High-efficiency automatic splicing system for indium antimonide short crystal rods

Abstract

This invention relates to a highly efficient automated splicing system for indium antimonide short crystal rods, belonging to the field of semiconductor material processing technology. Specifically, it relates to a highly efficient bonding and slicing technology for multiple short crystal rods of indium antimonide, indium phosphide, and other materials. The system includes a crystal rod conveying unit, a crystal orientation and size measurement unit, a splicing planning module, a buffer plate selection and adhesive application unit, and a crystal rod posture adjustment and bonding unit. This system achieves full automation from crystal rod loading to long rod assembly unloading. One operator can simultaneously manage three machines, requiring only periodic material replenishment; this reduces labor requirements by more than 80% compared to traditional manual splicing.

Description

Technical Field

[0001] This invention relates to the field of semiconductor material processing technology, specifically to a high-efficiency bonding and slicing technology for multiple short crystal rods such as indium antimonide and indium phosphide. Background Technology

[0002] Indium antimonide (ISI) is an important material for infrared detectors, and its crystal rods are typically short (approximately 50-80 mm) after growth. To improve the processing efficiency of subsequent wire cutting or slicing machines, multiple short crystal rods are often bonded together on a substrate to form a single "long rod" for one-time cutting. However, ISI is soft and brittle, sensitive to mechanical damage, and the bonding process requires extremely high precision. Therefore, multiple crystal rods must be strictly coplanar, with flush end faces and consistent overall crystal orientation; otherwise, the cut wafers will have uneven thickness, poor parallelism, or even breakage. Currently, most existing crystal rod orientation and bonding processes rely on manual labor or semi-automatic equipment, resulting in low efficiency, precision dependent on operator experience, poor consistency, and easy damage to the crystal rods. Existing automated bonding equipment typically does not consider the coplanar calibration requirements for multi-rod bonding, nor is it designed to prevent damage due to the soft and brittle nature of ISI, thus failing to meet the requirements for high-quality, high-efficiency ISI short rod bonding production. Summary of the Invention

[0003] This invention aims to overcome the shortcomings of existing technologies and provide a control method to improve the slicing efficiency of indium antimonide crystal rods. Through full-process automation and refined process control, it achieves efficient and high-precision splicing of multiple short crystal rods, significantly improving slicing efficiency and yield, and making the spliced ​​long rod assembly perfectly compatible with the specifications of multi-wire cutting machines such as the Highbird 610SD.

[0004] A high-efficiency automated splicing system for indium antimonide short crystal rods, comprising:

[0005] The crystal rod delivery unit is used to ensure the uniform orientation of the crystal rods.

[0006] The crystal orientation and size measurement unit acquires data on the crystal rod's external profile, diameter, end face tilt, length, end face parallelism, and crystal orientation.

[0007] The splicing planning module is used to calculate the crystal rod grouping and splicing parameters based on the measurement data of all crystal rods in the batch using a multi-objective optimization algorithm.

[0008] For each crystal rod, the angle around the Y-axis that needs to be compensated is -Δθ_Y, and the angle around the X-axis is -Δθ_X; for the whole group, the comprehensive deviation of multiple crystal rods is considered so that the overall crystal orientation after final bonding tends to be consistent.

[0009] The multi-objective optimization algorithm specifically includes the following steps:

[0010] S1, Data Input

[0011] Obtain measurement data for all crystal rods in the current batch, including length Li, X-axis crystal orientation deviation Δθx,i, Y-axis crystal orientation deviation Δθy,i, buffer plate thickness t, and effective length L of the material holder. max ;

[0012] Where i = 1, 2, 3…n, n represents the number of crystal rods in each group. In this embodiment, each group has three crystal rods, so n = 3, i = 1 represents crystal rod 1, i = 2 represents crystal rod 2, and i = 3 represents crystal rod 3.

[0013] In this embodiment, t = 0.5 mm; L max =270mm;

[0014] S2, Grouping Optimization

[0015] A clustering algorithm based on Euclidean distance is used to divide the crystal rods into several groups of three rods each, minimizing the combined differences in length and crystal orientation deviation within each group; the objective function is:

[0016] ;

[0017] in:

[0018] Length difference ΔL tol =0.02mm, crystal orientation deviation Δθ tol =0.02°;

[0019] α and β are weighting coefficients, where α = 0.5 and β = 0.5.

