Modular universal thermoelectric multifunctional intelligent sensor

Abstract

The application discloses a kind of modular general thermoelectric multifunctional intelligent sensors, belong to sensor technical field.The sensor includes thin film thermoelectric sensing component, replaceable function module and data conditioning module and data processing unit.The thin film thermoelectric sensing component uses high-density P-N thermoelectric pair array based on micro-electro-mechanical system process as sensitive core, function module is connected with the hot end of thermoelectric sensing component in detachable mode, for converting the energy change caused by optical radiation, chemical reaction process or gas absorption process into thermal signal.Various function modules can be replaced to realize high-sensitivity monitoring of light intensity, reaction heat and gas concentration and other parameters.The application overcomes the problem of single function and low integration of existing thermoelectric sensors, has the advantages of strong universality, fast response speed, compact structure, etc., and is suitable for environmental monitoring, industrial process control and medical detection.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and in particular to a modular, universal thermoelectric multifunctional smart sensor. Background Technology

[0002] With the rapid development of the Internet of Things, wearable systems, and miniaturized smart devices, higher demands are being placed on integrated sensors capable of sensing multiple parameters within limited spaces. Sensors not only need to possess high sensitivity and fast response capabilities, but also should have a compact structure, low power consumption, and the ability to adapt to various application scenarios.

[0003] Thermoelectric sensors can directly convert temperature changes into electrical signals based on the Seebeck effect. They have advantages such as no external excitation required, simple structure, and high stability, and are widely used in temperature monitoring, gas detection, and optical radiation measurement. However, existing thermoelectric sensors are mostly designed for single application scenarios, and their functions are usually limited to the detection of temperature or specific gas parameters, making it difficult to meet the needs of complex systems for multifunctional and scalable monitoring.

[0004] Furthermore, traditional macroscopic thermoelectric devices, due to their low thermocouple density and large heat capacity, have limited response speed and sensitivity to minute temperature differences or transient thermal signals, making them unsuitable for precision monitoring scenarios such as weak light signals, microscale reaction heat, or low-concentration gas absorption. Although advancements in microelectromechanical systems (MEMS) technology have significantly improved the integration and response performance of thin-film thermoelectric devices, existing technologies mostly focus on single detection functions and lack a universal system architecture that can flexibly combine thin-film thermoelectric sensing cores with multiple detection requirements.

[0005] Therefore, there is an urgent need for a thermoelectric sensor system that is compact, highly sensitive, and flexibly configurable. Summary of the Invention

[0006] This invention provides a modular, universal thermoelectric multifunctional smart sensor to solve the aforementioned problems in the prior art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: A modular, universal, thermoelectric multifunctional smart sensor, comprising: The thermoelectric sensing unit, fabricated based on microelectromechanical systems (MEMS) technology, includes a substrate and a PN thermoelectric pair array consisting of multiple pairs of P-type and N-type thermoelectric pillars disposed on the substrate. The thermoelectric sensing unit has a hot end and a cold end. Temperature control components are connected to the cold end in hot contact. Replaceable functional modules are detachably connected to the hot end and are used to convert energy changes caused by optical radiation, chemical reactions or gas absorption into thermal signals. The data conditioning module is connected to the thermoelectric sensing unit; The data processing module is connected to the data conditioning module.

[0008] Furthermore, the thermoelectric sensing unit employs a heat flow perpendicular to the interface. The structure consists of a P-type thermoelectric column and an N-type thermoelectric column connected in series via a top electrode and a bottom electrode.

[0009] Furthermore, the thermoelectric sensing unit adopts an in-plane type where heat flow is transferred along the plane of the device. The structure consists of P-type and N-type thermoelectric columns connected by connecting electrodes to form an in-plane thermocouple array structure.

[0010] Furthermore, the number of PN thermocouples is three or more; The materials for P-type and N-type thermoelectric columns are selected from... , One or more of MgAgSb, PbTe, and Si-Ge alloys.

