Double ended double acting spring for semiconductor test probe and method of manufacturing the same

Abstract

The application discloses a double-head double-motion spring for a semiconductor test probe and a processing method thereof, and relates to the technical field of semiconductor testing.The first effective part and the second effective part are provided with the integrated coaxial line structure but different middle diameters, and the spring is fixed in the middle part of the probe shell by the fixed clamping groove, so that the single spring provides differentiated elastic force for two independent motion probes.The effective part with the smaller middle diameter has greater rigidity, can exert greater test pressure on the driven probe, and avoids the problems of excessive contact resistance and signal distortion, and the other end can generate smaller test pressure to prevent the problem of physical damage.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, specifically to a double-headed, double-acting spring for semiconductor testing probes and its processing method. Background Technology

[0002] Semiconductor testing is a crucial step in the integrated circuit manufacturing process. Test probes, serving as the electrical signal channels connecting the testing machine to the chip pins, directly determine the accuracy and reliability of the test results. As semiconductor technology advances towards smaller process sizes and higher integration levels, the pitch of chip pads continues to shrink, placing extreme demands on the accuracy, stability, and adaptability to complex environments of test probes.

[0003] In advanced applications such as system-level testing (SLT) and 3D integrated chip testing, test probes with dual probes are often required to simultaneously contact and transmit signals to test points on the top and bottom or front and back of the chip. In such probe structures, more complex functional requirements are imposed on the core component, the spring. Traditional solutions often employ two independent springs corresponding to the two probes respectively, or a single spring with identical elastic force characteristics at both ends.

[0004] However, the aforementioned existing technologies have significant limitations. Using two independent springs not only increases the complexity of the probe's internal structure and assembly difficulty, leading to high manufacturing costs, but also makes it difficult to guarantee the consistency of performance degradation between the two springs after millions of test cycles, thus affecting long-term testing stability. Using a single spring with the same elasticity cannot address the practical need to apply differentiated contact pressures to two test points due to differences in material, height, or sensitivity. Insufficient pressure may result in excessive contact resistance and signal distortion; excessive pressure may damage the fragile micron-sized solder joints.

[0005] To address the above issues, there is an urgent need for a double-headed, double-acting spring for semiconductor test probes and its fabrication method. Summary of the Invention

[0006] Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a double-headed, double-acting spring for semiconductor test probes and its manufacturing method. This solves the problem of existing solutions using two independent springs, which not only increases the complexity of the probe's internal structure and assembly difficulty, leading to high manufacturing costs, but also makes it difficult to guarantee the consistency of performance degradation of the two springs after millions of test cycles, thus affecting long-term testing stability. Using a single spring with the same elastic force cannot meet the practical needs of applying differentiated contact pressures to two test points due to differences in material, height, or sensitivity. Insufficient pressure may lead to excessive contact resistance and signal distortion; excessive pressure may damage fragile micron-sized solder joints.

[0007] Technical solution To achieve the above objectives, the present invention is implemented through the following technical solution: a double-headed double-acting spring for semiconductor test probes, with different elastic forces at both ends, comprising: a first effective part, a connecting part, and a second effective part, wherein the first effective part, the connecting part, and the second effective part are an integral coaxial structure, wherein the wire diameter, effective number of turns, pitch, and stiffness of the first effective part and the second effective part are the same, but the mean diameter is different, and the connecting part is provided with a fixing groove for snapping and fixing to the inner wall of the probe housing.

[0008] Furthermore, the first effective part is provided with a first support part at its end, and the second effective part is provided with a second support part at its end.

[0009] Furthermore, the first support and the second support have at least two turns.

[0010] Preferably, the connecting part includes a support ring fixedly connected to the first effective part or the second effective part, and a conical spiral ring is fixedly connected to the other end of the support ring. The other end of the conical spiral ring is fixedly connected to a corresponding coaxially arranged second effective part or first effective part.

[0011] Furthermore, a fixing slot is provided at the connection between the support ring and the conical spiral ring.

[0012] Preferably, the connecting part includes a support ring fixedly connected to the first effective part or the second effective part, a bent section fixedly connected to the other end of the support ring, a support connecting ring coaxial with the support ring fixedly connected to the other end of the bent section, and a corresponding coaxially arranged second effective part or first effective part fixedly connected to the other end of the support connecting ring.

