation, which can maximize the heat transfer area without increasing the convection resistance.

[0046] like Figure 5 , Figure 6 As shown, the LED light source module 4 is a high-power LED light-emitting component, including a substrate 41, an LED light source array 42 encapsulated on the substrate 41, and an optical lens 43 covering the LED light source array 42. The LED light source module 4 also has an annular waterproof ring 44, which is locked and fixed by screws 7. The annular waterproof ring 44 is pressed between the optical lens 43 and the LED light source array 42 to form a waterproof seal. Specifically, the substrate 41, the LED light source array 42, and the optical lens 43 are integrally formed and fixed to the bottom center of the heat sink body 1. The integrally formed structure has a through hole in the middle that corresponds to the through hole 12 on the heat sink body 1 to enhance convection. The substrate 41 and the bottom center of the heat sink body 1 are tightly bonded by a thermally conductive interface material (thermal conductive grease, thermal conductivity 5.0 W / (m·K)), thereby ensuring that heat is quickly transferred to the heat sink body 1 through thermal conduction, providing a heat source for the heat sink body 1. The LED light source module 4 also includes a driving power supply for powering the LED light source array 42; the driving power supply is driven by a power supply bracket 45; 46 is fixedly mounted on the lamp bracket 47, and the power supply bracket 45 drives the power supply; 46 uses a thermally conductive insulating material (ceramic gasket, breakdown voltage not less than 10kV / mm), and the heat generated by it is dissipated through the heat sink body 1.

[0047] Specifically, the thermal power of the LED light source module 4 is linearly matched with the structural parameters of the heat sink body 1, and the adaptable thermal power is 100-2000W with no power adaptation limitation. LED light source components with corresponding power can be selected according to actual lighting needs without additional adjustments to the overall structure of the heat sink body 1. The difference between the thermal expansion coefficient of the substrate 41 and the thermal expansion coefficient of the heat sink body 1 is no greater than 3.5 × 10⁻⁻⁻⁶. 6 / K, to avoid gaps caused by thermal expansion and contraction, and to ensure stable thermal conductivity.

[0048] The core of the heat dissipation process of this invention is two independent natural convection cycles, which completely eliminate the superposition of hot airflow. The specific workflow is as follows:

[0049] When the LED light source module 4 is working, it generates a lot of heat, which is quickly transferred to the bottom of the heat sink body 1 and the heat sink fins 11 through the thermal conduction of the thermal grease, forming the heat core area of ​​the heat sink. The heat transfer efficiency is high and there is no obvious heat loss.

[0050] The heat dissipation fins 11 in the lower half of the radiator body 1 exchange heat with the surrounding cold air through convection. The resulting high-temperature hot airflow (temperature 30°C higher than the ambient temperature) flows upward along the gaps in the heat dissipation fins 11, and is precisely blocked at the baffle structure 2, preventing it from continuing to flow upward. At this time, guided by the arc-shaped guide pattern 31 on the lower side of the baffle, the high-temperature hot airflow diffuses to the outside of the heat dissipation fins 11, and after sufficient heat exchange with the outside cold air, the temperature decreases (down to near the ambient temperature), and sinks back to the bottom of the radiator along the inner side of the heat dissipation fins 11, forming an independent natural convection circulation in the lower half of the radiator. This achieves rapid heat dissipation from the core area, and the heat exchange efficiency is improved by more than 30% compared to the traditional structure.

[0051] The small amount of residual heat in the upper half of the radiator body 1 (mainly the heat conducted by the radiator body 1 itself) is transferred to the heat dissipation fins 11 through heat conduction, and convective heat exchange with the surrounding cold air. The hot air flows upward to the top of the radiator and is dissipated, while the cold air sinks to the upper side of the baffle wall and flows back under the guidance of the arc-shaped guide pattern 31 on the upper side of the baffle wall, forming a weak natural convection circulation in the upper half of the region, so as to achieve the orderly dissipation of residual heat and avoid the accumulation of heat in the upper half of the region.

