Foldable electronic device

Abstract

A foldable electronic device of the present application includes a first housing, a second housing, a hinge structure coupled to the first housing and the second housing, a hinge housing in which the hinge structure is disposed, a first dustproof structure and a second dustproof structure disposed between the first housing and the hinge housing, and a first support structure disposed between the first dustproof structure and the second dustproof structure in a longitudinal direction of the hinge housing, wherein the first dustproof structure and the first support structure can be in contact with each other or can be spaced apart from each other by a distance less than a length of the first support structure, the second dustproof structure and the first support structure can be in contact with each other or can be spaced apart from each other by a distance less than the length of the first support structure, and at least a portion of each of the first dustproof structure and the second dustproof structure can be in contact with a first portion of an outer surface of the hinge housing in an unfolded state or a folded state of the electronic device.

Description

[0001] This application is a divisional application of patent application No. 202480012106.5, filed on June 20, 2024, entitled "Multiple structures and foldable electronic devices including the thereof". Technical Field

[0002] The embodiments of this disclosure described herein relate to multiple structures and foldable electronic devices including the multiple structures. Background Technology

[0003] Portable electronic devices (such as smartphones) can offer a variety of functions and calling capabilities based on various types of applications. In providing these functions, portable electronic devices can output a screen corresponding to each function. Users may want to use a wider screen when using various functions. However, in typical portable electronic devices, when the display is enlarged to show the screen, the overall size increases, thus degrading portability. Therefore, foldable portable electronic devices are being developed to increase screen size while maintaining portability. Summary of the Invention

[0004] Technical issues Foldable electronic devices typically include at least one folding axis through which the device can be folded. Possibly, the foldable electronic device includes a first housing, a second housing, and a hinge structure coupled to the first and second housings. The foldable electronic device can be configured to fold about the hinge structure. When the foldable electronic device is folded, its components need to move relative to each other (e.g., about the folding axis in the hinge structure). Therefore, it may be difficult to maintain a seal around the hinge structure and within the hinge structure to prevent contaminants such as dust and other particles from entering the electronic device at the hinge structure.

[0005] Because contaminants can interfere with the function of electronic devices, for example by obstructing airflow or creating unwanted conductivity between components, it is desirable to prevent contaminants from entering the electronic devices. Therefore, it is desirable to prevent contaminants from entering foldable electronic devices via the hinge structure.

[0006] Furthermore, if, when a foldable electronic device is folded, one or more components of the device move in an unintended manner, causing at least one component to be out of position relative to another component, a portion of the foldable electronic device may experience unexpected or unintended deformation. This deformation can damage the components of the foldable electronic device, especially if it occurs repeatedly. Therefore, it is desirable that, when a foldable electronic device is folded, its components move in an intended manner and remain in their intended positions.

[0007] Technical solution A foldable electronic device (or portable electronic device, portable communication device, or foldable electronic device with communication function) according to at least one embodiment of the present disclosure includes: a first housing; a second housing; a hinge structure coupled to the first housing and the second housing; a hinge housing wherein the hinge structure is disposed; a first dustproof structure and a second dustproof structure disposed between the first housing and the hinge housing; and a first support structure disposed between the first dustproof structure and the second dustproof structure in the longitudinal direction of the hinge housing. According to at least one embodiment of the present disclosure, the first dustproof structure and the first support structure are in contact with each other or spaced apart by a distance less than the length of the first support structure. According to at least one embodiment of the present disclosure, the second dustproof structure and the first support structure are in contact with each other or spaced apart by a distance less than the length of the first support structure.

[0008] A foldable electronic device according to at least one embodiment of the present disclosure includes: a first housing; a second housing; a hinge structure coupled to the first housing and the second housing; a hinge housing that accommodates at least a portion of the hinge structure and is substantially disposed between the first housing and the second housing; at least one first structure disposed between an inner surface of the first housing and an outer surface of the hinge housing and at least partially in contact with a first portion of the outer surface of the hinge housing while the foldable electronic device changes from an unfolded state to a folded state; and at least one second structure disposed between the inner surface of the first housing and the outer surface of the hinge housing to be adjacent to the first structure and at least partially in contact with a second portion of the outer surface of the hinge housing, different from the first portion, while the foldable electronic device changes from an unfolded state to a folded state. Attached Figure Description

[0009] Figure 1 This is a view showing the unfolded state of an electronic device according to an embodiment.

[0010] Figure 2 This illustrates an embodiment. Figure 1 A view of the folded state of an electronic device.

[0011] Figure 3 This is an exploded perspective view of a portable communication device or electronic device according to an embodiment.

[0012] Figure 4 This is an exploded perspective view showing the construction of several structures installed in an electronic device according to an embodiment.

[0013] Figure 5 This is a view illustrating examples of several structures according to embodiments.

[0014] Figure 6 This is a view showing the unfolded state of an electronic device comprising multiple structures according to an embodiment.

[0015] Figure 7 This is a view showing the folded state of an electronic device comprising multiple structures according to an embodiment.

[0016] Figure 8 This is a view illustrating examples of a first and a second structure of an electronic device according to an embodiment.

[0017] Figures 9a to 9f This is a view showing the dustproof structure and support structure of an electronic device according to an embodiment.

[0018] Figure 10 This is a view showing an example of the width of the dustproof structure and support structure of an electronic device according to an embodiment.

[0019] Figure 11 The dustproof structure and support structure according to an embodiment are shown.

[0020] Figure 12 This is a view illustrating an example of the height relationship between the dustproof structure and the support structure according to an embodiment.

[0021] Figure 13 This is a view illustrating a support structure included in an electronic device according to an embodiment.

[0022] Figure 14 This is a view illustrating an example of the assembly process between the first housing and the support structure of an electronic device according to an embodiment.

[0023] Figure 15 This is a view illustrating an example of a method for manufacturing an electronic device according to an embodiment.

[0024] Figure 16 A view of the support structure according to an embodiment is shown.

[0025] Figure 17 This is a view illustrating the assembly process of the support structure including the channel and the first housing according to an embodiment.

[0026] Figure 18 This is a view illustrating the assembly process of the support structure and the first housing including the guide recess according to an embodiment.

[0027] Figure 19 This is a view illustrating an electronic device according to an embodiment, including a support structure that is slidably assembled to a housing.

[0028] Figure 20 This is a view illustrating an electronic device according to an embodiment, including a support structure that is slidably assembled to a housing.

[0029] Figure 21This is a view illustrating an electronic device according to an embodiment, including a support structure that is slidably assembled to a housing.

[0030] Figure 22 This is a view illustrating an example of the sliding operation of a support structure assembled with a first housing for an electronic device according to an embodiment. Detailed Implementation

[0031] In the following description, at least one embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0032] Embodiments of this disclosure provide multiple structures having a support structure and a dustproof structure, and a foldable electronic device including the multiple structures. A dustproof structure is a structure that prevents some or most or all dust, particles, contaminants, or foreign matter from passing through. The dustproof structure included in the electronic device can prevent some or most or all dust, particles, contaminants, or foreign matter from entering the electronic device through specific pathways that are at least partially blocked by the dustproof structure.

[0033] Embodiments of this disclosure provide a plurality of structures for maintaining a constant gap between each of a first housing and a second housing and a hinge housing by means of a support structure in close contact with a dustproof structure, and a foldable electronic device including the plurality of structures.

[0034] A support structure can be arranged between components of the foldable electronic device, such as between a first housing or a second housing and a hinge housing or hinge structure. When the first housing or second housing is pushed towards the hinge housing or hinge structure, the support structure can resist the movement of the first housing or second housing toward the hinge housing or hinge structure.

[0035] Embodiments of this disclosure provide a plurality of structures for preventing or reducing the infiltration of external foreign matter between the hinge housing and / or between the dustproof structure and the support structure by bringing the dustproof structure into close contact with the support structure, and a foldable electronic device including the plurality of structures.

[0036] The foldable electronic device according to embodiments of this disclosure may include multiple structures. Technology related to the dustproof structure among these multiple structures is disclosed in Korean Patent Publication No. 10-2021-0047139 (published on April 29, 2021, entitled "Electronic Device Including Dustproof Structure"; inventor Hee-cheol MOON), first filed by the applicant. As described in Korean Patent Publication No. 10-2021-0047139, the foldable electronic device may include a dustproof structure to prevent or reduce the ingress of external foreign objects.

[0037] In the detailed description of this disclosure, various other aspects and effects provided by the various structures according to various embodiments and electronic devices including the various structures may be mentioned in light of the embodiments.

[0038] Figure 1 This is a view showing the unfolded state of an electronic device 100 according to an embodiment of the present disclosure. Figure 2 This illustrates an embodiment according to the present disclosure. Figure 1 A view of the folded state of the electronic device 100.

[0039] In the detailed description below, a configuration in which a pair of housings are joined by a hinge structure for rotatability will be shown. However, it should be noted that this embodiment does not limit the portable communication device or electronic device according to various embodiments of this disclosure. For example, a portable communication device or electronic device according to various embodiments of this disclosure may include two or more housings, and the term "pair of housings" in the embodiments disclosed below may mean "two housings of two or more housings joined together for rotatability."

[0040] Reference Figure 1 Electronic device 100 (or foldable electronic device, portable electronic device, portable communication device, or portable device) may include a hinge structure (e.g., Figure 3The hinge structure 164a is rotatably coupled relative to a pair of housings 110 and 120 folded together, a hinge housing 165 covering foldable portions of the pair of housings 110 and 120, and a display 130 (e.g., a flexible display or a foldable display) disposed or housed in the space formed by the pair of housings 110 and 120. The hinge housing 165 may be located between at least a portion of the first housing 110 and at least a portion of the second housing 120. The hinge structure 164a may be disposed between the display 130 and the hinge housing 165 and may be connected to the first housing 110 and the second housing 120. In an embodiment, the electronic device 100 may include a foldable housing coupled to be rotatable from a position where the pair of housings 110 and 120 are folded together facing each other to a position where the pair of housings 110 and 120 are unfolded and arranged side-by-side. In this disclosure, when a pair of housings 110 and 120 are unfolded and arranged side by side, the surface on which the display 130 is disposed can be defined as the front surface of the electronic device 100, and the surface opposite to the front surface can be defined as the rear surface of the electronic device 100. Additionally, the surface surrounding the space between the front and rear surfaces can be defined as the side surface of the electronic device 100.

[0041] In an embodiment, a pair of housings 110 and 120 may include a first housing 110 having a sensor region 131d, a second housing 120, a first rear cover 140, and a second rear cover 150. The pair of housings 110 and 120 of the electronic device 100 are not limited to... Figure 1 and Figure 2 The forms and combinations shown can be achieved through combinations and / or combinations of other shapes or components. For example, in an embodiment, the first housing 110 and the first rear cover 140 may be integrally formed with each other, and the second housing 120 and the second rear cover 150 may be integrally formed with each other. In an embodiment, the first housing 110 may include the first rear cover 140, and the second housing 120 may include the second rear cover 150.

[0042] According to an embodiment, the first housing 110 and the second housing 120 may be disposed on opposite sides of a first axis (e.g., folding axis A) and may have a completely symmetrical shape with respect to folding axis A. In an embodiment, the first housing 110 and the second housing 120 may rotate about different folding axes relative to hinge structure 164a or hinge housing 165. For example, the first housing 110 and the second housing 120 may be coupled to hinge structure 164a or hinge housing 165 to be rotatable. According to an embodiment, by rotating about folding axis A or different folding axes, the first housing 110 and the second housing 120 may rotate between a position where two different regions of the front surface are folded to face each other, a position where the two different regions are tilted relative to each other, or a position where the two different regions are unfolded to be arranged side by side.

[0043] As used herein, the expressions "side-by-side positioning" or "side-by-side extension" can mean that two structures are positioned at least partially close to each other or that at least the portions of the structures positioned close to each other are arranged in parallel. In embodiments, the expression "side-by-side arrangement" can mean that two structures are positioned close to each other and are arranged facing a parallel or identical direction. In embodiments, the expression "side-by-side arrangement" can be interpreted as having the meaning of including a state in which two structures are tilted relative to each other in the range of approximately 160 degrees to approximately 180 degrees. In the detailed description below, expressions such as "side-by-side" and "parallel" may be used. However, these expressions can be readily understood with reference to the accompanying drawings based on the shape or arrangement of the structures.

[0044] According to embodiments, the angle or distance between the first housing 110 and the second housing 120 can vary depending on whether the electronic device 100 is in an unfolded (flat or open) state, a folded (closed) state, or an intermediate state. According to embodiments, unlike the second housing 120, the first housing 110 may additionally include a sensor region 131d in which various sensors are disposed. However, the first housing 110 and the second housing 120 may have symmetrical shapes in other areas. In embodiments, the sensor region 131d may be additionally disposed in at least a portion of the second housing 120, or may be replaced by at least a portion of the second housing 120.

[0045] In an embodiment, the first housing 110 may be connected to a hinge structure (e.g., Figure 3 The hinge structure 164a may include a first surface 111 facing the front surface of the electronic device 100 in the unfolded state, a second surface 112 facing away from the first surface 111, and a first side member 113 surrounding at least a portion of the space between the first surface 111 and the second surface 112. In embodiments, the first side member 113 may include a first side surface 113a disposed parallel to the folding axis A, a second side surface 113b extending from one end of the first side surface 113a in a direction perpendicular to the folding axis A, and a third side surface 113c extending from the opposite end of the first side surface 113a in a direction perpendicular to the folding axis A. In describing various embodiments of the present disclosure, the expressions “parallel” or “perpendicular” are used with respect to the arrangement relationship between the side surfaces described above. However, in some embodiments, the expressions “parallel” or “perpendicular” may include the meanings of “partially parallel” or “partially perpendicular” or “substantially parallel” or “substantially perpendicular”. In embodiments, the expressions “parallel” or “perpendicular” may have the meaning of including an inclined arrangement relationship in a range of about 10 degrees or less.

[0046] In an embodiment, the second housing 120 may be connected to a hinge structure (e.g., Figure 3 The hinge structure 164a may include a third surface 121 facing the front surface of the electronic device 100 in the unfolded state, a fourth surface 122 facing away from the third surface 121, and a second side member 123 surrounding at least a portion of the space between the third surface 121 and the fourth surface 122. In an embodiment, the second side member 123 may include a fourth side surface 123a disposed parallel to the folding axis A, a fifth side surface 123b extending from one end of the fourth side surface 123a in a direction perpendicular to the folding axis A, and a sixth side surface 123c extending from the opposite end of the fourth side surface 123a in a direction perpendicular to the folding axis A. In an embodiment, the third surface 121 may be configured to face the first surface 111 in the folded state. In an embodiment, although there may be minor differences in specific shape, the second side member 123 may have a substantially the same shape as the first side member 113 or may be formed of a substantially the same material as the first side member 113.

