A power terminal

By setting an insulating layer and a specific structural design on the power terminals of the IGBT module, the short circuit problem between the power terminals and the bonding wires is solved, improving the insulation performance and mechanical reliability of the module and adapting to the needs of different power levels and package sizes.

CN122121709APending Publication Date: 2026-05-29CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY
Filing Date
2026-01-22
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

In existing IGBT modules, the silicone gel isolation between the power terminals and the bonding wires is prone to failure, leading to short circuits and burnout. Traditional structural designs are also prone to solder joint detachment and short circuits between terminals under vibration, making it difficult to adapt to the needs of different power levels and package sizes.

Method used

An insulating layer and specific structural design are applied to the power terminals, including bending grooves, notches, and multiple layers of insulating material, forming a double physical barrier. The leads and solder feet are connected in an S-shape to buffer stress, and the terminals are prevented from contacting each other through notches.

Benefits of technology

It achieves stable insulation performance under high and low temperature and high frequency vibration conditions, reduces the risk of solder joint detachment, adapts to the needs of different power levels and package sizes, and improves mechanical strength and assembly convenience.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122121709A_ABST
    Figure CN122121709A_ABST
Patent Text Reader

Abstract

The application discloses a power terminal, which comprises a CE power terminal, a C power terminal and an E power terminal; each of the terminals comprises a lug, a connecting piece, a bridging piece, a lead wire and a soldering leg; the connecting piece and the lead wire are respectively arranged on the two sides of the bridging piece; the lug is connected with the end of the connecting piece; the center of the lug is processed with a lug hole; the end of the lead wire is connected with the soldering leg to form an S shape; the soldering legs on the CE power terminal, the C power terminal and the E power terminal are respectively welded on the CE power terminal, the C power terminal and the E power terminal of a chip. The bridging piece towards the insulating layer of the chip and the epoxy resin insulating layer of the terminal facing the bonding wire form double physical barriers, which completely eliminate the hidden danger of short circuit of the power terminal and the chip and the bonding wire, and the module can still maintain stable insulation performance under the working conditions of high-low temperature cycle and high-frequency vibration through test verification.
Need to check novelty before this filing date? Find Prior Art