A false attachment prevention management system and management method for wafer film attachment
By using an automated comparison and judgment system to prevent mis-application, the problems of incorrect selection of grinding tape type and incorrect placement of wafer front and back in wafer lamination operations have been solved, thereby improving product yield and production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING HUAFENG INTEGRATED ELECTRONICS CO LTD
- Filing Date
- 2025-12-30
- Publication Date
- 2026-05-29
AI Technical Summary
In semiconductor packaging processes, the existing wafer lamination process may result in incorrect selection of the polishing tape type and incorrect placement of the wafer front and back, leading to low product yield and low production efficiency.
An anti-misapplication management system is adopted, including a film applicator, a tape information management server, a detection unit, and an EAP/RMS server. Through automated comparison and judgment, the system ensures the accuracy of the grinding tape information and the wafer placement orientation, achieving three levels of anti-misapplication.
It significantly reduced the probability of incorrect application of the grinding tape, improved product yield and production efficiency, and reduced the probability of errors in manual review.
Smart Images
Figure CN122121587A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor packaging technology, specifically to a management system and method for preventing mis-attachment in wafer bonding operations. Background Technology
[0002] In semiconductor packaging processes, to achieve chip miniaturization, the back side of the wafer is often ground to ensure the final product's thickness meets specified requirements. To prevent damage or contamination of the front side (the side containing the integrated circuit) during grinding, protection tape is typically applied to the front side before grinding. Different wafer models require different types of protection tape (with varying lengths, single-layer thicknesses, and materials). Incorrect tape selection can lead to incorrect final product thickness, residual adhesive, or chipping. Currently, production processes typically involve manual material handling and visual inspection to verify tape information, increasing the risk of tape selection errors. Furthermore, placing the wafer in the designated position on the placement machine is also usually done manually, increasing the risk of incorrect placement (front and back sides). Incorrect placement can result in the front side of the wafer being incorrectly ground and rendered unusable. Continuous work can increase the probability of errors due to fatigue and irritability. As a result, there is a certain probability of errors in the current wafer lamination process, which affects product yield and production efficiency. Summary of the Invention
[0003] This application aims to address one of the technical problems in related technologies to a certain extent. To this end, this application provides a management system and method for preventing mis-attachment in wafer lamination operations.
[0004] To achieve the above objectives, this application adopts the following technical solution: a management system for preventing mis-attachment in wafer bonding operations, comprising:
[0005] A wafer laminator is configured to input polishing tape information before performing wafer lamination operations, the polishing tape information including at least first information and second information;
[0006] A tape information management server is used to record and store the grinding tape information in real time.
[0007] A detection unit, disposed in the laminator, is used to detect the second information of the tape to be polished and the placement orientation of the wafer to be polished; and,
[0008] The EAP / RMS server is used to compare the first and second information of the tape to be ground with the first and second information stored in the tape information management server in sequence, and to determine the placement orientation of the wafer to be ground.
[0009] The film applicator, the tape information management server, and the detection unit are all connected to the EAP / RMS server via signal transmission to transmit information.
[0010] The application of this application has the following beneficial effects: By integrating the laminating machine, tape information management server, detection unit, and EAP / RMS server into a system capable of information exchange, a three-tiered anti-misapplication system can be achieved: First, the first information can be compared through the EAP / RMS server; second, the second information collected by the detection unit can be obtained through the EAP / RMS server and compared; finally, the wafer placement orientation information collected by the detection unit can be obtained through the EAP / RMS server and judged. Compared with the existing manual review and verification scheme, the above-mentioned automated comparison and judgment operations can significantly reduce the probability of misapplication of grinding tape, and can greatly improve the product yield and production efficiency of the laminating operation.
[0011] Optionally, the film applicator, the tape information management server, the EAP / RMS server, and the detection unit are connected via a network port based on the SECS / GEM protocol.
[0012] Optionally, the first information includes at least one of the following: grinding tape model, grinding tape number, and grinding tape internal part number; the second information includes the grinding tape thickness.
[0013] Optionally, the first information may also include at least one of the following: the manufacturer of the abrasive tape, the length of the abrasive tape, and the expiration date of the abrasive tape.
[0014] Optionally, the detection unit includes a thickness measurement module and an image detection module. The thickness measurement module is used to detect the thickness value of the tape to be ground and send the thickness value to the EAP / RMS server for comparison. The image detection module is used to acquire a surface image of the wafer to be ground and send the surface image to the EAP / RMS server for judgment.