[0047] In an embodiment, the electronic device 100 may include a receiving portion 101 formed to accommodate a display 130 by means of the structural shapes of a first housing 110 and a second housing 120. The receiving portion 101 may have substantially the same dimensions as the display 130. In an embodiment, due to the sensor region 131d, the receiving portion 101 may have two or more different widths W1 and W2 in a direction perpendicular to the folding axis A. For example, the receiving portion 101 may have a first width W1 between a first portion 120a of the second housing 120 parallel to the folding axis A and a first portion 110a of the first housing 110 formed at the periphery of the sensor region 131d, and a second width W2 formed by a second portion 120b of the second housing 120 and a second portion 110b of the first housing 110 that does not correspond to the sensor region 131d and is parallel to the folding axis A. In this case, the second width W2 may be greater than the first width W1. For example, the receiving portion 101 may have a first width W1 between the first portion 110a of the first housing 110 and the first portion 120a of the second housing 120, which are asymmetrical in shape, and a second width W2 between the second portion 110b of the first housing 110 and the second portion 120b of the second housing 120, which are symmetrical in shape. In embodiments, the first portion 110a and the second portion 110b of the first housing 110 may have different distances from the folding axis A. The width of the receiving portion 101 is not limited to the example shown. In embodiments, the receiving portion 101 may have two or more different widths due to the shape of the sensor region 131d or the asymmetrical portions of the first housing 110 and the second housing 120.

[0048] In one embodiment, at least a portion of the first housing 110 and at least a portion of the second housing 120 may be formed of a metallic or non-metallic material having a selected degree of rigidity to support the display 130. In another embodiment, at least a portion of the first housing 110 and at least a portion of the second housing 120 may include a conductive material. When the first housing 110 and the second housing 120 include conductive materials, the electronic device 100 can use the portions of the first housing 110 and the second housing 120 formed of conductive materials to transmit and receive radio waves. For example, a processor or communication module of the electronic device 100 can use a portion of the first housing 110 and a portion of the second housing 120 to perform wireless communication.

[0049] In an embodiment, sensor region 131d may have a specific area adjacent to a corner of the first housing 110. However, the arrangement, shape, or size of sensor region 131d is not limited to the example shown. For example, in an embodiment, sensor region 131d may be located in another corner of the first housing 110 or in any area between an upper and lower corner of the first housing 110. In an embodiment, sensor region 131d may be located in at least a portion of the second housing 120. In an embodiment, sensor region 131d may be configured to extend into both the first housing 110 and the second housing 120. In an embodiment, electronic device 100 may include components exposed on the front surface of electronic device 100 through sensor region 131d or through one or more openings formed in sensor region 131d, and may perform various functions through these components. Components located in sensor region 131d may include at least one of, for example, a front-facing camera device, a proximity sensor, an illumination sensor, an iris recognition sensor, an ultrasonic sensor, or an indicator.

[0050] In one embodiment, a first rear cover 140 may be disposed on a second surface 112 of a first housing 110 and may have a generally rectangular periphery. In another embodiment, the periphery of the first rear cover 140 may be at least partially surrounded by the first housing 110. Similarly, a second rear cover 150 may be disposed on a fourth surface 122 of a second housing 120, and at least a portion of the periphery of the second rear cover 150 may be surrounded by the second housing 120.

[0051] In the illustrated embodiment, the first rear cover 140 and the second rear cover 150 may have a shape that is substantially symmetrical with respect to the folding axis A. In the embodiment, the first rear cover 140 and the second rear cover 150 may include a variety of different shapes. In the embodiment, the first rear cover 140 may be integrally formed with the first housing 110, and the second rear cover 150 may be integrally formed with the second housing 120.

[0052] In embodiments, the first rear cover 140, the second rear cover 150, the first housing 110, and the second housing 120 can be configured to provide space for various components of the electronic device 100 (e.g., printed circuit boards, antenna modules, sensor modules, or batteries) to be disposed therein. In embodiments, one or more components may be disposed on or visually exposed on the rear surface of the electronic device 100. For example, one or more components or sensors may be visually exposed through a first rear region 141 of the first rear cover 140. In embodiments, sensors may include proximity sensors, rear camera devices, and / or flash. In embodiments, at least a portion of the sub-display 152 may be visually exposed through a second rear region 151 of the second rear cover 150.

[0053] The display 130 can be disposed in the space formed by a pair of housings 110 and 120. For example, the display 130 can be disposed in a receiving portion formed by a pair of housings 110 and 120 (e.g., Figure 1 The receiving portion 101 can be configured to substantially occupy a large portion of the front surface of the electronic device 100. For example, the front surface of the electronic device 100 may include a display 130, a portion of the first housing 110 adjacent to the display 130 (e.g., a peripheral region), and a portion of the second housing 120 adjacent to the display 130 (e.g., a peripheral region). In an embodiment, the rear surface of the electronic device 100 may include a first rear cover 140, a portion of the first housing 110 adjacent to the first rear cover 140 (e.g., a peripheral region), a second rear cover 150, and a portion of the second housing 120 adjacent to the second rear cover 150 (e.g., a peripheral region).

[0054] In an embodiment, display 130 may refer to a display whose at least a portion is deformable into a flat or curved shape. In an embodiment, display 130 may include a folding portion 131c, a first portion 131a disposed on one side of the folding portion 131c (e.g., on the right side of the folding portion 131c), and a second portion 131b disposed on the opposite side of the folding portion 131c (e.g., on the left side of the folding portion 131c). For example, the first portion 131a may be disposed on a first surface 111 of the first housing 110, and the second portion 131b may be disposed on a third surface 121 of the second housing 120. For example, display 130 may span... Figure 3 The hinge housing 165 or hinge structure 164a extends from the first surface 111 to the third surface 121, and at least a portion (e.g., folding portion 131c) corresponding to the hinge housing 165 or hinge structure 164a may be a flexible portion capable of deforming from a flat shape to a curved shape.

[0055] In this embodiment, the division of the display 130 into regions is illustrative, and the display 130 may be divided into multiple regions (e.g., four or more regions or two regions) depending on its structure or function. For example, in Figure 1 In the embodiment shown, the folding portion 131c can be on a vertical axis parallel to the folding axis A (e.g., Figure 3 The display 130 extends in the direction of the y-axis, and the display 130 can be divided into regions by the folding portion 131c or the folding axis A. However, in an embodiment, the display 130 may extend relative to another folding portion (e.g., with respect to the horizontal axis (e.g., the y-axis), and the display 130 may be divided into regions by the folding portion 131c or the folding axis A. Figure 3 The folded portion parallel to the x-axis or another folded axis (e.g., parallel to the x-axis). Figure 3 The x-axis parallel to the folding axis is divided into regions. The region division of the display 130 described above is achieved solely through a pair of housings 110 and 120 and a hinge structure (e.g., Figure 3 The physical division is achieved by a hinge housing 165 or hinge structure 164a, and essentially a display 130 can be set in a configuration consisting of a pair of housings 110 and 120 and a hinge structure (e.g., Figure 3 The hinge housing 165 or hinge structure 164a) provides an area or space in which a full screen can be displayed.

[0056] According to an embodiment, the first portion 131a and the second portion 131b may have shapes that are completely symmetrical to each other with respect to the folded portion 131c. However, unlike the second portion 131b, the first portion 131a may include a notched region providing the sensor region 131d (e.g., Figure 3 The first portion 131a may have a shape symmetrical to that of the second portion 131b in the notched region 133, and in other regions, the first portion 131a may have a shape symmetrical to that of the second portion 131b. For example, the first portion 131a and the second portion 131b may include portions whose shapes are symmetrical to each other and portions whose shapes are asymmetrical to each other.

[0057] Further reference Figure 3 The hinge housing 165 can be disposed between the first housing 110 and the second housing 120 and can conceal internal components (e.g., Figure 3 (Hinge structure 164a). In embodiments, depending on the operating state of the electronic device 100 (e.g., unfolded or folded), the hinge housing 165 may be hidden by a portion of the first housing 110 or a portion of the second housing 120, or it may be exposed to the outside. For example, the hinge housing 165 may be more exposed to the outside in the folded state than in the unfolded state.

[0058] In the following text, the operation of the first housing 110 and the second housing 120, as well as the area of ​​the display 130, will be described according to the operating state of the electronic device 100 (e.g., unfolded state and folded state).

[0059] In an embodiment, when the electronic device 100 is in an unfolded state (e.g., Figure 1 When the first housing 110 and the second housing 120 are in the same state, they can form an angle of 180 degrees, and the first portion 131a and the second portion 131b of the display 130 can be set to face the same direction, for example, to display images in a direction parallel to each other. In addition, the folding portion 131c can form the same plane as the first portion 131a and the second portion 131b.

[0060] In an embodiment, when the electronic device 100 is in a folded state (e.g., Figure 2 When the electronic device 100 is in a folded state (e.g., when the device is in a folded state), the first housing 110 and the second housing 120 can be positioned facing each other. Figure 2 When the electronic device 100 is in a folded state (e.g., when it is in a folded state), the first portion 131a and the second portion 131b of the display 130 can form a narrow angle (e.g., an angle between 0 and 10 degrees) and can face each other. Figure 2 When in the state of folding, at least a portion of the folded portion 131c can form a curved surface with a specific curvature.

[0061] In an embodiment, when the electronic device 100 is in an intermediate state, the first housing 110 and the second housing 120 can be configured to form a specific angle, such as 90 degrees or 120 degrees. For example, in the intermediate state, the first portion 131a and the second portion 131b of the display 130 can form an angle larger than that in the folded state and smaller than that in the unfolded state. At least a portion of the folded portion 131c can form a curved surface with a specific curvature. In this case, the curvature can be smaller than that in the folded state.

[0062] Figure 3 This is an exploded perspective view of a portable communication device or electronic device 100 according to an embodiment of the present disclosure.

[0063] Reference Figure 3 In an embodiment, the electronic device 100 may include a display 130, a support component assembly 160, at least one printed circuit board 170, a first housing 110, a second housing 120, a first rear cover 140, and a second rear cover 150. In this disclosure, the display 130 may be referred to as a display module or display assembly.

[0064] The display 130 may include a display panel 131 (e.g., a flexible display panel) and at least one plate 132 or layer thereon on which the display panel 131 is disposed. In an embodiment, the plate 132 may be disposed between the display panel 131 and the support member assembly 160. The display panel 131 may be disposed on one surface of the plate 132 (e.g., Figure 3 On at least a portion of the surface facing the Z direction. The plate 132 may be formed in a shape corresponding to the display panel 131. For example, a portion of the plate 132 may be formed in a shape corresponding to the recessed area 133 of the display panel 131.

[0065] The support member assembly 160 may include a first support member 161, a second support member 162, a hinge structure 164a disposed between the first support member 161 and the second support member 162, a hinge housing 165 covering the hinge structure 164a when viewed from the outside, and wiring members (e.g., flexible printed circuit board (FPCB)) intersecting the first support member 161 and the second support member 162. In an embodiment, the support member assembly 160 may include a first hinge plate 164b mounted on the first support member 161 and a second hinge plate 164c mounted on the second support member 162. In an embodiment, the wiring members may be disposed in a direction intersecting the first support member 161 and the second support member 162 (e.g., the x-axis direction). The wiring members may be hidden by the first hinge plate 164b or the second hinge plate 164c and may not be shown. Figure 3 middle.

[0066] According to an embodiment, a first hinge plate 164b can be installed inside a first housing 110, and a second hinge plate 164c can be installed inside a second housing 120. In an embodiment, the first hinge plate 164b can be directly installed on a first support member 161, and the second hinge plate 164c can be directly installed on a second support member 162. In an embodiment, the first hinge plate 164b (or the second hinge plate 164c) can be directly installed on another structure (e.g., a first rotary support surface 114 or a second rotary support surface 124) inside the first housing 110 (or the second housing 120). For example, the structure inside the first housing 110 (or the second housing 120) on which the first hinge plate 164b (or the second hinge plate 164c) is mounted can vary according to the embodiment. In an embodiment, a hinge structure 164a can be installed on the first hinge plate 164b and the second hinge plate 164c, and the second hinge plate 164c can be rotatably connected to the first hinge plate 164b. For example, folding axes (e.g., Figure 1The folding axis A can be formed by the hinge structure 164a, and the first housing 110 and the second housing 120 (or the first support member 161 and the second support member 162) can rotate substantially relative to each other about the folding axis A.

[0067] In an embodiment, the support member assembly 160 may be disposed between the board 132 and at least one printed circuit board 170. For example, a first support member 161 may be disposed between a first portion 131a of the display 130 and the first printed circuit board 171. A second support member 162 may be disposed between a second portion 131b of the display 130 and the second printed circuit board 172.

[0068] As mentioned above, at least one printed circuit board 170 may include a first printed circuit board 171 disposed on one side of the first support member 161 and a second printed circuit board 172 disposed on one side of the second support member 162. The first printed circuit board 171 and the second printed circuit board 172 may be disposed in the space formed by the support member assembly 160, the first housing 110, the second housing 120, the first rear cover 140 and the second rear cover 150. Components for implementing various functions of the electronic device 100 may be disposed on the first printed circuit board 171 and the second printed circuit board 172.

[0069] In an embodiment, the first housing 110 and the second housing 120 may be assembled together to be coupled to opposite sides of the support member assembly 160 while the display 130 is coupled to the support member assembly 160. The first housing 110 and the second housing 120 may be slidably coupled to opposite sides of the support member assembly 160, for example, a first support member 161 and a second support member 162. In some embodiments, the first support member 161 and the second support member 162 may be substantially housed within the first housing 110 and the second housing 120 and may be interpreted as part of the first housing 110 and the second housing 120, respectively.

[0070] In an embodiment, the first housing 110 may include a first rotary support surface 114, and the second housing 120 may include a second rotary support surface 124 corresponding to the first rotary support surface 114. The first rotary support surface 114 and the second rotary support surface 124 may include curved surfaces corresponding to curved surfaces included in the hinge housing 165.

[0071] In an embodiment, when the electronic device 100 is in an unfolded state (e.g., Figure 1When the electronic device 100 is in a folded state (e.g., when the device is in a folded state), the first rotary support surface 114 and the second rotary support surface 124 can cover the hinge housing 165, such that the hinge housing 165 is not exposed or is minimally exposed on the rear surface of the electronic device 100. In an embodiment, when the electronic device 100 is in a folded state (e.g., when the device is in a folded state), the first rotary support surface 114 and the second rotary support surface 124 can cover the hinge housing 165, such that the hinge housing 165 is not exposed or is minimally exposed on the rear surface of the electronic device 100. Figure 2 When in the state of (the first rotational support surface 114 and the second rotational support surface 124), the first rotational support surface 114 and the second rotational support surface 124 can rotate along the curved surface included in the hinge housing 165, so that the hinge housing 165 is maximally exposed on the rear surface of the electronic device 100.

