High thermal conductive polyaryletherketone composite material and preparation method thereof
By employing electrostatic adsorption and braided lamination processes, the problem of insufficient thermal conductivity in polyaryletherketone (PBO) materials has been solved, resulting in a composite material with high thermal conductivity and low thermal resistance. This maintains the high strength and insulation properties of PBO fibers and expands their functional applications.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 江苏君华特种高分子材料股份有限公司
- Filing Date
- 2026-04-08
- Publication Date
- 2026-06-02
AI Technical Summary
Existing polyaryletherketone (PBO) materials have poor intrinsic thermal conductivity, making it difficult to meet the heat dissipation requirements of high-power-density equipment. Furthermore, traditional methods of adding thermally conductive fillers can easily lead to a decline in mechanical properties and insulation reliability. PBO fibers are prone to breakage under high temperature and high shear, and their interfacial compatibility is limited, making it difficult to form an efficient thermal conduction path.
Electrostatic adsorption technology is used to coat PAEK powder with PBO continuous fibers. Combined with weaving and lamination processes, a continuous fiber structure is formed. PAEK is melted and impregnated on the fiber surface by heating and pressure to form a strong chemical bonding interface and construct a continuous thermally conductive network.
It effectively retains the high strength and high thermal conductivity of PBO fibers, achieving high thermal conductivity and low thermal resistance in the material, while maintaining excellent insulation and mechanical properties. It can also be pre-filled with thermally conductive fillers to expand functional applications.
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