Electronic device comprising an antenna

Abstract

An electronic device includes a housing including a side member partially forming an outer side surface of the electronic device and including a conductive portion, a circuit board provided inside the housing, and a wireless communication circuit electrically connected to the circuit board. The circuit board includes a plurality of first coupling pads provided on at least some of a plurality of layers of the circuit board, at least one second coupling pad spaced apart from the plurality of first coupling pads, a dielectric provided between the plurality of first coupling pads and the at least one second coupling pad, and an electrical connection member connected to the plurality of first coupling pads to form an electrical path and connected to the conductive portion. The at least one second coupling pad is connected to the wireless communication circuit to form an electrical path.

Description

Technical Field

[0001] This disclosure relates to an electronic device including an antenna. Background Technology

[0002] Wireless communication technology enables the sending and receiving of information in various forms. With advancements in wireless communication technology, electronic devices suitable for performing wireless communication, such as smartphones, can use communication functions such as Global Positioning System (GPS), Wi-Fi, Long Term Evolution (LTE), or Near Field Communication (NFC) to provide services. To perform such wireless communication, the electronic device may include an antenna structure. The above description is based on information obtained by the inventors during the conception of this disclosure, or information already possessed at the time, and is not necessarily technology known prior to the filing of this application. Summary of the Invention

[0003] Additional aspects will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practice of the embodiments presented.

[0004] According to one aspect of this disclosure, an electronic device may include: a housing including a side member forming a portion of the outer side of the electronic device and including a conductive portion; a printed circuit board (PCB) provided in the housing; and a wireless communication circuit electrically connected to the PCB, wherein the PCB includes: a plurality of first coupling pads provided on at least some of a plurality of layers of the PCB; at least one second coupling pad spaced apart from the plurality of first coupling pads; a dielectric provided between the plurality of first coupling pads and at least one second coupling pad; and an electrical connection member connected to the plurality of first coupling pads to form an electrical path and connected to the conductive portion, wherein at least one second coupling pad is connected to the wireless communication circuit to form an electrical path, and wherein at least a portion of the at least one second coupling pad is provided between a pair of first coupling pads of the plurality of first coupling pads.

[0005] At least one second coupling pad can be provided as a plurality of second coupling pads, wherein a plurality of first coupling pads and a plurality of second coupling pads are alternately provided along a first direction on at least some of the plurality of layers of the PCB.

[0006] Multiple first coupling pads may be adjacent to multiple second coupling pads, and corresponding capacitances for indirect signal delivery may be formed between the multiple first coupling pads and the multiple second coupling pads, wherein the sum of the corresponding capacitances formed on the PCB is configured to be greater than or equal to 10 picofarads (pF).

[0007] The overlapping areas between the multiple first coupling pads and the multiple second coupling pads are substantially similar in the first direction.

[0008] The PCB may also include: at least one first conductive via connected to a plurality of first coupling pads to form an electrical path; and at least one second conductive via connected to a second coupling pad to form an electrical path.

[0009] The PCB may have a first board surface and a second board surface opposite to the first board surface, wherein a dielectric is provided on the first board surface and the second board surface such that a plurality of first coupling pads and at least one second coupling pad are not exposed to the outside of the PCB.

[0010] The PCB may also include: a switch connected to at least one of at least one first conductive via and at least one second conductive via, and configured to selectively block the electrical path formed by the at least one conductive via.

[0011] The PCB may also include: a grounding element spaced apart from a plurality of first coupling pads and at least one second coupling pad; and a discharge inductor portion configured to induce electrical signal discharge from the plurality of first coupling pads to the grounding element.

[0012] At least one of a plurality of first coupling pads and a grounding element are provided on the same layer of the PCB, wherein the discharge inductor portion includes at least one first discharge element that is directly connected to at least one first coupling pad on the same layer as the grounding element and protrudes toward the grounding element.

[0013] The discharge inductor portion may further include at least one second discharge member connected to the ground member and protruding toward at least one first coupling pad provided on the same layer as the ground member.

[0014] A first coupling pad among a plurality of first coupling pads may be adjacent to a second coupling pad among at least one second coupling pad along a first direction, wherein the first coupling pad and the second coupling pad form a coupling pad set, and wherein the distance between the first coupling pad and the second coupling pad forming the coupling pad set in the first direction is less than the distance between adjacent coupling pad sets in the first direction.

[0015] At least one first coupling pad and at least one second coupling pad of a plurality of first coupling pads may be provided on the same layer relative to a first direction of the PCB, wherein at least one first coupling pad and at least one second coupling pad on the same layer are alternately provided in a second direction of the PCB perpendicular to the first direction.

[0016] The PCB may further include: a third coupling pad electrically insulated from a plurality of first coupling pads and at least one second coupling pad based on a dielectric, wherein the third coupling pad and at least one second coupling pad at least partially overlap in a first direction of the PCB, and wherein the electrical connection member includes: a first electrical connection member connected to at least some of the plurality of first coupling pads to form an electrical path; and a second electrical connection member connected to the third coupling pad to form an electrical path.

[0017] The side member may include a first conductive portion and a second conductive portion electrically separated along the outside of the electronic device, wherein the first electrical connection member and the second electrical connection member are respectively connected to the first conductive portion and the second conductive portion.

[0018] The PCB may further include: a fourth coupling pad, electrically insulated from a plurality of first coupling pads and at least one second coupling pad based on a dielectric, and connected to a wireless communication circuit to form an electrical path, wherein at least one of the plurality of first coupling pads and the fourth coupling pad at least partially overlap in a first direction of the PCB.

[0019] The PCB may also include: a radiating member, comprising a conductive material or a conductive pattern, wherein the radiating member overlaps with or is electrically connected to a wireless communication circuit in a first direction of the PCB.

[0020] According to one aspect of this disclosure, an electronic device may include: a housing including a side member forming a portion of the outer side of the electronic device and including a conductive portion; a printed circuit board (PCB) provided in the housing; and a wireless communication circuit electrically connected to the PCB, wherein the PCB includes: a first coupling pad; a second coupling pad spaced apart from the first coupling pad and connected to the wireless communication circuit to form an electrical path; a dielectric configured to electrically insulate the first coupling pad and the second coupling pad; an electrical connection member connected to the first coupling pad to form an electrical path and connected to the conductive portion; a grounding member electrically isolated from the first coupling pad and the second coupling pad; and a discharge inductor portion configured to sense an electrical signal discharge from the first coupling pad to the grounding member, wherein the first coupling pad and the second coupling pad at least partially overlap along a first direction of the PCB.

[0021] The grounding component can be provided on the surface of the PCB, the first coupling pad can be provided on the same layer as the grounding component, and the discharge inductor portion can be between the first coupling pad and the grounding component on the same layer.

[0022] The discharge inductor portion may include: a first discharge member connected to a first coupling pad and protruding toward a grounding element; or a second discharge member connected to a grounding element and protruding toward the first coupling pad, wherein a gap is formed between the first discharge member and the grounding element or between the second discharge member and the first coupling pad, and wherein a dielectric is provided in the gap.

[0023] According to one aspect of this disclosure, an electronic device may include: a housing including a side member forming a portion of the outer side of the electronic device and including an electrically separable first conductive portion and a second conductive portion; a printed circuit board (PCB) provided in the housing; and a wireless communication circuit electrically connected to the PCB, wherein the PCB includes: a first coupling pad; a second coupling pad spaced apart from the first coupling pad and connected to the wireless communication circuit to form an electrical path; a third coupling pad spaced apart from the first and second coupling pads; a dielectric configured to electrically insulate the first, second, and third coupling pads; a first electrical connection member connected to the first coupling pad to form an electrical path and connected to the first conductive portion; and a second electrical connection member connected to the third coupling pad to form an electrical path and connected to the second conductive portion, wherein the first and third coupling pads at least partially overlap the second coupling pad along a first direction of the PCB.

[0024] According to one aspect of this disclosure, an electronic device may include: a housing including a side member forming a portion of the outer side of the electronic device and including a conductive portion; a printed circuit board (PCB) provided in the housing; and a wireless communication circuit electrically connected to the PCB, wherein the PCB includes: a first coupling pad; a second coupling pad spaced apart from the first coupling pad and connected to the wireless communication circuit via a first signal line; a fourth coupling pad spaced apart from the first and second coupling pads and connected to the wireless communication circuit via a second signal line; a dielectric configured to electrically insulate the first coupling pad, the second coupling pad, and the fourth coupling pad; and an electrical connection member connected to the first coupling pad to form an electrical path and connected to the conductive portion, wherein the second coupling pad and the fourth coupling pad at least partially overlap the first coupling pad along a first direction of the PCB.

[0025] According to one aspect of this disclosure, an electronic device may include: a housing including a side member forming a portion of the outer side of the electronic device and including an electrically separable first conductive portion and a second conductive portion; and a printed circuit board (PCB) provided in the housing, wherein the PCB includes: a first coupling pad; a second coupling pad spaced apart from the first coupling pad; a dielectric configured to electrically insulate the first coupling pad and the second coupling pad; a first electrical connection member connected to the first coupling pad to form an electrical path and connected to the first conductive portion; and a second electrical connection member connected to the second coupling pad to form an electrical path and connected to the second conductive portion, wherein the first coupling pad and the second coupling pad at least partially overlap along a first direction of the PCB.

[0026] According to one aspect of this disclosure, an electronic device may include: a housing including a side member forming a portion of the outer side of the electronic device and including a conductive portion; a printed circuit board (PCB) provided in the housing; and a wireless communication circuit electrically connected to the PCB, wherein the PCB includes: a first coupling pad; a plurality of second coupling pads spaced apart from the first coupling pad; a dielectric configured to electrically insulate the first coupling pad and the plurality of second coupling pads; and an electrical connection member connected to the first coupling pad to form an electrical path and connected to the conductive portion, wherein the plurality of second coupling pads are connected to the wireless communication circuit to form an electrical path, and at least a portion of the first coupling pad is provided between a pair of second coupling pads of the plurality of second coupling pads.

[0027] According to one aspect of this disclosure, an electronic device may include: a housing including a side member forming a portion of the outer side of the electronic device and including a conductive portion; a printed circuit board (PCB) provided in the housing; and a wireless communication circuit electrically connected to the PCB, wherein the PCB includes: a pair of first coupling pads provided on different layers of a plurality of layers of the PCB; a second coupling pad provided on a layer between the pair of first coupling pads and spaced apart from the pair of first coupling pads; a dielectric configured to electrically insulate the pair of first coupling pads and the second coupling pad; and an electrical connection member connected to the pair of first coupling pads to form an electrical path and connected to the conductive portion, wherein the second coupling pad is connected to the wireless communication circuit to form an electrical path, and at least a portion of the second coupling pad overlaps with the pair of first coupling pads. Attached Figure Description

[0028] The above and / or other aspects will become more apparent from the description of certain embodiments in conjunction with the accompanying drawings, wherein:

[0029] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to an embodiment of the present disclosure;

[0030] Figure 2a This is a front perspective view of an electronic device according to an embodiment of the present disclosure;

[0031] Figure 2b This is a rear perspective view of an electronic device according to an embodiment of the present disclosure;

[0032] Figure 3 This is an exploded perspective view of an electronic device according to an embodiment of the present disclosure;

[0033] Figure 4a This is a schematic diagram illustrating the connection structure between side components and a printed circuit board (PCB) in an electronic device according to an embodiment of the present disclosure;

[0034] Figure 4b This is a graph illustrating the antenna performance exhibited in an electronic device according to an embodiment of the present disclosure when electrical signals are transmitted via capacitance between coupled pads.

[0035] Figure 5a This is a cross-sectional view of a PCB according to an embodiment of the present disclosure;

[0036] Figure 5b This illustrates an embodiment according to the present disclosure. Figure 5a A partial cross-sectional view of the PCB in region A;

[0037] Figure 5c This illustrates an embodiment according to the present disclosure. Figure 5a A partial perspective view of the PCB in area A;

[0038] Figure 5d This is a partial top view of a PCB showing the discharge inductor portion according to an embodiment of the present disclosure;

[0039] Figure 5e This is a partial top view of a PCB showing the discharge inductor portion according to an embodiment of the present disclosure;

[0040] Figure 5f This is a partial top view of a PCB showing the discharge inductor portion according to an embodiment of the present disclosure;

[0041] Figure 5g This is a partial top view of a PCB showing the discharge inductor portion according to an embodiment of the present disclosure;

[0042] Figure 5h This is a partial top view of a PCB showing the discharge inductor portion according to an embodiment of the present disclosure;

[0043] Figure 6a This is a partial cross-sectional view of a PCB according to an embodiment of the present disclosure;

[0044] Figure 6b This is a partial top view of a PCB showing the discharge inductor portion according to an embodiment of the present disclosure;

[0045] Figure 7a This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0046] Figure 7b This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0047] Figure 7c This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0048] Figure 7d This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0049] Figure 7e This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0050] Figure 7f This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0051] Figure 7g This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0052] Figure 8a This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0053] Figure 8b This is an exploded perspective view showing the layer structure of a portion of a PCB according to an embodiment of the present disclosure;

[0054] Figure 9a This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0055] Figure 9b This is an exploded perspective view showing the layer structure of a portion of a PCB according to an embodiment of the present disclosure;

[0056] Figure 10 This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0057] Figure 11 This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0058] Figure 12 This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0059] Figure 13 This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0060] Figure 14a This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure;

[0061] Figure 14b This is a schematic diagram illustrating the circuit connection structure of the side components, PCB, and wireless communication circuit according to an embodiment of the present disclosure;

[0062] Figure 14c This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0063] Figure 14d This is an exploded perspective view showing the layer structure of a portion of a PCB according to an embodiment of the present disclosure;

[0064] Figure 15a This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure;

[0065] Figure 15b This is a schematic diagram illustrating the circuit connection structure of the side components, PCB, and wireless communication circuit according to an embodiment of the present disclosure;

[0066] Figure 15c This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0067] Figure 15d This is an exploded perspective view showing the layer structure of a portion of a PCB according to an embodiment of the present disclosure;

[0068] Figure 16a This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure;

[0069] Figure 16b This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0070] Figure 17a This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0071] Figure 17b This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0072] Figure 17c This is a graph showing the variation in radiation efficiency of an antenna with and without radiating elements on a PCB according to embodiments of the present disclosure;

[0073] Figure 18a This is a partial perspective view of a PCB according to an embodiment of the present disclosure;

[0074] Figure 18bThis is a partial cross-sectional view of a PCB according to an embodiment of the present disclosure;

[0075] Figure 19 This is a partial cross-sectional view of a PCB according to an embodiment of the present disclosure;

[0076] Figure 20a This is a partial exploded perspective view of an electronic device according to an embodiment of the present disclosure;

[0077] Figure 20b This is a partial cross-sectional view showing the connection structure between the PCB and the rear frame according to an embodiment of the present disclosure;

[0078] Figure 21a This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure;

[0079] Figure 21b It is shown Figure 21a A partial cross-sectional view of region F21;

[0080] Figure 22a This is a front perspective view of an electronic device according to an embodiment of the present disclosure;

[0081] Figure 22b This is a rear perspective view of an electronic device according to an embodiment of the present disclosure;

[0082] Figure 22c This is an exploded perspective view of an electronic device according to an embodiment of the present disclosure;

[0083] Figure 23 This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure;

[0084] Figure 24a This is a front perspective view of an electronic device according to an embodiment of the present disclosure;

[0085] Figure 24b This is a rear perspective view of an electronic device according to an embodiment of the present disclosure;

[0086] Figure 24c This is an exploded perspective view of an electronic device according to an embodiment of the present disclosure;

[0087] Figure 25 This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure;

[0088] Figure 26a This is a front perspective view of an electronic device in an unfolded state according to an embodiment of the present disclosure;

[0089] Figure 26bThis is a rear view of an electronic device in an unfolded state according to an embodiment of the present disclosure;

[0090] Figure 26c This is a perspective view of an electronic device in a folded state according to an embodiment of the present disclosure;

[0091] Figure 27 This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure;

[0092] Figure 28a This is a front perspective view of an electronic device in a first state according to an embodiment of the present disclosure;

[0093] Figure 28b This is a front perspective view of an electronic device in a second state according to an embodiment of the present disclosure;

[0094] Figure 28c This is a rear perspective view of an electronic device in a first state according to an embodiment of the present disclosure;

[0095] Figure 28d This is a rear perspective view of an electronic device in a second state according to an embodiment of the present disclosure; and

[0096] Figure 29 This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure. Detailed Implementation

[0097] In the following description, various embodiments will be described in more detail with reference to the accompanying drawings. When describing embodiments with reference to the drawings, the same reference numerals refer to the same elements, and repetitive descriptions associated with them will be omitted. The embodiments described herein are exemplary embodiments, and therefore, this disclosure is not limited thereto and may be implemented in various other forms. It should be understood that, unless the context clearly specifies otherwise, the singular form includes plural indicators. Terms used in this disclosure, including technical or scientific terms, may have the same meaning as commonly understood by those skilled in the art.

[0098] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment of the present disclosure.

[0099] refer to Figure 1In network environment 100, electronic device 101 can communicate with external electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of external electronic device 104 and server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with external electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In various embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In various embodiments, some of the components (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0100] Processor 120 can execute, for example, software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and can perform various data processing or calculations. According to embodiments, as at least part of data processing or calculation, processor 120 can store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be specifically used for a designated function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0101] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., ISP or CP) can be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., NPU) can include hardware architecture specified for artificial intelligence (AI) model processing. AI models can be generated through machine learning. This learning can be performed by, for example, an electronic device 101 that executes the AI ​​model, or via a separate server (e.g., server 108). The learning algorithm can include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The AI ​​model can include multiple layers of artificial neural networks. Artificial neural networks can include, for example, deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), deep Q-networks, or combinations of two or more of these, but are not limited thereto. The AI ​​model can alternatively or additionally include software structures in addition to hardware structures.

[0102] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The data may include, for example, software (e.g., program 140) and input or output data for commands associated therewith. Memory 130 may include volatile memory 132 or non-volatile memory 134. Non-volatile memory 134 may include internal memory 136 and external memory 138.

[0103] Program 140 may be stored as software in memory 130 and may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0104] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) to be used by another component of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0105] The audio output module 155 can output audio signals to the outside of the electronic device 101. The audio output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to embodiments, the receiver can be implemented separately from the speaker or as part of the speaker.

[0106] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to sense touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0107] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an external electronic device (e.g., an external electronic device 102 such as a speaker or headphones) directly or wirelessly connected to the electronic device 101.

[0108] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and generate electrical signals or data values ​​corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0109] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic device (e.g., external electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0110] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., external electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0111] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through their touch or kinesthesia. According to embodiments, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0112] Camera module 180 can capture still images and moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an ISP, or a flash.

[0113] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0114] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0115] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., external electronic device 102, external electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors that can operate independently of processor 120 (e.g., AP) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth™, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a fifth-generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components that are separate from each other (e.g., multiple chips). The wireless communication module 192 can use user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the SIM 196 to identify and authenticate the electronic device 101 in the communication network (such as the first network 198 or the second network 199).

[0116] Wireless communication module 192 can support 5G networks beyond fourth-generation (4G) networks, as well as next-generation communication technologies such as New Radio (NR) access technology. NR access technology can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable and low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), antenna arrays, analog beamforming, or massive MIMO. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic device (e.g., external electronic device 104), or network system (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or higher) for implementing eMBB, loss coverage (e.g., 164 dB or lower) for implementing mMTC, or U-plane delay (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for round trip) for implementing URLLC.

[0117] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element comprising conductive material or conductive patterns formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190. Signals or power can be transmitted or received between communication module 190 and external electronic device via at least one selected antenna. According to an embodiment, another component besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0118] According to various embodiments, antenna module 197 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include: a PCB; an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the PCB and capable of supporting a specified high-frequency band (e.g., millimeter-wave band); and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top or side surface) of the PCB and capable of transmitting or receiving signals in a specified high-frequency band.

[0119] At least some of the aforementioned components may be coupled to each other and transmit signals (e.g., commands or data) between them via a peripheral communication scheme (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0120] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of the external electronic devices 102 and 104 can be a device of the same or different type as electronic device 101. According to an embodiment, all or some of the operations to be performed by electronic device 101 can be performed at one or more of the external electronic devices 102 and 104 and server 108. For example, if electronic device 101 needs to perform a function or service automatically or in response to a request from a user or another device, instead of performing the function or service, or in addition to performing the function or service, electronic device 101 may also request one or more external electronic devices to perform at least a portion of the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or additional functions or services related to the request, and may pass the result of the performance to electronic device 101. Electronic device 101 may provide the result as at least part of a response to the request, with or without further processing. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies may be used, for example. Electronic device 101 can use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In an embodiment, external electronic device 104 may include Internet of Things (IoT) devices. Server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0121] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific exemplary embodiments, but rather to include various changes, equivalents, or substitutions for the respective embodiments. In conjunction with the description of the accompanying drawings, the same reference numerals may be used for similar or related components. As used herein, each of “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “A, B, or C” may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “1st” or “2nd” may be used only to distinguish a component from other components discussed and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., the first element) is referred to as “combined with another element (e.g., the second element),” “combined to another element (e.g., the second element),” “connected to another element (e.g., the second element),” or “connected to another element (e.g., the second element)”, it means that an element can be directly (e.g., via a wire), wirelessly connected to another element, or connected to another element via a third element.

[0122] It will be understood that the terms “comprising,” “including,” “having,” etc., specify the presence of a feature, graphic, step, operation, component, element, or combination thereof, but do not preclude the presence or addition of one or more other features, graphics, steps, operations, components, elements, or combinations thereof.

[0123] As used in conjunction with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or its smallest unit or part. For example, according to an embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0124] The various embodiments set forth herein can be implemented as software (e.g., program 140) including one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium. This allows the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between cases where data is stored semi-permanently in the storage medium and cases where data is temporarily stored in the storage medium.

[0125] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., an optical disc read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be distributed online (e.g., downloaded or uploaded) or directly between two user devices (e.g., smartphones). If distributed online, at least a portion of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium, such as the memory of a manufacturer's server, an app store's server, or a relay server.

[0126] According to various embodiments, each of the above components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately located in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as the corresponding components in the multiple components before integration. According to various embodiments, operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be performed in a different order or omitted, or one or more other operations may be added.

[0127] Figure 2a This is a front perspective view of an electronic device according to an embodiment of the present disclosure. Figure 2b This is a rear perspective view of an electronic device according to an embodiment of the present disclosure. Figure 3 This is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0128] refer to Figure 2a , Figure 2b and Figure 3 According to an embodiment, electronic device 201 (e.g., Figure 1 The electronic device 101 may include a housing 210, wherein the housing 210 forms a first surface 210a (or front surface), a second surface 210b (or rear surface), and side surfaces 211c surrounding the space between the first surface 210a and the second surface 210b. It should be noted that the shape of the housing shown in the figures is provided as an example only.

[0129] According to an embodiment, the electronic device 201 may include a housing 210 forming the exterior and housing components therein. The housing 210 may form a front surface 210a (e.g., a surface facing the +Z direction), a rear surface 210b (e.g., a surface facing the -Z direction), and side surfaces 211c surrounding the internal space between the front surface 210a and the rear surface 210b. In an embodiment, the housing 210 may form side surfaces 211c-1 (e.g., a surface facing the -Y direction), a second side surface 211c-2 (e.g., a surface facing the +Y direction), a third side surface 211c-3 (e.g., a surface facing the +X direction), and a fourth side surface 211c-4 (e.g., a surface facing the -X direction) connecting the front surface 210a and the rear surface 210b.

[0130] In an embodiment, the front surface 210a may be formed of a front panel 211a that is at least partially substantially transparent. The front panel 211a may comprise, for example, a glass or polymer panel including at least one coating. In an embodiment, the rear surface 210b may be formed of a substantially opaque rear panel 211b. The rear panel 211b may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, magnesium, etc.), or combinations thereof. In an embodiment, the side surface 211c may be formed of a side member 240 coupled to the front panel 211a and the rear panel 211b and comprising metal and / or polymer. In an embodiment, the rear panel 211b and the side member 240 may be seamlessly integrated. In an embodiment, the rear panel 211b and the side member 240 may be formed of substantially the same material (e.g., aluminum).

[0131] In an embodiment, the front panel 211a may include: a plurality of first edge regions 212a-1 facing one direction (e.g., the + / -X direction), extending from at least a portion of the front surface 210a to the rear panel 211b, and being circular; a plurality of second edge regions 212a-2 facing another direction (e.g., the + / -Y direction), extending from at least a portion of the front surface 210a to the rear panel 211b, and being circular; and a plurality of third edge regions 212a-3, which are circular, extending from at least a portion of the front surface 210a to the rear panel 211b, and being disposed between the plurality of first edge regions 212a-1 and the plurality of second edge regions 212a-2.

[0132] In an embodiment, the rear panel 211b may include: a plurality of fourth edge regions 212b-1 facing one direction (e.g., the + / -X direction), extending from at least a portion of the rear surface 210b to the front panel 211a, and being circular; a plurality of fifth edge regions 212b-2 facing another direction (e.g., the + / -Y direction), extending from at least a portion of the rear surface 210b to the front panel 211a, and being circular; and a plurality of sixth edge regions 212b-3, which are circular, extending from at least a portion of the rear surface 210b to the front panel 211a, and being disposed between the plurality of fourth edge regions 212b-1 and the plurality of fifth edge regions 212b-2.

[0133] In one embodiment, the side member 240 may surround at least a portion of the internal space between the front surface 210a and the rear surface 210b. In another embodiment, the display 261 may be disposed on one surface of the side member 240 (e.g., in the +Z direction), and the rear plate 211b may be disposed on the other surface of the side member 240 (e.g., in the -Z direction). In another embodiment, the side member 240 may include conductive portions. For example, at least a portion of the side member 240 may be formed of a conductive material. In another embodiment, the side member 240 may include a side portion 241 disposed on at least a portion of the side surface 211c, and a support portion 242 coupled to the side portion 241 and disposed within the electronic device 201.

[0134] In one embodiment, the side portion 241 may form the side surface 211c of the housing 210 by connecting the edges of the front panel 211a and the rear panel 211b and surrounding the space between the front panel 211a and the rear panel 211b. In another embodiment, the support portion 242 may be disposed inside the electronic device 201. In another embodiment, the side portion 241 and the support portion 242 may be integrally formed, or they may be formed separately and then coupled together. If the side portion 241 and the support portion 242 are formed separately, the side member 240 may be formed to include only the side portion 241. In another embodiment, the side portion 241 (e.g., the side member 240) may include a plurality of conductive portions disposed along the side surface 211c of the electronic device 201. For example, the conductive portions may be formed of a metal and / or a conductive polymer material. In another embodiment, the support portion 242 may be formed of the same metal and / or conductive polymer material as the side portion 241. In an embodiment, when the support portion 242 is directly connected to the conductive portion of the side portion 241, the support portion 242 can form an electrical path from the conductive portion of the side portion 241 to ground.

[0135] In an embodiment, electronic device 201 may include display 261 (e.g., Figure 1 The display module 160 in the embodiment. In an embodiment, the display 261 may be disposed on the front surface 210a of the electronic device 201. In an embodiment, the display 261 may be exposed through at least a portion of the front panel 211a (e.g., a first edge region 212a-1, a second edge region 212a-2, and a third edge region 212a-3). In an embodiment, the display 261 may have a shape substantially the same as the outer contour shape of the front panel 211a. Although not shown, according to an embodiment, the display 261 may include a touch screen panel (TSP), a pressure sensor, and / or a digitizer configured to detect a stylus.

[0136] In one embodiment, the display 261 may include a screen display area 261a that is visually exposed to the outside of the electronic device 201 and displays content through pixels or multiple units. In another embodiment, the screen display area 261a may include a sensing area 261a-1 and a camera area 261a-2. The sensing area 261a-1 may overlap with at least a portion of the screen display area 261a. The sensing area 261a-1 may allow transmission with a sensor module (e.g., ...). Figure 1 The sensor module 176 in the sensor module is associated with the input signal. The sensing area 261a-1 can be combined with the screen display area 261a that does not overlap with the sensing area 261a-1 to display content.

[0137] In an embodiment, camera region 261a-2 may overlap with at least a portion of screen display region 261a. Camera region 261a-2 may expose a first camera module 280a configured to face the front of electronic device 201 (e.g., Figure 1 The camera module 280a contains a lens. For example, camera area 261a-2 may allow the transmission of light signals (e.g., light) associated with the first camera module 280a. In an embodiment, camera area 261a-2 may share content with a portion of screen display area 261a that does not overlap with camera area 261a-2. For example, camera area 261a-2 may display content when the first camera module 280a is not in operation.

[0138] In an embodiment, electronic device 201 may include sensor module 276. Sensor module 276 can sense signals applied to electronic device 201. Sensor module 276 may be disposed, for example, on the front surface 210a of electronic device 201. Sensor module 276 may be disposed on electronic device 201 to correspond to sensing area 261a-1 of screen display area 261a. For example, sensor module 276 may be configured to perform its function within the internal space of electronic device 201, without being visually exposed through display 261. Sensor module 276 can receive input signals transmitted through sensing area 261a-1 and generate electrical signals based on the received input signals. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound, etc.). For another example, the input signal may include a signal associated with a user's biometric information (e.g., fingerprint, voice, etc.).