[0020] Simultaneously satisfying the total length ∑L of each group of crystal rods containing the buffer plate. i +(n-1)t≤L max ;

[0021] S3, Within-group sorting

[0022] Within each group, crystal rods are arranged in descending order of length, ensuring that the longer crystal rods are located at both ends to facilitate subsequent end-face alignment adjustments.

[0023] S4, Buffer plate layout and pre-compensation angle calculation

[0024] Based on the crystal orientation deviation of each crystal rod, calculate the required preset tilt angle of the buffer plate corresponding to each crystal rod:

[0025] α i =-Δθ x,i ,β i =-Δθ y,i ;

[0026] This angle is achieved by the adhesive-applying robotic arm when pasting the buffer plate, that is, the inclination of the buffer plate relative to the material base plane, which is used to pre-compensate for crystal orientation deviation before bonding;

[0027] S5, Calculation of Overall Crystal Orientation Compensation Parameters

[0028] For the entire set of crystal rods, calculate the vector average of their X-axis and Y-axis crystal orientation deviations:

[0029] ;

[0030] ;

[0031] The final rotation compensation angle of the bonding worktable is:

[0032] ;

[0033] ;

[0034] This compensation ensures that the overall crystal orientation of the entire group of bonded crystal rods approaches the target direction. <100> The residual deviation can be controlled within 0.02°;

[0035] S6, Output command

[0036] The system will sequentially send the grouping results, crystal rod order, buffer plate pretilt angle, and worktable rotation compensation angle to the buffer plate selection and gluing unit and the crystal rod attitude adjustment and bonding unit for execution.

[0037] The buffer plate is optional and the glue application unit is used. The buffer plate is pasted at a preset angle to a designated position on the material holder. By pasting the buffer plate at an angle, an angle compensation basis is provided for subsequent crystal rod bonding. The robotic arm applies a glue layer evenly to the upper surface of the buffer plate according to a preset path.

[0038] The crystal rod attitude adjustment and bonding unit performs orientation compensation and bonding based on the calculated crystal orientation deviation data (Δθ_X, Δθ_Y); it acquires side and end face images of the bonded crystal rod and the new crystal rod to be bonded, and performs coplanar control; it controls the pressure during the bonding process to ensure uniform bonding force and consistent adhesive layer thickness.

[0039] This invention employs a multi-loop closed-loop control system—visual pre-calculation, real-time laser monitoring, and pressure feedback verification—to control the adhesive dosage deviation within 20±0.05g and the adhesive layer thickness and uniformity within 2.0±0.1mm. This effectively avoids air bubbles or poor connections caused by adhesive overflow or insufficient adhesive, significantly improving bonding strength and the flatness of subsequent wafer cutting. X-ray diffraction and optical positioning are combined for measurement, along with X-ring scanning and Gaussian fitting algorithms, achieving an angular resolution of 0.001°. High-precision encoder closed-loop feedback is used for attitude adjustment, ensuring an overall crystal orientation deviation of ≤0.02° after splicing, greatly improving the thickness uniformity and crystal orientation consistency of multi-wire-cut wafers. By coordinating the four units of conveying, measuring, applying adhesive, and bonding in parallel, waiting time between workstations is eliminated. The splicing time for a single batch of three crystal rods is reduced from 30 minutes by manual operation to less than 8 minutes, increasing production efficiency by over 75%.

[0040] The system of this invention automates the entire process from crystal rod feeding to long rod assembly unloading. One operator can manage three machines at the same time and only needs to replenish materials periodically. Compared with traditional manual splicing, the labor demand is reduced by more than 80%. Attached Figure Description

[0041] Figure 1 This is a flowchart of the present invention.

[0042] Figure 2 crystal orientation <100> and <211> Schematic diagram of the crystal orientation of indium antimonide positioning plane. Detailed Implementation

[0043] The present invention will now be described in detail with reference to the embodiments and accompanying drawings.

[0044] Example 1: The existing crystal rod orientation and bonding production line is automated to achieve efficient splicing of indium antimonide short crystal rods. The following splicing system is adopted.

[0045] A high-efficiency automated splicing system for indium antimonide short crystal rods, comprising:

[0046] The crystal rod delivery unit is used to ensure the uniform orientation of the crystal rods.

[0047] In this embodiment, the crystal rod conveying unit adopts a conveying method combining a dual-channel belt conveyor and a robotic arm, which can buffer 20 short crystal rods at the same time; the orientation is uniformly confirmed by a vision recognition system to ensure the consistency of subsequent measurements.