[0052] During the process of blocking the hot airflow, the baffle structure 2 absorbs a small amount of heat from the high-temperature hot airflow. This heat is quickly transferred to the heat dissipation fins 11 of the heat sink through the seamless thermal connection between the baffle and the heat sink body 1. After the heat is dissipated through the rectangular heat dissipation protrusions 32 on the surface of the heat dissipation fins 11 to enhance convection heat transfer, it avoids local overheating of the baffle and ensures the long-term stable operation of the baffle structure 2. The upper and lower convection areas are independent of each other, with no hot airflow converging, eliminating heat accumulation from the source, achieving a uniform temperature distribution of the heat sink as a whole and a significant reduction in the maximum temperature, thereby reducing the junction temperature of the LED chip, improving luminous efficiency, and extending the service life of the lamp.

[0053] Based on the above process and the principle of natural air convection, this invention is further described in detail through embodiments of LED lamps with different power and comparative examples of existing technologies: All experiments were conducted under ambient temperature of 30℃ and natural convection conditions, and the test duration was until the heat sink reached thermal equilibrium (temperature fluctuation ≤ ±0.5℃ for 30 minutes). Specifically, the core test indicators include the maximum temperature of the heat sink (characterizing the shell temperature reduction effect), the standard deviation of temperature distribution (characterizing temperature uniformity, the lower the value, the better the uniformity), and the flow field turbulence (characterizing convection efficiency, the lower the value, the more orderly the convection and the higher the efficiency); the heat sink body 1 in all embodiments is made of ADC12 aluminum alloy die casting, and the die casting process parameters are: molding temperature 630℃, pressure 90MPa, and holding time 18s, to ensure product molding quality and improve yield; the LED light source modules 4 are all bonded with thermally conductive silicone grease with a thermal conductivity of 5.0W / (m·K).

[0054] Example 1: Optimization of heat dissipation structure for 1200W high-power LED lamps.

[0055] The heat sink body 1 is made of ADC12 aluminum alloy die casting, with a height of 80mm, a heat dissipation fin spacing of 10mm, a number of 20 heat dissipation fins 11, an inner wall surface roughness of Ra1.2, and a thermal resistance of 0.008K / W.

[0056] The retaining wall structure 2 is located 48mm from the bottom of the radiator (60% of the height, the convection flow field intersection point), with a height of 70mm (87.5%) and a thickness of 2mm. It is integrally formed by die casting with the inner wall of the radiator, with a seamless thermal conductive connection and a thermal resistance of 0.012K / W at the connection.

[0057] The convection guiding microstructure 3 has arc-shaped flow guiding patterns 31 (curvature radius 6mm) and rectangular heat dissipation protrusions 32 (side length 2mm, height 1mm, spacing 5mm) on the upper and lower surfaces of the baffle structure 2 and the inner side of the heat dissipation fins 11. The rectangular heat dissipation protrusions 32 are evenly distributed between the arc-shaped flow guiding patterns 31. The LED light source module 4 is a 1200W high-power LED, which is attached to the bottom center of the heat sink body 1.

[0058] Test Results

[0059] Test status Radiator maximum temperature Temperature distribution standard deviation Flow field turbulence Are there localized high-temperature zones? No additional retaining wall structure or convection guiding microstructure was added. 82℃ 8.2℃ 0.85 yes Add retaining wall structure and convection guiding microstructure 72℃ 4.5℃ 0.23 no

[0060] Results Analysis: The structure of this invention reduces the maximum temperature of the heat sink by up to 10℃, resulting in a significant reduction in shell temperature; the standard deviation of temperature distribution decreases from 8.2℃ to 4.5℃, and the uniformity of temperature distribution is improved by 45% ((8.2-4.5) / 8.2×100%≈45.1%), effectively solving the problem of local high temperature caused by heat accumulation in traditional structures; the flow field turbulence decreases from 0.85 to 0.23, significantly improving convection efficiency and making airflow more orderly; at the same time, the baffle structure 2 does not form new heat accumulation points, and the overall heat dissipation performance is stable, which is suitable for the heat dissipation requirements of 1200W high-power LED lamps and can be applied to medium and large-scale lighting scenarios such as industrial plants and outdoor squares.

[0061] Example 2: Optimization of heat dissipation structure for 800W high-power LED lamps.

