High-precision automatic block ring line cutting device for silicon carbide wafer

Abstract

The application discloses a high-precision automatic block ring line cutting device for silicon carbide wafers and particularly relates to the technical field of ring line cutting, which comprises a protective shell, a PLC controller is fixedly installed on one side of the protective shell, an operating frame is fixedly installed in the interior of the protective shell, and the top surface of the operating frame is provided with two feeding frames. Ring-shaped diamond lines are symmetrically arranged on the two sides of the operating frame, a silicon carbide crystal ingot is arranged between the two ring-shaped diamond lines, a double-side synchronous feeding mechanism driven by a forward and reverse toothed rod is cooperated, the two feeding frames always maintain the same feeding speed and displacement during cutting, the cutting forces are equal in size and opposite in direction when the two ring-shaped diamond lines simultaneously cut into the crystal ingot, the cutting forces are mutually counteracted in the crystal ingot, and no additional bending moment is generated. The structure effectively solves the problems that the crystal ingot is bent and deformed due to uneven force during unilateral cutting, cracks are easily caused in the high-stress edge area, and the cracking risk of the silicon carbide superhard and brittle material during the cutting process is reduced.

Description

Technical Field

[0001] This invention relates to the field of circular cutting technology, and more specifically to a high-precision automatic segmentation circular cutting device for silicon carbide wafers. Background Technology

[0002] Silicon carbide wafers are circular, thin-film single-crystal substrates obtained from silicon carbide ingots through multiple precision processing steps and can be directly used in semiconductor chip manufacturing. Silicon carbide ingots are the core raw material for wafers, and the two are in a progressive upstream-downstream relationship of raw material and finished substrate. The quality of the ingot directly determines the performance, yield, and upper limit of the wafer's specifications. Silicon carbide ingots are large-size, high-purity cylindrical silicon carbide single crystal blocks prepared through crystal growth processes. They are the core raw material product at the very upstream of the silicon carbide industry chain and the only core raw material for wafer preparation.

[0003] In the process of preparing silicon carbide wafer substrates, cutting silicon carbide ingots into wafers is a key step that determines material utilization, processing yield and production cost. As a third-generation semiconductor material, silicon carbide has characteristics such as Mohs hardness, high brittleness and low fracture toughness, which puts extremely high requirements on the precision and stability of the cutting process. In recent years, in order to improve cutting efficiency and reduce the risk of cracking, some high-end cutting equipment has begun to adopt double-line symmetrical cutting technology, that is, two annular diamond wire saws are symmetrically arranged on both sides of the ingot, and the goal of force balance and double efficiency is achieved by synchronous feeding on both sides.

[0004] Existing dual-wire cutting devices mostly use two independent motors to drive the two side feed mechanisms separately, or achieve synchronization through a simple mechanical coupling. In the actual cutting process, due to factors such as the difference in initial tension of the two wire saws, the inconsistency of the guide rail friction coefficient, and the motor response delay, the two side feed mechanisms are very prone to small displacement differences. For ultra-hard and brittle materials such as silicon carbide, even micron-level feed asynchrony can lead to uneven distribution of cutting force on both sides. One wire saw cuts deeper than the other, resulting in a bias cutting phenomenon. Bias cutting not only generates additional bending moment inside the ingot and induces crack propagation in the high-stress area at the edge, but may also cause unilateral overload of the wire saw, accelerating wear or even wire breakage.

[0005] Before double-wire cutting, the wire saws on both sides need to establish a precise initial contact position with the surface of the ingot as a reference point for subsequent feeding. Existing technology usually uses manual visual inspection or simple position sensors for tool setting. The operator first adjusts one side of the wire saw to contact the ingot, and then adjusts the other side. This step-by-step tool setting method is not only inefficient, but also difficult to eliminate the positioning error between the two adjustments. As a result, the initial contact points on both sides are not on the same radial section. When the two wires cut in at the same time, the cutting force on both sides cannot act symmetrically on the ingot, generating a deflection torque, which exacerbates the instability and cracking risk during the cutting process. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a high-precision automatic segmentation and ring cutting device for silicon carbide wafers, thereby solving the problems mentioned in the background art.

[0007] The above-mentioned technical objective of the present invention is achieved through the following technical solution:

[0008] A high-precision automatic segmentation and wire cutting device for silicon carbide wafers includes a protective shell. A PLC controller is fixedly installed on one side of the protective shell, and an operating frame is fixedly installed inside the protective shell. Two feed frames are provided on the top surface of the operating frame. A wire cutting assembly is disposed on the top surface of the operating frame and is used to cut the polycrystalline region at the edge of the silicon carbide ingot. The wire cutting assembly includes a vacuum stage disposed on the top surface of the operating frame. A winding wheel is provided on the bottom surface of the feed frame. A rotation hole is opened on the top surface of the feed frame. A first drive motor is fixedly installed on the top surface of the feed frame. The drive shaft of the first drive motor is fixedly installed with the winding wheel. Two support wheels are provided on the bottom surface of the feed frame. Two rotation holes are opened on the top surface of the feed frame. The inner circular wall surface of the rotation holes is movable. A rotating column is connected to the rotating frame, and the rotating column is fixedly installed with the support wheel. A ring-shaped diamond wire is wound around the outside of the winding wheel and the two support wheels. A mounting groove is provided on one side of the feeding frame, and an electric push rod is fixedly fitted onto the inner circular wall of the mounting groove. A force-bearing block is fixedly installed at one end of the telescopic rod of the electric push rod, and a pressure sensor is fixedly installed inside the force-bearing block. The first drive motor, the electric push rod, and the pressure sensor are electrically connected to the PLC controller. A tensioning component for adjusting the tension of the ring-shaped diamond wire is provided on the top surface of the feeding frame. A feeding component for moving the ring-shaped diamond wire is provided on the top surface of the operating frame. A ranging component for determining the moving distance of the ring-shaped diamond wire is provided inside the operating frame.

[0009] By adopting the above technical solution, and using the set annular diamond wire, when the operator performs annular wire cutting on the edge of a silicon carbide ingot, the silicon carbide ingot is first placed on the top surface of the vacuum stage. Then, the operator uses the first drive motor, whose drive shaft rotates to drive the winding wheel to rotate. The rotation of the winding wheel causes the annular diamond wire to rotate on the surface of the winding wheel. Since the annular diamond wire is wound into a loop on the outer circular wall of the winding wheel and the support wheel, the winding wheel and the two support wheels inside the annular diamond wire will spread it apart. After the annular diamond wire rotates and moves on the surface of the winding wheel and the support wheel, the moving feed frame drives the annular diamond wire to move closer to the silicon carbide ingot, thus facilitating the annular wire cutting of the edge of the silicon carbide ingot. Before the annular diamond wire cuts the silicon carbide ingot, an electric push rod is first used. The drive shaft of the electric push rod extends to drive the force block and pressure sensor to move, so that the pressure sensor is close to the outside of the annular diamond wire. In this state, the operator drives the moving feed frame to move the annular diamond wire. The toroidal diamond wire, electric actuator, force block, and pressure sensor move to bring the toroidal diamond wire close to the surface of the silicon carbide ingot. When the toroidal diamond wire contacts the silicon carbide ingot, a mutual compressive force is generated between them. The silicon carbide ingot then compresses the toroidal diamond wire, which in turn compresses the pressure sensor. Upon receiving a pressure signal, the pressure sensor transmits the signal to the PLC controller, which then stops the feed frame and the toroidal diamond wire. At this point, the toroidal diamond wire only touches the surface of the silicon carbide ingot. When the diamond wire touches the silicon carbide ingot, it rotates to cut the ingot, making it easier for the operator to calculate the feed rate during cutting. The diamond wire is positioned on both sides of the operating frame, so the silicon carbide ingot is between two diamond wires. Through symmetrical cutting on both sides, the diamond wire can cut into the ingot simultaneously, completing two symmetrical annular seams in one feed. If a complete annular groove is to be removed, simultaneous cutting from both sides can evenly divide the cutting depth, with each wire only needing to cut half the depth to merge, significantly reducing cutting time.

