A semiconductor package assembly, a lighting module and a control method thereof

Abstract

The application provides a semiconductor package assembly, a lighting module and a control method thereof. The semiconductor package assembly comprises a semiconductor carrier unit, a light emitting device and a driving integrated circuit. The light emitting device and the driving integrated circuit are integrated in the same semiconductor carrier unit to form an integrated package. The lighting module is formed by connecting a plurality of semiconductor package assemblies in series, and the wiring can be simplified by a relay function. The control method comprises parameter reading, signal receiving, driving regulation and closed-loop calibration steps. The application realizes high integration of the light emitting device and the driving integrated circuit, reduces the wiring complexity and cost, and is suitable for the field of lighting and display devices.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging, and more specifically to a semiconductor packaging component, a lighting module, and a control method thereof. Background Technology

[0002] The development of advanced lighting modules that can provide a better optical visual experience is driven by a variety of factors, such as thermal management, energy efficiency, device lifespan, LED density, high luminous intensity, fine local dimming area, fine luminous intensity adjustment control, wide color gamut, narrow wavelength spectrum, fine color adjustment control, ease of implementation, form factor, system cost, cross-platform compatibility, mass production compatibility, and overall device quality.

[0003] Current technologies for constructing lighting modules employ surface-mount device (SMD) LEDs, flip-chip (FC) LEDs, or micro-in-package (MiP) LEDs. SMD LEDs are the most common LED packaging technology and are frequently used in high-power applications (such as ambient lighting). SMD LEDs are considered the most economical way to achieve high brightness and are widely used in high-end applications (such as display backlighting and direct-view video walls). However, this design approach suffers from poor scalability and cost-effectiveness, and the large device size prevents high-density designs.

[0004] Flip-chip LEDs are commonly used in applications requiring high scalability and device density, particularly in LED backlit displays or LED video walls where image resolution depends on LED device density. Utilizing chip-level packaging and flip-chip technology, flip-chip LEDs eliminate the need for integrated circuit packaging substrates and wire bonding, simplifying the manufacturing process, increasing device integration, reducing device size, improving durability, enhancing scalability, and increasing LED density. Flip-chip LEDs do not require a substrate; they are directly soldered onto the surface of a printed circuit board (PCB) to form a chip-on-board (COB) lighting module. However, COB structures require costly PCBs and advanced surface mount technology (SMT) production lines; this structure only achieves efficient and economical scalability when device density is extremely low. At higher device densities, the cost of SMT processes and PCB panels increases exponentially, and overall yield decreases significantly. Therefore, the technology route of flip-chip LED and chip-on-board (COB) structure is not limited by technical difficulties, but by economic barriers. This design scheme cannot achieve efficient scaling for larger panel sizes and medium-to-high density designs.

[0005] Micro-LEDs within a package (MiP) are a packaging structure that contains multiple LEDs within a single package. They typically consist of an integrated circuit (IC) package substrate and multiple micro-LEDs, flip-chip LEDs, or wire-bonded LEDs. The IC package substrate provides minimal contact pads, allowing for the use of micro-LEDs smaller than those used in flip-chip LEDs. MiP assemblies are mounted on the upper surface of a printed circuit board (PCB) and connected to a driver IC via PCB traces. MiPs require at least multiple layers of PCBs; in high-density applications, high-density interconnect (HDI) PCBs are necessary. Similar to PCBs designed for high-density chip-on-board (COB) flip-chip architectures, the PCBs required for MiPs are extremely difficult to manufacture, have the longest production cycles, the highest costs, and the lowest yields. The MiP structure allows for the integration of various types of LEDs within the package, and even the mixing of different types of LEDs within the same package assembly, without being limited by LED size or structural form, opening up new possibilities. However, it did not solve the problems of chip-on-board (COB) devices, especially since micro-LEDs can achieve higher densities, which further exacerbates these problems and limits the widespread consumer application of micro-LEDs in packages (MiP) technology.

[0006] Many industry players have attempted to overcome the aforementioned technical and economic barriers by integrating multiple LEDs or LED packages into the same local dimming area and employing a passive matrix system architecture. However, this sacrifices luminous intensity control precision, resolution, and image quality. Existing technologies cannot simultaneously increase LED density while achieving precise luminous intensity control, scalable design, and cost-effective manufacturing.

[0007] Therefore, how to overcome the shortcomings of the existing technology is the subject of this invention. Summary of the Invention

[0008] The purpose of this invention is to provide a semiconductor packaging component, a lighting module, and a control method thereof, so as to at least partially solve the above-mentioned technical problems.

[0009] To achieve the above objectives, a first aspect of the present invention provides a semiconductor packaging assembly, comprising:

[0010] A semiconductor carrier unit for carrying semiconductor components and capable of being connected to a printed circuit board;

[0011] The semiconductor component includes:

[0012] One or more light-emitting devices are mounted on the surface of the semiconductor carrier unit away from the printed circuit board.

[0013] One or more driver integrated circuits are mounted on the semiconductor carrier unit, and the driver integrated circuits are electrically connected to the light-emitting device via the semiconductor carrier unit, or the driver integrated circuits are directly electrically connected to the light-emitting device; the driver integrated circuits are configured to control the voltage and current applied to the light-emitting device.

[0014] In the above solution, the driver integrated circuit and the LED are embedded in the same packaged semiconductor package component. This eliminates the need to rely on a printed circuit board (PCB) to establish an electrical connection between the driver integrated circuit and the LED, significantly shortening the electrical connection path between the two, reducing wiring complexity, and simplifying the assembly process of the subsequent lighting module.

[0015] In a further technical solution, the semiconductor carrier unit is an integrated circuit packaging substrate. The light-emitting device and the driving integrated circuit are electrically connected to the integrated circuit packaging substrate through pads. The integrated circuit packaging substrate is provided with a conductive wiring layer and conductive vias. The light-emitting device and the driving integrated circuit are electrically connected through the conductive wiring layer and the conductive vias. The integrated circuit packaging substrate is connected to a printed circuit board through surface mount pads.

[0016] In the above solution, an integrated circuit packaging substrate is used as the semiconductor carrier unit, and a stable interconnect channel is constructed by means of an internal conductive wiring layer and conductive vias. Combined with pads and surface mount technology, this ensures reliable electrical connection between the light-emitting device and the driver integrated circuit, and also achieves efficient assembly with the printed circuit board.

[0017] In a further technical solution, the light-emitting device is a light-emitting diode.

[0018] In the above solutions, various types of light-emitting diodes can be adapted to the needs of different lighting and display scenarios.

[0019] In a further technical solution, multiple light-emitting devices are provided, and the multiple light-emitting devices are distributed around the same central point.

[0020] In the above scheme, by distributing multiple light-emitting devices around the same central point, the light is fully superimposed in the central area, which effectively improves the uniformity of light emission, enhances the color overlap effect, and avoids problems such as uneven brightness or color fragmentation in some areas.

[0021] In a further technical solution, the semiconductor component further includes one or more light sensing elements, which are mounted on the semiconductor carrier unit and electrically connected to the driving integrated circuit. The light sensing elements are used to detect the light emission state of the light-emitting device and send a feedback signal to the driving integrated circuit. The driving integrated circuit is configured to calibrate the light emission intensity and color consistency of the light-emitting device according to the feedback signal of the light sensing elements.

[0022] In the above solution, the addition of a light-sensing element and its connection to the driving integrated circuit form a closed-loop control, which can detect the light emission status in real time and dynamically calibrate, thus significantly improving the light emission intensity and color consistency.

[0023] In a further technical solution, the semiconductor component further includes a storage module, which is electrically connected to the driver integrated circuit. The storage module is configured to store control parameters of the light-emitting device, and the driver integrated circuit is configured to read the control parameters from the storage module and drive the light-emitting device based on the control parameters.