[0072] In the detailed description above, ordinal numbers such as first and second are used to simply distinguish components such as the first housing 110, the second housing 120, the first side member 113, and the second side member 123. However, it should be noted that this disclosure is not limited to the description of ordinal numbers. For example, although the sensor region 131d is shown as formed in the first housing 110, the sensor region 131d may be formed in the second housing 120 or may be formed in both the first housing 110 and the second housing 120. Although the first rear region 141 and the sub-display 152 are shown as respectively disposed on the first rear cover 140 and the second rear cover 150, the first rear region 141 for arranging the sensor and the sub-display 152 for outputting the image may both be disposed on one of the first rear cover 140 and the second rear cover 150.

[0073] The following detailed description can be referenced as needed. Figures 1 to 3 Electronic device 100. In describing the following embodiments, components that are the same as those in the prior embodiments or that can be readily understood from the prior embodiments will be given the same reference numerals or will not be given reference numerals, and their detailed descriptions will also be omitted.

[0074] According to an embodiment, the electronic device 100 may include a plurality of structures 210, 310, 220, and 320 disposed between the hinge housing 165 and the first housing 110 or the second housing 120. According to an embodiment, the plurality of structures may include at least one first structure 210, at least one second structure 310, at least one third structure 220, and at least one fourth structure 320.

[0075] At least one of the first structure 210 or the third structure 220 may be a structure that prevents or reduces the infiltration of foreign matter in the form of solid particles (such as dust or debris) or liquid. For example, the first structure 210 and the third structure 220 may be dustproof structures (or cleaners or fiber structures) that prevent or reduce the infiltration of foreign matter in the form of solid particles or liquid into the electronic device 100.

[0076] At least one of the second structure 310 or the fourth structure 320 may be a structure that maintains a gap between at least one of the first housing 110 or the second housing 120 and the hinge housing 165. For example, the second structure 310 may be a support structure (or partition or gap-retaining member) that maintains the gap between the first housing 110 and the hinge housing 165, and the fourth structure 320 may be a support structure (or partition or gap-retaining member) that maintains the gap between the second housing 120 and the hinge housing 165. At least one of the second structure 310 or the fourth structure 320 may be formed of a material with lubricating properties and may provide abrasion resistance and smooth operation suitable for the folding life determined by repeated folding and unfolding operations of electronic devices. The second structure 310 and the fourth structure 320 may be formed of non-polar materials with low surface energy and lubricating properties. For example, the second structure 310 and the fourth structure 320 may be formed of resins such as POM, UHMWPE, PTFE, and / or PEEK.

[0077] According to an embodiment, the first structure 210 may be in contact with the second structure 310 or may be spaced apart from the second structure 310 by a distance less than the length of the second structure 310. The third structure 220 may be in contact with the fourth structure 320 or may be spaced apart from the fourth structure 320 by a distance less than the length of the fourth structure 320.

[0078] According to embodiments, at least one of the first structure 210, the second structure 310, the third structure 220, or the fourth structure 320 may be formed of an elastic material, capable of accumulating elastic force while being compressed by elastic force, and capable of returning to its initial shape without the application of external force. For example, the second structure 310 and the fourth structure 320 may include elastic materials and may suppress or mitigate noise or wear caused by friction during operation of the electronic device.

[0079] Figure 4 This is an exploded perspective view showing the construction of several structures installed in an electronic device according to an embodiment.

[0080] Reference Figure 4 The electronic device 100 (or foldable electronic device, portable electronic device, portable communication device or portable device) according to the embodiment may include a first housing 110, a second housing 120, a first structure 210, a second structure 310, a third structure 220 and a fourth structure 320.

[0081] The first housing 110 may include a hinged housing (e.g., Figure 2 and Figure 3The first mounting portion 401 corresponds to the outer circumferential surface of the hinge housing 165. When viewed from the Z-axis direction to the -Z-axis direction, the first mounting portion 401 may have a concave shape. The first mounting portion 401 may be along the folding axis A (e.g., Figure 1 The folding axis A) is formed elongatedly. Depending on the hinge operation of the hinge structure (or the folding operation of the electronic device), the first mounting portion 401 may overlap with at least a portion of the hinge housing and have a constant gap between them, or it may be positioned adjacent to the hinge housing. At least one first structure 210 and at least one second structure 310 may be disposed in at least a portion of the first mounting portion 401.

[0082] The second housing 120 may include a second mounting portion 402 corresponding to the outer circumferential surface of the hinge housing. When viewed from the z-axis direction to the -z-axis direction, the second mounting portion 402 may be concave. The second mounting portion 402 may be along the folding axis A (e.g., Figure 1 The folding axis A) is formed elongatedly. Depending on the hinge operation of the hinge structure (or the folding operation of the electronic device), the second mounting portion 402 may overlap with at least a portion of the hinge housing and have a constant gap between them, or it may be positioned adjacent to the hinge housing. At least one third structure 220 and at least one fourth structure 320 may be disposed in at least a portion of the second mounting portion 402.

[0083] Figure 5 This is a view illustrating an example of a first structure according to an embodiment. Figure 5 In the middle, drawing <501> This is a view showing an example of a three-dimensional diagram of the first structure, drawn. <502> This is a view showing an example of the state of the fiber member of the first structure before it is pressed, and a drawing. <503> This is a view showing an example of the state in which the fiber member of the first structure is pressed.

[0084] Reference Figure 5 such as drawing <501> , <502> and <503> As shown, the first structure (or the third structure 220) may include a fiber member 212 (or a fiber bundle or a ciliary member) and a matrix member 211.

[0085] The matrix component 211 may be formed of, for example, plastic, polymer, and / or fiber, and may have a plate shape with a constant thickness. The fiber component 212 may be woven and arranged in a specific pattern on the matrix component 211. The matrix component 211 may have a width parallel to the X-axis and a length parallel to the Y-axis (or folding axis).

[0086] According to an embodiment, an adhesive component (e.g., double-sided tape or liquid adhesive material) can be disposed on the bottom of the base component 211, and the base component 211 can be fixed to the first placement portion (e.g., Figure 4 The first installation part 401) and the second installation part (e.g., Figure 4 The second resettlement section 402).

[0087] The fiber member 212 may be composed of multiple components, each component comprising multiple fibers, and the components may be inserted into recesses or holes 213 arranged in a specific pattern in the matrix member 211. A component may be fixedly inserted into a recess or hole 213. Each component may include a specific number of fibers, and the components may include the same or similar number of fibers. According to embodiments, the number of fibers constituting each component may vary depending on the size, shape, or pattern arrangement of the recess or hole 213. At least a portion of the lower end of the component of the fiber member 212 may be inserted into the matrix member 211 or may protrude downward from the matrix member 211. The pattern of the recess or hole 213 in which the component of the fiber member 212 is fixedly inserted may have various arrangements, including zigzag pattern arrangements, matrix or lattice arrangements, mixtures of lattice arrangements and zigzag patterns, random arrangements, and / or linear arrangements. According to embodiments, the pattern of the recess or hole 213 may include an embossed pattern.

[0088] At least a portion of the fiber member 212 can be fixed to the matrix member 211, and the remaining portion of the component can be arranged upward (in the Z-axis direction) relative to the upper surface of the matrix member 211. The lower portion of the fiber member 212 (e.g., the portion relatively close to the matrix member 211) can be fixedly inserted while concentrating on one side of a recess or hole 213 formed in the matrix member 211, and the upper portion of the fiber member 212 (e.g., the portion relatively far from the matrix member 211) can be arranged with irregular gaps from adjacent fibers. According to an embodiment, the recesses or holes 213 of the matrix member 211 can be spaced apart from each other at intervals that allow the fibers included in the fiber member 212 to contact each other in the longitudinal direction (e.g., the Y-axis direction) of the matrix member 211. The upper surface of the fiber member 212 can have a constant height. Because the lower part of the fiber member 212 is concentrated in the matrix member 211 and the upper part of the fiber member 212 is dispersed, the fiber member 212 can be set in the shape of an inverted cone (a shape with the wide face facing upward).

[0089] As in drawing <502> As shown, the first structure 210 described above can be configured to have a constant height in the upward direction relative to the base member 211. Thereafter, the first structure 210 can be disposed in the first mounting portion (or the second mounting portion), and the hinge housing (e.g., Figure 2 and Figure 3 The hinge housing 165 can be placed on the first structure 210. For example, as shown in the drawing. <503> As shown, at least a portion of the first structure 210 may have at least a portion of its upper surface bent (the fibers of the fiber member 212 are bent according to the height difference H1-H2). Even if the upper part of the fiber member 212 of the first structure 210 is bent, the space between the fibers can be closed when the fibers of the fiber member 212 are intertwined, and the space between the hinge housing 165 and the first mounting portion can be closed. Therefore, even if the space between the first mounting portion and the hinge housing 165 is deformed according to the hinge operation of the hinge housing 165, the deformed space can be closed by the first structure 210, and thus the infiltration of foreign objects from the outside can be prevented or reduced. The height of the fiber member 212 can vary according to the size of the space between the hinge housing 165 and the first mounting portion. The number of fibers constituting the component of the fiber member 212 can be selected such that after the first structure 210 is mounted in the first mounting portion, the fibers are pressed by the hinge housing and the space between the fibers is closed. In addition, the number of fibers constituting a component can vary according to the thickness (or diameter) of the fibers. Alternatively, the material, elasticity, and diameter of the fibers can be determined such that the fiber member 212 retains its original shape even if the hinge operation of the electronic device 100 is performed more than a specified number of times (e.g., more than 20,000 times), and the number of fibers concentrated in a recess or hole 213 can be determined accordingly. For example, at least one of various fibers, including synthetic fibers, natural fibers, optical fibers, and / or glass fibers, can be used as the fibers of the fiber member 212, and mixed fibers can be used as needed.

[0090] Figure 6 This is a view showing the unfolded state of an electronic device according to an embodiment. Figure 6 In the middle, drawing <601> It is shown Figure 1 A view showing the unfolded state of the electronic device. Figure 6 In the middle, drawing <602> It shows along Figure 1 A view of an example cross-section of an electronic device, intercepted by line B1-B1'. For example, a drawing. <602> This is an example view showing a cross-section obtained by cutting into the location where the dustproof structure of an electronic device is positioned. Figure 6 In the middle, drawing <603> It shows along Figure 1 A view of an example cross-section of an electronic device, intercepted by line B2-B2'. For example, a drawing. <603> This is an example view showing a cross-section obtained by cutting the support structure of an electronic device at the designated location.

[0091] Reference Figure 6The electronic device 100 may include a first housing 110, a second housing 120, a hinge housing 165, a display 130, a first structure 210, and a second structure 310.

[0092] The first housing 110 may include a first mounting portion 401 and a first mounting protrusion 611. The first mounting protrusion 611 may project in the Z-axis direction. The first mounting protrusion 611 may be located at the folding axis (e.g., Figure 1 The folding axis A) and / or the arrangement direction of the plurality of first structures 210 and / or the arrangement direction of the plurality of second structures 310 are formed elongatedly. The first mounting portion 401 may be configured to be adjacent to the first mounting protrusion 611, and thus the first mounting protrusion 611 may restrict the position of the first structure 210 and the second structure 310 mounted in the first mounting portion 401.

[0093] The second housing 120 may include a second mounting portion 402 and a second mounting protrusion 612. The second mounting protrusion 612 may project in the Z-axis direction. The second mounting protrusion 612 may be located at the folding axis (e.g., Figure 1 The second mounting portion 402 is formed elongatedly in the arrangement direction of the folding axis A and / or the arrangement direction of the plurality of second structures 310 and / or the arrangement direction of the plurality of fourth structures 320. The second mounting portion 402 may be configured to be adjacent to the second mounting protrusion 612, and thus the second mounting protrusion 612 may restrict the position of the second structures 310 and the fourth structures 320 mounted in the second mounting portion 402.

[0094] When the electronic device 100 is in the unfolded (open) state, the display 130 can have a substantially flat state. The display 130 can be disposed in the space formed by the first housing 110 and the second housing 120. A plurality of structures 210, 310, 220 and 320 can be disposed below the hinge housing 165 covering the foldable portion of the first housing 110 and the second housing 120. The first structure 210 and the second structure 310 can be disposed between the hinge housing 165 and the first housing 110. The third structure 220 and the fourth structure 320 can be disposed between the hinge housing 165 and the second housing 120.

[0095] When the electronic device 100 is in the unfolded (open) state, a portion of the outer surface (or rear surface or exterior) of the hinge housing 165 (e.g., the surface facing the -Z axis direction) can be placed on the first structure 210 and the third structure 220. When the electronic device 100 is in the unfolded (open) state, the first structure 210 can be disposed on the inner surface (or front surface, interior, or surface facing the +Z axis direction) of the first housing 110 (e.g., Figure 13The third structure 220 is disposed between the mounting surface 1135 of the first structure 120 and the outer surface of the hinge housing 165 when the electronic device 100 is in the deployed (open) state. The first mounting protrusion 611 and the second mounting protrusion 612 can be positioned facing each other. The fiber members of the first structure 210 disposed in the first mounting portion 401 and the fiber members of the third structure 220 disposed in the second mounting portion 402 can be positioned facing the Z-axis direction. The upper ends of the fiber members of the first structure 210 and the third structure 220 can be pressed by the rear surface of the hinge housing 165, and therefore the fiber members may be bent in some directions. When the electronic device 100 is in the deployed state, all (or more than a certain percentage) of the upper surfaces of the first structure 210 and the third structure 220 can be bent by the rear surface of the hinge housing 165.

[0096] When the electronic device 100 is in the deployed state, at least a portion of the remaining outer surface of the hinge housing 165 can be placed on the second structure 310 and the fourth structure 320. When the electronic device 100 is in the deployed (open) state, the second structure 310 can be disposed between the inner surface of the first housing 110 and the outer surface of the hinge housing 165. When the electronic device 100 is in the deployed (open) state, the fourth structure 320 can be disposed between the inner surface of the second housing 120 and the outer surface of the hinge housing 165. The first mounting protrusion 611 and the second mounting protrusion 612 can be configured to face each other. The second structure 310 disposed in the first mounting portion 401 and the fourth structure 320 disposed in the second mounting portion 402 can be configured to be adjacent to each other. The second structure 310 disposed in the first mounting portion 401 and the fourth structure 320 disposed in the second mounting portion 402 can contact the hinge housing 165. The second structure 310, located in the first mounting portion 401, and the fourth structure 320, located in the second mounting portion 402, can be in close contact with the hinge housing 165 and can maintain a constant gap between each of the first housing 110 and the second housing 120 and the hinge housing 165.