[0139] In an embodiment, electronic device 201 may include camera modules 280a and 280b (e.g., Figure 1 The camera module 180 is included. In an embodiment, camera modules 280a and 280b may include a first camera module 280a and a second camera module 280b. In an embodiment, electronic device 201 may include a flash 280c disposed near the first camera module 280a and the second camera module 280b.

[0140] In an embodiment, the first camera module 280a may have a lens exposed on the front surface 210a of the housing 210 and may receive light signals from the front of the electronic device 201 (e.g., in the +Z direction). The second camera module 280b may have a lens exposed on the rear surface 210b of the housing 210 and may receive light signals from the rear of the electronic device 201 (e.g., in the -Z direction). In an embodiment, at least a portion of the first camera module 280a may be disposed on the housing 210 such that it is covered by the display 261. For example, the first camera module 280a may include an under-display camera (UDC). In an embodiment, the first camera module 280a may receive light signals transmitted through camera areas 261a-2. In an embodiment, the second camera module 280b may include multiple cameras (e.g., dual-camera, triple-camera, or quad-camera). In an embodiment, the flash 280c may include a light-emitting diode (LED) or a xenon lamp.

[0141] In an embodiment, electronic device 201 may include input module 250 (e.g., Figure 1 Input module 250 (input module 150). Input module 250 can receive operation signals from the user. For example, input module 250 may include at least one key input device configured to be exposed on the side 211c of housing 210.

[0142] In an embodiment, electronic device 201 may include connection terminal 278 (e.g., Figure 1 (Connection terminal 278 in the housing 210). In an embodiment, connection terminal 278 may be disposed on the outer peripheral surface of housing 210. Electronic device 201 can be wired to external device (e.g., another electronic device or external power supply) via connection terminal 278.

[0143] In an embodiment, the electronic device 201 may include at least one circuit board (e.g., a printed circuit board (PCB)). For example, the electronic device 201 may include a first PCB 251 (or a main PCB) and a second PCB 252 (or a sub-PCB). The first PCB 251 and the second PCB 252 may be disposed inside the electronic device 201, for example, on a second support structure 242. At least one PCB (e.g., 251 and 252) may be grounded to the second support portion 242. In an embodiment, the first PCB 251 may be accommodated in a first slot 242a formed by the second support portion 242. In an embodiment, the second PCB 252 may be accommodated in a second slot 242b formed by the second support portion 242. In an embodiment, the PCB (e.g., 251 and 252) may be a rigid PCB or a flexible PCB (FPCB) that is at least partially bendable. In an embodiment, the PCB (e.g., 251 and 252) may be formed as a multilayer structure. Hereinafter, for ease of description, the direction of the PCB layer stacking will be referred to as the first direction.

[0144] In one embodiment, the electronic device 201 may include a battery 289 disposed therein. The battery 289 may be disposed in a battery slot 245 formed in the second support portion 242.

[0145] According to various embodiments, the electronic device can be one of a variety of types of devices. As a non-limiting example, the electronic device may include a portable communication device (e.g., a smartphone), a computing device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics product. However, the electronic device described herein is not limited to the foregoing examples.

[0146] Figure 4a This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure. Figure 4b This is a graph illustrating the antenna performance exhibited in an electronic device according to an embodiment of the present disclosure when electrical signals are transmitted via capacitance between coupled pads.

[0147] refer to Figure 4a According to an embodiment, electronic device 401 (e.g., Figure 2a The electronic device 201 in the device may include a housing (e.g., Figure 2a The housing 210 and PCB 450 (e.g., Figure 3 The first PCB 251 or the second PCB 252) and the wireless communication circuit 490.

[0148] In an embodiment, the housing may include a front surface (e.g., Figure 2a(e.g., front surface 210a) and rear surface opposite the front surface (e.g., Figure 2a The rear surface 210b) and the sides (e.g., surrounding the interior space between the front and rear surfaces) Figure 2a Side 211c in the middle). In an embodiment, the housing may include side members 440 that form at least a portion of the side and surround the interior space (e.g., side members 440). Figure 3 Side member 440 (in FIG450). In an embodiment, side member 440 may include a plurality of conductive portions 4411 formed of conductive material. In an embodiment, some of the conductive portions 4411 may serve as radiators through which electrical signals flow. In an embodiment, side member 440 may include insulating portions 4412 disposed between the plurality of conductive portions 4411 and configured to electrically isolate adjacent conductive portions 4411 from each other. In an embodiment, side member 440 may include at least one connection portion 4413 formed on the conductive portions 4411 and electrically connected to PCB 450. In an embodiment, connection portion 4413 may serve as a feed point for applying electrical signals to the conductive portions 4411, or as a ground point from which electrical signals applied to the conductive portions 4411 escape. In an embodiment, referring to the top view shown in FIG4, connection portion 4413 may overlap with at least a portion of PCB 450 disposed within the housing. For example, connection portion 4413 may be in direct contact with an electrical connection member 453 disposed on PCB 450, as shown in FIG4. Alternatively, the connection portion 4413 can be configured not to overlap with the PCB 450. For example, the connection portion 4413 can indirectly contact the electrical connection member 453 disposed on the PCB 450 via a separate circuit.

[0149] In one embodiment, the PCB 450 may be disposed within the interior space of the housing. In another embodiment, the PCB 450 may be formed as a multilayer structure having multiple stacked layers. In another embodiment, the PCB 450 may include at least one electrical connection member 453 electrically connected to the conductive portion 4411. In another embodiment, the electrical connection member 453 may be provided in the form of a conductive contact member formed of a conductive material or in the form of a C-clamp. For example, the electrical connection member 453 may contact a connection portion 4413 formed on the conductive portion 4411. In another embodiment, the PCB 450 may be mounted within the interior space of the housing such that the electrical connection members 453 respectively contact the connection portions 4413 of the corresponding conductive portions 4411.

[0150] In an embodiment, PCB 450 may be electrically connected to wireless communication circuit 490. For example, wireless communication circuit 490 may be disposed on PCB 450 or may be disposed on another PCB. In an embodiment, PCB 450 may include at least one signal line 454 connected to wireless communication circuit 490. In an embodiment, PCB 450 may form at least one electrical path from electrical connection member 453 connected to conductive portion 4411 via signal line 454 to wireless communication circuit 490.

[0151] In an embodiment, the PCB 450 may include a plurality of coupling pads 451 disposed on an electrical path. The coupling pads 451 may electrically connect electrical connection members 453 and corresponding signal lines 454 connected to the wireless communication circuit 490 via a coupling feed structure (or coupling connection structure). In an embodiment, the coupling pads 451 may electrically connect corresponding electrical connection members 453 and signal lines 454 via the coupling feed structure, thereby indirectly transmitting electrical signals through capacitance formed between the coupling pads 451. According to an embodiment, the coupling feed structure may prevent or block direct signal delivery (or transmission) between the conductive portion 4411 of the side member 440 and the wireless communication circuit 490, and thus may form an electrostatic discharge (ESD) blocking structure that prevents or reduces the transmission of electrostatic or noise signals from the conductive portion 4411 to the wireless communication circuit 490.

[0152] In one embodiment, PCB 450 may include a grounding element 456 for grounding electrostatic or noise signals transmitted from conductive portion 4411. In another embodiment, the grounding element 456 of PCB 450 may be connected to a grounding region of electronic device 401 (e.g., the region of grounding element 456 of side member 440) to allow noise signals applied to PCB 450 to escape from PCB 450 and be removed.

[0153] refer to Figure 4b This illustrates the antenna radiation performance (or antenna radiation efficiency) exhibited when transmitting and receiving electrical signals of a specific frequency band through the conductive portion 4411 of the side member 440. Figure 4b In the graph, the horizontal axis represents the frequency band radiated through the conductive portion, and the vertical axis represents the total radiation efficiency through the conductive portion. In this graph, line G1 represents the frequency band-dependent radiation efficiency exhibited when the conductive portion 4411 and the wireless communication circuit 490 are directly connected through a circuit including ESD protection elements, and line G2 represents the frequency band-dependent radiation efficiency exhibited under the same conditions as G1 when the conductive portion 4411 and the wireless communication circuit 490 are connected through a capacitor formed between multiple coupling pads 451.

[0154] Compare Figure 4bAs shown by lines G1 and G2, it can be verified that there is no significant difference in radiation efficiency between G1 and G2 in lower frequency bands, while in higher frequency bands (e.g., the ultra-high frequency band (UHB) region, 4,400 to 5,000 MHz), G2 has a more efficient radiation efficiency than G1. For example, it can be verified that in a specific frequency band, antenna radiation efficiency can be maintained more stably by using a coupled feed structure with multiple coupled pads 451 to connect the conductive portion 4411 and the wireless communication circuit 490 without separate ESD protection elements, rather than by directly connecting the conductive portion 4411 and the wireless communication circuit 490 with a circuit including ESD protection elements. That is, it can be verified that in a specific frequency band, using a coupled feed structure that omits ESD elements can improve the phenomenon of antenna radiation efficiency degradation.

[0155] Figure 5a This is a cross-sectional view of a PCB according to an embodiment of the present disclosure. Figure 5b It is shown Figure 5a A partial cross-sectional view of the PCB in region A. Figure 5c It is shown Figure 5a A partial perspective view of the PCB in area A. Figure 5d This is a partial top view of a PCB showing the discharge inductor portion according to an embodiment of the present disclosure. Figure 5e This is a partial top view of a PCB showing the discharge inductor portion according to an embodiment of the present disclosure. Figure 5f This is a partial top view of a PCB showing the discharge inductor portion according to an embodiment of the present disclosure. Figure 5g This is a partial top view of a PCB showing the discharge inductor portion according to an embodiment of the present disclosure. Figure 5h This is a partial top view of a PCB showing the discharge inductor portion according to an embodiment of the present disclosure.

[0156] refer to Figures 5a to 5c According to an embodiment, a plurality of coupling pads 551 may be formed on a portion of the PCB 550. For example, as Figure 5a As shown, coupling pad 551 can be set on PCB 550 with electronic devices (e.g., Figure 4a The side component of the electronic device 401 in the middle (e.g., Figure 4a At the edge adjacent to the side member 440 in the PCB 550, for example, at the edge of the conductive portion (e.g., Figure 4a The conductive portion 4411) is adjacent to the edge region. Although Figure 5aA coupling feed structure formed by coupling pads 551 in the area indicated as A is shown, but this is provided only for ease of description, and it should be noted that the coupling feed structure can be formed in various areas of the PCB 550 connected to the conductive portions of the side members. In the following, embodiments will be described based on coupling feed structures formed in a portion of the PCB 550.

[0157] Figures 5a to 5h A portion of a PCB 550 in which coupling pads 551 are formed is schematically shown. (Reference) Figures 5a to 5h According to an embodiment, PCB 550 (e.g., Figure 4a PCB 450 may include electrical connection member 553, connected to wireless communication circuitry (e.g., Figure 4a The wireless communication circuit 490 includes signal lines 554, multiple coupling pads 551, dielectric 552, multiple conductive vias 5551 and 5552, ground 556, and discharge inductor 557.

[0158] In an embodiment, the PCB 550 may include a first board surface 550a and a second board surface 550b opposite to the first board surface 550a. The first board surface 550a and the second board surface 550b may form two outer surfaces exposed to the outside of the PCB 550. Furthermore, additional layers may be disposed on at least a portion of the first board surface 550a and the second board surface 550b of the PCB 550. For example, additional structures, such as protective layers (e.g., dielectric layers with dielectric 552 formed), conductive layers for signal delivery (or transmission), or shielding covers for protecting components disposed on the first board surface 550a or the second board surface 550b, may be disposed on the outer surfaces of the first board surface 550a or the second board surface 550b. In the following description, although for ease of description, the first board surface 550a and the second board surface 550b of PCB 550 are described as forming surfaces exposed to the outside of PCB 550, it should be noted that even without separate description, additional layers and / or structures may be provided on at least a portion of the first board surface 550a and the second board surface 550b of PCB 550, and the same description may be applied to other embodiments.

[0159] In an embodiment, the PCB 550 may be formed as a multilayer structure. For example, the PCB 550 may be formed as a multilayer structure in which coupling pads 551 and dielectrics 552 alternately overlap. In an embodiment, at least one coupling pad 551 and dielectric 552 may be disposed on substantially the same plane in the PCB 550, thereby forming a single layer.

[0160] In an embodiment, the electrical connection member 553 may be disposed on one side of the PCB 550, for example, on the first board surface 550a or the second board surface 550b. The electrical connection member 553 may be electrically connected to a conductive portion of the side member (e.g., Figure 4a The conductive part 4411 in it.

[0161] In an embodiment, signal line 554 can be connected to a wireless communication circuit. Although for ease of description, signal line 554 is... Figure 5a The signal line 554 is shown as being disposed on the first board surface 550a of PCB 550, but it should be noted that the position of the signal line 554 on PCB 550, its arrangement with other components, or its shape are not limited thereto.

[0162] In an embodiment, a plurality of coupling pads 551 may be disposed on the PCB 550 separately from each other. At least some of the plurality of coupling pads 551 (e.g., 5511-1, 5511-2, 5512-1, and 5512-2) may be disposed on the PCB 550 in a first direction T (e.g., in...). Figure 5b The multiple coupling pads 551 may have different positions along the W-axis direction of the PCB 550. For example, multiple coupling pads 551 may be arranged separately along a first direction T of the PCB 550. In an embodiment, the first direction T of the PCB 550 may refer to the direction in which multiple layers of the PCB 550 are stacked. In the following, unless otherwise stated, the first direction T will be interpreted as indicating the stacking direction (e.g., thickness direction) of the multiple layers of the PCB. In an embodiment, a dielectric 552 may be disposed between the multiple coupling pads 551. Each of the multiple coupling pads 551 may be electrically insulated by the dielectric 552. In an embodiment, the multiple coupling pads 551 may include a multiple first coupling pads 5511 and a multiple second coupling pads 5512.

[0163] In an embodiment, a plurality of first coupling pads 5511 may be electrically connected to each other. The plurality of first coupling pads 5511 may be electrically connected to an electrical connection member 553. For example, the first coupling pads 5511 may be in direct contact with the electrical connection member 553, or may be connected to the electrical connection member 553 via individual conductive traces (e.g., 5511) or conductive vias (e.g., 555). For example, a conductive via may be a structure in which the via is at least partially filled with a conductive material. For example, the plurality of first coupling pads 5511 may form an electrical path with the electrical connection member 553 through which an electrical signal flows. The first coupling pads 5511 may serve as feed pads, forming a path for applying an electrical signal to a conductive portion (e.g., via the electrical connection member 553). Figure 4a The conductive part 4411 in the middle or the electrical path used to receive electrical signals directly from the conductive part.

[0164] In an embodiment, the first coupling pad 5511 may include a 1-1 coupling pad 5511-1 and a 1-2 coupling pad 5511-2 separately disposed along a first direction T of the PCB 550. However, the number of first coupling pads 5511 is not limited thereto, and a single coupling pad may be provided instead of the one shown.

[0165] In an embodiment, a plurality of second coupling pads 5512 may be electrically connected to each other. The plurality of second coupling pads 5512 may be electrically insulated from the first coupling pad 5511 on the PCB 550. In an embodiment, the plurality of second coupling pads 5512 may be electrically connected to a signal line 554 connected to a wireless communication circuit. For example, the second coupling pads 5512 may be in direct contact with the signal line 554, or may be connected to the signal line 554 connected to the wireless communication circuit via a separate conductive trace or a second conductive via 5552. For example, the plurality of second coupling pads 5512 may form an electrical path through which electrical signals flow to the wireless communication circuit via the signal line 554. In an embodiment, the second coupling pads 5512 may serve as signal delivery pads, forming an electrical path for receiving electrical signals from the wireless communication circuit via the signal line 554 or for delivering (or transmitting) electrical signals to the wireless communication circuit via the signal line 554.

[0166] In an embodiment, the second coupling pad 5512 may include a 2-1 coupling pad 5512-1 and a 2-2 coupling pad 5512-2 disposed separately along a first direction T of the PCB 550. However, the number of second coupling pads 5512 is not limited thereto.

[0167] In an embodiment, the first coupling pad 5511 and the second coupling pad 5512 can transmit electrical signals in a non-contact manner. For example, the first coupling pad 5511 and the second coupling pad 5512 can be configured to at least partially overlap with the PCB 550 when viewed in one direction, and a capacitance can be formed between them for indirect signal delivery (or transmission). In an embodiment, the capacitance formed between the first coupling pad 5511 and the second coupling pad 5512 can be determined by factors such as, for example, the spacing or distance between the first coupling pad 5511 and the second coupling pad 5512, the overlapping area between them, or the dielectric constant of the dielectric 552. Based on the capacitance formed between the plurality of coupling pads 551 disposed on the PCB 550, the amount of electrical signal applied to the corresponding conductive portion (e.g., Figure 4a The impedance of the electrical signal in the conductive part 4411).

[0168] In an embodiment, when viewing the PCB 550 in a first direction T, at least one second coupling pad 5512 may be disposed overlappingly between at least one pair of first coupling pads 5511. For example, relative to the first direction T of the PCB 550, a 2-1 coupling pad 5512-1 may be disposed between a 1-1 coupling pad 5511-1 and a 1-2 coupling pad 5511-2.

[0169] In an embodiment, a plurality of first coupling pads 5511 and a plurality of second coupling pads 5512 may be alternately arranged along a first direction T of the PCB 550. For example, 1-1 coupling pads 5511-1, 2-1 coupling pads 5512-1, 1-2 coupling pads 5511-2, and 2-2 coupling pads 5512-2 may be alternately arranged along the first direction T of the PCB 550. In an embodiment, the plurality of first coupling pads 5511 and the plurality of second coupling pads 5512 may at least partially overlap each other along the first direction T of the PCB 550.

[0170] In an embodiment, when viewing the PCB 550 in a first direction T, the plurality of coupling pads 551 can be configured such that the overlapping area A between adjacent first coupling pads 5511 and second coupling pads 5512 is substantially the same. For example, as Figure 5b As shown, relative to the first direction T of the PCB 550, the overlapping areas A between 1-1 coupling pads 5511-1 and 2-1 coupling pads 5512-1, 1-1 coupling pads 5511-1 and 2-2 coupling pads 5512-2, and 1-2 coupling pads 5511-2 and 2-2 coupling pads 5512-2 can be substantially the same. However, it should be noted that the arrangement of the multiple coupling pads 551 is not limited to this, and the overlapping areas between adjacent coupling pads can be set differently depending on the design.

[0171] In an embodiment, where two first coupling pads 5511 and two second coupling pads 5512 are alternately overlapped along the first direction T of the PCB 550, as follows: Figure 5bAs shown, the total capacitance formed by multiple coupling pads 551 can be determined by the corresponding capacitances formed between coupling pads 1-1 (5511-1) and 2-1 (5512-1), between coupling pads 1-1 (5511-1) and 2-2 (5512-2), and between coupling pads 2-2 (5512-2) and 1-2 (5511-2). For example, the total capacitance formed by multiple coupling pads 551 can be greater than or equal to the sum of the respective capacitances formed between adjacent first coupling pads 5511 and second coupling pads 5512. In an embodiment, the total capacitance formed through the overlapping area of ​​the multiple first coupling pads 5511 and the multiple second coupling pads 5512 can be set according to the target capacitance. The total capacitance formed by multiple coupling pads 551 on the PCB 550 can be determined by the type of dielectric, the thickness of the dielectric, the distance between the coupling pads, the overlapping area between the coupling pads, etc. The corresponding capacitors used for indirect signal delivery (or transmission) may be formed between the first coupling pad 5511 and the second coupling pad 5512 that are adjacent to each other, and the sum of the corresponding capacitors formed on the PCB 550 (i.e., the total capacitance) may be approximately 10 picofarads (pF) or greater. However, the sum is not limited to this.

[0172] In an embodiment, a plurality of conductive vias 5551 and 5552 may penetrate the PCB 550 in a first direction T and electrically connect at least some of a plurality of separately disposed coupling pads 551 (e.g., 5511 and 5512). In an embodiment, the plurality of conductive vias 5551 and 5552 may respectively connect a plurality of first coupling pads 5511 and a plurality of second coupling pads 5512. For example, the plurality of conductive vias 5551 and 5552 may include at least one first conductive via 5551 connected to and electrically connected to the plurality of first coupling pads 5511, and at least one second conductive via 5552 connected to and electrically connected to the plurality of second coupling pads 5512. The first conductive vias 5551 and the second conductive vias 5552 may be electrically insulated from each other. For example, the plurality of conductive vias 5551 and 5552 may not be directly connected to the first coupling pads 5511 and the second coupling pads 5512.

[0173] In an embodiment, at least one first conductive via 5551 can electrically connect a plurality of first coupling pads 5511 along a first direction T of the PCB 550. For example, the first conductive via 5551 can form an electrical path between a plurality of first coupling pads 5511. In an embodiment, the first conductive via 5551 can be provided as a plurality of first conductive vias on the PCB 550, each first conductive via being disposed between a pair of adjacent first coupling pads 5511. In an embodiment, a first conductive via 5551 can be configured to penetrate the PCB 550 in the first direction T to simultaneously connect a plurality of first coupling pads 5511 spaced apart in the first direction T of the PCB 550. In an embodiment, when the first coupling pads 5511 and the electrical connection member 553 are configured to be separated on the PCB 550, the first conductive via 5551 can electrically connect at least one first coupling pad 5511 and the electrical connection member 553, thereby forming an electrical path between the electrical connection member 553 and the first coupling pad 5511.

[0174] In an embodiment, at least one second conductive via 5552 can electrically connect a plurality of second coupling pads 5512 along a first direction T of the PCB 550. For example, the second conductive via 5552 can form an electrical path between a plurality of second coupling pads 5512. In an embodiment, the second conductive via 5552 can be provided as a plurality of second conductive vias on the PCB 550, wherein each second conductive via is disposed between a pair of adjacent second coupling pads 5512. In an embodiment, a second conductive via 5552 can be configured to penetrate the PCB 550 in the first direction T to simultaneously connect a plurality of second coupling pads 5512 spaced apart in the first direction T of the PCB 550. In an embodiment, when the second coupling pads 5512 and the signal line 554 connected to the wireless communication circuit are configured to be separated on the PCB 550, the second conductive via 5552 can electrically connect at least one second coupling pad 5512 and the signal line 554, thereby forming an electrical path between the second coupling pads 5512 and the wireless communication circuit.

[0175] In an embodiment, the switch (e.g., Figure 18b The switch 1859 can be disposed between at least one of the plurality of conductive vias 5551 and 5552 and a first coupling pad 5511 or a second coupling pad 5512 to selectively block electrical signal connection paths formed through the conductive vias. For example, the switch can be disposed on at least one layer of the PCB 550 on which the first coupling pad 5511 or the second coupling pad 5512 is disposed, as will be described in more detail below.

[0176] In an embodiment, a grounding element 556 may be disposed on the PCB 550 and form a path through which electrostatic or noise signals introduced into the PCB 550 escape. For example, the grounding element 556 may allow introduced electrical signals to move through another electrical structure to prevent or reduce the introduction of electrical signals such as electrostatic or noise signals into components disposed on the PCB 550. For example, the grounding element 556 may be connected to another grounding element of an electronic device. In an embodiment, the grounding element 556 may be disposed on the PCB 550 such that it is separate from a plurality of coupling pads 551. In an embodiment, the grounding element 556 may be disposed on an exposed surface of the PCB 550 (e.g., Figure 5c The grounding element 556 is located on the second board surface 550b) to contact other structures of the electronic device, but the location of the grounding element 556 on the PCB 550 is not limited thereto. In an embodiment, the grounding element 556 can receive electrical signals such as electrostatic or noise signals from the first coupling pad 5511 and release them to the outside of the PCB 550.

[0177] In an embodiment, at least one of the plurality of first coupling pads 5511 may be configured to be adjacent to the ground element 556. For example, relative to a first direction T of the PCB 550, a first coupling pad 5511 may be disposed on the same layer as the ground element 556 to form a gap adjacent to the ground element 556. For example, as Figure 5d As shown, a first coupling pad 5511D and a grounding element 556 can be disposed on a second board surface 550b of the PCB 550, and the grounding element 556 can receive electrostatic or noise signals introduced into the PCB 550 from a conductive portion via the first coupling pad 5511D disposed adjacent to it. However, this is provided only as an example, and it is not required that the grounding element 556 and the first coupling pad 5511D be disposed on the same layer of the PCB 550. For example, as Figure 5g As shown, the grounding element 556 can be configured to be adjacent to the first conductive via 5551 connected to the first coupling pad 5511, and can receive electrostatic or noise signals introduced into the PCB 550 from the conductive portion via the adjacent first conductive via 5551. In an embodiment, when the grounding element 556 is disposed on the first board surface 550a of the PCB 550, the grounding element 556 can receive electrostatic or noise signals via the first coupling pad 5511 disposed on the first board surface 550a or via the first conductive via 5551 connected to the first coupling pad 5511. In an embodiment, it may be desirable for the grounding element 556 to be disposed on the first board surface 550a or the second board surface 550b of the PCB 550; however, it should be noted that the arrangement position of the grounding element 556 on the PCB 550 is not limited to this and can be changed according to the design of the PCB 550.

[0178] In embodiments, discharge inductance portions (e.g., 557D, 557E, 557F, 557G, and 557H) can cause movement of the electrical signal discharge from the first coupling pad 5511 to the ground member 556. In embodiments, discharge inductance portions (e.g., 557D, 557E, 557F, 557G, and 557H) can function as lightning rods, causing movement of the electrical signal from the first coupling pad 5511 to the ground member 556 by narrowing the gap between the ground member 556 and one of the first coupling pads 5511 (e.g., 1-2 coupling pads 5511-2). For example, discharge inductance portions (e.g., 557D, 557E, 557F, 557G, and 557H) can cause movement of the electrical signal between the ground member 556 and the first coupling pad 5511 adjacent to the ground member 556 for the discharge of the electrical signal.

[0179] In embodiments, the discharge inductor portion (e.g., 557D, 557E, 557F, 557G, and 557H) may include one or more discharge members 5571 and 5572 for narrowing the gap between the first coupling pad 5511 and the ground member 556. For example, discharge members 5571 and 5572 may be formed of a conductive material. Discharge members 5571 and 5572 can narrow the gap (or distance) between the first coupling pad 5511 and the ground member 556 by a gap G through which an electrical signal moves to discharge, for example, the electrical signal moves through the gap via a dielectric 552. In embodiments, the gap G may be approximately 200 micrometers (μm) or smaller, but is not limited thereto.

[0180] refer to Figure 5d According to an embodiment, the discharge inductor portion 557D in PCB 550D may include a first discharge member 5571, which is connected to one of the first coupling pads 5511D in the direction toward the ground member 556 (e.g., in...). Figure 5d It extends protrudingly in the +V direction. In an embodiment, the discharge inductor portion 557D may be formed separately from and connected to the first coupling pad 5511D by a material that is the same as or different from the first coupling pad 5511D, but it may also be a protrusion formed by a portion of the first coupling pad 5511D protruding toward the ground member 556. In an embodiment, a gap G may be formed between the first discharge member 5571 and the ground member 556, and a dielectric 552 is disposed in the gap G.

[0181] refer to Figure 5eAccording to an embodiment, the discharge inductor portion 557E in PCB 550E may include a second discharge member 5572, which is connected to the ground member 556 and in a direction toward one of the first coupling pads 5511E of the first coupling pads 5511 (e.g., in...). Figure 5e The second discharge member 5572 extends protrudingly in the AV direction. In an embodiment, the second discharge member 5572 may be formed separately from and connected to the ground member 556 by means of the same or different material as the ground member 556, but it may also be a protrusion formed by a portion of the ground member 556 protruding toward the first coupling pad 5511E. In an embodiment, a gap G may be formed between the second discharge member 5572 and the ground member 556, and the dielectric 552 is disposed in the gap G.

[0182] refer to Figure 5f According to an embodiment, the discharge inductor portion 557F in PCB 550F may include a first discharge member 5571 and a second discharge member 5572. The first discharge member 5571 and the second discharge member 5572 are respectively connected to a first coupling pad 5511F of the first coupling pad 5511 and a ground member 556, and are oriented toward each other (e.g., in...). Figure 5f (Extending in the V-axis direction). In an embodiment, the first discharge member 5571 may be formed separately from and connected to the first coupling pad 5511F by a material that is the same as or different from the first coupling pad 5511F, but it may also be a protrusion formed by a portion of the first coupling pad 5511F protruding toward the ground member 556. In an embodiment, the second discharge member 5572 may be formed separately from and connected to the ground member 556 by a material that is the same as or different from the ground member 556, but it may also be a protrusion formed by a portion of the ground member 556 protruding toward the first coupling pad 5511F. In an embodiment, a gap G may be formed between the first discharge member 5571 and the second discharge member 5572, and a dielectric 552 is disposed in the gap G.