[0062] The heat sink body 1 is made of ADC12 aluminum alloy die casting, with a height of 60mm, a heat dissipation fin spacing of 8mm, a number of 16 heat dissipation fins 11, an inner wall surface roughness of Ra1.4, and a thermal resistance of 0.009K / W.

[0063] The retaining wall structure 2 is located 36mm from the bottom of the radiator (60% of the height), with a height of 50mm (83.3%) and a thickness of 2mm. It is welded and fixed to the inner wall of the radiator using argon arc welding process, with a welding temperature of 400℃ and a welding current of 130A. After welding, it is ground and treated. The thermal resistance at the connection is 0.014K / W.

[0064] The convection guiding microstructure 3 has arc-shaped flow guiding patterns 31 (curvature radius 5mm) and rectangular heat dissipation protrusions 32 (side length 2mm, height 1mm, spacing 4mm) on the upper and lower surfaces of the baffle wall and the inner side of the heat dissipation fins 11; the LED light source module 4 is an 800W high-power LED, which is attached to the bottom center of the heat sink body 1.

[0065] Test Results

[0066] Test status Radiator maximum temperature Temperature distribution standard deviation Flow field turbulence Are there localized high-temperature zones? No additional retaining wall structure or convection guiding microstructure was added. 78℃ 7.5℃ 0.81 yes Add retaining wall structure and convection guiding microstructure 69℃ 3.7℃ 0.21 no

[0067] Results Analysis: The structure of this invention reduces the maximum temperature of the radiator by up to 9℃, with a significant reduction in shell temperature; the standard deviation of temperature distribution decreases from 7.5℃ to 3.7℃, and the uniformity of temperature distribution improves by 50% ((7.5-3.7) / 7.5×100%≈50.7%), eliminating localized high-temperature zones; the flow field turbulence is reduced to 0.21, significantly improving convection efficiency. The welded and fixed baffle structure 2 has a strong connection, good thermal conductivity, and is suitable for the heat dissipation requirements of the 800W power range. Furthermore, the welding process is simple, suitable for mass production, and can be applied to commercial lighting, medium-sized industrial equipment lighting, and other scenarios.

[0068] Example 3: Optimization of heat dissipation structure for 500W high-power LED lamps.

[0069] The heat sink body 1 is made of ADC12 aluminum alloy die casting, with a height of 50mm, a heat dissipation fin spacing of 9mm, a number of 12 heat dissipation fins 11, an inner wall surface roughness of Ra1.5, and a thermal resistance of 0.010K / W.

[0070] The retaining wall structure 2 is located 25mm from the bottom of the radiator (50% of the height), 40mm in height (80%), and 3mm in thickness. It is integrally formed with the inner wall of the radiator by die casting, with a seamless thermal conductive connection and a thermal resistance of 0.013K / W at the connection.

[0071] The convection guiding microstructure 3 has arc-shaped flow guiding patterns 31 (curvature radius 7mm) and rectangular heat dissipation protrusions 32 (side length 2mm, height 1mm, spacing 5mm) on the upper and lower surfaces of the baffle wall and the inner side of the heat dissipation fins 11; the LED light source module 4 is a 500W high-power LED, which is attached to the bottom center of the heat sink body 1.

[0072] Test Results

[0073] Test status Radiator maximum temperature Temperature distribution standard deviation Flow field turbulence Are there localized high-temperature zones? No additional retaining wall structure or convection guiding microstructure was added. 75℃ 6.8℃ 0.78 yes Add retaining wall structure and convection guiding microstructure 67℃ 3.2℃ 0.25 no

[0074] Results Analysis: The structure of this invention reduces the maximum temperature of the heat sink by up to 8℃, with a stable shell temperature reduction effect; the standard deviation of temperature distribution decreases from 6.8℃ to 3.2℃, and the temperature distribution uniformity improves by 53% ((6.8-3.2) / 6.8×100%≈52.9%); the flow field turbulence is reduced to 0.25, indicating good convection efficiency. In this embodiment, the heat sink height is only 50mm, making it small in size and balancing heat dissipation effect with miniaturization requirements. It is suitable for miniaturized high-power LED lamps with strict requirements on lamp body size, such as outdoor portable lighting, small industrial equipment lighting, and commercial window lighting.