[0015] Optionally, the thickness measurement module is a laser thickness measurement module, and the image detection module is an industrial camera.
[0016] Furthermore, this application also provides a method for preventing mis-attachment in wafer lamination operations, implemented using an anti-mis-attachment management system as described in any of the above technical solutions. The anti-mis-attachment management method includes the following steps:
[0017] S100: Place the grinding tape and the wafer to be ground on the laminator, and record the grinding tape information of the grinding tape into the laminator and the tape information management server;
[0018] S200: Trigger the start of the work process. The first information of the tape to be ground is compared with the first information stored in the tape information management server through the EAP / RMS server. If the comparison is successful, proceed to step S300. If the comparison fails, stop the work.
[0019] S300: The detection unit obtains the second information of the tape to be ground and transmits it to the EAP / RMS server. The EAP / RMS server compares the second information of the tape to be ground with the second information stored in the tape information management server. If the comparison is successful, proceed to step S400; otherwise, stop the operation.
[0020] S400: The placement orientation information of the wafer to be processed is obtained through the detection unit and transmitted to the EAP / RMS server. The EAP / RMS server determines the placement orientation of the wafer to be processed. If the orientation is correct, the film application operation is performed; if the orientation is incorrect, the operation is stopped.
[0021] The method for preventing accidental labeling provided in this application is similar to the reasoning process of the beneficial effects of the aforementioned method for preventing accidental labeling, and will not be repeated here.
[0022] Optionally, the step of recording the abrasive tape information of the tape to be abraded into the laminating machine and the tape information management server includes:
[0023] The grinding tape information of the tape to be ground is entered into the laminating machine and the tape information management server by manual input or QR code input.
[0024] Optionally, the second information includes the thickness of the grinding tape, and the comparison of the second information of the tape to be ground with the second information stored in the tape information management server via the EAP / RMS server includes:
[0025] The actual difference is obtained by subtracting the thickness of the grinding tape to be ground from the standard thickness of the grinding tape stored in the tape information management server.
[0026] The actual difference is compared with a pre-stored threshold in the EAP / RMS server.
[0027] Optionally, the detection unit includes an industrial camera, and the step of obtaining the placement orientation information of the wafer to be processed through the detection unit includes: acquiring an actual surface image of the wafer to be processed through the industrial camera;
[0028] The step of determining the placement orientation of the wafer to be processed by the EAP / RMS server includes comparing the pixels of the actual surface image with the pixels of a standard surface image pre-stored in the EAP / RMS server.
[0029] These features and advantages of this application will be disclosed in detail in the following specific embodiments and accompanying drawings. The best embodiments or means of this application will be shown in detail in conjunction with the accompanying drawings, but are not intended to limit the technical solutions of this application. In addition, each of these features, elements and components appearing in the following text and drawings is multiple and is labeled with different symbols or numbers for convenience, but all represent parts with the same or similar structure or function. Attached Figure Description
[0030] The following description, in conjunction with the accompanying drawings, further illustrates this application:
[0031] Figure 1 This application provides an embodiment of an information interaction diagram of an anti-mis-attachment management system for wafer film application.
[0032] Figure 2 This is a flowchart illustrating the anti-mislabeling management method for applying this anti-mislabeling management system.
[0033] The components include: 1. Film applicator; 2. Tape information management server; 3. Detection unit; 30. Thickness measurement module; 31. Image detection module; and 4. EAP / RMS server. Detailed Implementation
[0034] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described are intended to explain this application and should not be construed as limiting it.
[0035] The terms "an embodiment," "example," or "example" used in this specification refer to a particular feature, structure, or characteristic described in connection with the embodiment itself that may be included in at least one embodiment disclosed in this application. The phrase "in an embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment.
[0036] In the description of this application, it should be understood that the terms "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In the description of this application, "a plurality of" means two or more, unless otherwise precisely specified.