[0183] refer to Figure 5g According to an embodiment, the discharge inductor portion 557 in the PCB 550G may include a plurality of first discharge members 5571 and a plurality of second discharge members 5572. The plurality of first discharge members 5571 and the plurality of second discharge members 5572 are respectively connected to a first coupling pad 5511G of the first coupling pad 5511 and a grounding member 556, and are in a direction facing each other (e.g., in the direction of the first coupling pad 5511G and the second coupling pad 5572). Figure 5g(Extending in the V-axis direction). For example, a plurality of first discharge members 5571 may include 1-1 discharge member 5571-1 and 1-2 discharge member 5571-2 connected to a first coupling pad 5511G and spaced apart from each other. A plurality of second discharge members 5572 may include 2-1 discharge member 5572-1 and 2-2 discharge member 5572-2 connected to a ground member 556 and spaced apart from each other. In an embodiment, 1-1 discharge member 5571-1 and 2-1 discharge member 5572-1 may correspond to each other and form a gap G therebetween. 1-2 discharge member 5571-2 and 2-2 discharge member 5572-2 may correspond to each other and form a gap G therebetween. In an embodiment, the number of first discharge members 5571 and second discharge members 5572 is not limited thereto. For example, first discharge member 5571 and second discharge member 5572 may each be provided as three or more discharge members and may be configured to correspond to each other. Multiple discharge members 5571 and 5572 may have the same length, but may also have different lengths. For example, the gap G between corresponding first discharge members 5571 and second discharge members 5572 may be constant. In an embodiment, the first discharge member 5571 may be formed separately from and connected to the first coupling pad 5511G, which may be the same as or different from the first coupling pad 5511G, but may also be a protrusion formed by a portion of the first coupling pad 5511G protruding toward the ground member 556. In an embodiment, the second discharge member 5572 may be formed separately from and connected to the ground member 556, which may be the same as or different from the ground member 556, but may also be a protrusion formed by a portion of the ground member 556 protruding toward the first coupling pad 5511G.

[0184] refer to Figure 5h According to an embodiment, the discharge inductor portion 557H in PCB 550H may include a first discharge member 5571 connected to a conductive via 5553, which is connected to a first coupling pad 5511. The first discharge member 5571 may be formed in a different layer than the first coupling pad 5511 and connected to the first coupling pad 5511 via the conductive via 5553. The first discharge member 5571 may be located in a direction toward the ground member 556 (e.g., in...). Figure 5g(Extending in the +V direction). In an embodiment, the discharge inductor portion 557 may include a second discharge member 5572, which is connected to the ground member 556 and extends toward the first discharge member 5571. The second discharge member 5572 may be formed separately from and connected to the ground member 556 by the same or different material as the ground member 556, but may also be a protrusion formed by a portion of the ground member 556 protruding toward the first coupling pad 5511. In an embodiment, a gap G may be formed between the first discharge member 5571 and the second discharge member 5572, and a dielectric 552 is disposed in the gap G.

[0185] In an embodiment, PCB 550 may use a coupling connection structure (or a coupling feed structure as described herein) between a first coupling pad 5511 and a second coupling pad 5512 to form an indirect signal delivery path between an electrical connection member 553 connected to a conductive portion and a signal line 554 connected to a wireless communication circuit. This indirect signal delivery via the first coupling pad 5511 and the second coupling pad 5512 prevents a direct connection between the electrical connection member 553 and the wireless communication circuit on PCB 550, thus preventing or reducing the transmission of electrostatic or noise signals introduced into PCB 550 through the conductive portion to the wireless communication circuit. In an embodiment, electrostatic or noise signals introduced into PCB 550 through the conductive portion can be induced and transmitted from the first coupling pad 5511 to the ground member 556 via discharge inductors (e.g., 557D, 557E, 557F, 557G, and 557H), thus effectively releasing the electrostatic or noise signals introduced into PCB 550 to the outside of PCB 550.

[0186] In the following description, for ease of description, the description of the grounding element 556 and the discharge inductor portion (e.g., 557D, 557E, 557F, 557G, and 557H) will be omitted from some embodiments, but it will be apparent to those skilled in the art that the above references Figures 5d to 5g The configurations of the described grounding element 556 and discharge inductor portions (e.g., 557D, 557E, 557F, 557G, and 557H) can be applied to other embodiments. For example, even if the individual descriptions and indications in the figures are omitted, embodiments of the PCB including the coupled power supply structure should be interpreted as including the configurations of the aforementioned grounding and discharge inductor portions, unless otherwise specified to exclude these configurations.

[0187] Figure 6a This is a partial cross-sectional view of a PCB according to an embodiment of the present disclosure. Figure 6b This is a partial top view of a PCB showing the discharge inductor portion according to an embodiment of the present disclosure.

[0188] refer to Figure 6a and Figure 6b According to an embodiment, PCB 650 may include a first coupling pad 6511, a second coupling pad 6512 disposed separately from the first coupling pad 6511, a dielectric 652 electrically insulating the first coupling pad 6511 and the second coupling pad 6512, and conductive portions connected to the first coupling pad 6511 to form an electrical path therewith and connected to side members (e.g., Figure 4a The conductive portion 4411) of the conductive portion 653 is connected to the second coupling pad 6512 to form an electrical path therewith and is connected to the wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 in the circuit includes signal line 654 and grounding element 656.

[0189] In this embodiment, the first coupling pad 6511 and the second coupling pad 6512 may be separately disposed to overlap along a first direction T of the PCB 650. A capacitor for indirect signal delivery may be formed between the first coupling pad 6511 and the second coupling pad 6512.

[0190] In an embodiment, the electrical connection member 653 may be configured to contact the first coupling pad 6511, but it can be configured via, for example, a conductive via (e.g., Figure 5a The first conductive via 5551 in the PCB is connected to it via a conductive connection line. In an embodiment, the electrical connection member 653 can be disposed on the surface of the PCB 650, for example, the first board surface 650a of the PCB 650. In an embodiment, the signal line 654 can be directly connected to the second coupling pad 6512, but it can also be connected via a conductive via (e.g., a conductive via 5551 in the PCB 650). Figure 5a The conductive connection line of the second conductive via 5552 is connected to the second coupling pad 6512. In an embodiment, the signal line 654 may be formed separately from the second coupling pad 6512 by means of the same or different material to connect to the second coupling pad 6512, or it may be integrally formed with the second coupling pad 6512 to extend from the second coupling pad 6512.

[0191] In one embodiment, grounding element 656 may be disposed on PCB 650 such that it is isolated from the first coupling pad 6511 and the second coupling pad 6512. For example, dielectric 652 may be disposed between grounding element 656 and the coupling pad to prevent direct connection between grounding element 656 and the coupling pad. In another embodiment, grounding element 656 may be disposed on a surface of PCB 650, for example, a second board surface 650b of PCB 650, such that it is connected to another structure outside PCB 650. In yet another embodiment, grounding element 656 may be disposed on substantially the same plane (i.e., substantially the same layer) as the first coupling pad 6511 relative to a first direction T of PCB 650.

[0192] In an embodiment, a discharge inductor portion 657 may be disposed between a ground member 656 and a first coupling pad 6511 to sense the delivery or transmission of electrical signals such as electrostatic or noise signals. The discharge inductor portion 657 may be connected to either the ground member 656 or to the first coupling pad 6511 disposed adjacent to the ground member 656, thereby narrowing the gap between the first coupling pad 6511 and the ground member 656. For example, in the case where the discharge inductor portion 657 is connected to the first coupling pad 6511 and protrudes toward the ground member 656, such as... Figure 6b As shown, a gap G can be formed between the discharge inductor portion 657 and the grounding member 656, wherein a dielectric 652 is provided.

[0193] Figure 7a This is a partial perspective view of a PCB according to an embodiment of the present disclosure. Figure 7b This is a partial perspective view of a PCB according to an embodiment of the present disclosure. Figure 7c This is a partial perspective view of a PCB according to an embodiment of the present disclosure. Figure 7d This is a partial perspective view of a PCB according to an embodiment of the present disclosure. Figure 7e This is a partial perspective view of a PCB according to an embodiment of the present disclosure. Figure 7f This is a partial perspective view of a PCB according to an embodiment of the present disclosure. Figure 7g This is a partial perspective view of a PCB according to an embodiment of the present disclosure. Figures 7a to 7f A partial area of ​​a PCB with a coupled power supply structure is shown, and various embodiments of the PCB will be described with reference to the accompanying drawings.

[0194] refer to Figure 7a According to an embodiment, PCB 750A (e.g., Figure 4a PCB 450 may include a plurality of coupled pads 751 (e.g., separately arranged to be electrically insulated by a dielectric 752) Figure 4a Coupling pads 451 and electrical connection components 753 (e.g., in the context of coupling pads 451 and electrical connection components 753) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 includes signal lines 754, multiple conductive vias 755, a grounding element 756, and / or a discharge inductor portion 757.

[0195] In an embodiment, the plurality of coupling pads 751 may include a plurality of first coupling pads 7511 connected to an electrical connection member 753 to form an electrical path, and a plurality of second coupling pads 7512 connected to a wireless communication circuit via a signal line 754 to form an electrical path. For example, the first coupling pads 7511 may include 1-1 coupling pads 7511-1 and / or 1-2 coupling pads 7511-2, and the second coupling pads 7512 may include 2-1 coupling pads 7512-1 and / or 2-2 coupling pads 7512-2. In an embodiment, at least one of the second coupling pads 7512 may be disposed between a pair of first coupling pads 7511 relative to a first direction T of the PCB 750A. For example, 2-1 coupling pads 7512-1 may be disposed overlappingly between 1-1 coupling pads 7511-1 and 1-2 coupling pads 7511-2. In an embodiment, a plurality of first coupling pads 7511 and a plurality of second coupling pads 7512 may be arranged along a first direction T of the PCB 750A (e.g., Figure 7a The pads (in the W-axis direction) are arranged alternately and overlappingly. For example, along the first direction T of PCB 750A, 1-1 coupling pads 7511-1, 2-1 coupling pads 7512-1, 1-2 coupling pads 7511-2 and 2-2 coupling pads 7512-2 can be arranged alternately and overlappingly.

[0196] In an embodiment, the plurality of conductive vias 755 may be configured to penetrate the PCB 750A in a first direction T. For example, the plurality of conductive vias 755 may include at least one first conductive via 7551 electrically connected to a first coupling pad 7511 and at least one second conductive via 7552 electrically connected to a second coupling pad 7512. In an embodiment, at least one second conductive via 7552 may connect the second coupling pad 7512 and a signal line 754 connected to a wireless communication circuit.

[0197] In one embodiment, a grounding element 756 may be disposed on the surface of PCB 750A. In another embodiment, the grounding element 756 may be disposed separately on PCB 750 while being electrically insulated from a plurality of coupling pads 751 via a dielectric 752. In another embodiment, relative to a first direction T of PCB 750A, the grounding element 756 may be disposed on the same layer (e.g., the same plane) as at least one of a plurality of first coupling pads 7511. For example, the grounding element 756 may be disposed on the same plane as 1-1 coupling pad 7511-1. In another embodiment, a discharge inductor portion 757 may be disposed between 1-1 coupling pad 7511-1 and the grounding element 756 to induce the delivery (or transmission) of electrical signals (such as electrostatic or noise signals) from 1-1 coupling pad 7511-1 toward the grounding element 756. For example, the discharge inductor portion 757 may be formed separately from the same or different material as the 1-1 coupling pad 7511-1 to be connected to the 1-1 coupling pad 7511-1, or it may be a protrusion formed as part of the 1-1 coupling pad 7511-1 protruding toward the grounding element 756.

[0198] When the discharge inductor portion 757 extends from the first coupling pad 7511 to the grounding member 756, a gap G can be formed between the discharge inductor portion 757 and the grounding member 756, wherein a dielectric 752 is disposed.

[0199] refer to Figure 7b According to an embodiment, PCB 750B (e.g., Figure 4a PCB 450 may include a plurality of coupled pads 751 (e.g., separately arranged to be electrically insulated via dielectric 752) Figure 4a Coupling pads 451 and electrical connection components 753 (e.g., in the context of coupling pads 451 and electrical connection components 753) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 includes a signal line 754, multiple conductive vias 755, a grounding element 756, and / or a discharge inductor portion 757 for reducing the gap G between the grounding element 756 and the first coupling pad 7511.

[0200] In an embodiment, the plurality of coupling pads 751 may include a plurality of first coupling pads 7511 electrically connected through at least one first conductive via 7551, and a plurality of second coupling pads 7512 electrically connected through at least one second conductive via 7552. The first coupling pads 7511 may be connected to an electrical connection member 753 to form an electrical path. The second coupling pads 7512 may be connected to a signal line 754 connected to a wireless communication circuit to form an electrical path. In an embodiment, the plurality of first coupling pads 7511 may include 1-1 coupling pads 7511-1 and / or 1-2 coupling pads 7511-2 spaced apart along a first direction T of the PCB 750B. The plurality of second coupling pads 7512 may include 2-1 coupling pads 7512-1 and / or 2-2 coupling pads 7512-2 spaced apart along the first direction T of the PCB 750B. The plurality of first coupling pads 7511 and second coupling pads 7512 may be alternately arranged along the first direction T of the PCB 750B. When viewing the PCB 750 in the first direction T, the first coupling pads 7511 and the second coupling pads 7512 that are adjacent to each other can at least partially overlap each other. In an embodiment, the plurality of coupling pads 751 can transmit electrical signals in a non-contact manner through the capacitance formed in the overlapping area between the first coupling pads 7511 and the second coupling pads 7512 that are adjacent to each other.

[0201] In an embodiment, the electrical connection member 753 can be connected to the first coupling pad 7511 via a conductive material connection line 7531. For example, the connection line 7531 can be formed separately from the first coupling pad 7511, either from the same or a different material, and can also be an extension formed as part of the first coupling pad 7511 extending into the electrical connection member 753. A signal line 754 connected to the wireless communication circuit can be connected to the second coupling pad 7512 via a conductive material connection line 7541. For example, the signal line 754 can be formed separately from the second coupling pad 7512, either from the same or a different material, and can also be an extension formed as part of the second coupling pad 7512.

[0202] refer to Figure 7c According to an embodiment, PCB 750C (e.g., Figure 4a PCB 450 may include a plurality of coupled pads 751 (e.g., separately arranged to be electrically insulated via dielectric 752) Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4a Electrical connection member 753 (e.g., conductive portion 4411) in the conductive portion 4411) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 in the circuit contains signal lines 754 and / or multiple conductive vias 755.

[0203] In an embodiment, the plurality of coupling pads 751 may include a plurality of first coupling pads 7511 electrically connected to the electrical connection member 753 and a plurality of second coupling pads 7512 electrically connected to the signal line 754. For example, the plurality of first coupling pads 7511 may include 1-1 coupling pad 7511-1 and / or 1-2 coupling pad 7511-2. In an embodiment, the plurality of first coupling pads 7511 may be electrically connected via a first conductive via 7551. The plurality of second coupling pads 7512 may be connected to the signal line 754 via a second conductive via 7552. In an embodiment, the second coupling pads 7512 may be disposed between the 1-1 coupling pad 7511-1 and the 1-2 coupling pad 7511-2 relative to a first direction T of the PCB 750C. A capacitor for non-contact signal delivery (or transmission) may be formed between the second coupling pads 7512 and each of the first coupling pads 7511.

[0204] refer to Figure 7d According to an embodiment, PCB 750D (e.g., Figure 4a PCB 450 may include a plurality of coupled pads 751 (e.g., separated by dielectric 752 and electrically insulated from each other) Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4a Electrical connection member 753 (e.g., conductive portion 4411) in the conductive portion 4411) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 in the circuit contains signal lines 754 and / or multiple conductive vias 755.

[0205] In an embodiment, the plurality of coupling pads 751 may include a plurality of first coupling pads 7511 connected to an electrical connection member 753 to form an electrical path, and a plurality of second coupling pads 7512 connected to a signal line 754 to form an electrical path. For example, the plurality of first coupling pads 7511 may include 1-1 coupling pad 7511-1, 1-2 coupling pad 7511-2, and / or 1-3 coupling pad 7511-3. In an embodiment, the plurality of second coupling pads 7512 may include 2-1 coupling pad 7512-1, 2-2 coupling pad 7512-2, and / or 2-3 coupling pad 7512-3. In an embodiment, at least one of the plurality of second coupling pads 7512 may be disposed overlapping between a pair of first coupling pads 7511 relative to a first direction T of the PCB 750D. For example, when viewing PCB 750D along the first direction T, 2-1 coupling pads 7512-1 can be arranged overlappingly between 1-1 coupling pads 7511-1 and 1-2 coupling pads 7511-2, and 2-2 coupling pads 7512-2 can be arranged overlappingly between 1-2 coupling pads 7511-2 and 1-3 coupling pads 7511-3. In an embodiment, a plurality of first coupling pads 7511 and a plurality of second coupling pads 7512 can be arranged alternately along the first direction T of PCB 750D, such that they at least partially overlap each other. For example, along the first direction T of PCB 750D, three first coupling pads 7511-1, 7511-2, and 7511-3 and three second coupling pads 7512-1, 7512-2, and 7512-3 can be arranged alternately, such that they at least partially overlap. In an embodiment, a capacitance for contactless signal delivery can be formed between adjacent first coupling pads 7511 and second coupling pads 7512 relative to a first direction T of the PCB 750D. The total capacitance formed between the plurality of coupling pads 751 can be greater than or equal to the sum of the individual capacitances formed between adjacent first coupling pads 7511 and second coupling pads 7512.

[0206] In an embodiment, the plurality of conductive vias 755 may include a plurality of first conductive vias 7551 electrically connected to a plurality of first coupling pads 7511, and a plurality of second conductive vias 7552 electrically connected to a plurality of second coupling pads 7512. In an embodiment, the plurality of first conductive vias 7551 may electrically connect a pair of first coupling pads 7511 disposed adjacent to each other along a first direction T of the PCB 750D. For example, the first conductive vias 7551 may be disposed between 1-1 coupling pad 7511-1 and 1-2 coupling pad 7511-2, and between 1-2 coupling pad 7511-2 and 1-3 coupling pad 7511-3. In an embodiment, the plurality of second conductive vias 7552 may electrically connect a pair of second coupling pads 7512 disposed adjacent to each other along the first direction T of the PCB 750D. For example, a second conductive via 7552 can be disposed between 2-1 coupling pad 7512-1 and 2-2 coupling pad 7512-2, and between 2-2 coupling pad 7512-2 and 2-3 coupling pad 7512-3. In an embodiment, when the signal line 754 connected to the wireless communication circuit is separately disposed from the second coupling pad 7512 via a dielectric 752, at least one second connecting conductive via 7552a can electrically connect the second coupling pad 7512 and the signal line 754.

[0207] refer to Figure 7e According to an embodiment, PCB 750E (e.g., Figure 4a PCB 450 may include a plurality of coupled pads 751 (e.g., separately arranged to be electrically insulated via dielectric 752) Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4a Electrical connection member 753 (e.g., conductive portion 4411) in the conductive portion 4411) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 in the circuit contains signal lines 754 and / or multiple conductive vias 755.

[0208] In an embodiment, the plurality of coupling pads 751 may include a plurality of first coupling pads 7511 connected to the electrical connection member 753 to form an electrical path, and a plurality of second coupling pads 7512 connected to the signal line 754 to form an electrical path. In an embodiment, the plurality of second coupling pads 7512 may be connected to the signal line 754 through at least one conductive via 7522a. In an embodiment, the first coupling pads 7511 may include 1-1 coupling pad 7511-1, 1-2 coupling pad 7511-2, and / or 1-3 coupling pad 7511-3. In an embodiment, the second coupling pads 7512 may include 2-1 coupling pad 7512-1, 2-2 coupling pad 7512-2, 2-3 coupling pad 7512-3, and / or 2-4 coupling pad 7512-4. In an embodiment, the plurality of first coupling pads 7511 may be electrically connected through at least one first conductive via 7551. Multiple second coupling pads 7512 can be electrically connected through at least one second conductive via 7552.

[0209] In an embodiment, along a first direction T of the PCB 750E, a plurality of coupling pads 751 can form a plurality of coupling pad sets, the plurality of coupling pad sets including at least one first coupling pad 7511 and at least one second coupling pad 7512 arranged adjacent to each other. For example, 1-1 coupling pads 7511-1 and 2-1 coupling pads 7512-1 can be arranged adjacent to each other to form a first coupling pad set; 2-2 coupling pads 7512-2, 1-2 coupling pads 7511-2 and 2-3 coupling pads 7512-3 can form a second coupling pad set; and 1-3 coupling pads 7511-3 and 2-4 coupling pads 7512-4 can form a third coupling pad set.

[0210] In an embodiment, various gaps or distances (e.g., d1, d3, d4, and d6) may exist between the first coupling pad 7511 and the second coupling pad 7512 forming a coupling pad set relative to the first direction T of the PCB 750E. For example, the distance d1 between the 1-1 coupling pad 7511-1 and the 2-1 coupling pad 7512-1 forming the first coupling pad set, the distances d3 and d4 between the 2-2 coupling pad 7512-2 and the 1-2 coupling pad 7511-2 forming the second coupling pad set, and between the 1-2 coupling pad 7511-2 and the 2-3 coupling pad 7512-3 forming the second coupling pad set, and the distance d6 between the 1-3 coupling pad 7511-3 and the 2-4 coupling pad 7512-4 forming the third coupling pad set, may be smaller than the distance d2 between the first and second coupling pad sets and the distance d5 between the second and third coupling pad sets. In an embodiment, the distance d2 between the first and second coupled pad sets and the distance d5 between the second and third coupled pad sets may be different from each other. In an embodiment, the distances d1, d3, d4, and d6 between the first coupled pad 7511 and the second coupled pad 7512 forming the corresponding coupled pad sets may be substantially the same, but the example is not limited thereto, and they may also be different from each other.

[0211] refer to Figure 7f According to an embodiment, PCB 750F (e.g., Figure 4a PCB 450 may include a plurality of coupled pads 751 (e.g., separately arranged to be electrically insulated via dielectric 752) Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4a Electrical connection member 753 (e.g., conductive portion 4411) in the conductive portion 4411) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 in the circuit contains signal lines 754 and / or multiple conductive vias 755.

[0212] In an embodiment, the plurality of coupling pads 751 may include a plurality of first coupling pads 7511 electrically connected to the electrical connection member 753 and a plurality of second coupling pads 7512 electrically connected to the signal line 754. In an embodiment, the first coupling pads 7511 may include 1-1 coupling pad 7511-1, 1-2 coupling pad 7511-2, and / or 1-3 coupling pad 7511-3. The plurality of first coupling pads 7511 may be electrically connected via a first conductive via 7551. In an embodiment, the second coupling pads 7512 may include 2-1 coupling pad 7512-1, 2-2 coupling pad 7512-2, and 2-3 coupling pad 7512-3. In an embodiment, the plurality of second coupling pads 7512 may be connected to the signal line 754 via at least one conductive via 7522a. In an embodiment, at least one second coupling pad 7512 may be disposed between a pair of first coupling pads 7511 relative to a first direction T of the PCB 750F. In an embodiment, a plurality of first coupling pads 7511 and a plurality of second coupling pads 7512 may be alternately arranged such that they at least partially overlap along a first direction T of the PCB 750F.

[0213] In an embodiment, along a first direction T of the PCB 750F, a plurality of coupling pads 751 can form a plurality of coupling pad sets, the plurality of coupling pad sets including at least one first coupling pad 7511 and at least one second coupling pad 7512 arranged adjacent to each other. For example, 1-1 coupling pads 7511-1, 2-1 coupling pads 7512-1 and 1-2 coupling pads 7511-2 can be arranged adjacent to each other to form a first coupling pad set. 2-2 coupling pads 7512-2, 1-3 coupling pads 7511-3 and 2-3 coupling pads 7512-3 can be arranged adjacent to each other to form a second coupling pad set. In an embodiment, the distances (e.g., d1, d2, d4 and d5) between the first coupling pads 7511 and the second coupling pads 7512 forming a coupling group can be less than the distance d3 between adjacent coupling pad sets.

[0214] In an embodiment, the thickness of each of the plurality of coupling pads 751 and the distance between adjacent coupling pads (e.g., the thickness of the dielectric 752 disposed between adjacent coupling pads) may be different relative to the first direction T of the PCB 750F. For example, 1-1 coupling pad 7511-1 and 1-2 coupling pad 7511-2 may have a thickness 1-1 t1-1 and a thickness 1-2 t1-2, respectively, and 2-1 coupling pad 7512-1 disposed adjacent to 1-1 coupling pad 7511-1 and 1-2 coupling pad 7511-2 may have a thickness 2-1 t2-1 greater than the thicknesses 1-1 t1-1 and 1-2 t1-2. For example, 2-2 coupling pads 7512-2 and 2-3 coupling pads 7512-3 can have a thickness of 2-2 t2-2 and a thickness of 2-3 t2-3, respectively, and a 1-3 coupling pad 7511-3 disposed between the 2-2 coupling pads 7512-2 and the 2-3 coupling pads 7512-3 can have a thickness of 1-3 t1-3 greater than the thicknesses of 2-2 t2-2 and 2-3 t2-3. For example, the thicknesses of the plurality of coupling pads 751 can be the same or at least partially different from each other, and the distances between adjacent coupling pads 7511 and 7512 can also be the same or at least partially different from each other. Depending on the difference in the thickness of the coupling pads 751, the capacitance formed between adjacent coupling pads 7511 and 7512 can vary. Depending on the distance between adjacent coupling pads 7511 and 7512, the thickness of the dielectric 752 disposed between the coupling pads 7511 and 7512 can vary, and therefore the capacitance formed between the adjacent coupling pads 7511 and 7512 can be disposed differently.

[0215] refer to Figure 7g According to an embodiment, PCB 750G (e.g., Figure 4a PCB 450 may include a plurality of coupled pads 751 (e.g., separately arranged to be electrically insulated via dielectric 752) Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4a Electrical connection member 753 (e.g., conductive portion 4411) in the conductive portion 4411) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 in the circuit contains signal lines 754 and / or multiple conductive vias 755.

[0216] In one embodiment, the plurality of coupling pads 751 may include a first coupling pad 7511 electrically connected to an electrical connection member 753 and a plurality of second coupling pads 7512 electrically connected to a signal line 754. In another embodiment, the first coupling pad 7511 may be electrically connected to the electrical connection member 753 via a first conductive via 7551. In another embodiment, the second coupling pads 7512 may include a 2-1 coupling pad 7512-1 and a 2-2 coupling pad 7512-2. In yet another embodiment, the plurality of second coupling pads 7512 may be electrically connected to each other via a second conductive via 7552.

[0217] In an embodiment, a first coupling pad 7511 may be disposed between a pair of second coupling pads 7512 relative to a first direction T of the PCB 750G. For example, the first coupling pad 7511 may be disposed on a layer disposed between coupling pads 7512-1 (2-1) and 7512-2 (2-2). In an embodiment, the first coupling pad 7511 and the pair of second coupling pads 7512 may be alternately disposed to at least partially overlap along the first direction T of the PCB 750G.

[0218] Figure 8a This is a partial perspective view of a PCB according to an embodiment of the present disclosure. Figure 8b This is an exploded perspective view showing the layer structure of a portion of a PCB according to an embodiment of the present disclosure.

[0219] refer to Figure 8a and Figure 8b According to an embodiment, PCB 850 (e.g., Figure 4a The PCB 450 may include a plurality of coupled pads 851, separately arranged to be electrically insulated via a dielectric 852 (e.g., Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4a Electrical connection member 853 (e.g., conductive portion 4411) in the conductive portion 4411) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 in the circuit contains signal lines 854 and / or multiple conductive vias 855.

[0220] In an embodiment, the plurality of coupling pads 851 may include a plurality of first coupling pads 8511 electrically connected through at least one first conductive via 8551, and a plurality of second coupling pads 8512 electrically connected through at least one second conductive via 8552. For example, the plurality of first coupling pads 8511 and the plurality of second coupling pads 8512 may be alternately arranged along a first direction T of the PCB 850, and when the PCB 850 is viewed in the first direction T, adjacent first coupling pads 8511 and second coupling pads 8512 may at least partially overlap. For example, the first coupling pads 8511 may include 1-1 coupling pads 8511-1, 1-2 coupling pads 8511-2 and / or 1-3 coupling pads 8511-3. For example, the second coupling pads 8512 may include 2-1 coupling pads 8512-1, 2-2 coupling pads 8512-2 and / or 2-3 coupling pads 8512-3.

[0221] In an embodiment, the overlap area between adjacent first coupling pads 8511 and second coupling pads 8512 relative to the first direction T of the PCB 850 can be different. For example, the overlap area between adjacent first coupling pads 8511 and second coupling pads 8512 among a plurality of coupling pads 851 can have an irregular form. For example, the coupling pads 851 can have different shapes. For example, as Figure 8b As shown, when viewing PCB 850 in the first direction T, the overlapping area between adjacent 1-1 coupling pads 8511-1 and 2-1 coupling pads 8512-1 can be different from the overlapping area between 2-1 coupling pads 8512-1 and 1-2 coupling pads 8511-2. For example, when viewing PCB 850 along the first direction T, 2-2 coupling pads 8512-2 and 2-3 coupling pads 8512-3 can have different shapes, and therefore the overlapping areas relative to the 1-3 coupling pads 8511-3 disposed therebetween can be set differently. Since the overlapping areas between the first coupling pads 8511 and the second coupling pads 8512, which are adjacent to each other along the first direction T of PCB 850, are different, the corresponding capacitances formed between the adjacent first coupling pads 8511 and the second coupling pads 8512 can be set to different amplitudes.

