Multi-functional board assembly and scalable array module and assembly method

Abstract

The application discloses a multifunctional board assembly, an extensible array module and an assembling method. The multifunctional board assembly comprises a multifunctional board and a coupling shell. The multifunctional board is provided with a plurality of coupling shells on at least one board surface. One end of the coupling shell is provided with a recessed cavity, and the end is welded with the multifunctional board to form a welding surface. The welding surface and the multifunctional board are surrounded to form a coupling cavity. The coupling shell along the outer edge of the coupling cavity is provided with at least one circle of soldering dam. The soldering dam height determines the soldering paste height before soldering. The other end of the coupling shell is provided with an opening. The opening is communicated with the coupling cavity to form a vertical channel. The opening is provided with a detachable connecting part. The application has the following beneficial effects: the existing technology is abandoned, the elastic force of the hair button is generated by compression to press on the upper and lower pads, the upper shell is combined with the screw of the radio frequency connector, the radio frequency connector which needs to be repeatedly plugged and unplugged and bears external force is provided with stable mechanical strength and excellent maintainability.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment technology, and more particularly to multifunctional board assemblies, expandable array modules, and assembly methods. Background Technology

[0002] As electronic equipment evolves towards miniaturization, multifunctionality, and high frequency, system integration places higher demands on space utilization efficiency. Traditional planar transmission interconnection can no longer meet the needs, so three-dimensional vertical interconnection integration technology has become a key breakthrough. Due to its characteristics such as solderless operation, high density, low profile, and good microwave performance, button connectors are recognized as an advanced vertical interconnection solution in the RF and low frequency fields. Especially in millimeter-wave scalable array modules, button connectors are usually used to achieve vertical interconnection, and then the printed circuit board is fixed to the metal carrier by screw mechanical assembly or large-area welding to achieve functional integration and space compression.

[0003] However, button connectors inherently have limitations: their contacts are made of braided metal alloy wires, resulting in a random structure that makes reliability and lifespan difficult to assess; simultaneously, their transmission performance is highly dependent on the pressing state and alignment accuracy, making them extremely sensitive to assembly processes. In practical engineering applications, when the printed circuit board size of the expandable array module exceeds 200mm, its warpage can reach 1mm-1.5mm, leading to increased vertical height differences and alignment deviations. This makes it difficult to guarantee the pressing state of the array-type button connectors, posing a significant risk to transmission stability. Using screws for mechanical pressing introduces substantial mechanical stress, reducing solder joint and assembly reliability; large-area welding not only presents stress issues but also allows solder to easily flow into the button mounting holes, causing short circuits or improper assembly. Even with tooling protection or rework measures, achieving a high yield rate is difficult. Furthermore, in fields such as automotive electronics, civil aviation, and commercial aerospace, electronic products must withstand harsh vibration environments, and the long-term stability and reliability of button contact transmission cannot meet the requirements of high-reliability products.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of the invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0005] The technical problem to be solved by this invention is: on the basis of satisfying vertical interconnect transmission, how to ensure the miniaturization and high integration of scalable array modules, improve their assembly stability and long-term reliability, simplify the process flow, and improve production efficiency.

[0006] The present invention solves the above-mentioned technical problems through the following technical means:

[0007] This invention claims protection for a multifunctional board assembly, including a multifunctional board and coupling housings. At least one surface of the multifunctional board is provided with a plurality of coupling housings. One end of the coupling housing has a cavity, and the end of the coupling housing containing the cavity is welded to the multifunctional board to form a welding surface, which encloses each other to form a coupling cavity. At least one ring of weld resist barrier is provided along the outer edge of the coupling housing, and the weld at the welding surface is at the same height as the weld resist barrier. The other end of the coupling housing has an opening, which communicates with the coupling cavity to form a vertical channel, and a detachable connection part is provided at the opening.

[0008] Abandoning the existing technology of using a fuzzy button to generate elasticity and press against the upper and lower pads, this embodiment adopts a "bottom solder and top screw" combination design, with the upper shell threadedly connected to the RF connector. This provides the RF connector, which needs to be repeatedly plugged and unplugged and withstand external forces, with solid mechanical strength and excellent maintainability.

