Chip transfer apparatus and correction method thereof
By coordinating the visual inspection and monitoring module of the chip transfer device, the nozzle gap is corrected, which solves the positional offset problem during the chip transfer process and improves the transfer accuracy and packaging yield.
Patent Information
- Application Number
- CN202610204345.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-12
- Publication Date
- 2026-05-29
AI Technical Summary
Positional shifts caused by component processing and assembly errors during chip transfer can affect the chip-electrode contact yield and packaging effect.
A chip transfer device is adopted, including a first turret module, a second turret module, a vision inspection module, and a monitoring module. The vision inspection module detects the nozzle gap and feeds it back to the monitoring module. The turret moving platform is adjusted to correct the nozzle position so that the gap reaches the preset range.
It improves chip transfer accuracy, enhances packaging yield and chip performance, and simplifies the calibration process.
Smart Images
Figure CN122121605A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor technology, and in particular to a chip transfer device and its calibration method. Background Technology
[0002] In the field of semiconductor chip manufacturing and packaging testing, chip transfer is a crucial link connecting various production processes. Its core objective is to accurately transfer the chip from the original substrate to the target assembly position. The transfer accuracy directly determines the subsequent packaging yield and the final performance of the chip. In related technologies, chips are transferred using specialized transfer devices. However, due to errors in component manufacturing and assembly processes, the cumulative effect of these multiple errors leads to a deviation between the final assembly effect of the transfer device and the ideal situation. Therefore, positional misalignment can occur during chip transfer, ultimately resulting in chip displacement within the device. This affects the chip-electrode contact yield, and may even lead to packaging failure or the scrapping of the entire device. Summary of the Invention
[0003] The purpose of this invention is to provide a chip transfer device and its calibration method to improve chip transfer accuracy, subsequent packaging yield, and chip performance.
[0004] To achieve this objective, the present invention adopts the following technical solution: A chip transfer device, comprising: The first turret module includes a first turntable and a plurality of first suction nozzles disposed on the first turntable; The second turret module includes a turret moving platform, a second turntable, and multiple second suction nozzles. The multiple second suction nozzles are disposed on the second turntable. The turret moving platform is used to drive the second turntable to move along a first direction and a second direction, which are set at an angle. The first suction nozzle and the second suction nozzle can be docked to transfer chips. A first vision detection module is used to detect the gap between the first nozzle and the second nozzle along the first direction and the gap along the second direction; The monitoring module is communicatively connected to the second turret module and the first visual detection module, respectively. The first visual detection module can feed back to the monitoring module the gap information of the first suction nozzle and the second suction nozzle along the first direction and the gap information along the second direction; the monitoring module can send a signal to the second turret module to drive the turret moving platform to move the second turntable and the second suction nozzle, so that the gap between the first suction nozzle and the second suction nozzle along the first direction and the gap in the second direction respectively reach the preset size range.
[0005] In some embodiments, the first visual inspection module includes a first camera and a second camera, the first camera being used to detect the gap between the first nozzle and the second nozzle along the first direction, and the second camera being used to detect the gap between the first nozzle and the second nozzle along the second direction.
[0006] In some embodiments, it also includes: The ejector module includes an ejector moving platform and an ejector body disposed on the ejector moving platform, wherein the ejector body can be docked with a second suction nozzle; The second vision detection module is used to detect the gap between the ejector pin body and the second suction nozzle along the first direction and the gap along the second direction; The monitoring module is communicatively connected to the pin module and the second visual detection module, respectively. The second visual inspection module can feed back to the monitoring module the gap information between the ejector body and the second suction nozzle along the first direction and the gap information along the second direction. The monitoring module can send a signal to the ejector module to drive the ejector body to move on the ejector moving platform, so that the gap between the ejector body and the second suction nozzle along the first direction and the gap information along the second direction reach the preset size range respectively.
[0007] In some embodiments, the second visual inspection module includes a third camera and a fourth camera, the third camera being used to detect the gap between the ejector pin body and the second suction nozzle along the first direction, and the fourth camera being used to detect the gap between the ejector pin body and the second suction nozzle along the second direction.
[0008] In some embodiments, the second turret module is disposed between the first turret module and the monitoring module along a third direction. When one second suction nozzle is connected to the first suction nozzle, the other second suction nozzle is connected to the ejector pin body. The third direction is perpendicular to the first direction and the second direction, respectively.
[0009] In some embodiments, the first turntable rotates about a centerline parallel to the third direction, the second turntable rotates about a centerline parallel to the first or second direction, the first suction nozzle and the ejector pin body are disposed facing each other, and the second suction nozzle is radially outward along the second turntable.
[0010] In some embodiments, both the turret moving platform and the ejector pin moving platform include two moving mechanisms, one of which is used to output movement in the first direction, and the other is used to output movement in the second direction.
[0011] A calibration method for a chip transfer apparatus as described in any of the preceding claims, comprising: The first suction nozzles A on the first turret module are numbered 1, 2, 3, ... N, N+1, ... X, X+1, A respectively, and the second suction nozzles B on the second turret module are numbered 1, 2, 3, ... M, M+1, ... Y, Y+1, B respectively; Rotate the first and second turntables until the first suction nozzle (N) and the second suction nozzle (M) are aligned. The first visual inspection module is used to detect the gap between the first suction nozzle (N) and the second suction nozzle (M) along the first direction and the gap along the second direction, and to send information to the monitoring module. The monitoring module sends a signal to drive the turret moving platform to move the second turntable and the second suction nozzle, so that the gap between the first suction nozzle N and the second suction nozzle M along the first direction and the gap in the second direction are respectively within a preset size range, and saves the gap information of the first suction nozzle N and the second suction nozzle M along the first direction and the gap in the second direction. When the first suction nozzle (N) and the second suction nozzle (M) dock again, the monitoring module sends a signal according to the pre-stored information to drive the turret moving platform to move the second turntable and the second suction nozzle, so that the gap between the first suction nozzle (N) and the second suction nozzle (M) along the first direction and the gap along the second direction are respectively within a preset size range.