[0010] Preferably, the tensioning assembly includes: a movable hole, the movable hole being formed on the top surface of the feed frame; a bidirectional lead screw being movably sleeved inside the movable hole; an operating wheel being fixedly sleeved on the outer circular wall of the bidirectional lead screw; two adjusting blocks being slidably connected inside the movable hole; a first threaded hole being formed on one side of each adjusting block; the first threaded hole being threadedly connected to the bidirectional lead screw; a movable column being fixedly installed on the bottom surface of the adjusting block; and two tensioning wheels being provided on the bottom surface of the feed frame; the movable column being movably sleeved with the tensioning wheels.

[0011] By adopting the above technical solution, with the setting of adjustment blocks, two tensioning wheels are located between the winding wheel and the support wheel. The operator rotates the operating wheel to drive the bidirectional screw to rotate, which in turn causes the two adjustment blocks to move inside the moving hole simultaneously. By reversing the bidirectional screw, the two adjustment blocks can be moved away from or closer to each other. When the two adjustment blocks are far apart, the adjustment blocks will drive the movable column and tensioning wheel to squeeze the toroidal diamond wire, thereby increasing the tension of the toroidal diamond wire. When the two adjustment blocks are close together, the adjustment blocks will drive the movable column and tensioning wheel away from the toroidal diamond wire. At this time, the tension of the toroidal diamond wire will decrease, making it easier to adjust the tension of the toroidal diamond wire.

[0012] Preferably, the feed assembly includes: a mounting hole, the mounting hole being formed on the top surface of the operating frame; a limit hole being formed on one side of the mounting hole; a movable stage being slidably connected inside the mounting hole and slidably connected to the limit hole; a positive and negative threaded rod being movably connected inside the operating frame; a second threaded hole being formed on one side of the movable stage and threadedly connected to the positive and negative threaded rod; a first servo motor being fixedly mounted on the bottom surface of the operating frame; a synchronizing rod being movably connected inside the operating frame; two first transmission wheels being fixedly sleeved on the outer circular walls of the synchronizing rod and the positive and negative threaded rod, with each pair of first transmission wheels forming a group; a first transmission belt being wound around the outer circular wall of each group of first transmission wheels; second synchronizing wheels being fixedly sleeved on the outer circular walls of the first servo motor drive shaft and the synchronizing rod, with a second synchronizing belt being wound around the outer circular walls of the two second synchronizing wheels; and the first servo motor being electrically connected to the PLC controller.

[0013] By adopting the above technical solution, when the operator performs circular cutting on the silicon carbide ingot using the set moving platform, the first servo motor is started. The rotation of the drive shaft of the first servo motor drives the second synchronous wheel to rotate. Then, the two second synchronous wheels rotate simultaneously through the second synchronous belt and drive the synchronous rod to rotate. The rotation of the synchronous rod drives the first transmission wheel to rotate. The rotation of the two first transmission wheels is transmitted through the first transmission belt and drives the positive and negative thread screws to rotate. The rotation of the positive and negative thread screws causes the two moving platforms to move the feed frame and the annular diamond wire, so that the two feed frames and the annular diamond wire can simultaneously approach the silicon carbide ingot. When the pressure signal received by the pressure sensor is transmitted to the PLC controller, the PLC controller will control the first servo motor to stop, so that the feed frame and the annular diamond wire stop moving, allowing the annular diamond wire to maintain slight contact with the surface of the silicon carbide ingot.

[0014] Preferably, the ranging component includes: a center block, which is fixedly installed inside the operating frame, the center block is threadedly connected to the positive and negative threaded rods, ranging slots are respectively opened on both sides of the center block, a laser ranging sensor is fixedly installed inside the ranging slot, and the laser ranging sensor is electrically connected to the PLC controller.

[0015] By adopting the above technical solution, and through the laser rangefinder sensor, when the annular diamond wire contacts the surface of the silicon carbide ingot and stops moving, the laser emitted by the laser rangefinder sensor illuminates the surface of the moving stage. Subsequently, the PLC controller sets the distance between the laser rangefinder sensor and the moving stage to zero, and then the annular diamond wire rotates to cut the silicon carbide ingot. The first servo motor starts synchronously, allowing the feed frame to drive the annular diamond wire to continue moving towards the silicon carbide ingot to cut it. At this time, the moving stage gradually approaches the laser rangefinder sensor, and the distance between the two shortens. The laser rangefinder sensor will then measure a negative distance between itself and the moving stage, and the detected negative value is the feed distance of the annular diamond wire cutting the silicon carbide ingot.

[0016] Preferably, the top surface of the moving platform is provided with a fixing hole, and an electric hydraulic rod is fixedly sleeved on the inner circular wall of the fixing hole. A U-shaped frame is fixedly installed on the top surface of the telescopic rod of the electric hydraulic rod. Limiting blocks are fixedly installed on both sides of the inside of the U-shaped frame. A third threaded hole is provided on both sides of the U-shaped frame and the limiting block. A bolt is threaded to the inner circular wall of the third threaded hole. A sliding groove is provided on both sides of the feed frame, and the limiting block is slidably connected to the sliding groove.

[0017] By adopting the above technical solution and through the fixed holes, the operator uses an electric hydraulic rod. The extension rod of the electric hydraulic rod moves the U-shaped frame, which in turn moves the feed frame and the annular diamond wire upward, thereby adjusting the height of the annular diamond wire. When the operator needs to perform single-sided annular wire cutting, the feed frame is moved away from the vacuum stage, causing the limit block to slide inside the groove. After the feed frame moves away from the vacuum stage, the U-shaped frame and the feed frame can be fastened together by tightening the bolts. At this time, one feed frame is close to the vacuum stage and the other is away from the vacuum stage. When the feed frame close to the vacuum stage cuts the silicon carbide ingot, the feed frame away from the vacuum stage cannot touch the silicon carbide ingot. By resetting the feed frame, both feed frames are brought close to the vacuum stage, thus restoring the mode of cutting silicon carbide ingots on both sides.

[0018] Preferably, a support plate is fixedly installed inside the operating frame. The top surface of the support plate has a movable hole, and a stepper motor is fixedly installed on the bottom surface of the support plate. A main gear is fixedly installed on the top surface of the stepper motor drive shaft, and a driven gear is fixedly installed on the bottom surface of the vacuum stage. The main gear and the driven gear are meshed and connected. Several support legs are fixedly installed on the top surface of the support plate, and auxiliary wheels are movably sleeved inside the support legs. The drive shaft of the stepper motor is electrically connected to the PLC controller.