[0011] Furthermore, the temperature control component is used to stabilize the cold end temperature within a range close to the ambient temperature; The data conditioning module is used to amplify, filter, and suppress noise in the thermoelectric voltage signal output by the thermoelectric sensing unit. The data processing module is used to acquire, analyze, and calculate parameters of the conditioned signal, and output the monitoring results.

[0012] Furthermore, it also includes: An encapsulation layer, disposed above the PN thermocouple array, is made of one or more of polyimide, Parylene, or epoxy resin materials and is used to provide mechanical protection and environmental isolation for the internal thermoelectric pillars and electrode structure. The replaceable functional module can be detachably connected to the encapsulation layer of the thermoelectric sensing unit through at least one of the following methods: snap-fit ​​connection, magnetic connection, or plug-in connection, so as to achieve quick assembly and replacement of the module.

[0013] Furthermore, the replaceable functional module is an optical monitoring module, which includes a blackbody material; Incident light enters from above the optical monitoring module and irradiates the surface of the blackbody material. The blackbody material absorbs the incident light and converts the light energy into heat energy. The generated heat is conducted downward through the bottom of the module and transferred to the hot end through the thermal contact interface, causing the temperature of the hot end to rise.

[0014] Furthermore, the replaceable functional module is a reaction flow control module, which includes a reaction fluid inlet, a serpentine reaction chamber, a reaction fluid outlet, a reaction fluid inlet valve, and a reaction fluid outlet valve; After the reaction fluid enters the serpentine reaction chamber through the reaction fluid inlet, a chemical reaction occurs. The serpentine reaction chamber has an extended flow path to prolong the residence time of the reaction fluid. The exothermic or endothermic effect generated by the chemical reaction is transferred to the hot end through the bottom of the reaction flow control module, causing temperature changes. The reaction fluid inlet valve and reaction fluid outlet valve are used to regulate the flow rate of the reaction fluid and the reaction time.

[0015] Furthermore, the replaceable functional module is a gas detection module, which includes an adjustable light source, an air intake channel, an exhaust channel, and a blackbody material; The gas to be tested enters the gas detection module through the inlet channel to form a stable gas environment. The adjustable light source generates light of a specific wavelength that propagates inside the gas detection module. The gas to be tested absorbs the light, causing a change in the transmitted light energy. The changed transmitted light is absorbed by the blackbody material and converted into heat energy, which is transferred to the hot end. A temperature gradient is formed at both ends of the thermoelectric sensing unit to output the corresponding thermoelectric signal, thereby realizing the detection of the gas type and concentration. The detected gas is discharged through the exhaust channel.

[0016] Furthermore, the surface of the encapsulation layer is coated with a Parylene functional coating to improve resistance to gas permeation and chemical corrosion.

[0017] Compared with the prior art, the present invention has the following advantages: This invention, through a modular structural design, enables the monitoring of various functions, including optical, chemical reaction, and gas detection, by simply replacing functional modules while keeping the core thermoelectric sensing components unchanged. The system boasts strong versatility and high scalability. Employing thin-film thermoelectric devices and a high-density PN thermocouple array fabricated using microelectromechanical systems (MEMS) technology significantly improves thermoelectric conversion efficiency and signal sensitivity, enabling the detection of minute temperature differences and weak thermal signals. The thin-film structure effectively reduces the device's heat capacity and shortens the thermal response time, making it suitable for real-time monitoring of transient thermal signals and microscale reaction processes. The cold-end temperature control design minimizes the impact of ambient temperature fluctuations on measurement results, improving the system's measurement stability and repeatability. The compact overall structure facilitates integration and is suitable for various applications such as environmental monitoring, industrial process control, and medical testing. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the modular structure of a general-purpose thermoelectric sensor system in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the longitudinal thin-film thermoelectric sensing component in an embodiment of the present invention; Figure 3This is a schematic diagram of the structure of the in-plane thin-film thermoelectric sensing component in an embodiment of the present invention, wherein (a) is a cross-sectional view of the in-plane thin-film thermoelectric sensing component, and (b) is a schematic diagram of the PN thermoelectric column connection of the in-plane thin-film thermoelectric sensing component. Figure 4 This is a schematic diagram illustrating the working principle of the optical monitoring module configured in this embodiment of the invention; Figure 5 This is a schematic diagram of the microfluidic chemical reaction monitoring module configured in an embodiment of the present invention, wherein (a) is a top view of the microfluidic chemical reaction monitoring module and (b) is a cross-sectional view of the microfluidic chemical reaction monitoring module; Figure 6 This is a schematic diagram illustrating the working principle of a gas detection module based on the NDIR principle in an embodiment of the present invention.