[0009] The lower housing is welded to the functional board and connected to the coupling cavity through the upper housing cavity to form a vertical channel for signal transmission, achieving vertical interconnection. On this basis, a permanent and robust connection is formed between the lower housing and the multi-functional board. The signal transmission path is fixed and will not fluctuate due to changes in the external environment, resulting in transmission stability far exceeding that of contact type. Moreover, the housing can be printed with solder paste on a stencil and reflow soldered synchronously with other components, just like ordinary surface-mount components, without the need for additional mounting plates or pressing fixtures, simplifying the process.

[0010] Preferably, the coupling housing includes a lower housing and an upper housing, with a cavity at one end of the lower housing, one end of the upper housing at the other end of the lower housing, and an opening at the other end of the upper housing.

[0011] Preferably, welding pins are arranged diagonally at the end of the lower housing away from the upper housing, and the welding pins are offset from the cavity.

[0012] Welding pins have been added, which are set diagonally, which is equivalent to adding additional fixing points at the four corners of the lower housing. When the expandable array module is subjected to horizontal force, it can effectively share the stress and prevent the lower housing from sliding or shifting horizontally on the function board.

[0013] Preferably, the detachable connection is threaded.

[0014] The upper housing is threaded to the RF connector, which is used for RF connectors that require repeated insertion and removal and are subjected to external forces, providing robust mechanical strength and excellent maintainability.

[0015] Preferably, the welding surfaces and weld barrier dams of the coupling shell are silver-plated.

[0016] The welding surfaces and weld barrier of the lower shell are silver-plated to make them weldable.

[0017] Preferably, an adhesive dispensing groove is provided on the upper housing.

[0018] Two adhesive grooves are symmetrically provided on the upper housing for applying adhesive to the threads after the upper housing and non-RF connector are assembled to prevent loosening and ensure assembly reliability.

[0019] Preferably, the scalable array module using a multi-function board assembly includes a system-in-package (SIP) assembly and an RF connector. The SIP assembly is disposed on any side of the multi-function board, and the SIP assembly is offset from the coupling housing. The RF connector is disposed at the end of the coupling housing furthest from the multi-function board.

[0020] Preferably, the assembly method applied to the scalable array module of claim 7 is characterized by comprising the following steps: Confirm the solder paste height on the welding surface before welding; Based on the pre-soldering solder paste height, solder paste was applied to the surface of the multi-functional board. At the same temperature, system-in-package components and coupling housings are soldered onto the surface of the multi-functional board; The opening is connected to the RF connector via a detachable connection.

[0021] Preferably, the height of the weld interface after welding is determined based on the height of the weld barrier dam. Based on the solder height at the post-weld interface, determine the volume of the post-weld interface solder. Based on the welding process correction factor, confirm the volume of the weld metal at the interface after welding is equal to the volume of the pre-welding solder paste that needs to be applied before welding. The height of the solder paste before soldering is determined by the volume of the solder paste before soldering.

[0022] The height of the weld barrier is used as the design target value for the height of the weld after welding. By accurately calculating the amount of solder paste applied before welding and taking into account factors such as solder paste shrinkage, volatilization and melting, the solder formed after welding is made to fill the welding area on the outside of the barrier, without overflowing the inside of the barrier, and ensuring full filling. This effectively avoids the solder flowing into the coupling cavity and affecting the electrical properties when welding the lower shell and the multi-functional board.

[0023] Preferably, based on the volume of the solder paste before soldering, during solder paste application, an inward shrinkage compensation space is reserved in advance according to the amount of solder paste collapse under pressure.

[0024] The advantages of this invention are: it provides a scalable array module for use in the Ka band, with a port VSWR ≤1.8 and differential loss ≤0.8dB. The module weight is reduced by 30%, assembly efficiency is increased by 42%, cost is reduced by 55%, and the processing yield is 96%. It meets typical environmental testing requirements for thermal cycling from -30℃ to +70℃, passes typical vibration and shock environmental tests, exhibits stable electrical properties, and demonstrates good reliability and environmental adaptability. Attached Figure Description