[0019] By adopting the above technical solution and setting up a vacuum stage, the operator uses a stepper motor. The drive shaft of the stepper motor rotates, which drives the main gear to rotate. In turn, the main gear meshes with and drives the driven gear to rotate. The rotation of the driven gear drives the vacuum stage to rotate, so that the silicon carbide ingot can rotate synchronously when the annular diamond wire is rotating to cut the edge of the silicon carbide ingot.

[0020] Preferably, a bracket is fixedly installed on the bottom surface of the support plate, and a vacuum negative pressure pump is fixedly installed on the inner bottom surface of the bracket. An air pipe is fixedly sleeved on the outer circular wall of the air inlet of the vacuum negative pressure pump. The air pipe passes through the driven gear and is fixedly connected to the vacuum platform. A plurality of adsorption holes are opened on the top surface of the vacuum platform. A bearing is fixedly sleeved on the outer circular wall of the air pipe. The vacuum platform is fixedly sleeved with the outer ring of the bearing.

[0021] By adopting the above technical solution, and by setting up a vacuum negative pressure pump, when the worker places the silicon carbide crystal ingot on the top surface of the vacuum stage, the worker uses the vacuum negative pressure pump to generate negative pressure suction. Then the suction is transmitted to the inside of the vacuum stage through the air pipe, and then transmitted to the top of the vacuum stage through the adsorption hole, so that the silicon carbide crystal ingot can be tightly adsorbed.

[0022] Preferably, a second servo motor is fixedly installed on the inner bottom surface of the operating frame. Two transmission columns are movably connected inside the operating frame. Two first synchronous pulleys are fixedly sleeved on the outer circular wall of each transmission column. Each pair of first synchronous pulleys forms a group. A first synchronous belt is meshed with the outer circular wall of each group of first synchronous pulleys. Second transmission pulleys are fixedly sleeved on the outer circular wall of the transmission column and the drive shaft of the second servo motor, respectively. A second transmission belt is meshed with the outer circular wall of the two second transmission pulleys. A movable frame is fixedly installed on the top surface of the two first synchronous belts. A movable shaft is movably sleeved inside the movable frame. A diamond blade saw is fixedly sleeved on the outer circular wall of the movable shaft. A second drive motor is fixedly installed on one side of the movable frame. The drive shaft of the second drive motor is fixedly installed with the movable shaft. The second drive motor is electrically connected to the PLC controller. A fixing groove is opened on one side of the movable frame. A distance sensor is fixedly installed inside the fixing groove. The distance sensor is electrically connected to the PLC controller.

[0023] By adopting the above technical solution, and using the diamond blade saw, the operator uses a second drive motor. The rotation of the drive shaft of the second drive motor drives the diamond blade saw to rotate. Subsequently, using a second servo motor, the rotation of the drive shaft of the second servo motor drives the second transmission wheel to rotate. The two second transmission wheels rotate synchronously through the transmission belt, driving the transmission column to rotate. In turn, the rotation of the transmission column drives the first synchronous wheel to rotate. The rotation of the first synchronous wheel engages and drives the first synchronous belt to transmit power. Then, the first synchronous belt drives the moving frame and the diamond blade saw to move closer to the vacuum stage, so that the diamond blade saw can get close to the silicon carbide ingot and cut the silicon carbide ingot into pieces. When the moving frame moves closer to the vacuum stage, it will drive the distance sensor to move closer to the operating frame. When the distance sensor detects that it is close to the operating frame, the distance sensor will transmit a signal to the PLC controller. Then, the PLC controller will control the second servo motor to reverse, so that the first synchronous belt reverses and drives the moving frame and the diamond blade saw to reset and move away from the vacuum stage.

[0024] Preferably, a guide plate is fixedly installed inside the operating frame, and a collection compartment is provided inside the operating frame.

[0025] By adopting the above technical solution, the debris generated from cutting silicon carbide ingots will first fall onto the guide plate through the set collection chamber, and then, through the tilt angle of the guide plate, the debris will fall into the interior of the collection chamber for collection.

[0026] In summary, the present invention has the following main beneficial effects:

[0027] 1. This invention symmetrically arranges annular diamond wires on both sides of the operating frame, placing the silicon carbide ingot between the two annular diamond wires. Combined with a dual-sided synchronous feed mechanism driven by forward and reverse screws, the feed frames on both sides maintain the same feed speed and displacement during cutting. When the annular diamond wires on both sides simultaneously cut into the ingot, the cutting forces are equal in magnitude and opposite in direction, canceling each other out inside the ingot and preventing additional bending moments. This structure effectively solves the technical problems of ingot bending and deformation due to uneven force during single-sided cutting, and the tendency for crack propagation in high-stress areas at the edges. It significantly reduces the cracking risk of ultra-hard and brittle silicon carbide materials during cutting. Simultaneously, dual-sided simultaneous cutting shortens the circumferential seam processing time, with the two wire saws evenly dividing the cutting depth, halving the load on a single wire saw, and extending the service life of the diamond wire saw.

[0028] 2. This invention uses a first servo motor to drive the forward and reverse lead screws to rotate, which in turn moves the two moving tables and feed frames synchronously. This ensures that the two annular diamond wires approach the ingot at the same speed and displacement. During the feeding process, the electric push rod drives the force block and pressure sensor to approach the outer side of the annular diamond wire. When the wire saw contacts the surface of the ingot, the extrusion pressure is transmitted to the pressure sensor through the wire saw. After receiving the pressure signal, the PLC controller immediately stops the first servo motor, causing the two feed frames to stop simultaneously. This structure achieves zero-pressure contact positioning between the wire saw and the surface of the ingot, avoiding excessive initial contact that could cause the ingot edge to crack. It establishes a unified benchmark for subsequent accurate calculation of the cutting feed amount, ensuring the synchronicity of the dual-wire cutting and the consistency of the initial position.

[0029] 3. This invention features a laser rangefinder sensor along the moving path of the feed frame. When the annular diamond wire contacts the ingot surface and stops moving, the laser rangefinder sensor sets the distance to the moving stage to zero. During the cutting process, the first servo motor restarts to drive the feed frame to continue feeding. The moving stage gradually approaches the laser rangefinder sensor, and the detected distance value is negative. Its absolute value is the actual cutting depth of the annular diamond wire. This structure achieves real-time, non-contact, and precise monitoring of the cutting depth. The PLC controller can dynamically adjust the feed speed based on the feed data to form a closed-loop control, avoiding edge chipping or wire saw overload due to excessive feed, and ensuring a smooth and controllable cutting process.

[0030] 4. This invention uses a stepper motor to drive the main gear and the driven gear to rotate the vacuum stage, enabling the silicon carbide ingot to switch rotation modes according to the requirements of different cutting stages. In the circumferential cutting stage, the stepper motor runs continuously, driving the ingot to rotate at a uniform speed without interruption. With the fixed feed of the double-sided annular diamond wire, the entire circumference can be cut in one clamping, completely isolating the high-stress polycrystalline region at the edge from the internal monocrystalline region. In the block cutting stage, the stepper motor is changed to intermittent indexing rotation. After each radial cut is completed, it rotates by a set angle before the next cut is made. This structure ensures that a closed circular kerf is formed during circumferential cutting, and each cutting kerf is a straight trajectory during block cutting, resulting in regular fan-shaped blocks. This provides a precise blank reference for the subsequent rod extraction process and avoids material waste caused by cutting trajectory deviation.

