A high-temperature resistant, low-creep, medium-low adhesive strength silicone pressure-sensitive adhesive, its preparation method and application

Abstract

This invention discloses a high-temperature resistant, low-growth, medium-to-low adhesion silicone pressure-sensitive adhesive, its preparation method, and its application. The silicone pressure-sensitive adhesive comprises the following components by weight: 25-30 parts of high-hydroxymethyl MQ silicone resin, 15-20 parts of hydroxyl-terminated polydimethylsiloxane, 1-5 parts of hydroxyl-terminated polydimethylsiloxane, 1-5 parts of vinylmethyl MQ silicone resin, 10-20 parts of vinyl-terminated polydimethylsiloxane, 30-40 parts of solvent, 0.02-0.08 parts of acid catalyst, and 0.2-0.5 parts of inhibitor. The silicone pressure-sensitive adhesive provided by this invention has high cohesive strength and low adhesion creep during high-temperature baking, enabling protection during the high-temperature baking process of glass. It achieves no white haze precipitation, no adhesive residue, and easy peeling after high-temperature baking.

Description

Technical Field

[0001] This invention relates to an organosilicon pressure-sensitive adhesive, and more particularly to a high-temperature resistant, low-creep, medium-low adhesive strength organosilicon pressure-sensitive adhesive, its preparation method, and its application. Background Technology

[0002] Glass, combining functionality and aesthetics, exhibits a wide diversity in various downstream applications, leading to a variety of glass surface treatment methods. These include processes such as ink printing, polishing, painting, coating, and functional coating on the glass surface, all involving high-temperature baking to achieve the production of functional glass. During the die-cutting process at the rear of the glass manufacturing process, a protective film is needed to adhere to the glass surface or specific areas to prevent scratches or contamination. After the high-temperature baking process, the protective film can be peeled off without affecting the glass surface.

[0003] In the consumer electronics field, silicone protective films have always played a crucial role in the process protection of glass. Silicone protective films are generally divided into platinum-cured silicone and peroxide-cured silicone. Generally, the adhesion of platinum silicone protective films can range from 0-2000g / inch, but their temperature resistance is poor: white mist is released after baking at 150℃ for 60 minutes, and residual adhesive appears after baking at 200℃ for 60 minutes. Peroxide silicone protective films can withstand high temperatures of 260℃, but their adhesion is mainly distributed above 200g / inch. Therefore, the typical performance of conventional platinum-type and peroxide-type silicone cannot cover the high temperature resistance requirements under medium and low adhesion ranges. At the same time, in the above-mentioned high-temperature baking and die-cutting process of glass, the adhesion rise after high-temperature baking should not be too high, so that the protective film can be easily peeled off from the glass surface.

[0004] Chinese patent CN117844441A discloses a heat-resistant addition-type silicone pressure-sensitive adhesive, its preparation method, and its application. It is used in the high adhesion range and replaces the traditional peroxide-type silicone pressure-sensitive adhesive, which cannot achieve process protection applications in the medium and low adhesion range.

[0005] Chinese patent CN114958295A discloses an ultra-low adhesion strength and low creepage silicone pressure-sensitive adhesive, its preparation method and application. Its adhesion strength ranges from 0 to 3 g / inch and it is used in the field of graphite process protection. Although it can achieve low creepage during high temperature and high humidity aging, it cannot be applied to adhesion strength of 10-20 g / inch and high temperature resistance of 200℃.

[0006] Chinese patent CN116622335A discloses a high-temperature resistant silicone pressure-sensitive adhesive, which achieves high-temperature resistance by grafting multi-walled carbon nanotubes onto phenyl-modified silicone oil. However, the adhesive strength range is 100-200 g / inch, and it cannot meet the requirement of low adhesion rise performance under high-temperature baking.

[0007] Therefore, there is an urgent need for a high-temperature resistant, low-climbing, medium-to-low adhesion silicone pressure-sensitive adhesive to solve the problems existing in the above-mentioned technologies. Summary of the Invention

[0008] To address the aforementioned technical problems, this invention proposes a high-temperature resistant, low-growth, medium-to-low adhesive silicone pressure-sensitive adhesive, its preparation method, and its application. The silicone pressure-sensitive adhesive provided by this invention exhibits high cohesive strength and low adhesion creep during high-temperature baking, enabling protection during the high-temperature baking process of glass. It achieves no white haze precipitation, no adhesive residue, and easy peeling after high-temperature baking.