[0025] Figure 1 This is an exploded view of the scalable array module in Embodiment 1 of the present invention; Figure 2 yes Figure 1 A cross-sectional diagram from the AA perspective; Figure 3 yes Figure 2 Enlarged view of point A; Figure 4 yes Figure 3 A partial schematic diagram; Figure 5 This is a schematic diagram of the coupling shell cut along the axis in Embodiment 1 of the present invention; Figure 6 This is a bottom view of the coupling shell in Embodiment 2 of the present invention; Figure 7 This is a top view of the coupling shell in Embodiment 2 of the present invention; Figure 8 yes Figure 7 A cross-sectional diagram from a BB perspective; Figure 9 This is a schematic diagram of the total rectangular area enclosed by the coupling cavity and the edge of the solder paste in the recessed area reserved for the solder paste under pressure and collapse in Embodiment 2 of the present invention. Figure 10 This is a side view of the solder paste in embodiment two of the present invention, with pre-reserved inward shrinkage compensation on the multi-functional board; Figure 11 This is a side view of the multifunctional board and the lower shell after welding according to Embodiment 2 of the present invention.

[0026] 1. Multifunctional board; 10. A-side board; 11. B-side board; 2. Coupling housing; 20. Lower housing; 201. Welding pin; 202. Square channel; 203. Weld resistance barrier; 204. Directional foot; 21. Upper housing; 210. Glue dispensing groove; 3. System-in-package components; 4. RF connectors; 5. Mounting housing; 6. Cover plate. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Example 1 See Figure 1This embodiment requires protection of the scalable array module, including a multifunction board 1, a coupling housing 2, a system-in-package assembly 3, an RF connector 4, a mounting housing 5, and a cover plate 6.

[0029] See Figure 2 , Figure 3 and Figure 4 The multi-functional board 1 is flat and serves as the mounting reference for the entire structure. The multi-functional board 1 has two surfaces, defined as surface A 10 and surface B 11. Both surfaces A 10 and B 11 are arranged in an array with sixty-four coupling housings 2. The coupling housings 2 are used for non-contact mounting of the multi-functional board 1 and the radio frequency cable.

[0030] See Figure 5 The multifunctional board 1 is welded to the coupling shell 2. Specifically, the coupling shell 2 is an integral structure. The direction closer to the multifunctional board 1 is defined as "down". The coupling shell 2 includes a lower shell 20 and an upper shell 21. The lower surface of the lower shell 20 is welded to the surface of the multifunctional board 1. The lower shell 20 has a square structure. Welding pins 201 are arranged diagonally on both sides of the lower surface of the lower shell 20. The arrangement of welding pins 201 can increase the shear strength and tensile strength of the coupling shell 2 on the multifunctional board 1, reduce the influence of mechanical stress on the welding points of the coupling shell 2 during assembly or testing with the external interface, and ensure a high-precision and high-reliability welding connection between the non-contact coupling structure and the multifunctional board 1.

[0031] A square groove 202 runs through the center of the lower surface of the lower housing 20. After the lower housing 20 is welded to the surface of the multi-functional board 1, they form a coupling cavity. A weld barrier dam 203 protrudes from the lower surface of the lower housing 20 along the outer edge of the coupling cavity to prevent solder from flowing into the coupling cavity and affecting the electrical properties during the welding of the coupling housing 2 and the multi-functional board 1.

[0032] The upper surface of the lower housing 20 is provided with an upper housing 21, which is cylindrical. The cavity of the upper housing 21 is connected to the coupling cavity to form a vertical channel for signal transmission. The cavity of the upper housing 21 matches the outer contour of the RF connector 4 and they are assembled with threads. This is to ensure the connection strength between the cavity of the upper housing 21 and the RF connector 4 while also meeting the requirement of lightweight design. The RF connector 4 is connected to the RF cable.

[0033] Furthermore, the coupling cavity is silver-plated to make it conductive; the welding surface of the lower housing 20 and the weld barrier 203 are also silver-plated to make them solderable.

[0034] Furthermore, the lower housing 20 is provided with directional feet 204 on the outside for directional marking when the lower housing 20 is mounted and welded to the multi-functional board 1; the upper housing 21 is provided with two symmetrical glue dispensing grooves 210 for thread dispensing after the upper housing 21 and the non-RF connector 4 are assembled to prevent loosening and ensure assembly reliability.

[0035] Several system-in-package (SIP) components 3 and other components are also soldered onto surface A 10, which are staggered from the coupling housing 2. The SIP components 3 adopt BGA packaging to integrate chips with different functions such as CPU, memory, and power management into a single component. Similarly, other components required for this surface are also soldered onto surface B 11. This is existing technology and will not be described in detail here.