[0037] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected," "linked," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a connection through an intermediary, or a connection within two elements or an interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0038] This embodiment provides a management system for preventing mis-attachment during wafer bonding operations, such as... Figure 1 As shown, the anti-mis-application management system includes a film applicator 1, a tape information management server 2, a detection unit 3, and an EAP / RMS server 4. The film applicator 1 is configured to input grinding tape information before wafer film application, including first information and second information. The tape information management server 2 records and stores the grinding tape information in real time. The detection unit 3 is located on the film applicator 1 and is used to detect the second information of the tape to be ground and the placement orientation of the wafer to be processed. The EAP / RMS server 4 compares the first and second information of the tape to be ground with the first and second information stored in the tape information management server 2 sequentially, and determines the placement orientation of the wafer to be processed. In this embodiment, the film applicator 1, the tape information management server 2, and the detection unit 3 are all connected to the EAP / RMS server 4 via signal transmission.
[0039] The anti-misapplication management system provided in this embodiment integrates the film applicator 1, the tape information management server 2, the detection unit 3, and the EAP / RMS server 4 into a system capable of information exchange, achieving three levels of anti-misapplication. Specifically, firstly, the EAP / RMS server 4 can compare the first piece of information; secondly, the EAP / RMS server 4 can obtain the second piece of information collected by the detection unit 3 and compare it; finally, the EAP / RMS server 4 can obtain the wafer placement orientation information collected by the detection unit 3 and make a judgment. Compared with the existing manual review and verification scheme, the above-mentioned automated comparison and judgment operations can significantly reduce the probability of misapplication of grinding tape, and can greatly improve the product yield and production efficiency of the film applicator.
[0040] Furthermore, in this embodiment, the film applicator 1, the tape information management server 2, the EAP / RMS server 4, and the detection unit 3 are connected via a network port based on the SECS / GEM protocol. By using the standard communication protocol SECS / GEM from the semiconductor equipment field for interconnection, the standardization, high reliability, and real-time performance of data transmission between various components within the system (especially between the film applicator 1 from different manufacturers and the upper-level management system) can be ensured. This facilitates the widespread use of the anti-misapplication management system and can thereby reduce the implementation cost of the anti-misapplication management system.
[0041] The first information in this embodiment includes the grinding tape model, grinding tape serial number, and grinding tape internal part number. Each of these three elements constitutes a unique identification information for the grinding tape. Therefore, in other optional embodiments, the first information may include only one or any two of the grinding tape model, grinding tape serial number, and grinding tape internal part number. The second information in this embodiment includes the grinding tape thickness. By setting the second information and using the detection unit 3 to detect the grinding tape to be processed, secondary comparison and verification are facilitated.
[0042] Furthermore, the first information in this embodiment also includes at least one of the following: the manufacturer of the grinding tape, the length of the grinding tape, and the expiration date of the grinding tape. This helps to verify the accuracy of the grinding tape information and facilitates viewing relevant information about the grinding tape.
[0043] The detection unit 3 in this embodiment includes a thickness measurement module 30 and an image detection module 31. The thickness measurement module 30 detects the thickness of the tape to be polished and sends the thickness value to the EAP / RMS server 4 for comparison. The image detection module 31 acquires a surface image of the wafer to be polished and sends the surface image to the EAP / RMS server 4 for judgment. In this embodiment, the thickness measurement module 30 and the image detection module 31 can be integrated on the laminating machine 1, with the thickness measurement module 30 positioned above the polishing tape and the image detection module 31 positioned above the wafer. Therefore, after manually placing the polishing tape and wafer at predetermined positions on the laminating machine 1, detection can be completed without moving the polishing tape and wafer between different positions, thereby shortening the operation time.
[0044] Furthermore, in this embodiment, the thickness measurement module 30 is a laser thickness measurement module, and the image detection module 31 is an industrial camera. Laser thickness measurement has the advantages of being non-contact, highly accurate, and high-speed, and can accurately measure the thickness of the grinding tape without causing any physical impact on the grinding tape. The industrial camera can capture the surface micro-features of the wafer at high resolution, obtaining high-definition images of the wafer surface. This provides a highly reliable raw data basis for subsequent comparison or judgment. It should be noted that during the wafer lamination operation, placing the wafer face up is the correct placement orientation. However, the front side of the wafer has a rectangular grid structure, which may result in the surface image obtained from the front side of the wafer having a higher pixel count than the surface image obtained from the back side. The EAP / RMS server 4 can determine whether the wafer placement orientation is correct by comparing the pixel count of the wafer surface image obtained by the industrial camera with the pixel count of the standard image of the front side of the wafer.