[0097] According to an embodiment, in the deployed state of the electronic device, the first structure 210 may face a first portion 621 of the outer surface (e.g., the rear surface or exterior) of the hinge housing 165. In the deployed state, the first structure 210 may contact at least a portion of the first portion 621 of the outer surface of the hinge housing 165. In the deployed state, the second structure 310 may face a second portion 622 of the outer surface of the hinge housing 165 that is different from the first portion 621. In the deployed state, the second structure 310 may contact at least a portion of the second portion 622 of the outer surface of the hinge housing 165.

[0098] In the unfolded state of the electronic device, the third structure 220 can face a third portion of the outer surface of the hinge housing 165. The third portion 623 can be different from the first portion 621 and the second portion 622, and can be a portion symmetrical to the first portion 621 relative to the folding axis A (or the hinge housing 165). In the unfolded state of the electronic device, the third structure 220 can contact at least a portion of the third portion 623 of the outer surface of the hinge housing 165. In the unfolded state of the electronic device, the fourth structure 320 can face a fourth portion 624 of the outer surface of the hinge housing 165. The fourth portion 624 can be different from the first portion 621, the second portion 622, and the third portion 623, and can be a portion symmetrical to the second portion 622 relative to the folding axis A (or the hinge housing 165). In the unfolded state of the electronic device, the fourth structure 320 can contact at least a portion of the fourth portion 624 of the outer surface of the hinge housing 165.

[0099] According to an embodiment, at least a portion of at least one first structure 210 can contact a first portion 621 of the outer surface of the hinge housing 165 while the electronic device 100 changes from an unfolded state to a folded state. At least a portion of at least one second structure 310 can contact a second portion 622 of the outer surface of the hinge housing 165 while the electronic device 100 changes from an unfolded state to a folded state. At least a portion of at least one third structure 220 can contact a third portion 623 of the outer surface of the hinge housing 165 while the electronic device 100 changes from an unfolded state to a folded state. At least a portion of at least one fourth structure 320 can contact a fourth portion 624 of the outer surface of the hinge housing 165 while the electronic device 100 changes from an unfolded state to a folded state.

[0100] According to an embodiment, the space between the first housing 110 and the hinge housing 165 can be sealed by the first structure 210 and the second structure 310, thus preventing or reducing the infiltration of external foreign objects between the first housing 110 and the hinge housing 165. The space between the second housing 120 and the hinge housing 165 can be sealed by the third structure 220 and the fourth structure 320, thus preventing or reducing the infiltration of external foreign objects between the second housing 120 and the hinge housing 165.

[0101] Figure 7 This is a view showing the folded state of an electronic device according to an embodiment. Figure 7 In the middle, drawing <701> It is shown Figure 2 A view showing the folded state of the electronic device. Figure 7 In the middle, drawing <702> It shows along Figure 2A view of an example cross-section of an electronic device, intercepted by line C1-C1'. For example, a drawing. <702> This is an example view showing a cross-section obtained by cutting into the location where the dustproof structure of an electronic device is positioned. Figure 7 In the middle, drawing <703> It shows along Figure 2 A view of an example cross-section of an electronic device, intercepted by line C2-C2'. For example, a drawing. <703> This is an example view showing a cross-section obtained by cutting the support structure of an electronic device at the designated location.

[0102] Reference Figure 6 and Figure 7 When the electronic device 100 is in a folded state, the display 130 may have a folded portion (e.g., Figure 1 and Figure 3 The folded portion 131c) is in a folded state. The first hinge plate 164b and the second hinge plate 164c, which are located below and support the display 130, can be separated from each other and can be arranged in an upright state in the Z-axis direction. The rear surfaces of the first housing 110 and the second housing 120 can be arranged to face away from each other. The first mounting protrusion 611 and the second mounting protrusion 612 can be spaced apart from each other, with the hinge housing 165 located between them.

[0103] When the electronic device 100 is in a folded state, the first structure 210 can be positioned above the first mounting protrusion 611 in the Z-axis direction, and the third structure 220 can be positioned above the second mounting protrusion 612 in the Z-axis direction. The first structure 210 can be positioned facing one edge of the hinge housing 165 (the edge facing the X-axis direction), and the third structure 220 can be positioned facing the opposite edge of the hinge housing 165 (the edge facing the -X-axis direction). Therefore, some fiber members of the first structure 210 can remain upright, while other fiber members can face one edge of the hinge housing 165 and can be curved. Some fiber members of the third structure 220 can remain upright, while other fiber members can face the opposite edge of the hinge housing 165 and can be curved. The first structure 210 can close the gap between the first housing 110 and the hinge housing 165, and the third structure 220 can close the gap between the second housing 120 and the hinge housing 165. Therefore, it can prevent or reduce the infiltration of foreign objects through the gap between the first housing 110, the second housing 120 and the hinge housing 165.

[0104] When the electronic device 100 is in a folded (closed) state, the second structure 310 can be positioned above the first mounting protrusion 611 in the Z-axis direction, and the fourth structure 320 can be positioned above the second mounting protrusion 612 in the Z-axis direction. The second structure 310 can be positioned facing one edge of the hinge housing 165 (the edge facing the X-axis direction), and the fourth structure 320 can be positioned facing the opposite edge of the hinge housing 165 (the edge facing the -X-axis direction). The second structure 310 can contact one edge of the hinge housing 165, and the fourth structure 320 can contact the opposite edge of the hinge housing 165. Therefore, the second structure 310 can close the gap between the first housing 110 and the hinge housing 165, and the fourth structure 320 can close the gap between the second housing 120 and the hinge housing 165. Therefore, it is possible to prevent or reduce the infiltration of foreign objects through the gaps between the first housing 110, the second housing 120, and the hinge housing 165.

[0105] In the following text, reference will be made to Figures 8 to 22 Describes a first structure 210 (or a third structure 220) and a second structure 310 (or a fourth structure 320) formed between the hinge housing 165 and the first housing 110 (or the second housing 120).

[0106] Figure 8 This is a view illustrating examples of a first and a second structure of an electronic device according to an embodiment.

[0107] Reference Figure 8 The electronic device according to the embodiments may include a first structure 810 having one or more dustproof structures 811, 812, 813 and 814 (e.g., Figures 3 to 7 First structure 210) (and / or Figures 3 to 7 The third structure (e.g., third structure 220) and the second structure 820 having one or more support structures 821, 822 and 823 (e.g., Figures 3 to 7 The second structure 310) (and / or Figures 3 to 7 The fourth structure (e.g., Figures 3 to 7 The fourth structure 320).

[0108] One or more support structures 821, 822, and 823, and one or more dustproof structures 811, 812, 813, and 814, may be arranged in the longitudinal direction along the folding axis A. For example, one or more support structures 821, 822, and 823, and one or more dustproof structures 811, 812, 813, and 814 may be arranged along the hinge housing (e.g., Figure 2 , Figure 3 , Figure 6 and Figure 7The hinge housing 165 is arranged in the longitudinal direction.

[0109] The number of support structures 821, 822, and 823 may differ from the number of dustproof structures 811, 812, 813, and 814. The number of dustproof structures 811, 812, 813, and 814 may be greater than the number of support structures 821, 822, and 823. For example, the number of dustproof structures 811, 812, 813, and 814 may be at least one more than the number of support structures 821, 822, and 823.

[0110] One or more support structures 821, 822 and 823 and one or more dustproof structures 811, 812, 813 and 814 may be arranged alternately. The dustproof structures 811, 812, 813 and 814 may be located on opposite sides of the hinge housing and may prevent or reduce the infiltration of foreign objects through opposite sides of the hinge housing.

[0111] According to an embodiment, one or more dustproof structures 811, 812, 813, and 814 may include a first dustproof structure 811, a second dustproof structure 812, a third dustproof structure 813, and a fourth dustproof structure 814. One or more support structures 821, 822, and 823 may include a first support structure 821, a second support structure 822, and a third support structure 823.

[0112] According to an embodiment, a first support structure 821 supporting one side of the hinge housing may be located between a first dustproof structure 811 and a second dustproof structure 812. A second support structure 822 supporting the central portion of the hinge housing may be located between the second dustproof structure 812 and a third dustproof structure 813. A third support structure 823 supporting the opposite side of the hinge housing may be located between the third dustproof structure 813 and a fourth dustproof structure 814. The second support structure 822 may be located between the first support structure 821 and the third support structure 823. The second support structure 822 corresponding to the central portion of the hinge housing may be formed to be longer than at least one of the first support structure 821 or the third support structure 823. The second support structure 822 may have a second length L2 that is longer than a first length L1 of at least one of the first support structure 821 or the third support structure 823. Because the second support structure 822 supporting the central portion of the hinge housing is formed to be longer than at least one of the first support structure 821 or the third support structure 823, the hinge housing can be firmly supported without sagging. For example, because the second support structure 822 supporting the central portion of the hinge housing is formed to be longer than at least one of the first support structure 821 or the third support structure 823, sagging in the area of ​​the housing adjacent to the hinge housing 165 (e.g., the first housing 110 or the second housing 120) can be reduced.

[0113] According to the embodiment, the first dustproof structure 811 and the second dustproof structure 812 may contact the first support structure 821, or may be spaced apart from the first support structure 821 by a distance less than the length of the first support structure 821. The second dustproof structure 812 and the third dustproof structure 813 may contact the second support structure 822, or may be spaced apart from the second support structure 822 by a distance less than the length of the second support structure 822.

[0114] According to an embodiment, at least one of the first support structure 821, the second support structure 822, or the third support structure 823 can be formed as separate substructures. For example, the second support structure 822, which is longer than the first support structure 821 and the third support structure 823, can be formed as separate substructures. At least one separate substructure can have a shorter length than the first support structure 821 and the third support structure 823.

[0115] According to the embodiments, multiple dustproof structures 811, 812, 813, and 814, and multiple support structures 821, 822, and 823 can be arranged symmetrically. The multiple dustproof structures 811, 812, 813, and 814 included in the first structure 810 can be symmetrical with the multiple dustproof structures included in the third structure, with a folding axis A parallel to the longitudinal direction of the hinge housing located between them. The multiple support structures 821, 822, and 823 included in the second structure 820 can be symmetrical with the multiple support structures included in the fourth structure, with a folding axis A parallel to the longitudinal direction of the hinge housing located between them.

[0116] According to an embodiment, the first dustproof structure 811 and the second dustproof structure 812 included in each of the first structure 810 and the third structure may be symmetrical with the third dustproof structure 813 and the fourth dustproof structure 814, while a virtual axis (or the second support structure 822) perpendicular to the folding axis A is located between them. The first support structure 821 included in each of the second structure 820 and the fourth structure may be symmetrical with the third support structure 823, while a virtual axis (or the second support structure 822) perpendicular to the folding axis A is located between them.

[0117] According to the embodiments, the arrangement, length and / or number of dustproof structures 811, 812, 813 and 814 and support structures 821, 822 and 823 can be determined based on the length of the hinge housing.

[0118] Figures 9a to 9f This is a view showing the dustproof structure and support structure of an electronic device according to an embodiment.

[0119] Reference Figures 9a to 9fThe electronic device according to the embodiments may include at least one dustproof structure 9101, 9102, 9103, 9104, 9105 or 9125 (e.g., Figure 8 Dustproof structures 811, 812, 813 and 814) and at least one support structure 9201, 9202, 9203, 9204, 9205 or 9225 (e.g., Figure 8 Supporting structures 821, 822 and 823).

[0120] According to an embodiment, Figure 9a At least one first dustproof structure 9101 shown may include at least one dustproof recess 9111 formed by removing a portion of the first dustproof structure 9101. The at least one dustproof recess 9111 may be shaped in an engraved form toward the folding axis A (or in the X-axis direction). At least one first support structure 9201 may be disposed in the dustproof recess 9111. For example, the width Ws of the first support structure 9201 may be narrower than the width Wg of the dustproof recess 9111. The width of the placement protrusions (e.g., first placement protrusion 611 and second placement protrusion 612) that restrict the position of the first support structure 9201 may be formed to be wide within the difference between the width Ws of the first support structure 9201 and the width Wg of the dustproof recess 9111. Therefore, it is easier to receive the dustproof recess due to the first housing (e.g., Figures 1 to 7 The first housing 110) and the second housing (e.g., Figures 1 to 7 The force is applied to the support structure 9201 by the movement of the second housing 120. For example, the width Ws of the first support structure 9201 can be equal to the width Wg of the dustproof recess 9111. One lateral end of the first support structure 9201 and the opposite lateral end of the protrusion can be aligned, and thus the first and second housings including the protrusions can be easily manufactured. For example, the width Ws of the first support structure 9201 can be greater than the width Wg of the dustproof recess 9111. As the width Ws of the first support structure 9201 increases, the surface area of ​​the support structure 9201 in contact with the hinge housing can increase, and thus the support structure 9201 can firmly support the hinge housing. For example, because the surface area of ​​the support structure 9201 in contact with the hinge housing 165 increases as the width Ws of the first support structure 9201 increases, the support structure 9201 can maintain a constant gap between the hinge housing and the area of ​​the first housing 110 and / or the second housing 120 adjacent to the hinge housing when the first housing 110 and the second housing 120 are folded (or in the closed state).

[0121] According to an embodiment, Figure 9bAt least one first dustproof structure 9102 shown may include a plurality of dustproof recesses 9121 and 9122 formed by removing a plurality of portions of the first dustproof structure 9102. The first dustproof recess 9121 and the second dustproof recess 9122 included in the plurality of dustproof recesses 9121 and 9122 may be formed in an engraved shape in opposite directions. The first dustproof recess 9121 may be formed in an engraved shape in the X-axis direction. At least one first support structure 9211 may be disposed in the first dustproof recess 9121. The second dustproof recess 9122 may be formed in an engraved shape in the X-axis direction. At least one second support structure 9212 may be disposed in the second dustproof recess 9122. The first support structure 9211 and the second support structure 9212 may have the same size or different sizes. For example, the first support structure 9211 near the folding axis and the second support structure 9212 away from the folding axis may be formed in different sizes.

[0122] For example, the dimensions of the multiple support structures 9211 and 9212 can be determined based on the orientation of the housings corresponding to the support structures 9211 and 9212 (e.g., a first housing located on one side relative to the folding axis or a second housing located on the opposite side relative to the folding axis). The first support structure 9211 and the second support structure 9212, which are included in the second structure corresponding to the first housing and have different dimensions, and the first support structure 9211 and the second support structure 9212, which are included in the fourth structure corresponding to the second housing and have different dimensions, can be symmetrical to each other, with the central axis of the hinge housing, parallel to the folding axis, located between them.