[0013] Furthermore, a fixing slot is located in the middle of the support ring.

[0014] A method for fabricating a double-ended, double-acting spring for a semiconductor test probe, comprising the following steps: S1: Feeding and clamping: Provide spring wire and clamp it between the wire feeding mechanism and the winding spindle of the spring forming machine; S2: Winding the first end: Control the spring forming machine to wind the first support part through the first winding cutter group; then, keep the spring wire continuously supplied and wind the first effective part connected to the first support part through the first winding cutter group; S3: Winding support ring: Replace the winding cutter of the spring forming machine with the second winding cutter, and control the second winding cutter to wind and form a support ring for the connection part connected to the first effective part; S4: Machining the fixing groove: At the end of the wound support ring, control the side cutter of the forming machine to insert and press and bend the spring wire radially inward to form a fixing groove around the spring wire at the connection between the support ring and the conical spiral ring to be formed later. S5: Winding a conical spiral ring: Replace the winding cutter of the spring forming machine with the third winding cutter. Control the third winding cutter to move at a constant speed away from the support ring along the axial direction from the position where the fixed groove is processed, and wind at the same time to form a conical spiral ring with a small middle diameter at one end and a large middle diameter at the other end. S6: Winding the second end: Replace the winding cutter of the spring forming machine with the fourth winding cutter, and control the fourth winding cutter to wind and form the second effective part connected to the large diameter end of the conical spiral ring; then, continuously wind and form the second support part connected to the second effective part; S7: Post-processing: Cut and remove the spring blank from the spring forming machine, grind the end faces of the first support and the second support, and finally perform stress-relieving annealing.

[0015] A method for fabricating a double-ended, double-acting spring for a semiconductor test probe, comprising the following steps: S1: Feeding and clamping: Provide spring wire and clamp it between the wire feeding mechanism and the winding spindle of the spring forming machine; S2: Winding the first end: Control the spring forming machine to wind the first support part through the first winding cutter group; then, keep the spring wire continuously supplied and wind the first effective part connected to the first support part through the first winding cutter group; S3: Front section of the support ring: Replace the winding cutter of the spring forming machine with the second winding cutter, and control the second winding cutter to wind the front section of the support ring that forms the connection part connected to the first effective part; S4: Machining the fixing groove: At the middle position of the wound support ring, control the side cutter of the forming machine to insert and press and bend the spring wire radially inward to form a fixing groove around the spring wire. S5: Rear section of the support ring: Replace the winding cutter of the spring forming machine with the second winding cutter, and control the second winding cutter to wind the rear section of the support ring that forms the connection part connected to the first effective part. S6: Forming a bending section: At the end of the support ring with the fixed groove, the side cutter of the forming machine is inserted again to bend the spring wire radially inward for a short period of time to form a bending section. S7: Winding the support connecting ring: Replace the winding cutter of the spring forming machine with the third winding cutter, adjust the feeding direction of the spring wire, control the third winding cutter to wind and form a support connecting ring connected to the bending section, and make the support connecting ring and the support ring coaxial. S8: Winding the second end: Replace the winding cutter of the spring forming machine with the fourth winding cutter, and control the fourth winding cutter to wind and form the second effective part connected to the support connecting ring; then, continuously wind and form the second support part connected to the second effective part; S9: Post-processing: Cut and remove the spring blank from the spring forming machine, grind the end faces of the first support and the second support, and finally perform stress-relieving annealing.

[0016] Beneficial effects The present invention has the following beneficial effects: (1) This invention achieves differentiated elastic force for two independently moving probes by setting up a first effective part and a second effective part with an integrated coaxial structure but different median diameters, and using a fixing slot to fix the spring as a whole to the middle of the probe housing. The effective part with a smaller median diameter has greater stiffness and can apply greater test pressure to the probe it drives, avoiding problems such as excessive contact resistance and signal distortion, while the other end can generate less test pressure to prevent physical damage.

[0017] (2) This invention provides a wide, flat, and stable interface for force transmission between the spring and the probe by setting a first support portion and a second support portion with at least two turns and grinding their end faces. This "guide sleeve" structure effectively prevents probe sway, suppresses vibration, and ensures accurate axial force transmission. It guarantees long-term consistency and reliability of pressure output during testing and greatly reduces wear caused by point or line contact, thereby increasing the probe's durability to the level of millions of test cycles.