[0019] In the diagram: 1 Optical monitoring module, 2 Reaction flow control module, 3 Gas detection module, 4 Thermoelectric sensing unit, 5 Temperature control component, 6 Data conditioning module, 7 Data processing module, 21 Top electrode, 22 Bottom electrode, 23 Substrate, 24 Encapsulation layer, 25 Snap-on, 26 N-type thermoelectric column, 27 P-type thermoelectric column, 31 P-type thermoelectric column (in-plane), 32 N-type thermoelectric column (in-plane), 33 Connecting electrode, 41 Incident light, 42 Blackbody material, 43 Snap-on, 51 Reaction fluid inlet, 52 Reaction fluid outlet, 53 Serpentine reaction chamber, 54 Reaction fluid inlet valve, 55 Reaction fluid outlet valve, 61 Adjustable light source, 62 Inlet channel, 63 Exhaust channel. Detailed Implementation

[0020] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0021] This invention provides a modular, universal thermoelectric multifunctional smart sensor, comprising: Thermoelectric sensing unit 4 is fabricated based on microelectromechanical systems (MEMS) technology. It includes a substrate and a PN thermoelectric pair array consisting of multiple pairs of P-type and N-type thermoelectric pillars disposed on the substrate. The thermoelectric sensing unit has a hot end and a cold end. Temperature control component 5 is connected to the cold end in hot contact; Replaceable functional modules are detachably connected to the hot end and are used to convert energy changes caused by optical radiation, chemical reactions or gas absorption into thermal signals. Data conditioning module 6 is connected to thermoelectric sensing unit 4; Data processing module 7 is connected to data conditioning module 6.

[0022] The following is a detailed description with reference to specific embodiments.

[0023] like Figure 1 As shown, this embodiment provides a modular universal thermoelectric multifunctional smart sensor, including a thermoelectric sensing unit 4, a temperature control component 5, a replaceable functional module, a data conditioning module 6, and a data processing module 7.

[0024] The thermoelectric sensing unit 4 is fabricated using microelectromechanical systems (MEMS) technology and includes a substrate and a PN thermoelectric pair array consisting of multiple pairs of P-type and N-type thermoelectric pillars disposed on the substrate. The number of PN thermoelectric pairs is 3 or more, preferably 10 or more, to improve thermoelectric conversion efficiency and signal sensitivity. The materials of the P-type and N-type thermoelectric pillars are selected from... , One or more of MgAgSb, PbTe, and Si-Ge alloys. In this embodiment, it is preferred to use... The base material has a high Seebeck coefficient and good thermoelectric properties.

[0025] The thermoelectric sensing unit 4 has a hot end and a cold end. The hot end is used for thermal contact connection with the replaceable functional module to receive the heat signal introduced by the functional module; the cold end is used for thermal contact connection with the temperature control component 5.

[0026] The temperature control component 5 is located on the cold end side of the thermoelectric sensing unit 4 and is in thermal contact with it. It is used to stabilize the cold end temperature within a range close to the ambient temperature, preferably within ±0.5℃ of the ambient temperature, thereby reducing the impact of ambient temperature fluctuations on the thermoelectric output signal and improving measurement stability and repeatability. In specific implementations, the temperature control component 5 can be implemented using a semiconductor cooling chip, a thermoelectric cooler, or a constant temperature water bath.