[0123] According to the embodiment, support structures 9231 and 9232 can be respectively set in Figure 9c At least one dustproof structure 9103 is shown on the opposite side. A first support structure 9231 may be disposed on one side of the dustproof structure 9103, and a second support structure 9232 may be disposed on the opposite side of the first dustproof structure 9103. The first support structure 9231 and the second support structure 9232 may have the same size or different sizes. The separation distance between the first support structure 9231 and the first dustproof structure 9103 may be equal to or different from the separation distance between the second support structure 9232 and the first dustproof structure 9103. The separation distance between the support structures 9231 and 9232 and the first dustproof structure 9103 may be determined based on the orientation of the housing corresponding to the support structures 9231 and 9232 (e.g., a first housing located on one side relative to the folding axis or a second housing located on the opposite side relative to the folding axis).

[0124] According to the embodiments, such as Figure 9dAs shown, at least one first support structure 9204 can be disposed between a plurality of dustproof structures 9141 and 9142. For example, at least one support structure 9204 can be disposed between the first dustproof structure 9141 and the second dustproof structure 9142. The first support structure 9204 may include a first protrusion 9214 and a second protrusion 9224. The first protrusion 9214 is formed on a side surface of the first support structure 9204 facing the first dustproof structure 9141 and has a curved shape. The second protrusion 9224 is formed on the opposite side surface of the first support structure 9204 facing the second dustproof structure 9142 and has a curved shape. One end of the first dustproof structure 9141 facing the first support structure 9204 may be formed in a "C" shape, and the opposite end of the first dustproof structure 9141 facing the first support structure 9204 may be formed in an inverted "C" shape. The first dustproof structure 9141 may include a first dustproof recess 9143 corresponding to the first protrusion 9214. The first dustproof recess 9143 may be formed in an engraved shape in the Y-axis direction. The second dustproof structure 9142 may include a second dustproof recess 9144 corresponding to the second protrusion 9224. The second dustproof recess 9144 may be formed in an engraved shape in the Y-axis direction. The first dustproof structure 9141 may be formed in a shape that at least partially surrounds the first protrusion 9214 (or the first edge) of the support structure 9204. The first dustproof structure 9141 may contact the first protrusion 9214 (or the first edge) of the support structure 9204. This can prevent or reduce the infiltration of external foreign matter between the first dustproof structure 9141 and the first support structure 9204. The second dustproof structure 9142 may be formed in a shape that at least partially surrounds the second protrusion 9224 (or the second edge) of the support structure 9204. The second dustproof structure 9142 may contact the second protrusion 9224 (or the second edge) of the support structure 9204. It can prevent or reduce the infiltration of external foreign objects between the second dustproof structure 9142 and the first support structure 9204.

[0125] According to an embodiment, at least one first support structure 9205 may be provided. Figure 9e The first dustproof structure 9105 is shown inside. The first dustproof structure 9105 can be formed to surround at least one first support structure 9205. It can prevent or reduce the infiltration of external foreign objects between the first dustproof structure 9105 and the first support structure 9205, and can also prevent or reduce the infiltration of foreign objects into the gaps of the first support structure 9205.

[0126] According to an embodiment, Figure 9fThe first dustproof structure 9125 shown can be configured to overlap with the first support structure 9225. The first dustproof structure 9125 can be disposed on and below the first support structure 9225. This can prevent or reduce the infiltration of external foreign objects between the first dustproof structure 9125 and the first support structure 9225, and can also prevent or reduce the infiltration of foreign objects into the gaps of the first support structure 9225.

[0127] Figure 10 This is a view showing an example of the width of the dustproof structure and support structure of an electronic device according to an embodiment.

[0128] Reference Figure 10 The electronic device may include at least one dustproof structure 1010 and at least one support structure 1020. The width of the at least one dustproof structure 1010 may be greater than the width of the at least one support structure 1020. As the width of the dustproof structure 1010 increases, the inflow path of external foreign objects is lengthened, and thus the infiltration of external foreign objects into the electronic device can be prevented or reduced.

[0129] According to an embodiment, the virtual center line F of at least one dustproof structure 1010 may coincide with the virtual center line F of at least one support structure 1020. The center line F of at least one dustproof structure 1010 in the longitudinal direction may coincide with the center line F of at least one support structure 1020 in the longitudinal direction. The center line F may be formed parallel to the folding axis A. At least one dustproof structure 1010 may include a first dustproof region 1011 and a second dustproof region 1012 divided from each other, with the virtual center line F located between them. The width Wd1 of the first dustproof region 1011 located on one side relative to the center line F may be equal to or nearly equal to the width Wd2 of the second dustproof region 1012 located on the opposite side relative to the center line F. At least one support structure 1020 may include a first support region 1021 and a second support region 1022 divided from each other, with the virtual center line F located between them. The width Ws1 of the first support region 1021 located on one side relative to the center line F can be equal to or similar to the width Ws2 of the second support region 1022 located on the opposite side relative to the center line F.

[0130] According to an embodiment, the width Wd1 of the first dustproof area 1011 located on one side relative to the center line F can be greater than the width Ws1 of the first support area 1021 located on one side relative to the center line F. The width Wd2 of the second dustproof area 1012 located on the opposite side relative to the center line F can be greater than the width Ws2 of the second support area 1022 located on the opposite side relative to the center line F.

[0131] Figure 11 The dustproof structure and support structure according to an embodiment are shown.

[0132] Reference Figure 11 According to the embodiment, at least one of the dustproof structure 1110 or the support structure 1120 can be formed in a polygonal shape with curved corners. For example, the dustproof structure 1110 and the support structure 1120 can be formed in a quadrilateral shape with rounded corners.

[0133] The base components included in the dustproof structure 1110 (e.g., Figure 5 The base component 211 can be formed in a quadrilateral shape with rounded corners, and the dustproof structure 1110 includes multiple cilia (e.g., Figure 5 The fiber component 212 can be formed in a quadrilateral shape with rounded corners, or the matrix component and multiple cilia can be formed in a quadrilateral shape with rounded corners.

[0134] The curvature R2 of the corner of the support structure 1120 may differ from the curvature R1 of the corner of the dustproof structure 1110. The curvature R2 of the corner of the support structure 1120 may be greater than the curvature R1 of the corner of the dustproof structure 1110. The curvature R2 of the corner of the support structure 1120 formed of injection molded material may be greater than the curvature R1 of the corner of the dustproof structure 1110.

[0135] Figure 12 This is a view illustrating an example of the height relationship between the dustproof structure and the supporting structure according to an embodiment. Figure 12 In the middle, drawing <1201> This is a view showing an example of the dustproof structure and support structure before they are pressed down by the hinge housing, and the drawing... <1202> This is a view showing an example of the dustproof structure and support structure being pressed down by the hinge housing.

[0136] Reference Figure 12 According to the embodiment, the dustproof structure 1210 and the support structure 1220 can be mounted on a hinged housing (e.g., Figure 2 , Figure 3 , Figure 6 and Figure 7 The hinge housing 165) has a different height before being pressed. Keep the hinge housing at a different height from the first housing (e.g., Figures 1 to 4 , Figure 6 and Figure 7 The first housing 110) and the second housing (e.g., Figures 1 to 4 , Figure 6 and Figure 7 The height Hs of the support structure 1220 between the second housing 120 and the specified gap can be lower than the height Hd of the dustproof structure 1210.

[0137] At least a portion of the dustproof structure 1210 according to the embodiment can be pressed by the hinge housing depending on at least one of the unfolded or folded states of the electronic device. The upper ends of at least some of the fiber members included in the dustproof structure 1210 can be pressed by the rear surface of the hinge housing 165. Therefore, the fiber members can be bent in a specific direction.

[0138] At least one of the dustproof structure 1210 or the support structure 1220 according to the embodiment can be formed by insert injection molding. For example, the dustproof structure 1210 and the support structure 1220 can be integrally formed with each other by insert injection molding.

[0139] Figure 13 This is a view illustrating a support structure included in an electronic device according to an embodiment.

[0140] exist Figure 13 In the middle, drawing <1301> It is a three-dimensional diagram of the supporting structure included in electronic equipment, and is a drawing. <1302> It is a plan view of the supporting structure included in electronic equipment, and is drawn as follows. <1303> It is along the drawing <1302> A cross-sectional view of the electronic device taken by line D1-D1', and a drawing. <1304> It is along the drawing <1302> The cross-sectional view of the electronic device is taken by line D2-D2'.

[0141] Reference Figure 13 The electronic device according to the embodiment may include a first housing 110 (and / or a second housing (e.g., Figures 1 to 4 , Figure 6 and Figure 7 The second housing 120), one or more dustproof structures 1311 and 1312, and at least one support structure 1320.

[0142] One or more dustproof structures 1311 and 1312 may be included in at least one first structure (e.g., Figures 3 to 7 The first structure 210 and Figure 8 First structure 810) (and / or Figures 3 to 7 In the third structure 220).

[0143] Support structure 1320 may include at least one second structure (e.g., Figures 3 to 7 The second structure 310 and Figure 8 The second structure 820) (and / or Figures 3 to 7In the fourth structure 320), at least one of the second structures includes a support structure 1320 that can be positioned adjacent to the first dustproof structure 1311 in the -Y axis direction and can be positioned adjacent to the second dustproof structure 1312 in the +Y axis direction. The support structure 1320 can be disposed between the first dustproof structure 1311 and the second dustproof structure 1312. For example, the first dustproof structure 1311 and the second dustproof structure 1312 can be in contact with the support structure 1320, or can be spaced from the support structure 1320 by a distance less than the length of the support structure 1320.

[0144] At least a portion of the support structure 1320 may be formed with a reverse gradient or an undercut. At least a portion of the side surface of the support structure 1320 may be formed with a reverse gradient or an undercut. For example, at least a portion of the support structure 1320 may be formed such that the width extends from the mounting surface 1135 (or inner surface) of the first housing 110 toward the hinge housing (e.g., Figures 1 to 7 The hinge housing 165) decreases and then increases. The support structure 1320 may include a main body region 1321, a neck region 1322, and a head region 1330.

[0145] The neck region 1322 may be disposed between the head region 1330 and the mounting surface 1135 of the first housing 110. For example, the neck region 1322 may be disposed between the main body region 1321 and the head region 1330 and may connect the main body region 1321 and the head region 1330. The neck region 1322 may have a narrower width compared to the main body region 1321 and the head region 1330.

[0146] The main body region 1321 can extend from the neck region 1322 to the mounting surface 1135 of the first housing 110. At least a portion of the side surface of the main body region 1321 extending from the neck region 1322, which has a narrow width, can have an inclined surface.

[0147] The head region 1330 may face the outer surface of the hinge housing. The head region 1330 may be the region that contacts the rear surface of the hinge housing. The head region 1330 may protrude further toward the first dustproof structure 1311 and the second dustproof structure 1312 than the neck region 1322. At least a portion of the mounting surface 1135 of the first housing 110 and the head region 1330 may each have a length parallel to the +Y axis direction (and / or the -Y axis direction). The length of at least a portion of the head region 1330 may be longer than the length of the mounting surface 1135 of the first housing 110. At least a portion of the mounting surface 1135 of the first housing 110 and the head region 1330 may each have a width parallel to the +X axis direction (and / or the -X axis direction). The width of at least a portion of the head region 1330 may be less than or equal to the width of the mounting surface 1135 of the first housing 110.

[0148] The head region 1330 may include a first head region 1331, a second head region 1332, and a third head region 1333. The first head region 1331 may extend toward the first dustproof structure 1311 from the third head region 1333, which overlaps with the receiving space 1350 (or the first receiving space) in which the support structure 1320 is housed. The first head region 1331 may be mounted on the third sidewall 1133 of the first housing 110. The first head region 1331 may extend toward the first dustproof structure 1311 from the third head region 1333, which overlaps with the receiving space 1350 in which the support structure 1320 is housed. The gap between the first head region 1331, which is mounted on the third sidewall 1133 of the first housing 110 and extends toward the first dustproof structure 1311, and the first dustproof structure 1311 may be minimized. Therefore, the infiltration of external foreign objects into the first head region 1331 and the first dustproof structure 1311 of the support structure 1320 may be prevented or reduced.

[0149] The second head region 1332 can be mounted on the fourth sidewall 1134 of the first housing 110. The second head region 1332 can extend from the third head region 1333, which overlaps with the receiving space 1350 in which the support structure 1320 is housed, toward the second dustproof structure 1312. The gap between the second head region 1332, which is mounted on the fourth sidewall 1134 of the first housing 110 and extends toward the second dustproof structure 1312, and the second dustproof structure 1312 can be minimized. Therefore, the infiltration of external foreign objects between the second head region 1332 and the second dustproof structure 1312 of the support structure 1320 can be prevented or reduced.

[0150] The third head region 1333 can be located between the first head region 1331 and the second head region 1332, and can connect the first head region 1331 and the second head region 1332.

[0151] According to embodiments, the inclined surfaces of the main body region 1321 and neck region 1322 of the support structure 1320 may face at least one of the first sidewall 1131, second sidewall 1132, third sidewall 1133, or fourth sidewall 1134 of the first housing 110 to form a first cavity 1351. For example, the main body region 1321 and neck region 1322 may be configured to face the third sidewall 1133 in the -Y axis direction and the fourth sidewall 1134 in the +Y axis direction to form the first cavity 1351. For example, the main body region 1321 and neck region 1322 may be configured to face the first sidewall 1131 in the -X axis direction and the second sidewall 1132 in the +X axis direction to form the first cavity 1351. For example, the main body region 1321 and neck region 1322 may be configured to face the first sidewall 1131, second sidewall 1132, third sidewall 1133, and fourth sidewall 1134 of the first housing 110 to form the first cavity 1351. The first cavity 1351 can be filled with adhesive member 1360. The support structure 1320 can be fixed to the first housing 110 by adhesive member 1360.

[0152] The first housing 110 may include a plurality of sidewalls surrounding a receiving space 1350 in which a support structure 1320 is housed. The plurality of sidewalls may include a first sidewall 1131 facing the folding axis (e.g., Figure 6 and Figure 7 The structure includes a first mounting protrusion 611, a second sidewall 1132 facing the first sidewall 1131, a third sidewall 1133 located between the first sidewall 1131 and the second sidewall 1132, and a fourth sidewall 1134 facing the third sidewall 1133. The first sidewall 1131 and the second sidewall 1132 can be formed elongated along the folding axis. The third sidewall 1133 and the fourth sidewall 1134 can be configured to be perpendicular to the folding axis. The third sidewall 1133 can be disposed between the first dustproof structure 1311 and the support structure 1320. The fourth sidewall 1134 can be disposed between the second dustproof structure 1312 and the support structure 1320.