[0222] Figure 9a This is a partial perspective view of a PCB according to an embodiment of the present disclosure. Figure 9b This is an exploded perspective view showing the layer structure of a portion of a PCB according to an embodiment of the present disclosure.

[0223] refer to Figure 9a and Figure 9b According to an embodiment, PCB 950 (e.g., Figure 4aPCB 450 may include a plurality of coupled pads 951 (e.g., separately arranged to be electrically insulated via dielectric 952) Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4a Electrical connection member 953 (e.g., conductive portion 4411) in the conductive portion 4411) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 in the circuit contains signal lines 954 and / or multiple conductive vias 955.

[0224] In an embodiment, the plurality of coupling pads 951 may include a plurality of first coupling pads 9511 electrically connected through at least one first conductive via 9551 and a plurality of second coupling pads 9512 electrically connected through at least one second conductive via 9552. In an embodiment, the plurality of first coupling pads 9511 may be separately arranged along a first direction T of the PCB 950. For example, the plurality of first coupling pads 9511 may include coupling pad 9511-1 (1-1), coupling pad 9511-2 (1-2), coupling pad 9511-3 (1-3), coupling pad 9511-4 (1-4), and coupling pad 9511-5 (1-5). In an embodiment, the plurality of second coupling pads 9512 may be separately arranged along the first direction T of the PCB 950. For example, a plurality of second coupling pads 9512 may include 2-1 coupling pad 9512-1, 2-2 coupling pad 9512-2, 2-3 coupling pad 9512-3, 2-4 coupling pad 9512-4, and 2-5 coupling pad 9512-5. In an embodiment, when the PCB 950 is viewed in a first direction T, the first coupling pads 9511 and second coupling pads 9512 arranged adjacent to each other may at least partially overlap. For example, relative to the first direction T of the PCB 950, 2-2 coupling pads 9512-2 can be overlapped between 1-1 coupling pads 9511-1 and 1-3 coupling pads 9511-3; 2-3 coupling pads 9512-3 can be overlapped between 1-3 coupling pads 9511-3 and 1-5 coupling pads 9511-5; and 2-4 coupling pads 9512-4 can overlap with 1-4 coupling pads 9511-4. In embodiments, the overlap areas between adjacent first coupling pads 9511 and second coupling pads 9512 relative to the first direction T of the PCB 950 can be different. For example, the overlap areas between adjacent first coupling pads 9511 and second coupling pads 9512 among a plurality of coupling pads 951 can have irregular forms. For example, the coupling pads 951 can have different shapes.

[0225] In an embodiment, at least one first coupling pad 9511 and at least one second coupling pad 9512 may be disposed on substantially the same layer relative to a first direction T of the PCB 950. For example, when viewed along a direction perpendicular to the first direction T of the PCB 950, at least one first coupling pad 9511 and at least one second coupling pad 9512 may be configured to at least partially overlap each other. For example, when viewed in a direction perpendicular to the first direction T of the PCB 950 (e.g., the V-axis direction), 1-1 coupling pad 9511-1 and 2-1 coupling pad 9512-1 may be disposed overlapping. When viewed in a direction perpendicular to the first direction T of the PCB 950 (e.g., the V-axis direction and the U-axis direction, respectively), 1-2 coupling pad 9511-2 and 2-2 coupling pad 9512-2 may be configured to overlap each other. When viewed in a second direction perpendicular to the first direction T of the PCB 950 (e.g., the V-axis and U-axis directions, respectively), the 1-4 coupling pads 9511-4 and 2-3 coupling pads 9512-3 can be configured to overlap each other. Similarly, when viewed in a second direction perpendicular to the first direction T of the PCB 950 (e.g., the V-axis and U-axis directions, respectively), the 1-5 coupling pads 9511-5 and 2-4 coupling pads 9512-4 can be configured to overlap each other.

[0226] In an embodiment, a plurality of coupling pads 951 may form a capacitance between first coupling pads 9511 and second coupling pads 9512 that are overlapped along a first direction T of the PCB 950 (e.g., capacitance formed along the first direction T of the PCB 950). Simultaneously, the plurality of coupling pads 951 may also form a capacitance between first coupling pads 9511 and second coupling pads 9512 disposed on the same layer (or plane) (e.g., capacitance formed between overlapping regions in the U-axis or V-axis direction). For example, the capacitance between the first coupling pads 9511 and second coupling pads 9512 formed in the first direction T of the PCB 950 (and also in the planar direction of the PCB 950) can be used to determine the total capacitance formed by the plurality of coupling pads 951.

[0227] Figure 10 This is a partial perspective view of a PCB according to an embodiment of the present disclosure.

[0228] refer to Figure 10 According to an embodiment, PCB 1050 (e.g., Figure 4a PCB 450 may include a plurality of coupled pads 1051 (e.g., separately arranged to be electrically insulated via dielectric 1052) Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4aElectrical connection member 1053 (e.g., conductive portion 4411) in the conductive portion 4411) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 in the circuit contains signal lines 1054 and / or multiple conductive vias 1055.

[0229] In an embodiment, PCB 1050 may include a first board surface 1050a and a second board surface 1050b exposed to the outside relative to a first direction T. In an embodiment, an electrical connection member 1053 may be disposed on the first board surface 1050a of PCB 1050. In an embodiment, a grounding member (e.g., Figure 5b The grounding element 556 can be set on the first board surface 1050a or the second board surface 1050b of the PCB 1050.

[0230] In an embodiment, the plurality of coupling pads 1051 may include a plurality of first coupling pads 10511 electrically connected through at least one first conductive via 10551 and a plurality of second coupling pads 10512 electrically connected through at least one second conductive via 10552. In an embodiment, the plurality of first coupling pads 10511 and the plurality of second coupling pads 10512 may be alternately arranged along a first direction T of the PCB 1050. When viewing the PCB 1050 along the first direction T, the first coupling pads 10511 and second coupling pads 10512 arranged adjacent to each other may be configured to at least partially overlap each other. For example, the plurality of first coupling pads 10511 may include 1-1 coupling pad 10511-1 and 1-2 coupling pad 10511-2. The plurality of second coupling pads 10512 may include 2-1 coupling pad 10512-1 and 2-2 coupling pad 10512-2.

[0231] In this embodiment, multiple coupling pads 1051 can be disposed inside the PCB 1050 such that they are not exposed to the outside of the PCB 1050, for example, on the first board surface 1050a and the second board surface 1050b. For example, a dielectric 1052 can be disposed on the outer surface of coupling pad 10511-1 in the direction of the first board surface 1050a, and on the outer surface of coupling pad 10512-2 in the direction of the second board surface 1050b. In this case, the dielectric 1052 can be used so that the multiple coupling pads 1051 are not exposed to the outside of the PCB 1050.

[0232] Figure 11 This is a partial perspective view of a PCB according to an embodiment of the present disclosure.

[0233] refer to Figure 11According to an embodiment, PCB 1150 (e.g., Figure 4a PCB 450 may include a plurality of coupled pads 1151 (e.g., separately arranged to be electrically insulated via dielectric 1152) Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4a Electrical connection member 1153 (e.g., conductive portion 4411) in the conductive portion 4411) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 in the circuit contains signal lines 1154 and / or multiple conductive vias 1155.

[0234] In an embodiment, the plurality of coupling pads 1151 may include a plurality of first coupling pads 11511 electrically connected through at least one first conductive via 11551 and a plurality of second coupling pads 11512 electrically connected through at least one second conductive via 11552. In an embodiment, the plurality of first coupling pads 11511 may be separately arranged along a first direction T of the PCB 1150. For example, the plurality of first coupling pads 11511 may include 1-1 coupling pad 11511-1, 1-2 coupling pad 11511-2, and 1-3 coupling pad 11511-3. In an embodiment, the plurality of second coupling pads 11512 may be separately arranged along the first direction T of the PCB 1150. For example, the plurality of second coupling pads 11512 may include 2-1 coupling pad 11512-1 and 2-2 coupling pad 11512-2.

[0235] In an embodiment, when viewed in the first direction T, at least one first coupling pad 11511 and a second coupling pad 11512 can be configured to at least partially overlap with the PCB 1150. For example, when viewing the PCB 1150 along the first direction T, a 2-2 coupling pad 11512-2 can be disposed between a 1-2 coupling pad 11511-2 and a 1-3 coupling pad 11511-3, and at least a portion thereof can overlap with both the 1-2 coupling pad 11512-2 and the 1-3 coupling pad 11511-3.

[0236] In an embodiment, at least one first coupling pad 11511 and at least one second coupling pad 11512 may be disposed on the same layer of PCB 1150 relative to a first direction T of PCB 1150. For example, 1-1 coupling pad 11511-1 and 2-1 coupling pad 11512-1 may be disposed on the same layer of PCB 1150 in the first direction T of PCB 1150, while being separated from each other via dielectric 1152. When viewed in a direction perpendicular to the first direction T of PCB 1150 (e.g., the V-axis direction), 1-1 coupling pad 11511-1 and 2-1 coupling pad 11512-1 may at least partially overlap. A capacitor may be formed between the overlapping areas of 1-1 coupling pad 11511-1 and 2-1 coupling pad 11512-1 in a direction perpendicular to the first direction T of PCB 1150 (e.g., the V-axis direction).

[0237] Figure 12 This is a partial perspective view of a PCB according to an embodiment of the present disclosure.

[0238] refer to Figure 12 According to an embodiment, PCB 1250 (e.g., Figure 4a PCB 450 may include a plurality of coupled pads 1251 (e.g., separately arranged to be electrically insulated via dielectric 1252) Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4a Electrical connection member 1253 (e.g., conductive portion 4411) in the conductive portion 4411) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 in the circuit contains signal lines 1254 and / or multiple conductive vias 1255.

[0239] In an embodiment, the plurality of coupling pads 1251 may include a plurality of first coupling pads 12511 electrically connected through at least one first conductive via 12551 and a plurality of second coupling pads 12512 electrically connected through at least one second conductive via 12552. In an embodiment, the plurality of first coupling pads 12511 may be separately arranged along a first direction T of the PCB 1150. For example, the plurality of first coupling pads 12511 may include 1-1 coupling pad 12511-1, 1-2 coupling pad 12511-2, and 1-3 coupling pad 12511-3. In an embodiment, the plurality of second coupling pads 12512 may be separately arranged along the first direction T of the PCB 1250. For example, the plurality of second coupling pads 12512 may include 2-1 coupling pad 12512-1 and 2-2 coupling pad 12512-2.

[0240] In an embodiment, when viewed in the first direction T, at least one first coupling pad 12511 and a second coupling pad 12512 can be configured to at least partially overlap with the PCB 1250. For example, when viewing the PCB 1250 along the first direction T, a 2-2 coupling pad 12512-2 can be disposed between a 1-2 coupling pad 12511-2 and a 1-3 coupling pad 12511-3, and at least a portion thereof can overlap with the 1-2 coupling pad 12511-2 and the 1-3 coupling pad 12511-3. In an embodiment, a capacitor can be formed on the PCB 1250 in the first direction T between the first coupling pads 12511 and the second coupling pad 12512 disposed adjacent to each other.

[0241] In an embodiment, at least one first coupling pad 12511 and at least one second coupling pad 12512 may be disposed on the same layer of the PCB 1250 relative to a first direction T of the PCB 1150. For example, 1-1 coupling pads 12511-1 and 2-1 coupling pads 12512-1 may be disposed on the same layer. In an embodiment, the first coupling pads 12511 and second coupling pads 12512 disposed on the same layer may each include a plurality of pad portions alternately disposed in a direction perpendicular to the first direction T of the PCB 1250. For example, 1-1 coupling pads 12511-1 may include a plurality of 1-1 pad portions 12511a extending in the +V direction and separated from each other, and 2-1 coupling pads 12512-1 may include a plurality of 2-1 pad portions 12512a extending in the -V direction and separated from each other. In one embodiment, a plurality of 1-1 pad portions 12511a and a plurality of 2-1 pad portions 12512a may be alternately arranged along a direction perpendicular to a first direction T of the PCB 1250 (e.g., the U-axis direction), while being separated by a dielectric 1252. In another embodiment, a capacitor may be formed between the 1-1 pad portions 12511a and 2-1 pad portions 12512a that may be arranged adjacent to each other in the U-axis direction.

[0242] Figure 13 This is a partial perspective view of a PCB according to an embodiment of the present disclosure.

[0243] refer to Figure 13 According to an embodiment, PCB 1350 (e.g., Figure 4a PCB 450 may include a plurality of coupled pads 1351 (e.g., separately arranged to be electrically insulated via dielectric 1352) Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4a Electrical connection member 1353 (e.g., conductive portion 4411) in the conductive portion 4411) Figure 4aElectrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 in the circuit contains signal lines 1354 and / or multiple conductive vias 1355.

[0244] In an embodiment, the plurality of coupling pads 1351 may include a plurality of first coupling pads 13511 electrically connected through at least one first conductive via 13551 and a plurality of second coupling pads 13512 electrically connected through at least one second conductive via 13552.

[0245] In an embodiment, at least one first coupling pad 13511 and at least one second coupling pad 13512 may be disposed on the same layer of the PCB 1350 relative to a first direction T of the PCB 1350. In an embodiment, the first coupling pad 13511 and the second coupling pad 13512 disposed on the same layer may each include a plurality of pad portions alternately disposed in a direction perpendicular to the first direction T of the PCB 1350. For example, the first coupling pad 13511 may include a 1-1 pad portion 13511a extending in the +V direction and a 1-2 pad portion 13511b extending in the +U direction. The second coupling pad 13512 may include a 2-1 pad portion 13512a extending in the -V direction and a 2-2 pad portion 13512b extending in the -U direction. In an embodiment, the pad portion of the first coupling pad 13511 and the pad portion of the second coupling pad 13512 may be alternately arranged at least partially along a first direction T perpendicular to the PCB 1350, while being separated by a dielectric 1352. For example, the 1-2-pad portion 13511b of the first coupling pad 13511 and the 2-2-pad portion 13512b of the second coupling pad 13512 may be alternately arranged along a direction perpendicular to the first direction T of the PCB 1350, such as the V-axis direction. In an embodiment, a capacitor may be formed in the V-axis direction between adjacent 1-2-pad portions 13511b and 2-2-pad portions 13512b. In an embodiment, a capacitor may be formed in the U-axis direction between adjacent 1-1 pad portions 13511a and 2-2 pad portions 13512b. In the U-axis direction, a capacitor can be formed between the 2-1 pad portion 13512a and the 1-2 pad portion 13511b, which are arranged adjacent to each other.

[0246] In an embodiment, when a plurality of first conductive vias 13551 are connected to a first coupling pad 13511 and a plurality of second conductive vias 13552 are connected to a second coupling pad 13512, a capacitor can be formed between the first conductive vias 13551 and the second conductive vias 13552 that are arranged adjacent to each other along a direction perpendicular to the first direction T of the PCB 1350.

[0247] Although for ease of description in Figure 13 The diagram shows that the first coupling pad 13511 and the second coupling pad 13512 are only disposed on the surface layer of the PCB 1350 (e.g., the surface facing the +W direction), but the PCB 1350 may have a plurality of first coupling pads 13511 and a plurality of second coupling pads 13512 disposed on layers of the PCB 1350 along a first direction T. In an embodiment, the first coupling pads 13511 and the second coupling pads 13512 disposed on the same layer of the PCB 1350 may form the same pattern and may be disposed along the first direction T of the PCB 1350.

[0248] Figure 14a This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure. Figure 14b This is a schematic diagram illustrating the circuit connection structure of the side components, PCB, and wireless communication circuit according to an embodiment of the present disclosure. Figure 14c This is a partial perspective view of a PCB according to an embodiment of the present disclosure. Figure 14d This is an exploded perspective view showing the layer structure of a portion of a PCB according to an embodiment of the present disclosure.

[0249] refer to Figure 14a and Figure 14b According to an embodiment, the electronic device 1401 may include a housing (e.g., Figure 2a The housing 210 and PCB 1450 (e.g., Figure 3 PCBs 251 and 252 and wireless communication circuit 1490.

[0250] In an embodiment, the housing may include a front surface (e.g., Figure 2a (e.g., front surface 210a) and rear surface opposite the front surface (e.g., Figure 2b The rear surface 210b) and the sides (e.g., surrounding the interior space between the front and rear surfaces) Figure 2a Side 211c). In an embodiment, the housing may include side members 1440 that form at least a portion of the side and surround the interior space (e.g., side members 1440). Figure 3The side member 1440 (in the embodiment) may include a conductive portion 14411 formed of a conductive material. In an embodiment, the conductive portion 14411 may serve as a radiator for an antenna through which an electrical signal flows. In an embodiment, the side member 1440 may include at least one connection portion 14413 formed on the conductive portion 14411 and electrically connected to the PCB 1450. In an embodiment, the connection portion 14413 may serve as a feeder to which an electrical signal to be applied to the conductive portion 14411 is applied, or as a grounding element to which an electrical signal applied to the conductive portion 14411 escapes to ground.

[0251] In one embodiment, PCB 1450 may be disposed within the interior space of a housing. In another embodiment, PCB 1450 may include at least one electrical connection member 1453 electrically connected to a conductive portion 14411. In yet another embodiment, PCB 1450 may be electrically connected to a wireless communication circuit 1490. PCB 1450 may include multiple signal lines 14541 and 14542 connected to the wireless communication circuit 1490. For example, PCB 1450 may include a first signal line 14541 and a second signal line 14542, each connected to the wireless communication circuit 1490. The multiple signal lines 14541 and 14542 may be connected to different wireless communication circuits 1490, or they may be independently connected to a single wireless communication circuit 1490 to transmit and receive individual electrical signals. In another embodiment, PCB 1450 may form multiple electrical paths from the electrical connection member 1453 connected to a conductive portion 14411 via the respective signal lines 14541 and 14542 to the wireless communication circuit 1490. For example, PCB 1450 may form a first electrical path from electrical connection member 1453 to first signal line 14541 and a second electrical path from electrical connection member 1453 to second signal line 14542.

[0252] In an embodiment, PCB 1450 may include a plurality of coupling pads 1451 disposed on an electrical path. The plurality of coupling pads 1451 may electrically connect electrical connection member 1453 to signal lines 14541 and 14542 connected to wireless communication circuit 1490 via a non-contact coupling feed structure. In an embodiment, the plurality of coupling pads 1451 may include a first coupling pad 14511 connected to the electrical connection member 1453, a second coupling pad 14512 coupled to the first coupling pad 14511 and connected to the first signal line 14541, and a fourth coupling pad 14514 coupled to the first coupling pad 14511 and connected to the second signal line 14542. For example, the second coupling pad 14512 and the fourth coupling pad 14514 can each be coupled to the first coupling pad 14511 to form a capacitance between them, thereby forming an electrical path between the electrical connection member 1453 and the first signal line 14541, and an electrical path between the electrical connection member 1453 and the second signal line 14542. In an embodiment, the electronic device 1401 can selectively transmit electrical signals to an electrical connection member 1453 via the first signal line 14541 and the second signal line 14542 to use a conductive portion 14411 connected to the electrical connection member 1453 as an antenna for a different frequency band. In an embodiment, the wireless communication circuit 1490 may include a first circuit 14901 and a second circuit 14902 respectively connected to the first signal line 14541 and the second signal line 14542. In an embodiment, the wireless communication circuit 1490 can selectively transmit and receive electrical signals via one of the first signal line 14541 and the second signal line 14542 through a switching operation of the first circuit 14901 and the second circuit 14902.

[0253] refer to Figure 14c and Figure 14d According to an embodiment, PCB 1450 may include a plurality of coupling pads 1451 separately disposed to be electrically insulated via dielectric 1452, an electrical connection member 1453 adapted to be connected to a conductive portion 14411 of side member 1440, a first signal line 14541 and a second signal line 14542 connected to wireless communication circuit 1490, and a plurality of conductive vias 1455.

[0254] In one embodiment, the plurality of coupling pads 1451 may include a plurality of first coupling pads 14511, a plurality of second coupling pads 14512, and a plurality of fourth coupling pads 14514. In another embodiment, the plurality of first coupling pads 14511 may be connected to an electrical connection member 1453 to form an electrical path. In another embodiment, the plurality of second coupling pads 14512 may be connected to a wireless communication circuit 1490 via a first signal line 14541 to form an electrical path. In yet another embodiment, the plurality of fourth coupling pads 14514 may be connected to the wireless communication circuit 1490 via a second signal line 14542 to form an electrical path.

[0255] In one embodiment, at least one of a plurality of second coupling pads 14512 may be disposed between a pair of first coupling pads 14511 relative to a first direction T of the PCB 1450. When the PCB 1450 is viewed in the first direction T, the second coupling pads 14512 may at least partially overlap with adjacent first coupling pads 14511. In another embodiment, at least one of a plurality of fourth coupling pads 14514 may be disposed between a pair of first coupling pads 14511 relative to the first direction T of the PCB 1450. When the PCB 1450 is viewed in the first direction T, the fourth coupling pads 14514 may at least partially overlap with adjacent first coupling pads 14511.

[0256] In an embodiment, a plurality of first coupling pads 14511 and a plurality of second coupling pads 14512 may be alternately arranged along a first direction T of the PCB 1450. For example, the plurality of first coupling pads 14511 may include 1-1 coupling pad 14511-1, 1-2 coupling pad 14511-2, and 1-3 coupling pad 14511-3, and the plurality of second coupling pads 14512 may include 2-1 coupling pad 14512-1, 2-2 coupling pad 14512-2, and 2-3 coupling pad 14512-3, respectively, alternately arranged with the first coupling pads 14511-1, 14511-2, and 14511-3. In an embodiment, a plurality of first coupling pads 14511 and a plurality of fourth coupling pads 14514 may be alternately arranged along a first direction T of the PCB 1450. For example, a plurality of fourth coupling pads 14514 may include 4-1 coupling pads 14514-1, 4-2 coupling pads 14514-2, and 4-3 coupling pads 14514-3, and may be alternately arranged with 1-1 coupling pads 14511-1, 1-2 coupling pads 14511-2, and 1-3 coupling pads 14511-3 along a first direction T of the PCB 1450. In an embodiment, when viewed in the first direction T, adjacent first coupling pads 14511 and second coupling pads 14512 may at least partially overlap with the PCB 1450 and form a capacitance therebetween for indirect signal delivery or transmission between the electrical connection member 1453 and the first signal line 14541. In an embodiment, when viewed in the first direction T, the first coupling pad 14511 and the fourth coupling pad 14514, which are adjacent to each other, may at least partially overlap with the PCB 1450 and form a capacitor between them for indirect signal delivery or transmission between the electrical connection member 1453 and the second signal line 14542.

[0257] In an embodiment, the second coupling pad 14512 and the fourth coupling pad 14514 can be separated by insulating each other via dielectric 1452. In an embodiment, the second coupling pad 14512 and the fourth coupling pad 14514 can be disposed on the same layer, such as... Figure 14dAs shown in the diagram. For example, 2-1 coupling pads 14512-1 and 4-1 coupling pads 14514-1 can be disposed on the same layer, 2-2 coupling pads 14512-2 and 4-2 coupling pads 14514-2 can be disposed on the same layer, and 2-3 coupling pads 14512-3 and 4-3 coupling pads 14514-3 can be disposed on the same layer. However, this is provided only as an example, and at least one second coupling pad 14512 and at least one fourth coupling pad 14514 may not be disposed on the same layer. In embodiments, the second coupling pads 14512 and fourth coupling pads 14514 disposed on the same layer may have different overlap areas relative to adjacent first coupling pads 14511. In this case, for the same first coupling pad 14511, the capacitances formed by the second coupling pads 14512 and fourth coupling pads 14514 may be different, respectively.

[0258] In an embodiment, the plurality of conductive vias 1455 may include at least one first conductive via 14551 electrically connected to a plurality of first coupling pads 14511, at least one second conductive via 14552 electrically connected to a plurality of second coupling pads 14512, and at least one fourth conductive via 14554 electrically connected to a plurality of fourth coupling pads 14514. The first conductive vias 14551, the second conductive vias 14552, and the fourth conductive via 14554 may be electrically insulated from each other. For example, the plurality of conductive vias 1455 may not be directly connected to the first coupling pads 14511, the second coupling pads 14512, and the fourth coupling pads 14514.

[0259] Figure 15a This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure. Figure 15b This is a schematic diagram illustrating the circuit connection structure of the side components, PCB, and wireless communication circuit according to an embodiment of the present disclosure. Figure 15c This is a partial perspective view of a PCB according to an embodiment of the present disclosure. Figure 15d This is an exploded perspective view showing the layer structure of a portion of a PCB according to an embodiment of the present disclosure.

[0260] refer to Figures 15a to 15d According to an embodiment, electronic device 1501 may include a housing (e.g., Figure 2a The housing 210), PCB 1550 (e.g., Figure 3 PCBs 251 and 252 and wireless communication circuit 1590.

[0261] In an embodiment, the housing may include a front surface (e.g., Figure 2a (e.g., front surface 210a) and rear surface opposite the front surface (e.g., Figure 2bThe rear surface 210b) and the sides (e.g., surrounding the interior space between the front and rear surfaces) Figure 2a Side 211c). In an embodiment, the housing may include side members 1540 that form at least a portion of the side and surround the interior space (e.g., side members 211c). Figure 4a The side member 1540 (in the embodiment) may include a plurality of conductive portions 15411 formed of a conductive material. The plurality of conductive portions 15411 may be physically separated along the side by insulating portions 15412. For example, the side member 1540 may include a first conductive portion 15411-1 and a second conductive portion 15411-2 physically separated by insulating portions 15412. In an embodiment, conductive portions 15411-1 and 15411-2 may each serve as radiators for an antenna through which an electrical signal flows. In an embodiment, the side member 1540 may include one or more connection portions 15413 formed on the respective conductive portions 15411-1 and 15411-2 and electrically connected to the PCB 1550. In an embodiment, the connection portions 15413 may serve as feed lines to which electrical signals to be applied to the conductive portions 15411 corresponding to the connection portions 15413 are applied, or as grounding elements to which electrical signals applied to the conductive portions 15411 escape.

[0262] In one embodiment, the PCB 1550 may be disposed within the internal space of the housing. In another embodiment, the PCB 1550 may include a plurality of electrical connection members 15531 and 15532, respectively electrically connected to the first conductive portion 15411-1 and the second conductive portion 15411-2. For example, the plurality of electrical connection members 15531 and 15532 may include a first electrical connection member 15531 electrically connected to the first conductive portion 15411-1 and a second electrical connection member 15532 electrically connected to the second conductive portion 15411-2.

[0263] In one embodiment, PCB 1550 may be electrically connected to wireless communication circuit 1590. PCB 1550 may include signal lines 1554 connected to wireless communication circuit 1590. In another embodiment, PCB 1550 may form multiple electrical paths from electrical connection members 15531 and 15532, respectively connected to multiple conductive portions 15411-1 and 15411-2, to wireless communication circuit 1590. For example, PCB 1550 may form a first electrical path from a first electrical connection member 15531 connected to a first conductive portion 15411-1 to signal line 1554, and a second electrical path from a second electrical connection member 15532 connected to a second conductive portion 15411-2 to signal line 1554.

[0264] In an embodiment, the PCB 1550 may include a plurality of coupling pads 1551 disposed on an electrical path. The plurality of coupling pads 1551 can be electrically connected to the electrical connection member 1553 and the signal line 1554 connected to the wireless communication circuit 1590 via a non-contact coupling feed structure. In an embodiment, the plurality of coupling pads 1551 may include a first coupling pad 15511 connected to a first electrical connection member 15531, a third coupling pad 15513 connected to a second electrical connection member 15532, and a second coupling pad 15512 coupled to the first coupling pad 15511 and the third coupling pad 15513 and connected to the signal line 1554. For example, the second coupling pad 15512 may be coupled to the first coupling pad 15511 and the third coupling pad 15513 respectively to form independent capacitances between them, and thus can respectively form electrical paths between the first electrical connection member 15531 and the signal line 1554 and between the second electrical connection member 15532 and the signal line 1554. In an embodiment, the electronic device 1501 can selectively deliver electrical signals to a plurality of electrical connectors 15531 and 15532 via a signal line 1554, and selectively use any one of the first conductive portion 15411-1 connected to the first electrical connector 15531 and the second conductive portion 15411-2 connected to the second electrical connector 15532 as an antenna.

[0265] refer to Figure 15c and Figure 15d According to an embodiment, PCB 1550 may include a plurality of coupling pads 1551 separately disposed to be electrically insulated via dielectric 1552, electrical connection members 15531 and 15532 adapted to be connected to conductive portions 15411 of side member 1540, signal lines 1554 connected to wireless communication circuit 1590, and a plurality of conductive vias 1555.

[0266] In one embodiment, the plurality of coupling pads 1551 may include a plurality of first coupling pads 15511, a plurality of third coupling pads 15513, and a plurality of second coupling pads 15512. In another embodiment, the plurality of first coupling pads 15511 may be electrically connected to a first electrical connection member 15531. In yet another embodiment, the plurality of third coupling pads 15513 may be electrically connected to a second electrical connection member 15532. And in yet another embodiment, the plurality of second coupling pads 15512 may be electrically connected to a signal line 1554.