[0009] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0010] A high-temperature resistant, low-creep, medium-to-low adhesion silicone pressure-sensitive adhesive, comprising the following formulation components by weight:

[0011] 25-30 parts of high-hydroxymethyl MQ silicone resin

[0012] 15-20 parts of hydroxyl-terminated polydimethylsiloxane

[0013] 1-5 parts of hydroxyl-terminated polydimethyl silicone oil

[0014] 1-5 parts of vinyl methyl MQ silicone resin

[0015] 10-20 parts of vinyl-terminated polydimethylsiloxane

[0016] 30-40 parts solvent

[0017] 0.02-0.08 parts of acid catalyst,

[0018] Inhibitor 0.2-0.5 parts.

[0019] In some examples of the present invention, the high-hydroxymethyl MQ silicone resin has an M / Q ratio of 0.6-0.9, a weight-average molecular weight of 6500-8000, and a hydroxyl content of 2.5-3.5 wt%; preferably, the high-hydroxymethyl MQ silicone resin has the structural formula (R3SiO2). 1 / 2 ) m (SiO 4 / 2 ) n R is independently selected from methyl or hydroxyl, m takes the value of 10-25, and n takes the value of 25-45.

[0020] In some examples of the present invention, the hydroxyl-terminated polydimethylsiloxane has a weight-average molecular weight of 400,000-800,000 and a hydroxyl content of 0.1-0.3 wt%.

[0021] Preferably, the hydroxyl-terminated polydimethyl silicone oil has a viscosity of 2500-3500 mPa·s and a hydroxyl content of 1.2-2.0 wt%.

[0022] Preferably, the vinyl methyl MQ silicone resin has an M / Q ratio of 0.6-0.9, a weight-average molecular weight of 7000-10000, a vinyl content of 2.0-3.0 wt%, and a hydroxyl content of less than 0.5 wt%. The vinyl methyl MQ silicone resin has the structural formula (R3SiO2). 1 / 2 ) p (SiO 4 / 2 ) q R is independently selected from vinyl or hydroxyl groups, p is 20-40, and q is 35-65;

[0023] Preferably, the vinyl-terminated polydimethylsiloxane has a weight-average molecular weight of 450,000-850,000 and a vinyl content of 0.13-0.18 wt%.

[0024] In some examples of the present invention, the acid catalyst is selected from at least one of acetic acid, benzoic acid, phenylacetic acid, and trifluoromethanesulfonic acid;

[0025] Preferably, the inhibitor is selected from at least one of ethynylcyclohexanol, dimethylhexynol, methylbutynol, and methylethynol;

[0026] Preferably, the solvent is selected from toluene and / or xylene.

[0027] A method for preparing a high-temperature resistant, low-climbing, medium-low adhesion silicone pressure-sensitive adhesive as described above is characterized by adding high-hydroxymethyl MQ silicone resin, hydroxyl-terminated polydimethylsiloxane, hydroxyl-terminated polydimethylsiloxane oil, solvent, and acid catalyst to a vacuum distillation reactor, purging with nitrogen for protection, starting stirring, and heating to 120-160℃ for 4-6 hours; after the reactor cools to room temperature, vinylmethyl MQ silicone resin, vinyl-terminated polydimethylsiloxane, and inhibitor are added, and the mixture is stirred for 3-5 hours to obtain the pressure-sensitive adhesive.

[0028] In addition, the present invention also provides an organosilicon pressure-sensitive adhesive film, comprising the following components by weight:

[0029] 100 parts of main adhesive

[0030] Hydrogen-containing silicone oil 0.8-2.0 parts,

[0031] 1.0-2.0 parts of anchoring agent.

[0032] Platinum catalyst 1.0-2.0 parts;

[0033] The main adhesive is the silicone pressure-sensitive adhesive described above or the silicone pressure-sensitive adhesive prepared by the method described above.

[0034] In some examples of the present invention, the hydrogen-containing silicone oil is one or more of trimethyl-terminated polymethylhydrosiloxane and trimethyl-terminated polydimethylhydrosiloxane, preferably a hydrogen-containing silicone oil with a viscosity of 15-200 cP and a side hydrogen content of 1.0-1.6 wt%.

[0035] Preferably, the anchoring agent is one or more of epoxy propylene oxide modified polydimethyl methyl vinyl siloxane and epoxy cyclohexyl modified polydimethyl methyl vinyl siloxane, and more preferably an anchoring agent with a viscosity of 300-1000 cP.