[0048] The robotic arm can be a vacuum suction cup, with the surface of the suction cup covered with a polyurethane elastic layer to prevent scratches.

[0049] The crystal orientation and size measurement unit acquires data on the crystal rod's external profile, diameter, end face tilt, length, end face parallelism, and crystal orientation.

[0050] In this embodiment, the crystal rod data measurement unit includes a non-contact optical measurement device, an X-ray diffraction crystal orientation measurement device, and a length measurement device, wherein...

[0051] A non-contact optical measurement device performs a rapid three-dimensional scan, acquiring data on the crystal rod's outline, diameter, and end face tilt in about 5 seconds. This data is used for subsequent crystal rod size matching and optical positioning of the buffer plate with a CCD camera.

[0052] The X-ray diffraction crystal orientation measurement device automatically measures the crystal orientation of a crystal rod, and its working principle is based on Bragg's law. In this embodiment, the target crystal orientation is... <100> Direct measurement <100> The diffraction of the surface is difficult, therefore, by measuring and <100> Crystal planes with a fixed angle (such as <211> The crystal orientation deviation is indirectly calculated using the plane; according to the crystallographic formula, the angle Ø between the two crystal orientations [u1v1w1] and [u2v2w2] satisfies:

[0053] cos Ø= ;

[0054] The result can be obtained from the above formula. <100> and <211> The included angle is 35.26°. <211> and <111> The included angle is 19.47°, which matches the theoretical values ​​of 35.3° and 19.5°.

[0055] During measurement, Bragg's law is used to calculate... <211> The expected diffraction angle is 2θ. The X-ray diffraction crystal orientation measuring device is placed at the corresponding angle, and a χ-ring rotation scan is performed. If the detector captures the strongest diffraction signal at the theoretically calculated position of 35.3°, it indicates that the crystal rod's orientation is accurate. <100> If the strongest signal appears at a slightly off-center position, it indicates that there is a deviation in the crystal orientation, and the deviation value is the scanning angle offset.

[0056] In this step, because <100> and <211> The included angle is 35.3°, therefore the initial orientation of the measuring device cannot be rotated to angle θ, but must be set at an angle of θ. <100> Near the direction where the axis is at 35.3°;

[0057] This embodiment uses a copper target X-ray tube (35kV, 25mA). The strongest peak is located within ±5° of the theoretical diffraction angle using a rotating X-ring scan. The peak position is determined using a Gaussian fitting algorithm, achieving an angular resolution of 0.001° and a measurement accuracy of ≤0.01°, taking approximately 15 seconds. The measurement results include those from the crystal rod. <100> The deviation angles (Δθ_X, Δθ_Y) of the direction relative to the X and Y axes of the device coordinate system, and the direction of the deviation;

[0058] After the crystal orientation measurement is completed, the crystal rod is transferred to a high-precision length measuring device to measure the length and end face parallelism. The measurement accuracy is ±0.003mm, and the measurement takes about 3 seconds.

[0059] The splicing planning module is used to calculate the crystal rod grouping and splicing parameters based on the measurement data of all crystal rods in the batch using a multi-objective optimization algorithm.

[0060] In this embodiment, within a batch, three crystal rods with a length difference ≤0.02mm and a crystal orientation deviation ≤0.02° are grouped together. The arrangement order of each crystal rod is determined, and the overall crystal orientation compensation amount for each group is calculated based on the crystal orientation deviation of each crystal rod, including the compensation amount for each individual crystal rod and the entire group. This ensures that the total length of the spliced ​​long rod assembly is less than 270mm and the diameter is ≤6 inches, to accommodate the winding width of the Highbird 610SD wire saw. For each crystal rod, the angle around the Y-axis to be compensated is -Δθ_Y, and the angle around the X-axis is -Δθ_X. For the entire group, the comprehensive deviation of multiple crystal rods is considered to make the overall crystal orientation of the final bonded assembly more consistent.

[0061] The multi-objective optimization algorithm specifically includes the following steps:

[0062] S1, Data Input

[0063] Obtain measurement data for all crystal rods in the current batch, including length Li, X-axis crystal orientation deviation Δθx,i, Y-axis crystal orientation deviation Δθy,i, buffer plate thickness t, and effective length L of the material holder. max ;

[0064] Where i = 1, 2, 3…n, n represents the number of crystal rods in each group. In this embodiment, each group has three crystal rods, so n = 3, i = 1 represents crystal rod 1, i = 2 represents crystal rod 2, and i = 3 represents crystal rod 3.