[0036] After the above welding assembly, the welded parts are assembled inside the mounting housing 5, and the cover plate 6 is installed. Finally, they are assembled into an expandable array module.

[0037] The advantage of this implementation is that it abandons the method of using a bobbin to generate elasticity and press against the upper and lower pads in the existing technology. This embodiment adopts a "bottom soldering and top screwing" combination design, in which the upper housing 21 is threadedly connected to the RF connector 4. This provides the RF connector 4, which needs to be repeatedly plugged and unplugged and withstand external forces, with solid mechanical strength and excellent maintainability.

[0038] The lower housing 20 is welded to the functional board and connected to the coupling cavity through the upper housing 21 cylinder cavity to form a vertical channel for signal transmission, achieving the effect of vertical interconnection. On this basis, a permanent and robust connection is formed between the lower housing 20 and the multi-functional board 1. The signal transmission path is fixed and will not fluctuate due to changes in the external environment. The transmission stability is much higher than that of contact type. Moreover, the housing can be printed with solder paste on a stencil and reflow soldered synchronously with other components, just like ordinary surface-mount components, without the need for additional mounting plates or pressing fixtures, simplifying the process.

[0039] Furthermore, a weld barrier dam 203 is set up, which not only prevents the solder from flowing into the coupling cavity during welding and affecting the electrical properties; but also works together with the amount of solder after welding to precisely lock the height of the coupling cavity, so that it is not directly affected by the warping and deformation of the multi-functional board 1.

[0040] Furthermore, welding pins 201 are added. By setting them diagonally, it is equivalent to adding additional fixing points at the four corners of the lower housing 20. When the expandable array module is subjected to horizontal force, it can effectively share the stress and prevent the lower housing 20 from sliding or shifting horizontally on the function board.

[0041] Based on this, in this embodiment, sixty-four coupling shells 2 are arranged on both sides of the multi-functional board 1, and a large number of system-in-package components 3 and other components are also integrated on it. Compared with the traditional button solution that requires a special mounting plate and pressing tool, this solves the layout limitation and achieves an integration density that is difficult to achieve.

[0042] Example 2 See Figure 6 and Figure 7 and Figure 8This embodiment, based on Embodiment 1, provides a method for confirming the pre-soldering solder paste coating height, used to confirm the required pre-soldering solder paste height before welding the lower housing 20 to the multi-functional board surface. h The confirmation method specifically includes the following steps: S 1. Based on the height of the weld resistance dam 203, confirm the height of the weld interface after welding. H Specifically, in order to ensure the electrical performance of the coupling connection between the multi-functional board and the radio frequency cable 4, the height of the weld between the sealed lower housing 20 and the multi-functional board surface should be infinitely close to the height of the weld barrier dam 203.

[0043] S 2. Based on the solder height at the post-weld interface H Calculate the volume of solder at the interface after welding. V 标准 Specifically, the volume of solder at the interface after welding. V 标准 Satisfying Formula 1: V 标准 = H × S 1 (Formula 1) in, S 1 represents the welding surface area between the lower housing 20 and the multi-functional panel. S 1 satisfies formula 2: S 1= S max - S 2- S 3 (Formula 2) in, S max The area of ​​the outermost large rectangle of the coupling shell. S 2 represents the rectangular area of ​​the outer edge of the weld resistance dam 203 boundary. S 3 represents the area of ​​hole 201 for welding pin.

[0044] In Formula 2, the area of ​​the outermost large rectangle of the coupling shell S max Satisfying Formula 3: S max = ( L 0+ X 0×2)×( W 0+ Y 0×2) (Formula 3) in, L 0 represents the length of the coupling cavity; X 0 represents the length of one side of the pad on the multi-functional board where the coupling housing is located;W 0 represents the width of the coupling cavity; Y 0 represents the width of the pad on the multifunction board of the coupling housing.

[0045] In Formula 3, the single-side length of the pad on the multi-functional board of the coupling housing is... X 0 satisfies formula 4: X 0= X 1+ B (Formula 4) in, X 1 represents the length of a single side of the welding surface of the coupling shell; B The thickness of the weld resistance dam is 203.

[0046] In Formula 3, the single-side width of the pads on the multi-functional board of the coupling housing is... Y 0 satisfies formula 5: Y 0= Y 1+ B (Formula 5) in, Y 0 represents the width of a single side of the welding surface of the coupling shell; B The thickness of the weld resistance dam is 203.