[0018] (3) By setting the processing method, the present invention enables the double-headed double-acting spring for semiconductor test probes to be wound into shape in one go.

[0019] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 .

[0021] Figure 2 This is a schematic diagram of the overall structure of the present invention. Figure 2 .

[0022] Reference numerals: First support part 1, First effective part 2, Connecting part 3, Support ring 31, Fixing groove 32, Conical spiral ring 33, Bending section 34, Support connecting ring 35, Second effective part 4, Second support part 5. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Please see Figures 1 to 2 The present invention provides a technical solution: a double-headed double-acting spring for semiconductor test probes, with different elastic forces at both ends, including: a first effective part 2, a connecting part 3, and a second effective part 4. The first effective part 2, the connecting part 3, and the second effective part 4 are an integral coaxial structure. The wire diameter, effective number of turns, pitch, and stiffness of the first effective part 2 and the second effective part 4 are the same, but the mean diameter is different. The connecting part 3 is provided with a fixing groove 32 that is snapped and fixed to the inner wall of the probe housing.

[0025] In practical implementation, a double-ended double-acting spring is used in a double-ended double-acting semiconductor test probe. The probe has a housing, with two independently axially movable probes at its two ends. The double-ended double-acting spring is engaged with a protrusion in the middle of the inner wall of the probe housing via a fixing slot 32 on its connecting part 3, thus being fixed in the middle position of the inner wall of the probe housing, becoming an independent fixed reference point. The first effective part 2 extends upward, and its end contacts or connects with the inner end of the upper probe; the second effective part 4 extends downward, and its end contacts or connects with the inner end of the lower probe. When the two tips of the probe contact the upper and lower test points of the device under test respectively, the two probes move towards each other, independently compressing the first effective part 2 and the second effective part 4 respectively. Because the first effective part 2 and the second effective part 4 have the same stiffness but different pitch diameters, under the same wire diameter, effective number of turns, and pitch, the effective part with the smaller pitch diameter (assumed to be the first effective part 2) has greater stiffness, and therefore applies greater test pressure to the probe in contact with it. This design allows the two probes within a single probe to apply different, independently controllable contact pressures to the upper and lower test points, thereby optimizing pressure parameters for solder joints of different materials, heights, or sensitivities. This ensures reliable electrical contact while minimizing the risk of physical damage to fragile solder joints.

[0026] Furthermore, the first effective part 2 is provided with a first support part 1 at its end, and the second effective part 4 is provided with a second support part 5 at its end.

[0027] In practical implementation, the first support part 1 and the second support part 5 provide a stable and reliable force transmission interface between the two ends of the double-headed double-acting spring and the internal moving parts of the probe (i.e., the two probes). In the double-headed double-acting probe, the lower end of the upper probe usually has a flat bearing surface. The ground end face of the first support part 1 fits against this bearing surface, ensuring uniform pressure transmission and preventing stress concentration and probe sway caused by point contact. Similarly, the upper end of the lower probe also has a corresponding bearing surface, which fits against the end face of the second support part 5. These two supports not only provide a larger contact area to disperse pressure, but their flat end faces also ensure that the spring force is always transmitted along the probe axis, avoiding lateral force components. This ensures the coaxiality and smoothness of the movement of the two probes during compression and rebound, so that the differentiated elastic force generated by the first effective part 2 and the second effective part 4 can be accurately and without loss applied to the tips of the two probes, realizing precise and independent control of the test pressure.

[0028] Furthermore, the first support portion 1 and the second support portion 5 have at least two turns.

[0029] In practical implementation, setting the number of turns for the first support part 1 and the second support part 5 to at least two turns can effectively improve the long-term working stability and service life of the probe. During the high-frequency testing cycles of the dual-headed, dual-action probe, repeated micro-impacts and friction occur between the probe and the spring support end face. If the support part has only one turn, the flatness and perpendicularity of its end face are prone to slight deformation after long-term stress, causing the contact between the spring and the probe to degenerate from surface contact to unstable line contact or point contact, thus causing elastic force fluctuations and probe movement jamming. Designing the support part to have at least two turns is equivalent to adding a short and rigid "guide sleeve," which can maintain the flatness and perpendicularity of the end face for a long time. It provides a wider and more stable support base for the probe, effectively suppressing vibration and lateral displacement, and ensuring the long-term consistency and reliability of the spring output force during millions of test cycles.