[0267] In one embodiment, at least one of a plurality of second coupling pads 15512 may be disposed between a pair of first coupling pads 15511 relative to a first direction T of the PCB 1550. When the PCB 1550 is viewed in the first direction T, the second coupling pad 15512 may at least partially overlap with the adjacent first coupling pad 15511. In another embodiment, at least one of a plurality of second coupling pads 15512 may be disposed between a pair of third coupling pads 15513 relative to the first direction T of the PCB 1550. When the PCB 1550 is viewed in the first direction T, the second coupling pad 15512 may at least partially overlap with the adjacent third coupling pad 15513.

[0268] In an embodiment, a plurality of first coupling pads 15511 and a plurality of second coupling pads 15512 may be alternately arranged along a first direction T of the PCB 1550. For example, the plurality of first coupling pads 15511 may include 1-1 coupling pad 15511-1, 1-2 coupling pad 15511-2, and 1-3 coupling pad 15511-3, and the plurality of second coupling pads 15512 may include 2-1 coupling pad 15512-1, 2-2 coupling pad 15512-2, and 2-3 coupling pad 15512-3, respectively, alternately arranged with the first coupling pads 15511. In an embodiment, a plurality of third coupling pads 15513 and a plurality of second coupling pads 15512 may be alternately arranged along a first direction T of the PCB 1550. For example, a plurality of third coupling pads 15513 may include 3-1 coupling pads 15513-1, 3-2 coupling pads 15513-2, and 3-3 coupling pads 15513-3, and may be alternately arranged with 2-1 coupling pads 15512-1, 2-2 coupling pads 15512-2, and 2-3 coupling pads 15512-3 along a first direction T of the PCB 1550. In an embodiment, when viewed in the first direction T, the first coupling pads 15511 and second coupling pads 15512 that are adjacent to each other may at least partially overlap with the PCB 1550, and a capacitance may be formed between them for indirect signal delivery or transmission between the first electrical connection member 15531 and the signal line 1554. In an embodiment, when viewed in the first direction T, the third coupling pad 15513 and the second coupling pad 15512, which are adjacent to each other, may at least partially overlap with the PCB 1550, and a capacitor may be formed between them for indirect signal delivery or transmission between the second electrical connection member 15532 and the signal line 1554.

[0269] In this embodiment, the first coupling pad 15511 and the third coupling pad 15513 can be separated and insulated from each other via a dielectric 1552. In this embodiment, the first coupling pad 15511 and the third coupling pad 15513 can be respectively disposed on the same layer, such as... Figure 15d As shown in the diagram. For example, 1-1 coupling pads 15511-1 and 3-1 coupling pads 15513-1 can be disposed on the same layer, 1-2 coupling pads 15511-2 and 3-2 coupling pads 15513-2 can be disposed on the same layer, and 1-3 coupling pads 15511-3 and 3-3 coupling pads 15513-3 can be disposed on the same layer. However, this is provided only as an example, and the first coupling pad 15511 and the third coupling pad 15513 may not be disposed on the same layer. In an embodiment, the first coupling pad 15511 and the third coupling pad 15513 disposed on the same layer may have different overlapping areas relative to the adjacent second coupling pad 15512. In this case, for the same second coupling pad 15512, the capacitances formed by the first coupling pad 15511 and the third coupling pad 15513 may be different, respectively.

[0270] In an embodiment, the plurality of conductive vias 1555 may include at least one first conductive via 15551 electrically connected to a plurality of first coupling pads 15511, at least one second conductive via 15552 electrically connected to a plurality of second coupling pads 15512, and at least one third conductive via 15553 electrically connected to a plurality of third coupling pads 15513. The first conductive vias 15551, the second conductive vias 15552, and the third conductive vias 15553 may be electrically insulated from each other. For example, the plurality of conductive vias 1555 may not be directly connected to the first coupling pads 15511, the second coupling pads 15512, and the third coupling pads 15513.

[0271] Figure 16a This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure. Figure 16b This is a partial perspective view of a PCB according to an embodiment of the present disclosure.

[0272] refer to Figure 16a and Figure 16b According to an embodiment, electronic device 1601 may include a housing (e.g., Figure 2a The housing 210), PCB 1650 (e.g., Figure 3 PCBs 251 and 252 in the figure) and wireless communication circuits (e.g., wireless communication circuit 490 in Figure 4).

[0273] In an embodiment, the housing may include a front surface (e.g., Figure 2a(e.g., front surface 210a) and rear surface opposite the front surface (e.g., Figure 2b The rear surface 210b) and the sides (e.g., surrounding the interior space between the front and rear surfaces) Figure 2a Side 211c). In an embodiment, the housing may include side members 1640 that form at least a portion of the side and surround the interior space (e.g., side members 1640). Figure 4a Side member 1640 (in the embodiment). In an embodiment, side member 1640 may include a plurality of conductive portions 16411 formed of a conductive material. The plurality of conductive portions 16411 may be physically separated along the sides by insulating portions 16412. For example, side member 1640 may include a physically separated first conductive portion 16411-1 and a second conductive portion 16411-2. In an embodiment, conductive portions 16411-1 and 16411-2 may each serve as radiators of an antenna through which an electrical signal flows. For example, conductive portions 16411-1 and 16411-2 may each serve as radiators of an antenna that transmits and receives wireless (or radio) signals in a frequency band corresponding to the electrical path length in the conductive portions 16411-1 and 16411-2 through which an applied electrical signal flows. In an embodiment, side member 1640 may include one or more connection portions 16413 formed on conductive portions 16411-1 and 16411-2 and electrically connected to PCB 1650.

[0274] In one embodiment, the PCB 1650 may be disposed within the internal space of the housing. In another embodiment, the PCB 1650 may include a plurality of electrical connection members 16531 and 16532, each electrically connected to different conductive portions 1641. For example, the plurality of electrical connection members 16531 and 16532 may include a first electrical connection member 16531 electrically connected to a first conductive portion 16411-1 and a second electrical connection member 16532 electrically connected to a second conductive portion 16411-2.

[0275] In an embodiment, PCB 1650 may include a plurality of coupling pads 1651 and 1651a for indirect signal delivery (or transmission) between a first conductive portion 16411-1 and a second conductive portion 16411-2. In an embodiment, the plurality of coupling pads 1651 and 1651a may be provided separately on PCB 1650 by being spaced apart from each other by a dielectric 1652. In an embodiment, the plurality of coupling pads 1651 may be electrically connected to the first conductive portion 16411-1 and the second conductive portion 16411-2 via a non-contact coupling feed structure. In an embodiment, the plurality of coupling pads 1651a, which are separately disposed from the plurality of coupling pads 1651 connecting the first conductive portion 16411-1 and the second conductive portion 16411-2, may connect the first conductive portion 16411-1 or the second conductive portion 16411-2 to a wireless communication circuit 1690 or a grounding element 1656.

[0276] In an embodiment, the plurality of coupling pads 1651 may include one or more first coupling pads 16511 connected to the first electrical connection member 16531 and one or more second coupling pads 16512 connected to the second electrical connection member 16532. For example, the first coupling pads 16511 may include 1-1 coupling pads 16511-1, 1-2 coupling pads 16511-2, and 1-3 coupling pads 16511-3. The second coupling pads 16512 may include 2-1 coupling pads 16512-1, 2-2 coupling pads 16512-2, and 2-3 coupling pads 16512-3. The plurality of first coupling pads 16511 may be electrically connected through a first conductive via 16551. The plurality of second coupling pads 16512 may be electrically connected through a second conductive via 16552. In an embodiment, PCB 1650 may also include additional coupling pads for connecting conductive portion 16411 to wireless communication circuit 1690 or for connecting conductive portion 16411 to grounding element 1656.

[0277] In an embodiment, at least one of a plurality of second coupling pads 16512 may be disposed between a pair of first coupling pads 16511 relative to a first direction T of the PCB 1650. In an embodiment, the plurality of first coupling pads 16511 and the plurality of second coupling pads 16512 may be alternately disposed along the first direction T of the PCB 1650. In an embodiment, when viewed in the first direction T, adjacent first coupling pads 16511 and second coupling pads 16512 may at least partially overlap with the PCB 1650, and a capacitance may be formed between them for indirect signal delivery (or transmission) between the first electrical connection member 16531 and the second electrical connection member 16532.

[0278] In an embodiment, multiple coupling pads 1651 can be non-contactly connected to a first conductive portion 16411-1 connected to a first electrical connection member 16531 and a second conductive portion 16411-2 connected to a second electrical connection member 16532 via a capacitance formed between the first coupling pad 16511 and the second coupling pad 16512. For example, when an electrical signal is applied to the first conductive portion 16411-1, the PCB 1650 can transmit the electrical signal applied to the first conductive portion 16411-1 to the second conductive portion 16411-2 through the coupling connection structure of the first coupling pad 16511 and the second coupling pad 16512. In this case, the first conductive portion 16411-1 and the second conductive portion 16411-2 can be used as a single radiator.

[0279] Figure 17a This is a partial perspective view of a PCB according to an embodiment of the present disclosure. Figure 17b This is a partial perspective view of a PCB according to an embodiment of the present disclosure. Figure 17c This is a graph showing the variation in radiation efficiency of an antenna with and without radiating elements on a PCB according to embodiments of the present disclosure.

[0280] refer to Figure 17a According to an embodiment, PCB 1750A (e.g., Figure 4a PCB 450 may include a plurality of coupled pads 1751 (e.g., separately arranged to be electrically insulated via dielectric 1752) Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4a Electrical connection member 1753 (e.g., conductive portion 4411) in the conductive portion 4411) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 includes line 1754, multiple conductive vias 1755, and radiating element 1756.

[0281] In an embodiment, the plurality of coupling pads 1751 may include a plurality of first coupling pads 17511 electrically connected to and connected to an electrical connection member 1753 via at least one first conductive via 17551, and a plurality of second coupling pads 17512 electrically connected to and connected to a signal line 1754 via at least one second conductive via 17552. In an embodiment, the plurality of first coupling pads 17511 may be separately arranged along a first direction T of the PCB 1750A. For example, the plurality of first coupling pads 17511 may include 1-1 coupling pad 17511-1, 1-2 coupling pad 17511-2, and 1-3 coupling pad 17511-3. In an embodiment, the plurality of second coupling pads 17512 may be separately arranged along the first direction T of the PCB 1750A. For example, a plurality of second coupling pads 17512 may include 2-1 coupling pad 17512-1, 2-2 coupling pad 17512-2 and 2-3 coupling pad 17512-3.

[0282] In an embodiment, when viewing PCB 1750A (or PCB 1750B) in a first direction T, at least one of the second coupling pads 17512 may be disposed between two of the first coupling pads 17511, and may at least partially overlap with two adjacent pads. In an embodiment, a plurality of first coupling pads 17511 and a plurality of second coupling pads 17512 may be alternately disposed along the first direction T of PCB 1750A or 1750B. In an embodiment, capacitance for indirect signal delivery (or transmission) may be formed between adjacent first coupling pads 17511 and second coupling pads 17512.

[0283] In an embodiment, the radiating member 1756 may be formed of a conductive material. In an embodiment, the radiating member 1756 may be physically spaced from a plurality of coupling pads 1751 via a dielectric 1752. In an embodiment, when viewing PCB 1750A in a first direction T, the radiating member 1756 may be arranged overlapping with a second coupling pad 17512. For example, the radiating member 1756 may be configured to at least partially overlap with a 2-1 coupling pad 17512-1. In an embodiment, the radiating member 1756 and the second coupling pad 17512 may be adapted to couple through an overlapping area on the first direction T of PCB 1750A. For example, a capacitor may be formed between the radiating member 1756 and the 2-1 coupling pad 17512-1 on the first direction T of PCB 1750A. In this case, when an electrical signal is applied to the second coupling pad 17512 via signal line 1754, the radiating member 1756 may indirectly receive the electrical signal from the second coupling pad 17512. The radiating element 1756 can be used as a radiator of an antenna, which forms a radiating pattern by receiving electrical signals from the second coupling pad 17512.

[0284] refer to Figure 17b According to an embodiment, PCB 1750B (e.g., Figure 4a PCB 450 in the diagram may include a plurality of coupled pads 1751 (e.g., physically separated via dielectric 1752) Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4a Electrical connection member 1753 (e.g., conductive portion 4411) in the conductive portion 4411) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The wireless communication circuit 490 in the PCB includes a signal line 1754, multiple conductive vias 1755, and a radiating member 1757. In an embodiment, the multiple coupling pads 1751 may include multiple first coupling pads 17511 electrically connected to and connected to an electrical connection member 1753 via at least one first conductive via 17551, and multiple second coupling pads 17512 electrically connected to and connected to the signal line 1754 via at least one second conductive via 17552. For example, the multiple first coupling pads 17511 may include 1-1 coupling pad 17511-1, 1-2 coupling pad 17511-2, and 1-3 coupling pad 17511-3, which are separately arranged along a first direction T of the PCB 1750B (or 1750A). In an embodiment, the multiple second coupling pads 17512 may be separately arranged along a first direction T of the PCB 1750B. For example, a plurality of second coupling pads 17512 may include 2-1 coupling pads 17512-1, 2-2 coupling pads 17512-2, and 2-3 coupling pads 17512-3. In an embodiment, when viewing PCB 1750B in a first direction T, at least one of the second coupling pads 17512 may be disposed between two of the first coupling pads 17511 and may at least partially overlap with two adjacent pads. In an embodiment, a plurality of first coupling pads 17511 and a plurality of second coupling pads 17512 may be alternately disposed along the first direction T of PCB 1750B. In an embodiment, capacitance for indirect signal delivery (or transmission) may be formed between adjacent first coupling pads 17511 and second coupling pads 17512.

[0285] In an embodiment, the radiating member 1757 may include a conductive pattern. For example, the radiating member 1757 may be a PCB embedded antenna (PEA) with a radiating pattern formed on its surface. In an embodiment, the radiating member 1757 may be directly connected to the signal line 1754. The radiating member 1757 may function as a radiator of an antenna, receiving and radiating electrical signals from a wireless communication circuit via the signal line 1754.

[0286] In an embodiment, with the radiating element 1757 disposed on the PCB 1750B, the radiation efficiency of the antenna can be improved when transmitting and receiving electrical signals in a specific frequency band. Figure 17c This is a graph showing the radiation efficiency of antennas with and without the radiating member 1757 having a conductive pattern, when an electrical signal is applied to use the same conductive part as the antenna. Figure 17c In the diagram, the horizontal axis represents the frequency band, and the vertical axis represents the total radiation efficiency. The solid line represents the frequency-specific radiation efficiency of the antenna when using radiating element 1757, and the dashed line represents the frequency-specific radiation efficiency of the antenna when not using radiating element 1757.

[0287] refer to Figure 17c This demonstrates that the antenna's radiation efficiency when using radiating element 1757 is significantly higher in a specific frequency band (e.g., the Wi-Fi band from 5 GHz to 6 GHz) compared to the radiation efficiency obtained without radiating element 1757. For example, it has been demonstrated that, when transmitting and receiving electrical signals in a specific frequency band via conductive portions, the antenna's radiation efficiency can be improved by additionally using radiating elements with corresponding radiation patterns.

[0288] Figure 18a This is a partial perspective view of a PCB according to an embodiment of the present disclosure. Figure 18b This is a partial cross-sectional view of a PCB according to an embodiment of the present disclosure.

[0289] refer to Figure 18a and Figure 18b According to an embodiment, PCB 1850 (e.g., Figure 4a PCB 450 in the diagram may include a plurality of coupled pads 1851 (e.g., physically separated via dielectric 1852) Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4a Electrical connection member 1853 (e.g., conductive portion 4411) in the conductive portion 4411) Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The signal line 1854 of the wireless communication circuit 490 in the circuit (e.g., Figure 4a The signal line 454 and multiple conductive vias 1855 are included.

[0290] In an embodiment, the plurality of coupling pads 1851 may include a plurality of first coupling pads 18511 connected to the electrical connection member 1853 and a plurality of second coupling pads 18512 connected to the signal line 1854. For example, the plurality of first coupling pads 18511 may include 1-1 coupling pad 18511-1, 1-2 coupling pad 18511-2, and 1-3 coupling pad 18511-3, and the plurality of second coupling pads 18512 may include 2-1 coupling pad 18512-1, 2-2 coupling pad 18512-2, and 2-3 coupling pad 18512-3. In an embodiment, when the PCB 1850 is viewed in a first direction T, at least one second coupling pad 18512 may be disposed between a pair of first coupling pads 18511 and may at least partially overlap with the adjacent first coupling pad 18511. In one embodiment, a plurality of first coupling pads 18511 and a plurality of second coupling pads 18512 may be alternately arranged along a first direction T (e.g., the W-axis direction) of the PCB 1850. In another embodiment, a capacitor for indirect signal delivery (or transmission) may be formed between overlapping areas of adjacent first coupling pads 18511 and second coupling pads 18512.

[0291] In an embodiment, at least one first conductive via 18551 can penetrate the PCB 1850 in the first direction T and electrically connect a plurality of first coupling pads 18511. At least one second conductive via 18552 can penetrate the PCB 1850 in the first direction T and electrically connect a plurality of second coupling pads 18512.

[0292] In an embodiment, at least one of the plurality of conductive vias 1855 may be connected to a switch 1859, which is adapted to selectively disconnect the electrical connection between coupling pads via the conductive via. For example, as Figure 18b As shown, a first conductive via 18551 can be connected to a plurality of switches 1859 to selectively disconnect corresponding electrical connections to 1-1 coupling pads 18511-1, 1-2 coupling pads 18511-2, and 1-3 coupling pads 18511-3. Similarly, a second conductive via 18552 can be connected to a plurality of switches 1859 to selectively disconnect corresponding electrical connections to 2-1 coupling pads 18512-1, 2-2 coupling pads 18512-2, and 2-3 coupling pads 18512-3. For example, the plurality of switches 1859 can be disposed on one surface of PCB 1850 (e.g., Figure 5a On the first plate surface 550a). In an embodiment, the plurality of switches 1859 can be implemented as a switch module 18590. For example, based on Figure 18bIn the embodiment shown, when switch 1859 is operated to connect only the first conductive via 18551 and the 1-1 coupling pad 18511-1 and only the second conductive via 18552 and the 2-1 coupling pad 18512-1, during the process of indirect electrical signal delivery or transmission, electrical signals can be transmitted and received through the capacitance formed between the 1-1 coupling pad 18511-1 and the 2-1 coupling pad 18512-1 of the plurality of first coupling pads 18511 and the plurality of second coupling pads 18512. For example, in the case of including a plurality of first coupling pads 18511 and a plurality of second coupling pads 18512, selective operation of switch 1859 can selectively change the total capacitance formed between the plurality of coupling pads 1851.

[0293] Figure 19 This is a partial cross-sectional view of a PCB according to an embodiment of the present disclosure.

[0294] refer to Figure 19 According to an embodiment, PCB 1950 (e.g., Figure 4a PCB 450 in the diagram may include multiple coupled pads 1951 (e.g., physically separated via dielectric 1952) Figure 4a The coupling pad 451 in the middle), is adapted to be connected to the conductive portion of the side member (e.g., Figure 4a Electrical connection components (e.g., conductive portion 4411) in the conductive portion of ... Figure 4a Electrical connection component 453), connected to wireless communication circuit (e.g., Figure 4a The signal lines of the wireless communication circuit 490 in the circuit (e.g., Figure 4a The signal line 454), multiple first conductive vias 19551 and multiple second conductive vias 19552.

[0295] In an embodiment, the plurality of coupling pads 1951 may include a plurality of first coupling pads 19511 electrically connected through a plurality of first conductive vias 19551 and a plurality of second coupling pads 19512 electrically connected through a plurality of second conductive vias 19552. In an embodiment, the first coupling pads 19511 may be connected to an electrical connection member. The second coupling pads 19512 may be connected to a wireless communication circuit via a signal line. In an embodiment, the plurality of first coupling pads 19511 may be separately arranged along a first direction T of the PCB 1950. For example, the plurality of first coupling pads 19511 may include 1-1 coupling pad 19511-1, 1-2 coupling pad 19511-2, and 1-3 coupling pad 19511-3. In an embodiment, the plurality of second coupling pads 19512 may be separately arranged along the first direction T of the PCB 1950. For example, a plurality of second coupling pads 19512 may include 2-1 coupling pad 19512-1, 2-2 coupling pad 19512-2, and 2-3 coupling pad 19512-3. In an embodiment, the first coupling pad 19511 and the second coupling pad 19512 may be arranged overlappingly along a first direction T. A capacitor for signal delivery (or transmission) may be formed between the overlapping areas of the first coupling pad 19511 and the second coupling pad 19512 in the first direction T.

[0296] In an embodiment, adjacent first coupling pads 19511 can be connected via corresponding first conductive vias 19551. For example, a first conductive via 19551-1 may electrically connect coupling pads 1-1 and 1-2 along a first direction T of the PCB 1950, and a second conductive via 19551-2 may electrically connect coupling pads 1-2 and 1-3. In an embodiment, adjacent second coupling pads 19512 can be connected via corresponding second conductive vias 19552. For example, corresponding first conductive vias 19551 may connect adjacent first coupling pads 19511 to each other, and corresponding second conductive vias 19552 may connect adjacent second coupling pads 19512 to each other. For example, the second conductive via 19552 may include a 2-1 conductive via 19552-1 electrically connecting 2-1 coupling pads 19512-1 and 2-2 coupling pads 19512-2 along a first direction T of the PCB 1950, and a 2-2 conductive via 19552-2 electrically connecting 2-2 coupling pads 19512-2 and 2-3 coupling pads 19512-3.

[0297] In this embodiment, a plurality of first conductive vias 19551 can be disposed on different layers of the PCB 1950. A plurality of second conductive vias 19552 can be disposed on different layers of the PCB 1950. This structure allows tuning (e.g., cutting) any one of the conductive vias 19551 and 19552 connecting a pair of coupling pads 1951 to disconnect or adjust the electrical connection between the corresponding coupling pads 1951, thereby changing the capacitance formed between the plurality of coupling pads 1951. Therefore, the capacitance setting value can be easily adjusted via the conductive vias 1955 to easily compensate for capacitance errors that may occur due to design variations or manufacturing of the PCB 1950.

[0298] Figure 20a This is a partial exploded perspective view of an electronic device according to an embodiment of the present disclosure. Figure 20b This is a partial cross-sectional view showing the connection structure between the PCB and the rear frame according to one embodiment of the present disclosure.

[0299] refer to Figure 20a According to an embodiment, electronic device 2001 (e.g., Figure 2a The electronic device 201 may include a housing 2010 (e.g., Figure 2a The housing 210), rear frame 2090, and PCB 2050 (e.g., Figure 3 PCB 251 in the middle.

[0300] In an embodiment, the housing 2010 may form the exterior of the electronic device 2001. The housing 2010 may include a front surface (e.g., a surface facing the +Z direction), a rear surface (e.g., a surface facing the -Z direction), and side surfaces (e.g., sides) surrounding the internal space between the front and rear surfaces. Figure 2a (211c, side view).

[0301] In an embodiment, the rear frame 2090 may be disposed within the internal space of the electronic device 2001. In an embodiment, the rear frame 2090 may support components or parts (e.g., PCB 2050) within the electronic device 2001. In an embodiment, the rear frame 2090 may include a conductive portion 2091 exposed on at least a portion of its surface. For example, the rear frame 2090 may be formed of a non-conductive material such as a synthetic resin (e.g., polycarbonate (PC)), and the conductive portion 2091 may be formed as a metal pattern layer on the surface of the rear frame 2090 facing the PCB 2050 (e.g., the surface facing the +Z direction). For example, the conductive portion 2091 may be formed on the surface of the rear frame 2090 by a laser direct forming (LDS) patterning electroplating process, but the method of forming the conductive portion 2091 is not limited to this. In an embodiment, the rear frame 2090 may be disposed within the electronic device 2001 such that at least a portion of the conductive portion 2091 is in contact with or indirectly connected to the PCB 2050 via another connecting member.

[0302] In an embodiment, PCB 2050 may be disposed within the internal space of electronic device 2001. In an embodiment, PCB 2050 may include a plurality of coupled pads 2051 physically separated via dielectric 2052, electrical connection members 2053 adapted to connect to conductive portions 2091 of a rear frame 2090, and connections to wireless communication circuitry (e.g., Figure 4a The signal lines of the wireless communication circuit 490 in the circuit (e.g., Figure 4a Signal line 454 or multiple conductive vias 2055.

[0303] In one embodiment, the plurality of coupling pads 2051 may include a plurality of first coupling pads 20511 electrically connected via a first conductive via 20551 and a plurality of second coupling pads 20512 electrically connected via a second conductive via 20552. In one embodiment, the first coupling pads 20511 may be connected to an electrical connection member 2053. In one embodiment, the second coupling pads 20512 may be connected to a wireless communication circuit via a signal line.

[0304] In an embodiment, a plurality of first coupling pads 20511 may be separately arranged along a first direction T of the PCB 2050. For example, the plurality of first coupling pads 20511 may include 1-1 coupling pad 20511-1 and 1-2 coupling pad 20511-2. A plurality of second coupling pads 20512 may be separately arranged along the first direction T of the PCB 2050. For example, the plurality of second coupling pads 20512 may include 2-1 coupling pad 20512-2 and 2-2 coupling pad 20512-2. In an embodiment, the first coupling pads 20511 and the second coupling pads 20512 may be arranged overlapping along the first direction T. Capacitance for signal delivery (or transmission) may be formed between the overlapping areas of the first coupling pads 20511 and the second coupling pads 20512 in the first direction T.

[0305] In an embodiment, multiple coupling pads 2051 can transmit electrical signals between the conductive portion 2091 of the rear frame 2090 and the wireless communication circuit via a capacitance formed between the first coupling pad 20511 and the second coupling pad 20512. The conductive portion 2091 of the rear frame 2090 can be used as an antenna with radiation performance (or radiation efficiency) by the electrical signals transmitted from the wireless communication circuit.

[0306] Figure 21a This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure. Figure 21b It is shown Figure 21a A partial sectional view of region F21.

[0307] refer to Figure 21a and Figure 21b According to an embodiment, electronic device 2101 may include a housing (e.g., Figure 2a The first PCB 2150a includes a housing 210, multiple PCBs 2150a and 2150b, a connecting PCB 2150 connecting the multiple PCBs 2150a and 2150b, and a wireless communication circuit 2190 disposed on the first PCB 2150a.

[0308] In an embodiment, the housing may include a front surface (e.g., Figure 2a (e.g., front surface 210a) and rear surface opposite the front surface (e.g., Figure 2b The rear surface 210b) and the sides (e.g., surrounding the interior space between the front and rear surfaces) Figure 2a Side 211c of the housing). In an embodiment, the side of the housing may include side members 2140 that form at least a portion of the side and surround the interior space (e.g., Figure 3(Side member 240). In an embodiment, side member 2140 may include a conductive portion 2141 formed of a conductive material. In an embodiment, the conductive portion 2141 may serve as a radiator for an antenna through which electrical signals flow. In an embodiment, electronic device 2101 may include a feed portion formed on the conductive portion 2141 and adapted to receive electrical signals, or a ground portion adapted to serve as ground for electrical signals.

[0309] In an embodiment, multiple PCBs 2150a and 2150b may be disposed within the interior space of the housing. For example, the multiple PCBs 2150a and 2150b may include a first PCB 2150a and a second PCB 2150b spaced apart from each other. In an embodiment, a wireless communication circuit 2190 may be disposed on the first PCB 2150a.

[0310] In one embodiment, the connecting PCB 2150 may be connected to the first PCB 2150a and the second PCB 2150b to electrically connect the first PCB 2150a and the second PCB 2150b. In another embodiment, the connecting PCB 2150 may be at least partially connected to the conductive portion 2141. For example, the connecting PCB 2150 may be connected to a connection portion formed in the conductive portion 2141.

[0311] In an embodiment, the connecting PCB 2150 may be formed as a flexible PCB (FPCB). The connecting PCB 2150 may be at least partially flexible. In an embodiment, the connecting PCB 2150 may form an electrical path for signal delivery or transmission between the conductive portion 2141 and the wireless communication circuit 2190.

[0312] In an embodiment, the connecting PCB 2150 may include an electrical connection member 2153 electrically connected to a conductive portion 2151 and a signal line 2154 electrically connected to a wireless communication circuit 2190. The connecting PCB 2150 may include a plurality of coupling pads 2151 adapted to transmit electrical signals between the electrical connection member 2153 and the signal line 2154, and a plurality of conductive vias 2155 adapted to electrically connect the plurality of coupling pads 2151.

[0313] In an embodiment, a plurality of coupling pads 2151 may be separately disposed on a layer connecting the PCB 2150 via a dielectric 2152. In an embodiment, the plurality of coupling pads 2151 may include one or more first coupling pads 21511 connected to an electrical connection member 2153 and one or more second coupling pads 21512 connected to a signal line 2154. In an embodiment, one or more first coupling pads 21511 and one or more second coupling pads 21512 may be configured to at least partially overlap along a first direction T connecting the PCB 2150 to form a capacitance between them. For example, along the first direction T connecting the PCB 2150, the second coupling pads 21512 may be configured to at least partially overlap between 1-1 coupling pad 21511-1 and 1-2 coupling pad 21511-2. In an embodiment, 1-1 coupling pad 21511-1 and 1-2 coupling pad 21511-2 may be electrically connected via a first conductive via 21551. The second coupling pad 21512 can be directly connected to the signal line 2154, or it can be connected to the signal line 2154 through the second conductive via 21552.