[0024] In the above scheme, the storage module pre-stores the control parameters of the light-emitting device, providing a precise driving basis for the driver integrated circuit. The storage module can also coordinate with the closed-loop calibration of the photosensitive element, storing the calibrated control parameters to improve the accuracy of drive control.

[0025] In a further technical solution, the semiconductor packaging assembly also includes an optical structure, which partially covers the light-emitting device. The optical structure is used to change the optical path of the light emitted by the light-emitting device and to encapsulate and protect the internal semiconductor components.

[0026] In the above scheme, the optical structure covers the light-emitting device, which can not only control the focusing, scattering, or uniformity of light as needed, but also provide physical protection for the internal semiconductor components. In addition, the optical structure, together with the surrounding distributed light-emitting devices, can achieve a more uniform color distribution.

[0027] According to a second aspect of the present invention, a lighting module is provided, comprising:

[0028] Printed circuit boards;

[0029] Multiple semiconductor packaging components as described in the first aspect, each of the semiconductor packaging components being assembled on the printed circuit board and electrically connected to the printed circuit board;

[0030] The control motherboard is configured to send control commands to each driver integrated circuit of each semiconductor package assembly to control the light emission state of the light-emitting devices in each semiconductor package assembly.

[0031] In the above solution, the lighting module is constructed using multiple integrated semiconductor packaged components, coupled with centralized control from the main control board. This significantly simplifies the printed circuit board wiring design, improves module assembly efficiency, and enables independent control of each packaged component, enhancing the flexibility and scalability of the lighting module.

[0032] In a further technical solution, the driver integrated circuit is provided with a relay function module, which relays the various semiconductor package components and connects them in series to the control motherboard.

[0033] In the above solution, the semiconductor packaging components are connected in series to the control motherboard via relay connections, eliminating the need to lay signal lines for each component separately, significantly reducing wiring complexity and cost, while ensuring the stability of signal transmission.

[0034] In a further technical solution, the semiconductor carrier unit of the semiconductor packaging assembly is soldered to the printed circuit board via a ball grid array, and the driving integrated circuit is disposed in the space between the semiconductor carrier unit and the printed circuit board.

[0035] In the above solution, a ball grid array (BGA) bonding process is used, and the driver integrated circuit is placed between the semiconductor carrier unit and the printed circuit board. This makes full use of space to achieve high-density integration and reduces the overall size of the lighting module.

[0036] A further technical solution also includes an external lens, which is encapsulated on the outside of the entire semiconductor package assembly and connected to the printed circuit board.

[0037] In the above solution, an external lens encapsulates the entire semiconductor packaging component and connects it to the printed circuit board. It works in conjunction with the internal optical structure of the component to achieve secondary optimization of the optical path, enhance the light distribution effect, and provide protection for the component.

[0038] In a further technical solution, the printed circuit board is a metal-based single-sided printed circuit board.

[0039] According to a third aspect of the present invention, a method for controlling a lighting module is provided, comprising:

[0040] S1. Initialization Configuration: The driver integrated circuit of each semiconductor package component is started. The driver integrated circuit reads preset control parameters from the corresponding storage module. The preset control parameters include at least the reference luminous intensity parameter, reference driving voltage parameter, reference driving current parameter and refresh rate control parameter of the light-emitting device.

[0041] S2. Signal Reception: The driver integrated circuit receives external control commands, which are sent by the control motherboard of the lighting module to indicate the target light emission state of the light-emitting device;

[0042] S3. Drive control: The drive integrated circuit adjusts the voltage and current output to the light-emitting device based on the preset control parameters and external control commands, and drives the light-emitting device to emit light at the preset refresh rate, so that the light-emitting device reaches the target light-emitting state.

[0043] In the above scheme, the lighting accuracy is greatly improved because each semiconductor package component can be controlled independently.

[0044] In a further technical solution, the control method also includes:

[0045] S4. Status Feedback: The actual light emission parameters of the light emission device are collected by the light emission sensor assembled in the semiconductor carrier unit, and the actual light emission parameters are fed back to the driver integrated circuit;

[0046] S5. Closed-loop calibration: The driver integrated circuit compares the deviation between the actual light emission parameters and the preset control parameters, and dynamically adjusts the voltage, current or driving timing output to the light emission device to achieve calibration of the light emission state.

[0047] In the above scheme, the deviation between the actual light emission parameters and the preset values ​​is corrected in real time, and the drive output is dynamically optimized to further improve the stability and accuracy of the light emission state.

[0048] In a further technical solution, step S3, the driving control also includes: dividing a single full-color image frame into three or more monochrome image frames, driving the light-emitting device to output corresponding monochrome light in chronological order, and using the persistence of vision effect of the human eye to make the viewer have the visual illusion of a full-color frame.

[0049] The above solution achieves full-color display based on high refresh rate timing and visual persistence effect. Combined with independent control of the driver integrated circuit, it achieves high brightness and high resolution color display effects in a low-cost manner without the need for additional color filter structures.

[0050] The semiconductor packaging component, lighting module, and control method provided in this application have the following technical advantages:

[0051] This application proposes a novel heterogeneous integration solution that improves device control precision, luminous performance, and scalability while reducing device and system complexity. This improvement is achieved by constructing a semiconductor package assembly that embeds the driver IC and LED in the same package, eliminating the need for a printed circuit board (PCB) to establish an electrical connection between the driver IC and the LED.

[0052] Although the manufacturing cost of semiconductor packaged components is relatively high, at optimal density levels, cost savings in printed circuit boards (PCBs), surface mount technology (SMT), and driver packaging are sufficient to cover the manufacturing cost of semiconductor packaged components. In addition to hardware cost savings, the development process for new lighting modules will also be significantly simplified, cost-effective, and time-efficient. Attached Figure Description

[0053] Figure 1 An integrated circuit packaging substrate of a non-limiting embodiment is shown, the substrate being configured to accommodate flip-chip LEDs and flip-chip driver integrated circuits, wherein LED receiving pads and driver integrated circuit receiving pads are both disposed on the upper surface of the integrated circuit packaging substrate;

[0054] Figure 2 An integrated circuit packaging substrate of a non-limiting embodiment is shown, the substrate being configured to accommodate a flip-chip LED and a flip-chip driver integrated circuit, wherein LED receiving pads are disposed on the upper surface of the integrated circuit packaging substrate, and driver integrated circuit receiving pads are disposed on the lower surface of the integrated circuit packaging substrate.

[0055] Figure 3 An integrated circuit packaging substrate of a non-limiting embodiment is shown, wherein no solder resist layer is disposed on the surface of the substrate;

[0056] Figure 4 An integrated circuit packaging substrate of a non-limiting embodiment is shown, the substrate being configured to accommodate a front-mounted LED and a wire-bonded driver integrated circuit, wherein both the LED wire-bonded pads and the driver integrated circuit wire-bonded pads are disposed on the upper surface of the integrated circuit packaging substrate.

[0057] Figure 5 An integrated circuit packaging substrate of a non-limiting embodiment is shown. The substrate is configured to accommodate a vertical LED and a flip-chip driver integrated circuit. LED wire bonding pads and LED mounting pads are both disposed on the upper surface of the integrated circuit packaging substrate, and the driver integrated circuit is also disposed on the upper surface of the integrated circuit packaging substrate.

[0058] Figure 6 An integrated circuit packaging substrate of a non-limiting embodiment is shown, which carries a flip-chip LED and a flip-chip driver integrated circuit, both of which are mounted on the upper surface of the integrated circuit packaging substrate using flip-chip technology;

[0059] Figure 7 An integrated circuit packaging substrate of a non-limiting embodiment is shown, wherein flip-chip LEDs are mounted on the upper surface of the substrate using flip-chip technology, and flip-chip driver integrated circuits are mounted on the lower surface of the substrate using flip-chip technology.