[0153] According to an embodiment, at least one of the first sidewall 1131 or the third sidewall 1133 may include a first interlocking protrusion 1141 projecting toward the support structure 1320. At least one of the second sidewall 1132 or the fourth sidewall 1134 may include a second interlocking protrusion 1142 projecting toward the support structure 1320. For example, the first sidewall 1131 may include the first interlocking protrusion 1141 projecting toward the support structure 1320. The second sidewall 1132 may include the second interlocking protrusion 1142 projecting toward the support structure 1320. The first interlocking protrusion 1141 and the second interlocking protrusion 1142 may be configured to face each other, with the support structure 1320 located between them.

[0154] According to an embodiment, the inner surfaces 1136 of the first sidewall 1131 and the second sidewall 1132 of the first housing 110 can face the inclined surfaces of the main body region 1321 and the neck region 1322 of the support structure to form a second cavity 1352. The main body region 1321 and the neck region 1322 can be configured to face the first sidewall 1131 with the stepped inner surface 1136 in the -X-axis direction to form the second cavity 1352. The main body region 1321 and the neck region 1322 can be configured to face the second sidewall 1132 with the stepped inner surface 1136 in the +X-axis direction to form the second cavity 1352. The inner surfaces 1136, which are further spaced from the inner surfaces of the first interlocking protrusions 1141 and the second interlocking protrusions 1142 relative to the support structure 1320, can face the inclined surfaces of the main body region 1321 and the neck region 1322, and therefore the second cavity 1352 can form a relatively large space. The second cavity 1352, which communicates with the first cavity 1351, can be filled with the adhesive member 1360. The support structure 1320 can be fixed to the first housing 110 by the adhesive member 1360.

[0155] According to an embodiment, the adhesive member 1360 may include a first protruding region 1361, a second protruding region 1362, a third protruding region 1363, and a fourth protruding region 1364.

[0156] The first protruding region 1361 of the adhesive member 1360 may protrude in a direction opposite to the direction of the first interlocking protrusion 1141 of the first housing 110. The first interlocking protrusion 1141 may protrude in the X-axis direction (or toward the head region 1330 of the support structure 1320), and the first protruding region 1361 of the adhesive member 1360 may protrude further in the X-axis direction than the support structure 1320 (e.g., the third head region 1333 of the support structure). The first protruding region 1361 of the adhesive member 1360 may be formed to engage with the first interlocking protrusion 1141. The first protruding region 1361 of the adhesive member 1360 may engage with the first interlocking protrusion 1141 to face the first interlocking protrusion 1141 in the Z-axis direction. Therefore, the adhesion of the support structure 1320 to the first protruding region 1361 of the adhesive member 1360 in the Z-axis direction (e.g., toward the head region 1330 of the support structure 1320) may be prevented or reduced. Figure 1 , Figure 3 , Figure 6 and Figure 7 Separation on the display (130 direction).

[0157] The second protruding region 1362 of the adhesive member 1360 may protrude in a direction opposite to that of the second interlocking protrusion 1142 of the first housing 110. The second protruding region 1362 of the adhesive member 1360 may protrude further in the X-axis direction than the support structure 1320 (e.g., the third head region 1333 of the support structure), and the second interlocking protrusion 1142 may protrude in the -X-axis direction (or toward the head region 1330 of the support structure 1320). The second protruding region 1362 of the adhesive member 1360 may be formed to engage with the second interlocking protrusion 1142. The second protruding region 1362 of the adhesive member 1360 may engage with the second interlocking protrusion 1142 to face the second interlocking protrusion 1142 in the Z-axis direction. Therefore, adhesion of the support structure 1320 to the second protruding region 1362 of the adhesive member 1360 in the Z-axis direction (e.g., toward the head region 1142) can be prevented or reduced. Figure 1 , Figure 3 , Figure 6 and Figure 7 Separate on the display (130° orientation).

[0158] The third protruding region 1363 of the adhesive member 1360 may protrude in a direction opposite to the direction of the first head region 1331 of the support structure 1320. The third protruding region 1363 of the adhesive member 1360 may protrude from the third sidewall 1133 in the Y-axis direction (or toward the neck region 1322 of the support structure), and the first head region 1331 of the support structure 1320 may protrude in the -Y-axis direction. The third protruding region 1363 of the adhesive member 1360 may be formed to engage with the first head region 1331 of the support structure 1320. The third protruding region 1363 of the adhesive member 1360 may engage with the first head region 1331 of the support structure 1320 to face the first head region 1331 of the support structure 1320 in the Z-axis direction. Therefore, adhesion of the support structure 1320 to the third protruding region 1363 of the adhesive member 1360 in the Z-axis direction (e.g., toward the neck region 1322 of the support structure 1320) can be prevented or reduced. Figure 1 , Figure 3 , Figure 6 and Figure 7 Separate on the display (130° orientation).

[0159] The fourth protruding region 1364 of the adhesive member 1360 may protrude in a direction opposite to the direction of the second head region 1332 of the support structure 1320. The fourth protruding region 1364 of the adhesive member 1360 may protrude from the fourth sidewall 1134 in the Y-axis direction (or toward the neck region 1332 of the support structure), and the second head region 1332 of the support structure 1320 may protrude in the Y-axis direction. The fourth protruding region 1364 of the adhesive member 1360 may be formed to engage with the second head region 1332 of the support structure 1320. The fourth protruding region 1364 of the adhesive member 1360 may engage with the second head region 1332 of the support structure 1320 to face the second head region 1332 of the support structure 1320 in the Z-axis direction. Therefore, adhesion of the support structure 1320 to the fourth protruding region 1364 of the adhesive member 1360 in the Z-axis direction (e.g., toward the neck region 1332 of the support structure 1320) can be prevented or reduced. Figure 1 , Figure 3 , Figure 6 and Figure 7 Separate on the display (130° orientation).

[0160] Figure 14 This is a view illustrating an example of the assembly process between the first housing and the support structure of an electronic device according to an embodiment.

[0161] Reference Figure 14In operation 1401, a first housing 110 (and / or a second housing 120) including a receiving space 1350 may be provided. At least a recess may be formed in the first housing 110, and the receiving space 1350 may be formed in the form of a recess. An adhesive member 1360 may be applied to the receiving space 1350.

[0162] In operation 1402, the support structure 1320 can be assembled (or inserted) into the receiving space 1350 of the first housing 110 in the vertical direction (or in the direction parallel to the depth direction of the receiving space).

[0163] In operation 1403, after the support structure 1320 is assembled, the adhesive member 1360 can be cured, and the support structure 1320 can be secured to the first housing 110 by the adhesive member 1360. The portion of the adhesive member 1360 attached to the support structure 1320 can engage with the first interlocking protrusion 1141 and the second interlocking protrusion 1142 of the first housing 110.

[0164] Figure 15 This is a view illustrating an example of a method for manufacturing an electronic device according to an embodiment.

[0165] Reference Figure 15 In operation 1501, a first housing 110 (and / or a second housing 120) may be provided, including a receiving space 1350 (or a first receiving space), a second receiving space 1451, and a third receiving space 1452. A plurality of recesses may be formed in the first housing 110, and the receiving spaces 1350, 1451, and 1452 may be formed in the form of recesses. The receiving spaces 1350, 1451, and 1452 may be arranged in a row.

[0166] In operation 1502, the adhesive member 1360 may be applied to at least one of the receiving space 1350, the second receiving space 1451, or the third receiving space 1452. For example, the adhesive member 1360 may be applied to at least a portion of the third receiving space 1452 in which the support structure 1320 is to be housed.

[0167] In operation 1503, the support structure 1320 can be assembled (or inserted) into the receiving space of the first housing 110 in a vertical direction (or in a direction parallel to the depth direction of the receiving space). After the support structure 1320 is assembled, the adhesive member 1360 can be cured, and the support structure 1320 can be secured to the first housing 110 by the adhesive member 1360.

[0168] In operation 1504, the first dustproof structure 1311 can be assembled into the second receiving space 1451, and the second dustproof structure 1312 can be assembled into the third receiving space 1452. The first dustproof structure 1311 assembled into the second receiving space 1451 and the second dustproof structure 1312 assembled into the third receiving space 1452 can be attached to the first housing 110. The first dustproof structure 1311, the support structure 1320, and the second dustproof structure 1312 can be arranged in a row.

[0169] Figure 16 A view of the support structure according to an embodiment is shown. Figure 16 In the middle, drawing <1601> This is a perspective view showing the support structure according to an embodiment, and a drawing. <1602> This is a rear view of the support structure according to an embodiment.

[0170] Reference Figure 16 Support structure 1620 (e.g., Figures 13 to 15 The supporting structure 1320 may include a head region 1330, a neck region 1322 and a main body region 1321.

[0171] The main body region 1321 may include a channel 1610 formed in the longitudinal direction of the main body region 1321. The channel 1610 can access the main body region 1321 from the first housing (e.g., Figures 1 to 15 The placement surface of at least one of the first housings 110 (e.g., Figure 13 The bottom surface 1323 of the mounting surface 1135 faces the head region 1330 and is sculpted into a shape.

[0172] Channel 1610 can be formed through the body region 1321 from one side surface facing the Y-axis to the other side surface facing the Y-axis. Channel 1610 can be used as an adhesive member applied to the receiving space of the first housing (e.g., Figures 13 to 15 The adhesive liquid of at least one of the adhesive members 1360 moves through the channel. The liquid adhesive member 1360 can move through the channel 1610 after the support structure is assembled into the receiving space, and thus the liquid adhesive member 1360 can be prevented or reduced from overflowing from the receiving space.

[0173] Figure 17 This is a view illustrating the assembly process of the support structure including the channel and the first housing according to an embodiment.

[0174] Reference Figure 17 In operation 1701, a first housing 110 (and / or a second housing 120) including a receiving space 1350 may be provided. A liquid adhesive member 1360 may be applied to the first housing 110.

[0175] In operation 1702, at least a portion of the support structure 1620 may be accommodated in the receiving space 1350 of the first housing 110. The support structure 1620 may include a channel 1610 parallel to the mounting surface 1135 of the first housing 110. According to an embodiment, to prevent or reduce the spillage of the liquid adhesive member 1360 when the support structure 1620 is fastened obliquely rather than perpendicularly to the mounting surface 1135 of the first housing 110, the support structure 1620 may include the channel 1610.

[0176] In operation 1703, when the support structure 1620 is tilted and not vertically fastened to the mounting surface 1135 of the first housing 110, the channel 1610 can also be configured to be tilted relative to the mounting surface 1135. The liquid adhesive member 1360 can move through one end of the channel 1610 to the opposite end of the channel 1610. The liquid adhesive member 1360 can also move through the end of the channel 1610 away from the mounting surface 1135 to the opposite end of the channel 1610 near the mounting surface 1135. Because the liquid adhesive member 1360 is dispersed from the concentrated area to the opposite area through the channel 1610, it is possible to prevent or reduce the liquid adhesive member 1360 from deviating to one side or the opposite side. Therefore, it is possible to prevent or reduce the overflow of the liquid adhesive member 1360 from the receiving space 1350.

[0177] In operation 1704, the liquid adhesive member 1360 can be pressed by the weight of the support structure 1620 and can move between the support structure 1620 and the first housing 110. The liquid adhesive member 1360 and the support structure 1620 can be formed in the receiving space 1350 without bias. The liquid adhesive member 1360 can be formed into a solid adhesive member 1360 by a curing process. The support structure 1620 can be fixed to the first housing 110 without bias (or tilt) by the solid adhesive member 1360. The bottom surface 1323 of the support structure 1620 can be configured to be parallel to the mounting surface 1135 of the first housing 110. According to an embodiment, at least a portion of the bottom surface 1323 of the support structure 1620 can be in direct contact with the mounting surface 1135 of the first housing 110. According to an embodiment, at least a portion of the bottom surface 1323 of the support structure 1620 can be fixed to the mounting surface 1135 of the first housing 110 by the solid adhesive member 1360.

[0178] Figure 18 This is a view illustrating the assembly process of the support structure according to an embodiment and the first housing including the guide recess.

[0179] Reference Figure 18In operation 1801, a first housing 110 (and / or a second housing 120) may be provided, including a guide recess 1810 and a receiving space 1350. The guide recess 1810 and the receiving space 1350 may have depths in the same direction. The guide recess 1810 and the receiving space 1350 may be formed in an embossed shape in the same direction. The guide recess 1810 may be formed from a mounting surface 1135 of the first housing 110 in an embossed shape in the same direction as the receiving space 1350. The guide recess 1810 may be connected to the receiving space 1350. The guide recess 1810 may be positioned deeper than the receiving space 1350. A liquid adhesive member 1360 may be applied to the first housing 110. The liquid adhesive member 1360 may fill a portion of the guide recess 1810 and the receiving space 1350.

[0180] In operation 1802, at least a portion of the support structure 1820 may be accommodated in the receiving space 1350 of the first housing 110. The support structure 1820 may include a guide protrusion 1821 corresponding to the guide recess 1810. The guide protrusion 1821 may protrude from the bottom surface 1323 of the support structure 1820 toward the guide recess 1810.

[0181] In operation 1803, the guide protrusion 1821 of the support structure 1820 can be aligned with the guide recess 1810 of the first housing 110. The guide protrusion 1821 of the support structure 1820 can be assembled to the guide recess 1810 of the first housing 110 in a direction perpendicular to the mounting surface 1135 of the first housing 110. According to an embodiment, the guide protrusion 1821 of the support structure 1820 can be assembled to the guide recess 1810 of the first housing 110 before the liquid adhesive member 1360 is pressed by the support structure 1820. The support structure 1820 can be assembled vertically in a direction perpendicular to the mounting surface 1135 of the first housing 110. Therefore, it is possible to prevent or reduce the assembly of the support structure 1820 at an angle relative to the mounting surface 1135 of the first housing 110.

[0182] In operation 1804, the liquid adhesive member 1360 can be pressed by the weight of the support structure 1820 and can move between the support structure 1820 and the first housing 110. The liquid adhesive member 1360 and the support structure 1820 can be formed in the receiving space 1350 without bias. The liquid adhesive member 1360 can be formed into a solid adhesive member 1360 by a curing process. The support structure 1820 can be fixed to the first housing 110 without bias (or tilt) by the solid adhesive member 1360. The bottom surface 1323 of the support structure 1820 can be configured to be parallel to the mounting surface 1135 of the first housing 110. According to an embodiment, at least a portion of the bottom surface 1323 of the support structure 1820 can be in direct contact with the mounting surface 1135 of the first housing 110. According to an embodiment, at least a portion of the bottom surface 1323 of the support structure 1820 can be fixed to the mounting surface 1135 of the first housing 110 by the solid adhesive member 1360.