[0314] In an embodiment, the connecting PCB 2150 can be connected to the wireless communication circuit 2190 disposed on the first PCB 2150a via the signal line 2154, and the electrical signal can be transmitted between the conductive portion 2141 and the signal line 2154 via the capacitance formed between the multiple coupling pads 2151.

[0315] In the following, embodiments of various forms of electronic devices will be described. In describing these various forms of electronic devices, it will be apparent to those skilled in the art that the PCB structure according to the various embodiments described above (e.g., a method using PCB connections with coupled feed structures (or coupled connection structures) via coupled pads as conductive portions of an antenna and wireless communication circuits) can be applied to the various forms of electronic devices described below. For example, it should be noted that, according to the above references... Figure 4a The various embodiments described up to 21B, the structure of the PCB, and the method for signal delivery between the conductive portions of the PCB and the wireless communication circuit can be readily modified, altered, and combined by those skilled in the art to suit the embodiments described below.

[0316] Figure 22a This is a front perspective view of an electronic device according to an embodiment of the present disclosure. Figure 22b This is a rear perspective view of an electronic device according to an embodiment of the present disclosure. Figure 22c This is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0317] refer to Figure 22a , Figure 22b and Figure 22c According to an embodiment, the electronic device 2201 may include a first housing 2210 (e.g., a first housing structure 2210) and a second housing 2220 (e.g., a second housing structure 2220) that are foldable relative to each other about a folding axis F via at least one hinge device 2270 and 2270-1 (e.g., a hinge module or hinge structure). For example, the first housing 2210 and the second housing 2220 may be provided as foldable housings (e.g., foldable housing structures). In an embodiment, the first housing 2210 may include a first surface 2211 and a direction facing away from the first surface 2211 (e.g., Figure 22a The second housing 2220 may include a third surface 2221 and a surface facing the direction opposite to the third surface 2221 (e.g., in the -Z direction). Figure 22a The fourth surface 2222 (in the -Z direction). In an embodiment, the first housing 2210 may include a first side formed between the first surface 2211 and the second surface 2212. The second housing 2220 may include a second side formed between the third surface 2221 and the fourth surface 2222.

[0318] In one embodiment, the first housing 2210 may include a first side member 2240a (e.g., a first side frame) forming at least a portion of a first side. The first side member 2240a may include a conductive portion. In another embodiment, the first housing 2210 may include a first back cover 2214 coupled to the first side member 2240a and forming a second surface 2212. In another embodiment, the second housing 2220 may include a second side member 2240b (e.g., a second side frame) forming at least a portion of a second side. The second side member 2240b may include a conductive portion. In yet another embodiment, the second housing 2220 may include a second back cover 2224 coupled to the second side member 2240b and forming a fourth surface 2222.

[0319] In an embodiment, the electronic device 2201 can change its shape as the relative angle between the first housing 2210 and the second housing 2220 changes about the folding axis F. For example, the electronic device 2201 can change its shape between a first state (e.g., an open or unfolded state) and a second state (e.g., a folded or unfolded state), in which the first surface 2211 and the second surface 2212 are fully unfolded such that they are substantially in the same plane, and in the second state, the first surface 2211 and the second surface 2212 are fully folded inward such that they face each other, or fully folded outward such that they face opposite directions. In an embodiment, the electronic device 2201 is operable to have a shape in a third state (e.g., an intermediate unfolded state) between the first and second states.

[0320] In one embodiment, the electronic device 2201 may include a first receiver 2200 disposed through a first surface 2211 of the first housing 2210, at least one first sensor module 2204 (e.g., an illuminance sensor), and / or at least one first camera module 2205 (e.g., an under-display camera (UDC)). In another embodiment, the electronic device 2201 may include at least one button 2206 formed on a first side member 2240a. In yet another embodiment, the electronic device 2201 may include at least one second camera module 2208 and / or a flash 2209 disposed through a second surface 2212 (e.g., a first rear cover 2214) of the first housing 2210.

[0321] In an embodiment, the electronic device 2201 may include a first display 2236 (e.g., flexible, foldable, or main display 2236) supported by a first housing 2210 and a second housing 2220 and configured to be visually visible through a first surface 2211 and a third surface 2221.

[0322] In an embodiment, the first display 2236 may include a first region 2236a (e.g., a first flat portion) corresponding to at least a portion of the first surface 2211, a second region 2236b (e.g., a second flat portion) corresponding to at least a portion of the third surface 2221, and a folding region 2236c (e.g., a folding portion) connecting the first region 2236a and the second region 2236b and changing shape during the folding of the electronic device 2201. In an embodiment, when viewed from above (e.g., in...) Figure 22a When viewing the first display 2236 in the +Z direction, the folding region 2236c can be positioned at a location where it at least partially overlaps with at least one hinge device 2270 and 2270-1. For example, the first display 2236 can be configured such that in a second state (e.g., in the case of an inward-folding type) of the electronic device 2201, the first surface 2211 and the third surface 2221 face each other, it is not visible from the outside. For example, the first display 2236 can be configured such that it is visible from the outside in a second state of the electronic device 2201, in which the first surface 2211 and the third surface 2221 face opposite directions (e.g., in the case of an outward-folding type).

[0323] In an embodiment, the electronic device 2201 may include a second display 2231 (e.g., an auxiliary display), at least one third camera module 2225, at least one second sensor module 2226, and / or a second receiver 2227 disposed via a fourth surface 2222 of the second housing 2220. For example, the second display 2231 may be configured to be externally visible through at least a portion of the second rear cover 2224. In an embodiment, the electronic device 2201 may include a speaker 2202 disposed via a second side member 2240b and a microphone 2203 and / or a connector port 2207 disposed via a first side member 2240a. At least some of the above components may be repositioned and / or modified between the first housing 2210 and / or the second housing 2220.

[0324] In an embodiment, at least one hinge device 2270 and 2270-1 may be disposed below the first display 2236 (e.g., in...). Figure 22c (in the -Z direction), and can connect the first housing 2210 and the second housing 2220. For example, at least one hinge device 2270 and 2270-1 may include a first hinge device 2270 disposed along the folding axis F and a second hinge device 2270-1 spaced apart from the first hinge device 2270. In an embodiment, the first hinge device 2270 may be configured to be substantially symmetrical or substantially identical with respect to the second hinge device 2270-1. For example, at least one hinge device 2270 and 2270-1 may be supported by a first support member 2281 extending from the first side member 2240a to the first space 22101 of the first housing 2210 and a second support member 2282 extending from the second side member 2240b to the second space 22201 of the second housing 2220. In an embodiment, at least one hinge device 2270 and 2270-1 may be covered between the first housing 2210 and the second housing 2220 by a hinge housing 2250, making it invisible from the outside.

[0325] In an embodiment, the hinge device (e.g., 2270 or 2270-1) may include a gear assembly 2243 that connects a first rotating member 2251 (e.g., a first arm or a first rotator) disposed on a first support member 2281 of the first housing and a second rotating member 2242 (e.g., a second arm or a second rotator) disposed on a second support member 2282 of the second housing 2220 to rotate symmetrically relative to each other.

[0326] For example, gear assembly 2243 may include a plurality of gears (e.g., spur gears and / or worm gears) meshing with each other. For example, gear assembly 2243 may include a cam coupling structure and / or a spring structure to press the first housing 2210 and the second housing 2220 at an angle relative to each other, in a direction of transition from a first state to a second state or in a direction of transition from a second state to a first state.

[0327] In an embodiment, electronic device 2201 may include at least one positioning module adapted to interlock with at least one hinge device 2270 and 2270-1 and provide a stop at various folding angles of electronic device 2201. For example, when electronic device 2201 is in a first state, at least one hinge device 2270 and 2270-1 and / or the positioning module may form a plane substantially the same as the first support member 2281 and the second support member 2282.

[0328] In an embodiment, the electronic device 2201 may include a first hinge plate 2261 connected to the first support member 2281 and / or the first rotating member 2251. The electronic device 2201 may also include a second hinge plate 2262 connected to the second support member 2282 and / or the second rotating member 2252. For example, when the electronic device 2201 is in a first state, at least one hinge device 2270 and 2270-1, the first rotating member 2251, the second rotating member 2252, the first hinge plate 2261, and the second hinge plate 2262 may form substantially the same plane with the first support member 2281 and the second support member 2282.

[0329] Figure 23 This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure.

[0330] refer to Figure 23 According to an embodiment, electronic device 2301 (e.g., Figures 22a to 22c The electronic device 2201 may include a housing structure 2300, a first PCB 2350a disposed in a first housing 2310, a second PCB 2350b disposed in a second housing 2320, a connecting PCB 2350c (e.g., FPCB) connecting the first PCB 2350a and the second PCB 2350b across a folding axis F, and a wireless communication circuit 2390. The housing structure 2300 includes a first housing 2310 and a second housing 2320 that are rotatable about the folding axis F.

[0331] In one embodiment, the first housing 2310 and the second housing 2320 are rotatable relative to each other about the folding axis F. In another embodiment, the housing structure 2300 may include side members 2340 surrounding the internal space of the electronic device 2301. For example, the first housing 2310 and the second housing 2320 may each include a first side member 2340a and a second side member 2340b, which form corresponding sides surrounding the internal space of the electronic device 2301. In another embodiment, the first side member 2340a and the second side member 2340b may each include a plurality of conductive portions 23411 comprising a conductive material. In another embodiment, at least some of the conductive portions 23411 may function as radiators through which electrical signals flow. In another embodiment, the conductive portions 23411 may include a first conductive portion 23411a disposed on the first housing 2310 and a second conductive portion 23411b disposed on the second housing 2320. In an embodiment, the first side member 2340a and the second side member 2340b may include insulating portions 23412 formed of insulating material. The insulating portions 23412 physically separate adjacent conductive portions 23411 from each other. The conductive portions 23411 physically separated by the insulating portions 23412 can form an electrical path through which electrical signals flow. In an embodiment, the first side member 2340a and the second side member 2340b may include one or more connection portions formed on each conductive portion 23411 and adapted to be connected to PCBs 2350a and 2350b.

[0332] In this embodiment, at least some of the plurality of conductive portions 23411 can be connected to the wireless communication circuit 2390 via PCBs 2350a and 2350b, and each can form an antenna region for transmitting and receiving wireless (or radio) signals in a frequency band corresponding to the path length of the electrical signal flow. For example, a first conductive portion 23411a formed on a first side member 2340a can be connected to the wireless communication circuit 2390 to function as an antenna, and a second conductive portion 23411b formed on a second side member 2340b may not be connected to the wireless communication circuit 2390. However, it should be noted that this is provided only as an example, and at least some of the second conductive portions 23411b can be connected to the wireless communication circuit 2390 to form an antenna region.

[0333] For ease of description, the following description will be presented through... Figure 23 The connection structure of the conductive portion 23411 and the wireless communication circuit 2390 shown is an example of using some conductive portions 23411 of the electronic device 2301 as an antenna. However, it should be noted that the length and arrangement of each conductive portion 23411 formed on the electronic device 2301 and its connection structure with the wireless communication circuit 2390 and the grounding member 2356 are not limited to this example.

[0334] In an embodiment, the first conductive portion 23411a formed on the first side member 2340a may include conductive portion 23411a-1, conductive portion 23411a-2, conductive portion 23411a-3, conductive portion 23411a-4, conductive portion 23411a-5, conductive portion 23411a-6 and / or conductive portion 23411a-7. In an embodiment, the second conductive portion 23411b formed on the second side member 2340b may include conductive portion 23411b-1, conductive portion 23411b-2, conductive portion 23411b-3, conductive portion 23411b-4, conductive portion 23411b-5, conductive portion 23411b-6 and / or conductive portion 23411b-7.

[0335] In embodiments, the lengths and arrangement of the first conductive portion 23411a formed on the first side member 2340a and the second conductive portion 23411b formed on the second side member 2340b can be configured to be symmetrical about the folding axis F. For example, at least some of the first conductive portions 23411a and second conductive portions 23411b facing each other in the folded state of the electronic device 2301 can be configured to have substantially the same length, such that they are symmetrical about the folding axis F. For example, conductive portions 1-1 23411a-1 and 2-1 23411b-1 can be symmetrical about the folding axis F. For example, conductive portions 1-2 23411a-2 and 2-2 23411b-2 can be symmetrical about the folding axis F. For example, conductive portions 1-3 23411a-3 and 2-3 23411b-3 can be symmetrical about the folding axis F. For example, conductive portions 23411a-4 (1-4) and 23411b-4 (2-4) can be symmetrical about the folding axis F. For example, conductive portions 23411a-5 (1-5) and 23411b-5 (2-5) can be symmetrical about the folding axis F. For example, conductive portions 23411a-6 (1-6) and 23411b-6 (2-6) can be symmetrical about the folding axis F. For example, conductive portions 23411a-7 (1-7) and 23411b-7 (2-7) can be symmetrical about the folding axis F.

[0336] In embodiments where at least some of the first conductive portion 23411a and the second conductive portion 23411b are formed symmetrically about the folding axis F, antenna performance degradation of the symmetrical conductive portion due to electrical signals introduced into the conductive portion not used as an antenna can be reduced or prevented. For example, as Figure 23As shown, assuming that conductive portions 1-1 23411a-1 and 2-1 23411b-1 are symmetrical about the folding axis F, and conductive portion 1-1 23411a-1 is connected to the wireless communication circuit 2390 while conductive portion 2-1 23411b-1 is not connected to the wireless communication circuit 2390, the frequency band of the electrical path formed by the electrical signal (e.g., an unexpected electrical signal) introduced into conductive portion 23411b-1 can be formed to be similar to the frequency band of the electrical path formed by the electrical signal applied to conductive portion 1-1 23411a-1. Therefore, the antenna performance degradation can be reduced by conductive portion 1-1 23411a-1. Furthermore, when the first conductive portion (e.g., conductive portion 1-1 23411a-1) and the second conductive portion (e.g., conductive portion 2-1 23411b-1) facing each other have symmetrical lengths and arrangements, when the electronic device 2301 is used in the folded state, even when an electrical signal applied to the first conductive portion (e.g., conductive portion 1-1 23411a-1) is transmitted to the corresponding second conductive portion (e.g., conductive portion 2-1 23411b-1), the change in the electrical path through which the electrical signal flows can be minimized or prevented. Therefore, the degradation of antenna performance by an electrical signal applied to the second conductive portion (e.g., conductive portion 2-1 23411b-1) through the first conductive portion (e.g., conductive portion 1-1 23411a-1) can be minimized or prevented. It should be noted that although the foregoing example is described with 1-1 conductive portion 23411a-1 and 2-1 conductive portion 23411b-1, this is provided for ease of description and can be applied substantially equivalently to the first conductive portion 23411a and the second conductive portion 23411b that are symmetrical to each other.

[0337] In an embodiment, the wireless communication circuit 2390 may be disposed on the first PCB 2350a (e.g., the main PCB), but may alternatively be disposed on the second PCB 2350b or another PCB. Alternatively, the wireless communication circuit 2390 may be disposed on both the first PCB 2350a and the second PCB 2350b.

[0338] In an embodiment, the first PCB 2350a and / or the second PCB 2350b may include at least one electrical connection member 2353. In an embodiment, the first PCB 2350a may be electrically connected via the electrical connection member 2353 to the connection portion 2353 formed on the first conductive portion 23411a, and may thereby be electrically connected to the first conductive portion 23411a. The second PCB 2350b may be electrically connected via the electrical connection member 2353 to the connection portion 2353 formed on the second conductive portion 23411b, and may thereby be electrically connected to the second conductive portion 23411b.

[0339] In embodiments, the PCB (e.g., 2350a and 2350b) may include one or more coupled feed structures 2351 (or coupled connection structures) for signal delivery. In embodiments, the coupled feed structure 2351 may include one or more first coupling pads (e.g., ...) disposed on different layers of the PCB and separated from each other. Figure 5a The first coupling pad 5511) and one or more second coupling pads (e.g., Figure 5b The second coupling pad 5512 in the first coupling pad). In an embodiment, the coupled feed structure 2351 can transmit electrical signals through a capacitance formed between the first coupling pad and the second coupling pad. In an embodiment, the coupled feed structure 2351 can be referenced above. Figure 4a Up to 21B, the arrangement and connection structure of multiple coupled pads described in various embodiments are implemented.

[0340] In an embodiment, the coupling feed structure 2351 may include a first coupling feed structure 2351a for forming an electrical path between the conductive portion 23411 and the wireless communication circuit 2390 and / or a second coupling feed structure 2351b for forming an electrical path between a pair of adjacent conductive portions 23411.

[0341] In an embodiment, the first coupling feed structure 2351a can form an electrical path with the conductive portion 23411 via at least one first coupling pad, and an electrical path with the wireless communication circuit 2390 or the grounding element 2356 via at least one second coupling pad. In an embodiment, the first coupling feed structure 2351a can transmit electrical signals between the conductive portion 23411 and the wireless communication circuit 2390, or between the conductive portion 23411 and the grounding element 2356, via a capacitance formed between at least one first coupling pad and at least one second coupling pad. In an embodiment, the first coupling feed structure 2351a can prevent direct signal delivery (or transmission) between the conductive portion 23411 and the wireless communication circuit 2390, thereby achieving ESD blocking functionality to prevent or reduce the delivery or transmission of electrostatic or noise signals from the conductive portion 23411 to the wireless communication circuit 2390. In an embodiment, the first coupling feed structure 2351a may include a discharge inductor portion (e.g., Figure 5d The discharge inductor portion 557D is adapted to sense electrostatic or noise signals transmitted from the conductive portion 23411 to the first coupling pad for discharge to the grounding component 2356. In embodiments, the discharge inductor portion can be described above according to various embodiments. Figures 5a to 5h The arrangement and structure of the discharge inductor section are described to achieve this.

[0342] In an embodiment, the second coupled feed structure 2351b (e.g., Figure 16aThe coupling feed structure 1651 can form an electrical path for an electrical signal to move between a pair of adjacent conductive portions 23411 separated from each other via an insulating portion 23412. For example, the second coupling feed structure 2351b can form an electrical path with one of the conductive portions (e.g., conductive portion 1-5 23511a-5 and conductive portion 1-6 23511a-6) via at least one first coupling pad, and with the other conductive portion (e.g., conductive portion 1-6 23511a-6) via at least one second coupling pad. In an embodiment, the second coupling feed structure 2351b can transmit an electrical signal between a pair of adjacent conductive portions (e.g., conductive portion 1-5 23511a-5 and conductive portion 1-6 23511a-6) via a capacitance formed between the first and second coupling pads. For example, the second coupled feed structure 2351b can use a pair of conductive portions (e.g., conductive portion 1-5 23511a-5 and conductive portion 1-6 23511a-6) that are separate from each other as a single radiator.

[0343] In this embodiment, each of the first conductive portions 23411a formed on the first side member 2340a can be connected to the wireless communication circuit 2390 and form an antenna region through which electrical signals corresponding to different frequency bands flow. For example, conductive portion 23411a-1 can form a first antenna region A1. Conductive portion 23411a-2 can form a second antenna region A2. Conductive portion 23411a-3 can form a third antenna region A3. Conductive portion 23411a-4 can form a fourth antenna region A4. Conductive portion 23411a-5 can form a fifth antenna region A5. Conductive portion 23411a-6 can form a sixth antenna region A6. Conductive portion 23411a-7 can form a seventh antenna region A7.

[0344] In an embodiment, among multiple antenna regions, some antenna regions (e.g., A1, A2, and A5) can be used to transmit and receive wireless (or radio) signals in a specific frequency band (e.g., a frequency band of 3 GHz or higher). For example, the first antenna region A1, the second antenna region A2, and the fifth antenna region A5 can be used as antennas for transmitting and receiving wireless signals in the UHB (e.g., a frequency band from 6 GHz to 10 GHz). In an embodiment, the 1-1 conductive portion 23411a-1 forming the first antenna region A1, the 1-2 conductive portion 23411a-2 forming the second antenna region A2, and the 1-5 conductive portion 23411a-5 forming the fifth antenna region A5 can be connected to the wireless communication circuit 2390 or the grounding member 2356 via a first coupling feed structure 2351a. In an embodiment, applying an electrical signal to a conductive portion (e.g., 23411a-1, 23411a-2, and 23411a-5) via a first coupling feed structure 2351a, or grounding an electrical signal from a conductive portion (e.g., 23411a-1, 23411a-2, and 23411a-5), can minimize or reduce the loss of the electrical signal that may occur in the high-frequency band (e.g., UHB) and omit additional elements (e.g., ESD protection element 2358) for removing ESD during signal delivery (or transmission).

[0345] In an embodiment, based on the usage state of the electronic device 2301, the conductive portions (e.g., 23411a-1, 23411a-2, and 23411a-5) of the antenna region (e.g., A1, A2, and A5) connected to the wireless communication circuit 2390 via the first coupling feed structure 2351a can be more disposed on the upper side of the electronic device 2301 (e.g., the portion of the first side member 2340a adjacent to the +Y direction) rather than the lower side of the electronic device 2301 (e.g., the portion of the first side member 2340a adjacent to the -Y direction). In an embodiment, the antenna region connected to the wireless communication circuit 2390 via the first coupling feed structure 2351a can be configured to be adjacent to a housing region (e.g., the first housing 2310) where a main PCB (e.g., the first PCB 2350a) is disposed. For example, the main PCB can be a circuit board on which an application processor (AP), a communication processor (CP), etc., are disposed. For example, when the main PCB is the first PCB 2350a, compared to the second side member 2340b of the second housing 2320, the antenna regions (e.g., A1, A2, and A5) connected to the wireless communication circuit 2390 via the first coupling feed structure 2351a can be more extensively disposed on the first side member 2340a of the first housing 2310, such as... Figure 23As shown. In this case, the antenna region connected to the wireless communication circuit 2390 via the first coupling feed structure 2351a may not be disposed on the second side member 2340b of the second housing 2320. In an embodiment, the antenna region connected to the wireless communication circuit 2390 via the first coupling feed structure 2351a may be configured to be connected to the camera module (e.g., Figure 22b The second camera module 2208 is adjacent to it. For example, in such a case... Figure 22b When the camera module is positioned so that it is adjacent to the upper side (e.g., the portion of the first side member 2340a adjacent to the -Y direction) of the electronic device 2301 compared to the lower side (e.g., the portion of the first side member 2340a adjacent to the +Y direction), a larger antenna region that would be connected to the wireless communication circuit 2390 via the first coupling feed structure 2351a can be provided on the portion of the first side member 2340a adjacent to the upper side compared to the lower side of the electronic device 2301. In this case, the antenna region connected to the wireless communication circuit 2390 via the first coupling feed structure 2351a may not be provided on the portion of the first side member 2340a adjacent to the lower side of the electronic device 2301.

[0346] However, the foregoing embodiments are provided as examples only, and the arrangement and number of antenna regions (e.g., A1, A2 and A5) connected to the wireless communication circuit 2390 via the first coupling feed structure 2351a are not limited thereto.

[0347] In an embodiment, at least some of the antenna regions (e.g., A1, A2, and A5) connected to the wireless communication circuit 2390 via the first coupling feed structure 2351a may additionally include connection paths directly connected to the wireless communication circuit 2390 or the grounding element 2356 to enable the transmission and reception of wireless signals in a specific frequency band (e.g., 3 GHz or lower). For example, as Figure 23 As shown, the 1-1 conductive portion 23411a-1 forming the first antenna region A1 and the 1-5 conductive portion 23411a-5 forming the fifth antenna region A5 can be directly connected to the wireless communication circuit 2390 or the grounding component 2356 via a signal delivery path on which the ESD protection element 2358 is disposed. This signal delivery path is independent of the signal delivery path formed by the first coupling feed structure 2351a. In this case, depending on the frequency band of the wireless signal to be transmitted or received, the first antenna region A1 or the fifth antenna region A5 can be connected to the wireless communication circuit 2390 or the grounding component 2356 via the signal delivery path formed by the first coupling feed structure 2351a or the signal delivery path containing the ESD protection element 2358.

[0348] In an embodiment, among multiple antenna regions, some antenna regions (e.g., antenna region A6) can be connected to the wireless communication circuit 2390 or the grounding element 2356 via a signal delivery path including the ESD protection element 2358 for transmitting and receiving wireless signals in a specific frequency band (e.g., a frequency band of 3 GHz or below). For example, conductive portions 23411a-6 forming the sixth antenna region A6 can be directly connected to the wireless communication circuit 2390 or the grounding element 2356 via a signal delivery path on which the ESD protection element 2358 is disposed.

[0349] In an embodiment, some of the conductive portions 23411a forming the antenna region (e.g., 23411a-3, 23411a-4, and 23411a-7) can be contacted via conductive structures of the electronic device 2301 (e.g., Figure 22c The conductive portions 23411a-3 forming the third antenna region A3 and the conductive portions 23411a-7 forming the seventh antenna region A7 can contact the hinge plate to connect to ground (e.g., the grounding element of an electronic device). For example, the conductive portions 23411a-3 forming the third antenna region A3 and the conductive portions 23411a-7 forming the seventh antenna region A7 can contact the hinge plate to connect to ground without a separate signal delivery path to the first PCB 2350a. For example, the conductive portions 23411a-4 forming the fourth antenna region A4 can contact the support member (e.g., support member 2282) to connect to ground without a separate signal delivery path to the first PCB 2350a. In an embodiment, the conductive portions 23411a-3, 23411a-4, and 23411a-7 forming the antenna regions A3, A4, and A7 that are directly connected to ground can be connected to the wireless communication circuit 2390 via a signal delivery path that omits the ESD protection element 2358.

[0350] In an embodiment, the 1-5 conductive portion 23411a-5 forming the fifth antenna region A5 and the 1-6 conductive portion 23411a-6 forming the sixth antenna region A6 can be connected to transmit and receive electrical signals via the second coupling feed structure 2351b. In this case, the 1-5 conductive portion 23411a-5 and the 1-6 conductive portion 23411a-6 can be used as a single radiator via the second coupling feed structure 2351b. For example, an electrical signal applied to the 1-5 conductive portion 23411a-5 can be moved to the 1-6 conductive portion 23411a-6 via the second coupling feed structure 2351b to form an electrical path flowing through at least a portion of the 1-5 conductive portion 23411a-5 and at least a portion of the 1-6 conductive portion 23411a-6.

[0351] In an embodiment, the second conductive portion 23411b may not be connected to the wireless communication circuit 2390. At least some of the second conductive portions 23411b (e.g., 23411b-1, 23411b-2, 23411b-5, and 23411b-6) can transmit applied electrical or noise signals to the grounding element 2356 via a signal delivery path including the ESD protection element 2358. At least some of the second conductive portions 23411b (e.g., 23411b-3, 23411b-4, and 23411b-7) can be connected to the conductive structure of the contact electronic device 2301 (e.g., Figure 22c The support member 2282 or hinge plate 2262, etc., is connected to the ground.

[0352] In an embodiment, at least one pair of adjacent conductive portions of a plurality of second conductive portions 23411b can be connected to transmit electrical signals via a second coupling feed structure 2351b. For example, conductive portions 2-6 and 2-7 can be electrically connected via the second coupling feed structure 2351b. In this case, an electrical signal (e.g., a noise signal) applied to conductive portion 2-6 adjacent to conductive portion 2-7 can be transmitted to conductive portion 2-6 via the second coupling feed structure 2351b to escape to ground. An electrical signal (e.g., a noise signal) applied to conductive portion 2-6 adjacent to conductive portion 2-5 can escape to ground via a signal delivery path on which an ESD protection element 2358 is disposed.

[0353] Figure 24a This is a front perspective view of an electronic device according to an embodiment of the present disclosure. Figure 24b This is a rear perspective view of an electronic device according to an embodiment of the present disclosure. Figure 24c This is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0354] refer to Figure 24a , Figure 24b and Figure 24c According to an embodiment, the electronic device 2401 may include a first housing 2410 (e.g., a first housing structure) and a second housing 2420 (e.g., a second housing structure), the first housing 2410 and the second housing 2420 being foldable relative to each other about a folding axis F via at least one hinge device 2460 and 2460-1 (e.g., a hinge module or hinge structure). For example, the first housing 2410 and the second housing 2420 may be implemented as foldable housings (e.g., housing structures). In an embodiment, the first housing 2410 may include a first surface 2411 and a direction facing away from the first surface 2411 (e.g., Figure 22a The second housing 2420 may include a third surface 2421 and a surface facing the direction opposite to the third surface 2421 (e.g., in the -Z direction). Figure 22a The fourth surface 2422 (in the -Z direction). In an embodiment, the first housing 2410 may include a first side formed between the first surface 2411 and the second surface 2412. The second housing 2420 may include a second side formed between the third surface 2421 and the fourth surface 2422.