[0060] Figure 8An integrated circuit packaging substrate of a non-limiting embodiment is shown, which carries a front-mounted LED and a front-mounted driver integrated circuit, which are mounted on the upper surface of the integrated circuit packaging substrate by a non-conductive bonding layer;

[0061] Figure 9 An integrated circuit packaging substrate of a non-limiting embodiment is shown, which carries a vertical LED and a flip-chip driver integrated circuit, both of which are mounted on the upper surface of the integrated circuit packaging substrate;

[0062] Figure 10 An integrated circuit packaging substrate of a non-limiting embodiment is shown, which carries a vertical LED and a front-mounted driver integrated circuit, both of which are mounted on the upper surface of the integrated circuit packaging substrate;

[0063] Figure 11 A non-limiting embodiment of a semiconductor packaging assembly is shown, wherein a single optical layer is deposited on its entire upper surface;

[0064] Figure 12 A non-limiting embodiment of a semiconductor packaging assembly is shown, wherein multiple optical layers are deposited on its entire upper surface;

[0065] Figure 13 A non-limiting embodiment of a semiconductor packaging assembly is shown, wherein multiple optical layers are deposited on the entire upper surface, the uppermost layer being in the shape of a lens;

[0066] Figure 14 A non-limiting embodiment of a semiconductor packaging assembly is shown, wherein multiple optical layers are deposited on the entire upper surface, the uppermost layer being a lens shape eccentrically disposed to the semiconductor packaging assembly;

[0067] Figure 15 A non-limiting embodiment of a semiconductor packaging assembly is shown, wherein a single optical layer is deposited on the entire upper surface, the uppermost layer being a lens shape eccentrically disposed to the semiconductor packaging assembly;

[0068] Figure 16 A non-limiting embodiment of a semiconductor packaging assembly is shown, wherein a single optical layer is deposited on the entire upper surface, and the upper surface is in the shape of a lens.

[0069] Figure 17 A non-limiting embodiment of a semiconductor packaging assembly is shown, wherein a single optical layer, in the shape of a lens, is deposited on a portion of its upper surface;

[0070] Figure 18 A non-limiting embodiment of a semiconductor packaging assembly is shown, wherein a single optical layer is deposited on a portion of its upper surface, the optical layer being crater-shaped;

[0071] Figure 19A semiconductor package assembly with a ball grid array (BGA) is shown as a non-limiting embodiment;

[0072] Figure 20 An embodiment of a semiconductor packaging assembly that is surface-mounted (SMT) to the upper surface of a printed circuit board (PCB) is shown;

[0073] Figure 21 An embodiment of a semiconductor package assembly with a ball grid array (BGA) is shown, which is surface-mounted (SMT) to the upper surface of a printed circuit board (PCB);

[0074] Figure 22 An embodiment of a semiconductor packaging assembly is shown, which has a ball grid array (BGA) and is mounted on the top surface of a printed circuit board (PCB) using surface mount technology (SMT).

[0075] Figure 23 A non-limiting embodiment of a semiconductor packaging assembly is shown, which is packaged with an external lens that is convex in shape;

[0076] Figure 24 A non-limiting embodiment of a semiconductor packaging assembly is shown, which is packaged with an external lens in the shape of a volcano;

[0077] Figure 25 This illustrates a parallel arrangement of LEDs in the prior art;

[0078] Figure 26 A first, non-limiting embodiment of arranging LEDs around a center point is shown;

[0079] Figure 27 A second, non-limiting embodiment of arranging LEDs around a center point is shown;

[0080] Figure 28 A third, non-limiting embodiment of arranging LEDs around a center point is shown;

[0081] Figure 29 A non-limiting embodiment of a driver integrated circuit is shown;

[0082] Figure 30 This illustrates the internal structure of a lighting module and its connection to the control motherboard in the prior art;

[0083] Figure 31 The internal structure of the lighting module provided in this application and its connection with the control motherboard are shown.

[0084] in:

[0085] 1-Integrated circuit packaging substrate;

[0086] 111 - LED receiving pad; 112 - LED wire bonding pad; 113 - LED mounting pad; 114 - LED bonding pad;

[0087] 121 - Driver integrated circuit receiving pad; 122 - Driver integrated circuit lead bonding pad; 123 - Driver integrated circuit bonding pad;

[0088] 131-SMT pads;

[0089] 14- Solder resist layer;

[0090] 1A - Top surface of integrated circuit packaging substrate; 1B - Bottom surface of integrated circuit packaging substrate; 1C - Core material of integrated circuit packaging substrate;

[0091] 15- Solder joint; 16- Flip chip bump; 17- Underfill adhesive; 18- Non-conductive adhesive layer; 19- Conductive adhesive layer;

[0092] 21-Flip-chip LED; 22-Front-mount LED; 23-Vertical LED; 23-Mini LED;

[0093] 31 - Flip-chip driver integrated circuit; 32 - Top-mounted driver integrated circuit;

[0094] 4-Optical structure; 41-First optical layer; 42-Second optical layer;

[0095] 5-Printed circuit board; 6-External lens; 7-Ball grid array; 8-Thermal interface material solder joint. Detailed Implementation

[0096] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0097] The terms "first," "second," etc., used in this article do not specifically refer to order or sequence, nor are they intended to limit this case; they are merely used to distinguish components or operations described using the same technical terms.

[0098] The terms "connection" or "positioning" as used in this article can refer to two or more components or devices making direct physical contact with each other, or making indirect physical contact with each other, or to two or more components or devices operating or moving with each other.

[0099] The terms “include,” “including,” and “have” used in this article are all open-ended, meaning they include but are not limited to.

[0100] The terms “front,” “back,” “up,” “down,” “left,” and “right” used in this article are directional terms. In this case, they are only used to describe the positional relationship between the structures and are not intended to limit the specific direction of the protection scheme or its actual implementation.

[0101] This invention can be applied to various devices and display devices that require artificial lighting, including but not limited to general lighting, mobile device lighting, wearable device lighting, display backlighting, and LED direct display screens (including large-size LED video walls using direct-view LED display technology).

[0102] This embodiment provides a semiconductor packaging assembly, including a semiconductor carrier unit and a semiconductor component mounted thereon. The lower surface of the semiconductor carrier unit can be connected to a printed circuit board. The semiconductor component includes at least one light-emitting device and at least one driving integrated circuit. The driving integrated circuit is electrically connected to the light-emitting device via the semiconductor carrier unit, or the driving integrated circuit is directly electrically connected to the light-emitting device. The driving integrated circuit is configured to control the voltage and current applied to the light-emitting device.

[0103] In this embodiment, the semiconductor carrier unit is an integrated circuit packaging substrate. In possible embodiments, RDL (redistribution layer) carriers, ceramic packaging substrates, glass interconnect substrates, or flexible packaging substrates may also be used as semiconductor carrier units to adapt to the integration density, heat dissipation, or flexibility requirements of different scenarios.

[0104] Figures 1 to 5 This illustrates a possible structure of the integrated circuit packaging substrate in the semiconductor packaging assembly provided in this application. See also... Figures 1 to 5 The integrated circuit packaging substrate provided in this application embodiment has an upper surface and a lower surface, both of which include a solder mask layer and various pads. The layout of the pads and solder mask layer shown in the illustration is for illustrative purposes only and does not constitute a limitation.

[0105] Four types of pads can be selectively provided on the integrated circuit packaging substrate: LED landing pad, LED mounting pad, wire-bond pad, and surface mount technology (SMT) pad.