[0065] In this embodiment, t = 0.5 mm; L max =270mm;

[0066] S2, Grouping Optimization

[0067] A clustering algorithm based on Euclidean distance is used to divide the crystal rods into several groups of three rods each, minimizing the combined differences in length and crystal orientation deviation within each group; the objective function is:

[0068] ;

[0069] in:

[0070] Length difference ΔL tol =0.02mm, crystal orientation deviation Δθ tol =0.02°;

[0071] α and β are weighting coefficients, where α = 0.5 and β = 0.5.

[0072] Simultaneously satisfying the total length ∑L of each group of crystal rods containing the buffer plate. i +(n-1)t≤Lmax ;

[0073] S3, Within-group sorting

[0074] Within each group, crystal rods are arranged in descending order of length, ensuring that the longer crystal rods are located at both ends to facilitate subsequent end-face alignment adjustments.

[0075] S4, Buffer plate layout and pre-compensation angle calculation

[0076] Based on the crystal orientation deviation of each crystal rod, calculate the required preset tilt angle of the buffer plate corresponding to each crystal rod:

[0077] α i =-Δθ x,i ,β i =-Δθ y,i ;

[0078] This angle is achieved by the adhesive-applying robotic arm when pasting the buffer plate, that is, the inclination of the buffer plate relative to the material base plane, which is used to pre-compensate for crystal orientation deviation before bonding;

[0079] S5, Calculation of Overall Crystal Orientation Compensation Parameters

[0080] For the entire set of crystal rods, calculate the vector average of their X-axis and Y-axis crystal orientation deviations:

[0081] ;

[0082] ;

[0083] The final rotation compensation angle of the bonding worktable is:

[0084] ;

[0085] ;

[0086] This compensation ensures that the overall crystal orientation of the entire group of bonded crystal rods approaches the target direction. <100> The residual deviation can be controlled within 0.02°;

[0087] S6, Output command

[0088] The system sequentially sends the grouping results, crystal rod order, buffer plate pretilt angle, and worktable rotation compensation angle to the buffer plate selection and gluing unit and the crystal rod posture adjustment and bonding unit for execution.

[0089] The buffer plate is optional and the glue application unit is used. The buffer plate is pasted at a preset angle to a designated position on the material holder. By pasting the buffer plate at an angle, an angle compensation basis is provided for subsequent crystal rod bonding. The robotic arm applies a glue layer evenly to the upper surface of the buffer plate according to a preset path.

[0090] The adhesive layer uses different adhesives for different bonding interfaces. JX5018 epoxy resin is used for the crystal rod-graphite buffer plate, and AD3848BR-2 / AD1238A-2 fast-curing adhesive is used for the graphite-material seat and crystal rod-support strip. An automatic dispensing system ensures precise mixing of the two-component adhesive (accuracy ±0.1g). During dispensing, the robotic arm evenly applies the adhesive layer to the upper surface of the buffer plate along a preset path. The amount of adhesive used for a single crystal rod is controlled at 20.0±0.05g, the adhesive layer thickness is controlled at 2.0±0.1mm, and the dispensing time per plate is approximately 8 seconds. A laser displacement sensor monitors the adhesive layer height in real time and provides feedback for adjustment.

[0091] The crystal rod attitude adjustment and bonding unit performs orientation compensation and bonding based on the calculated crystal orientation deviation data (Δθ_X, Δθ_Y); it acquires side and end face images of the bonded crystal rod and the new crystal rod to be bonded, and performs coplanar control; it controls the pressure during the bonding process to ensure uniform bonding force and consistent adhesive layer thickness.

[0092] In this embodiment, the prepared material base assembly is conveyed to a high-precision bonding worktable. The worktable is driven by an air-bearing guide rail and a linear motor, with a Y and Z axis positioning accuracy of ±0.005mm and an XZ plane rotary table angular positioning accuracy of ≤0.01°.

[0093] The first crystal rod to be spliced ​​undergoes automatic orientation compensation based on its crystal orientation deviation data (Δθ_X, Δθ_Y):

[0094] First, the crystal rod attitude adjustment mechanism drives the crystal rod to rotate around its own axis by clamping it with a double roller, with a rotation angle equal to -Δθ_Y, in order to compensate for the Y-axis deviation; the mechanism adopts high-precision encoder closed-loop control, and the rotation positioning accuracy is ≤0.01°;

[0095] Then, the high-precision bonding worktable drives the material seat assembly to rotate around the XZ plane, with a rotation angle equal to -Δθ_X, to compensate for the X-axis deviation, and closed-loop control is also used.