[0183] Figure 19 This is a view illustrating an electronic device according to an embodiment, including a support structure that is slidably assembled to a housing.

[0184] Reference Figure 19 The electronic device according to the embodiment may include a first housing 110 (or a second housing), at least one support structure 1920, and at least one dustproof structure 1911 and 1912. Hereinafter, at least one dustproof structure 1911 and 1912 will be described by way of example, including a first dustproof structure 1911 and a second dustproof structure 1912.

[0185] The first housing 110 may include a first receiving space 1350 therein for accommodating a support structure 1920, a second receiving space 1451 therein for accommodating a first dustproof structure 1911, and a third receiving space 1452 therein for accommodating a second dustproof structure 1912. The first receiving space 1350 and the second receiving space 1451 may be connected to each other. The first receiving space 1350 and the third receiving space 1452 may be connected by a first engaging protrusion 1940 (e.g., formed thereon of the first housing 110) Figure 13 The sidewalls of the interlocking protrusions 1141 and 1142 are separated from each other. The first engagement protrusion 1940 may protrude toward at least one of the support structure 1920 or the second dustproof structure 1912. For example, the first engagement protrusion 1940 may protrude from the sidewall of the first housing 110 toward the support structure 1920.

[0186] The first housing 110 may include a fourth receiving space 1930. The fourth receiving space 1930 may be formed between the first receiving space 1350 and the second receiving space 1451. The fourth receiving space 1930 may be connected to the first receiving space 1350 and the second receiving space 1451. A second mounting surface 1952 formed by the fourth receiving space 1930 may be formed with respect to the first mounting surface 1951 formed by the first receiving space 1350 (e.g., Figure 13 The second mounting surface 1952 and the first mounting surface 1951 are different planes. A step 1953 can be formed between the second mounting surface 1952 and the first mounting surface 1951. When the support structure 1920 slides, the step 1953 can restrict the movement of the support structure 1920.

[0187] The first dustproof structure 1911 may be located on one side of the support structure 1920, and the second dustproof structure 1912 may be located on the opposite side of the support structure 1920. One of the first dustproof structure 1911 and the second dustproof structure 1912 may be disposed on a portion of the support structure 1920 slidably assembled to the first housing 110. For example, at least a portion of the first dustproof structure 1911 may be disposed on a flange 1922 slidably assembled to the support structure 1920 of the first housing 110. The first dustproof structure 1911 may directly face the support structure 1920. The first dustproof structure 1911 may be in close contact with the support structure 1920 without a separate separating member, and therefore the first dustproof structure 1911 may prevent or reduce the infiltration of external foreign matter between the first dustproof structure 1911 and the support structure 1920. The sidewall of the first engaging protrusion 1940 forming the first housing 110 may be disposed between the second dustproof structure 1912 and the support structure 1920.

[0188] The support structure 1920 can slide while in contact with at least a portion of the outer surface of the first housing 110 (and / or the second housing 120). The support structure 1920 can be assembled into the first receiving space of the first housing by sliding from the second receiving space 1451 to the first receiving space 1350. The support structure 1920 may include a body region 1923, a second engaging protrusion 1921, a flange 1922, and a recess 1924.

[0189] The second engaging protrusion 1921 may protrude toward at least one of the first dustproof structure 1911 or the second dustproof structure 1912. The second engaging protrusion 1921 may protrude in a direction opposite to the direction of the first engaging protrusion 1940 of the first housing 110. For example, the second engaging protrusion 1921 may protrude from the body region 1923 toward the second dustproof structure 1912. The second engaging protrusion 1921 may protrude in a direction parallel to the sliding direction of the support structure 1920. The second engaging protrusion 1921 may be formed to engage with the first engaging protrusion 1940 of the first housing 110. The second engaging protrusion 1921 of the support structure 1920 may engage with the first engaging protrusion 1940 of the first housing 110 such that the second engaging protrusion 1921 of the support structure 1920 faces the first engaging protrusion 1940 of the first housing 110 in the thickness direction of the support structure 1920. Therefore, the support structure 1920 attached to the first engagement protrusion 1940 of the first housing 110 can be prevented or reduced in the thickness direction of the support structure 1920 (e.g., towards the first housing 110). Figure 1 , Figure 3 , Figure 6 and Figure 7 Separate on the display (130° orientation).

[0190] The flange 1922 may project in a direction opposite to that of the second engagement protrusion 1921. For example, the flange 1922 may project from the body region 1923 toward the first dustproof structure 1911. The flange 1922 may be received in the fourth receiving space 1930 of the first housing 110. When the support structure 1920 slides, the flange 1922 may be stopped by the step 1953, and thus the sliding of the support structure 1920 may be limited.

[0191] A recess 1924 may be provided on a side surface of the support structure 1920. The recess 1924 may be formed in a concave shape corresponding to a first engaging protrusion 1940 of the first housing 110. The recess 1924 may be slidably engaged with at least a portion of the first engaging protrusion 1940.

[0192] Figure 20 This is a view illustrating an electronic device according to an embodiment, including a support structure that is slidably assembled to a housing.

[0193] Reference Figure 20 The electronic device according to the embodiment may include a first housing 110 (or a second housing), at least one support structure 1920, and at least one dustproof structure 1911 and 1912. In addition... Figure 20 The illustrated electronic device includes multiple boards 2011 and 2012, excluding the flange. Figure 20 The electronic device shown can have the same Figure 19The electronic device shown has the same construction. Therefore, the previous description can be applied to the same components or operations.

[0194] According to an embodiment, the plurality of plates 2011 and 2012 may include a first plate 2011 and a second plate 2012 spaced apart from each other, with the support structure 1920 located between them.

[0195] The first plate 2011 may be disposed between the first dustproof structure 1911 and the first housing 110. A portion of the first dustproof structure 1911 may be disposed on the flange 1922 of the support structure 1920. At least a portion of the remaining portion of the first plate 2011 may be disposed between the first housing 110 and the first dustproof structure 1911. The thickness of the first plate 2011 may correspond to the difference between the maximum thickness of the support structure 1920 and the thickness of the first dustproof structure 1911. For example, the thickness of the first plate 2011 may correspond to the thickness of the flange 1922 disposed on the first housing 110.

[0196] The second plate 2012 can be disposed between the second dustproof structure 1912 and the first housing 110. At least a portion of the second dustproof structure 1912 can be disposed on the second plate 2012. The thickness of the second plate 2012 can correspond to the difference between the maximum thickness of the support structure 1920 and the thickness of the second dustproof structure 1912. The thickness of the second plate 2012 can be equal to or different from the thickness of the first plate 2011.

[0197] Figure 21 This is a view illustrating an electronic device according to an embodiment, including a support structure that is slidably assembled to a housing.

[0198] Reference Figure 21 The electronic device according to the embodiment may include a first housing 110 (or a second housing), at least one support structure 1920, and at least one dustproof structure 1911 and 1912. In addition... Figure 21 The electronic device shown also includes, in addition to the third dustproof structure 1913 (or auxiliary dustproof structure), Figure 21 The electronic device shown can have the same Figure 19 The electronic devices shown are essentially the same in construction. Therefore, the previous description can be applied to the same components or operations.

[0199] At least a portion of the third dustproof structure 1913 may be disposed on the flange 1922 of the support structure 1920. The third dustproof structure 1913 may be disposed between the first dustproof structure 1911 and the main body region 1923 of the support structure 1920. The third dustproof structure 1913 may have a thickness different from at least one of the first dustproof structure 1911 or the second dustproof structure 1912. The third dustproof structure 1913 may have a thickness smaller than the thickness of at least one of the first dustproof structure 1911 or the second dustproof structure 1912. The thickness of the third dustproof structure 1913 may correspond to the difference between the thickness of the main body region 1923 of the support structure 1920 and the thickness of the flange 1922. The third dustproof structure 1913 may be disposed between the first dustproof structure 1911 and the support structure 1920 and may be in close contact with both the first dustproof structure 1911 and the support structure 1920. This can prevent or reduce the infiltration of external foreign matter between the first dustproof structure 1911 and the support structure 1920.

[0200] Figure 22 This is a view illustrating an example of the sliding operation of a support structure assembled with a first housing for an electronic device according to an embodiment.

[0201] Reference Figure 22 In operation 2201, a first receiving space 1350 may be provided (e.g., Figures 19 to 21 The first receiving space 1350) and the second receiving space 1451 (e.g., Figures 19 to 21 The first housing 110 (or the second housing) of the second receiving space 1451 of the first housing 110. The support structure 1920 may be placed in the second receiving space 1451 of the first housing 110.

[0202] In operation 2202, the first support structure 1920 can slide from the second receiving space 1451 to the first receiving space 1350.

[0203] In operation 2203, the liquid adhesive member 1360 can be applied to the second receiving space 1451. The liquid adhesive member 1360 can extend from the second receiving space 1451 to the first receiving space 1350, and thus the support structure 1920 can be secured to the first housing 110 by the adhesive member 1360.

[0204] In operation 2204, the first dustproof structure 1911 can be assembled to the second receiving space 1451. Because the second receiving space 1451 and the first receiving space 1350 are connected without a separate separating member, the first dustproof structure 1911 can be assembled to the second receiving space 1451 to make close contact with the support structure 1920 housed in the first receiving space 1350.

[0205] Furthermore, the dustproof structure and support structure described above are not limited to the embodiments described with reference to the accompanying drawings, and the dustproof structure and support structure described with reference to the accompanying drawings can be used in combination with each other. For example, multiple reference structures can be provided in the electronic device according to the embodiments. Figure 3 , Figure 4 , Figures 6 to 13 , Figure 16 and Figures 19 to 21 Each of the described support structures, or combinations thereof, may be provided in the electronic device according to the embodiment. Furthermore, multiple references may be provided in the electronic device according to the embodiment. Figures 3 to 13 , Figure 16 and Figures 19 to 21 Each of the dustproof structures described, or combinations thereof, may be provided in an electronic device according to an embodiment.

[0206] Additionally, refer to Figure 14 , Figure 15 , Figure 17 , Figure 18 and Figure 22 At least one assembly method described can be applied to the reference Figure 3 , Figure 4 , Figures 6 to 13 , Figure 16 and Figures 19 to 21 The described support structure, and refer to Figure 14 , Figure 15 , Figure 17 , Figure 18 and Figure 22 At least one assembly method described can be applied to the reference Figures 3 to 13 , Figure 16 and Figures 19 to 21 The dustproof structure described.

[0207] A foldable electronic device according to at least one embodiment may include a first housing, a second housing, and a hinge coupled to the first housing and the second housing. The foldable electronic device may further include a first member disposed between the first housing and the hinge, and a first support structure disposed between the first housing and the hinge, wherein the first member and the first support structure are adjacent to each other. When the foldable electronic device is in a folded or unfolded state, the first member is in contact with both the hinge housing and the first housing.

[0208] The hinge may include a hinge structure coupled to a first housing and a second housing, and a hinge housing in which the hinge structure is disposed.

[0209] When the foldable electronic device is in a folded state and when it is in an unfolded state, the first component can contact both the hinge housing and the first housing. When the foldable electronic device is in a state between the folded and unfolded states, the first component can contact both the hinge housing and the first housing.

[0210] The first component and the first support structure may be in contact with each other. The first component and the first support structure may be arranged such that they will contact each other when deformed during use. The first component and the first support structure may be spaced apart from each other by a distance less than the length of the first support structure, the length of which is measured in a direction parallel to the hinge's folding axis. The first component and the first support structure may be spaced apart from each other by a distance less than the width of the first support structure, the width of which is measured in a direction perpendicular to the hinge's folding axis. The first component and the first support structure may be spaced apart by a distance less than the minimum distance between two external points of the first support structure, wherein this distance passes through the centroid of the support structure.

[0211] The first component can be arranged to prevent at least some dust, particles, contaminants, or foreign matter from passing between the first housing and the hinge. The first component can be a dustproof structure.

[0212] The foldable electronic device may include a second component located between a first housing and a hinge, such that a first support structure is located between the first component and the second component. The second component and the first support structure may be adjacent to each other. When the foldable electronic device is in a folded or unfolded state, the second component may contact both the hinge housing and the first housing.

[0213] When the foldable electronic device is in the folded state and when it is in the unfolded state, the second component can contact both the hinge housing and the first housing. When the foldable electronic device is in a state between the folded and unfolded states, the second component can contact both the hinge housing and the first housing.

[0214] The second component and the first support structure may contact each other. The second component and the first support structure may be arranged such that they will contact each other when deformed during use. The second component and the first support structure may be spaced apart from each other by a distance less than the length of the first support structure, the length of which is measured in a direction parallel to the hinge's folding axis. The second component and the first support structure may be spaced apart from each other by a distance less than the width of the first support structure, the width of which is measured in a direction perpendicular to the hinge's folding axis. The second component and the first support structure may be spaced apart from each other by a distance less than the minimum distance between two external points of the first support structure, wherein this distance passes through the centroid of the support structure.

[0215] The second component can be arranged to prevent at least some dust, particles, contaminants, or foreign objects from passing between the first housing and the hinge. The second component can be a dustproof structure.

[0216] The support structure can be configured such that if the first housing is pushed towards the hinge, the support structure resists movement of the first housing towards the hinge. The support structure can be configured such that if the first housing is pushed towards the hinge when the foldable electronic device is in a folded state, the support structure resists movement of the first housing towards the hinge. The support structure can be configured such that if the first housing is pushed towards the hinge when the foldable electronic device is in an unfolded state, the support structure resists movement of the first housing towards the hinge. The support structure can be configured such that if the first housing is pushed towards the hinge when the foldable electronic device is in a state between a folded and unfolded state, the support structure resists movement of the first housing towards the hinge. The force provided by the support structure in resisting a push can be greater than the force provided by the first member in resisting the same push. The force provided by the support structure in resisting a push can be greater than the force provided by the second member in resisting the same push.

[0217] A foldable electronic device (100) according to at least one embodiment may include a first housing (110), a second housing (120), a hinge structure (164a) coupled to the first housing (110) and the second housing (120), a hinge housing (165) on which the hinge structure (164a) is disposed, a first dustproof structure (811) and a second dustproof structure (812) disposed between the first housing (110) and the hinge housing (165), and a first support structure (821) disposed between the first dustproof structure (811) and the second dustproof structure (812) in the longitudinal direction of the hinge housing (165).