[0106] LED bonding pads are used to form electrical connections with flip-chip LEDs, and LED wire bonding pads are used to form electrical connections with vertical or standard-mount LEDs; these LED pads can only be formed on the upper surface of the integrated circuit packaging substrate. LED mounting pads are used to form electrical connections with vertical LEDs; LED mounting pads can only be formed on the upper surface of the integrated circuit packaging substrate.

[0107] Driver integrated circuit receiving pads are used to form electrical connections with face-down flip-chip driver integrated circuits, while driver integrated circuit wire bonding pads are used to form electrical connections with face-up wire bonding driver integrated circuits; both types of driver integrated circuit pads can be formed on the upper surface of the integrated circuit package substrate (e.g., ...). Figure 1 (as shown) or the lower surface (such as) Figure 2 (As shown).

[0108] Surface mount technology (SMT) pads are used to mount packaged semiconductor components onto printed circuit boards (PCBs); this type of pad can only be formed on the lower surface of the integrated circuit package substrate.

[0109] The integrated circuit packaging substrate has at least two or more wiring layers to achieve circuit interconnection and signal transmission between the upper and lower surfaces and between layers. The core material and add-on material of the integrated circuit packaging substrate are selected from materials that are heat-resistant, highly insulating, and suitable for high-density wiring, including but not limited to BT resin, FR4 epoxy resin, ABF (Ajinomoto Build-up Film), and ceramic materials. The core material and add-on material can be set with corresponding colors according to the light-emitting performance requirements, including but not limited to white and black. White can improve light reflection efficiency and reduce light loss, while black can suppress stray light crosstalk and improve light efficiency utilization, thereby enhancing the overall light-emitting performance of the packaged component. The integrated circuit packaging substrate also integrates at least one conductive via structure, including but not limited to through vias, buried vias, blind vias, micro vias, X-type vias, stacked vias, interleaved vias, masked vias, filled vias, pad-in-the-hole vias, half-castellated holes, and quarter-castellated holes. These conductive vias serve as the core structure for interlayer circuit conduction, enabling electrical connection between the wiring circuits on the upper and lower surfaces of the integrated circuit packaging substrate, and ensuring stable signal and current transmission between the pads.

[0110] like Figure 1As shown, LED receiving pads 111, driver integrated circuit receiving pads 121 and solder resist layer 14 are provided on the upper surface 1A of the integrated circuit packaging substrate; SMT pads 131 and solder resist layer 14 are provided on the lower surface 1B of the integrated circuit packaging substrate; the interior of the integrated circuit packaging substrate is the integrated circuit packaging substrate core material 1C, and the integrated circuit packaging substrates are divided into units by dicing channels.

[0111] Among them, SMT pad 131 is used to perform surface mount soldering of integrated circuit packaging substrate and printed circuit board (PCB); solder mask layer 14 is used to protect the circuit and prevent solder bridging short circuit.

[0112] One possible implementation is as follows: Figure 2 As shown, an LED receiving pad 111 and a solder mask layer 14 are disposed on the upper surface 1A of the integrated circuit packaging substrate; a driver integrated circuit receiving pad 121, an SMT pad 131, and a solder mask layer 14 are disposed on the lower surface 1B of the integrated circuit packaging substrate. Compared to Figure 1 , Figure 2 In one embodiment, the driver integrated circuit receiving pad 121 is mounted on the lower surface 1B of the integrated circuit packaging substrate.

[0113] One possible implementation is as follows: Figure 3 As shown, an LED receiving pad 111 is provided on the upper surface 1A of the integrated circuit packaging substrate; a driver integrated circuit receiving pad 121 and an SMT pad 131 are provided on the lower surface 1B of the integrated circuit packaging substrate. Figure 3 exist Figure 2 The solder mask layer 14 was removed from the base layer.

[0114] The solder mask layer can be an optional component (such as...) Figure 3 As shown, the solder mask layer may also be omitted. For all embodiments described herein, the solder mask layer is an optional feature.

[0115] The solder resist layer deposited on the integrated circuit packaging substrate may be colored. Depending on the final product application, the preferred colors are (but not limited to) white for backlight applications and black for direct-view applications. The solder resist layer may be deposited over the pads to form solder resist defined pads (SMD), or not deposited over the pads to form non-solder resist defined pads (NSMD). The solder resist defined pad (SMD) and non-solder resist defined pad (NSMD) structures shown in the illustrations are for illustrative purposes only and do not constitute a limitation.

[0116] One possible implementation is as follows: Figure 4As shown, the upper surface 1A of the integrated circuit packaging substrate is provided with LED wire bonding pads 112, driver integrated circuit wire bonding pads 122, and a solder mask layer 14; the lower surface 1B of the integrated circuit packaging substrate is provided with SMT pads 131 and a solder mask layer 14. The LED wire bonding pads 112 are used to electrically connect to the mounted LED 22 via wire bonding; the driver integrated circuit wire bonding pads 122 are used to electrically connect to the mounted driver integrated circuit via wire bonding.

[0117] One possible implementation is as follows: Figure 5 As shown, the upper surface 1A of the integrated circuit packaging substrate is provided with LED mounting pads 113, LED wire bonding pads 112, driver integrated circuit receiving pads 121, and a solder mask layer 14; the lower surface 1B of the integrated circuit packaging substrate is provided with SMT pads 131 and a solder mask layer 14. The LED mounting pads 113 are used to achieve electrical connection and mechanical fixation with vertical LEDs 23 through a conductive adhesive layer; the LED wire bonding pads 112 are used to achieve electrical connection with vertical LEDs 23 through wire bonding; and the driver integrated circuit receiving pads 121 are used to achieve electrical connection with flip-chip driver integrated circuits through bump soldering.

[0118] Semiconductor devices are placed on a substrate using chip mounting techniques known in the art (including but not limited to UV-emitting and pick-and-place). The semiconductor devices are mechanically connected to the integrated circuit packaging substrate using one of the following methods and materials: die-attach film (DAF), die-attach adhesive (DAAs), UV-emitting die-attach adhesive, epoxy resin, silver conductive paste, or copper conductive paste, forming solder joints or adhesive layers (such as…). Figure 8 and Figure 10 (As shown).

[0119] Semiconductor devices are electrically connected to integrated circuit packaging substrates using one of the following methods: solder, silver paste, low-temperature sintered silver paste, copper paste, low-temperature sintered copper paste, flip chip bumps, or wire bonding. Flip chip processes, bump construction, and thermosetting bonding technologies are well-known in the art. Flip chip bumps include, but are not limited to, C4 bumps, electroplated bumps, copper pillars, wire pillar bumps, gold bumps, and indium bumps.

[0120] The pads on the integrated circuit packaging substrate may be treated with at least one or more of the following surface treatments, either in whole or in part: organic solderability preservative (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion gold (ENEPIG), solder-coated pads (SOP), electroplated gold, electroplated silver, and electroplated gold.

[0121] In possible embodiments, multiple LEDs are integrated on the upper surface of the integrated circuit packaging substrate. The integrated circuit packaging substrate supports various LED structure types, including but not limited to flip-chip LEDs, lateral LEDs, vertical LEDs, or micro LEDs. LEDs can emit a variety of colors, including but not limited to white, red, green, blue, yellow, green-red, blue-green, and blue-green-red. LED colors can be achieved by the LED itself or by applying a layer of LED color conversion material (using techniques known in the art), including but not limited to phosphors, potassium fluorosilicate (PFS / KSF), and quantum dots.

[0122] See Figures 6 to 10 This application also provides a non-limiting embodiment of a semiconductor packaging assembly. The semiconductor packaging assembly structure and semiconductor device combination layout shown in the illustrations are for illustrative purposes only and do not constitute a limitation. In the following illustrations, four types of semiconductor devices can be selectively disposed on the integrated circuit packaging substrate: upright LEDs, flip-chip LEDs, vertical LEDs, and driver integrated circuits.