[0012] In some embodiments, the chip transfer device further includes a pin module, and the calibration method further includes: Rotate the second turntable until the second suction nozzle (number X) and the ejector pin body are aligned; The second visual inspection module is used to detect the gap between the ejector pin body and the second suction nozzle X along the first direction and the gap along the second direction, and to send information to the monitoring module; The monitoring module sends a signal to drive the ejector pin moving platform to move the ejector pin body, so that the gap between the ejector pin body and the second suction nozzle X along the first direction and the gap along the second direction respectively reach a preset size range, and saves the gap information between the ejector pin body and the second suction nozzle X along the first direction and the gap along the second direction. When the second suction nozzle X and the ejector pin body are reconnected, the monitoring module sends a signal according to the pre-stored information to drive the ejector pin moving platform to move the ejector pin body, so that the gap between the ejector pin body and the second suction nozzle X along the first direction and the gap along the second direction respectively reach the preset size range.
[0013] In some embodiments, when the second suction nozzle M is connected to the first suction nozzle N, the second suction nozzle X can be connected to the ejector pin body; the calibration method further includes: Rotate the first and second turntables to align the first suction nozzle (N) and the second suction nozzle (M), and align the second suction nozzle (X) and the ejector pin body. The monitoring module sends a signal to drive the turret moving platform to move the second turntable and the second suction nozzle, so that the gap between the first suction nozzle N and the second suction nozzle M along the first direction and the gap in the second direction are respectively within a preset size range; The monitoring module sends a signal to drive the ejector pin moving platform to move the ejector pin body, so that the gap between the ejector pin body and the second suction nozzle X along the first direction and the gap along the second direction respectively reach a preset size range.
[0014] The beneficial effects of this invention are: The present invention provides a chip transfer device in which, after a first suction nozzle and a second suction nozzle are docked, a first vision detection module first detects the gap between them along a first direction and the gap along a second direction. The gap information of the first and second suction nozzles along the first and second directions is fed back to a monitoring module. Finally, the monitoring module sends a signal to adjust the position of the second suction nozzle along the first and second directions through a turret moving platform, thereby adjusting the size of the gap between the first and second suction nozzles along the first and second directions. This ensures that the gap size in both directions is within a preset size range, thus satisfying the relative positional accuracy between the first and second suction nozzles and improving the chip transfer accuracy between the first and second suction nozzles.
[0015] Using the first nozzle of the first turret module in its working position as a reference, the first vision inspection module, the monitoring module, and the second turret module work together to fine-tune the position of the second nozzle. This ensures that the gap between the second nozzle and the first nozzle in the first and second directions are within a preset range, thereby ensuring that the first and second nozzles are aligned along the third direction. This, in turn, ensures chip transfer accuracy, improves subsequent packaging yield, and enhances chip performance.
[0016] The present invention provides a calibration method for a chip transfer device. The turret moving platform drives the second turntable and the corresponding second suction nozzle to move along the first direction and the second direction, thereby realizing the deviation correction between the second suction nozzle and the first suction nozzle. Furthermore, by monitoring the gap information of the first and second suction nozzles along the first direction and the gap information along the second direction stored by the monitoring module, the position of the N-number first suction nozzle and the M-number second suction nozzle can be directly adjusted when they are docked again, without the need to perform gap detection again through the first vision detection module, thus simplifying the steps and process. Attached Figure Description
[0017] Figure 1This is a schematic diagram of a chip transfer device from one perspective, provided in a specific embodiment of the present invention; Figure 2 This is a front view of the chip transfer device provided in a specific embodiment of the present invention; Figure 3 This is a partial schematic diagram of a chip transfer device from another perspective, provided by a specific embodiment of the present invention; Figure 4 This is a schematic diagram of the second turret module provided in a specific embodiment of the present invention; Figure 5 This is a schematic diagram of the ejector pin module provided in a specific embodiment of the present invention; Figure 6 This is a schematic diagram of a pin module without a third moving module provided in a specific embodiment of the present invention; Figure 7 This is a schematic diagram of a pin module without a pin body provided in a specific embodiment of the present invention; Figure 8 This is a flowchart of a calibration method for a chip transfer device provided in a specific embodiment of the present invention.
[0018] In the picture: 1000, Ejector pin module; 1100, Ejector pin moving platform; 100. Base plate; 110. First plane; 120. Second plane; 130. Boss; 200, First moving module; 210, First driving component; 220, First adapter plate; 221, First plate; 222, Second plate; 223, First opening; 224, Third plate; 230, First transmission assembly; 231, First lead screw; 232, First lead screw nut; 240, First guide assembly; 250, First slotted photoelectric sensor; 260, First detection component; 300. Second moving module; 310. Second driving component; 320. Second adapter plate; 321. Second opening; 330. Second transmission assembly; 331. Second lead screw; 332. Second lead screw nut; 333. Guide block; 340. Second guide assembly; 350. Second slotted photoelectric sensor; 360. Second detection component; 400, Ejector pin body; 500, Support frame; 610, Third guide assembly; 611, Third guide rail; 612, Third slider; 620, Connecting frame; 2000, First turret module; 2100, First turntable; 2200, First suction nozzle; 3000, Second turret module; 3100, Turret moving platform; 3110, First moving unit; 3111, First motor; 3112, First lead screw and nut pair; 3113, First sliding assembly; 3120, Second moving unit; 3121, Second motor; 3122, Second lead screw and nut pair; 3123, Second sliding assembly; 3130, First connecting plate; 3140, Second connecting plate; 3150, Third connecting plate; 3160, Connecting block; 3200, Second turntable; 3300, Second suction nozzle; 3400, Rotary drive unit; 4100, First camera; 4200, Second camera; 5100, the third camera; 5200, the fourth camera. Detailed Implementation
[0019] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0020] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0021] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0022] like Figures 1-7As shown, this embodiment provides a chip transfer device, including a first turret module 2000, a second turret module 3000, a first visual inspection module, and a monitoring module. The first turret module 2000 includes a first turntable 2100 and a plurality of first suction nozzles 2200 disposed on the first turntable 2100. The second turret module 3000 includes a turret moving platform 3100, a second turntable 3200, and a plurality of second suction nozzles 3300, all of which are disposed on the second turntable 3200. The turret moving platform 3100 is used to drive the second turntable 3200 to move along a first direction and a second direction, the first direction and the second direction being set at an angle. The first suction nozzles 2200 and the second suction nozzles 3300 can be docked for transfer. The system includes a moving chip; a first vision detection module for detecting the gap between the first suction nozzle 2200 and the second suction nozzle 3300 along a first direction and the gap in a second direction; a monitoring module for communication with the second turret module 3000 and the first vision detection module; the first vision detection module for feedback to the monitoring module on the gap information between the first suction nozzle 2200 and the second suction nozzle 3300 along the first direction and the gap information in the second direction; and the monitoring module for sending signals to the second turret module 3000 to drive the turret moving platform 3100 to move the second turntable 3200 and the second suction nozzle 3300, thereby ensuring that the gap between the first suction nozzle 2200 and the second suction nozzle 3300 along the first direction and the gap in the second direction reach preset size ranges.