[0355] In one embodiment, the first housing 2410 may include a first side member 2440a (e.g., a first side frame) forming at least a portion of a first side. The first side member 2440a may include a conductive portion. In another embodiment, the first housing 2410 may include a first back cover 2414 connected to the first side member 2440a and forming a second surface 2412. In another embodiment, the second housing 2420 may include a second side member 2440b (e.g., a second side frame) forming at least a portion of a second side. The second side member 2440b may include a conductive portion. In yet another embodiment, the second housing 2420 may include a second back cover 2424 connected to the second side member 2440b and forming a fourth surface 2422.

[0356] In an embodiment, the electronic device 2401 can change shape as the relative angle between the first housing 2410 and the second housing 2420 changes about the folding axis F. For example, the electronic device 2401 can change shape between a first state (e.g., an open or unfolded state) and a second state (e.g., a folded or unfolded state), in which the first surface 2411 and the second surface 2412 are fully unfolded such that the first surface 2411 and the second surface 2412 are substantially in the same plane, and in the second state, the first surface 2411 and the second surface 2412 are fully folded inward such that the first surface 2411 and the second surface 2412 face each other, or fully folded outward such that they face opposite directions. In an embodiment, the electronic device 2401 can operate to have a shape in a third state (e.g., an intermediate unfolded state) between the first state and the second state.

[0357] In one embodiment, the electronic device 2401 may include a first receiver 2481 disposed through a first surface 2411 of the first housing 2410, at least one first sensor module 2404 (e.g., an illuminance sensor), and / or at least one first camera module 2405 (e.g., a UDC). In another embodiment, the electronic device 2401 may include at least one button 2406 formed on a first side member 2440a. In yet another embodiment, the electronic device 2401 may include at least one second camera module 2408 and / or a flash 2409 disposed through a second surface 2412 (e.g., a first rear cover 2414) of the first housing 2410.

[0358] In an embodiment, the electronic device 2401 may include a first display 2436 (e.g., a flexible, foldable, or main display 2436), which is supported by a first housing 2410 and a second housing 2420 and is configured to be visually visible through a first surface 2411 and a third surface 2421.

[0359] In an embodiment, the first display 2436 may include a first region 2436a (e.g., a first flat portion) corresponding to at least a portion of the first surface 2411, a second region 2436b (e.g., a second flat portion) corresponding to at least a portion of the third surface 2421, and a folding region 2436c (e.g., a folding portion) connecting the first region 2436a and the second region 2436b and changing shape during the folding of the electronic device 2401. In an embodiment, when viewed from above (e.g., in...) Figure 22a When viewing the first display 2436 in the +Z direction, the folding region 2436c can be positioned where it at least partially overlaps with at least one hinge device 2460 and 2460-1. For example, in a second state of the electronic device 2401 where the first surface 2411 and the third surface 2421 face each other (e.g., in the case of an inward folding type), the first display 2436 can be configured to be invisible from the outside. For example, in a second state of the electronic device 2401 where the first surface 2411 and the third surface 2421 face opposite directions (e.g., in the case of an outward folding type), the first display 2436 can be configured to be visible from the outside.

[0360] In an embodiment, the electronic device 2401 may include a second display 2431 (e.g., an auxiliary display) disposed via a third surface 2421 of the first housing 2410, at least one third camera module 2408, at least one second sensor module 2409, and / or a second receiver. For example, the second display 2431 may be configured to be externally visible through at least a portion of the first rear cover 2414. In an embodiment, the electronic device 2401 may include a speaker 2402 disposed via a second side member 2440b and a microphone 2403 and / or a connector port 2407 disposed via a first side member 2440a. At least some of the above components may be repositioned and / or modified between the first housing 2410 and / or the second housing 2420.

[0361] In an embodiment, at least one hinge device 2460 and 2460-1 may be disposed below the first display 2436 (e.g., in...). Figure 24c (in the -Z direction), and can connect the first housing 2410 and the second housing 2420. For example, at least one hinge device 2460 and 2460-1 may include a first hinge device 2460 disposed along the folding axis F and a second hinge device 2460-1 spaced apart from the first hinge device (e.g., 2460 or 2460-1). In embodiments, the first hinge device 2460 may be formed in a configuration substantially symmetrical or substantially identical to the second hinge device 2460-1. For example, at least one hinge device 2460 and 2460-1 may be supported by a first support member 24131 extending from the first side member 2440a to the first space 24101 of the first housing 2410 and a second support member 24231 extending from the second side member 2440b to the second space 24201 of the second housing 2420. In an embodiment, at least one hinge device 2460 and 2460-1 may be covered by a hinge housing 2450 between the first housing 2410 and the second housing 2420, making it invisible from the outside.

[0362] In embodiments, the hinge device (e.g., 2460 or 2460-1) may include a gear assembly 2463 connecting a first rotating member 2461 (e.g., a first arm or a first rotator) disposed in a first support member 24131 of a first housing 2410 and a second rotating member 2462 (e.g., a second arm or a second rotator) disposed in a second support member 24231 of a second housing 2420, for symmetrical rotation relative to each other. For example, the gear assembly 2463 may include a plurality of gears (e.g., spur gears and / or worm gears) meshing relative to each other. For example, the gear assembly 2463 may include a cam coupling structure and / or a spring structure to press the first housing 2410 and the second housing 2420 at an angle relative to each other, in a direction transitioning from a first state to a second state or in a direction transitioning from a second state to a first state.

[0363] In an embodiment, the electronic device 2401 may include at least one positioning module 2464 adapted to interlock with at least one hinge device 2460 and 2460-1 and provide a stop at various folding angles of the electronic device 2401. For example, when the electronic device 2401 is in a first state, at least one hinge device 2460 and 2460-1 and / or positioning module 2464 may form a plane substantially the same as the first support member and the second support member.

[0364] Figure 25 This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure. Reference Figure 25 According to an embodiment, electronic device 2501 (e.g., electronic device 2401 in FIG. 24) may include housing structure 2500, housing structure 2500 including a first housing 2510 and a second housing 2520 rotatable about a folding axis F, a first PCB 2550a disposed in the first housing 2510, a second PCB 2550b disposed in the second housing 2520, a connecting PCB 2550c (e.g., FPCB) connecting the first PCB 2550a and the second PCB 2550b, and wireless communication circuit 2590.

[0365] In an embodiment, the first housing 2510 and the second housing 2520 can rotate relative to each other about the folding axis F. In an embodiment, the housing structure 2500 may include side members 2540 surrounding the interior space. For example, the first housing 2510 and the second housing 2520 may each include a first side member 2540a and a second side member 2540b forming respective sides surrounding the interior space. In an embodiment, the first side member 2540a and the second side member 2540b may each include a plurality of conductive portions 25411 comprising a conductive material. In an embodiment, at least some of the conductive portions 25411 can serve as radiators through which electrical signals flow. In an embodiment, the conductive portions 25411 may include a first conductive portion 25411a disposed on the first housing 2510 and a second conductive portion 25411b disposed on the second housing 2520. In an embodiment, the first side member 2540a and the second side member 2540b may include insulating portions 25412 formed of an insulating material. The insulating portions 25412 can physically separate adjacent conductive portions 25411 from each other. The conductive portion 25411, physically separated by the insulating portion 25412, can form an electrical path through which electrical signals flow. In an embodiment, the first side member 2540a and the second side member 2540b may include one or more connection portions formed on at least a portion of the conductive portion 25411 and adapted to be connected to the PCBs 2550a and 2550b.

[0366] In one embodiment, a portion of the plurality of conductive portions 25411 can be connected to the wireless communication circuit 2590 via PCBs 2550a and 2550b, forming an antenna region for transmitting and receiving wireless (or radio) signals in a frequency band corresponding to the path length of the electrical signal flow. Another portion of the plurality of conductive portions 25411 may not be connected to the wireless communication circuit 2590. Hereinafter, for ease of description, it will be based on... Figure 25 The connection structure of the conductive portion 25411 and the wireless communication circuit 2590 shown illustrates an example of using some conductive portions 25411 of the electronic device 2501 as an antenna. However, it should be noted that the length and arrangement of each conductive portion 25411 formed on the electronic device 2501 and its connection structure with the wireless communication circuit 2590 and ground 2556 are not limited to this example.

[0367] In an embodiment, the first conductive portion 25411a formed on the first side member 2540a may include conductive portion 25411a-1, conductive portion 25411a-2, conductive portion 25411a-3, conductive portion 25411a-4, and / or conductive portion 25411a-5. In an embodiment, the second conductive portion 25411b formed on the second side member 2540b may include conductive portion 25411b-1, conductive portion 25411b-2, conductive portion 25411b-3, conductive portion 25411b-4, and / or conductive portion 25411b-5.

[0368] In embodiments, the lengths and arrangement of the first conductive portion 25411a formed on the first side member 2540a and the second conductive portion 25411b formed on the second side member 2540b can be configured to be mutually symmetrical about the folding axis F. For example, at least some of the first conductive portions 25411a and at least some of the second conductive portions 25411b that face each other in the folded state of the electronic device 2501 can be configured to have substantially the same length, such that they are mutually symmetrical about the folding axis F. For example, conductive portions 1-1 25411a-1 and 2-1 25411b-1 can be mutually symmetrical about the folding axis F. For example, conductive portions 1-2 25411a-2 and 2-2 25411b-2 can be mutually symmetrical about the folding axis F. For example, conductive portions 1-3 25411a-3 and 2-3 25411b-3 can be mutually symmetrical about the folding axis F. For example, conductive portions 25411a-4 (1-4) and 25411b-4 (2-4) can be symmetrical about the folding axis F. Similarly, conductive portions 25411a-5 (1-5) and 25411b-5 (2-5) can be symmetrical about the folding axis F. Although the first conductive portion 25411a and the second conductive portion 25411b are shown as symmetrical about the folding axis F respectively, the examples are not limited to this.

[0369] In an embodiment, the wireless communication circuit 2590 may be disposed on the first PCB 2550a (e.g., the main PCB), but may alternatively be disposed on the second PCB 2550b or another PCB. Alternatively, the wireless communication circuit 2590 may be disposed on both the first PCB 2550a and the second PCB 2550b.

[0370] In an embodiment, the first PCB 2550a and the second PCB 2550b may each include at least one electrical connection member 2553. In an embodiment, the first PCB 2550a may be connected via the electrical connection member 2553 to a connection portion formed on the first conductive portion 25511a to form a signal delivery path with the first conductive portion 25411a. The second PCB 2550b may be connected via the electrical connection member 2553 to a connection portion formed on the second conductive portion 25411b to form a signal delivery path with a portion of the second conductive portion 25411b.

[0371] In embodiments, the PCB (e.g., 2550a and 2550b) may include at least one coupled power supply structure 2551 (or coupled connection structure) for signal delivery or transmission. In embodiments, the coupled power supply structure 2551 may include one or more first coupling pads (e.g., ...) disposed on different layers of the PCB (e.g., 2550a and 2550b) and separated from each other. Figure 5a The first coupling pad 5511) and one or more second coupling pads (e.g., Figure 5b The second coupling pad 5512 in the first coupling pad). In an embodiment, the coupling feed structure 2551 can transmit electrical signals through a capacitance formed between the first coupling pad and the second coupling pad. In an embodiment, the coupling feed structure 2551 can be referenced above. Figure 4a Up to 21B, the arrangement and connection structure of multiple coupled pads described in various embodiments are implemented.

[0372] In an embodiment, the coupling feed structure 2551 can form an electrical path with the conductive portion 25411 via one or more first coupling pads, and an electrical path with the wireless communication circuit 2590 or ground 2556 via one or more second coupling pads. In an embodiment, the coupling feed structure 2551 can transmit electrical signals between the conductive portion 25411 and the wireless communication circuit 2590, or between the conductive portion 25411 and ground 2556, via a capacitance formed between one or more first coupling pads and one or more second coupling pads. In an embodiment, the coupling feed structure 2551 can prevent direct signal delivery (or transmission) between the conductive portion 25411 and the wireless communication circuit 2590, thereby achieving ESD blocking functionality to prevent or reduce the delivery or transmission of electrostatic or noise signals from the conductive portion 25411 to the wireless communication circuit 2590. In an embodiment, the coupling feed structure 2551 may include a discharge inductor portion (e.g., Figure 5d The discharge inductor portion 557D is adapted to sense electrostatic or noise signals transmitted from the conductive portion 25411 to the first coupling pad for discharge to the grounding component 2556. In embodiments, the discharge inductor portion can be described above according to various embodiments. Figures 5a to 5h The arrangement and structure of the discharge inductor section are described to achieve this.

[0373] In this embodiment, some of the conductive portions 25411 can be connected to the wireless communication circuit 2590 and form antenna regions through which electrical signals corresponding to various frequency bands flow. For example, conductive portion 25411a-1 (1-1) can form a first antenna region A1. Conductive portion 25411a-2 (1-2) can form a second antenna region A2. Conductive portion 25411a-3 (1-3) can form a third antenna region A3. Conductive portion 25411a-4 (1-4) can form a fourth antenna region A4. Conductive portion 25411a-5 (1-5) can form a fifth antenna region A5 or a sixth antenna region A6. Conductive portion 25411b-5 (2-5) can form a seventh antenna region A7. Conductive portion 25411b-2 (2-2) can form an eighth antenna region A8. Conductive portion 25411b-3 (2-3) can form a ninth antenna region A9.

[0374] In an embodiment, among multiple antenna regions, some antenna regions (e.g., A3, A4, and A7) can be used to transmit and receive wireless (or radio) signals in a specific frequency band (e.g., 3 GHz or higher). For example, the third antenna region A3, the fourth antenna region A4, and the seventh antenna region A7 can be used as antennas for transmitting and receiving wireless signals in the UHB (e.g., a frequency band from 6 GHz to 10 GHz). In an embodiment, conductive portions 25411a-3 forming the third antenna region A3, conductive portions 25411a-4 forming the fourth antenna region A4, and conductive portions 25411b-5 forming the seventh antenna region A7 can be connected to the wireless communication circuit 2590 or ground 2556 via a coupling feed structure 2551. In the embodiment, using the coupling feed structure 2551 to transmit electrical signals between the wireless communication circuit 2590 and the conductive portions 25411a-3, 25411a-4 and 25411b-5 can minimize or reduce the loss of electrical signals that may occur in the high-frequency band (e.g., UHB) and omit separate components (e.g., ESD protection element 2558) for removing ESD during signal delivery or transmission.

[0375] In an embodiment, based on the usage state of the electronic device 2501, the antenna regions A3, A4 and A7 connected to the wireless communication circuit 2590 via the coupling feed structure 2551 can be more disposed on the upper side of the electronic device 2501 (e.g., the first side member 2540a adjacent to the +Y direction) rather than the lower side of the electronic device 2501 (e.g., the second side member 2540b adjacent to the -Y direction).

[0376] In an embodiment, the antenna region connected to the wireless communication circuit 2590 via the coupling feed structure 2551 can be configured to be adjacent to a housing region (e.g., first housing 2510) where a main PCB (e.g., first PCB 2550a) is disposed. For example, the main PCB can be a circuit board on which AP, CP, etc., are disposed. For example, when the main PCB is the first PCB 2550a, the antenna regions A3, A4, and A7 connected to the wireless communication circuit 2590 via the coupling feed structure 2551 can be more extensively disposed on the first side member 2540a of the first housing 2510 compared to the second side member 2540b of the second housing 2520. Figure 25 As shown. In this case, the antenna region connected to the wireless communication circuit 2590 via the coupling feed structure 2551 may not be disposed on the second side member 2540b of the second housing 2520. In an embodiment, the antenna region connected to the wireless communication circuit 2590 via the coupling feed structure 2551 may be configured to be connected to the camera module (e.g., Figure 24b The second camera module 2408 is adjacent to the electronic device 2501. For example, when the camera module is positioned adjacent to the lower side (e.g., the portion of the first side member 2540a adjacent to the -Y direction) of the electronic device 2501 compared to the upper side (e.g., the portion of the first side member 2540a adjacent to the +Y direction), more antenna regions that will be connected to the wireless communication circuit 2590 via the coupling feed structure 2551 can be provided on the portion of the first side member 2540a adjacent to the upper side compared to the lower side of the electronic device 2501. In this case, the antenna regions that are connected to the wireless communication circuit 2590 via the coupling feed structure 2551 may not be provided on the portion of the first side member 2540a adjacent to the lower side of the electronic device 2501.

[0377] However, the foregoing embodiments are provided as examples only, and the arrangement and number of antenna regions (e.g., A3, A4 and A7) connected to the wireless communication circuit 2590 via the coupling feed structure 2551 are not limited thereto.

[0378] In an embodiment, among multiple antenna regions, some antenna regions A2, A8, and A9 can be connected to the wireless communication circuit 2590 or ground 2556 via a signal delivery path including the ESD protection element 2558 to transmit and receive wireless (or radio) signals in a specific frequency band (e.g., 3 GHz or below). For example, the 1-2 conductive portion 25411a-2 forming the second antenna region A2, the 2-2 conductive portion 25411b-2 forming the eighth antenna region A8, and the 2-3 conductive portion 25411b-3 forming the ninth antenna region A9 can be directly connected to the wireless communication circuit 2590 or ground 2556 via a signal delivery path in which the ESD protection element 2558 is disposed.

[0379] In an embodiment, some of the conductive portions 25411 forming the antenna regions (e.g., 25411a-1 and 25411a-5) can be directly connected to ground by contacting conductive structures of the electronic device 2501 (e.g., support members or hinge plates, etc.) without a separate signal delivery path to the PCB (e.g., 2550a). For example, conductive portion 25411a-1 forming the first antenna region A1 and conductive portions 25411a-5 forming the fifth antenna region A5 and the sixth antenna region A6 are directly connected to ground to connect to the wireless communication circuit 2590 by omitting the signal delivery path of the ESD protection element 2558. In an embodiment, conductive portions 25411a-5 may have multiple grounding elements / feeders formed thereon. Depending on the path through which the electrical signal applied to conductive portions 25411a-5 flows, conductive portions 25411a-5 can be used as the fifth antenna region A5 or the sixth antenna region A6.

[0380] Figure 26a This is a front perspective view of an electronic device in an unfolded state according to an embodiment of the present disclosure. Figure 26b This is a rear view of an electronic device in an unfolded state according to an embodiment of the present disclosure. Figure 26c This is a perspective view of an electronic device in a folded state according to an embodiment of the present disclosure.

[0381] refer to Figure 26a , Figure 26b and Figure 26c According to an embodiment, electronic device 2601 can change shape according to a usage state indicating how it is used. For example, electronic device 2601 may be provided in a foldable type, which can be folded or unfolded depending on the usage state. In an embodiment, electronic device 2601 may include a first housing 2610, a second housing 2620, a third housing 2630, a display 2661, a first hinge housing 2615, and a second hinge housing 2625.

[0382] In the following text, in reference Figures 26a to 26c When describing the embodiments, for ease of description, the surface of the display 2661 that is visible to the external eye will be referred to as the front surface 2601a of the electronic device 2601 (e.g., facing). Figure 26a The surface in the +Z direction of the electronic device 2601, which is opposite to the front surface 2601a, will be referred to as the rear surface 2601b of the electronic device 2601 (e.g., facing the +Z direction). Figure 26a The surface in the -Z direction of the electronic device 2601, and the outer surface of the internal space between the front surface 2601a and the rear surface 2601b will be referred to as the side surface 2601c.

[0383] In an embodiment, the first housing 2610, the second housing 2620, and the third housing 2630 may form the exterior of the electronic device 2601. In an embodiment, the first housing 2610 may include a first front surface 2610a and a first rear surface 2610b. The second housing 2620 may include a second front surface 2620a and a second rear surface 2620b. The third housing 2630 may include a third front surface 2630a and a third rear surface 2630b. In an embodiment, the first front surface 2610a of the first housing 2610, the second front surface 2620a of the second housing 2620, and the third front surface 2630a of the third housing 2630 may be based on, for example... Figure 26a The unfolded state of the electronic device 2601 shows a front surface 2601a. ​​In an embodiment, the front surface 2601a of the electronic device 2601 can be configured such that a large portion of it is open to allow the display 2661 to be visually visible to the outside. In an embodiment, as... Figure 26b As shown, the first rear surface 2610b of the first housing 2610, the second rear surface 2620b of the second housing 2620, and the third rear surface 2630b of the third housing 2630 can form the rear surface 2601b of the electronic device 2601 based on the unfolded state of the electronic device 2601. In an embodiment, the first housing 2610, the second housing 2620, and the third housing 2630 can form the side surface 2601c surrounding the internal space between the front surface 2601a and the rear surface 2601b of the electronic device 2601.

[0384] In one embodiment, the first housing 2610 may include a first side member 2640a forming a portion of a side surface 2601c of the electronic device 2601. The first side member 2640a may include a conductive portion. In another embodiment, the second housing 2620 may include a second side member 2640b forming a portion of a side surface 2601c of the electronic device 2601. The second side member 2640b may include a conductive portion. In yet another embodiment, the third housing 2630 may include a third side member 2640c forming a portion of a side surface 2601c of the electronic device 2601. The third side member 2640c may include a conductive portion.

[0385] In one embodiment, a first rear cover 2651 may be disposed on a first rear surface 2610b of a first housing 2610. At least a portion of the edge of the first rear cover 2651 may be surrounded by the first housing 2610. In another embodiment, a second rear cover 2652 may be disposed on a second rear surface 2620b of a second housing 2620. At least a portion of the edge of the second rear cover 2652 may be surrounded by the second housing 2620. In yet another embodiment, a third rear cover 2653 may be disposed on a third rear surface 2630b of a third housing 2630. At least a portion of the edge of the third rear cover 2653 may be surrounded by the third housing 2630. In another embodiment, the first rear cover 2651, the second rear cover 2652, and the third rear cover 2653 may be integrally formed with the first housing 2610, the second housing 2620, and the third housing 2630, respectively.

[0386] In an embodiment, the first housing 2610, the second housing 2620, the third housing 2630, the first rear cover 2651, the second rear cover 2652, and the third rear cover 2653 may be coupled together to form various components in which the electronic device 2601 is disposed (e.g., Figure 27 The space of PCBs 2750a, 2750b, and 2750c, etc. In an embodiment, at least one component may be disposed on the rear surface 2601b of the electronic device 2601 to be visually visible. For example, at least one component (e.g., a proximity sensor, a rear camera module, and / or a flash) may be externally visible through the second rear region 2652a of the second rear cover 2652. In an embodiment, at least a portion of the sub-display 2670 may be visually exposed through the third rear region 2653a of the third rear cover 2653.

[0387] In one embodiment, the first hinge housing 2615 can be rotatably connected to the first housing 2610 and the second housing 2620 about a first folding axis F1. In another embodiment, the second hinge housing 2625 can be rotatably connected to the second housing 2620 and the third housing 2630 about a second folding axis F2. In yet another embodiment, the first folding axis F1 and the second folding axis F2 can be parallel to each other.

[0388] In an embodiment, the display 2661 may be deformable in at least some areas, such that the display 2661 can respond to the electronic device 2601 in... Figure 26a The first state shown (e.g., unfolded state or fully opened state) and Figure 26cThe shape changes by altering its shape between the second state shown (e.g., a folded state or a fully closed state) (e.g., the opening or closing operation of the electronic device 2601). In an embodiment, the display 2661 may be supported by a first housing 2610, a second housing 2620, a third housing 2630, a first hinge housing 2615, and a second hinge housing 2625, and may be configured to be visually visible to the outside through the front surface 2601a of the electronic device 2601.

[0389] In an embodiment, the display 2661 may include a first flat portion 2661a corresponding to the first housing 2610, a second flat portion 2661b corresponding to the second housing 2620, a third flat portion 2661c corresponding to the third housing 2630, a first folding portion 2661d connecting the first flat portion 2661a and the second flat portion 2661b and corresponding to the first hinge housing 2615, and a second folding portion 2661e connecting the second flat portion 2661b and the third flat portion 2661c and corresponding to the second hinge housing 2625. In an embodiment, the first folding portion 2661d and the second folding portion 2661e may be at least partially bent in response to a change in the shape of the electronic device 2601.

[0390] In an embodiment, electronic device 2601 may include a sound output module 2655, which includes a connector port 2678 disposed through side 2601c (e.g., Figure 1 The connection end 178) and at least one hole formed on the side surface 2601c.

[0391] Figure 27 This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure.

[0392] refer to Figure 27 According to an embodiment, electronic device 2701 (e.g., electronic device 2601 in FIG. 26) may include housing structure 2700, housing structure 2700 including a first housing 2710, a second housing 2720 and a third housing 2730, and a first PCB 2750a disposed in the first housing 2710, a second PCB 2750b disposed in the second housing 2720, a third PCB 2750c disposed in the third housing 2730, a first connecting PCB 2750d connecting the first PCB 2750a and the second PCB 2750b, a second connecting PCB 2750e connecting the second PCB 2750b and the third PCB 2750c and / or wireless communication circuit 2790.

[0393] In this embodiment, the first housing 2710 and the second housing 2720 are rotatable relative to each other about a first folding axis F1. The second housing 2720 and the third housing 2730 are rotatable relative to each other about a second folding axis F2.

[0394] In an embodiment, the housing structure 2700 may include side members 2740 forming sides surrounding the interior space. For example, the first housing 2710, the second housing 2720, and the third housing 2730 may each include a first side member 2740a, a second side member 2740b, and a third side member 2740c forming sides surrounding the interior space. In an embodiment, the first side member 2740a, the second side member 2740b, and the third side member 2740c may include a plurality of conductive portions 27411 comprising a conductive material. In an embodiment, at least some of the conductive portions 27411 may serve as radiators through which electrical signals flow. In an embodiment, the first side member 2740a, the second side member 2740b, and the third side member 2740c may include insulating portions 27412 disposed between the plurality of conductive portions 27411 and electrically separating adjacent conductive portions 27411. For example, the first side member 2740a, the second side member 2740b, and the third side member 2740c may include one or more connection portions formed on the conductive portion 27411 and adapted to be connected to a PCB (e.g., 2750a and 2350b).

[0395] In an embodiment, a portion of the conductive portion 27411 formed on the first side member 2740a, the second side member 2740b, and the third side member 2740c can be connected to the wireless communication circuit 2790 via PCBs 2750a, 2750b, and 2750c, and can be used as a radiator for transmitting and receiving wireless (or radio) signals in a frequency band corresponding to the length of the path through which the electrical signal flows. Another portion of the conductive portion 27411 may not be connected to the wireless communication circuit 2790. Hereinafter, for ease of description, the embodiment will be described based on the antenna region shown in the accompanying drawings; however, it should be noted that the antenna structure and arrangement formed in the electronic device 2701 are not limited thereto.

[0396] In an embodiment, the plurality of conductive portions 27411 may include a first conductive portion 27411-1, a second conductive portion 27411-2, a third conductive portion 27411-3, a fourth conductive portion 27411-4, a fifth conductive portion 27411-5, a sixth conductive portion 27411-6, a seventh conductive portion 27411-7, an eighth conductive portion 27411-8, a ninth conductive portion 27411-9, a tenth conductive portion 27411-10, an eleventh conductive portion 27411-11, a twelfth conductive portion 27411-12, and / or a thirteenth conductive portion 27411-13. In one embodiment, the first conductive portion 27411-1, the second conductive portion 27411-2, the third conductive portion 27411-3, the sixth conductive portion 27411-6, the seventh conductive portion 27411-7, the eighth conductive portion 27411-8, and / or the tenth conductive portion 27411-10 may be formed on the first side member 2740a. In another embodiment, the fourth conductive portion 27411-4, the fifth conductive portion 27411-5, the ninth conductive portion 27411-9, and / or the eleventh conductive portion 27411-11 may be formed on the second side member 2740b. In yet another embodiment, the twelfth conductive portion 27411-12 and / or the thirteenth conductive portion 27411-13 may be formed on the third side member 2740c.

[0397] In an embodiment, among the plurality of conductive portions 27411 formed on the first side member 2740a, the second side member 2740b, and the third side member 2740c, the conductive portions 27411 facing each other when the electronic device 2701 is folded can be formed symmetrically about the first folding axis F1 and / or the second folding axis F2. For example, the fifth conductive portion 27411-5 can be formed symmetrically about the first folding axis F1 with the second conductive portion 27411-2, and symmetrically about the second folding axis F2 with the twelfth conductive portion 27411-12. The eleventh conductive portion 27411-11 can be formed symmetrically about the first folding axis F1 with the seventh conductive portion 27411-7, and symmetrically about the second folding axis F2 with the thirteenth conductive portion 27411-13.

[0398] In an embodiment, the wireless communication circuit 2790 may be disposed on the first PCB 2750a, but may alternatively be disposed on the second PCB 2750b, the third PCB 2750c, or another PCB.

[0399] In an embodiment, the first PCB 2750a, the second PCB 2750b, and the third PCB 2750c may be disposed in the first housing 2710, the second housing 2720, and the third housing 2730, respectively, and may include one or more electrical connection members 2753 electrically connected to the conductive portions 27411 of the respective housings. In an embodiment, the electrical connection members 2753 may be connected to the conductive portions 27411 by contacting connection portions formed on the conductive portions 27411.