[0096] After compensation is completed, the robotic arm moves the crystal rod above the bonding station. At this point, the actual crystal orientation of the crystal rod is aligned with the target direction of the equipment coordinate system (i.e., <100> Precise alignment, with a deviation ≤0.02°.

[0097] Splicing calibration and coplanar control: Obtain side and end face images of the bonded crystal rod and the new crystal rod, and calculate the side coplanar deviation ΔD and the end face height difference ΔH to keep the height difference within the allowable range;

[0098] In this embodiment, when bonding the second and subsequent crystal rods, the splicing calibration and coplanar control module is activated, and a high-resolution industrial camera (5 million pixels, 30fps) fixed on the equipment frame captures images of the side and end faces of the bonded crystal rods and the new crystal rods to be bonded; the image processing system uses a sub-pixel edge extraction algorithm to calculate the side coplanar deviation ΔD and the end face height difference ΔH.

[0099] If ΔD or ΔH exceeds the set threshold (ΔD≤0.01mm, ΔH≤0.005mm), the control system drives the bonding stage to make micro-movements in the Y and Z directions or a slight pitch around the X axis until the deviation is within the allowable range. This process requires crystal orientation to be maintained to ensure that the compensated crystal orientation is not damaged when adjusting the position.

[0100] In this embodiment, a closed-loop pressure control system is adopted. The pressure head of the pressing mechanism is embedded with a high-precision pressure sensor (range 0–10N, accuracy 0.01N), which collects the current pressure value in real time and feeds it back to the central controller. The controller compares the measured pressure with the preset pressure curve (e.g., 0.5N held for 2s → 2N held for 5s → 0.5N held for 3s), calculates the adjustment amount through the built-in PID algorithm, and then drives the servo motor or proportional valve to adjust the drive current or air pressure of the pressing mechanism, so that the actual pressure dynamically tracks the set value. At the same time, the controller coordinates the adjustment of the rising speed of the high-precision bonding worktable to ensure a smooth pressure transition during the pressing process and avoid impact or overpressure. This closed-loop control mechanism ensures uniform and controllable bonding force and consistent adhesive layer thickness, effectively improving the splicing quality.

[0101] During the bonding process, the camera continuously monitors the process. If the crystal rod is found to be misaligned, the process is immediately paused and fine-tuned.

[0102] Repeat the above steps until all crystal rods are bonded together, forming a long rod assembly. The total time from measurement to bonding of the three crystal rods in the entire batch is approximately 7 minutes and 30 seconds, a 75% improvement in efficiency compared to manual operation (approximately 30 minutes). The bonded long rod assembly has a total length of 215mm (composed of three crystal rods with an average length of 70mm plus a buffer plate thickness) and a diameter ≤6 inches (153mm), fully meeting the loading requirements of the Highbird 610SD multi-wire dicing machine. The operator directly installs the assembly onto the roller of the dicing machine; the 270mm winding width can accommodate the entire assembly. In actual cutting tests, the assembly automatically oriented and spliced ​​using this invention produced wafers with a thickness deviation ≤0.015mm, a crystal orientation deviation ≤0.02°, and a wafer yield of 96%, an 11 percentage point improvement compared to traditional manual splicing. No wire breaks or wafer fractures due to splicing quality issues occurred during the cutting process, demonstrating the significant effect of this invention in improving cutting efficiency and quality.

[0103] Table 1

[0104] Item Manual operation Apparatus of the present invention Lifting amplitude Single batch splicing time 30 minutes 7.5 minutes 75% Coplanar deviation ±0.05mm ≤0.01mm 5 times End surface flushness ±0.03mm ≤0.005mm 6 times Crystal direction consistency deviation ±0.1° ≤0.02° 5 times Crystal bar damage rate 5% <0.5% 90% Subsequent slicing yield 85% 96% 11% Labor demand 2 people / shift 0.3 people / shift 85%