[0123] Figure 6 This demonstrates a structure where both the flip-chip LED and the flip-chip driver integrated circuit 31 are mounted on the upper surface of an integrated circuit packaging substrate. (Example:) Figure 6 As shown, the flip-chip LED 21 is connected to the LED receiving pad 111 on the upper surface 1A of the integrated circuit packaging substrate via LED bonding pad 114; the flip-chip driver integrated circuit 31 is connected to the driver integrated circuit receiving pad 121 on the upper surface 1A of the integrated circuit packaging substrate via driver integrated circuit bonding pad 123. The flip-chip driver integrated circuit 31 is electrically connected to the integrated circuit packaging substrate via flip-chip bumps 16; solder joints 15 are used to achieve electrical conduction and mechanical connection between the flip-chip LED 21 and the integrated circuit packaging substrate.

[0124] The process of forming an electrical connection between the flip-chip LED 21 and the integrated circuit packaging substrate 1 is as follows: First, solder paste is screen-printed on the LED receiving pad 111. Then, the flip-chip LED 21 is mounted onto the LED receiving pad 111 by pick-and-place. Finally, reflow soldering is performed to melt the solder paste and form solder joints 15.

[0125] Figure 7 This illustrates the structure where a flip-chip driver integrated circuit 31 is mounted on the lower surface of an integrated circuit packaging substrate. (Example:) Figure 7As shown, the flip-chip LED 21 is electrically connected to the upper surface 1A of the integrated circuit packaging substrate via solder joint 15; the flip-chip driver integrated circuit 31 is electrically connected to the lower surface 1B of the integrated circuit packaging substrate via flip-chip bumps 16. Furthermore, an underfill adhesive 17 is filled between the integrated circuit packaging substrate 1 and the flip-chip driver integrated circuit 31 to protect the flip-chip bumps 16 and improve the mechanical strength and thermal fatigue resistance of the package.

[0126] Figure 8 This illustrates the structure where a standard-mounted LED 22 and a standard-mounted driver integrated circuit 32 are mounted on the upper surface 1A of an integrated circuit packaging substrate. (See diagram below.) Figure 8 As shown, the upright LED 22 is fixed to the upper surface 1A of the integrated circuit packaging substrate by the non-conductive adhesive layer 18, and is electrically connected to the LED lead bonding pad 112 by wire bonding; the upright driver integrated circuit 32 is fixed to the upper surface 1A of the integrated circuit packaging substrate by the non-conductive adhesive layer 18, and is electrically connected to the driver integrated circuit lead bonding pad 122 by wire bonding.

[0127] Figure 9 The structure shown depicts a vertically oriented LED 23 and a flip-chip driver integrated circuit 31 mounted on the upper surface of an integrated circuit packaging substrate. (Example) Figure 9 As shown, the vertical LED 23 is electrically connected and mechanically fixed to the LED mounting pad 113 through the conductive adhesive layer 19, and the LED bonding pad 114 is electrically connected to the LED wire bonding pad 112 through wire bonding; the flip-chip driver integrated circuit 31 is electrically connected to the upper surface 1A of the integrated circuit packaging substrate through the flip-chip bump 16, and the bottom filler 17 is filled between the flip-chip bump 16 and the integrated circuit packaging substrate; the lower surface 1B of the integrated circuit packaging substrate is provided with SMT pads 131 and solder resist layer 14.

[0128] The adhesive layer can be a non-conductive layer (serving only as a mechanical connection) or a conductive layer (serving both mechanical and electrical connections). The mechanical connection between the driver integrated circuit and the integrated circuit packaging substrate can be selectively further strengthened by underfill (e.g., Figure 7 and Figure 9 (As shown). The materials and processes used for bottom filling are well-known in the art.

[0129] The driver integrated circuit can be directly wired to the LED, forming a direct chip-to-chip connection. Chip-to-chip connections can be formed using ball-on-ball bonding (BSOB) or pin-on-ball bonding (BBOS) techniques (e.g., ...). Figure 10 (As shown).

[0130] Figure 10 The structure shown depicts a vertically mounted LED 23 and a front-mounted driver integrated circuit 32 mounted on the upper surface of an integrated circuit packaging substrate. (Example) Figure 10As shown, the vertical LED 23 is electrically connected and mechanically fixed to the LED mounting pad 113 on the upper surface 1A of the integrated circuit packaging substrate through the conductive adhesive layer 19, and is electrically connected to the driver integrated circuit bonding pad 123 of the upright driver integrated circuit 32 through wire bonding; the upright driver integrated circuit 32 is fixed to the upper surface 1A of the integrated circuit packaging substrate through the non-conductive adhesive layer 18, and is electrically connected to the driver integrated circuit wire bonding pad 122 through wire bonding; SMT pads 131 and solder mask layer 14 are provided on the lower surface 1B of the integrated circuit packaging substrate.

[0131] Other semiconductor devices not shown may also be integrated into the semiconductor packaging assembly structure, including but not limited to capacitors, resistors, photovoltaic (PV) cells, CMOS sensor integrated circuits, memory integrated circuits, power management integrated circuits, signal relay integrated circuits, wireless radio frequency integrated circuits, signal encoding integrated circuits, and signal decoding integrated circuits.

[0132] Semiconductor devices, including driver integrated circuits, can be selectively thinned using back-grinding (BG) processes known in the art when they are still in silicon wafer form. The thinned driver integrated circuits will reduce interference with the optical path and semiconductor package structure.

[0133] The driver integrated circuit includes, but is not limited to, control logic units, display controllers, voltage converters, current controllers, constant current circuits, memory, photonic sensors, data receivers, and data transmitters.

[0134] See Figures 11 to 18 This application also provides a non-limiting embodiment of a semiconductor packaging component, whose top surface is deposited with an optical structure for altering the optical path of the device. The structure of the semiconductor packaging component and the combined layout of the optical layers shown in the illustrations are merely illustrative and do not constitute a limitation on the scope of protection.

[0135] One possible implementation is as follows: Figure 11 As shown, the optical structure 4 covers the flip-chip LED 21 and the flip-chip driver integrated circuit 31, and is used to realize optical control and device protection.

[0136] One possible implementation is as follows: Figure 12 As shown, the optical structure 4 is a double-layer structure, including a first optical layer 41 and a second optical layer 42.

[0137] One possible implementation is as follows: Figure 13 As shown, the second optical layer is configured as a lens structure.

[0138] One possible implementation is as follows: Figure 14 As shown, the second optical layer 42 above the LED is formed as a lens structure.

[0139] One possible implementation is as follows: Figure 15 As shown, when optical structure 4 is a single-layer structure, a lens structure can also be formed above the LED.

[0140] One possible implementation is as follows: Figure 16 As shown, when the optical structure 4 is a single-layer structure, it can also be formed as a lens structure.

[0141] One possible implementation is as follows: Figure 17 As shown, the optical structure 4 may not cover the area above the flip-chip driver integrated circuit 31, but only the area where the LED is located.

[0142] One possible implementation is as follows: Figure 18 As shown, optical structure 4 can be equipped with volcano-shaped protrusions to achieve more precise control over light.

[0143] The material for the optical structure can be resin, epoxy resin, silicone, or other polymeric materials known in the art that can withstand reflow temperatures and are suitable for LED lens manufacturing. Optionally, the material for the optical structure can be premixed with one or more filler materials; the filler materials will change the optical properties and coefficient of thermal expansion (CTE). Filler materials include, but are not limited to, silicon oxide (SiO2) particles of different sizes and shapes.