[0027] Data conditioning module 6 is electrically connected to thermoelectric sensing unit 4 and is used to amplify, filter, and suppress noise in the thermoelectric voltage signal output by thermoelectric sensing unit 4. Since the voltage signal output by thermoelectric sensing unit 4 is typically in the microvolt to millivolt range, data conditioning module 6 usually includes a preamplifier, a bandpass filter, and a low-noise amplifier circuit to improve signal quality and signal-to-noise ratio.

[0028] The data processing module 7 is connected to the data conditioning module 6 and is used to acquire, analyze, and calculate parameters of the conditioned signal, and output monitoring results. The data processing module 7 can be implemented using a microcontroller, digital signal processor, or field-programmable gate array, and has functions such as analog-to-digital conversion, digital filtering, feature extraction, and parameter calculation. In some embodiments, the data processing module 7 can also communicate with a host computer or cloud platform via wired or wireless means.

[0029] like Figure 2As shown, in a preferred embodiment, the thermoelectric sensing unit 4 employs a π-type structure with heat flow perpendicular to the interface. P-type thermoelectric pillars 27 and N-type thermoelectric pillars 26 are disposed on the substrate 23 and electrically connected in series via a top electrode 21 and a bottom electrode 22. In this structure, heat flow is transmitted along the height direction of the P-type thermoelectric pillars 27 and N-type thermoelectric pillars 26. When a temperature gradient is formed between the hot and cold ends, each PN thermoelectric pair generates a thermoelectric potential based on the Seebeck effect, and a measurable thermoelectric voltage signal is generated at the output terminal.

[0030] A thermoelectric sensing unit 4 has an encapsulation layer 24 disposed above the PN thermocouple array. The encapsulation layer 24 is made of one or more materials selected from polyimide (PI), Parylene, or epoxy resin, preferably polyimide. The encapsulation layer 24 has good thermal insulation properties, electrical insulation properties, and mechanical stability, and is used to provide mechanical protection and environmental isolation for the internal thermoelectric pillars and electrode structure, while ensuring the normal thermal response of the thermoelectric sensing unit 4. The thickness of the encapsulation layer 24 is preferably 5-50 micrometers, so as not to significantly increase the thermal resistance while ensuring protective performance.

[0031] In some embodiments, the surface of the encapsulation layer 24 may be coated with a Parylene functional coating to improve resistance to gas permeation and chemical corrosion. The Parylene coating thickness is preferably 1-10 micrometers, and it can be prepared by chemical vapor deposition to form a dense protective layer.

[0032] The replaceable functional module is detachably connected to the encapsulation layer 24 of the thermoelectric sensing unit 4 via at least one of the following methods: snap-fit ​​connection, magnetic connection, or plug-in connection, to enable quick assembly and replacement of the module. For example... Figure 2 As shown, a snap-fit ​​buckle 25 can be provided above the encapsulation layer 24, and the functional module is fixedly connected to the thermoelectric sensing unit 4 through a snap-fit ​​buckle connection. In other embodiments, a magnetic material layer can be provided on the surface of the encapsulation layer 24, and a corresponding magnetic adsorption structure can be provided at the bottom of the functional module to achieve connection through magnetic attraction; or a slot structure can be provided on the encapsulation layer 24, and the functional module can be connected to it through a plug-in connection.

[0033] like Figure 3 (a) and Figure 3 As shown in (b), in another embodiment, the thermoelectric sensing unit 4 adopts an in-plane type where heat flow is transferred along the plane of the device. The structure consists of a P-type thermoelectric pillar 31 and an N-type thermoelectric pillar 32 disposed on a substrate and electrically connected by a connecting electrode 33 to form an in-plane thermoelectric pair array structure. In this structure, heat flow is transferred along the plane of the device. When a temperature gradient is formed between the hot and cold ends, each PN thermoelectric pair generates a thermoelectric potential based on the Seebeck effect, and forms a measurable thermoelectric voltage signal at the output end. This structure is suitable for detecting in-plane temperature gradients or distributed thermal signals, and can improve the integration and space utilization efficiency of the device in some application scenarios.