[0023] After the first suction nozzle 2200 and the second suction nozzle 3300 are docked, the first vision detection module first detects the gap between them along the first direction and the gap along the second direction. The gap information of the first suction nozzle 2200 and the second suction nozzle 3300 along the first direction and the second direction is fed back to the monitoring module. Finally, the monitoring module sends a signal to adjust the position of the second suction nozzle 3300 along the first direction and the second direction through the turret moving platform 3100, thereby adjusting the size of the gap between the first suction nozzle 2200 and the second suction nozzle 3300 along the first direction and the second direction, so that the gap size in both directions is within the preset size range, that is, the relative positional accuracy between the first suction nozzle 2200 and the second suction nozzle 3300 is satisfied, thereby improving the chip transfer accuracy between the first suction nozzle 2200 and the second suction nozzle 3300.
[0024] Specifically, the first turret module 2000 is provided with multiple first suction nozzles 2200, and the second turret module 3000 is provided with multiple second suction nozzles 3300. The rotation of the first turntable 2100 can put any one of the first suction nozzles 2200 into a working position, and the rotation of the second turntable 3200 can put any one of the second suction nozzles 3300 into a working position. Therefore, the multiple first suction nozzles 2200 and the multiple second suction nozzles 3300 can be arbitrarily matched for chip transfer, or they can be matched one-to-one for chip transfer.
[0025] The first direction and the second direction are set at an angle, and the third direction is perpendicular to the first direction and the second direction. For example, the first direction and the second direction are horizontal, and the third direction is vertical.
[0026] By using the first nozzle 2200 of the first turret module 2000 in its working position as a reference, the first vision inspection module, the monitoring module, and the second turret module 3000 coordinate to fine-tune the position of the second nozzle 3300. This ensures that the gaps in the first and second directions between the second nozzle 3300 and the first nozzle 2200 are within a preset range, thereby ensuring that the first nozzle 2200 and the second nozzle 3300 are aligned along the third direction. This, in turn, ensures chip transfer accuracy, improves subsequent packaging yield, and enhances chip performance.
[0027] The first vision inspection module includes a first camera 4100 and a second camera 4200. The first camera 4100 is used to detect the gap between the first nozzle 2200 and the second nozzle 3300 along a first direction, and the second camera 4200 is used to detect the gap between the first nozzle 2200 and the second nozzle 3300 along a second direction. By setting the first camera 4100 and the second camera 4200 separately for detecting the gap in the first direction and the gap in the second direction, control is facilitated, and the detection accuracy is improved.
[0028] The chip transfer device also includes a pin module 1000 and a second vision inspection module. The pin module 1000 includes a pin moving platform 1100 and a pin body 400 disposed on the pin moving platform 1100. The pin body 400 can dock with the second suction nozzle 3300. The second vision inspection module is used to detect the gap between the pin body 400 and the second suction nozzle 3300 along a first direction and the gap in a second direction. A monitoring module is communicatively connected to the pin module 1000 and the second vision inspection module respectively. The second vision inspection module can feed back the gap information between the pin body 400 and the second suction nozzle 3300 along the first direction and the gap in the second direction to the monitoring module. The monitoring module can send a signal to the pin module 1000 to drive the pin moving platform 1100 to move the pin body 400, so that the gap between the pin body 400 and the second suction nozzle 3300 along the first direction and the gap in the second direction respectively reach a preset size range. When the chip transfer is performed by the ejector body 400 on the ejector module 1000 in conjunction with the second suction nozzle 3300, after the ejector body 400 and the second suction nozzle 3300 are docked, the gap between them along the first direction and the gap along the second direction are first detected by the second vision detection module. The gap information of the ejector body 400 and the second suction nozzle 3300 along the first direction and the second direction is fed back to the monitoring module. Finally, the monitoring module sends a signal to adjust the position of the ejector body 400 along the first direction and the second direction through the ejector moving platform 1100, thereby adjusting the size of the gap between the ejector body 400 and the second suction nozzle 3300 along the first direction and the second direction, so that the gap size in the two directions is within the preset size range, that is, the relative positional accuracy between the ejector body 400 and the second suction nozzle 3300 is satisfied, thereby improving the chip transfer accuracy between the ejector body 400 and the second suction nozzle 3300.
[0029] Specifically, the second turret module 3000 is provided with multiple second suction nozzles 3300, and the rotation of the second turntable 3200 can enable any one of the second suction nozzles 3300 to be in the working position to dock with the ejector pin body 400.
[0030] By using the second nozzle 3300 of the second turret module 3000 in its working position as a reference, the second vision inspection module, the monitoring module, and the ejector pin moving platform 1100 coordinate to fine-tune the position of the ejector pin body 400. This ensures that the gaps in the first and second directions between the second nozzle 3300 and the ejector pin body 400 are within a preset range, thereby ensuring that the ejector pin body 400 and the second nozzle 3300 are aligned along the third direction. This, in turn, ensures chip transfer accuracy, improves subsequent packaging yield, and enhances chip performance.