[0400] In an embodiment, the PCB (e.g., 2750a, 2750b, and 2750c) may include at least one coupling feed structure 2751 for transmitting electrical signals. In an embodiment, the coupling feed structure 2751 may include at least one first coupling pad (e.g., ...) disposed on different layers of the PCB (e.g., 2750a, 2750b, and 2750c) and separated from each other. Figure 5a The first coupling pad 5511) and at least one second coupling pad (e.g., Figure 5b The second coupling pad 5512 in the first coupling pad). In an embodiment, the coupling feed structure 2751 can transmit electrical signals through a capacitance formed between the first coupling pad and the second coupling pad. In an embodiment, the coupling feed structure 2751 can be referenced above. Figure 4a Up to 21B, the arrangement and connection structure of multiple coupled pads described in various embodiments are implemented.

[0401] In an embodiment, the coupling feed structure 2751 can form an electrical path with the conductive portion 27411 through at least one first coupling pad, and an electrical path with the wireless communication circuit 2790 or ground 2756 through at least one second coupling pad. In an embodiment, the coupling feed structure 2751 can transmit electrical signals between the conductive portion 27411 and the wireless communication circuit 2790 or between the conductive portion 27411 and ground 2756 through a capacitance formed between at least one first coupling pad and at least one second coupling pad. In an embodiment, the coupling feed structure 2751 can prevent direct signal delivery (or transmission) between the conductive portion 27411 and the wireless communication circuit 2790, thereby enabling ESD blocking functionality to prevent or reduce the delivery or transmission of electrostatic or noise signals from the conductive portion 27411 to the wireless communication circuit 2790. In an embodiment, the coupling feed structure 2751 may include a discharge inductor portion (e.g., Figure 5d The discharge inductor portion 557D is adapted to sense electrostatic or noise signals transmitted from the conductive portion 27411 to the first coupling pad for discharge to the grounding component 2756. In embodiments, the discharge inductor portion can be described above according to various embodiments. Figures 5a to 5h The arrangement and structure of the discharge inductor section are described to achieve this.

[0402] In this embodiment, some of the plurality of conductive portions 27411 can be connected to the wireless communication circuit 2790 and form an antenna region through which electrical signals corresponding to various frequency bands can flow. For example, the first conductive portion 27411-1 can form a first antenna region A1. The second conductive portion 27411-2 can form a second antenna region A2. The third conductive portion 27411-3 can form a third antenna region A3. The fourth conductive portion 27411-4 can form a fourth antenna region A4. The fifth conductive portion 27411-5 can form a fifth antenna region A5. The sixth conductive portion 27411-6 can form a sixth antenna region A6. The seventh conductive portion 27411-7 can form a seventh antenna region A7. The eighth conductive portion 27411-8 can form an eighth antenna region A8. The ninth conductive portion 27411-9 can form a ninth antenna region A9. The tenth conductive portion 27411-10 can form a tenth antenna region A10.

[0403] In an embodiment, among multiple antenna regions, some antenna regions (e.g., A1 and A2) can be used to transmit and receive wireless (or radio) signals in a specific frequency band (e.g., 3 GHz or higher). For example, the first antenna region A1 and the second antenna region A2 can be used as antennas for transmitting and receiving wireless signals in the UHB (e.g., a frequency band from 6 GHz to 10 GHz). In an embodiment, the first conductive portion 27411-1 forming the first antenna region A1 and the second conductive portion 27411-2 forming the second antenna region A2 can be connected to the wireless communication circuit 2790 or ground 2756 via a coupling feed structure 2751. In an embodiment, using the coupling feed structure 2751 to transmit electrical signals between the wireless communication circuit 2790 and the conductive portions 27411-1 and 27411-2 can minimize or reduce the loss of electrical signals that may occur in the high-frequency band (e.g., UHB) and omit separate components (e.g., ESD protection element 2758) for removing ESD during signal delivery or transmission.

[0404] In an embodiment, based on the usage state of the electronic device 2701, antenna regions A1 and A2 connected to the wireless communication circuit 2790 via the coupling feed structure 2751 can be more often located on the upper side (e.g., +Y direction) of the electronic device 2701 rather than on the lower side (e.g., -Y direction). In an embodiment, the antenna regions connected to the wireless communication circuit 2790 via the coupling feed structure 2751 can be configured to be adjacent to a housing region (e.g., second housing 2720) where a main PCB (e.g., second PCB 2750b) is disposed. For example, the main PCB can be a circuit board on which AP, CP, etc., are disposed. For example, when the main PCB is the second PCB 2750b, the antenna regions connected to the wireless communication circuit 2790 via the coupling feed structure 2751 can be more often located on the side member 2740b of the second housing 2720 compared to the first housing 2710 or the third housing 2730. In this case, the antenna region connected to the wireless communication circuit 2790 via the coupling feed structure 2751 may not be disposed on the first housing 2710 or the third housing 2730. In an embodiment, the antenna region connected to the wireless communication circuit 2790 via the coupling feed structure 2751 may be configured to be connected to the camera module (e.g., disposed on the camera module). Figure 26b At least one camera module 2680a is located adjacent to the first rear cover 2652 of the device. For example, when the camera module is positioned adjacent to the lower side (e.g., the portion of the second side member 2740b adjacent to the -Y direction) of the electronic device 2701 compared to the upper side (e.g., the portion of the second side member 2740b adjacent to the +Y direction), more antenna regions that will be connected to the wireless communication circuit 2790 via the coupling feed structure 2751 can be provided on the portion of the second side member 2740b adjacent to the upper side compared to the lower side of the electronic device 2701. For example, the first housing 2710 and the third housing 2730, where no camera module (e.g., 2680a) is provided, can have an equal number of antenna regions connected to the wireless communication circuit 2790 via the coupling feed structure 2751. For example, the antenna regions connected to the wireless communication circuit 2790 via the coupling feed structure 2751 may not be provided on the portion of the second side member 2740b adjacent to the lower side of the electronic device 2701.

[0405] However, the foregoing embodiments are provided as examples only, and the arrangement and number of antenna regions connected to the wireless communication circuit 2790 via the coupling feed structure 2751 are not limited thereto.

[0406] In an embodiment, the first antenna region A1 may separately include a signal delivery path directly connected to the wireless communication circuit 2790 or ground 2756, enabling the transmission and reception of wireless signals in a frequency band different from the frequency band used for transmission and reception via the coupling feed structure 2751 (e.g., 3 GHz or lower). For example, the first conductive portion 27411-1 may be directly connected to the wireless communication circuit 2790 or ground 2756 via a signal delivery path in which an ESD protection element 2758 is disposed, a signal delivery path separate from the signal delivery path formed by the coupling feed structure 2751. The frequency band of the wireless signals transmitted and received through the first antenna region A1 can be changed depending on the path along which the electrical signal applied to the first conductive portion 27411-1 flows.

[0407] In an embodiment, among multiple antenna regions, some antenna regions A5, A6, and A7 can be connected to the wireless communication circuit 2790 or ground 2756 via a signal delivery path including an ESD protection element 2758 to transmit and receive wireless signals in a specific frequency band (e.g., 3 GHz or lower). For example, the fifth conductive portion 27411-5 forming the fifth antenna region A5, the sixth conductive portion 27411-6 forming the sixth antenna region A6, and the seventh conductive portion 27411-7 forming the seventh antenna region A7 can be directly connected to the wireless communication circuit 2790 or ground 2756 via a signal delivery path in which an ESD protection element 2758 for noise signal removal is provided.

[0408] In an embodiment, some of the conductive portions 27411 forming the antenna regions (e.g., 23411-3, 23411-4, 23411-8, 23411-9, and 23411-10) can be directly connected to ground by contacting conductive structures of the electronic device 2701 (e.g., support members or hinge plates, etc.). For example, the third conductive portion 27411-3 forming the third antenna region A3, the fourth conductive portion 27411-4 forming the fourth antenna region A4, the eighth conductive portion 27411-8 forming the eighth antenna region A8, the ninth conductive portion 27411-9 forming the ninth antenna region A9, and / or the tenth conductive portion 27411-10 forming the tenth antenna region A10 can be connected to ground without requiring separate signal delivery paths to PCBs 2750a, 2750b, and 2750c. In an embodiment, conductive portions 27411-3, 27411-4, 27411-8, 27411-9, and 27411-10 forming antenna regions A3, A4, A8, A9, and A10 directly connected to ground can be connected to the wireless communication circuit 2790 via a signal delivery path that omits the ESD protection element 2758.

[0409] Figure 28a This is a front perspective view of an electronic device in a first state according to an embodiment of the present disclosure. Figure 28b This is a front perspective view of an electronic device in a second state according to an embodiment of the present disclosure. Figure 28c This is a rear perspective view of an electronic device in a first state according to an embodiment of the present disclosure. Figure 28d This is a rear perspective view of an electronic device in a second state according to an embodiment of the present disclosure.

[0410] refer to Figure 28a , Figure 28b , Figure 28c and Figure 28d According to an embodiment, electronic device 2801 (e.g., Figure 1 The electronic device 2801 can be deformable. In an embodiment, the electronic device 2801 can be deformable along the direction of movement (e.g., parallel to the direction of movement). Figure 28a The size can be changed by expanding and contracting (in the direction of the Y-axis). For example, electronic device 2801 can be used in a way that... Figure 28a The first state shown (e.g., the slide-in state) and as shown Figure 28b The state changes between the second state shown (e.g., the slide-out state).

[0411] In an embodiment, the electronic device 2801 may include housings 2810 and 2820 forming the exterior and housing components therein. In an embodiment, housings 2810 and 2820 may include a first housing 2810 and a second housing 2820 movably connected relative to each other. In an embodiment, the first housing 2810 may be slidably connected to the second housing 2820. For example, the first housing 2810 may move relative to the second housing 2820 in a first direction of movement ① (e.g., the -Y direction) or slide in a second direction of movement ② (e.g., the +Y direction) opposite to the first direction of movement ① (e.g., the -Y direction). Although reference will be made below... Figure 28a The state changes of electronic device 2801 are described based on the sliding in / out movement of the first housing 2810 relative to the second housing 2820, but this is intended to describe the relative movement of the first housing 2810 and the second housing 2820 relative to each other, and can also be understood as the movement of the second housing 2820 relative to the first housing 2810.

[0412] In an embodiment, the state of the electronic device 2801 can be changed between a first state (e.g., a slide-in state) and a second state (e.g., a slide-out state) by the relative movement of the first housing 2810 relative to the second housing 2820. In an embodiment, the electronic device 2801 can have the minimum exposure area of ​​the display 2861 in the first state, and the electronic device 2801 can have the maximum exposure area of ​​the display 2861 in the second state. In an embodiment, the electronic device 2801 can be used in the first state and the second state, but it can also be used in an intermediate state between the first state and the second state.

[0413] In an embodiment, the first housing 2810 may include a 1-1 surface 2810a (e.g., a first front surface), a 1-2 surface 2810b (e.g., a first rear surface) opposite to the 1-1 surface 2810a, a 1-1 side surface 2810c facing a first lateral direction (e.g., the +X direction) and formed between the 1-1 surface 2810a and the 1-2 surface 2810b, a 1-2 side surface 2810d facing a second lateral direction opposite to the first lateral direction (e.g., the -X direction) and formed between the 1-1 surface 2810a and the 1-2 surface 2810b, and a third side surface 2810e facing a third lateral direction intersecting with the first lateral direction (e.g., the +Y direction) and formed between the 1-1 surface 2810a and the 1-2 surface 2810b.

[0414] In an embodiment, the first housing 2810 may include a first plate 2811 and a first side member 2840a extending substantially in the thickness direction (e.g., the +Z direction) along the edge of the first plate 2811. In an embodiment, the first plate 2811 may form first and second surfaces 2810b, and the first side member 2840a may form the sides 2810c, 2810d, and 2810e of the first housing 2810. In an embodiment, the first plate 2811 and the first side member 2840a may be integrally formed, or they may be coupled after being formed separately. In an embodiment, the first side member 2840a may include a conductive portion.

[0415] In an embodiment, the second housing 2820 may include a 2-1 surface 2820a (e.g., a second front surface), a 2-2 surface 2820b (e.g., a second rear surface) opposite to the 2-1 surface 2820a, a 2-1 side surface 2820c facing a first lateral direction (e.g., the +X direction) and formed between the 2-1 surface 2820a and the 2-2 surface 2820b, a 2-2 side surface 2820d facing a second lateral direction opposite to the first lateral direction (e.g., the -X direction) and formed between the 2-1 surface 2820a and the 2-2 surface 2820b, and a fourth side surface 2820e facing a fourth lateral direction intersecting the first lateral direction (e.g., the -Y direction) and formed between the 2-1 surface 2820a and the 2-2 surface 2820b.

[0416] In an embodiment, the second housing 2820 may include a second plate 2821 and a second side member 2840b extending substantially in the thickness direction (e.g., the +Z direction) along the edge of the second plate 2821. In an embodiment, the second plate 2821 may form a 2-2 surface 2820b, and the second side member 2840b may form the sides 2820c, 2820d, and 2820e of the second housing 2820. In an embodiment, the second plate 2821 and the second side member 2840b may be integrally formed, or they may be coupled after being formed separately. In an embodiment, the second side member 2840b may include a conductive portion.

[0417] In an embodiment, the first housing 2810 and the second housing 2820 can form the first surface 2801a (or front surface) (e.g., the +Z-facing surface) of the electronic device 2801 through the 1-1 surface 2810a and the 2-1 surface 2820a, and form the second surface 2801b (or rear surface) (e.g., the -Z-facing surface) of the electronic device 2801 through the 1-2 surface 2810b and the 2-2 surface 2820b. In an embodiment, the first surface 2801a of the electronic device 2801 can be opened to expose the display 2861. In an embodiment, the first housing 2810 and the second housing 2820 can form the first side 2801c (e.g., the +X-facing surface) of the electronic device 2801 through the 1-1 side 2810c and the 2-1 side 2820c, and form the second side 2801d (e.g., the -X-facing surface) of the electronic device 2801 through the 1-2 side 2810d and the 2-2 side 2820d.

[0418] In an embodiment, the first housing 2810 can be partially inserted into the second housing 2820 while retracting or exiting relative to the second housing 2820. In an embodiment, the second housing 2820 may include an opening 2820g formed in a fourth lateral direction (e.g., +Y direction) opposite to the third lateral direction to allow insertion of the first housing 2810. In an embodiment, when the first housing 2810 is inserted into the second housing 2820, at least a portion of side 1-1 2810c and side 1-2 2810d of the first housing 2810 can be retracted into the second housing 2820 and covered by side 2-1 2820c and side 2-2 2820d. Therefore, the lengths of the first side 2801c and second side 2801d of the electronic device 2801 can change depending on the state of the electronic device 2801.

[0419] In an embodiment, the electronic device 2801 may include a display 2861 (e.g., a flexible or rollable display) for displaying visual information. In an embodiment, the display 2861 may be exposed to the outside of the electronic device 2801, i.e., its front side, via a display area 28610. In an embodiment, the display area 28610 may include a first area 2861a disposed on a 1-1 surface 2810a and a 2-1 surface 2820a, a second area 2861b disposed adjacent to a fourth side surface 2820e, and a third area 2861c disposed adjacent to a third side surface 2810e. In an embodiment, the second area 2861b and / or the third area 2861c may form a flexible curved surface. In an embodiment, the display area 28610 may expand and / or contract in response to a change in the size of the first area 2861a. In an embodiment, the display 2861 may display a screen on the display area 28610. In one embodiment, the display 2861 may display a single connected screen using the display area 28610, or it may display a screen using only a portion of the display area 28610. In another embodiment, the display 2861 may display multiple different screens on the display area 28610.

[0420] In an embodiment, the display 2861 may include: a flat portion 28611 forming at least a portion of the display area 28610 (e.g., Figure 28aThe display area 28610 consists of a first region 2861a in a first state and supported by a first housing 2810 and a second housing 2820; and a curled portion 28612 (or a bent portion) extending from the flat portion 28611 along a first movement direction and supported by the second housing 2820. In an embodiment, regardless of the change in state of the electronic device 2801, the flat portion 28611 can be exposed to the first surface 2801a of the housings 2810 and 2820 to form the display area 28610. In an embodiment, the curled portion 28612 can retract into the interior of the electronic device 2801 or retract to the exterior of the electronic device 2801 in response to movement of the first housing 2810 relative to the second housing 2820. In an embodiment, the curled portion 28612 retracting to the exterior of the electronic device 2801 can be disposed on the 2-1 surface 2820a of the second housing 2820 and exposed to the exterior of the electronic device 2801 to form the display area 28610 together with the flat portion 28611. For example, the size of the display area 28610 can be changed according to the degree to which the curled portion 28612 is withdrawn.

[0421] In an embodiment, the display 2861 may have a display area 28610 whose size (e.g., a first area 2861a, a second area 2861b, and a third area 2861c) changes in response to a change in the state of the electronic device 2801. In an embodiment, the display area 28610 of the display 2861 may be formed in a first state of the electronic device 2801 (e.g., ...). Figure 28a The first region size (e.g., minimum region size) is minimized in the slide-in state and in the second state of the electronic device 2801 (e.g., Figure 28bThe second region size (e.g., the maximum region size) is maximized under the sliding-out state. When the electronic device 2801 is in a state between the first state and the second state, as the state of the display 2861 changes in response to the state of the electronic device 2801, the display area 28610 can have a region size between the first region size and the second region size. For example, in the action of changing the state of the electronic device 2801 from the first state to the second state, when the first housing 2810 moves a certain length d relative to the second housing 2820 along the second moving direction ②, the length of the display area 28610 parallel to the second moving direction ② (e.g., the length along the Y-axis) can be changed from the first length d1 to a second length d2 that increases by a certain length d, thereby expanding the display area 28610. For example, when the state of electronic device 2801 changes from a second state to a first state, the first housing 2810 may move a specific length d relative to the second housing 2820 in a first movement direction ①, and the length of the display area 28610 parallel to the first movement direction ① (e.g., the length along the Y-axis) may change from a second length d2 to a first length d1 that is reduced by the specific length d, thereby shrinking the display area 28610. In this embodiment, regardless of how the state of electronic device 2801 changes, the dimensions of the second area 2861b and the third area 2861c may remain substantially constant.

[0422] In an embodiment, electronic device 2801 may include input button 2850 (e.g., Figure 1 Input module 150), sound output module (e.g., Figure 1 The audio output module 155 and the camera module 2880 (e.g., Figure 1 The electronic device 2801 includes a camera module 180 and a connector port 2808. In embodiments, at least one of the above-mentioned components may be omitted, or other components may be included.

[0423] In this embodiment, the input button 2850 can receive an input signal in response to a user's operation. The input button 2850 can be located externally to the electronic device 2801 and, when pressed by a user, transmits the input signal to a processor (e.g., ...). Figure 1 (Processor 120 in the embodiment). In this embodiment, input buttons 2850 may be formed on one side of housings 2810 and 2820. For example, input buttons 2850 may be formed on at least one of two-three sides 2820c or two-four sides 2820d of the second housing 2820. Although a single input button 2850 is shown formed on two-three sides 2820c of the second housing 2820 for ease of description, it should be noted that the arrangement and number of input buttons 2850 of the electronic device 2801 are provided only as examples for ease of description and are not limited to what is shown.

[0424] In an embodiment, the sound output module can radiate sound to the outside via sound holes H1 and H2 communicating with the outside of housings 2810 and 2820. In an embodiment, sound holes H1 and H2 may include, for example, a first sound hole H1 formed on the second housing 2820 and a second sound hole H2 formed on the first housing 2810. In an embodiment, in a first state of the electronic device 2801, the first sound hole H1 and the second sound hole H2 can be substantially aligned to communicate with each other.

[0425] Figure 29 This is a schematic diagram illustrating the connection structure between a side member and a PCB in an electronic device according to an embodiment of the present disclosure.

[0426] refer to Figure 29 According to an embodiment, electronic device 2901 (e.g., Figures 28a to 28d The electronic device 2801 may include a first housing 2910 and a second housing 2920 that can slide relative to each other, a first PCB 2950a disposed in the first housing 2910, a second PCB 2950b disposed in the second housing 2920, a connecting PCB 2950c connecting the first PCB 2950a and the second PCB 2950b, and a wireless communication circuit 2990.

[0427] In an embodiment, the first housing 2910 may slide along the sliding direction (e.g., Figure 29 (In the Y-axis direction) retracts into or exits from the second housing 2920. The first housing 2910 and the second housing 2920 may each include a first side member 2940a and a second side member 2940b forming sides surrounding the interior space. In an embodiment, the first side member 2940a and the second side member 2940b may each include a plurality of conductive portions 29411 comprising conductive material. In an embodiment, the conductive portions 29411 may each serve as radiators through which electrical signals flow. In an embodiment, the first side member 2940a and the second side member 2940b may each include an insulating portion 29412 disposed between the plurality of conductive portions 29411 and electrically separating adjacent conductive portions 29411. The first side member 2940a and the second side member 2940b may each include at least one connection portion formed on the conductive portions 29411 and adapted to be connected to PCBs 2950a and 2950b.

[0428] In an embodiment, a portion of the plurality of conductive portions 29411 formed on the first side member 2940a and the second side member 2940b can be connected to the wireless communication circuit 2990 via PCBs 2950a and 2950b to function as a radiator for transmitting and receiving frequency bands corresponding to the path length of the electrical signal flow. Another portion of the plurality of conductive portions 29411 may not be connected to the wireless communication circuit 2990. Hereinafter, for ease of description, the embodiment will be described based on the antenna region shown in the accompanying drawings; however, it should be noted that the antenna structure and arrangement formed in the electronic device 2901 are not limited thereto.

[0429] In an embodiment, the plurality of conductive portions 29411 may include a first conductive portion 29411-1, a second conductive portion 29411-2, a third conductive portion 29411-3, a fourth conductive portion 29411-4, a fifth conductive portion 29411-5, a seventh conductive portion 29411-7, an eighth conductive portion 29411-8, and a ninth conductive portion 29411-9. In an embodiment, the first conductive portion 29411-1, the second conductive portion 29411-2, the third conductive portion 29411-3, the fourth conductive...

Claims

1. An electronic device (101; 201; 401; 1401; 1501; 2301; 2501; 2701; 2901), including: Housing (210; 2300; 2500; 2700; 2900), including components forming electronic devices (101; 201; A side member of the outer portion of (401; 1401; 1501; 2301; 2501; 2701; 2901), and includes conductive portions (4411; 14411; 15411; 23411; 25411; 27411; 29411). Printed circuit boards (PCBs) (450; 550; 650; 750A; 750B; 750C; 750D; 750E; 750F; 750G; 850; 950; 1050; 1150; 1250; 1350; 1450; 1550; 1650; 1750A; 1750B; 1850; 1950; 2350a; 2550a; 2750a; 2950a) are provided in housings (210; 2310; 2510; 2710; 2910); as well as Wireless communication circuits (490; 1490; 1590; 2390; 2590; 2790; 2990) are electrically connected to the PCB. The PCB includes: Multiple first coupling pads (5511; 7511; 8511; 9511; 10511; 11511; 12511; 13511; 14511; 15511; 17511; 18511; 19511) are provided on at least some of the multiple layers of the PCB; At least one second coupling pad (5512; 7512; 8512; 9512; 10512; 11512; 12512; 13512; 14512; 15512; 17512; 18512; 19512) is spaced apart from a plurality of first coupling pads; Dielectrics (552; 752; 852; 952; 1052; 1152; 1252; 1352; 1452; 1552; 1752; 1852; 1952) are provided between a plurality of first coupling pads and at least one second coupling pad; and Electrical connection components (453; 553; 653; 753; 853; 953; 1053; 1153; 1253; 1353; 1453; 1553; 1753; 1853) are connected to a plurality of first coupling pads to form an electrical path and are connected to conductive portions. At least one second coupling pad is connected to the wireless communication circuit to form an electrical path, and In this embodiment, at least a portion of at least one second coupling pad is provided between a pair of first coupling pads among a plurality of first coupling pads.

2. The electronic device according to claim 1, wherein, At least one second coupling pad (5512; 7512) is provided as a plurality of second coupling pads, and In this embodiment, a plurality of first coupling pads (5512; 7512) and a plurality of second coupling pads (5512; 7512) are alternately provided along a first direction on at least some of the multiple layers of the PCB.

3. The electronic device according to claim 1 or 2, wherein, Multiple first coupling pads (5511; 7511) are adjacent to multiple second coupling pads (5512; 7512), and corresponding capacitors for indirect electrical signal delivery are configured to be formed between the multiple first coupling pads and the multiple second coupling pads. The total capacitance formed on the PCB is configured to be greater than or equal to 10 picofarads (pF).

4. The electronic device according to any one of claims 1 to 3, wherein, The overlapping areas between the multiple first coupling pads (5511; 7511) and the multiple second coupling pads (5512; 7512) are substantially similar in the first direction.

5. The electronic device according to any one of claims 1 to 4, wherein, PCB also includes: At least one first conductive via (5551; 7551; 8551; 9551; 10551; 11551; 12551; 13551; 14551; 15551; 17551; 18551; 19551) is connected to a plurality of first coupling pads to form an electrical path; and At least one second conductive via (5552; ​​7552; 8552; 9552; 10552; 11552; 12552; 13552; 14552; 15552; ​​17552; 18552; 19552) is connected to a second coupling pad to form an electrical path.

6. The electronic device according to any one of claims 1 to 5, wherein, The PCB (1050) has a first board surface (1050a) and a second board surface (1050b) opposite to the first board surface, and The dielectric (1052) is provided on the surface of the first board and the surface of the second board, such that a plurality of first coupling pads (10511) and at least one second coupling pad (10512) are not exposed to the outside of the PCB.

7. The electronic device according to any one of claims 1 to 6, wherein, PCBs (350; 450; 1850) also include: A switch (1859) is connected to at least one of at least one first conductive via (18551) and at least one second conductive via (18552), and is configured to selectively block the electrical path formed by the at least one conductive via.

8. The electronic device according to any one of claims 1 to 7, wherein, The PCBs (550; 550D; 550E; 550F; 550G; 550H) also include: Grounding element (556) is spaced apart from a plurality of first coupling pads (5511) and at least one second coupling pad (5512); and The discharge inductor section (557) is configured to sense electrical signal discharge from a plurality of first coupling pads (5511) to the grounding element (556).

9. The electronic device according to any one of claims 1 to 8, wherein, At least one of the plurality of first coupling pads (5511; 5511D; 5511E; 5511F; 5511G) and a grounding element (556) are provided on the same layer of the PCB, and The discharge inductor section (557) includes: At least one first discharge element (5571) is directly connected to at least one first coupling pad (5511D; 5511F; 5511G) on the same layer as the ground element (556) and protrudes toward the ground element, or At least one second discharge member (5572) is connected to the ground member (556) and protrudes toward at least one first coupling pad (5511; 5511D; 5511E; 5511F; 5511G) provided on the same layer as the ground member (556).

10. The electronic device according to any one of claims 1 to 9, wherein, A first coupling pad (7511) of a plurality of first coupling pads (7511) is adjacent to a second coupling pad (7512) of at least one second coupling pad (7512) along a first direction. The first coupling pad and the second coupling pad form a coupling pad set, and The distance (d1) between the first and second coupled pads forming the coupled pad set in the first direction is smaller than the distance (d2) between adjacent coupled pad sets in the first direction.

11. The electronic device according to any one of claims 1 to 10, wherein, At least one first coupling pad (12511; 13511) and at least one second coupling pad (12512; 13512) of a plurality of first coupling pads (12511; 13511) are provided on the same layer in a first direction relative to the PCB (1250; 1350), and In this embodiment, at least one first coupling pad and at least one second coupling pad on the same layer are alternately provided in a second direction perpendicular to the first direction of the PCB.

12. The electronic device according to any one of claims 1 to 11, wherein, The PCB (1550) also includes: The third coupling pad (15513) is electrically insulated from a plurality of first coupling pads (15511) and at least one second coupling pad (15512) based on a dielectric (1552). Wherein, the third coupling pad (15513) and at least one second coupling pad (15512) at least partially overlap in a first direction of the PCB (1550), and The electrical connection component (1553) includes: A first electrical connection member (15531) is connected to at least some of a plurality of first coupling pads (15511) to form an electrical path; and The second electrical connection component (15532) is connected to the third coupling pad (15513) to form an electrical path.

13. The electronic device according to any one of claims 1 to 12, wherein, The side member (1540) includes a first conductive portion (15411-1) and a second conductive portion (15411-2) electrically separated along the outside of the electronic device. The first electrical connection member (15531) and the second electrical connection member (15532) are respectively connected to the first conductive part (15411-1) and the second conductive part (15411-2).

14. The electronic device according to any one of claims 1 to 13, wherein, The PCB (1450) also includes: The fourth coupling pad (14514), electrically insulated from a plurality of first coupling pads (14511) and at least one second coupling pad (14512) by a dielectric (1452), is connected to the wireless communication circuit (1490) to form an electrical path, and Among them, at least one of the plurality of first coupling pads (14511) and the fourth coupling pad (14514) at least partially overlap in a first direction of the PCB (1450).

15. The electronic device according to any one of claims 1 to 14, wherein, PCB (1750A; 1750b) also includes: Radiation components (1756; 1757) include conductive material or conductive patterns, and The radiating components (1756; 1757) overlap with at least one second coupling pad (17512) in a first direction of the PCB, or are electrically connected to the wireless communication circuit (1490).

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