[0045] like Figure 2 As shown, the method for preventing accidental labeling using the anti-accidental labeling management system provided in this embodiment includes the following steps:
[0046] S100: Place the grinding tape and wafer to be ground on laminating machine 1, and input the grinding tape information into laminating machine 1 and tape information management server 2. In practice, the grinding tape and wafer can be manually or by a robotic arm and placed at predetermined positions on laminating machine 1. Simultaneously, the grinding tape information can be manually entered into laminating machine 1 and tape information management server 2 via barcode scanning. For example, if an operator takes a roll of grinding tape from the storage location and scans it with the barcode scanner on tape information management server 2, the relevant information will be entered into tape information management server 2 in real time, recording the removal of a roll of grinding tape and its related grinding tape information (grinding tape model, grinding tape number, internal part number, and thickness, etc.). The operator then scans the abrasive tape using the barcode scanner on the laminating machine 1, and the laminating machine 1 records the abrasive tape information corresponding to that abrasive tape.
[0047] S200: The work process is triggered. The EAP / RMS server 4 compares the first information of the tape to be ground with the first information stored in the tape information management server 2. If the comparison is successful, proceed to step S300; otherwise, stop the work. In this embodiment, the first information includes the tape model, tape number, and internal part number. The EAP / RMS server 4 obtains relevant information from the laminator 1 and the tape information management server 2 and compares them. If the comparison results are the same, proceed to the next step; if the comparison results are different, stop the work. Stopping the work means that the EAP / RMS server 4 sends a signal to the laminator 1, and the laminator 1 stops working. In a preferred embodiment, an alarm can also be issued.
[0048] S300: The detection unit 3 acquires the second information of the tape to be ground and transmits it to the EAP / RMS server 4. The EAP / RMS server 4 compares the second information of the tape to be ground with the second information stored in the tape information management server 2. If the comparison is successful, proceed to step S400; otherwise, stop the operation. Specifically, in this embodiment, the second information includes the thickness of the grinding tape. The comparison of the second information of the tape to be ground with the second information stored in the tape information management server 2 by the EAP / RMS server 4 includes: subtracting the thickness of the grinding tape to be ground from the standard thickness of the grinding tape stored in the tape information management server 2 to obtain the actual difference value; then, comparing the actual difference value with a preset threshold value stored in the EAP / RMS server 4. For example, the standard thickness of the grinding tape is set to 100μm, with an allowable tolerance of ±25μm, that is, the aforementioned preset threshold value is 25μm. If the actual thickness of the grinding tape to be worked is measured to be 118μm by laser thickness measurement, then the actual difference mentioned above is 18μm. Comparing 18μm with 25μm, it can be seen that the actual difference is less than the set threshold, so it is judged that the comparison is passed.
[0049] S400: The placement orientation information of the wafer to be processed is obtained by the detection unit 3 and transmitted to the EAP / RMS server 4. The EAP / RMS server 4 determines the placement orientation of the wafer to be processed. If the orientation is correct, the film application operation is performed; if the orientation is incorrect, the operation is stopped. Specifically, in this embodiment, the detection unit 3 includes an industrial camera. Obtaining the placement orientation information of the wafer to be processed by the detection unit 3 specifically includes: capturing an actual surface image of the wafer to be processed using the industrial camera; then, comparing the pixels of the actual surface image with the pixels of a standard surface image pre-stored in the EAP / RMS server 4. As mentioned above, during the wafer film application operation, placing the wafer face up is the correct placement orientation. However, the front of the wafer has a rectangular grid structure, which may result in the pixel count of the surface image obtained from capturing the front of the wafer being higher than that obtained from capturing the back of the wafer. The EAP / RMS server 4 can determine whether the wafer placement orientation is correct by comparing the pixel count of the wafer surface image obtained by the industrial camera with the pixel count of the standard image of the front of the wafer. When the pixel count of the actual surface image is equal to the pixel count of the standard surface image pre-stored in the EAP / RMS server 4, the wafer is considered to be placed in the correct orientation (wonder side facing up). It should be noted that "pixel equal" here refers to approximate equality, not absolute equality. When the pixel count of the actual surface image is less than the pixel count of the standard surface image pre-stored in the EAP / RMS server 4, the wafer is considered to be placed in the wrong orientation (back side facing up). In practical applications, if the wafer is incorrectly placed with the back side facing up, the pixel count of the actual surface image will be significantly smaller than the pixel count of the standard surface image pre-stored in the EAP / RMS server 4.