[0031] The second vision inspection module includes a third camera 5100 and a fourth camera 5200. The third camera 5100 is used to detect the gap between the ejector pin body 400 and the second suction nozzle 3300 along a first direction, and the fourth camera 5200 is used to detect the gap between the ejector pin body 400 and the second suction nozzle 3300 along a second direction. By setting the third camera 5100 and the fourth camera 5200 separately for detecting the gap in the first and second directions, control is facilitated, and the detection accuracy is improved.
[0032] The second turret module 3000 is positioned between the first turret module 2000 and the monitoring module along a third direction. When one second suction nozzle 3300 mates with the first suction nozzle 2200, the other second suction nozzle 3300 mates with the ejector pin body 400. The third direction is perpendicular to the first and second directions, respectively. The two second suction nozzles 3300 on the same second turntable 3200 simultaneously mate with the first suction nozzle 2200 and the ejector pin body 400, improving work efficiency. For example, the first turntable 2100 rotates about a centerline parallel to the third direction, and the second turntable 3200 rotates about a centerline parallel to either the first or second direction. The first suction nozzle 2200 and the ejector pin body 400 are positioned facing each other, and the second suction nozzle 3300 faces outwards radially along the second turntable 3200, resulting in a compact structure.
[0033] Both the turret moving platform 3100 and the ejector pin moving platform 1100 include two moving mechanisms: one moving mechanism is used to output movement in the first direction, and the other moving mechanism is used to output movement in the second direction.
[0034] like Figure 3 and Figure 4 As shown, the second turret module 3000 also includes a rotary drive unit 3400, a first connecting plate 3130, a second connecting plate 3140, a third connecting plate 3150, and a connecting block 3160. The second suction nozzle 3300 is mounted on the second turntable 3200. The rotary drive unit 3400 drives the second turntable 3200 to rotate, thereby rotating the second suction nozzle 3300 to a preset position for docking with the first suction nozzle 2200 or with the ejector pin body 400. The turret moving platform 3100 includes a first moving unit 3110 and a second moving unit 3120, thereby enabling the second turntable 3200 and the second suction nozzle 3300 to adjust their positions along a first direction and a second direction.
[0035] In one embodiment, the first moving unit 3110 includes a first motor 3111, a first lead screw and nut pair 3112, and a first sliding assembly 3113; the second moving unit 3120 includes a second motor 3121, a second lead screw and nut pair 3122, and a second sliding assembly 3123. Both the first lead screw and nut pair 3112 and the second lead screw and nut pair 3122 include a lead screw and a lead screw nut that cooperates with the lead screw. Both the first sliding assembly 3113 and the second sliding assembly 3123 include a guide rail and a slider that cooperates with the guide rail. The first motor 3111 is connected to the lead screw of the first lead screw and nut pair 3112, and the lead screw nut of the first lead screw and nut pair 3112 is connected to the second connecting plate 3140. The guide rail of the first sliding assembly 3113 and the first motor 3111 are both fixed on the first connecting plate 3130. The slider of the first sliding assembly 3113 is mounted on the second connecting plate 3140, thereby enabling the first motor 3111 to drive the second connecting plate 3140 to move along a second direction. The second motor 3121 is connected to the lead screw of the second lead screw and nut assembly 3122. The lead screw and nut of the second lead screw and nut assembly 3122 are connected to the rotary drive unit 3400. The third connecting plate 3150 is also connected to the rotary drive unit 3400. That is, both the lead screw and nut of the second lead screw and nut assembly 3122 and the third connecting plate 3150 are connected to the rotary drive unit 3400. The guide rail of the second sliding assembly 3123 and the second motor 3121 are both fixed on the second connecting plate 3140. The slider of the second sliding assembly 3123 is mounted on the third connecting plate 3150, thereby enabling the second motor 3121 to drive the connecting block 3160 to move along the first direction, causing the third connecting plate 3150 to move accordingly along the first direction. Furthermore, the sliding of the third connecting plate 3150 along the first direction via the second sliding assembly 3123 improves the movement accuracy of the rotary drive unit 3400, the second turntable 3200, and the second suction nozzle 3300 along the first direction.
[0036] Furthermore, the first connecting plate 3130 and the second connecting plate 3140 have an irregular shape and form a recessed space. The rotary drive unit 3400 is disposed in the recessed space, and there are two third connecting plates 3150, which are respectively disposed on both sides of the rotary drive unit 3400 along the second direction, further making the structure more compact.
[0037] like Figures 5-7As shown, this embodiment provides a pin moving platform, including a base plate 100 and a first moving module 200. The base plate 100 is stepped, including a first plane 110 and a second plane 120, with the first plane 110 being higher than the second plane 120. The first moving module 200 includes a first driving member 210 and a first adapter plate 220. The first adapter plate 220 is stepped, including a first plate 221 and a second plate 222, with the first plate 221 being higher than the second plate 222. The first adapter plate 220 is slidably connected to the base plate 200 along a first direction. The base plate 100 has a first plate 221 that is slidably connected to the first plane 110 and a second plate 222 that is slidably connected to the second plane 120. The first driving member 210 is used to drive the first adapter plate 220 to move. The first driving member 210 is disposed on the second plate 222 and on one side of the first plate 221 along the second direction, and the first direction and the second direction are perpendicular. The first plate 221 has a through first opening 223 and is used to connect with the ejector pin body 400, and the ejector pin body 400 passes through the first opening 223.
[0038] The ejector body 400 can be directly connected to the ejector moving platform 1100, or indirectly connected to the ejector moving platform 1100 through an adapter or other structure, without limitation.