[0031] 5. This invention uses an electric hydraulic rod to drive the U-shaped frame, which in turn moves the feed frame up and down, allowing for flexible adjustment of the cutting height to accommodate silicon carbide ingots of different heights. Simultaneously, a sliding groove and a limiting block are provided between the feed frame and the U-shaped frame. By pulling the feed frame, the limiting block slides within the groove. Once in position, tightening the bolt locks one side of the feed frame away from the vacuum stage. This structure allows operators to quickly switch between single-sided and double-sided symmetrical cutting modes according to process requirements: when processing ingots with low edge stress or performing small-size cuts, the single-sided mode can be selected to simplify operation; when efficient, low-risk cutting of large-diameter ingots is required, the double-sided mode can be reverted to fully utilize the advantages of double-line symmetrical cutting.

[0032] 6. This invention uses a vacuum negative pressure pump to generate negative pressure suction on the surface of the vacuum stage through air pipes and adsorption holes, which tightly adsorbs and fixes the silicon carbide ingot. With the help of the radial clamping unit, it ensures that the ingot does not shift or vibrate during high-speed rotation and cutting, while avoiding damage to the ingot surface caused by mechanical clamping. During segmented cutting, the second servo motor drives the moving frame and diamond blade saw to feed towards the ingot through the second transmission wheel, the second transmission belt, the transmission column, the first synchronous wheel, and the first synchronous belt. The distance sensor monitors the distance between the moving frame and the operating frame in real time. When the cutting is detected to be in place, the PLC immediately triggers the second servo motor to reverse, so that the moving frame and diamond blade saw automatically reset. This structure realizes the detection of cutting to place and automatic blade retraction, avoiding overcutting and damage to the equipment or ingot, and ensuring the safety and automation level of the segmented cutting process. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0034] Figure 2 This is a schematic diagram of the operating frame structure of the present invention;

[0035] Figure 3 This is a schematic diagram of the guide plate structure of the present invention;

[0036] Figure 4 This is a schematic diagram of the collection chamber structure of the present invention;

[0037] Figure 5 This is a schematic diagram of the feed frame structure of the present invention;

[0038] Figure 6 This is a schematic diagram of the synchronizing rod structure of the present invention;

[0039] Figure 7 This is a schematic diagram of the transmission column structure of the present invention;

[0040] Figure 8 This is a schematic diagram of the U-shaped frame structure of the present invention;

[0041] Figure 9 This is a schematic diagram of the mobile station structure of the present invention;

[0042] Figure 10 This is a schematic diagram of the second synchronous belt structure of the present invention;

[0043] Figure 11 This is a schematic diagram of the support plate structure of the present invention;

[0044] Figure 12 This is a schematic diagram of the tracheal structure of the present invention;

[0045] Figure 13 This is a schematic diagram of the mobile frame structure of the present invention.

[0046] Reference numerals: 1. Protective shell; 2. Operating frame; 3. Feed frame; 4. Vacuum stage; 5. Winding wheel; 6. Support wheel; 7. Ring-shaped diamond wire; 8. Rotating hole; 9. First drive motor; 10. Mounting slot; 11. Electric push rod; 12. Force block; 13. Pressure sensor; 14. Rotating hole; 15. Rotating column; 16. Moving hole; 17. Bidirectional lead screw; 18. Operating wheel; 19. Adjusting block; 20. First threaded hole; 21. Moving column; 22. Tensioning wheel; 23. Limiting hole; 24. Mounting hole; 25. Moving stage; 26. Positive and negative threaded screw; 27. First servo motor; 28. First transmission wheel; 29. ​​First transmission belt; 30. Second threaded hole; 31. Synchronizing rod; 32. Center block; 33. Range measuring slot; 34. Laser range measuring sensor; 5. Fixing hole; 36. Electro-hydraulic rod; 37. Support plate; 38. Movable hole; 39. Stepper motor; 40. Main gear; 41. Driven gear; 42. Vacuum negative pressure pump; 43. Air pipe; 44. Adsorption hole; 45. Support leg; 46. Auxiliary wheel; 47. Bracket; 48. Second servo motor; 49. Transmission column; 50. Second transmission wheel; 51. Second transmission belt; 52. First synchronous pulley; 53. First synchronous belt; 54. Moving frame; 55. Movable shaft; 56. Diamond blade saw; 57. Second drive motor; 58. Fixing groove; 59. Distance sensor; 60. U-shaped frame; 61. Limiting block; 62. Third threaded hole; 63. Bolt; 64. Slide groove; 65. Second synchronous belt; 66. Guide plate; 67. Collection bin; 68. Second synchronous pulley. Detailed Implementation

[0047] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] Example: Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 A high-precision automatic segmentation and wire cutting device for silicon carbide wafers includes a protective housing 1. A PLC controller is fixedly installed on one side of the protective housing 1. An operating frame 2 is fixedly installed inside the protective housing 1. Two feed frames 3 are provided on the top surface of the operating frame 2. A wire cutting assembly is provided on the top surface of the operating frame 2 for cutting the polycrystalline region at the edge of the silicon carbide ingot. The wire cutting assembly includes a vacuum stage 4, which is located on the top surface of the operating frame 2. A winding wheel 5 is provided on the bottom surface of the feed frame 3. A rotation hole 8 is opened on the top surface of the feed frame 3. A first drive motor 9 is fixedly installed on the top surface of the feed frame 3. The drive shaft of the first drive motor 9 is fixedly installed with the winding wheel 5. The bottom surface of the feed frame 3 is provided with two support wheels 6, and the top surface of the feed frame 3 is provided with two rotating holes 14. The inner circular wall of the rotating hole 14 is movably sleeved with a rotating column 15. The rotating column 15 is fixedly installed with the support wheels 6. The winding wheel 5 and the two support wheels 6 are wound with annular diamond wire 7. The side of the feed frame 3 is provided with a mounting groove 10. The inner circular wall of the mounting groove 10 is fixedly sleeved with an electric push rod 11. One end of the telescopic rod of the electric push rod 11 is fixedly installed with a force block 12. The inside of the force block 12 is fixedly installed with a pressure sensor 13. The first drive motor 9, the electric push rod 11 and the pressure sensor 13 are electrically connected to the PLC controller respectively.

[0049] refer to Figure 1 , Figure 2 , Figure 3 and Figure 5 The top surface of the feed frame 3 is provided with a tensioning assembly for adjusting the tension of the annular diamond wire 7. The tensioning assembly includes a moving hole 16, which is opened on the top surface of the feed frame 3. A double-acting screw 17 is movably sleeved inside the moving hole 16. An operating wheel 18 is fixedly sleeved on the outer circular wall of the double-acting screw 17. Two adjusting blocks 19 are slidably connected inside the moving hole 16. A first threaded hole 20 is opened on one side of the adjusting block 19. The first threaded hole 20 is threadedly connected to the double-acting screw 17. A movable column 21 is fixedly installed on the bottom surface of the adjusting block 19. Two tensioning wheels 22 are provided on the bottom surface of the feed frame 3. The movable column 21 is movably sleeved with the tensioning wheels 22.