[0034] The in-plane thermoelectric sensing unit 4 also has an encapsulation layer 24 above the thermoelectric column. The material, thickness, and functional coating of the encapsulation layer 24 are the same as those in the aforementioned embodiments. A snap-fit ​​buckle 25 can be provided above the encapsulation layer 24 for detachable connection with the functional module.

[0035] like Figure 4 As shown, in one application, the replaceable functional module is an optical monitoring module 1. The optical monitoring module 1 is located on the hot end side of the thermoelectric sensing unit 4 and is detachably connected to the thermoelectric sensing unit 4 via a snap-fit ​​43, thereby ensuring both module detachability and a stable thermal coupling path.

[0036] The optical monitoring module 1 includes a blackbody material 42. In operation, incident light 41 enters the module from above and illuminates the surface of the blackbody material 42. The blackbody material 42 efficiently absorbs the incident light 41, preferably with an absorption rate greater than 95%, and converts the absorbed light energy into heat energy. The blackbody material 42 can be one or more of the following: carbon black coating, copper oxide black, nickel-phosphorus alloy blackening layer, or multilayer nanostructured blackbody material.

[0037] The heat generated by the blackbody material 42 is conducted downwards through the bottom of the module and transferred to the hot end of the thermoelectric sensing unit 4 via the thermal contact interface, causing the temperature of the hot end to rise. A temperature gradient is formed between the hot and cold ends of the thermoelectric sensing unit 4, thereby generating a corresponding thermoelectric voltage signal. By measuring this thermoelectric voltage signal, the intensity of incident light can be monitored. This optical monitoring module is suitable for light intensity detection in different wavelength bands, including ultraviolet, visible, and near-infrared light.

[0038] like Figure 5 (a) and Figure 5 As shown in (b) of the diagram, in another application, the replaceable functional module is reaction flow control module 2. Reaction flow control module 2 includes a reaction fluid inlet 51, a serpentine reaction chamber 53, a reaction fluid outlet 52, a reaction fluid inlet valve 54, and a reaction fluid outlet valve 55.

[0039] The reaction fluid enters the serpentine reaction chamber 53 through the reaction fluid inlet 51 and undergoes a chemical reaction. The serpentine reaction chamber 53 has an extended flow path, preferably 10-100 mm in length, which effectively prolongs the residence time of the reaction fluid within the module and improves the detectability of heat release or absorption. The cross-sectional dimensions of the serpentine reaction chamber 53 are preferably 100-1000 micrometers to ensure sufficient reaction volume while enabling microfluidic operation.

[0040] The exothermic or endothermic effects generated during the chemical reaction are transmitted to the hot end of the thermoelectric sensing unit 4 through the bottom of the reaction flow control module 2, causing a change in the hot end temperature. For exothermic reactions, the hot end temperature rises; for endothermic reactions, the hot end temperature decreases. The thermoelectric sensing unit 4 converts this temperature change into a thermoelectric voltage signal output.

[0041] A reaction fluid inlet valve 54 is located at the reaction fluid inlet 51, and a reaction fluid outlet valve 55 is located at the reaction fluid outlet 52, used to regulate the flow rate of the reaction fluid and the reaction time. By controlling the opening of the inlet valve 54 and the outlet valve 55, the inflow rate of reactants, the reaction time, and the reaction conditions can be precisely controlled, thereby enabling the monitoring of different chemical reaction processes. After the reaction is completed, the reaction fluid is discharged through the reaction fluid outlet 52. This reaction flow control module is suitable for monitoring the thermal effects of various chemical reactions, such as enzymatic reactions, neutralization reactions, and redox reactions.

[0042] like Figure 6 As shown, in another application, the replaceable functional module is a gas detection module 3. The gas detection module 3 includes an adjustable light source 61, an air inlet channel 62, an exhaust channel 63, and a blackbody material 42.