[0039] The first plate 221 and the first plane 110 are correspondingly arranged, and the second plate 222 and the second plane 120 are correspondingly arranged and slidably connected, thereby realizing the sliding connection between the stepped base plate 100 and the stepped first adapter plate 220; the first driving member 210 is used to drive the first adapter plate 220 to move, that is, to realize the first adapter plate 220 to move along the first direction. Since the ejector body 400 is connected to the first plate 221 of the first adapter plate 220, the first driving member 210 drives the ejector body 400 to move along the first direction through the first adapter plate 220. By setting both the base plate 100 and the first adapter plate 220 in a stepped shape, and placing the first drive member 210 on the lower second plate 222 and located on one side of the first plate 221 along the second direction, the size in the second direction is reduced. Furthermore, this avoids the first drive member 210 and the ejector body 400 being arranged coaxially in their directions of movement, reducing the space occupied by the ejector moving platform 1100 along the first direction. This results in a compact structure and high space utilization. Moreover, it eliminates the need for direction conversion via timing belts, gear sets, or worm gears, simplifying the structure and ensuring transmission accuracy. Additionally, the ejector body 400 passes through the first opening 223 of the first plate 221, further enhancing the compactness of the structure along the third direction, i.e., the vertical direction. This structure can greatly reduce the volume of the ejector pin moving platform 1100 and reduce the installation space. At the same time, when running at high speed, since the ejector pin body 400 passes through the first opening 223 of the first plate 221, that is, the ejector pin body 400 is placed at the center of the first moving module 200, the entire ejector pin moving platform 1100 can be subjected to more balanced forces and run more stably.
[0040] The first adapter plate 220 further includes a third plate 224 connected between the first plate 221 and the second plate 222; the first moving module 200 further includes a first transmission assembly 230, which is disposed on the second plate 222 and includes a first lead screw 231 and a first lead screw nut 232 cooperating with the first lead screw 231. The first lead screw 231 is connected to the first driving member 210, and the first lead screw nut 232 is connected to the third plate 224. Optionally, the first driving member 210 is a motor, and the first lead screw 231 extends along a first direction. The motor drives the first lead screw 231 to rotate, thereby causing the first lead screw nut 232 to move along the first direction, and thus causing the first adapter plate 220 to move along the first direction.
[0041] The first moving module 200 further includes two first guide components 240. The first plate 221 is slidably connected to the first plane 110 via one first guide component 240, and the second plate 222 is slidably connected to the second plane 120 via the other first guide component 240. The two first guide components 240 are located on both sides of the first opening 223 along the second direction. By setting two first guide components 240, the movement stability of the first adapter plate 220 is improved. The first driving member 210, the second plate 222, the first guide components 240, and the second plane 120 are arranged along the third direction, reducing the installation space in the second direction. For example, the first guide component 240 includes a guide rail and a slider. The slider is slidably connected to the guide rail, the guide rail is fixed to the base plate 100 along the first direction, and the slider is connected to the first adapter plate 220.
[0042] A boss 130 is provided on the second plane 120, and the boss 130 and the first plane 110 are located on both sides of the first guide assembly 240 on the second plane 120. A first slotted photoelectric sensor 250 is provided on the boss 130, and a first detection element 260 is provided on the second plate 222. The first adapter plate 220 can move to allow the first detection element 260 to pass through the slot of the first slotted photoelectric sensor 250. Specifically, the first driving member 210 drives the first adapter plate 220 to move. When the first detection element 260 passes through the first slotted photoelectric sensor 250, the first slotted photoelectric sensor 250 feeds back a signal, which can be used for applications such as position calibration of the first adapter plate 220 along a first direction, without limitation. The first detection element 260 is a metal sheet.
[0043] The ejector pin moving platform 1100 also includes a second moving module 300, which includes a second driving member 310 and a second adapter plate 320. The second adapter plate 320 is slidably connected to the first adapter plate 220 along a second direction. The second driving member 310 is used to drive the second adapter plate 320 to move. The second adapter plate 320 has a second opening 321 communicating with the first opening 223. The first adapter plate 220 is connected to the ejector pin body 400 through the second adapter plate 320, and the ejector pin body 400 passes through the second opening 321. By positioning the second moving module 300 above the first moving module 200 and connecting it to the first adapter plate 220, and connecting the ejector pin body 400 to the first adapter plate 220 through the second adapter plate 320, the ejector pin body 400 can move along the first direction and the second direction respectively, thus realizing two-dimensional movement.
[0044] The second driving component 310 is disposed on the first adapter plate 220 and on one side of the second adapter plate 320 along the first direction, thereby reducing the size along the first direction. In addition, it avoids the coaxial arrangement of the movement direction of the second driving component 310 and the ejector body 400, reducing the space occupied by the ejector moving platform 1100 along the second direction, resulting in a compact structure and high space utilization; and it eliminates the need for direction conversion through steering transmission mechanisms such as synchronous belts, gear sets or worm gears, simplifying the structure and meeting transmission accuracy requirements.
[0045] The second moving module 300 further includes a second transmission assembly 330, which is disposed on one side of the second adapter plate 320 along the first direction. The second transmission assembly 330 includes a second lead screw 331 and a second lead screw nut 332 that cooperates with the second lead screw 331. The second lead screw 331 is connected to the second driving member 310, and the second lead screw nut 332 is connected to the second adapter plate 320. Optionally, the second driving member 310 is a motor, and the second lead screw 331 extends along the second direction. The motor drives the second lead screw 331 to rotate, thereby causing the second lead screw nut 332 to move along the second direction, and thus causing the second adapter plate 320 to move along the second direction.
[0046] Optionally, the second transmission assembly 330 further includes a guide block 333, and one end of the second lead screw 331 is an optical shaft, which is rotatably connected to a through hole in the guide block 333 to achieve the limiting of the second lead screw 331.
[0047] The second moving module 300 also includes a second guide assembly 340. The second adapter plate 320 is slidably connected to the first adapter plate 220 via the second guide assembly 340. Two second guide assemblies 340 are provided, located on both sides of the second opening 321 along the first direction. By providing two second guide assemblies 340, the moving stability of the second adapter plate 320 is improved. For example, the second guide assembly 340 includes a guide rail and a slider. The slider is slidably connected to the guide rail, the guide rail is fixed to the base plate 100 along the second direction, and the slider is connected to the second adapter plate 320.