[0050] With the annular diamond wire 7 set, symmetrical annular diamond wires 7 are set on both sides of the operating frame 2. After the silicon carbide ingot is placed on the top surface of the vacuum stage 4, it is located between the two annular diamond wires 7. Before the annular wire cutting, the tool positioning is first performed: the electric push rod 11 is started, its drive shaft extends, and drives the force block 12 and pressure sensor 13 to move close to the outside of the annular diamond wire 7. Then, the feed frame 3 drives the annular diamond wire 7, electric push rod 11, force block 12 and pressure sensor 13 to move towards the silicon carbide ingot as a whole. When the annular diamond wire 7 contacts the surface of the ingot, the two generate mutual squeezing force. The ingot squeezes the wire saw, and the wire saw squeezes the pressure sensor 13. After receiving the pressure signal, the pressure sensor 13 transmits it to the PLC controller. The PLC immediately commands the feed frame 3 to stop moving. At this time, the annular diamond wire 7 only maintains slight contact with the surface of the ingot, which establishes a benchmark for subsequent accurate calculation of the cutting feed amount.

[0051] With the adjustment block 19 in place, the two tensioning wheels 22 are located between the winding wheel 5 and the support wheel 6. They are mounted on the movable column 21 via the adjustment block 19. When the operator rotates the operating wheel 18, it drives the bidirectional lead screw 17 to rotate. The bidirectional lead screw 17 drives the two adjustment blocks 19 to move synchronously within the moving hole 16. When the two adjustment blocks 19 move away from each other, the tensioning wheel 22 squeezes the annular diamond wire 7 outward, increasing the tension of the wire saw. When the adjustment blocks 19 move closer to each other, the tension decreases.

[0052] Based on the above embodiments, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 6 , Figure 7 , Figure 9 and Figure 10 The top surface of the operating frame 2 is provided with a feed assembly for moving the annular diamond wire 7. The feed assembly includes a mounting hole 24, which is located on the top surface of the operating frame 2. A limit hole 23 is provided on one side of the mounting hole 24. A moving table 25 is slidably connected inside the mounting hole 24 and is slidably connected to the limit hole 23. A positive and negative threaded rod 26 is movably connected inside the operating frame 2. A second threaded hole 30 is provided on one side of the moving table 25, and the positive and negative threaded rod 26 is threadedly connected to the second threaded hole 30. The bottom surface of the operating frame 2 is fixedly mounted. The operating frame 2 is equipped with a first servo motor 27. A synchronizing rod 31 is movably connected inside the frame. Two first transmission wheels 28 are fixedly sleeved on the outer circular wall of the synchronizing rod 31 and the positive and negative threaded rod 26, respectively. Each pair of first transmission wheels 28 forms a group. A first transmission belt 29 is wound around the outer circular wall of each group of first transmission wheels 28. A second synchronizing wheel 68 is fixedly sleeved on the outer circular wall of the first servo motor 27 drive shaft and the synchronizing rod 31, respectively. A second synchronizing belt 65 is wound around the outer circular wall of the two second synchronizing wheels 68. The first servo motor 27 is electrically connected to the PLC controller.

[0053] refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 9 The operating frame 2 is equipped with a ranging component for determining the moving distance of the annular diamond wire 7. The ranging component includes a center block 32, which is fixedly installed inside the operating frame 2. The center block 32 is threadedly connected to the positive and negative threaded rods 26. A ranging groove 33 is opened on both sides of the center block 32. A laser ranging sensor 34 is fixedly installed inside the ranging groove 33. The laser ranging sensor 34 is electrically connected to the PLC controller.

[0054] The first servo motor 27 is started by the set moving platform 25. Its drive shaft drives the second synchronous wheel 68 to rotate. The two second synchronous wheels 68 are synchronously transmitted through the second synchronous belt 65, which drives the synchronous rod 31 to rotate. The synchronous rod 31 drives the first transmission wheel 28. The first transmission wheel 28 drives the positive and negative threaded rod 26 to rotate through the first transmission belt 29. When the positive and negative threaded rod 26 rotates, it drives the two moving platforms 25 to move synchronously, which drives the feed frames 3 on both sides and the annular diamond wire 7 to move closer to the silicon carbide ingot at the same time. When the pressure sensor 13 triggers the stop signal, the PLC controller stops the first servo motor 27 synchronously, so that the feed frames 3 on both sides stop at the same time, ensuring that the initial contact position of the two wires is consistent.

[0055] When the annular diamond wire 7 contacts the surface of the ingot and stops moving, the laser rangefinder 34 emits a laser beam that illuminates the surface of the moving stage 25. The PLC controller sets this distance to zero. After the cutting begins, the first servo motor 27 restarts and drives the feed frame 3 to continue feeding the annular diamond wire 7 into the ingot. At this time, the moving stage 25 gradually approaches the laser rangefinder 34, and the distance between them shortens. The distance value detected by the laser rangefinder 34 is negative, and the absolute value of this negative value is the actual cutting depth of the annular diamond wire 7.

[0056] Based on the above embodiments, refer to Figure 2 , Figure 4 , Figure 5 , Figure 7 , Figure 8 and Figure 9 The top surface of the moving platform 25 is provided with a fixing hole 35. An electric hydraulic rod 36 is fixedly sleeved on the inner circular wall of the fixing hole 35. A U-shaped frame 60 is fixedly installed on the top surface of the telescopic rod of the electric hydraulic rod 36. Limiting blocks 61 are fixedly installed on both sides of the inside of the U-shaped frame 60. Third threaded holes 62 are provided on both sides of the U-shaped frame 60 and the limiting blocks 61. Bolts 63 are threadedly connected to the inner circular wall of the third threaded holes 62. Sliding grooves 64 are provided on both sides of the feed frame 3. The limiting blocks 61 are slidably connected to the sliding grooves 64.

[0057] Through the fixed hole 35, the telescopic rod of the electric hydraulic rod 36 moves and pushes the U-shaped frame 60, which in turn moves the feed frame 3 and the annular diamond wire 7 up and down to adjust the cutting height. When unilateral annular cutting is required, one side of the feed frame 3 is pulled away from the vacuum stage 4, and the limiting block 61 slides in the slide groove 64. After it is in place, the bolt 63 is tightened to secure the U-shaped frame 60 to the feed frame 3. At this time, the feed frame 3 on this side is away from the vacuum stage 4, and its annular diamond wire 7 cannot contact the ingot. The other side of the feed frame 3 remains close to the vacuum stage 4 for unilateral cutting. After the feed frame 3 is reset, the symmetrical cutting mode can be restored.

[0058] Based on the above embodiments, refer to Figure 2 , Figure 3 , Figure 11 and Figure 12 The operating frame 2 has a support plate 37 fixedly installed inside. The top surface of the support plate 37 has a movable hole 38. The bottom surface of the support plate 37 has a stepper motor 39 fixedly installed. The top surface of the drive shaft of the stepper motor 39 has a main gear 40 fixedly installed. The bottom surface of the vacuum stage 4 has a driven gear 41 fixedly installed. The main gear 40 and the driven gear 41 are meshed and connected. The top surface of the support plate 37 has several support legs 45 fixedly installed. The support legs 45 have auxiliary wheels 46 movably sleeved inside. The drive shaft of the stepper motor 39 is electrically connected to the PLC controller.