[0047] In Formula 2, the rectangular area of ​​the outer edge of the weld resistance dam 203 boundary. S 2 satisfies formula 6: S 2 = ( L 0+ B ×2)×( W 0+ B ×2) (Formula 6) in, L 0 represents the length of the coupling cavity. B For the weld resistance dam, the thickness is 203. W 0 represents the width of the coupling cavity.

[0048] In Formula 2, the area of ​​welding pin 201 hole S 3 satisfies formula 7: S 3= πr 2 (Formula 7) in, r The radius is 201 for welding pins.

[0049] S 3. Based on the welding process correction factor, confirm the volume of solder at the interface after welding. V 标准 Volume of solder paste required to be applied before soldering V 涂覆 Specifically, the volume of solder paste before soldering.V 涂覆 Satisfying Formula 8: V 标准 = V 涂覆 ×(1- k ) / R (Formula 8) in, k This is the volume volatility factor of solder paste, typically 40%. R The welding penetration rate is typically 98%.

[0050] Solder paste volume volatility k and welding penetration R Together, they constitute the welding process correction coefficient, which is used to compensate for the fact that in actual welding, the solder paste will evaporate and the molten solder may not fill 100% of the gap, so as to correct the theoretically calculated solder paste volume.

[0051] S 4. Based on the volume of solder paste before soldering V 涂覆 The height of the solder paste before soldering was obtained. h Specifically, the volume of solder paste before soldering. V 涂覆 Satisfying Formula 9: V 涂覆 = h × S 涂覆 (Formula 9) in, S 涂覆 The area covered by solder paste satisfies Formula 10: S 涂覆 = S max - S 4- S 3 (Formula 10) See Figure 9 and Figure 10 and Figure 11 ,in, S max The area of ​​the outermost large rectangle of the coupling shell; S 4. The total rectangular area enclosed by the coupling cavity and the edge of the solder paste in the recessed area reserved to accommodate the collapse of the solder paste under pressure; In Formula 9, the total area of ​​the rectangle enclosed by the coupling cavity and the edge of the solder paste in the recessed region reserved to accommodate the solder paste's collapse under pressure is... S 4 satisfies formula 11: S 4 = ( L 0+ u×2)×( W 0+ u ×2) (Formula 11) in, u The solder paste application size is the single-sided inward reduction dimension relative to the solder pad, typically 0.5. mm .

[0052] In this embodiment, the height of the weld barrier dam 203 is used as the design target value for the height of the weld after welding. By accurately calculating the amount of solder paste applied before welding, and taking into account factors such as the shrinkage, volatilization and melting of the solder paste due to pressure collapse, the solder formed after welding is made to fill the welding area on the outside of the barrier, without overflowing the inside of the barrier, and ensuring full filling. This effectively avoids the solder from flowing into the coupling cavity and affecting the electrical properties when welding the lower shell 20 and the multi-functional board 1.

[0053] Example 3 This embodiment, based on Embodiment 2, provides a specific application of the scalable array module. To achieve high-performance specifications for the Ka band (26.5 GHz to 40 GHz), the size of the scalable array module is quantified. Specifically, the Ka band refers to: The thickness of the upper shell 21 is 0.6mm.

[0054] The length L0 of the coupling cavity is 4.5 mm; the width W0 of the coupling cavity is 6 mm; during processing, the machining accuracy of the characteristic structural dimensions of the coupling cavity must be ±0.02 mm.

[0055] The single-sided length X1 of the welding surface of the coupling shell is 1.5mm, and the single-sided width Y1 of the welding surface of the coupling shell is 3.5mm; during welding, it is necessary to ensure that the flatness of the welding surface is ≤0.05mm.

[0056] The solder height H at the interface after soldering is 0.06mm, and the thickness of the solder resist dam 203 is 0.06mm. The width B of the solder resist dam 203 is preferably 0.2mm. According to Formula 4, the single-side length X0 of the pad on the multi-functional board of the coupling shell is 1.7mm. According to Formula 5, the single-side width Y0 of the pad on the multi-functional board of the coupling shell is 3.7mm.

[0057] Based on Formula 2, the area S of the outermost large rectangle of the coupled shell can be obtained. max It is 105.86mm. 2 .