[0050] By comparing and judging as described above, the probability of applying the wrong abrasive tape can be significantly reduced, which can greatly improve the product yield and work efficiency of the film application process.
[0051] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Those skilled in the art should understand that this application includes, but is not limited to, the contents described in the accompanying drawings and the specific embodiments above. Any modifications that do not depart from the functional and structural principles of this application will be included within the scope of the claims.
Claims
1. A management system for preventing mis-attachment in wafer film application operations, characterized in that, include: A wafer laminator is configured to input polishing tape information before performing wafer lamination operations, the polishing tape information including at least first information and second information; A tape information management server is used to record and store the grinding tape information in real time. A detection unit, disposed in the laminator, is used to detect the second information of the tape to be polished and the placement orientation of the wafer to be polished; and, The EAP / RMS server is used to compare the first and second information of the tape to be ground with the first and second information stored in the tape information management server in sequence, and to determine the placement orientation of the wafer to be ground. The film applicator, the tape information management server, and the detection unit are all connected to the EAP / RMS server via signal transmission to transmit information.
2. The anti-mislabeling management system as described in claim 1, characterized in that, The film applicator, the tape information management server, the EAP / RMS server, and the detection unit are connected via a network port based on the SECS / GEM protocol.
3. The anti-mislabeling management system as described in claim 1 or 2, characterized in that, The first information includes at least one of the following: grinding tape model, grinding tape number, and grinding tape internal part number; the second information includes the grinding tape thickness.
4. The anti-mislabeling management system as described in claim 3, characterized in that, The first information also includes at least one of the following: the manufacturer of the abrasive tape, the length of the abrasive tape, and the expiration date of the abrasive tape.
5. The anti-mislabeling management system as described in claim 3, characterized in that, The detection unit includes a thickness measurement module and an image detection module. The thickness measurement module is used to detect the thickness value of the tape to be ground and send the thickness value to the EAP / RMS server for comparison. The image detection module is used to acquire the surface image of the wafer to be ground and send the surface image to the EAP / RMS server for judgment.
6. The anti-mislabeling management system as described in claim 5, characterized in that, The thickness measurement module is a laser thickness measurement module, and the image detection module is an industrial camera.
7. A method for preventing mis-attachment during wafer lamination operations, characterized in that, The method of preventing accidental labeling is implemented using the anti-accidental labeling management system as described in any one of claims 1 to 6, and the anti-accidental labeling management method includes the following steps: S100: Place the grinding tape and the wafer to be ground on the laminator, and record the grinding tape information of the grinding tape into the laminator and the tape information management server; S200: Trigger the start of the work process. The first information of the tape to be ground is compared with the first information stored in the tape information management server through the EAP / RMS server. If the comparison is successful, proceed to step S300. If the comparison fails, stop the work. S300: The detection unit obtains the second information of the tape to be ground and transmits it to the EAP / RMS server. The EAP / RMS server compares the second information of the tape to be ground with the second information stored in the tape information management server. If the comparison is successful, proceed to step S400; otherwise, stop the operation. S400: The placement orientation information of the wafer to be processed is obtained through the detection unit and transmitted to the EAP / RMS server. The EAP / RMS server determines the placement orientation of the wafer to be processed. If the orientation is correct, the film application operation is performed; if the orientation is incorrect, the operation is stopped.
8. The method for preventing accidental labeling as described in claim 7, characterized in that, The step of inputting the grinding tape information of the tape to be ground into the laminating machine and the tape information management server includes: The grinding tape information of the tape to be ground is entered into the laminating machine and the tape information management server by manual input or QR code input.
9. The method for preventing accidental labeling as described in claim 7, characterized in that, The second information includes the thickness of the grinding tape. The comparison of this second information with the second information stored in the tape information management server via the EAP / RMS server includes: The actual difference is obtained by subtracting the thickness of the grinding tape to be ground from the standard thickness of the grinding tape stored in the tape information management server. The actual difference is compared with a pre-stored threshold in the EAP / RMS server.
10. The method for preventing accidental labeling as described in claim 7, characterized in that, The detection unit includes an industrial camera, and the process of obtaining the placement orientation information of the wafer to be processed through the detection unit includes: acquiring an actual surface image of the wafer to be processed through the industrial camera; The step of determining the placement orientation of the wafer to be processed by the EAP / RMS server includes comparing the pixels of the actual surface image with the pixels of a standard surface image pre-stored in the EAP / RMS server.