[0048] A second slotted photoelectric sensor 350 is provided on the base plate 100, and a second detection element 360 is provided on the second adapter plate 320. The second adapter plate 320 can move to allow the second detection element 360 to pass through the slot of the second slotted photoelectric sensor 350. Specifically, the second driving member 310 drives the second adapter plate 320 to move. When the second detection element 360 passes through the second slotted photoelectric sensor 350, the second slotted photoelectric sensor 350 feeds back a signal, which can be used for applications such as position calibration of the second adapter plate 320 along a second direction, without limitation. The second detection element 360 is a metal sheet.
[0049] The second driving member 310 and the first driving member 210 are arranged in an alternating manner. Since the first driving member 210 and the second driving member 310 are relatively large, the space can be fully utilized by the alternating arrangement, which further makes the structure more compact.
[0050] The ejector pin moving platform 1100 also includes a support frame 500 and a third moving module disposed within the support frame 500. The third moving module is used to drive the base plate 100 to move along a third direction, which is perpendicular to the first and second directions respectively. The third moving module can be a structure of a cylinder or a motor with a lead screw and nut assembly. The inner wall of the support frame 500 is provided with a third guide assembly 610, including a third guide rail 611 and a third slider 612. The third guide rail 611 is connected to the inner wall of the support frame 500, and the third slider 612 is slidably connected to the third guide rail 611. The third slider 612 is connected to the base plate 100. Furthermore, the base plate 100 and the slider are connected by a connecting frame 620, which facilitates installation and improves the structural installation stability.
[0051] The assembly is formed by stacking the first driving component 210 and the second driving component 310, the two first guide components 240 and the two second guide components 340 in a U-shape. The first adapter plate 220 has a first opening 223 and the second adapter plate 320 has a second opening 321, leaving a middle position for placing the ejector body 400, resulting in a compact structure.
[0052] like Figure 8 As shown, this embodiment also provides a calibration method for the chip transfer device as described above, including: The first suction nozzles 2200 on the first turret module 2000 are numbered 1, 2, 3, ... N, N+1, ... X, X+1, A respectively, and the second suction nozzles 3300 on the second turret module 3000 are numbered 1, 2, 3, ... M, M+1, ... Y, Y+1, B respectively; S100, rotate the first turntable 2100 and the second turntable 3200 until the N-number first suction nozzle 2200 and the M-number second suction nozzle 3300 are aligned; S200, the first visual inspection module is used to detect the gap between the N-number first suction nozzle 2200 and the M-number second suction nozzle 3300 along the first direction and the gap in the second direction, and send information to the monitoring module; S300, the monitoring module sends a signal to drive the turret moving platform 3100 to move the second turntable 3200 and the second suction nozzle 3300, so that the gap between the N-number first suction nozzle 2200 and the M-number second suction nozzle 3300 along the first direction and the gap in the second direction are respectively within a preset size range, and saves the gap information of the N-number first suction nozzle 2200 and the M-number second suction nozzle 3300 along the first direction and the gap in the second direction. When S400, the first suction nozzle 2200 (N) and the second suction nozzle 3300 (M) are reconnected, the monitoring module sends a signal according to the pre-stored information to drive the turret moving platform 3100 to move the second turntable 3200 and the second suction nozzle 3300, so that the gap between the first suction nozzle 2200 (N) and the second suction nozzle 3300 (M) along the first direction and the gap in the second direction are respectively within the preset size range, that is, step S300 is executed.
[0053] The turret moving platform 3100 drives the second turntable 3200 and the corresponding second suction nozzle 3300 to move along the first and second directions, thereby correcting the deviation between the M-sized second suction nozzle 3300 and the N-sized first suction nozzle 2200. Furthermore, the gap information of the N-sized first suction nozzle 2200 and the M-sized second suction nozzle 3300 along the first and second directions, which are stored by the monitoring module, is recorded as a preset correction form. When the N-sized first suction nozzle 2200 and the M-sized second suction nozzle 3300 are docked again, their positions can be adjusted directly without having to perform gap detection again through the first vision detection module, thus simplifying the steps and process.
[0054] The chip transfer device also includes a pin module 1000, and the calibration method also includes: S10. Rotate the second turntable 3200 until the second suction nozzle 3300 (X) and the ejector pin body 400 are aligned. S20, the second visual inspection module is used to detect the gap between the ejector pin body 400 and the second suction nozzle 3300 along the first direction and the gap in the second direction, and sends information to the monitoring module; S30. The monitoring module sends a signal to drive the ejector pin moving platform 1100 to move the ejector pin body 400, so that the gap between the ejector pin body 400 and the X-number second suction nozzle 3300 along the first direction and the gap in the second direction respectively reach the preset size range, and saves the gap information between the ejector pin body 400 and the X-number second suction nozzle 3300 along the first direction and the gap in the second direction. When S40, the second suction nozzle 3300 and the ejector body 400 are reconnected, the monitoring module sends a signal according to the pre-stored information to drive the ejector body 400 to move by the ejector moving platform 1100, so that the gap between the ejector body 400 and the second suction nozzle 3300 in the first direction and the gap in the second direction respectively reach the preset size range, that is, step S30 is executed.
[0055] The ejector pin moving platform 1100 drives the ejector pin body 400 to move along the first and second directions, thereby correcting the deviation between the ejector pin body 400 and the second suction nozzle 3300. The gap information between the ejector pin body 400 and the second suction nozzle 3300 along the first and second directions, which are stored by the monitoring module, is recorded as a preset correction form. When the ejector pin body 400 and the second suction nozzle 3300 are docked again, the position can be adjusted directly without having to perform gap detection again through the second vision detection module, thus simplifying the steps and process.