[0043] The gas to be tested enters the gas detection module 3 through the inlet channel 62 and forms a stable gas environment within the module. The gas detection module 3 is equipped with a gas flow chamber, the volume of which is preferably 0.1-10 ml, in order to ensure a sufficient amount of gas sample while shortening the response time.

[0044] The adjustable light source 61 is used to generate light in a specific wavelength band and to propagate the light within the gas detection module 3. The adjustable light source 61 can be a light-emitting diode, a laser diode, or a thermal radiation source, and its wavelength can be selected according to the absorption characteristics of the gas to be measured. For example, for... For detection, an infrared light source in the 4.26-micron band can be used; for For detection, an infrared light source in the 3.3-micron band can be used.

[0045] Different gases have different absorption characteristics for light of specific wavelengths. According to the Lambert-Beer law, gas concentration is directly proportional to light absorption intensity, thus causing a change in the transmitted light energy. The changed transmitted light is ultimately absorbed by the blackbody material 42 located at the bottom of the module and converted into heat energy. The selection of the blackbody material 42 is the same as that in the optical monitoring module 1, preferably a material with high absorption rate.

[0046] The generated heat is transferred to the hot end of the thermoelectric sensing unit 4, creating a temperature gradient between the hot and cold ends of the unit. This generates a corresponding thermoelectric signal, enabling the detection of gas type and concentration. Higher gas concentrations result in stronger light absorption, lower transmitted light energy, less heat generated by the blackbody material 42, and a smaller thermoelectric signal. A quantitative relationship between the thermoelectric signal and gas concentration can be established using a calibration curve.

[0047] After the test is completed, the gas to be tested is discharged from the gas detection module 3 through exhaust channel 63. This gas detection module operates based on the principle of non-dispersive infrared (NDIR) and is suitable for... , CO It can detect the concentration of various gases, with detection limits down to the ppm level.

[0048] In practical applications, users can select the appropriate functional modules according to their monitoring needs. When light intensity monitoring is required, the optical monitoring module 1 is installed at the hot end of the thermoelectric sensing unit 4; when monitoring the heat of chemical reaction is required, it is replaced with the reaction flow control module 2; when detecting gas concentration is required, it is replaced with the gas detection module 3. The entire replacement process is simple and quick, without changing the configuration of the thermoelectric sensing unit 4, temperature control component 5, data conditioning module 6, and data processing module 7, greatly improving the system's versatility and flexibility.

[0049] The thermoelectric sensing unit 4, temperature control component 5, data conditioning module 6, and data processing module 7 can be integrated into a single structure via printed circuit board or flexible circuit board, forming a compact sensor platform. The size of the entire sensor system can be controlled at the centimeter level, facilitating deployment in various application scenarios.

[0050] The modular universal thermoelectric multifunctional intelligent sensor of the present invention achieves the goal of adapting a single sensor platform to multiple monitoring functions through modular design. It has the advantages of strong versatility, high sensitivity, fast response speed and compact structure, and is suitable for multiple fields such as environmental monitoring, industrial process control, medical testing and scientific research.

[0051] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from the spirit and scope of this invention.

Claims

1. A modular, universal thermoelectric multifunctional intelligent sensor, characterized in that, include: The thermoelectric sensing unit (4) is fabricated based on microelectromechanical systems technology, including a substrate and a PN thermoelectric pair array composed of multiple pairs of P-type thermoelectric pillars and N-type thermoelectric pillars disposed on the substrate. The thermoelectric sensing unit has a hot end and a cold end. Temperature control component (5) is in hot contact with the cold end; Replaceable functional modules are detachably connected to the hot end and are used to convert energy changes caused by optical radiation, chemical reactions or gas absorption into thermal signals. The data conditioning module (6) is connected to the thermoelectric sensing unit (4); The data processing module (7) is connected to the data conditioning module (6).

2. The modular universal thermoelectric multifunctional intelligent sensor according to claim 1, characterized in that: The thermoelectric sensing unit (4) adopts heat flow perpendicular to the interface. The P-type thermoelectric column (27) and the N-type thermoelectric column (26) are electrically connected through the top electrode (21) and the bottom electrode (22) to form a series structure.