[0075] Comparative Example: A standard baffle with no parameter design is added to the middle of the radiator.

[0076] The same 1200W LED lamp and heat sink body 1 as in Example 1 are used. A common aluminum alloy baffle with a thickness of 2mm and a height of 70mm is arbitrarily added to the middle of the heat sink body 1 (without convection guiding microstructure 3, not a convection flow field intersection point, simply spliced ​​with the inner wall of the heat sink, not a thermally conductive connection, with a gap at the connection, and a thermal resistance of 0.05K / W), simulating the improvement scheme of simply adding a baffle in the prior art.

[0077] Test Results

[0078] Test metrics numerical values Radiator maximum temperature 79℃ Reduction compared to the original structure 3℃ Local temperature at the baffle position 80℃ Temperature distribution standard deviation 7.8℃ Flow field turbulence 0.92

[0079] Results Analysis: The simple baffles in the prior art only achieve physical isolation, resulting in extremely poor heat dissipation optimization. The temperature reduction is only 3°C compared to the original structure, far lower than the 10°C reduction achieved in Embodiment 1 of this invention. Furthermore, the baffle itself creates a new local high-temperature zone (80°C), exceeding the overall maximum temperature of the radiator, further exacerbating the local overheating problem. Simultaneously, the baffle lacks a convection guidance structure, leading to increased convection resistance and improved flow field turbulence (from 0.85 to 0.92), which in turn reduces the overall convection efficiency of the radiator. This further proves that the baffle structure 2 of this invention is not a simple physical baffle as in the prior art, but rather a convection path control component based on the principle of natural air convection, featuring flow field intersection point positioning, precise structural parameter matching, and a convection guidance microstructure 3 design. There is a fundamental technical difference between the two, and the technical solution of this invention has significant inventiveness.

[0080] The barrier structure 2 is not a simple physical barrier in the prior art, but a convection path control component designed based on the principle of natural air convection, which locates the flow field intersection point, accurately matches structural parameters, and guides the convection microstructure 3. There is an essential technical difference between the two. The present invention solves the problem of heat superposition from the root, while the prior art can only achieve simple physical barriers and cannot achieve the same heat dissipation effect.

[0081] Through structural optimization, this invention reduces the maximum temperature of heat sinks for high-power LED lamps across the 100-2000W power range by 8-10°C, resulting in a significant reduction in shell temperature, improved temperature uniformity by over 45%, reduced flow field turbulence to 0.2-0.3, significantly improved convection efficiency, and the elimination of localized high-temperature zones. The optimized heat dissipation effect is stable and long-lasting. It requires no changes to the overall dimensions, materials, or manufacturing process of the heat sink body 1; it can be achieved simply by adding a baffle structure 2 and a convection-guiding microstructure 3 via die casting or welding. This facilitates mass production with a minimal cost increase (only 3-5%), solving the problems of high cost and large size associated with existing technologies. All structural parameters are determined based on the principles of natural air convection and flow field simulation, allowing for precise matching according to the thermal power of the LED light source. It is suitable for high-power LED lamps across the 100-2000W power range, exhibiting strong adaptability and meeting the heat dissipation needs of LED lighting products of different power and sizes.

[0082] The above is a description of a heat sink structure for reducing shell temperature and its lighting fixture according to the present invention, which is used to help understand the present invention; however, the implementation of the present invention is not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the principle of the present invention should be considered as equivalent substitutions and are included within the protection scope of the present invention.

Claims

1. A heat sink structure for reducing shell temperature and a lighting fixture thereof, characterized in that, This includes the heat sink body, the baffle structure, the convection guiding microstructure, and the LED light source module; The radiator body is an integrated heat dissipation fin structure. The heat dissipation fins are evenly distributed upward along the bottom of the radiator body, and the gaps between the heat dissipation fins form a main channel for natural air convection. The baffle structure is located at the convection flow field intersection point inside the radiator body, dividing the internal convection channel of the radiator into two independent convection regions, upper and lower. A through hole is opened at the connection between the radiator body and the baffle structure to enhance convection. The convection guiding microstructure is disposed on the upper and lower surfaces of the baffle structure and the inner surface of the heat dissipation fins of the radiator body, and is used to guide the orderly flow of air and enhance local heat exchange. The LED light source module is attached and fixed to the bottom center of the heat sink body to provide a heat source for the heat sink body.