[0058] Based on Formula 6, the rectangular area S2 of the outer edge of the weld resistance dam 203 is 31.36 mm². 2 .

[0059] The welding pin 201 has a diameter of 1mm and a length of 2mm. Based on formula 7, the area of ​​the two holes for welding pin 201 is 1.57mm². 2 .

[0060] Based on Formula 1, the volume of solder at the interface after welding, V, can be obtained. 标准 It is 4.38mm 3 .

[0061] Based on Formula 8, the volume of solder paste before soldering, V, can be obtained. 涂覆 It is 7.24mm 3 .

[0062] Based on Formula 11, the rectangular area S4 of the outer edge of the weld resistance dam 203 is 38.5 mm². 2 .

[0063] Based on Formula 10, the solder paste coating area S can be obtained. 涂覆 It is 65.79mm 2 .

[0064] Based on Formula 9, the solder paste height h before soldering is 0.11 mm.

[0065] In this embodiment, the scalable array module exhibits excellent overall performance when used in the Ka band. In terms of electrical performance, it has a port VSWR ≤1.8 and insertion loss ≤0.8dB, meeting the high performance requirements of the millimeter-wave band. In terms of cost, compared to traditional button-type vertical interconnect solutions, it reduces weight by more than 30%, increases assembly efficiency by more than 40%, and reduces costs by more than 50%, demonstrating good engineering manufacturability and cost advantages. In terms of reliability, the scalable array module has a yield rate exceeding 90%, meets the requirements of thermal cycling tests from -30℃ to +70℃, and successfully passes typical vibration and shock environment tests. Its stable electrical performance indicators demonstrate high reliability and good environmental adaptability.

[0066] Example 4 Based on Embodiment 3, this embodiment provides a method for assembling a scalable array module, including the following steps: S5. Confirm the solder paste height before soldering; specifically, refer to Example 2, which will not be repeated here.

[0067] S6. Based on the pre-soldering solder paste height, confirm the stencil thickness and apply solder paste to side B using stencil printing; specifically including: S60. To ensure the penetration rate of the weld joints on the welding surface, the opening ratio of the stencil pads on the welding surface is set to 72%. Therefore, the actual stencil thickness used on the welding surface satisfies the formula: stencil thickness = solder paste height before welding / stencil pad opening ratio, resulting in a stencil thickness of 0.15 mm.

[0068] S61. Using a stencil with a thickness of 0.15mm, Sn63Pb37 solder paste is applied to side B by stencil printing. Sn63Pb37 is a standard grade of solder alloy, consisting of 63% tin and 37% lead, which is the eutectic composition of tin-lead alloy. This is existing technology and will not be elaborated further.

[0069] S7. Under the same temperature profile, weld surface B to the corresponding lower surface of the lower housing 20 and other components.

[0070] S8. Based on the solder paste height before soldering, determine the stencil thickness and apply solder paste to side A using stencil printing; refer to S6 for details, which will not be repeated here.

[0071] S9. Under the same temperature profile, solder surface A to the lower surface of the corresponding lower housing 20, system-in-package component 3, and other corresponding components.

[0072] S10. Post-weld cleaning.

[0073] S11. A surface-mount component with a coupling cavity structure is formed by threaded assembly and RF connector 4 on the upper housing 21.

[0074] S12. Apply epoxy glue to the dispensing groove 210 to reinforce and prevent loosening.

[0075] S13. Assemble the above-mentioned welded parts into the mounting housing 5, install the cover plate 6, and finally assemble them into an expandable array module.

[0076] It is worth mentioning that S4 and S5 are not consecutive steps, but exist as step labels.

[0077] Furthermore, in practical applications, solder pads can also be used for welding. The method for confirming the welding thickness can refer to the method for confirming the solder paste height before welding, which will not be elaborated further.

[0078] The advantages of this embodiment are as follows: First, after solder paste is applied to sides A and B of the multi-functional board 1, all non-contact coupling housings 2, system-in-package components 3, and other components are soldered under the same temperature profile. This eliminates the need for step-by-step soldering and secondary heating, simplifying the process and improving production efficiency.

[0079] Secondly, this method eliminates the problem of the traditional button-type assembly solution, which requires specialized pressing fixtures and thus demands extremely high flatness of the multi-functional board 1, making it difficult to guarantee assembly consistency. In this method, the lower housing 20 is mounted and reflow soldered like ordinary components, eliminating the need for pressing and avoiding the impact of mechanical stress on the solder joints, resulting in better assembly consistency.