[0144] Besides altering the optical path, optical structures can also be used to form optically transparent and distortion-free physical protective layers, preventing physical damage and other environmental factors from affecting the device during operation. Optical structures can be selectively used to fill the underside of flip-chip drivers (e.g.,...). Figures 11 to 16 As shown in the figure, this eliminates the need for a separate bottom filling operation.

[0145] The deposition techniques for the aforementioned optical structures include, but are not limited to, lamination, molding, and spraying. Optical materials can be deposited to form monolayer structures (such as...). Figure 11 (as shown) or multi-layered structure (such as) Figure 12 The optical structure shown is an optical structure where each optical layer can be formed using the same materials and deposition techniques, or a combination of different materials and deposition techniques. This allows each optical layer to have different physical shapes, reflection spectra, light diffusion characteristics, refractive indices, diffraction effects, scattering effects, and wavelength absorption characteristics.

[0146] Figure 19 exist Figure 7 Based on this, an optical structure 4 is added, and the integrated circuit packaging substrate is connected to the printed circuit board 5 through a ball grid array 7, so that the flip-chip driver integrated circuit 31 can be installed in the space between the integrated circuit packaging substrate 1 and the printed circuit board 5.

[0147] like Figure 19As shown, a ball grid array 7 (BGA) is formed on the lower surface of its integrated circuit packaging substrate. The ball grid array 7 (BGA) supports high-density surface mount technology (SMT) pad layout, enabling the most input / output (IO) contact points between the printed circuit board 5 (PCB) and the semiconductor package assembly.

[0148] A ball grid array (BGA) can be formed at a specific height to create a cavity between a semiconductor package assembly and a printed circuit board (PCB). This cavity can be used to accommodate one or more semiconductor integrated circuits, including but not limited to driver integrated circuits.

[0149] Ball grid arrays (BGAs) can be formed using ball-mounting methods known in the art, including but not limited to screen-printed solder paste followed by reflow soldering or stencil mesh ball-mounting followed by reflow soldering. For Figure 19 The illustrated embodiment preferably employs a template stencil ball-mounting method. This method utilizes prefabricated solder balls with standardized volume and size to ensure that the semiconductor package assembly remains horizontal relative to the printed circuit board (PCB) and to form a uniform cavity between them.

[0150] After the ball grid array (BGA) fabrication process is completed, one or more semiconductor integrated circuits can be mounted on the lower surface of the integrated circuit package substrate. For other embodiments where semiconductor integrated circuits are not mounted on the lower surface of the integrated circuit package substrate, screen printing solder paste is preferred because it is less expensive; however, for any embodiment employing a ball-mounting method, the physical contact between each ball grid array (BGA) ball and the printed circuit board (PCB) and integrated circuit package substrate is improved, and the entire semiconductor package assembly will remain horizontal relative to the PCB, thereby enabling uniform light emission from the entire lighting module composed of multiple semiconductor package assemblies.

[0151] Figures 20 to 22 This is a cross-sectional side view of a single semiconductor packaged assembly, which is mounted on the upper surface of a printed circuit board 5 to form the lighting module described herein. The fabrication steps that form the final structure are shown in sequence.

[0152] like Figures 20 to 22 As shown, the semiconductor packaging assembly is first diced at the dicing channel to form a complete device. Then, using surface mount technology (SMT), known in the art, the diced complete device is mounted onto the upper surface of the printed circuit board 5. This semiconductor packaging assembly is compatible with various printed circuit boards, including but not limited to metal-based single-sided printed circuit boards, FR4 double-sided printed circuit boards, FR4 multilayer printed circuit boards, and FR4 high-density interconnect printed circuit boards.

[0153] Figure 20This diagram illustrates a possible connection structure between an integrated circuit packaging substrate and a printed circuit board. The SMT pads 131 on the lower surface 1B of the integrated circuit packaging substrate are electrically connected to the PAD pads of the printed circuit board 5 via solder joints 15.

[0154] The component is mounted on the upper surface of the printed circuit board 5 using surface mount technology (SMT). The solder joints are formed by stencil-printed solder paste: solder paste is first deposited on the PCB, then the semiconductor package component is placed on the PCB, and then the solder paste is melted and formed into solder joints through a reflow soldering process.

[0155] Figure 21 Showing Figure 19 The semiconductor packaged component is mounted on the PCB. This component is mounted on the upper surface of the printed circuit board 5 using surface mount technology (SMT). The BGA is... Figure 19 The process shown is as follows: A semiconductor package assembly with a BGA is placed on a PCB. If necessary, additional solder paste can be selectively applied to the PCB pads. The BGA is then melted by a reflow soldering process, thereby forming a solder joint between the semiconductor package assembly and the PCB.

[0156] For the semiconductor packaging assembly embodiments described herein, a metal-core single-sided printed circuit board (PCB) is preferred. Metal-core single-sided PCBs offer excellent heat dissipation and a low coefficient of thermal expansion (CTE), which are crucial for LED devices. Metal-core single-sided PCBs can be fabricated to large panel sizes while maintaining acceptable yields and are one of the lowest-cost PCB solutions.

[0157] Existing technologies, due to the structural separation of LEDs and driver integrated circuits, cannot fully utilize the advantages of metal-based single-sided printed circuit boards (PCBs). In existing technologies, the connection between the driver integrated circuit and the LED is achieved through PCB wiring, forming a complex network of traces that often need to intersect. For low-density, low-complexity, low-illumination areas, and monochrome lighting modules, this problem can be solved using a small number or a dozen shunt jumpers or 0-ohm SOT jumpers. However, as the market increasingly demands higher density, complexity, more local dimming areas, and multiple colors, single-sided PCBs are insufficient to meet wiring requirements, typically necessitating the use of double-sided or even multi-layer PCBs.

[0158] The semiconductor packaging components described in this article can integrate the connections between the driver integrated circuit and the LED within the packaging components, simplifying the wiring between the semiconductor packaging components and the printed circuit board. This allows full utilization of the advantages of metal-based single-sided printed circuit boards, enabling the realization of higher density and more complex lighting modules.

[0159] For all semiconductor integrated circuits mounted on the underside of an integrated circuit package substrate, thermal interface material (TIM) solder joints can be formed between the back side of the semiconductor integrated circuit and the printed circuit board (PCB). These TIM solder joints provide additional heat dissipation paths and enhance the physical mounting connection with the PCB (e.g., ...). Figure 22 (As shown). Figure 22 In this circuit, the flip-chip driver integrated circuit 31 is connected to the printed circuit board 5 through thermal interface material solder joints 8, thereby achieving electrical connection while significantly improving the thermal conduction efficiency of the package structure.

[0160] The aforementioned thermal interface material solder joint 8 can be made of standard tin-based solder paste, including but not limited to the common SAC305 solder paste. Indium or indium silver alloy or other indium-based solder pastes can also be used to mitigate cyclic plastic strain. Gold-based solder paste (such as AuSn20) is the least preferred thermal interface material solder joint material because of its high cost and high tensile strength.

[0161] The aforementioned thermal interface material solder joints are preferably formed on a metal-based printed circuit board (PCB), which has a smaller coefficient of thermal expansion (CTE) mismatch compared to an organic-based PCB. A gold, nickel, and titanium metallization layer should be sputtered onto the back side of the semiconductor integrated circuit; this metallization layer is used to form a reliable solder joint connection with the thermal interface material solder joints.

[0162] Figures 23 to 24 This is a cross-sectional side view of a single semiconductor package assembly with an external lens structure, mounted on the upper surface of a printed circuit board 5. An optional external lens can be deposited or mounted over the semiconductor package assembly, completely encapsulating the entire assembly and altering the optical path of the device. The illustration shows the fabrication steps that form the final structure in sequence.