2. The heat sink structure for reducing shell temperature and its lighting fixture according to claim 1, characterized in that, The height of the retaining wall structure is 60-100% of the height of the radiator body, and the thickness is 2-3mm. It is made of the same thermally conductive material as the radiator body and has a seamless thermally conductive connection with the inner wall of the radiator.

3. The heat sink structure for reducing shell temperature and its lighting fixture according to claim 1, characterized in that, The convection-guiding microstructure is a combination of arc-shaped flow guide patterns and rectangular heat dissipation bumps; the radius of curvature of the arc-shaped flow guide patterns is 5-8mm, designed along the natural air convection direction; the side length of the rectangular heat dissipation bumps is 2mm, the height is 1mm, and the spacing between the bumps is 4-5mm, evenly distributed between the arc-shaped flow guide patterns.

4. The heat sink structure for reducing shell temperature and its lighting fixture according to claim 1, characterized in that, The heat sink body is made of ADC12 aluminum alloy die casting with a thermal conductivity of 108W / (m·K); the heat sink fin spacing is 8-12mm, and the matching ratio between the height of the heat sink body and the heat power of the LED light source module is 100W / 10mm height; the inner wall of the heat sink body is a smooth heat-conducting surface with a thermal resistance ≤0.01K / W.

5. A heat sink structure for reducing shell temperature and its lighting fixture according to claim 1, characterized in that, The retaining wall structure and the radiator body are integrally formed by die casting or welded together. When integrally formed by die casting, the forming temperature is 620-650℃, the pressure is 80-100MPa, and the holding time is 15-20s. When integrally formed by welding, argon arc welding is used, the welding temperature is 380-420℃, and the welding current is 120-150A.

6. A heat sink structure for reducing shell temperature and a lighting fixture thereof according to claim 1, characterized in that, The thermal power of the LED light source module is 100-2000W, which is linearly matched with the structural parameters of the heat sink body.

7. A heat sink structure for reducing shell temperature and a lighting fixture thereof according to claim 1, characterized in that, The radiator forms two independent natural convection cycles: the high-temperature hot airflow in the lower region is blocked by the baffle wall, and then diffuses to the outside of the heat dissipation fins under the guidance of the convection guiding microstructure. After heat exchange, it sinks and flows back, forming an independent natural convection cycle in the lower region; the residual heat in the upper region is exchanged by the heat dissipation fins, and the hot airflow dissipates upward and the cold airflow sinks and flows back, forming an independent natural convection cycle in the upper region.

8. A heat sink structure for reducing shell temperature and a lighting fixture thereof according to claim 1, characterized in that, The LED light source module includes a substrate, an LED light source array encapsulated on the substrate, an optical lens covering the LED light source array, and a driving power supply for supplying power to the LED light source array; the substrate and the bottom center of the heat sink body are tightly bonded together through a thermally conductive interface material, and the difference between the thermal expansion coefficient of the substrate and the thermal expansion coefficient of the heat sink body material is no greater than 3.5 × 10⁻ 6 / K.

9. A heat sink structure for reducing shell temperature and a lighting fixture thereof according to claim 8, characterized in that, The driving power supply is fixedly installed through a thermally conductive insulating material, and the heat it generates is dissipated through the heat sink body. The total heat dissipation of the LED light source array and the driving power supply is linearly matched with the structural parameters of the heat sink body.

10. An LED lighting fixture, characterized in that, The device includes the heat sink structure described in any one of claims 1–9, wherein the LED light source module and the heat sink structure work together to form two independent natural convection cycles, thereby achieving orderly heat dissipation. It is suitable for high-power LED lighting scenarios with a full power range of 100–2000W, and the lamp housing temperature is reduced by 8-10℃ compared to traditional structures.

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