[0059] A bracket 47 is fixedly installed on the bottom surface of the support plate 37. A vacuum negative pressure pump 42 is fixedly installed on the bottom surface inside the bracket 47. An air pipe 43 is fixedly sleeved on the outer circular wall of the suction port of the vacuum negative pressure pump 42. The air pipe 43 passes through the gear 41 and is fixedly connected to the vacuum platform 4. Several adsorption holes 44 are opened on the top surface of the vacuum platform 4. A bearing is fixedly sleeved on the outer circular wall of the air pipe 43. The vacuum platform 4 is fixedly sleeved with the outer ring of the bearing.

[0060] The vacuum stage 4, with a rotary drive mechanism at its bottom, is used to drive the main gear 40 to rotate via the stepper motor 39. The main gear 40 meshes with and drives the driven gear 41 to rotate, which in turn drives the vacuum stage 4 and the silicon carbide ingot adsorbed on it to rotate around their own axis. The stepper motor 39 continues to operate, causing the ingot to rotate at a constant speed. When the annular diamond wire 7 cuts into the edge of the ingot, the ingot continues to rotate while the wire saw maintains a fixed feed, completing a full annular cut and completely separating the high-stress polycrystalline region at the edge from the internal monocrystalline region. In this mode, the ingot and the wire saw move in tandem, completing the entire circumference cut in a single clamping operation. Because the goal of the annular cut is to form a closed circular kerf, the wire saw can only maintain a fixed feed when the ingot rotates continuously. The ingot is cut into a complete ring. The stepper motor 39 drives the ingot to rotate at a set angle and then stops. After one radial cut is completed, the ingot rotates to the next angle and repeats until all blocks are completed. During block cutting, the diamond blade saw 56 feeds in a straight radial direction. Each time the ingot rotates by an angle, a radial cut is completed, dividing the ingot into several fan-shaped blocks. The intermittent rotation mode ensures that each cutting kerf is a straight line trajectory, resulting in regular fan-shaped blocks, which provide accurate blanks for subsequent rod cutting. Block cutting requires a straight cutting trajectory. If the ingot rotates during the cutting process, the cut will be an arc instead of a straight line. Therefore, the intermittent mode of "fixing the ingot during cutting, rotating by an angle after one cut, and then fixing and cutting again" is adopted to ensure that the boundary of each fan-shaped block is straight and regular.

[0061] After placing the silicon carbide ingot on the top surface of the vacuum stage 4 using the vacuum negative pressure pump 42, the vacuum negative pressure pump 42 is activated to generate negative pressure suction. The suction is conducted to the inside of the vacuum stage 4 through the air pipe 43, and then acts on the bottom of the ingot through the adsorption hole 44, tightly adsorbing and fixing the ingot onto the vacuum stage 4.

[0062] Based on the above embodiments, refer to Figure 1 , Figure 3 , Figure 7 , Figure 9 and Figure 13The operating frame 2 has a second servo motor 48 fixedly mounted on its inner bottom surface. Two transmission columns 49 are movably connected inside the operating frame 2. Two first synchronous pulleys 52 are fixedly sleeved on the outer circular wall of each transmission column 49, forming a group of two first synchronous pulleys 52. A first synchronous belt 53 is meshed with the outer circular wall of each group of first synchronous pulleys 52. Second transmission wheels 50 are fixedly sleeved on the outer circular wall of the transmission columns 49 and the drive shaft of the second servo motor 48, respectively. A second transmission belt 51 is meshed with the outer circular wall of the two second transmission wheels 50. A movable frame 54 is fixedly mounted on the top surface of the two first synchronous belts 53. The movable frame 54 has a movable shaft 55 inside, and a diamond blade saw 56 is fixedly sleeved on the outer circular wall of the movable shaft 55. A second drive motor 57 is fixedly installed on one side of the movable frame 54. The drive shaft of the second drive motor 57 is fixedly installed with the movable shaft 55. The second drive motor 57 is electrically connected to the PLC controller. A fixing groove 58 is opened on one side of the movable frame 54. A distance sensor 59 is fixedly installed inside the fixing groove 58. The distance sensor 59 is electrically connected to the PLC controller. A guide plate 66 is fixedly installed inside the operating frame 2. A collection bin 67 is set inside the operating frame 2.

[0063] When the diamond blade saw 56 is used for segmented cutting, the second drive motor 57 is started, and its drive shaft drives the diamond blade saw 56 to rotate. At the same time, the second servo motor 48 is started, and its drive shaft drives the second transmission wheel 50 to rotate. The two second transmission wheels 50 are synchronously driven by the second transmission belt 51, which drives the transmission column 49 to rotate. The transmission column 49 drives the first synchronous wheel 52, and the first synchronous wheel 52 meshes with and drives the first synchronous belt 53. The first synchronous belt 53 drives the moving frame 54 and the diamond blade saw 56 to move closer to the vacuum stage 4 to perform radial cutting on the silicon carbide ingot. During the movement of the moving frame 54, the distance sensor 59 monitors the distance to the operating frame 2 in real time. When it detects that the distance is too close and the cutting is in place, the distance sensor 59 transmits a signal to the PLC controller. The PLC controls the second servo motor 48 to reverse, causing the first synchronous belt 53 to reverse, which drives the moving frame 54 and the diamond blade saw 56 to reset.

[0064] Working principle: Please refer to Figures 1-13As shown, when the operator performs ring-shaped cutting on the edge of a silicon carbide ingot using the ring-shaped diamond wire 7, the silicon carbide ingot is first placed on the top surface of the vacuum stage 4. Then, the operator uses the first drive motor 9. The rotation of the drive shaft of the first drive motor 9 drives the winding wheel 5 to rotate. The rotation of the winding wheel 5 causes the ring-shaped diamond wire 7 to rotate on the surface of the winding wheel 5. Since the ring-shaped diamond wire 7 is wound into a loop on the outer circular wall of the winding wheel 5 and the support wheel 6, the winding wheel 5 and the two support wheels 6 inside the ring-shaped diamond wire 7 will... 7. After the annular diamond wire 7 rotates and moves on the surfaces of the winding wheel 5 and the support wheel 6, the moving feed frame 3 drives the annular diamond wire 7 to move closer to the silicon carbide ingot, thus facilitating the annular wire cutting of the silicon carbide ingot's edge. Before the annular diamond wire 7 cuts the silicon carbide ingot, the electric push rod 11 is used. The drive shaft of the electric push rod 11 extends, driving the force block 12 and pressure sensor 13 to move, so that the pressure sensor 13 is close to the outside of the annular diamond wire 7. In this state, the operator moves the moving feed frame 3 to... The moving annular diamond wire 7, electric push rod 11, force block 12, and pressure sensor 13 move to bring the annular diamond wire 7 close to the surface of the silicon carbide ingot. When the annular diamond wire 7 contacts the silicon carbide ingot, a mutual compressive force is generated between them. Then, the silicon carbide ingot squeezes the annular diamond wire 7, which in turn squeezes the pressure sensor 13. After receiving the pressure signal, the pressure sensor 13 transmits the signal to the PLC controller, which in turn stops the movement of the feed frame 3 and the annular diamond wire 7. At this point, the annular diamond wire 7 only touches the silicon carbide ingot. The silicon ingot surface is then touched, and then the annular diamond wire 7 rotates to cut the silicon carbide ingot. This makes it easier for the operator to calculate the feed rate when cutting the silicon carbide ingot. Annular diamond wires 7 are set on both sides of the operating frame 2. Therefore, the silicon carbide ingot is between two annular diamond wires 7. Through symmetrical cutting on both sides, the silicon carbide ingot can be cut into simultaneously. Two symmetrical annular seams are completed in one feed. If a whole annular groove is to be cut, the cutting depth can be evenly divided by cutting from both sides. Each wire only needs to be cut half the depth to merge, which greatly shortens the cutting time.