[0163] The external lens structure layout and shape shown in the illustrations are for illustrative purposes only, explaining the processing methods that enable the design of various embodiment configurations, and do not constitute a limitation. Optical materials may be glass, polymethyl methacrylate (PMMA), polycarbonate (PC), polyurethane-based monomers, resins, epoxy resins, silicone, or other polymeric materials known in the art suitable for lens manufacturing. Lenses may be deposited by molding or jetting (e.g.,...). Figure 23 (As shown). Figure 23 A non-limiting embodiment of a semiconductor package assembly with an external lens 6 is shown; the external lens 6 is formed in a convex shape and is capable of changing the optical path of the device.

[0164] In other embodiments, a pre-fabricated lens or lens stack may be mounted above the semiconductor package assembly and connected to the printed circuit board 5 via adhesive (e.g., Figure 24 (As shown). Figure 24 A non-limiting embodiment of a semiconductor package assembly with an external lens 6 is shown; the external lens 6 is crater-shaped and can change the optical path of the device.

[0165] LEDs can be electrically connected to and controlled by a driver integrated circuit within a semiconductor package. LEDs can be individually wired and controlled, or wired and controlled as series arrays, parallel arrays, multiple arrays, or combinations thereof. LEDs and related semiconductor integrated circuits can be arranged in various pattern configurations, and different end products will adopt the most effective unique pattern according to specific application scenarios.

[0166] In certain applications, optimizing the arrangement of LEDs can improve luminous uniformity and color blending. For example... Figure 25 As shown, in the prior art, LEDs of the three colors R, G, and B are usually arranged in parallel, and uneven color overlap and inconsistent luminous intensity are prone to occur in the central area.

[0167] This application provides an improved LED arrangement method, such as... Figure 26 and Figure 27 As shown, by arranging the LEDs in a ring around the same central point, the light can be fully superimposed in the central area, ensuring both the balance of luminous intensity and enhancing the color overlap effect of different colored LEDs, thereby improving the consistency of the overall lighting or display. Figure 28 As shown, an LED can also be placed at the center point, with other LEDs arranged around it.

[0168] This arrangement allows for greater overlap of the light-emitting areas of each LED in the central region. This enables a more complete mixing of various colors of light in the human eye, reducing color unevenness caused by pixel separation, especially noticeable when displaying high-contrast, high-saturation images. The wraparound tilted layout, by bringing sub-pixels closer to the center, results in tighter pixel overlap, effectively suppressing color shift and improving the sharpness and color purity of the image edges. Because color mixing is more natural and there are fewer color fringes, it also reduces color halos.

[0169] It should be noted that, Figures 26 to 28 The embodiments shown are merely examples; LED particles of other colors can also be arranged in this manner, and there are no restrictions on the color and number of LEDs.

[0170] This embodiment integrates a driver integrated circuit into a semiconductor package assembly, allowing the embedded driver integrated circuit to control other semiconductor components within the package. For example... Figure 29As shown, the driver integrated circuit (IC) can relay received data signals and pass them to the next driver IC in the line. This data signal relay process continues until it stops. The driver IC can be configured with additional power and data signal bypasses, so if one driver IC fails, the data signal and power can still be transmitted normally without affecting other devices downstream of the line. The driver IC can also be configured with two or more relay modules, allowing backup relay modules and backup communication lines to be activated in the event of a failure in one relay module.

[0171] Data signals are typically transmitted on dedicated data signal lines, but they can also be mixed into power lines to further simplify printed circuit board (PCB) design and reduce the size of integrated circuit packaging substrates and printed circuit boards (PCBs). The method of mixing data signals into power lines is a well-known technique in the field of power line communication (PLC).

[0172] The data signal relay range is not limited to a single lighting module, but can also be relayed to the next lighting module. Therefore, it not only reduces the wiring complexity of the lighting module printed circuit board (PCB), but also reduces the number of interface printed circuit boards (PCBs) or flexible printed circuit boards (PCBs) required to communicate with the main control motherboard.

[0173] Driver integrated circuits (ICs) maintain accurate luminous intensity and color gamut by providing stable, precise, and adjustable power to LEDs. These ICs can integrate photosensors for active self-calibration; these photosensors can be integrated inside the driver, placed on top of the IC, beside the IC, or in any other location on the surface of the IC package substrate. Semiconductor package assemblies can be calibrated using either integrated or external photosensors. Calibration can be performed in three distinct integration stages: before installation into the lighting module, after installation into the lighting module, and after the lighting module is installed into the complete device (such as a video display). While integrating photosensors into semiconductor package assemblies increases costs, this design allows users to perform high-precision device recalibration in home settings, effectively compensating for color and brightness inconsistencies caused by inconsistent LED degradation over time.

[0174] The photosensitive element can be electrically connected to the driver integrated circuit via dedicated sensing pads on the integrated circuit packaging substrate, specifically forming a signal path with the control logic unit of the driver integrated circuit. The photosensitive element detects the luminous state of the light-emitting diode in real time and converts the detected light signal into an electrical signal, which is then transmitted to the control logic unit of the driver integrated circuit. The control logic unit adjusts the output parameters of the constant current drive unit based on this electrical signal, thereby achieving active self-calibration of the device. Photosensitive elements include, but are not limited to, charge-coupled devices (CCDs), complementary metal-oxide-semiconductor (CMOS) image sensors, or photovoltaic (PV) devices, which are components capable of converting light signals into electrical signals.

[0175] Figure 29 This demonstrates a possible structure for a driver integrated circuit. After the upstream data signal enters through the data input port, it is split into two transmission paths: one path enters the relay function module, where it is processed sequentially by a signal shaping and amplification unit, a timing synchronization unit, and a data buffer unit before being transmitted to the data output port for forwarding to downstream devices; the other path is a redundant path, using a data signal bypass unit connected in parallel between the data input and data output ports to directly transmit data in case of a driver integrated circuit failure. Simultaneously, the control logic unit receives the processed signal from the relay function module, parses it, and transmits control commands to the constant current drive unit, forming a bidirectional signal interaction with the storage module and the photosensitive element.

[0176] After the external power supply is connected through the power input port, the main path supplies power to internal modules such as the relay function module and the control logic unit. The redundant path, through a power bypass unit connected in parallel between the power input port and the power output port, directly transmits power to downstream devices in the event of a fault in the driver integrated circuit. Finally, the constant current drive unit outputs the regulated current to the light-emitting device through the light-emitting device interface to achieve light emission drive.

[0177] Figure 30 The diagram illustrates the connection relationship between LEDs, driver ICs, and the control board in an existing lighting module: In this solution, multiple LEDs need to share the same driver IC, and all LED signal / power lines need to be routed separately to the driver IC, which is then connected to the control board. The large number of dispersed wirings not only increases the design difficulty of the printed circuit board (PCB) but also significantly increases the wiring cost.

[0178] Figure 31The connection between the lighting module and the control motherboard after adopting the semiconductor packaged components of this application is demonstrated: Since each semiconductor packaged component integrates an independent driver IC and the driver IC has a built-in relay function, each semiconductor packaged component can be connected in series through its own cascading port to form a link. Only the component at the beginning of the link needs to be connected to the control motherboard. The signals and power of subsequent components can be transmitted through the relay path of the previous stage component without additional separate wiring. This greatly simplifies the PCB wiring structure and reduces wiring complexity and cost.

[0179] This invention constructs an active matrix system for the lighting module by placing an independent driver integrated circuit in each semiconductor package component. Compared to traditional passive matrix systems, active matrix systems offer several advantages: support for the largest number of local dimming zones, simplified circuit wiring, increased brightness, support for the highest refresh rates, reduced eye strain, elimination of flicker in scan-line operation mode, and elimination of crosstalk issues in scan-line systems that prevent precise power supply to each local dimming zone. The improvements brought by active matrix systems are well-known in the field of display technology.