Claims

1. A high-efficiency automatic splicing system for indium antimonide short crystal rods, characterized in that... The system includes: The crystal rod delivery unit is used to ensure the uniform orientation of the crystal rods. The crystal orientation and size measurement unit acquires data on the crystal rod's external profile, diameter, end face tilt, length, end face parallelism, and crystal orientation. The splicing planning module is used to calculate the crystal rod grouping and splicing parameters based on the measurement data of all crystal rods in the batch using a multi-objective optimization algorithm. For each crystal rod, the angle around the Y-axis that needs to be compensated is -Δθ_Y, and the angle around the X-axis is -Δθ_X; for the whole group, the comprehensive deviation of multiple crystal rods is considered so that the overall crystal orientation after final bonding tends to be consistent. The multi-objective optimization algorithm specifically includes the following steps: S1, Data Input Obtain measurement data for all crystal rods in the current batch, including length Li, X-axis crystal orientation deviation Δθx,i, Y-axis crystal orientation deviation Δθy,i, buffer plate thickness t, and effective length L of the material holder. max ; Where i = 1, 2, 3…n, n represents the number of crystal rods in each group. In this embodiment, each group has three crystal rods, so n = 3, i = 1 represents crystal rod 1, i = 2 represents crystal rod 2, and i = 3 represents crystal rod 3. In this embodiment, t = 0.5 mm; L max =270mm; S2, Grouping Optimization A clustering algorithm based on Euclidean distance is used to divide the crystal rods into several groups of three rods each, minimizing the combined differences in length and crystal orientation deviation within each group; the objective function is: ； in: Length difference ΔL tol =0.02mm, crystal orientation deviation Δθ tol =0.02°; α and β are weighting coefficients, where α = 0.5 and β = 0.

5. Simultaneously satisfying the total length ∑L of each group of crystal rods containing the buffer plate. i +(n-1)t≤L max ; S3, Within-group sorting Within each group, crystal rods are arranged in descending order of length, ensuring that the longer crystal rods are located at both ends to facilitate subsequent end-face alignment adjustments. S4, Buffer plate layout and pre-compensation angle calculation Based on the crystal orientation deviation of each crystal rod, calculate the required preset tilt angle of the buffer plate corresponding to each crystal rod: a i =-Δθ x,i ,b i =-Δθ y,i ; This angle is achieved by the adhesive-applying robotic arm when pasting the buffer plate, that is, the inclination of the buffer plate relative to the material base plane, which is used to pre-compensate for crystal orientation deviation before bonding; S5, Calculation of Overall Crystal Orientation Compensation Parameters For the entire set of crystal rods, calculate the vector average of their X-axis and Y-axis crystal orientation deviations: ； ； The final rotation compensation angle of the bonding worktable is: ； ； This compensation ensures that the overall crystal orientation of the entire group of bonded crystal rods approaches the target direction. <100> The residual deviation can be controlled within 0.02°; S6, Output command The system will sequentially send the grouping results, crystal rod order, buffer plate pretilt angle, and worktable rotation compensation angle to the buffer plate selection and gluing unit and the crystal rod attitude adjustment and bonding unit for execution. The buffer plate is optional and the glue application unit is used. The buffer plate is pasted at a preset angle to a designated position on the material holder. By pasting the buffer plate at an angle, an angle compensation basis is provided for subsequent crystal rod bonding. The robotic arm applies a glue layer evenly to the upper surface of the buffer plate according to a preset path. The crystal rod attitude adjustment and bonding unit performs orientation compensation and bonding based on the calculated crystal orientation deviation data (Δθ_X, Δθ_Y); it acquires side and end face images of the bonded crystal rod and the new crystal rod to be bonded, and performs coplanar control; it controls the pressure during the bonding process to ensure uniform bonding force and consistent adhesive layer thickness.

2. The high-efficiency automatic splicing system for indium antimonide short crystal rods as described in claim 1, characterized in that... For the adhesive layer, different adhesives are selected for different bonding interfaces. JX5018 epoxy resin adhesive is used for crystal rod-graphite buffer plate, and AD3848BR-2 / AD1238A-2 fast curing adhesive is used for graphite-material seat and crystal rod-support strip.

3. The high-efficiency automatic splicing system for indium antimonide short crystal rods as described in claim 1, characterized in that... During the bonding process, the camera continuously monitors the process. If the crystal rod is found to be misaligned, the process is immediately paused and fine-tuned.

4. The high-efficiency automatic splicing system for indium antimonide short crystal rods as described in claim 1, characterized in that... The crystal rod data measurement unit includes a non-contact optical measurement device, an X-ray diffraction crystal orientation measurement device, and a length measurement device. Non-contact optical measurement devices acquire data on the crystal rod's external profile, diameter, and end face tilt. X-ray diffraction crystal orientation measuring device for directional measurement of crystal rod orientation; A high-precision length measuring device measures length and end face parallelism.

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