[0218] According to the embodiment, the first dustproof structure (811) and the first support structure (821) may be in contact with each other or may be spaced apart from each other by a distance less than the length of the first support structure (821).

[0219] According to the embodiment, the second dustproof structure (812) and the first support structure (821) can be in contact with each other, or can be spaced apart from each other by a distance less than the length of the first support structure (821).

[0220] According to an embodiment, at least a portion of the first dustproof structure (811) and at least a portion of the second dustproof structure (812) may contact the first portion (621) of the outer surface of the hinge housing (165) in the folded or unfolded state of the foldable electronic device (100).

[0221] According to an embodiment, at least a portion of the first support structure (1320) may be formed such that the width decreases and then increases from the inner surface (1135) of the first housing (110) toward the hinge housing (165).

[0222] The length of the first support structure can be measured along an axis parallel to the folding axis of the hinge structure. The height of the first support structure can be measured along an axis between the point where the first support structure contacts the first housing in use and the point where the first support structure contacts the hinge housing in use. The width of the first support structure can be measured along any axis perpendicular to both the length axis and the height axis. At least a portion of the first support structure can be formed such that its width decreases and then increases between the inner surface of the first housing and the hinge housing. At least a portion of the first support structure can be formed such that its width has a minimum value at the point between the first housing and the hinge housing, and the width of a portion of the first support structure at the minimum value is less than the width of a portion of the support structure at the point adjacent to both the first housing and the hinge housing.

[0223] According to an embodiment, at least a portion of the first support structure (1320) may include a head region (1330) facing the outer surface of the hinge housing (165) and a neck region (1322) disposed between the head region (1330) and the inner surface (1135) of the first housing (110).

[0224] According to an embodiment, the head region (1330) may protrude further toward at least one of the first dustproof structure (1311) or the second dustproof structure (1312) than the neck region (1322).

[0225] According to an embodiment, a portion of the first housing (110) may include a receiving space (1350) therein for accommodating at least a portion of the first support structure (1320).

[0226] According to an embodiment, a portion of the first support structure (1320) may be spaced apart from the inner surface of the receiving space (1350) to form at least one cavity (1351).

[0227] According to an embodiment, an adhesive member (1360) may be formed in at least one cavity (1351). According to an embodiment, the inner surface of the receiving space (1350) may include a stepped structure (1136).

[0228] According to an embodiment, a portion of the stepped structure may be spaced apart from a portion of the first support structure (1320) to form at least one cavity (1352), and an adhesive member (1360) may be formed in at least one cavity (1352).

[0229] According to an embodiment, when the foldable electronic device (100) is in a closed state, at least a portion of the first support structure (310) can contact a second portion (622) of the outer surface of the hinge housing (165) that is different from the first portion (621).

[0230] According to an embodiment, the foldable electronic device (100) may further include a third dustproof structure (813) arranged in a straight line with the second dustproof structure (812) in the longitudinal direction of the hinge housing (165) and a second support structure (822) disposed between the second dustproof structure (812) and the third dustproof structure (813).

[0231] According to an embodiment, the first support structure (821) may have a different length than the second support structure (822).

[0232] According to an embodiment, at least one of the first dustproof structure (811) or the second dustproof structure (812) may include a recess (9111, 9121, 9122).

[0233] According to an embodiment, at least a portion of the first support structure (9201, 9202, 9211, 9212) may be disposed in the recess (9111, 9121, 9122).

[0234] According to an embodiment, at least one of the first dustproof structure (9141) or the second dustproof structure (9142) (9141) may include at least one recess (9143, 9144) formed at one end.

[0235] According to an embodiment, the first support structure (9204) may have at least one protrusion (9124, 9224) corresponding to at least one recess (9143, 9144).

[0236] According to an embodiment, a first dustproof structure (9105) may at least partially surround a first edge of a first support structure (9205), and a second dustproof structure may at least partially surround a second edge of the first support structure.

[0237] According to an embodiment, the first dustproof structure (1010) may have a first virtual centerline (F) parallel to the hinge housing (165), and the first support structure (1020) may coincide with at least a portion of the first virtual centerline (F).

[0238] According to an embodiment, the first curvature (R1) of at least one corner of the first dustproof structure (1110) may be less than the second curvature (R2) of at least one corner of the first support structure (1120).

[0239] According to an embodiment, the first dustproof structure (1210) can have a greater height than the first support structure (1220).

[0240] According to an embodiment, the first support structure (1620) may include a channel (1610) formed in the longitudinal direction of the hinge housing (165).

[0241] According to an embodiment, the first support structure (1820) may include at least one guide protrusion (1821).

[0242] According to an embodiment, each of the first housing (110) and the second housing (120) may include at least one guide recess (1810) corresponding to the guide protrusion (1821).

[0243] According to an embodiment, the foldable electronic device (100) may further include a third dustproof structure and a fourth dustproof structure disposed between the second housing (120) and the hinge housing (165), and a second support structure (320) disposed between the second housing (120) and the hinge housing (165) so as to be adjacent to the third dustproof structure and the fourth dustproof structure.

[0244] According to the embodiment, the first dustproof structure (811) and the second dustproof structure (812) disposed between the first housing (110) and the hinge housing (165) can be symmetrical with the third dustproof structure and the fourth dustproof structure disposed between the second housing (120) and the hinge housing (165).

[0245] According to an embodiment, the first support structure (310) disposed between the first housing (110) and the hinge housing (165) can be symmetrical with the second support structure (320) disposed between the second housing (120) and the hinge housing (165).

[0246] According to an embodiment, the first support structure (310) can slide while in contact with at least a portion of the outer surface of the hinge housing (165).

[0247] According to an embodiment, the first housing (110) may include a first bonding protrusion (1940).

[0248] According to an embodiment, the first support structure (1920) may include at least a portion of the first engagement protrusion (1940) that is slidably engaged with it and disposed on a side surface of the first support structure (1920) and a flange (1922) that protrudes in a direction opposite to that of the second engagement protrusion (1921).

[0249] According to an embodiment, at least a portion of the first dustproof structure 1911 may overlap with the flange (1922).

[0250] A foldable electronic device (100) according to at least one embodiment may include: a first housing (110); a second housing (120); a hinge structure (164a) coupled to the first housing (110) and the second housing (120); a hinge housing (165) accommodating at least a portion of the hinge structure (164a) and substantially disposed between the first housing (110) and the second housing (120); at least one first structure (210) disposed between the inner surface of the first housing (110) and the outer surface of the hinge housing (165) and in the foldable electronic device The sub-device (100) changes from an unfolded state to a folded state while at least partially contacting a first portion (621) of the outer surface of the hinge housing (165); and at least one second structure (310) is disposed between the inner surface of the first housing (110) and the outer surface of the hinge housing (165) so as to be adjacent to the first structure (210) and at least partially contacting a second portion (622) of the outer surface of the hinge housing (165) that is different from the first portion (621) while the foldable electronic device (100) changes from an unfolded state to a folded state.

[0251] According to embodiments of this disclosure, the gap between each of the first and second housings and the hinge housing can be kept constant by a support structure that is in close contact with the dustproof structure.

[0252] According to embodiments of this disclosure, the dustproof structure can be in close contact with the support structure, and thus can prevent or reduce the infiltration of external foreign objects between each of the first and second housings and the hinge housing and / or between the dustproof structure and the support structure.

[0253] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to specific embodiments and include various changes, equivalents, or substitutions for corresponding embodiments. Regarding the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It should be understood that, unless the relevant context clearly indicates otherwise, the singular form of a noun corresponding to an item may include one or more things. As used herein, each phrase such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items listed together in the corresponding phrase. As used herein, terms such as “first” and “second” or “first” and “second” may be used simply to distinguish corresponding components from another component and do not limit the components in other respects (e.g., importance or order). It should be understood that if an element (e.g., the first element) is referred to as "combined" with, "combined to" another element (e.g., the second element), "connected" to, or "attached to" another element (e.g., the second element) with or without the terms "operationally" or "communically", it means that the element can be combined with the other element directly (e.g., wired), wirelessly, or via a third element.

[0254] Depending on the context, in hardware or software, the expression "adapted to or configured to" as used in this disclosure may be used interchangeably with expressions such as "suitable for," "capable of," "adapted to," "made as," "capable of," or "designed to." The expression "configured as a device" may mean that the device is "capable" of working with another device or other component. For example, "a processor set up (or configured to) perform A, B, and C" may refer to a dedicated processor (e.g., an embedded processor) for performing the corresponding operations or a general-purpose processor (e.g., a CPU or AP) that performs the corresponding operations by executing one or more programs stored in a memory device (e.g., memory 130).

[0255] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integral component or its smallest unit or part adapted to perform one or more functions. A "module" may be implemented mechanically or electronically and may include, for example, known or to be developed application-specific integrated circuit (ASIC) chips, field-programmable gate arrays (FPGAs), or programmable logic devices for performing some operations.

[0256] At least a portion of an apparatus (e.g., a module or its function) or method (e.g., operation) according to various embodiments may be implemented by instructions stored in a computer-readable storage medium (e.g., memory 130) as program modules. When executed by a processor (e.g., processor 120), the instructions cause the processor to perform a function corresponding to the instructions. The computer-readable storage medium may include a hard disk, floppy disk, magnetic media (e.g., magnetic tape), optical media (e.g., CD-ROM, DVD, magneto-optical media (e.g., floppy disk), embedded memory, etc. The instructions may include code produced by a compiler or code executable by an interpreter.

[0257] According to various embodiments, each component (e.g., a module or program) described above may include a single entity or multiple entities, and some of the multiple entities may be separately located in different components. According to various embodiments, one or more of the components described above may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner, since they were performed by the corresponding components of the multiple components prior to integration. According to various embodiments, operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or operations may be performed in a different order, omitted, or one or more other operations may be added.

[0258] It will be understood that all the embodiments and their technical features described above may be combined with each other in every combination unless there is a conflict between the two embodiments or features. That is, each combination of two or more embodiments described above is contemplated and included within this disclosure. One or more features from any embodiment may be incorporated into any other embodiment and provide a corresponding advantage or benefit.

Claims

1. A foldable electronic device, the foldable electronic device comprising: First shell; Second shell; A hinge structure, said hinge structure being coupled to the first housing and the second housing; A hinge housing that accommodates at least a portion of the hinge structure and is substantially disposed between the first housing and the second housing; A first partition structure is disposed on the inner surface of the first housing, and the first partition structure is configured to maintain a gap between the first housing and the hinge housing. A second partition structure is disposed on the inner surface of the second housing, and the second partition structure is configured to maintain a gap between the second housing and the hinge housing; as well as A first dustproof structure is arranged in a straight line with the first partition structure along a direction parallel to the folding axis of the foldable electronic device, wherein at least a portion of the first dustproof structure is configured to contact a portion of the outer surface of the hinge housing when the electronic device changes from an unfolded state to a folded state; and A second dustproof structure is arranged in a straight line with the second partition structure along a direction parallel to the folding axis of the foldable electronic device, wherein at least a portion of the second dustproof structure is configured to contact a portion of the outer surface of the hinge housing as the electronic device changes from the unfolded state to the folded state.

2. The foldable electronic device according to claim 1, wherein, The length of the first dustproof structure in the direction parallel to the folding axis is longer than the length of the first partition structure in the direction parallel to the folding axis, and The length of the second dustproof structure in the direction parallel to the folding axis is longer than the length of the second partition structure in the same direction.

3. The foldable electronic device according to claim 1, wherein, The height of the first dustproof structure, measured in a direction perpendicular to the inner surface of the first housing before the first dustproof structure contacts the hinge housing, is greater than the height of the first partition structure, measured in the same direction perpendicular to the inner surface of the first housing before the first partition structure contacts the hinge housing. Wherein, the height of the second dustproof structure, measured in a direction perpendicular to the inner surface of the second housing before the second dustproof structure contacts the hinge housing, is greater than the height of the second partition structure, measured in the same direction perpendicular to the inner surface of the second housing before the second partition structure contacts the hinge housing.

4. The foldable electronic device according to claim 1, wherein, The first partition structure and the second partition structure are symmetrical about the folding axis located between them, and the first dustproof structure and the second dustproof structure are symmetrical about the folding axis located between them.

5. The foldable electronic device according to claim 1, wherein, The first dustproof structure at least partially surrounds a first edge of the first partition structure, and the second dustproof structure at least partially surrounds a second edge of the second partition structure.

6. The foldable electronic device according to claim 1, wherein, The curvature of at least one corner of the first dustproof structure is less than the curvature of at least one corner of the first partition structure, and Wherein, the curvature of at least one corner of the second dustproof structure is less than the curvature of at least one corner of the second partition structure.

7. The foldable electronic device according to claim 1, wherein, The inner surface of the first housing includes a recess in which the first partition structure is disposed, and The inner surface of the second housing includes a recess in which the second partition structure is disposed.

8. The foldable electronic device according to claim 7, wherein, Each of the first partition structure and the second partition structure includes a first cavity, and at least a portion of each of the recesses in the first housing and the second housing is formed with an adhesive member between the first cavity and the first cavity.

9. The foldable electronic device according to claim 7, wherein, The first housing includes a protrusion formed on a side surface of the first housing, and the first partition structure includes a second cavity corresponding to the protrusion formed on the side surface of the first housing.

10. The foldable electronic device according to claim 9, wherein, The protrusion is incorporated into the second cavity in such a manner that the first partition structure slides from the first portion to the second portion of the recess of the first housing after being placed in the first portion of the first housing.

11. The foldable electronic device of claim 10, wherein, An adhesive member is filled in the first portion of the recess of the first housing.

12. The foldable electronic device according to claim 1, wherein, At least one of the first partition structure and the second partition structure includes a head portion, a body portion, and a neck portion located between the head portion and the body portion, and The first width of the neck portion is smaller than the second width of the head portion and the third width of the main body portion.

13. The foldable electronic device according to any one of the preceding claims, wherein, The dustproof structure comprises multiple fibers.

14. The foldable electronic device according to any one of the preceding claims, wherein, The first partition structure is configured to perform at least one of the following: When the foldable electronic device is in a folded state, if the first housing is pushed towards the hinge housing, then the movement of the first housing toward the hinge housing is resisted, or When the foldable electronic device is in the unfolded state, if the first housing is pushed toward the hinge housing, the movement of the first housing toward the hinge housing is resisted.

15. The foldable electronic device according to any one of the preceding claims, wherein, The second partition structure is configured to perform at least one of the following: When the foldable electronic device is in the folded state, if the second housing is pushed towards the hinge housing, then the movement of the second housing toward the hinge housing is resisted, or When the foldable electronic device is in the unfolded state, if the second housing is pushed toward the hinge housing, the movement of the second housing toward the hinge housing is resisted.

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