[0180] This invention enables low-cost multi-color illumination with an extremely high refresh rate, giving it a unique competitive advantage over existing liquid crystal display (LCD) backlighting technologies. In existing technologies, LCDs simultaneously produce multiple colors, typically presented as millions of pixels, each composed of red, green, and blue sub-pixels. Colors are separated by color filters deposited above the liquid crystal layer. This color filter method means that at least two-thirds of the luminous intensity generated by the illumination module is wasted, the boundaries between color sub-pixels are not illuminated, and the light transmittance of the color filters themselves is not 100%. These problems apply to all existing LCDs, including traditional white-backlit LCDs, high-end quantum dot LCDs, and the latest RGB LCDs.

[0181] Using the semiconductor packaging components described herein, low-cost color liquid crystal displays can be constructed using only monochrome image frames. The active matrix system should be able to generate a sufficiently high refresh rate or frame rate to divide a single full-color image frame into three or more monochrome image frames, creating the visual illusion of a full-color frame for the viewer.

[0182] In this embodiment, the driving integrated circuit uses a refresh rate of no less than 120Hz to drive the light-emitting device. This refresh rate threshold is determined based on the persistence of vision in the human eye and the principle of temporal color synthesis. The persistence of vision in response to light stimulation in the human eye is approximately 10–20ms. To ensure that the sequentially output red, green, and blue monochromatic lights fuse in the human eye to form a continuous, flicker-free full-color visual effect, a single frame of full-color image needs to be decomposed into three frames of monochromatic images and output sequentially. When the refresh rate is no less than 120Hz, color fragmentation and visual flicker can be effectively avoided, achieving high-quality color display based on persistence of vision.

[0183] Compared to existing technologies, this new liquid crystal display method offers at least three times the brightness and at least three times the resolution. This enables significant cost savings, such as the use of smaller LEDs, smaller power supplies, thinner wires, and lower-resolution LCD panels, while achieving the highest energy efficiency, highest resolution, and highest brightness achievable with current LCD panel technology. Thanks to these advantages, dual-LCD technology is now available for consumer products. While dual-LCD technology is known for addressing the issue of LCD panels failing to display black properly, it suffers from drawbacks in energy efficiency, brightness, size, and cost.

[0184] This invention covers all variations falling within the scope of the appended claims, including cases where two or more other semiconductor devices are mounted on an integrated circuit package substrate. It should be understood that the invention is not limited to the embodiments described and illustrated herein. Other objects, features, functions, and advantages of the invention will become apparent from the description, claims, and drawings.

[0185] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

[0186] This invention covers all variations falling within the scope of the appended claims, including cases where two or more other semiconductor devices are mounted on an integrated circuit package substrate. It should be understood that the invention is not limited to the embodiments described and illustrated herein. Other objects, features, functions, and advantages of the invention will become apparent from the description, claims, and drawings.

[0187] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor packaging component, characterized in that, include: A semiconductor carrier unit for carrying semiconductor components and capable of being connected to a printed circuit board; The semiconductor component includes: One or more light-emitting devices are mounted on the surface of the semiconductor carrier unit away from the printed circuit board. One or more driver integrated circuits are mounted on the semiconductor carrier unit, and the driver integrated circuits are electrically connected to the light-emitting device via the semiconductor carrier unit, or the driver integrated circuits are directly electrically connected to the light-emitting device; the driver integrated circuits are configured to control the voltage and current applied to the light-emitting device.

2. The semiconductor packaging assembly according to claim 1, characterized in that, The semiconductor carrier unit is an integrated circuit packaging substrate. The light-emitting device and the driving integrated circuit are electrically connected to the integrated circuit packaging substrate through pads. The integrated circuit packaging substrate is provided with a conductive wiring layer and conductive vias. The light-emitting device and the driving integrated circuit are electrically connected through the conductive wiring layer and the conductive vias. The integrated circuit packaging substrate is connected to the printed circuit board through surface mount pads.

3. The semiconductor packaging assembly according to claim 1, characterized in that, The light-emitting device is a light-emitting diode.

4. The semiconductor packaging assembly according to claim 1, characterized in that, The light-emitting device is provided in multiple ways, and the multiple light-emitting devices are distributed around the same central point.

5. The semiconductor packaging assembly according to claim 1, characterized in that, The semiconductor component further includes one or more light sensing elements electrically connected to the driving integrated circuit. The light sensing elements are used to detect the light emission state of the light-emitting device and send a feedback signal to the driving integrated circuit. The driving integrated circuit is configured to calibrate the light emission intensity and color consistency of the light-emitting device based on the feedback signal from the light sensing elements.

6. The semiconductor packaging assembly according to claim 1 or 5, characterized in that, The semiconductor component further includes a storage module electrically connected to the driver integrated circuit. The storage module is configured to store control parameters of the light-emitting device, and the driver integrated circuit is configured to read the control parameters from the storage module and drive the light-emitting device based on the control parameters.

7. The semiconductor packaging assembly according to claim 1 or 4, characterized in that, It also includes an optical structure that partially covers the light-emitting device. The optical structure is used to change the light path of the light emitted by the light-emitting device and to encapsulate and protect the internal semiconductor components.

8. A lighting module, characterized in that, include: Printed circuit boards; Multiple semiconductor packaging components as described in claim 1, each of the semiconductor packaging components being assembled on the printed circuit board and electrically connected to the printed circuit board; The control motherboard is configured to send control commands to each driver integrated circuit of each semiconductor package assembly to control the light emission state of the light-emitting devices in each semiconductor package assembly.

9. The lighting module according to claim 8, characterized in that, The driver integrated circuit is equipped with a relay function module, which relays the various semiconductor package components and connects them in series to the control motherboard.

10. The lighting module according to claim 8, characterized in that, The driver integrated circuit is disposed in the space between the semiconductor carrier unit and the printed circuit board.

11. The lighting module according to claim 8, characterized in that, It also includes an external lens, which is encapsulated on the outside of the entire semiconductor package and connected to the printed circuit board.

12. The lighting module according to claim 8, characterized in that, The printed circuit board is a metal-based single-sided printed circuit board.

13. A control method for the lighting module as described in claim 8, characterized in that, include: S1. Initialization Configuration: The driver integrated circuit of each semiconductor package component is started. The driver integrated circuit reads preset control parameters from the corresponding storage module. The preset control parameters include at least the reference luminous intensity parameter, reference driving voltage parameter, reference driving current parameter and refresh rate control parameter of the light-emitting device. S2. Signal Reception: The driver integrated circuit receives external control commands, which are sent by the control motherboard of the lighting module to indicate the target light emission state of the light-emitting device; S3. Drive control: The drive integrated circuit adjusts the voltage and current output to the light-emitting device based on the preset control parameters and external control commands, and drives the light-emitting device to emit light at the preset refresh rate, so that the light-emitting device reaches the target light-emitting state.

14. The control method for the lighting module according to claim 13, characterized in that, Also includes: S4. Status Feedback: The actual light emission parameters of the light-emitting device are collected by the photosensitive element assembled in the semiconductor carrier unit, and the actual light emission parameters are fed back to the driver integrated circuit; S5. Closed-loop calibration: The driver integrated circuit compares the deviation between the actual light emission parameters and the preset control parameters, and dynamically adjusts the voltage, current or driving timing output to the light emission device to achieve calibration of the light emission state.

15. The control method for the lighting module according to claim 13, characterized in that, In step S3, the driving control also includes: dividing a single full-color image frame into three or more monochrome image frames, driving the light-emitting device to output corresponding monochrome light in chronological order, and using the persistence of vision effect of the human eye to make the viewer have the visual illusion of a full-color frame.

Images