[0030] Preferably, the connecting part 3 includes a support ring 31 fixedly connected to the first effective part 2 or the second effective part 4, and a conical spiral ring 33 is fixedly connected to the other end of the support ring 31. The other end of the conical spiral ring 33 is fixedly connected to a corresponding coaxially arranged second effective part 4 or first effective part 2.

[0031] In a specific implementation, the preferred structure of the connecting part 3 is a combination of a support ring 31 and a conical spiral ring 33. The support ring 31 is coaxially connected to the first effective part 2, and its outer diameter is slightly larger, used to provide initial radial positioning within the probe housing. The large end of the conical spiral ring 33 is connected to the support ring 31, and the small end is connected to the second effective part 4. During processing, a smooth transition is achieved through the conical spiral ring 33.

[0032] Furthermore, the fixing groove 32 is provided at the connection between the support ring 31 and the conical spiral ring 33.

[0033] In practical implementation, the fixing slot 32 is further positioned at the connection between the support ring 31 and the conical spiral ring 33. The direction of the spring wire transitions from the stable spiral of the support ring 31 to the variable diameter spiral of the conical spiral ring 33, resulting in a natural change in structural stiffness. The fixing slot 32 is positioned in this stiffness transition zone, aligning the protrusion in the middle of the probe housing's inner wall with the fixing slot 32 located in the middle of the support ring 31. It is then locked in place by axial pressing or rotation.

[0034] Preferably, the connecting part 3 includes a support ring 31 fixedly connected to the first effective part 2 or the second effective part 4, and a bending section 34 fixedly connected to the other end of the support ring 31. A support connecting ring 35 coaxial with the support ring 31 is fixedly connected to the other end of the bending section 34. A corresponding coaxially arranged second effective part 4 or first effective part 2 is fixedly connected to the other end of the support connecting ring 35.

[0035] In a specific implementation, another preferred structure for the connecting part 3 is a combination of a support ring 31, a bent section 34, and a support connecting ring 35. The support ring 31 connects to the first effective part 2. The bent section 34 is a short section in which the spring wire is bent radially at a small angle from the end of the support ring 31 inward (towards the spring axis). The support connecting ring 35 is wound from the bending point and is coaxial with the support ring 31, ultimately connecting to the second effective part 4. When the double-ended double-acting spring is installed in the middle of the double-ended double-acting probe housing, the bent section 34 creates a slight radial offset. This design cleverly frees up valuable radial space for other components inside the probe housing (such as signal transmission lines, insulating sleeves, or grease storage space). The support connecting ring 35 ensures that the axis of the second effective part 4 is strictly aligned with the axis of the first effective part 2.

[0036] Furthermore, the fixing slot 32 is located in the middle of the support ring 31.

[0037] In practice, the protrusion in the middle of the inner wall of the probe housing is aligned with the fixing groove 32 in the middle of the support ring 31, and the probe is locked in place by axial pressing or rotation.

[0038] In the processing example, the process is completed using an existing spring forming machine.

[0039] The spring forming machine uses existing equipment and includes the following existing structures: a wire feeding mechanism and winding spindle, a first winding cutter, a second winding cutter, a third winding cutter, a fourth winding cutter, a side cutter, a cutting cutter, a bending cutter, and a torsion cutter, etc., which are essential spring winding mechanisms for spring forming machines.

[0040] A method for fabricating a double-ended, double-acting spring for a semiconductor test probe, comprising the following steps: S1: Feeding and clamping: Provide spring wire and clamp it between the wire feeding mechanism and the winding spindle of the spring forming machine; S2: Winding the first end: Control the spring forming machine to wind the first support part 1 through the first winding cutter group; then, keep the spring wire continuously supplied and wind the first effective part 2 connected to the first support part 1 through the first winding cutter group. S3: Winding support ring: Replace the winding cutter of the spring forming machine with the second winding cutter, and control the second winding cutter to wind and form a support ring 31 that is connected to the connecting part 3 connected to the first effective part 2; S4: Machining the fixing groove: At the end of the wound support ring 31, the side cutter of the forming machine is inserted to press and bend the spring wire radially inward, so as to form a fixing groove 32 around the spring wire at the connection between the support ring 31 and the conical spiral ring 33 to be formed later. S5: Winding a conical spiral ring: Replace the winding tool of the spring forming machine with the third winding tool. Control the third winding tool to move at a constant speed away from the support ring 31 along the axial direction from the position where the fixed groove 32 is processed, and wind at the same time to form a conical spiral ring 33 with a small middle diameter at one end and a large middle diameter at the other end. S6: Winding the second end: Replace the winding cutter of the spring forming machine with the fourth winding cutter, and control the fourth winding cutter to wind and form the second effective part 4 that is connected to the large diameter end of the conical spiral coil 33; then, continuously wind and form the second support part 5 that is connected to the second effective part 4. S7: Post-processing: Cut and remove the spring blank from the spring forming machine, grind the end faces of the first support part 1 and the second support part 5, and finally perform stress-relieving annealing.