[0056] Furthermore, when the M-type second suction nozzle 3300 mates with the N-type first suction nozzle 2200, the X-type second suction nozzle 3300 can mate with the ejector pin body 400; the calibration method also includes: At this time, S100 and S10 are combined into the same step S1000, which causes the first turntable 2100 and the second turntable 3200 to rotate to the N-number first suction nozzle 2200 and the M-number second suction nozzle 3300 docking, and the X-number second suction nozzle 3300 docking with the ejector pin body 400. S300, the monitoring module sends a signal to drive the turret moving platform 3100 to move the second turntable 3200 and the second suction nozzle 3300, so that the gap between the N-number first suction nozzle 2200 and the M-number second suction nozzle 3300 in the first direction and the gap in the second direction are respectively within the preset size range. S30, the monitoring module sends a signal to drive the ejector pin moving platform 1100 to move the ejector pin body 400, so that the gap between the ejector pin body 400 and the second suction nozzle 3300 in the first direction and the gap in the second direction respectively reach the preset size range.
[0057] When the first turntable 2100 and the second turntable 3200 rotate to the point where the first suction nozzle 2200 (N) and the second suction nozzle 3300 (M) are first connected, and the second suction nozzle 3300 (X) and the ejector body 400 are first connected, then step S200 is executed before step S300, and step S20 is executed before step S30.
[0058] Using the first suction nozzle 2200 as a reference, the second suction nozzle 3300 and the ejector pin body 400 are calibrated sequentially, without the need to adjust the position of the first suction nozzle 2200, thus simplifying the structure of the chip transfer device and the calibration process.
[0059] Specifically, the first turret module 2000 is provided with multiple first suction nozzles 2200, and the second turret module 3000 is provided with multiple second suction nozzles 3300. The rotation of the first turntable 2100 allows any one of the first suction nozzles 2200 to be in a working position, and the rotation of the second turntable 3200 allows any one of the second suction nozzles 3300 to be in a working position. Therefore, the multiple first suction nozzles 2200 and multiple second suction nozzles 3300 can be arbitrarily paired for chip transfer, or they can be paired in a one-to-one correspondence for chip transfer. The paired first suction nozzles 2200 and second suction nozzles 3300 can both achieve error correction using the above method. Specifically, the second turret module 3000 is provided with multiple second suction nozzles 3300, and the rotation of the second turntable 3200 allows any one of the second suction nozzles 3300 to be in a working position to mate with the ejector pin body 400. The ejector pin body 400 and any one of the second suction nozzles 3300 can both achieve error correction using the above method. Error correction is performed based on the actual matching structure of the workstation and the preset correction form. The workstation mating positions are periodically and randomly adjusted to reduce fixed wear.
[0060] By configuring the turret moving platform 3100 in the second turret module 3000, the ejector pin moving platform 1100 in the ejector pin module 1000, a first vision detection module, a second vision detection module, and a monitoring module, the positions of the second suction nozzle 3300 and the ejector pin body 400 can be fine-tuned. During the adjustment process, using the position of the first suction nozzle 2200 as a reference, the deviation between the first suction nozzle 2200 and the second suction nozzle 3300 is captured by the first camera 4100 and the second camera 4200. The position of the second turntable 3200 is then fine-tuned by the turret moving platform 3100 to correct the deviation, ensuring that the centers of the first suction nozzle 2200 and the second suction nozzle 3300 are aligned. In addition, the deviation value of the first suction nozzle 2200 and the second suction nozzle 3300 in this pair is recorded by the monitoring module. Then, the deviation values of the remaining paired first suction nozzles 2200 and the second suction nozzle 3300 are obtained in the same way.
[0061] The deviation between the second suction nozzle 3300 and the ejector pin body 400 is then captured by the third camera 5100 and the fourth camera 5200. Using the second suction nozzle 3300 as a reference, the position of the ejector pin body 400 is finely adjusted by the ejector pin moving platform 1100 of the ejector pin module 1000 to ensure that the ejector pin body 400 is aligned with the center of the second suction nozzle 3300. Furthermore, the deviation value between the second suction nozzle 3300 and the ejector pin body 400 is recorded by the monitoring module. The same method is then used to obtain the deviation values between the remaining second suction nozzles 3300 and the ejector pin bodies 400.
[0062] During operation, simply call the above deviation value, and the monitoring module will directly drive the turret moving platform 3100 to drive the second suction nozzle 3300 to the specified position, and drive the ejector pin moving platform 1100 to drive the ejector pin body 400 to the specified position, thus ensuring that the first suction nozzle 2200 and the corresponding second suction nozzle 3300, as well as the ejector pin body 400 and the corresponding second suction nozzle 3300, are in the same center.
[0063] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.
Claims
1. A chip transfer device, characterized in that, include: The first turret module (2000) includes a first turntable (2100) and a plurality of first suction nozzles (2200) disposed on the first turntable (2100); The second turret module (3000) includes a turret moving platform (3100), a second turntable (3200), and a plurality of second suction nozzles (3300). The plurality of second suction nozzles (3300) are disposed on the second turntable (3200). The turret moving platform (3100) is used to drive the second turntable (3200) to move along a first direction and a second direction, the first direction and the second direction being set at an angle. The first suction nozzle (2200) and the second suction nozzles (3300) can be docked for transferring chips. A first vision detection module is used to detect the gap between the first suction nozzle (2200) and the second suction nozzle (3300) along the first direction and the gap along the second direction; The monitoring module is communicatively connected to the second turret module (3000) and the first visual inspection module, respectively; The first visual inspection module can feed back to the monitoring module the gap information of the first suction nozzle (2200) and the second suction nozzle (3300) along the first direction and the gap information in the second direction; the monitoring module can send a signal to the second turret module (3000) to drive the turret moving platform (3100) to move the second turntable (3200) and the second suction nozzle (3300), so that the gap size of the first suction nozzle (2200) and the second suction nozzle (3300) along the first direction and the gap size in the second direction respectively reach the preset size range.