[0036] Preferably, the platinum catalyst is a complex catalyst formed by coordination of platinum and divinyltetramethyldisiloxane, wherein the platinum content is 4000-6000 ppm;

[0037] In some examples of the present invention, the silicone pressure-sensitive adhesive film further includes a diluent selected from one or more of ethyl acetate, toluene, and xylene;

[0038] Preferably, the amount of the diluent is 100-140 parts, relative to 100 parts of the main adhesive mass.

[0039] The method of adding various additives to the base adhesive to prepare a pressure-sensitive adhesive film can be carried out by referring to any known method, which is not difficult for those skilled in the art. Moreover, the existing method can be slightly modified or simply adjusted to obtain the pressure-sensitive adhesive film. The following implementation method is only a feasible example of obtaining the aforementioned silicone pressure-sensitive adhesive film:

[0040] According to the mass ratio, add the main adhesive to the diluent, and while stirring, add the hydrogen-containing silicone oil, anchoring agent, and platinum catalyst. After all the ingredients are added, stir for a period of time to obtain the pressure-sensitive adhesive bath. Coat the pressure-sensitive adhesive bath onto the base film material and place it in an oven at 130-160℃ to cure for 1-2 minutes to obtain the silicone pressure-sensitive adhesive film.

[0041] Finally, the present invention also provides the application of the silicone pressure-sensitive adhesive as described above, or the silicone pressure-sensitive adhesive prepared by the method described above, or the silicone pressure-sensitive adhesive film described above, in protective films for consumer electronics and glass surface treatment processes, especially in the protection of products during high-temperature baking processes.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] 1) The silicone pressure-sensitive adhesive provided by this invention can maintain a medium-low adhesion range of 10-20g / inch, and can also achieve high-temperature baking without residue or white mist.

[0044] 2) The silicone pressure-sensitive adhesive formulation of this invention combines high molecular weight, low hydroxyl content hydroxyl-terminated polydimethylsiloxane and low molecular weight, high hydroxyl content hydroxyl-terminated polydimethylsiloxane, and dehydrates and condenses with high hydroxyl methyl MQ silicone resin to prepare a cross-linked network structure with higher cohesive strength. At the same time, it further improves the temperature resistance and medium-low adhesion performance of the silicone pressure-sensitive adhesive, and can also meet the low creep adhesion performance after high temperature baking.

[0045] 3) The cross-linking network structure I of vinyl-terminated polydimethylsiloxane and vinylmethyl MQ silicone resin with high vinyl content and hydrogen-containing silicone oil, combined with the above-mentioned cross-linking network structure II, can effectively suppress the outward migration of MQ silicone resin under high temperature baking environment, thereby achieving easy peeling performance of the laminated glass after high temperature aging, and further improving the operability of the die-cutting process. Detailed Implementation

[0046] The present invention will be further illustrated below with specific embodiments. These embodiments are merely illustrative and do not limit the scope of the invention.

[0047] In all embodiments, unless otherwise stated, all quantities are by weight; for ease of description, the sources of the main raw materials used in each embodiment and comparative example are as follows:

[0048] High hydroxymethyl MQ silicone resin SF 6266: M / Q = 0.8, weight average molecular weight 7000, hydroxyl content 3.2wt%, Wanhua Chemical Group Co., Ltd.

[0049] High hydroxymethyl MQ silicone resin MSR8002: M / Q = 0.8, weight average molecular weight 7500, hydroxyl content 3.0wt%, Chengdu Chenguang Boda New Materials Co., Ltd.;

[0050] Hydroxyl-terminated polydimethylsiloxane RTV-107-2: weight average molecular weight of 500,000, hydroxyl content of 0.2wt%, Hoshine Silicon Industry Co., Ltd.

[0051] Hydroxyl-terminated polydimethylsiloxane 101-B: weight average molecular weight of 550,000, hydroxyl content of 0.18wt%, Dongjue Organosilicon Group Co., Ltd.

[0052] Hydroxyl-terminated polydimethyl silicone oil F3: viscosity 3000 mPa·s, hydroxyl content 1.5 wt%, Jiangsu Kexing New Material Co., Ltd.;

[0053] Hydroxyl-terminated polydimethyl silicone oil RTV-107-T02: viscosity 3500 mPa·s, hydroxyl content 1.3 wt%, Hoshine Silicon Industry Co., Ltd.