[0041] A method for fabricating a double-ended, double-acting spring for a semiconductor test probe, comprising the following steps: S1: Feeding and clamping: Provide spring wire and clamp it between the wire feeding mechanism and the winding spindle of the spring forming machine; S2: Winding the first end: Control the spring forming machine to wind the first support part 1 through the first winding cutter group; then, keep the spring wire continuously supplied and wind the first effective part 2 connected to the first support part 1 through the first winding cutter group. S3: Winding the front section of the support ring: Replace the winding cutter of the spring forming machine with the second winding cutter, and control the second winding cutter to wind the front section of the support ring 31 that is connected to the first effective part 2. S4: Machining the fixing groove: At the middle position of the wound support ring 31, the side cutter of the forming machine is inserted to press and bend the spring wire radially inward to form a fixing groove 32 around the spring wire. S5: Rear section of the support ring: Replace the winding cutter of the spring forming machine with the second winding cutter, and control the second winding cutter to wind the rear section of the support ring 31 that is connected to the first effective part 2. S6: Forming a bending section: At the end of the support ring 31 with the fixed groove 32, the side cutter of the forming machine is inserted again to bend the spring wire radially inward for a short period of time to form a bending section 34. S7: Winding the support connecting ring: Replace the winding cutter of the spring forming machine with the third winding cutter, adjust the feeding direction of the spring wire, control the third winding cutter to wind and form the support connecting ring 35 connected to the bending section 34, and make the support connecting ring 35 and the support ring 31 coaxially set. S8: Winding the second end: Replace the winding cutter of the spring forming machine with the fourth winding cutter, and control the fourth winding cutter to wind and form the second effective part 4 connected to the support connecting ring 35; then, continuously wind and form the second support part 5 connected to the second effective part 4. S9: Post-processing: Cut and remove the spring blank from the spring forming machine, grind the end faces of the first support part 1 and the second support part 5, and finally perform stress-relieving annealing.

[0042] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0043] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A double-headed, double-acting spring for semiconductor test probes, characterized in that: The elastic forces at both ends are different, including: a first effective part (2), a connecting part (3), and a second effective part (4). The first effective part (2), the connecting part (3), and the second effective part (4) are an integral coaxial structure. The wire diameter, number of effective turns, pitch, and stiffness of the first effective part (2) and the second effective part (4) are the same, but the mean diameter is different. The connecting part (3) is provided with a fixing groove (32) that is snapped and fixed to the inner wall of the probe housing.

2. The double-headed, double-acting spring for a semiconductor test probe according to claim 1, characterized in that: The first effective part (2) is provided with a first support part (1) at its end, and the second effective part (4) is provided with a second support part (5) at its end.

3. A double-headed, double-acting spring for a semiconductor test probe according to claim 2, characterized in that: The number of turns of the first support (1) and the second support (5) is at least two.

4. A double-headed, double-acting spring for a semiconductor test probe according to any one of claims 1 to 3, characterized in that: The connecting part (3) includes a support ring (31) fixedly connected to the first effective part (2) or the second effective part (4). The other end of the support ring (31) is fixedly connected to a conical spiral ring (33), and the other end of the conical spiral ring (33) is fixedly connected to a corresponding coaxially arranged second effective part (4) or first effective part (2).

5. A double-headed, double-acting spring for a semiconductor test probe according to claim 4, characterized in that: The fixing slot (32) is located at the connection between the support ring (31) and the conical spiral ring (33).