2. The chip transfer apparatus according to claim 1, characterized in that, The first visual inspection module includes a first camera (4100) and a second camera (4200). The first camera (4100) is used to detect the gap between the first nozzle (2200) and the second nozzle (3300) along the first direction, and the second camera (4200) is used to detect the gap between the first nozzle (2200) and the second nozzle (3300) along the second direction.
3. The chip transfer apparatus according to claim 1, characterized in that, Also includes: Ejector module (1000), the ejector module (1000) includes an ejector moving platform (1100) and an ejector body (400) disposed on the ejector moving platform (1100), the ejector body (400) being able to dock with the second suction nozzle (3300); The second vision detection module is used to detect the gap between the ejector pin body (400) and the second suction nozzle (3300) along the first direction and the gap along the second direction; The monitoring module is communicatively connected to the pin module (1000) and the second visual detection module, respectively. The second visual inspection module can feed back to the monitoring module the gap information of the ejector body (400) and the second suction nozzle (3300) along the first direction and the second direction. The monitoring module can send a signal to the ejector module (1000) to drive the ejector body (400) to move, so that the gap between the ejector body (400) and the second suction nozzle (3300) along the first direction and the second direction respectively reach the preset size range.
4. The chip transfer apparatus according to claim 3, characterized in that, The second visual inspection module includes a third camera (5100) and a fourth camera (5200). The third camera (5100) is used to detect the gap between the ejector body (400) and the second suction nozzle (3300) along the first direction, and the fourth camera (5200) is used to detect the gap between the ejector body (400) and the second suction nozzle (3300) along the second direction.
5. The chip transfer apparatus according to claim 3, characterized in that, The second turret module (3000) is located between the first turret module (2000) and the monitoring module along a third direction. When one second suction nozzle (3300) is connected to the first suction nozzle (2200), the other second suction nozzle (3300) is connected to the ejector pin body (400). The third direction is perpendicular to the first direction and the second direction, respectively.
6. The chip transfer apparatus according to claim 5, characterized in that, The first turntable (2100) rotates about a center line parallel to the third direction, and the second turntable (3200) rotates about a center line parallel to the first direction or the second direction. The first suction nozzle (2200) and the ejector pin body (400) are arranged facing each other, and the second suction nozzle (3300) is radially outward along the second turntable (3200).
7. The chip transfer apparatus according to claim 3, characterized in that, Both the turret moving platform (3100) and the ejector pin moving platform (1100) include two moving mechanisms, one of which is used to output movement in the first direction, and the other of which is used to output movement in the second direction.
8. A calibration method for a chip transfer apparatus as described in any one of claims 1-7, characterized in that, include: The first suction nozzles (2200) on the first turret module (2000) are numbered 1, 2, 3, ... N, N+1, ... X, X+1, A, respectively, and the second suction nozzles (3300) on the second turret module (3000) are numbered 1, 2, 3, ... M, M+1, ... Y, Y+1, B, respectively; Rotate the first turntable (2100) and the second turntable (3200) to align the first suction nozzle (2200) of size N and the second suction nozzle (3300) of size M; The first visual inspection module is used to detect the gap between the first suction nozzle (2200) of No. N and the second suction nozzle (3300) of No. M along the first direction and the gap along the second direction, and to send information to the monitoring module; The monitoring module sends a signal to drive the turret moving platform (3100) to move the second turntable (3200) and the second suction nozzle (3300), so that the gap between the Nth first suction nozzle (2200) and the Mth second suction nozzle (3300) along the first direction and the gap in the second direction are respectively within a preset size range, and saves the gap information of the Nth first suction nozzle (2200) and the Mth second suction nozzle (3300) along the first direction and the gap in the second direction. When the first suction nozzle (2200) of size N and the second suction nozzle (3300) of size M are reconnected, the monitoring module sends a signal according to the pre-stored information to drive the turret moving platform (3100) to move the second turntable (3200) and the second suction nozzle (3300), so that the gap between the first suction nozzle (2200) of size N and the second suction nozzle (3300) of size M along the first direction and the gap in the second direction are respectively within the preset size range.
9. The calibration method for the chip transfer device according to claim 8, characterized in that, The chip transfer device also includes a pin module (1000), and the calibration method also includes: Rotate the second turntable (3200) until the second suction nozzle (3300) of the X type aligns with the ejector pin body (400); The second visual inspection module is used to detect the gap between the ejector pin body (400) and the second suction nozzle (3300) along the first direction and the gap along the second direction, and to send information to the monitoring module; The monitoring module sends a signal to drive the ejector pin moving platform (1100) to move the ejector pin body (400), so that the gap between the ejector pin body (400) and the Xth second suction nozzle (3300) along the first direction and the gap in the second direction respectively reach a preset size range, and saves the gap information of the ejector pin body (400) and the Xth second suction nozzle (3300) along the first direction and the gap in the second direction. When the second suction nozzle (3300) of X and the ejector body (400) are re-connected, the monitoring module sends a signal according to the pre-stored information to drive the ejector moving platform (1100) to move the ejector body (400), so that the gap between the ejector body (400) and the second suction nozzle (3300) of X along the first direction and the gap in the second direction respectively reach the preset size range.
10. The calibration method for the chip transfer device according to claim 9, characterized in that, When the second suction nozzle (3300) of size M is mated with the first suction nozzle (2200) of size N, the second suction nozzle (3300) of size X can be mated with the ejector pin body (400); the calibration method also includes: Rotate the first turntable (2100) and the second turntable (3200) to align the first suction nozzle (2200) of No. N and the second suction nozzle (3300) of No. M, and align the second suction nozzle (3300) of No. X with the ejector pin body (400); The monitoring module sends a signal to drive the turret moving platform (3100) to move the second turntable (3200) and the second suction nozzle (3300), so that the gap between the N-number first suction nozzle (2200) and the M-number second suction nozzle (3300) along the first direction and the gap in the second direction are respectively within a preset size range; The monitoring module sends a signal to drive the ejector pin moving platform (1100) to move the ejector pin body (400), so that the gap between the ejector pin body (400) and the second suction nozzle (3300) in the first direction and the gap in the second direction respectively reach a preset size range.