[0080] Then, after soldering, clean the machine directly, then screw on the RF connector (4), apply adhesive to prevent loosening, and finally install it into the mounting housing (5) and cover it with the cover plate (6). The entire process is clear and the steps are compact, making it suitable for mass production.

[0081] Furthermore, due to precise control of solder paste volume, damming and limiting, and reinforcement with welding pin 201, the height consistency of the coupling cavity after welding is good, and the weld strength is high. The measured finished product yield is higher than 90%, and it can pass environmental tests such as vibration, impact, and thermal cycling, proving that the assembly method is stable and reliable.

[0082] The final product is a scalable array module for use in the Ka band, with a port VSWR ≤1.8 and differential loss ≤0.8dB. The module weight is reduced by 30%, assembly efficiency is increased by 42%, cost is reduced by 55%, and the processing yield is 96%. It can meet the typical environmental test requirements for thermal cycling from -30℃ to +70℃, and has passed typical vibration and shock environmental tests. Its electrical properties are stable, and it has good reliability and environmental adaptability.

[0083] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multi-functional board assembly, characterized in that, The device includes a multifunctional plate (1) and a coupling shell (2). At least one surface of the multifunctional plate (1) is provided with several coupling shells (2). One end of the coupling shell (2) has a cavity, and one end of the coupling shell (2) where the cavity is located is welded to the multifunctional plate (1) to form a welding surface. They surround each other to form a coupling cavity. At least one ring of weld-resistant dam (203) is protruding from the coupling shell (2) along the outer edge of the coupling cavity. The weld at the welding surface is at the same height as the weld-resistant dam (203). The other end of the coupling shell (2) has an opening, which is connected to the coupling cavity to form a vertical channel. A detachable connection part is provided at the opening.

2. The multifunctional board assembly according to claim 1, characterized in that, The coupling housing (2) includes a lower housing (20) and an upper housing (21). A cavity is provided at one end of the lower housing (20), and the upper housing (21) is provided at the other end of the lower housing (20). An opening is provided at the other end of the upper housing (21).

3. The multifunctional board assembly according to claim 2, characterized in that, Welding pins (201) are arranged diagonally at the end of the lower housing (20) away from the upper housing (21), and the welding pins (201) are offset from the cavity.

4. The multifunctional board assembly according to claim 1, characterized in that, The detachable connection is threaded.

5. The multifunctional board assembly according to claim 2, characterized in that, A dispensing groove (210) is provided on the upper housing (21).

6. The multifunctional board (1) assembly according to claim 1, characterized in that, The welding surfaces of the coupling shell (2) and the weld barrier (203) are all silver-plated.

7. A scalable array module employing the multi-functional board (1) assembly according to any one of claims 1 to 6, characterized in that, The system includes a system-in-package (3) and an RF connector (4). The system-in-package (3) is set on any side of the multifunction board (1), and the system-in-package (3) is offset from the coupling housing (2). The RF connector (4) is set on one end of the coupling housing (2) away from the multifunction board (1).

8. An assembly method applied to the scalable array module of claim 7, characterized in that, Includes the following steps: Confirm the solder paste height on the welding surface before welding; Based on the height of the solder paste before welding, solder paste was applied to the surface of the multi-functional board (1); At the same temperature, the system-in-package component (3) and the coupling housing (2) are soldered onto the surface of the multi-functional board (1); The opening is connected to the RF connector (4) via a detachable connection part.

9. The assembly method according to claim 8, characterized in that, Confirming the solder paste height on the welding surface before welding includes the following steps: Based on the height of the weld resistance dam (203), the height of the weld interface after welding is confirmed; Based on the solder height at the post-weld interface, determine the volume of the post-weld interface solder. Based on the welding process correction factor, confirm the volume of the weld metal at the interface after welding is equal to the volume of the pre-welding solder paste that needs to be applied before welding. The height of the solder paste before soldering is determined by the volume of the solder paste before soldering.

10. The method for confirming the pre-soldering solder paste coating height according to claim 9, characterized in that, When the height of the solder paste before welding is determined by the volume of the solder paste before welding, an internal shrinkage compensation space is reserved in advance based on the amount of solder paste collapse under pressure during solder paste application.

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