[0054] Vinyl methyl MQ silicone resin CF90-7: M / Q = 0.7, weight average molecular weight 8000, vinyl content 2.8wt%, hydroxyl content 0.2wt%, Sichuan Chenfei Technology Co., Ltd.

[0055] Vinyl methyl MQ silicone resin VSR8201-3: M / Q = 0.8, weight average molecular weight 9000, vinyl content 2.5wt%, hydroxyl content 0.3wt%, Chengdu Chenguang Boda New Materials Co., Ltd.;

[0056] Vinyl-terminated polydimethylsiloxane 110-2: weight average molecular weight of 590,000, vinyl content of 0.15 wt%, Hoshine Silicon Industry Co., Ltd.

[0057] Vinyl-terminated polydimethylsiloxane 110-2: weight average molecular weight of 630,000, vinyl content of 0.14 wt%, Dongjue Organosilicon Group Co., Ltd.

[0058] Low-hydroxyl methyl MQ silicone resin SF 6216: M / Q = 0.8, weight average molecular weight 5500, hydroxyl content 0.9wt%, Wanhua Chemical Group Co., Ltd.

[0059] Hydrogen-containing silicone oil RH202-20: viscosity 20 cP, side hydrogen content 1.6 wt%, Ningbo Runhe High-Tech Materials Technology Co., Ltd.

[0060] Anchoring agent SK-M02: Shenzhen Tianqi New Material Technology Co., Ltd.;

[0061] Platinum catalyst CSAT-F5: Platinum content 5000ppm, Suzhou Betterley Polymer Materials Co., Ltd.

[0062]

Examples 1-5

[0063] Pressure-sensitive adhesives were prepared according to the following method. The formulations for each example are shown in Table 1.

[0064] High-hydroxymethyl MQ silicone resin, hydroxyl-terminated polydimethylsiloxane, hydroxyl-terminated polydimethylsiloxane oil, solvent, and acid catalyst were added to a vacuum distillation reactor, nitrogen gas was introduced for protection, stirring was started, and the temperature was raised to 140°C for 5 hours. After the reactor cooled to room temperature, vinylmethyl MQ silicone resin, vinyl-terminated polydimethylsiloxane, and inhibitor were added, and the mixture was stirred for 4 hours to obtain pressure-sensitive adhesive.

[0065] Table 1. Pressure-sensitive adhesive formulations (parts by weight) in Examples 1-5

[0066]

[0067]

[0068] Note: In Table 1, " / " indicates that it has not been added.

[0069] Comparative Example 1

[0070] According to the weight parts, 30 parts of low hydroxymethyl MQ silicone resin SF 6216, 20 parts of vinyl-terminated polydimethylsiloxane 110-2 (Hesheng), 0.3 parts of ethynylcyclohexanol and 50 parts of xylene were stirred at room temperature for 5 hours to obtain pressure-sensitive adhesive.

[0071] Comparative Example 2

[0072] According to the weight parts, 44 parts of high hydroxymethyl MQ silicone resin SF 6266, 20 parts of hydroxyl-terminated polydimethylsiloxane RTV-107-2, 36 parts of xylene and 0.08 parts of benzoic acid were added to a vacuum distillation reactor, nitrogen gas was introduced for protection, stirring was started, and the temperature was raised to 160℃ for 5 hours to obtain pressure-sensitive adhesive.

[0073] Comparative Example 3

[0074] The pressure-sensitive adhesive was prepared according to a formulation that was essentially the same as that in Example 1, except that hydroxyl-terminated polydimethyl silicone oil F3 was not added.

[0075] Comparative Example 4

[0076] The pressure-sensitive adhesive was prepared according to a formulation that was essentially the same as that in Example 1, except that hydroxyl-terminated polydimethylsiloxane RTV-107-2 was not added.

[0077] Comparative Example 5

[0078] The pressure-sensitive adhesive was prepared according to a formulation that was essentially the same as that in Example 1, except that vinyl-terminated polydimethylsiloxane 110-2 (Hesheng) was not added.

[0079]

Application Example

[0080] Using the pressure-sensitive adhesives prepared in each embodiment and comparative example as the main adhesive, pressure-sensitive adhesive films were prepared according to the following formulations and their performance was tested. The results are shown in Table 2.