[0065] With the adjustment block 19 in place, the two tensioning wheels 22 are located between the winding wheel 5 and the support wheel 6. The operator rotates the operating wheel 18 to drive the bidirectional screw 17 to rotate, which in turn causes the two adjustment blocks 19 to move inside the moving hole 16. By rotating the bidirectional screw 17 in both directions, the two adjustment blocks 19 can be moved away from or closer to each other. When the two adjustment blocks 19 move away from each other, the adjustment blocks 19 will drive the movable column 21 and the tensioning wheel 22 to squeeze the annular diamond wire 7, thereby increasing the tension of the annular diamond wire 7. When the two adjustment blocks 19 move closer to each other, the adjustment blocks 19 will drive the movable column 21 and the tensioning wheel 22 away from the annular diamond wire 7. At this time, the tension of the annular diamond wire 7 will decrease, making it easier to adjust the tension of the annular diamond wire 7.

[0066] When the operator performs circular cutting on the silicon carbide ingot using the movable stage 25, the first servo motor 27 is activated. The drive shaft of the first servo motor 27 rotates, which in turn drives the second synchronous wheel 68 to rotate. The two second synchronous wheels 68 rotate simultaneously through the second synchronous belt 65, which in turn drives the synchronous rod 31 to rotate. The rotation of the synchronous rod 31 drives the first transmission wheel 28 to rotate. The rotation of the two first transmission wheels 28 is transmitted through the first transmission belt 29, which drives the forward and reverse threaded rods 26 to rotate. The rotation of the forward and reverse threaded rods 26 causes the two movable stages 25 to move the feed frame 3 and the annular diamond wire 7, allowing the two feed frames 3 and the annular diamond wire 7 to simultaneously approach the silicon carbide ingot. When the pressure signal received by the pressure sensor 13 is transmitted to the PLC controller, the PLC controller will control the first servo motor 27 to stop, thereby stopping the movement of the feed frame 3 and the annular diamond wire 7, allowing the annular diamond wire 7 to maintain slight contact with the surface of the silicon carbide ingot.

[0067] When the annular diamond wire 7 contacts the surface of the silicon carbide ingot and stops moving, the laser emitted by the laser rangefinder 34 illuminates the surface of the moving stage 25. Subsequently, the PLC controller sets the distance between the laser rangefinder 34 and the moving stage 25 to zero, and the annular diamond wire 7 rotates to cut the silicon carbide ingot. The first servo motor 27 starts synchronously, allowing the feed frame 3 to drive the annular diamond wire 7 to continue moving towards the silicon carbide ingot to cut it. At this time, the moving stage 25 gradually approaches the laser rangefinder 34, and the distance between the two shortens. The laser rangefinder 34 will then measure a negative distance between itself and the moving stage 25. The detected negative value is the feed distance of the annular diamond wire 7 cutting the silicon carbide ingot.

[0068] Through the fixed hole 35, the operator uses the electric hydraulic rod 36. The telescopic movement of the electric hydraulic rod 36 pushes the U-shaped frame 60, which in turn moves the feed frame 3 and the annular diamond wire 7 upwards, thereby adjusting the height of the annular diamond wire 7. When the operator needs to perform single-sided annular wire cutting, by moving the feed frame 3, the feed frame 3 is pulled away from the vacuum stage 4, causing the limit block 61 to slide inside the slide groove 64. When the feed frame 3 is away from the vacuum stage 4, the U-shaped frame 60 and the feed frame 3 can be fastened together by tightening the bolt 63. At this time, one feed frame 3 is close to the vacuum stage 4, and the other feed frame 3 is away from the vacuum stage 4. When the feed frame 3 close to the vacuum stage 4 cuts the silicon carbide ingot, the feed frame 3 away from the vacuum stage 4 cannot touch the silicon carbide ingot. By resetting the feed frame 3, both feed frames 3 are brought close to the vacuum stage 4, thus restoring the mode of cutting silicon carbide ingots on both sides.

[0069] With the vacuum stage 4 in place, the operator uses a stepper motor 39. The drive shaft of the stepper motor 39 rotates, which drives the main gear 40 to rotate. The main gear 40 then meshes with and drives the driven gear 41 to rotate. The driven gear 41 rotates, which in turn drives the vacuum stage 4 to rotate. This allows the silicon carbide ingot to rotate synchronously while the annular diamond wire 7 is rotating to cut the edge of the silicon carbide ingot.

[0070] With the vacuum negative pressure pump 42 in place, when the operator places the silicon carbide ingot on the top surface of the vacuum stage 4, the operator uses the vacuum negative pressure pump 42 to generate negative pressure suction. The suction is then transmitted to the inside of the vacuum stage 4 through the air pipe 43, and then to the top of the vacuum stage 4 through the adsorption hole 44, so that the silicon carbide ingot can be tightly adsorbed.

[0071] The diamond blade saw 56 is configured so that the operator uses a second drive motor 57. The drive shaft of the second drive motor 57 rotates, causing the diamond blade saw 56 to rotate. Subsequently, the second servo motor 48 rotates, causing the drive shaft of the second servo motor 48 to rotate, which in turn causes the second transmission wheel 50 to rotate. The two second transmission wheels 50 rotate synchronously through the transmission belt 51, which in turn causes the transmission column 49 to rotate. The rotation of the transmission column 49 then causes the first synchronous wheel 52 to rotate. The rotation of the first synchronous wheel 52 engages with the first synchronous belt 53 for transmission. The first synchronous belt 53 then drives the movement of the machine. The moving frame 54 and the diamond blade saw 56 move closer to the vacuum stage 4, so that the diamond blade saw 56 can get close to the silicon carbide ingot and cut the silicon carbide ingot into pieces. When the moving frame 54 moves closer to the vacuum stage 4, it will drive the distance sensor 59 to move closer to the position of the operating frame 2. When the distance sensor 59 detects that it is close to the operating frame 2, the distance sensor 59 will transmit a signal to the PLC controller, and then the PLC controller will control the second servo motor 48 to reverse, so that the first synchronous belt 53 reverses and drives the moving frame 54 and the diamond blade saw 56 to reset and move away from the vacuum stage 4.