6. A double-headed, double-acting spring for a semiconductor test probe according to any one of claims 1 to 3, characterized in that: The connecting part (3) includes a support ring (31) fixedly connected to the first effective part (2) or the second effective part (4). The other end of the support ring (31) is fixedly connected to a bending section (34). The other end of the bending section (34) is fixedly connected to a support connecting ring (35) coaxial with the support ring (31). The other end of the support connecting ring (35) is fixedly connected to a corresponding coaxially arranged second effective part (4) or first effective part (2).

7. A double-headed, double-acting spring for a semiconductor test probe according to claim 6, characterized in that: The fixing slot (32) is located in the middle of the support ring (31).

8. A method for fabricating a double-headed, double-acting spring for a semiconductor test probe, characterized in that: The application of a double-headed, double-acting spring for a semiconductor test probe as described in claim 5 includes the following steps: S1: Feeding and clamping: Provide spring wire and clamp it between the wire feeding mechanism and the winding spindle of the spring forming machine; S2: Winding the first end: Control the spring forming machine to wind the first support part (1) through the first winding cutter group; then, keep the spring wire continuously supplied and wind the first effective part (2) connected to the first support part (1) through the first winding cutter group. S3: Winding support ring: Replace the winding cutter of the spring forming machine with the second winding cutter, and control the second winding cutter to wind and form a support ring (31) that is connected to the first effective part (2) and the connecting part (3). S4: Machining the fixing groove: At the end of the completed support ring (31), the side cutter of the forming machine is inserted to press and bend the spring wire radially inward to form the fixing groove (32) around the spring wire at the connection between the support ring (31) and the conical spiral ring (33) to be formed later. S5: Winding a conical spiral ring: Replace the winding tool of the spring forming machine with the third winding tool, and control the third winding tool to move away from the support ring (31) at a constant speed along the axial direction from the position where the fixed groove (32) is processed, while winding to form the conical spiral ring (33) with a small middle diameter at one end and a large middle diameter at the other end. S6: Winding the second end: Replace the winding cutter of the spring forming machine with the fourth winding cutter, and control the fourth winding cutter to wind and form a second effective part (4) that is connected to the large diameter end of the conical spiral ring (33); then, continuously wind and form a second support part (5) that is connected to the second effective part (4). S7: Post-processing: Cut off and remove the whole spring blank from the spring forming machine, grind the end faces of the first support part (1) and the second support part (5) flat, and finally perform stress-relieving annealing.

9. A method for fabricating a double-headed, double-acting spring for a semiconductor test probe, characterized in that: The application of a double-headed, double-acting spring for a semiconductor test probe as described in claim 7 includes the following steps: S1: Feeding and clamping: Provide spring wire and clamp it between the wire feeding mechanism and the winding spindle of the spring forming machine; S2: Winding the first end: Control the spring forming machine to wind the first support part (1) through the first winding cutter group; then, keep the spring wire continuously supplied and wind the first effective part (2) connected to the first support part (1) through the first winding cutter group. S3: Winding the front section of the support ring: Replace the winding cutter of the spring forming machine with the second winding cutter, and control the second winding cutter to wind the front section of the support ring (31) that forms the connecting part (3) connected to the first effective part (2); S4: Machining the fixing groove: At the middle position of the wound support ring (31), the side cutter of the forming machine is inserted to press and bend the spring wire radially inward to form the fixing groove (32) surrounding the spring wire. S5: Rear section of the support ring: Replace the winding tool of the spring forming machine with the second winding tool, and control the second winding tool to wind the rear section of the support ring (31) that forms the connecting part (3) connected to the first effective part (2). S6: Forming a bending section: At the end of the support ring (31) with the fixed groove (32) processed, the side cutter of the forming machine is inserted again to bend the spring wire radially inward for a short period of time to form the bending section (34). S7: Winding the support connecting ring: Replace the winding cutter of the spring forming machine with the third winding cutter, adjust the feeding direction of the spring wire, control the third winding cutter to wind and form a support connecting ring (35) connected to the bending section (34), and make the support connecting ring (35) and the support ring (31) coaxially set. S8: Winding the second end: Replace the winding cutter of the spring forming machine with the fourth winding cutter, and control the fourth winding cutter to wind and form the second effective part (4) connected to the support connecting ring (35); then, continuously wind and form the second support part (5) connected to the second effective part (4). S9: Post-processing: Cut off and remove the whole spring blank from the spring forming machine, grind the end faces of the first support part (1) and the second support part (5) flat, and finally perform stress-relieving annealing.

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