[0081] According to the weight proportions, 100 parts of the main adhesive are added to 120 parts of ethyl acetate and stirred for 10 minutes. Then, while stirring, 1.5 parts of hydrogen-containing silicone oil RH202-20 and 1.0 part of anchoring agent SK-M02 are added and stirred for 5 minutes. Finally, 1.3 parts of platinum catalyst CAST-F5 are added. After all the additions are completed, the mixture is stirred for 15 minutes to obtain the pressure-sensitive adhesive bath. The prepared bath is coated onto a 50μm PET film and then placed in a 150℃ oven to cure for 1.5 minutes to obtain the pressure-sensitive adhesive film.

[0082] <Performance Testing Methods>

[0083] 1. Steel plate adhesion test: Cut the pressure-sensitive adhesive film (10μm thick) into standard tapes 25.4mm wide and 300mm long, and apply them to the mirror steel plate for 20min. During the test, peel the pressure-sensitive adhesive tape with the face up at 180° (peeling speed of 300mm / min) and test the adhesion to the steel plate. The test environment is 23±2℃ and 50±5% RH.

[0084] 2. Glass Peel Strength Test: The pressure-sensitive adhesive tape was adhered to the glass for 20 minutes. During the test, the tape was peeled off at a 180° angle with the tape facing upwards (peeling speed of 300 mm / min). The glass peel strength at room temperature was tested. Then, the pressure-sensitive adhesive tape was applied to the glass and baked at 200°C for 60 minutes. After cooling to room temperature, the tape was peeled off at a 180° angle with the tape facing upwards (peeling speed of 300 mm / min). The glass peel strength under high-temperature aging was tested. The test environment was 23±2°C and 50±5% RH.

[0085] 3. High temperature resistance test: The pressure-sensitive adhesive tape was applied to the glass and baked at 200℃ for 60 minutes. After cooling to room temperature, the pressure-sensitive adhesive tape was peeled off and the glass surface was observed for any residual adhesive or white fog.

[0086] Table 2. Performance Test Results

[0087]

[0088]

[0089] As can be seen from Examples 1-5, the silicone pressure-sensitive adhesive of the present invention has high cohesive strength, can withstand baking at 200℃ for 60 minutes without residue or white fog, and effectively reduces the adhesive force range. The peel force of the adhesive to the glass is 10-20 g / inch.

[0090] As can be seen from Examples 1-5, the silicone pressure-sensitive adhesive of the present invention can effectively inhibit the external migration of MQ silicone resin under high temperature baking environment, and the glass peel force after baking at 200℃ for 60 minutes is 35-50g / inch (meeting the index requirement of ≤60g / inch).

[0091] As can be seen from Comparative Examples 1 and 2, although the adhesion of conventional platinum-based silicone pressure-sensitive adhesives can be kept stable in the range of 10-20 g / inch, their temperature resistance is poor, and obvious residue and white haze appear after high-temperature baking. In contrast, traditional peroxide-based silicone pressure-sensitive adhesives can withstand high temperatures, but they cannot cover the range of medium and low adhesion strength. In particular, the peel strength after high-temperature baking climbs to nearly 700 g / inch, making it difficult to peel off the silicone pressure-sensitive adhesive protective film from the glass.

[0092] As can be seen from Comparative Examples 3, 4, and 5, the absence of any one of the raw materials—hydroxyl-terminated polydimethylsiloxane, hydroxyl-terminated polydimethylsiloxane, and vinyl-terminated polydimethylsiloxane—in the formulation system will not be able to effectively suppress the increase in peel force after high-temperature baking, and serious residual glue and white fog phenomena will occur.

[0093] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several improvements and additions without departing from the method of the present invention, and these improvements and additions should also be considered within the scope of protection of the present invention.

Claims

1. A high-temperature resistant, low-creep, medium-to-low adhesive strength silicone pressure-sensitive adhesive, characterized in that, The silicone pressure-sensitive adhesive comprises the following formulation components in parts by weight: 25-30 parts of high-hydroxymethyl MQ silicone resin 15-20 parts of hydroxyl-terminated polydimethylsiloxane 1-5 parts of hydroxyl-terminated polydimethyl silicone oil 1-5 parts of vinyl methyl MQ silicone resin 10-20 parts of vinyl-terminated polydimethylsiloxane 30-40 parts solvent 0.02-0.08 parts of acid catalyst, Inhibitor 0.2-0.5 parts.