[0072] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-precision automatic segmentation and ring-wire cutting device for silicon carbide wafers, characterized in that, include: A protective shell (1) is provided with a PLC controller fixedly installed on one side of the protective shell (1), and an operating frame (2) is fixedly installed inside the protective shell (1). Two feed frames (3) are provided on the top surface of the operating frame (2). A wire cutting assembly is disposed on the top surface of the operating frame (2) and is used to cut the polycrystalline region at the edge of a silicon carbide ingot. The wire cutting assembly includes: a vacuum stage (4) disposed on the top surface of the operating frame (2); a winding wheel (5) disposed on the bottom surface of the feed frame (3); a rotating hole (8) opened on the top surface of the feed frame (3); a first drive motor (9) fixedly mounted on the top surface of the feed frame (3); the drive shaft of the first drive motor (9) fixedly mounted to the winding wheel (5); two support wheels (6) disposed on the bottom surface of the feed frame (3); and two rotating holes (14) opened on the top surface of the feed frame (3). A rotating column (15) is movably sleeved on the inner circular wall of the feed frame (3). The rotating column (15) is fixedly installed with the support wheel (6). The winding wheel (5) and the two support wheels (6) are wound with annular diamond wire (7). A mounting groove (10) is opened on one side of the feed frame (3). An electric push rod (11) is fixedly sleeved on the inner circular wall of the mounting groove (10). A force block (12) is fixedly installed at one end of the telescopic rod of the electric push rod (11). A pressure sensor (13) is fixedly installed inside the force block (12). The first drive motor (9), the electric push rod (11) and the pressure sensor (13) are electrically connected to the PLC controller respectively. The top surface of the feed frame (3) is provided with a tensioning component for adjusting the tension of the annular diamond wire (7); The top surface of the operating frame (2) is provided with a feeding assembly for moving the annular diamond wire (7). The feeding assembly includes: a mounting hole (24) which is opened on the top surface of the operating frame (2). A limit hole (23) is opened on one side of the mounting hole (24). A moving stage (25) is slidably connected inside the mounting hole (24). The moving stage (25) is slidably connected to the limit hole (23). A positive and negative threaded rod (26) is movably connected inside the operating frame (2). A second threaded hole (30) is opened on one side of the moving stage (25). The positive and negative threaded rod (26) is threadedly connected to the second threaded hole (30). The operating frame (2) has... A first servo motor (27) is fixedly installed on the inner bottom surface. A synchronizing rod (31) is movably connected inside the operating frame (2). Two first transmission wheels (28) are fixedly sleeved on the outer circular wall surfaces of the synchronizing rod (31) and the positive and negative threaded rods (26). Each pair of first transmission wheels (28) forms a group. A first transmission belt (29) is wound around the outer circular wall surface of each group of first transmission wheels (28). A second synchronizing wheel (68) is fixedly sleeved on the drive shaft of the first servo motor (27) and the outer circular wall surface of the synchronizing rod (31). A second synchronizing belt (65) is wound around the outer circular wall surface of the two second synchronizing wheels (68). The first servo motor (27) is electrically connected to the PLC controller. The operating frame (2) is equipped with a ranging component for determining the moving distance of the annular diamond wire (7). The ranging component includes a center block (32), which is fixedly installed inside the operating frame (2). The center block (32) is threadedly connected to the positive and negative threaded rods (26). A ranging groove (33) is opened on both sides of the center block (32). A laser ranging sensor (34) is fixedly installed inside the ranging groove (33). The laser ranging sensor (34) is electrically connected to the PLC controller.

2. The high-precision automatic segmentation and ring wire cutting device for silicon carbide wafers according to claim 1, characterized in that, The tensioning component includes: A movable hole (16) is opened on the top surface of the feed frame (3). A double-acting screw (17) is movably sleeved inside the movable hole (16). An operating wheel (18) is fixedly sleeved on the outer circular wall of the double-acting screw (17). Two adjusting blocks (19) are slidably connected inside the movable hole (16). A first threaded hole (20) is opened on one side of the adjusting block (19). The first threaded hole (20) is threadedly connected to the double-acting screw (17). A movable column (21) is fixedly installed on the bottom surface of the adjusting block (19). Two tensioning wheels (22) are provided on the bottom surface of the feed frame (3). The movable column (21) is movably sleeved with the tensioning wheel (22).

3. The high-precision automatic segmentation and ring cutting device for silicon carbide wafers according to claim 1, characterized in that: The top surface of the moving platform (25) is provided with a fixing hole (35). An electric hydraulic rod (36) is fixedly sleeved on the inner circular wall of the fixing hole (35). A U-shaped frame (60) is fixedly installed on the top surface of the telescopic rod of the electric hydraulic rod (36). Limiting blocks (61) are fixedly installed on both sides of the inside of the U-shaped frame (60). A third threaded hole (62) is provided on both sides of the U-shaped frame (60) and the limiting block (61). A bolt (63) is threadedly connected to the inner circular wall of the third threaded hole (62). A sliding groove (64) is provided on both sides of the feed frame (3). The limiting block (61) is slidably connected to the sliding groove (64).

4. The high-precision automatic segmentation and ring cutting device for silicon carbide wafers according to claim 1, characterized in that: The operating frame (2) has a support plate (37) fixedly installed inside. The top surface of the support plate (37) has a movable hole (38). The bottom surface of the support plate (37) has a stepper motor (39) fixedly installed. The top surface of the drive shaft of the stepper motor (39) has a main gear (40) fixedly installed. The bottom surface of the vacuum stage (4) has a driven gear (41) fixedly installed. The main gear (40) and the driven gear (41) are meshed and connected. The top surface of the support plate (37) has a number of support legs (45) fixedly installed. The support legs (45) have auxiliary wheels (46) movably sleeved inside. The drive shaft of the stepper motor (39) is electrically connected to the PLC controller.

5. The high-precision automatic segmentation and ring cutting device for silicon carbide wafers according to claim 4, characterized in that: A bracket (47) is fixedly installed on the bottom surface of the support plate (37). A vacuum negative pressure pump (42) is fixedly installed on the inner bottom surface of the bracket (47). An air pipe (43) is fixedly sleeved on the outer circular wall of the suction port of the vacuum negative pressure pump (42). The air pipe (43) passes through the gear (41) and is fixedly connected to the vacuum platform (4). Several adsorption holes (44) are opened on the top surface of the vacuum platform (4). A bearing is fixedly sleeved on the outer circular wall of the air pipe (43). The vacuum platform (4) is fixedly sleeved with the outer ring of the bearing.

6. The high-precision automatic segmentation and ring cutting device for silicon carbide wafers according to claim 1, characterized in that: The operating frame (2) has a second servo motor (48) fixedly installed on its inner bottom surface. The operating frame (2) has two movably connected transmission columns (49). Two first synchronous pulleys (52) are fixedly sleeved on the outer circular wall of each transmission column (49). Each pair of first synchronous pulleys (52) forms a group. A first synchronous belt (53) meshes with the outer circular wall of each group of first synchronous pulleys (52). Second transmission wheels (50) are fixedly sleeved on the outer circular wall of the transmission column (49) and the drive shaft of the second servo motor (48). A second transmission belt (51) meshes with the outer circular wall of the two second transmission wheels (50). The two first synchronous belts (53)... A movable frame (54) is fixedly installed on the top surface of the device. A movable shaft (55) is movably sleeved inside the movable frame (54). A diamond blade saw (56) is fixedly sleeved on the outer circular wall of the movable shaft (55). A second drive motor (57) is fixedly installed on one side of the movable frame (54). The drive shaft of the second drive motor (57) is fixedly installed with the movable shaft (55). The second drive motor (57) is electrically connected to the PLC controller. A fixed groove (58) is opened on one side of the movable frame (54). A distance sensor (59) is fixedly installed inside the fixed groove (58). The distance sensor (59) is electrically connected to the PLC controller.

7. The high-precision automatic segmentation and ring cutting device for silicon carbide wafers according to claim 1, characterized in that: The operating frame (2) is fixedly installed with a guide plate (66), and the operating frame (2) is provided with a collection bin (67).

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