3. The modular universal thermoelectric multifunctional intelligent sensor according to claim 1, characterized in that: The thermoelectric sensing unit (4) adopts an in-plane type where heat flow is transferred along the plane of the device. The P-type thermoelectric column (31) and N-type thermoelectric column (32) are electrically connected through connecting electrode (33) to form an in-plane thermoelectric pair array structure.

4. The modular universal thermoelectric multifunctional intelligent sensor according to claim 1, characterized in that: The number of PN thermocouples is 3 or more; The materials for P-type and N-type thermoelectric columns are selected from... , One or more of MgAgSb, PbTe, and Si-Ge alloys.

5. The modular universal thermoelectric multifunctional intelligent sensor according to claim 1, characterized in that: Temperature control components are used to stabilize the cold end temperature within a range close to ambient temperature; The data conditioning module is used to amplify, filter, and suppress noise in the thermoelectric voltage signal output by the thermoelectric sensing unit. The data processing module is used to acquire, analyze, and calculate parameters of the conditioned signal, and output the monitoring results.

6. The modular, universal thermoelectric multifunctional intelligent sensor according to claim 1, characterized in that, Also includes: The encapsulation layer (24), disposed above the PN thermocouple array, is made of one or more of polyimide, Parylene or epoxy resin materials, and is used to provide mechanical protection and environmental isolation for the internal thermocouple pillars and electrode structure. The replaceable functional module can be detachably connected to the encapsulation layer of the thermoelectric sensing unit through at least one of the following methods: snap-fit ​​connection, magnetic connection, or plug-in connection, so as to achieve quick assembly and replacement of the module.

7. The modular universal thermoelectric multifunctional intelligent sensor according to claim 1, characterized in that: The replaceable functional module is an optical monitoring module (1), which includes a blackbody material (42); Incident light (41) enters from above the optical monitoring module and irradiates the surface of the blackbody material. The blackbody material absorbs the incident light and converts the light energy into heat energy. The generated heat is conducted downward through the bottom of the module and transferred to the hot end through the thermal contact interface, causing the temperature of the hot end to rise.

8. The modular universal thermoelectric multifunctional intelligent sensor according to claim 1, characterized in that: The replaceable functional module is a reaction flow control module (2), which includes a reaction fluid inlet (51), a serpentine reaction chamber (53), a reaction fluid outlet (52), a reaction fluid inlet valve (54), and a reaction fluid outlet valve (55). After the reaction fluid enters the serpentine reaction chamber through the reaction fluid inlet (51), a chemical reaction occurs. The serpentine reaction chamber has an extended flow path to prolong the residence time of the reaction fluid. The exothermic or endothermic effect generated by the chemical reaction is transmitted to the hot end through the bottom of the reaction flow control module (2), causing temperature changes. The reaction fluid inlet valve (54) and the reaction fluid outlet valve (55) are used to regulate the flow rate and reaction time of the reaction fluid.

9. The modular universal thermoelectric multifunctional intelligent sensor according to claim 1, characterized in that: The replaceable functional module is a gas detection module (3), which includes an adjustable light source (61), an air intake channel (62), an exhaust channel (63), and a blackbody material (42). The gas to be tested enters the gas detection module through the air intake channel to form a stable gas environment. The adjustable light source (61) generates light of a specific wavelength that propagates inside the gas detection module (3). The gas to be tested absorbs the light, causing the transmitted light energy to change. The changed transmitted light is absorbed by the blackbody material and converted into heat energy, which is transferred to the hot end. A temperature gradient is formed at both ends of the thermoelectric sensing unit (4) to output the corresponding thermoelectric signal, thereby realizing the detection of the gas type and concentration. The detected gas is discharged through the exhaust channel (63).

10. The modular universal thermoelectric multifunctional intelligent sensor according to claim 6, characterized in that: The surface of the encapsulation layer (24) is coated with a Parylene functional coating to improve resistance to gas permeation and chemical corrosion.

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