2. The high-temperature resistant, low-creep, medium-low adhesion silicone pressure-sensitive adhesive according to claim 1, characterized in that, The high-hydroxymethyl MQ silicone resin has an M / Q ratio of 0.6-0.9, a weight-average molecular weight of 6500-8000, and a hydroxyl content of 2.5-3.5 wt%.

3. The high-temperature resistant, low-creep, medium-low adhesion silicone pressure-sensitive adhesive according to claim 1 or 2, characterized in that, The hydroxyl-terminated polydimethylsiloxane has a weight-average molecular weight of 400,000-800,000 and a hydroxyl content of 0.1-0.3 wt%. Preferably, the hydroxyl-terminated polydimethyl silicone oil has a viscosity of 2500-3500 mPa·s and a hydroxyl content of 1.2-2.0 wt%. Preferably, the vinyl methyl MQ silicone resin has an M / Q ratio of 0.6-0.9, a weight-average molecular weight of 7000-10000, a vinyl content of 2.0-3.0 wt%, and a hydroxyl content of less than 0.5 wt%. Preferably, the vinyl-terminated polydimethylsiloxane has a weight-average molecular weight of 450,000-850,000 and a vinyl content of 0.13-0.18 wt%.

4. The high-temperature resistant, low-creep, medium-low adhesion silicone pressure-sensitive adhesive according to any one of claims 1-3, characterized in that, The acid catalyst is selected from at least one of acetic acid, benzoic acid, phenylacetic acid, and trifluoromethanesulfonic acid; Preferably, the inhibitor is selected from at least one of ethynylcyclohexanol, dimethylhexynol, methylbutynol, and methylethynol; Preferably, the solvent is selected from toluene and / or xylene.

5. A method for preparing a high-temperature resistant, low-creep, medium-to-low adhesive silicone pressure-sensitive adhesive as described in any one of claims 1-4, characterized in that, High-hydroxymethyl MQ silicone resin, hydroxyl-terminated polydimethylsiloxane, hydroxyl-terminated polydimethylsiloxane oil, solvent, and acid catalyst are added to a vacuum distillation reactor, nitrogen gas is introduced for protection, stirring is started, and the temperature is raised to 120-160℃ for 4-6 hours. After the reactor cools to room temperature, vinylmethyl MQ silicone resin, vinyl-terminated polydimethylsiloxane, and inhibitor are added, and the mixture is stirred for 3-5 hours to obtain the pressure-sensitive adhesive.

6. An organosilicon pressure-sensitive adhesive film, characterized in that, Based on parts by weight, it includes the following components: 100 parts of main adhesive Hydrogen-containing silicone oil 0.8-2.0 parts, 1.0-2.0 parts of anchoring agent. Platinum catalyst 1.0-2.0 parts; The main adhesive is the silicone pressure-sensitive adhesive according to any one of claims 1-4 or the silicone pressure-sensitive adhesive prepared by the method described in claim 5.

7. The silicone pressure-sensitive adhesive film according to claim 6, characterized in that, The hydrogen-containing silicone oil is one or more of trimethyl-terminated polymethylhydrosiloxane and trimethyl-terminated polydimethylhydrosiloxane, preferably a hydrogen-containing silicone oil with a viscosity of 15-200 cP and a side hydrogen content of 1.0-1.6 wt%. Preferably, the anchoring agent is one or more of epoxy propylene oxide modified polydimethyl methyl vinyl siloxane and epoxy cyclohexyl modified polydimethyl methyl vinyl siloxane, and more preferably an anchoring agent with a viscosity of 300-1000 cP. Preferably, the platinum catalyst is a complex catalyst formed by coordination of platinum and divinyltetramethyldisiloxane, wherein the platinum content is 4000-6000 ppm.

8. The silicone pressure-sensitive adhesive film according to claim 6 or 7, characterized in that, The silicone pressure-sensitive adhesive film also includes a diluent, which is selected from one or more of ethyl acetate, toluene, and xylene. Preferably, the amount of the diluent is 100-140 parts, relative to 100 parts of the main adhesive mass.

9. The application of an organosilicon pressure-sensitive adhesive as described in any one of claims 1-4, or an organosilicon pressure-sensitive adhesive prepared by the method of claim 5, or an organosilicon pressure-sensitive adhesive film as described in claim 6 or 8, in protective films for consumer electronics and in glass surface treatment processes.

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